TW202213582A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The subject of the present invention is that the conveyance and processing of the substrates are managed on a group basis. The sequential processing unit processes the substrates while sequentially conveying the substrates according to the sequential processing substrate data set for each of the substrates divided into a plurality of groups. The simultaneous processing unit simultaneously processes the substrates on a group basis according to the simultaneous processing substrate data respectively set for each group. The simultaneous processing substrate data includes group identification information for identifying the group; substrate numbers, which distinguish the substrates belonging to the group from each other; position information, which indicates the transport position representing the position in the transport direction of the substrates of the group; and recipe information, which is used to specify the processing content to be commonly executed with the substrates belonging to the group. The sequential processing substrate data include position information, group identification information, and recipe information about the substrates corresponding to the sequential processing substrate data.

Description

Substrate processing apparatus and substrate processing method

This case relates to a substrate processing apparatus and a substrate processing method.

In order to increase the throughput of substrate processing, a technique has been proposed in which a plurality of substrates are transported between apparatuses as a unit. For example, a plurality of substrates are collectively conveyed to a sequential processing apparatus (to be described in detail later). The substrates are processed while being sequentially conveyed one at a time in the sequential processing apparatus. The processed substrates are collectively transferred to a simultaneous processing device (to be described in detail later).

For example, Patent Document 1 described below discloses a technique in which conveyance and processing of each of a plurality of substrates in a sequential processing apparatus are controlled according to individual substrate data, and in a simultaneous processing apparatus the transfer and processing of a plurality of substrates are Transport and handling are controlled based on overall substrate data. Recipe information is included in both individual substrate data and overall substrate data. The processing content of the substrate is specified by the recipe information. The recipe information for a plurality of substrates in one unit is common. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2020-17604

(The problem that the invention intends to solve)

When the recipe information is shared by a plurality of substrates as a unit (hereinafter also referred to as a "group"), it is desirable that the conveyance and processing of the substrates are managed in a group unit. For example, it is desirable to manage to which group the substrates transferred from the sequential processing apparatus to the simultaneous processing apparatus belong. For example, even if any one of the substrates belonging to a certain group is removed in the sequential processing apparatus, it is hoped that the above-mentioned management is still preferable.

The purpose of the substrate processing apparatus and the substrate processing method disclosed in this application is to manage the conveyance and processing of the substrates on a group basis. (Technical means to solve problems)

The substrate processing apparatus disclosed in this application includes a sequential processing unit, a simultaneous processing unit, and a control unit. The sequential processing unit processes the substrates while sequentially conveying the substrates according to the sequential processing substrate data set for each of the substrates divided into a plurality of groups. The said simultaneous processing part processes the said board|substrate simultaneously by the said group as a unit based on the said simultaneous processing board|substrate data set for each said group. The control unit controls the conveyance and processing of the substrates in the sequential processing unit based on the sequential processing substrate data, and controls the processing of the substrates in the simultaneous processing unit based on the simultaneous processing substrate data.

The above-mentioned simultaneously processed substrate data includes: group identification information, which identifies the above-mentioned group; a substrate number, which mutually distinguishes the above-mentioned substrates belonging to the above-mentioned group; and position information, which indicates the conveying direction of the above-mentioned substrate as the above-mentioned group The transfer position of the position; and recipe information, which is used to specify the processing content to be executed in common with the above-mentioned substrates belonging to the above-mentioned group.

The sequentially processed substrate data includes the aforementioned position information, the aforementioned group identification information, and the aforementioned recipe information about the aforementioned substrates corresponding to the aforementioned sequentially processed substrate data.

The control unit generates the sequentially processed substrate data from the simultaneously processed substrate data, and generates the simultaneously processed substrate data from the sequentially processed substrate data.

The substrate processing method disclosed in this case includes sequential processing and simultaneous processing. The said sequential processing processes the said board|substrate while conveying the said board|substrate sequentially based on the sequential processing board|substrate data set for each board|substrate divided into a plurality of groups. The above-mentioned simultaneous processing processes the above-mentioned substrates simultaneously in the above-mentioned group according to the data of the above-mentioned simultaneous processing substrates respectively set for each of the above-mentioned groups.

In the above-mentioned sequential processing, the conveyance of the above-mentioned substrate and the above-mentioned processing are controlled based on the above-mentioned sequential processing substrate data. The processing of the above-mentioned substrates in the above-mentioned simultaneous processing is controlled according to the above-mentioned simultaneous processing substrate data. The above-mentioned simultaneously processed substrate data includes: group identification information, which identifies the above-mentioned group; a substrate number, which mutually distinguishes the above-mentioned substrates belonging to the above-mentioned group; and position information, which indicates the conveying direction of the above-mentioned substrate as the above-mentioned group The transfer position of the position; and recipe information for specifying the content of the process to be executed in common with the above-mentioned substrates belonging to the above-mentioned group.

The sequentially processed substrate data includes the aforementioned position information, the aforementioned group identification information, and the aforementioned recipe information about the aforementioned substrates corresponding to the aforementioned sequentially processed substrate data.

The sequentially processed substrate data is generated from the concurrently processed substrate data, and the concurrently processed substrate data is generated from the sequentially processed substrate data. (Compared to the efficacy of the prior art)

The substrate processing apparatus and the substrate processing method disclosed in this application manage the conveyance and processing of the substrates on a group basis.

The objects, features, aspects, and advantages related to the technology disclosed in the specification of the present application will be more clarified by the detailed description and drawings shown below.

Hereinafter, the embodiment will be described with reference to the accompanying drawings. In addition, the drawings are shown schematically, and are obtained by appropriately omitting and simplifying the configuration for the convenience of description. In addition, the mutual relationship between the size and the position of the structure shown in the drawings is not necessarily described accurately, but can be appropriately changed.

In addition, in the description shown below, the same code|symbol is attached|subjected to the same component, and it is shown in figure, and these names and functions are also set as the same thing. Therefore, there are cases where the detailed description about them is omitted in order to avoid repetition.

In addition, in the description described below, even if there are cases where ordinal numbers such as "first" or "second" are used, these terms are used for convenience in order to facilitate understanding of the content of the embodiments, and the present invention is not intended to be limited to the order produced by the ordinal numbers, etc.

Terms indicating relative or absolute positional relationship (such as "towards one direction", "along one direction", "parallel", "orthogonal", "center", "concentric", "coaxial", etc.) unless otherwise specified, Otherwise, not only the positional relationship is strictly indicated, but also the state that is relatively shifted in angle or distance within a tolerance or a range in which the same degree of function can be obtained. Terms expressing a state of equality (such as "identical", "equal", "homogeneous", etc.), unless otherwise specified, not only denote a state of quantitative and strict equality, but also denote a state where there is a tolerance or the same degree of function can be obtained. poor state. Terms denoting a shape (such as "quadrilateral" or "cylindrical shape", etc.), unless otherwise specified, not only express the shape strictly geometrically, but also mean that it has, for example, concavo-convex or convexity within the range where the same effect can be obtained. Shapes such as chamfers. The terms "has", "has", "has", "includes" or "has" a constituent element are not exclusive terms excluding the presence of other constituent elements. The term "at least any one of A, B, and C" means that only A is included, only B is included, only C is included, any two of A, B, and C are included, and all of A, B, and C are included.

<1. Overall configuration and overall operation of a substrate processing apparatus> FIG. 1 is a diagram schematically showing an example of the configuration of a substrate processing apparatus 1 . In the example of FIG. 1 , the substrate processing apparatus 1 is a coating/developing device, which mainly includes a cleaning device 12 , a dehydration baking device 13 , a coating related device 14 , a pre-baking device 15 , a developing device 17 and a post-baking device. Each processing apparatus such as the roasting apparatus 18. Moreover, the indexing part 11 which carries in and carries out a board|substrate with respect to the substrate processing apparatus 1 is arrange|positioned at one side of the substrate processing apparatus 1. As shown in FIG. Moreover, on the other side of the substrate processing apparatus 1, the exposure apparatus 16 is arrange|positioned via the interface part which is not shown in figure.

On the outgoing route from the indexing part 11 to the exposure device 16 , a cleaning device 12 , a dehydration baking device 13 , a coating-related device 14 and a pre-baking device 15 are sequentially arranged. A developing device 17 and a post-baking device 18 are sequentially arranged on the return route from the exposure device 16 to the indexing portion 11 .

A plurality of cassettes (not shown) for accommodating a plurality of substrates are placed on the indexing portion 11 . The substrate is, for example, a rectangular glass substrate used in a liquid crystal display device. An indexing robot (not shown) serving as a conveying unit is arranged in the indexing unit 11 . The indexing robot takes out the substrate from the cassette and transfers the substrate to the cleaning device 12 . In the cleaning device 12, the substrate is cleaned. The cleaned substrate is transported to the dehydration baking device 13 . In the dehydration and baking apparatus 13, the dehydration treatment (dehydration baking treatment) is performed by heating. The substrate subjected to the dehydration and baking process is transported to the coating-related apparatus 14, and various processes including the coating process of the photoresist are performed. The substrate subjected to this treatment is transported to the prebaking apparatus 15 and subjected to heat treatment. The heat-processed board|substrate is conveyed to the exposure apparatus 16, and exposure processing is performed.

The substrate subjected to these processes is transported to the developing device 17 and subjected to development processing. The substrate subjected to the development treatment is transported to the post-baking device 18 and subjected to heat treatment. Thereafter, the substrate is accommodated in the cassette placed on the indexing section 11 by the indexing robot. Through these series of treatments, a pattern of photoresist is formed on the surface of the substrate.

Hereinafter, when the first process is performed before the second process, it is stated that the device performing the first process is located "upstream" of the device performing the second process, and the device performing the second process is located in the device performing the first process. Description of "downstream". The indexing portion 11 is located upstream with respect to the cleaning device 12 and downstream with respect to the post-baking device 18 . The terms "upstream" and "downstream" are used not only for the device or each element constituting the device, but also when describing the positional relationship of the substrates being conveyed.

<2. Type of processing device> In this substrate processing apparatus 1, the following two types of processing apparatuses are mixed as types of processing apparatuses. That is, a sequential processing apparatus (horizontal tape processing apparatus) that processes the substrates one at a time while sequentially conveying the substrates in one direction, and N (an integer of 2 or more) sheets that can collectively be mixed exist. Simultaneous processing apparatus in which substrates are processed simultaneously. Furthermore, it is not necessary for the processing periods of the simultaneous processing apparatus to be completely consistent with each other, as long as at least a part of each processing period overlaps. In short, the term "simultaneous" here is used in the sense of being compared with a state in which each processing period does not overlap at all. As the sequential processing device, the cleaning device 12 and the developing device 17 are exemplified, and as the simultaneous processing device, the dehydration baking device 13 , the coating-related device 14 , the pre-baking device 15 , and the post-baking device 18 are exemplified.

The sequential processing apparatus can be regarded as a sequential processing section which is a part of the substrate processing apparatus 1 . The simultaneous processing apparatus can be regarded as a part of the substrate processing apparatus 1 , that is, a simultaneous processing unit.

<2-1. Sequential processing device> FIG. 2 is a side view schematically showing an example of the configuration of the sequential processing apparatus 30 . The sequential processing apparatus 30 includes a processing apparatus main body 32 and a substrate lead-out portion 33 , and a substrate introduction portion (receiving portion) 31 is provided in front of the sequential processing apparatus 30 . The substrate introduction unit 31 collectively receives a plurality of (N) substrates W conveyed from the upstream apparatus. The processing apparatus main body 32 receives the plurality of substrates W conveyed from the substrate introduction portion 31 one at a time and sequentially, and moves the substrates W in one direction (conveying direction: from the left to the right in FIG. 2 ). The substrate W is subjected to various processes while being conveyed in the direction). The processed substrate W is conveyed from the processing apparatus main body 32 to the substrate lead-out portion 33 . The substrate lead-out portion 33 sequentially receives the plurality of substrates W conveyed from the processing apparatus main body 32 . The substrate lead-out portion 33 can hold a plurality of (N) substrates W that are sequentially received. The plurality of substrates W are collectively taken out from the substrate lead-out portion 33 and conveyed to a downstream device. In addition, it can also be considered that the substrate introduction part 31 is included in the sequential processing apparatus 30 . The substrate introduction part 31 can function as an entrance part of the sequential processing apparatus 30 , and the substrate exporting part 33 can function as an exit part of the sequential processing apparatus 30 . Hereinafter, the case of N=2 is exemplified.

<2-1-1. Board introduction part 31> The board introduction part 31 has a plurality of rollers 311 and a plurality of rollers 313 as conveying means, and sensors 314 and 315 . The cross section of the rollers 311 and 313 has a circular shape, and the central axes of the rollers 311 and 313 are set to be substantially perpendicular to the conveyance direction of the substrate W and to be substantially horizontal. The conveyance direction referred to here is the conveyance direction of the substrate W in the sequential processing apparatus 30 . The plurality of rollers 311 are arranged in a row along the conveyance direction at intervals. Each roller 311 can be rotated with its own central axis as a rotation axis. Both ends of the central axis of each roller 311 are rotatably fixed to a support plate (not shown). The pair of support plates are plate-like members extending in the conveying direction, and are fixed to a predetermined base 312 provided on the floor surface. The plurality of rollers 313 are arranged at intervals along the conveyance direction. The roller 313 is located on the downstream side of the roller 311 , and is provided at the same height as the roller 311 . Each roller 313 can be rotated with its own central axis as a rotation axis. Both ends of the central axis of each roller 313 are rotatably fixed to the support plate, respectively.

