JPH11106042A - Substrate processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify the constitution, to make the processor inexpensive and to remarkably suppress damage such as a crack of a substrate and sticking of particles to the substrate surface. SOLUTION: A substrate carrier device 3 is designed not to carry a substrate 2 in the direction perpendicular to a surface to be processed of the substrate 2 but to carry the substrate 2 in the direction along the surface to be processed of the substrate 2. Within a clean room, a down flow F is positively utilized to prevent suspending of particles. The carrying of the substrate 2 between each process by the substrate carrier device 3 and various kinds of processings by each process are performed, holding the substrate 2 at a vertical or inclined attitude at an adsorption stage 43 in each process. Further, a plurality of processing parts performing the same processing are provided in heat processing parts 6 to 8, 10, 11. The substrate 2 can be pooled within a processing process for a long processing time and carrier time can be controlled by a shorter processing tact.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in a manufacturing process of a liquid crystal display device (LCD), a plasma display device (PDP), a semiconductor device and various electronic parts, and is used for a glass substrate for an LCD or PDP, a semiconductor substrate, and a print. The present invention relates to a substrate processing apparatus for performing a predetermined process such as a coating process of a thin film such as a photoresist film or a drying process on a surface of a substrate such as a substrate.

[0002]

2. Description of the Related Art Conventionally, this type of substrate processing apparatus is installed in a clean room, for example, in a manufacturing process of a liquid crystal display panel or a semiconductor device, and cleans a substrate surface such as a glass square substrate for a liquid crystal. Further, for example, a substrate surface treatment unit such as a resist coating unit for applying a photoresist film or the like, and a bake unit (hot plate, cool plate, or the like) as a next process of the surface treatment are used. Each of these processing units is arranged in consideration of the basic processing steps.
A substrate transfer robot having a book hand moves while holding the substrate horizontally, and randomly accesses and sequentially transfers the substrates one by one to perform required processing. .

In the above-described substrate processing apparatus, it is assumed that the substrate processing apparatus operates in a clean room with few particles as an environment for processing the substrate. In general, a clean room requires a high level of cleanliness, and in order to prevent the floating of particles, a down flow, which is a clean air flow, is supplied from above the building into the clean room. The downflow is also actively used in the substrate processing apparatus so that the components do not easily adhere to the substrate to be processed.

[0004]

However, in the above-mentioned conventional configuration, the substrate transport robot travels while holding the substrate horizontally, accesses each processing unit, transfers the substrate, and further transfers the substrate in each processing unit. Since various processes are performed while the substrate is held horizontally, as the size of the substrate increases, the deflection of the substrate increases, making it difficult to transport the substrate. However, there is a problem that there is a risk of causing damage. This damage such as cracking of the substrate is particularly remarkable when the substrate is transported at high speed in a direction perpendicular to the substrate surface.

Further, the supply and discharge of substrates to and from each processing unit is a random access method using a substrate transfer robot, and the structure and control thereof become complicated and expensive in order to satisfy the degree of freedom as a transfer device. Had the problem that

Further, in the clean room where the substrate processing apparatus is installed, the down flow is positively used, and the substrate is held and transported in the horizontal direction, and various processes are performed while the substrate is held in the horizontal direction. As a result, the downflow is sprayed on the entire surface of the substrate, so that there is a problem that the adhesion rate of particles to the substrate surface is high.

The present invention solves the above-mentioned conventional problems, and has a simple and inexpensive substrate processing apparatus capable of greatly suppressing damage such as cracking of a substrate and adhesion of particles to a substrate surface. The purpose is to provide.

[0008]

According to the present invention, there is provided a substrate processing apparatus for carrying out predetermined processing on a substrate by transporting the substrate while holding the substrate in a vertical or inclined posture. A processing unit having a plurality of processing units that perform at least the same processing, and a transfer unit that holds the substrate in a vertical or inclined posture and transfers the substrate in a direction along the substrate surface, in order to transfer the substrate to the processing unit, Moving means for moving the plurality of processing units in a direction intersecting the transport direction of the transport means.

