JP2020088194A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

To provide a substrate processing apparatus and a substrate processing method which are suitable for both simultaneous processing of a plurality of substrates and individual processing of the plurality of substrates.SOLUTION: A substrate processing apparatus includes: an upstream processing part 22; a downstream processing part; a first standby part 231; a second standby part 232; and a transfer robot 4. The upstream processing part 22 sequentially processes a plurality of substrates W one by one.The downstream processing part can simultaneously process two substrates processed by the upstream processing part 22. The first standby part 231 waits for a first substrate W 1 which is a substrate W processed by the upstream processing part 22. The second standby part 232 waits for a second substrate W 2 which is the substrate W processed by the upstream processing part 22 and is a next substrate of the first substrate W 1. The transfer robot 4 can take out both of the first substrate W 1 and the second substrate W 2, and one of only the first substrate W1 and only the second substrate W2 as a transfer target and can convey the transfer target to the downstream processing part.SELECTED DRAWING: Figure 3

Description

The present invention relates to a substrate processing apparatus and a substrate processing method.

Coater/developer devices having a plurality of processing devices are known. For example, in the coater/developer apparatus described in Patent Document 1, a plurality of substrates taken out from a cassette placed on an indexer section are sequentially put into a cleaning apparatus, and then a dehydration baking apparatus, a resist coating apparatus, a prebaking apparatus. , The exposure device, the developing device, and the post-baking device in this order, and then stored again in the cassette.

In this coater/developer device, the following two types of processing devices are mixed. That is, the flat-flow processing apparatus and the variable transfer type processing apparatus coexist. Substrates are loaded one by one into this flatbed processing apparatus. The flatbed processing apparatus sequentially conveys these substrates in one direction to process the substrates one by one. Examples of the flat-flow processing device include a cleaning device and a developing device.

Substrates are loaded into the variable transfer type processing apparatus one by one. The variable transfer type processing apparatus has a plurality of processing units and a substrate transfer unit that transfers a substrate to the plurality of processing units. The substrate carrying means has a hand for receiving the substrate and a moving mechanism for moving the hand to each processing section. The substrate transfer means receives the substrates one by one from the upstream device and transfers the substrates to the processing section. The substrate transfer means can also transfer the substrate between the processing units. An example of this variable transfer type processing apparatus is a dehydration baking apparatus. In this dehydration baking apparatus, a heating unit and a cooling unit are provided as a plurality of processing units.

JP, 2005-156426, A

However, for example, a substrate is conveyed one by one from an upstream side flattening device to each treatment section of such a variable conveyance type treatment apparatus, and each treatment section processes the substrate one by one. Therefore, there is a problem that the throughput of substrate processing is low.

Therefore, it is conceivable to cause each processing unit of the variable transfer type processing apparatus to simultaneously process a plurality of substrates. Thereby, the throughput of substrate processing can be improved.

However, it is not always desirable that each processing unit of the variable transfer type processing apparatus simultaneously processes a plurality of substrates, and it is desirable that each processing unit performs a processing on one substrate. There is also. A brief description will be given below.

For example, in the flatbed processing apparatus, after the processing of the preceding substrate (hereinafter referred to as the preceding substrate) is completed, the substrate flowing next (hereinafter referred to as the next substrate) is processed. Therefore, the preceding substrate needs to wait for the processing of the next substrate to be completed, and the state of the preceding substrate may change over time during the waiting period. Therefore, the states of the preceding substrate and the next substrate at the time when the processing of the next substrate is completed may be different from each other. When the difference between the states of the preceding substrate and the next substrate becomes large as described above, it is not preferable to wait for the completion of the processing of the next substrate in the flatbed processing apparatus. Therefore, it is desirable that the preceding substrate and the next substrate are sequentially carried to each processing unit of the variable carrying type processing apparatus on the downstream side, and the preceding substrate and the next substrate are individually processed one by one. As a result, it is possible to perform processing on a substrate having no difference in state.

On the other hand, if the difference is small, it is desirable that each processing unit of the variable transfer type processing apparatus on the downstream side simultaneously processes the preceding substrate and the next substrate. Thereby, the throughput can be improved.

However, conventionally, such a difference in processing method has not been taken into consideration, and a substrate processing apparatus suitable for both such processing methods has not been proposed.

Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing apparatus and a substrate processing method suitable for both simultaneous processing of a plurality of substrates and individual processing of a plurality of substrates. ..

A first aspect of the substrate processing apparatus is an upstream processing unit that sequentially processes a plurality of substrates one by one, a downstream processing unit that can simultaneously process two substrates processed by the upstream processing unit, and A first standby unit that waits for a first substrate that is a substrate processed by an upstream processing unit, and a second substrate that is a substrate processed by the upstream processing unit and that is the next substrate to the first substrate. A second standby unit, both the first substrate waiting in the first standby unit and the second substrate waiting in the second standby unit, only the first substrate waiting in the first standby unit; Also, a transfer robot is provided which can take out only the second substrate waiting in the second standby unit as a transfer target and can transfer the transfer target to the downstream processing unit.

A second aspect of the substrate processing apparatus is the substrate processing apparatus according to the first aspect, wherein the first standby unit has a first raising mechanism for raising the first substrate, and the second standby unit is There is a second raising mechanism that raises the second substrate, and the first raising mechanism and the second raising mechanism are driven independently of each other.

A third aspect of the substrate processing apparatus is the substrate processing apparatus according to the second aspect, wherein the upstream processing unit has a transport unit that sequentially transports the plurality of substrates one by one along a transport direction. However, the first standby unit is located downstream of the transport unit in the transport direction, and the second standby unit is located between the transport unit and the first standby unit in the transport direction. And has a function of transporting the first substrate from the transport unit to the first standby unit. When the first substrate is transported from the second standby unit to the first standby unit, the first substrate is transferred to the first standby unit. The first raising mechanism raises the first substrate, and the second substrate is conveyed from the conveying unit to the second standby unit in a state where the first raising mechanism raises the first substrate.

A fourth aspect of the substrate processing apparatus is the substrate processing apparatus according to any one of the first to third aspects, wherein the downstream processing unit has a plurality of drying units that perform a drying process, The robot conveys the first substrate to one of the plurality of drying units when the required drying time required for drying each of the first substrate and the second substrate is the first time, and the second substrate Is conveyed to another one of the plurality of drying units, and when the required drying time is a second time longer than the first time, both of the first substrate and the second substrate are received and collectively received. Then, it is conveyed to one of the plurality of drying sections.

The aspect of the substrate processing method includes a first step of sequentially processing a plurality of substrates one by one, a second step of waiting the first substrate that is the substrate processed in the first step, and a first step of the first step. A third step of waiting for a second substrate that is a processed substrate, which is a substrate next to the first substrate, both the first substrate and the second substrate, only the first substrate, and A fourth step of taking out the transfer target by a transfer robot capable of taking out only the second substrate as a transfer target, and transferring the transfer target by the transfer robot to a downstream processing unit capable of simultaneously processing two substrates. And a fifth step.

According to the first aspect of the substrate processing apparatus and the aspect of the substrate processing method, the transfer robot can also transfer both the first substrate and the second substrate to the downstream processing unit in a lump, and the first substrate and The second substrate can also be individually transported to the downstream processing unit. If both the first substrate and the second substrate are collectively transported to the downstream processing unit, the downstream processing apparatus simultaneously processes both the first substrate and the second substrate. According to this, the throughput can be improved. On the other hand, if the first substrate and the second substrate are individually conveyed to the downstream processing unit, the downstream processing unit individually processes the first substrate and the second substrate. According to this, the downstream processing unit can perform processing on the first substrate and the second substrate under processing conditions suitable for the first substrate and the second substrate, respectively.

