TW202201623A - Substrate processing device comprising a holding surface, a plurality of lifting pins, a frame member, and a lifting pin driving part - Google Patents

Substrate processing device comprising a holding surface, a plurality of lifting pins, a frame member, and a lifting pin driving part Download PDF

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TW202201623A
TW202201623A TW110118902A TW110118902A TW202201623A TW 202201623 A TW202201623 A TW 202201623A TW 110118902 A TW110118902 A TW 110118902A TW 110118902 A TW110118902 A TW 110118902A TW 202201623 A TW202201623 A TW 202201623A
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Taiwan
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frame member
holding surface
substrate
lift
substrate processing
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TW110118902A
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Chinese (zh)
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中根慎悟
池田文彦
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日商斯庫林集團股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)

Abstract

The subject of the present invention is to facilitate the maintenance of a substrate processing device. The substrate processing device comprises a holding surface for holding the substrate, a plurality of lifting pins protruding from the holding surface, a frame member supporting the lifting pins from below and configured to overlap the holding surface when viewed from above, and a lifting pin driving part configured at the peripheral portion of the frame member when viewed from above to move the lifting pins up and down by raising and lowering the frame member. The lifting pin driving part includes a driving source, a driving force transmission mechanism configured to extend along the circumferential direction of the frame member, and a plurality of lifting mechanisms connected to the driving force transmission mechanism and the outer peripheral portion of the frame member to move the frame member up and down.

Description

基板處理裝置Substrate processing equipment

本申請說明書中所公開的技術涉及一種基板處理裝置。作為處理對象的基板中例如包含半導體晶圓、液晶顯示裝置用玻璃基板、有機電致發光（electroluminescence，EL）顯示裝置等平板顯示器（flat panel display，FPD）用基板、光盤用基板、磁碟用基板、光磁碟用基板、光罩幕用玻璃基板、陶瓷基板、場發射顯示器（field emission display，即，FED）用基板、或太陽能電池用基板等。The technology disclosed in the specification of the present application relates to a substrate processing apparatus. Examples of substrates to be processed include semiconductor wafers, glass substrates for liquid crystal display devices, substrates for flat panel displays (FPD) such as organic electroluminescence (EL) display devices, substrates for optical disks, and substrates for magnetic disks. Substrates, substrates for optical magnetic disks, glass substrates for photomasks, ceramic substrates, substrates for field emission displays (FED), or substrates for solar cells, etc.

在基板處理裝置中，設置有用於在基板的搬入時或搬出時等使基板升降的多個升降銷。The substrate processing apparatus is provided with a plurality of lift pins for raising and lowering the substrate at the time of carrying in or carrying out the substrate, or the like.

多個升降銷通過從設置於基板的保持面的多個貫通孔向上方突出並支撐基板，而使基板上升，另外，通過收容於所述貫通孔而使基板下降並配置於保持面（例如，參照專利文獻1）。 [現有技術文獻] [專利文獻]The plurality of lift pins protrude upward from a plurality of through holes provided in the holding surface of the substrate to support the substrate, thereby raising the substrate, and by being accommodated in the through holes, the substrate is lowered and disposed on the holding surface (for example, Refer to Patent Document 1). [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2010-114175號公報[Patent Document 1] Japanese Patent Laid-Open No. 2010-114175

[發明所要解決的問題] 在專利文獻1所示的技術中，用於使升降銷升降的驅動機構配置於框構件的正下方。因此，例如在進行所述驅動機構的維護的情況下，需要作業者潛入框構件的下方來進行作業，從而存在作業空間狹小而難以作業的問題。[Problems to be Solved by Invention] In the technique disclosed in Patent Document 1, a drive mechanism for raising and lowering the lift pins is arranged just below the frame member. Therefore, for example, when the maintenance of the drive mechanism is performed, the operator needs to sneak under the frame member to perform the work, and there is a problem that the work space is narrow and the work is difficult.

本申請說明書中所公開的技術是鑒於如以上所記載那樣的問題而成，且是用於使基板處理裝置的維護作業變得容易的技術。 [解決問題的技術手段]The technique disclosed in the present specification is a technique for facilitating maintenance work of a substrate processing apparatus in view of the above-described problems. [Technical means to solve the problem]

本申請說明書中所公開的技術的第一形態涉及一種基板處理裝置，其包括：保持面，用於在上表面保持基板；多個升降銷，經由形成於所述保持面的多個貫通孔分別向所述保持面的所述上表面突出；框構件，從下方支撐所述多個升降銷，且在俯視時與所述保持面重疊地配置；以及升降銷驅動部，在俯視時配置於所述框構件的外周部，且用於通過使所述框構件升降來使所述多個升降銷升降，且所述升降銷驅動部包括：驅動源；驅動力傳遞機構，沿所述框構件的周向延伸地配置，且用於傳遞所述驅動源的驅動力；以及多個升降機構，連結於所述驅動力傳遞機構與所述框構件的外周部，且用於使所述框構件升降。A first aspect of the technology disclosed in the specification of the present application relates to a substrate processing apparatus including: a holding surface for holding a substrate on an upper surface; a frame member that protrudes toward the upper surface of the holding surface; a frame member that supports the plurality of lift pins from below, and is arranged so as to overlap the holding surface in plan view; The outer peripheral portion of the frame member is used for raising and lowering the plurality of lift pins by raising and lowering the frame member, and the lift pin driving portion includes: a driving source; extended in the circumferential direction and used for transmitting the driving force of the driving source; and a plurality of elevating mechanisms connected to the outer peripheral portion of the driving force transmission mechanism and the frame member and used for raising and lowering the frame member .

本申請說明書中所公開的技術的第二形態涉及第一形態，其中所述升降銷驅動部在俯視時不與所述框構件重疊。The second aspect of the technology disclosed in the specification of the present application relates to the first aspect in which the lift pin driving portion does not overlap the frame member in a plan view.

本申請說明書中所公開的技術的第三形態涉及第一形態或第二形態，其中所述升降銷驅動部在俯視時不與所述保持面重疊。The third aspect of the technology disclosed in the specification of the present application relates to the first aspect or the second aspect in which the lift pin driving portion does not overlap the holding surface in a plan view.

