JP2021150496A - Substrate processing system and substrate processing method - Google Patents

Abstract

To provide a substrate processing system capable of suppressing step variations caused by variation in the number of substrates processed by a simultaneous treatment part.SOLUTION: A first horizontally transporting treatment part PF1 performs a treatment one by one to a plurality of product substrates WP. A simultaneous treatment part PC1 performs a treatment N by N (N≥2) to a plurality of substrates W containing the product substrates WP. A first substrate transportation part TR1 can collectively transport the N substrates of the plurality of substrates W at maximum to the simultaneous treatment part PC1 while horizontally holding them arranged in parallel. The first substrate transportation part TR1 is configured to be operable in a simple mode in which the N product substrates WP from the first horizontally transporting treatment part PF1 are collectively transported to the simultaneous treatment part PC1 and a mixed loading mode in which P (1≤P<N) product substrates WP from the first horizontally transporting treatment part PF1 and D (1≤D≤N-P) dummy substrates WD from a substrate standby part SD are collectively transported to the simultaneous treatment part PC1.SELECTED DRAWING: Figure 2

Description

The present invention relates to a substrate processing system and a substrate processing method, and more particularly to a substrate processing system having a flat flow processing unit and a simultaneous processing unit, and a substrate processing method using a flat flow processing unit and a simultaneous processing unit.

The substrate processing system has a plurality of processing units (processing units), and a series of processing is performed on the substrate by these. As a substrate processing system, for example, a coater developer system is known. The coater developer system needs to perform a series of processes such as a cleaning process, a dehydration process, a coating process, a pre-baking process, a developing process, an exposure process, a developing process, and a post-baking process. In this case, the substrate processing system has a plurality of processing units and a transport unit for transporting the substrate between these processing units.

A substrate processing system for mass production needs to efficiently process a large number of substrates. For that purpose, it is desirable that each of the processing units included in the substrate processing system is a flat flow processing unit or a simultaneous processing unit. The flat flow processing unit processes the substrates one by one while sequentially conveying the substrates along the conveying direction. The simultaneous processing unit simultaneously processes N (integer of 2 or more) sheets. Due to the requirements of each processing unit, the substrate processing system may include a flat flow processing unit and a simultaneous processing unit.

For example, Japanese Patent Application Laid-Open No. 2018-160586 (Patent Document 1) discloses a substrate processing system in which a flat flow processing unit and a simultaneous processing unit are mixed as described above. In this substrate processing system, the substrate transport unit holds N of the plurality of substrates processed by the flat flow processing unit side by side in one horizontal direction, and simultaneously processes the N substrates at once. Transport to.

JP-A-2018-160586

For convenience of explanation, in the present specification, a substrate intended to be finally processed into a product is referred to as a product substrate. A plurality of product substrates are typically managed by being grouped into a plurality of sets each having an number of N sheets in a mass production process using a substrate processing system. The substrate transfer unit usually transfers a set of product substrates processed by the flat flow processing unit, that is, N product substrates, to the simultaneous processing unit at once. However, the flat flow processing unit may not be able to prepare all of the N product substrates. For example, in the flat flow processing unit or the processing unit upstream from the flat flow processing unit, some of the substrates were removed from the process because there was an abnormality in the processing of a part of the N product substrates constituting this set. There are times when. In this case, the number of product substrates in this set is less than N. It is possible to maintain the number of sheets in the set to N by supplementing the product substrate from another set, but such measures are often unsuitable for process control. The technology of the above gazette does not take such circumstances into consideration.

If the process is to proceed while maintaining the initial grouping, the substrate transport unit can supply only P (1 ≦ P <N) product substrates to the simultaneous processing unit. Since it is originally assumed that N substrates are processed at the same time in the simultaneous processing unit, when only P substrates are processed, process variation occurs due to the difference in the number of substrates. obtain. For example, when the simultaneous processing unit is a hot plate that performs a temperature raising treatment or a cool plate that performs a temperature lowering treatment, the difference in heat capacity due to the difference in the number of substrates causes variation in temperature change. Further, for example, when the simultaneous processing unit is a vacuum drying unit, the change in the air flow due to the absence of the substrate that should be originally causes the variation in the pressure change.

The present invention has been made in view of the above problems, and is a substrate processing system and a substrate processing method capable of suppressing process variation due to fluctuations in the number of substrates processed simultaneously by the simultaneous processing unit. The purpose is to provide.

The first aspect disclosed in the present specification is a substrate processing system for processing a plurality of substrates including a plurality of product substrates, while sequentially transporting the plurality of product substrates along a transport direction. The first flat flow processing unit that processes the plurality of product substrates one by one, the simultaneous processing unit that simultaneously processes N sheets (N ≧ 2) of the plurality of substrates, and the simultaneous processing unit. While holding the substrate standby unit for waiting at least one dummy substrate to be processed as a part of the plurality of substrates in the processing unit and the maximum N substrates among the plurality of substrates horizontally arranged side by side. The first substrate transporting section includes a first substrate transporting section capable of collectively transporting to the simultaneous processing section, and the first substrate transporting section processes N product substrates from the first horizontal flow processing section at the same time. A simple mode in which the components are collectively carried into the unit, and D sheets (1 ≦ D ≦ N−P) from the product board and the board standby part of P sheets (1 ≦ P <N) from the first flat flow processing unit. ) Is configured to be operable in a mixed loading mode in which the dummy substrate is collectively carried into the simultaneous processing unit.

A second aspect disclosed in the present specification is the substrate processing system of the first aspect, in which a control unit that divides and manages the plurality of product substrates into a plurality of sets each having a maximum number of N sheets is provided. Further provided, the first substrate transport unit transports the plurality of sets from the first flat flow processing unit to the simultaneous processing unit one by one, and the control unit is such that the one set of the plurality of product substrates is N. When the number of sheets is large, the first substrate transfer unit is operated in the simple mode, and when the set of the plurality of product substrates has one or more and less than N sheets, the first substrate transfer is performed. The unit is operated in the mixed loading mode.

A third aspect disclosed herein is the substrate processing system of the first or second aspect, wherein D = NP is satisfied.

A fourth aspect disclosed in the present specification is a substrate processing system according to any one of the first to third aspects, wherein the first substrate transport unit is a substrate processed by the simultaneous processing unit. The dummy substrate among the substrates carried out and carried out from the simultaneous processing unit is conveyed to the substrate standby unit.

A fifth aspect disclosed in the present specification is a substrate processing system according to any one of the first to third aspects, which includes a second substrate transport unit that carries out the substrate processed by the simultaneous processing unit. Further, among the substrates processed by the simultaneous processing unit, a substrate delivery unit that receives the dummy substrate from the second substrate transport unit is further provided.

A sixth aspect disclosed in the present specification is the substrate processing system of the fifth aspect, in which the first substrate transporting portion transports the dummy substrate from the substrate delivery portion to the substrate standby portion.

A seventh aspect disclosed in the present specification is a substrate processing system according to any one of the first to sixth aspects, wherein the substrate standby portion has an aligning portion for aligning the dummy substrates. ..

An eighth aspect disclosed in the present specification is a substrate processing system according to any one of the first to seventh aspects, wherein the first flat flow processing unit pays out to the first substrate transport unit. The number of product boards can be controlled.

A ninth aspect disclosed in the present specification is the substrate processing system of any one of the first to eighth aspects, the second aspect for further processing the product substrate processed by the simultaneous processing unit. The flat flow processing unit is further provided, and the second flat flow processing unit is configured to accept the product substrate and expel the dummy substrate among the plurality of substrates carried into the second flat flow processing unit. Has been done.

A tenth aspect disclosed herein is a substrate processing system according to any one of the first to ninth aspects, wherein the at least one dummy substrate includes a first dummy substrate and a second dummy substrate. There are a plurality of dummy boards, and the board standby unit includes a first standby place for waiting for the first dummy board and a second standby place for waiting for the second dummy board, and the second standby place is the said. It is located above the first waiting area.

The eleventh aspect disclosed in the present specification is a substrate processing method for processing a plurality of product substrates, wherein the plurality of product substrates are sequentially transferred along a transport direction by (a) a flat flow processing unit. The process of processing the plurality of product substrates one by one while being conveyed to the product, and (b1) simultaneously processing the N product substrates processed in the step (a) by the simultaneous processing unit. And (b2) a step of simultaneously processing the P sheets (1 ≦ P <N) of the product substrate and the dummy substrate processed in the step (a) by the simultaneous processing unit. Each of the plurality of product substrates is processed through one of the steps (b1) and the step (b2).

According to the first aspect, there is a simple mode in which N product boards from the first flat flow processing unit are collectively carried into the simultaneous processing unit, and P sheets (1 ≦ P) from the first flat flow processing unit. It is possible to select one of the mixed loading mode in which the product board of <N) and the dummy board of D sheets (1 ≦ D ≦ N−P) from the board standby part are collectively carried into the simultaneous processing part. .. As a result, when the number of product substrates simultaneously processed by the simultaneous processing unit is less than N, the dummy substrates are also processed at the same time, so that the number of substrates simultaneously processed by the simultaneous processing unit is close to N. Can be done. Therefore, it is possible to suppress process variation due to fluctuations in the number of substrates that are simultaneously processed by the simultaneous processing unit.

According to the second aspect, when the control unit has a set of a plurality of product substrates to be conveyed from the first flat flow processing unit to the simultaneous processing unit by the control unit, the first substrate transfer unit has N sheets. When one substrate transfer unit is operated in the simple mode and a set of the plurality of product substrates has one or more and less than N sheets, the first substrate transfer unit is operated in the mixed mounting mode. As a result, when the number of product substrates simultaneously processed by the simultaneous processing unit is less than N, the dummy substrates are also processed at the same time, so that the number of substrates simultaneously processed by the simultaneous processing unit is close to N. Can be done. Therefore, it is possible to suppress process variation due to the number of substrates simultaneously processed by the simultaneous processing unit fluctuating from N.

According to the third aspect, the substrate processing system of the first or second aspect is satisfied with D = NP. As a result, when the number of product substrates simultaneously processed by the simultaneous processing unit is less than N, the dummy substrates are also processed at the same time, so that the number of substrates simultaneously processed by the simultaneous processing unit is N. Can be done. Therefore, it is possible to suppress process variation due to the number of substrates simultaneously processed by the simultaneous processing unit fluctuating from N.

According to the fourth aspect, the first substrate transport unit carries out the substrate processed by the simultaneous processing unit, and transports the dummy substrate among the substrates carried out from the simultaneous processing unit to the substrate standby unit. .. As a result, the first substrate transporting unit can fulfill the function of collecting the dummy substrate in addition to the function of transporting the product substrate.

According to the fifth aspect, the substrate processing system has a second substrate transfer unit that carries out the substrate processed by the simultaneous processing unit, and a dummy substrate among the substrates processed by the simultaneous processing unit as the second substrate transfer unit. It further includes a board delivery unit that receives from. As a result, the second substrate transporting unit can fulfill the function of transporting the dummy substrate to the substrate delivery portion in addition to the function of transporting the product substrate.

According to the sixth aspect, the first substrate transporting portion transports the dummy substrate from the substrate delivery portion to the substrate standby portion. As a result, the second substrate transfer unit, the substrate delivery unit, and the first substrate transfer unit can cooperate to collect the dummy substrate.

According to the seventh aspect, in the substrate processing system of any one of the first to sixth aspects, the substrate standby portion has an aligning portion for aligning dummy substrates. Thereby, the dummy substrates having a disordered posture at the time of being collected from the simultaneous processing unit can be aligned.

According to the eighth aspect, the first flat flow processing unit is configured to be able to control the number of product substrates to be delivered to the first substrate transport unit. Thereby, the number of product substrates transported from the first flat flow processing unit to the simultaneous processing unit can be adjusted.

According to the ninth aspect, the second flat flow processing unit is configured to accept the product substrate and expel the dummy substrate among the plurality of substrates carried into the second flat flow processing unit. As a result, it is possible to prevent the dummy substrate from being processed by the second flat flow processing unit.

According to the tenth aspect, in the substrate standby unit, the second standby place where the second dummy substrate waits is located above the first standby place where the first dummy substrate waits. As a result, it is possible to suppress the area required for the substrate standby portion in the flat layout while securing a larger number of dummy substrates.

According to the eleventh aspect, the step of simultaneously processing N product substrates by the simultaneous processing unit and the simultaneous processing unit for P (1 ≦ P <N) product substrate and dummy substrate. It is possible to select one of the steps of performing the processing at the same time. As a result, when the number of product substrates simultaneously processed by the simultaneous processing unit is less than N, the dummy substrates are also processed at the same time, so that the number of substrates simultaneously processed by the simultaneous processing unit is close to N. Can be done. Therefore, it is possible to suppress process variation due to the number of substrates simultaneously processed by the simultaneous processing unit fluctuating from N.

Objectives, features, aspects, and advantages of the present invention will become more apparent with the following detailed description and accompanying drawings.

It is a block diagram which shows the outline of the structure of the substrate processing system in Embodiment 1. FIG. It is a partial plan view (a) and a partial side view (b) which show the structure of the substrate processing system in Embodiment 1. FIG. It is a partially enlarged view of FIG. 2 (b). It is a flow figure which shows typically the substrate processing method in Embodiment 1. FIG. It is a partial side view which shows roughly one process in FIG. It is a partial side view which shows roughly one process in FIG. It is a partial side view which shows roughly one process in FIG. It is a partial side view which shows roughly one process in FIG. It is a partial side view which shows roughly one process in FIG. It is a partial side view which shows roughly one process in FIG. It is a partial side view which shows roughly one process in FIG. It is a block diagram which shows the outline of the structure of the substrate processing system in Embodiment 2. It is a flow figure which shows typically the substrate processing method in Embodiment 2. It is a block diagram which shows the outline of the structure of the substrate processing system in Embodiment 3. It is a partial plan view (a) and a partial side view (b) which show the structure of the substrate processing system in Embodiment 3. FIG. It is a flow figure which shows typically the substrate processing method in Embodiment 3. It is a top view which shows schematic structure of the substrate standby part in Embodiment 4. FIG. It is a top view which shows the operation of FIG. 17 schematically. It is a side view which shows schematic the structure of the substrate standby part in Embodiment 5. It is a top view which shows typically an example of the structure of a substrate processing system. It is a block diagram which shows an example of the structure of the control part schematicly. It is a side view which shows typically an example of the structure of the flat flow processing part. It is a top view which shows an example of the structure of the simultaneous processing part schematicly. It is a top view which shows typically an example of the structure of the simultaneous processing part. It is a side view which shows an example of the structure of the resist coating apparatus. It is a top view which shows the modification of the simultaneous processing apparatus of FIG. 24 schematically. It is a top view which shows typically the modification of the coating apparatus in FIG. 24. It is a side view of FIG. 27.

Hereinafter, embodiments will be described in detail with reference to the drawings. Also, for the purpose of easy understanding, the dimensions and number of each part are exaggerated or simplified as necessary.

