JP2003007670A - Substrate processing apparatus and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and method which can collect a substrate, without damaging the surface of the substrate. SOLUTION: A cleaning system 1 includes wafer transfer devices 13 and 15, a sensor for detecting wafer present within the system 1, a memory 74 for storing information on the wafer present within the system 1 at turning off of the power of the system 1, a device controller 71 for controlling the transfer devices 13 and 15 to collect the wafer present within the system 1 outside of the system, and a collection starter 77 for issuing a command to the device controller 71 to cause the devices 13 and 15 to start the collection of the wafer. Information, detected by the wafer detection sensor at the time of starting the power turning on of the system 1 is collated with wafer information extracted from the memory 74, and after it is confirmed that the wafer within the system 1 is collected with their being set to face a predetermined direction, a collection command has been issued from the collection starter 77 to the device controller 71.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a semiconductor wafer and L
The present invention relates to a substrate processing apparatus and a substrate processing method for performing a predetermined process such as a liquid process or a thermal process after the liquid process on a substrate such as a CD substrate.

[0002]

2. Description of the Related Art For example, in a semiconductor device manufacturing process, it is necessary to maintain high cleanliness of the surface of a semiconductor wafer on which semiconductor devices are formed. For this reason, the surface of the wafer is cleaned before and after various manufacturing processes. Particularly in the photolithography process, cleaning of the front and back surfaces of the wafer is essential. Therefore, conventionally, for example, a brush that rotates while supplying a cleaning liquid to the upper surface of a wafer that is placed on a substantially horizontal surface and rotates in-plane is brought into contact with the upper surface of the wafer. Scrub cleaning is performed to remove contaminants such as particles adhering to the upper surface of the wafer by reciprocating between them.

The loading and unloading of wafers to and from the cleaning apparatus for carrying out such scrubbing is carried out by using a container capable of accommodating a plurality of wafers in a substantially horizontal posture in the vertical direction at regular intervals. In order to distinguish the front surface and the back surface of the wafer, the wafers housed in the container are housed so that the front surface of the wafer is the upper surface (hereinafter, such a state is referred to as “frontward”).

In such a cleaning processing apparatus, a wafer is first taken out from a predetermined slot of a container and carried into the apparatus. After that, the wafer is inverted at a predetermined timing according to the recipe, and the cleaning processing of the front and back surfaces of the wafer and the drying processing after the cleaning processing are performed. Such various processes are performed while recognizing whether the front surface or the back surface of the wafer is the upper surface. Finally, the processed wafer is returned to the original slot of the container with the wafer facing up. In normal operation, all the wafers contained in the container are returned to the original slots of the original container after the processing is completed, and the whole process is completed.

However, for example, in the case where the cleaning processing apparatus is shut down due to a natural disaster such as an earthquake or a strong wind during the processing or a human error, the cleaning processing apparatus is shut down. The process cannot be completed on the wafer. In this case, when the cleaning processing apparatus is activated again, all the wafers existing in the cleaning processing apparatus must be collected. Such a wafer recovery can be performed without distinguishing the front surface and the back surface of the wafer.
It was done by collecting in an empty slot in the container.

[0006]

However, when the wafer is accommodated in the container with the back surface facing upward (hereinafter, such a condition is referred to as "reverse direction"), the wafer provided in the container is held. The shelf plate and the wafer surface rub against each other. In this case, the wafer is damaged and becomes unusable. In addition, when starting the reprocessing of the wafer, it is necessary for the operator to visually check the state of the substrates collected in the container and align the wafers face up.
In this case, the burden on the operator increases and the productivity also decreases. Further, since the operator manually handles the wafer, the wafer may be damaged due to removal or the like.

The present invention has been made in view of the above circumstances, and provides a substrate processing apparatus and a substrate processing method capable of recovering a substrate existing in the apparatus while avoiding damage to the surface of the substrate. The purpose is to provide. Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method that reduce the burden on the operator. Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method that facilitate recovery of a substrate existing in the apparatus and restart of a predetermined processing on the substrate.

[0008]

That is, the first aspect of the present invention
From the viewpoint of, the apparatus main body that performs a predetermined process on the substrate and inverts the substrate therein, the substrate transfer unit that transfers the substrate in the apparatus main body, and the apparatus main body exist in the apparatus main body. A board detecting means for detecting a board to be stored, and information regarding the position and orientation of the board existing in the apparatus body when the apparatus body is powered off, and stored when the apparatus body is powered on next. The storage means for retrieving the stored information and the detection information detected by the substrate detection means when the apparatus main body is powered on are collated with the information retrieved from the storage means, and there is a difference in these information. If there is a warning, a warning means for issuing a warning, a warning canceling means for canceling the warning, and a control for controlling the board transfer means so as to collect the board existing in the apparatus body to a predetermined position outside the apparatus body. Means and a recovery start means for issuing a command to the control means to start substrate recovery, the alarm is canceled by the alarm canceling means, and the substrate in the apparatus main body is recovered in a predetermined direction. After it is confirmed that the recovery start means issues a substrate recovery command to the control means, a substrate processing apparatus is provided.

According to a second aspect of the present invention, an apparatus main body for performing a predetermined process on the substrate and inverting the substrate therein, and a substrate transfer means for transferring the substrate in the apparatus main body. And storage means for storing information relating to the position and orientation of a substrate existing in the apparatus body when the apparatus body is powered off, and for retrieving the stored information when the apparatus body is powered on next. An information manipulating means for manipulating the information retrieved from the storing means when the apparatus body is powered on; and a board at a predetermined position outside the apparatus body based on the board information obtained by the information manipulating means. Control means for controlling the substrate transfer means so as to recover the substrate, and recovery start means for issuing a command to the control means to start substrate recovery, and the substrate in the apparatus main body is recovered in a predetermined direction. The recovered starting means after Rukoto is confirmed substrate processing apparatus characterized by issuing a command for collecting the substrate to the control means, is provided.

According to a third aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, and a container loading / unloading section for loading / unloading a container capable of storing a plurality of substrates at predetermined intervals.
A substrate processing unit having a liquid processing unit for performing a predetermined liquid processing on the front surface or the back surface of the substrate and a reversing unit for reversing the substrate, and a substrate for transporting the substrate between the container loading / unloading unit and the substrate processing unit. An apparatus main body having a transfer section; a first substrate transfer apparatus that transfers a substrate in the substrate processing section; a second substrate transfer apparatus that transfers a substrate in the substrate transfer section; Board detecting means for detecting a board existing in the device main body, and information about the position and orientation of the board existing in the apparatus main body when the power supply of the apparatus main body is cut off, and then when the power is turned on to the apparatus main body. The storage means for extracting the stored information is collated with the detection information detected by the substrate detection means when the apparatus main body is powered on, and the information retrieved from the storage means is collated. When there is a difference between the information, an alarm means for issuing an alarm, an alarm canceling means for canceling the alarm, and a substrate existing in the apparatus main body are collected in a container placed in the container loading / unloading section. And a recovery start means for issuing a command to the control means to start substrate recovery, and an alarm is issued by the alarm release means. And the substrate in the apparatus main body is confirmed to be collected in a predetermined direction, the collecting start means issues a substrate collecting command to the control means. , Are provided.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, which is a container loading / unloading unit for loading / unloading a container capable of storing a plurality of substrates at predetermined intervals.
A substrate processing unit having a liquid processing unit for performing a predetermined liquid processing on the front surface or the back surface of the substrate and a reversing unit for reversing the substrate, and a substrate for transporting the substrate between the container loading / unloading unit and the substrate processing unit. An apparatus main body having a transfer section; a first substrate transfer apparatus for transferring a substrate in the substrate processing section; a second substrate transfer apparatus for transferring a substrate in the substrate transfer section; Storage means for storing information regarding the position and orientation of the substrate existing in the apparatus main body when the power is turned off, and the stored information being taken out when the power is turned on next to the apparatus main body; Information operating means for operating information retrieved from the storage means when power is turned on, and a board existing in the apparatus main body based on board information obtained by the information operating means. Serial container unloading the first substrate transport device to recover to the placed container portion and the second
And a recovery start means for issuing a command to the control means to start substrate recovery, and the substrate existing in the apparatus main body can be recovered in a predetermined direction. After the confirmation, the recovery start means issues a substrate recovery command to the control means, and a substrate processing apparatus is provided.

According to a fifth aspect of the present invention, there is provided a substrate processing method in a substrate processing apparatus comprising substrate transfer means for performing a predetermined process on a front surface and a back surface of a substrate and transferring the substrate therein. A step of storing information on the position and orientation of a substrate existing in the substrate processing apparatus in a memory when the substrate processing apparatus is powered off, and when the substrate processing apparatus is first powered on after the storing step. A step of retrieving the information stored in the memory, a step of correcting the information retrieved in the retrieving step to match an actual substrate state in the substrate processing apparatus, and determining the substrate information; The substrate existing in the substrate processing apparatus is carried out to a predetermined position outside the substrate processing apparatus by the substrate transfer means in a predetermined direction based on the substrate information determined in the process. That the substrate processing method and a step, and is provided.

According to a sixth aspect of the present invention, there is provided a substrate processing method in a substrate processing apparatus including substrate transfer means for performing a predetermined process on a front surface and a back surface of a substrate and transferring the substrate therein. A step of storing information about the position and orientation of the substrate existing in the substrate processing apparatus in the memory when the substrate processing apparatus is powered off, and when the substrate processing apparatus is first powered on after the storing step, A step of taking out the information stored in the memory and detecting a substrate existing in the substrate processing apparatus; a step of detecting the information retrieved from the memory and the substrate detected in the substrate processing apparatus in the detecting step; By collating with the position information, if there is no difference in these information, the substrate information is determined, and the substrate existing in the substrate processing apparatus is transferred to the substrate transfer means based on the substrate information. Ri substrate processing method characterized by having the steps of unloading a predetermined position outside the substrate processing apparatus in a predetermined orientation, is provided.

According to a seventh aspect of the present invention, there is provided a substrate processing method in a substrate processing apparatus comprising substrate transfer means for performing a predetermined process on a front surface and a back surface of a substrate and transferring the substrate therein. A step of storing information about the position and orientation of the substrate existing in the substrate processing apparatus in the memory when the substrate processing apparatus is powered off, and when the substrate processing apparatus is first powered on after the storing step, A step of taking out the information stored in the memory and detecting a substrate existing in the substrate processing apparatus; and a step of detecting the information retrieved from the memory and the positional information of the substrate detected in the substrate processing apparatus. The step of collating and issuing an alarm when there is a difference or an unclear point in these information, and the operator confirms the substrate information indicating the actual substrate state in the substrate processing apparatus. A step of releasing the alarm and a step of unloading the substrate existing in the substrate processing apparatus to a predetermined position outside the substrate processing apparatus by the substrate transfer means based on the substrate information determined in the releasing step. When,
A substrate processing method, comprising:

According to an eighth aspect of the present invention, an apparatus main body for performing a predetermined process on the substrate and inverting the substrate therein, and a substrate transfer means for transferring the substrate in the apparatus main body. A substrate detecting means for detecting a substrate existing in the apparatus body; and a substrate detecting means for detecting the substrate in the apparatus body when the apparatus body is powered on. It is provided in the apparatus main body, comprising control means for determining the operation of the substrate transfer means for collecting at a predetermined position outside the main body, and recovery start means for sending a command for starting the substrate recovery to the control means. A substrate processing apparatus, characterized in that, after it is confirmed that the substrate is recovered in a predetermined direction, the recovery start means issues a command for recovering the substrate to the control means.

