JP2022052174A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

To manage substrate transfer and processing for each group.SOLUTION: A sequential processing unit performs processing on a substrate while sequentially transporting the substrate on the basis of sequential processing substrate data set for each substrate divided into a plurality of groups. A simultaneous processing unit simultaneously processes the substrate for each group on the basis of the simultaneous processing substrate data set for each group. The simultaneous processing substrate data includes group identification information for identifying the group, a substrate number for distinguishing the substrates belonging to the group from each other, position information indicating a position of the substrate in the group in a transport direction, and recipe information for defining the processing contents commonly performed on the substrate belonging to the group. The sequential processing substrate data includes the position information about the substrate corresponding to the sequential processing substrate data, the group identification information, and the recipe information.SELECTED DRAWING: Figure 5

Description

The present application relates to a substrate processing apparatus and a substrate processing method.

In order to improve the substrate processing throughput, a technique for transporting a plurality of substrates as a group between devices has been proposed. For example, a plurality of substrates are collectively transported to a sequential processing device (which will be described in detail later). The substrates are sequentially conveyed and processed one by one in the sequential processing apparatus. A plurality of processed substrates are collectively transported to a simultaneous processing apparatus (which will be described in detail later).

For example, in Patent Document 1 below, transfer and processing of a plurality of boards in a sequential processing device are controlled based on individual board data, and transfer and processing of a plurality of boards in a simultaneous processing device are controlled based on the entire board data. The technology to be used is disclosed. Recipe information is included in both the individual board data and the whole board data. The recipe information defines the processing content for the board. The recipe information of multiple boards that are grouped together is common.

Japanese Unexamined Patent Publication No. 2020-17604

When the recipe information is common to each group of a plurality of boards (hereinafter, also referred to as "group"), it is desired that the transfer and processing of the boards are managed for each group. For example, it is desirable to manage which group the substrate transported from the sequential processing device to the simultaneous processing device belongs to. For example, even if any of the substrates belonging to a certain group is sequentially removed in the processing apparatus, such control is desirable.

The substrate processing apparatus and the substrate processing method disclosed in the present application are intended to control the transfer and processing of the substrate for each group.

The substrate processing apparatus disclosed in the present application includes a sequential processing unit, a simultaneous processing unit, and a control unit. The sequential processing unit performs processing on the substrate while sequentially transporting the substrate based on the sequential processing substrate data set for each substrate divided into a plurality of groups. The simultaneous processing unit simultaneously processes the substrate for each group based on the simultaneous processing board data set for each group. The control unit controls the transfer to the substrate and the processing in the sequential processing unit based on the sequential processing board data, and controls the processing to the substrate in the simultaneous processing unit based on the simultaneous processing board data. ..

The simultaneous processing board data includes group identification information for identifying the group, a board number for distinguishing the boards belonging to the group from each other, and position information indicating a position of the board in the group in a transport direction. , The recipe information for defining the processing contents commonly performed on the substrate belonging to the group.

The sequential processing board data includes the position information about the substrate corresponding to the sequential processing board data, the group identification information, and the recipe information.

The control unit generates the sequential processing board data from the simultaneous processing board data, and generates the simultaneous processing board data from the sequential processing board data.

The substrate processing method disclosed in the present application includes sequential processing and simultaneous processing. In the sequential processing, processing is performed on the substrate while sequentially transporting the substrate based on the sequential processing substrate data set for each substrate divided into a plurality of groups. In the simultaneous processing, the substrate is simultaneously processed for each group based on the simultaneous processing board data set for each group.

The simultaneous processing board data includes group identification information for identifying the group, a board number for distinguishing the boards belonging to the group from each other, and position information indicating a position of the board in the group in a transport direction. , The recipe information for defining the processing contents commonly performed on the substrate belonging to the group.

The sequential processing board data includes the position information about the substrate corresponding to the sequential processing board data, the group identification information, and the recipe information.

The sequential processing board data is generated from the simultaneous processing board data, and the simultaneous processing board data is generated from the sequential processing board data.

The substrate processing apparatus and the substrate processing method disclosed in the present application control the transfer and processing of the substrate for each group.

The objectives, features, aspects and advantages of the technology disclosed herein will be further clarified by the detailed description and accompanying drawings set forth below.

It is a top view which shows an example of the structure of the substrate processing apparatus schematically. It is a side view which shows the example of the structure of the sequential processing apparatus schematically. It is a top view which shows the example of the structure of the simultaneous processing apparatus schematically. It is a functional block diagram which shows an example of the structure of a control part schematicly. It is a figure which shows the example of the simultaneous processing board data schematically. It is a figure which shows typically the mode in which a plurality of substrates are accommodated in a cassette. It is a figure which shows typically the mode in which a plurality of substrates are accommodated in a cassette. It is a figure which shows the example of the simultaneous processing board data schematically. It is a figure which shows the example of the simultaneous processing board data schematically. It is a top view which shows the example of the substrate transfer of the simultaneous processing apparatus schematically. It is a figure which shows the example of the sequential processing board data schematically. It is a figure which shows the example of the sequential processing board data schematically. It is a side view which shows the example of substrate transfer of a sequential processing apparatus schematicly. It is a side view which shows the example of substrate transfer of a sequential processing apparatus schematicly. It is a figure which shows the example of the sequential processing board data schematically. It is a side view which shows the example of substrate transfer of a sequential processing apparatus schematicly. It is a side view which shows the example of substrate transfer of a sequential processing apparatus schematicly. It is a side view which shows the example of substrate transfer of a sequential processing apparatus schematicly. It is a side view which shows the example of substrate transfer of a sequential processing apparatus schematicly. It is a flowchart which illustrates the flow of operation in a simultaneous processing apparatus and a sequential processing apparatus. It is a flowchart illustrating the details of step S3. It is a flowchart illustrating the details of step S5. It is a flowchart illustrating the details of step S509.

Hereinafter, embodiments will be described with reference to the attached drawings. It should be noted that the drawings are shown schematically, and for convenience of explanation, the configuration is omitted and the configuration is simplified as appropriate. Further, the interrelationship between the sizes and positions of the configurations shown in the drawings is not always accurately described and can be changed as appropriate.

Further, in the description shown below, similar components are illustrated with the same reference numerals, and their names and functions are the same. Therefore, detailed description of them may be omitted to avoid duplication.

Further, even if ordinal numbers such as "first" or "second" may be used in the description described below, these terms are used to facilitate understanding of the contents of the embodiments. It is used for convenience, and is not limited to the order that can occur due to these ordinal numbers.

Expressions that indicate relative or absolute positional relationships (for example, "in one direction", "along one direction", "parallel", "orthogonal", "center", "concentric", "coaxial", etc.) are not specified. Not only does it represent the positional relationship exactly, but it also represents the state of being displaced relative to the angle or distance within the range where tolerances or similar functions can be obtained. Expressions indicating equality (eg, "same", "equal", "homogeneous", etc.) not only represent quantitatively exactly equal states, but also provide tolerance or similar functionality, unless otherwise noted. It shall also represent the state in which there is a difference. Unless otherwise specified, the expression indicating the shape (for example, "square shape" or "cylindrical shape") not only expresses the shape strictly geometrically, but also, for example, to the extent that the same effect can be obtained. It shall also represent a shape having irregularities and chamfers. The expressions "equipped", "equipped", "equipped", "included", or "have" one component are not exclusive expressions that exclude the existence of other components. The expression "at least one of A, B and C" includes A only, B only, C only, any two of A, B and C, and all of A, B and C.

<1. Overall configuration / operation of board processing equipment>
FIG. 1 is a diagram schematically showing an example of the configuration of the substrate processing device 1. In the example of FIG. 1, the substrate processing device 1 is a coater / developer device, and is mainly a cleaning device 12, a dehydration baking device 13, a coating-related device 14, a prebaking device 15, a developing device 17, and a post-baking device 18. To prepare for. Further, on one side of the substrate processing apparatus 1, an indexer unit 11 for carrying in and out the substrate to the substrate processing apparatus 1 is arranged. Further, the exposure apparatus 16 is arranged on the other side of the substrate processing apparatus 1 via an interface portion (not shown).

A cleaning device 12, a dehydration baking device 13, a coating-related device 14, and a pre-baking device 15 are arranged in this order on the going line from the indexer section 11 to the exposure device 16. The developing device 17 and the post-baking device 18 are arranged in this order on the return line from the exposure device 16 to the indexer section 11.

A plurality of cassettes (not shown) for accommodating a plurality of substrates are placed on the indexer unit 11. The substrate is, for example, a rectangular glass substrate used in a liquid crystal display device. An indexer robot (not shown) as a transport unit is arranged in the indexer unit 11. The indexer robot takes out the substrate from the cassette and conveys the substrate to the cleaning device 12. In the cleaning device 12, the substrate is cleaned. The washed substrate is conveyed to the dehydration baking device 13. In the dehydration bake device 13, a dehydration treatment (dehydration bake treatment) is performed by heating. The substrate that has been dehydrated and baked is conveyed to the coating-related device 14, and various treatments including the resist coating treatment are performed. The substrate on which this treatment has been performed is conveyed to the prebaking device 15 and heat-treated. The heat-treated substrate is conveyed to the exposure apparatus 16 and exposed.

The substrate on which these treatments have been performed is conveyed to the developing apparatus 17, and the developing treatment is performed. The developed substrate is transferred to the post-baking device 18 and heat-treated. After that, the substrate is housed in a cassette placed on the indexer unit 11 by the indexer robot. By a series of these processes, a resist pattern is formed on the surface of the substrate.

In the following, when the first process is performed prior to the second process, the device performing the first process is described as being "upstream" of the device performing the second process, and the device performing the second process is described as being "upstream". It is described as being "downstream" of the device performing the first process. The indexer portion 11 is upstream of the cleaning device 12 and downstream of the post-baking device 18. The terms "upstream" and "downstream" are used not only for the device and the elements that make up the device, but also for explaining the positional relationship of the substrates to be transported.

<2. Processing device type>
In this substrate processing device 1, the following two types of processing devices are mixed as the types of processing devices. That is, a sequential processing device (flat flow processing device) that sequentially transports the boards in one direction and processes the boards one by one, and an N (integer of 2 or more) boards collectively. Simultaneous processing devices that can process at the same time are mixed. It should be noted that the processing periods of the N substrates by the simultaneous processing apparatus do not have to be completely the same, and it is sufficient that at least a part of each processing period overlaps. In short, the term "simultaneous" here is used in contrast to the state in which the treatment periods do not overlap at all. Examples of the sequential processing device include a cleaning device 12 and a developing device 17, and examples of the simultaneous processing device include a dehydration baking device 13, a coating-related device 14, a prebaking device 15, and a post-baking device 18.

The sequential processing apparatus can be regarded as a sequential processing unit that is a part of the substrate processing apparatus 1. The simultaneous processing apparatus can be regarded as a simultaneous processing unit that is a part of the substrate processing apparatus 1.

<2-1. Sequential processing device>
FIG. 2 is a side view schematically showing an example of the configuration of the sequential processing device 30. The sequential processing device 30 includes a processing device main body 32 and a substrate lead-out unit 33, and a substrate introduction unit (accepting unit) 31 is provided immediately before the sequential processing device 30. The board introduction unit 31 collectively receives a plurality of (N sheets) of boards W transported from the upstream device. The processing apparatus main body 32 sequentially receives a plurality of substrates W transported from the substrate introduction unit 31 one by one, and transports the substrate W along one direction (transport direction: from the left side to the right side in FIG. 2). While doing so, various processes are performed on the substrate W. The processed substrate W is conveyed from the processing apparatus main body 32 to the substrate lead-out unit 33. The board lead-out unit 33 sequentially receives a plurality of boards W conveyed from the processing device main body 32. The board lead-out unit 33 can hold a plurality (N sheets) of the boards W received in sequence. The plurality of boards W are collectively taken out from the board lead-out unit 33 and transported to a downstream device. It may be considered that the substrate introduction unit 31 is included in the sequential processing device 30. The substrate introduction unit 31 can function as an inlet portion of the sequential processing device 30, and the substrate lead-out unit 33 can function as an outlet portion of the sequential processing device 30. In the following, the case of N = 2 is exemplified.