According to this structure, the transfer means does not transfer in a direction perpendicular to the substrate surface but in a direction along the substrate surface. Therefore, no acceleration is applied in the direction in which the substrate is bent, and the substrate is broken. Damage is prevented. In the clean room, the down flow is actively used to prevent the floating of particles.However, while holding the substrate in a vertical or inclined posture, the substrate is transported by the transport unit and various processes are performed by the processing unit. Therefore, the down flow is sprayed only on the very narrow plate surface of the substrate, so that the floating particles do not easily adhere to the surface of the substrate to be processed. Furthermore, since the processing means has a plurality of processing units for performing at least the same processing, the substrate can be pooled for a long processing time in one processing step, and the transport time can be controlled with a shorter processing tact. In addition, the throughput is improved, and the configuration and control thereof are simpler and cheaper than those of a conventional random access method using a substrate transfer robot that supplies and discharges substrates to and from each processing unit.

Preferably, the transport means in the substrate processing apparatus of the present invention transports the substrate in a first horizontal direction, and the moving means includes a second transport means which is perpendicular to the first horizontal direction.
Are configured to move a plurality of processing units in the horizontal direction.

According to this configuration, the moving means moves the plurality of processing units in a direction orthogonal to the direction of the transport between the processes. Therefore, when a plurality of processing units are provided in one process, the apparatus is more compact. And can be easily configured.

Still preferably, in a substrate processing apparatus according to the present invention, the plurality of processing units are heat treatment units that perform a heating process or a cooling process on the substrate.

The heat treatment section has a relatively long processing tact. With this configuration, if a plurality of processing sections are provided in the heat treatment section and the substrates are pooled for a long processing time in one processing step. In addition, the transfer can be controlled based on shorter processing tacts other than the heat treatment section, and the effect of improving the throughput is favorably performed.

Still preferably, in a substrate processing apparatus according to the present invention, the plurality of processing units are configured by combining a plurality of processing units such that substrates being processed by the plurality of processing units are parallel to each other.

According to this configuration, if a plurality of processing units are connected to each other so that the substrates are disposed in parallel with each other, the configuration is simplified and positioning can be easily performed such as transfer of the conveyance. .

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the substrate processing apparatus according to the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments described below.

FIG. 1 is a perspective view showing a schematic configuration of a substrate processing apparatus according to one embodiment of the present invention.

In FIG. 1, a substrate processing apparatus 1 includes a substrate 2
Transport device 3 for transporting the substrate between processing steps, a cassette section 21 for accommodating a plurality of substrates 2, and an ultraviolet (UV) exposure processing section 4 for decomposing and removing organic substances attached to the surface of the substrate 2.
A cleaning processing unit 5 for cleaning the substrate 2 exposed by the ultraviolet exposure processing unit 4, a heat treatment unit 6 including a plurality of hot plates for heating and drying the substrate 2 cleaned by the cleaning processing unit 5, A heat treatment section 7 composed of a plurality of hot plates for heating the dried substrate 2 in the vapor atmosphere of the adhesion enhancer, a heat treatment section 8 composed of a plurality of cool plates for cooling the warmed substrate 2, and after cooling A vertical coating processing unit 9 for applying a coating liquid such as a photoresist on the surface of the substrate 2, and a plurality of hot plates for heating the coated substrate 2 to remove the solvent from the coating liquid surface and to dry. And a heat treatment unit 1 comprising a cool plate for cooling the substrate 2 which has been heated and dried.
1 is provided. These cool plates are for cooling so that the heat of the substrate 2 baked by the hot plate does not affect the next step.

The processing means including the ultraviolet exposure processing unit 4, the cleaning processing unit 5, the heat treatment unit 6, the heat treatment unit 7, the heat treatment unit 8, the coating treatment unit 9, the heat treatment unit 10 and the heat treatment unit 11, The transported substrate 2 is held in a vertical posture, and a series of various processes are performed. In particular, each of the heat treatment units 6 to 8 and 10 has a plurality of treatment units that perform the same heat treatment or cooling treatment while holding the substrate in a vertical or inclined posture. in this way,
By providing a plurality of identical processing units in one processing step,
The substrate 2 can be held for a long processing time in one processing step, so that the processing cycle of the heat treatment section requiring a relatively long processing time and the processing time of another processing step are matched.

Further, such a substrate processing apparatus 1 of the present invention
Is installed in a clean room, the down flow F is positively used in the clean room to prevent the floating of particles, and the substrate 2 is held in a vertical or inclined posture during transport and various processes. Therefore, the down flow is sprayed only on the thick surface of the substrate, and the area thereof is extremely small, so that the floating particles are hardly reattached to the surface of the substrate to be processed.

