TW202208161A - 高分子膜與銅箔的接合方法、高分子膜層疊體以及具備高分子膜層疊體的裝置 - Google Patents
高分子膜與銅箔的接合方法、高分子膜層疊體以及具備高分子膜層疊體的裝置 Download PDFInfo
- Publication number
- TW202208161A TW202208161A TW110130289A TW110130289A TW202208161A TW 202208161 A TW202208161 A TW 202208161A TW 110130289 A TW110130289 A TW 110130289A TW 110130289 A TW110130289 A TW 110130289A TW 202208161 A TW202208161 A TW 202208161A
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- Prior art keywords
- polymer film
- copper foil
- inorganic material
- bonding
- material layer
- Prior art date
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- 229920006254 polymer film Polymers 0.000 title claims abstract description 172
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 111
- 239000011889 copper foil Substances 0.000 title claims abstract description 105
- 238000000034 method Methods 0.000 title claims abstract description 77
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 118
- 239000011147 inorganic material Substances 0.000 claims abstract description 118
- -1 polyethylene naphthalate Polymers 0.000 claims description 36
- 239000002245 particle Substances 0.000 claims description 30
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- 238000001659 ion-beam spectroscopy Methods 0.000 claims description 14
- 229920002223 polystyrene Polymers 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 11
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 11
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 11
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 11
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 229920006026 co-polymeric resin Polymers 0.000 claims description 10
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 9
- 239000004952 Polyamide Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 229920002647 polyamide Polymers 0.000 claims description 9
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 8
- 239000005977 Ethylene Substances 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 8
- 239000004760 aramid Substances 0.000 claims description 8
- 229920003235 aromatic polyamide Polymers 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 8
- 238000005304 joining Methods 0.000 claims description 7
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 6
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- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229920010524 Syndiotactic polystyrene Polymers 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
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- 229920000570 polyether Polymers 0.000 claims description 6
- 229920002530 polyetherether ketone Polymers 0.000 claims description 6
- 229920001601 polyetherimide Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 239000004800 polyvinyl chloride Substances 0.000 claims description 6
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 6
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 6
- 239000004962 Polyamide-imide Substances 0.000 claims description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229920002312 polyamide-imide Polymers 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 4
- 230000035699 permeability Effects 0.000 claims description 3
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- 239000010410 layer Substances 0.000 description 121
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- 229920001955 polyphenylene ether Polymers 0.000 description 16
- 239000010408 film Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 238000005477 sputtering target Methods 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 10
- 239000010936 titanium Substances 0.000 description 9
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- 239000012790 adhesive layer Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
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- 239000000758 substrate Substances 0.000 description 5
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000010931 gold Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
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- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920005597 polymer membrane Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
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- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
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- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020139040 | 2020-08-20 | ||
| JPJP2020-139040 | 2020-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202208161A true TW202208161A (zh) | 2022-03-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110130289A TW202208161A (zh) | 2020-08-20 | 2021-08-17 | 高分子膜與銅箔的接合方法、高分子膜層疊體以及具備高分子膜層疊體的裝置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022038876A1 (https=) |
| TW (1) | TW202208161A (https=) |
| WO (1) | WO2022038876A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117328062A (zh) * | 2023-08-18 | 2024-01-02 | 基迈克材料科技（苏州）有限公司 | 一种增强锂电池复合集流体膜基结合力的方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245303A (ja) * | 2005-03-03 | 2006-09-14 | Nikko Kinzoku Kk | 銅箔の表面処理方法 |
| JP2006310357A (ja) * | 2005-04-26 | 2006-11-09 | Teijin Ltd | フレキシブルプリント回路用基板 |
| JP2009073943A (ja) * | 2007-09-20 | 2009-04-09 | Seiko Epson Corp | 接合方法および接合体 |
| JP2011009453A (ja) * | 2009-06-25 | 2011-01-13 | Jx Nippon Mining & Metals Corp | プリント配線板用銅箔 |
| US9962908B2 (en) * | 2012-04-10 | 2018-05-08 | Lan Technical Service Co., Ltd. | Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate |
-
2021
- 2021-06-14 WO PCT/JP2021/022432 patent/WO2022038876A1/ja not_active Ceased
- 2021-06-14 JP JP2022543295A patent/JPWO2022038876A1/ja active Pending
- 2021-08-17 TW TW110130289A patent/TW202208161A/zh unknown
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| Publication number | Publication date |
|---|---|
| WO2022038876A1 (ja) | 2022-02-24 |
| JPWO2022038876A1 (https=) | 2022-02-24 |
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