<2-1-1. Board introduction unit 31>
The substrate introduction unit 31 has a plurality of rollers 311 and a plurality of rollers 313 as a transport mechanism, and sensors 314 and 315. The cross section of the rollers 311, 313 has a circular shape, and the rollers 311, 313 are provided so that the central axis thereof is substantially perpendicular to and substantially horizontal to the transport direction of the substrate W. The transport direction referred to here is the transport direction of the substrate W in the sequential processing device 30. The plurality of rollers 311 are provided side by side at intervals along the transport direction. Each roller 311 can rotate about its own central axis as a rotation axis. Both ends of each roller 311 on the central axis are rotatably fixed to a support plate (not shown). The pair of support plates are plate-shaped members extending along the transport direction, and are fixed to a predetermined pedestal 312 provided on the floor surface. The plurality of rollers 313 are provided side by side at intervals along the transport direction. The roller 313 is located downstream of the roller 311 and is provided at the same height as the roller 311. Each roller 313 can rotate about its own central axis as a rotation axis. Both ends of each roller 313 in the central axis are rotatably fixed to the support plate.

The plurality of rollers 311 are driven by a drive unit (not shown) and rotate (synchronously rotate) in the same predetermined direction at substantially equal rotation speeds. The drive unit has a motor. The substrate W is placed on the plurality of rollers 311. The substrate W is placed so that the normal direction of its main surface is along the vertical direction (vertical direction in FIG. 2). In this state, the plurality of rollers 311 rotate synchronously in the same direction, so that the substrate W moves on the rollers 311 to the processing apparatus main body 32 along the transport direction. The plurality of rollers 313 are also driven by a drive unit (not shown) and rotate synchronously. Since the rollers 311, 313 are driven by different drive units, they are controlled independently of each other.

The substrate W is placed one by one on the rollers 311, 313. For example, two substrates W from the indexer portion 11 may be placed on the rollers 311, 313. By synchronously rotating only the roller 313 in this state, the substrate W on the roller 313 can be conveyed to the processing apparatus main body 32. Next, both the rollers 311, 313 rotate synchronously, so that the substrate W on the rollers 313 can be transported to the processing apparatus main body 32.

The sensor 314 detects whether or not the substrate W is present at the stop position on the roller 311. The sensor 315 detects whether or not the substrate W is present at the stop position on the roller 313. The sensors 314 and 315 are, for example, optical sensors, and detect the substrate W when the reflected light from the substrate W is received. The detection results of the sensors 314 and 315 are output to the control unit 60.

Hereinafter, one of the two substrates W is also referred to as a substrate W1, and the other is also referred to as a substrate W2. Here, it is assumed that the substrate W1 is located on the upstream side of the substrate W2.

<2-1-2. Board lead-out unit 33>
The board lead-out unit 33 can hold a plurality (N sheets) of boards W sequentially conveyed from the processing apparatus main body 32. The number of substrates W that can be held by the substrate lead-out unit 33 is the same as the number of substrates W that can be processed by the next simultaneous processing device 40 (for example, if the sequential processing device 30 is the cleaning device 12, the dehydration baking device 13). be. Here, as an example, it is assumed that the substrate lead-out unit 33 holds two substrates W, and the simultaneous processing device 40 simultaneously processes the two substrates W.

The board lead-out unit 33 includes a plurality of rollers 331 and a plurality of rollers 332 as a transport mechanism, and sensors 334 and 335. The cross sections of the rollers 331 and 332 have a circular shape. The rollers 331 are arranged at intervals along the transport direction so that the central axis thereof is perpendicular and horizontal to the transport direction of the substrate W. The roller 332 is arranged on the downstream side of the roller 331. The rollers 332 are arranged at intervals along the transport direction in the same posture as the rollers 331. Both ends of each roller 331 and 332 in the central axis are rotatably fixed to a support plate (not shown). The plurality of rollers 331 are synchronously rotated by the drive unit (not shown), and the plurality of rollers 332 are synchronously rotated by the drive unit (not shown). Since the rollers 331 and 332 are driven by different drive units, they can be controlled independently of each other. Each drive unit has, for example, a motor.

The rollers 331 and 332 are provided at the same height as each other. The substrate W is conveyed from the processing apparatus main body 32 to the rollers 331, and is appropriately conveyed from the rollers 331 to the rollers 332. As will be described later, one substrate W is stopped on the roller 331, and one substrate W is stopped on the roller 332. As a result, the substrate lead-out unit 33 can hold the two substrates W.

The sensor 334 detects whether or not the substrate W is present at the stop position on the roller 331. The sensor 335 detects whether or not the substrate W is present at the stop position on the roller 332. The sensors 334 and 335 are, for example, optical sensors, and detect the substrate W when the reflected light from the substrate W is received. The detection results of the sensors 334 and 335 are output to the control unit 60.

The board lead-out unit 33 can sequentially receive two boards W from the processing device main body 32 and hold them. Hereinafter, for the sake of simplicity, a case where two substrates W are processed together will be described below. The case where the N substrates W are processed without being batched will be described in detail later.

First, the first substrate W is conveyed to the stop position on the roller 332 by the synchronous rotation of the rollers 331 and 332. Specifically, when both the sensors 334 and 335 do not detect the substrate W, the rollers 331 and 332 are rotated synchronously to convey the substrate W from the processing apparatus main body 32 to the substrate lead-out unit 33. Then, when the sensor 335 detects the substrate W, the synchronous rotation of the roller 332 is stopped. As a result, the first substrate W (the substrate W2 on the downstream side) is stopped and supported on the roller 332. For the second substrate W (upstream side substrate W1), the roller 332 is not rotated, but the roller 331 is rotated synchronously to convey the substrate W to the stop position of the roller 331. Specifically, when the sensor 334 detects the substrate W, the synchronous rotation of the roller 331 is stopped. That is, when both the sensors 334 and 335 detect the substrate W, the synchronous rotation of the roller 331 is stopped. As a result, the second substrate W is stopped and supported on the roller 331. In this way, the substrate lead-out unit 33 can hold the two substrates W.

<2-1-3. Processing device body 32>
The processing device main body 32 has a plurality of rollers 321 as a transport mechanism. The plurality of rollers 321 have the same shape as the rollers 311 and are arranged in the same posture as the rollers 311. Both ends of the roller 321 on the central axis are rotatably fixed to a support plate (not shown). The plurality of rollers 321 are arranged at intervals along the transport direction. The plurality of rollers 321 are provided at the same height as the rollers 311 of the substrate introduction portion 31, and the substrate W can move from the rollers 311 to the rollers 332 via the rollers 313, 321, 331 in this order.

The processing apparatus main body 32 appropriately processes the substrate W flowing on the roller 321 at each position in the transport direction. Here, the cleaning device 12 will be described as an example of the sequential processing device 30. For example, the processing device main body 32 has a chemical solution unit 34, a water washing unit 35, and a draining unit 36. The chemical solution unit 34, the water washing unit 35, and the draining unit 36 are provided in series in this order from upstream to downstream. Further, the plurality of rollers 321 are provided over the chemical solution section 34, the washing section 35, and the draining section 36. The plurality of rollers 321 are driven by a drive unit (not shown) and rotate synchronously. As a result, the substrate W can be conveyed along the conveying direction, and the chemical solution portion 34, the washing portion 35, and the draining portion 36 can be passed in this order.

The chemical solution unit 34 is a device for cleaning the substrate W by supplying the chemical solution to the substrate W on the roller 321. The chemical solution unit 34 supplies the chemical solution to the nozzle 341 via a plurality of nozzles 341 for discharging the chemical solution, a chemical solution tank 342 for storing the chemical solution, a supply pipe 343 connecting the chemical solution tank 342 and the nozzle 341, and a supply pipe 343. It is equipped with a pump 344. Nozzles 341 are provided on both sides of the substrate W in the vertical direction, and supply chemicals to both sides of the substrate W. The supply pipe 343 is provided with a flow rate sensor 345, which contributes to controlling the amount of the chemical liquid to be supplied. The chemical solution unit 34 may have a brush (not shown) for brushing the substrate W or the like. By brushing while supplying the chemical solution to the substrate W, the cleaning effect can be enhanced. The chemical solution supplied to the substrate W mainly falls from the peripheral edge of the substrate W and is collected in the chemical solution tank 342.

The water washing unit 35 is a device for washing away the chemical solution remaining on the substrate W by supplying washing water to the substrate W. The washing unit 35 has a first water tank 355 and a second water tank 356 for storing washing water. Further, the water washing unit 35 has a low pressure water supply unit 351, a high pressure water supply unit 352, an ultrasonic cleaning water supply unit 353, and a pure water supply unit 354 arranged in this order from upstream to downstream. Similar to the chemical solution unit 34, each unit 351 to 354 includes a nozzle for discharging the liquid to the substrate W, a supply pipe connected to the nozzle, and a pump for supplying the liquid to the nozzle via the supply pipe. ing.

The pump 35t of the low-pressure water supply unit 351 is a low-pressure pump, and draws wash water from the first water tank 355 with a low pressure and supplies it to the nozzle. As a result, the low pressure water supply unit 351 can supply the washing water to the substrate W at a low pressure. The low-pressure water supply unit 351 is provided with a slit nozzle (also referred to as a liquid knife) 35a, and cleaning water is also supplied to the substrate W from the liquid knife 35a. The pressure of the washing water supplied to the low pressure water supply unit 351 is measured by the pressure sensor 357.

The pump 35r of the high-pressure water supply unit 352 is a high-pressure pump, and draws wash water from the first water tank 355 with high pressure and supplies it to the nozzle. As a result, the high-pressure water supply unit 352 can supply the washing water to the substrate W at high pressure. The pressure of the washing water supplied to the high-pressure water supply unit 352 is measured by the pressure sensor 358. The washing water supplied by the low-pressure water supply unit 351 and the high-pressure water supply unit 352 mainly falls from the peripheral edge of the substrate W and is collected in the first water tank 355.

The nozzle 35b of the ultrasonic cleaning water supply unit 353 is provided with an ultrasonic vibrator that applies ultrasonic vibration to the cleaning water from the second water tank 356. The nozzle 35b functions as a liquid knife. The pump 35s of the ultrasonic cleaning water supply unit 353 draws cleaning water from the second water tank 356 and supplies it to the nozzle 35b. When the ultrasonic vibrator of the nozzle 35b vibrates, the ultrasonic cleaning water supply unit 353 supplies the cleaning water in a vibrating state from the nozzle 35b to the substrate W. The cleaning water supplied by the ultrasonic cleaning water supply unit 353 is mainly collected in the second water tank 356. The flow rate of the washing water supplied to the nozzle 35b is measured by the flow rate sensor 359.

The nozzle of the pure water supply unit 354 supplies pure water supplied from the pure water supply source 365 toward the substrate W. The pure water supply source 365 is provided, for example, as factory equipment (utility). This pure water is mainly recovered in the second water tank 356.

The draining portion 36 is a device that blows water from the substrate W by flowing a high-pressure air flow to the substrate W. The draining unit 36 has an injection unit (dry air knife) 361 that injects gas onto the substrate W, a gas supply source 362 that supplies gas, and a pipeline 363 that connects the injection unit 361 and the gas supply source 362. ing. A flow rate sensor 364 for measuring the flow rate of the gas is provided in the pipeline 363. The gas supply source 362 is a gas source provided as factory equipment (utility).

As described above, in the processing apparatus main body 32, the substrate W is conveyed along the conveying direction, and various processing is performed at each position. The substrate W that has been completely processed by the processing apparatus main body 32 is conveyed to the substrate lead-out unit 33.

<3. Simultaneous processing device 40>
FIG. 3 is a diagram schematically showing an example of the configuration of the simultaneous processing device 40. Here, the dehydration baking device 13 will be described as an example of the simultaneous processing device 40. FIG. 3 is a schematic plan view showing an example of the configuration of the dehydration bake device 13 as viewed vertically downward.

<3-1. Dehydration baking device 13>
The dehydration baking device 13 includes a heating unit 82 and a cooling unit 83. The dehydration baking device 13 receives the substrate W cleaned by the cleaning device 12 (which is the sequential processing device 30) from the transfer robot (transport unit) 81, and simultaneously processes the received substrate W. The dehydration baking device 13 can simultaneously process a plurality of (N) substrates W. Hereinafter, for the sake of simplicity, a case where two substrates W are processed together will be described below. The case where the N substrates W are processed without being batched will be described in detail later.

<3-1-1. Transfer robot 81>
The transfer robot 81 has a hand H1, a moving mechanism 51, an elevating mechanism 52, and a rotation mechanism 53. The moving mechanism 51 can move the hand H1 in a horizontal plane. For example, the moving mechanism 51 has a pair of arms (not shown). Each arm has a plurality of long connecting members, and the ends of the connecting members are rotatably connected to each other. One end of each arm is connected to the hand H1 and the other end is connected to the elevating mechanism 52. By controlling the connecting angle of the connecting member, the hand H1 can be moved in the horizontal plane. The elevating mechanism 52 raises and lowers the hand H1 by raising and lowering the arm along the vertical direction. The elevating mechanism 52 has, for example, a ball screw mechanism. The rotation mechanism 53 can rotate the elevating mechanism 52 around a rotation axis along the vertical direction. As a result, the hand H1 rotates along the circumferential direction. By this rotation, the direction of the hand H1 can be changed. The rotation mechanism 53 has, for example, a motor.