According to the second aspect of the substrate processing apparatus, since the first raising mechanism and the second raising mechanism are driven independently of each other, it is possible to raise only the first substrate or only the second substrate. It is also possible to raise both the first substrate and the second substrate.

According to the third aspect of the substrate processing apparatus, the first substrate can be raised at an earlier timing. According to this, the 1st board|substrate can be supported apart from a conveyance part. Therefore, the amount of heat transferred between the transfer unit and the substrate can be reduced. Therefore, the difference between the temperature states of the first substrate and the second substrate can be reduced.

According to the fourth aspect of the substrate processing apparatus, since the upstream processing unit sequentially processes the first substrate and the second substrate one by one, the end timing of the processing differs between the first substrate and the second substrate. To do. Specifically, the end timing of the first substrate is earlier than the end timing of the second substrate. Therefore, the dry state of the first substrate after the processing on the first substrate and the second substrate is different from the dry state of the second substrate.

When the required drying time is short, each of the first substrate and the second substrate is easily dried, and the difference in the degree of drying due to the difference in the processing end timing is relatively large. In this case, the transfer robot transfers the first substrate and the second substrate to different drying units. Therefore, the drying process can be performed for the drying time suitable for each of the first substrate and the second substrate.

On the other hand, when the required drying time is long, it is difficult to dry each of the first substrate and the second substrate, and the difference in the degree of drying due to the difference in the processing end timing is relatively small. In this case, the transfer robot collectively transfers the first substrate and the second substrate to one drying unit. As a result, the throughput required for drying can be improved.

It is a top view which shows roughly an example of a structure of a substrate processing apparatus. It is a functional block diagram which shows roughly an example of a structure of a control part. It is a side view which shows roughly an example of a structure of a coating device and a conveyance robot. It is a flow chart which shows an example of operation of a control part. It is a side view which shows roughly an example of a structure of a coating device and a conveyance robot.

First embodiment.
<1. An example of an overview of the overall configuration and overall operation of the substrate processing apparatus>
FIG. 1 is a plan view schematically showing an example of the configuration of the substrate processing apparatus 1. In each of the drawings referred to below, the dimensions and the number of each part are exaggerated or simplified as necessary for the purpose of easy understanding. Further, in each drawing, an XYZ orthogonal coordinate system is appropriately shown in order to explain the positional relationship of each configuration. Here, the Z axis is arranged in a posture along the vertical direction, and the X axis and the Y axis are arranged along the horizontal plane. Below, one side in the X-axis direction is also called +X side, and the other side is also called −X side. The same applies to the Y axis and the Z axis. In the following, the +Z side means the vertically upper side.

The substrate processing apparatus 1 includes a coating device 2, a reduced pressure drying device 3, a transfer robot 4, and a control unit 6. The substrate W is loaded into the coating device 2 from the upstream side. It is preferable that the substrate W be appropriately subjected to a treatment such as a cleaning treatment before the coating device 2 is carried in. The coating device 2 performs the coating process on the substrates W one by one while sequentially transporting the plurality of substrates W one by one along the transport direction. As a result, a coating film is formed on the upper surface of the substrate W. As the coating liquid for coating the substrate W, for example, a coating liquid for photoresist or a coating liquid for insulating film can be adopted.

The reduced-pressure drying device 3 is provided on the downstream side of the coating device 2 and includes a plurality of drying units 31. Each of the plurality of drying units 31 is capable of receiving N (N is an integer of 2 or more) substrates W processed by the coating device 2. Hereinafter, as an example, a case where two substrates are used as the N substrates W will be described. The drying unit 31 performs a reduced pressure drying process on the loaded substrate W. That is, when the two substrates W are loaded into the drying unit 31, the drying unit 31 simultaneously performs the reduced-pressure drying process on the two substrates W. Further, when one substrate W is carried into the drying unit 31, the drying unit 31 performs reduced pressure drying processing on the one substrate W. By this reduced-pressure drying treatment, the coating film on the substrate W is dried to some extent. Note that the processing periods of the two substrates in the drying unit 31 do not have to completely match, and it is sufficient that at least some of the processing periods overlap. In short, the term "simultaneous" is used in the sense of being in contrast to a state in which the processing periods do not overlap at all.

The transfer robot 4 can collectively take out the two substrates W processed by the coating device 2 as transfer targets, and transfer the transfer targets to the drying unit 31 in a batch. Hereinafter, as an example, a case where two substrates are used as the N substrates W will be described.

The transfer robot 4 can also take out the substrates W processed by the coating device 2 one by one as a transfer target and sequentially transfer the respective substrates W to different drying units 31. The number of substrates W transported by the transport robot 4 is changed according to the processing content of the coating apparatus 2 (specifically, the type of coating liquid), as described later in detail.

The transfer robot 4 transfers the substrate W processed by the reduced-pressure drying device 3 to the transfer unit 5. The delivery unit 5 is provided above the drying unit 31 and can receive two substrates W. When the two substrates W are simultaneously processed in the drying unit 31, the transfer robot 4 takes out the two substrates W from the drying unit 31 and transfers the two substrates W to the delivery unit 5 all at once. To do. On the other hand, when one substrate W is processed in the drying unit 31, the transfer robot 4 takes out the one substrate W and transfers the one substrate W to the transfer unit 5. Further, the transfer robot 4 takes out one substrate W processed by the other drying unit 31 and transfers the one substrate W to the transfer unit 5. As a result, the two substrates W are loaded into the delivery unit 5.

The two substrates W loaded into the delivery unit 5 are collectively taken out by the transfer robot 72 provided on the downstream side thereof and transferred to the heating unit 71 of the heating device 7 on the downstream side. The heating unit 71 simultaneously heats the two substrates W. As a result, the coating films on the two substrates W are almost completely dried.

The controller 6 controls the processing in each processing apparatus and the transfer of the substrate W. FIG. 2 is a functional block diagram schematically showing an example of the configuration of the control unit 6. The control unit 6 is a control circuit, and as shown in FIG. 2, for example, a CPU (Central Processing Unit) 61, a ROM (Read Only Memory) 62, a RAM (Random Access Memory) 63, a storage device 64, etc. It is composed of general computers interconnected via a bus line 65. The ROM 62 stores basic programs and the like, and the RAM 63 serves as a work area when the CPU 61 performs a predetermined process. The storage device 64 is composed of a flash memory or a non-volatile storage device such as a hard disk device.

Further, in the control unit 6, the input unit 66, the display unit 67, and the communication unit 68 are also connected to the bus line 65. The input unit 66 includes various switches, a touch panel, or the like, and receives various input setting instructions such as a processing recipe from an operator. The display unit 67 includes a liquid crystal display device, a lamp, and the like, and displays various information under the control of the CPU 61. The communication unit 68 has a data communication function via a LAN (Local Area Network) or the like.

Further, each robot (transport robots 4, 72, etc.) and each processing device described above are connected to the control unit 6 as control targets. That is, the control unit 6 can function as a transfer control unit that controls the transfer of the substrate W.

The function of the control unit 6 may be realized by the CPU 61 executing a program stored in the ROM 62 or the storage device 64. That is, the function of the control unit 6 may be realized by software. Alternatively, all or some of the functions of the control unit 6 may be realized by hardware including a dedicated logic circuit or the like.

