TW202201508A - Cutting device and manufacturing method of cut product forming a temporary groove on the object based on the height position of the object measured by the measuring device - Google Patents

Cutting device and manufacturing method of cut product forming a temporary groove on the object based on the height position of the object measured by the measuring device Download PDF

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TW202201508A
TW202201508A TW110117429A TW110117429A TW202201508A TW 202201508 A TW202201508 A TW 202201508A TW 110117429 A TW110117429 A TW 110117429A TW 110117429 A TW110117429 A TW 110117429A TW 202201508 A TW202201508 A TW 202201508A
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height position
workpiece
cutting device
main shaft
groove
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TW110117429A
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Chinese (zh)
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TWI834970B (en
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今井一郎
坂本真二
大西將馬
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

A cutting device includes a main shaft portion, a control portion, and a measuring device. The main shaft portion can be adjusted for its height position and is equipped with a blade. The measuring device is configured to measure the height position of the upper surface of the object. The control portion controls the main shaft portion to form a temporary groove on the object based on the height position of the object measured by the measuring device. The control portion controls the main shaft portion to adjust the height position of the main shaft portion based on the height position of the temporary groove portion measured by the measuring device, and then grooves are formed on the workpiece based on the height position of each of the plurality of portions of the upper surface of the workpiece measured by the measuring device.

Description

切斷裝置及切斷品的製造方法Cutting device and manufacturing method of cut product

本發明關於一種切斷裝置及切斷品的製造方法。The present invention relates to a cutting device and a method for manufacturing a cut product.

日本特開2018-206995號公報（專利文獻1）揭示一種封裝體基板的切削方法。於該切削方法中，封裝體基板的上表面的高度是沿分割預定線測定。基於該測定結果，控制切削單元的高度方向的位置。然後，切削單元沿分割預定線形成切削溝（參考專利文獻1）。 [先前技術文獻] （專利文獻）Japanese Patent Laid-Open No. 2018-206995 (Patent Document 1) discloses a cutting method of a package substrate. In this cutting method, the height of the upper surface of the package substrate is measured along the planned dividing line. Based on the measurement result, the position of the cutting unit in the height direction is controlled. Then, the cutting unit forms cutting grooves along the line to divide (refer to Patent Document 1). [Prior Art Literature] (patent literature)

專利文獻1 日本特開2018-206995號公報Patent Document 1 Japanese Patent Laid-Open No. 2018-206995

（發明所欲解決之問題）(The problem that the invention intends to solve)

即便基於封裝體基板（工件的一例）的上表面的高度控制切削單元的高度位置，亦存在因各種原因而未於工件上形成所需深度的切削溝之情況。Even if the height position of the cutting unit is controlled based on the height of the upper surface of the package substrate (an example of the workpiece), there are cases where a cutting groove of a desired depth is not formed on the workpiece for various reasons.

本發明是為解決此種問題而完成者，其目的在於提供一種切斷裝置及切斷品的製造方法，其能夠於工件上更確實地形成所需深度的溝槽。 （解決問題之技術手段）The present invention was made to solve such a problem, and an object thereof is to provide a cutting device and a method for manufacturing a cut product that can more reliably form grooves of a desired depth in a workpiece. (Technical means to solve problems)

根據本發明的某一態樣之切斷裝置包括：主軸部、控制部及測定器。主軸部，可調整高度位置，且安裝有構成為將包括工件之對象物加以切斷之刀片。控制部，構成為控制主軸部。測定器，構成為測定對象物的上表面的高度位置。控制部控制主軸部，以基於由測定器測得之對象物的高度位置，於對象物形成臨時溝。控制部控制主軸部，以基於由測定器測得之臨時溝部分的高度位置調整主軸部的高度位置，然後基於由測定器測得之工件的上表面的複數個部位之各者的高度位置，於工件上形成溝槽。A cutting device according to one aspect of the present invention includes a main shaft portion, a control portion, and a measuring device. The main shaft portion can adjust the height position, and is equipped with a blade configured to cut an object including a workpiece. The control unit is configured to control the spindle unit. The measuring device is configured to measure the height position of the upper surface of the object. The control unit controls the spindle unit to form a temporary groove in the object based on the height position of the object measured by the measuring device. The control part controls the main shaft part to adjust the height position of the main shaft part based on the height position of the temporary groove part measured by the measuring device, and then based on the height position of each of the plurality of parts of the upper surface of the workpiece measured by the measuring device, Form grooves on the workpiece.

根據本發明的另一態樣之切斷品的製造方法，是使用上述切斷裝置之切斷品的製造方法。切斷品的製造方法包括：第1測定工序、第1槽形成工序、第2測定工序、調整工序及第2槽形成工序。第1測定工序，是測定對象物的上表面的高度位置之工序。第1溝槽形成工序，是基於第1測定工序中的測定結果，於對象物上形成臨時溝之工序。第2測定工序，是測定臨時溝部分的高度位置之工序。調整工序，是基於第2測定工序中的測定結果，調整主軸部的高度位置之工序。第2溝槽形成工序，是於調整工序之後，基於工件的上表面的複數個部位之各者的高度位置的測定結果，於工件上形成溝槽之工序。 （發明的效果）According to another aspect of the present invention, a method for producing a cut product is a method for producing a cut product using the above-described cutting device. The manufacturing method of a cut product includes a 1st measurement process, a 1st groove formation process, a 2nd measurement process, an adjustment process, and a 2nd groove formation process. The first measurement step is a step of measuring the height position of the upper surface of the object. The first groove forming step is a step of forming a temporary groove on the object based on the measurement result in the first measurement step. The second measurement step is a step of measuring the height position of the temporary groove portion. The adjustment step is a step of adjusting the height position of the main shaft portion based on the measurement result in the second measurement step. The second groove forming step is a step of forming grooves on the workpiece based on the measurement result of the height position of each of a plurality of locations on the upper surface of the workpiece after the adjustment step. (effect of invention)

根據本發明，可提供一種切斷裝置及切斷品的製造方法，其能夠於工件上更確實地形成所需深度的溝槽。ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a cutting device and a cut product which can form the groove|channel of a desired depth in a workpiece|work more reliably can be provided.

以下，參考圖式對本發明的實施方式詳細地進行說明。再者，在圖中，對同一或相當部分賦與同一符號，並省略其說明。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in the figure, the same code|symbol is attached|subjected to the same or a corresponding part, and the description is abbreviate|omitted.

[1. 實施方式 1] ＜ 1-1. 切斷裝置的構造＞ 第1圖是示意性地表示根據本實施方式1之切斷裝置10的一部分的平面之圖。第2圖是示意性地表示切斷裝置10的一部分的正面的圖。再者，於第1圖及第2圖中，箭頭XYZ的各者所表示之方向是共通的。 [1. Embodiment 1] < 1-1. Configuration of Cutting Device> FIG. 1 is a plan view schematically showing a part of a cutting device 10 according to the first embodiment. FIG. 2 is a view schematically showing a front side of a part of the cutting device 10 . In addition, in FIG. 1 and FIG. 2, the direction indicated by each arrow XYZ is common.

切斷裝置10構成為藉由將工件W1切斷而將工件W1單片化為複數個切斷品。又，切斷裝置10構成為藉由移除工件W1的一部分而於工件W1在形成溝槽。亦即，切斷裝置10的名稱（切斷裝置）中所包含之用語「切斷」的概念包括將切斷對象分離為複數個、及移除切斷對象的一部分。工件W1為例如封裝體基板。於封裝體基板中，裝有半導體晶片之基板或引線框架由樹脂密封。於以下說明中，將工件W1的密封側的面記為「封裝體面」，將基板或引線框架側的面記為「基板面」。The cutting device 10 is configured to separate the workpiece W1 into a plurality of cut products by cutting the workpiece W1. Moreover, the cutting apparatus 10 is comprised so that a groove|channel may be formed in the workpiece|work W1 by removing a part of the workpiece|work W1. That is, the concept of the term "cutting" included in the name (cutting device) of the cutting device 10 includes dividing the cutting object into plural pieces and removing a part of the cutting object. The workpiece W1 is, for example, a package substrate. In the package substrate, the substrate or lead frame on which the semiconductor chip is mounted is sealed by resin. In the following description, the surface on the sealing side of the workpiece W1 is referred to as the "package surface", and the surface on the substrate or lead frame side is referred to as the "substrate surface".