<1. Overview>
First, as an overview, the contents related to the transfer of the substrate between the flat flow processing unit and the simultaneous processing unit in the substrate processing system will be mainly described. A detailed example of the flat flow processing unit and the simultaneous processing unit itself will be described later.

<1-1. Embodiment 1>
<1-1-1. Configuration>
FIG. 1 is a block diagram showing an outline of the configuration of the substrate processing system SY1 according to the first embodiment. The substrate processing system SY1 is for processing a plurality of substrates W. Here, the plurality of substrates W include not only the product substrate WP but also at least one dummy substrate WD described later. In other words, the product substrate WP and the dummy substrate WD are collectively referred to as the substrate W. The dummy substrate WD is a substrate that is not intended to be finally processed into a product, unlike the product substrate WP. The substrate processing system SY1 simultaneously processes the flat flow processing unit PF1 (first flat flow processing unit), the flat flow processing unit PF2 (second flat flow processing unit), and the transfer robot TR1 (first substrate transfer unit). It has a part PC1 and a board storage part SD (board standby part). The flat flow processing unit PF1 has a receiving portion PF1i, a processing portion PF1m, and a payout portion PF1o. Similarly, the flat flow processing unit PF2 also has a receiving portion PF2i, a processing portion PF2m, and a payout portion (not shown).

The flat flow processing unit PF1 sequentially conveys a plurality of product substrate WPs along the conveying direction (direction from left to right in FIG. 1), and processes the plurality of product substrate WPs one by one. .. The receiving portion PF1i receives the product substrate WP to be processed by the flat flow processing unit PF1. The processing portion PF1m substantially processes the product substrate WP. The payout portion PF1o brings the product substrate WP processed by the processing portion PF1m into a state in which it can be paid out to the transfer robot TR1. Specifically, the payout portion PF1o makes it possible to pay out a maximum of N product board WPs to the transfer robot TR1. The payout portion PF1o may be configured so that more than N product board WPs can be paid out, but in the present embodiment, only N product board WPs at the maximum can be paid out once. Will not be paid out. Therefore, in order not to increase the size unnecessarily, the payout portion PF1o may be configured so that the number of product substrate WPs exceeding N cannot be paid out. In this case, the payout portion PF1o has N payout positions in which the product substrate WP is arranged. In FIG. 1, N = 2, and the payout portion PF1o has positions P1 and P2.

It is preferable that the flat flow processing unit PF1 is configured to be able to control the number of product substrate WPs to be delivered to the transfer robot TR1. In FIG. 1, when the product substrates WP1 and WP2 are arranged at the positions P1 and P2, respectively, it is selected whether both of them are in a payable state or one of them is in a payable state. Thereby, the number of product board WPs to be paid out can be controlled. Alternatively, the number of product board WPs to be paid out can be controlled by selecting whether to place both the product boards WP1 and WP2 or only one of them.

The simultaneous processing unit PC1 simultaneously processes N sheets (N ≧ 2) of a plurality of substrates W. Although N is an arbitrary integer of 2 or more, the case of N = 2 is shown in the drawings, and the case of N = 2 will be mainly described below.

The substrate accommodating unit SD makes at least one dummy substrate WD, which will be processed as a part of a plurality of substrates W, on standby in the simultaneous processing unit PC1. FIG. 1 shows a case where one dummy substrate WD is made to stand by. The substrate storage portion SD is preferably arranged above the flat flow processing portion PF1 and more preferably above the payout portion PF1o.

The transfer robot TR1 can collectively transfer up to N of the plurality of substrates W to the simultaneous processing unit PC1 while holding them horizontally side by side. The transfer robot TR1 may be configured to be able to transfer more than N substrates W, but in the present embodiment, only N substrates W can be conveyed at the maximum. Therefore, in order not to increase the size unnecessarily, the transfer robot TR1 may be configured so that the number of substrates W exceeding N cannot be transferred. Further, in the present embodiment, the transfer robot TR1 carries out the substrate W processed by the simultaneous processing unit PC1. Further, in the present embodiment, the transfer robot TR1 transfers the dummy board WD of the boards W carried out from the simultaneous processing unit PC1 to the board storage unit SD as described above.

The control unit 60 operates each configuration by controlling each configuration constituting the substrate processing system SY1. As a result, substrate processing is performed on a plurality of product substrate WPs. At that time, the control unit 60 manages the plurality of product board WPs by dividing them into a plurality of sets each having a maximum number of N sheets. In FIG. 1, a plurality of product substrates are managed by being divided into first to nth sets, and the maximum number of product substrate WPs in each set is N = 2. The product substrate WP belonging to the same set is processed one by one in each of the flat flow processing unit PF1 and the flat flow processing unit PF2, but is processed simultaneously in the simultaneous processing unit PC1. In order for the simultaneous processing unit PC1 to perform the processing in units of sets in this way, the transfer robot TR1 transfers a plurality of sets from the flat flow processing unit PF1 to the simultaneous processing unit PC1 one by one. When a set of a plurality of product board WPs has N sheets (in the case of two sheets in FIG. 1), the control unit 60 operates the transfer robot TR1 in a simple mode, and is one of the plurality of product board WPs. When the set has one or more and less than N sheets (in the case of one in FIG. 1), the transfer robot TR1 is operated in the mixed loading mode. Therefore, the transfer robot TR1 is controlled by the control unit 60 to carry the N product board WPs from the flat flow processing unit PF1 into the simultaneous processing unit PC1 in a simple mode and from the flat flow processing unit PF1. Mixed loading mode in which the product board WP of P sheets (1 ≦ P <N) and the dummy board WD of D sheets (1 ≦ D ≦ N−P) from the board storage unit SD are collectively carried into the simultaneous processing unit PC1. And, it is configured to be operational. In FIG. 1, D = N−P is satisfied, and specifically, N = 2, P = 1, and D = 1. Therefore, in the simple mode, the two product board WPs from the flat flow processing unit PF1 are collectively carried into the simultaneous processing unit PC1, and in the mixed loading mode, one product board WP and the board from the flat flow processing unit PF1. One dummy board WD from the storage unit SD is collectively carried into the simultaneous processing unit PC1.

The flat flow processing unit PF2 is for further processing the product substrate WP processed by the simultaneous processing unit PC1. The flat flow processing unit PF2 is configured to accept the product substrate WP and expel the dummy substrate WD among the plurality of substrates W carried into the receiving portion PF2i.

FIG. 2 shows a downstream portion (processing portion PF1m and a payout portion PF1o) of the flat flow processing unit PF1 of the substrate processing system SY1, a transfer robot TR1, a simultaneous processing unit PC1, and a substrate storage unit SD. It is a plan view (a) and a side view (b) which show the structure. FIG. 3 is a partially enlarged view of FIG. 2 (b).

The transfer robot TR1 has a hand HND and a mechanism for displacing the hand HND. The hand HND can be displaced between the payout portion PF1o of the flat flow processing unit PF1, the substrate storage unit SD, and the simultaneous processing unit PC1. When N = 2, the maximum number of product board WPs in one set is two, and the hand HND includes two positions, positions Q1 and Q2, correspondingly. As a result, the hand HND can hold the substrate W at each of the positions Q1 and Q2. Therefore, the hand HND can simultaneously hold two boards W as one set of boards W. As a relative positional relationship between the positions Q1 and Q2, the position Q1 is located on the root side of the hand HND, and the position Q2 is located on the tip side of the hand HND.

The board storage unit SD keeps the dummy board WD on standby. For example, the substrate storage portion SD has a pin PD that supports the dummy substrate WD. The dummy substrate WD may be made of substantially the same material as the product substrate WP, but may be made of a different material. For example, the product substrate WP may be a glass substrate and the dummy substrate WD may be a metal substrate. In this case, the dummy substrate WD is less likely to crack than the product substrate WP, and can be used for a long period of time. The weight of the dummy substrate WD is preferably equal to or less than the weight of the product substrate WP in order to avoid an excessive load on the transfer robot TR1. Further, the heat capacity of the dummy substrate WD is preferably substantially the same as the amount of heat of the product substrate WP (for example, a difference within the range of ± 10%) from the viewpoint of the thermal effect on the simultaneous processing unit PC1.

The receiving portion PF1i of the flat flow processing unit PF1 sequentially receives a plurality of product substrate WPs. Each of the received product substrate WPs is conveyed by the roller RL from the receiving portion PF1i to the discharging portion PF1o via the processing portion PF1m. In other words, the roller RL sequentially conveys the plurality of product substrate WPs along the conveying direction. The processing portion PF1m of the flat flow processing unit PF1 processes the plurality of product substrate WPs conveyed in this way one by one.

The payout portion PF1o of the flat flow processing unit PF1 includes two positions P1 and P2 when N = 2. As a result, a set of product substrates WP1 and WP2 can be arranged at positions P1 and P2, respectively. Lift pins LP1 and LP2 are provided at positions P1 and P2, respectively. The lift pins LP1 and LP2 are driven in the vertical direction by the vertical drive mechanisms AC1 and AC2, respectively. As a result, it is possible to selectively raise both or one of the product substrates WP1 and WP2 arranged at the positions P1 and P2 of the product substrate WP. The raised product board WP is ready to be paid out to the transfer robot TR1.

When the flat flow processing unit can prepare both the product substrates WP1 and WP2, both the product substrates WP1 and WP2 are arranged in the payout portion PF1o. In this case, the hand HND may receive a set of product boards WP1 and WP2 without receiving the dummy board WD. On the other hand, when the flat flow processing unit cannot prepare both of these product substrates WP1 and WP2, only one of the product substrates WP1 and WP2 is arranged in the payout portion PF1o. For example, in the processing portion PF1m of the flat flow processing unit PF1 or the processing unit upstream of the processing unit (not shown), there is an abnormality in the processing of one of the two product substrates constituting this set, so that one of them is concerned. This is the case when the substrate has been removed. Here, the position P1 is located between the position P2 and the transfer robot TR1. As will be described in detail later, the hand HND on which the dummy board WD is placed may access the position P2 in order to receive the product board WP2 at the position P2. In this case, by not raising the lift pin LP1 at the position P1. , It is possible to prevent the lift pin LP1 from coming into contact with the dummy substrate WD on the hand HND.

When N = 2, the simultaneous processing unit PC1 includes two positions, positions P3 and P4. Thereby, the substrate W can be arranged at each of the positions P3 and P4. Specifically, the product substrate WP can be arranged at both the positions P3 and P4, and the product substrate WP can be arranged at one of the positions P3 and P4 and the dummy substrate WD can be arranged at the other. Lift pins LP3 are provided at positions P3 and P4. The lift pin LP3 is driven in the vertical direction by the vertical drive mechanism AC3. When the lift pin LP3 is raised, the transfer robot TR1 can accept or pay out the substrate W at each of the positions P3 and P4.

<1-1-2. Substrate processing method>
FIG. 4 is a flow chart showing a part of the steps of the substrate processing method by the substrate processing system SY1 (FIGS. 1 to 3) for processing the plurality of product substrate WPs described above. 5 to 11 are side views schematically showing each process.

In the substrate processing method by the substrate processing system SY1, the control unit 60 (FIG. 1) manages a plurality of product substrate WPs by dividing them into a plurality of sets each having a maximum number of N sheets. In the following, the case of N = 2 will be described as an example. In this case, a plurality of product board WPs are managed by being divided into the first to nth sets, and the maximum number of product board WPs in each set is two.

In step S101 (FIG. 4), the receiving portion PF1i of the flat flow processing unit PF1 (FIGS. 1 to 3) receives a plurality of product substrate WPs. The plurality of accepted product substrate WPs are sequentially transported along the transport direction (arrow AR1 in FIG. 5). The processing portion PF1m of the flat flow processing unit PF1 processes the plurality of product substrate WPs conveyed in this way one by one.

The transfer robot TR1 transfers a plurality of sets of product substrate WPs one by one from the flat flow processing unit PF1 to the simultaneous processing unit PC1. Prior to this transfer, in step S102 (FIG. 4), the control unit 60 is set by the set of product board WPs reaching the payout portion PF1o of the flat flow processing unit PF1, in other words, the payout portion PF1o by the transfer robot TR1. It is determined whether the set to be carried out from is having N sheets or one or more and less than N sheets. Here, N = 2, and therefore, it is determined whether the number of sets to be carried out is two or one. This determination may be made based on information from a sensor mounted at an arbitrary location in the board processing system SY1, or may be made based on information given to the control unit 60 from the outside of the board processing system SY1. good.

First, when the determination result in step S102 (FIG. 4) is YES (in the case of N sheets), the control unit 60 controls to operate the transfer robot TR1 in the simple mode among the simple mode and the mixed loading mode described above. Start. At this start, the product boards WP1 and WP2, which belong to the set of product board WPs, are located at positions P1 and P2, respectively. The lift pins LP1 and LP2 are raised by the vertical drive mechanisms AC1 and AC2, respectively. As a result, the product substrates WP1 and WP2 located at the positions P1 and P2 are in a payable state. The simultaneous processing unit PC1 simultaneously processes these N = 2 product substrates WP1 and WP2. Specifically, first, in step S201 (FIG. 4), the product boards WP1 and WP2 are transferred from the payout portion FP1o of the flat flow processing unit PF1 to the positions P3 and P4 of the simultaneous processing unit PC1 by the transfer robot TR1. Will be done. In step S202 (FIG. 4), the simultaneous processing unit PC1 processes N = 2 product substrates WP1 and WP2. In step S203 (FIG. 4), the transfer robot TR1 transfers the product substrates WP1 and WP2 processed by the simultaneous processing unit PC1 to the positions P5 and P6 of the flat flow processing unit PF2 (FIG. 1). After that, processing is performed by the flat flow processing unit PF2.

Second, when the determination result in step S102 (FIG. 4) is NO (when one or more and less than N), the control unit 60 sets the transfer robot TR1 in the mixed mode among the simple mode and the mixed mode described above. Start the control to operate. At the start of this, only one of the product substrates WP1 and WP2, which belong to the set of the product substrate WPs, is arranged in the payout portion PF1o of the flat flow processing unit PF1. Hereinafter, an example in which the product board WP2 is arranged at the position P2 will be described.

In step S301 (FIG. 4), the product substrate WP of P sheets (1 ≦ P <N) processed by the flat flow processing unit PF1 and the dummy substrate WD are transferred to the simultaneous processing unit PC1 by the transfer robot TR1. Will be done. In the example of N = 2, one product substrate (specifically, product substrate WP2) and one dummy substrate WD are conveyed.