<1-1. Coating device>
The coating apparatus 2 includes a substrate introducing section 21, a processing apparatus main body 22, and a substrate standby section 23. The substrate introducing unit 21 receives the substrate W. For example, the two substrates W are collectively loaded into the substrate introducing section 21. The processing apparatus main body 22 sequentially receives the substrates W transferred from the substrate introducing unit 21, and transfers the substrates W along the transfer direction. Here, the transport direction in the processing apparatus main body 22 is the X-axis direction, the upstream side in the transport direction is the −X side, and the downstream side in the transport direction is the +X side. The coating device 2 is an upstream processing unit located on the upstream side (−X side) of the reduced pressure drying device 3.

The processing apparatus main body 22 sequentially conveys the substrates W to the +X side, and sequentially applies the substrates W one by one. The substrate W after the coating process is sequentially transported from the processing apparatus main body 22 to the substrate standby unit 23. The substrate standby unit 23 sequentially receives the substrates W transferred from the processing apparatus main body 22. The substrate waiting section 23 can put the two substrates W received sequentially in a standby state. The term "standby" as used herein means to stop at that position regardless of the length of the waiting time. The substrate W waiting in the substrate standby unit 23 is taken out by the transfer robot 4 and transferred to the reduced pressure drying device 3 on the downstream side.

<1-1-1. Substrate introduction part>
FIG. 3 is a side view schematically showing an example of the configurations of the coating device 2 and the transfer robot 4. In the example of FIG. 3, the substrate introducing unit 21 includes, for example, a roller conveyor. This roller conveyor includes a plurality of rotating shafts 211A, a plurality of rotating shafts 211B, a plurality of rollers 212A and a plurality of rollers 212B. Each of the rotating shaft 211A and the rotating shaft 211B is provided such that its central axis is along the Y axis. The plurality of rotating shafts 211A are arranged at intervals in the X-axis direction, and the plurality of rotating shafts 211B are arranged at intervals in the X-axis direction on the downstream side of the plurality of rotating shafts 211A. The rotary shaft 211A and the rotary shaft 211B are provided at substantially the same height position. Each of the rotating shaft 211A and the rotating shaft 211B can rotate about its own central axis.

A plurality of rollers 212A are provided on the outer peripheral surface of each rotating shaft 211A, and a plurality of rollers 212B are provided on the outer peripheral surface of each rotating shaft 211B. The rollers 212A and 212B have an annular shape, and are provided with their central axes aligned with the Y axis.

The substrate W is placed on the plurality of rollers 212A and the plurality of rollers 212B. That is, the uppermost part of the outer peripheral surface of the plurality of rollers 212A contacts the lower surface of the substrate W, and the uppermost part of the outer peripheral surface of the plurality of rollers 212B contacts the lower surface of the substrate W.

The plurality of rotation shafts 211A are driven by a drive unit (not shown) and rotate in the same predetermined direction at substantially equal rotation speeds (synchronous rotation). By this rotation, the plurality of rollers 212A also rotate in the same direction at substantially the same rotation speed. The drive unit has a motor and is controlled by the control unit 6. Due to the rotation of the roller 212A, the substrate W placed on the roller 212A is transported to the +X side. The plurality of rotary shafts 211B are also driven by a drive unit (not shown) to rotate synchronously. As a result, the substrate W placed on the roller 212B is transported to the +X side. The rotary shaft 211A and the rotary shaft 211B are controlled independently of each other.

One substrate W may be placed on each of the rollers 212A and 212B. For example, two substrates W may be placed on the rollers 212A and 212B, respectively, from the upstream device. In this state, the controller 6 synchronously rotates only the rotary shaft 211B. As a result, the substrate W on the roller 212B can be transported to the processing apparatus main body 22. Next, the control unit 6 synchronously rotates both the rotary shaft 211A and the rotary shaft 211B. As a result, the substrate W on the roller 212A can be transported to the processing apparatus main body 22.

<1-1-2. Overview of processing unit>
The processing apparatus main body 22 sequentially transports the substrates W and sequentially performs coating processing on the substrates W. In the example of FIGS. 1 and 3, the processing apparatus main body 22 includes a transfer unit 221, a floating stage 222, a substrate transfer unit 223, and a nozzle 224.

The transfer unit 221 is a unit that transfers the substrate W transferred from the substrate introducing unit 21 to the levitation stage 222, and is a unit that changes the transfer method. That is, while the substrate W is transported by the roller transport system in the substrate introduction unit 21, the levitation stage 222, which will be described later, transports the substrate W by the levitation transport system, so the transfer unit 221 transfers between them. Change the transport method.

A plurality of jet ports are provided on the upper surface of the floating stage 222, and gas is jetted from the jet ports. Therefore, the substrate W is given a buoyancy by the gas on the floating stage 222.

The substrate transport unit 223 transports the substrate W from the transfer unit 221 via the floating stage 222 to the substrate standby unit 23 while holding both end portions of the substrate W in the Y-axis direction. Since the substrate transport unit 223 holds only both end portions of the substrate W, the substrate W can bend near the center thereof. However, the levitation stage 222 ejects gas from the ejection port to the lower surface of the substrate W to give buoyancy to the substrate W. Thereby, the bending of the substrate W can be suppressed. Therefore, the substrate W can pass through the levitation stage 222 in a horizontal posture.

The nozzle 224 is provided in the space above the floating stage 222. The substrate transport unit 223 moves the substrate W to the +X side above the floating stage 222, so that the substrate W crosses directly under the nozzle 224. The nozzle 224 applies the coating liquid to the substrate W immediately below. Thereby, a coating film can be formed on the substrate W. The nozzle 224 may be configured to be movable between the processing position and the standby position. The processing position is a position where the nozzle 224 discharges the coating liquid onto the substrate W, and the standby position is a position where the nozzle 224 is on standby. At the standby position, a mechanism or the like for cleaning the discharge port of the nozzle 224 may be provided.

The substrate W on which the coating film is formed is transported by the substrate transport unit 223 to the substrate standby unit 23. The substrate transport unit 223 releases the holding of the substrate W in the substrate standby unit 23. After that, the substrate transport unit 223 returns to the transfer unit 221 again and holds the next substrate W.

<1-1-2-1. Transfer unit>
In the example of FIG. 3, the transfer unit 221 includes a plurality of rollers 2211, an entrance floating stage 2212, and a plurality of lift pins 2213. The plurality of rollers 2211 have the same configuration as the rollers of the substrate introducing unit 21, and are arranged at intervals in the X-axis direction. The rotation of the roller 2211 is controlled by the control unit 6. The roller 2211 receives the substrate W transported from the substrate introducing unit 21 by its rotation and transports it to the +X side.

The entrance floating stage 2212 is provided on the downstream side (+X side) of the plurality of rollers 2211. A plurality of ejection ports (not shown) are formed on the upper surface of the inlet floating stage 2212. The jet outlets are arranged, for example, in a matrix in a plan view (that is, when viewed along the Z-axis direction). Each ejection port is connected to a gas supply source (not shown) via a gas supply path formed inside the inlet levitation stage 2212. The gas from the gas supply source is ejected from this ejection port. Accordingly, buoyancy can be applied to the substrate W on the entrance levitation stage 2212.

The plurality of lift pins 2213 have a rod shape extending along the Z-axis direction, and are provided so as to be able to move up and down. Some of the plurality of lift pins 2213 are provided corresponding to the rollers 2211, and the rest are provided corresponding to the entrance levitation stage 2212. The lift pins 2213 corresponding to the rollers 2211 are provided in the gaps between the plurality of rollers 2211. A plurality of through holes are formed in the inlet floating stage 2212 so as not to interfere with any of the plurality of ejection ports. This through hole penetrates the entrance levitation stage 2212 in the Z-axis direction. The remaining lift pins 2213 are arranged to pass through the through holes. As illustrated in FIG. 3, the plurality of lift pins 2213 may be connected to each other at the base end on the −Z side.