Next, each component of the substrate processing apparatus 1 will be described in detail with reference to FIG.

The substrate transporting device 3 comprises an inverted L-shaped component member 33 in which a horizontal member 31 positioned horizontally and a vertical member 32 connected to the horizontal member 31 and positioned vertically are substantially inverted L-shaped. A plurality of suction holding means 34 are respectively arranged along the leading end of the horizontal member 31 in the width direction of the substrate 2, and the plurality of suction holding means 34 arranged in a line are arranged at the upper edge of the substrate 2. In this configuration, the portion is sucked and the substrate 2 is held in a hanging state. Further, in the substrate transporting device 3, the vertical member 35 positioned vertically and the horizontal member 36 connected to the vertical member 35 and positioned horizontally form an L-shaped component member 37 having a substantially L shape. , It is configured to be slidable in the transport direction (Y direction) between the respective steps. In addition, the inverted L-shaped component member 33 for holding the substrate is configured to be vertically movable with respect to the L-shaped component member 37 for transporting between processes.
The substrate 2 is configured so as to be freely transferred from each process via the suction holding means 34. As described above, the L-shaped component member 37 for transporting between processes is disposed below the horizontal member 36 in a state where the inverted L-shaped component member 33 is placed on the L-shaped component member 37 so as to be vertically movable. Guided by a certain guide member 38, the horizontal drive mechanism 39 is configured to be able to move tact between two adjacent steps, and the suction and holding means 34 can hold the substrate 2 and move to the next step. It has become.

The vertical drive of the inverted L-shaped member 33 with respect to the L-shaped member 37 and the horizontal drive mechanism 39 may be constituted by a motor such as a stepping motor or a servomotor and a ball screw. In addition, a cylinder configuration or a rack and pinion configuration may be used, and further, a configuration using a motor and a belt or a wire may be used, and various driving mechanisms are conceivable.

As described above, the substrate transfer device 3 transfers the substrate 2 in two directions (inter-process direction A in the Y-axis direction and vertical direction B in the Z-axis direction) while holding the substrate 2 in the vertical position. And
In each processing unit, a predetermined process is performed while delivering the substrate 2 and holding the substrate 2 in a vertical posture.
In the present embodiment, for simplicity of description, the processing units of eight processes simultaneously drive the four substrate transporting devices 3 to sequentially feed the substrates 2 in a tact manner. In order to improve the performance, eight substrate transfer devices 3 are simultaneously driven in all the processing units of the eight processes, and the substrate 2 is tact-feeded.

Further, the above-mentioned ultraviolet exposure processing section 4, cleaning processing section 5, heat treatment sections 6 to 8, coating processing section 9, heat treatment section 10,
11 correspond to each of the heat treatment sections HP1 to HP in FIG.
Like the substrate holding mechanism shown in FIG.
A suction stage 43 for holding the substrate 2,
The suction stage 43 sucks and holds the substrate 2 with the surface to be processed of the substrate 2 facing outward.
The suction stage 43 is provided with a plurality of elongated recesses in which suction cups (not shown) as suction members capable of being sucked and retracted are provided at appropriate positions corresponding to the outer peripheral portion of each substrate 2 of a size to be used. The suction cup is drawn into a predetermined position in the recess after being sucked by the suction cup to the substrate 2 and is stored to hold the substrate 2. The holding state of the substrate by the suction stage 43 may be in a vertical (vertical) direction, or may be in an inclined posture. For example, the holding state may be slightly adjusted so that the substrate 2 is positioned above the suction stage 43. It may be inclined. Furthermore, the reason why the suction cup (not shown) as the suction member does not hold the central portion of the substrate 2 is that the central portion of the substrate 2 is a portion where important circuits and the like are arranged.
This is to prevent processing irregularities such as coating irregularities due to a temperature drop or rise due to vacuum suction and release by a suction cup (not shown). Therefore, the suction cup (not shown) also has an elongated suction cup shape similar to that of the elongated recess in order to suck the outer peripheral portion of the substrate 2. In addition,
Here, the case where the suction stage 43 holds the substrate 2 by suction using a suction cup (not shown) has been described, but a configuration in which the upper, lower, left, and right sides of the substrate 2 are hooked and held by claw-shaped members may be used. The good thing is needless to say.