Specifically, referring to FIGS. 5 and 6, the hand HND of the transfer robot TR1 receives the dummy substrate WD by the operation shown by the arrow AR2 (FIG. 6). As a result, the dummy substrate WD is held on the position Q1 of the hand HND. With reference to FIG. 7, the hand HND of the transfer robot TR1 then accesses the payout portion PF1o of the flat flow processing unit PF1 as shown by the arrow AR4. As a result, the position Q2 of the hand HND is arranged directly below the payout portion PF1o. At this time, since the product board WP1 (FIG. 3) does not exist at the position P1 of the payout portion PF1o and the lift pin LP1 is not lifted by the vertical drive mechanism AC1, the movement of the hand HND moves with the product board WP1 and the lift pin LP1. It is not hindered by. With reference to FIG. 8, then, as shown by the arrow AR5, the hand HND of the transfer robot TR1 receives the product substrate WP2 by raising the hand HND. As a result, the product substrate WP2 is held on the position Q2 of the hand HND. With reference to FIG. 9, as shown by the arrow AR6, the hand HND of the transfer robot TR1 accesses the simultaneous processing unit PC1. By lowering the hand HND, the dummy substrate WD and the product substrate WP2 are placed on the lift pin LP3 at the positions P3 and P4 of the simultaneous processing unit PC1. Next, the hand HND saves from the simultaneous processing unit PC1. With the above, step S301 (FIG. 4) is completed.

In step S302 (FIG. 4), then, by the simultaneous processing unit PC1 (FIG. 9), P product substrate WP (in this example, one product substrate WP2) and at least one dummy substrate WD ( In this example, processing is performed on one dummy substrate WD).

In step S303 (FIG. 4), the transfer robot TR1 transfers the product substrate WP2 to the flat flow processing unit PF2 and collects the dummy substrate WD to the substrate storage unit SD. Specifically, referring to FIG. 10, first, the transfer robot TR1 carries the dummy substrate WD and the product substrate WP2 above the positions P5 and P6 of the receiving portion PF2i of the flat flow processing unit PF2. .. Next, the lift pin LP5 provided at the position P6 of the receiving portion PF2i is lifted to the upper position while the lift pin LP4 provided at the position P5 of the receiving portion PF2i is maintained at the lower position. As a result, the product substrate WP2 is supported by the lift pin LP5. Next, as shown by the arrow AR7, the hand HND retracts from the flat flow processing unit PF2. Next, the lift pin LP5 is lowered to the lower position. As a result, the product substrate WP2 is placed on the roller RL at the position P6. From the above, the flat flow processing unit PF2 is configured to accept the product substrate WP2 among the product substrate WP2 and the dummy substrate WD as a plurality of substrates W carried into the receiving portion PF2i, while expelling the dummy substrate. .. The accepted product substrate WP2 is processed by the processing portion PF2m to the flat flow processing unit PF2. With reference to FIG. 11, the hand HND of the transfer robot TR1 then transfers the dummy substrate WD above the pin PD of the substrate storage portion SD. Subsequently, the dummy substrate WD is placed on the pin PD by operating the hand HND as shown by the arrow AR8 (FIG. 11). As a result, the dummy substrate WD is collected in the substrate storage portion SD.

As described above, in the substrate processing system SY1, the plurality of product substrate WPs are managed by being divided into a plurality of sets each having a maximum of two sheets. In step S101 (FIG. 4) described above, the plurality of sets are sequentially processed, and one product substrate is processed in each of these sets. After that, either the step including steps S201 to S203 or the step including steps S301 to S303 is performed for each set of the product substrate WP according to the determination result in step S102 described above. Therefore, each of the plurality of product substrate WPs is processed through either a step including steps S201 to S203 or a step including steps S301 to S303.

<1-1-3. Effect>
First, the effect especially in the case of N = 2 will be described below.

According to the present embodiment, there is a simple mode (corresponding to steps S201 to S203 in FIG. 4) in which the two product boards WP1 and WP2 from the flat flow processing unit PF1 are collectively carried into the simultaneous processing unit PC1 and flat. Mixed loading mode in which one product board WP2 from the sink processing unit PF1 and one dummy board WD from the board storage unit SD are collectively carried into the simultaneous processing unit PC1 (corresponding to steps S301 to S303 in FIG. 4). And, can be selected in step S102 (FIG. 4). As a result, when the number of product substrates WP processed simultaneously by the simultaneous processing unit PC1 is less than two and one, the dummy substrate WD is also processed at the same time, so that the substrate processed simultaneously by the simultaneous processing unit PC1. The number of Ws can be two. As a result, in either the simple mode or the mixed loading mode, the number of substrates W simultaneously processed by the simultaneous processing unit PC1 is two in common. As a result, process variation due to fluctuations in the number of substrates W simultaneously processed by the simultaneous processing unit PC1 can be suppressed.

Specifically, when the transfer robot TR1 has two sets of a plurality of product boards WP to be transferred from the flat flow processing unit PF1 to the simultaneous processing unit PC1 by the control unit 60, the transfer robot TR1 is simple. When the set of the plurality of product boards WP has one number of sheets, the transfer robot TR1 is operated in the mixed loading mode. As a result, when the number of product substrates WP processed simultaneously by the simultaneous processing unit PC1 is less than two, the number of substrate W processed simultaneously by the simultaneous processing unit PC1 is increased by simultaneously processing the dummy substrate WD. It can be two sheets. Therefore, it is possible to suppress process variation due to the number of substrates W being simultaneously processed by the simultaneous processing unit PC1 fluctuating from two.

The flat flow processing unit PF1 is configured to be able to control the number of product substrate WPs to be delivered to the transfer robot TR1. Specifically, in FIG. 3, two boards can be dispensed by arranging the product board WP at both positions P1 and P2, and one piece by arranging the product board WP on only one of them. The substrate may be payable. Thereby, the number of product substrate WPs transported from the flat flow processing unit PF1 to the simultaneous processing unit PC1 can be adjusted.

The flat flow processing unit PF2 (FIG. 10) is configured to accept the product substrate WP2 and expel the dummy substrate WD among the plurality of substrates W carried into the flat flow processing unit PF2. As a result, the dummy substrate WD can be prevented from being processed by the flat flow processing unit PF2.

Next, the effect when N is not limited to N = 2 and is an arbitrary integer will be described below.

According to the present embodiment, there is a simple mode (corresponding to steps S201 to S203 in FIG. 4) in which N product board WPs from the flat flow processing unit PF1 are collectively carried into the simultaneous processing unit PC1 and a flat flow process. The product board WP of P sheets (1 ≦ P <N) from the unit PF1 and the dummy board WD of D sheets (1 ≦ D ≦ N−P) from the board storage unit SD are collectively carried into the simultaneous processing unit PC1. It is possible to select one of the mixed loading modes (corresponding to steps S301 to S303 in FIG. 4). As a result, when the number of product substrates WP processed simultaneously by the simultaneous processing unit PC1 is less than N, the number of substrates W simultaneously processed by the simultaneous processing unit PC1 is increased by simultaneously processing the dummy substrate WD. It can be approached to N sheets. Therefore, it is possible to suppress process variation due to fluctuations in the number of substrates W that are simultaneously processed by the simultaneous processing unit PC1.

Specifically, when the transfer robot TR1 has a set of a plurality of product boards WP to transfer from the flat flow processing unit PF1 to the simultaneous processing unit PC1 by the control unit 60, the transfer robot TR1 has a simple mode. When the set of the plurality of product board WPs has one or more and less than N sheets, the transfer robot TR1 is operated in the mixed loading mode. As a result, when the number of product substrates WP processed simultaneously by the simultaneous processing unit PC1 is less than N, the number of substrates W simultaneously processed by the simultaneous processing unit PC1 is increased by simultaneously processing the dummy substrate WD. It can be approached to N sheets. Therefore, it is possible to suppress process variation due to the number of substrates W being simultaneously processed by the simultaneous processing unit PC1 fluctuating from N.

In the above, it is preferable that D = NP is satisfied. As a result, when the number of product substrates WP processed simultaneously by the simultaneous processing unit PC1 is less than N, the number of substrates W simultaneously processed by the simultaneous processing unit PC1 is increased by simultaneously processing the dummy substrate WD. It can be N sheets. Therefore, it is possible to suppress process variation due to the number of substrates W being simultaneously processed by the simultaneous processing unit PC1 fluctuating from N.

In step S303 (FIG. 4), the transfer robot TR1 carries out the substrate W processed by the simultaneous processing unit PC1 and uses the dummy substrate WD of the substrates W carried out from the simultaneous processing unit PC1 as the substrate storage unit SD. Transport to. As a result, the transfer robot TR1 can fulfill the function of collecting the dummy substrate WD in addition to the function of conveying the product substrate WP.

The flat flow processing unit PF1 is configured to be able to control the number of product substrate WPs to be delivered to the transfer robot TR1. Thereby, the number of product substrate WPs transported from the flat flow processing unit PF1 to the simultaneous processing unit PC1 can be adjusted.

The flat flow processing unit PF2 is configured to accept the product substrate WP and expel the dummy substrate WD from among the plurality of substrates W carried into the flat flow processing unit PF2. As a result, the dummy substrate WD can be prevented from being processed by the flat flow processing unit PF2.

<1-2. Embodiment 2>
<1-2-1. Configuration>
FIG. 12 is a block diagram showing an outline of the configuration of the substrate processing system SY2 according to the second embodiment. The substrate processing system SY2 further includes a simultaneous processing unit PC2 in addition to the configuration of the substrate processing system SY1 (FIG. 1). The simultaneous processing unit PC2 simultaneously processes N sheets (N ≧ 2) of a plurality of substrates W. Although N is an arbitrary integer of 2 or more, the case of N = 2 is shown in the drawings, and the simultaneous processing unit PC2 has positions P13 and P14 for arranging the two substrates. .. The case where N = 2 will be mainly described below.

In the present embodiment, the transfer robot TR1 can also access the simultaneous processing unit PC2. The transfer robot TR1 transfers the substrate W processed by the simultaneous processing unit PC1 to the simultaneous processing unit PC2. Specifically, the substrate W arranged at the positions P3 and P4 of the simultaneous processing unit PC1 is conveyed to the positions P13 and P14 of the simultaneous processing unit PC2. Further, the transfer robot TR1 carries out the substrate W processed by the simultaneous processing unit PC2. Further, the transfer robot TR1 transfers the dummy board WD of the boards W carried out from the simultaneous processing unit PC2 to the board storage unit SD. Further, the transfer robot TR1 transports the product substrate WP among the substrates W carried out from the simultaneous processing unit PC2 to the flat flow processing unit PF2. Therefore, in the present embodiment, the flat flow processing unit PF2 is for further processing the product substrate WP processed by the simultaneous processing unit PC1 and the simultaneous processing unit PC2.

<1-2-2. Substrate processing method>
FIG. 13 is a flow chart showing a part of the steps of the substrate processing method by the substrate processing system SY2 (FIG. 12). Steps S101 and S102 are common to the case of the first embodiment (FIG. 4).

First, when the determination result in step S102 (FIG. 13) is YES (in the case of N sheets), steps S211 and S212 (FIG. 13) are the same as in steps S201 and S202 (FIG. 4: Embodiment 1). It is done in. In step S213 (FIG. 13), the transfer robot TR1 (FIG. 12) moves the two product board WPs arranged at the positions P3 and P4 of the simultaneous processing unit PC1 to the positions P13 and P14 of the simultaneous processing unit PC2. Transport. In step S214 (FIG. 13), the transferred product substrate WP is processed by the simultaneous processing unit PC2. In step S215 (FIG. 13), the transfer robot TR1 transfers the two product substrate WPs processed by the simultaneous processing unit PC1 to the positions P5 and P6 of the flat flow processing unit PF2 (FIG. 12). After that, processing is performed by the flat flow processing unit PF2.

Secondly, when the determination result in step S102 (FIG. 13) is NO (when one or more and less than N), steps S311 and S312 (FIG. 13) are the steps S301 and S302 (FIG. 4: Embodiment). It is performed in the same manner as 1). In step S313 (FIG. 13), the transfer robot TR1 (FIG. 12) transfers the two substrates W arranged at the positions P3 and P4 of the simultaneous processing unit PC1 to the positions P13 and P14 of the simultaneous processing unit PC2. do. The two substrates W here are one product substrate WP (for example, product substrate WP2) and one dummy substrate WD (see FIG. 9). In step S314 (FIG. 13), the transferred product substrate WP and dummy substrate WD are processed by the simultaneous processing unit PC2. In step S315 (FIG. 13), the transfer robot TR1 transfers the product substrate WP2 to the flat flow processing unit PF2 and collects the dummy substrate WD to the substrate storage unit SD. This step S315 is the same as step S303 (FIG. 4: Embodiment 1) except that the product substrate WP and the dummy substrate WD are carried out from the simultaneous processing unit PC2 instead of the simultaneous processing unit PC1.

<1-3. Embodiment 3>
<1-3-1. Configuration>
FIG. 14 is a block diagram showing an outline of the configuration of the substrate processing system SY3 according to the third embodiment. The substrate processing system SY3 has a flat flow processing unit PF1, a flat flow processing unit PF2, a transfer robot TR1, a simultaneous processing unit PC1, and a substrate storage unit SD, and the configuration of each of these is implemented. This is the same as in the case of the first form. As a difference from the first embodiment, in the present embodiment, the transfer robot TR1 does not have to be able to access the flat flow processing unit PF2.

The substrate processing system SY3 further includes a transfer robot TR2 (second substrate transfer unit) and a substrate delivery unit VD. The transfer robot TR2 carries out the substrate W processed by the simultaneous processing unit PC1. The substrate delivery unit VD receives the dummy substrate WD from the substrate W processed by the simultaneous processing unit PC1 from the transfer robot TR2. In the present embodiment, the transfer robot TR1 transfers the dummy substrate WD from the substrate delivery portion VD to the substrate storage portion SD.

FIG. 15 shows a downstream portion of the flat flow processing unit PF1 (processing portion PF1m and a payout portion PF1o) and an upstream portion of the flat flow processing unit PF2 (accepting portion PF2i and processing portion PF2m) of the substrate processing system SY3. It is a plan view (a) and a side view (b) which show the structure of the transfer robot TR1, the transfer robot TR2, the simultaneous processing part PC1, the board storage part SD, and the board delivery part VD. Similar to the first embodiment, the configuration in the case of N = 2 is illustrated, and the case of N = 2 will be mainly described below as an example.

The transfer robot TR2 has a hand HND2 similar to the hand HND of the transfer robot TR1 and a mechanism for displacing the hand HND2. The hand HND2 can be displaced between the simultaneous processing unit PC1, the substrate delivery unit VD, and the receiving portion PF2i of the flat flow processing unit PF2.

The board delivery unit VD delivers the dummy board WD. Specifically, the board delivery unit VD receives the dummy board WD from the transfer robot TR2, temporarily holds the received dummy board WD, and passes the held dummy board WD to the transfer robot TR1. The substrate delivery unit VD is preferably arranged above the simultaneous processing unit PC1. The board delivery unit VD has a pin PV (holding unit) arranged at a position P7 accessible from each of the transfer robots TR1 and TR2. As a modification, instead of the pin PV, a roller (transportation unit) capable of transporting the dummy substrate WD may be provided. In this case, the roller receives the dummy substrate WD from the transfer robot TR2 at the transport start position, and then transports the dummy substrate WD to the transport end position. The transport robot TR1 carries out the dummy board WD at the transport end position. Therefore, the transfer robot TR2 does not need to be accessible to the transport end position, and the transfer robot TR1 does not need to be accessible to the transport start position.