The lift pin 2213 is moved up and down by the lifting mechanism 2214. The lifting mechanism 2214 is, for example, an air cylinder, and is controlled by the control unit 6.

When the lift pin 2213 is in the lowered state, the +Z side tip of the lift pin 2213 is located on the −Z side with respect to both the uppermost part of the outer peripheral surface of the roller 2211 and the upper surface of the entrance floating stage 2212. When the lift pin 2213 is in the raised state, its tip is located on the +Z side with respect to both the uppermost part of the roller 2211 and the upper surface of the entrance levitation stage 2212, and may contact the lower surface of the substrate W to lift the substrate W. it can. The substrate W is held by the substrate transport unit 223 while being lifted by the lift pins 2213.

<1-1-2-2. Levitation stage>
The levitation stage 222 is provided on the +X side of the entrance levitation stage 2212. A plurality of ejection ports (not shown) are also formed on the upper surface of the floating stage 222. The jet outlets are arranged, for example, in a matrix in a plan view. Each ejection port is connected to a gas supply source via a gas supply path formed inside the floating stage 222. The gas from the gas supply source is ejected from this ejection port.

A plurality of suction ports may be formed on the upper surface of the floating stage 222. The suction port is formed at a position different from the ejection port, and is arranged in a matrix, for example. Each suction port is connected to a suction device (for example, a pump) via a gas suction path formed inside the levitation stage 222. A part of the gas ejected from the ejection port of the floating stage 222 is sucked from the suction port. According to this, the buoyancy applied to the substrate W can be controlled more precisely. As a result, the bending of the substrate W can be further reduced.

<1-1-2-3. Substrate transfer unit>
In the example of FIG. 1, the substrate transfer unit 223 includes a substrate chuck unit 2231 and an advancing/retreating mechanism 2232. The substrate chuck portion 2231 holds the end faces on both sides of the substrate W in the Y-axis direction. In the example of FIG. 1, a pair of substrate chuck portions 2231 are provided on both sides of the substrate W in the Y-axis direction. The pair of substrate chuck portions 2231 are provided at intervals in the X-axis direction. Each substrate chuck portion 2231 has a support portion that supports an end portion of the lower surface of the substrate W in the Y-axis direction. For example, a suction port is formed on the upper surface of the support portion, and the suction port is connected to a suction device (for example, a pump) via a suction path inside the support portion. By sucking the gas from the suction port, the substrate chuck portion 2231 can suck and hold the substrate W.

The advancing/retreating mechanism 2232 moves the substrate chuck portion 2231 along the X-axis direction. The advancing/retreating mechanism 2232 of the substrate W is, for example, a linear motor. The advancing/retreating mechanism 2232 is controlled by the control unit 6. The advancing/retreating mechanism 2232 moves the substrate chuck portion 2231 from the transfer unit 221 to the substrate standby portion 23 via the floating stage 222. As a result, the substrate W held by the substrate chuck section 2231 also moves from the transfer unit 221 to the substrate standby section 23 via the levitation stage 222.

<1-1-2-4. Nozzle>
The nozzle 224 is provided in the space above the floating stage 222. At the lower end of the nozzle 224, a discharge port corresponding to the coating region R1 of the substrate W is formed. The nozzle 224 is a long nozzle whose discharge port is long in the Y-axis direction. The length of the ejection port (the length along the Y-axis direction) is substantially equal to the length of the application region R1 (the length along the Y-axis direction).

Each of the nozzles 224 is connected to a coating liquid supply source via a coating liquid supply pipe (not shown). A pump (not shown) is provided in the middle of the coating liquid supply pipe, and by controlling the drive of this pump, discharge/stop of the coating liquid from the nozzle 224 can be switched. The pump is controlled by the control unit 6.

The substrate transport unit 223 moves the substrate W to the +X side, so that the substrate W crosses directly under the nozzle 224. The nozzle 224 discharges the coating liquid when the substrate W crosses. Specifically, the nozzle 224 starts discharging the coating liquid when the +X side end of the coating region R1 of the substrate W is located directly below the nozzle 224, and the −X side end of the coating region R1 is the nozzle 224. When it is located directly below, the discharge of the coating liquid is completed. As a result, the application liquid is applied to the application region R1 and a coating film is formed on the application region R1.

The nozzle 224 may be capable of ejecting a plurality of types of coating liquid onto the substrate W. More specifically, a plurality of nozzles 224 corresponding to a plurality of types of coating liquids may be provided. As the plurality of types of coating liquid, for example, a coating liquid for photoresist and a coating liquid for insulating film can be adopted.

<1-1-3. Substrate waiting section>
The substrate standby unit 23 sequentially receives the substrates W processed by the processing apparatus main body 22. The substrate waiting section 23 can make two substrates W stand by. The substrate waiting section 23 includes a first waiting section 231 and a second waiting section 232. The first standby unit 231 can make one substrate W stand by, and the second standby unit 232 can make one substrate W stand by.

In the example of FIGS. 1 and 3, the first standby unit 231 and the second standby unit 232 are arranged side by side in the transport direction of the processing apparatus main body 22 (that is, the X-axis direction). More specifically, the first standby unit 231 is provided on the +X side of the processing device main body 22, and the second standby unit 232 is provided between the processing device main body 22 and the first standby unit 231. The second standby unit 232 also has a function of transporting the substrate W transported from the processing apparatus main body 22 to the first standby unit 231.

One substrate W processed in the processing apparatus main body 22 (hereinafter, referred to as a first substrate W1) is transported by the substrate transport unit 223 to the first standby unit 231 via the second standby unit 232. The first standby unit 231 can make the first substrate W1 stand by. The second substrate W2 processed after the first substrate W1 in the processing apparatus main body 22 is transferred to the second standby unit 232 by the substrate transfer unit 223. The second standby unit 232 can make the second substrate W2 stand by.

As a more specific example, the substrate standby unit 23 includes an exit levitation stage 233, a first raising mechanism 234, and a second raising mechanism 235. The exit levitation stage 233 is provided on the +X side of the levitation stage 222. On the upper surface of the outlet levitation stage 233, as in the inlet levitation stage 2212, a plurality of ejection ports for ejecting gas are formed. The length of the exit levitation stage 233 (length along the X-axis direction) is set to be longer than the sum of the lengths of the two substrates W (length along the X-axis direction).

The first substrate W1 is transported to the downstream portion of the exit levitation stage 233. The first raising mechanism 234 raises the first substrate W1 located in the downstream portion. The first raising mechanism 234 is controlled by the controller 6. In the example of FIG. 3, the first lifting mechanism 234 includes a plurality of lift pins 2341 and a lifting mechanism 2342. Each lift pin 2341 has a rod shape, and is provided with its longitudinal direction along the Z axis. As illustrated in FIG. 3, the −Z side proximal ends of the lift pins 2341 may be connected to each other. The outlet levitation stage 233 is formed with a plurality of through holes extending in the Z-axis direction so as not to interfere with any of the plurality of jet outlets. The lift pins 2341 are arranged to pass through the through holes of the exit levitation stage 233.