The two substrates W are placed side by side on the hand H1 in one horizontal direction (horizontal direction in FIG. 3). The hand H1 has, for example, a plurality of finger-shaped members F1 and a base end member P1 that connects the base ends of the finger-shaped members F1 to each other. One end of the above-mentioned arm is connected to the base end member P1. The finger-shaped member F1 has a long shape, and the substrate W is placed on the upper surface thereof. The two substrates W are placed side by side along the longitudinal direction (left-right direction in FIG. 3) of the finger-shaped member F1. Therefore, the length of the finger-shaped member F1 in the longitudinal direction is set according to the length of two substrates W and the distance between the substrates W.

The transfer robot 81 appropriately moves and rotates the hand H1 to move the hand H1 to a heating unit 82, a cooling unit 83, a substrate lead-out unit 33 of the cleaning device 12, and a coating-related device 14 in the next process (not shown in FIG. 3). Can be moved to each of. The transfer robot 81 may collectively take out the two substrates W from each of the substrate lead-out unit 33, the heating unit 82, and the cooling unit 83, or collectively take out the two substrates W from the heating unit 82, the cooling unit 83, and the cooling unit 83. It can be handed over to each of the coating-related devices 14.

For example, the transfer robot 81 collectively takes out two boards W from the board lead-out unit 33 as follows. That is, the transfer robot 81 moves the hand H1 to the board lead-out unit 33 in order to position the hand H1 below the two boards W held by the board lead-out unit 33.

The rollers 331 and 332 are configured to avoid collision with the hand H1 of the transfer robot 81. Then, the transfer robot 81 can lift the N-sheet substrate W by the hand H1 by raising the hand H1 vertically upward. As a result, the two substrates W are separated from the rollers 331 and 332, respectively. The two substrates W will be placed side by side on the hand H1 at intervals along the longitudinal direction thereof. The two substrates W are placed on the hand H1 in a posture in which the normal direction of the main surface is along the vertical direction.

The two substrates W may be placed side by side on the hand H1 at intervals along the lateral direction (minor direction). Such mounting is realized, for example, by providing a turntable and rotating the substrate W by 90 degrees.

Next, the transfer robot 81 moves the hand H1 away from the board lead-out unit 33, so that the two boards W are collectively taken out from the board lead-out unit 33.

A plurality of suction ports may be formed on the upper surface of the finger-shaped member F1 (the surface on which the substrate W is placed). This suction port is provided at a position facing the two boards W, and air is drawn from the suction port to suck the board W. Thereby, the holding force for holding the substrate W can be improved.

The transfer robot 81 collectively takes out two substrates W from each of the heating unit 82 and the cooling unit 83 by the same operation as the above operation. On the other hand, the transfer robot 81 collectively passes the two substrates W to each of the heating unit 82, the cooling unit 83, and the coating-related device 14 (hereinafter referred to as each unit) in the reverse procedure of the above operation. That is, the transfer robot 81 moves the hand H1 on which the two boards W are placed to the inside of each part, lowers the hand H1 and collectively puts the two boards W on the upper surface of the board holding part of each part. Place it. The substrate holding portion of each portion is configured so as not to collide with the hand H1 when the two substrates W are carried in and out. Then, the transfer robot 81 moves the hand H1 from the inside to the outside of each part. As a result, the two substrates W are collectively passed to each part.

As described above, the transfer robot 81 holds N (two) of the plurality of substrates W processed by the cleaning apparatus 12, which is a sequential processing device, side by side in one horizontal direction, and holds the N. The sheets (two sheets) of the substrate W can be collectively transported to the dehydration baking device 13 which is a simultaneous processing device. By transporting a plurality of substrates W at once, it is possible to improve the throughput of the transport operation as compared with the case where the substrates W are transported one by one.

<3-1-2. Heating unit 82>
Two substrates W are collectively handed over to the heating unit 82 from the transfer robot 81. The heating unit 82 includes a substrate holding unit 91 that holds the two substrates W side by side in the horizontal direction, and a heating means 92 that simultaneously heats the two substrates W at the same time. .. In other words, the heating unit 82 heat-treats the two substrates W at the same time.

The board holding portion 91 has a member that supports the lower surfaces of the two boards W. The two substrates W are held by being placed on this member. The two substrates W are placed in a posture in which the normal direction of the main surface is along the vertical direction. For example, the substrate holding portion 91 includes a plurality of lift pins (not shown). The plurality of lift pins move up and down between the upper position where the tip of the lift pin protrudes from the upper surface of the substrate holding portion 91 and the lower position retracted below the upper surface. The transfer robot 81 passes the two substrates W to the plurality of lift pins protruding upward, and then retracts from the heating unit 82. The plurality of lift pins descend while supporting the two boards W, and the two boards W are placed on the upper surface of the board holding portion 91.

The heating means 92 is, for example, a heater or the like, and simultaneously heat-treats the two substrates W held by the substrate holding portion 91 at the same time. By this heat treatment, for example, the pure water remaining on the substrate W can be evaporated (dehydration treatment). By performing the heat treatment on a plurality of substrates W at the same time at the same time, the throughput of the heat treatment can be improved as compared with the case where the heat treatment is performed on the substrate W one by one.

<3-1-3. Cooling unit 83>
The two substrates W heated by the heating unit 82 are collectively delivered to the cooling unit 83 from the transfer robot 81. That is, the transfer robot 81 holds the two substrates W processed by the heating unit 82 after being processed by the cleaning device 12, which is a sequential processing device, side by side in one horizontal direction, and holds the two substrates W. It is collectively transported to the cooling unit 83. The cooling unit 83 includes a substrate holding unit 93 that holds the two substrates W side by side in the horizontal direction, and a cooling means 94 that collectively cools the two substrates W. In other words, the cooling unit 83 cools the two substrates W at the same time.

The substrate holding portion 93 has a member (not shown) that supports the lower surfaces of the two substrates W. The two substrates W are held by being placed on this member. The two substrates W are placed in a posture in which the normal direction of the main surface is along the vertical direction. The structure of the substrate holding portion 93 is the same as that of the substrate holding portion 91.

The cooling means 94 is, for example, a cooling plate for flowing cold water through a liquid passage formed inside the metal plate, and collectively performs cooling treatment on the two substrates W held by the substrate holding portion 93. The cooling means 94 is controlled by the control unit 60. By this cooling treatment, the two substrates W are cooled, and the temperature of the two substrates W can be set to a temperature suitable for the processing device (coating-related device 14) on the downstream side. By performing the cooling treatment on the two substrates W at the same time at the same time, the throughput of the cooling treatment can be improved as compared with the case where the cooling treatment is performed on the substrates W one by one.

The cooling unit 83 may cool the two substrates W by natural cooling. The natural cooling means that the heated substrate W is not cooled by using power (electric power), but the substrate W is left to cool. In this case, the cooling means 94 as a configuration such as a cooling plate is unnecessary.

<3-1-4. A series of processing of dehydration baking equipment>
Next, a series of processes by the dehydration baking apparatus 13 will be briefly described. The transfer robot 81 collectively takes out two boards W from the board lead-out unit 33 of the cleaning device 12 on the upstream side, and hands the two boards W together to the heating unit 82. Even in this heating unit 82, the two substrates W are held in a horizontally aligned state. The heating unit 82 collectively heats the two substrates W. The two substrates W after the heat treatment are collectively taken out by the transfer robot 81 and collectively passed to the cooling unit 83. Even in the cooling unit 83, the two substrates W are held in a horizontally aligned state. The cooling unit 83 collectively cools the two substrates W. The two substrates W that have been cooled are collectively taken out by the transfer robot 81 and collectively transferred to the coating-related device 14.

<4. Control unit>
As illustrated in FIG. 1, the substrate processing apparatus 1 has a control unit 60 that controls processing in each processing apparatus and transfer of a substrate. FIG. 4 is a functional block diagram schematically showing an example of the configuration of the control unit 60.

The control unit 60 is a control circuit, and as shown in FIG. 4, for example, a CPU (Central Processing Unit) 61, a ROM (Read Only Memory) 62, a RAM (Random Access Memory) 63, a storage device 64, and the like are included. It is composed of general computers interconnected via a bus line 65. The ROM 62 stores a basic program and the like, and the RAM 63 is provided as a work area when the CPU 61 performs a predetermined process. The storage device 64 is composed of a flash memory or a non-volatile storage device such as a hard disk device.

Further, in the control unit 60, the input unit 66, the display unit 67, and the communication unit 68 are also connected to the bus line 65. The input unit 66 is composed of various switches, a touch panel, or the like, and receives various input setting instructions such as processing recipes from the operator. The display unit 67 is composed of a liquid crystal display device, a lamp, and the like, and displays various information under the control of the CPU 61. The communication unit 68 has a data communication function via a LAN (Local Area Network) or the like.

Further, each robot (such as a transfer robot such as an indexer robot) and each of the above-mentioned processing devices are connected to the control unit 60 as control targets. That is, the control unit 60 can function as a transfer control unit that controls the transfer of the substrate W.

The storage device 64 of the control unit 60 stores a processing program P for controlling each device constituting the board processing device 1. By executing the processing program P by the CPU 61 of the control unit 60, the transfer operation and the processing operation of the substrate are controlled. Further, the processing program P may be stored in the recording medium. By using this recording medium, the processing program P can be installed in the control unit 60 (computer). Further, a part or all of the functions executed by the control unit 60 do not necessarily have to be realized by software, and may be realized by hardware such as a dedicated logic circuit.

The control unit 60 may have a plurality of layers. For example, the control unit 60 may include a main control unit and a plurality of terminal control units. The terminal control unit is provided in, for example, each processing device of the indexer unit 11, the cleaning device 12, the dehydration baking device 13, the coating-related device 14, the prebaking device 15, the exposure device 16, the developing device 17, and the post-baking device 18. The main control unit is provided in the substrate processing device 1 and communicates with a plurality of terminal control units. The main control unit manages the overall operation of the substrate processing device 1, and the terminal control unit controls the operation of each corresponding device.

A plurality of terminal control units can communicate with each other. For example, data regarding the substrate W is transmitted and received between the terminal control units. The data relating to the substrate W indicates, for example, the data of the substrate W in a group unit, and the data includes information indicating the contents of the processing of the substrate W. The terminal control unit controls the corresponding device based on the data of the substrate W received from the terminal control unit on the upstream side, and processes the substrate W. For example, the terminal control unit of the cleaning device 12 receives the data of the substrate W from the terminal control unit of the indexer unit 11, and the substrate W is carried into the cleaning device 12 in group units. The terminal control unit of the cleaning device 12 controls the cleaning device 12 based on the received data of the substrate to perform the cleaning process on the carried-in substrate W. Then, after the processing of the substrate W is completed, the substrate W is conveyed to the dehydration bake device 13 in group units, and the data of the substrate W is transmitted from the terminal control unit of the cleaning device 12 to the terminal device of the dehydration bake device 13. Hereinafter, the process is performed in the same manner.

<5. Simultaneous processing board data>
The control unit 60 can handle the board data corresponding to each board W. The control unit 60 controls the processing on the substrate W in the simultaneous processing apparatus 40 based on the simultaneous processing board data D0 (k).

FIG. 5 is a diagram schematically showing an example of simultaneous processing board data D0 (k) (k is a positive integer). The simultaneous processing board data D0 (k) includes data corresponding to N boards (here, two boards) belonging to the kth group. The substrates W belonging to the same group are collectively conveyed when they are conveyed between the simultaneous processing apparatus and the sequential processing apparatus.

As illustrated in FIG. 5, the simultaneous processing board data D0 (k) includes a board number, group identification information Da1, position information Db1, and recipe information Dc1.

The board number is information for identifying the boards W belonging to the same group. In the example shown in FIG. 5, the substrate number of one substrate W is (board) W1, and the substrate number of the other substrate W is (board) W2.

The group identification information Da1 indicates which group the simultaneous processing board data D0 (k) corresponds to. In the example shown in FIG. 5, since a pair of substrates belong to one group, the pair number k is adopted as the group identification information Da1. For example, in the simultaneous processing board data D0 (1) for the first group, the pair number 1 is adopted as the group identification information Da1. Similarly, in the simultaneous processing board data D0 (2) for the second group, the pair number 2 is adopted as the group identification information Da1.

