JPH08102459A - Cleaning treatment equipment and its control method - Google Patents

Abstract

PURPOSE: To relieve wafers during treatment when troubles of a treating tank are generated, by constituting each conveying equipment so as to enable carrying out objects to be treated during treatment to rinsing tanks in the downstream, according to a signal from abnormality sensors. CONSTITUTION: When the abnormality of a chemical liquid tank is detected by various kinds of sensors installed in the chemical liquid tank, an abnormality processing system is set to execute automatic carry-out operation. Wafers in a treating tank are automatically carried out by wafer conveying equipment 140a-n and transferred from chemical liquid tanks 202a-n in which troubles are generated to primary rinsing tanks 203a-n or secondary rinsing tanks 204a-n . Hence the relief of a lot during treatment is realized. Since the lot during treatment can be automatically carried out to the rinsing tanks in the downstream, the damage of wafers cauused by troubles can be restrained to a minimum.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning processing apparatus for cleaning an object to be processed such as a semiconductor wafer and a control method thereof.

[0002]

2. Description of the Related Art A cleaning process in a manufacturing process of a semiconductor device such as an LSI will be described as an example. Conventionally, in order to remove contamination such as particles, organic contaminants and metal impurities on the surface of a semiconductor wafer, Cleaning treatment equipment is used. Among them, the wet type cleaning treatment equipment can remove particles effectively and can perform batch treatment,
Widely used.

In this type of cleaning processing apparatus, a carrier, which stores a predetermined number of semiconductor wafers, for example, 25 semiconductor wafers, is carried into a loader section of the processing apparatus by a transfer robot to perform orientation flat alignment. After that, in the wafer holding unit, the housed semiconductor wafer is taken out of the carrier by the holding tool and placed in a transfer standby state. Then, the semiconductor wafer in the transfer standby state is
A transfer device having a gripping device called a wafer chuck transfers the wafer to a cleaning processing unit where various cleaning processes are performed, and a predetermined cleaning process is performed in the cleaning processing unit.

The cleaning processing section is equipped with SC1 cleaning, SC2 cleaning,
One or more cleaning units for cleaning various chemicals such as HF cleaning and SPM cleaning are sequentially arranged,
Each cleaning unit is composed of a chemical tank for chemical cleaning and a water cleaning tank for pure water cleaning. The processing object transferred to a certain cleaning unit by the transfer device is
First, the chemical solution is washed in the chemical solution tank, and then transferred to a water washing tank disposed downstream of the chemical solution tank. Then, in the water washing tank, the chemical liquid adhering to the surface of the semiconductor wafer is washed away with pure water and then transferred to a cleaning unit using another type of chemical liquid. In this way, the semiconductor wafer that has undergone a series of cleaning processes is finally cleaned with pure water, dried, and carried out of the processing apparatus via the unloader unit.

[0005]

In the chemical solution tank of the cleaning apparatus as described above, a chemical solution having a high temperature and a high reactivity is generally used, such as APM (a mixture solution of ammonia water and hydrogen peroxide solution), HPM (a mixture of hydrochloric acid and hydrochloric acid). Hydrogen peroxide mixture), HF
Since liquid or SPM (sulfuric acid) is used, an abnormality in the processing chemical itself, such as an abnormality in temperature or an abnormality in the amount of chemical, or a failure in the chemical tank itself, such as an abnormality in the chemical circulation system, When an abnormality in the exhaust system or an abnormality in the opening / closing of the lid portion occurs, the lot being processed is damaged and the cleaning device itself may be in a dangerous state. Therefore, with respect to troubles in the chemical liquid tank, it is important that the cleaning device itself is automatically controlled to avoid the worst situation in accordance with the fail-safe concept. Development is strongly desired.

By the way, in the chemical bath, various troubles may occur during the cleaning process. For example, if the temperature of the drug solution is too low, sufficient cleaning cannot be performed, and if the temperature of the drug solution is too high, normal parts other than foreign matter may be damaged. In addition, if sufficient chemicals are not supplied to the chemical tank, it may not be possible to perform sufficient cleaning, and it may damage the wafer part exposed to the outside air.If the chemical solution in the chemical tank is too large, the components of the chemical tank itself may be damaged. Damage and contamination may occur on the. Further, the cleaning apparatus is provided with an exhaust means for exhausting the vaporized chemical liquid, but when trouble occurs in such an exhaust system, the vaporized chemical liquid can be sufficiently exhausted. It may damage and contaminate the chemical bath components. Alternatively, even when an abnormality occurs in the chemical liquid circulation system, sufficient cleaning cannot be performed. Furthermore, the chemical bath is provided with a lid, which is opened during loading and unloading of wafers and closed at other times to prevent diffusion of the chemical from the chemical bath,
Foreign matter is prevented from entering the chemical bath from the outside. However, if a trouble occurs in the lid opening / closing mechanism, the wafer in the chemical solution tank cannot be carried out,
The wafer in the chemical bath may be damaged. As described above, various troubles may occur in the chemical tank of the cleaning treatment apparatus, but conventionally, there is no cleaning treatment apparatus and a control method therefor capable of performing an optimum abnormal time treatment against these troubles. It was

The present invention has been made in view of the above technical problems on which a conventional cleaning processing apparatus is based,
Its purpose is to be able to flexibly respond to troubles that have occurred in the chemical liquid tank, minimize damage to the lot being processed in the chemical liquid tank where the trouble has occurred, and not only to the chemical liquid tank. It is an object of the present invention to provide a new and improved cleaning treatment apparatus and its control method capable of automatically avoiding the worst case in which a trouble occurs in the entire cleaning apparatus.

[0008]

In order to solve the above-mentioned problems, according to a first aspect of the present invention, a loader section for loading an object to be processed into the apparatus and an object to be processed are carried out of the apparatus. And one or more chemical baths for cleaning the object to be treated with the same type of chemical solution, and one or more water washings disposed downstream of the chemical bath for cleaning the object to be treated with pure water. One or more cleaning units consisting of a tank and
The objects to be processed are sequentially arranged between the loader section and the unloader section, and between the loader section and the cleaning unit, or between the adjacent cleaning units, or between the cleaning unit and the unloader section. In a cleaning processing apparatus equipped with one or two or more transfer apparatuses for transferring, the cleaning processing apparatus is provided with an abnormality detection sensor, and each of the transfer apparatuses receives an object to be processed during processing in response to a signal from the abnormality detection sensor. Provided is a cleaning treatment apparatus, which is configured so that a body can be transported to a water washing tank downstream thereof.