作為封裝體基板的一例，可列舉球柵陣列(Ball Grid Array；BGA)封裝體基板、柵格陣列(Land Grid Array；LGA)封裝體基板、晶片尺寸封裝(Chip Size Package；CSP)封裝體基板、發光二極體(Light Emitting Diode；LED)封裝體基板、四方無引線(Quad Flat No-leaded；QFN)封裝體基板。Examples of package substrates include ball grid array (BGA) package substrates, land grid array (LGA) package substrates, and chip size package (CSP) package substrates , Light Emitting Diode (Light Emitting Diode; LED) package substrate, Quad Flat No-leaded (Quad Flat No-leaded; QFN) package substrate.

如第1圖及第2圖所示，切斷裝置10包括切斷單元100、工件保持單元200、接觸刀具組(Contact Cutter Set；CCS)區塊300、測定器400及控制部500。再者，CCS區塊300為輔助構件的一例。As shown in FIGS. 1 and 2 , the cutting device 10 includes a cutting unit 100 , a workpiece holding unit 200 , a contact cutter set (CCS) block 300 , a measuring device 400 , and a control unit 500 . In addition, the CCS block 300 is an example of an auxiliary member.

切斷單元100構成為切斷工件W1，且包括主軸部110、滑塊103和104、以及支撐體105。再者，切斷裝置10，在將主軸部110與滑塊103和104作為一組的情況下，可為包括兩組的雙主軸構造，亦可為僅包括一組的單主軸構造。The cutting unit 100 is configured to cut the workpiece W1 , and includes a main shaft portion 110 , sliders 103 and 104 , and a support body 105 . Furthermore, the cutting device 10 may have a double-spindle structure including two sets or a single-spindle structure including only one set when the spindle portion 110 and the sliders 103 and 104 are set as one set.

支撐體105為金屬製棒狀構件，構成為沿未圖示之導件在箭頭Y方向移動。於支撐體105，形成有沿長度方向（箭頭X方向）延伸之導件G1。The support body 105 is a metal rod-shaped member, and is configured to move in the arrow Y direction along a guide (not shown). The support body 105 is formed with a guide G1 extending in the longitudinal direction (arrow X direction).

滑塊104為金屬製板狀構件，且以可沿導件G1在箭頭X方向移動之狀態安裝於支撐體105。於滑塊104，形成有沿長度方向（箭頭Z方向）延伸之導件G2。滑塊103為金屬製板狀構件，且以可沿導件G2在高度方向（箭頭Z方向）移動之狀態安裝於滑塊104。The slider 104 is a metal plate-like member, and is attached to the support body 105 in a state of being movable in the direction of the arrow X along the guide G1. The slider 104 is formed with a guide G2 extending in the longitudinal direction (arrow Z direction). The slider 103 is a metal plate-like member, and is attached to the slider 104 in a state of being movable in the height direction (arrow Z direction) along the guide G2 .

主軸部110包括主軸部主體102及安裝於主軸部主體102上的刀片101。刀片101藉由高速旋轉，而將工件W1切斷，從而將工件W1單片化為複數個切斷品（半導體封裝體）。主軸部主體102安裝於滑塊103。主軸部110構成為隨滑塊103和104及支撐體105的移動而移動至切斷裝置10內的所需的位置。The main shaft portion 110 includes a main shaft portion main body 102 and a blade 101 mounted on the main shaft portion main body 102 . The blade 101 cuts the workpiece W1 by rotating at a high speed, and separates the workpiece W1 into a plurality of cut products (semiconductor packages). The main shaft portion main body 102 is attached to the slider 103 . The main shaft portion 110 is configured to move to a desired position in the cutting device 10 in accordance with the movement of the sliders 103 and 104 and the support body 105 .

工件保持單元200構成為保持工件W1，且包括切斷台201及配置於切斷台201上之橡膠件202。於本實施方式1中，例示有具有兩個工件保持單元200之雙切割台構造的切斷裝置10。再者，工件保持單元200的數量並不限於兩個，亦可為一個，亦可為三個以上。The workpiece holding unit 200 is configured to hold the workpiece W1 and includes a cutting table 201 and a rubber member 202 arranged on the cutting table 201 . In this Embodiment 1, the cutting apparatus 10 of the double cutting table structure which has two workpiece|work holding units 200 is illustrated. Furthermore, the number of the workpiece holding units 200 is not limited to two, and may be one or three or more.

橡膠件202為橡膠製板狀構件，於橡膠件202中形成有複數個孔。於橡膠件202上配置工件W1。切斷台201藉由自下方的封裝體面側對配置於橡膠件202上之工件W1加以吸附而保持工件W1。切斷台201可沿θ方向旋轉。工件W1是於由工件保持單元200保持之狀態下自基板面側被主軸部110切斷。The rubber piece 202 is a rubber-made plate-like member, and a plurality of holes are formed in the rubber piece 202 . The workpiece W1 is arranged on the rubber member 202 . The cutting table 201 holds the workpiece W1 by attracting the workpiece W1 arranged on the rubber member 202 from the lower package surface side. The cutting table 201 is rotatable in the θ direction. The workpiece W1 is cut by the spindle portion 110 from the substrate surface side in a state held by the workpiece holding unit 200 .

CCS區塊300用以對主軸部110的高度位置的控制中的控制座標原點進行檢測。控制座標原點包括例如電性原點，為「基準位置」的一例。關於CCS區塊300的用途，在下文進行詳細說明。The CCS block 300 is used to detect the origin of the control coordinates in the control of the height position of the main shaft portion 110 . The control coordinate origin includes, for example, an electrical origin, and is an example of the "reference position". The purpose of the CCS block 300 will be described in detail below.

測定器400由例如雷射位移計構成，且構成為對工件W1的上表面（基板面）及CCS區塊300的上表面等的高度位置進行測定。關於測定器400的用途，在下文進行詳細說明。The measuring device 400 is composed of, for example, a laser displacement meter, and is configured to measure the height positions of the upper surface (substrate surface) of the workpiece W1 , the upper surface of the CCS block 300 , and the like. The use of the measuring device 400 will be described in detail below.

控制部500包括中央處理單元(Central Processing Unit；CPU)、隨機存取記憶體(Random Access Memory；RAM)及唯讀記憶體(Read Only Memory；ROM)等，且構成為根據資訊處理來進行各構成要素之控制。控制部500構成為例如控制切斷單元100、工件保持單元200及測定器400。The control unit 500 includes a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), etc., and is configured to perform various functions according to information processing. Control of Elements. The control unit 500 is configured to control the cutting unit 100 , the workpiece holding unit 200 , and the measuring device 400 , for example.

於切斷裝置10中，進行工件W1的全切及半切。為了經半切而於工件W1上形成所需深度的溝槽，需高精度地調整主軸部110的高度位置。於根據本實施方式1之切斷裝置10中，於進行工件W1的半切時，高精度地調整主軸部110的高度位置。以下，與作為比較對象之切斷裝置中的主軸部的高度位置的調整方法進行對比，對根據本實施方式1之切斷裝置10中的主軸部110的高度位置的調整方法進行說明。In the cutting device 10, full cutting and half cutting of the workpiece W1 are performed. In order to form a groove of a desired depth on the workpiece W1 by half cutting, the height position of the spindle portion 110 needs to be adjusted with high precision. In the cutting device 10 according to the first embodiment, when half-cutting the workpiece W1, the height position of the main shaft portion 110 is adjusted with high accuracy. Hereinafter, the adjustment method of the height position of the spindle part 110 in the cutting device 10 according to the first embodiment will be described in comparison with the adjustment method of the height position of the spindle part in the cutting device which is the object of comparison.