The plurality of rollers 311 are driven by a drive unit (not shown), and rotate (synchronized rotation) in the same direction determined in advance at a substantially equal rotational speed. The drive unit has a motor. The substrate W is placed on the plurality of rollers 311 . The substrate W is placed so that the normal direction of the main surface is along the vertical direction (the vertical direction in FIG. 2 ). In this state, by synchronously rotating the plurality of rollers 311 in the same direction, the substrate W moves toward the processing apparatus body 32 along the conveyance direction on the rollers 311 . The plurality of rollers 313 are also driven by a drive unit (not shown) to rotate synchronously. Since the rollers 311 and 313 are driven by different drive units, they are controlled independently of each other.

The substrates W are placed on the rollers 311 and 313 one at a time. For example, two substrates W may be placed on the rollers 311 and 313 from the indexing section 11 . In this state, the substrate W on the rollers 313 can be conveyed toward the processing apparatus main body 32 by synchronously rotating only the rollers 313 . Next, the substrate W on the roller 313 can be conveyed to the processing apparatus main body 32 by synchronously rotating both of the rollers 311 and 313 .

The sensor 314 detects whether the substrate W exists at the stop position on the roller 311 . The sensor 315 detects whether the substrate W exists at the stop position on the roller 313 . The sensors 314 and 315 are, for example, optical sensors, and detect the substrate W when the reflected light from the substrate W is received. The detection results of the sensors 314 and 315 are output to the control unit 60 .

Hereinafter, one of the two substrates W is also referred to as a substrate W1, and the other is also referred to as a substrate W2. Here, the board|substrate W1 is made to be located more upstream than the board|substrate W2.

<2-1-2. Board lead-out portion 33 > The substrate lead-out portion 33 can hold a plurality of (N) substrates W sequentially conveyed from the processing apparatus main body 32 . The number of substrates W that can be held by the substrate lead-out portion 33 is the same as the number of substrates W that can be processed by the next simultaneous processing device 40 (for example, if the sequential processing device 30 is the cleaning device 12, the dehydration baking device 13). . Here, as an example, the substrate lead-out portion 33 is assumed to hold two substrates W, and the simultaneous processing apparatus 40 is assumed to perform processing on the two substrates W at the same time.

The board|substrate lead-out part 33 is equipped with the some roller 331 and the some roller 332 as a conveyance mechanism, and sensors 334 and 335. The cross section of the rollers 331 and 332 has a circular shape. The roller 331 is arrange|positioned at intervals along the conveyance direction so that the center axis|shaft and the conveyance direction of the board|substrate W may become perpendicular|vertical and horizontal. The roller 332 is arranged on the downstream side of the roller 331 . The rollers 332 are arranged at intervals along the conveyance direction in the same posture as the rollers 331 . Both ends of the central axis of each of the rollers 331 and 332 are rotatably fixed to a support plate (not shown). The plurality of rollers 331 are synchronously rotated by a driving part (not shown), and the plurality of rollers 332 are synchronously rotated by a driving part (not shown). Since the roller 331 and the roller 332 are driven by different drive units, they can be controlled independently of each other. Each drive unit has, for example, a motor.

The rollers 331 and 332 are mutually provided at the same height. The substrate W is conveyed from the processing apparatus main body 32 to the rollers 331 , and is appropriately conveyed from the rollers 331 to the rollers 332 . As described later, one substrate W is stopped on the roller 331 , and one substrate W is stopped on the roller 332 . Thereby, the substrate lead-out portion 33 can hold two substrates W. As shown in FIG.

The sensor 334 detects whether or not the substrate W exists at the stop position on the roller 331 . The sensor 335 detects whether or not the substrate W exists at the stop position on the roller 332 . The sensors 334 and 335 are, for example, optical sensors, and detect the substrate W when the reflected light from the substrate W is received. The detection results of the sensors 334 and 335 are output to the control unit 60 .

The substrate lead-out portion 33 can sequentially receive two substrates W from the processing apparatus main body 32 and hold them. Hereinafter, first, for simplicity, the case where two substrates W are collectively processed will be described. The case where the N-piece substrates W are not collectively processed will be described in detail later.

First, the 1st board|substrate W is conveyed to the stop position on the roller 332 by the synchronous rotation of the rollers 331 and 332. Specifically, when the sensors 334 and 335 do not detect the substrate W, the rollers 331 and 332 are rotated synchronously to convey the substrate W from the processing apparatus body 32 to the substrate lead-out portion 33 . Then, when the sensor 335 detects the substrate W, the synchronized rotation of the rollers 332 is stopped. Thereby, the 1st board|substrate W (substrate W2 on the downstream side) stops on the roller 332, and is supported. For the second substrate W (the substrate W1 on the upstream side), the rollers 331 are rotated synchronously without rotating the rollers 332 , thereby conveying the substrate W to the stop position of the rollers 331 . Specifically, when the sensor 334 detects the substrate W, the synchronized rotation of the rollers 331 is stopped. That is, when both the sensors 334 and 335 detect the substrate W, the synchronous rotation of the rollers 331 is stopped. Thereby, the 2nd board|substrate W stops on the roller 331, and is supported. In this way, the substrate lead-out portion 33 can hold two substrates W. As shown in FIG.

<2-1-3. Processing device body 32 > The processing apparatus main body 32 has a plurality of rollers 321 as conveying means. The plurality of rollers 321 have the same shape as the rollers 311 and are arranged in the same posture as the rollers 311 . Both ends of the central axis of the roller 321 are respectively rotatably fixed to a support plate (not shown). The plurality of rollers 321 are arranged at intervals along the conveyance direction. The plurality of rollers 321 are provided at the same height as the rollers 311 of the substrate introduction portion 31 , and the substrate W can be moved from the rollers 311 to the rollers 332 via the rollers 313 , 321 , and 331 in this order.

The processing apparatus main body 32 appropriately processes the substrate W flowing on the roller 321 at each position in the conveying direction. Here, as the sequential processing apparatus 30, the cleaning apparatus 12 is taken as an example and demonstrated. For example, the processing apparatus main body 32 includes a chemical solution part 34 , a water washing part 35 , and a moisture removal part 36 . The chemical solution part 34 , the water washing part 35 , and the moisture removal part 36 are provided in series in this order from upstream to downstream. In addition, the plurality of rollers 321 are provided so as to extend over the chemical solution part 34 , the water washing part 35 and the water removal part 36 . The plurality of rollers 321 are driven by a drive unit (not shown) to rotate synchronously. Thereby, the board|substrate W can be conveyed along the conveyance direction, and can pass through the chemical|medical solution part 34, the water washing part 35, and the water|moisture removal part 36 in this order.

The chemical liquid portion 34 is a device for supplying chemical liquid to the substrate W on the roller 321 to clean the substrate W. As shown in FIG. The chemical solution part 34 includes: a plurality of nozzles 341 for discharging the chemical solution; a chemical solution tank 342 for storing the chemical solution; a supply pipe 343 for connecting the chemical solution tank 342 and the nozzles 341; and a pump 344 for passing the chemical solution The supply pipe 343 supplies the chemical solution to the nozzle 341 . The nozzles 341 are provided on both sides of the substrate W in the vertical direction, and supply the chemical solution toward both sides of the substrate W. As shown in FIG. The supply pipe 343 is provided with a flow sensor 345, which helps to control the amount of the liquid medicine to be supplied. The chemical liquid part 34 may have a brush (not shown) for brushing the substrate W, or the like. By performing brush cleaning while supplying the chemical solution to the substrate W, the cleaning effect can be improved. The chemical solution supplied to the substrate W falls mainly from the periphery of the substrate W, and is recovered into the chemical solution tank 342 .

The water washing unit 35 is a device for washing away the chemical solution remaining on the substrate W by supplying washing water to the substrate W. As shown in FIG. The water washing part 35 has the 1st water tank 355 and the 2nd water tank 356 which store the washing water. Moreover, the water washing part 35 has the low pressure water supply part 351, the high pressure water supply part 352, the ultrasonic cleaning water supply part 353, and the pure water supply part 354 which are arrange|positioned in this order from upstream to downstream. Like the chemical liquid portion 34 , each of the parts 351 to 354 includes a nozzle for discharging the liquid to the substrate W, a supply pipe connected to the nozzle, and a pump for supplying the liquid to the nozzle through the supply pipe.

The pump 35t of the low-pressure water supply part 351 is a low-pressure pump, and draws cleaning water from the first water tank 355 at a relatively low pressure and supplies it to the nozzle. Thereby, the low-pressure water supply unit 351 can supply the cleaning water to the substrate W at a low pressure. The low-pressure water supply part 351 is provided with a slit nozzle (also referred to as a liquid knife) 35a, and cleaning water is also supplied to the substrate W from the liquid knife 35a. The pressure of the washing water supplied to the low-pressure water supply unit 351 is measured by the pressure sensor 357 .

The pump 35r of the high-pressure water supply part 352 is a high-pressure pump, and draws washing water from the first water tank 355 at a relatively high pressure and supplies it to the nozzle. Thereby, the high-pressure water supply unit 352 can supply the cleaning water to the substrate W at a high pressure. The pressure of the washing water supplied to the high-pressure water supply unit 352 is measured by the pressure sensor 358 . The cleaning water supplied from the low-pressure water supply part 351 and the high-pressure water supply part 352 falls mainly from the periphery of the substrate W and is recovered into the first water tank 355 .

The nozzle 35b of the ultrasonic cleaning water supply part 353 is provided with the ultrasonic oscillator which applies ultrasonic vibration to the cleaning water from the 2nd water tank 356. The nozzle 35b functions as a liquid knife. The pump 35s of the ultrasonic cleaning water supply part 353 draws cleaning water from the second water tank 356 and supplies it to the nozzle 35b. When the ultrasonic oscillator of the nozzle 35b vibrates, the ultrasonic cleaning water supply part 353 supplies the cleaning water in a vibrating state to the substrate W from the nozzle 35b. The cleaning water supplied by the ultrasonic cleaning water supply unit 353 is mainly recovered to the second water tank 356 . The flow rate of the washing water supplied to the nozzle 35b is measured by the flow rate sensor 359 .

The nozzle of the pure water supply part 354 supplies the pure water supplied from the pure water supply source 365 toward the substrate W. The pure water supply source 365 is installed, for example, as a factory facility (a public facility). This pure water is mainly recovered to the second water tank 356 .

The water removal unit 36 is a device that blows water off the substrate W by flowing a high-pressure airflow to the substrate W. As shown in FIG. The moisture removal unit 36 includes an injection unit (drying air knife) 361 that injects gas onto the substrate W, a gas supply source 362 that supplies the gas, and a pipeline 363 that connects the injection unit 361 and the gas supply source 362 . A flow sensor 364 for measuring the flow rate of the gas is provided in the pipeline 363 . The gas supply source 362 is provided as a gas source of factory facilities (common facilities).

As described above, the substrate W is conveyed in the conveyance direction in the processing apparatus main body 32, and various processes are performed at each position. The substrate W on which all processing has been performed by the processing apparatus main body 32 is conveyed to the substrate lead-out portion 33 .

<3. Simultaneous processing device 40> FIG. 3 is a diagram schematically showing an example of the configuration of the simultaneous processing apparatus 40 . Here, as the simultaneous processing apparatus 40, the dehydration and baking apparatus 13 can be mentioned as an example and demonstrated. FIG. 3 is a schematic plan view showing an example of the configuration of the dehydration and baking apparatus 13 when viewed vertically downward.

<3-1. Dehydration and baking device 13> The dehydration and baking apparatus 13 includes a heating unit 82 and a cooling unit 83 . The dehydration and baking apparatus 13 receives the substrates W that have been cleaned by the cleaning apparatus 12 (as the sequential processing apparatus 30 ) from the transfer robot (transfer portion) 81 , and processes the received substrates W simultaneously. The dehydration baking device 13 can process a plurality of (N) substrates W at the same time. Hereinafter, first, for simplicity, the case where two substrates W are collectively processed will be described. The case where the N-piece substrates W are not collectively processed will be described in detail later.

<3-1-1. Transfer robot 81> The transfer robot 81 includes a hand H1 , a movement mechanism 51 , a lift mechanism 52 , and a rotation mechanism 53 . The moving mechanism 51 can move the hand H1 in the horizontal plane. For example, the moving mechanism 51 has a pair of arms (not shown). Each arm has a plurality of elongated connecting members, and the ends of the connecting members are rotatably connected to each other. One end of each arm is connected to the hand H1 , and the other end is connected to the elevating mechanism 52 . By controlling the connection angle of the connection member, the hand H1 can be moved in the horizontal plane. The raising and lowering mechanism 52 raises and lowers the hand H1 by raising and lowering the arm in the vertical direction. The elevating mechanism 52 has, for example, a ball screw mechanism. The rotation mechanism 53 can rotate the elevating mechanism 52 around a rotation axis along the vertical direction. Thereby, the hand H1 is rotated in the circumferential direction. By this rotation, the orientation of the hand H1 can be changed. The rotation mechanism 53 has, for example, a motor.

On the hand H1, two substrates W are placed in a state of being aligned in one of the horizontal directions (the left-right direction in FIG. 3). The hand H1 has, for example, a plurality of finger members F1 and a proximal end member P1 that connects the proximal ends of the finger members F1 to each other. One end of the above-mentioned arm is connected to the base end member P1. The finger member F1 has an elongated shape, and the substrate W is placed on the upper surface thereof. The two substrates W are aligned and mounted along the longitudinal direction of the finger member F1 (the left-right direction in FIG. 3 ). Therefore, the length in the longitudinal direction of the finger member F1 is set according to the length of the two substrates W and the interval between the substrates W. As shown in FIG.

By appropriately moving and rotating the hand H1, the transfer robot 81 can move the hand H1 toward the heating part 82, the cooling part 83, the substrate lead-out part 33 of the cleaning device 12, and the coating-related device 14 in the next step (see Fig. 3 (not shown in the figure) move. The transfer robot 81 can collectively take out two substrates W from each of the substrate lead-out unit 33 , the heating unit 82 and the cooling unit 83 , or can collectively deliver the two substrates W to the heating unit 82 , the cooling unit 83 and the coating-related each of the devices 14.