The elevating mechanism 2342 is, for example, an air cylinder, and moves up and down the plurality of lift pins 2341. The elevating mechanism 2342 is controlled by the controller 6. In the state where the lift pin 2341 is lowered, the tip end portion of the lift pin 2341 is located on the −Z side with respect to the upper surface of the exit levitation stage 233. On the other hand, when the lift pin 2341 is raised, the tip of the lift pin 2341 is located on the +Z side with respect to the upper surface of the exit levitation stage 233. The elevating mechanism 2342 raises the lift pins 2341 in a state where the suction of the first substrate W1 by the substrate chuck portion 2231 is released. Due to this rise, the tips of the lift pins 2341 come into contact with the lower surface of the first substrate W1, and the first substrate W1 can be lifted. The lift pins 2341 may raise the first substrate W1 to a height position where the gas ejected from the exit levitation stage 233 does not substantially reach. As a result, the first substrate W1 is supported by the lift pins 2341.

In the example of FIG. 3, the first standby unit 231 for waiting the first substrate W1 is configured by the downstream portion of the exit levitation stage 233 and the first lifting mechanism 234.

The second substrate W2 to be processed after the first substrate W1 is transported to the upstream portion of the exit levitation stage 233. The upstream part of the exit levitation stage 233 is located on the −X side with respect to the downstream part. The second raising mechanism 235 raises the second substrate W2 located in the upstream portion. The second raising mechanism 235 is controlled by the control unit 6 independently of the first raising mechanism 234. In the example of FIG. 3, the second lifting mechanism 235 includes a plurality of lift pins 2351 and a lifting mechanism 2352. Since the lift pin 2351 and the lifting mechanism 2352 are similar to the lift pin 2341 and the lifting mechanism 2342, respectively, detailed description thereof will be omitted.

The elevating mechanism 2352, like the elevating mechanism 2342, raises the lift pins 2351 in a state where the suction of the second substrate W2 by the substrate chuck portion 2231 is released. By this rise, the tip end portion of the lift pin 2351 comes into contact with the lower surface of the second substrate W2, and the second substrate W2 can be lifted. The second substrate W2 is supported by the lift pins 2351.

In the example of FIG. 3, the second standby part 232 for waiting the second substrate W2 is configured by the upstream part of the exit levitation stage 233 and the second lifting mechanism 235.

As described above, since the first raising mechanism 234 and the second raising mechanism 235 are driven independently of each other, it is possible to raise only the first substrate W1 or only the second substrate W2. It is also possible to raise both the substrate W1 and the second substrate W2.

The first substrate W1 and the second substrate W2 are taken out by the transfer robot 4 while being supported by the lift pins 2341 and the lift pins 2351, respectively.

<1-2. Transfer robot>
In the example of FIG. 3, the transfer robot 4 is located on the +X side of the substrate standby unit 23. The transfer robot 4 can take out both the first substrate W1 and the second substrate W2 from the substrate standby unit 23 at a time. The transfer robot 4 can also take out the first substrate W1 and the second substrate W2 individually from the substrate standby unit 23.

In the example of FIGS. 1 and 3, the transfer robot 4 includes a hand 41, a moving mechanism 42, a rotating mechanism 43, and an elevating mechanism 44. The hand 41 has a size such that two substrates W can be placed in a state of being aligned in the X-axis direction. For example, the hand 41 has a plurality of finger-shaped members 411 and a base end member 412 that connects the base ends of the finger-shaped members 411. The finger member 411 has an elongated shape, and the substrate W is placed on the upper surface thereof. The two substrates W are placed side by side along the longitudinal direction of the finger member 411. Therefore, the length of the finger member 411 in the longitudinal direction is set according to the length of two substrates W and the distance between the substrates W.

The moving mechanism 42 can move the hand 41 in the horizontal direction. For example, the moving mechanism 42 has a pair of arms (not shown). Each arm has a plurality of elongated connecting members, and the ends of the connecting members are rotatably connected to each other. One end of each arm is connected to the hand 41 (specifically, the base end member 412), and the other end is connected to the rotation mechanism 43. The hand 41 can be moved in the horizontal direction by controlling the connection angle of the connection member. The rotation mechanism 43 can rotate the other end of the arm of the movement mechanism 42 about a rotation axis along the Z-axis direction. As a result, the hand 41 moves along the arc. By this movement, the direction of the hand 41 can be changed. The rotation mechanism 43 has, for example, a motor. The elevating mechanism 44 raises and lowers the hand 41 by raising and lowering the rotating mechanism 43 along the Z-axis direction. The elevating mechanism 44 has, for example, a ball screw mechanism. The moving mechanism 42, the rotating mechanism 43, and the elevating mechanism 44 are controlled by the control unit 6.

By appropriately moving and rotating the hand 41, the transfer robot 4 can move the hand 41 to each of the substrate standby unit 23, the drying unit 31, and the delivery unit 5.

For example, the transport robot 4 drives the rotating mechanism 43 to make the hand 41 face the substrate standby unit 23. Next, the transfer robot 4 drives the lifting mechanism 44 to position the hand 41 on the −Z side with respect to the first substrate W1 and the second substrate W2. Next, the transfer robot 4 drives the moving mechanism 42 to move the hand 41 to the −X side, and causes the hand 41 to face both the first substrate W1 and the second substrate W2 in the Z-axis direction. Next, the transfer robot 4 drives the lifting mechanism 44 to raise the hand 41. Thereby, the transfer robot 4 can receive both the first substrate W1 and the second substrate W2 from the substrate standby unit 23.

The transport robot 4 transports the first substrate W1 and the second substrate W2 collectively to the drying unit 31 by rotating and moving the hand 41 as appropriate. Specifically, the transport robot 4 drives the rotating mechanism 43 to make the hand 41 face the drying unit 31. Next, the transport robot 4 drives the lifting mechanism 44 to make the hand 41 face the shutter of the drying unit 31. Next, the transfer robot 4 drives the moving mechanism 42 to cause the hand 41 to enter the inside of the drying unit 31 via the shutter, and to make the first substrate W1 and the second substrate W2 face the substrate holding unit in the Z-axis direction. Next, the transport robot 4 drives the elevating mechanism 44 to lower the hand 41 to transfer the first substrate W1 and the second substrate W2 to the substrate holding unit. Next, the transport robot 4 drives the moving mechanism 42 to retract the hand 41 from the inside of the drying unit 31.

The transfer robot 4 can also take out the first substrate W1 and the second substrate W2 individually. By the way, in order to take out the first substrate W1 and the second substrate W2 collectively, it is necessary that both the first substrate W1 and the second substrate W2 stand by in the substrate waiting section 23. That is, it is necessary to wait for the next second substrate W2 to be transported to the substrate standby unit 23 after the first substrate W1 is transported to the substrate standby unit 23. On the other hand, when the first substrate W1 and the second substrate W2 are individually taken out, the first substrate W1 is removed from the substrate standby unit 23 even when the second substrate W2 is not yet transported to the substrate standby unit 23. You can take it out. Therefore, in the individual transfer, the transfer robot 4 may take out the first substrate W1 from the substrate transfer unit 23 without waiting for the second substrate W2.

The transfer robot 4 can take out only the first substrate W1 from the substrate standby unit 23. As a specific example, the transfer robot 4 performs a take-out operation in a state where the second substrate W2 is not transferred to the substrate standby unit 23 (that is, a state in which the second substrate W2 is processed by the processing apparatus main body 22). To do. That is, the transport robot 4 causes the hand 41 to face the substrate standby unit 23 by the rotation of the rotation mechanism 43, and then moves the lifting mechanism 44 up and down to position the hand 41 on the −Z side with respect to the first substrate W1. .. Then, the transport robot 4 drives the moving mechanism 42 to move the hand 41 to the −X side so that the tip side portion of the hand 41 faces only the first substrate W1. Then, the transfer robot 4 raises the hand 41. As a result, the transfer robot 4 can receive only the first substrate W1 from the substrate standby unit 23. The transfer robot 4 transfers only the first substrate W1 to the drying unit 31.