＜ 1-2. 主軸部的高度 位置的調整順序＞ （ 1-2-1. 比較對象中的調整順序） 第3圖是用以說明作為比較對象之切斷裝置10A中的主軸部110A在高度方向上的控制座標原點的檢測順序的圖。於切斷裝置10A中，預先記憶有CCS區塊300A的高度H1。如第3圖所示，於切斷裝置10A中，藉由使刀片101A接觸CCS區塊300A，而檢測主軸部110A在高度方向上的控制座標原點。 < 1-2. Adjustment procedure of height position of main shaft > ( 1-2-1. Adjustment procedure in comparison) FIG. 3 is for explaining the height of main shaft 110A in cutting device 10A as comparison. Diagram of the detection order of the origin of the control coordinates in the direction. In the cutting device 10A, the height H1 of the CCS block 300A is stored in advance. As shown in FIG. 3 , in the cutting device 10A, by bringing the blade 101A into contact with the CCS block 300A, the origin of the control coordinates in the height direction of the spindle portion 110A is detected.

第4圖是用以說明作為比較對象之切斷裝置10A中的主軸部110A的高度位置的調整順序的圖。於切斷裝置10A中，預先記憶有工件W1的高度H2及橡膠件202A的高度H3等各構件的高度例如基於設計階段的尺寸值。於切斷裝置10A中，基於檢測到的控制座標原點及預先記憶之各構件的高度，調整主軸部110A的高度位置，以於工件W1上形成所需深度的溝槽。再者，於切斷裝置10A中，CCS區塊300A以及橡膠件202A和工件W1配置於共同的切斷台201A上，以避免切斷台201A的高度的誤差影響主軸部110A的高度調整。亦即，CCS區塊300A於各切斷台201A上各配置一個。FIG. 4 is a diagram for explaining the adjustment procedure of the height position of the main shaft portion 110A in the cutting device 10A to be compared. In the cutting device 10A, the heights of the respective members, such as the height H2 of the workpiece W1 and the height H3 of the rubber piece 202A, are stored in advance, for example, based on dimension values in the design stage. In the cutting device 10A, the height position of the main shaft portion 110A is adjusted based on the detected origin of the control coordinates and the height of each member memorized in advance to form a groove of a desired depth in the workpiece W1. Furthermore, in the cutting device 10A, the CCS block 300A, the rubber piece 202A, and the workpiece W1 are arranged on the common cutting table 201A, so as to prevent the height error of the cutting table 201A from affecting the height adjustment of the main shaft 110A. That is, one CCS block 300A is arranged on each cutting stage 201A.

當各構件的高度的資訊準確時，可藉由此種順序，適當地調整主軸部110A的高度位置。然而，各構件的高度資訊並不一定準確。例如，橡膠件202A可能會因切斷台201A之吸附而撓曲。又，橡膠件202A可能會因經時變化而磨損。又，工件W1可能會因前一工序中的熱量等而撓曲。又，工件W1可能會因主軸部等構成零件的加工所導致之誤差等而撓曲。When the information on the height of each member is accurate, the height position of the main shaft portion 110A can be appropriately adjusted by this sequence. However, the height information of each component is not necessarily accurate. For example, the rubber member 202A may be deflected by the suction of the cutting table 201A. Also, the rubber member 202A may be worn out due to changes over time. In addition, the workpiece W1 may be deflected by heat or the like in the previous process. In addition, the workpiece W1 may be deflected due to errors or the like caused by machining of constituent parts such as the main shaft portion.

如此，因各種原因，可能會導致各構件的實際高度與預先記憶之高度不同。於該情況下，利用以上述順序調整高度位置後之主軸部110A，無法於工件W1上形成所需深度的溝槽。Thus, due to various reasons, the actual height of each component may be different from the pre-remembered height. In this case, a groove of a desired depth cannot be formed on the workpiece W1 by the spindle portion 110A after the height position has been adjusted in the above-described procedure.

（ 1-2-2. 本實施方式 1 中的調整順序） 於根據本實施方式1之切斷裝置10中，與上述比較對象同樣地（第3圖），藉由使刀片101接觸CCS區塊300，而檢測主軸部110在高度方向上的控制座標原點。另一方面，於切斷裝置10中，作為各構件的高度，不使用預先記憶之資訊。 ( 1-2-2. Adjustment procedure in Embodiment 1) In the cutting device 10 according to Embodiment 1, as in the above-mentioned comparison object (FIG. 3), by bringing the blade 101 into contact with the CCS block 300, and the origin of the control coordinates of the main shaft portion 110 in the height direction is detected. On the other hand, in the cutting device 10, information stored in advance is not used as the height of each member.

第5圖是用以說明切斷裝置10中的CCS區塊300的高度位置的測定方法之圖。如第5圖所示，於切斷裝置10中，CCS區塊300的高度位置是於每次進行新工件W1的切斷時由測定器400測定。藉此，能夠更準確地特定控制座標原點與實際的高度位置之對應關係。再者，CCS區塊300的高度位置的測定亦可不必於每次進行新工件W1的切斷時都要進行。例如，亦可當在主軸部110中更換刀片101之時機進行CCS區塊300的高度位置的測定。又，亦可於利用下述修整板600（第12圖）消除刀片101的堵塞後之時機進行CCS區塊300的高度位置的測定。FIG. 5 is a diagram for explaining a method of measuring the height position of the CCS block 300 in the cutting device 10 . As shown in FIG. 5 , in the cutting device 10, the height position of the CCS block 300 is measured by the measuring device 400 every time a new workpiece W1 is cut. Thereby, the correspondence relationship between the origin of the control coordinates and the actual height position can be specified more accurately. Furthermore, the measurement of the height position of the CCS block 300 does not need to be performed every time the cutting of a new workpiece W1 is performed. For example, the measurement of the height position of the CCS block 300 may be performed when the blade 101 is replaced in the spindle unit 110 . In addition, the measurement of the height position of the CCS block 300 may be performed at the timing after the clogging of the blade 101 is eliminated by the following trimming plate 600 (FIG. 12).

再者，於切斷裝置10中，由於有實際測定CCS區塊300的高度位置，因此，與上述比較對象之切斷裝置10A不同，無需考慮切斷台201的高度的誤差，且CCS區塊300無需設置於各切斷台201上。因此，於切斷裝置10中，CCS區塊300於兩個切斷台201之間僅配置一個（第1圖）。Furthermore, in the cutting apparatus 10, since the height position of the CCS block 300 is actually measured, unlike the cutting apparatus 10A of the comparison object, there is no need to consider the error in the height of the cutting table 201, and the CCS block 300 does not need to be installed on each cutting table 201 . Therefore, in the cutting apparatus 10, only one CCS block 300 is arranged between the two cutting stages 201 (FIG. 1).

第6圖是用以說明切斷裝置10中的工件W1的高度位置的測定方法之圖。如第6圖所示，工件W1的高度位置由測定器400測定。於切斷裝置10中，工件W1的高度位置例如於每次進行新工件W1的切斷時由測定器400測定。又，工件W1的高度位置的測定例如可當更換主軸部110中的刀片101之時機進行，亦可於利用下述修整板600（第12圖）消除刀片101的堵塞後之時機進行。藉此，能夠準確地識別工件W1的高度位置。FIG. 6 is a diagram for explaining a method of measuring the height position of the workpiece W1 in the cutting device 10 . As shown in FIG. 6 , the height position of the workpiece W1 is measured by the measuring device 400 . In the cutting device 10 , the height position of the workpiece W1 is measured by the measuring device 400 every time a new workpiece W1 is cut, for example. The height position of the workpiece W1 can be measured, for example, when the blade 101 in the spindle unit 110 is replaced, or when the blade 101 is clogged by the trimming plate 600 (FIG. 12) described below. Thereby, the height position of the workpiece W1 can be accurately recognized.