For example, the transfer robot 81 collectively takes out the two substrates W from the substrate lead-out unit 33 as follows. That is, the transfer robot 81 moves the hand H1 toward the substrate lead-out portion 33 so that the hand H1 is positioned below the two substrates W held by the substrate lead-out portion 33 .

In addition, the rollers 331 and 332 are configured to avoid collision with the hand H1 of the transfer robot 81 . Furthermore, the transfer robot 81 can lift up the N-piece substrates W by the hand H1 by raising the hand H1 vertically upward. Thereby, the two substrates W are separated from the rollers 331 and 332, respectively. The two substrates W are placed on the hand H1 at intervals along the longitudinal direction thereof. The two substrates W are placed on the hand H1 in a posture in which the normal line direction of the main surface is along the vertical direction.

The two substrates W may be placed on the hand H1 so as to be arranged at intervals along the lateral direction (short-side direction). Such mounting can be realized, for example, by providing a turntable and rotating the substrate W by 90 degrees.

Next, the transfer robot 81 moves the hand H1 away from the substrate lead-out portion 33 to collectively take out the two substrates W from the substrate lead-out portion 33 .

Furthermore, a plurality of suction ports may be formed on the upper surface of the finger member F1 (the surface on which the substrate W is placed). The suction port is provided at a position facing the two substrates W, and air is sucked out from the suction port to suck the substrates W. As shown in FIG. Thereby, the holding force for holding the substrate W can be improved.

The transfer robot 81 collectively takes out two substrates W from each of the heating unit 82 and the cooling unit 83 by the same operation as the above-mentioned operation. On the other hand, the transfer robot 81 collectively delivers the two substrates W to each of the heating unit 82 , the cooling unit 83 , and the coating-related device 14 (hereinafter referred to as each unit) in the reverse order of the above operation. That is, the transfer robot 81 moves the hand H1 on which the two substrates W are placed inside each part, and lowers the hand H1 to collectively place the two substrates W on the upper surface of the substrate holding part of each part. In addition, the board holding|maintenance part of each part is comprised so that it may not collide with the hand H1 when the board|substrate W of two sheets is carried in and carried out. Then, the transfer robot 81 moves the hand H1 from the inside to the outside of each part. Thereby, the two substrates W are collectively handed over to each unit.

As described above, the transfer robot 81 can align and hold the N (two) substrates W among the plurality of substrates W processed by the cleaning device 12 as the sequential processing device in a horizontal direction, while holding The N pieces (two pieces) of substrates W are collectively conveyed to the dehydration baking apparatus 13 as a simultaneous processing apparatus. By collectively conveying the plurality of substrates W, the throughput of the conveying operation can be improved compared to the case where the substrates W are conveyed one at a time.

<3-1-2. Heating part 82> The two substrates W are collectively handed over to the heating unit 82 from the transfer robot 81 . The heating unit 82 includes a substrate holding unit 91 that holds the two substrates W aligned in the horizontal direction, and a heating means 92 that simultaneously heat-processes the two substrates W collectively. In other words, the heating unit 82 heats the two substrates W at the same time.

The board|substrate holding part 91 has the member which supports the lower surface of the board|substrate W of two sheets. The two substrates W are held by being placed on the member. The two substrates W are placed in a posture in which the normal line direction of the main surface is along the vertical direction. For example, the board|substrate holding part 91 is equipped with the several lift pins (not shown). The plurality of lift pins are moved up and down between a position where the front end thereof protrudes above the upper surface of the substrate holding portion 91 and a position where it is retracted to a lower position than the upper surface. The transfer robot 81 withdraws from the heating unit 82 after passing the two substrates W to the plurality of lift pins protruding upward. The plurality of lift pins descend while supporting the two substrates W, and the two substrates W are placed on the upper surface of the substrate holding portion 91 .

The heating means 92 is, for example, a heater or the like, and collectively heat-processes the two substrates W held by the substrate holding portion 91 at the same time. By this heat treatment, for example, pure water remaining on the substrate W can be evaporated (dehydration treatment). By collectively subjecting the plurality of substrates W to the heat treatment at the same time, the throughput of the heat treatment can be improved as compared with the case of subjecting the substrates W to the heat treatment one at a time.

<3-1-3. Cooling part 83> The two substrates W heated by the heating unit 82 are collectively handed over to the cooling unit 83 from the transfer robot 81 . That is, the transfer robot 81 aligns and holds the two substrates W processed by the heating unit 82 after being processed by the cleaning device 12 as the sequential processing device in one of the horizontal directions. The two substrates W are collectively conveyed to the cooling unit 83 . The cooling unit 83 includes a substrate holding unit 93 that holds the two substrates W aligned in the horizontal direction, and a cooling means 94 that performs cooling processing on the two substrates W collectively. In other words, the cooling unit 83 performs the cooling process on the two substrates W at the same time.

The substrate holding portion 93 has a member (not shown) for supporting the lower surfaces of the two substrates W. As shown in FIG. The two substrates W are held by being placed on the member. The two substrates W are placed in a posture in which the normal direction of the main surface is along the vertical direction. The structure of the substrate holding portion 93 is the same as that of the substrate holding portion 91 .

The cooling means 94 is, for example, a cooling plate or the like that allows cold water to flow through a liquid passage formed inside the metal plate, and collectively cools the two substrates W held by the substrate holding portion 93 . The cooling means 94 is controlled by the control unit 60 . By this cooling process, the two substrates W are cooled, and the temperature of the two substrates W can be set to a temperature suitable for the processing device (coating-related device 14 ) on the downstream side. By collectively performing the cooling process on the two substrates W at the same time, the throughput of the cooling process can be improved compared to the case where the cooling process is performed on the substrates W one at a time.

Furthermore, the cooling unit 83 may cool the two substrates W by natural cooling. The so-called natural cooling system does not cool the heated substrate W using power (electricity), but leaves the substrate W to cool. In this case, the cooling means 94 constituted as a cooling plate or the like is not required.

<3-1-4. One series of processing of dehydration and baking equipment> Next, a series of processes performed by the dehydration and baking apparatus 13 will be briefly described. The transfer robot 81 takes out the two substrates W collectively from the substrate lead-out unit 33 of the upstream cleaning device 12 , and transfers the two substrates W collectively to the heating unit 82 . Even in the heating section 82, the two substrates W are held in a state of being aligned in the horizontal direction. The heating unit 82 heats the two substrates W collectively. The two substrates W after the heat treatment are collectively taken out by the transfer robot 81 and handed to the cooling unit 83 collectively. Even in the cooling section 83, the two substrates W are held in a state of being aligned in the horizontal direction. The cooling unit 83 performs cooling processing on the two substrates W collectively. The two substrates W that have been cooled are collectively taken out by the transfer robot 81 and collectively transported to the coating-related apparatus 14 .

<4. Control section> As illustrated in FIG. 1 , the substrate processing apparatus 1 includes a control unit 60 that controls the processing in each processing apparatus and the conveyance of the substrate. FIG. 4 is a functional block diagram schematically showing an example of the configuration of the control unit 60 .

The control unit 60 is a control circuit, as shown in FIG. 4 , for example, a CPU (Central Processing Unit) 61 , a ROM (Read Only Memory) 62 , and a RAM (Random Access Memory) The memory) 63, the storage device 64, and the like are composed of a general computer in which the bus lines 65 are connected to each other. The ROM 62 stores basic programs and the like, and the RAM 63 is used as a work area when the CPU 61 performs predetermined processing. The storage device 64 is constituted by a non-volatile storage device such as a flash memory or a hard disk device.

In addition, in the control unit 60 , the input unit 66 , the display unit 67 , and the communication unit 68 are also connected to the bus line 65 . The input unit 66 is composed of various switches, a touch panel, and the like, and receives various input setting instructions such as processing recipes from an operator. The display unit 67 is composed of a liquid crystal display device, lamps, etc., and displays various information under the control of the CPU 61 . The communication unit 68 has a data communication function via a LAN (Local Area Network) or the like.

Moreover, each robot (transfer robot, such as an indexing robot, etc.) and each processing apparatus mentioned above are connected to the control part 60 as a control object. That is, the control part 60 can function as a conveyance control part which controls the conveyance of the board|substrate W.

The storage device 64 of the control unit 60 stores a processing program P for controlling each device constituting the substrate processing apparatus 1 . The conveying operation and the processing operation of the substrate are controlled by the execution of the processing program P by the CPU 61 of the control unit 60 . In addition, the processing program P may also be stored in a recording medium. When this recording medium is used, the processing program P can be installed in the control unit 60 (computer). In addition, some or all of the functions performed by the control unit 60 are not necessarily realized by software, and may be realized by hardware such as a dedicated logic circuit.

The control unit 60 may have a plurality of hierarchical structures. For example, the control unit 60 may include a main control unit and a plurality of terminal control units. The end control unit is provided, for example, in each of the indexing unit 11 , the cleaning device 12 , the dehydration baking device 13 , the coating-related device 14 , the prebaking device 15 , the exposure device 16 , the developing device 17 , and the post-baking device 18 . processing device. The main control unit is provided in the substrate processing apparatus 1 and communicates with a plurality of end control units. The main control unit manages the overall operation of the substrate processing apparatus 1 , and the end control unit controls the operation of each corresponding apparatus.

A plurality of terminal control units can communicate with each other. For example, data related to the substrate W is transmitted and received between the terminal control units. The data related to the substrate W, for example, represents the data of the substrate W in units of groups, and the information representing the content of the processing of the substrate W is included in the data. The end control unit controls the corresponding device according to the data of the substrate W received from an upstream end control unit, and processes the substrate W. For example, the end control part of the cleaning device 12 receives the data of the substrates W from the end control part of the indexing part 11 , and the substrates W are carried into the cleaning device 12 in units of groups. The end control part of the cleaning device 12 controls the cleaning device 12 according to the data of the received substrate, and performs cleaning processing on the loaded substrate W. Then, after the processing of the substrates W is completed, the substrates W are transferred to the dehydration baking device 13 in groups, and the data of the substrates W are transferred from the end control part of the cleaning device 12 to the end of the dehydration baking device 13. device. Hereinafter, processing is performed in the same manner.

<5. Simultaneous processing of substrate data> The control part 60 can process the board|substrate data corresponding to each board|substrate W. The control unit 60 controls the processing of the substrate W in the simultaneous processing apparatus 40 based on the simultaneous processing substrate data D0(k).

FIG. 5 is a diagram schematically showing an example of the simultaneous processing of the substrate data D0(k) (k is a positive integer). The simultaneously processed substrate data D0(k) includes data corresponding to the N (here, 2) substrates W belonging to the k-th group. The substrates W belonging to the same group are collectively conveyed when being conveyed between the simultaneous processing apparatus and the sequential processing apparatus.

As illustrated in FIG. 5 , the simultaneously processed substrate data D0(k) includes the substrate number, group identification information Da1, position information Db1, and recipe information Dc1.

The substrate number is used to identify the information of the substrates W belonging to the same group. In the example shown in FIG. 5 , the substrate number of one substrate W is (substrate) W1, and the substrate number of the other substrate W is (substrate) W2.

The group identification information Da1 indicates which group the simultaneously processed substrate data D0(k) corresponds to. In the example shown in FIG. 5 , since a pair of substrates belong to one group, the pairing number k is used as the group identification information Da1 . For example, in the simultaneous processing of the substrate data D0(1) regarding the first group, the pairing number 1 is adopted as the group identification information Da1. Likewise, in the simultaneous processing of the substrate data D0 ( 2 ) regarding the second group, the pairing number 2 is adopted as the group identification information Da1 .

FIG. 6 is a diagram schematically showing a state in which a plurality of substrates are accommodated in groups in the cassette 10 . A plurality of substrates are accommodated in different accommodating positions (slots) in a group unit in the cassette 10 . Therefore, as the group identification information Da1, information (slot number) indicating the storage position of the group in the cassette 10 may also be used.

The state in which the substrates W are accommodated in the cassette 10 is the same when the substrates W are transferred from the indexing unit 11 to the cleaning device 12 and when the substrates are transferred from the post-baking device 18 to the indexing unit 11 .

The different sockets in Figure 6 are located above and below the figure. In FIG. 6 , the case where two substrates W1(k) and W2(k) are accommodated in any of the k-th groups is illustrated.

The substrates W1(k) and W2(k) belonging to the k-th group in the cassette 10 (wherein k=1 to 7 in FIG. 6 ) are accommodated in the left-right direction in the drawing. The substrate W1(k) can be exemplified as the substrate W1 described above, and the substrate W2(k) can be exemplified as the substrate W2 described above.

The positional information Db1 indicates the positional relationship in the conveyance direction of the substrates W of N pieces (here, two pieces). In the example shown in FIG. 5 , the substrate W1(k) corresponding to the substrate number W1 in the k-th group is located on the upstream side with respect to the substrate W2(k) corresponding to the substrate number W2, and relative to the substrate numbers W1 and W2 The position information Db1 represents "upstream" and "downstream", respectively. The position information Db1 is mainly used for conveyance control in the sequential processing device 30 . Specifically, the sequential processing apparatus 30 firstly transports the substrate W2(k) assigned the "downstream" position information Db1, and then transports the substrate W1(k) assigned the "upstream" position information Db1.

In the following description, the larger the value indicated by the group identification information Da1 is, the more upstream the substrates belonging to the group corresponding to the group identification information Da1 are conveyed. For example, when the substrates accommodated in the slots shown above in FIG. 6 are sequentially carried out toward the substrates accommodated in the slots shown below, the substrates W1 ( 3 ) are higher than the substrates W2 ( 3 ). ) is transported further upstream, the substrate W2(3) is transported further upstream than the substrate W1(2), the substrate W1(2) is transported further upstream than the substrate W2(2), and the substrate W2(2) is transported further upstream than the substrate W2(2) The substrate W1(1) is conveyed further upstream, and the substrate W1(1) is conveyed further upstream than the substrate W2(1).

