JPH0722366A - Cleaning equipment for silicon wafer - Google Patents
Cleaning equipment for silicon waferInfo
- Publication number
- JPH0722366A JPH0722366A JP15934393A JP15934393A JPH0722366A JP H0722366 A JPH0722366 A JP H0722366A JP 15934393 A JP15934393 A JP 15934393A JP 15934393 A JP15934393 A JP 15934393A JP H0722366 A JPH0722366 A JP H0722366A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- tank
- pure water
- chemical
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置製造工程に
おけるシリコンウエハの洗浄装置に関する。詳しくは、
作業時間の短縮、クリーンルームの省スペース、異常発
生時等の薬液によるシリコンウエハの損傷防止等を好適
に実現できるシリコンウエハ洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silicon wafer cleaning apparatus in a semiconductor device manufacturing process. For more information,
The present invention relates to a silicon wafer cleaning apparatus capable of suitably reducing working time, saving space in a clean room, and preventing damage to a silicon wafer due to a chemical solution when an abnormality occurs.
【０００２】[0002]
【従来の技術】ＬＳＩや超ＬＳＩ等の半導体製造工程に
おいて、所定品質の半導体装置を安定して製造するため
には、シリコンウエハ表面を清浄に保つことは極めて重
要であり、従って、製造工程途中に多数回行われるシリ
コンウエハの洗浄工程は極めて重要な工程である。シリ
コンウエハの洗浄状態が悪いと、製造された半導体装置
に不良品が多発して、歩留まりが大幅に低下してしま
う。2. Description of the Related Art In order to stably manufacture a semiconductor device of a predetermined quality in a semiconductor manufacturing process such as LSI and VLSI, it is extremely important to keep the surface of a silicon wafer clean. The cleaning process of the silicon wafer, which is performed many times, is an extremely important process. If the cleaning state of the silicon wafer is poor, the manufactured semiconductor devices will frequently have defective products and the yield will be significantly reduced.
【０００３】シリコンウエハの洗浄は、通常、洗浄用の
薬液による洗浄の後、純水で所定回数洗浄して十分にリ
ンスすることによって行われる。そのため、半導体製造
のクリーンルーム内には、薬液洗浄槽と純水洗浄槽の２
槽の洗浄槽が設けられ、前工程を終了したシリコンウエ
ハは、まず薬液洗浄槽に搬入されて所定時間の薬液洗浄
を行われ、その後薬液洗浄槽から取り出され、次いで純
水洗浄槽に搬入されて、所定回数の純水洗浄を行われた
後に次工程に搬送される。Cleaning of a silicon wafer is usually carried out by cleaning with a cleaning chemical solution, followed by cleaning with pure water a predetermined number of times and sufficient rinsing. Therefore, in the clean room for semiconductor manufacturing, there are two chemical cleaning tanks and a pure water cleaning tank.
A cleaning tank is provided, and the silicon wafer that has undergone the previous process is first loaded into the chemical cleaning tank for chemical cleaning for a predetermined time, then removed from the chemical cleaning tank, and then loaded into the pure water cleaning tank. Then, after cleaning with pure water a predetermined number of times, it is conveyed to the next step.
【０００４】ところが、このような従来のシリコンウエ
ハ洗浄には、下記のような問題点がある。まず、薬液洗
浄槽と純水洗浄槽とが別々の装置については、薬液洗浄
槽から純水洗浄槽へのシリコンウエハの搬送を行う必要
があるため、洗浄に時間がかかると共に、シリコンウエ
ハに付着した薬液による周囲の汚染等も懸念される。However, such conventional silicon wafer cleaning has the following problems. First, in the case of an apparatus in which the chemical cleaning tank and the pure water cleaning tank are separate, it is necessary to transfer the silicon wafer from the chemical cleaning tank to the pure water cleaning tank. There is also concern about contamination of the surroundings by the used chemicals.
【０００５】また、薬液洗浄槽からシリコンウエハを取
り出す際の搬送装置のトラブル、他の工程における異常
等によって製造ラインが停止した場合、さらには作業員
のミス、等によってシリコンウエハの薬液洗浄を所定時
間以上行ってしてしまう場合がある。所定時間以上の薬
液洗浄は、シリコンウエハに重大なダメージを与えてし
まい、甚だしい場合にはそのバッチのシリコンウエハが
全て不良になってしまう場合もある。Further, when the manufacturing line is stopped due to a trouble of the transfer device when the silicon wafer is taken out from the chemical cleaning tank, an abnormality in another process, or the like, the chemical cleaning of the silicon wafer is predetermined due to an operator error or the like. There are times when you go over time. The chemical cleaning for a predetermined time or longer causes serious damage to the silicon wafers, and in some cases, all the silicon wafers in the batch may be defective.