Further, with the first substrate W1 taken out, the transfer robot 4 can take out only the second substrate W2 from the substrate waiting section 23 as follows. That is, the transport robot 4 causes the hand 41 to face the substrate standby portion 23 by the rotation of the rotation mechanism 43, and then moves the lifting mechanism 44 up and down to position the hand 41 on the −Z side with respect to the second substrate W2. .. Then, the transport robot 4 drives the moving mechanism 42 to make the hand 41 face the second substrate W2. Then, the transfer robot 4 drives the lifting mechanism 44 to raise the hand 41. Thereby, the transfer robot 4 can receive only the second substrate. The transfer robot 4 transfers only the second substrate W2 to the drying unit 31.

As described above, the transport robot 4 can sequentially take out the substrates W sequentially transported to the substrate standby unit 23 one by one and sequentially transport the substrates W to the drying unit 31. In such an individual transfer, when the second substrate W2 is transferred to the substrate standby unit 23, the first substrate W1 has already been taken out, so the second substrate W2 is transferred to the first standby unit 231. Good.

A method of determining the number of substrates W taken out from the substrate standby unit 23 by the transfer robot 4 will be described later in detail.

<1-3. Vacuum dryer>
The drying unit 31 of the reduced pressure drying apparatus 3 can collectively perform the reduced pressure drying process on the two substrates W. The reduced-pressure drying device 3 is a downstream processing unit located on the downstream side (+X side) of the coating device 2.

As the plurality of drying units 31, for example, three drying units 31a to 31c are provided. In the example of FIG. 1, two drying units 31 are provided around the transport robot 4 in a plan view. For example, the drying unit 31a is provided on the +Y side of the transport robot 4, and the drying unit 31c is provided on the +X side of the transport robot 4. The drying unit 31b is provided on the +Z side with respect to the drying unit 31a. That is, the drying unit 31b is laminated on the +Z side of the drying unit 31a.

The drying unit 31 includes a chamber, a substrate holding unit, and a decompression mechanism, all not shown. The chamber forms an enclosed space. However, a shutter (not shown) used for loading and unloading the substrate W is provided on the side surface of the chamber facing the transfer robot 4. By closing this shutter, the chamber forms a closed space. By opening the shutter, the transfer robot 4 can transfer the substrate W to and from the substrate holding unit in the chamber. The substrate holding part can hold two substrates W in a state where they are horizontally arranged. The transfer robot 4 can transfer the two substrates W to the substrate holding unit at once, or can transfer the single substrate W to the substrate holding unit. The decompression mechanism sucks the gas in the chamber to reduce the pressure in the chamber. Specifically, for example, the pressure in the chamber is reduced to the vapor pressure of the solvent of the coating liquid. Thereby, the solvent of the coating film on the substrate W is evaporated, and the coating film on the substrate W can be appropriately dried. That is, the reduced pressure drying process is performed.

<1-4. Delivery unit>
The delivery unit 5 is a unit that relays delivery of the substrate W between the reduced pressure drying apparatus 3 and the heat treatment apparatus 7. For example, the delivery unit 5 is located between the transfer robot 4 and the heat treatment device 7. As a more specific example, the delivery unit 5 may be provided on the +Z side of the drying unit 31c. That is, the delivery unit 5 may be laminated on the +Z side of the drying unit 31c.

The delivery unit 5 has a substrate holding portion that holds two substrates W in a horizontally arranged state. The transfer robot 4 can collectively transfer the two substrates W to the substrate holding unit, and also transfers the substrates W one by one to the substrate holding unit to hold the two substrates W in the substrate holding unit. You can also For example, the transfer robot 4 transfers the first substrate W1 to a portion on the back side of the substrate holding unit when viewed from the transfer robot 4, and transfers the second substrate W2 to a portion on the front side of the substrate holding unit. As a result, the first substrate W1 and the second substrate W2 are placed on the substrate holder.

<2. Heat treatment equipment>
In the example of FIG. 1, the heat treatment apparatus 7 is also shown. The heat treatment device 7 includes a heating unit 71 and a transfer robot 72. The transfer robot 72 has the same configuration as the transfer robot 4, and takes out both the first substrate W1 and the second substrate W2 from the transfer unit 5 at once. The transfer robot 72 collectively transfers the first substrate W1 and the second substrate W2 to the heating unit 71.

Each of the heating units 71 includes a substrate holder and a heater (not shown). The substrate holding unit can hold both the first substrate W1 and the second substrate W2 in a state where they are horizontally arranged. The heater gives heat to the first substrate W1 and the second substrate W2. As a result, the coating films on the first substrate W1 and the second substrate W2 are almost completely dried.

When a photoresist coating solution is used as the coating solution applied in the processing apparatus main body 22, the heating by the heating unit 71 enables the so-called pre-baking process before the exposure process.

<3. Transfer robot operation>
As described above, the processing apparatus main body 22 (upstream processing unit) transports the substrates W and sequentially performs coating processing on the substrates W one by one. That is, after the coating process on the first substrate W1 is completed, the coating process is performed on the next second substrate W2. Since the substrate W after the coating process is naturally dried over time, the dry state of the first substrate W1 to which the coating process is first completed may be different from the dry state of the second substrate W2 to be subsequently processed by the coating process. .. The degree of the difference in the dry state depends on, for example, the thickness (film thickness) of the coating film formed on the substrate.

For example, when a photoresist liquid that is to be an etching resistant film is applied as a coating liquid (hereinafter referred to as a first coating liquid), the film thickness of the coating film is made relatively thin. When the film thickness is thin, the amount of solvent contained in the coating film is small. As a result, the required drying time required for drying is relatively short. That is, the drying speed of the first coating liquid is relatively high. In this case, the difference in the dry state of both substrates W due to the difference in the natural drying time becomes relatively large. Therefore, it is desirable to perform the reduced pressure drying process on the first substrate W1 and the second substrate W2 for individual drying times.

On the other hand, for example, when a polyimide-based or acrylic-based coating liquid (hereinafter referred to as a second coating liquid) to be an insulating film is applied, the film thickness of the coating film is relatively large (for example, a photoresist liquid The film thickness is about twice the film thickness). When the film thickness is large, the amount of solvent contained in the coating film increases. As a result, the speed at which the second coating liquid dries becomes relatively slow. In this case, the difference in the dry state of both substrates W due to the difference in the natural drying time is relatively small.

Therefore, the transfer robot 4 switches the transfer method according to the required drying time required for drying the substrate W. Specifically, when the required drying time required to dry the substrate W is the first time, the transfer robot 4 transfers the first substrate W1 to one of the plurality of drying units 31, and the second substrate W2 to the plurality of drying units 31. It is transported to another one of the drying units 31. Accordingly, the reduced pressure drying process can be performed on the first substrate W1 and the second substrate W2 in a drying time suitable for each.

On the other hand, when the required drying time is the second time, which is longer than the first time, the transfer robot 4 receives both the first substrate W1 and the second substrate W2 and collectively selects one of the plurality of drying units 31. Transport to. Thereby, the throughput can be improved.