本申請說明書中所公開的技術的第四形態涉及第一形態至第三形態中的任一形態，其中所述驅動力傳遞機構沿所述框構件的不同的兩個周向延伸地配置。 [發明的效果]A fourth aspect of the technology disclosed in the specification of the present application relates to any one of the first aspect to the third aspect, in which the driving force transmission mechanism is arranged to extend in two different circumferential directions of the frame member. [Effect of invention]

根據本申請說明書中所公開的技術的至少第一形態，由於可將升降銷驅動部配置於在俯視時充分遠離基板的中心的位置，因此在進行基板處理裝置的維護作業時作業變得容易。According to at least the first aspect of the technology disclosed in the present specification, since the lift pin driving unit can be arranged at a position sufficiently distant from the center of the substrate in plan view, the maintenance work of the substrate processing apparatus is facilitated.

另外，通過以下所示的詳細說明與隨附圖式，與本申請說明書中所公開的技術相關聯的目的、特徵、方面與優點變得更清楚。In addition, the objects, features, aspects, and advantages related to the technology disclosed in the specification of the present application will become clearer from the detailed description shown below and the accompanying drawings.

以下，參照隨附的圖式對實施方式進行說明。在以下的實施方式中，為了說明技術還示出了詳細的特徵等，但這些是例示，且這些並非均是為了使實施方式能夠實施所必需的特徵。Hereinafter, the embodiment will be described with reference to the accompanying drawings. In the following embodiments, detailed features and the like are also shown in order to explain the technology, but these are only examples, and these are not all features necessary to enable the embodiments to be implemented.

再者，圖式是概要性地示出，且為了便於說明，適宜在圖式中進行結構的省略、或結構的簡化。另外，不同的圖式中分別示出的結構等的大小及位置的相互關係未必準確地記載，可適宜變更。另外，在並非剖面圖的平面圖等圖式中，為了容易理解實施方式的內容，有時也標注陰影線。It should be noted that the drawings are schematically shown, and for convenience of description, the omission of the structure or the simplification of the structure is suitably performed in the drawings. In addition, the mutual relationship of the magnitude|size and position of the structure etc. each shown in a different drawing is not necessarily described exactly, and it can change suitably. In addition, in some drawings, such as a plan view which is not a cross-sectional view, hatching may be attached in order to make it easy to understand the content of embodiment.

另外，在以下所示的說明中，對同樣的構成元件標注相同的符號來圖示，對於它們的名稱與功能也同樣。因此，為了避免重複，有時省略關於它們的詳細說明。In addition, in the description shown below, the same code|symbol is attached|subjected to the same structural element, and it is shown in figure, and the name and function are also the same. Therefore, in order to avoid repetition, detailed descriptions about them are sometimes omitted.

另外，在以下所記載的說明中，在記載為“包括”、“包含”或“具有”某一構成元件等的情況下，只要無特別說明，則並非排除其他構成元件的存在的排他性的表達。In addition, in the description described below, when it is described as "comprising", "including" or "having" a certain constituent element, unless otherwise specified, it is not an exclusive expression excluding the existence of other constituent elements .

另外，在以下所記載的說明中，即便在使用意指“上”、“下”、“左”、“右”、“側”、“底”、“表”或“背”等特定的位置或方向的用語的情況下，這些用語也是為了便於容易理解實施方式的內容而使用，且與實際所實施時的位置或方向無關。In addition, in the description described below, even if the use means a specific position such as "upper", "lower", "left", "right", "side", "bottom", "front" or "back" In the case of terms of directions or directions, these terms are also used in order to facilitate understanding of the content of the embodiment, and are not related to the position or direction at the time of actual implementation.

＜實施方式＞ 以下，對與本實施方式相關的基板處理裝置進行說明。<Embodiment> Hereinafter, the substrate processing apparatus according to this embodiment will be described.

＜關於基板處理裝置的結構＞ 圖1是示意性地表示與本實施方式相關的基板處理裝置1的立體圖。<About the structure of the substrate processing apparatus> FIG. 1 is a perspective view schematically showing a substrate processing apparatus 1 according to the present embodiment.

基板處理裝置1為使用狹縫噴嘴2向基板3的上表面31塗佈塗佈液的狹縫塗佈機。基板處理裝置1中，作為其塗佈液，能夠使用作為耐蝕刻被膜的光致抗蝕劑液、彩色濾光片用的光致抗蝕劑液、聚醯亞胺前驅物（聚醯胺酸）、包含矽、奈米金屬油墨或導電性材料的漿料（糊料）等各種塗佈液。再者，所謂“基板3的上表面31”，是指基板3的兩主面中用來塗佈塗佈液一側的主表面。The substrate processing apparatus 1 is a slit coater that applies a coating liquid to the upper surface 31 of the substrate 3 using the slit nozzle 2 . In the substrate processing apparatus 1, as the coating liquid, a photoresist liquid for an etching-resistant film, a photoresist liquid for a color filter, a polyimide precursor (polyimide acid) can be used. ), various coating liquids such as pastes (pastes) containing silicon, nano-metal inks or conductive materials. In addition, "the upper surface 31 of the board|substrate 3" means the main surface on the side which applies the coating liquid among the two main surfaces of the board|substrate 3.

基板處理裝置1包括：平台4，能夠以水平姿勢吸附保持基板3；塗佈處理部5，使用狹縫噴嘴2對保持於平台4的基板3實施塗佈處理；以及控制部70，對基板處理裝置1的各個結構的動作進行控制。The substrate processing apparatus 1 includes: a stage 4 capable of sucking and holding the substrate 3 in a horizontal posture; a coating processing unit 5 for applying a coating process to the substrate 3 held on the stage 4 using the slit nozzle 2; and a control section 70 for processing the substrate The operation of each configuration of the device 1 is controlled.

控制部70通過執行內部或外部的記憶介質（硬盤驅動器（Hard Disk Drive，HDD）、隨機存取記憶體（Random Access Memory，RAM）、只讀記憶體（Read Only Memory，ROM）或閃速記憶體等易失性或非易失性的記憶體等）中所記憶的程式來對控制對象進行控制，且例如包括中央處理器（central processing unit，即CPU）、微處理器或微電腦等。The control unit 70 executes an internal or external storage medium (Hard Disk Drive (HDD), Random Access Memory (RAM), Read Only Memory (ROM) or flash memory A program stored in a volatile or non-volatile memory such as a computer is used to control the control object, and includes, for example, a central processing unit (CPU), a microprocessor, or a microcomputer.