According to a ninth aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, which is a container loading / unloading unit for loading / unloading a container capable of storing a plurality of substrates at predetermined intervals.
A substrate processing unit having a liquid processing unit for performing a predetermined liquid processing on the front surface or the back surface of the substrate and a reversing unit for reversing the substrate so that the front surface or the back surface of the substrate becomes the upper surface of the substrate; and the container loading / unloading unit. An apparatus main body having a substrate transfer unit that transfers a substrate to and from the substrate processing unit, a first substrate transfer device that transfers a substrate in the substrate processing unit, and a substrate transfer in the substrate transfer unit. A second substrate carrying device for performing, a substrate detecting means for detecting a substrate existing in the apparatus body, and the substrate detecting means for detecting the substrate in the apparatus body when the apparatus body is powered on. In this case, the control means for determining the operation of the first substrate transfer device and the second substrate transfer device for recovering the substrate into the container placed in the container loading / unloading part, and the control means. Recovery start means for sending a command to start plate recovery, and after it is confirmed that the substrate in the substrate processing section is recovered in a predetermined direction, the recovery start means instructs the control means to recover the substrate. Is provided.

According to the substrate processing apparatus and the substrate processing method of the present invention, the position of the substrate existing in the substrate processing apparatus when the substrate processing apparatus is powered off and then restarted for the first time, The direction can be easily grasped. Thereby, the operator can easily distinguish the front surface and the back surface of the substrate and perform the operation according to the predetermined processing procedure to easily collect the substrate with the orientation thereof aligned. Also, automatic collection can be performed. In this way, damage to the substrate is prevented and the burden on the operator is reduced. Further, it is possible to prevent the occurrence of the removal of the substrate when the operator directly handles the substrate.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the substrate processing apparatus of the present invention will be described below with reference to the accompanying drawings. In the present embodiment, a case will be described where the present invention is applied to a cleaning processing system configured to consistently carry, clean and dry semiconductor wafers (wafers).

FIG. 1 is a plan view showing a schematic structure of the cleaning processing system 1, and FIG. 2 is a side view thereof. These Figure 1
And as shown in FIG. 2, the cleaning treatment system 1 is
A substrate cleaning processing unit 3 that performs cleaning processing on the wafer W and thermal processing after the cleaning processing, and a plurality of, for example, 25 wafers W
Is a container (F
IN / OUT port 4 provided with a mounting table 11 for mounting an OUP F (Front Opening Unified Pod)
And a wafer transfer device (C which transfers wafers between the FOUP F mounted on the mounting table 11 and the substrate cleaning processing unit 3).
RA) 13 is included in the wafer transfer section 5. The main body of the cleaning processing system 1 is composed of a substrate cleaning processing unit 3 and a wafer transfer unit 5.

The loading / unloading of the wafer W to / from the FOUP F is performed through the loading / unloading port provided on one side surface of the FOUP F.
The hoop F is provided with a lid that opens and closes the loading / unloading port. A shelf plate for holding the wafer W in the vertical direction at regular intervals is provided on the inner wall of the hoop F, and slots 1 to 25 for accommodating the wafer W are formed.
The wafer W is in a state where the surface of the wafer W (referred to as a surface on which a semiconductor device is formed) is an upper surface (referred to as an upper surface when the wafer W is held horizontally). One (one) is accommodated in each slot in the (face-up state).

On the mounting table 11 of the in / out port 4, for example, three hoops F can be mounted side by side in the Y direction of the horizontal plane. The hoop F is placed with the side surface provided with the loading / unloading port facing the boundary wall 91 side between the in / out port 4 and the wafer transfer section 5.
A window 92 is formed on the boundary wall 91 at a position corresponding to the mounting location of the hoop F. A window opening / closing mechanism 12 for opening / closing the window 92 with a shutter or the like is provided on the wafer transfer section 5 side with respect to each window 92.

The window opening / closing mechanism 12 can also hold the lid of the hoop F, whereby the loading / unloading port of the hoop F can be opened / closed at the same time when the window 92 is opened / closed. It is preferable to provide an interlock on the window opening / closing mechanism 12 so that the window opening / closing mechanism 12 does not operate when the hoop F is not placed at a predetermined position on the mounting table 11. When the window 92 is opened and the wafer loading / unloading port of the FOUP F and the wafer transfer section 5 are communicated with each other, the wafer transfer section 5
Hoop F of wafer transfer device (CRA) 13 installed in
Access to. As a result, the wafer W can be transferred.

A wafer inspection device (not shown) is provided above each window 92. The wafer inspection device is a hoop F
The number and state of the wafers W housed inside are detected for each slot. Such a wafer inspection apparatus has a window opening / closing mechanism 1
You may attach it to 2.

The wafer transfer device (CRA) 13 provided in the wafer transfer section 5 is movable in the Y and Z directions and is rotatable (in the θ direction) in the XY plane. . The wafer transfer device (CRA) 13 has a transfer pick 13 a for holding the wafer W.
a is slidable in the X direction. As a result, the transport pick 13a accesses the slots of any height of all the FOUPs F mounted on the mounting table 11, and the two wafer transfer units (TRS) provided in the substrate cleaning processing unit 3 are provided. You can access 14a and 14b.

The wafer transfer device (CRA) 13 is provided with a wafer detection sensor (not shown) for detecting whether or not the transfer pick 13a holds the wafer W. The wafer detection sensor also functions as a position sensor that allows the wafer W to be carried out from a predetermined slot of the hoop F and can be carried into the predetermined slot. That is, the wafer detection sensor can also recognize the slot of the hoop F.

The substrate cleaning processing unit 3 includes two wafer reversing units (RVS) 14c and 14d for reversing the wafer W.
And a transfer / reversing unit (TRS / RVS) having two wafer transfer units (TRS) 14a and 14b for temporarily mounting the wafer W for transferring the substrate to and from the wafer transfer unit 5. 14 are provided. Further, the substrate cleaning processing unit 3 includes three hot plate units (HP) 16a to 16c that heat-process the wafer W after the cleaning processing,
Cooling unit (COL) for cooling the heated wafer W
And a heating / cooling unit (HP / COL) 16 having 16d.

Further, the substrate cleaning processing unit 3 includes four scrub cleaning units (SC) for scrub cleaning the wafer W.
R) 21a to 21d, and a main wafer transfer device (PRA) 15 that can access all of these units provided in the substrate cleaning processing unit 3 and transfer the wafer W between these units. Have

Wafer transfer unit (TRS) 14a-1
4b and wafer reversing unit (RVS) 14c and 14d
Each of the scrub cleaning units (SCR) 21a to 21d is provided with a wafer detection sensor (not shown) that detects whether or not the wafer W is present in each unit. The hot plate unit (HP) 16
It is of course possible to provide a wafer detection sensor in each of a to 16c and the cooling unit (COL) 16d.

The substrate cleaning processing section 3 includes an electrical unit (E) which is a power source for operating the entire cleaning processing system 1.
B) 18 and various units provided in the cleaning processing system 1 and a machine control unit (MCB) 19 that operates and controls the entire cleaning processing system 1 and scrub cleaning units (SCR) 21a to 21d. A chemical liquid storage unit (CTB) 17 that stores a predetermined cleaning liquid is provided. The electrical unit (EB) 18 is connected to a main power source (not shown). A filter fan unit (FFU) 22 for downflowing clean air is provided in each unit for handling the wafer W and the main wafer transfer apparatus (PRA) 15 on the ceiling of the substrate cleaning processing unit 3.

Chemical liquid storage unit (CTB) 17, electrical equipment unit (EB) 18 and machine control unit (MCB) 19
Is installed outside the substrate cleaning processing unit 3 or is pulled out to the outside, the transfer / reversing unit (TRS / RVS) 14, the main wafer transfer device (PRA) 15, and the heating are performed from this surface (side surface in the Y direction). / Cooling unit (HP / CO
L) 16 can be maintained.

FIG. 3 shows a transfer / reversal unit (TRS / RVS) 1.
Wafer transfer unit (TRS) 14a ・ 14 in 4
b and the wafer reversing unit (RVS) 14c and 14d are arranged so that the main wafer transfer device (PRA) is adjacent in the X direction.
FIG. 15 is a cross-sectional view showing together with 15 and a heating / cooling unit (HP / COL) 16. Delivery / reversal unit (TRS / RVS)
In 14, the wafer transfer unit (TRS) is on the lower side.
14a and 14b are stacked in two stages, and the wafer reversing unit (RV) is placed on the wafer transfer unit (TRS) 14b.
S) 14c and 14d are further stacked in two stages.

For example, the lower wafer transfer unit (TR
S) 14a is used to place a wafer W to be transferred from the in / out port 4 side to the substrate cleaning processing section 3 side, while the upper wafer transfer unit (TRS) 14b is used to transfer the wafer W from the substrate cleaning processing section 3 side. It can be used to place the wafer W to be transferred to the outport 4 side.

The lower wafer reversing unit (RV
S) 14c is used for reversing the wafer W from a state in which the wafer W is faced up to a state in which its back surface (which means a surface on which a semiconductor device is not formed) is an upper surface (reverse direction), while the upper stage Wafer reversing unit (RVS) 14
d can be used to reverse the wafer W from the reverse state to the front state.

Filter fan unit (FFU) 22
Part of the downflow from the wafer transfer unit (T
After being guided to the inside of the RS) 14a / 14b and the inside of the wafer reversing unit (RVS) 14c / 14d, the structure is such that it flows out toward the wafer transfer unit 5. This prevents particles and the like from entering the substrate cleaning processing unit 3 from the wafer transfer unit 5, so that the cleanliness of the substrate cleaning processing unit 3 is maintained.

The main wafer transfer device (PRA) 15 includes vertical walls 51a and 51b and a side opening 51c between them.
And a wafer carrier 52 that is provided inside the tubular support 51 and is vertically movable in the Z direction along the tubular support 51. Cylindrical support 51
Can be rotated by the rotational driving force of the motor 53, and the wafer transfer body 52 is also rotated integrally therewith.

The wafer transfer body 52 is provided with a transfer base 54 and three main wafer transfer arms 55, 56 and 57 which are movable back and forth along the transfer base 54. To 57 are side surface openings 5 of the tubular support 51.
It has a size capable of passing 1c. The main wafer transfer arms 55 to 57 can be independently moved forward and backward by a motor and a belt mechanism built in the transfer base 54. The wafer carrier 52 is
By driving the belt 59 with the motor 58, the belt can be raised and lowered. Reference numeral 60 is a drive pulley, 61
Is a driven pulley. In addition, the main wafer transfer device (PR
A) 15 is equipped with a wafer detection sensor (not shown) for detecting whether or not the wafer W is held.

The heating / cooling unit (HP / COL) 16 is provided on the opposite side of the transfer / reversal unit (TRS / RVS) 14 with the main wafer transfer device (PRA) 15 interposed therebetween. In the heating / cooling unit (HP / COL) 16, three hot plate units (HP) 16a to 16c that perform forced heating / natural cooling are provided on one cooling unit (COL) 16d that performs forced cooling of the wafer W. The pedestals are stacked.

Scrub cleaning unit (SCR) 21a-
Two units 21d are arranged in each of the upper and lower stages. For example, the two scrub cleaning units (SCR) 21c and 21d arranged on the upper stage are used for cleaning the surface of the wafer W, and the two scrub cleaning units (SCR) 21a and 21b arranged on the lower stage are the wafer W. Used for cleaning the back surface of the. In this case, for example, in the scrub cleaning units (SCR) 21c and 21d for cleaning the surface, as a spin chuck that holds the wafer W substantially in parallel and rotates it, one that holds the wafer W by using a vacuum suction force is used. It is preferably used. Further, in the scrub cleaning units (SCR) 21a and 21b for cleaning the back surface,
A spin chuck that holds the wafer W by mechanically gripping the outer periphery of the wafer W is preferably used.