【０００６】さらに、薬液洗浄槽と純水洗浄槽の２つの
洗浄槽が必要であるので、広いスペースが必要であり、
クリーンルーム内を非常に狭くしてしまう。Furthermore, since two cleaning tanks, a chemical cleaning tank and a pure water cleaning tank, are required, a large space is required,
It makes the inside of the clean room very small.
【０００７】また、薬液洗浄と純水洗浄とを同一の槽で
行う装置もあるが、この装置では１回毎に薬液をすてる
ことになり、非常にコストがかかってしまう。Further, there is an apparatus for performing the chemical solution cleaning and the pure water cleaning in the same tank, but since the chemical solution is spilled every time in this apparatus, the cost is very high.
【０００８】[0008]
【発明が解決しようとする課題】本発明の目的は、前記
従来技術の問題点を解決することにあり、薬液使用量の
減少によるコスト削減、シリコンウエハの搬送工程減少
による作業時間の短縮および洗浄用の薬液による汚染防
止、クリーンルームの省スペース、作業員のミスや搬送
装置の搬送ミスさらには異常等が発生した際の、薬液に
よるシリコンウエハの損傷防止等を好適に実現できるシ
リコンウエハ洗浄装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to reduce the cost by reducing the amount of chemicals used, shorten the working time by reducing the transfer process of silicon wafers, and perform cleaning. A silicon wafer cleaning device that can suitably prevent contamination with chemicals for chemicals, save space in a clean room, prevent damage to silicon wafers due to chemicals in the event of operator errors, transport errors in the transport device, or other abnormalities. To provide.
【０００９】[0009]
【課題を解決するための手段】前記目的を達成するため
に、本発明は、半導体装置の製造工程において、シリコ
ンウエハの薬液洗浄および純水洗浄を行うシリコンウエ
ハ洗浄装置であって、シリコンウエハの薬液洗浄および
純水洗浄を行う、廃液の排出手段を有する洗浄処理槽
と、前記洗浄処理槽においてシリコンウエハの純水洗浄
を行っている間に薬液を貯留しておく薬液待機槽と、前
記洗浄処理槽から薬液待機槽に薬液を液送する手段と、
前記薬液待機槽から洗浄処理槽に薬液を供給する手段
と、前記洗浄処理槽に純水を供給する手段とを有するこ
とを特徴とするシリコンウエハ洗浄装置を提供する。In order to achieve the above object, the present invention is a silicon wafer cleaning apparatus for cleaning a silicon wafer with a chemical and pure water in a semiconductor device manufacturing process. A cleaning treatment tank having a waste liquid discharging means for performing chemical cleaning and pure water cleaning, a chemical standby tank for storing the chemical while the silicon wafer is cleaned with pure water in the cleaning processing tank, and the cleaning A means for sending the chemical solution from the processing tank to the chemical solution standby tank,
There is provided a silicon wafer cleaning apparatus comprising: a means for supplying a chemical solution from the chemical solution standby tank to the cleaning processing tank; and a means for supplying pure water to the cleaning processing tank.
【００１０】[0010]
【発明の作用】本発明のシリコンウエハ洗浄装置は、シ
リコンウエハの薬液洗浄および純水洗浄を行う洗浄処理
槽と、シリコンウエハの純水洗浄時等に薬液を一時的に
貯留する薬液待機槽とを有する。つまり、本発明のシリ
コンウエハ洗浄装置においては、シリコンウエハおよび
薬液を洗浄処理装置に入れ、洗浄処理槽によってシリコ
ンウエハの薬液洗浄を行った後、薬液を洗浄処理槽より
薬液待機槽に液送して一次ここに貯留する。この状態で
洗浄処理槽に純水を供給して、シリコンウエハが所定の
状態にリンスされるまで純水洗浄を行う。シリコンウエ
ハの純水洗浄が終了したら、洗浄を終了したシリコンウ
エハを取り出した後、薬液待機槽に貯留していた薬液の
洗浄処理槽への供給を行い、洗浄処理槽に次バッチのシ
リコンウエハを装填し、次バッチのシリコンウエハの洗
浄を行う。The silicon wafer cleaning apparatus of the present invention comprises a cleaning treatment tank for cleaning the silicon wafer with a chemical solution and pure water, and a chemical solution standby tank for temporarily storing the chemical solution when cleaning the silicon wafer with pure water. Have. That is, in the silicon wafer cleaning apparatus of the present invention, the silicon wafer and the chemical solution are put into the cleaning processing apparatus, the silicon wafer is chemically cleaned by the cleaning processing tank, and then the chemical solution is transferred from the cleaning processing tank to the chemical solution standby tank. And store it here primarily. In this state, pure water is supplied to the cleaning treatment tank to perform pure water cleaning until the silicon wafer is rinsed in a predetermined state. After cleaning the silicon wafer with deionized water, remove the cleaned silicon wafer, supply the chemical solution stored in the chemical solution standby tank to the cleaning process tank, and place the next batch of silicon wafers in the cleaning process tank. Load and clean the next batch of silicon wafers.