圖1中例示的平台4由具有大致長方體的形狀的花崗岩等石材構成。平台4在其上表面（+Z側的面）中的-Y側的區域內包括被加工成大致水平的平坦面並對基板3進行保持的保持面41。保持面41只要為在俯視時與基板3重疊的區域、或在俯視時比與基板3重疊的區域稍寬的區域即可。在保持面41分散形成有未圖示的許多真空吸附口。通過利用這些真空吸附口來吸附基板3，在塗佈處理時基板3以大致水平狀態保持於預先確定的位置處。再者，基板3的保持形態並不限定於此，例如也能夠以機械地保持基板3的方式構成有平台4。The platform 4 illustrated in FIG. 1 is composed of a stone material such as granite having a substantially rectangular parallelepiped shape. The stage 4 includes a holding surface 41 that is processed to be a substantially horizontal flat surface and that holds the substrate 3 in a region on the −Y side of the upper surface (the surface on the +Z side). The holding surface 41 may be a region overlapping with the substrate 3 in plan view, or a region slightly wider than the region overlapping with the substrate 3 in plan view. A large number of vacuum suction ports (not shown) are formed dispersedly on the holding surface 41 . By sucking the substrate 3 using these vacuum suction ports, the substrate 3 is held at a predetermined position in a substantially horizontal state during the coating process. In addition, the holding form of the board|substrate 3 is not limited to this, For example, the stage 4 may be comprised so that the board|substrate 3 may be hold|maintained mechanically.

另外，平台4在比保持面41所佔有的區域更靠+Y側的區域中包括噴嘴調整區域100。在噴嘴調整區域100中，配置有在塗佈處理之前對狹縫噴嘴2實施清潔處理的噴嘴清掃裝置（未圖示）。In addition, the stage 4 includes the nozzle adjustment region 100 in the region on the +Y side rather than the region occupied by the holding surface 41 . In the nozzle adjustment area 100, a nozzle cleaning device (not shown) that performs a cleaning process on the slit nozzle 2 before the coating process is arranged.

在基板處理裝置1中，使狹縫噴嘴2沿Y軸方向移動的後述的移動機構設置於塗佈處理部5，利用所述移動機構，可使狹縫噴嘴2在保持面41的上方與噴嘴調整區域100的上方之間往返移動。In the substrate processing apparatus 1 , a moving mechanism to move the slit nozzle 2 in the Y-axis direction is provided in the coating processing section 5 , and the slit nozzle 2 can be positioned above the holding surface 41 and the nozzle can be moved by the moving mechanism. Move back and forth between the top of the adjustment area 100 .

而且，在狹縫噴嘴2向噴嘴調整區域100的上方移動的期間，即，在平台4中的保持面41所佔有的區域的上方無狹縫噴嘴2的期間，在平台4上進行先進行了塗佈處理的基板3的搬出、與接下來進行塗佈處理的基板3的搬入。另一方面，在狹縫噴嘴2在保持面41的上方移動的期間，從狹縫噴嘴2向保持面41上的基板3的上表面31塗佈塗佈液。Then, while the slit nozzle 2 is moving above the nozzle adjustment area 100 , that is, while there is no slit nozzle 2 above the area occupied by the holding surface 41 in the table 4 , the first step is performed on the table 4 . The carrying out of the substrate 3 subjected to the coating process and the carrying in of the substrate 3 to be subjected to the coating process next. On the other hand, while the slit nozzle 2 is moving above the holding surface 41 , the coating liquid is applied from the slit nozzle 2 to the upper surface 31 of the substrate 3 on the holding surface 41 .

塗佈處理部5的移動機構主要包括：橋接結構的噴嘴支撐體51，沿X軸方向橫穿平台4的上方並支撐狹縫噴嘴2；以及狹縫噴嘴移動部53，沿著沿Y軸方向延伸的一對導軌52使噴嘴支撐體51及由所述噴嘴支撐體51支撐的狹縫噴嘴2水平移動。The moving mechanism of the coating treatment part 5 mainly includes: a nozzle support body 51 of a bridge structure, which traverses the upper part of the platform 4 in the X-axis direction and supports the slit nozzle 2; and a slit nozzle moving part 53, which is along the Y-axis direction. The extended pair of guide rails 52 horizontally move the nozzle support body 51 and the slit nozzle 2 supported by the nozzle support body 51 .

如圖1中例示那樣，噴嘴支撐體51為將平台4的左右兩端部沿著X軸方向架設並跨越保持面41的架橋結構。狹縫噴嘴移動部53使作為架橋結構的噴嘴支撐體51與由噴嘴支撐體51保持的狹縫噴嘴2相對於保持於平台4的基板3沿著Y軸方向相對移動。As illustrated in FIG. 1 , the nozzle support body 51 is a bridge structure in which the left and right end portions of the platform 4 are spanned along the X-axis direction and spanned over the holding surface 41 . The slit nozzle moving unit 53 relatively moves the nozzle support 51 as a bridge structure and the slit nozzle 2 held by the nozzle support 51 in the Y-axis direction with respect to the substrate 3 held by the stage 4 .

具體而言，狹縫噴嘴移動部53包括：在±X側分別沿Y軸方向引導狹縫噴嘴2的移動的導軌52、作為驅動源的線性馬達54、以及用於檢測狹縫噴嘴2的吐出口的位置的線性編碼器55。Specifically, the slit nozzle moving unit 53 includes a guide rail 52 for guiding the movement of the slit nozzle 2 in the Y-axis direction on the ±X side, respectively, a linear motor 54 as a drive source, and a discharge for detecting the discharge of the slit nozzle 2 Linear encoder 55 for the position of the outlet.

如圖1中例示那樣，兩個導軌52在平台4的X軸方向的兩端部沿著Y軸方向延伸。As illustrated in FIG. 1 , the two guide rails 52 extend in the Y-axis direction at both end portions of the stage 4 in the X-axis direction.

此處，在保持面41設置有多個升降銷（此處未圖示），所述多個升降銷用於在搬入基板3並配置於保持面41時、及將保持於保持面41的基板3搬出時，支撐基板3。各個升降銷從形成於保持面41的貫通孔（此處未圖示）向保持面41的上表面突出，並從下方支撐基板3。Here, the holding surface 41 is provided with a plurality of lift pins (not shown here) for the substrates to be held on the holding surface 41 when the substrate 3 is carried in and arranged on the holding surface 41 . 3 When carrying out, the substrate 3 is supported. Each lift pin protrudes toward the upper surface of the holding surface 41 from through holes (not shown here) formed in the holding surface 41 , and supports the substrate 3 from below.

在如以上那樣的結構中，狹縫噴嘴2能夠在用來保持基板3的保持面41的上部空間中，相對於保持面41向Y軸方向大致水平地移動。然後，基板處理裝置1通過從狹縫噴嘴2的吐出口21吐出塗佈液同時使狹縫噴嘴2如上所述那樣相對移動，可在由保持面41保持的基板3的上表面31形成塗佈層。In the above configuration, the slit nozzle 2 can move substantially horizontally in the Y-axis direction with respect to the holding surface 41 in the upper space of the holding surface 41 for holding the substrate 3 . Then, the substrate processing apparatus 1 can form coating on the upper surface 31 of the substrate 3 held by the holding surface 41 by discharging the coating liquid from the discharge port 21 of the slit nozzle 2 while relatively moving the slit nozzle 2 as described above. Floor.