利用基於檢測到的控制座標原點及實際測得之各構件的高度位置來調整主軸部110的高度位置之方法，相較於上述比較對象，能夠降低於工件W1上未形成所需深度的溝槽之可能性，且能夠於工件W1上更確實地形成所需深度的溝槽。然而，即便利用此種方法，亦可能會因各種原因而未能於工件W1上形成所需深度的溝槽。於根據本實施方式1之切斷裝置10中，採取進一步的對策。於切斷裝置10中，在工件W1的上表面測定複數個部位的高度位置。Using the method of adjusting the height position of the main shaft portion 110 based on the detected control coordinate origin and the actually measured height position of each member, compared with the above-mentioned comparison object, it is possible to reduce the number of grooves that do not form a required depth on the workpiece W1 The possibility of grooves can be more reliably formed on the workpiece W1 with a groove of a desired depth. However, even if this method is used, a groove of a desired depth may not be formed on the workpiece W1 due to various reasons. In the cutting device 10 according to the first embodiment, further measures are taken. In the cutting device 10, the height positions of a plurality of places are measured on the upper surface of the workpiece W1.

第7圖是用以說明待測定高度位置之部位的一例之圖，且是表示自工件W1的基板面側觀察到的情況之圖。如第7圖所示，工件W1中包括複數個半導體晶片C1。工件W1中包括於切斷後用作產品之產品區PT1、及於切斷後不用作產品之非產品區NPT1。於本實施方式1中，產品區PT1存在於工件W1的中央部分，非產品區NPT1存在於產品區PT1的周圍。然而，它們的配置並不限於此。例如，非產品區NPT1亦可存在於工件W1的中央部分。非產品區NPT1中不含半導體晶片C1。於複數個位置P1中測定高度位置，其中該等複數個位置P1是沿著計劃要形成之溝槽。待測定高度位置之位置P1包含於非產品區NPT1及產品區PT1之各者中。再者，於非產品區NPT1，既可形成密封樹脂，亦可不形成密封樹脂。FIG. 7 is a diagram for explaining an example of a position to be measured for a height position, and is a diagram showing a situation as seen from the substrate surface side of the workpiece W1. As shown in FIG. 7 , the workpiece W1 includes a plurality of semiconductor wafers C1 . The workpiece W1 includes a product area PT1 used as a product after cutting, and a non-product area NPT1 not used as a product after cutting. In this Embodiment 1, the product area PT1 exists in the center part of the workpiece|work W1, and the non-product area NPT1 exists in the periphery of the product area PT1. However, their configuration is not limited to this. For example, the non-product area NPT1 may also exist in the central portion of the workpiece W1. The non-product area NPT1 does not contain the semiconductor wafer C1. Height positions are determined in a plurality of positions P1, wherein the plurality of positions P1 are along the grooves that are planned to be formed. The position P1 of the height position to be determined is included in each of the non-product area NPT1 and the product area PT1. Furthermore, in the non-product region NPT1, the sealing resin may or may not be formed.

第8圖是用以說明於非產品區NPT1上形成臨時溝GR1之順序之圖。臨時溝GR1不會反映在切斷品（產品）上，是用來調整主軸部110的高度位置而形成。如第8圖所示，於切斷裝置10中，基於在非產品區NPT1中測得之工件W1的高度位置，於非產品區NPT1上形成臨時溝GR1。再者，在第8圖所示之例中，臨時溝GR1是自非產品區NPT1的一端部形成至相反側的端部，但亦可僅於非產品區NPT1的一部分上形成臨時溝GR1。FIG. 8 is a diagram for explaining the sequence of forming the temporary groove GR1 in the non-product area NPT1. The temporary groove GR1 is not reflected on the cut product (product), but is formed for adjusting the height position of the main shaft portion 110 . As shown in FIG. 8, in the cutting device 10, a temporary groove GR1 is formed in the non-product region NPT1 based on the height position of the workpiece W1 measured in the non-product region NPT1. In the example shown in FIG. 8, the temporary groove GR1 is formed from one end of the non-product region NPT1 to the opposite end, but the temporary groove GR1 may be formed only in a part of the non-product region NPT1.

第9圖是用以說明臨時溝GR1的高度位置的測定方法之圖。如第9圖所示，於切斷裝置10中，利用測定器400測定臨時溝GR1的高度位置。於切斷裝置10中，利用控制部500判定臨時溝GR1的深度（高度位置）是否在容許範圍內。於切斷裝置10中，利用控制部500預先記憶有如下條件：例如，若誤差在X%以內，則為容許範圍。FIG. 9 is a diagram for explaining a method of measuring the height position of the temporary groove GR1. As shown in FIG. 9 , in the cutting device 10 , the height position of the temporary groove GR1 is measured by the measuring device 400 . In the cutting device 10 , it is determined by the control unit 500 whether the depth (height position) of the temporary groove GR1 is within the allowable range. In the cutting device 10 , the control unit 500 pre-stores the following conditions: for example, if the error is within X%, it is within the allowable range.

若臨時溝GR1的深度在容許範圍內，則判定主軸部110的高度調整是適當的。另一方面，若臨時溝GR1的深度在容許範圍外，則判定主軸部110的高度調整並不適當，而對主軸部110的高度位置進行微調整。如此，根據切斷裝置10，由於是基於實際形成之臨時溝GR1的深度，來對主軸部110的高度位置進行進一步微調整，因此能夠於工件W1上更確實地形成所需深度的溝槽。If the depth of the temporary groove GR1 is within the allowable range, it is determined that the height adjustment of the main shaft portion 110 is appropriate. On the other hand, if the depth of the temporary groove GR1 is outside the allowable range, it is determined that the height adjustment of the main shaft portion 110 is not appropriate, and the height position of the main shaft portion 110 is finely adjusted. As described above, according to the cutting device 10 , the height position of the main shaft portion 110 is further finely adjusted based on the depth of the temporarily formed temporary groove GR1 , so that a groove of a desired depth can be more reliably formed on the workpiece W1 .

第10圖是用以說明切斷裝置10中的溝槽的形成順序之圖。如第10圖所示，切斷裝置10根據產品區PT1的複數個部位之各者的高度位置，來調整刀片101（主軸部110）的高度位置，並於工件W1上形成溝槽。再者，於第10圖中，以單點鏈線表示之部分是表示形成於工件W1上之溝槽的底面的位置。如此，根據切斷裝置10，由於根據複數個部位之各者的高度位置來調整主軸部110的高度位置，因此能夠於工件W1上更確實地形成所需深度的溝槽。再者，於非產品區NPT1中形成之臨時溝GR1亦以與產品區PT1相同的順序形成。FIG. 10 is a diagram for explaining the sequence of forming grooves in the cutting device 10 . As shown in FIG. 10 , the cutting device 10 adjusts the height position of the blade 101 (spindle part 110 ) according to the height position of each of a plurality of parts of the product area PT1 , and forms a groove on the workpiece W1 . In addition, in FIG. 10, the part shown by the single-dot chain line shows the position of the bottom surface of the groove|channel formed in the workpiece|work W1. As described above, according to the cutting device 10, since the height position of the main shaft portion 110 is adjusted according to the height position of each of the plurality of positions, the groove of the desired depth can be more reliably formed on the workpiece W1. Furthermore, the temporary grooves GR1 formed in the non-product region NPT1 are also formed in the same order as the product region PT1.

＜ 1-3. 切斷裝置的動作＞ 第11圖是表示切斷裝置10中的溝槽的形成順序之流程圖。該流程圖所示之處理是於在工件W1上形成溝槽時執行。 < 1-3. Operation of Cutting Device> FIG. 11 is a flowchart showing the procedure of forming grooves in the cutting device 10 . The processing shown in this flowchart is executed when a groove is formed on the workpiece W1.