Further, in each of the cassette section 21, the ultraviolet exposure processing section 4, the cleaning processing section 5, the heat treatment sections 6 to 8, the coating processing section 9, and the heat treatment sections 10 and 11,
Between the delivery position of the substrate 2 by the suction holding means 34 and the substrate holding position (two-dot chain line) of the suction stage 43 or the like in each processing unit while holding the substrate in a vertical posture or an inclined posture. A vertical moving means (not shown) for vertically moving is provided, and the substrate 2 received from the suction holding means 34 by the vertical moving means (not shown).
Is lowered to the substrate holding position, the substrate 2 is sucked by the suction stage 43, and various processes are performed in a state where the substrate 2 is held in the vertical posture or the inclined posture.

The control means 41 connected to the moving drive means and the transport drive means receives a supply of DC power from the power supply means 42, and controls a drive mechanism and a transport drive mechanism of each processing unit. A microcomputer comprising an arithmetic processing unit (CPU) and its peripheral circuits (not shown)
And a storage unit (not shown) for storing a control program and its control data, etc., and are adapted to perform tact feeding in synchronization with each other. Instead of these, the moving drive means and the transport drive means are sequentially turned on / off.
It may be a sequencer (not shown) that controls off.
In this case, the structure is further simplified and the cost is reduced.

FIG. 2 is a perspective view showing a schematic configuration of the moving mechanism and the driving means in the heat treatment section 10 of FIG.

In FIG. 2, a moving mechanism and a driving means in the heat treatment section 10 are supported by a motor 51 as a driving means such as a stepping motor or a servomotor, and a front and rear bearing (not shown). A ball screw 52 connected to a rotating shaft (not shown) of the same via a connecting portion (not shown), a moving member 53 screwed to the ball screw 52, and an upper surface of the moving member 53 is fixed at a lower surface. The driving side base member 54 on which each of the heat processing units HP1 to HP3, which are three hot plates, is mounted, and the ball screw 52 and the moving member 53 are disposed on the fixed side base member 55 in parallel on both sides. Pair of rail members 56
And a guide member 57 which is fitted to each of these rail members 56 from above and slidably guided, and the upper surface of which is fixed to the lower surface of the drive-side base member 54. Ball screw 5 by driving 51
2 rotates and is guided by the rail member 56 by the rotation,
Along with the moving member 53, a drive-side base member 54 on which the heat processing units HP1 to HP3 are mounted is configured to be slidable in the X direction. In this case, the motor 51 is mounted on a motor mounting member 58 erected on the fixed-side base member 55, and one of the bearings and the connecting portion (not shown) is built in the fixed-side base member 55. .

The surface of each of the heat treatment sections HP1 to HP3, which are three hot plates, is constituted by a suction stage 43, and a suction member capable of suction is provided at an appropriate position corresponding to an outer peripheral portion of each substrate 2 of a size to be used. A plurality of elongated concave portions 46 are provided in which lift pins 45 with suction cups (suction pads) are provided so as to be able to freely move out and forth. By doing so, the substrate 2 is held at various positions.

A moving means is constituted by the motor 51, the ball screw 52, the moving member 53 and the control means 41, and each of the heating processing sections HP1 to HP1 as a plurality of processing sections.
The configuration is such that P3 is moved in a direction orthogonal to the transfer direction between the respective steps by the substrate transfer device 3.

With the above configuration, first, one of the plurality of substrates 2 vertically placed in the cassette unit 21 corresponding to the loader is moved by the vertical moving means (not shown) to the transfer position of the suction holding means 34. The substrate 2 is pushed up, and the substrate 2 is sucked and held by the suction holding means 34 of the substrate transfer device 3 and received.
Is lifted up to a predetermined position in a state where is suspended. further,
The substrate transfer device 3 performs tact feeding to a position immediately above the processing unit in the next process, and then lowers the device to the delivery position of the suction holding unit 34 and transfers it to the vertical moving unit in each processing process. The vertical moving means lowers the substrate 2 to a predetermined position, sucks and holds the substrate 2 on the suction stage 43 of each vertical processing unit, and performs various processes for each processing step.