The recipe information Dc1 includes information indicating that the substrates W1(k) and W2(k) that should be assigned the same pairing number k (that is, belonging to the k-th group) to the group identification information Da1 are processed in common (for example, the recipe number). ), and information on the processing conditions for that processing.

As processing conditions, for example, in the cleaning process, conditions such as the type of chemical solution to be used, the flow rate of the chemical solution, and the processing time (ie, conveying speed) can be adopted. For example, in the case of dehydration baking treatment, conditions such as heating temperature, heating time, cooling temperature, and cooling time can be employed as treatment conditions.

Since the recipe information Dc1 is information common to the substrates W1(k) and W2(k), the recipe information Dc1 is common to the substrate numbers W1 and W2, and corresponds to the group identification information Da1.

FIG. 7 is a diagram schematically showing another aspect in which a plurality of substrates W are accommodated in units of groups in the cassette 10 . In FIG. 7 , in the second group, the substrate W2 ( 2 ) is not accommodated and only the substrate W1 ( 2 ) is accommodated, and in the fifth group, the substrate W1 ( 5 ) is not accommodated and only the substrate W2 ( 5) The situation of being accepted.

FIG. 8 is a diagram schematically showing an example of the simultaneous processing of the substrate data D0(k) when the substrate W2(k) on the downstream side in the k-th group does not exist. FIG. 9 is a diagram schematically showing an example of the simultaneous processing of the substrate data D0(k) when the upstream-side substrate W1(k) in the k-th group does not exist. 7, FIG. 5 corresponds to the case of k=1, 3, 4, 6, 7, FIG. 8 corresponds to the case of k=2, and FIG. 9 corresponds to the case of k=5.

In FIGS. 5 , 8 , 9 , 11 , 12 , and 15 , a column marked with a mark “×” indicates that the value corresponding to the column has no special meaning. Here, "not meaningful" includes not only the absence of a substrate, but also a case where even if a certain object exists, the object is not an object of evaluation.

FIG. 10 is similar to FIG. 3 , and is a schematic plan view of the simultaneous processing device 40 (eg, the dehydration and baking device 13 ) viewed vertically downward. FIG. 10 schematically shows an example of substrate transfer by the simultaneous processing apparatus 40 . In FIG. 3, the case where the board|substrates W are paired and processed is illustrated. In FIG. 10, the case where the board|substrate W is processed in the unit of a group is illustrated. Among them, in the first group, the substrate W2(1) does not exist but the substrate W1(1) exists, in the second group, the substrate W1(2) does not exist but the substrate W2(2) exists, and in the third group The case where both substrates W1(3) and W2(3) exist in the group. The positions of the substrates W2(1) and W1(2) when they are assumed to exist are represented by single-dot chain lines.

10, FIG. 5 corresponds to the case of k=3, FIG. 8 corresponds to the case of k=1, and FIG. 9 corresponds to the case of k=2.

The simultaneous processing device 40 can simultaneously process the substrate data D0(k) according to the setting of each group, and the substrates W1(k) and W2(k) can be processed simultaneously on a group-by-group basis. From this viewpoint, the indexing unit 11 can also be regarded as an example of the simultaneous processing device 40 .

<6. Sequential processing of substrate data> The sequentially processed substrate data J1(k) and J2(k) are respectively set according to the substrates W1(k) and W2(k) belonging to the kth group. The sequentially processed substrate data J1(k) includes group identification information Da1, position information Db1, and recipe information Dc1 about the corresponding substrate W1(k). The sequentially processed substrate data J2(k) includes position information Db1 and recipe information Dc1 about the corresponding substrate W2(k).

In the following description, the sequentially processed substrate data J1(k) includes the substrate number W1, and the sequentially processed substrate data J2(k) includes the substrate number W2. However, since the sequential processing board data J1(k) is set with respect to the board|substrate W1(k), it is unnecessary to include the board|substrate number W1. Since the sequential processing board data J2(k) is set with respect to the board|substrate W2(k), it is unnecessary to include the board|substrate number W2.

The sequentially processed substrate data J1(k) and J2(k) are generated from the simultaneous processing of the substrate data D0(k) by the control unit 60 . The control part 60 controls the sequential processing device 30 (eg, the cleaning device 12 located downstream of the indexing part 11 and located upstream of the dehydration baking device 13 ) according to the sequential processing of the substrate data J1(k) and J2(k). For the conveyance and processing of the substrates W1(k) and W2(k).

The sequential processing apparatus 30 sequentially transfers the substrates W1(k) and W2(k) divided into a plurality of groups, and processes the substrates W1(k) and W2(k) according to the sequentially processed substrate data J1(k) and J2(k). ) and W2(k) for processing.

<6-1. When there is no shortage of substrates in the group> In this section, the case where the substrates W1(k) and W2(k) exist in all the k-th groups (k=1, 2, 3) will be described. FIG. 5 corresponds to the simultaneous processing of the substrate data D0(k) in this case. FIG. 11 is a diagram schematically showing an example of the sequential processing of the substrate data J1(k) in this case. FIG. 12 is a diagram schematically showing an example of the sequential processing of the substrate data J2(k) in this case.

Regardless of the sequential processing of the group identification information Da1 of any one of the substrate data J1(k) and J2(k), the group identification information Da1 included in the simultaneous processing of the substrate data D0(k) is used. Thereby, the grouping of the substrates W in the sequential processing apparatus 30 is maintained, and the conveyance and processing of the substrates W are managed on a group basis.

The position information Db1 of the substrate data J1(k) is processed sequentially, and the position information Db1 ("upstream") corresponding to the substrate number W1 in the substrate data D0(k) is processed simultaneously. The position information Db1 ("downstream") of the substrate data D0(k) corresponding to the substrate number W2 in the simultaneous processing of the substrate data J2(k) is processed sequentially. The relationship between the transport positions of the substrates W in the simultaneous processing apparatus 40 and the sequential processing apparatus 30 is maintained, and the transport and processing of the substrates W are managed on a group basis.

Regardless of whether the recipe information Dc1 of any one of the substrate data J1(k) and J2(k) is processed sequentially, the recipe information Dc1 included in the simultaneous processing of the substrate data D0(k) is used. The reason for this is that the recipe information Dc1 is information indicating the processing that should be commonly performed on any of the substrates W1(k) and W2(k) and processing conditions for the processing.

Either one of the sequentially processed substrate data J1(k), J2(k) includes the final information Dd1. The final information Dd1 indicates whether the substrate Wn(k) is the last sheet in the conveying direction in the k-th group to which the substrate Wn(k) corresponding to a substrate number Wn (n is an integer of 1 or more and N or less) belongs. Here, the number coefficient of the substrates W belonging to the k-th group is N=2, any one of the substrates W1(k) and W2(k) exists, and the conveying position of the substrate W1(k) is located higher than that of the substrate W2 ( The conveying position of k) is further upstream. Therefore, the final information Dd1 in the sequentially processed substrate data J1(k) is adopted to indicate that the substrate W1(k) corresponding to the sequentially processed substrate data J1(k) is the last sheet in the kth group (this is also the most upstream) "END". The final information Dd1 in the substrate data J1(k) is processed sequentially, and the value is not specially used.

Furthermore, any one of the substrate data J1(k) and J2(k) may or may not contain the final information Dd1 in sequence. This case will be described later in <6-2-2> and <6-2-3>.

FIG. 13 is a side view schematically showing an example of substrate transfer by the sequential processing apparatus 30 . In FIG. 13 , from the structure of the sequential processing apparatus 30 shown in FIG. 2 , the description of the structure of supplying liquid or gas and the structure of recovering liquid is omitted.

In the state shown in FIG. 13 , the substrates W1 ( 3 ) and W2 ( 3 ) are located in the substrate introduction portion 31 . The fact that the substrate W1 ( 3 ) is placed on the roller 311 is detected by the sensor 314 . The fact that the substrate W2 ( 3 ) is placed on the roller 313 is detected by the sensor 315 .

The substrate W1(2) is located in the chemical liquid part 34 further downstream than the substrates W1(3) and W2(3). The substrate W2(2) is located in the water washing part 35 further downstream than the substrate W1(2).

The substrates W1(1) and W2(1) are located in the substrate lead-out portion 33 downstream of the substrate W2(2). The fact that the substrate W1 ( 1 ) is placed on the roller 331 is detected by the sensor 334 . The fact that the substrate W2( 1 ) is placed on the roller 332 is detected by the sensor 335 .

Before this state, the substrates W1 ( 1 ) and W2 ( 1 ) are located in the substrate introduction portion 31 , and thereafter, the substrates W1 ( 1 ) and W2 ( 1 ) are transported to the processing apparatus main body 32 . The control unit 60 generates sequentially processed substrate data J1(1) and J2(1) when, for example, the presence of the substrates W1(1) and W2(1) is detected by the sensors 314 and 315 as a trigger. Thereafter, similarly, the substrates W1(2) and W2(2) are located in the substrate introduction portion 31 to generate sequentially processed substrate data J1(2) and J2(2), and the substrates W1(3) and W2(3) are located in the substrates The introduction unit 31 generates sequentially processed substrate data J1(3) and J2(3).

After reaching the state shown in FIG. 13 , the substrates W1( 1 ) and W2 ( 1 ) are discharged from the substrate lead-out portion 33 to the simultaneous processing apparatus 40 (for example, the dehydration baking apparatus 13 ) located further downstream.

The control unit 60 generates the simultaneously processed substrate data D0(k) from the sequentially processed substrate data J1(k) and J2(k). For example, the concurrently processed substrate data D0(k) is generated when the sensor 334 detects the substrate W1(k) corresponding to the sequentially processed substrate data J1(k) using "END" in the final information Dd1.

Simultaneous processing substrate data D0(1) is generated by sequentially processing substrate data J1(1) and J2(1) in the following manner.

At the same time, the group identification information Da1 in the substrate data D0(1) is processed, and the group identification information Da1 common to the substrate data J1(1) and J2(1) is processed sequentially. Thereby, the grouping of the substrates W in the processing apparatus 40 is maintained even when they are located downstream, and the conveyance and processing of the substrates W are managed on a group basis.

At the same time, the recipe information Dc1 in the substrate data D0(1) is processed, and the common recipe information Dc1 in the substrate data J1(1) and J2(1) is processed sequentially. The reason for this is that the recipe information Dc1 is information indicating the processing that should be commonly performed on either of the substrates W1(1) and W2(1) and processing conditions for the processing.

The position information Db1 relative to the substrate number W1 in the substrate data D0(1) is processed simultaneously, and the position information Db1 ("upstream") in the substrate data J1(1) is processed sequentially. The position information Db1 relative to the substrate number W2 in the substrate data D0(1) is processed simultaneously, and the position information Db1 (“downstream”) in the substrate data J2(1) is processed sequentially. Although the position information Db1 is not necessarily used in the simultaneous processing device 40 , it is used in other sequential processing devices 30 (eg, the developing device 17 ) located further downstream than the simultaneous processing device 40 . Using the position information Db1 in the simultaneous processing of the substrate data D0 ( 1 ) helps to generate the sequentially processed substrate data J1 ( 1 ) and J2 ( 1 ) used by the other sequentially processed devices 30 .

In the process of the simultaneous processing apparatus 40, the relationship of the conveyance position of the board|substrate W is small. As will be described later, the final information Dd1 is information that varies according to the lack of substrates in the sequential processing apparatus 30 , and does not need to be commonly used in a plurality of sequential processing apparatuses 30 . Therefore, the necessity of maintaining the final information Dd1 during the simultaneous processing of the substrate data D0(k) is small and can be omitted.

After the substrates W1 ( 1 ) and W2 ( 1 ) are ejected from the substrate lead-out portion 33 , the processing in the sequential processing apparatus 30 is continued and the substrates W1 ( 2 ) and W2 ( 2 ) are located in the substrate lead-out portion 33 . Similar to the simultaneous processing of the substrate data D0 ( 1 ), the simultaneous processing of the substrate data D0 ( 2 ) is generated from the sequential processing of the substrate data J1 ( 2 ) and J2 ( 2 ). Thereafter, the substrate data D0(3) is processed simultaneously and generated from the sequential processing of the substrate data J1(3) and J2(3).

The processing of the simultaneous processing apparatus 40 is performed according to the simultaneous processing substrate data D0(k) corresponding to each group, the upstream and downstream groups of the sequential processing apparatus 30 are maintained, and the conveyance and processing of the substrate W are performed by Groups are managed in units.

<6-2. The case where the board is missing in the group> In this section, the case where the substrates W1(k) and W2(k) do not exist in any of the k-th group (k=1, 2, 3) will be described.

<6-2-1. The case where the substrate on the upstream side is excluded in the sequential processing apparatus> FIG. 5 corresponds to the simultaneous processing of the substrate data D0(k) in this case. FIG. 11 is a diagram schematically showing an example of the sequentially processed substrate data J1(k) generated first in this case. FIG. 12 is a diagram schematically showing an example of the sequentially processed substrate data J2(k) generated first in this case. The term "initially generated" refers to generation when the substrates W1(k) and W2(k) are located in the substrate introduction portion 31 .

FIG. 14 is a side view schematically showing an example of substrate transfer by the sequential processing apparatus 30 . In FIG. 14 , the description of the configuration of supplying liquid or gas and the configuration of recovering liquid is also omitted from the configuration of the sequential processing apparatus 30 shown in FIG. 2 .

The state shown in FIG. 14 shows a state in which the substrate W1 ( 1 ) existing in the state shown in FIG. 13 is removed when the water removal unit 36 is processed. The position of the substrate W1 ( 1 ) before being excluded is imaginarily represented by a single-dot chain line.