<1-3-2. Substrate processing method>
FIG. 16 is a flow chart showing a part of the steps of the substrate processing method by the substrate processing system SY3 (FIG. 15). Steps S101 and S102 are common to the case of the first embodiment (FIG. 4).

When the determination result in step S102 (FIG. 16) is YES (in the case of N sheets), steps S221 and S222 (FIG. 16) are performed in the same manner as in steps S201 and S202 (FIG. 4: Embodiment 1). In step S223 (FIG. 16), the transfer robot TR2 (FIG. 15) transfers the product substrate WP from the positions P3 and P4 of the simultaneous processing unit PC1 to the positions P5 and P6 of the flat flow processing unit PF2 (FIG. 1). .. After that, processing is performed by the flat flow processing unit PF2.

Secondly, when the determination result in step S102 (FIG. 16) is NO (when one or more and less than N), steps S321 and S322 (FIG. 16) are in steps S301 and S302 (FIG. 4: Embodiment). It is performed in the same manner as 1). In step S323 (FIG. 16), the transfer robot TR2 (FIG. 15) transfers the product substrate WP2 to the flat flow processing unit PF2 and the dummy substrate WD to the substrate delivery unit VD. In step S324 (FIG. 16), the transfer robot TR1 (FIG. 15) collects the dummy substrate WD from the substrate delivery portion VD to the substrate storage portion SD.

<1-3-3. Effect>
According to the present embodiment, the transfer robot TR2 can fulfill the function of transferring the dummy substrate WD to the substrate delivery portion VD in addition to the function of conveying the product substrate WP. Further, the transfer robot TR2, the substrate delivery unit VD, and the transfer robot TR1 can cooperate to collect the dummy substrate WD.

<1-4. Embodiment 4>
17 and 18 are plan views schematically showing the configuration and operation of the substrate accommodating portion SD (board standby portion) in the fourth embodiment. In the fourth embodiment, the substrate storage portion SD (see FIG. 2) has at least one (four in FIGS. 17 and 18) alignment portions LM for aligning the dummy substrate WD. There is. The alignment unit LM has an alignment pin AP and a drive mechanism AC9. The drive mechanism AC9 advances and retreats the alignment pin AP with respect to the dummy substrate WD. As shown by the arrow AR9 (FIG. 18), the alignment pin AP advances to the dummy substrate WD, so that the position of the dummy substrate WD in the substrate accommodating portion SD is adjusted to a predetermined position. According to the present embodiment, the dummy substrate WD having a disordered posture at the time of being recovered from the simultaneous processing unit PC1 can be aligned. Since the configurations other than the above are almost the same as the configurations of the above-described first to third embodiments, the same or corresponding elements are designated by the same reference numerals, and the description thereof will not be repeated.

<1-5. Embodiment 5>
FIG. 19 is a side view schematically showing the configuration of the substrate storage portion SD (board standby portion) according to the fifth embodiment. In the present embodiment, a plurality of dummy substrate WDs are made to stand by in the substrate accommodating portion SD. Therefore, the substrate storage unit SD includes a standby place G1 (first standby place) and a standby place G2 (second standby place) in which each of the first dummy board WD and the second dummy board WD is made to stand by. The waiting place G2 is located above the waiting place G1. According to the present embodiment, as compared with the first to fourth embodiments, it is possible to secure a larger number of dummy substrate WDs and suppress the area required for the substrate accommodating portion SD in the flat layout. Since the configurations other than the above are almost the same as the configurations of the above-described first to fourth embodiments, the same or corresponding elements are designated by the same reference numerals, and the description thereof will not be repeated.

<2. Supplement>
Next, a description for supplementing the details of each configuration of the flat flow processing unit, the simultaneous processing unit, and the control unit will be described below. As the flat flow processing unit, the simultaneous processing unit, and the control unit in the above-described first to fifth embodiments, the flat flow processing unit and the simultaneous processing unit in the substrate processing system described below may be applied.

<2-1. Overall configuration and overall operation of the board processing system>
FIG. 20 is a diagram schematically showing an example of the configuration of the substrate processing system 1. In the example of FIG. 20, the substrate processing system 1 is a coater / developer device, and is mainly a cleaning device 12, a dehydration baking device 13, a coating-related device 14, a prebaking device 15, a developing device 17, and a post-baking device 18. (Processing unit) is provided. Further, on one side of the substrate processing system 1, an indexer unit 11 for loading and unloading the substrate to and from the substrate processing system 1 is arranged. Further, the exposure apparatus 16 is arranged on the other side of the substrate processing system 1 via an interface portion (not shown).

A cleaning device 12, a dehydration baking device 13, a coating-related device 14, a pre-baking device 15, and the like are arranged in this order on the going line from the indexer section 11 to the exposure device 16. The developing device 17, the post-baking device 18, and the like are arranged in this order on the return line from the exposure device 16 to the indexer section 11.

A plurality of cassettes for accommodating a plurality of substrates are placed on the indexer unit 11. An indexer robot as a substrate transporting means is arranged in the indexer unit 11. The indexer robot takes out the substrate from the cassette and conveys the substrate to the cleaning device 12. In the cleaning device 12, the substrate is cleaned. The washed substrate is conveyed to the dehydration baking device 13. In the dehydration baking apparatus 13, a dehydration treatment (dehydration baking treatment) is performed by heating. The dehydrated-baked substrate is conveyed to the coating-related apparatus 14, and various treatments including a resist coating treatment are performed. The substrate subjected to this treatment is conveyed to the prebaking device 15 and heat-treated. The heat-treated substrate is conveyed to the exposure apparatus 16 and exposed. The substrate is, for example, a rectangular glass substrate used in a liquid crystal display device.

The substrate subjected to these treatments is conveyed to the developing apparatus 17 and subjected to the developing treatment. The developed substrate is conveyed to the post-baking device 18 and heat-treated. After that, the substrate is housed in a cassette placed on the indexer section 11 by the indexer robot. By a series of these processes, a resist pattern is formed on the surface of the substrate.

Further, the substrate processing system 1 has a control unit 60 that controls processing in each processing apparatus and transfer of the substrate. FIG. 21 is a functional block diagram schematically showing an example of the configuration of the control unit 60.

The control unit 60 is a control circuit, and as shown in FIG. 21, for example, a CPU (Central Processing Unit) 61, a ROM (Read Only Memory) 62, a RAM (Random Access Memory) 63, a storage device 64, and the like are included. It is composed of general computers interconnected via a bus line 65. The ROM 62 stores a basic program and the like, and the RAM 63 is provided as a work area when the CPU 61 performs a predetermined process. The storage device 64 is composed of a flash memory or a non-volatile storage device such as a hard disk device.

Further, in the control unit 60, the input unit 66, the display unit 67, and the communication unit 68 are also connected to the bus line 65. The input unit 66 is composed of various switches, a touch panel, or the like, and receives various input setting instructions such as processing recipes from the operator. The display unit 67 is composed of a liquid crystal display device, a lamp, and the like, and displays various information under the control of the CPU 61. The communication unit 68 has a data communication function via a LAN (Local Area Network) or the like.

Further, each robot (such as a transfer robot such as an indexer robot) and each of the above-mentioned processing devices are connected to the control unit 60 as control targets. That is, the control unit 60 can function as a transfer control unit that controls the transfer of the substrate.

The storage device 64 of the control unit 60 is preset with a plurality of modes for transport control of each device constituting the substrate processing system 1 (setting step). When the CPU 61 of the control unit 60 executes the processing program P, one of the plurality of modes is selected, and the transfer operation of the substrate is controlled by the mode (execution step). Further, the processing program P may be stored in the recording medium. By using this recording medium, the processing program P can be installed in the control unit 60 (computer). Further, a part or all of the functions executed by the control unit 60 do not necessarily have to be realized by software, and may be realized by hardware such as a dedicated logic circuit.

<2-2. Processing device type>
In this substrate processing system 1, the following two types of processing devices are mixed as the types of processing devices. That is, a flat flow processing device (flat flow processing unit) that sequentially transports the boards in one direction and processes the boards W one by one, and N (integer of 2 or more) of the boards at once. Simultaneous processing equipment (simultaneous processing unit) for simultaneous processing is mixed. It is not necessary that the processing periods of the N substrates by the simultaneous processing apparatus completely match, and it is sufficient that at least a part of each processing period overlaps. In short, the term "simultaneous" as used herein is used in contrast to a state in which the processing periods do not overlap at all. Examples of the flat flow processing device include a cleaning device 12 and a developing device 17, and examples of the simultaneous processing device include a dehydration baking device 13, a coating-related device 14, a pre-baking device 15, and a post-baking device 18.

<2-2-1. Flat flow processing equipment>
FIG. 22 is a diagram schematically showing an example of the configuration of the flat flow processing device 30. The flat flow processing apparatus 30 includes a substrate introduction portion (accepting portion) 31, a processing apparatus main body (processing portion) 32, and a substrate lead-out portion (delivery portion) 33. The board introduction unit 31 receives the board W conveyed from the upstream device. The processing device main body 32 receives the substrate W transported from the substrate introduction unit 31, and performs various processes on the substrate W while transporting the substrate W along one direction (conveying direction). The processed substrate W is conveyed from the processing apparatus main body 32 to the substrate lead-out unit 33. The board lead-out unit 33 sequentially receives the board W conveyed from the processing device main body 32. The board lead-out unit 33 can hold a plurality (N sheets) of the boards W received in sequence. The plurality of substrates W are collectively taken out from the substrate lead-out unit 33 and transported to a downstream device.

In the following, the cleaning device 12 will be described as an example of the flat flow processing device 30. The following description of the substrate introduction unit 31 and the substrate lead-out unit 33 is common to other flat flow processing devices 30 (for example, the developing device 17). On the other hand, since the processing device main body 32 is a block that controls the substantial processing of the substrate, the following description regarding the cleaning of the processing device main body 32 is a description peculiar to the cleaning device 12.

<2-2-1-1. Board introduction section 31>
The substrate introduction unit 31 has a plurality of rollers 311 and a plurality of rollers 313 as a conveyor. The cross section of the rollers 311, 313 has a circular shape, and the rollers 311, 313 are provided in a posture in which the central axis thereof is substantially perpendicular to and substantially horizontal to the transport direction D1 of the substrate W. The plurality of rollers 311 are provided side by side at intervals along the transport direction D1. Each roller 311 can rotate about its own central axis as a rotation axis. Both ends of each roller 311 on the central axis are rotatably fixed to a support plate (not shown). The pair of support plates are plate-shaped members extending along the transport direction D1 and are fixed to a predetermined pedestal 312 provided on the floor surface. The plurality of rollers 313 are provided side by side at intervals along the transport direction D1. The roller 313 is located on the downstream side of the roller 311 and is provided at the same height as the roller 311. Each roller 313 can rotate about its own central axis as a rotation axis. Both ends of each roller 313 on the central axis are rotatably fixed to the support plate.

The plurality of rollers 311 are driven by a drive unit (not shown) and rotate (synchronously rotate) in the same predetermined direction at substantially equal rotation speeds. The drive unit has a motor and is controlled by the control unit 60. The substrate W is placed on the plurality of rollers 311. The substrate W is placed in a posture in which the normal direction of the main surface is along the vertical direction. In this state, the plurality of rollers 311 rotate synchronously in the same direction, so that the substrate W moves on the rollers 311 to the processing apparatus main body 32 along the transport direction D1. The plurality of rollers 313 are also driven by a drive unit (not shown) to rotate synchronously. The rollers 311, 313 are independently controlled.

The substrate W may be placed one by one on the rollers 311, 313. For example, two substrates W1 from the indexer portion 11 may be placed on the rollers 311, 313. In this state, the control unit 60 conveys the substrate W on the roller 313 to the processing device main body 32 by synchronously rotating only the roller 313. Next, the control unit 60 conveys the substrate W on the roller 313 to the processing device main body 32 by rotating both the rollers 311, 313 synchronously.

<2-2-1-2. Processing device body 32>
The processing device main body 32 has a chemical solution unit 34, a water washing unit 35, and a draining unit 36. The chemical solution portion 34, the water washing portion 35, and the draining portion 36 are provided in series in this order from upstream to downstream. The processing device main body 32 also has a plurality of rollers 321 as a conveyor. The plurality of rollers 321 have the same shape as the roller 311 and are arranged in the same posture as the roller 311. The plurality of rollers 321 are arranged at intervals along the transport direction D1. The plurality of rollers 321 are provided at the same height as the rollers 311 of the substrate introduction portion 31, and the substrate W can move from the rollers 311 to the rollers 321. Further, the plurality of rollers 321 are provided over the chemical solution portion 34, the water washing portion 35, and the draining portion 36. The plurality of rollers 321 are driven by a drive unit (not shown) and rotate synchronously. As a result, the substrate W can be transported in the transport direction D1 and passed through the chemical solution section 34, the water washing section 35, and the draining section 36 in this order.

The chemical solution unit 34 is a device for cleaning the substrate W by supplying the chemical solution to the substrate W on the roller 321. The chemical solution unit 34 supplies the chemical solution to the nozzle 341 via a plurality of nozzles 341 for discharging the chemical solution, a chemical solution tank 342 for storing the chemical solution, a supply pipe 343 connecting the chemical solution tank 342 and the nozzle 341, and a supply pipe 343. It is equipped with a pump 344. Nozzles 341 are provided on both sides of the substrate W in the vertical direction, and supply chemicals to both sides of the substrate W. The chemical solution unit 34 may have a brush (not shown) for brushing the substrate W or the like. The cleaning effect can be enhanced by brushing while supplying the chemical solution to the substrate W. The chemical solution supplied to the substrate W mainly falls from the peripheral edge of the substrate W and is collected in the chemical solution tank 342.

The water washing unit 35 is a device for washing away the chemical solution remaining on the substrate W by supplying washing water to the substrate W. The washing unit 35 has a first water tank 355 and a second water tank 356 for storing washing water. Further, the water washing unit 35 has a low pressure water supply unit 351, a high pressure water supply unit 352, an ultrasonic cleaning water supply unit 353, and a pure water supply unit 354 arranged in this order from upstream to downstream. Like the chemical solution section 34, each section 351 to 354 includes a nozzle for discharging the liquid to the substrate W and a supply pipe connected to the nozzle. The low-pressure water supply unit 351 supplies wash water from the first water tank 355 to the nozzle at a low pressure adjusted by a regulator (pressure adjusting unit). As a result, the low-pressure water supply unit 351 can supply the washing water to the substrate W at a low pressure. The high-pressure water supply unit 352 supplies the washing water from the first water tank 355 to the nozzle at a high pressure adjusted by the regulator. As a result, the high-pressure water supply unit 352 can supply the washing water to the substrate W at high pressure. The wash water supplied by the low-pressure water supply unit 351 and the high-pressure water supply unit 352 mainly falls from the peripheral edge of the substrate W and is collected in the first water tank 355.