Regarding the signal from the abnormality detection sensor, the abnormality signal is a primary abnormality signal generated when the abnormality signal deviates from the steady range and is in the primary abnormality range, and a secondary abnormality signal which further deviates from the primary abnormality range. It is composed of a secondary abnormal signal generated when it is in an abnormal range, each of the transfer device, in accordance with the secondary abnormal signal, to transfer the object to be processed to the washing tank downstream thereof. It is preferable to configure as possible.

Further, in the processing at the time of abnormality, when the abnormality signal sent from the abnormality detection sensor continues for a predetermined time or longer, the object to be processed is transferred to the washing tank downstream thereof by the transfer device. It is preferable to operate.

According to a second aspect of the present invention, the object to be processed is provided with a loader section for loading the object to be processed into the apparatus and an unloader section for discharging the object to be processed from the apparatus. 1 or more chemical solution tanks to be cleaned with the above chemical solution, and the object to be processed which is arranged downstream of the chemical solution tank is cleaned with pure water 1
Alternatively, in a cleaning processing apparatus in which one or more cleaning units including two or more water washing tanks are sequentially arranged between the loader section and the unloader section, an abnormality detection sensor is provided in the cleaning processing apparatus, A cleaning processing apparatus is provided, which is configured to drain the chemical liquid in the chemical liquid tank and introduce pure water into the chemical liquid tank in response to a signal from the abnormality detection sensor.

Regarding the signal from the abnormality detecting sensor, in this case as well, the signal is a primary abnormality signal generated when the signal is out of the steady range and is in the primary abnormal range, and further out of the primary abnormal range. It is composed of a secondary abnormal signal generated when it is in the secondary abnormal range, and the chemical liquid in the chemical liquid tank is discharged according to the secondary abnormal signal, and pure water is introduced into the chemical liquid tank. It is preferable to configure.

Further, in the abnormal time processing, when the abnormal signal sent from the abnormality detection sensor continues for a predetermined time or longer, the chemical liquid in the chemical liquid tank is drained and pure water is introduced into the chemical liquid tank. It is preferably configured as described above.

As the abnormality detecting sensor, a sensor for detecting an abnormality in each chemical liquid tank, for example, a temperature sensor,
It is possible to use a liquid level sensor, an exhaust system sensor, a sensor that detects an abnormality in the chemical liquid circulation system, or a sensor that detects an opening / closing abnormality of the lid part of the chemical liquid tank, and the abnormality signal detected by those sensors can be used. Is preferably used as a trigger for abnormal time processing.

Furthermore, according to another aspect of the present invention,
In the above-mentioned cleaning processing device, an abnormal control flow that operates to automatically dispense the lot in the chemical liquid tank when the chemical liquid tank is abnormal, or the chemical liquid in the chemical liquid tank is discharged when the chemical liquid tank is abnormal, There is provided a control method for an abnormal time control flow that operates so as to automatically introduce pure water into the tank.

As described above, according to the first aspect of the present invention, when an abnormality is detected by the abnormality detecting sensor, the object to be treated is automatically taken out from the chemical liquid tank in which the abnormality has occurred by the conveying device, It can be moved to a water washing tank located downstream of the chemical solution tank. As described above, by automatically retracting the object to be processed from the chemical liquid tank in which the abnormality has occurred to the safe water washing tank, it is possible to minimize damage to the wafer being processed. Then, if further required, the wafer is automatically transferred to the final cleaning tank at the most downstream through the washing tank of each cleaning unit in sequence, and after the wafer is dried in the drying processing tank, if necessary, from the unloader section. It is possible to carry it out of the device.

Further, according to the second aspect of the present invention, when an abnormality is detected by the abnormality detection sensor, the chemical liquid is automatically drained from the chemical liquid tank in which the abnormality has occurred, and further, in the chemical liquid tank after the waste liquid is discharged. By introducing pure water into and circulating the pure water, the object to be processed can be placed in a safe state, the damage to the wafer being processed can be minimized, and then the subsequent measures can be taken. This process is carried out to the outside of the chemical liquid tank, especially when the chemical liquid circulation system malfunctions, the exhaust system malfunctions, or the chemical liquid tank lid opening / closing mechanism malfunctions. It is effective when it becomes impossible.

According to the present invention, the abnormality signal generated by the abnormality detection sensor is a primary abnormality signal generated when the abnormality signal deviates from the steady range and is within the primary abnormality range, and further exceeds the primary abnormality range. It consists of a secondary abnormal signal that is generated when it is in the secondary abnormal range.For example, in the case of a primary abnormal signal, only a warning is issued, and in the case of a secondary abnormal signal, automatic abnormal condition processing is performed. It is also possible, or based on the duration of the abnormal signal, it is also possible to configure the abnormal time processing only when the abnormality continues for a predetermined time or longer. Accordingly, it is possible to construct a system capable of performing optimum processing.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a cleaning treatment apparatus constructed according to the present invention and a control method thereof will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1, the entire cleaning processing apparatus 1 includes a loader section 100 for accommodating an object to be processed before cleaning, for example, a semiconductor wafer in carrier units, and a cleaning processing section 200 for cleaning the wafer. And an unloader unit 300 for carrying the cleaned wafer out of the apparatus in carrier units.

The loader section 100 includes a mounting section 110 for loading and mounting a carrier C containing a predetermined number, for example, 25 unwashed wafers, and a mounted carrier C.
2 to the holding units 133 and 135 shown in an enlarged manner in FIG. 2, and a transfer unit 130 that takes out the wafer from the carrier C and transfers it to the wafer transfer device 140.
It is mainly composed of This mounting portion 110 is shown in FIG.
As shown in FIG. 11, a hollow mounting table 111 is provided, and a plurality of stations 112a, 112b, ..., 112n each having an opening through which the lower part of the carrier C can be inserted are arranged in two rows on the upper surface thereof. There is. In the vicinity of each corner of each station 112, a locking portion 113 that can lock the upper edge corner of the carrier C is provided.