This removal is performed by the operator when, for example, the substrate W1 ( 1 ) is damaged in the moisture removal unit 36 or a processing defect including the substrate W ( 1 ) falling from the roller 321 occurs.

The operator who carries out this exclusion operates the control unit 60 to cause the control unit 60 to delete the sequentially processed board data J1 ( 1 ). The control unit 60 confirms the content of the final information Dd1 when the sequentially processed substrate data J1(1) is to be deleted. The final information Dd1 of the sequential processing of the substrate data J1(1) is “END”, but since the substrate W1(1) has been excluded, the control unit 60 regenerates and belongs to the same group further downstream than the substrate W1(1). The substrate data J2(1) corresponding to the substrate W2(1) is processed sequentially. The so-called re-generation here also includes "END" as the final information Dd1 and is transmitted toward the sequentially processed substrate data J2 ( 1 ). Specifically, the group identification information Da1, the position information Db1, and the recipe information Dc1 of the sequentially processed substrate data J2(1) are maintained, and the final information Dd1 adopts "END". The re-generation of the sequentially processed substrate data J2(1) can also be regarded as the update of the sequentially processed substrate data J2(1).

Before the sequentially processed substrate data J1(1) is deleted, the sequentially processed substrate data J1(1) corresponds to the case of k=1 in FIG. 11 . The sequentially processed substrate data J2(1) before being updated corresponds to the case of k=1 in FIG. 12 . FIG. 15 shows the sequentially processed substrate data J2(k) after being updated. The updated sequentially processed substrate data J2 ( 1 ) corresponds to the case of k=1 in FIG. 15 , and the final information Dd1 adopts “END”. The configuration shown in FIG. 15 differs from the configuration shown in FIG. 12 only in that the final information Dd1 adopts "END".

Simultaneous processing substrate data D0(1) is generated when the sensor 335 detects the substrate W2(1) corresponding to the sequentially processed substrate data J2(1) using "END" in the final information Dd1. The substrate W2 ( 1 ) is discharged from the substrate lead-out portion 33 .

The concurrently processed substrate data D0(1) is generated using the sequentially processed substrate data J2(1) instead of the deleted sequentially processed substrate data J1(1).

At the same time, the group identification information Da1 in the substrate data D0(1) is processed, and the group identification information Da1 in the substrate data J2(1) is processed sequentially. Thereby, the grouping of the substrates W in the processing apparatus 40 is maintained even when they are located downstream, and the conveyance and processing of the substrates W are managed on a group-by-group basis.

The recipe information Dc1 in the substrate data D0(1) is processed simultaneously, and the recipe information Dc1 in the substrate data J2(1) is processed sequentially. The reason for this is that the recipe information Dc1 indicates information indicating the processing to be performed on the substrate W2 ( 1 ) and the processing conditions in the processing regardless of the presence or absence of the substrate W1 ( 1 ).

The board number W1 and the position information Db1 relative to the board number W1 are not used in the simultaneous processing board data D0(1). The position information Db1 in the substrate data D0(1) relative to the substrate number W2 is processed simultaneously, and the position information Db1 in the substrate data J2(1) is processed sequentially. The final information Dd1 is not required in the simultaneous processing of the substrate data D0(k).

In this way, the processing of the simultaneous processing device 40 is performed according to the simultaneously processed substrate data D0(k) corresponding to each group, even if the substrate W is excluded, the upstream and downstream groups in the sequential processing device 30 are maintained, And the conveyance and processing of the board|substrate W are managed by group unit.

For example, the substrate data J2(1) can be processed sequentially after the final information Dd1 is updated with "END", and the alarm is triggered by the detection of the substrate W2(1) by the sensor 335, for example, by the display unit 67. issued. The issuance of the alarm indicates that the number of substrates constituting the group is abnormal due to the removal of the substrate W, which will help to draw the attention of the operator of the substrate processing apparatus 1 .

<6-2-2. In the case of confirming the presence or absence of the upstream side substrate in the sequential processing apparatus> In the method described in this item, no matter what the value of the final information Dd1 is, any one of the substrate data J1(k) and J2(k) processed sequentially may not include the final information Dd1.

As a first example of the case where the presence or absence of the substrate on the upstream side is confirmed in the sequential processing apparatus, as described in <6-2-1>, the substrate W1 ( 1 ) is conveyed in the sequential processing apparatus 30 . And in the middle of accepting processing, the situation is excluded by the operator. As a second example, there is a case in which the substrate W1(k) on the upstream side no longer exists at the time when the substrate W has been conveyed toward the substrate introduction portion 31, and the substrate number in the substrate data D0(k) is processed at the same time. W1 does not exist either. In the following description, the case where the board|substrate W1(1) does not exist and the board|substrate W2(1) exists is illustrated as a 1st example or as a 2nd example.

FIG. 16 is a side view schematically showing an example of substrate transfer by the sequential processing apparatus 30 . In FIG. 16 , the configuration of supplying liquid or gas and the configuration of recovering liquid are omitted from the configuration of the sequential processing apparatus 30 shown in FIG. 2 for illustration.

In the first example, as described in <6-2-1>, the control unit 60 deletes the sequentially processed board data J1 ( 1 ). The sequential processing of the substrate data J2( 1 ) can be maintained in the structure set to k=1 in FIG. 12 , or can be updated to the structure set to k=1 in FIG. 15 .

In the second example and the simultaneous processing substrate data D0 ( 1 ) has a structure where k=1 in FIG. 9 , the control unit 60 does not generate the sequentially processed substrate data J1 ( 1 ), but generates the sequentially processed substrate data J2 (1). The sequentially processed substrate data J2( 1 ) may have a structure set to k=1 in FIG. 15 or a structure set to k=1 in FIG. 12 . The substrate data J2(1) can be processed sequentially without including the final information Dd1.

Regardless of the first or second example, the sequentially processed substrate data J1(1) does not exist, the substrate W1(1) is not detected by the sensor 334, and it is confirmed that the substrate W1(1) is missing. Taking this confirmation and the detection of the substrate W2(1) by the sensor 335 as a trigger, the sequentially processed substrate data J2(1) is used to generate the concurrently processed substrate data D0(1). The substrate W2 ( 1 ) is discharged from the substrate lead-out portion 33 .

For example, when the sensor 335 detects the substrate W2, the control unit 60, the group identification information Da1 for sequentially processing the substrate data for the substrate W2, and the sequentially processing substrate data for a substrate W on the upstream side of the substrate W2 The group identification information Da1 is compared. Arranging the sequentially processed substrate data in the conveyance order allows the control unit 60 to be easily specified by the sequentially processed substrate data with respect to each of the two substrates W that are conveyed adjacently. When the two group identification information Da1 are different from each other, there is no substrate W1 belonging to the same group as the substrate W2. In this case, in the above example, the control unit 60 uses the sequentially processed substrate data J2(1) to generate the simultaneous processed substrate data D0(1). The substrate W2 ( 1 ) is discharged from the substrate lead-out portion 33 without waiting for the detection of the substrate W by the sensor 334 .

Simultaneous processing substrate data D0(1) is not used (deleted or not created) sequentially processed substrate data J1(1), but is generated using sequentially processed substrate data J2(1).

At the same time, the group identification information Da1 in the substrate data D0(1) is processed, and the group identification information Da1 in the substrate data J2(1) is processed sequentially. Thereby, the grouping of the substrates W in the processing apparatus 40 is maintained even when they are located downstream, and the conveyance and processing of the substrates W are also managed on a group basis.

The recipe information Dc1 in the substrate data D0(1) is processed simultaneously, and the recipe information Dc1 in the substrate data J2(1) is processed sequentially.

The board number W1 and the position information Db1 for the board number W1 are not used in the simultaneous processing of the board data D0(1). The position information Db1 in the substrate data D0(1) relative to the substrate number W2 is processed simultaneously, and the position information Db1 in the substrate data J2(1) is processed sequentially. The final information Dd1 is not required in the simultaneous processing of the substrate data D0(k).

In this way, the processing of the simultaneous processing device 40 is performed according to the simultaneously processed substrate data D0(k) corresponding to each group, even if the substrate W is excluded, the upstream and downstream groups in the sequential processing device 30 are maintained, In addition, the conveyance and processing of the substrate W are also managed on a group basis.

For example, the alarm is based on the fact that the substrate data J1(1) does not exist in sequence, and the substrate W1(1) is not detected by the sensor 334 and the substrate W2(1) is detected by the sensor 335 as an opportunity, and For example, it is issued by the display unit 67 . The issuance of the alarm indicates that the number of substrates constituting the group is abnormal due to the removal of the substrate W, which will help to draw the attention of the operator of the substrate processing apparatus 1 .

<6-2-3. The case where the substrate on the downstream side is missing in the sequential processing apparatus> In the method described in this item, no matter what the value of the final information Dd1 is, any one of the substrate data J1(k) and J2(k) that is sequentially processed may not include the final information Dd1.

As a first example of the case where the presence or absence of the downstream substrate is confirmed in the sequential processing apparatus, there is a case where the substrate W2(k) is transported in the sequential processing apparatus 30 and is excluded by the operator in the middle of being processed. . In addition, as a second example, there is a case where the substrate W2(k) on the downstream side no longer exists at the time when the substrate W has been conveyed toward the substrate introduction portion 31, and the substrate data D0(k) is being processed at the same time. The board number W2 also does not exist. In the following description, the case where the board|substrate W2(1) does not exist but the board|substrate W1(1) exists is illustrated as a 1st example and a 2nd example.

FIG. 17 is a side view schematically showing an example of substrate transfer by the sequential processing apparatus 30 . In FIG. 17 , the description of the configuration of supplying liquid or gas and the configuration of recovering liquid is also omitted from the configuration of the sequential processing apparatus 30 shown in FIG. 2 .

In the first example, the control unit 60 deletes the sequentially processed substrate data J2(1). In the second example and the simultaneous processing substrate data D0 ( 1 ) has a structure in which k=1 in FIG. 8 , the control unit 60 does not generate the sequentially processed substrate data J2 ( 1 ) and generates the sequentially processed substrate data J1 ( 1). The sequential processing of the substrate data J1 ( 1 ) adopts the structure set to k=1 in FIG. 11 . However, the sequentially processed substrate data J1(1) may not include the final information Dd1.

Regardless of the first example or the second example, the sequentially processed substrate data J2(1) does not exist, and the sequentially processed substrate data J1(1) is generated. Simultaneous processing substrate data D0 ( 1 ) is generated when substrate W2 ( 1 ) is not detected by sensor 335 and substrate W1 ( 1 ) is detected by sensor 334 . The substrate W1 ( 1 ) is discharged from the substrate lead-out portion 33 .

Simultaneous processing of substrate data D0(1) does not use (deleted or ungenerated) sequentially processed substrate data J2(1), but uses sequentially processed substrate data J1(1) generated.

At the same time, the group identification information Da1 in the substrate data D0(1) is processed, and the group identification information Da1 in the substrate data J1(1) is processed sequentially. Thereby, the grouping of the substrates W in the processing apparatus 40 is maintained even when they are located downstream, and the conveyance and processing of the substrates W are managed on a group-by-group basis.

The recipe information Dc1 in the substrate data D0(1) is processed simultaneously, and the recipe information Dc1 in the substrate data J1(1) is processed sequentially.

In the simultaneous processing of the substrate data D0(1), the substrate number W2 and the position information Db1 relative to the substrate number W2 are not used. Relative to the position information Db1 of the substrate number W1 in the simultaneous processing of the substrate data D0(1), the position information Db1 in the sequentially processed substrate data J1(1) is used. The final information Dd1 is not required in the simultaneous processing of the substrate data D0(k).

In this way, the processing of the simultaneous processing device 40 is performed according to the simultaneously processed substrate data D0(k) corresponding to each group, so even if the substrate W is excluded, the grouping is maintained upstream and downstream of the sequential processing device 30 , and the conveyance and processing of the substrate W are managed on a group basis.

For example, if there is no sequential processing substrate data J2(1), the substrate W2(1) is not detected by the sensor 335, and the substrate W1(1) is detected by the sensor 334 as an opportunity, the alarm is displayed by, for example, Issued by Section 67. The issuance of the alarm indicates that the number of substrates constituting the group is abnormal due to the removal of the substrate W, which helps to call the attention of the operator of the substrate processing apparatus 1 .

<6-2-4. There is no shortage of substrates in the simultaneous processing of substrate data> The case where there is no upstream substrate W1(k) when the substrate W has been conveyed toward the substrate introduction portion 31 is handled in the same manner as in the second example in <6-2-2>. The simultaneous processing substrate data D0 ( 1 ) in this description has a structure set to k=1 in FIG. 9 .

When the substrate W2 (k) on the downstream side does not exist when the substrate W has been conveyed toward the substrate introduction portion 31, it is handled in the same manner as the second example in <6-2-3>. The simultaneous processing substrate data D0 ( 1 ) in this description has a structure set to k=1 in FIG. 8 .

In these second examples, the case where a substrate defect occurs in the simultaneous processing of the substrate data D0 ( 1 ) will be described. As an example of these cases, for example, when the cassette 10 lacks the substrate, the absence of the substrate is detected by the transfer robot 81 .

However, it can also be assumed that the substrate data D0(k) is processed at the same time and no substrate defect occurs. For example, the following situation (hereinafter referred to as "the third example") can be assumed: the substrate W1(k) is not detected by the sensor 314 even though the substrate data D0(k) has the configuration shown in FIG. 5 while being processed out and the substrate W2(k) is detected by the sensor 315. Alternatively, for example, the following situation can be assumed (hereinafter referred to as “the fourth example”): Although the substrate data D0(k) is processed simultaneously with the configuration shown in FIG. 5 , the substrate W1(k) is still detected by the sensor 314 Detected but the substrate W2(k) is not detected by the sensor 315.