再者，從基板3的各個邊的端部起規定寬度的區域（框緣狀的區域）成為不作為塗佈液的塗佈對象的非塗佈區域。In addition, the area|region (frame-shaped area|region) of predetermined width|variety from the edge part of each side of the board|substrate 3 becomes a non-coating area|region which is not a coating object of a coating liquid.

另外，在基板處理裝置1與外部搬送機構之間的基板3的交接期間（即，基板3的搬入搬出期間）等在平台4上不進行塗佈處理的期間，狹縫噴嘴2退避至作為從基板3的保持面41向+Y側偏離的區域的噴嘴調整區域100（相當於圖1中例示的狀態），狹縫噴嘴2通過噴嘴清掃裝置接受清潔處理。In addition, during a period in which the coating process is not performed on the stage 4, such as a period in which the substrate 3 is delivered between the substrate processing apparatus 1 and the external transport mechanism (ie, a period in which the substrate 3 is loaded and unloaded), the slit nozzle 2 is withdrawn as a In the nozzle adjustment region 100 (corresponding to the state illustrated in FIG. 1 ) in the region where the holding surface 41 of the substrate 3 is deviated to the +Y side, the slit nozzle 2 is cleaned by the nozzle cleaning device.

再者，作為基板處理裝置1進行的基板處理，除了上文所述的塗佈處理以外，還可假定例如高溫處理等。在此情況下，用於支撐基板3的升降銷從形成於熱板的上表面的貫通孔突出。另外，即便在堆積包括多個此種熱板的情況下，在各個熱板也會包括升降銷。In addition, as the substrate processing performed by the substrate processing apparatus 1, in addition to the coating processing described above, for example, high temperature processing can be assumed. In this case, lift pins for supporting the substrate 3 protrude from through holes formed on the upper surface of the hot plate. In addition, even when a stack includes a plurality of such hot plates, lift pins are included in each of the hot plates.

圖2是用於對圖1中例示的設置於基板處理裝置1的保持面41的下方的升降銷6、框構件7及升降銷驅動部8進行說明的圖。FIG. 2 is a diagram for explaining the lift pins 6 , the frame member 7 , and the lift pin drive unit 8 provided below the holding surface 41 of the substrate processing apparatus 1 illustrated in FIG. 1 .

如圖2中例示那樣，在平台4的保持面41的下方，形成有貫通設置於保持面41的多個貫通孔（此處未圖示）的多個升降銷6以及各個升降銷6。As illustrated in FIG. 2 , below the holding surface 41 of the platform 4 are formed a plurality of lift pins 6 and each lift pin 6 penetrating through a plurality of through holes (not shown) provided in the holding surface 41 .

多個升降銷6由共用的框構件7支撐，並與框構件7一起升降。圖2中的框構件7配置於在俯視時配置有保持面41的區域內，但框構件7也可從配置有保持面41的區域伸出地配置。The plurality of lift pins 6 are supported by a common frame member 7 and ascend and descend together with the frame member 7 . The frame member 7 in FIG. 2 is arranged in the region where the holding surface 41 is arranged in plan view, but the frame member 7 may be arranged so as to protrude from the region where the holding surface 41 is arranged.

框構件7在其外周中的至少一部分（外周部）連結於升降銷驅動部8。升降銷驅動部8與平台4直接或間接地連結。The frame member 7 is connected to the lift pin driving portion 8 at least in a part (outer peripheral portion) of the outer periphery thereof. The lift pin driving part 8 is directly or indirectly connected to the platform 4 .

升降銷驅動部8包括：驅動源8A，作為旋轉驅動馬達等；驅動力傳遞機構8B，連接於驅動源8A，且向框構件7的周向傳遞來自驅動源8A的驅動力；以及多個升降機構8C，根據由驅動力傳遞機構8B傳遞的驅動力升降。升降銷驅動部8通過驅動力傳遞機構8B傳遞由驅動源8A引起的旋轉驅動或水平驅動，進而轉換為升降驅動。再者，驅動源8A也可包括多個。The lift pin drive unit 8 includes a drive source 8A as a rotary drive motor or the like; a drive force transmission mechanism 8B connected to the drive source 8A and transmitting the drive force from the drive source 8A to the circumferential direction of the frame member 7; and a plurality of lifters The mechanism 8C moves up and down according to the driving force transmitted by the driving force transmission mechanism 8B. The lift pin drive unit 8 transmits the rotational drive or the horizontal drive by the drive source 8A through the drive force transmission mechanism 8B, and is converted into the lift drive. Furthermore, the driving source 8A may include a plurality of them.

如圖2所示，升降銷驅動部8以在俯視時包圍框構件7的方式，沿著框構件7的外周的至少一部分（外周部）配置。As shown in FIG. 2 , the lift pin driving portion 8 is arranged along at least a part (outer peripheral portion) of the outer periphery of the frame member 7 so as to surround the frame member 7 in plan view.

再者，在圖2中，升降銷驅動部8配置於在俯視時不與框構件7重疊的位置，但升降銷驅動部8也可在至少一部分上與框構件7的外周部重疊。另外，在圖2中，升降銷驅動部8的至少一部分（驅動力傳遞機構8B及升降機構8C）配置於在俯視時與保持面41重疊的位置，但也可升降銷驅動部8全部配置於在俯視時與保持面41不重疊的位置。In addition, in FIG. 2, although the lift pin drive part 8 is arrange|positioned in the position which does not overlap with the frame member 7 in plan view, the lift pin drive part 8 may overlap the outer peripheral part of the frame member 7 in at least a part. In addition, in FIG. 2 , at least a part of the lift pin drive unit 8 (the driving force transmission mechanism 8B and the lift mechanism 8C) is arranged at a position overlapping the holding surface 41 in plan view, but all the lift pin drive units 8 may be arranged on the A position that does not overlap with the holding surface 41 in a plan view.

圖3是詳細地表示圖2中例示的升降銷6、框構件7及升降銷驅動部8的結構的立體圖。FIG. 3 is a perspective view showing in detail the configurations of the lift pins 6 , the frame member 7 , and the lift pin drive unit 8 illustrated in FIG. 2 .