The nozzle of the ultrasonic cleaning water supply unit 353 is provided with an ultrasonic vibrator that applies ultrasonic vibration to the cleaning water from the second water tank 356. The ultrasonic cleaning water supply unit 353 supplies cleaning water in a vibrating state to the substrate W. The cleaning water supplied by the ultrasonic cleaning water supply unit 353 is mainly collected in the second water tank 356. Pure water is supplied toward the substrate W from the nozzle of the pure water supply unit 354. This pure water is mainly collected in the second water tank 356.

The draining portion 36 is a device that blows water from the substrate W by flowing a high-pressure air flow to the substrate W. The draining unit 36 has an injection unit 361 that injects gas onto the substrate W, a gas supply unit 362 that supplies gas, and a pipeline 363 that connects the injection unit 361 and the gas supply unit 362. The gas supply unit 362 is a gas source provided as factory equipment (utility).

As described above, in the processing apparatus main body 32, the substrate W is transported along the transport direction D1, and various processes are performed at each position. The substrate W that has been completely processed by the processing apparatus main body 32 is conveyed to the substrate lead-out unit 33.

<2-2-1-3. Board lead-out unit 33>
The board lead-out unit 33 can hold a plurality (N sheets) of boards W that are sequentially conveyed from the processing device main body 32. The number of substrates W that can be held by the substrate lead-out unit 33 is the same as the number of substrates W that are processed by the next simultaneous processing device 40 (for example, the dehydration baking device 13). Here, as an example, it is assumed that the substrate lead-out unit 33 holds two substrates W, and the simultaneous processing device 40 simultaneously processes the two substrates W.

The board lead-out unit 33 includes a plurality of first rollers 331 and a plurality of second rollers 332 as a conveyor, and sensors 334 and 335. The cross section of the first roller 331 has a circular shape. The first roller 331 is arranged at intervals along the transport direction D1 in a posture in which the central axis thereof is perpendicular and horizontal to the transport direction D1 of the substrate W. The second roller 332 is arranged on the downstream side of the first roller 331. The second roller 332 also has the same shape as the first roller 331, and is arranged in the same posture as the first roller 331 at intervals along the transport direction D1. The plurality of first rollers 331 are synchronously rotated by the first drive unit (not shown), and the second roller 332 is synchronously rotated by the second drive unit (not shown). Since the first roller 331 and the second roller 332 are driven by the first drive unit and the second drive unit that are different from each other, they can be controlled independently of each other. The first drive unit has, for example, a motor, and the second drive unit has, for example, a motor. The first drive unit and the second drive unit are controlled by the control unit 60.

The first roller 331 and the second roller 332 are provided at the same height as the roller 321. When they rotate synchronously, the substrate W is transported from the roller 321 to the first roller 331, and the first roller 331 is appropriately transported. It is conveyed from the roller 331 to the second roller 332. As will be described later, one substrate W is stopped on the first roller 331, and one substrate W is stopped on the second roller 332. As a result, the substrate lead-out unit 33 can hold the two substrates W.

The sensor 334 detects whether or not the substrate W exists at the stop position on the first roller 331. The sensor 335 detects whether or not the substrate W exists at the stop position on the second roller 332. The sensors 334 and 335 are, for example, optical sensors, and detect the substrate W when the reflected light from the substrate W is received. The detection results of the sensors 334 and 335 are output to the control unit 60.

The board lead-out unit 33 can sequentially receive two boards W from the processing device main body 32 and hold them. First, the first substrate W is conveyed to a stop position on the second roller 332 by the synchronous rotation of the first roller 331 and the second roller 332. Specifically, when both the sensors 334 and 335 do not detect the substrate W, the control unit 60 synchronously rotates the roller 332, the first roller 331, and the second roller 332 from the processing device main body 32. The board W is transported to the board lead-out unit 33. Then, when the sensor 335 detects the substrate W, the control unit 60 stops the synchronous rotation of the second roller 332. As a result, the first substrate W is stopped and supported on the second roller 332. For the second substrate W, the control unit 60 does not rotate the second roller 332, but synchronously rotates the roller 321 and the first roller 331 to bring the substrate W to the stop position of the first roller 331. Transport. Specifically, when the sensor 334 detects the substrate W, the control unit 60 stops the synchronous rotation of the first roller 331. That is, when both the sensors 334 and 335 detect the substrate W, the control unit 60 stops the synchronous rotation of the first roller 331. As a result, the second substrate W is stopped and supported on the first roller 331. In this way, the substrate lead-out unit 33 can hold the two substrates W.

Hereinafter, one of the two substrates W is also referred to as a substrate W1, and the other is also referred to as a substrate W2. Here, it is assumed that the substrate W1 stops on the first roller 331 and the substrate W2 stops on the second roller 332. Further, in the following, the direction orthogonal to the transport direction D1 and horizontal is also referred to as the width direction D2.

Further, the substrate lead-out unit 33 can adjust the distance between the two substrates W. Specifically, the substrate lead-out unit 33 controls the rotation of the first roller 331 and the second roller 332 to control the stop positions of the two substrates W that are sequentially carried onto the conveyor. The distance between the two substrates W can be adjusted. The board lead-out unit 33 adjusts the distance between the two carried-in boards W to the distance when the two boards W are processed at the same time by the dehydration baking device 13 immediately after. As will be described later, the adjusted spacing is such that both of the two substrates W can be placed on the substrate holding portion of the dehydration baking apparatus 13. That is, if the distance between the two substrates W is too wide, it cannot be placed on the substrate holding portion on the downstream side, so the substrate lead-out portion 33 adjusts the distance in advance.

The substrate lead-out unit 33 may include an alignment unit for aligning the two substrates W1 and W2. The positions of the substrates W1 and W2 in the width direction D2 are adjusted and aligned.

<2-3. Simultaneous processing device 40>
23 and 24 are diagrams schematically showing an example of the configuration of the simultaneous processing device 40. Here, the dehydration baking device 13 and the coating-related device 14 will be described as an example of the simultaneous processing device 40. FIG. 23 is a schematic view showing an example of the configuration of the dehydration baking device 13, and FIG. 24 is a diagram schematically showing an example of the configuration of the coating-related device 14. In FIGS. 23 and 24, the transport direction of the substrate W is indicated by a block arrow.

<2-3-1. Dehydration baking device 13>
The dehydration baking device 13 includes a heating unit HP and a cooling unit CP. The dehydration baking device 13 receives the two substrates W cleaned by the cleaning device 12 from the transfer robot (board transfer means) TR1, and processes the two received substrates W.

<2-3-1-1. Transfer robot TR1>
The transfer robot TR1 has a hand H1, a moving mechanism 51, an elevating mechanism 52, and a rotating mechanism 53. The moving mechanism 51 can move the hand H1 in a horizontal plane. For example, the moving mechanism 51 has a pair of arms. Each arm has a plurality of elongated connecting members, and the ends of the connecting members are rotatably connected to each other. One end of each arm is connected to the hand H1 and the other end is connected to the elevating mechanism 52. By controlling the connecting angle of the connecting member, the hand H1 can be moved in the horizontal plane. The elevating mechanism 52 raises and lowers the hand H1 by raising and lowering the arm along the vertical direction. The elevating mechanism 52 has, for example, a ball screw mechanism. The rotation mechanism 53 can rotate the elevating mechanism 52 around a rotation axis along the vertical direction. As a result, the hand H1 rotates along the circumferential direction. By this rotation, the direction of the hand H1 can be changed. The rotation mechanism 53 has, for example, a motor. The moving mechanism 51, the elevating mechanism 52, and the rotating mechanism 53 are controlled by the control unit 60.

The two substrates W are placed side by side in one horizontal direction on the hand H1. The hand H1 has, for example, a plurality of finger-shaped members F1 and a base end member P1 that connects the base ends of the finger-shaped members F1. One end of the arm is connected to the base end member P1. The finger-shaped member F1 has an elongated shape, and the substrate W is placed on the upper surface thereof. The two substrates W are placed side by side along the longitudinal direction of the finger-shaped member F1. Therefore, the length of the finger-shaped member F1 in the longitudinal direction is set according to the length of two substrates W and the distance between the substrates W.

The transfer robot TR1 appropriately moves and rotates the hand H1 to move the hand H1 to the heating unit HP, the cooling unit CP, the substrate lead-out unit 33 of the cleaning device 12, and the coating-related device 14 in the next process (not shown in FIG. 23). Can be moved to each of. The transfer robot TR1 collectively takes out the two substrates W from each of the substrate lead-out unit 33, the heating unit HP, and the cooling unit CP, or collectively removes the two substrates W from the heating unit HP, the cooling unit CP, and the cooling unit CP. It can be handed over to each of the coating-related devices 14.

For example, the transfer robot TR1 collectively takes out two boards W from the board lead-out unit 33 as follows. That is, the transfer robot TR1 moves the hand H1 to the board lead-out unit 33 in order to position the hand H1 below the two boards W held by the board lead-out unit 33.

The substrate W is conveyed via lift pins LP1 and LP2 (not shown in FIG. 23) that move up and down as shown in FIG. The first roller 331 and the second roller 332 are configured to avoid collision with the hand H1 of the transfer robot TR1. For example, in FIG. 23, the plurality of first rollers 331 are arranged in a grid pattern when viewed from above. Specifically, three first rollers 331 are arranged at intervals along the arrangement direction D1. Five sets having the three first rollers 331 are provided, and these five sets are provided at intervals along the width direction D2. Five first rollers 331 arranged along the width direction D2 are connected to each other on the same axis and rotate around this axis. The second roller 332 is also arranged in the same manner. Each set of the first roller 331 is aligned with each set of the second roller 332 along the arrangement direction D1. The finger-shaped member F1 is inserted between the sets of the first rollers 311 and between the sets of the second rollers 332 so as not to collide with the first roller 331 and the second roller 332.

Then, the transfer robot TR1 raises the hand H1 vertically upward, so that the two substrates W are lifted by the hand H1. As a result, the two substrates W are separated from the first roller 331 and the second roller 332, respectively. The two substrates W are placed side by side on the hand H1 at intervals along the longitudinal direction thereof. The two substrates W are placed on the hand H1 in a posture in which the normal direction of the main surface is along the vertical direction. Further, since almost no horizontal force is generated on the two substrates W in this carrying-out operation, the distance between the two substrates W in the substrate lead-out unit 33 is substantially maintained even in the transfer robot TR1.

Next, the transfer robot TR1 moves the hand H1 away from the board lead-out unit 33, so that the two boards W are collectively taken out from the board lead-out unit 33.

A plurality of suction ports may be formed on the upper surface of the finger-shaped member F1 (the surface on which the substrate W is placed). This suction port is provided at a position facing the two substrates W, and air is drawn from the suction port to suck the substrate W. Thereby, the holding force for holding the substrate W can be improved.

The transfer robot TR1 collectively takes out two substrates W from each of the heating unit HP and the cooling unit CP by the same operation as the above operation. On the other hand, the transfer robot TR1 collectively delivers the two substrates W to each of the heating unit HP, the cooling unit CP, and the coating-related device 14 (hereinafter referred to as each unit) in the reverse procedure of the above operation. That is, the transfer robot TR1 moves the hand H1 on which the two boards W are placed to the inside of each part, lowers the hand H1 and collectively puts the two boards W on the upper surface of the board holding part of each part. Place it. The substrate holding portion of each portion is configured so as not to collide with the hand H1 when the two substrates W are carried in and out. Then, the transfer robot TR1 moves the hand H1 from the inside to the outside of each part. As a result, the two substrates W are collectively passed to each part. Further, even in this carry-in operation, almost no force is generated in the horizontal direction on the two substrates W, so that the distance between the two substrates W in the transfer robot TR1 is substantially maintained in each part.

As described above, the transfer robot TR1 takes out the two boards W from the board lead-out unit 33 while maintaining the interval adjusted by the board lead-out unit 33, and dehydrates the two boards W while maintaining this distance. It can be passed to the baking device 13. Similarly, the transfer robot TR1 can transfer two substrates W while maintaining an interval between the parts.

The transfer robot TR1 may have two hands H1. The two hands H1 are driven independently of each other. For example, a moving mechanism 51, an elevating mechanism 52, and a rotating mechanism 53 for one hand H1 may be provided, and a moving mechanism 51, an elevating mechanism 52, and a rotating mechanism 53 may be provided for the other hand H1 as well. For example, the transfer robot TR1 uses one hand H1 to take out two boards W from the board lead-out unit 33. At this time, the other hand H1 is empty. Then, the transfer robot TR1 takes out the two substrates W processed by the heating unit HP from the heating unit HP using the other hand H1, and removes the two substrates W placed on the one hand H1. Pass it to the heating section HP. As a result, the throughput of substrate transfer can be improved. Hereinafter, the transfer robot having two hands H1 is also referred to as a double hand type transfer robot, and the transfer robot having one hand H1 is also referred to as a single hand type transfer robot.

As described above, the transfer robot TR1 holds N (2) of the plurality of substrates W processed by the cleaning device 12 which is the flat flow processing unit side by side in one horizontal direction (D1 direction). At the same time, the N (2) substrates are collectively transported to the dehydration baking apparatus 13 which is a simultaneous processing unit. As a result, the throughput of the transport process can be improved as compared with the case where the substrates W are transported one by one.

<2-3-1-2. Heating part HP>
Two substrates W are collectively handed over to the heating unit HP from the transfer robot TR1. The heating unit HP includes a substrate holding unit 91 that holds the two substrates W side by side in the horizontal direction, and a heating means 92 that simultaneously heats the two substrates W at the same time. .. In other words, the heating unit HP heat-treats the two substrates at the same time.

The substrate holding portion has a member that supports the lower surfaces of the two substrates W. The two substrates W are held by being placed on this member. The two substrates W are placed in a posture in which the normal direction of the main surface is along the vertical direction. For example, the substrate holding portion 91 includes a plurality of lift pins (not shown). The plurality of lift pins move up and down between an upper position in which the tip of the lift pin protrudes from the upper surface of the substrate holding portion 91 and a lower position retracted below the upper surface. The transfer robot TR1 passes the two substrates W to the plurality of lift pins protruding upward, and then retracts the two boards. The plurality of lift pins descend while supporting the two substrates W, and the two substrates W are placed on the upper surface of the substrate holding portion 91. Since the distance between the two substrates W is adjusted to an appropriate interval by the substrate lead-out portion 33 of the cleaning device 12, the substrate holding portion 91 can appropriately hold the two substrates W. Conversely, the substrate lead-out unit 33 adjusts the distance between the two substrates W conveyed from the processing apparatus main body 32 so that the two substrates W can be placed on the substrate holding portion 91.

The heating means 92 is, for example, a heater or the like, and simultaneously heat-treats the two substrates W held by the substrate holding portion 91 at the same time. The heating means 92 is controlled by the control unit 60. By this heat treatment, for example, the pure water remaining on the substrate W can be evaporated (dehydration treatment). Since the heat treatment is simultaneously performed on the two substrates W at the same time, the throughput of the heat treatment can be improved as compared with the case where the heat treatment is performed on the substrates W one by one. It can be said that the heating unit HP is a simultaneous processing unit that simultaneously processes N (for example, two) substrates at the same time.