Next, one mode of the cleaning process of the wafer W by the cleaning system 1 described above will be described below. Here, the wafer transfer unit (TRS) 14a is used for mounting the wafer W transferred from the in / out port 4 side to the substrate cleaning processing unit 3 side, and the wafer transfer unit (TRS) 14b is used for the substrate cleaning processing unit 3 The wafer W to be transferred from the side to the in / out port 4 side is used for mounting. Also, the wafer reversing unit (RVS) 1
Reference numeral 4c is used to reverse the front-side wafer W so as to be reversed, and the wafer reversing unit (RVS) 14d is used to reverse the reversed wafer W to the front. Further, the scrub cleaning units (SCR) 21c and 21d are used for cleaning the front surface of the wafer W, and the scrub cleaning units (SCR) 21a and 21b are used for cleaning the rear surface of the wafer W.

FIG. 4 is a process explanatory view (flow chart) schematically showing the cleaning process described below. First, the FOUP F, which accommodates 25 wafers W in a face-up state, is mounted on the mounting table 11 (step 1). Next, the window 92 and the hoop F are opened by the window opening / closing mechanism 12.
Open the loading / unloading port. Subsequently, the wafer W in the predetermined slot of the FOUP F is unloaded from the FOUP F using the wafer transfer device (CRA) 13 (step 2) and transferred to the wafer transfer unit (TRS) 14a (step 3).

The main wafer transfer device (PRA) 15 carries out the wafer W from the wafer transfer unit (TRS) 14a and scrubs the cleaning unit (SC) for cleaning the surface.
R) 21c or 21d is conveyed (step 4). Therefore, a scrub cleaning process for the wafer W is performed (step 5).

The wafer W for which the processing of step 5 has been completed is
The main wafer transfer device (PRA) 15 transfers the wafer to one of the hot plate units (HP) 16a to 16c, and heat-drys it there (step 6), and then transfers it to the cooling unit (COL) 16d. A cooling process is performed (step 7).

The cooled wafer W is transferred to the wafer reversing unit (RV) by the main wafer transfer device (PRA) 15.
(S) Transport to 14c (step 8). In the wafer reversing unit (RVS) 14c, the wafer W is reversed by 180 ° so that the front-facing wafer W is reversed (step 9). The wafer W turned upside down by the process of step 9 is transferred by the main wafer transfer device (PRA) 15 to one of the scrub cleaning units (SCR) 21a and 21b (step 10), where the back surface of the wafer W is scrubbed. A cleaning process is performed (step 11).

Wafer W for which the processing in step 11 has been completed
Is transferred to the wafer reversing unit (RVS) 14d by the main wafer transfer device (PRA) 15 (step 1
2) Then, the reversal process of the wafer W is performed so that the wafer W is face-up (step 13). The wafer W turned upside-down in step 13 is transferred to the wafer reversing unit (RV
S) 14d to hot plate unit (HP) 16a
To 16c, and the wafer W is heated and dried there (step 14). Subsequently, the main wafer transfer device (PRA) 15 transfers the wafer W to the cooling unit (COL) 16d, where the wafer W is cooled (step 15).

The cooled wafer W is cooled by the main wafer transfer device (PRA) 15 by the cooling unit (COL) 1.
The wafer 6d is transferred to the wafer transfer unit (TRS) 14b (step 16). Wafer transfer unit (TRS)
The wafer W, which has been subjected to the cleaning process and placed on 14b, is returned to a predetermined slot in the hoop F by the wafer transfer device (CRA) 13 (step 17). Note that the steps 6 and 7 and the steps 14 and 15 described above can be omitted.

When the cleaning processing system 1 is turned on to start the cleaning processing system 1 in order to perform the cleaning processing by the above-described steps 1 to 17, each unit constituting the cleaning processing system 1 is started. The initialization process (initialization process) is performed to confirm whether the wafer W is in a normal operation state and to confirm whether or not the wafer W is present in each unit or the transfer device. Done.

At this time, if a wafer W exists in the cleaning processing system 1 (such a wafer W is hereinafter referred to as an "extra wafer"), the extra wafer hinders the start of the cleaning processing. , It becomes necessary to perform a recovery process for returning the extra wafer to the hoop F mounted on the mounting table 11.

The reason for the existence of the extra wafer is that the cleaning processing system 1 is inevitably caused by a power failure due to a natural disaster such as an earthquake or a typhoon during the operation of the cleaning processing system 1.
There is a case where the power of the cleaning processing system 1 is turned off, or when an operator intentionally turns off the power of the cleaning processing system 1 in order to ensure safety when a trouble occurs in the substrate cleaning processing unit 3.

Even when the power is turned off to stop the operation of the cleaning processing system 1 after the cleaning processing is normally completed, the initialization processing needs to be performed when the cleaning processing system 1 is started next time. . At that time, it is necessary to confirm the presence or absence of the extra wafer from the viewpoint of ensuring the operational safety of the cleaning processing system 1.

During the extra wafer recovery process, for example, when the extra wafer is returned to the hoop F in the opposite direction, scratches are generated on the surface of the extra wafer when the extra wafer is held by the transfer pick 13a. Alternatively, the shelf plate provided in the hoop F and the surface of the extra wafer may rub against each other and the extra wafer may be damaged. In this case, there is a high possibility that the extra wafer cannot be used as a product. Therefore, in order to avoid such a problem, the extra wafer recovery process is
It is desirable to return the extra wafer to the hoop F in a face-up state.

When the cleaning processing system 1 is turned on to start the cleaning processing system 1, the cleaning processing system 1
As a general rule, the extra wafer recovery sequence for each unit when there are extra wafers is (1) wafer transfer device (CRA) 13, (2) wafer transfer units (TRS) 14a, 14b, (3) main Wafer transfer device (PRA) 15, (4) Wafer inversion unit (RVS)
14c ・ 14d, (5) Scrub cleaning unit (SC
R) 21a to 21d, (6) hot plate unit (HP) 16a to 16c, (7) cooling unit (CO
L) 16d.

The wafer transfer device (CRA) 13 is a wafer W.
It does not have the function of reversing the wafer W, and the wafer W is held between the FOUP F and the wafer transfer units (TRS) 14a and 14b.
Wafer transfer device (C
The transfer pick 13a of (AR) 13 always transfers the wafer W in a state of facing up. Therefore, when the transfer pick 13a holds the extra wafer, the extra wafer is directly loaded into the empty slot of the hoop F.

Wafer transfer unit (TRS) 14a-1
Even when the extra wafer exists in 4b, the extra wafer is in a state of facing up. Therefore, these extra wafers are transferred to the wafer transfer device (CRA) 1
Wafer transfer unit (TRS) 14a ・ 14 by 3
It is carried out from b and carried into the empty slot of the hoop F.

In this way, the extra wafers are first collected in the wafer transfer units (TRS) 14a and 14b, and the extra wafers are not present in them. As a result, when many extra wafers are present in the substrate cleaning processing unit 3, the extra wafers can be temporarily retracted to the wafer transfer units (TRS) 14a and 14b.

When the main wafer transfer device (PRA) 15 holds the extra wafer, there are two cases of (a-1) the front side of the extra wafer and (a-2) the back side of the extra wafer. There are two cases. This (a
In the case of -1), the main wafer transfer device (PRA) 15 transfers the held extra wafer to one of the wafer transfer units (TRS) 14a and 14b, and the wafer transfer device (CRA) 13 transfers the wafer. Unit (TR
S) The extra wafer is taken out from 14a and 14b and accommodated in a predetermined slot of the hoop F.

In the case of (a-2), first, the extra wafer held by the main wafer transfer device (PRA) 15 is transferred to one of the wafer reversal units (RVS) 14c and 14d, and there. The front and back of the extra wafer are turned over so that the extra wafer faces up. Then
The main wafer transfer device (PRA) 15 transfers the extra wafer from the wafer reversal units (RVS) 14c and 14d to either of the wafer transfer units (TRS) 14a and 14b. After that, the wafer transfer device (CRA) 13 takes out the extra wafer from the wafer transfer units (TRS) 14a and 14b and stores it in a predetermined slot of the hoop F.

Wafer reversing unit (RVS) 14c-1
If there is an extra wafer in 4d, the wafer W
Even when the unit for reversing from the front side to the reverse side and the unit for performing the reverse reversal are selectively used, the wafer W can be either the front side or the reverse side before and after the reversing process. Further, when the operation of the cleaning processing system 1 is stopped in the middle of the reversing process, it is unclear whether the extra wafer is face-up or face-up.

That is, the wafer reversing unit (RVS) 1
4c and 14d, (b-1) the case where the extra wafer is facing up, (b-2) the case where the extra wafer is opposite, and (b-3) the direction of the extra wafer (whether the front surface or the back surface is There is a case where it is unclear whether or not it is on the upper surface.

In the case of (b-1), first, the main wafer transfer device (PRA) 15 transfers the extra wafers from the wafer reversal units (RVS) 14c and 14d to the wafer transfer units (TRS) 14a and 14b. Transport to. Thereafter, the wafer transfer device (CRA) 13 takes out the extra wafer from the wafer and stores it in a predetermined slot of the hoop F.

In the case of (b-2), first, the extra wafer is inverted on the spot to make the extra wafer face up. After that, the main wafer transfer device (PR
A) 15 is a wafer reversal unit (R
VS) 14c ・ 14d to wafer transfer unit (TR
S) Transport to either 14a or 14b. Then, the wafer transfer device (CRA) 13 takes out the extra wafer from the wafer and stores it in a predetermined slot of the hoop F.

In the case of (b-3), the extra wafers in the wafer reversal units (RVS) 14c and 14d are first temporarily cleaned by the main wafer transfer device (PRA) 15 from the scrub cleaning unit (back surface cleaning unit). SC
R) Transport to either 21a or 21b. Next, the operator visually observes the state in which the extra wafer is placed and determines the orientation of the extra wafer.

In this visual observation, when the operator determines that the extra wafer is face up, the extra wafer is transferred to the main wafer transfer device (PR).
A) Wafer transfer unit (TRS) 14a by 15
-Transferred to either 14b. On the other hand, when it is determined that the extra wafer is in the reverse direction, the extra wafer is transferred by the main wafer transfer device (PRA) 15 to one of the wafer reversing units (RVS) 14c and 14d, and the reversing process is performed there. Then, the main wafer transfer device (PRA) 15 transfers the wafer to one of the wafer transfer units (TRS) 14a and 14b. Wafer transfer unit (TRS) 14a-1
The extra wafer carried into 4b is carried into a predetermined slot of the hoop F by the wafer transfer device (CRA) 13.

Scrub cleaning unit (SCR) 21c
Since 21d is used for cleaning the surface, when an extra wafer is present in the scrub cleaning units (SCR) 21c and 21d, the extra wafer is always face up. Therefore, the extra wafers existing in the scrub cleaning units (SCR) 21c and 21d are transferred by the main wafer transfer device (PRA) 15 to one of the wafer transfer units (TRS) 14a and 14b, and then the wafer transfer device (CRA). ) 13, the wafer transfer units (TRS) 14a and 14b are taken out and housed in a predetermined slot of the hoop F.