如圖3中例示那樣，多個升降銷6鉛垂向上地支撐於呈格子狀形成的框構件7的各個邊。各個升降銷6被支撐的位置與形成於保持面41的貫通孔的位置對應，升降銷6與框構件7的升降驅動聯動地插入至貫通孔，進而各個升降銷6從保持面41的上表面突出。再者，各個升降銷6的高度方向（Z軸方向）的位置能夠調整。As illustrated in FIG. 3 , the plurality of lift pins 6 are vertically supported on each side of the frame member 7 formed in a lattice shape. The position where each lift pin 6 is supported corresponds to the position of the through hole formed in the holding surface 41 , the lift pin 6 is inserted into the through hole in conjunction with the lifting and lowering drive of the frame member 7 , and each lift pin 6 extends from the upper surface of the holding surface 41 . protrude. In addition, the position of each lift pin 6 in the height direction (Z-axis direction) can be adjusted.

驅動力傳遞機構8B包括：與驅動源8A的驅動聯動地旋轉的多個軸82；以及在框構件7的角部使軸82彼此聯動的聯動部84。此處，也可不包括聯動部84。即便在無聯動部84的情況下，只要與驅動源8A連結的軸82沿框構件7的周向延伸，且可沿著所述周向傳遞其驅動力即可。The driving force transmission mechanism 8B includes: a plurality of shafts 82 that rotate in conjunction with the driving of the drive source 8A; Here, the interlocking portion 84 may not be included. Even in the absence of the interlocking portion 84 , the shaft 82 connected to the drive source 8A may extend in the circumferential direction of the frame member 7 and may transmit the driving force along the circumferential direction.

再者，圖3中的驅動力傳遞機構8B經由聯動部84沿著框構件7的三邊延伸地配置，但通過驅動力傳遞機構8B沿著框構件7的多個邊（包含兩邊）延伸地配置，可經由多個邊上的升降機構8C而使升降銷6進而基板3均勻且穩定地升降。In addition, the driving force transmission mechanism 8B in FIG. 3 is arranged to extend along three sides of the frame member 7 via the interlocking portion 84, but the driving force transmission mechanism 8B extends along a plurality of sides (including both sides) of the frame member 7. The arrangement enables the lift pins 6 and thus the substrate 3 to be raised and lowered uniformly and stably via the lift mechanisms 8C on the plurality of sides.

多個升降機構8C沿框構件7的周向彼此分離地配置。各個升降機構8C連結於框構件7的外周部與驅動力傳遞機構8B，使框構件7升降。The plurality of elevating mechanisms 8C are arranged apart from each other in the circumferential direction of the frame member 7 . Each of the elevating mechanisms 8C is connected to the outer peripheral portion of the frame member 7 and the driving force transmission mechanism 8B, and moves the frame member 7 up and down.

＜關於升降銷驅動部的結構＞ 圖4是表示升降銷驅動部8的驅動力傳遞機構8B及升降機構8C的結構的例子的圖。<About the structure of the lift pin drive section> FIG. 4 is a diagram showing an example of the configuration of the drive force transmission mechanism 8B and the lift mechanism 8C of the lift pin drive unit 8 .

驅動力傳遞機構8B包括：與驅動源8A的驅動聯動地旋轉的多個軸82；以及在框構件7的角部使軸82彼此聯動的聯動部84。The driving force transmission mechanism 8B includes: a plurality of shafts 82 that rotate in conjunction with the driving of the drive source 8A;

如圖4中例示那樣，在軸82的與升降機構8C相向的部位設置有小齒輪82A。另外，在軸82的端部設置有用於與其他軸82聯動的聯動夾具82B。聯動夾具82B插入至聯動部84的內部，且在聯動部84的內部與其他軸82的聯動夾具82B接觸，由此使軸彼此的旋轉聯動。As illustrated in FIG. 4 , a pinion gear 82A is provided at a portion of the shaft 82 facing the elevating mechanism 8C. In addition, an interlocking jig 82B for interlocking with another shaft 82 is provided at the end of the shaft 82 . The interlocking jig 82B is inserted into the interlocking portion 84 and contacts the interlocking jig 82B of the other shaft 82 inside the interlocking portion 84 , thereby interlocking the rotations of the shafts.

另一方面，各個升降機構8C包括與設置於軸82的小齒輪82A嚙合的齒條86。齒條86連結於框構件7，驅動源8A的驅動力通過軸82的小齒輪82A與升降機構8C的齒條86嚙合而傳遞至升降機構8C。On the other hand, each lift mechanism 8C includes a rack 86 that meshes with a pinion 82A provided on the shaft 82 . The rack 86 is coupled to the frame member 7, and the driving force of the drive source 8A is transmitted to the elevating mechanism 8C by meshing the pinion 82A of the shaft 82 with the rack 86 of the elevating mechanism 8C.

和升降機構8C連結的框構件7、進而由框構件7從下方支撐的升降銷6與由驅動源8A的驅動引起的升降機構8C的升降驅動聯動地升降。The frame member 7 connected to the elevating mechanism 8C and further the elevating pins 6 supported from below by the frame member 7 move up and down in conjunction with the elevating drive of the elevating mechanism 8C by the drive of the drive source 8A.

＜關於升降銷的升降動作＞ 圖5及圖6是表示升降銷6的升降動作的例子的剖面圖。首先，如圖5中例示那樣，在升降銷6未從平台4的保持面41向上方突出的狀態（在圖5中，升降銷6插入至貫通孔90，且升降銷6未從保持面41向上方突出的狀態）下，與升降機構8C連結的框構件7配置於下方位置。<About the lifting action of the lift pin> 5 and 6 are cross-sectional views showing an example of the raising/lowering operation of the raising/lowering pin 6 . First, as illustrated in FIG. 5 , in a state where the lift pins 6 do not protrude upward from the holding surface 41 of the platform 4 (in FIG. 5 , the lift pins 6 are inserted into the through holes 90 and the lift pins 6 do not protrude from the holding surface 41 The frame member 7 connected to the elevating mechanism 8C is arranged in a downward position in a state protruding upward.

另一方面，當升降機構8C通過驅動源8A的驅動使框構件7上升時，框構件7配置於上方位置，伴隨於此，由框構件7從下方支撐的各個升降銷6經由貫通孔90向保持面41的上方突出。於是，由升降銷6支撐下表面的基板3與保持面41分離地被抬起。在基板3由升降銷6支撐的狀態下，進行基板3的搬入或搬出等。On the other hand, when the elevating mechanism 8C raises the frame member 7 by the driving of the driving source 8A, the frame member 7 is arranged in the upper position, and accordingly, the respective elevating pins 6 supported by the frame member 7 from below pass through the through holes 90 to the upper position. The upper part of the holding surface 41 protrudes. Then, the substrate 3 whose lower surface is supported by the lift pins 6 is lifted apart from the holding surface 41 . In a state where the substrate 3 is supported by the lift pins 6 , the loading or unloading of the substrate 3 is performed.