<2-3-1-3. Cooling unit CP>
Two substrates W heated by the heating unit HP are collectively delivered to the cooling unit CP from the transfer robot TR1. That is, the transfer robot TR1 holds the two substrates W processed by the heating unit HP after being processed by the cleaning device 12 which is the flat flow processing unit, side by side in one horizontal direction, and the two substrates W. Are collectively transported to the cooling unit CP. The cooling unit CP includes a substrate holding unit 93 that holds the two substrates W side by side in the horizontal direction, and a cooling means 94 that collectively cools the two substrates W. In other words, the cooling unit CP performs the cooling process on the two substrates at the same time.

The substrate holding portion 93 has a member that supports the lower surfaces of the two substrates W. The two substrates W are held by being placed on this member. The two substrates W are placed in a posture in which the normal direction of the main surface is along the vertical direction. The structure of the substrate holding portion 93 is the same as that of the substrate holding portion 91.

The cooling means 94 is, for example, a cooling plate for flowing cold water through a liquid passage formed inside the metal plate, and collectively performs cooling treatment on the two substrates W held in the substrate holding portion. The cooling means 94 is controlled by the control unit 60. By this cooling process, the two substrates W are cooled, and the temperature of the two substrates W can be set to a temperature suitable for the downstream processing apparatus (coating-related apparatus 14). Since the two substrates W are simultaneously cooled at the same time, the throughput of the cooling process can be improved as compared with the case where the two substrates W are cooled one by one.

The cooling unit CP may cool the two substrates W by natural cooling. The natural cooling means that the heated substrate W is not cooled by using power (electric power), but the substrate W is left to cool. In this case, the cooling means 94 as a configuration such as a cooling plate is unnecessary. It can be said that this cooling unit CP is a simultaneous processing unit that simultaneously processes N (two) substrates.

<2-3-1-4. A series of processes of the dehydration baking device>
Next, a series of processes by the dehydration baking apparatus 13 will be briefly described. The transfer robot TR1 collectively takes out two substrates W from the substrate lead-out unit 33 of the cleaning device 12 on the upstream side, and collectively delivers the two substrates W to the heating unit HP. Even in this heating unit HP, the two substrates W are held in a horizontally aligned state. The heating unit HP collectively heats the two substrates W. The two substrates W after the heat treatment are collectively taken out by the transfer robot TR1 and collectively passed to the cooling unit CP. Even in the cooling unit CP, the two substrates W are held in a horizontally aligned state. The cooling unit CP collectively cools the two substrates W. The two substrates W that have been cooled are collectively taken out by the transfer robot TR1 and collectively conveyed to the coating-related device 14.

<2-3-2. Coating-related device 14>
As shown in FIG. 24, the coating-related device 14 includes an interval adjusting unit 41, a resist coating device 42, a vacuum drying device 43, and transfer robots TR2 and TR3. In the coating-related device 14, the following two processes are mainly performed on the two substrates W. That is, the resist coating device 42 collectively performs the resist coating process on the two substrates W at the same time, and then the vacuum drying device 43 collectively performs the vacuum drying process on the two substrates W at the same time. ..

By the way, in this resist coating apparatus 42, it is desirable that the distance between the two substrates W is a predetermined distance. This predetermined interval (that is, an interval suitable for the resist coating apparatus 42) will be described in detail later.

However, the distance between the two substrates W at the time of being passed from the dehydration baking device 13 on the upstream side to the coating-related device 14 may not be the predetermined distance. Therefore, in the example of FIG. 24, the interval adjusting unit 41 is provided. The interval adjusting unit 41 collectively receives two substrates W from the transfer robot TR1 of the dehydration baking apparatus 13, and adjusts the interval between the two substrates W to an interval suitable for the resist coating apparatus 42.

<2-3-2-1. Transfer robot TR2>
Returning to FIG. 24, the transfer robot TR2 collectively takes out the two substrates W from the interval adjusting unit 41. The interval adjusting portion 41 has a supporting portion (not shown) that supports the substrate W. When the substrate W is carried out, the hand of the transfer robot TR2 is inserted between the support portions of the interval adjusting portion 41. Therefore, the transfer robot TR2 does not collide with the support portion. The transfer robot TR2 collectively passes the two substrates W to the resist coating device 42. At this time, the transfer robot TR2 takes out the two substrates W while maintaining the changed interval by the interval adjusting unit 41, and passes the two substrates W to the resist coating device 42 while maintaining this interval. Also in the resist coating device 42, the two substrates W are held while maintaining this interval.

The transfer robot TR2 has the same configuration as the transfer robot TR1 and performs the same operation as the transfer robot TR1. That is, the transfer robot TR2 takes out the two boards W by raising the empty hand and lifting the two boards W. Further, the transfer robot TR2 lowers the hand on which the two substrates W are placed and mounts the two substrates W on the substrate holding portion. Since almost no horizontal force is generated on the two substrates W in these operations, the distance between the two substrates W is substantially maintained when the transfer robot TR2 carries in and out the two substrates W. That is, the transfer robot TR2 takes out the two substrates W from the interval adjusting unit 41 while maintaining the interval changed by the interval adjusting unit 41, and while maintaining this interval, removes the two substrates W from the resist coating device 42. Can be passed to. The transfer robot TR2 may be a single-hand type transfer robot.

As described above, the transfer robot TR2, like the transfer robot TR1, uses the N (2) substrates W processed by the cleaning device 12 which is the flat flow processing unit in the upstream process in one horizontal direction. While holding them side by side in the (D1 direction), the N substrates W are collectively conveyed to the resist coating device 42, which is a simultaneous processing unit. As a result, the throughput of the transport process can be improved as compared with the case where the substrates W are transported one by one.

<2-3-2-2. Resist coating device>
The resist coating device 42 receives two substrates W from the transfer robot TR2 at intervals changed by the interval adjusting unit 41, and performs coating processing on the two received substrates W. FIG. 25 is a side view showing an example of the configuration of the resist coating device 42. The resist coating device 42 includes a substrate holding portion 421, a nozzle 422, and a nozzle moving mechanism 423. The substrate holding portion 421 is a member for horizontally arranging and holding two substrates W transported from the transport robot TR2. The two substrates W are placed on the substrate holding portion 421 in a posture in which the normal direction of the main surface is along the vertical direction. The substrate holding portion 421 includes a plurality of lift pins (not shown). The plurality of lift pins move up and down between an upper position in which the tip of the lift pin protrudes from the upper surface of the substrate holding portion 421 and a lower position retracted below the upper surface. The transfer robot TR2 passes the two substrates to the plurality of lift pins protruding upward, and then retracts the two boards. The plurality of lift pins descend while supporting the two substrates, and the two substrates are placed on the upper surface of the substrate holding portion 421. As a result, the substrate holding portion 421 holds the two substrates W at the same interval as the interval between the two substrates W held by the transfer robot TR2. Regarding the above-mentioned lift pin and its elevating mechanism, for example, the technique described in Japanese Patent Application Laid-Open No. 2014-130868 may be applied to the present embodiment.

Hereinafter, the direction in which the two substrates W supported by the support portion of the interval adjusting portion 41 are lined up is also referred to as an arrangement direction D11, and the direction orthogonal to the arrangement direction D11 and horizontal is also referred to as a width direction D12. Further, the direction in which the two substrates W are lined up in the substrate holding portion 421 is also referred to as an arrangement direction D21, and the direction orthogonal to the arrangement direction D21 and horizontal is also referred to as a width direction D22. In the example of FIG. 24, the interval adjusting unit 41 and the resist coating device 42 are arranged so that the arrangement directions D11 and D21 are in the same direction.

As shown in FIG. 25, the nozzle 422 is a nozzle extending along the arrangement direction D21, and two discharge ports 42a and 42b for discharging the coating liquid are formed on the lower end surface of the nozzle 422. .. The two discharge ports 42a and 42b have a slit-like shape extending along the arrangement direction D21. The two discharge ports 42a and 42b are formed corresponding to the coating regions R1 and R2 (FIG. 24) on the surfaces of the two substrates W1 and W2, respectively. The coating areas R1 and R2 are areas to which the coating liquid is applied, and the coating areas R1 and R2 have a rectangular shape in a plan view. One side of the coating region R1 is parallel to one side of the substrate W1, and one side of the coating region R2 is parallel to one side of the substrate W2.

Both ends of the discharge port 42a face each other in the vertical direction in the arrangement direction D21 of the coating region R1 of the substrate W1. Therefore, the length of the discharge port 42a in the arrangement direction D21 is substantially equal to the length of the arrangement direction D21 of the coating region R1 of the substrate W1. Similarly, both ends of the discharge port 42b face each other in the vertical direction in the arrangement direction D21 of the coating region R2 of the substrate W2. Therefore, the length of the discharge port 42b in the arrangement direction D21 is substantially equal to the length of the arrangement direction D21 of the coating region R2 of the substrate W2. The distance between the coating region R1 of the substrate W1 and the coating region R2 of the substrate W2 is substantially equal to the distance between the discharge ports 42a and 42b.

Inside the nozzle 422, a flow path (not shown) for sending the coating liquid to the discharge ports 42a and 42b is formed. This flow path is connected to a coating liquid supply pipe (not shown). The coating liquid is applied from the discharge port via the coating liquid supply pipe and the flow path. This flow path spreads the coating liquid supplied from the coating liquid supply pipe in the arrangement direction D21, and discharges the coating liquid from the two discharge ports 42a and 42b to the substrates W1 and W2, respectively. The discharge of the coating liquid from the nozzle 422 is controlled by the control unit 60.

The nozzle 422 is supported by the nozzle holding portion 424. The nozzle holding portion 424 has a cross-linked structure that bridges both ends of the substrate holding portion 421 in the arrangement direction D21. That is, the nozzle holding portion 424 can straddle a set of two substrates W in the arrangement direction D21. The nozzle holding portion 424 includes a main body portion 4241 extending along the arrangement direction D21 and a pair of pillar portions 4242 that support both ends of the main body portion 4241. The nozzle 422 is fixed to the lower surface of the main body 4241. The pair of pillar portions 4242 are fixed to the substrate holding portion 421 so as to be movable along the width direction D22.

The nozzle moving mechanism 423 moves the nozzle 422 with respect to the substrate holding portion 421 along the width direction D22. Two nozzle moving mechanisms 423 are provided, for example, having a linear motor. The linear motor includes a mover 4231 and a stator 4232. The stator 4232 is fixed to both side surfaces of the substrate holding portion 421, and has a plurality of coils arranged along the width direction D22. The movers 4231 are respectively arranged to face the stator 4232 and have permanent magnets. Each of the movers 4231 is fixed to the pillar portion 4242. When a voltage is applied to the coil, the stator 4232 applies a moving magnetic field to the mover 4231. As a result, the mover 4231 moves along the width direction D22. As a result, the pillar portion 4242 fixed to the mover 4231 and the nozzle 422 fixed to the pillar portion 4242 via the main body portion 4241 move along the width direction D22 with respect to the substrate holding portion 421. .. The nozzle moving mechanism 423 (specifically, the voltage of the coil) is controlled by the control unit 60.

The nozzle 422 moves above the two substrates W1 and W2 held by the substrate holding portion 421 along the width direction D22. When the nozzle 422 faces one end of the coating region D22 of the two substrates W1 and W2, the control unit 60 starts supplying the coating liquid, and when the nozzle 422 faces the other end of the coating region. , The control unit 60 ends the supply of the coating liquid. In this way, the nozzle 422 moves along the width direction D22 while discharging the coating liquid to the two substrates W1 and W2, thereby forming a coating film on the coating regions R and R2 of the two substrates W1 and W2. can.

As described above, according to the resist coating apparatus 42, it is possible to simultaneously apply the two substrates W1 and W2 at the same time by moving the nozzle 422 once. Thereby, the throughput of the coating process can be improved. It can be said that the resist coating device 42 is a simultaneous processing unit that simultaneously processes N (two) substrates W.

Moreover, the interval adjusting unit 41 adjusts the interval between the two substrates W1 and W2 carried in from the cleaning apparatus 12 side to an interval suitable for the resist coating apparatus 42. Specifically, the distance between the substrates W1 and W2 is adjusted so that the distance between the coating region R1 of the substrate W1 and the coating region R2 of the substrate W2 matches the distance between the discharge ports 42a and 42b of the nozzle 422. As a result, the coating liquid can be applied to the coating regions R1 and R2 with high positional accuracy with respect to the substrates W1 and W2.

Further, according to the resist coating device 42, the nozzle 422 moves along the width direction D22. As a comparative example, it is assumed that a nozzle having a discharge port extending along the width direction D22 is moved with respect to the substrates W1 and W2 along the arrangement direction D21. In this case, the nozzle discharges the coating liquid during the period directly above the coating region R1, temporarily stops the discharge of the coating liquid during the period located between the coating regions R1 and R2, and is located directly above the coating region R2. Resume the discharge of the coating liquid during the period. However, once the discharge of the coating liquid is stopped, the coating liquid may remain unevenly in the vicinity of the discharge port of the nozzle. If the discharge of the coating liquid is restarted in this state, the accuracy of the film thickness of the coating film formed in the coating region R2 may deteriorate.

On the other hand, according to the resist coating device 42, the moving direction (width direction D22) of the nozzle 422 is orthogonal to the arrangement direction D21 in which the substrates W1 and W2 are arranged. Therefore, it is not necessary to interrupt the supply of the coating liquid from the nozzle 422. Therefore, such deterioration in film thickness accuracy can be avoided.

<2-3-2-3. Transfer robot TR3>
With reference to FIG. 24, the transfer robot TR3 is arranged on the side opposite to the transfer robot TR2 with respect to the resist coating device 42. The transfer robot TR3 collectively takes out the two substrates W that have been coated from the resist coating device 42. The structure of the transfer robot TR3 is the same as that of the transfer robot TR1. The resist coating device 42 lifts the two substrates W that have been coated by a plurality of lift pins above the upper surface of the substrate holding portion 421. The transfer robot TR3 collectively takes out two substrates W supported by a plurality of lift pins, and collectively delivers the two substrates W to the vacuum drying device 43. The two substrates W are placed on the transfer robot TR3 in a posture in which the normal direction of the main surface is along the vertical direction. Similar to the transfer robot TR1, this transfer robot TR3 also holds N (two) substrates W processed by the cleaning device 12 which is a flat flow processing unit in the upstream process side by side in one horizontal direction. , The plurality of substrates are collectively conveyed to the vacuum drying device 43, which is a simultaneous processing unit. As a result, the throughput of the transport process can be improved as compared with the case where the substrates W are transported one by one. The transfer robot TR3 may be a double-hand type transfer robot.

Further, the transfer robot TR3 collectively holds the two substrates W that have been subjected to the vacuum drying process side by side in one horizontal direction (D21 or D22), and collectively removes the two substrates W from the vacuum drying apparatus 43. It can be transported to the device on the downstream side (pre-baking device 15).