Further, the loader section 100 includes a moving mechanism 11
5, the moving mechanism 115 can be freely driven in the vertical and horizontal directions by a driving mechanism (not shown), and the carrier C held by the clamp member 116 is moved to desired stations 112a, 112b, ..., 112n. It is possible to move up to. This moving mechanism 1
Reference numeral 15 includes an alignment device 117 for aligning the orientation flats of the wafers W stored in the carrier C, and can align the orientation flats of the wafers W stored when the carrier C is moved.

Further, as shown in FIG. 2, the transfer device 120 is provided behind the loader section 100. The transfer device 120 includes a pair of arms 121 a and 121 b configured to be movable toward and away from each other and the arms 1 a and 121 b.
21a and 121b are horizontally directed, a Z base 123 for moving the lifter in the vertical direction (Z direction), and the Z base 123 itself is moved in the longitudinal direction (X direction) of the cleaning processing apparatus. And an X base 124 for moving the arms 121a, 1
21b, the outer side surfaces of the carrier C are placed on the arms 121a, while the upper side edges of the carrier C are placed.
It is clamped by 121b, and the relay section 13 shown in FIG.
It is configured so that it can be transferred to 0.

The relay section 130, as shown in FIG.
The holding unit 1 fixed on the top plate 132 via the columns 131
33, and a holding portion 135 supported by a movable column 134 that is movable in the Y direction with respect to the top plate 132, respectively, connected in the Y direction. Each of these holding portions 13
Reference numerals 3 and 135 have such a shape that they can pass through the bottom opening of the carrier C. Further, a part of the peripheral edge of the wafer W is inserted into the upper surfaces of the holding portions 133 and 135 to stand substantially vertically. As described above, a predetermined number of arcuate holding grooves 136 are formed, for example, 25 corresponding to the number of wafers of the carrier C stored. On the top plate 132 near the bases of the support column 131 and the moving column 134, locking members 137 for locking the corners of the lower end of the carrier C are provided at four locations. There is.

Then, the wafer transfer device 140 for holding the wafers W held by the holding parts 133 and 135 collectively and transferring the wafers W to the cleaning processing part 200.
Are configured as shown in FIG. That is, the wafer transfer device 140 includes, for example, a pair of left and right gripping members 141a and 141 for collectively gripping 50 wafers.
The wafer chuck 142 configured by b, the support body 143 that supports the wafer chuck 142, and the support body 143 are moved up and down in the vertical direction (Z direction).
A drive mechanism 144 that moves in the front-back direction (Y direction),
This drive mechanism 144 is connected to the longitudinal direction (X
And a transfer base 145 (see FIG. 2) for moving along the direction.

The gripping members 141a and 141b of the wafer chuck 142 are symmetrical with each other.
The rotation shafts 146a and 146b are rotatably supported by the support body 143, and can be opened and closed.
Further, the upper ends of the aluminum gripping members 141a and 141b are fixed to the rotary shafts 146a and 146b, and between the lower ends of the gripping members 141a and 141b, two upper and lower quartz grips are provided. Bars 147a, 147b, 1
48a and 148b are passed in parallel. On the surface of each of the gripping rods 147a, 147b, 148a, 148b,
For example, 50 holding grooves 149 into which the peripheral portion of the wafer W is inserted are formed. Then, each gripping member 141a,
By rotating the rotary shafts 146a and 146b, the 141b has gripping bars 147a, 147b, 148a,
The wafer W is gripped at 148b and can be transferred to a desired position in the vertical direction (Z direction) and the longitudinal direction (X direction).

The transport device 140 includes cleaning units 201a, 201b, ..., 201n, which will be described later.
It is installed to transfer the wafers between them, and by moving the transfer base 145, a lot of a predetermined number of wafers is subjected to the primary cleaning of the loader unit 100 and the cleaning processing unit 200 by the wafer transfer device 140a, for example. Between the units 201a and the primary cleaning unit 201a
And the secondary cleaning unit 201b, or between the primary cleaning unit and the secondary cleaning unit by the wafer transfer device 104b, or by the wafer transfer device 140n (n−
1) Between the next cleaning unit 201n and the nth cleaning tank 140n,
And n-th cleaning unit 201n and unloader unit 300
It is possible to transfer the wafers in lot units between them. Then, the wafer is transferred between the adjacent cleaning units 140 via a secondary washing tank (interface tank) 204 described later, and a wafer described later provided in a predetermined chemical solution tank 202 or washing tanks 204, 205. A wafer can be transferred to the holder 212 (see FIG. 4).

Next, the cleaning processing section 200 will be described. In the cleaning processing section 200, as shown in FIG. 1, a plurality of cleaning units 201a, 201b, ..., 201n are sequentially arranged from a primary cleaning unit to an n-th cleaning unit. Is configured. Each cleaning unit 201 is composed of, for example, a chemical solution tank 202, a primary water cleaning tank 203, and a secondary water cleaning tank 204. After chemical solution cleaning in the chemical solution tank 202, pure water is applied to the wafer W in the primary water cleaning tank 203 and the secondary water cleaning tank 204. After cleaning the attached chemical liquid, the wafer transfer device 140 described above can transfer the chemical liquid to a cleaning unit further downstream. Further, at the most downstream side of the cleaning processing unit 200, a final water cleaning tank 205 for performing final cleaning with pure water and a drying processing tank 206 for drying the cleaned wafers with, for example, IPA (isopropyl alcohol). Are sequentially arranged so that a series of cleaning processes can be performed.

In each cleaning unit, a predetermined chemical liquid is introduced and a chemical liquid cleaning process is performed in accordance with the type of contamination adhering to the wafer surface, such as organic impurities and metal impurities. For example, so-called SC1 cleaning can be performed with a mixed solution of ammonia water and hydrogen peroxide water with respect to organic matter contamination. In addition, the so-called H
It is possible to remove the natural oxide film and metal impurities by F cleaning. Further, by performing so-called SC2 cleaning with a mixed solution of hydrochloric acid and hydrogen peroxide, it is possible to grow a clean natural oxide film while removing metal impurities attached to bare silicon. And
Typical cleaning method based on hydrogen peroxide, so-called R
Speaking of the CA cleaning method, SC1 cleaning → HF cleaning → S
It is possible to clean the wafer by sequentially performing the C2 cleaning by the corresponding cleaning unit.