FIG. 6 is a diagram schematically showing a mode in which a plurality of substrates are housed in a group in the cassette 10. A plurality of boards are housed in cassettes 10 in different storage positions (slots) for each group. Therefore, as the group identification information Da1, information (slot number) indicating the accommodation position of the group in the cassette 10 may be adopted.

The mode in which the substrate W is accommodated in the cassette 10 is common to the case where the substrate W is conveyed from the indexer section 11 to the cleaning device 12 and the case where the substrate W is conveyed from the post-baking device 18 to the indexer section 11.

The different slots in FIG. 6 are located above and below in the figure. In FIG. 6, a case where two substrates W1 (k) and W2 (k) are stored in any of the k-th groups is exemplified.

In the cassette 10, the substrates W1 (k) and W2 (k) belonging to the kth group (however, k = 1 to 7 in FIG. 6) are stored in the left-right direction in the figure. The substrate W1 (k) can be considered as an example of the above-mentioned substrate W1, and the substrate W2 (k) can be considered as an example of the above-mentioned substrate W2.

The position information Db1 indicates the positional relationship of N (here, two) substrates W in the transport direction. In the example shown in FIG. 5, in the kth group, the substrate W1 (k) corresponding to the substrate number W1 is located upstream of the substrate W2 (k) corresponding to the substrate number W2, and the substrate number is The position information Db1 with respect to W1 and W2 indicates "upstream" and "downstream", respectively. The position information Db1 is mainly used for transport control in the sequential processing device 30. Specifically, the sequential processing device 30 first conveys the substrate W2 (k) to which the "downstream" position information Db1 is attached, and then the substrate W1 (k) to which the "upstream" position information Db1 is attached. To transport.

In the following description, the larger the value indicated by the group identification information Da1, the more upstream the substrate belonging to the group corresponding to the group identification information Da1 is conveyed. For example, when the substrate W1 (3) is sequentially carried out from the substrate stored in the slot shown above in FIG. 6 to the substrate stored in the slot shown below, the substrate W1 (3) is conveyed upstream of the substrate W2 (3). The substrate W2 (3) is conveyed upstream of the substrate W1 (2), the substrate W1 (2) is conveyed upstream of the substrate W2 (2), and the substrate W2 (2) is conveyed upstream of the substrate W1 (1). Is also transported upstream, and the substrate W1 (1) is transported upstream of the substrate W2 (1).

The recipe information Dc1 is information indicating processing to be performed in common for the substrates W1 (k) and W2 (k) to which the same pair number k is given to the group identification information Da1 (that is, belonging to the kth group) (for example,). Recipe number) and information on processing conditions in the processing.

As the treatment conditions, for example, for the cleaning treatment, conditions such as the type of the chemical solution to be used, the flow rate of the chemical solution, and the treatment time (that is, the transport speed) can be adopted. For example, in the case of dehydration baking treatment, conditions such as heating temperature, heating time, cooling temperature and cooling time can be adopted as treatment conditions.

Since the recipe information Dc1 is information common to the substrates W1 (k) and W2 (k), the recipe information Dc1 is common to the substrate numbers W1 and W2 and corresponds to the group identification information Da1.

FIG. 7 is a diagram schematically showing another aspect in which a plurality of substrates W are housed in a group in the cassette 10. In FIG. 7, in the second group, the substrate W2 (2) is not stored and only the substrate W1 (2) is stored, and in the fifth group, the substrate W1 (5) is not stored and only the substrate W2 (5) is stored. The case where it is stored is exemplified.

FIG. 8 is a diagram schematically showing an example of simultaneous processing board data D0 (k) when the downstream board W2 (k) does not exist in the kth group. FIG. 9 is a diagram schematically showing an example of simultaneous processing board data D0 (k) when the upstream board W1 (k) does not exist in the kth group. According to FIG. 7, FIG. 5 corresponds to the case of k = 1,3,4,6,7, FIG. 8 corresponds to the case of k = 2, and FIG. 9 corresponds to the case of k = 5. Equivalent to.

In FIGS. 5, 8, 9, 11, 12, and 15, the column marked with the symbol “x” indicates that the value corresponding to the column has no particular meaning. Here, "meaningless" includes not only the absence of the substrate but also the existence of some object that is not the subject of evaluation.

FIG. 10 is a schematic plan view showing the simultaneous processing device 40 (for example, the dehydration baking device 13) as viewed vertically downward, similar to FIG. FIG. 10 schematically shows an example of substrate transfer of the simultaneous processing device 40. In FIG. 3, a case where the substrates W are processed as a pair is exemplified. In FIG. 10, a case where the substrate W is processed for each group is exemplified. However, in the first group, the substrate W2 (1) does not exist and the substrate W1 (1) exists, and in the second group, the substrate W1 (2) does not exist and the substrate W2 (2) exists. , The case where any of the substrates W1 (3) and W2 (3) is present in the third group is exemplified. When the substrates W2 (1) and W1 (2) are virtually present, their positions are indicated by the alternate long and short dash line.

According to FIG. 10, FIG. 5 corresponds to the case of k = 3, FIG. 8 corresponds to the case of k = 1, and FIG. 9 corresponds to the case of k = 2.

It can be said that the simultaneous processing apparatus 40 simultaneously processes the substrates W1 (k) and W2 (k) for each group based on the simultaneous processing board data D0 (k) set for each group. From this point of view, the indexer unit 11 can also be regarded as an example of the simultaneous processing device 40.

<6. Sequential processing board data>
The processing board data J1 (k) and J2 (k) are sequentially set for each of the boards W1 (k) and W2 (k) belonging to the kth group. The sequential processing board data J1 (k) includes group identification information Da1 for the corresponding board W1 (k), position information Db1, and recipe information Dc1. The sequential processing board data J2 (k) includes position information Db1 and recipe information Dc1 for the corresponding board W2 (k).

In the following description, the sequential processing board data J1 (k) includes the substrate number W1, and the sequential processing board data J2 (k) includes the substrate number W2. However, since the sequential processing board data J1 (k) is set for the board W1 (k), it is not necessary to include the board number W1. Since the sequential processing board data J2 (k) is set for the board W2 (k), it is not necessary to include the board number W2.

The sequential processing board data J1 (k) and J2 (k) are generated from the simultaneous processing board data D0 (k) by the control unit 60. The control unit 60 is in the sequential processing device 30 (for example, the cleaning device 12 located downstream of the indexer unit 11 and upstream of the dehydration bake device 13) based on the sequential processing board data J1 (k) and J2 (k). Controls transport and processing for the substrates W1 (k) and W2 (k).

The sequential processing apparatus 30 sequentially conveys the substrates W1 (k) and W2 (k) divided into a plurality of groups, and based on the sequential processing substrate data J1 (k) and J2 (k), the substrate W1 ( processing is performed for k) and W2 (k).

<6-1. If there is no lack of board in the group>
In this section, the case where the substrates W1 (k) and W2 (k) are present in all of the kth groups (k = 1, 2, 3) will be described. FIG. 5 corresponds to the simultaneous processing board data D0 (k) in this case. FIG. 11 is a diagram schematically showing an example of sequential processing board data J1 (k) in this case. FIG. 12 is a diagram schematically showing an example of sequential processing board data J2 (k) in this case.

The group identification information Da1 included in the simultaneous processing board data D0 (k) is adopted for any of the group identification information Da1 of the sequential processing board data J1 (k) and J2 (k). As a result, the grouping of the substrate W is maintained also in the sequential processing apparatus 30, and the transport and processing of the substrate W are managed for each group.

As the position information Db1 of the sequential processing board data J1 (k), the position information Db1 (“upstream”) corresponding to the board number W1 in the simultaneous processing board data D0 (k) is adopted. As the position information Db1 of the sequential processing board data J2 (k), the position information Db1 (“downstream”) corresponding to the board number W2 in the simultaneous processing board data D0 (k) is adopted. In both the simultaneous processing device 40 and the sequential processing device 30, the relationship between the transfer positions of the substrate W is maintained, and the transfer and processing of the substrate W are managed for each group.

The recipe information Dc1 included in the simultaneous processing board data D0 (k) is adopted for any of the recipe information Dc1 of the sequential processing board data J1 (k) and J2 (k). This is because the recipe information Dc1 is information indicating the processing to be performed in common to both the substrates W1 (k) and W2 (k) and the processing conditions in the processing.

Both the sequential processing board data J1 (k) and J2 (k) include the final information Dd1. In the final information Dd1, in the kth group to which the substrate Wn (k) corresponding to a certain substrate number Wn (n is an integer of 1 or more and N or less) belongs, the substrate Wn (k) is the last in the transport direction. Indicates whether or not. Here, the number of substrates W belonging to the kth group is N = 2, both of the substrates W1 (k) and W2 (k) exist, and the transport position of the substrate W1 (k) is the substrate W2 (k). It is upstream from the transport position of. Therefore, in the final information Dd1 in the sequential processing board data J1 (k), the substrate W1 (k) corresponding to the sequential processing board data J1 (k) is the last in the kth group (this is also the most upstream). ) Is adopted. No particular value is adopted for the final information Dd1 in the sequential processing board data J1 (k).

In some cases, none of the sequential processing board data J1 (k) and J2 (k) may include the final information Dd1. This case will be described later in <6-2-2> and <6-2-3>.

FIG. 13 is a side view schematically showing an example of substrate transfer of the sequential processing device 30. In FIG. 13, from the configuration of the sequential processing apparatus 30 shown in FIG. 2, the drawing of the configuration for supplying the liquid or gas and the configuration for recovering the liquid is omitted.

In the state shown in FIG. 13, the substrates W1 (3) and W2 (3) are located at the substrate introduction portion 31. It is detected by the sensor 314 that the substrate W1 (3) is placed on the roller 311. It is detected by the sensor 315 that the substrate W2 (3) is placed on the roller 313.

The substrate W1 (2) is located in the chemical solution portion 34 downstream of the substrates W1 (3) and W2 (3). The substrate W2 (2) is located in the washing portion 35 downstream of the substrate W1 (2).

The substrates W1 (1) and W2 (1) are located in the substrate lead-out portion 33 downstream of the substrate W2 (2). It is detected by the sensor 334 that the substrate W1 (1) is placed on the roller 331. It is detected by the sensor 335 that the substrate W2 (1) is placed on the roller 332.

Prior to this state, the substrates W1 (1) and W2 (1) are located at the substrate introduction portion 31, and then the substrates W1 (1) and W2 (1) are conveyed to the processing apparatus main body 32. The control unit 60 sequentially generates the processing board data J1 (1) and J2 (1) when the presence of the boards W1 (1) and W2 (1) is detected by the sensors 314 and 315, for example. After that, the substrates W1 (2) and W2 (2) are similarly located at the substrate introduction portion 31, and the processing substrate data J1 (2) and J2 (2) are sequentially generated, and the substrates W1 (3) and W2 (3) are generated. ) Is located in the substrate introduction unit 31, and the processing substrate data J1 (3) and J2 (3) are sequentially generated.

After the state shown in FIG. 13, the substrates W1 (1) and W2 (1) are discharged from the substrate lead-out unit 33 to the simultaneous processing device 40 (for example, the dehydration bake device 13) located further downstream.

The control unit 60 generates simultaneous processing board data D0 (k) from the sequential processing board data J1 (k) and J2 (k). For example, simultaneous processing board data D0 (k) is generated when the sensor 334 detects the board W1 (k) corresponding to the sequential processing board data J1 (k) in which "END" is adopted as the final information Dd1. Will be done.

Simultaneous processing board data D0 (1) is generated from the sequential processing board data J1 (1) and J2 (1) as follows.

As the group identification information Da1 in the simultaneous processing board data D0 (1), the group identification information Da1 common to the sequential processing board data J1 (1) and J2 (1) is adopted. As a result, the grouping of the substrate W is maintained even in the simultaneous processing apparatus 40 located downstream, and the transport and processing of the substrate W are managed for each group.

As the recipe information Dc1 in the simultaneous processing board data D0 (1), the recipe information Dc1 common to the sequential processing board data J1 (1) and J2 (1) is adopted. This is because the recipe information Dc1 is information indicating the processing to be performed in common to both the substrates W1 (1) and W2 (1) and the processing conditions in the processing.