【００１１】このような本発明のシリコンウエハ洗浄装
置によれば、薬液洗浄と純水洗浄とを別々の槽で行う装
置に対して、シリコンウエハは洗浄開始から終了するま
で洗浄処理槽に装填されているので、シリコンウエハの
搬送時間を省略することができ、またシリコンウエハに
付着した薬液による周囲汚染の問題もない。また、薬液
洗浄終了後、薬液は直ちに薬液待機槽に送られるので、
搬送装置のミスや作業員のミスによって所定時間以上シ
リコンウエハが薬液に浸漬されることがない。また、他
の工程の異常によって製造ラインが停止した等の場合で
も、直ちに薬液を洗浄処理槽から排出できるので、シリ
コンウエハが薬液に必要以上に浸漬されることを防止で
きる。そのため、異常発生時等における薬液によるシリ
コンウエハの損傷を防止することができる。さらに、薬
液待機槽への異物混入を防止すれば、薬液待機槽は特に
クリーンルーム内に配置する必要はないので、クリーン
ルームのスペースを大幅に広く使用することができる。According to the silicon wafer cleaning apparatus of the present invention as described above, the silicon wafer is loaded into the cleaning processing tank from the start to the end of cleaning, with respect to the apparatus for performing the chemical cleaning and the pure water cleaning in separate tanks. Therefore, the time for carrying the silicon wafer can be omitted, and there is no problem of surrounding contamination due to the chemical liquid adhering to the silicon wafer. Also, since the chemical solution is immediately sent to the chemical solution standby tank after the chemical solution cleaning is completed,
The silicon wafer will not be immersed in the chemical solution for a predetermined time or longer due to an error in the transfer device or an error in the operator. Further, even if the manufacturing line is stopped due to an abnormality in another process, the chemical liquid can be immediately discharged from the cleaning treatment tank, so that the silicon wafer can be prevented from being unnecessarily immersed in the chemical liquid. Therefore, it is possible to prevent the silicon wafer from being damaged by the chemical liquid when an abnormality occurs. Furthermore, if foreign substances are prevented from entering the chemical solution standby tank, the chemical solution standby tank does not need to be arranged in the clean room, so that the space of the clean room can be widely used.
【００１２】また、薬液洗浄と純水洗浄とを同一の槽で
行う装置に対しては、薬液待機槽を有することにより、
薬液を複数回使用することが可能となるため、薬液使用
量の削減を計ることができる。Further, for an apparatus that performs chemical solution cleaning and pure water cleaning in the same tank, by providing a chemical solution standby tank,
Since it is possible to use the chemical solution multiple times, it is possible to reduce the amount of the chemical solution used.
【００１３】[0013]
【実施例】以下、本発明のシリコンウエハ洗浄装置につ
いて、添付の図面に示される好適実施例をもとに詳細に
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A silicon wafer cleaning apparatus of the present invention will be described in detail below with reference to the preferred embodiments shown in the accompanying drawings.
【００１４】図１に、本発明のシリコンウエハ洗浄装置
の一例を模式的に示す。図１に示されるシリコンウエハ
洗浄装置１０（以下、洗浄装置１０とする）は、ＬＳＩ
等の半導体装置の製造工程において、シリコンウエハ
（以下、ウエハとする）を洗浄用の薬液および純水で洗
浄する装置であって、基本的に、洗浄処理槽１２、薬液
待機槽１４、純水供給ライン１６、液送ライン２０、三
方コック２６、ポンプ２８、およびライン２２，２４お
よび３０より構成される。また、洗浄処理槽１２あるい
は薬液待機槽１４には、薬液を供給する薬液供給ライン
（図示省略）が接続される。FIG. 1 schematically shows an example of the silicon wafer cleaning apparatus of the present invention. The silicon wafer cleaning apparatus 10 (hereinafter referred to as the cleaning apparatus 10) shown in FIG.
Is a device for cleaning a silicon wafer (hereinafter referred to as a wafer) with cleaning chemicals and pure water in the manufacturing process of semiconductor devices such as It is composed of a supply line 16, a liquid feeding line 20, a three-way cock 26, a pump 28, and lines 22, 24 and 30. A chemical liquid supply line (not shown) for supplying a chemical liquid is connected to the cleaning treatment tank 12 or the chemical liquid standby tank 14.