Next, with reference to FIGS. 4 and 5, the structure of a typical processing tank that can be used in the cleaning apparatus constructed according to the present invention will be described by taking the SC1 cleaning tank 210 as an example. To do. The basic structures of other types of chemical liquid tanks and water washing tanks are the same as those of the SC1 cleaning tank described here, and detailed description thereof will be omitted.

As shown in the figure, the processing bath 210 is a box-shaped processing bath 211 for containing a SC1 cleaning chemical solution composed of a mixture of ammonia water and hydrogen peroxide solution heated to a high temperature, and the inside of this processing bath 211. And the wafer W is placed on, for example, 50
And a wafer holder 212 for holding the wafer vertically.
Further, a cleaning chemical supply port 214 is opened in the bottom portion 213 of the processing bath 211, and the cleaning liquid introduced into the bath through the supply port 214 is used for holding the holder 212 and the bottom portion 2.
It is uniformly supplied to the periphery of the wafer W via the rectifying means 220 interposed between the wafer W and the wafer 13 without generating a turbulent flow.

That is, the rectifying means 220 includes a rectifying plate 221 arranged horizontally so as to divide the processing tank 211 into upper and lower parts, and a diffusion plate 22 arranged above the supply port 214.
2 and. A large number of small holes 223 are bored in the rectifying plate 221, and the chemical liquid introduced from the supply port 214 first collides with the back surface of the diffusing plate 222, and the rectifying plate 221 moves from the periphery of the diffusing plate 222. The wafer W is diffused over the entire back surface, then passes through the small holes 223 of the rectifying plate 221, and is supplied to the periphery of the wafer W held by the wafer holder 212, so that the wafer W is uniformly flown without causing turbulence. Is configured so that the entire wafer W can be uniformly cleaned.

Further, the processing bath 210 receives an inner bath 215 in which the wafer holder 212 is housed and the wafer W can be immersed in the processing liquid, and a processing liquid overflowing from the upper end of the inner bath 215. A chemical solution circulation path 218 is connected between the supply port 214 provided at the bottom 213 of the inner tank 215 and the discharge port 217 provided at the bottom of the outer tank 216. It
A circulation pump P and a filter F are interposed in the chemical liquid circulation path 218 so that the chemical liquid overflowing from the outer tank 216 can be cleaned and circulated and supplied to the inner tank 215 again. ing.

Then, the inner tank 21 of the processing tank 210
5 and above the exhaust port 2 as shown in FIGS.
30 is provided, and the chemical liquid evaporated and vaporized in the processing tank 210 can be appropriately exhausted by an exhaust means 231 such as a vacuum pump.

Further, an openable lid 240 is inserted in the upper opening of the processing bath 210.
By closing 0, it is possible to prevent vaporization and diffusion of the processing liquid during processing, and also to prevent contaminants and dust from mixing into the processing tank 210 from the outside. As shown in FIGS. 5 and 6, the lid 240 is fixed to a pair of fixed open / close arms 242 projecting from two rotary shafts 241 pivotally mounted on the side wall of the processing bath 210. It is composed of a lid 243, and the pair of lids 243 can be opened and closed by rotating the rotary shaft 241 with a predetermined time delay by an air cylinder (not shown).

In the processing bath 210, various abnormality detecting sensors, for example, a temperature sensor 251 for monitoring a change in the temperature of the chemical liquid, a liquid level sensor 252 for monitoring a change in the liquid surface of the chemical liquid, and a lid of the chemical liquid tank 210. A lid sensor 253 that monitors the opening / closing operation of the body 243, a circulation system sensor 254 that monitors abnormalities in the circulation system of the chemical solution, and an exhaust sensor 255 such as a manometer that monitors abnormalities in the exhaust system are provided. The detection signal from the sensor is electrically controlled 2
It is possible to drive the cleaning processing apparatus in the abnormal-time processing mode described later by sending the cleaning processing apparatus to 60 as appropriate. It is possible to use various commercially available or publicly known sensors for these sensors, but the present invention is not intended for the sensors themselves, and therefore detailed description thereof is omitted. Further, in the illustrated example, the configuration is shown in which the exhaust system is shown in the chemical liquid tank, but the present invention is not limited to such an embodiment, and an exhaust system for exhausting the entire cleaning processing apparatus is provided outside the chemical liquid tank. It goes without saying that it can be applied to the configuration.

As described above, the cleaning processing unit 200 shown in FIG.
The wafer W that has been returned to the carrier C after completion of the cleaning process is provided downstream of the cleaning processing unit 200.
Although the unloader unit 300 is provided to carry out the unloading device to the outside of the apparatus, the basic configuration of the unloader unit 300 is the same as that of the loader unit 100. Processed wafer W
Are carried out of the device. Therefore, detailed description is omitted here.

The cleaning processing apparatus 1 to which this embodiment is applied is
It is configured as described above, and then its normal operation will be described. (1) Normal processing operation Carrier C1 that stores 25 unprocessed wafers W each,
C2 is placed on the loading position of the station 112 shown in FIG. 2 of the loading unit 110 of the loader unit 100 shown in FIG. 1 by a transfer robot (not shown).

Then, the carrier C is moved by the moving mechanism 115.
While sequentially clamping C1 and C2 and aligning the orientation flat,
The station 112 is sequentially moved to the transfer position. The transfer device 12 is placed at the transfer position.
The arms 121a and 121b of the carrier C1 and C
The Z base 123 is moved in the X direction to the relay section 130 while holding the two at the same time, and the holding section 13 of the relay section 130 is held.
3, 135 is moved upward in the Z direction, and carriers C1 and C
The wafer W in 2 is transferred onto the holders 133 and 135.
After that, the transferred wafers W are aligned by the orientation flat aligning unit provided with the aligning device 116, and a predetermined number of wafers, for example, a row of 50 wafers W, is set as one lot, and the subsequent cleaning process is waited.