<2-3-2-4. Decompression drying device>
The vacuum drying device 43 includes, for example, a substrate holding unit and a suction device as described in Japanese Patent Application Laid-Open No. 2014-126263. The substrate holding unit collectively receives two substrates W from the transfer robot TR3 and holds them. The two substrates W are placed on the substrate holding portion in a posture in which the normal direction of the main surface is along the vertical direction. This substrate holding portion is configured so as not to collide with the hand of the transfer robot TR3. Also in this substrate holding portion, the two substrates W are held side by side in the horizontal direction, and the distance between the two substrates W is the same as the distance between the two substrates W in the transfer robot TR3. The substrate holding portion is arranged in the chamber, for example, and the suction device sucks the gas in the chamber to reduce the pressure in the chamber. Specifically, for example, the pressure in the chamber is reduced to the vapor pressure of the solvent of the coating liquid. As a result, the solvent of the coating liquid evaporates, and the coating film can be appropriately dried prior to the prebaking treatment by the prebaking device 15. That is, the vacuum drying process is performed.

In this vacuum drying device 43 as well, since the vacuum drying treatment is performed on the two substrates W at the same time at the same time, the vacuum drying treatment is performed as compared with the case where the substrate W is subjected to the vacuum drying treatment one by one. Throughput can be improved.

<2-4. Modification example of coating-related device 14 (FIG. 24)>
FIG. 26 is a diagram schematically showing the configuration of the coating-related device 14A, which is another example of the coating-related device 14. The coating-related device 14A includes an interval adjusting unit 41, a resist coating device 42A, a vacuum drying device 43, and transfer robots TR2 and TR3. That is, the coating-related device 14A has the same configuration as the coating-related device 14 except for the configuration of the resist coating device.

The resist coating device 42 described above has a configuration in which the nozzle 422 moves along the width direction D22, whereas in the resist coating device 42A, the two substrates W move along the width direction D22. Specifically, the resist coating device 42A includes a roller conveyor 423A, a transfer unit 424A, a pair of substrate chuck portions 425A, a levitation stage 421A, a nozzle 422A, and an advancing / retreating mechanism 426A. The resist coating device 42A is, for example, a substrate floating type coating device as described in Japanese Patent Application Laid-Open No. 2011-210985.

The roller conveyor 423A receives two substrates W1 and W2 from the transfer robot TR2. Also in this roller conveyor 423A, the substrates W1 and W2 are placed while maintaining the distance between the substrates W1 and W2 in the transfer robot TR2. The substrates W1 and W2 are placed in a posture in which the normal direction of the main surface is along the vertical direction. The roller conveyor 423A is a contact-type conveyor that gives propulsive force to the substrates W and moves them along the width direction D22 by contacting the uppermost portions of the outer peripheral surfaces of a plurality of rollers (not shown) with the lower surfaces of the two substrates W. be.

The transfer unit 424A is installed between the roller conveyor 423A and the levitation stage 421A. The transfer unit 424A includes a plurality of rollers and levitation pads (not shown). The levitation pad is a levitation mechanism that ejects compressed gas, for example, air to the lower surfaces of the substrates W1 and W2 to levitate the substrate W and supports the substrates W1 and W2 in a non-contact state. The levitation pad has a plurality of spouts formed on the upper surface thereof. This spout is connected to a gas supply unit (gas source) via a gas supply path. Gas from the gas supply unit is ejected from this spout.

A plurality of rollers of the transfer unit 424A are formed so as to be able to move up and down. The ascending position is a position where the uppermost portion of the outer peripheral surface of the plurality of rollers comes into contact with the lower surfaces of the two substrates W even during the injection of the compressed gas by the floating pad. Therefore, at this time, the plurality of rollers of the transfer unit 424A can also give propulsive force to the substrates W1 and W2 to move the substrates W1 and W2 along the width direction D22. The lowering position is a position where a plurality of rollers of the transfer unit 424A are separated from the substrates W1 and W2 during the injection of the compressed gas by the floating pad. That is, when the plurality of rollers are descending, the substrates W1 and W2 are supported by the compressed gas from the levitation pad.

The levitation stage 421A extends along the width direction D22. A plurality of spouts are formed on the upper surface of the levitation stage 421A (the surface on which the two substrates W are placed). This spout is connected to a gas supply unit (gas source) via a gas supply path formed inside the levitation stage 421A. The gas from the gas supply unit is ejected from the ejection port on the upper surface of the levitation stage 421A, whereby the substrates W1 and W2 are levitated from the upper surface of the levitation stage 421A. The substrate W is conveyed from the transfer unit 424A to the levitation stage 421A.

The board chuck portion 425A can hold each end face of the boards W1 and W2 in a state where a plurality of rollers of the transfer unit 424A are lowered and the boards W1 and W2 are floated. Specifically, the substrate chuck portion 425A holds the end face of the substrate W1 opposite to the substrate W2, and holds the end face of the substrate W2 opposite to the substrate W1. The substrate chuck portion 425A is formed so as to be able to move up and down, and when the substrate chuck portion 425A rises, it is attracted to the lower surfaces (end faces) of the substrates W1 and W2.

The advancing / retreating mechanism 426A moves the substrate chuck portion 425A along the width direction D22. For example, the advance / retreat mechanism 426A is a linear motor or the like. The board chuck portion 425A moves the boards W1 and W2 from the transfer unit 424A to the levitation stage 421A.

The nozzle 422A is provided above the substrates W1 and W2 in the middle of the movement path of the substrates W1 and W2. The nozzle 422A has the same configuration as the nozzle 422. That is, discharge ports 42a and 42b corresponding to the coating regions R1 and R2 of the substrates W1 and W2 are formed on the lower end surface of the nozzle 422A, respectively. Although the side surface of only the nozzle 422A is schematically shown in FIG. 26, the discharge ports 42a and 42b are actually formed on the lower surface of the nozzle 422A, so that they do not appear in a plan view.

The nozzle 422A is fixed to the levitation stage 421A by a nozzle holding portion similar to the nozzle holding portion 424 illustrated in FIG. 25.

The initial positions of the substrates W1 and W2 are positions that do not face the nozzle 422A in the vertical direction. The substrate chuck portion 425A moves the substrates W1 and W2 along the width direction D22, so that the substrates W1 and W2 move across the nozzle 422A. During the period when the coating areas R1 and R2 of the substrates W1 and W2 are directly below the nozzle 422A, the coating liquid is appropriately discharged to the substrates W1 and W2 from the discharge ports 42a and 42b of the nozzle 422A, respectively. As a result, a coating film is formed on the coating regions R1 and R2 of the substrates W1 and W2.

Then, the substrate chuck portion 425A is moved along the width direction D22 to a position where the substrates W1 and W2 do not face the nozzle 422A in the vertical direction. That is, the stop positions of the substrates W1 and W2 are located on the side opposite to the initial positions of the substrates W1 and W2 with respect to the nozzle 422A.

Even with such a resist coating device 42A, the coating process is simultaneously performed on the two substrates W at the same time by moving the two substrates W once. Therefore, the throughput of the coating process can be improved as compared with the case where the coating process is performed on the two substrates W one by one.

The transfer robot TR3 collectively takes out the two substrates W stopped at this stop position, holds them side by side in one horizontal direction (D21 or D22), and transfers the two substrates W to the decompression drying device 43. And pass it all at once. Further, the transfer robot TR3 holds the two substrates W after the vacuum drying process side by side in one horizontal direction (D21 or D22), and collectively removes the two substrates W from the vacuum drying apparatus 43. The substrate W is collectively passed to the device on the downstream side.

In the above example, each transfer robot transfers two substrates W at once, and each simultaneous processing device simultaneously processes two substrates W, but the transfer robot has three or more sheets. The substrates may be collectively conveyed, and the simultaneous processing apparatus may simultaneously process three or more substrates.

<3. Modification example of coating related equipment in the above supplement>
The coating-related device 14 (FIG. 24) is a simultaneous processing device (simultaneous processing unit), and by replacing the coating device BP (FIG. 24) possessed by the coating device 14 (FIG. 24) with the coating device BPv (FIG. 27), the flat flow processing device (flat flow processing device) (flat flow processing device). It can be a sink processing unit). Hereinafter, this modification will be described.

The coating device BPv includes a substrate introduction unit 21, a processing device main body 22, and a substrate standby unit 23. The board introduction unit 21 receives the board W. For example, two substrates W are collectively carried into the substrate introduction section 21. The processing device main body 22 sequentially receives the substrate W to be conveyed from the substrate introduction unit 21, and conveys the substrate W along the conveying direction. Here, the transport direction in the processing apparatus main body 22 is the X-axis direction, the upstream side in the transport direction is the −X side, and the downstream side in the transport direction is the + X side. The coating device BPv is an upstream processing unit located on the upstream side (−X side) of the vacuum drying device 43 (FIG. 24).

The processing apparatus main body 22 sequentially conveys the substrate W to the + X side, and sequentially applies the substrate W one by one. The substrate W after the coating process is sequentially conveyed from the processing apparatus main body 22 to the substrate standby unit 23. The substrate standby unit 23 sequentially receives the substrate W conveyed from the processing apparatus main body 22. The board standby unit 23 can make two boards W received in sequence stand by. The term "standby" as used herein means to stop at that position regardless of the length of the waiting time. The substrate W waiting in the substrate standby unit 23 is taken out by the transfer robot 4 and transferred to the decompression drying device 43 (FIG. 24) on the downstream side.

<3-1. Board introduction part>
FIG. 28 is a side view schematically showing an example of the configuration of the coating device BPv and the transfer robot 4. In the example of FIG. 28, the substrate introduction section 21 includes, for example, a roller conveyor. The roller conveyor includes a plurality of rotating shafts 211A, a plurality of rotating shafts 211B, a plurality of rollers 212A, and a plurality of rollers 212B. Each of the rotating shaft 211A and the rotating shaft 211B is provided so that its central axis is along the Y axis. The plurality of rotating shafts 211A are arranged at intervals in the X-axis direction, and the plurality of rotating shafts 211B are arranged at intervals in the X-axis direction on the downstream side of the plurality of rotating shafts 211A. Further, the rotating shaft 211A and the rotating shaft 211B are provided at substantially the same height position as each other. Each of the rotating shaft 211A and the rotating shaft 211B can rotate with its own central axis as the rotating shaft.

A plurality of rollers 212A are provided on the outer peripheral surface of each rotating shaft 211A, and a plurality of rollers 212B are provided on the outer peripheral surface of each rotating shaft 211B. The rollers 212A and 212B have an annular shape, and the central axis thereof is provided in a posture along the Y axis.

The substrate W is placed on the plurality of rollers 212A and the plurality of rollers 212B. That is, the uppermost portion of the outer peripheral surface of the plurality of rollers 212A contacts the lower surface of the substrate W, and the uppermost portion of the outer peripheral surface of the plurality of rollers 212B contacts the lower surface of the substrate W.

The plurality of rotation shafts 211A are driven by a drive unit (not shown) and rotate (synchronously rotate) in the same predetermined direction at substantially equal rotation speeds. Due to this rotation, the plurality of rollers 212A also rotate in the same direction at substantially equal rotation speeds. The drive unit has a motor and is controlled by the control unit 60. Due to the rotation of the roller 212A, the substrate W placed on the roller 212A is conveyed to the + X side. The plurality of rotation shafts 211B are also driven by a drive unit (not shown) to rotate synchronously. As a result, the substrate W placed on the roller 212B is conveyed to the + X side. The rotating shaft 211A and the rotating shaft 211B are controlled independently of each other.

One substrate W may be placed on each of the rollers 212A and 212B. For example, two substrates W from the device on the upstream side may be placed on the rollers 212A and 212B, respectively. In this state, the control unit 60 synchronously rotates only the rotation shaft 211B. As a result, the substrate W on the roller 212B can be conveyed to the processing apparatus main body 22. Next, the control unit 60 synchronously rotates both the rotating shaft 211A and the rotating shaft 211B. As a result, the substrate W on the roller 212A can be conveyed to the processing apparatus main body 22.

<3-2. Overview of the main body of the processing device>
The processing apparatus main body 22 sequentially conveys the substrate W and sequentially performs a coating process on the substrate W. In the examples of FIGS. 27 and 28, the processing apparatus main body 22 includes a transfer unit 221, a levitation stage 222, a substrate transfer unit 223, and a nozzle 224.

The transfer unit 221 is a unit that conveys the substrate W conveyed from the substrate introduction unit 21 to the levitation stage 222, and is a unit that converts the transfer method. That is, while the substrate introduction unit 21 conveys the substrate W by the roller transfer method, the levitation stage 222 described later conveys the substrate W by the levitation transfer method, so that the transfer unit 221 transfers the substrate W between them. Convert the transport method.

A plurality of spouts are provided on the upper surface of the levitation stage 222, and gas is ejected from these spouts. Therefore, in the levitation stage 222, the substrate W is given buoyancy by this gas.

The substrate transfer unit 223 transfers the substrate W from the transfer unit 221 to the substrate standby unit 23 via the levitation stage 222 while holding both end portions of the substrate W in the Y-axis direction. Since the substrate transport portion 223 holds only both end portions of the substrate W, the substrate W can bend near the center thereof. However, the levitation stage 222 ejects gas from the ejection port to the lower surface of the substrate W to give buoyancy to the substrate W. Thereby, the bending of the substrate W can be suppressed. Therefore, the substrate W can pass through the levitation stage 222 in a horizontal posture.

The nozzle 224 is provided in the space above the levitation stage 222. The substrate transport unit 223 moves the substrate W to the + X side above the levitation stage 222, so that the substrate W crosses directly under the nozzle 224. The nozzle 224 applies the coating liquid to the substrate W immediately below the nozzle 224. As a result, a coating film can be formed on the substrate W. The nozzle 224 may be configured to be movable between the processing position and the standby position. The processing position is a position where the nozzle 224 discharges the coating liquid to the substrate W, and the standby position is a position where the nozzle 224 is made to stand by. At the standby position, a mechanism for cleaning the discharge port of the nozzle 224 may be provided.

The substrate W on which the coating film is formed is conveyed to the substrate standby portion 23 by the substrate transport portion 223. The substrate transport unit 223 releases the holding of the substrate W at the substrate standby unit 23. After that, the substrate transport unit 223 returns to the transfer unit 221 again and holds the next substrate W.

<3-2-1. Transfer unit>
In the example of FIG. 28, the transfer unit 221 includes a plurality of rollers 2211, an inlet levitation stage 2212, and a plurality of lift pins 2213. The plurality of rollers 2211 have the same configuration as the rollers of the substrate introduction portion 21, and are arranged at intervals in the X-axis direction. The rotation of the roller 2211 is controlled by the control unit 60. The roller 2211 receives the substrate W conveyed from the substrate introduction unit 21 by its own rotation and conveys it to the + X side.

The entrance levitation stage 2212 is provided on the downstream side (+ X side) of the plurality of rollers 2211. A plurality of spouts (not shown) are formed on the upper surface of the inlet levitation stage 2212. The spouts are arranged in a plan view (ie, along the Z-axis direction), for example, in a matrix. Each spout is connected to a gas supply source (not shown) via a gas supply path formed inside the inlet levitation stage 2212. Gas from the gas source is ejected from this spout. As a result, buoyancy can be applied to the substrate W on the inlet levitation stage 2212.