Scrub cleaning unit (SCR) 21a
Since 21b is used for cleaning the back surface, when extra wafers are present in the scrub cleaning units (SCR) 21a and 21b, the extra wafers are always reversed. Therefore, the extra wafers existing in the scrub cleaning units (SCR) 21a and 21b are transferred by the main wafer transfer device (PRA) 15 to one of the wafer reversing units (RVS) 14c and 14d, where the reversing process is performed. After being turned upside down, the main wafer transfer device (PRA) 15 transfers the wafer to one of the wafer transfer units (TRS) 14a and 14b, and the wafer transfer device (CRA) 13 stores the wafer in a predetermined slot of the hoop F. .

Scrub cleaning unit (SCR) 21a-
21d is used without distinction for front surface cleaning and back surface cleaning, and when the extra wafer is facing up, the scrub cleaning unit (SCR) 2 described above is used.
The extra wafer is collected according to the case where the extra wafer exists in 1c and 21d. On the other hand, when the extra wafer is in the opposite direction, the extra wafer is collected according to the case where the extra wafer exists in the scrub cleaning units (SCR) 21a and 21b described above. If the orientation of the extra wafer is unknown, the operator first visually confirms the orientation of the extra wafer. The operator determines an appropriate recovery method based on the confirmation result, and recovers the extra wafer.

Hot plate unit (HP) 16a-
When the extra wafer exists in 16c and the cooling unit (COL) 16d, the extra wafer is face up according to the cleaning process described above with reference to FIG. Therefore, the hot plate units (HP) 16a to 16c and the cooling unit (COL) 16
When an extra wafer exists in d, the scrub cleaning unit (SCR) 21c.2 for surface cleaning described above is used.
It can be recovered according to the case where the extra wafer exists in 1d.

The hot plate unit (HP) 1
The collection order of 6a to 16c and the cooling unit (COL) 16d may be exchanged. That is, the cooling unit (CO
L) After collecting the extra wafer of 16d, the extra wafers of the hot plate units (HP) 16a to 16c are loaded into the vacant cooling unit (COL) 16d, and after cooling the extra wafer there, the FOUP F
You may collect it at. In this case, it is possible to reduce the thermal influence on other wafers in the recovered hoop F.

FIG. 5 is a machine control unit (control unit) for controlling each processing unit and transfer device provided in the cleaning processing system 1 when performing the above-described series of cleaning processing, initializing processing and extra wafer collecting processing. MC
B) is an explanatory diagram showing an example of a configuration of 19. In the cleaning processing system 1, control is performed by the device control unit (CPU) 71 based on a preset recipe.

A memory (storage device) 74 is connected to the device control unit (CPU) 71. In this memory 74,
A cleaning recipe corresponding to a desired cleaning process, an initializing recipe corresponding to the initializing process, and a collecting recipe corresponding to the collecting process of the extra wafer are recorded. Further, by selecting a desired cleaning recipe and other conditions in the operation unit 73 and sending the signal to the device control unit (CPU) 71, the recipe controller 72 selects the desired cleaning recipe and the device control unit ( The CPU) 71 controls each unit and the transport device based on the processing recipe and the setting information.

The position of the wafer W and the orientation of the wafer W in the cleaning processing system 1 are determined by the history of control signals sent by the apparatus control unit (CPU) 71 to each unit and the transfer apparatus,
Wafer transfer device (CRA) 13 and main wafer transfer device (P
It can be known by the signal from the wafer detection sensor provided in RA) 15. The memory 74 stores the history of this control signal as wafer information. For storing the wafer information by the memory 74, signals from wafer detection sensors provided in the wafer reversing units (RVS) 14c and 14d and the scrub cleaning units (SCR) 21a to 21d can be used as necessary.

The device controller (CPU) 71 has a monitor 75.
Are connected, and a desired cleaning recipe and other conditions can be selected by operating the operation unit 73 from the screen of the monitor 75, for example.
In addition, the monitor 75 can display the progress of processing in the cleaning processing system 1 in real time, based on the history of control signals sent by the apparatus control unit (CPU) 71 to each unit and the transportation apparatus. It is possible.

The wafer information operation unit 76 and the collection start unit 77, which send a predetermined signal to the apparatus control unit (CPU) 71, carry out the processing for collecting the extra wafers existing in the cleaning processing system 1 at the time of the initialization processing into the hoop F. Used when doing. The wafer information operation unit 76 changes the collection recipe of the extra wafer, corrects information regarding the extra wafer, and the like, and the corrected information is sent to the apparatus control unit (CPU) 71. The collection start unit 77 sends an extra wafer collection start instruction to the apparatus control unit (CPU) 71.

Hereinafter, one mode of the extra wafer recovery process using the control system of the cleaning system 1 shown in FIG. 5 will be described in more detail including the usage modes of the wafer information operation unit 76 and the recovery start unit 77. To do.

FIG. 6 is an explanatory view showing one mode of the procedure for collecting the extra wafer. Here, the memory 74 stores the position and orientation of the wafer W when processing is performed in the cleaning processing system 1, but the wafer W carried out from which slot of which FOUP F is in which processing unit and orientation. I don't even remember the information that
Also, hot plate units (HP) 16a to 16c
Wafer information regarding the cooling unit (COL) 16d is not stored. Note that the orientation of the extra wafer stored in the memory 74 is determined by the number of times the wafer W is inverted by the wafer inversion units (RVS) 14c and 14d.

The first recovery mode of the extra wafer will be described below. First, the cleaning processing system 1 is powered on to start the cleaning processing system 1 (step 10).
1). As a result, the initialization processing recipe is automatically retrieved from the memory 74, and the initialization processing of the cleaning processing system 1 is performed. At the time of this initialization processing, the wafer information in the cleaning processing system 1 stored in the memory 74 when the power of the cleaning processing system 1 was turned off last time is taken out, and the result is displayed on the monitor 75 (step 102). Further, the extra wafer recovery recipe is retrieved from the memory 74 and applied to the wafer information retrieved from the memory 74. The operator corrects the wafer information displayed on the monitor 75 to appropriate wafer information as necessary (step 103), and then starts the collection of extra wafers (step 104).

FIG. 7 is an explanatory view schematically showing a screen displayed on the monitor 75 as a result of applying the extra wafer recovery recipe to the wafer information retrieved from the memory 74. When the wafer information including the extra wafer is retrieved from the memory 74, the wafer information is displayed in the column indicating the unit including the extra wafer.

Extra wafers from units such as a wafer transfer device (CRA) 13, a main wafer transfer device (PRA) 15, and scrub cleaning units (SCR) 21a to 21d in which extra wafers may exist are included in the recovery recipe. The collection order of is set in advance. According to the recovery order, serial numbers such as W1, W2, and W3 are automatically assigned to the extra wafers that actually exist.

At this time, when the extra wafer is facing up, for example, "W1" is displayed, and when the extra wafer is facing up, for example, "W1R" is displayed, and the orientation of the extra wafer is unknown. If so, for example, "W1?" Is displayed.

Further, the hoop F of the extra wafer is
It is unclear if they were shipped from. For this reason, the slot position of the hoop F of the collection destination is automatically given to each extra wafer. In FIG. 7, the recovery destination hoop F is only the hoop F1. For example, the slot number is represented as “S1” after the serial number of the wafer. The screen display of the extra wafer on the monitor 75 is not limited to such an example, and for example, a method such as changing the display color or using a reverse character can be used.

FIG. 7 shows that only one hoop F1 is mounted on the mounting table 11 and that there are 15 empty slots in the hoop F1 ((S: 15) display). This hoop F1 is detected, for example, by the window opening / closing mechanism 1
This is performed depending on whether or not the operation of the window opening / closing mechanism 12 by the interlock 2 is executable. The detection of the empty slot is performed by, for example, a wafer inspection device provided for the window 92. The hoop F1 may be the one from which the extra wafer is unloaded, or may be prepared exclusively for collecting the extra wafer. Here, the hoop F1 will be described as the latter case.

Since no wafer number is displayed in the column labeled "CRA 13" in FIG.
It can be seen that the transfer pick 13a of the wafer transfer device (CRA) 13 does not hold the extra wafer, and the wafer transfer units (TRS) 14a and 14b also have no extra wafer.

Scrub cleaning unit (SCR) 21c
Although the extra wafers W1 and W2 are present in 21d, respectively, as described above, in the cleaning processing system 1, the scrub cleaning units (SCR) 21c and 21d are provided.
Is used for cleaning the surface of the wafer W, the extra wafers W1 and W2 are displayed to indicate that they are face up. In addition, extra wafers W1 and W2
Are set to be collected in the slots 11 and 12 of the hoop F1, respectively.

Although no extra wafer exists in the scrub cleaning unit (SCR) 21a, an extra wafer W3 to be recovered in the slot 13 of the hoop F1 exists in the scrub cleaning unit (SCR) 21b. . Since the scrub cleaning unit (SCR) 21b is used for cleaning the back surface of the wafer W, the extra wafer W3 is displayed as "W3R", which indicates that it is in the opposite direction.

Wafer reversing unit (RVS) 14c-1
In 4d, there are extra wafers W4 and W5 scheduled to be collected in the slots 14 and 15 of the FOUP F1, respectively. Of these, the extra wafer W5 is displayed with "W5?" Indicating that its orientation is unknown. This is because the orientation of the extra wafer W5 is unknown because it is unknown whether the power supply to the cleaning processing system 1 was shut off before or after the reversal processing.

The main wafer transfer device (PRA) 15 holds the extra wafer W6 scheduled to be collected in the slot 16 of the FOUP F1. For this extra wafer W6, since it is not known from which unit the wafer W was unloaded, “W6?” Indicating that the direction is unknown is displayed.

These extra wafers W1 to W6 are
Although the wafers are sequentially collected in predetermined slots of the FOUP F1 in accordance with the above-described collection procedure for each processing unit, it is necessary to determine the wafer information for the extra wafer whose orientation is unknown prior to this collection processing. Further, for example, when the operator manually carries out the extra wafer from the cleaning processing system 1 while the cleaning processing system 1 is stopped, the wafer information displayed on the monitor 75 is stored in the memory 74. Since it is based on the existing wafer information, the wafer information displayed on the monitor 75 and the state of the extra wafer actually existing in the cleaning processing system 1 become different. In such a case, it becomes necessary to correct the wafer information. Further, there may be a case where it is desired to change the slot where the extra wafer is collected.

Such editing of wafer information can be performed by operating the wafer information operating unit 76. For example, in the cleaning processing system 1, the operator operates the wafer information operating unit 76 on the screen of the monitor 75, whereby “deletion of extra wafer” is displayed.
It is possible to edit the wafer information such as "addition of extra wafer", "inversion of front and back of extra wafer", and "change of collection destination slot of extra wafer" (step 103 in FIG. 6).

The extra wafer deleting function is executed by the memory 7
Although the wafer information extracted from No. 4 shows that the extra wafer exists at a certain position,
In actuality, this is a function of deleting the data regarding the extra wafer when there is no extra wafer at that position.

The additional function of the extra wafer is stored in the memory 7
The wafer information taken out from No. 4 shows that the extra wafer does not exist at the position, but when the extra wafer actually exists at that position, the extra wafer exists at that position. Is a function to add existing data.

The function of reversing the front and back of the extra wafer is such that the wafer information indicating that the extra wafer is in the reverse direction is retrieved from the memory 74 and displayed on the monitor 75 with respect to the extra wafer which is actually in the front direction. If it is present, this wafer information is a function to correct it so as to display the correct state of the extra wafer. Similarly,
The extra wafer front / back inversion function corrects the wafer information even when the wafer information about the extra wafer in the reverse direction is retrieved from the memory 74 and displayed on the monitor 75. The slot changing function is a function of automatically changing the slot position of the collection destination.