Subsequently, the primary wafer transfer device 1 shown in FIG.
40a moves to the relay unit 130, holds the wafers W aligned by the wafer chuck 142 shown in FIG. 3 in lot units, and conveys them to the SC1 cleaning tank 202a of the primary cleaning unit 201a. Processing tank 21 shown in
The processing solution in 0 is transferred to a holding unit 212 provided in advance in lot units. Then, after introducing a predetermined chemical solution into the processing bath 210 and performing a predetermined SC1 cleaning on the wafer W, the wafer W is taken out again by the wafer chuck 142 and transferred to the primary water washing bath 203a, where It is transferred to the holding part 212 provided in the cleaning tank 203, and primary cleaning with pure water is performed. Then, by the same method, the wafer W after cleaning with pure water is sent to the secondary water cleaning tank 204a (FIG. 1), and secondary cleaning with pure water is performed to completely clean the chemical liquid adhering to the wafer W. The secondary washing tank 204a is also referred to as an interface tank, and is located between adjacent cleaning units where cleaning is performed with another type of chemical solution, and has a function as a buffer for preventing mixing of both chemical solutions. According to the illustrated embodiment, the wafer W that has undergone SC1 cleaning in the chemical solution tank 201a is subjected to primary water cleaning and then to a secondary water cleaning tank 204a provided as an interface tank, if necessary. The HF cleaning in the secondary cleaning unit 201b in the subsequent step is awaited.

Then, by the secondary wafer transfer device 140b which is in charge of the secondary cleaning unit 201b, the wafer W is taken out from the secondary water washing tank 204a of the primary cleaning unit 201a and the H of the secondary cleaning unit 201b for HF cleaning is removed.
It is conveyed to the F chemical liquid tank 202b. After the predetermined chemical treatment, the primary washing tank 203b is subjected to the primary washing, and then the second washing is performed.
In the secondary water washing tank 204b provided as the interface tank of No. 2, the cleaning process of the subsequent process is vacant. Less than,
The same steps are repeated to perform SC2 cleaning and other necessary cleaning processing. Next, the wafer W is transferred to the n-th wafer transfer device 1
40n, it is sent to the final washing tank 205, where it is subjected to the final washing treatment with pure water, and then sent to the drying treatment tank 206, where it is subjected to vapor drying treatment by IPA, for example. The dried wafer is carried out of the apparatus via the unloader unit 300.

The above is the cleaning processing apparatus 1 to which the present invention can be applied.
It is a series of processing flow in the normal processing operation mode of
According to the present invention, when an abnormality occurs in the chemical bath of the cleaning processing apparatus, the apparatus is automatically operated in the following abnormal time processing mode.

(2) Abnormality Detection Operation 2-1 Temperature Abnormality When an abnormal value is detected by the temperature sensor 251, a processing flow as shown in FIG. 7 is executed. It should be noted that according to the present invention, the abnormal value can be set in two stages, and optimal abnormal time processing can be performed. For example, when performing SC1 cleaning, if the steady temperature range is set to 60 ° C or higher, the primary abnormal temperature range is set to a range deviating from the steady temperature range by ± 3 ° C, that is, 57 ° C or higher or 63 ° C or lower. In addition, the secondary abnormal temperature range deviates from the primary abnormal temperature range by ± 5 ° C, that is, 55 ° C or lower or 65 ° C.
It is possible to set it as ℃ or more. Similarly, in the case of SPM cleaning in which processing is performed at a high temperature, when the steady temperature range is set to 120 ° C, the primary abnormal temperature range is set to a range deviating from the steady temperature range by ± 10 ° C, and the secondary abnormal temperature is further set. It is possible to set the temperature range as a range that deviates from the primary abnormal temperature range by ± 15 ° C. The steady temperature range, the primary abnormal temperature range, and the secondary abnormal temperature range can be optimally set according to the type of chemical liquid.

A case where a temperature abnormality occurs during SC1 cleaning will be described below with reference to FIG. 7 as an example. During the cleaning process (S71), the temperature of the chemical solution is constantly measured by the temperature sensor 251 in the steady temperature range ( For example, whether the temperature is 60 ° C. or higher is monitored (S72), and in S73, the temperature of the chemical solution deviates from the steady temperature range and the primary abnormal temperature range (5
If it is determined that the temperature has risen to 7 ° C. or higher or 63 ° C. or lower), for example, 64 ° C., a warning (S74) is issued to the operator by lighting a pilot lamp or the like. If the temperature of the chemical liquid further rises and it is determined in S75 that the temperature is within the secondary abnormal temperature range (55 ° C. or lower or 65 ° C. or higher), abnormal time processing (S76) described later in FIGS. 13 and 14 is performed. To be executed.

2-2 Liquid Level Abnormality Further, the chemical liquid tank 210 is provided with a liquid level sensor 252, and as shown in FIG. 8, during the cleaning process (S81), the chemical liquid tank is supplied and circulated. We are monitoring the proper amount of chemicals. When the liquid level sensor determines in S82 that the chemical liquid has deviated from the steady value, it is further determined in S83 whether the liquid level is sufficient to immerse the wafer, which is sufficient for cleaning. If it is determined that a sufficient amount is secured, only a warning is issued in S84, but if it is determined in S85 that the liquid level has fallen to an insufficient level for continuing the cleaning, 13 and FIG. 14, abnormal time processing (S86) as described later is executed.

2-3 Exhaust System Abnormality Further, the exhaust system of the chemical liquid tank 210 is provided with an exhaust sensor 255 such as a manometer to detect an exhaust abnormality such as abnormal exhaust. . That is, as shown in FIG. 9, during the cleaning process (S91), it is determined by the manometer whether or not exhaust is sufficiently performed (S92), and if an exhaust abnormality is detected, S9 is performed.
A warning is issued at 3. Then, in S94, it is determined how long the exhaust abnormality continues, and if the exhaust abnormality continues for a predetermined time or more, sufficient exhaust is not performed, and there is a possibility that the components of the processing tank are contaminated and damaged. Therefore, the abnormal time process (S95) described later with reference to FIGS. 13 and 14 is executed.