The plurality of lift pins 2213 have a rod-like shape extending along the Z-axis direction, and are provided so as to be able to move up and down. Some of the plurality of lift pins 2213 are provided corresponding to the rollers 2211, and the rest are provided corresponding to the entrance levitation stage 2212. The lift pin 2213 corresponding to the roller 2211 is provided in a gap between the plurality of rollers 2211. The inlet levitation stage 2212 is formed with a plurality of through holes so as not to interfere with any of the plurality of spouts. This through hole penetrates the inlet levitation stage 2212 in the Z-axis direction. The remaining lift pins 2213 are respectively arranged through the through holes. As illustrated in FIG. 28, the plurality of lift pins 2213 may be connected to each other at the base end portion on the −Z side.

The lift pin 2213 is lifted and lowered by the lifting mechanism 2214. The elevating mechanism 2214 is, for example, an air cylinder, and is controlled by a control unit 60.

When the lift pin 2213 is lowered, the tip of the lift pin 2213 on the + Z side is located on the −Z side with respect to both the uppermost portion of the outer peripheral surface of the roller 2211 and the upper surface of the inlet levitation stage 2212. When the lift pin 2213 is raised, its tip is located on the + Z side of either the uppermost portion of the roller 2211 or the upper surface of the inlet levitation stage 2212, and the substrate W can be lifted by contacting the lower surface of the substrate W. can. The substrate W is held by the substrate transport unit 223 in a state of being lifted by the lift pin 2213.

<3-2-2. Ascending stage ＞
The levitation stage 222 is provided on the + X side of the entrance levitation stage 2212. A plurality of spouts (not shown) are also formed on the upper surface of the levitation stage 222. The spouts are arranged in a matrix, for example, in a plan view. Each spout is connected to a gas supply source via a gas supply path formed inside the levitation stage 222. Gas from the gas source is ejected from this spout.

A plurality of suction ports may be formed on the upper surface of the levitation stage 222. The suction ports are formed at positions different from the spouts, and are arranged in a matrix, for example. Each suction port is connected to a suction device (for example, a pump) via a gas suction path formed inside the levitation stage 222. A part of the gas ejected from the ejection port of the levitation stage 222 is sucked from the suction port. According to this, the buoyancy applied to the substrate W can be controlled more precisely. As a result, the bending of the substrate W can be further reduced.

<3-2-3. Board carrier>
In the example of FIG. 27, the substrate transport portion 223 includes a substrate chuck portion 2231 and an advancing / retreating mechanism 2232. The substrate chuck portion 2231 holds the end faces of the substrate W on both sides in the Y-axis direction. In the example of FIG. 27, a pair of substrate chuck portions 2231 are provided on both sides in the Y-axis direction with respect to the substrate W. The pair of substrate chuck portions 2231 are provided at intervals in the X-axis direction. Each substrate chuck portion 2231 has a support portion that supports an end portion of the lower surface of the substrate W in the Y-axis direction. For example, a suction port is formed on the upper surface of the support portion, and the suction port is connected to a suction device (for example, a pump) via a suction path inside the support portion. By sucking the gas from the suction port, the substrate chuck portion 2231 can suck and hold the substrate W.

The advancing / retreating mechanism 2232 moves the substrate chuck portion 2231 along the X-axis direction. For example, the advancing / retreating mechanism 2232 of the substrate W is a linear motor or the like. The advancing / retreating mechanism 2232 is controlled by the control unit 60. The advancing / retreating mechanism 2232 moves the substrate chuck portion 2231 from the transfer unit 221 to the substrate standby portion 23 via the levitation stage 222. As a result, the substrate W held by the substrate chuck portion 2231 also moves from the transfer unit 221 to the substrate standby portion 23 via the levitation stage 222.

<3-2-4. Nozzle ＞
The nozzle 224 is provided in the space above the levitation stage 222. At the lower end of the nozzle 224, a discharge port corresponding to the coating region R1 of the substrate W is formed. The nozzle 224 is a long nozzle whose discharge port is long in the Y-axis direction. The length of the discharge port (length along the Y-axis direction) substantially coincides with the length of the coating region R1 (length along the Y-axis direction).

Each of the nozzles 224 is connected to the coating liquid supply source via a coating liquid supply pipe (not shown). A pump (not shown) is provided in the middle of the coating liquid supply pipe, and by driving and controlling this pump, the discharge / stop of the coating liquid from the nozzle 224 can be switched. The pump is controlled by the control unit 60.

When the substrate transport unit 223 moves the substrate W to the + X side, the substrate W crosses directly under the nozzle 224. The nozzle 224 discharges the coating liquid when the substrate W crosses. Specifically, the nozzle 224 starts discharging the coating liquid when the + X side end of the coating region R1 of the substrate W is located directly below the nozzle 224, and the −X side end of the coating region R1 is the nozzle 224. Discharge of the coating liquid ends when it is located directly below. As a result, the coating liquid is applied to the coating region R1 and a coating film is formed on the coating region R1.

The nozzle 224 may be capable of discharging a plurality of types of coating liquids onto the substrate W. More specifically, a plurality of nozzles 224 corresponding to each of a plurality of types of coating liquids may be provided. As the plurality of types of coating liquids, for example, a coating liquid for a photoresist and a coating liquid for an insulating film can be adopted.

<3-3. Board standby part>
The substrate standby unit 23 sequentially receives the substrate W processed by the processing apparatus main body 22. The board standby unit 23 can make two boards W stand by. The substrate standby unit 23 includes a first standby unit 231 and a second standby unit 232. The first standby unit 231 can make one substrate W stand by, and the second standby unit 232 can make one substrate W stand by.

In the examples of FIGS. 27 and 28, the first standby unit 231 and the second standby unit 232 are arranged along the transport direction (that is, the X-axis direction) of the processing device main body 22. More specifically, the first standby unit 231 is provided on the + X side of the processing device main body 22, and the second standby unit 232 is provided between the processing device main body 22 and the first standby unit 231. The second standby unit 232 also has a function of transporting the substrate W transported from the processing device main body 22 to the first standby unit 231.

One substrate W (hereinafter, referred to as a first substrate W1) processed in the processing apparatus main body 22 is conveyed to the first standby unit 231 via the second standby unit 232 by the substrate transfer unit 223. The first standby unit 231 can make the first substrate W1 stand by. The second substrate W2 processed next to the first substrate W1 in the processing apparatus main body 22 is transported to the second standby unit 232 by the substrate transport unit 223. The second standby unit 232 can make the second substrate W2 stand by.

As a more specific example, the substrate standby unit 23 includes an outlet levitation stage 233, a first ascending mechanism 234, and a second ascending mechanism 235. The exit levitation stage 233 is provided on the + X side of the levitation stage 222. Similar to the inlet levitation stage 2212, a plurality of spouts for ejecting gas are also formed on the upper surface of the outlet levitation stage 233. The length of the outlet levitation stage 233 (the length along the X-axis direction) is set to be longer than the total length of the two substrates W (the length along the X-axis direction).

The first substrate W1 is conveyed to the downstream portion of the outlet levitation stage 233. The first raising mechanism 234 raises the first substrate W1 located in the downstream portion. The first ascending mechanism 234 is controlled by the control unit 60. In the example of FIG. 28, the first lifting mechanism 234 includes a plurality of lift pins 2341 and a lifting mechanism 2342. Each lift pin 2341 has a rod-like shape, and is provided in a posture in which the longitudinal direction thereof is along the Z axis. As illustrated in FIG. 28, the base ends of the lift pins 2341 on the −Z side may be connected to each other. The outlet levitation stage 233 is formed with a plurality of through holes extending in the Z-axis direction so as not to interfere with any of the plurality of spouts. The lift pins 2341 are arranged through the through holes of the outlet levitation stage 233, respectively.

The elevating mechanism 2342 is, for example, an air cylinder, which elevates and elevates a plurality of lift pins 2341. The elevating mechanism 2342 is controlled by the control unit 60. When the lift pin 2341 is lowered, the tip of the lift pin 2341 is located on the −Z side with respect to the upper surface of the outlet levitation stage 233. On the other hand, when the lift pin 2341 is raised, the tip of the lift pin 2341 is located on the + Z side with respect to the upper surface of the outlet levitation stage 233. The elevating mechanism 2342 raises the lift pin 2341 in a state where the adsorption of the first substrate W1 by the substrate chuck portion 2231 is released. Due to this rise, the tip end portion of the lift pin 2341 comes into contact with the lower surface of the first substrate W1 and the first substrate W1 can be lifted. The lift pin 2341 may raise the first substrate W1 to a height position where the gas ejected from the outlet levitation stage 233 does not substantially reach. As a result, the first substrate W1 is supported by the lift pin 2341.

In the example of FIG. 28, the first standby unit 231 that makes the first substrate W1 stand by is composed of a downstream portion of the outlet levitation stage 233 and a first ascending mechanism 234.

The second substrate W2 to be processed next to the first substrate W1 is conveyed to the upstream portion of the outlet levitation stage 233. The upstream portion of the exit levitation stage 233 is located on the −X side with respect to the downstream portion. The second raising mechanism 235 raises the second substrate W2 located in the upstream portion. The second ascending mechanism 235 is controlled by the control unit 60 independently of the first ascending mechanism 234. In the example of FIG. 28, the second lifting mechanism 235 includes a plurality of lift pins 2351 and a lifting mechanism 2352. Since the lift pin 2351 and the elevating mechanism 2352 are the same as the lift pin 2341 and the elevating mechanism 2342, respectively, detailed description thereof will be omitted.

Like the elevating mechanism 2342, the elevating mechanism 2352 raises the lift pin 2351 in a state where the suction of the second substrate W2 by the substrate chuck portion 2231 is released. Due to this rise, the tip of the lift pin 2351 comes into contact with the lower surface of the second substrate W2, and the second substrate W2 can be lifted. The second substrate W2 is supported by a lift pin 2351.

In the example of FIG. 28, the second standby unit 232 that makes the second substrate W2 stand by is composed of an upstream portion of the outlet levitation stage 233 and a second ascending mechanism 235.

As described above, since the first ascending mechanism 234 and the second ascending mechanism 235 are driven independently of each other, it is possible to raise only the first substrate W1 or only the second substrate W2. Both the substrate W1 and the second substrate W2 can be raised.

The first substrate W1 and the second substrate W2 are taken out by the transfer robot 4 in a state of being supported by the lift pin 2341 and the lift pin 2351, respectively.

Although the present invention has been described in detail, the above description is exemplary in all aspects and the invention is not limited thereto. It is understood that innumerable variations not illustrated can be assumed without departing from the scope of the present invention. The configurations described in the above embodiments and the modifications can be appropriately combined or omitted as long as they do not conflict with each other.

G1: Waiting place (first waiting place)
G2: Waiting place (second waiting place)
LM: Alignment unit PC1: Simultaneous processing unit PC2: Simultaneous processing unit PF1: Flat flow processing unit (first flat flow processing unit)
PF2: Flat flow processing unit (second flat flow processing unit)
SD: Board storage (board standby)
SY1 to SY3: Substrate processing system TR1: Transfer robot (first substrate transfer unit)
TR2: Transfer robot (second board transfer unit)
W: Board WD: Dummy board WP: Product board

Claims (11)

A substrate processing system for processing a plurality of substrates including a plurality of product substrates.
A first flat flow processing unit that sequentially transports the plurality of product substrates along the transport direction and processes the plurality of product substrates one by one.
A simultaneous processing unit that simultaneously processes N sheets (N ≧ 2) of the plurality of substrates, and a simultaneous processing unit.
A substrate standby unit for waiting at least one dummy substrate to be processed as a part of the plurality of substrates in the simultaneous processing unit, and a substrate standby unit.
A first substrate transporting unit capable of collectively transporting up to N of the plurality of substrates to the simultaneous processing unit while holding them horizontally side by side.
With
The first substrate transport section is
A simple mode in which N sheets of the product substrates from the first flat flow processing unit are collectively carried into the simultaneous processing unit, and a simple mode.
The simultaneous processing unit combines the product substrate of P sheets (1 ≦ P <N) from the first flat flow processing unit and the dummy substrate of D sheets (1 ≦ D ≦ N−P) from the substrate standby unit. In the mixed loading mode, which is carried in all at once,
A board processing system that is configured to work with. The substrate processing system according to claim 1.
A control unit for separately managing the plurality of product boards in a plurality of sets each having a maximum number of N sheets is further provided.
The first substrate transport section transports the plurality of sets one by one from the first flat flow processing section to the simultaneous processing section.
When the set of the plurality of product boards has N sheets, the control unit operates the first substrate transport unit in the simple mode, and the set of the plurality of product boards is one. When the number of sheets is less than N, the first substrate transport unit is operated in the mixed loading mode.
Board processing system. The substrate processing system according to claim 1 or 2, wherein D = NP is satisfied. The substrate processing system according to any one of claims 1 to 3.
The first substrate transport unit carries out the substrate processed by the simultaneous processing unit, and transports the dummy substrate among the substrates carried out from the simultaneous processing unit to the substrate standby unit. Processing system. The substrate processing system according to any one of claims 1 to 3.
A second substrate transport unit that carries out the substrate processed by the simultaneous processing unit, and
Among the substrates processed by the simultaneous processing unit, a substrate delivery unit that receives the dummy substrate from the second substrate transport unit, and a substrate delivery unit.
A board processing system further equipped with. The substrate processing system according to claim 5.
The first substrate transporting unit is a substrate processing system that transports the dummy substrate from the substrate delivery portion to the substrate standby portion. The substrate processing system according to any one of claims 1 to 6, wherein the substrate standby portion has an aligning portion for aligning the dummy substrates. The substrate processing system according to any one of claims 1 to 7, wherein the first flat flow processing unit is configured to be able to control the number of product substrates to be delivered to the first substrate transport unit. There is a board processing system. The substrate processing system according to any one of claims 1 to 8, further comprising a second flat flow processing unit for further processing the product substrate processed by the simultaneous processing unit, and the second flat flow processing unit. The flat flow processing unit is a substrate processing system configured to accept the product substrate and expel the dummy substrate among the plurality of substrates carried into the second flat flow processing unit. The substrate processing system according to any one of claims 1 to 9, wherein the at least one dummy substrate is a plurality of dummy substrates including a first dummy substrate and a second dummy substrate, and the substrate standby unit. Includes a first standby place for the first dummy board to stand by and a second standby place for the second dummy board to stand by, and the second standby place is located above the first standby place. , Substrate processing system. It is a substrate processing method for processing a plurality of product substrates.
(A) A step of sequentially transporting the plurality of product substrates along the transport direction by the flat flow processing unit, and processing the plurality of product substrates one by one.
(B1) A step of simultaneously processing the N product substrates processed in the step (a) by the simultaneous processing unit, and
(B2) A step of simultaneously processing the P sheets (1 ≦ P <N) of the product substrate and the dummy substrate processed in the step (a) by the simultaneous processing unit.
A substrate processing method, wherein each of the plurality of product substrates is processed through one of the steps (b1) and the step (b2).

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