再者，在圖5中示出了升降銷6不從保持面41突出且基板3與保持面41接觸的情況（或被吸附的情況），但也可為如接近銷等那樣維持從保持面41稍微突出的狀態的升降銷。5 shows the case where the lift pins 6 do not protrude from the holding surface 41 and the substrate 3 is in contact with the holding surface 41 (or is sucked), but it may be maintained from the holding surface such as a proximity pin or the like. 41 Lift pins in a slightly protruding state.

＜關於升降銷驅動部的結構的變形例＞ 圖7是表示驅動力傳遞機構80B及升降機構80C的結構的例子的圖。<A modified example of the structure of the lift pin drive portion> FIG. 7 is a diagram showing an example of the configuration of the driving force transmission mechanism 80B and the elevating mechanism 80C.

如圖7中例示那樣，驅動力傳遞機構80B為與線性馬達等驅動源的驅動聯動地沿框構件7的周向水平移動的多個板構件。As illustrated in FIG. 7 , the driving force transmission mechanism 80B is a plurality of plate members that horizontally move in the circumferential direction of the frame member 7 in conjunction with the driving of a driving source such as a linear motor.

如圖7中例示那樣，滑動孔88形成於驅動力傳遞機構80B的與升降機構80C相向的位置。滑動孔88包括位於驅動力傳遞機構80B的鉛垂方向上側的端部88A以及位於鉛垂方向下側的端部88B，端部88A與端部88B之間傾斜同時平滑地連接。As illustrated in FIG. 7 , the slide hole 88 is formed at a position of the driving force transmission mechanism 80B facing the lift mechanism 80C. The slide hole 88 includes an end portion 88A positioned on the upper side in the vertical direction of the driving force transmission mechanism 80B and an end portion 88B positioned on the lower side in the vertical direction.

另一方面，各個升降機構80C為嵌入至形成於驅動力傳遞機構80B的滑動孔88的凸部。所述凸部形成於框構件7的外周部。On the other hand, each of the elevating mechanisms 80C is a convex portion fitted into a sliding hole 88 formed in the driving force transmission mechanism 80B. The convex portion is formed on the outer peripheral portion of the frame member 7 .

而且，當驅動力傳遞機構80B與驅動源的驅動力聯動地水平移動時，嵌入至滑動孔88的凸部在嵌入至滑動孔88的狀態下從滑動孔88的端部88A（或端部88B）向端部88B（或端部88A）平滑地移動並升降。Furthermore, when the driving force transmission mechanism 80B moves horizontally in conjunction with the driving force of the driving source, the convex portion fitted into the sliding hole 88 is inserted into the sliding hole 88 from the end portion 88A (or the end portion 88B of the sliding hole 88 ). ) moves smoothly toward the end 88B (or the end 88A) and ascends and descends.

由此，和升降機構80C連結的框構件7、進而由框構件7從下方支撐的升降銷6與由驅動源的驅動引起的升降機構80C的升降驅動聯動地升降。Thereby, the frame member 7 connected to the elevating mechanism 80C and further the elevating pins 6 supported from below by the frame member 7 ascend and descend in conjunction with the ascending and descending drive of the ascending and descending mechanism 80C by the drive of the drive source.

再者，驅動力傳遞機構及升降機構的結構除此以外還可假定多種結構。例如，也可設為使用曲柄臂或滾珠絲杠等將旋轉驅動馬達的旋轉驅動轉換為升降驅動的機構的組合。另外，也可沿著框構件7的周向拉伸帶、鏈條或線等，由此傳遞旋轉驅動馬達的驅動力。或者，也可使多個齒輪沿著框構件7的周向連結，由此傳遞旋轉驅動馬達的驅動力。In addition, various structures other than the structures of the driving force transmission mechanism and the elevating mechanism can be assumed. For example, a combination of a mechanism that converts the rotational drive of the rotational drive motor into the lift drive using a crank arm, a ball screw, or the like may be employed. In addition, a belt, a chain, a wire, or the like may be stretched along the circumferential direction of the frame member 7 to transmit the driving force of the rotational drive motor. Alternatively, a plurality of gears may be coupled along the circumferential direction of the frame member 7 to transmit the driving force of the rotary drive motor.

＜關於由以上所記載的實施方式產生的效果＞ 接著，示出由以上所記載的實施方式產生的效果的例子。再者，在以下的說明中，基於以上所記載的實施方式中例示的具體結構來記載所述效果，但也可在產生同樣的效果的範圍內，與本申請說明書中例示的其他具體結構置換。<About the effects of the above-described embodiment> Next, an example of the effect produced by the embodiment described above is shown. In addition, in the following description, the above-mentioned effects are described based on the specific structures exemplified in the above-described embodiments, but the effects may be replaced with other specific structures exemplified in the specification of the present application within the scope of producing the same effects. .

根據以上所記載的實施方式，基板處理裝置包括：保持面41、多個升降銷6、框構件7、以及升降銷驅動部8。保持面41在上面保持基板3。多個升降銷6經由形成於保持面41的多個貫通孔90分別向保持面41的上表面突出。框構件7從下方支撐多個升降銷6，且在俯視時與保持面41重疊地配置。升降銷驅動部8在俯視時配置於框構件7的外周部。另外，升降銷驅動部8通過使框構件7升降來使多個升降銷6升降。此處，升降銷驅動部8包括驅動源8A、驅動力傳遞機構8B（或驅動力傳遞機構80B）、多個升降機構8C（或升降機構80C）。驅動力傳遞機構8B沿框構件7的周向延伸地配置，且傳遞驅動源8A的驅動力。多個升降機構8C連結於驅動力傳遞機構8B與框構件7的外周部，且使框構件7升降。According to the above-described embodiment, the substrate processing apparatus includes the holding surface 41 , the plurality of lift pins 6 , the frame member 7 , and the lift pin drive unit 8 . The holding surface 41 holds the substrate 3 thereon. The plurality of lift pins 6 respectively protrude toward the upper surface of the holding surface 41 through the plurality of through holes 90 formed in the holding surface 41 . The frame member 7 supports the plurality of lift pins 6 from below, and is arranged so as to overlap with the holding surface 41 in a plan view. The lift pin driving portion 8 is disposed on the outer peripheral portion of the frame member 7 in a plan view. In addition, the lift pin drive unit 8 lifts and lowers the plurality of lift pins 6 by raising and lowering the frame member 7 . Here, the lift pin drive unit 8 includes a drive source 8A, a drive force transmission mechanism 8B (or a drive force transmission mechanism 80B), and a plurality of lift mechanisms 8C (or lift mechanisms 80C). The driving force transmission mechanism 8B is arranged to extend in the circumferential direction of the frame member 7 and transmits the driving force of the driving source 8A. The plurality of elevating mechanisms 8C are connected to the driving force transmission mechanism 8B and the outer peripheral portion of the frame member 7 to elevate the frame member 7 .

