JPWO2022038876A1 - - Google Patents
Info
- Publication number
- JPWO2022038876A1 JPWO2022038876A1 JP2022543295A JP2022543295A JPWO2022038876A1 JP WO2022038876 A1 JPWO2022038876 A1 JP WO2022038876A1 JP 2022543295 A JP2022543295 A JP 2022543295A JP 2022543295 A JP2022543295 A JP 2022543295A JP WO2022038876 A1 JPWO2022038876 A1 JP WO2022038876A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020139040 | 2020-08-20 | ||
| PCT/JP2021/022432 WO2022038876A1 (ja) | 2020-08-20 | 2021-06-14 | 高分子フィルムと銅箔の接合方法、高分子フィルム積層体および高分子フィルム積層体を備えるデバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022038876A1 true JPWO2022038876A1 (https=) | 2022-02-24 |
Family
ID=80323587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022543295A Pending JPWO2022038876A1 (https=) | 2020-08-20 | 2021-06-14 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022038876A1 (https=) |
| TW (1) | TW202208161A (https=) |
| WO (1) | WO2022038876A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117328062A (zh) * | 2023-08-18 | 2024-01-02 | 基迈克材料科技（苏州）有限公司 | 一种增强锂电池复合集流体膜基结合力的方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245303A (ja) * | 2005-03-03 | 2006-09-14 | Nikko Kinzoku Kk | 銅箔の表面処理方法 |
| JP2006310357A (ja) * | 2005-04-26 | 2006-11-09 | Teijin Ltd | フレキシブルプリント回路用基板 |
| JP2009073943A (ja) * | 2007-09-20 | 2009-04-09 | Seiko Epson Corp | 接合方法および接合体 |
| JP2011009453A (ja) * | 2009-06-25 | 2011-01-13 | Jx Nippon Mining & Metals Corp | プリント配線板用銅箔 |
| WO2013154107A1 (ja) * | 2012-04-10 | 2013-10-17 | ランテクニカルサービス株式会社 | 高分子フィルムと高分子フィルムとを接合する方法、高分子フィルムと無機材料基板とを接合する方法、高分子フィルム積層体及び高分子フィルムと無機材料基板との積層体 |
-
2021
- 2021-06-14 WO PCT/JP2021/022432 patent/WO2022038876A1/ja not_active Ceased
- 2021-06-14 JP JP2022543295A patent/JPWO2022038876A1/ja active Pending
- 2021-08-17 TW TW110130289A patent/TW202208161A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245303A (ja) * | 2005-03-03 | 2006-09-14 | Nikko Kinzoku Kk | 銅箔の表面処理方法 |
| JP2006310357A (ja) * | 2005-04-26 | 2006-11-09 | Teijin Ltd | フレキシブルプリント回路用基板 |
| JP2009073943A (ja) * | 2007-09-20 | 2009-04-09 | Seiko Epson Corp | 接合方法および接合体 |
| JP2011009453A (ja) * | 2009-06-25 | 2011-01-13 | Jx Nippon Mining & Metals Corp | プリント配線板用銅箔 |
| WO2013154107A1 (ja) * | 2012-04-10 | 2013-10-17 | ランテクニカルサービス株式会社 | 高分子フィルムと高分子フィルムとを接合する方法、高分子フィルムと無機材料基板とを接合する方法、高分子フィルム積層体及び高分子フィルムと無機材料基板との積層体 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202208161A (zh) | 2022-03-01 |
| WO2022038876A1 (ja) | 2022-02-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220907 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230912 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20240305 |