2-4 When Circulation System is Abnormal As described above, the chemical solution supplied to the chemical solution tank 210 is always circulated while being cleaned by the filter F by the circulation system 18 in which the circulation pump P is interposed. However, when an abnormality of the chemical liquid circulation system is detected by the circulation system abnormality detection sensor 254 due to a failure of the circulation pump P or the like, the processing according to the flow shown in FIG. 10 is executed. That is, during the cleaning process (S101), it is monitored whether or not the circulation system is operating normally (S102), and if an abnormality of the circulation system due to the stop of the circulation pump P or the like is detected, S103.
Gives an alarm at. Then, in this case, since there is a possibility that a sufficient chemical solution is not supplied and a satisfactory cleaning process cannot be performed, an abnormal condition process (S104) described later in FIGS. 13 and 14 is executed.

2-5 When the Lid Opening / Closing Mechanism is Abnormal According to the present invention, a sensor 253 for detecting an abnormality in the lid opening / closing mechanism of the processing tank is provided. 11 and the processing flow shown in FIG. That is, as shown in FIG. 11, when it is determined that the predetermined cleaning process (S111) is completed (S112), the lid is normally opened, and the wafer transfer device moves the inside of the processing tank by the wafer transfer device in S114. The operation of unloading the wafer is performed. However, S1
If an abnormality in the mechanism for opening and closing the lid of the chemical liquid tank is detected in 13, it is not possible to carry out the processed lot. Therefore, in S115, the waste liquid and pure water supply processing described later in FIGS. 13 and 14 is performed. This is executed as abnormal time processing, and the wafer is protected. Further, as shown in FIG. 12, after it is confirmed in S121 that the wafer has been loaded into the processing bath, it is determined in S122 whether the lid of the processing bath can be closed. Then, the normal cleaning process is performed, but if the mouth cannot be closed, the process proceeds to S124, and an abnormal condition process described later with reference to FIGS. 13 and 14 is executed to maintain the wafer.

(3) Abnormality Processing As described above, when an abnormality in the chemical liquid tank is detected by various sensors provided in the chemical liquid tank, according to the present invention, the automatic dispensing operation as shown in FIG. 12 is performed. Alternatively, the chemical / pure water exchange operation as shown in FIG. 13 can be performed.

3-1 Automatic Dispensing Operation FIG. 13 schematically shows a processing flow of the automatic dispensing operation. When the abnormality processing system is set to perform the automatic dispensing operation when the abnormality of the chemical liquid tank as shown in FIGS. 7 to 12 is detected, the process automatically proceeds to S131 to transfer the wafer. The wafer W in the processing bath 210 is unloaded by the apparatus 140, and the primary washing bath 20 located downstream from the processing bath 202 in which the trouble occurs.
3 or transferred to the secondary washing tank 204, and the lot being processed is relieved. If the operator determines in S132 that the carried-out lot is not damaged and it is not necessary to pay it out of the apparatus as an abnormal lot, the process proceeds to S133 and the process is continued. However, in S132, when the operator determines that the delivered lot should be discharged as an abnormal lot to the outside of the apparatus, in S134, the lot is sequentially washed through the interface bath 204 and the final washing bath 205.
The operator determines whether or not the drying process is further performed (S135), and if the drying process is not necessary, the drying process is performed as it is, and if the drying process is necessary, the drying process is performed (S136). ) Is unloaded from the unloader unit 300 to the outside of the apparatus.

As described above, according to the present invention, by setting the apparatus in the automatic dispensing mode, when a trouble occurs in the chemical liquid tank, the lot being processed is automatically carried out to the downstream washing tank. As a result, it is possible to minimize the damage to the wafer caused by the trouble.

3-2 Automatic chemical / pure water exchange operation Further, according to the present invention, when trouble occurs in the chemical tank,
It is possible to set to shift to the automatic chemical / pure water exchange operation mode. In this mode, as shown in FIG. 14, when an abnormality is detected in the chemical liquid tank, the process proceeds to S141, where the chemical liquid in the chemical liquid tank is automatically drained, and then, in S142, pure water is introduced to perform processing. Protect the wafer. Then, if necessary, according to the flow shown in FIG.
At 143, lots are paid out.

Thus, according to the present invention, for example,
If a trouble occurs in the opening / closing mechanism of the lid of the processing tank and it is not possible to carry out the processed lot, or if there is an emergency situation where the automatic payout function cannot make it in time, It is possible to shift to the pure water exchange mode and rescue the wafer being processed.

The preferred embodiment of the present invention has been described above with reference to FIG.
~ Although described with reference to Fig. 13, the present invention is not limited to such an embodiment. For example, in addition to the above-mentioned troubles, the present invention can be applied to any troubles that may occur in the chemical liquid tank, such as water leakage from the chemical liquid tank, N ₂ abnormality, and abnormal chemical concentration.

Furthermore, in the present specification, the abnormal signal is classified into a primary abnormal signal in the primary abnormal range and a secondary abnormal signal in the secondary abnormal range. 2 which is the signal to be executed and the other signals
It is meant to be classified into two, and should not be limitedly interpreted to control by only two kinds of signals.
A person skilled in the art, in the scope of the technical idea of the present invention,
It should be conceivable that control is performed by signals of various forms, and it is understood that control by signals of these various forms also belongs to the scope of the present invention.

Furthermore, regarding abnormal time processing, in the above embodiment, the automatic dispensing operation and the automatic chemical liquid / pure water exchange operation have been individually described, but it goes without saying that the automatic dispensing function and the automatic chemical liquid / pure water exchange are performed. Selective operation, or prioritize automatic dispensing operation, and if that is not possible, shift to automatic chemical / pure water exchange operation, or
It is also possible to prioritize the pure water exchange operation and to perform the automatic dispensing operation after the chemical / pure water exchange.

Further, in the above-mentioned embodiment, the cleaning processing apparatus in which the cleaning unit composed of one chemical liquid tank and two water cleaning tanks is combined has been described, but the present invention is not limited to such an example and, for example, the same chemical liquids can be used. The present invention can be applied to a cleaning device that combines various processing tanks, such as a cleaning unit including a plurality of chemical liquid tanks for performing the treatment according to (1) or a cleaning unit including only one water cleaning tank.

[0058]

As described above, according to the present invention,
If a trouble occurs in the chemical tank of the cleaning equipment, such as temperature abnormality, chemical liquid surface abnormality, exhaust system abnormality, circulation system abnormality, lid opening / closing mechanism abnormality, water leakage, etc., automatic dispensing operation and / or automatic By performing the chemical / pure water exchange operation, it is possible to minimize damage to the lot being processed.