18 and 19 are both side views schematically showing an example of substrate transfer by the sequential processing apparatus 30 . FIG. 18 shows the third example, and FIG. 19 shows the fourth example. In FIGS. 18 and 19 , the configuration of supplying liquid or gas and the configuration of recovering liquid are also omitted from the configuration of the sequential processing apparatus 30 shown in FIG. 2 .

Regarding the third example, FIG. 18 illustrates a case where the substrate W1 ( 3 ) is not detected by the sensor 314 when the substrate W of the third group has been conveyed toward the substrate introduction portion 31 , And the substrate W2 ( 3 ) is detected by the sensor 315 .

In the third example, the simultaneous processing of the substrate data D0 ( 3 ) at this point in time has a configuration in which k=3 in FIG. 5 , and the absence of the substrate W1 ( 3 ) does not occur. The control unit 60 generates sequentially processed substrate data J2 ( 3 ) without generating the sequentially processed substrate data J1 ( 3 ) according to the results of the operations of the sensors 314 and 315 . The sequentially processed substrate data J2 ( 3 ) has a structure set to k=3 in FIG. 15 .

Alternatively, at this time, the control unit 60 first generates the sequentially processed substrate data J1(3) and J2(3), and an alarm is issued by the display unit 67, for example. The operator who recognizes the alarm can use the input unit 66 to cause the control unit 60 to delete the sequentially processed substrate data J1 ( 3 ) and maintain the sequentially processed substrate data J2 ( 3 ).

As for the fourth example, FIG. 19 illustrates a case where the substrate W2 ( 3 ) is not detected by the sensor 315 at the time point when the substrate W of the third group has been conveyed toward the substrate introduction portion 31 , and The state of the substrate W1 ( 3 ) detected by the sensor 314 .

In the fourth example, the substrate data D0 ( 3 ) being simultaneously processed at this point in time has a configuration in which k=3 in FIG. 5 , and the absence of the substrate W2 ( 3 ) does not appear. The control unit 60 generates sequentially processed substrate data J1 ( 3 ) without generating the sequentially processed substrate data J2 ( 3 ) according to the results of the operations of the sensors 314 and 315 . The sequentially processed substrate data J1 ( 3 ) has a structure set to k=3 in FIG. 11 .

Alternatively, at this time, the control unit 60 first generates the sequentially processed substrate data J1(3) and J2(3), and an alarm is issued by the display unit 67, for example. The operator who recognizes the alarm can use the input unit 66 to cause the control unit 60 to delete the sequentially processed substrate data J2(3) and maintain the sequentially processed substrate data J1(3).

<7. Explanation of overall handling> FIG. 20 is a flowchart illustrating the flow of operations in the simultaneous processing apparatus 40 and the sequential processing apparatus 30 according to the present embodiment. In this flowchart, emphasis is placed on the processing in the sequential processing means 30 .

In step S1 , the sequential processing device 30 (eg, the cleaning device 12 ) is connected to the inlet portion (eg, the substrate introduction portion 31 ) of the sequential processing device 30 , while the processing device 40 (eg, the indexing portion 11 ) is connected to the upstream side thereof. ) to the substrate W that was transported.

In step S2, the control unit 60 accesses the simultaneous processing substrate data D0(k) used in the simultaneous processing apparatus 40. Simultaneous processing substrate data D0(k) may also be sent from the simultaneous processing apparatus 40 or an apparatus on the upstream side. For example, the simultaneous processing of the substrate data D0(k) is sent from the indexing section 11 or a device on the upstream side of the indexing section 11 . For example, when the substrate W is taken out from the cassette 10, the simultaneously processed substrate data D0(k) can also be obtained.

The simultaneous processing substrate data D0(k) does not necessarily have to be sent from the upstream device, and the operator can also use the input unit 66 to input the simultaneous processing substrate data D0(k). The order in which steps S1 and S2 are executed can also be reversed. For example, when the control for processing without grouping the substrates W is changed to the control for processing the substrates W in groups, the simultaneous processing substrate data D0(k) can be obtained.

In step S3, the control unit 60 generates one or both of the sequentially processed substrate data J1(k) and the sequentially processed substrate data J2(k) according to the simultaneously processed substrate data D0(k). In the drawings following Fig. 20, "and/or" means any one or both of the constituent elements before and after it.

For example, in the case described in <6-1>, both the substrate data J1(k) and J2(k) are sequentially processed and generated.

For example, in the case described in the first example of <6-2-1> and <6-2-2>, although the sequential processing board data J1(k) is deleted in the subsequent step S4, the sequential processing Both processing substrate data J1(k) and J2(k) are generated first.

For example, in the case described in the first example of <6-2-3>, although the sequential processing board data J2(k) is deleted in the subsequent step S4, the sequential processing board data J1(k), Both sides of J2(k) are generated first.

For example, in the cases described in the second example of <6-2-2> and the third example of <6-2-4>, only the sequentially processed substrate data J2(k) is generated. For example, in the cases described in the second example of <6-2-3> and the fourth example of <6-2-4>, only the sequentially processed substrate data J1(k) is generated.

In step S4 , any one of the sequentially processed substrate data J1(k) and the sequentially processed substrate data J2(k) is sequentially processed in the sequential processing apparatus 30 . For example, in the case described in <6-1>, both of the substrate data J1(k) and J2(k) are processed sequentially.

For example, in the case described in the first example of <6-2-1> and <6-2-2>, both of the substrate data J1(k) and J2(k) are processed sequentially using the sequential processing After that, only the sequentially processed substrate data J2(k) is used for sequential processing. Specifically, after step S3 is performed, the substrate W1(1) is excluded from being present, and the substrate W2(1) is present. Then, "END" is applied to the final information Dd1 of the board number W2, and only the sequentially processed board data J2(1) is left (refer to FIG. 15).

For example, in the case described in the first example of <6-2-3>, after sequentially processing both of the substrate data J1(k) and J2(k), only the sequentially processed substrate data is used J1(k) is processed sequentially. Specifically, after step S3 is performed, the substrate W2(1) is excluded from being present, and the substrate W1(1) is present. Then, in a state where "END" is adopted for the final information Dd1 of the board number W1, only the board data J1(1) (refer to FIG. 11) is left to be processed sequentially.

For example, in the cases described in the second example of <6-2-2> and the third example of <6-2-4>, only the sequentially processed substrate data J2(k) is used for sequential processing.

For example, in the cases described in the second example of <6-2-3> and the fourth example of <6-2-4>, only the sequentially processed substrate data J1(k) is used for sequential processing.

In step S5, the control unit 60 generates the simultaneously processed substrate data D0(k) according to one or both of the sequentially processed substrate data J1(k) and J2(k). For example, in the case described in <6-1>, the simultaneous processing board data D0(k) is generated by sequentially processing both the board data J1(k) and J2(k).

For example, in the cases described in <6-2-1>, the first and second examples of <6-2-2>, and the third example of <6-2-4>, the substrate data D0 ( k) is only generated according to the sequential processing of the substrate data J2(k).

For example, in the cases described in the first and second examples of <6-2-3> and the fourth example of <6-2-4>, the simultaneous processing of the substrate data D0(k) is only based on the sequential processing of the substrates Data J1(k) generated.

The substrates W are discharged toward the simultaneous processing device 40 at the exit portion (eg, the substrate lead-out portion 33 ) of the sequential processing device 30 .

In step S6, the simultaneous processing using the simultaneous processing substrate data D0(k) is performed in the simultaneous processing apparatus 40 (eg, the dehydration baking apparatus 13).

FIG. 21 is a flowchart illustrating the details of step S3. Step S3 includes steps S301 to S305.

In step S301, it is determined whether all the substrate numbers W1 and W2 exist in the simultaneously processed substrate data D0(k). When the result of the judgment is affirmative, the process proceeds to step S302, and when it is negative, the process proceeds to step S305.

For example, in <6-1>, <6-2-1>, the first example of <6-2-2>, the first example of <6-2-3>, and the third example of <6-2-4> In the cases described in the example and the fourth example, the result of the determination in step S301 is affirmative, and the process proceeds to step S302. For example, in the cases described in the second example of <6-2-2> and the second example of <6-2-3>, the result of the determination in step S301 is negative, and the process proceeds to step S305.

In step S302, it is determined whether all the substrates W1(k) and W2(k) in the entrance portion have been detected. When the result of the judgment is affirmative, the process proceeds to step S303, and when it is negative, the process proceeds to step S304.

For example, in the cases described in <6-1>, <6-2-1>, the first example of <6-2-2>, and the first example of <6-2-3>, in step S302 If the result of the judgment is affirmative, the process proceeds to step S303. For example, in the cases described in the third and fourth examples of <6-2-4>, the result of the determination in step S302 is negative, and the process proceeds to step S304.

In step S303, the separation of the simultaneous processing substrate data D0(k) is performed. The term "separation" here means that group identification information Da1, position information Db1, and recipe information Dc1 are obtained separately (individually) for each board number W1, W2. For example, through the processing in step S303, the substrate data D0(k) can be processed simultaneously with the structure shown in FIG. The data of the structure and the data having the same structure as the simultaneous processing substrate data D0(k) having the structure shown in FIG. 9 .

In step S304, the substrate number and position information Db1 corresponding to the substrate not detected in the entrance portion are deleted. For example, in the case described in the third example of <6-2-4>, the structure of the simultaneously processed substrate data D0(k) is changed from the structure shown in FIG. 5 by the process in step S304. It is the structure shown in FIG. 9 . For example, in the case described in the fourth example of <6-2-4>, by the process in step S304, the structure of the simultaneously processed substrate data D0(k) is changed from the structure shown in FIG. 5 to The structure shown in Figure 8.

Even after step S303 is executed or after step S304 is executed, step S305 is executed similarly to the case where a negative result is obtained in the judgment in step S301.

In step S305, one or both of the substrate data J1(k) and J2(k) are sequentially processed to be generated. The final information Dd1 about the board number that is the most upstream (this is also the last) of the existing board numbers is adopted as "END".

For example, the cases described in <6-1>, <6-2-1>, the first example of <6-2-2>, and the first example of <6-2-3> are executed in step S303 After that, both the substrate W1(k) and the substrate W2(k) exist, the final information Dd1 about the substrate number W1 uses "END", and both the substrate data J1(k) and J2(k) are generated in sequence ( 11, 12).

However, as described above, in the cases described in the first example of <6-2-2> and the first example of <6-2-3>, the final information may be omitted regardless of the value of the final information Dd1 Addition of Dd1.

For example, in the case described in the third example of <6-2-4>, through the execution of step S304, the board number W1 does not exist but the board number W2 exists in the simultaneous processing board data D0(3). In step S305, the final information Dd1 about the board number W2 is "END", and only the sequentially processed board data J2(3) is generated (refer to FIG. 15).

For example, in the case described in the fourth example of <6-2-4>, through the execution of step S304, the board number W2 does not exist but the board number W1 exists in the simultaneous processing board data D0(3). In step S305, in a state where "END" is adopted for the final information Dd1 on the board number W1, only the sequentially processed board data J1(3) is generated (see FIG. 11).

For example, in the case described in the second example of <6-2-2>, the board number W1 does not exist in the simultaneous processing board data D0(1), but the board number W2 exists. In step S305, the final information Dd1 about the board number W2 is "END", and only the sequentially processed board data J2(3) is generated (refer to FIG. 15).

For example, in the case described in the second example of <6-2-3>, the board number W2 does not exist in the simultaneous processing board data D0(1), but the board number W1 exists. In step S305, the final information Dd1 about the board number W1 is "END", and only the sequentially processed board data J1(3) is generated (refer to FIG. 11).

FIG. 22 is a flowchart illustrating the details of step S5. Step S5 includes steps S501 to S509. FIG. 23 is a flowchart illustrating the details of step S509.

In step S4, step S501 is executed after sequentially processing the sequentially processed substrate data J1(k) and sequentially processed substrate data J2(k) in the sequential processing apparatus 30.

In step S501 , it is determined whether the substrate W2(k) has reached the outlet of the sequential processing device 30 . If the result of this determination is affirmative, the process proceeds to step S502. If the result of this determination is negative, the process proceeds to step S509.

For example, in the cases described in <6-1>, <6-2-1>, the first and second examples of <6-2-2>, and the third example of <6-2-4>, The result of the judgment in step S501 is affirmative, and the process proceeds to step S502. For example, in the cases described in the first and second examples of <6-2-3> and the fourth example of <6-2-4>, the result of the judgment in step S501 is negative, and the process proceeds to Step S509.

In step S502, it is determined whether there is "END" in the final information Dd1 of the sequentially processed substrate data J2(k) (whether "END" has been adopted). If the result of this determination is affirmative, the process proceeds to step S507. If the result of this determination is negative, the process proceeds to step S503.

For example, in <6-2-1>, the first example of <6-2-2>, and the second example of <6-2-2> (sequential processing of substrate data J2(k) has the structure shown in FIG. 15 In the case described in step S305, the final information Dd1 of the sequentially processed substrate data J2(k) is adopted as "END", the result of the judgment in step S502 is affirmative, and the process proceeds to step S507. For example, in the second example of <6-1> and <6-2-2> (when the substrate data J2(k) to be processed sequentially has the structure shown in FIG. 12 ), the third example of <6-2-4> In the case described in , the result of the judgment in step S502 is negative, and the process proceeds to step S503.

In step S503, it is determined whether there is a substrate W1(k) (belonging to the same k-th group as the substrate W2(k)) on the upstream side of the substrate W2(k). If the result of this determination is affirmative, the process proceeds to step S504. If the result of this determination is negative, the process proceeds to step S507.