【００１５】洗浄処理槽１２は、ウエハの薬液洗浄およ
び純水洗浄を行う槽で、底面に廃液ライン１８および薬
液待機槽１４への薬液の液送ライン２０が、上部には純
水供給ライン１６および薬液供給のためのライン３０
が、側面には薬液循環のためのライン２２が、それぞれ
配設される。The cleaning treatment tank 12 is a tank for cleaning the wafer with a chemical solution and with pure water. A waste solution line 18 and a chemical solution feed line 20 to the chemical solution standby tank 14 are provided on the bottom surface, and a pure water supply line 16 is provided on the upper part. And line 30 for supplying chemicals
However, lines 22 for circulating the chemical liquid are arranged on the side surfaces, respectively.
【００１６】廃液ライン１８は、廃液すなわち廃薬液お
よびウエハの洗浄を行った廃純水を排出するラインで、
バルブ１８ａを開放することによって廃液を廃液槽や廃
水処理設備等に排出する。The waste liquid line 18 is a line for discharging the waste liquid, that is, the waste chemical liquid and the waste pure water after cleaning the wafer,
By opening the valve 18a, the waste liquid is discharged to a waste liquid tank, a waste water treatment facility, or the like.
【００１７】この廃液ライン１８には、廃純水の比抵抗
や電気伝導度等を測定するセンサＳ１が設置されてい
る。図示例の洗浄装置１０は、このセンサＳ１で比抵抗
等を測定してウエハの純水洗浄の終了を判断するように
構成され、この測定値が所定の値になるまで純水洗浄が
繰り返される。なお、本発明の洗浄装置１０において
は、ウエハの純水洗浄の終了をセンサＳ１で検出する構
成に限定はされず、所定回数の純水洗浄を行うことによ
ってウエハの純水洗浄を終了してもよい。The waste liquid line 18 is provided with a sensor S1 for measuring the specific resistance and electric conductivity of waste pure water. The cleaning apparatus 10 of the illustrated example is configured to measure the specific resistance and the like with the sensor S1 to determine the end of the pure water cleaning of the wafer, and the pure water cleaning is repeated until the measured value reaches a predetermined value. . The cleaning apparatus 10 of the present invention is not limited to the configuration in which the sensor S1 detects the end of the pure water cleaning of the wafer, and the pure water cleaning of the wafer is completed by performing the predetermined number of pure water cleaning. Good.
【００１８】なお、本発明の洗浄装置における薬液の交
換サイクル（寿命）は、薬液がウエハの洗浄を行った総
時間、あるいは洗浄を行ったウエハのバッチ数によって
設定すればよい。例えば、６インチウエハの１バッチの
ウエハ枚数が５０枚で、薬液としてＳＣ−１（ NH4OH :
H2O2 : ＤＩＷ＝１：１：６）を用いた場合には、１０
バッチの洗浄あるいは合計１２０分の洗浄を行った際に
薬液の交換を行えばよい。従って、洗浄装置１０におい
ては、洗浄バッチ数を計測するカウンタおよび／または
総洗浄時間を計測する手段が必要であり、図示例におい
ては、薬液循環のためのライン２２に設置されるセンサ
Ｓ２がこれを行う。The chemical solution exchange cycle (life) in the cleaning apparatus of the present invention may be set according to the total time for cleaning the wafer by the chemical solution or the number of batches of the cleaned wafers. For example, the number of wafers in one batch of 6-inch wafers is 50, and SC-1 (NH 4 OH:
When H 2 O 2 : DIW = 1: 1: 6) is used, 10
The chemical solution may be exchanged when the batch is cleaned or the cleaning is performed for 120 minutes in total. Therefore, the cleaning apparatus 10 requires a counter for measuring the number of cleaning batches and / or a means for measuring the total cleaning time. In the illustrated example, the sensor S2 installed in the line 22 for circulating the chemical liquid is used. I do.
【００１９】純水供給ライン１６は、洗浄処理槽１２に
純水を供給するラインで、純水貯留槽や純水製造装置等
に接続され、ウエハの純水洗浄を行う際に、ポンプ、落
差、差圧等の公知の手段によって洗浄処理槽１２に純水
を供給する。The pure water supply line 16 is a line for supplying pure water to the cleaning treatment tank 12 and is connected to a pure water storage tank, a pure water manufacturing apparatus or the like, and a pump or a head drop is used for cleaning the wafer with pure water. Pure water is supplied to the cleaning treatment tank 12 by a known means such as differential pressure.