First, according to the first aspect of the present invention, when an abnormality is detected by the abnormality detection sensor, the object to be treated is automatically taken out from the chemical liquid tank in which the abnormality has occurred by the transport device, and the chemical liquid tank is then taken out. It is possible to move it to a water washing tank located downstream of. As described above, by automatically retracting the object to be processed from the chemical liquid tank in which the abnormality has occurred to the safe water washing tank, it is possible to minimize damage to the wafer being processed. Then, if further required, the wafer is automatically transferred to the final cleaning tank at the most downstream through the washing tank of each cleaning unit in sequence, and after the wafer is dried in the drying processing tank, if necessary, from the unloader section. It is possible to carry it out of the device.

Further, according to the second aspect of the present invention, when an abnormality is detected by the abnormality detection sensor, the chemical liquid is automatically drained from the chemical liquid tank in which the abnormality has occurred, and the chemical liquid tank after the waste liquid is drained. By introducing and circulating pure water therein, the object to be processed can be placed in a safe state, the damage to the wafer being processed can be minimized, and then the subsequent measures can be taken. This process is carried out to the outside of the chemical liquid tank, especially when the chemical liquid circulation system malfunctions, the exhaust system malfunctions, or the chemical liquid tank lid opening / closing mechanism malfunctions. It is effective when it becomes impossible.

According to the present invention, the abnormality signal generated by the abnormality detection sensor is a primary abnormality signal generated when the abnormality signal deviates from the steady range and falls within the primary abnormality range, and further exceeds the primary abnormality range. It consists of a secondary abnormal signal that is generated when it is in the secondary abnormal range.For example, in the case of a primary abnormal signal, only a warning is issued, and in the case of a secondary abnormal signal, automatic abnormal condition processing is performed It is also possible, or based on the duration of the abnormal signal, it is also possible to configure the abnormal time processing only when the abnormality continues for a predetermined time or longer. Accordingly, it is possible to construct a system capable of performing optimum processing.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of a cleaning processing apparatus configured according to the present invention.

FIG. 2 is an enlarged perspective view showing an example of a loader section of the cleaning processing apparatus shown in FIG.

FIG. 3 is an enlarged perspective view showing an example of a wafer transfer device of the cleaning processing apparatus shown in FIG.

FIG. 4 is a perspective view schematically showing an example of a part of the cleaning processing tank of the cleaning processing apparatus shown in FIG.

5 is a schematic cross-sectional view showing a state of the cleaning treatment tank shown in FIG.

FIG. 6 is a perspective view schematically showing a state in which the lid of the cleaning treatment tank shown in FIG. 4 is closed.

FIG. 7 is a flowchart showing a processing flow when a temperature abnormality occurs.

FIG. 8 is a flowchart showing a processing flow when a liquid level abnormality occurs.

FIG. 9 is a flowchart showing a processing flow when an exhaust system abnormality occurs.

FIG. 10 is a flowchart showing a processing flow when a circulation system abnormality occurs.

FIG. 11 is a flow chart showing a processing flow when an abnormality occurs in the opening / closing mechanism of the lid of the chemical liquid tank.

FIG. 12 is a flow chart showing a processing flow when an abnormality occurs in the opening / closing mechanism of the lid of the chemical liquid tank.

FIG. 13 is a flowchart showing a processing flow of an automatic payout operation.

FIG. 14 is a flowchart showing a processing flow of an automatic chemical / pure water exchange operation.

[Explanation of reference numerals] 1 cleaning processing apparatus 100 loader section 110 mounting section 130 relay section 140 wafer transfer apparatus 200 cleaning processing section 201 cleaning unit 202 chemical solution tank 203 primary water washing tank 204 secondary water washing tank (interface tank) 231 controller 251 Temperature sensor 252 Liquid level sensor 253 Abnormality detection sensor for lid opening / closing mechanism 254 Circulation system sensor 255 Exhaust system sensor 300 Unloader section

Claims (28)