參考第11圖，控制部500控制主軸部110，使刀片101接觸CCS區塊300，以檢測主軸部110在高度方向上的控制座標原點（步驟S100）。控制部500控制測定器400對CCS區塊300的上表面的高度位置進行測定，以測定基準高度（步驟S110）。11 , the control unit 500 controls the spindle unit 110 to make the blade 101 contact the CCS block 300 to detect the control coordinate origin of the spindle unit 110 in the height direction (step S100 ). The control unit 500 controls the measuring device 400 to measure the height position of the upper surface of the CCS block 300 to measure the reference height (step S110 ).

控制部500控制測定器400對保持於工件保持單元200上之工件W1的上表面的複數個部位的高度位置進行測定（步驟S120）。控制部500控制主軸部110，以基於工件W1的非產品區NPT1中的高度位置，進行主軸部110的高度位置的第1次調整（步驟S130）。例如，控制部500於步驟S120中，針對形成於產品區PT1及非產品區NPT1之各溝槽，生成主軸部110的高度位置的校正資料。控制部500於步驟130中，可基於與形成於非產品區NPT1之溝槽相關之校正資料，調整主軸部110的高度。The control unit 500 controls the measuring device 400 to measure the height positions of a plurality of locations on the upper surface of the workpiece W1 held by the workpiece holding unit 200 (step S120 ). The control unit 500 controls the spindle unit 110 to perform the first adjustment of the height position of the spindle unit 110 based on the height position in the non-product area NPT1 of the workpiece W1 (step S130 ). For example, in step S120 , the control unit 500 generates calibration data for the height position of the main shaft portion 110 for each of the grooves formed in the product area PT1 and the non-product area NPT1 . In step 130, the control part 500 may adjust the height of the main shaft part 110 based on the calibration data related to the grooves formed in the non-product area NPT1.

控制部500控制主軸部110，以基於工件W1的非產品區NPT1中的高度位置於非產品區NPT1形成臨時溝GR1（步驟S140）。控制部500控制測定器400，以對所形成之臨時溝GR1的高度位置（深度）進行測定（步驟S150）。The control unit 500 controls the spindle unit 110 to form a temporary groove GR1 in the non-product area NPT1 based on the height position in the non-product area NPT1 of the workpiece W1 (step S140 ). The control unit 500 controls the measuring device 400 to measure the height position (depth) of the formed temporary groove GR1 (step S150 ).

控制部500判定臨時溝GR1的深度是否在容許範圍內（步驟S160）。若判定為不在容許範圍內（於步驟S160中為「否」），控制部500控制主軸部110，以進行主軸部110的高度位置的第2次調整（步驟S170）。亦即，控制部500生成主軸部110的高度位置的調整資料（高度位置調整資料），並基於該高度位置調整資料進行主軸部110的高度位置的微調整。例如，控制部500可基於在步驟S120中生成之產品區PT1的各溝槽的校正資料及高度位置調整資料，調整主軸部110的高度。The control unit 500 determines whether or not the depth of the temporary groove GR1 is within the allowable range (step S160 ). If it is determined that it is not within the allowable range (NO in step S160 ), the control unit 500 controls the main shaft part 110 to perform the second adjustment of the height position of the main shaft part 110 (step S170 ). That is, the control unit 500 generates adjustment data (height position adjustment data) of the height position of the main shaft part 110 , and performs fine adjustment of the height position of the main shaft part 110 based on the height position adjustment data. For example, the control part 500 may adjust the height of the main shaft part 110 based on the calibration data and the height position adjustment data of each groove of the product area PT1 generated in step S120.

在判定為臨時溝GR1的深度在容許範圍內之後（於步驟S160中為「是」），或於步驟S170中進行主軸部110的高度位置的微調整之後，控制部500控制主軸部110，以於工件W1的產品區PT1上形成溝槽（步驟S180）。再者，當於步驟S170中生成高度位置調整資料時，控制部500控制主軸部110，以基於該高度位置調整資料調整主軸部110的高度位置，然後基於工件W1的產品區PT1的各部位的高度位置，於產品區PT1上形成溝槽。另一方面，當於步驟S170中未生成高度位置調整資料時，控制部500控制主軸部110，以基於產品區PT1的各部位的高度位置，於產品區PT1上形成溝槽。於任一情況下，控制部500均控制主軸部110，以對應於產品區PT1的各部位的高度位置來調整高度位置，並於工件W1上形成溝槽。After it is determined that the depth of the temporary groove GR1 is within the allowable range (YES in step S160 ), or after fine adjustment of the height position of the main shaft portion 110 is performed in step S170 , the control portion 500 controls the main shaft portion 110 to A trench is formed on the product area PT1 of the workpiece W1 (step S180 ). Furthermore, when the height position adjustment data is generated in step S170, the control part 500 controls the main shaft part 110 to adjust the height position of the main shaft part 110 based on the height position adjustment data, and then based on the height position adjustment data of each part of the product area PT1 of the workpiece W1. At the height position, a trench is formed on the product area PT1. On the other hand, when the height position adjustment data is not generated in step S170, the control unit 500 controls the spindle unit 110 to form grooves in the product area PT1 based on the height positions of the respective parts of the product area PT1. In any case, the control unit 500 controls the spindle unit 110 to adjust the height position corresponding to the height position of each part of the product area PT1, and to form a groove on the workpiece W1.

＜ 1-4. 特徵＞ 如上所述，於根據本實施方式1之切斷裝置10中，控制部500是控制主軸部110，以基於由測定器400測得之對象物（工件W1的非產品區NPT1）的高度位置，於對象物（非產品區NPT1）上形成臨時溝GR1。並且，控制部500控制主軸部110，以基於由測定器400測得之臨時溝GR1部分的高度位置調整主軸部110的高度位置，然後基於由測定器400測得之工件W1的上表面的複數個部位之各者的高度位置，於工件W1的產品區PT1上形成溝槽。 < 1-4. Features> As described above, in the cutting device 10 according to the first embodiment, the control unit 500 controls the spindle unit 110 so as to be based on the object measured by the measuring device 400 (the non-product of the workpiece W1 ). At the height position of the area NPT1), a temporary groove GR1 is formed on the object (non-product area NPT1). Then, the control unit 500 controls the spindle unit 110 to adjust the height position of the spindle unit 110 based on the height position of the temporary groove GR1 portion measured by the measuring device 400 , and then based on the plural number of the upper surface of the workpiece W1 measured by the measuring device 400 At the height positions of each of the positions, grooves are formed on the product area PT1 of the workpiece W1.

根據該切斷裝置10，由於各構件的高度位置由測定器400測定，因此能夠適當地控制主軸部110的高度位置。進而，根據該切斷裝置10，由於基於臨時溝GR1的高度位置進一步調整主軸部110的高度位置，因此能夠更適當地控制主軸部110的高度位置。其結果為，根據該切斷裝置10，能夠於工件W1上更確實地形成所需深度的溝槽。According to this cutting device 10, since the height position of each member is measured by the measuring device 400, the height position of the main shaft portion 110 can be appropriately controlled. Furthermore, according to this cutting device 10, since the height position of the main shaft part 110 is further adjusted based on the height position of the temporary groove GR1, the height position of the main shaft part 110 can be controlled more appropriately. As a result, according to this cutting apparatus 10, the groove|channel of a desired depth can be formed more reliably in the workpiece|work W1.

又，於切斷裝置10中，控制部500控制主軸部110，以基於工件W1的上表面的複數個部位之各者的高度位置，一邊調整主軸部110的高度位置並一邊於產品區PT1上形成溝槽。Further, in the cutting device 10, the control unit 500 controls the spindle unit 110 to adjust the height position of the spindle unit 110 on the product area PT1 based on the height position of each of the plurality of locations on the upper surface of the workpiece W1. form grooves.