【００２０】液送ライン２０は、洗浄処理槽１２におけ
るウエハの薬液洗浄が終了した後、薬液待機槽１４に薬
液を液送するラインで、図示例においては、薬液洗浄終
了後にバルブ２０ａを開放することによって薬液を薬液
待機槽１４に送る。なお、図示例においては、液送ライ
ン２０は落差によって薬液を薬液待機槽１４に送るもの
であるが、本発明はこれに限定はされず、ポンプや差圧
等の公知の液送手段はすべて利用可能である。The liquid feed line 20 is a line for feeding the chemical liquid to the chemical liquid standby tank 14 after the chemical liquid cleaning of the wafer in the cleaning processing tank 12 is completed. In the illustrated example, the valve 20a is opened after the chemical liquid cleaning is completed. The chemical solution is thereby sent to the chemical solution standby tank 14. In the illustrated example, the liquid feed line 20 feeds the chemical liquid to the chemical liquid standby tank 14 by a drop, but the present invention is not limited to this, and any known liquid feeding means such as a pump and a differential pressure may be used. It is available.
【００２１】薬液待機槽１４は、洗浄処理槽１２におい
てウエハの純水洗浄を行っている間に薬液を貯留する槽
で、下方には薬液を洗浄処理槽１２に供給するためのラ
イン２４が配設される。The chemical solution standby tank 14 is a tank for storing the chemical solution while the wafer is being cleaned with pure water in the cleaning processing tank 12, and a line 24 for supplying the chemical solution to the cleaning processing tank 12 is arranged below. Set up.
【００２２】ここで、薬液待機槽１４はウエハの純水洗
浄時に一次的に薬液を貯留するものである。従って、薬
液待機槽１４は特に半導体製造のクリーンルーム内に配
置する必要はなく、薬液への異物混入を防止するために
薬液待機槽１４を中心とする系を密閉系にすれば、クリ
ーンルームの外部に設置することができ、クリーンルー
ムの省スペースを計ることができる。なお、この点に関
しては、後に説明するポンプ２８および三方コック２６
も同様である。また、薬液待機槽１４を中心とする系を
密閉系にした場合には、系内は不活性雰囲気とするのが
好ましい。Here, the chemical liquid standby tank 14 temporarily stores the chemical liquid when cleaning the wafer with pure water. Therefore, it is not necessary to dispose the chemical liquid standby tank 14 in a clean room for semiconductor manufacturing, and if the system centering on the chemical liquid standby tank 14 is a closed system in order to prevent foreign substances from being mixed into the chemical liquid, it can be installed outside the clean room. It can be installed to save space in a clean room. Regarding this point, the pump 28 and the three-way cock 26, which will be described later, will be described.
Is also the same. Further, when the system centered on the chemical solution standby tank 14 is a closed system, it is preferable to make the system an inert atmosphere.
【００２３】薬液循環のためのライン２２、および薬液
を洗浄処理槽１２に供給するためのライン２４は、共に
三方コック２６に接続される。また、三方コック２６の
残りの一端はポンプ２８の流入口に接続され、ポンプの
流出口は洗浄処理槽１４の上部に至るライン３０に連結
される。従って、図示例の洗浄装置１０においては、三
方コック２６を切り替えることで、ライン２２，３０お
よびポンプ２８によってウエハの薬液洗浄時の薬液循環
ラインが構成され、ライン２４，３０およびポンプ２８
によって薬液待機槽１４から洗浄処理槽１２に薬液を供
給するための供給ラインが構成される。The line 22 for circulating the chemical liquid and the line 24 for supplying the chemical liquid to the cleaning treatment tank 12 are both connected to a three-way cock 26. The other end of the three-way cock 26 is connected to the inflow port of the pump 28, and the outflow port of the pump is connected to the line 30 reaching the upper part of the cleaning treatment tank 14. Therefore, in the cleaning apparatus 10 of the illustrated example, by switching the three-way cock 26, the lines 22, 30 and the pump 28 constitute a chemical liquid circulation line for cleaning the wafer with the chemical liquid, and the lines 24, 30 and the pump 28.
Thus, a supply line for supplying the chemical liquid from the chemical liquid standby tank 14 to the cleaning treatment tank 12 is configured.
【００２４】なお、図示例の洗浄装置１０においては、
薬液待機槽１４から洗浄処理槽１２への薬液の供給をポ
ンプ２８によって行うが、本発明はこれに限定はされ
ず、落差、差圧等によって薬液待機槽１４から洗浄処理
槽１２への薬液供給を行ってもよい。In the cleaning apparatus 10 shown in the figure,
The chemical liquid is supplied from the chemical liquid standby tank 14 to the cleaning treatment tank 12 by the pump 28, but the present invention is not limited to this, and the chemical liquid is supplied from the chemical liquid standby tank 14 to the cleaning treatment tank 12 due to a drop or a differential pressure. You may go.