For example, in the case described in <6-1>, the result of the determination in step S503 is affirmative, and the process proceeds to step S504. For example, the situation described in the second example of <6-2-2> (when the substrate data J2(k) has the structure shown in FIG. 12 for sequential processing) and the third example of <6-2-4> , the result of the judgment in step S503 is negative, and the process proceeds to step S507.

According to the above processing flow, in the case described in the second example of <6-2-2>, the substrate data J2(k) to be processed sequentially has the structure shown in FIG. 12 or the structure shown in FIG. 15. configuration, step S507 is executed.

In step S504 , it is determined whether the substrate W1(k) has reached the outlet of the sequential processing device 30 . If the result of the judgment is negative, step S504 is repeatedly executed, and the other processes stand by. If the result of the determination in step S504 is affirmative, the process proceeds to step S505.

Since the execution of step S504 is premised on the affirmative determination of step S503, the processing does not stop in step S504.

In step S505, the concurrently processed substrate data D0(k) is generated by combining the sequentially processed substrate data J1(k) and J2(k). The so-called "combination" here means that the data possessed by the sequentially processed substrate data J1(k) is used as the data corresponding to the substrate number W1, and the sequentially processed substrate data J2(k) is used as the data corresponding to the substrate number W2. ) has the data to generate the simultaneous processing substrate data D0(k).

As described above, in the same group, the group identification information Da1 and the recipe information Dc1 are common. In the simultaneous processing board data D0(k), board numbers W1 and W2 are used as common data.

After step S505 is executed, step S506 is executed. In step S506 , the substrates W1(k) and W2(k) are discharged toward the simultaneous processing apparatus 40 .

In step S507, the final information Dd1 is deleted from the sequentially processed substrate data J2(k). The sequentially processed substrate data J2(k) with the final information Dd1 deleted is used to generate the concurrently processed substrate data D0(k).

For example, the first example of <6-2-1>, the first example of <6-2-2>, and the second example of <6-2-2> (the substrate data J2 ( k) In the case described in the case of having the structure shown in FIG. 15), by executing step S305, the final information Dd1 of the sequentially processed substrate data J2(k) is adopted as “END”. When it is taught that the substrate W1(k) does not exist by the final information Dd1, the generation of the simultaneously processed substrate data D0(k) does not use the sequentially processed substrate data J1(k).

For example, the second example of <6-2-2> in which a negative judgment is made in step S503 (when the substrate data J2(k) has the structure shown in FIG. 12 to be processed sequentially), the second example of <6-2-4> In the case described in the third example, the sequentially processed substrate data J1(k) is not generated. In these cases, the generation of the simultaneous processing substrate data D0(k) also does not use the sequential processing substrate data J1(k).

After step S507 is executed, step S508 is executed. In step S508 , only the substrate W2(k) is discharged toward the simultaneous processing apparatus 40 .

After steps S506 and S508 are executed, the process proceeds to step S6 (see FIG. 20 ).

Step S509 includes steps S511 to S513 (see FIG. 23 ). When the determination in step S501 is negative, step S511 is executed. In step S511 , it is determined whether the substrate W1(k) has reached the exit portion (substrate lead-out portion 33 ) of the sequential processing apparatus 30 . When the result of this judgment is affirmative, the process proceeds to step S512.

When the result of this determination is negative, the process in step S5 ends (see FIG. 22 ), and the process proceeds to step S6 (see FIG. 20 ). However, when the determination in step S511 is negative, since the substrate W2(k) has been determined to have not arrived by the determination in step S501, all the substrates W1(k) discharged from the outlet of the sequential processing apparatus 30 ) and W2(k) do not exist. Therefore, when the determination in step S511 is negative, step S6 related to the k-th group is not actually executed.

In step S512, the control unit 60 does not use the sequentially processed substrate data J2(k), deletes the final information Dd1 from the sequentially processed substrate data J1(k), and generates concurrently processed substrate data D0(k). For example, in the first example of <6-2-3>, the sequential processing board data J2(k) is deleted in step S4. For example, in the second example of <6-2-3> and the fourth example of <6-2-4>, the sequentially processed substrate data J2(k) is not generated.

After the simultaneous processing of the substrate data D0(k) is generated by step S512, step S513 is executed. In step S513 , only the substrate W1(k) is discharged toward the simultaneous processing apparatus 40 .

When step S513 is executed, step S509 ends, and the process proceeds to step S6 (see FIG. 20 ).

<8. General description> Based on the descriptions of the above items, general descriptions are given below.

(i) The substrate processing apparatus 1 includes the sequential processing apparatus 30 for processing the substrates W, the simultaneous processing apparatus 40 for processing the substrates W simultaneously, and the control unit 60 . For example, the substrate processing apparatus 1 includes the cleaning apparatus 12 as the sequential processing apparatus 30 . For example, the substrate processing apparatus 1 includes the indexing unit 11 and the dehydration baking apparatus 13 as the simultaneous processing apparatus 40 .

The substrates W are divided into a plurality of groups. The substrates W1(k), . . . WN(k) belong to the k-th group. The notation N represents a positive integer. For example, although N=2 has been described, it may be N≧3.

The sequential processing apparatus 30 processes the substrates W while sequentially conveying the substrates W based on the sequentially processed substrate data J1(k), . . . JN(k). The sequentially processed substrate data J1(k),...JN(k) are set with respect to the substrates W1(k),...WN(k), respectively.

The simultaneous processing device 40 simultaneously processes the substrates W1(k), . . . WN(k) on a group basis according to the simultaneous processing substrate data D0(k). The simultaneous processing substrate data D0(k) is set corresponding to the k-th group.

The control unit 60 controls the sequential processing device according to the sequential processing substrate data J1(k),...JN(k) respectively set for each of the substrates W1(k),...WN(k) belonging to the kth group Among 30, conveyance and processing of substrates W1(k), ... WN(k).

The control unit 60 controls the processing of the substrates W1(k), . . . WN(k) in the simultaneous processing apparatus 40 based on the simultaneous processing substrate data D0(k).

The simultaneously processed substrate data D0(k) includes group identification information Da1, substrate numbers W1, W2, position information Db1 and recipe information Dc1. The group identification information Da1 identifies the group. Specifically, the fact that the substrates W1(k), ... WN(k) belong to the k-th group is indicated by the group identification information Da1. The substrate numbers W1, . . . WN distinguish the substrates W belonging to the same group from each other. The position information Db1 indicates the transfer position of the substrates W in the same group. The recipe information Dc1 specifies the content of processing that is commonly performed on the substrates W belonging to the same group.

The sequentially processed substrate data J1(k),...JN(k) include position information Db1, group identification information Da1, and recipe information Dc1 about the substrates W1(k),...WN(k) corresponding to each.

The control unit 60 generates sequentially processed substrate data J1(k), . . . JN(k) from the concurrently processed substrate data D0(k) (see step S3 in FIG. 20 ). The control unit 60 generates the simultaneously processed board data D0(k) from the sequentially processed board data J1(k), . . . JN(k) (see step S5 in FIG. 20 ).

When sequentially processing any one of the group identification information Da1 of the substrate data J1(k), . . . JN(k), the group identification information Da1 included in the substrate data D0(k) is simultaneously processed. Thereby, even in the sequential processing apparatus 30, the grouping of the substrates W can be maintained, and the conveyance and processing of the substrates W are managed on a group basis.

(ii) For example, the control unit 60 uses the board number W1 in the simultaneously processed board data D0(k), the position information Db1 corresponding to the board number W1, the recipe information Dc1, and the final information Dd1, to generate information about the board number W1 corresponding to the board number W1. The substrate W1(k) is sequentially processed for the substrate data J1(k) (refer to FIG. 11 ). Using the substrate number Wm in the simultaneous processing substrate data D0(k), the position information Db1 corresponding to the substrate number Wm, the recipe information Dc1, and the final information Dd1, a dependency on the substrate Wm(k) corresponding to the substrate number Wm is generated. Substrate data Jm(k) (m is an integer of 2 or more and N or less, and refer to FIG. 12 ) is sequentially processed.

The final information Dd1 indicates whether the substrate W1(k) is the last sheet in the conveying direction (whether it is the most upstream) in the k-th group to which the substrate W1(k) corresponding to the substrate number W1 belongs. For example, in the case described in <6-2-1>, the sequentially processed substrate data J1(k) having the configuration shown in FIG. 11 is generated first (refer to step S305 in FIG. 21 ). After that, the sequentially processed substrate data J1(k) is deleted, and it becomes the final piece of the sequentially processed substrate data J2(k) of the last piece (at the most upstream) in the conveyance direction in the sequentially processed substrate data Jm(k). The information Dd1 indicates that the substrate W2(k) is the last sheet (at the most upstream) in the conveying direction (see FIG. 15 ).

Thereby, in the sequential processing apparatus 30, the grouping of the substrates W is maintained even if the group identification information Da1 is not identified, and the conveyance and processing of the substrates W can be managed in units of groups.

(iii) For example, the control unit 60 uses the board number Wn in the simultaneously processed board data D0(k), the position information Db1 corresponding to the board number Wn, the recipe information Dc1, and the group identification information Da1 to generate information about the board number The substrate data Jn(k) of the substrate Wn(k) corresponding to Wn is sequentially processed. In this way, in the sequential processing apparatus 30, even if the grouping of the substrates W is not based on the final information Dd1, the grouping of the substrates W is maintained, and the transport and processing of the substrates W can be managed in units of groups. In this case, the grouping of the substrates W can also be maintained using the final information Dd1.

(iv) For example, the sequential processing apparatus 30 includes the substrate lead-out portion 33 as an outlet portion for discharging the substrates W toward the simultaneous processing apparatus 40 . If the cleaning device 12 is considered as the sequential processing device 30 , the dehydration and baking device 13 can be considered as the simultaneous processing device 40 .

The substrate lead-out portion 33 has sensors 334 and 335 that detect the presence or absence of the substrate W in the substrate lead-out portion 33 . When the substrate W1(k) is not detected by the sensor of the outlet portion but the substrate Wm(k) is detected (refer to the flow of steps S503 to S507 in FIG. 22 ), and the absence of the substrate W1(k) is confirmed (refer to the flow of steps S503 to S507 in FIG. 22 ), the control unit 60 does not use the sequentially processed substrate data J1(k) related to the substrate W1(k) but uses the sequentially processed substrate data related to the substrate Wm(k) Jm(k) to generate the simultaneous substrate data D0(k) (refer to step S507 in FIG. 22 ).

For example, a situation can be assumed in which the substrates W1(k),...Ws(k) (s=m-1) are arranged upstream of the substrates Wm(k),...WN(k), and the substrates W1(k) , ... Wm(k) all belong to the kth group.

For example, when the substrates W1(k),...Ws(k) are not detected and the substrates Wm(k),...WN(k) are detected, the control unit 60 does not process the substrate data J1 sequentially in step S507. (k), ···Js(k), and sequentially processed board data Jm(k), ···WN(k) are used to generate simultaneous processing board data D0(k).

Thereby, the simultaneous processing substrate data D0(k) corresponding to the actually ejected substrate W is used for the simultaneous processing (refer to step S508 in FIG. 22 ).

For example, the substrates W1(k),...Ws(k) can be regarded as the first substrates, and the substrates Wm(k),...WN(k) can be regarded as the second substrates. In this case, when the first substrate is not detected by the sensor of the outlet portion but the second substrate is detected, and the absence of the first substrate is confirmed, the control unit 60 does not use the sequence for the first substrate. The substrate data J1(k), ...Js(k) are processed and the simultaneously processed substrate data D0(k) is generated using the sequentially processed substrate data Jm(k), ...JN(k) for the second substrate.

(v) For example, the sequential processing apparatus 30 includes the substrate lead-out portion 33 as an outlet portion for discharging the substrates W toward the simultaneous processing apparatus 40 . The substrate lead-out portion 33 has sensors 334 and 335 that detect the presence or absence of the substrate W in the substrate lead-out portion 33 . When the substrate Wm(k) is not detected by the sensor of the outlet but the substrate W1(k) is detected (refer to the process flow from step S501 to step S512 in FIG. 23 ), the control unit 60 does not use the The sequentially processed substrate data Jm(k) of the substrate Wm(k) is used to generate the concurrently processed substrate data D0(k) using the sequentially processed substrate data J1(k) for the substrate W1(k) (refer to the steps of FIG. 23 ). S512).

Both the substrates W1(k) and Wm(k) belong to the kth group. These positional information Db1 indicate that the substrate W1(k) is on the upstream side (rear side in the conveyance direction) of the substrate Wm(k). For example, referring to FIG. 11 , it is shown that the substrate W1(k) is located more upstream than the other substrates. For example, referring to FIG. 12 , it is shown that the substrate W2(k) is positioned more upstream than the other substrates.

For example, when the substrates Wm(k),...WN(k) are not detected but the substrates W1(k),...Ws(k) are detected, in step S512, the control unit 60 does not use the sequential processing of the substrate data Jm( k), ···JN(k), and sequentially processed board data J1(k), ···Ws(k) are used to generate simultaneous processing board data D0(k).

Thereby, the substrate data D0(k) that is simultaneously processed corresponding to the substrate W actually ejected is used for the simultaneous processing (refer to step S513 in FIG. 22 ).

For example, the substrates W1(k),...Ws(k) can be regarded as the first substrates, and the substrates Wm(k),...WN(k) can be regarded as the second substrates. In this case, when the second substrate is not detected by the sensor of the outlet but the first substrate is detected, the control unit 60 does not use the sequentially processed substrate data Jm(k), . . . JN(k) uses sequentially processed substrate data J1(k), ...Js(k) with respect to the first substrate to generate simultaneous processed substrate data D0(k).