In the simultaneous processing board data D0 (1), the position information Db1 (“upstream”) in the sequential processing board data J1 (1) is adopted as the position information Db1 with respect to the board number W1. In the simultaneous processing board data D0 (1), the position information Db1 in the sequential processing board data J2 (1) is adopted as the position information Db1 with respect to the board number W2 (“downstream”). Although the position information Db1 is not necessarily used in the simultaneous processing device 40, it is used in another sequential processing device 30 (for example, a developing device 17) further downstream from the simultaneous processing device 40. The fact that the position information Db1 is adopted in the simultaneous processing board data D0 (1) contributes to the generation of the sequential processing board data J1 (1) and J2 (1) used in the other sequential processing apparatus 30.

The transport position of the substrate W has little relation to the processing in the simultaneous processing apparatus 40. As will be described later, the final information Dd1 is information that varies due to the lack of a substrate in the sequential processing device 30, and does not need to be commonly adopted in the plurality of sequential processing devices 30. Therefore, the need to retain the final information Dd1 in the simultaneous processing board data D0 (k) is small and can be omitted.

After the substrates W1 (1) and W2 (1) are discharged from the substrate out-licensing unit 33, the processing in the processing apparatus 30 proceeds in sequence, and the substrates W1 (2) and W2 (2) are located in the substrate out-licensing unit 33. Simultaneous processing board data D0 (2) is generated from the sequential processing board data J1 (2) and J2 (2) in the same manner as the simultaneous processing board data D0 (1). After that, the simultaneous processing board data D0 (3) is similarly generated from the sequential processing board data J1 (3) and J2 (3).

Processing by the simultaneous processing device 40 is performed based on the simultaneous processing board data D0 (k) corresponding to each group, grouping is maintained upstream and downstream of the sequential processing device 30, and the substrate W is transported and processed for each group. Is managed.

<6-2. If the group lacks a board>
In this section, the case where the substrates W1 (k) and W2 (k) do not exist in any one of the kth groups (k = 1, 2, 3) will be described.

<6-2-1. When the upstream board is eliminated in the sequential processing device>
FIG. 5 corresponds to the simultaneous processing board data D0 (k) in this case. FIG. 11 is a diagram schematically showing an example of the sequential processing board data J1 (k) first generated in this case. FIG. 12 is a diagram schematically showing an example of sequential processing board data J2 (k) first generated in this case. “First generated” means that the substrates W1 (k) and W2 (k) are generated when they are located at the substrate introduction unit 31.

FIG. 14 is a side view schematically showing an example of substrate transfer of the sequential processing device 30. Also in FIG. 14, from the configuration of the sequential processing apparatus 30 shown in FIG. 2, the drawing of the configuration for supplying the liquid or gas and the configuration for recovering the liquid is omitted.

The state shown in FIG. 14 shows an aspect in which the substrate W1 (1), which was present in the state shown in FIG. 13, was eliminated when being processed by the draining portion 36. The position of the substrate W1 (1) before being excluded is virtually indicated by a long-dotted line.

Such exclusion is performed by the operator when, for example, the substrate W1 (1) is damaged in the draining portion 36, or a processing defect including dropping of the substrate W (1) from the roller 321 occurs.

The operator who has performed such exclusion operates the control unit 60 and causes the control unit 60 to sequentially delete the processing board data J1 (1). When the control unit 60 deletes the sequential processing board data J1 (1), the control unit 60 confirms the content of the final information Dd1. Since the final information Dd1 of the sequential processing board data J1 (1) is "END" but the board W1 (1) is excluded, the control unit 60 is downstream from the board W1 (1) and belongs to the same group. The sequential processing board data J2 (1) corresponding to the board W2 (1) is generated again. The re-generation referred to here includes the transmission of "END" as the final information Dd1 to the sequential processing board data J2 (1). Specifically, the group identification information Da1, the position information Db1, and the recipe information Dc1 of the sequential processing board data J2 (1) are maintained, and "END" is adopted as the final information Dd1. It can be said that such generation of the sequential processing board data J2 (1) again is an update of the sequential processing board data J2 (1).

Before the sequential processing board data J1 (1) is deleted, the sequential processing board data J1 (1) corresponds to the case of k = 1 in FIG. The sequential processing board data J2 (1) before being updated corresponds to the case of k = 1 in FIG. FIG. 15 shows the sequential processing board data J2 (k) after being updated. The updated sequential processing board data J2 (1) corresponds to the case of k = 1 in FIG. 15, and “END” is adopted as the final information Dd1. The configuration shown in FIG. 15 differs from the configuration shown in FIG. 12 only in that "END" is adopted for the final information Dd1.

Simultaneous processing board data D0 (1) is generated when the sensor 335 detects the board W2 (1) corresponding to the sequential processing board data J2 (1) in which "END" is adopted as the final information Dd1. To. The substrate W2 (1) is dispensed from the substrate lead-out unit 33.

The simultaneous processing board data D0 (1) is generated by using the sequential processing board data J2 (1) without using the deleted sequential processing board data J1 (1).

As the group identification information Da1 in the simultaneous processing board data D0 (1), the group identification information Da1 in the sequential processing board data J2 (1) is adopted. As a result, the grouping of the substrate W is maintained even in the simultaneous processing apparatus 40 located downstream, and the transport and processing of the substrate W are managed for each group.

The recipe information Dc1 in the sequential processing board data J2 (1) is adopted as the recipe information Dc1 in the simultaneous processing board data D0 (1). This is because the recipe information Dc1 is information indicating the processing to be performed on the substrate W2 (1) regardless of the presence or absence of the substrate W1 (1) and the processing conditions in the processing.

In the simultaneous processing board data D0 (1), the position information Db1 with respect to the board number W1 and the board number W1 is not adopted. In the simultaneous processing board data D0 (1), the position information Db1 in the sequential processing board data J2 (1) is adopted as the position information Db1 with respect to the board number W2. The final information Dd1 is unnecessary in the simultaneous processing board data D0 (k).

In this way, processing is performed by the simultaneous processing device 40 based on the simultaneous processing board data D0 (k) corresponding to each group, and even if the board W is eliminated, the groups are sequentially upstream and downstream of the processing device 30. The division is maintained, and the transfer and processing of the substrate W are managed for each group.

For example, when "END" is adopted as the final information Dd1 and updated sequential processing board data J2 (1) is obtained and the board W2 (1) is detected by the sensor 335, an alarm is set, for example, a display unit. Issued by 67. Such an alarm indicates that the substrate W is removed and the number of substrates constituting the group is not normal, which contributes to alerting the operator of the substrate processing apparatus 1.

<6-2-2. When the presence or absence of the board on the upstream side is confirmed in the sequential processing device>
In the method described in this section, the value of the final information Dd1 does not matter, and neither of the sequential processing board data J1 (k) and J2 (k) may include the final information Dd1.

As a first example in which the presence or absence of the substrate on the upstream side is confirmed in the sequential processing apparatus, the substrate W1 (1) is conveyed in the sequential processing apparatus 30 as described in <6-2-1>. In the middle of receiving the process, it may be excluded by the operator. As a second example, the board W1 (k) on the upstream side does not already exist at the time when the board W is transported to the board introduction unit 31, and the board number W1 also exists in the simultaneous processing board data D0 (k). There are cases where it was not. In the following description, in both the first example and the second example, the case where the substrate W1 (1) does not exist and the substrate W2 (1) exists is exemplified.

FIG. 16 is a side view schematically showing an example of substrate transfer of the sequential processing device 30. Also in FIG. 16, from the configuration of the sequential processing apparatus 30 shown in FIG. 2, the drawing of the configuration for supplying the liquid or gas and the configuration for recovering the liquid is omitted.

In the first example, as described in <6-2-1>, the control unit 60 sequentially deletes the processing board data J1 (1). The sequential processing board data J2 (1) may maintain the structure in which k = 1 in FIG. 12, or may be updated to the structure in which k = 1 in FIG.

In the second example, when the simultaneous processing board data D0 (1) has a structure in which k = 1 in FIG. 9, the control unit 60 sequentially processes the processing board data J1 (1) without generating it. The board data J2 (1) is generated. The sequential processing board data J2 (1) may have a structure in which k = 1 in FIG. 15 or a structure in which k = 1 in FIG. The sequential processing board data J2 (1) does not have to include the final information Dd1.

In both the first example and the second example, the sequential processing board data J1 (1) does not exist, the board W1 (1) is not detected by the sensor 334, and the board W1 (1) The lack is confirmed. With this confirmation and the detection of the substrate W2 (1) by the sensor 335, the simultaneous processing substrate data D0 (1) is generated using the sequential processing substrate data J2 (1). The substrate W2 (1) is dispensed from the substrate lead-out unit 33.

For example, when the sensor 335 detects the substrate W2, the control unit 60 has a group of the group identification information Da1 of the sequential processing board data of the substrate W2 and a group of the sequential processing board data of the substrate W on the upstream side of the substrate W2. Compare with the identification information Da1. The fact that the sequentially processed board data are arranged in the order of transfer makes it easy for the control unit 60 to specify the respective sequentially processed board data for the two boards W to be transferred adjacent to each other. When these two group identification information Da1 are different from each other, the substrate W1 belonging to the same group as the substrate W2 is missing. In this case, in the above example, the control unit 60 generates the simultaneous processing board data D0 (1) using the sequential processing board data J2 (1). The substrate W2 (1) is discharged from the substrate lead-out unit 33 without waiting for the detection of the substrate W by the sensor 334.

The simultaneous processing board data D0 (1) is generated using the sequential processing board data J2 (1) without using the sequential processing board data J1 (1) (deleted or not generated).

As the group identification information Da1 in the simultaneous processing board data D0 (1), the group identification information Da1 in the sequential processing board data J2 (1) is adopted. As a result, the grouping of the substrate W is maintained even in the simultaneous processing apparatus 40 located downstream, and the transport and processing of the substrate W are managed for each group.

The recipe information Dc1 in the sequential processing board data J2 (1) is adopted as the recipe information Dc1 in the simultaneous processing board data D0 (1).

In the simultaneous processing board data D0 (1), the position information Db1 with respect to the board number W1 and the board number W1 is not adopted. In the simultaneous processing board data D0 (1), the position information Db1 in the sequential processing board data J2 (1) is adopted as the position information Db1 with respect to the board number W2. The final information Dd1 is unnecessary in the simultaneous processing board data D0 (k).

In this way, processing is performed by the simultaneous processing device 40 based on the simultaneous processing board data D0 (k) corresponding to each group, and even if the board W is eliminated, the groups are sequentially upstream and downstream of the processing device 30. The division is maintained, and the transfer and processing of the substrate W are managed for each group.

For example, when there is no sequential processing board data J1 (1), the board W1 (1) is not detected by the sensor 334, and the board W2 (1) is detected by the sensor 335, an alarm is set, for example, a display unit. Issued by 67. Such an alarm indicates that the substrate W is removed and the number of substrates constituting the group is not normal, which contributes to alerting the operator of the substrate processing apparatus 1.

<6-2-3. When the downstream board is missing in the sequential processing device>
In the method described in this section, the value of the final information Dd1 does not matter, and neither of the sequential processing board data J1 (k) and J2 (k) may include the final information Dd1.

As a first example of the case where the presence or absence of the substrate on the downstream side is confirmed in the sequential processing apparatus, the substrate W2 (k) is conveyed in the sequential processing apparatus 30 and is eliminated by the operator while being processed. There are cases. Further, as a second example, the substrate W2 (k) on the downstream side does not already exist at the time when the substrate W is conveyed to the substrate introduction unit 31, and the substrate number W2 also exists in the simultaneous processing substrate data D0 (k). There are cases where it was not done. In the following description, in both the first example and the second example, the case where the substrate W2 (1) does not exist and the substrate W1 (1) exists is exemplified.

FIG. 17 is a side view schematically showing an example of substrate transfer of the sequential processing device 30. Also in FIG. 17, from the configuration of the sequential processing apparatus 30 shown in FIG. 2, the drawing of the configuration for supplying the liquid or gas and the configuration for recovering the liquid is omitted.

In the first example, the control unit 60 sequentially deletes the processing board data J2 (1). In the second example, when the simultaneous processing board data D0 (1) has a structure in which k = 1 in FIG. 8, the control unit 60 sequentially processes the processing board data J2 (1) without generating it. The board data J1 (1) is generated. The structure in which k = 1 is adopted in FIG. 11 for the sequential processing board data J1 (1). However, the sequential processing board data J1 (1) does not have to include the final information Dd1.

In both the first example and the second example, the sequential processing board data J2 (1) does not exist, and the sequential processing board data J1 (1) is generated. Simultaneous processing board data D0 (1) is generated when the board W1 (1) is detected by the sensor 334 without the board W2 (1) being detected by the sensor 335. The substrate W1 (1) is dispensed from the substrate lead-out unit 33.