FIG. 8 exemplifies a case where the extra wafer deleting function is used, and the monitor 75 at the time of data editing is used.
It is explanatory drawing which showed the change of the display of. FIG. 8A shows an initial screen, and the wafer information is the same as that shown in FIG. In the state of FIG. 8A, the monitor 7
In the lower column of 5, there are displays of "data edit" and "wafer collection". The change of the wafer information in the wafer information operation unit 76 can be started by selecting the display of "data edit". Further, the instruction to start the wafer collection from the collection start unit 77 is started by selecting the display of "wafer collection".

For example, the operator may set the cleaning system 1
As a result of visual inspection, when it is confirmed that the main wafer transfer device (PRA) 15 does not hold the extra wafer W6, first, the data of the extra wafer W6 is deleted. When the display of "data edit" in the lower column of the monitor 75 shown in FIG. 8A is selected, "wafer deletion" and "wafer deletion" are displayed in the lower column of the monitor 75 as shown in FIG. 8B. Each display of "Add", "Reverse face up", and "Change slot" appears.

After selecting the newly displayed "Delete Wafer", the number "W" of the extra wafer to be deleted is selected.
When "6" is input from a keyboard (not shown) or the number portion of the extra wafer W6 is touched on the screen of the monitor 75, a message confirming deletion is displayed as shown in FIG. 8C. The extra wafer W6 is deleted by touching the display of “YES” shown in FIG. 8C. This brings the screen of the monitor 75 into the state shown in FIG.

With respect to "add wafer", "reverse face", and "change slot", the wafer information can be corrected by the same interactive operation. In the case shown in FIG. 7,
It is necessary to determine the information regarding the extra wafer W5 of the wafer reversing unit (RVS) 14d. After this wafer information is confirmed and it is no longer necessary to edit the wafer information, the extra wafer recovery is started by touching the “wafer recovery” portion shown in FIG. 8A.

The extra wafer recovery process (see FIG. 6).
As a method of step 104) of step 1, by selecting “wafer recovery” first on the screen of the monitor 75 and then selecting one extra wafer, the selected extra wafer is recovered in a predetermined slot. There is a method of performing the operation of "being performed" on all the extra wafers.

As another method of collecting extra wafers, when "wafer collecting" is selected on the screen of the monitor 75, the apparatus control unit (CPU) 71 continuously collects the extra wafers in predetermined slots according to the collecting recipe. There is a method of controlling the main wafer transfer device (PRA) 15 and the like so as to be stored in

When the extra wafers are continuously collected based on the wafer information obtained by correcting the wafer information shown in FIG. 7, for example, the main wafer transfer device (PR) is used.
A) Since the extra wafer W6 held by 15 is deleted, first, the wafer reversing unit (RVS)
Extra wafer W4 that existed in 14c and 14d
W5 is stored in the designated empty slots 14 and 15, respectively. Then, scrub cleaning unit (SCR) 2
The extra wafers W1 and W2 existing in 1c and 21d are stored in the designated empty slots 11 and 12. Finally, the empty wafer 1 in which the extra wafer W3 existing in the scrub cleaning unit (SCR) 21b is designated
After being stored in No. 3, the extra wafer recovery process is completed.

After the extra wafer recovery process displayed on the monitor 75 is completed, the hot plate units (HP) 16a to 16c and the cooling unit (COL) 16 are processed.
The extra wafer unloading operation is performed by the main wafer transfer device (PRA) 15 for each of the d. At this time, whether or not the extra wafer is held by the main wafer transfer device (PRA) 15 is confirmed by a wafer detection sensor attached to the main wafer transfer device (PRA) 15. Since the wafer W is loaded face-up into the hot plate units (HP) 16a to 16c and the cooling unit (COL) 16d, the main wafer transfer device (PRA) 1
5 detects an extra wafer, the extra wafer is a wafer transfer unit (TRS) 14a.
4b, and further the wafer transfer device (CRA) 13
Is returned to a predetermined empty slot of the hoop F.

Before starting the processing of collecting the extra wafer displayed on the monitor 75, the main wafer transfer device (PRA) 15 not holding the extra wafer is connected to the hot plate units (HP) 16a to 16c and the cooling unit. When the main wafer transfer device (PRA) 15 holds the extra wafer by performing the operation of accessing the (COL) 16d and unloading the extra wafer from each of these units, the empty wafer transfer unit (TRS) The extra wafers are transferred to 14a, 14b, etc., and wafer information is added to the other extra wafers W.
It can also be collected in the hoop F1 together with the first and the like.

When a plurality of FOUPs F are mounted on the mounting table 11, the wafer information operating section 76 can be provided with a function of selecting the FOUP F from which extra wafers are collected. Furthermore, it is also possible to divide the extra wafer into a plurality of groups and store them in different hoops F for each group. For example, when "Change slot" is selected on the screen of the monitor 75 shown in FIG. 8, the number of the recovery destination hoop and its slot number can be selected, and the wafer W is already stored in the selected recovery destination. When stored, an error message can be displayed so that the extra wafer is not stored in the slot.

When the above-described extra wafer collecting method is used, the operator confirms the orientation of the wafer W as necessary and operates the wafer information operating section 76 according to a predetermined processing procedure, The wafer W can be easily collected with its direction aligned. As a result, damage to the wafer W is prevented, and the operator does not need to manually replace the wafer W in the hoop F, so that the burden on the operator is reduced. In addition, it is possible to eliminate an artificial error in handling the wafer W.

Next, a machine control unit (MCB) 19 ', which is another embodiment of the machine control unit (MCB) 19, will be described.
FIG. 9 is an explanatory diagram showing the configuration of the above. The machine control unit (MCB) 19 ′ is a machine control unit (MCB) 19
Does not have the wafer information operation unit 76 that
Alarm device 78a, alarm device 78b, and alarm canceller 79
And have. In the machine control unit (MCB) 19 ′, the device control unit (CPU) 71, the recipe controller 72, the operation unit 73, the memory 74, and the monitor 75 have the same functions as those of the machine control unit (MCB) 19.

The alarm device 78a is a processing unit or a processing unit that has a difference when the wafer information retrieved from the memory 74 during the initialization processing and the extra wafer position information actually detected by the wafer detection sensor are different. An alarm is issued for each carrier. With this alarm, the operator can easily know the position of the extra wafer and can confirm the wafer information. As a method of issuing this alarm, for example, a method of displaying a screen on the monitor 75 or a method of using a voice can be cited. The alarm device 78a also issues an alarm when there are no empty slots in the hoop F according to the number of extra wafers to be collected.

Further, the alarm device 78b includes the wafer transfer device (CRA) 13, the main wafer transfer device (PRA) 15, and a specific processing unit such as the wafer reversal units (RVS) 14c and 14d and the scrub cleaning unit (S).
When an extra wafer exists in (CR) 21a to 21d, an alarm is issued. By this alarm, for example, the wafer transfer device (CRA) 13 or the main wafer transfer device (PR)
A) While 15 holds the extra wafer,
Access to the processing unit where another extra wafer resides is prohibited. This makes it possible to prevent damage to the extra wafer and damage to the wafer transfer device (CRA) 13 and the main wafer transfer device (PRA) 15.

Wafer reversing unit (RVS) 14c-1
An alarm indicating that there is an extra wafer in 4d allows the operator to move another extra wafer to the wafer reversing unit (RVS) 14c even if the other extra wafer is present in the opposite direction in another processing unit.・
It can be easily recognized that the sheet cannot be conveyed to 14d and the reversal process cannot be performed. This makes it possible to prevent damage to the extra wafer.

Scrub cleaning unit (SCR) 21a-
When the extra wafer exists in 21d, it is possible that the cleaning processing system 1 shuts down while supplying the cleaning liquid to the wafer W. In this case,
The extra wafer may be wet with the cleaning liquid. When the extra wafer is transferred to the main wafer transfer device (PRA) 15 in such a state, the main wafer transfer device (PRA) 15 may get wet and malfunction may occur. Therefore, by issuing an alarm when an extra wafer exists in the scrub cleaning units (SCR) 21a to 21d, the operator can
For example, after performing a cleaning process on the extra wafer and performing spin drying, the scrub cleaning unit (SCR) 21
It is possible to easily take measures such as carrying out from a to 21d.

The scrub cleaning unit (SCR) 2
When the extra wafer exists in 1a to 21d,
It is also preferable that the rinse liquid (pure water) is automatically and automatically discharged onto the extra wafer to perform a simple cleaning process, and then spin drying is performed.

As described above, when the orientation of the extra wafer is unknown, it is necessary to carry the extra wafer into the scrub cleaning units (SCR) 21a and 21b for cleaning the back surface to determine the orientation of the extra wafer. There is. However, the scrub cleaning unit (SC
(R) When the extra wafers are present from the beginning in 21a and 21b, further carry the extra wafers present in another processing unit or the like into the scrub cleaning units (SCR) 21a and 21b for backside cleaning. I can't. The operator can easily recognize such a situation by an alarm from the alarm device 78.

The alarm canceling unit 79 includes alarm devices 78a and 78a.
Cancel the alarm issued by b. Collection starter 77
The extra wafer recovery command is issued by the alarm canceling unit 79.
With this, all the alarms can be sent to the device control unit (CPU) 71 in a released state. That is, the alarm cancellation operation by the alarm cancellation unit 79 is
It is also an operation to determine the wafer information used in the extra wafer recovery process. For example, the alarm devices 78a and 78
The alarm by b is displayed on the screen of the monitor 75, and the operation of the alarm canceling unit 79 can be performed from the screen of the monitor 75 or a keyboard or a manual operation button of each processing unit. .

FIG. 10 shows a machine control unit (MCB) 19
It is explanatory drawing which showed 1 aspect of the collection procedure of the extra wafer at the time of using '. Here, the memory 74 is the wafer W when processing is being performed in the cleaning processing system 1.
Information and the orientation of the wafer W carried out from which slot of which FOUP F is stored in which unit, and the hot plate units (HP) 16a to 16c. It is assumed that the wafer information regarding the cooling unit (COL) 16d is not stored.

When the cleaning processing system 1 is powered on and the cleaning processing system 1 is activated (step 201), the initialization processing is started. At the time of this initialization processing, the memory 7 is turned off when the cleaning processing system 1 is powered off last time.
The wafer information in the cleaning processing system 1 stored in No. 4 is taken out and the result is displayed on the monitor 75 (step 202). Further, the extra wafer detected by the wafer detection sensor is detected (step 2
03).

As described above, in the cleaning processing system 1, the wafer transfer units (TRS) 14a and 14b provided with the wafer detection sensor, the wafer reversing units (RVS) 14c and 14d, and the scrub cleaning unit (SCR) 21a. ~ 21d, Wafer transfer device (CRA)
13. The main wafer transfer device (PRA) 15 can detect the presence or absence of extra wafers. However, the hot plate units (HP) 16a to 16c and the cooling unit (COL) 1 without the wafer detection sensor are provided.
For 6d, the presence or absence of an extra wafer is unknown.

The wafer information retrieved from the memory 74 and the detection result detected by the wafer detection sensor are collated (step 204). As a result, if these pieces of information are different from each other, the detection result by the wafer detection sensor is preferentially displayed and the alarm is issued by the alarm device 78a (step 205). This is because the detection result of the wafer detection sensor reflects the actual state inside the cleaning processing system 1. For example, the wafer information retrieved from the memory 74 stores the content that an extra wafer exists at a certain position, but if the wafer detection sensor does not detect the extra wafer at that position, the extra wafer is It is determined that the position is not present, and the result is displayed on the screen of the monitor 75.