Since the required drying time depends, for example, on the film thickness of the coating film, it can be said that the transfer robot 4 switches the transfer method according to the film thickness of the coating film. That is, when the nozzle 224 of the processing apparatus main body 22 discharges the first coating liquid onto the substrate W to form a relatively thin coating film, the transfer robot 4 individually transfers the first substrate W1 and the second substrate W2 to the substrate standby unit. Take out from 23. More specifically, the transfer robot 4 takes out only the first substrate W1 from the substrate standby unit 23 without waiting for the transfer of the second substrate W2 to the substrate standby unit 23, and extracts the first substrate W1 from the drying unit, for example. It is transported to 31a. The drying unit 31a performs a reduced pressure drying process on the first substrate W1 for a predetermined first drying time. When the second substrate W2 is transported to the substrate standby unit 23, the transport robot 4 takes out only the second substrate W2 from the substrate standby unit 23, and removes the second substrate W2 from the drying unit 31b different from the first substrate W1. Transport to. The drying unit 31b performs a reduced pressure drying process on the second substrate W2 for a predetermined second drying time.

The transport robot 4 takes out the first substrate W1 from the drying unit 31a and transports it to the delivery unit 5 when the reduced pressure drying process by the drying unit 31a is completed, and when the reduced pressure drying process by the drying unit 31b is completed, 2 The substrate W2 is taken out of the drying section 31b and conveyed to the delivery unit 5.

As described above, for the first substrate W1 and the second substrate W2 that are likely to have a large difference in dry state due to natural drying, individual transport is performed instead of simultaneous transport. In this individual transfer, since the first substrate W1 is taken out without waiting for the next second substrate W2, the difference in the dry state between the first substrate W1 and the second substrate W2 at each taking-out point is small. Then, the drying units 31a and 31b perform the reduced-pressure drying process on the first substrate W1 and the second substrate W2, respectively, for a first drying time and a second drying time that are substantially equal to each other. The first drying time and the second drying time are preset, for example, and are 40 seconds, for example. Since the difference between the dried state of the first substrate W1 immediately before being transported to the drying unit 31a and the dried state of the second substrate W2 immediately before being transported to the drying unit 31b is small, the first substrate W1 after the reduced pressure drying process is performed. Also, the difference in the dry state of the second substrate W2 is small.

On the other hand, when the nozzle 224 of the processing apparatus main body 22 discharges the second coating liquid to form a relatively thick coating film, the transfer robot 4 collectively takes out both the first substrate W1 and the second substrate W2. The transport robot 4 collectively transports both the first substrate W1 and the second substrate W2 to the drying unit 31 (for example, the drying unit 31a). The drying unit 31a collectively performs the reduced-pressure drying process on both the first substrate W1 and the second substrate W2 for a predetermined drying time (for example, 80 seconds). This drying time is also set in advance, for example. As described above, when there is no need to worry that the difference in the dry state due to the natural drying becomes large, the transfer robot 4 collectively transfers both the first substrate W1 and the second substrate W2 to the drying unit 31. You may convey.

More specifically, it is assumed that the difference between the standby times of the first substrate W1 and the second substrate W2, that is, the difference between the naturally dried states is 5 seconds. When the first coating liquid is discharged onto the substrate W to form a relatively thin coating film, the first substrate W1 and the second substrate W2 are each subjected to reduced pressure drying treatment for 40 seconds as described above. At this time, when the first substrate W1 and the second substrate W2 are simultaneously dried under reduced pressure, two substrates having a difference in natural drying state of 5 seconds are simultaneously dried under reduced pressure. Since the time difference of natural drying (5 seconds) with respect to the reduced pressure drying time (40 seconds) is relatively large, the coating state on the first substrate W1 and the coating state on the second substrate W2 after the reduced pressure drying process are different. Is afraid. Therefore, as described above, the first substrate W1 and the second substrate W2 are dried one by one so that the difference in the waiting time between the first substrate W1 and the second substrate W2 (the time difference in the natural drying state) does not occur. , 31b to carry out the reduced pressure drying process.

When the first coating liquid is discharged onto the substrate W to form a relatively thick coating film, the first substrate W1 and the second substrate W2 are simultaneously subjected to reduced pressure drying treatment for 80 seconds respectively as described above. .. As described above, even if the first substrate W1 and the second substrate W2 are collectively dried under reduced pressure, the time difference (5 seconds) between the natural drying and the reduced pressure drying time (80 seconds) is relatively small. The subsequent state of the coating film on the first substrate W1 and the state of the coating film on the second substrate W2 will not be so different as to cause a problem in the process.

When the reduced-pressure drying process by the drying unit 31a is completed, the transport robot 4 collectively takes out both the first substrate W1 and the second substrate W2 from the drying unit 31a and transports them to the delivery unit 5.

According to this, it is possible to collectively perform the drying process on the first substrate W1 and the second substrate W2. According to this, the throughput can be improved.

When the coating device 2 (processing device main body 22) coats one type of coating liquid, the transport robot 4 employs one type of transport method according to the type (film thickness) of the coating liquid. According to the substrate processing apparatus 1 of the present embodiment, the transfer robot 4 can switch the transfer method. Therefore, as the coating apparatus 2, a coating apparatus that coats the first coating liquid may be adopted. You may employ|adopt the coating device which applies a coating liquid. In other words, the substrate processing apparatus 1 can be applied to a system that requires the coating device 2 that applies the first coating liquid and a system that requires the coating device 2 that applies the second coating liquid. That is, the substrate processing apparatus 1 is suitable for both simultaneous processing of a plurality of substrates W and individual processing of a plurality of substrates W.

On the other hand, the coating device 2 may selectively coat the first coating liquid and the second coating liquid according to the substrate W. In this case, the information (film thickness information) on the type of coating liquid applied in the coating device 2 may be notified to the control unit 6 from a device on the upstream side of the substrate processing apparatus 1, or by an operator. It may be entered. The control unit 6 switches the transfer method by the transfer robot 4 as described above according to the type of the coating liquid.

FIG. 4 is a flowchart showing an example of an operation of determining a carrying method when the carrying method of the control unit 6 is switched. The flowchart of FIG. 4 may be executed, for example, each time the substrate W is loaded into the substrate processing apparatus 1. First, in step S1, the control unit 6 determines whether the required drying time T1 required for drying the substrate W is equal to or less than the reference time Tref. Information indicating the required drying time T1 is input to the control unit 6 by an apparatus or an operator on the upstream side of the substrate processing apparatus 1. The reference time Tref is preset, for example, and is stored in, for example, the storage device 64 or the like.

When it is determined that the required drying time T1 is equal to or shorter than the reference time Tref, the control unit 6 individually takes out the first substrate W1 and the second substrate W2 from the substrate standby unit 23 in step S2, and then the first substrate W1. Further, a transfer method (individual transfer) of transferring the second substrates W2 to the different drying units 31 one by one is adopted.

On the other hand, when it is determined that the required reference time T1 is longer than the reference time Tref, the control unit 6 collectively removes the first substrate W1 and the second substrate W2 from the substrate standby unit 23 in step S3, A transfer method (simultaneous transfer) in which the first substrate W1 and the second substrate W2 are collectively transferred to one drying unit 31 is adopted.

<4. Wait>
In the above-mentioned example, when the first substrate W1 is transported to the first standby unit 231, the first raising mechanism 234 raises the first substrate W1. Therefore, in the simultaneous transport, the second substrate W2 is transported from the substrate transport unit 223 to the second standby unit 232 in a state where the first lifting mechanism 234 lifts the first substrate W1. In other words, the first substrate W1 is waiting for the second substrate W2 or the transfer robot 4 while being supported by the lift pins 2341.

For comparison, consider the case where the first substrate W1 stands by on the exit floating stage 233. For example, the first substrate W1 may be made to stand by on the exit levitation stage 233 in a state where the ejection of gas in the downstream portion of the exit levitation stage 233 is stopped. In this case, the lower surface of the first substrate W1 has a large contact area with the upper surface of the exit levitation stage 233. Therefore, the amount of heat transferred between the first substrate W1 and its support (exit floating stage 233) is relatively large.