(vi) For example, a plurality of sensors at the outlet are provided, and the number thereof is the same as the number of the substrates W belonging to the group. For example, when N=2, the substrate lead-out portion 33 has sensors 334 and 335 that detect the presence or absence of the substrate W in the substrate lead-out portion 33 . Disposing the sensors in such a number is helpful to correctly detect the presence or absence of the substrates W in the group.

(vii) For example, the sequential processing apparatus 30 includes the substrate introduction portion 31 as an inlet portion for receiving the substrates W from the simultaneous processing apparatus 40 . If the cleaning device 12 is considered as the sequential processing device 30 , the indexing unit 11 can be considered as the simultaneous processing device 40 . The substrate introducing portion 31 has sensors 314 and 315 that detect the presence or absence of the substrate W in the substrate introducing portion 31 .

When the substrate W1(k) is not detected by the sensor at the entrance but the substrate W2(k) is detected (for example, in the case described in the third example of <6-2-4>), the control The section 60 does not generate the sequentially processed substrate data J1(k) but generates the sequentially processed substrate data J2(k) (refer to step S304 in FIG. 21 ).

When the substrate W2(k) is not detected by the sensor at the entrance but the substrate W1(k) is detected (for example, in the case described in the fourth example of <6-2-4>), the control The section 60 does not generate the sequentially processed substrate data J2(k) but generates the sequentially processed substrate data J1(k) (refer to step S304 in FIG. 21 ).

For example, the substrates W1(k),...Ws(k) can be regarded as the third substrates, and the substrates Wm(k),...WN(k) can be regarded as the fourth substrates. In this case, when the fourth substrate is not detected by the sensor of the entrance portion and the third substrate is detected, in step S305, the control unit 60 does not generate sequentially processed substrate data Jm ( k), ...JN(k), and generate sequentially processed substrate data J1(k), ...Js(k) about the third substrate.

When the third substrate is not detected by the sensor at the entrance but the fourth substrate is detected, in step S305, the control unit 60 does not generate sequentially processed substrate data J1(k), ...Js(k) to generate sequentially processed substrate data Jm(k), ...JN(k) for the fourth substrate.

In addition, the above-mentioned substrate processing apparatus can realize the following substrate processing method. The substrate processing method includes sequential processing and simultaneous processing. Sequential processing According to the sequential processing substrate data Jn(k) set for each of the substrates W divided into a plurality of groups, the substrates W1(k), . Wn(k) is processed. Simultaneous processing According to the simultaneous processing substrate data D0(k) set for each group, the substrates W1(k), . . . WN(k) are processed simultaneously on a group-by-group basis.

The simultaneously processed substrate data D0(k) includes group identification information Da1, substrate numbers W1, W2, position information Db1, and recipe information Dc1. The group identification information Da1 identifies the group. Specifically, the fact that the substrates W1(k), ... WN(k) belong to the k-th group is indicated by the group identification information Da1. The substrate numbers W1, . . . WN distinguish the substrates W belonging to the same group from each other. The position information Db1 indicates the transfer position of the substrates W in the same group. The recipe information Dc1 specifies the content of processing that is commonly performed on the substrates W belonging to the same group.

The sequentially processed substrate data J1(k),...JN(k) include position information Db1, group identification information Da1, and recipe information Dc1 about the substrates W1(k),...WN(k) corresponding to each.

The sequentially processed substrate data J1(k),...JN(k) are generated from the concurrently processed substrate data D0(k), and the concurrently processed substrate data D0(k) is generated from the sequentially processed substrate data J1(k),... generated by JN(k).

As above, although the substrate processing apparatus and the substrate processing method have been described in detail, the above descriptions are exemplary in all aspects, and the present disclosure is not limited thereto. In addition, the above-mentioned various modification examples can be used in combination as long as they do not contradict each other. In addition, a plurality of modifications not illustrated are also obtained without departing from the scope of the present disclosure.

1: Substrate processing device 10: Box 11: Indexing Department 12: Cleaning device 13: Dehydration baking device 14: Coating related devices 15: Pre-baking device 16: Exposure device 17: Developing device 18: Post-bake device 30: Process devices sequentially 31: Substrate introduction part (entrance part) 32: Processing device body 33: Substrate lead-out part (exit part) 34: Liquid medicine department 35: Washing Department 35a: Liquid Knife 35b, 341: Nozzle 35r, 35s, 35t, 344: Pump 36: Moisture removal section 40: Simultaneous processing device 51: Moving Mechanisms 52: Lifting mechanism 53: Rotary Mechanism 60: Control Department 61:CPU 62:ROM 63: RAM 64: Storage Device 65: bus wire 66: Input part 67: Display part 68: Department of Communications 81: Transfer Robot 82: Heating part 83: Cooling Department 91,93: Substrate holding part 92: Heating means 94: Cooling means 311, 313, 321, 331, 332: Rollers 312: Pedestal 314, 315, 334, 335: Sensors 342: Medicine tank 343: Supply Tube 345, 359, 364: Flow Sensors 351: Low pressure water supply department 352: High pressure water supply department 353: Ultrasonic cleaning water supply department 354: Pure water supply department 355: 1st sink 356: 2nd Sink 357, 358: Pressure Sensor 361: Jet Department 362: Gas supply source 363: Pipeline 365: Pure water supply source D0(k): Simultaneous processing of substrate data Da1: group identification information Db1: Location Information Dc1: Recipe Information Dd1: Final Information F1: finger member H1: Hands J1(k), J2(k): Process substrate data sequentially k: pairing number P: handler P1: Base end member W,W1,W2,W1(k),W2(k): Substrate

FIG. 1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus. FIG. 2 is a side view schematically showing an example of the configuration of the sequential processing apparatus. FIG. 3 is a plan view schematically showing an example of the configuration of the simultaneous processing apparatus. FIG. 4 is a functional block diagram schematically showing an example of the configuration of the control unit. FIG. 5 is a diagram schematically showing an example of simultaneous processing of substrate data. FIG. 6 is a diagram schematically showing a state in which a plurality of substrates are accommodated in the cassette. FIG. 7 is a diagram schematically showing a state in which a plurality of substrates are accommodated in the cassette. FIG. 8 is a diagram schematically showing an example of simultaneous processing of substrate data. FIG. 9 is a diagram schematically showing an example of simultaneous processing of substrate data. FIG. 10 is a plan view schematically showing an example of substrate transfer in the simultaneous processing apparatus. FIG. 11 is a diagram schematically showing an example of sequential processing of substrate data. FIG. 12 is a diagram schematically showing an example of sequential processing of substrate data. FIG. 13 is a side view schematically showing an example of substrate transfer in the sequential processing apparatus. FIG. 14 is a side view schematically showing an example of substrate conveyance in the sequential processing apparatus. FIG. 15 is a diagram schematically showing an example of sequential processing of substrate data. FIG. 16 is a side view schematically showing an example of substrate conveyance of the sequential processing apparatus. FIG. 17 is a side view schematically showing an example of substrate transfer in the sequential processing apparatus. FIG. 18 is a side view schematically showing an example of substrate conveyance in the sequential processing apparatus. FIG. 19 is a side view schematically showing an example of substrate transfer in the sequential processing apparatus. FIG. 20 is a flowchart illustrating the flow of actions in a simultaneous processing device and a sequential processing device. FIG. 21 is a flowchart illustrating the details of step S3. FIG. 22 is a flowchart illustrating the details of step S5. FIG. 23 is a flowchart illustrating the details of step S509.

D0(k): Simultaneous processing of substrate data

Da1: group identification information

Db1: Location Information

Dc1: Recipe Information

k: pairing number

W1, W2: substrate

Claims (8)

A substrate processing apparatus is provided with: a sequential processing unit, which processes the substrates while sequentially conveying the substrates according to the sequential processing substrate data set for each of the substrates divided into a plurality of groups; A simultaneous processing unit that simultaneously processes the substrates in units of the groups according to the simultaneously processed substrate data set for each of the groups; and a control unit that controls the conveyance and the processing of the substrates in the sequential processing unit based on the sequentially processed substrate data, and controls the processing of the substrates in the simultaneous processing unit based on the simultaneous processing substrate data; The above-mentioned simultaneously processed substrate data includes: group identification information, which identifies the above-mentioned group; a substrate number, which mutually distinguishes the above-mentioned substrates belonging to the above-mentioned group; and position information, which indicates the conveying direction of the above-mentioned substrate as the above-mentioned group The transfer position of the position; and recipe information, which is used to specify the processing content to be executed in common with the above-mentioned substrates belonging to the above-mentioned group; The sequentially processed substrate data includes the aforementioned position information, the aforementioned group identification information, and the aforementioned recipe information about the aforementioned substrate corresponding to the aforementioned sequentially processed substrate data, and The control unit generates the sequentially processed substrate data from the simultaneously processed substrate data, and generates the simultaneously processed substrate data from the sequentially processed substrate data. The substrate processing apparatus of claim 1, wherein, The control unit generates the above-mentioned board number corresponding to the one board number corresponding to the board number, the position information corresponding to the one board number, the recipe information, and the final information using one of the board numbers for simultaneous processing of board numbers. The substrate data is processed sequentially, and The above-mentioned final information indicates whether the above-mentioned substrate corresponding to the above-mentioned one of the above-mentioned substrate numbers in the above-mentioned group to which the above-mentioned substrate corresponding to the above-mentioned one of the above-mentioned substrate numbers belongs to is the last piece in the above-mentioned conveying direction. The substrate processing apparatus of claim 1, wherein, The control unit uses one of the above-mentioned board numbers of the simultaneously processed board data, the position information corresponding to the one of the board numbers, the group identification information, and the recipe information to generate the information about the board corresponding to the one of the board numbers. The above-mentioned sequential processing of the substrates processes the substrate data. The substrate processing apparatus of claim 2, wherein, The sequential processing portion includes an outlet portion for discharging the substrate toward the simultaneous processing portion, The outlet portion has a sensor for detecting whether the substrate exists in the outlet portion, When the first and second substrates are not detected by the sensor, and the defect of the first and second substrates is confirmed, the control unit does not use the above-mentioned criteria for the first and second substrates. The sequential processing substrate data is used to generate the simultaneous processing substrate data using the sequential processing substrate data for the second substrate. The above-mentioned first above-mentioned substrate and the above-mentioned second above-mentioned substrate belong to the same above-mentioned group, and The said position information of the said 1st said board|substrate or the said position information of the said 2nd said board|substrate shows that the said 1st said board|substrate is more upstream than the said 2nd said board|substrate. The substrate processing apparatus of claim 3, wherein, The sequential processing portion includes an outlet portion for discharging the substrate toward the simultaneous processing portion, The outlet portion has a sensor for detecting whether the substrate exists in the outlet portion, When the first and second substrates are not detected by the sensor, and the defect of the first and second substrates is confirmed, the control unit does not use the above-mentioned criteria for the first and second substrates. The sequential processing substrate data is used to generate the simultaneous processing substrate data using the sequential processing substrate data for the second substrate. The above-mentioned first above-mentioned substrate and the above-mentioned second above-mentioned substrate belong to the same above-mentioned group, and The said position information of the said 1st said board|substrate or the said position information of the said 2nd said board|substrate shows that the said 1st said board|substrate is more upstream than the said 2nd said board|substrate. The substrate processing apparatus of claim 3, wherein, The sequential processing portion includes an outlet portion for discharging the substrate toward the simultaneous processing portion, The outlet portion has a sensor for detecting whether the substrate exists in the outlet portion, When the second substrate is not detected and the first substrate is detected by the sensor, the control unit does not use the sequentially processed substrate data for the second substrate but uses the first substrate data. The above-mentioned sequential processing of the substrate data of the substrate to generate the above-mentioned simultaneous processing of the substrate data, The above-mentioned first above-mentioned substrate and the above-mentioned second above-mentioned substrate belong to the same above-mentioned group, and The said position information of the said 1st said board|substrate or the said position information of the said 2nd said board|substrate shows that the said 1st said board|substrate is more upstream than the said 2nd said board|substrate. The substrate processing apparatus of any one of claims 1 to 6, wherein, The sequential processing section includes an inlet section for receiving the substrate from the simultaneous processing section, The inlet portion has a sensor for detecting whether the substrate is present in the inlet portion, When the third said board is not detected and the fourth said board is detected by the said sensor of the said entrance part, the said control part does not generate the said sequential processing board data about the said 3rd said board, but generates; The above-mentioned sequentially processed substrate data with respect to the above-mentioned fourth above-mentioned substrate, and The said third said board|substrate and the said 4th said board|substrate belong to the same said group. A substrate processing method, comprising: Sequential processing, which processes the substrates while sequentially transporting the substrates according to the sequential processing substrate data set for each substrate divided into a plurality of groups; and Simultaneous processing, which simultaneously processes the above-mentioned substrates in units of the above-mentioned groups according to the data of the above-mentioned simultaneous processing substrates respectively set for each of the above-mentioned groups; Wherein, in the above-mentioned sequential processing, the conveyance of the above-mentioned substrate and the above-mentioned processing are controlled according to the above-mentioned sequential processing substrate data, In the above-mentioned simultaneous processing, the processing of the above-mentioned substrate is controlled according to the above-mentioned simultaneous processing substrate data, The above-mentioned simultaneously processed substrate data includes: group identification information, which identifies the above-mentioned group; a substrate number, which mutually distinguishes the above-mentioned substrates belonging to the above-mentioned group; and position information, which indicates the conveying direction of the above-mentioned substrate as the above-mentioned group The transfer position of the position; and recipe information, which is used to specify the processing content to be executed in common with the above-mentioned substrates belonging to the above-mentioned group; The sequentially processed substrate data includes the aforementioned position information, the aforementioned group identification information, and the aforementioned recipe information about the aforementioned substrate corresponding to the aforementioned sequentially processed substrate data, and The sequentially processed substrate data is generated from the concurrently processed substrate data, and the concurrently processed substrate data is generated from the sequentially processed substrate data.

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