FIG. 11 shows the monitor 7 as a result of applying the extra wafer recovery recipe to the wafer information retrieved from the memory 74 and the wafer information detected by the wafer detection sensor.
It is explanatory drawing which showed the screen displayed on 5 typically. Here, as the collection recipe, the extra wafers are automatically numbered, and a predetermined hoop F is assigned in the order of numbers.
It is assumed that the one having the contents for accommodating the extra wafers in order from the empty slot in is used.

FIG. 11 shows that the mounting table 11 has three hoops F1.
Although ~ F3 is placed, only the hoop F1 has an empty slot, and the hoop F1 has five empty slots. As will be described later, since there are 6 extra wafers in the cleaning processing system 1, the number of recovery slots is insufficient. Therefore, the alarm device 78a issues an alarm.

No extra wafer exists in the wafer transfer device (CRA) 13 and the wafer transfer units (TRS) 14a and 14b. Therefore, the wafer transfer device (C
No warning has been issued for RA) 13.

Although the main wafer transfer device (PRA) 15 holds the extra wafer W1, "W1?" Indicating that its orientation is unknown is displayed. "W1
? The serial number display of “−0” after the display of “” indicates that the wafer information retrieved from the memory 74 does not include the information that the main wafer transfer apparatus (PRA) 15 holds the extra wafer. There is. That is, the extra wafer W is actually loaded on the main wafer transfer device (PRA) 15.
1 exists, and the orientation of the extra wafer W1 is unknown, and as a result, "W1? -0" is displayed. For the main wafer transfer device (PRA) 15, double alarms by the alarm devices 78a and 78b,
For example, the display of "W1? -0" blinks and an alarm is issued by voice or the like.

Regarding the extra wafer W1, for example, the extra wafer W1 is carried into the scrub cleaning unit (SCR) 21a in which the extra wafer does not exist, and the operator judges the orientation thereof, and the wafer information regarding the extra wafer W1 is determined. Yes (Step 20)
At the same time as 6), the alarm canceller 79 is operated to cancel the alarm based on the alarm device 78a, and the extra wafer W1 is returned to the main wafer transfer device (PRA) 15.

The wafer reversing unit 14c has a front-side extra wafer W2, and the wafer reversing unit 14d has a reverse-direction extra wafer W3. Both of them are, for example, "W2" and "W3R". An alarm is issued by the alarm device 78b such as a blinking display. Also, scrub cleaning unit (SCR) 21c ・ 2
Extra wafers W4 and W5 are present in 1d, respectively, and an alarm is issued by the alarm device 78b, for example, the display of "W4" and "W5" blinks. Similarly, the scrub cleaning unit (SCR) 21b has an extra wafer W6 in the opposite direction, and the "W
A warning such as a blinking "6R" display is issued.

The operator confirms the processing unit or the like for which the alarm is issued by the alarm device 78b and releases the alarm (step 207). Next, since there are only five empty slots in the hoop F1, all the extra wafers W1 to W6 cannot be collected in the hoop F1 by the alarm device 78a. For this purpose, for example, the hoop F1 is unloaded from the mounting table 11 and replaced with a hoop F having a necessary number of empty slots to cancel the alarm regarding the number of recovery destination slots. In this way, a command to start the collection of the extra wafers W1 to W6 is issued from the collection start unit 77 to the device control unit (CP
(U) 71 to start collection work (step 2)
08). The extra wafers W1 to W6 are automatically collected from the smallest number given.

After that, the hot plate unit (H
P) 16a to 16c and the cooling unit (COL) 16d are individually carried out by the main wafer transfer device (PRA) 15. Hot plate units (HP) 16a to 16c and cooling unit (COL)
Since the wafer W is loaded into the 16d in a face-up direction, when the main wafer transfer device (PRA) 15 detects an extra wafer, the extra wafer is transferred to the wafer transfer units (TRS) 14a and 14b. Further, it is returned to a predetermined empty slot of the hoop F by the wafer transfer device (CRA) 13.

The extra wafer recovery procedure by the mechanical control unit (MCB) 19 'can be modified as shown in the flowchart of FIG. In this recovery procedure, without confirming all the information of the extra wafer,
Although the presence / absence of the extra wafer is confirmed, the collection of the extra wafer is started in a state where the orientation of the extra wafer is not confirmed.

First, the cleaning system 1 is started (step 301). As a result, the position and orientation of the extra wafer based on the wafer information stored in the memory 74 is displayed on the monitor 75 (step 302). Further, the extra wafer is detected by the wafer detection sensor (step 303). Further, the wafer information retrieved from the memory 74 is collated with the detection result of the wafer detection sensor (step 304).

Next, it is confirmed whether or not there is an extra wafer (step 305). If the wafer information retrieved from the memory 74 and the detection result of the extra wafer by the wafer detection sensor are different, the detection result by the wafer detection sensor is used. In this way, the presence / absence of extra wafers is determined, but the orientation has not yet been determined for all extra wafers.

When the wafer information retrieved from the memory 74 and the detection result of the extra wafer by the wafer detection sensor are different, an alarm is issued, and the operator cancels the alarm without confirming the orientation of the extra wafer. Further, the start of the collection of the extra wafer is instructed (step 306).

As described above, the extra wafers are collected in principle as follows: (1) Wafer transfer device (CRA) 1
3, (2) Wafer transfer unit (TRS) 14a ・ 14
b, (3) main wafer transfer device (PRA) 15, (4) wafer reversing units (RVS) 14c and 14d, (5) scrub cleaning units (SCR) 21a to 21d, (6).
Hot plate units (HP) 16a to 16c,
(7) The cooling unit (COL) 16d is performed in this order.

For example, since the extra wafers of the wafer transfer device (CRA) 13 and the wafer transfer units (TRS) 14a and 14b are determined to be face-up, it can be easily recovered (step 307). However, when the next main wafer transfer device (PRA) 15 holds the extra wafer, the direction of the extra wafer may be unknown. Therefore, an alarm is issued (step 308), the operator confirms the orientation of the extra wafer (step 309), and then the alarm is released (step 310). The operator corrects the wafer information displayed on the monitor 75 based on the confirmation work result, and the main wafer transfer device (PRA) 15 collects the extra wafer (step 311).

After that, when the orientation of the extra wafer is clearly face-up, the extra wafer is recovered as it is. When the orientation of the extra wafer is clearly opposite, the extra wafer is collected face up after performing the reversing process. Furthermore, when the orientation of the extra wafer is unknown, steps 308 to 311
The extra wafer is collected face up according to the procedure of (3). This completes the work of collecting all the extra wafers (step 313).

Although the embodiments of the present invention have been described above, the present invention is not limited to such embodiments. For example, in the above description, the case where some trouble occurs in starting the collection of the extra wafer in the wafer information retrieved from the memory 74 or the detection result by the wafer detection sensor has been described. However, when such a failure does not occur, it is possible to automatically collect the extra wafer after the initialization process is completed.

Further, in the cleaning processing system 1, when the scrub cleaning units (SCR) 21a to 21d are separately used for the front surface cleaning and the back surface cleaning, the wafer information regarding the scrub cleaning units (SCR) 21a to 21d. Need not be stored in the memory 74, and the presence or absence of the extra wafer and its orientation can be determined based only on the result of wafer detection by the wafer detection sensor.

The extra wafer held by the transfer pick 13a and the wafer transfer unit (TRS) 14a.
The extra wafer existing in 14b is always face up. Therefore, it is not necessary to store the wafer information regarding the transfer pick 13a and the wafer transfer units (TRS) 14a and 14b in the memory 74, and the presence or absence of the extra wafer and its direction are determined only based on the wafer detection result by the wafer detection sensor. You can

In other words, the scrub cleaning unit (SC
R) 21a to 21d, and wafer transfer device (CRA) 13
With respect to the wafer transfer units (TRS) 14a and 14b, even if the wafer information is stored in the memory 74,
The extra wafer can be collected by using only the detection information of the extra wafer from the wafer detection sensor without using the wafer information.

Furthermore, in the cleaning processing system 1, for example, the machine control unit (MCB) 19 may be provided with alarm devices 78a and 78b and an alarm release section 79 provided in the machine control unit (MCB) 19 '. Good. In this case, the alarm canceling section 79 does not have the function of fixing the wafer information but simply has the function of canceling the alarm, and the wafer information manipulating section 76 corrects and fixes the wafer information. Is preferred. With such a configuration, the operator can easily grasp the position where the extra wafer exists from the detection result of the wafer detection sensor. Moreover, the orientation of the wafer W can be easily confirmed by the wafer information retrieved from the memory 74. By operating the wafer information operating unit 76, the operator appropriately corrects the wafer information in the processing unit or the transfer device in which the alarm is issued, changes the slot position of the recovery destination, and the like, and further releases the alarm releasing unit 79. It is possible to release the alarm from and start the collection of the extra wafer. This further reduces the burden on the operator.

In the above description, the extra wafer information regarding the hot plate units (HP) 16a to 16c and the cooling unit (COL) 16d is not displayed on the screen of the monitor 75. However, the hot plate units (HP) 16a to 16c and the cooling unit (COL) 1
6d is provided with a wafer detection sensor, or the hot plate units (HP) 16a to 16c and the cooling unit (COL) are operated from the operation of the main wafer transfer device (PRA) 15.
It is also possible to store the loading / unloading history of the wafer W with respect to 16d in the memory 74. Thereby, the hot plate units (HP) 16a to 16c and the cooling unit (C
For the extra wafer existing in (OL) 16d,
It is possible to collect the extra wafer in a predetermined slot of a predetermined hoop F according to the same procedure as in the case where the extra wafer exists in another processing unit or the like.

In the above description, regarding the wafer W existing in the cleaning processing system 1 when the cleaning processing system 1 is powered off, the memory 74 stores only the information on the position and orientation of the wafer W. . Therefore, in addition to these, information on which wafer W (CRA) 13 has taken out from which slot of which hoop F, and processing of the wafer reversing units (RVS) 14c and 14d for a certain wafer W. Information regarding the orientation of the wafer W determined from the number of times, and movement history information in the cleaning processing system 1 for the wafer W by storing the movements of the wafer transfer apparatus (CRA) 13 and the main wafer transfer apparatus (PRA) 15. Is stored in the memory 74 so that these pieces of information can be taken out at the time of the initialization processing, it is possible to return the extra wafer to the slot of the FOUP F from which it is carried out.

When it is clear that the cleaning process is performed according to the process recipe shown in FIG. 4, and the movement history information of the wafer W in the cleaning process system 1 is stored in the memory 74, It is also possible to restart the cleaning process without performing the extra wafer recovery process. For example, a scrub cleaning unit (SCR) 21 for surface cleaning
For the extra wafers existing in c.21d, the front surface cleaning processing is performed from the beginning, and then the back surface cleaning and drying processing are performed according to the processing recipe, and then the predetermined hoop F
Can be stored in.

The extra wafers detected by the scrub cleaning units (SCR) 21a and 21b for cleaning the back surface may be contaminated on the surface. Therefore, after the spin drying, the surface cleaning is performed again. It is preferable to return to the scrub cleaning unit (SCR) 21c · 21d for use for reprocessing the surface cleaning. In this case, after that, the back surface is washed again to perform the drying process, and the operation of collecting in the predetermined slot of the predetermined hoop F may be performed.

Hot plate unit (HP) 16a-
When the extra wafer exists in 16c or the cooling unit (COL) 16d, at least the cleaning processing of the surface of the extra wafer is completed, but again,
A series of processes starting from the front surface cleaning process may be performed, or a series of processes starting from the back surface cleaning process may be performed.