Next, the suction holding of the substrate 2 by the suction stage is released, and the substrate 2 processed in this step is pushed up to the transfer position of the suction holding means 34 by the vertical moving means, and the suction of the substrate transfer device 3 is performed. The substrate 2 is sucked and held by the holding means 34 and received, and is pulled up to a predetermined position while the substrate 2 is suspended. Further, the substrate transport device 3 transports the wafer to a position immediately above the processing unit in the next step, and then lowers the wafer to the delivery position of the suction holding unit 34 and delivers it to the vertical moving unit. The vertical moving means lowers the substrate 2 to a predetermined processing position, sucks and holds the substrate 2 on the suction stage 43 of each vertical processing unit, and performs various processes.

In this manner, the substrates 2 which have been processed in each of the vertical processing units in each of the above-described series of processes are sequentially tact-fed to finish various processes in each process by the substrate processing apparatus 1. Thereafter, the substrate 2 is sent to, for example, an exposure processing apparatus 44 arranged in the processing direction of the substrate processing apparatus 1, and the photoresist applied to the substrate 2 is subjected to exposure processing.

At this time, for example, heat treatment using a hot plate or the like takes a long time. Therefore, by arranging a plurality of vertical processing units such as a plurality of hot plates in parallel, a processing tact can be obtained. And productivity can be improved.
In this case, by disposing a moving mechanism and a driving means for moving a plurality of vertical processing units provided in parallel in synchronism with the tact feeding, the processing tact in each step becomes substantially the same, and the time wasted. , And efficient tact feeding can be achieved.

As described above, when a plurality of vertical processing units such as a hot plate are arranged in parallel, the transfer position of the substrate 2 to and from the substrate transfer device 3 changes, although the processing tact is reduced. Alternatively, it is necessary to move any one of the plurality of vertical processing units to the transfer position to keep the transfer position constant. However, when the substrate transfer device 3 is moved in the X direction while the substrate 2 is suspended, The substrate 2 moves in a direction perpendicular to the surface against the resistance of air, and the substrate 2 bends and causes damage, or the substrate 2 cuts off the wind and forms a vortex on the substrate surface to dry. There is a possibility that unevenness or the like may be created. For this reason, in this embodiment, the delivery position is kept constant by moving the plurality of vertical processing units to the delivery position.

As described above, according to the present embodiment, the substrate transport device 3 transports the substrate 2 not in the direction perpendicular to the processing surface but in the direction along the processing surface of the substrate 2. In addition, no acceleration is applied in the direction in which the substrate 2 bends, and damage such as cracking of the substrate 2 can be prevented. That is, by carrying the substrate 2 in a vertical or inclined posture and carrying it along the surface, the amount of bending of the substrate 2 can be almost ignored, and damage to the substrate 2 due to high-speed carrying can be greatly suppressed. Further, since the transport direction of the substrate 2 is not in the thickness direction of the substrate 2 but in the direction along the substrate surface in both the Y-axis and the Z-axis, there is little wind-off phenomenon, and there is no eddy current caused by this wind-off phenomenon. Drying unevenness of the coating film can be suppressed.

In the clean room, the downflow F is actively used to prevent the floating of particles.
Since the substrate 2 is transported between each process by the substrate transport device 3 and various processes are performed while holding the substrate in a vertical or inclined posture, the downflow is sprayed only on the very narrow plate surface of the substrate 2. Therefore, the floating particles are unlikely to re-attach to the surface of the substrate 2 to be processed.

Further, the thermal processing units 6 to 8, 10, and 11 have a plurality of processing units for performing the same processing, and the substrate 2 can be pooled for a long processing time in one processing step, thereby shortening the processing time. Since the transfer time can be controlled by the tact, the throughput can be further improved, and the control configuration is simpler than the conventional random access method by the conventional substrate transfer robot that supplies and discharges the substrate 2 to each processing unit. And it becomes cheaper.

Further, since the moving means moves the plurality of processing units in a direction orthogonal to the direction of conveyance between the processes, the apparatus can be made more compact when a plurality of processing units are provided in one process. And a simple configuration. Further, by arranging a plurality of stages of bake plates in a direction (X direction) orthogonal to the line length of the apparatus and by allowing them to slide, the line length of the apparatus can be shortened.

Furthermore, the heat treatment sections 6 to 8, 10, and 11 have a relatively long processing tact, and
If a plurality of identical processing units are provided in 0 and 11, the substrate 2 can be pooled for a long processing time in one processing step, so that transport control can be performed based on a shorter processing tact other than the heat treatment unit. As a result, the effect of improving the throughput can be improved.