The simultaneous processing board data D0 (1) is generated using the sequential processing board data J1 (1) without using the sequential processing board data J2 (1) (deleted or not generated).

As the group identification information Da1 in the simultaneous processing board data D0 (1), the group identification information Da1 in the sequential processing board data J1 (1) is adopted. As a result, the grouping of the substrate W is maintained even in the simultaneous processing apparatus 40 located downstream, and the transport and processing of the substrate W are managed for each group.

The recipe information Dc1 in the sequential processing board data J1 (1) is adopted as the recipe information Dc1 in the simultaneous processing board data D0 (1).

In the simultaneous processing board data D0 (1), the position information Db1 with respect to the board number W2 and the board number W2 is not adopted. In the simultaneous processing board data D0 (1), the position information Db1 in the sequential processing board data J1 (1) is adopted as the position information Db1 with respect to the board number W1. The final information Dd1 is unnecessary in the simultaneous processing board data D0 (k).

In this way, processing is performed by the simultaneous processing device 40 based on the simultaneous processing board data D0 (k) corresponding to each group, and even if the board W is eliminated, the groups are sequentially upstream and downstream of the processing device 30. The division is maintained, and the transfer and processing of the substrate W are managed for each group.

For example, when there is no sequential processing board data J2 (1), the board W2 (1) is not detected by the sensor 335, and the board W1 (1) is detected by the sensor 334, an alarm is set, for example, a display unit. Issued by 67. Such an alarm indicates that the substrate W is removed and the number of substrates constituting the group is not normal, which contributes to alerting the operator of the substrate processing apparatus 1.

<6-2-4. When the lack of the board does not appear in the simultaneous processing board data>
When the substrate W is transported to the substrate introduction unit 31, the case where the upstream substrate W1 (k) does not exist is processed in the same manner as the second example in <6--2-2>. .. The simultaneous processing board data D0 (1) in the above description has a structure in which k = 1 in FIG.

When the substrate W is transported to the substrate introduction unit 31, the case where the downstream substrate W2 (k) does not exist is processed in the same manner as the second example in <6-2-3>. .. The simultaneous processing board data D0 (1) in the above description has a structure in which k = 1 in FIG.

In these second examples, the case where the lack of the substrate appears in the simultaneous processing substrate data D0 (1) was described. An example of such a case is, for example, when the lack of a substrate is found in the cassette 10, and the lack of the substrate is detected by the transfer robot 81.

However, it is assumed that the lack of the substrate does not appear in the simultaneous processing substrate data D0 (k). For example, although the simultaneous processing board data D0 (k) has the configuration shown in FIG. 5, the board W2 (k) is detected by the sensor 315 without the board W1 (k) being detected by the sensor 314. A case (hereinafter referred to as "third example") is assumed. Alternatively, for example, when the simultaneous processing board data D0 (k) has the configuration shown in FIG. 5, but the board W1 (k) is detected by the sensor 314 but the board W2 (k) is not detected by the sensor 315. (Hereinafter referred to as "fourth example") is also assumed.

18 and 19 are side views schematically showing an example of substrate transfer of the sequential processing apparatus 30. FIG. 18 shows a third example and FIG. 19 shows a fourth example. Also in FIGS. 18 and 19, the drawing of the configuration for supplying the liquid or gas and the configuration for recovering the liquid is omitted from the configuration of the sequential processing apparatus 30 shown in FIG.

Regarding the third example, when the substrate W of the third group is conveyed to the substrate introduction unit 31, the substrate W1 (3) is not detected by the sensor 314, but the substrate W2 (3) is detected by the sensor 315. Is illustrated in FIG.

In the third example, the simultaneous processing board data D0 (3) at this time has a configuration in which k = 3 in FIG. 5, and the lack of the board W1 (3) does not appear. The control unit 60 generates the sequential processing board data J2 (3) from the operation results of the sensors 314 and 315 without generating the sequential processing board data J1 (3). The sequential processing board data J2 (3) has a structure in which k = 3 in FIG.

Alternatively, at this time, the control unit 60 once sequentially generates the processing board data J1 (3) and J2 (3), and the alarm is issued by, for example, the display unit 67. The operator who recognizes the alarm causes the control unit 60 to delete the sequential processing board data J1 (3) by using the input unit 66, and maintains the sequential processing board data J2 (3).

Regarding the fourth example, when the substrate W of the third group is conveyed to the substrate introduction unit 31, the substrate W1 (3) is detected by the sensor 314 without being detected by the sensor 315. Is illustrated in FIG.

In the fourth example, the simultaneous processing board data D0 (3) at this time has a configuration in which k = 3 in FIG. 5, and the lack of the board W2 (3) does not appear. The control unit 60 generates the sequential processing board data J1 (3) from the operation results of the sensors 314 and 315 without generating the sequential processing board data J2 (3). The sequential processing board data J1 (3) has a structure in which k = 3 in FIG.

Alternatively, at this time, the control unit 60 once sequentially generates the processing board data J1 (3) and J2 (3), and the alarm is issued by, for example, the display unit 67. The operator who recognizes the alarm causes the control unit 60 to delete the sequential processing board data J2 (3) by using the input unit 66, and maintains the sequential processing board data J1 (3).

<7. Explanation of the overall process>
FIG. 20 is a flowchart illustrating the flow of operations in the simultaneous processing device 40 and the sequential processing device 30 in the present embodiment. In the flowchart, the main focus is on the processing in the sequential processing device 30.

In step S1, the sequential processing device 30 (for example, the cleaning device 12) transfers the substrate W conveyed from the simultaneous processing device 40 (for example, the indexer section 11) on the upstream side thereof to the inlet portion (for example, the substrate introduction section) of the sequential processing device 30. Receive at 31).

The control unit 60 receives the simultaneous processing board data D0 (k) used in the simultaneous processing device 40 in step S2. The simultaneous processing board data D0 (k) may be transmitted from the simultaneous processing device 40 or a device on the upstream side. For example, the simultaneous processing board data D0 (k) is transmitted from the indexer unit 11 or a device upstream of the indexer unit 11. For example, when the substrate W is taken out from the cassette 10, the simultaneous processing substrate data D0 (k) may be obtained.

The simultaneous processing board data D0 (k) does not necessarily have to be transmitted from the device on the upstream side, and the operator may input the simultaneous processing board data D0 (k) using the input unit 66. The order in which steps S1 and S2 are executed may be changed. For example, the simultaneous processing board data D0 (k) may be obtained when the control in which the substrate W is processed without being divided into groups is changed to the control in which the substrate W is processed in groups.

In step S3, the control unit 60 generates one or both of the sequential processing board data J1 (k) and the sequential processing board data J2 (k) based on the simultaneous processing board data D0 (k). In the figures after FIG. 20, “and / or” means one or both of the components before and after the component.

For example, in the case described in <6-1>, both the sequential processing board data J1 (k) and J2 (k) are generated.

For example, in the case described in the first example of <6-2-1> and <6--2-2>, although the sequential processing board data J1 (k) is deleted in the subsequent step S4, the sequential processing is performed. Both the board data J1 (k) and J2 (k) are once generated.

For example, in the case described in the first example of <6-2-3>, although the sequential processing board data J2 (k) is deleted in the later step S4, the sequential processing board data J1 (k), J2 Both of (k) are once generated.

For example, in the case described in the second example of <6--2-2> and the third example of <6-2-4>, only the sequential processing board data J2 (k) is generated. For example, in the case described in the second example of <6-2-3> and the fourth example of <6-2-4>, only the sequential processing board data J1 (k) is generated.

In step S4, the sequential processing apparatus 30 performs sequential processing using either the sequential processing board data J1 (k) or the sequential processing board data J2 (k). For example, in the case described in <6-1>, the sequential processing is performed using both the sequential processing board data J1 (k) and J2 (k).

For example, in the case described in the first example of <6-2-1> and <6--2-2>, both the sequential processing board data J1 (k) and J2 (k) are used for sequential processing. After that, the sequential processing is performed using only the sequential processing board data J2 (k). Specifically, after step S3 is executed, the substrate W1 (1) is eliminated and does not exist, and the substrate W2 (1) exists. Then, "END" is adopted as the final information Dd1 about the substrate number W2, and only the sequentially processed substrate data J2 (1) remains (see FIG. 15).

For example, in the case described in the first example of <6-2-3>, the sequential processing is performed using both the sequential processing board data J1 (k) and J2 (k), and then the sequential processing is performed. Only the board data J1 (k) is used and the sequential processing is performed. Specifically, after step S3 is executed, the substrate W2 (1) is eliminated and does not exist, and the substrate W1 (1) exists. Then, while "END" is adopted as the final information Dd1 about the substrate number W1, only the sequentially processed substrate data J1 (1) remains (see FIG. 11).

For example, in the case described in the second example of <6--2-2> and the third example of <6-2-4>, only the sequential processing board data J2 (k) is used and the sequential processing is performed. Will be.

For example, in the case described in the second example of <6-2-3> and the fourth example of <6-2-4>, only the sequential processing board data J1 (k) is used and the sequential processing is performed. Will be.

In step S5, the control unit 60 generates simultaneous processing board data D0 (k) based on one or both of the sequential processing board data J1 (k) and J2 (k). For example, in the case described in <6-1>, the simultaneous processing board data D0 (k) is generated based on both the sequential processing board data J1 (k) and J2 (k).

For example, in the cases described in the first example and the second example of <6-2-1>, <6--2-2>, and the third example of <6--2-4>, the processing substrate is sequentially processed. Simultaneous processing board data D0 (k) is generated based only on the data J2 (k).

For example, in the case described in the first example and the second example of <6-2-3> and the fourth example of <6-2-4>, it is based only on the sequential processing board data J1 (k). Simultaneous processing board data D0 (k) is generated.

The substrate W is dispensed to the simultaneous processing apparatus 40 at the outlet portion (for example, the substrate lead-out portion 33) of the sequential processing apparatus 30.

In step S6, simultaneous processing using the simultaneous processing board data D0 (k) is performed in the simultaneous processing device 40 (for example, the dehydration baking device 13).

FIG. 21 is a flowchart illustrating the details of step S3. Step S3 has steps S301 to S305.

In step S301, it is determined whether or not all of the board numbers W1 and W2 are present in the simultaneous processing board data D0 (k). If the result of the determination is positive, the process proceeds to step S302, and if the result is negative, the process proceeds to step S305.

For example, the first example of <6-1>, <6-2-1>, <6--2-2>, the first example of <6-2-3>, the first example of <6-2-4>. In the case described in the third example and the fourth example, the result of the determination in step S301 becomes affirmative, and the process proceeds to step S302. For example, in the case of the second example of <6--2-2> and the second example of <6-2-3>, the result of the determination in step S301 is negative, and the process is stepped. Proceed to S305.

In step S302, it is determined whether or not all of the substrates W1 (k) and W2 (k) are detected at the inlet portion. If the result of the determination is positive, the process proceeds to step S303, and if the result is negative, the process proceeds to step S304.

For example, in the case described in the first example of <6-1>, <6-2-1>, <6--2-2>, and the first example of <6-2-3>, step S302. The result of the determination in is positive, and the process proceeds to step S303. For example, in the case described in the third example and the fourth example of <6-2-4>, the result of the determination in step S302 becomes negative, and the process proceeds to step S304.

In step S303, the simultaneous processing board data D0 (k) is separated. Here, "separation" means that the group identification information Da1, the position information Db1, and the recipe information Dc1 are obtained (separately) for each of the substrate numbers W1 and W2. For example, by the processing in step S303, the data having the same structure as the simultaneous processing board data D0 (k) having the structure shown in FIG. 8 and the simultaneous processing board data D0 (k) having the structure shown in FIG. 9 The data having the same structure is obtained from the simultaneous processing board data D0 (k) having the structure shown in FIG.

In step S304, the board number and the position information Db1 corresponding to the board not detected at the inlet portion are deleted. For example, in the case described in the third example of <6-2-4>, the structure of the simultaneous processing board data D0 (k) by the processing in step S304 is changed from the structure shown in FIG. 5 to FIG. The structure is changed to the one shown in. For example, in the case described in the fourth example of <6-2-4>, the structure of the simultaneous processing board data D0 (k) by the processing in step S304 is changed from the structure shown in FIG. 5 to FIG. The structure is changed to the one shown in.

Whether after step S303 has been executed or after step S304 has been executed, step S305 is executed as if a negative result was obtained in the determination in step S301.

In step S305, one or both of the sequential processing board data J1 (k) and J2 (k) are generated. Among the existing substrate numbers, "END" is adopted as the final information Dd1 about the most upstream (which is also the last) substrate number.