In the case of (a-2) described above, that is, when the cleaning processing system 1 is powered on to start the cleaning processing system 1, the main wafer transfer device (PR
A) When the extra wafer is held by 15 and the extra wafer is in the reverse direction, and when the extra wafer already exists in both of the wafer reversing units (RVS) 14c and 14d, the main wafer transfer is performed. Device (PRA) 15 to wafer reversal unit (RV
The wafer W can be delivered to the S) 14c and 14d by the following method.

That is, the main wafer transfer device (PRA) 15
Has a main wafer transfer arm 55, 56, 57, so that it can structurally have three wafers. However, the number of extra wafers held by the main wafer transfer apparatus (PRA) 15 at the time of restart is 0, 1 or 2, and the number of extra wafers cannot be three. Because the main wafer transfer device (PRA) 15 only performs the wafer W replacement operation, no wafers or 1 wafers are transferred.
In many cases, two wafers are present when the power of the cleaning processing system 1 is turned off during the process of replacing the wafers W in a certain processing unit, that is, the wafer W in the processing unit is transferred to the main wafer transfer device. (PRA) 15 is taken out, and the power is turned off before the main wafer transfer apparatus (PRA) 15 carries the wafer W into another processing unit.
This is a rare phenomenon.

Therefore, the wafer reversing unit (RV
S) 14c or 14d extra wafer is received by the vacant arm of the main wafer transfer device (PRA) 15 and then the vacant wafer reversing unit (RVS)
The extra wafer can be transferred to either 14c or 14d to perform the work (a-2).

When the main wafer transfer device (PRA) 15 can hold only up to two wafers (for example, the main wafer transfer device (PRA) 15 can wait up to two wafers W in normal operation). Therefore, if the main wafer transfer device (PRA) 15 has a maximum of two wafers due to the operation software, the main wafer transfer device (PRA) 15 will be
If you have one extra wafer and the extra wafer exists in both of the wafer reversing units (RVS) 14c and 14d, you can either stop the collection or collect it without considering the orientation of the extra wafer. Good. When the collection is stopped, the operator carries out the collection work. When the main wafer transfer device (PRA) 15 can hold three wafers at a time in terms of operation software, the operation (a-2) can be performed in any case.

In the case of (b-2) described above, that is,
When the cleaning processing system 1 is powered on to start the cleaning processing system 1, the wafer reversing unit (RVS) 1
When an extra wafer exists in 4c and 14d and the orientation of the extra wafer is unknown, a scrub cleaning unit (SCR) 21a.
If an extra wafer already exists in any of 1b, the extra wafer can be collected as follows.

That is, the main wafer transfer device (PRA) 15
The empty arm picks up the extra wafer from one of the scrub cleaning units (SCR) 21a and 21b for backside cleaning, and inserts it into one of the empty scrub cleaning units (SCR) 21a and 21b for backside cleaning. The extra wafer in the (RVS) 14c and 14d is transferred, and the operator visually observes the front and back. The subsequent recovery method is as described above.

If the main wafer transfer device (PRA) 15 can hold three wafers W, the cleaning processing system 1
When the extra wafer is transferred to the main wafer transfer device (P
RA) 2 in 2, scrub cleaning unit (SCR) 2
Wafer reversal unit (RVS), 1 each for 1a and 21b
Even if there is one wafer in each of 14c and 14d, all the extra wafers can be collected face up without any problem.

However, the main wafer transfer device (PRA) 15
However, if only two wafers can be held at the same time because of operation software, two extra wafers are provided in the main wafer transfer device (PRA) 15 and one extra wafer is provided in each of the scrub cleaning units (SCR) 21a and 21b. If there is one wafer in each of the wafer reversing units (RVS) 14c and 14c, it is not possible to collect all the extra wafers face up.

In this case, the scrub cleaning unit (S
The CR) 21a or 21b extra wafer is collected by the operator himself, and the scrub cleaning unit (SC
By setting either R) 21a or 21b to an empty state, all the other extra wafers can be collected face up. In addition, scrub cleaning unit (SCR) 2
Since 1a and 21b are arranged outside the cleaning processing system 1 and in the lower stage, the operator can easily take out the extra wafer from either of the scrub cleaning units (SCR) 21a and 21b. On the other hand, since the wafer reversing units (RVS) 14c and 14d are located at the center of the cleaning processing system 1, it is difficult for the operator to take out the extra wafer from the wafer reversing units (RVS) 14c and 14d.

For example, when there is a processing unit in which a defect occurs even after the initialization processing of the cleaning processing system 1, for example, the power for driving the unit is stopped, the supply of the processing liquid is stopped, and the power to the unit is stopped. If a problem such as a stop of supply occurs, the initialization process of the processing unit cannot be performed. For this reason, even if there is an extra wafer in the processing unit, it may not be recovered.

In such a case, first, the first recovery operation is performed on the recoverable extra wafers existing in the processing units other than the processing units in which the initialization processing has not been completed. Next, the operator manually repairs the malfunction occurring in the processing unit without turning off the power source of the apparatus, and then performs the initialization process again without turning off the power source of the apparatus. As a result, the cleaning processing system 1
It is possible to perform the second collection operation of the extra wafer existing inside. By following the procedure described above, after the cleaning processing system 1 is turned on and started,
All extra wafers can be collected without turning off the power supply of the apparatus again.

The memory 74 stores the position and orientation of the wafer W, but may further store information as to which slot of which FOUP F has carried out the wafer W. This information is used to collect hoops F when collecting extra wafers.
The loading slot for the extra wafer may be determined. For example, it may be collected in the same slot as the carry-out slot, or may be collected in a predetermined slot assigned by the apparatus control unit (CPU) 71 according to a slot designated by the operator or a collection recipe.

In the above description, the semiconductor wafer is taken as the substrate, but the substrate may be an LCD substrate or the like. Further, the substrate processing apparatus and the substrate processing method of the present invention can be applied to an apparatus and a method for processing both surfaces of a substrate such as a resist coating processing apparatus and a developing processing apparatus.

[0152]

As described above, according to the substrate processing apparatus and the substrate processing method of the present invention, the substrate existing in the substrate processing apparatus when the substrate processing apparatus is powered off and then restarted for the first time. The position and orientation of can be easily grasped.
Thereby, the operator can easily distinguish the front surface and the back surface of the substrate and perform the operation according to the predetermined processing procedure to easily collect the substrate with the orientation thereof aligned. Also, automatic collection can be performed. In this way, it is possible to prevent the substrate from being damaged and to reduce the burden on the operator. Further, there is an effect that it is possible to prevent the occurrence of the removal of the substrate when the operator directly handles the substrate.

[Brief description of drawings]

FIG. 1 is a plan view showing a schematic structure of a cleaning processing system.

FIG. 2 is a side view of the cleaning processing system shown in FIG.

FIG. 3 Delivery / reversal unit, main wafer transfer device and heating /
Sectional drawing which shows arrangement | positioning of a cooling unit.

FIG. 4 is a flowchart schematically showing a cleaning processing step.

5 is an explanatory diagram showing one aspect of a configuration of a machine control unit (MCB) in the cleaning processing system shown in FIG.

FIG. 6 is an explanatory diagram showing one mode of collecting extra wafers at the time of starting the cleaning processing system.

FIG. 7 is an explanatory diagram schematically showing a specific example of contents displayed on the monitor when the cleaning processing system is started.

FIG. 8 is an explanatory diagram showing a change in display on the monitor during data editing.

FIG. 9 is an explanatory diagram showing another aspect of the configuration of the machine control unit (MCB) in the cleaning processing system.

FIG. 10 is a flowchart showing another mode of collecting extra wafers at the time of starting the cleaning processing system.

FIG. 11 is another explanatory diagram schematically showing a specific example of the contents displayed on the monitor when the cleaning processing system is activated.

FIG. 12 is a flowchart showing still another mode of collecting extra wafers at the time of starting the cleaning processing system.

[Explanation of symbols]

1; Cleaning system 3; Substrate cleaning processing unit 4; In / out port 5: Wafer transfer unit 13; Wafer transfer device 14; Delivery / reversal unit (TRS / RVS) 14a and 14b: Wafer transfer unit (TRS) 14c, 14d; Wafer reversing unit (RVS) 15; Main wafer transfer device (PRA) 16; Heating / cooling unit (HP / COL) 16a to 16c; hot plate unit (HP) 16d; Cooling unit (COL) 19 ・ 19 '; Machine control unit (MCB) 21a to 21d; scrub cleaning unit (SCR) 71; Device control unit (CPU) 72; Recipe controller 73; operation unit 74; Memory 75; Monitor 76; Wafer information operation unit 77; Collection start section 78a / 78b; alarm device 79; Alarm release unit W: Semiconductor wafer (substrate) F: Hoop (board container)

Continued front page    F-term (reference) 5F031 CA02 CA05 DA08 EA14 FA01                       FA02 FA07 FA11 FA12 FA15                       FA20 GA36 GA57 GA58 GA59                       HA13 JA22 JA23 LA13 MA23                       MA30 NA02 NA10 NA16 PA02                       PA10 PA20

Claims (26)