Alternatively, the first substrate W1 may be held by a predetermined chuck mechanism and stand by while the gas is ejected from the exit levitation stage 233. In this case, since the airflow is generated on the lower surface of the first substrate W1, the amount of heat transferred between the first substrate W1 and the airflow is relatively large.

On the other hand, when the first substrate W1 is supported by the lift pins 2341, the contact area between the first substrate W1 and the lift pins 2341 is small. According to this, the amount of heat transferred between the first substrate W1 and the support (lift pin 2341) is relatively small. Further, the first substrate W1 can stand by at a position where the gas does not reach the lower surface of the first substrate W1. Therefore, the amount of heat transferred between the first substrate W1 and the gas is also small. Therefore, the influence of the support and the gas on the temperature state (that is, the dry state) of the first substrate W1 can be reduced. In other words, it is possible to reduce the difference in the dry state between the first substrate W1 and the second substrate W2 during simultaneous conveyance.

Second embodiment.
An example of the configuration of the substrate processing apparatus 1 according to the second embodiment is similar to that of the first embodiment. However, the substrate processing apparatus 1 according to the second embodiment includes a coating apparatus 2A instead of the coating apparatus 2.

FIG. 5 is a side view showing an example of the configurations of the coating device 2A and the transfer robot 4. The coating apparatus 2A has the same configuration as the coating apparatus 2 except for the configuration of the processing apparatus main body 22 and the configuration of the substrate standby unit 23. The processing apparatus main body 22 of the coating apparatus 2A further includes an outlet levitation stage 225 as compared with the processing apparatus main body 22 of FIG. The exit levitation stage 225 has the same structure as the exit levitation stage 233.

The substrate standby unit 23 is, for example, a roller conveyor, and has a plurality of rotating shafts 236A, a plurality of rotating shafts 236B, a plurality of rollers 237A, and a plurality of rollers 237B. The structure of the substrate standby unit 23 is the same as that of the substrate introduction unit 21. However, since the substrate W is taken out by the transfer robot 4, the substrate standby unit 23 is configured so as not to interfere with the hand 41 of the transfer robot 4. In the substrate standby unit 23, the rotation shaft 236B and the roller 237B configure a first standby unit 231, and the rotation shaft 236A and the roller 237A configure a second standby unit 232.

The first substrate processed by the processing apparatus main body 22 is transferred from the exit floating stage 225 to the first standby unit 231 via the second standby unit 232. The first substrate W1 stands by on the roller 237B. The second substrate W2 processed by the processing apparatus main body 22 is transported from the exit floating stage 225 to the second standby unit 232. The second substrate W2 stands by on the roller 237A.

Similar to the first embodiment, the transfer robot 4 can collectively take out both the first substrate W1 and the second substrate W2 from the substrate standby unit 23, and the first substrate W1 and the second substrate W2. Can be taken out individually.

In addition, also in the second embodiment, the first raising mechanism 234 and the second raising mechanism 235 may be provided as in the first embodiment.

Although the embodiments of the substrate transfer apparatus and the substrate transfer method have been described above, various modifications other than those described above can be made without departing from the spirit of the present embodiment. The various embodiments and modified examples described above can be implemented in an appropriate combination.

For example, instead of changing the transfer method depending on the difference in film thickness, the transfer method may be changed according to the type of the coating liquid. For example, in the case of a coating liquid containing a highly volatile solvent, the reduced pressure drying time becomes relatively short. In this case, the influence of the time difference in the naturally dried state on the reduced pressure drying becomes large. Therefore, it is preferable to transport the substrates one by one to the reduced pressure drying device. On the contrary, in the case of a coating liquid containing a solvent having low volatility, the drying time under reduced pressure becomes relatively long. In this case, the influence of the time difference in the naturally dried state on the reduced pressure drying is small. Therefore, it is preferable to improve the throughput by adopting a method in which a plurality of substrates are collectively transported to a reduced pressure drying apparatus.

Instead of providing a plurality of drying units for drying under reduced pressure, one drying unit may be used. When the time intervals of the plurality of substrates carried out from the coating apparatus are long, even if only one drying unit is used, the vacuum drying process for the preceding substrates is completed and is empty, so the substrates should be carried in one by one. You can

For example, the substrate processing apparatus 1 may be provided with an alignment mechanism for adjusting the positions and orientations of the first substrate W1 and the second substrate W2. This alignment mechanism can be provided, for example, in at least one of the substrate standby unit 23, the reduced-pressure drying device 3, and the delivery unit 5. As the alignment mechanism, for example, a gap adjusting unit and an aligning unit disclosed in JP-A-2018-160586 can be adopted.

1 Substrate processing device 3 Downstream processing unit (vacuum drying device)
4 Transport robot 22 Upstream processing unit (processing device main body)
31, 31a to 31c Drying unit 223 Transport unit (substrate transport unit)
231 1st standby part 232 2nd standby part 234 1st raising mechanism 235 2nd raising mechanism

Claims (5)

An upstream processing unit that sequentially processes a plurality of substrates one by one;
A downstream processing unit capable of simultaneously processing two substrates processed by the upstream processing unit;
A first standby unit for waiting a first substrate, which is a substrate processed by the upstream processing unit,
A second standby unit that waits for a second substrate that is a substrate processed by the upstream processing unit and that is a substrate next to the first substrate;
Both the first substrate waiting in the first waiting unit and the second substrate waiting in the second waiting unit, only the first substrate waiting in the first waiting unit, and the second waiting unit A substrate processing apparatus comprising: a transfer robot that can take out only the second substrate that is on standby at the transfer target and that can transfer the transfer target to the downstream processing unit. The substrate processing apparatus according to claim 1, wherein
The first standby unit has a first raising mechanism that raises the first substrate,
The second standby unit has a second raising mechanism that raises the second substrate,
The substrate processing apparatus, wherein the first raising mechanism and the second raising mechanism are driven independently of each other. The substrate processing apparatus according to claim 2, wherein
The upstream processing unit has a transfer unit that sequentially transfers the plurality of substrates one by one along a transfer direction,
The first standby unit is located on the downstream side of the transport unit in the transport direction,
The second standby unit is located between the transport unit and the first standby unit in the transport direction, and also has a function of transporting the first substrate from the transport unit to the first standby unit. Have,
When the first substrate is transported from the second standby unit to the first standby unit, the first raising mechanism raises the first substrate,
The substrate processing apparatus, wherein the second substrate is transported from the transport unit to the second standby unit in a state where the first lifting mechanism lifts the first substrate. The substrate processing apparatus according to any one of claims 1 to 3, wherein
The downstream processing unit has a plurality of drying units for performing a drying process,
The transfer robot is
When the required drying time required for drying each of the first substrate and the second substrate is the first time, the first substrate is transported to one of the plurality of drying units, and the second substrate is transported to the plurality of drying units. Transport to another one of the drying section of
When the required drying time is a second time that is longer than the first time, both the first substrate and the second substrate are received and collectively transported to one of the plurality of drying units. Processing equipment. A first step of sequentially processing a plurality of substrates one by one,
A second step of waiting the first substrate, which is the substrate processed in the first step,
A third step of waiting a second substrate, which is the substrate processed in the first step and is the next substrate of the first substrate,
A fourth step of taking out the transfer target by a transfer robot capable of taking out both of the first substrate and the second substrate, only the first substrate, and only the second substrate,
A substrate processing method, comprising: a downstream processing unit capable of simultaneously processing two substrates; and a fifth step of transporting the transport target by the transport robot.

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