【００２５】以下、図２〜図３を参照して、洗浄装置１
０におけるウエハ洗浄の作用を説明する。まず、図２
（ａ）に示されるように、ウエハ（１バッチ分のウエハ
を収納するカセット）３２ａが洗浄処理槽１２に装填さ
れ、薬液が洗浄処理槽１２に供給されると、三方コック
２６によってライン２２とライン３０とが接続されて薬
液の循環ラインが形成され、ポンプ２８が作動して薬液
を循環して、ウエハ３２ａの薬液洗浄が開始される。な
お、ウエハ３２ａの装填と、薬液の洗浄処理槽１２への
供給はいずれを先に行ってもよい。Hereinafter, with reference to FIGS. 2 to 3, the cleaning apparatus 1
The operation of wafer cleaning at 0 will be described. First, FIG.
As shown in (a), when a wafer (a cassette for storing one batch of wafers) 32 a is loaded into the cleaning treatment tank 12 and a chemical solution is supplied to the cleaning treatment tank 12, the three-way cock 26 causes the line 22 to move to the line 22. The line 30 is connected to form a chemical liquid circulation line, the pump 28 is operated to circulate the chemical liquid, and the chemical liquid cleaning of the wafer 32a is started. Either the loading of the wafer 32a or the supply of the chemical liquid to the cleaning processing tank 12 may be performed first.
【００２６】所定時間の薬液洗浄が終了すると、ポンプ
２８が停止され、次いでバルブ２０ａが開放されて、図
２（ｂ）に示されるように、薬液が液送ライン２０によ
って洗浄処理槽１２から薬液待機槽１４に送られる。薬
液の液送が終了すると、図２（ｃ）に示されるように、
純水供給ライン１６より洗浄処理槽１２に純水が供給さ
れ、ウエハ３２ａの純水洗浄が行われる。When the chemical cleaning for a predetermined time is completed, the pump 28 is stopped, the valve 20a is then opened, and the chemical is supplied from the cleaning treatment tank 12 by the liquid delivery line 20 as shown in FIG. 2 (b). It is sent to the standby tank 14. When the delivery of the chemical solution is completed, as shown in FIG. 2 (c),
Pure water is supplied from the pure water supply line 16 to the cleaning processing tank 12, and the wafer 32a is cleaned with pure water.
【００２７】一回目のウエハ３２ａの純水洗浄が終了す
ると、バルブ１８ａが開放して、廃液ライン１８より廃
純水が排水され、配水が終了した後バルブ１８ａが閉塞
され、再度純水供給ライン１６より洗浄処理槽１２に純
水が供給されて、二回目の純水洗浄が行われる。前述の
ように、廃液ライン１８には廃純水の比抵抗や電気電導
度等を測定するセンサＳ１が配設されており、このセン
サＳ１による測定値が所定の値になるまでウエハの純水
洗浄が繰り返される。なお、純水洗浄の終了は、例え
ば、廃純水の比抵抗であれば１６ＭΩ・ｃｍ以上となっ
た時点等とすればよい。When the first cleaning of the wafer 32a with pure water is completed, the valve 18a is opened and the waste pure water is drained from the waste liquid line 18. After the water distribution is completed, the valve 18a is closed and the pure water supply line is again provided. Pure water is supplied to the cleaning treatment tank 12 from 16, and the second pure water cleaning is performed. As described above, the waste liquid line 18 is provided with the sensor S1 for measuring the specific resistance and electric conductivity of the waste pure water, and the pure water of the wafer is measured until the measured value by the sensor S1 reaches a predetermined value. The washing is repeated. The washing with pure water may be completed at the time when the specific resistance of waste pure water reaches 16 MΩ · cm or more, for example.