[Claims] 1. A device main body for performing a predetermined process on a substrate and inverting the substrate therein, a substrate transfer means for transferring a substrate in the device main body, and a device existing in the device main body. Substrate detection means for detecting a substrate, and information about the position and orientation of the substrate existing in the apparatus body when the apparatus body is powered off, and stored when the apparatus body is powered on next. The storage means for retrieving the stored information is collated with the detection information detected by the substrate detection means when the apparatus main body is powered on, and the information retrieved from the storage means is collated. In some cases, an alarm means for issuing an alarm, an alarm canceling means for canceling the alarm, and a control means for controlling the substrate transfer means so as to recover the substrate existing in the apparatus body to a predetermined position outside the apparatus body. Control means and recovery start means for issuing a command to the control means to start substrate recovery, the alarm is canceled by the alarm cancellation means, and the substrate in the apparatus main body is recovered in a predetermined direction. The substrate processing apparatus is characterized in that the recovery start means issues a substrate recovery command to the control means after it is confirmed. 2. The alarm canceling means comprises information modifying means for modifying the information about the board for which the alarm is issued by the alarm means to fix the board information, and for canceling the alarm after the board information is fixed. The control means controls the substrate transfer means so as to collect the substrate existing in the apparatus main body at a predetermined position outside the apparatus main body based on the substrate information determined by the information correction means. The substrate processing apparatus according to claim 1. 3. The information correction unit retrieves data indicating that a substrate exists at the predetermined position from the storage unit even though the substrate detection unit has not detected the substrate at the predetermined position. Data is deleted, or data indicating that a substrate does not exist at the predetermined position is retrieved from the storage unit even though the substrate detection unit detects the substrate at the predetermined position. In this case, data indicating the state of the substrate existing at the predetermined position is added, or the data regarding the orientation of the substrate existing at the predetermined position retrieved from the storage means is different from the actual orientation of the substrate. The substrate processing apparatus according to claim 2, wherein the substrate can be modified. 4. A device main body for performing a predetermined process on a substrate and inverting the substrate therein, a substrate transfer means for transferring the substrate in the device main body, and a power source of the device main body when the power is turned off. Storage means for storing information relating to the position and orientation of the board existing in the apparatus body, and for retrieving the stored information when the apparatus body is powered on next, and the apparatus body being powered on. Information manipulating means for manipulating the information retrieved from the storage means when the substrate is manipulated, and the substrate carrying means for collecting the substrate to a predetermined position outside the apparatus main body based on the substrate information obtained by the information manipulating means. After it is confirmed that the substrate in the apparatus main body is recovered in a predetermined direction, it is provided with a control means for controlling the substrate and a recovery start means for issuing a command to the control means to start substrate recovery. The recovery start means the substrate processing apparatus characterized by issuing a command for collecting the substrate to the control means. 5. The information manipulating means deletes data indicating that the board exists at a predetermined position taken out from the storage means, or that the board does not exist at the predetermined position from the storage means. Data indicating that the substrate is present at the predetermined position when the data indicating the above is taken out, or the data regarding the orientation of the substrate present at the predetermined position taken out from the storage means is different from the actual orientation of the substrate. The substrate processing apparatus according to claim 4, wherein the data can be modified in some cases. 6. The substrate is continuously collected at a predetermined position outside the device body after it is confirmed that all the substrates in the device body are collected in a predetermined direction. The substrate processing apparatus according to claim 1. 7. A substrate processing apparatus for performing a predetermined process on a substrate, comprising: a container loading / unloading part for loading / unloading a container capable of storing a plurality of substrates at a predetermined interval; and a predetermined surface or back surface of the substrate. An apparatus main body having a substrate processing unit having a liquid processing unit for performing the liquid processing of 1 and a reversing unit for reversing a substrate, and a substrate transfer unit for transferring a substrate between the container loading / unloading unit and the substrate processing unit. A first substrate transfer device that transfers a substrate in the substrate processing unit, a second substrate transfer device that transfers a substrate in the substrate transfer unit, and a substrate detection device that detects a substrate existing in the device main body And means for storing information relating to the position and orientation of the substrate existing in the apparatus body when the apparatus body is powered off, and storing the stored information when the apparatus body is powered on next. Means and the detection information detected by the substrate detection means when the apparatus main body is powered on and the information retrieved from the storage means are collated, and an alarm is issued when the information is different. Alarm means, alarm canceling means for canceling the alarm, and the first substrate transfer device and the second substrate transfer device for recovering the substrate existing in the apparatus body into the container placed in the container loading / unloading section. Control means for controlling the substrate transfer apparatus, and recovery start means for issuing a command to the control means to start substrate recovery, wherein the alarm is canceled by the alarm cancellation means, and the substrate in the apparatus main body is The substrate processing apparatus, wherein the recovery start means issues a substrate recovery command to the control means after it has been confirmed that is recovered in a predetermined direction. 8. The alarm means is configured such that, when the apparatus main body is powered on, the substrate detecting means causes the liquid processing unit, the reversing unit, the first substrate transfer device, or the second substrate transfer device. The substrate processing apparatus according to claim 7, wherein when the apparatus detects a substrate, an alarm is issued. 9. The container recovering procedure and the container for recovering the substrate when the control unit compares the detection information detected by the substrate detecting unit with the information retrieved from the storage unit is normal. 9. The substrate accommodation slot in is automatically determined, and the substrate is recovered by controlling the first substrate transfer device and the second substrate transfer device according to a command from the recovery start means. The substrate processing apparatus according to. 10. The alarm canceling means comprises information modifying means for modifying the information about the substrate for which the alarm is issued by the alarming means to fix the board information, and for canceling the alarm after the board information is fixed. The control unit is configured to collect the substrate existing in the apparatus main body into the container placed in the container loading / unloading unit based on the substrate information determined by the information correction unit. 10. The substrate processing apparatus according to claim 7, further comprising: controlling the second substrate transfer device. 11. The information correction unit retrieves data indicating that a substrate exists at the predetermined position from the storage unit even though the substrate detection unit has not detected the substrate at the predetermined position. If the data is deleted, or data indicating that the substrate is not present at the predetermined position is retrieved from the storage unit even though the substrate detection unit detects the substrate at the predetermined position. In this case, data indicating the state of the substrate at the predetermined position is added, or the data regarding the orientation of the substrate at the predetermined position retrieved from the storage means is different from the actual orientation of the substrate. 11. The substrate storing slot in a container for collecting substrates, or the substrate collecting order can be changed, as claimed in claim 10. Substrate processing equipment. 12. The information correction means comprises a monitor capable of displaying the information retrieved from the storage means, the information displayed on the monitor is edited on a monitor screen, and the information is displayed from the screen of the monitor. The substrate processing apparatus according to claim 10 or 11, characterized in that a substrate recovery command from the recovery start means can be sent to the control means. 13. A substrate processing apparatus for performing a predetermined process on a substrate, comprising: a container loading / unloading unit for loading / unloading a container capable of housing a plurality of substrates at a predetermined interval; and a predetermined surface or back surface of the substrate. An apparatus main body having a substrate processing unit having a liquid processing unit for performing the liquid processing of 1 and a reversing unit for reversing a substrate, and a substrate transfer unit for transferring a substrate between the container loading / unloading unit and the substrate processing unit. A first substrate transfer device for transferring a substrate in the substrate processing part, a second substrate transfer device for transferring a substrate in the substrate transfer part, and present in the device main body when the power supply of the device main body is cut off Storage means for storing information regarding the position and orientation of the substrate to be stored, and the stored information being taken out when the apparatus body is powered on next; and the memory when the apparatus body is powered on. hand Information operating means for operating the information taken out from the stage, and the substrate existing in the apparatus main body is collected into the container placed in the container loading / unloading section based on the substrate information obtained by the information operating means. A control means for controlling the first substrate transfer device and the second substrate transfer device, and a recovery start means for issuing a command to start the substrate recovery to the control means. The substrate processing apparatus, wherein the recovery starting unit issues a substrate recovery command to the control unit after it is confirmed that the existing substrate is recovered in a predetermined direction. 14. The information manipulating means deletes data indicating that the board exists at a predetermined position taken out from the storage means, or that the board does not exist at the predetermined position from the storage means. Add the data that the substrate is present at the predetermined position when the data indicating
Alternatively, when the data regarding the orientation of the substrate existing at the predetermined position taken out from the storage means is different from the actual orientation of the substrate, the data is corrected, or the substrate accommodation slot in the container for collecting the substrate is changed, 14. The substrate processing apparatus according to claim 13, wherein the substrate collection order can be changed. 15. The information operating means comprises a monitor capable of displaying information retrieved from the storage means, the information displayed on the monitor is edited on a monitor screen, and the information is displayed on the monitor screen. The substrate processing apparatus according to claim 13 or 14, wherein a command for substrate recovery from the recovery start means can be sent to the control means. 16. The method according to claim 7, wherein the storage unit stores the state by determining the orientation of the substrate existing in the substrate processing unit according to the number of times the substrate is inverted by the inversion unit. Item 16. The substrate processing apparatus according to any one of items 15. 17. The substrate existing in the apparatus main body is recovered in a container placed on the container loading / unloading part with the surface of the substrate as an upper surface. 16. The substrate processing apparatus according to any one of 16. 18. The liquid processing unit is a single-wafer cleaning unit that performs cleaning processing on the front surface or the back surface of a substrate, and the single-wafer cleaning units are stacked in multiple stages. The substrate processing apparatus according to any one of claims 7 to 17. 19. The thermal processing unit according to claim 7, wherein the substrate processing unit includes a thermal processing unit that performs a predetermined thermal processing on the substrate that has been subjected to the liquid processing in the liquid processing unit. The substrate processing apparatus according to item 1. 20. The thermal processing unit comprises a heat processing unit for heat-treating a substrate, and a cooling processing unit for cooling the substrate heat-treated in the heat treatment unit. The substrate processing apparatus described. 21. A substrate processing method in a substrate processing apparatus comprising substrate transfer means for performing a predetermined process on a front surface and a back surface of a substrate and transferring the substrate therein, which is provided when a power source of the substrate processing apparatus is shut off. A step of storing information on the position and orientation of a substrate existing in the substrate processing apparatus in a memory; and a step of storing the information stored in the memory when the substrate processing apparatus is first powered on after the storing step. The step of taking out, and the information taken out in the step of taking out is corrected so as to match the actual state of the substrate in the substrate processing apparatus,
Based on the board information determined in the step of determining the board information, the determination step,
And a step of unloading a substrate existing in the substrate processing apparatus to a predetermined position outside the substrate processing apparatus in a predetermined direction by the substrate transporting means. 22. A substrate processing method in a substrate processing apparatus, comprising substrate transfer means for performing a predetermined process on a front surface and a back surface of a substrate and transferring the substrate therein, the method comprising: A step of storing information on the position and orientation of a substrate existing in the substrate processing apparatus in a memory; and when the power is first turned on to the substrate processing apparatus after the storing step, the information stored in the memory is taken out. In addition, the step of detecting a substrate existing in the substrate processing apparatus, the information retrieved from the memory in the detection step and the positional information of the substrate detected in the substrate processing apparatus are collated, If there is no difference in the information of the substrate, the substrate information is confirmed, and the substrate existing in the substrate processing apparatus is moved in the predetermined direction by the substrate transfer means based on the substrate information. And a step of unloading the substrate to a predetermined position outside the processing apparatus. 23. A substrate processing method in a substrate processing apparatus comprising substrate transfer means for performing a predetermined process on a front surface and a back surface of a substrate and transferring the substrate in the substrate processing method, the method comprising: A step of storing information on the position and orientation of a substrate existing in the substrate processing apparatus in a memory; and when the power is first turned on to the substrate processing apparatus after the storing step, the information stored in the memory is taken out. In addition, the step of detecting a substrate existing in the substrate processing apparatus, the information retrieved from the memory and the positional information of the substrate detected in the substrate processing apparatus are collated, and these information are different from each other. The step of issuing an alarm when there is a point or an uncertain point, and the step of fixing the substrate information indicating the actual substrate state in the substrate processing apparatus by the operator and releasing the alarm. Based on the determined board information in the release process,
And a step of unloading the substrate existing in the substrate processing apparatus to a predetermined position outside the substrate processing apparatus in a predetermined direction by the substrate transfer means. 24. In the detecting step, the information retrieved from the memory and the position of the substrate detected in the substrate processing apparatus are displayed on a monitor, and in the releasing step, the information displayed on the monitor is displayed on a monitor screen. 24. The substrate processing method according to claim 23, wherein the substrate recovery command is sent from the monitor screen to a control unit that controls the operation of the substrate transfer means in the unloading step. 25. A device main body for performing a predetermined process on the substrate and inverting the substrate therein, a substrate transfer means for transferring the substrate in the device main body, and present in the device main body. Substrate detection means for detecting a substrate, and for collecting the substrate at a predetermined position outside the device body when the substrate detection means detects the substrate in the device body when the device body is powered on. A control means for determining the operation of the substrate transfer means, and a recovery start means for sending a command to start the recovery of the substrate to the control means, and the substrate existing in the apparatus main body is recovered in a predetermined direction. After confirming that, the recovery starting means issues a command for recovering the substrate to the control means. 26. A substrate processing apparatus for performing a predetermined process on a substrate, comprising: a container loading / unloading part for loading / unloading a container capable of storing a plurality of substrates at a predetermined interval; and a predetermined surface or back surface of the substrate. And a substrate processing unit having a reversing unit for reversing the substrate so that the front surface or the back surface of the substrate becomes the upper surface of the substrate, and the substrate between the container loading / unloading unit and the substrate processing unit. An apparatus main body having a substrate transfer section that transfers a substrate, a first substrate transfer apparatus that transfers a substrate in the substrate processing section, and a second substrate transfer apparatus that transfers a substrate in the substrate transfer section, Substrate detecting means for detecting a substrate existing in the apparatus body; and when the substrate detecting means detects the substrate in the apparatus body when the apparatus body is powered on, the substrate is carried in the container. Control means for deciding the operation of the first substrate transfer device and the second substrate transfer device for recovering to the container placed on the exit part, and recovery start for sending a command to start the substrate recovery to the control means A substrate processing unit, wherein the recovery start unit issues a substrate recovery command to the control unit after it is confirmed that the substrate in the substrate processing unit is recovered in a predetermined direction. apparatus.