根據該切斷裝置10，由於基於工件W1的上表面的複數個部位之各者的高度位置，一邊調整主軸部110的高度位置並一邊形成溝槽，因此，能夠於工件W1上更確實地形成所需深度的溝槽。According to this cutting device 10, since the groove is formed while adjusting the height position of the main shaft portion 110 based on the height position of each of the plurality of positions on the upper surface of the workpiece W1, the workpiece W1 can be formed more reliably. Grooves of desired depth.

[2. 實施方式 2] 於根據上述實施方式1之切斷裝置10中，臨時溝GR1是形成於工件W1的非產品區NPT1。然而，臨時溝GR1亦可不必形成於工件W1的非產品區NPT1。於根據本實施方式2之切斷裝置10A中，臨時溝形成於修整板600。以下，針對根據本實施方式2之切斷裝置10X進行詳細說明。再者，關於與根據上述實施方式1之切斷裝置10共同之部分，省略其說明。 [2. Embodiment 2] In the cutting device 10 according to the above-described Embodiment 1, the temporary groove GR1 is formed in the non-product area NPT1 of the workpiece W1. However, the temporary groove GR1 may not necessarily be formed in the non-product area NPT1 of the workpiece W1. In the cutting device 10A according to the second embodiment, temporary grooves are formed in the trimming plate 600 . Hereinafter, the cutting device 10X according to the second embodiment will be described in detail. In addition, about the part common to the cutting apparatus 10 based on the said Embodiment 1, the description is abbreviate|omitted.

＜ 2-1. 切斷裝置的構造＞ 第12圖是示意性地表示根據本實施方式2之切斷裝置10X的一部分的平面之圖。如第12圖所示，切斷裝置10X包括控制部500X及修整板600。 < 2-1. Structure of Cutting Device> FIG. 12 is a plan view schematically showing a part of the cutting device 10X according to the second embodiment. As shown in FIG. 12 , the cutting device 10X includes a control unit 500X and a trimming plate 600 .

控制部500X包括CPU、RAM及ROM等，且構成為根據資訊處理來進行各構成要素之控制。控制部500X構成為例如控制切斷單元100、工件保持單元200及測定器400。The control unit 500X includes a CPU, a RAM, a ROM, and the like, and is configured to control each component according to information processing. The control unit 500X is configured to control the cutting unit 100 , the workpiece holding unit 200 , and the measuring device 400 , for example.

修整板600用於刀片101的修整。藉由進行修整，能夠消除刀片101的堵塞、整理未使用的刀片101的形狀或進行在主軸部110上安裝新刀片101時的修圓。刀片101的修整，例如於更換主軸部110中的刀片101時或刀片堵塞時進行。The trim plate 600 is used for trimming of the blade 101 . By performing trimming, clogging of the inserts 101 can be eliminated, the shape of the unused inserts 101 can be adjusted, or the rounding can be performed when a new insert 101 is mounted on the spindle portion 110 . The dressing of the blade 101 is performed, for example, when the blade 101 in the spindle part 110 is replaced or when the blade is clogged.

＜ 2-2. 切斷裝置的動作＞ 第13圖是表示切斷裝置10X中的溝槽的形成順序之流程圖。該流程圖所示之處理是於主軸部110中進行刀片101的更換之後執行。 < 2-2. Operation of Cutting Device> FIG. 13 is a flowchart showing a procedure of forming grooves in the cutting device 10X. The processing shown in this flowchart is executed after the blade 101 is replaced in the spindle unit 110 .

參考第13圖，控制部500X控制主軸部110，使刀片101接觸CCS區塊300，以檢測主軸部110在高度方向上的控制座標原點（步驟S200）。控制部500X控制測定器400對CCS區塊300的上表面的高度位置進行測定，以測定基準高度（步驟S210）。Referring to FIG. 13 , the control unit 500X controls the spindle unit 110 to make the blade 101 contact the CCS block 300 to detect the control coordinate origin of the spindle unit 110 in the height direction (step S200 ). The control unit 500X controls the measuring device 400 to measure the height position of the upper surface of the CCS block 300 to measure the reference height (step S210 ).

於進行修整前，控制部500X控制測定器400，以對修整板600的上表面的複數個部位的高度位置進行測定（步驟S220）。再者，在修整板600的上表面中，待測定高度位置之部位並非必須為複數個部位，亦可為一個部位。控制部500X控制主軸部110，以基於測得之高度位置進行主軸部110的高度位置的第1次調整（步驟S230）。Before trimming, the control unit 500X controls the measuring device 400 to measure the height positions of a plurality of locations on the upper surface of the trimming plate 600 (step S220 ). Furthermore, on the upper surface of the trimming plate 600 , the location where the height position is to be measured does not necessarily have to be a plurality of locations, and may be one location. The control unit 500X controls the spindle unit 110 to perform the first adjustment of the height position of the spindle unit 110 based on the measured height position (step S230 ).

控制部500X控制主軸部110，以基於測得之修整板600的上表面的高度位置於修整板600形成臨時溝（步驟S240）。亦即，進行刀片101的修整。控制部500X控制測定器400，以對所形成之臨時溝的高度位置（深度）進行測定（步驟S250）。The control unit 500X controls the spindle unit 110 to form a temporary groove in the trimming plate 600 based on the measured height of the upper surface of the trimming plate 600 (step S240 ). That is, trimming of the blade 101 is performed. The control unit 500X controls the measuring device 400 to measure the height position (depth) of the formed temporary groove (step S250 ).

控制部500X判定臨時溝的深度是否在容許範圍內（步驟S260）。若判定為不在容許範圍內（於步驟S260中為「否」），則控制部500X控制主軸部110，以進行主軸部110的高度位置的第2次調整（步驟S270）。亦即，控制部500X生成主軸部110的高度位置的調整資料（高度位置調整資料），並基於該高度位置調整資料進行主軸部110的高度位置的微調整。The control unit 500X determines whether or not the depth of the temporary groove is within the allowable range (step S260 ). If it is determined that it is not within the allowable range (NO in step S260 ), the control unit 500X controls the main shaft part 110 to perform the second adjustment of the height position of the main shaft part 110 (step S270 ). That is, the control unit 500X generates adjustment data (height position adjustment data) of the height position of the main shaft part 110 , and performs fine adjustment of the height position of the main shaft part 110 based on the height position adjustment data.

在判定為臨時溝的深度在容許範圍內之後（於步驟S260中為「是」），或於步驟S270中生成高度位置調整資料後，控制部500X控制測定器400，以對保持於工件保持單元200上之工件W1的上表面的複數個部位的高度位置進行測定（步驟S280）。After it is determined that the depth of the temporary groove is within the allowable range (YES in step S260 ), or after the height position adjustment data is generated in step S270 , the control unit 500X controls the measuring device 400 to hold the workpiece in the workpiece holding unit. The height positions of a plurality of locations on the upper surface of the workpiece W1 on the 200 are measured (step S280 ).