[Claims] 1. A loader unit for loading an object to be processed into the apparatus, and an unloader section for transferring the object to be processed out of the apparatus. Between the loader section and the unloader section, there is provided one or more cleaning units each including a chemical solution tank and one or more water washing tanks disposed downstream of the chemical solution tank for cleaning the object to be treated with pure water. And one or more transfer devices that transfer the object to be processed between the loader unit and the cleaning unit, or between the adjacent cleaning units, or between the cleaning unit and the unloader unit. In the cleaning processing apparatus provided with, the cleaning apparatus is provided with an abnormality detection sensor, and each of the transport devices, in response to a signal from the abnormality detection sensor, transfers the object to be processed to a washing tank downstream thereof. A cleaning processing apparatus, characterized in that it is configured so that it can be transported to a container. 2. A primary anomaly signal generated when the signal from the anomaly detection sensor deviates from the steady range and is within the primary anomaly range, and a signal from the anomaly detection sensor that deviates from the primary anomaly range and is within the secondary anomaly range. Consisting of a secondary anomaly signal generated,
The said each conveyance apparatus is comprised so that the to-be-processed object in process can be conveyed to the washing tank of the downstream according to the said secondary abnormal signal, It is characterized by the above-mentioned. Cleaning equipment. 3. When the abnormality signal sent from the abnormality detecting sensor continues for a predetermined time or more, the conveying device is configured to convey an object to be treated to a washing tank downstream thereof. The cleaning processing apparatus according to claim 1, wherein the cleaning processing apparatus is a cleaning processing apparatus. 4. When an object to be processed is being processed in a chemical solution tank, the object to be processed is taken out of the chemical solution tank and conveyed to a washing tank downstream thereof in accordance with a signal from the abnormality detection sensor. The cleaning processing apparatus according to any one of claims 1 to 3, wherein the cleaning processing apparatus is configured so as to be capable of performing the cleaning. 5. A loader unit for loading an object to be processed into the apparatus, and an unloader section for transferring the object to be processed out of the apparatus. Between the loader section and the unloader section, there is provided one or more cleaning units each including a chemical solution tank and one or more water washing tanks disposed downstream of the chemical solution tank for cleaning the object to be treated with pure water. In the cleaning processing device sequentially arranged in, the cleaning device is provided with an abnormality detection sensor, the chemical liquid in the chemical liquid tank is discharged according to a signal from the abnormality detection sensor, and pure water is stored in the chemical liquid tank. A cleaning processing apparatus, which is configured to be introduced. 6. A primary anomaly signal generated when the signal from the anomaly detection sensor deviates from the steady range and is in the primary anomaly range, and when a signal is further out of the primary anomaly range and is in the secondary anomaly range. Consisting of a secondary anomaly signal generated,
The cleaning processing apparatus according to claim 5, wherein the cleaning solution is configured to drain the chemical solution in the chemical solution tank and introduce pure water into the chemical solution tank in accordance with the secondary abnormal signal. 7. When the abnormality signal sent from the abnormality detection sensor continues for a predetermined time or more, the chemical liquid in the chemical liquid tank is drained and pure water is introduced into the chemical liquid tank. The cleaning processing apparatus according to claim 5 or 6, which is characterized in that. 8. The cleaning processing apparatus according to claim 1, wherein the abnormality detection sensor is a sensor arranged in each chemical liquid tank and detecting an abnormality in each chemical liquid tank. 9. The cleaning processing apparatus according to claim 1, wherein the abnormality detection sensor is a temperature sensor. 10. The cleaning processing apparatus according to claim 1, wherein the abnormality detection sensor is a liquid level sensor. 11. The cleaning processing apparatus according to claim 1, wherein the abnormality detection sensor is an exhaust system sensor. 12. The abnormality detecting sensor is a sensor for detecting an abnormality of a chemical liquid circulation system.
The cleaning processing device according to any one of to 8. 13. The cleaning processing apparatus according to claim 1, wherein the abnormality detection sensor is a sensor that detects an opening / closing abnormality of a lid of the chemical liquid tank. 14. A loader unit for loading an object to be processed into the apparatus, and an unloader section for transferring the object to be processed out of the apparatus. One or two or more units for cleaning the object to be processed with the same kind of chemical solution. Between the loader section and the unloader section, there is provided one or more cleaning units each including a chemical solution tank and one or more water washing tanks disposed downstream of the chemical solution tank for cleaning the object to be treated with pure water. A method for controlling a cleaning treatment device sequentially arranged in a cleaning process, wherein when a predetermined abnormality signal is detected from an abnormality detection sensor installed in the cleaning device, the cleaning treatment is stopped and an object to be treated is being processed. And a step of loading the water into a water washing tank downstream thereof are carried out. 15. A primary anomaly signal generated when the signal from the anomaly detection sensor deviates from the steady range and is in the primary anomaly range, and a signal from the anomaly detection sensor that deviates from the primary anomaly range and is in the secondary anomaly range. It is composed of a secondary abnormal signal that is generated, and each of the transport devices can stop the cleaning process in accordance with the secondary abnormal signal and carry the object to be processed into the downstream washing tank. The method for controlling a cleaning processing apparatus according to claim 14, wherein the method is configured as described above. 16. When the abnormality signal sent from the abnormality detection sensor continues for a predetermined time or more, the cleaning process is stopped and the object to be processed can be carried into the washing tank downstream thereof. The method for controlling a cleaning processing apparatus according to claim 14 or 15, characterized in that the cleaning processing apparatus is controlled. 17. The method according to claim 14, further comprising a step of transporting the object to be treated carried into the water washing tank to the final water washing tank through a further downstream water washing tank.
17. The method for controlling the cleaning processing device according to any one of 16. 18. The cleaning processing apparatus according to claim 17, further comprising the step of drying the object to be processed after the final washing with water and carrying it out of the cleaning processing apparatus via the unloader section. Control method. 19. The step of stopping the cleaning process in the chemical liquid tank and taking out the object to be treated from the chemical liquid tank when a predetermined abnormal signal is detected from the abnormality detection sensor, and the object to be taken out from the chemical liquid tank. The step of carrying in the treated body to a water washing tank downstream thereof is executed.
The method for controlling the cleaning treatment apparatus according to any one of 4 to 18. 20. A loader unit for loading the object to be processed into the apparatus, and an unloader unit for discharging the object to be processed from the apparatus. Between the loader section and the unloader section, there is provided one or more cleaning units each including a chemical solution tank and one or more water washing tanks disposed downstream of the chemical solution tank for cleaning the object to be treated with pure water. A method for controlling a cleaning treatment apparatus sequentially arranged in the above, wherein a step of discharging the chemical solution in the chemical solution tank according to a signal from an abnormality detection sensor provided in the cleaning treatment apparatus, And a step of introducing the chemical treatment solution into the chemical solution tank. 21. A primary abnormality signal generated when the signal from the abnormality detection sensor deviates from the steady range and is in the primary abnormal range, and a signal when the signal further deviates from the primary abnormal range and is in the secondary abnormal range. Consisting of a secondary abnormal signal generated, when the secondary abnormal signal is emitted, the step of draining the chemical solution in the chemical solution tank, and the step of introducing pure water into the waste chemical solution tank 22. The method for controlling a cleaning processing apparatus according to claim 20, which is executed. 22. When the abnormality signal sent from the abnormality detection sensor continues for a predetermined time or more, the step of draining the chemical solution in the chemical solution tank and the step of introducing pure water into the drained chemical solution tank are performed. It is performed, It is characterized by the above-mentioned.
22. A method for controlling the cleaning processing apparatus according to 0 or 21. 23. The cleaning processing apparatus according to claim 14, wherein the abnormality detection sensor is a sensor that is arranged in each chemical liquid tank and detects an abnormality in each chemical liquid tank. Method. 24. The method for controlling a cleaning processing apparatus according to claim 14, wherein the abnormality detection sensor is a temperature sensor. 25. The method for controlling a cleaning processing apparatus according to claim 14, wherein the abnormality detection sensor is a liquid level sensor. 26. The method for controlling a cleaning processing apparatus according to claim 14, wherein the abnormality detection sensor is an exhaust system sensor. 27. The abnormality detecting sensor is a sensor for detecting an abnormality of a chemical liquid circulation system.
The method for controlling the cleaning treatment apparatus according to any one of 4 to 23. 28. The method for controlling a cleaning processing apparatus according to claim 14, wherein the abnormality detection sensor is a sensor that detects an opening / closing abnormality of the lid of the chemical liquid tank.