根據此種結構，由於可將升降銷驅動部8配置於在俯視時充分遠離基板3的中心的位置，因此在進行驅動源8A或升降機構8C等的維護作業時，不需要潛入至基板3的下方。因此，維護作業變得容易。另外，由於沿框構件7的周向延伸形成的驅動力傳遞機構8B將驅動源8A的驅動力傳遞至多個升降機構8C，因此可經由多個升降機構8C使框構件7整體均等且穩定地升降。另外，由於可在框構件7的外周部充分遠離地配置多個升降機構8C，因此可使由框構件7支撐的多個升降銷6均等且穩定地升降。According to such a configuration, since the lift pin driving unit 8 can be arranged at a position sufficiently distant from the center of the substrate 3 in plan view, it is not necessary to infiltrate the substrate 3 when maintenance work such as the drive source 8A or the lift mechanism 8C is performed. below. Therefore, maintenance work becomes easy. In addition, since the driving force transmission mechanism 8B formed to extend in the circumferential direction of the frame member 7 transmits the driving force of the driving source 8A to the plurality of elevating mechanisms 8C, the entire frame member 7 can be raised and lowered equally and stably via the plurality of elevating mechanisms 8C. . In addition, since the plurality of elevating mechanisms 8C can be arranged sufficiently distant from the outer peripheral portion of the frame member 7, the plurality of elevating pins 6 supported by the frame member 7 can be raised and lowered equally and stably.

再者，即便在對上文所述的結構中適宜追加了本申請說明書中例示的其他結構的情況下，即，適宜追加了作為上文所述的結構未提及的本申請說明書中的其他結構的情況下，也可產生同樣的效果。In addition, even when other structures illustrated in the specification of the present application are appropriately added to the structures described above, that is, other structures not mentioned in the specification of the present application that are not mentioned as the structures described above are appropriately added. In the case of the structure, the same effect can be produced.

另外，根據以上所記載的實施方式，升降銷驅動部8在俯視時不與框構件7重疊。根據此種結構，通過升降銷驅動部8在俯視時向框構件7的外周部側偏移地配置，在升降銷驅動部8（特別是驅動源8A）中產生的熱難以籠罩在框構件7的下方。特別是在保持面41上進行高溫處理或冷卻處理等的情況下，若在保持面41的下方配置升降銷驅動部8，則容易受到急劇的溫度變化的影響而在升降銷驅動部8產生不良狀況。因此，此種結構有效。另外，通過將升降銷驅動部8配置於不與框構件7重疊的位置，可將升降銷驅動部8配置於與框構件7相同的高度處，因此可將基板處理裝置1的結構的高度抑制得低。因此，維護作業的安全性提高，另外，在輸送基板處理裝置1時也可提高安全性。In addition, according to the above-described embodiment, the lift pin driving portion 8 does not overlap the frame member 7 in a plan view. According to such a configuration, since the lift pin driving portion 8 is arranged offset to the outer peripheral portion side of the frame member 7 in plan view, the heat generated in the lift pin driving portion 8 (particularly, the drive source 8A) is less likely to be enveloped in the frame member 7 . below. In particular, when the holding surface 41 is subjected to high temperature treatment or cooling treatment, if the lift pin driving unit 8 is disposed below the holding surface 41 , the lift pin driving section 8 is likely to be affected by a sudden temperature change and cause defects in the lift pin driving section 8 . situation. Therefore, this structure is effective. In addition, by arranging the lift pin driving portion 8 at a position not overlapping the frame member 7, the lift pin driving portion 8 can be arranged at the same height as the frame member 7, so that the height of the structure of the substrate processing apparatus 1 can be suppressed. lower. Therefore, the safety of maintenance work can be improved, and the safety can also be improved when the substrate processing apparatus 1 is conveyed.

另外，根據以上所記載的實施方式，升降銷驅動部8在俯視時不與保持面41重疊。根據此種結構，通過升降銷驅動部8在俯視時露出至保持面41的外側，可有效地釋放在升降銷驅動部8（特別是驅動源8A）中產生的熱。另外，通過將升降銷驅動部8配置於不與保持面41重疊的位置，可將升降銷驅動部8配置於與保持面41相同的高度處。因此，可將基板處理裝置1的結構的高度抑制得低。In addition, according to the above-described embodiment, the lift pin driving portion 8 does not overlap the holding surface 41 in a plan view. According to such a configuration, the lift pin drive portion 8 is exposed to the outside of the holding surface 41 in plan view, and heat generated in the lift pin drive portion 8 (particularly, the drive source 8A) can be efficiently released. In addition, by arranging the lift pin driving portion 8 at a position not overlapping the holding surface 41 , the lift pin driving portion 8 can be arranged at the same height as the holding surface 41 . Therefore, the height of the structure of the substrate processing apparatus 1 can be suppressed low.

另外，根據以上所記載的實施方式，驅動力傳遞機構8B（或驅動力傳遞機構80B）沿框構件7的不同的兩個周向延伸地配置。根據此種結構，來自驅動源8A的驅動力通過驅動力傳遞機構8B沿著框構件7的多個邊傳遞。因此，可經由多個邊上的升降機構8C，使升降銷6進而基板3均勻且穩定地升降。Moreover, according to the embodiment described above, the driving force transmission mechanism 8B (or the driving force transmission mechanism 80B) is arranged to extend in two different circumferential directions of the frame member 7 . According to such a configuration, the driving force from the driving source 8A is transmitted along the plurality of sides of the frame member 7 by the driving force transmission mechanism 8B. Therefore, the lift pins 6 and thus the substrate 3 can be raised and lowered uniformly and stably through the lift mechanisms 8C on the plurality of sides.