控制部500X控制主軸部110，以於工件W1的產品區PT1上形成溝槽（步驟S290）。再者，當於步驟S270中生成高度位置調整資料時，控制部500X控制主軸部110，以基於高度位置調整資料調整主軸部110的高度位置，然後基於工件W1的上表面的高度位置於工件W1的產品區上PT1形成溝槽。另一方面，當於步驟S270中未生成高度位置調整資料時，控制部500X控制主軸部110，以基於工件W1的高度位置於工件W1的產品區PT1上形成溝槽。於任一情況下，控制部500X均控制主軸部110，以對應產品區PT1的各部位的高度位置，一邊調整高度位置並一邊於工件W1上形成溝槽。於該情況下，例如，於步驟S280中針對形成於產品區PT1中之各溝槽生成主軸部110的高度位置的校正資料，並基於該校正資料調整主軸部110的高度位置。The control part 500X controls the main shaft part 110 to form a groove on the product area PT1 of the workpiece W1 (step S290 ). Furthermore, when the height position adjustment data is generated in step S270, the control part 500X controls the spindle part 110 to adjust the height position of the spindle part 110 based on the height position adjustment data, and then adjusts the height position of the workpiece W1 based on the height position of the upper surface of the workpiece W1. A trench is formed on PT1 on the product area. On the other hand, when the height position adjustment data is not generated in step S270, the control unit 500X controls the spindle unit 110 to form a groove on the product area PT1 of the workpiece W1 based on the height position of the workpiece W1. In any case, the control unit 500X controls the spindle unit 110 to form grooves on the workpiece W1 while adjusting the height positions corresponding to the height positions of the respective parts of the product area PT1. In this case, for example, in step S280, correction data of the height position of the main shaft portion 110 is generated for each groove formed in the product area PT1, and the height position of the main shaft portion 110 is adjusted based on the correction data.

＜ 2-3. 特徵＞ 如上所述，於根據本實施方式2之切斷裝置10X中，控制部500X是控制主軸部110，以基於由測定器400測得之對象物（修整板600）的高度位置，於對象物（修整板600）上形成臨時溝。並且，控制部500X控制主軸部110，以基於由測定器400測得之臨時溝部分的高度位置調整主軸部110的高度位置，然後基於由測定器400測得之工件W1的上表面的複數個部位之各者的高度位置，於工件W1的產品區PT1上形成溝槽。 < 2-3. Features> As described above, in the cutting device 10X according to Embodiment 2, the control unit 500X controls the spindle unit 110 so as to determine At the height position, a temporary groove is formed on the object (the trimming plate 600 ). Then, the control unit 500X controls the spindle unit 110 to adjust the height position of the spindle unit 110 based on the height position of the temporary groove portion measured by the measuring device 400 , and then a plurality of pieces of the upper surface of the workpiece W1 measured by the measuring device 400 The height positions of each of the parts form grooves in the product area PT1 of the workpiece W1.

根據該切斷裝置10X，由於各構件的高度位置由測定器400測定，因此能夠適當地控制主軸部110的高度位置。進而，根據該切斷裝置10X，由於基於臨時溝的高度位置進一步調整主軸部110的高度位置，因此能夠更適當地控制主軸部110的高度位置。其結果為，根據該切斷裝置10X，能夠於工件W1上更確實地形成所需深度的溝槽。According to this cutting device 10X, since the height position of each member is measured by the measuring device 400, the height position of the main shaft portion 110 can be appropriately controlled. Furthermore, according to this cutting device 10X, since the height position of the main shaft portion 110 is further adjusted based on the height position of the temporary groove, the height position of the main shaft portion 110 can be controlled more appropriately. As a result, according to this cutting apparatus 10X, the groove|channel of a desired depth can be more reliably formed in the workpiece|work W1.

[3.實施方式3] 於根據上述實施方式1之切斷裝置10中，臨時溝GR1形成於工件W1的非產品區NPT1上，於根據上述實施方式2之切斷裝置10X中，臨時溝形成於修整板600上。於根據本實施方式3之切斷裝置10Y中，臨時溝形成於工件W1的非產品區NPT1及修整板600之兩者上。以下，針對根據本實施方式3之切斷裝置10Y進行詳細說明。再者，關於與根據上述實施方式1、2之切斷裝置10、10X共通之部分，省略其說明。[3. Embodiment 3] In the cutting device 10 according to the above-mentioned Embodiment 1, the temporary groove GR1 is formed on the non-product region NPT1 of the workpiece W1 , and in the cutting device 10X according to the above-mentioned Embodiment 2, the temporary groove is formed on the trimming plate 600 . In the cutting device 10Y according to Embodiment 3, temporary grooves are formed on both the non-product area NPT1 of the workpiece W1 and the trimming plate 600 . Hereinafter, the cutting device 10Y according to the third embodiment will be described in detail. In addition, about the part common to the cutting apparatus 10 and 10X based on the said Embodiment 1, 2, the description is abbreviate|omitted.

＜ 3-1. 切斷裝置的構造＞ 第14圖是示意性地表示根據本實施方式3之切斷裝置10Y的一部分的平面之圖。如第14圖所示，切斷裝置10Y包括控制部500Y。控制部500Y包括CPU、RAM及ROM等，且構成為對應資訊處理來進行各構成要素之控制。控制部500Y構成為例如控制切斷單元100、工件保持單元200及測定器400。 < 3-1. Configuration of Cutting Device> FIG. 14 is a plan view schematically showing a part of the cutting device 10Y according to the third embodiment. As shown in FIG. 14, the cutting device 10Y includes a control unit 500Y. The control unit 500Y includes a CPU, a RAM, a ROM, and the like, and is configured to control each component in accordance with information processing. The control unit 500Y is configured to control the cutting unit 100 , the workpiece holding unit 200 , and the measuring device 400 , for example.

＜ 3-2. 切斷裝置的動作＞ 第15圖是表示切斷裝置10Y中的溝槽的形成順序之第1流程圖。第16圖是表示切斷裝置10Y中的溝槽的形成順序之第2流程圖。第15圖的流程圖所示之處理是於主軸部110中進行刀片101的更換之後執行。第16圖的流程圖的處理是於第15圖的流程圖的處理後執行。 < 3-2. Operation of Cutting Device> FIG. 15 is a first flowchart showing the procedure of forming grooves in the cutting device 10Y. FIG. 16 is a second flowchart showing the procedure of forming grooves in the cutting device 10Y. The process shown in the flowchart of FIG. 15 is performed after the replacement|exchange of the blade 101 in the spindle part 110. The processing of the flowchart of FIG. 16 is executed after the processing of the flowchart of FIG. 15 .

再者，第15圖的流程圖中的步驟S300-S340的處理分別對應於第13圖的流程圖中的步驟S200-S280，第16圖的流程圖中的步驟S345-S365的處理分別對應於第11圖的流程圖中的步驟S140-S180。亦即，於根據本實施方式3之切斷裝置10Y中，控制部500Y於步驟S315中進行主軸部110的高度位置的第1次調整，於步驟S335中進行主軸部110的高度位置的第2次調整，於步驟S360中進行主軸部110的高度位置的第3次調整。Furthermore, the processes of steps S300 to S340 in the flowchart of FIG. 15 correspond to steps S200 to S280 of the flowchart of FIG. 13, respectively, and the processes of steps S345 to S365 of the flowchart of FIG. 16 correspond to Steps S140-S180 in the flowchart of FIG. 11 . That is, in the cutting device 10Y according to the third embodiment, the control unit 500Y performs the first adjustment of the height position of the main shaft portion 110 in step S315, and performs the second adjustment of the height position of the main shaft portion 110 in step S335. In the second adjustment, the third adjustment of the height position of the main shaft portion 110 is performed in step S360.

＜ 3-3. 特徵＞ 如上所述，於根據本實施方式3之切斷裝置10Y中，控制部500Y控制主軸部110，以基於由測定器400測得之對象物（修整板600及非產品區NPT1）的高度位置，於對象物（修整板600及非產品區NPT1）上形成臨時溝。並且，控制部500Y控制主軸部110，基於由測定器400測得之臨時溝部分的高度位置調整主軸部110的高度位置，然後基於由測定器400測得之工件W1的上表面的複數個部位之各者的高度位置，於工件W1的產品區PT1上形成溝槽。 < 3-3. Features> As described above, in the cutting device 10Y according to the third embodiment, the control unit 500Y controls the spindle unit 110 so as to be based on the objects (the dressing plate 600 and the non-product) measured by the measuring device 400 . At the height position of the area NPT1), a temporary groove is formed on the object (the trimming plate 600 and the non-product area NPT1). Then, the control unit 500Y controls the spindle unit 110 to adjust the height position of the spindle unit 110 based on the height position of the temporary groove portion measured by the measuring device 400 , and then based on the plurality of locations on the upper surface of the workpiece W1 measured by the measuring device 400 At the height positions of each of them, grooves are formed on the product area PT1 of the workpiece W1.