【００２８】純水洗浄が終了すると、図３（ｄ）に示さ
れるように洗浄が終了したウエハ３２ａが取り出されて
次工程に搬送され、次いで、図３（ｅ）に示されるよう
に、三方コック２６が切り替わってライン２４とライン
３０とが接続されて供給ラインが形成され、ポンプ２８
が作動して純水洗浄の間は薬液待機槽１４に貯留されて
いた薬液が洗浄処理槽１２に供給され、次バッチのウエ
ハ３２ｂが洗浄処理槽１２に装填される。このようにし
て薬液の供給およびウエハ３２ｂの装填が行なわれる
と、先と同様にしてウエハ３２ｂの洗浄が開始される。
なお、薬液の総洗浄時間および洗浄バッチ数は、センサ
Ｓ２によってカウントされており、時間あるいはバッチ
数が所定量になった時点で新規な薬液に交換される。廃
薬液の排出は洗浄処理槽１２の廃液ライン１８によって
行えばよく、あるい薬液待機槽１４に薬液排水用のライ
ンを設けてもよい。When the cleaning with pure water is completed, the cleaned wafer 32a is taken out as shown in FIG. 3 (d) and transferred to the next step, and then three-way as shown in FIG. 3 (e). The cock 26 is switched to connect the line 24 and the line 30 to form a supply line, and the pump 28
Is activated and the chemical solution stored in the chemical solution standby tank 14 is supplied to the cleaning processing tank 12 during the pure water cleaning, and the next batch of wafers 32b is loaded into the cleaning processing tank 12. When the chemical solution is supplied and the wafer 32b is loaded in this manner, the cleaning of the wafer 32b is started in the same manner as above.
The total cleaning time of the chemical liquid and the number of cleaning batches are counted by the sensor S2, and the chemical liquid is replaced with a new chemical liquid when the time or the number of batches reaches a predetermined amount. The waste chemical liquid may be discharged through the waste liquid line 18 of the cleaning treatment tank 12, or the chemical liquid standby tank 14 may be provided with a line for draining the chemical liquid.
【００２９】以上説明したように、本発明の洗浄装置１
０においては、洗浄の開始から終了までウエハ３２は薬
液処理槽１２に装填された状態であるので、ウエハ３２
の搬送を省略することができ、またウエハ３２に付着し
た薬液による周囲汚染の問題もない。また、薬液洗浄終
了後、薬液は直ちに液送ライン２０によって薬液待機槽
１４に送られ、あるいは、他の工程の異常によって製造
ラインが停止した等の場合でも直ちに薬液を洗浄処理槽
１２から排出できるので、ウエハ３２が所定時間以上浸
漬されることを防止して、薬液によるウエハ３２の損傷
を防止できる。しかも、薬液は複数バッチのウエハ洗浄
に使用されるので、薬液の使用量も低減することができ
る。As described above, the cleaning device 1 of the present invention
In No. 0, the wafer 32 is in the state of being loaded in the chemical liquid processing tank 12 from the start to the end of cleaning, so the wafer 32
Can be omitted, and there is no problem of surrounding contamination due to the chemical liquid adhering to the wafer 32. Further, after the cleaning with the chemical solution, the chemical solution is immediately sent to the chemical solution standby tank 14 by the solution delivery line 20, or the chemical solution can be immediately discharged from the cleaning treatment tank 12 even if the manufacturing line is stopped due to an abnormality in another process. Therefore, it is possible to prevent the wafer 32 from being immersed for a predetermined time or longer, and to prevent the wafer 32 from being damaged by the chemical solution. Moreover, since the chemical is used for cleaning a plurality of batches of wafers, the amount of the chemical used can be reduced.
【００３０】以上、本発明のシリコンウエハ洗浄装置に
ついて詳細に説明したが、本発明は上記実施例に限定は
されず、本発明の要旨を逸脱しない範囲において、各種
の改良および変更を行ってもよいのはもちろんである。Although the silicon wafer cleaning apparatus of the present invention has been described above in detail, the present invention is not limited to the above-described embodiments, and various improvements and modifications can be made without departing from the spirit of the present invention. Of course it's good.
【００３１】[0031]
【発明の効果】以上詳細に説明したように、本発明のシ
リコンウエハ洗浄装置は、シリコンウエハの薬液洗浄お
よび純水洗浄を行う洗浄処理槽と、シリコンウエハの純
水洗浄時等に薬液を一時的に貯留する薬液待機槽とを有
するため、シリコンウエハの搬送工程減少による作業時
間の短縮および洗浄用薬液による汚染防止、クリーンル
ームの省スペース、薬液の使用量低減、搬送ミスや異常
発生時等の薬液によるシリコンウエハの損傷防止等等を
好適に実現することができる。As described in detail above, the silicon wafer cleaning apparatus of the present invention has a cleaning treatment tank for cleaning a silicon wafer with a chemical solution and with pure water, and a chemical solution for cleaning the silicon wafer with pure water. Since it has a chemical solution storage tank that stores the chemical solution, it shortens the work time by reducing the transfer process of silicon wafers, prevents contamination by cleaning chemicals, saves space in a clean room, reduces the amount of chemicals used, and can be used for transportation errors and abnormalities. It is possible to preferably realize the prevention of damage to the silicon wafer due to the chemical solution and the like.