＜關於以上所記載的實施方式的變形例＞ 在以上所記載的實施方式中，有時也記載了各個構成元件的材質、材料、尺寸、形狀、相對的配置關係或實施條件等，但這些在所有方面均是一個例子，並非限定性。<About a modification of the above-described embodiment> In the above-described embodiments, the materials, materials, dimensions, shapes, relative arrangement relationships, and implementation conditions of the respective constituent elements are sometimes described, but these are examples in all respects and are not restrictive.

因此，在本申請說明書中所公開的技術範圍內可假定未例示的無數變形例及均等物。例如，包含對至少一個構成元件進行變形的情況、追加的情況或省略的情況。Therefore, innumerable modification examples and equivalents which are not illustrated can be assumed within the technical scope disclosed in this specification. For example, the case where at least one constituent element is deformed, the case where it is added, or the case where it is omitted is included.

另外，在以上所記載的實施方式中，在未特別指定而記載了材料名稱等的情況下，只要不產生矛盾，則在所述材料中包含其他添加物，例如包含合金等。In addition, in the embodiment described above, in the case where the material name or the like is described without special designation, other additives, such as alloys, etc. are included in the material as long as there is no conflict.

1:基板處理裝置 2:狹縫噴嘴 3:基板 4:平台 5:塗佈處理部 6:升降銷 7:框構件 8:升降銷驅動部 8A:驅動源 8B、80B:驅動力傳遞機構 8C、80C:升降機構 21:吐出口 31:上表面 41:保持面 51:噴嘴支撐體 52:導軌 53:狹縫噴嘴移動部 54:線性馬達 55:線性編碼器 70:控制部 82:軸 82A:小齒輪 82B:聯動夾具 84:聯動部 86:齒條 88:滑動孔 88A、88B:端部 90:貫通孔 100:噴嘴調整區域1: Substrate processing device 2: Slit nozzle 3: Substrate 4: Platform 5: Coating treatment part 6: Lifting pin 7: Frame member 8: Lifting pin drive part 8A: drive source 8B, 80B: Driving force transmission mechanism 8C, 80C: Lifting mechanism 21: Spit out 31: Upper surface 41: Keep Faces 51: Nozzle support 52: Rails 53: Slit nozzle moving part 54: Linear Motor 55: Linear encoder 70: Control Department 82: Shaft 82A: pinion gear 82B: Linkage clamp 84: Linkage Department 86: rack 88: Sliding hole 88A, 88B: end 90: Through hole 100: Nozzle adjustment area

圖1是示意性地表示與實施方式相關的基板處理裝置的立體圖。 圖2是用於對圖1中例示的設置於基板處理裝置的保持面的下方的升降銷、框構件及升降銷驅動部進行說明的圖。 圖3是詳細地表示圖2中例示的升降銷、框構件及升降銷驅動部的結構的立體圖。 圖4是表示升降銷驅動部的驅動力傳遞機構及升降機構的結構的例子的圖。 圖5是表示升降銷的升降動作的例子的剖面圖。 圖6是表示升降銷的升降動作的例子的剖面圖。 圖7是表示驅動力傳遞機構及升降機構的結構的例子的圖。FIG. 1 is a perspective view schematically showing a substrate processing apparatus according to the embodiment. FIG. 2 is a diagram for explaining a lift pin, a frame member, and a lift pin drive unit provided below the holding surface of the substrate processing apparatus illustrated in FIG. 1 . FIG. 3 is a perspective view showing in detail the configuration of the lift pin, the frame member, and the lift pin drive unit illustrated in FIG. 2 . FIG. 4 is a diagram showing an example of the structure of a driving force transmission mechanism and a lift mechanism of a lift pin drive unit. FIG. 5 is a cross-sectional view showing an example of the lifting and lowering operation of the lift pins. FIG. 6 is a cross-sectional view showing an example of the lifting and lowering operation of the lift pins. FIG. 7 is a diagram showing an example of the configuration of the driving force transmission mechanism and the elevating mechanism.

3:基板3: Substrate

6:升降銷6: Lifting pin

7:框構件7: Frame member

8:升降銷驅動部8: Lifting pin drive part

8A:驅動源8A: drive source

8B:驅動力傳遞機構8B: Driving force transmission mechanism

8C:升降機構8C: Lifting mechanism

41:保持面41: Keep Faces

Claims (4)

一種基板處理裝置，包括： 保持面，用於在上表面保持基板； 多個升降銷，經由形成於所述保持面的多個貫通孔分別向所述保持面的所述上表面突出； 框構件，從下方支撐所述多個升降銷，且在俯視時與所述保持面重疊地配置；以及 升降銷驅動部，在俯視時配置於所述框構件的外周部，且用於通過使所述框構件升降來使所述多個升降銷升降，且 所述升降銷驅動部包括： 驅動源； 驅動力傳遞機構，沿所述框構件的周向延伸地配置，且用於傳遞所述驅動源的驅動力；以及 多個升降機構，連結於所述驅動力傳遞機構與所述框構件的外周部，且用於使所述框構件升降。A substrate processing device, comprising: a holding surface for holding the substrate on the upper surface; a plurality of lift pins respectively protruding toward the upper surface of the holding surface through a plurality of through holes formed in the holding surface; a frame member that supports the plurality of lift pins from below, and is disposed so as to overlap the holding surface in plan view; and a lift pin driving unit is arranged on an outer peripheral portion of the frame member in plan view, and is used to lift and lower the plurality of lift pins by raising and lowering the frame member, and The lift pin driving part includes: drive source; a driving force transmission mechanism extending in the circumferential direction of the frame member and configured to transmit the driving force of the driving source; and A plurality of elevating mechanisms are connected to the driving force transmission mechanism and the outer peripheral portion of the frame member, and are used to elevate the frame member. 如請求項1所述的基板處理裝置，其中， 所述升降銷驅動部在俯視時不與所述框構件重疊。The substrate processing apparatus according to claim 1, wherein, The lift pin driving portion does not overlap the frame member in a plan view. 如請求項1或請求項2所述的基板處理裝置，其中， 所述升降銷驅動部在俯視時不與所述保持面重疊。The substrate processing apparatus according to claim 1 or claim 2, wherein, The lift pin driving portion does not overlap the holding surface in a plan view. 如請求項1至請求項3中任一項所述的基板處理裝置，其中， 所述驅動力傳遞機構沿所述框構件的不同的兩個周向延伸地配置。The substrate processing apparatus according to any one of claim 1 to claim 3, wherein, The driving force transmission mechanism is arranged to extend along two different circumferential directions of the frame member.
TW110118902A 2020-06-22 2021-05-25 Substrate processing device comprising a holding surface, a plurality of lifting pins, a frame member, and a lifting pin driving part TW202201623A (en)

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