For example, in the case described in the first example of <6-1>, <6-2-1>, <6--2-2>, and the first example of <6-2-3>, step S303. Is executed, both the substrate W1 (k) and the substrate W2 (k) are present, and "END" is adopted as the final information Dd1 about the substrate number W1, and the sequentially processed substrate data J1 (k), Both J2 (k) are generated (see FIGS. 11 and 12).

However, as described above, in the case described in the first example of <6-2-2> and the first example of <6-2-3>, the value of the final information Dd1 is irrelevant. , The addition of the final information Dd1 may be omitted.

For example, in the case described in the third example of <6-2-4>, the substrate number W1 does not exist and the substrate number W2 exists in the simultaneous processing board data D0 (3) by executing step S304. In step S305, "END" is adopted as the final information Dd1 for the substrate number W2, and only the sequential processing substrate data J2 (3) is generated (see FIG. 15).

For example, in the case described in the fourth example of <6-2-4>, the substrate number W2 does not exist but the substrate number W1 exists in the simultaneous processing board data D0 (3) by executing step S304. In step S305, only the sequential processing board data J1 (3) is generated while "END" is adopted as the final information Dd1 for the board number W1 (see FIG. 11).

For example, in the case described in the second example of <6--2-2>, the substrate number W1 does not exist in the simultaneous processing substrate data D0 (1), but the substrate number W2 exists. In step S305, "END" is adopted as the final information Dd1 for the substrate number W2, and only the sequential processing substrate data J2 (3) is generated (see FIG. 15).

For example, in the case described in the second example of <6-2-3>, the substrate number W2 does not exist in the simultaneous processing substrate data D0 (1), but the substrate number W1 exists. In step S305, "END" is adopted as the final information Dd1 about the substrate number W1, and only the sequential processing board data J1 (3) is generated (see FIG. 11).

FIG. 22 is a flowchart illustrating the details of step S5. Step S5 includes steps S501 to S509. FIG. 23 is a flowchart illustrating the details of step S509.

In step S4, the sequential processing apparatus 30 performs sequential processing using either the sequential processing board data J1 (k) or the sequential processing board data J2 (k), and then step S501 is executed.

In step S501, it is determined whether or not the substrate W2 (k) has arrived at the outlet portion of the sequential processing apparatus 30. If the result of the determination is positive, the process proceeds to step S502. If the result of the determination is negative, the process proceeds to step S509.

For example, when described in the first example and the second example of <6-1>, <6-2-1>, <6--2-2>, and the third example of <6--2-4>. The result of the determination in step S501 becomes affirmative, and the process proceeds to step S502. For example, when described in the first and second examples of <6-2-3> and the fourth example of <6-2-4>, the result of the determination in step S501 is negative. Then, the process proceeds to step S509.

In step S502, it is determined whether or not "END" is present in the final information Dd1 of the sequential processing board data J2 (k) (whether or not "END" is adopted). If the result of the determination is positive, the process proceeds to step S507. If the result of the determination is negative, the process proceeds to step S503.

For example, the first example of <6-2-1>, <6--2-2>, and the second example of <6--2-2> (the structure in which the sequential processing board data J2 (k) is shown in FIG. 15). When described in), "END" is adopted as the final information Dd1 of the sequential processing board data J2 (k) by executing step S305, and the result of the determination in step S502 becomes positive. The process proceeds to step S507. For example, the second example of <6-1> and <6--2-2> (when the sequential processing board data J2 (k) has the structure shown in FIG. 12), the third of <6-2-4>. In the case described in the above example, the result of the determination in step S502 becomes negative, and the process proceeds to step S503.

In step S503, it is determined whether or not the substrate W1 (k) (which belongs to the same k-th group as the substrate W2 (k)) exists on the upstream side of the substrate W2 (k). If the result of the determination is positive, the process proceeds to step S504. If the result of the determination is negative, the process proceeds to step S507.

For example, in the case described in <6-1>, the result of the determination in step S503 becomes affirmative, and the process proceeds to step S504. For example, it will be described in the second example of <6--2-2> (when the sequential processing board data J2 (k) has the structure shown in FIG. 12) and the third example of <6-2-4>. If so, the result of the determination in step S503 becomes negative, and the process proceeds to step S507.

From the above processing flow, in the case described in the second example of <6-2-2>, it is shown in FIG. 15 whether the sequential processing board data J2 (k) has the structure shown in FIG. Step S507 is performed regardless of the structure.

In step S504, it is determined whether or not the substrate W1 (k) has arrived at the outlet portion of the sequential processing apparatus 30. If the result of the determination is negative, step S504 is repeatedly executed, and another process is awaited. If the result of the determination in step S504 is affirmative, the process proceeds to step S505.

Since the execution of step S504 is premised on the positive judgment in step S503, the process does not stop in step S504.

In step S505, the simultaneous processing board data D0 (k) is generated by combining the sequential processing board data J1 (k) and J2 (k). Here, "coupling" adopts the data possessed by the sequential processing board data J1 (k) as the data corresponding to the board number W1, and the sequential processing board data J2 (k) is used as the data corresponding to the board number W2. It means that the simultaneous processing board data D0 (k) is generated by adopting the possessed data.

As described above, the group identification information Da1 and the recipe information Dc1 are common in the same group. In the simultaneous processing board data D0 (k), it is used as data common to the board numbers W1 and W2.

After step S505 is executed, step S506 is executed. In step S506, the substrates W1 (k) and W2 (k) are dispensed to the simultaneous processing device 40.

In step S507, the final information Dd1 is deleted from the sequential processing board data J2 (k). Simultaneous processing board data D0 (k) is generated using the sequential processing board data J2 (k) from which the final information Dd1 is deleted.

For example, the first example of <6-2-1>, <6--2-2>, and the second example of <6--2-2> (sequential processing board data) for which a positive judgment was made in step S502. When J2 (k) has the structure shown in FIG. 15), "END" is adopted as the final information Dd1 of the sequential processing board data J2 (k) by executing step S305. The final information Dd1 suggests that the substrate W1 (k) does not exist, and the sequential processing board data J1 (k) is not used to generate the simultaneous processing board data D0 (k).

For example, the second example of <6--2-2> (when the sequential processing board data J2 (k) has the structure shown in FIG. 12), <6--2-, which was negatively determined in step S503). In the case described in the third example of 4>, the sequential processing board data J1 (k) was not generated. Even in these cases, the sequential processing board data J1 (k) is not used to generate the simultaneous processing board data D0 (k).

After step S507 is executed, step S508 is executed. In step S508, only the substrate W2 (k) is dispensed to the simultaneous processing device 40.

After the steps S506 and S508 are executed, the process proceeds to step S6 (see FIG. 20).

Step S509 includes steps S511 to S513 (see FIG. 23). When the determination in step S501 is negative, step S511 is executed. In step D511, it is determined whether or not the substrate W1 (k) has arrived at the outlet portion (board lead-out portion 33) of the sequential processing apparatus 30. When the result of the determination is positive, the process proceeds to step S512.

When the result of the determination is negative, the process in step S5 ends (see FIG. 22), and the process proceeds to step S6 (see FIG. 20). However, when the determination in step S511 is negative, the substrate W2 (k) has not already arrived due to the determination in step S501, so that the substrates W1 (k) and W2 (k), W2 ( All of k) do not exist. Therefore, when the judgment in step S511 is negative, step S6 regarding the k-th group is not substantially executed.

In step S512, the control unit 60 deletes the final information Dd1 from the sequential processing board data J1 (k) without using the sequential processing board data J2 (k), and generates the simultaneous processing board data D0 (k). For example, in the first example of <6-2-3>, the sequential processing board data J2 (k) is deleted in step S4. For example, in the second example of <6-2-3> and the fourth example of <6-2-4>, the sequential processing board data J2 (k) is not generated.

After the simultaneous processing board data D0 (k) is generated by step S512, step S513 is executed. In step S513, only the substrate W1 (k) is dispensed to the simultaneous processing device 40.

Since step S513 is executed, step S509 ends, and the process proceeds to step S6 (see FIG. 20).

<8. General explanation>
Based on the description of each of the above sections, a general description will be given below.

(i) The substrate processing apparatus 1 includes a sequential processing apparatus 30 that processes the substrate W, a simultaneous processing apparatus 40 that simultaneously processes the substrate W, and a control unit 60. For example, the substrate processing device 1 includes a cleaning device 12 as a sequential processing device 30. For example, the substrate processing device 1 includes an indexer unit 11 and a dehydration baking device 13 as a simultaneous processing device 40.

The substrate W is divided into a plurality of groups. The substrate W1 (k), ... WN (k) belong to the kth group. The symbol N indicates a positive integer. For example, although it was explained as N = 2, N ≧ 3 may be used.

The sequential processing apparatus 30 processes the substrate W while sequentially transporting the substrate W based on the sequential processing board data J1 (k), ... JN (k). The sequential processing board data J1 (k) and ... JN (k) are set for the boards W1 (k) and ... WN (k), respectively.

The simultaneous processing apparatus 40 simultaneously processes the substrates W1 (k), ... WN (k) for each group based on the simultaneous processing board data D0 (k). The simultaneous processing board data D0 (k) is set corresponding to the kth group.

The control unit 60 in the sequential processing apparatus 30 is based on the sequential processing board data J1 (k), ... JN (k) set for each of the substrates W1 (k), ... WN (k) belonging to the kth group. Controls transport and processing for the substrates W1 (k), ... WN (k).

The control unit 60 controls the processing of the substrates W1 (k), ... WN (k) in the simultaneous processing apparatus 40 on the substrate based on the simultaneous processing board data D0 (k).

The simultaneous processing board data D0 (k) includes the group identification information Da1, the board numbers W1 and W2, the position information Db1, and the recipe information Dc1. The group identification information Da1 identifies the group. Specifically, the group identification information Da1 indicates that the substrates W1 (k), ... WN (k) belong to the kth group. The substrate numbers W1, ... WN distinguish the substrates W belonging to the same group from each other. The position information Db1 indicates the transport position of the substrate W in the same group. The recipe information Dc1 defines the processing content commonly performed on the substrate W belonging to the same group.

The sequential processing board data J1 (k), ... JN (k) includes position information Db1 for the corresponding boards W1 (k), ... WN (k), group identification information Da1, and recipe information Dc1. ..

The control unit 60 sequentially generates the processing board data J1 (k), ... JN (k) from the simultaneous processing board data D0 (k) (see step S3 in FIG. 20). The control unit 60 generates simultaneous processing board data D0 (k) from the sequential processing board data J1 (k), ... JN (k) (see step S5 in FIG. 20).

The group identification information Da1 included in the simultaneous processing board data D0 (k) is adopted for any of the group identification information Da1 of the sequential processing board data J1 (k) and ... JN (k). As a result, the grouping of the substrate W is maintained also in the sequential processing apparatus 30, and the transport and processing of the substrate W are managed for each group.

(ii) For example, the control unit 60 uses the board number W1 in the simultaneous processing board data D0 (k), the position information Db1 corresponding to the board number W1, the recipe information Dc1, and the final information Dd1 to use the board number W1. The sequential processing board data J1 (k) for the board W1 (k) corresponding to the above is generated (see FIG. 11). About the substrate Wm (k) corresponding to the substrate number Wm by using the substrate number Wm in the simultaneous processing substrate data D0 (k), the position information Db1 corresponding to the substrate number Wm, the recipe information Dc1 and the final information Dd1. Sequentially processed board data Jm (k) is generated (m is an integer of 2 or more and N or less, see FIG. 12).

The final information Dd1 indicates whether or not the substrate W1 (k) is the last (most upstream) in the transport direction in the kth group to which the substrate W1 (k) corresponding to the substrate number W1 belongs. For example, in the case described in <6-2-1>, the sequential processing board data J1 (k) having the configuration shown in FIG. 11 is once generated (see step S305 in FIG. 21). After that, the sequential processing board data J1 (k) is deleted, and among the sequential processing board data Jm (k), the final information Dd1 of the sequential processing board data J2 (k) which is the last (most upstream) in the transport direction is obtained. It is shown that the substrate W2 (k) is the last (most upstream) in the transport direction (see FIG. 15).

As a result, even in the sequential processing apparatus 30, the grouping of the substrate W is maintained without relying on the group identification information Da1, and the transport and processing of the substrate W are managed for each group.