【図１】本発明のシリコンウエハ洗浄装置の一例を概念
的に示す図である。FIG. 1 is a diagram conceptually showing an example of a silicon wafer cleaning apparatus of the present invention.
【図２】（ａ），（ｂ）および（ｃ）は、図１に示され
るシリコンウエハ洗浄装置の作用を概念的に示す図であ
る。2 (a), (b) and (c) are views conceptually showing the operation of the silicon wafer cleaning apparatus shown in FIG.
【図３】（ｄ）および（ｅ）は、図１に示されるシリコ
ンウエハ洗浄装置の作用を概念的に示す図である。3 (d) and (e) are diagrams conceptually showing the operation of the silicon wafer cleaning apparatus shown in FIG.
１０ シリコンウエハ洗浄装置（洗浄装置） １２ 洗浄処理槽 １４ 薬液待機槽 １６ 純水供給ライン １８ 廃液ライン ２０ 液送ライン ２２，２４，３０ ライン ２６ 三方コック ２８ ポンプ ３２ シリコンウエハ（ウエハ） 10 Silicon Wafer Cleaning Device (Cleaning Device) 12 Cleaning Treatment Tank 14 Chemical Solution Standby Tank 16 Pure Water Supply Line 18 Waste Liquid Line 20 Liquid Transfer Line 22, 24, 30 Line 26 Three-way Cock 28 Pump 32 Silicon Wafer (Wafer)
Claims (1)
ウエハの薬液洗浄および純水洗浄を行うシリコンウエハ
洗浄装置であって、 シリコンウエハの薬液洗浄および純水洗浄を行う、廃液
の排出手段を有する洗浄処理槽と、前記洗浄処理槽にお
いてシリコンウエハの純水洗浄を行っている間に薬液を
貯留しておく薬液待機槽と、前記洗浄処理槽から薬液待
機槽に薬液を液送する手段と、前記薬液待機槽から洗浄
処理槽に薬液を供給する手段と、前記洗浄処理槽に純水
を供給する手段とを有することを特徴とするシリコンウ
エハ洗浄装置。1. A silicon wafer cleaning apparatus for cleaning a silicon wafer with a chemical solution and pure water in a manufacturing process of a semiconductor device, the cleaning method having a waste liquid discharging means for performing a chemical solution cleaning and a pure water cleaning of a silicon wafer. A treatment tank, a chemical solution standby tank for storing the chemical solution while cleaning the silicon wafer in the cleaning treatment tank with pure water, a means for feeding the chemical solution from the cleaning treatment tank to the chemical solution standby tank, A silicon wafer cleaning apparatus comprising: a means for supplying a chemical solution from a chemical solution standby tank to a cleaning processing tank; and a means for supplying pure water to the cleaning processing tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15934393A JPH0722366A (en) | 1993-06-29 | 1993-06-29 | Cleaning equipment for silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15934393A JPH0722366A (en) | 1993-06-29 | 1993-06-29 | Cleaning equipment for silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0722366A true JPH0722366A (en) | 1995-01-24 |
Family
ID=15691772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15934393A Withdrawn JPH0722366A (en) | 1993-06-29 | 1993-06-29 | Cleaning equipment for silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0722366A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7056498B2 (en) | 1999-12-20 | 2006-06-06 | L'oreal | Composition containing aminophenol derivative, use thereof, and process for dissolving aminophenol derivative |
| JP2010168275A (en) * | 2008-12-26 | 2010-08-05 | Mitsubishi Materials Corp | Method for washing polycrystalline silicon, washing device, and method for producing polycrystalline silicon |
| JP2012126643A (en) * | 2007-09-04 | 2012-07-05 | Mitsubishi Materials Corp | Apparatus for washing polycrystalline silicon |
-
1993
- 1993-06-29 JP JP15934393A patent/JPH0722366A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7056498B2 (en) | 1999-12-20 | 2006-06-06 | L'oreal | Composition containing aminophenol derivative, use thereof, and process for dissolving aminophenol derivative |
| JP2012126643A (en) * | 2007-09-04 | 2012-07-05 | Mitsubishi Materials Corp | Apparatus for washing polycrystalline silicon |
| JP2010168275A (en) * | 2008-12-26 | 2010-08-05 | Mitsubishi Materials Corp | Method for washing polycrystalline silicon, washing device, and method for producing polycrystalline silicon |
| US9238876B2 (en) | 2008-12-26 | 2016-01-19 | Mitsubishi Materials Corporation | Method of washing polycrystalline silicon, apparatus for washing polycrystalline silicon, and method of producing polycrystalline silicon |
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