Further, since a plurality of identical processing units are combined so that the substrates 2 are arranged in parallel with each other,
The configuration can be simplified, and positioning can be easily performed, such as delivery of the conveyance.

In this embodiment, as the processing means having a plurality of processing units for holding the substrate 2 in a vertical or inclined posture and performing at least the same processing, the ultraviolet exposure processing unit 4
Cleaning processing unit 5, heat treatment unit 6, heat treatment unit 7, heat treatment unit 8,
It has the respective processing steps of a coating processing section 9, a heat treatment section 10 and a heat treatment section 11, and among the processing means composed of these processing steps, the heat treatment sections 6 to 8 and 10 respectively have the substrate 2 vertically or It has a plurality of processing units for performing the same heat treatment or cooling process while holding it in an inclined posture, and the other ultraviolet exposure processing unit 4, cleaning processing unit 5, and coating processing unit 9 have the plurality of processing units, respectively. However, the processing unit has only one processing unit, but the processing unit has one or more processing units having only a plurality of processing units that perform the same heating process or cooling process while holding the substrate 2 in a vertical or inclined posture. It may be composed of a processing unit (a plurality of steps).

[0044]

As described above, according to the first aspect of the present invention, the transporting means transports not in the direction perpendicular to the substrate surface but in the direction along the substrate surface. And damage such as cracking of the substrate can be prevented. In the clean room, the down flow is actively used to prevent the floating of particles.However, while holding the substrate in a vertical or inclined posture, the substrate is transported by the transport unit and various processes are performed by the processing unit. Therefore, the down flow is sprayed only on the very narrow plate thickness surface of the substrate, so that it is possible to adopt a configuration in which floating particles do not easily adhere to the surface of the substrate to be processed. Further, since the processing means has at least a plurality of processing units for performing the same processing, the substrate can be pooled for a long processing time in one processing step, and the transport time can be controlled with a shorter processing tact. The throughput and the throughput can be further improved, and the configuration and control thereof can be simplified and the cost can be reduced as compared with a conventional random access method using a substrate transfer robot that supplies and discharges a substrate to and from each processing unit. .

According to the second aspect, the moving means moves the plurality of processing units in a direction orthogonal to the direction of the inter-process transfer, so that a plurality of processing units are provided in one process. The apparatus can be made more compact and can have a simple configuration.

Further, according to the third aspect, the heat treatment section has a relatively long processing tact, and a plurality of processing sections are provided in the heat treatment section to pool the substrates in one processing step for a long processing time. Therefore, the transfer can be controlled based on a shorter processing tact other than the heat treatment unit, and the effect of improving the throughput can be improved.

Further, according to the fourth aspect, since a plurality of processing units are combined and configured so that the substrates are arranged in parallel with each other, the configuration can be simplified and the transfer of the conveyance can be achieved. For example, positioning can be easily performed.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a schematic configuration of a moving mechanism and a driving unit in the heat treatment unit 10 of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Substrate 3 Substrate transfer apparatus 6-8, 10, 11 Heat treatment part 34 Suction holding means 39 Horizontal drive mechanism part 41 Control means 43 Suction stage 51 Motor 52 Ball screw 53 Moving member HP1-HP3 Heat processing part (hot plate)

Claims (4)

[Claims] 1. A substrate processing apparatus for performing a predetermined process on a substrate by transporting the substrate while holding the substrate in a vertical or inclined position, comprising a plurality of processing units for holding at least the same process while holding the substrate in a vertical or inclined position. Processing means having; a transfer means for holding a substrate in a vertical or inclined posture and transferring the plurality of processing units in a direction along the substrate surface in order to transfer the substrate to the processing means; and a transfer direction of the plurality of processing units by the transfer means. And a moving means for moving in a direction intersecting with the substrate processing apparatus. 2. The transporting means transports a substrate in a first horizontal direction, and the moving means moves the plurality of processing units in a second horizontal direction orthogonal to the first horizontal direction. 2. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is configured as described above. 3. The substrate processing apparatus according to claim 1, wherein the plurality of processing units are heat treatment units that perform a heating process or a cooling process on the substrate. 4. The processing unit according to claim 1, wherein the plurality of processing units are configured by combining the plurality of processing units such that substrates being processed by the plurality of processing units are parallel to each other. 4. The substrate processing apparatus according to any one of claims 1 to 3.