(iii) For example, the control unit 60 uses the board number Wn in the simultaneous processing board data D0 (k), the position information Db1 corresponding to the board number Wn, the recipe information Dc1, and the group identification information Da1. The sequential processing board data Jn (k) for the board Wn (k) corresponding to Wn is generated. As a result, even in the sequential processing apparatus 30, the grouping of the substrate W is maintained without relying on the final information Dd1, and the transport and processing of the substrate W are managed for each group. In this case, the grouping of the substrate W may be maintained by using the final information Dd1.

(iv) For example, the sequential processing apparatus 30 includes a substrate lead-out unit 33 which is an outlet portion for discharging the substrate W to the simultaneous processing apparatus 40. Considering the cleaning device 12 as the sequential processing device 30, the dehydration baking device 13 can be considered as the simultaneous processing device 40.

The board lead-out unit 33 has sensors 334 and 335 for detecting the presence / absence of the board W in the board lead-out unit 33. The substrate Wm (k) is detected without the substrate W1 (k) being detected by the sensor at the outlet (see the flow from step S503 to step S507 in FIG. 22), and the lack of the substrate W1 (k) is confirmed. When this is done (see the flow from step S503 to step S507 in FIG. 22), the control unit 60 is about the substrate Wm (k) without using the sequential processing substrate data J1 (k) for the substrate W1 (k). Simultaneous processing board data D0 (k) is generated using the sequential processing board data Jm (k) (see step S507 in FIG. 22).

For example, the substrates W1 (k), ... Ws (k) are arranged upstream of the substrates Wm (k), ... WN (k), and the substrates W1 (k), ... Wm (k). ) Suppose that they all belong to the kth group.

For example, when the substrate Wm (k), ... WN (k) is detected without detecting the substrate W1 (k), ... Ws (k), the control unit 60 sequentially processes the substrate data J1 (in step S507). Simultaneous processing board data D0 (k) is generated using sequential processing board data Jm (k), ... WN (k) without using k), ... Js (k).

As a result, the simultaneous processing board data D0 (k) corresponding to the board W actually discharged is subjected to simultaneous processing (see step S508 in FIG. 22).

For example, the substrates W1 (k), ... Ws (k) can be regarded as the first substrate, and the substrates Wm (k), ... WN (k) can be regarded as the second substrate. In this case, when the second board is detected without the first board being detected by the sensor at the outlet and the lack of the first board is confirmed, the control unit 60 describes the first board. Simultaneous processing board data D0 (k) using sequential processing board data Jm (k), ... JN (k) for the second substrate without using sequential processing board data J1 (k), ... Js (k). To generate.

(v) For example, the sequential processing device 30 includes a board lead-out unit 33 which is an outlet unit for discharging the board W to the simultaneous processing device 40. The board lead-out unit 33 has sensors 334 and 335 for detecting the presence / absence of the board W in the board lead-out unit 33. When the substrate W1 (k) is detected by the sensor at the outlet portion without detecting the substrate Wm (k) (see the process flow from step S501 to step S512 in FIG. 23), the control unit 60 Simultaneous processing board data D0 (k) is generated using the sequential processing board data J1 (k) for the board W1 (k) without using the sequential processing board data Jm (k) for the board Wm (k). See step S512 in FIG. 23).

The substrates W1 (k) and Wm (k) both belong to the kth group. These position information Db1 indicate that the substrate W1 (k) is on the upstream side (rear side in the transport direction) of the substrate Wm (k). For example, with reference to FIG. 11, it is shown that the substrate W1 (k) is upstream of the other substrates. For example, with reference to FIG. 12, it is shown that the substrate W2 (k) is upstream of the other substrates.

For example, when the substrate W1 (k), ... Ws (k) is detected without detecting the substrate Wm (k), ... WN (k), the control unit 60 sequentially processes the substrate data Jm (k) in step S512. ), ... The simultaneous processing board data D0 (k) is generated using the sequential processing board data J1 (k), ... Ws (k) without using JN (k).

As a result, the simultaneous processing board data D0 (k) corresponding to the board W actually discharged is subjected to simultaneous processing (see step S513 in FIG. 22).

For example, the substrates W1 (k), ... Ws (k) can be regarded as the first substrate, and the substrates Wm (k), ... WN (k) can be regarded as the second substrate. In this case, when the first substrate is detected by the sensor at the outlet portion without detecting the second substrate, the control unit 60 sequentially processes the second substrate data Jm (k), ... Simultaneous processing board data D0 (k) is generated using sequential processing board data J1 (k), ... Js (k) for the first board without using JN (k).

(vi) For example, a plurality of sensors are provided at the outlet portion, and the number thereof matches the number of substrates W belonging to the group. For example, when N = 2, the substrate lead-out unit 33 has sensors 334 and 335 for detecting the presence / absence of the substrate W in the substrate lead-out unit 33. Providing such a number of sensors contributes to accurate detection of the presence or absence of the substrate W in the group.

(vii) For example, the sequential processing device 30 includes a substrate introduction unit 31 which is an inlet portion for receiving the substrate W from the simultaneous processing device 40. Considering the cleaning device 12 as the sequential processing device 30, the indexer unit 11 can be considered as the simultaneous processing device 40. The substrate introduction unit 31 has sensors 314 and 315 that detect the presence or absence of the substrate W in the substrate introduction unit 31.

When the substrate W2 (k) is detected without being detected by the sensor at the inlet (for example, as described in the third example of <6-2-4>), the control unit 60 does not generate the sequential processing board data J1 (k), but generates the sequential processing board data J2 (k) (see step S304 in FIG. 21).

When the substrate W1 (k) is detected without being detected by the sensor at the inlet (for example, as described in the fourth example of <6-2-4>), the control unit 60 does not generate the sequential processing board data J2 (k), but generates the sequential processing board data J1 (k) (see step S304 in FIG. 21).

For example, the substrates W1 (k), ... Ws (k) can be regarded as the third substrate, and the substrates Wm (k), ... WN (k) can be regarded as the fourth substrate. In this case, when the third substrate is detected by the sensor at the inlet portion without detecting the fourth substrate, the control unit 60 in step S305 sequentially processes the substrate data Jm (k) for the fourth substrate. ), ... The sequential processing board data J1 (k), ... Js (k) for the third substrate is generated without generating JN (k).

When the fourth board is detected by the sensor at the inlet without detecting the third board, the control unit 60 sequentially processes the third board in step S305. Board data J1 (k), ... The sequential processing board data Jm (k), ... JN (k) for the fourth board is generated without generating Js (k).

Further, it can be said that the above-mentioned substrate processing apparatus realizes the following substrate processing method. The substrate processing method includes sequential processing and simultaneous processing. In the sequential processing, the substrate Wn while sequentially transporting the substrates W1 (k), ... WN (k) based on the sequential processing substrate data Jn (k) set for each substrate W divided into a plurality of groups. Processing is performed for (k). In the simultaneous processing, the substrates W1 (k) and ... WN (k) are simultaneously processed for each group based on the simultaneous processing board data D0 (k) set for each group.

The simultaneous processing board data D0 (k) includes the group identification information Da1, the board numbers W1 and W2, the position information Db1, and the recipe information Dc1. The group identification information Da1 identifies the group. Specifically, the group identification information Da1 indicates that the substrates W1 (k), ... WN (k) belong to the kth group. The substrate numbers W1, ... WN distinguish the substrates W belonging to the same group from each other. The position information Db1 indicates the transport position of the substrate W in the same group. The recipe information Dc1 defines the processing content commonly performed on the substrate W belonging to the same group.

The sequential processing board data J1 (k), ... JN (k) includes position information Db1 for the corresponding boards W1 (k), ... WN (k), group identification information Da1, and recipe information Dc1. ..

Sequential processing board data J1 (k), ... JN (k) is generated from the simultaneous processing board data D0 (k), and simultaneous processing board data D0 (k) is generated from the sequential processing board data J1 (k), ... JN (k). Is generated.

As described above, the substrate processing apparatus and the substrate processing method have been described in detail, but the above description is exemplary in all aspects, and the disclosure is not limited thereto. Further, the various modifications described above can be applied in combination as long as they do not contradict each other. And it is understood that a large number of modifications not exemplified can be assumed without departing from the scope of this disclosure.

31 Board introduction part (entrance part)
33 Board lead-out part (exit part)
314,315,334,335: Sensor Da1 group identification information Db1 position information Dc1 recipe information Dd1 final information k pair number J1 (k), J2 (k) sequential processing board data D0 (k) simultaneous processing board data W, W1, W2, W1 (k), W2 (k) substrate

Claims (7)

Sequential processing unit that performs processing on the substrate while sequentially transporting the substrate based on the sequential processing board data set for each substrate divided into a plurality of groups.
A simultaneous processing unit that simultaneously processes the board for each group based on the simultaneous processing board data set for each group.
It is provided with a control unit that controls the transfer to the substrate and the processing in the sequential processing unit based on the sequential processing board data, and controls the processing to the substrate in the simultaneous processing unit based on the simultaneous processing board data. ,
The simultaneous processing board data includes group identification information for identifying the group, a board number for distinguishing the boards belonging to the group from each other, and position information indicating a position of the board in the group in a transport direction. , Includes recipe information for defining the processing content commonly performed on the substrate belonging to the group.
The sequential processing board data includes the position information about the substrate corresponding to the sequential processing board data, the group identification information, and the recipe information.
The control unit is a substrate processing apparatus that generates the sequential processing board data from the simultaneous processing board data and generates the simultaneous processing board data from the sequential processing board data. The control unit uses the board number of one of the simultaneous processing board data, the position information corresponding to the board number of the one, the recipe information, and the final information, and the board number of the one. Generates the sequential processing board data for the board corresponding to
The final information indicates whether or not the substrate corresponding to the one substrate number is the last in the transport direction in the group to which the substrate corresponding to the one substrate number belongs. Item 1. The substrate processing apparatus according to item 1. The control unit uses the board number of the simultaneous processing board data, the position information corresponding to the board number of the one, the group identification information, and the recipe information of the one. The substrate processing apparatus according to claim 1, wherein the sequential processing substrate data for the substrate corresponding to the substrate number is generated. The sequential processing unit includes an outlet unit for discharging the substrate to the simultaneous processing unit.
The outlet portion has a sensor for detecting the presence / absence of the substrate at the outlet portion.
When the second substrate is detected without the sensor detecting the first substrate and the lack of the first substrate is confirmed, the control unit determines the first substrate. Instead of using the sequential processing board data, the simultaneous processing board data is generated using the sequential processing board data for the second substrate.
The first substrate and the second substrate belong to the same group.
The position information of the first substrate or the position information of the second substrate indicates that the first substrate is upstream of the second substrate, claim 2 or. The substrate processing apparatus according to claim 3. The sequential processing unit includes an outlet unit for discharging the substrate to the simultaneous processing unit.
The outlet portion has a sensor for detecting the presence / absence of the substrate at the outlet portion.
When the first substrate is detected by the sensor without detecting the second substrate, the control unit does not use the sequential processing substrate data for the second substrate, and the control unit does not use the sequential processing substrate data for the second substrate. Using the sequential processing board data for the first board, the simultaneous processing board data is generated.
The first substrate and the second substrate belong to the same group.
3. The third aspect of the present invention, wherein the position information of the first substrate or the position information of the second substrate indicates that the first substrate is on the upstream side of the second substrate. Board processing equipment. The sequential processing unit includes an inlet unit that receives the substrate from the simultaneous processing unit.
The entrance portion has a sensor for detecting the presence / absence of the substrate at the entrance portion.
When the fourth board is detected without the sensor at the inlet detecting the third board, the control unit generates the sequential processing board data for the third board. Instead, generate the sequential processing board data for the fourth board.
The substrate processing apparatus according to any one of claims 1 to 5, wherein the third substrate and the fourth substrate belong to the same group. Sequential processing that is set for each board divided into a plurality of groups Sequential processing that performs processing on the board while sequentially transporting the board based on the board data.
A substrate processing method including simultaneous processing of simultaneously processing the substrate for each group based on the simultaneous processing board data set for each group.
The transfer to the substrate and the processing in the sequential processing are controlled based on the sequential processing board data.
The processing to the substrate in the simultaneous processing is controlled based on the simultaneous processing board data.
The simultaneous processing board data includes group identification information for identifying the group, a board number for distinguishing the boards belonging to the group from each other, and position information indicating a position of the board in the group in a transport direction. , Includes recipe information for defining the processing content commonly performed on the substrate belonging to the group.
The sequential processing board data includes the position information about the substrate corresponding to the sequential processing board data, the group identification information, and the recipe information.
A substrate processing method in which the sequential processing board data is generated from the simultaneous processing board data, and the simultaneous processing board data is generated from the sequential processing board data.

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