根據該切斷裝置10Y，由於各構件的高度位置由測定器400測定，因此能夠適當地控制主軸部110的高度位置。進而，根據該切斷裝置10Y，由於基於臨時溝的高度位置進一步調整主軸部110的高度位置，因此能夠更適當地控制主軸部110的高度位置。其結果為，根據該切斷裝置10Y，能夠於工件W1上更確實地形成所需深度的溝槽。According to this cutting device 10Y, since the height position of each member is measured by the measuring device 400, the height position of the main shaft portion 110 can be appropriately controlled. Furthermore, according to this cutting device 10Y, since the height position of the main shaft portion 110 is further adjusted based on the height position of the temporary groove, the height position of the main shaft portion 110 can be controlled more appropriately. As a result, according to this cutting apparatus 10Y, the groove|channel of a desired depth can be formed in the workpiece|work W1 more reliably.

[4. 其他實施方式 ] 上述實施方式的思想並不限於以上所說明之實施方式1-3。以下，針對可應用上述實施方式1-3的思想之其他實施方式的一例進行說明。 [4. Other Embodiments ] The idea of the above-described embodiments is not limited to the above-described Embodiments 1-3. Hereinafter, an example of another embodiment to which the ideas of the above-mentioned Embodiments 1 to 3 can be applied will be described.

上述實施方式1-3中，主軸部110在箭頭XY方向上移動。然而，主軸部110亦可不必在箭頭XY方向上移動。例如，亦可為工件保持單元200在箭頭XY方向上移動，而並非主軸部110在箭頭XY方向上移動，藉此，將工件W1搬送至主軸部110的下方的切斷位置。In the above-described Embodiment 1-3, the main shaft portion 110 moves in the arrow XY directions. However, the main shaft portion 110 need not necessarily move in the arrow XY directions. For example, the workpiece holding unit 200 may be moved in the arrow XY direction instead of the spindle part 110 in the arrow XY direction, whereby the workpiece W1 may be conveyed to the cutting position below the spindle part 110 .

又，於上述實施方式1-3中，是藉由使用CCS區塊300（輔助構件的一例），來檢測主軸部110在高度方向上的控制座標原點。然而，主軸部110在高度方向上的控制座標原點亦可不必藉由使用CCS區塊300來進行檢測。主軸部110在高度方向上的控制座標原點亦可藉由例如使用檢測刀片101的接觸之觸控感測器（輔助構件的一例）等進行檢測。於任一例中，均基於輔助構件的導通狀態進行檢測。又，檢測控制座標原點時接觸輔助構件之部分並非必須為刀片101。例如，亦可為主軸部110的刀片101以外的部分接觸輔助構件。Moreover, in the above-mentioned Embodiment 1-3, the control coordinate origin of the main shaft part 110 in the height direction is detected by using the CCS block 300 (an example of an auxiliary member). However, the origin of the control coordinates of the main shaft portion 110 in the height direction does not need to be detected by using the CCS block 300 . The origin of the control coordinates in the height direction of the main shaft portion 110 may be detected by, for example, using a touch sensor (an example of an auxiliary member) that detects the contact of the blade 101 . In either case, detection is performed based on the conduction state of the auxiliary member. In addition, the portion that contacts the auxiliary member when detecting the origin of the control coordinates does not necessarily have to be the blade 101 . For example, the part other than the blade 101 of the main shaft part 110 may contact the auxiliary member.

又，上述實施方式中，於一個切斷品中包括一個半導體晶片C1。然而，亦可於一個切斷品中包括複數個半導體晶片C1。In addition, in the above-described embodiment, one semiconductor wafer C1 is included in one cut product. However, a plurality of semiconductor wafers C1 may be included in one cut product.

又，本發明中的「對象物」是例如由刀片101切斷者。上述實施方式1中的「對象物」為工件W1的產品區PT1及非產品區NPT1，上述實施方式2中的「對象物」為工件W1的產品區PT1及修整板600，上述實施方式3中的「對象物」為工件W1的產品區PT1、非產品區NPT1及修整板600。然而，「對象物」並不限於該等寸象，亦可包括除此以外的對象。In addition, the "object" in the present invention is, for example, what is cut by the blade 101 . The "objects" in the first embodiment are the product area PT1 and the non-product area NPT1 of the workpiece W1, the "objects" in the second embodiment are the product area PT1 and the trimming plate 600 of the workpiece W1, and in the third embodiment The "objects" of the workpiece W1 are the product area PT1 , the non-product area NPT1 , and the trimming plate 600 of the workpiece W1 . However, "objects" are not limited to these dimensional images, and may also include objects other than these.

以上，針對本發明的實施方式進行了示例性說明。即，為進行示例性說明，揭示了詳細說明及附圖。由此，於詳細說明及附圖所記載之構成要素中，可能包括並非解決問題所必需的構成要素。因此，雖該等非必需的構成要素記載於詳細說明及附圖中，但不應直接認定該等非必需的構成要素是必需要素。In the above, the embodiment of the present invention has been exemplarily described. That is, for illustrative purposes, the detailed description and drawings are disclosed. Therefore, the components described in the detailed description and the drawings may include components that are not necessary to solve the problem. Therefore, although these non-essential components are described in the detailed description and the drawings, these non-essential components should not be directly identified as essential.

又，上述實施方式於各個方面僅為本發明的例示。上述實施方式可於本發明的範圍內進行各種改良和變更等。即，於實施本發明時，可根據實施方式適當採用具體的構造。In addition, the above-mentioned embodiment is only an illustration of this invention in every respect. The above-described embodiment can be variously improved, changed, and the like within the scope of the present invention. That is, when carrying out this invention, a specific structure can be suitably employ|adopted according to embodiment.

10,10A,10X,10Y:切斷裝置 100:切斷單元 101,101A:刀片 102,102A:主軸部主體 103,104:滑塊 105:支撐體 110,110A:主軸部 200:工件保持單元 201,201A:切斷台 202,202A:橡膠件 300,300A:CCS區塊 400:測定器 500,500X,500Y:控制部 600:修整板 C1:半導體晶片 G1,G2:導件 GR1:臨時溝 H1,H2,H3:高度 NPT1:非產品區 P1:位置 PT1:產品區 S100-S180,S200-S290,S300-S365:步驟 W1:工件 X,Y,Z:箭頭 θ:方向10, 10A, 10X, 10Y: cutting device 100: Cut off unit 101, 101A: Blades 102, 102A: Main body of main shaft 103, 104: Slider 105: Support body 110, 110A: Spindle part 200: Workpiece holding unit 201, 201A: Cut-off table 202, 202A: Rubber parts 300,300A: CCS block 400: Measurer 500, 500X, 500Y: Control Department 600: Trim Plate C1: Semiconductor wafer G1, G2: Guide GR1: Temporary groove H1,H2,H3: height NPT1: Non-Product Area P1: Location PT1: Product area S100-S180, S200-S290, S300-S365: Steps W1: Workpiece X,Y,Z: Arrow θ: direction

第1圖是示意性地表示根據實施方式1之切斷裝置的一部分的平面之圖。 第2圖是示意性地表示切斷裝置的一部分的正面的圖。 第3圖是用以說明作為比較對象之切斷裝置中的主軸部在高度方向上的控制座標原點的檢測順序的圖。 第4圖是用以說明作為比較對象之切斷裝置中的主軸部的高度位置的調整順序的圖。 第5圖是用以說明切斷裝置中的CCS(Contact Cutter Set；接觸刀具組)區塊的高度位置的測定方法之圖。 第6圖是用以說明切斷裝置中的工件的高度位置的測定方法之圖。 第7圖是用以說明待測定高度位置之部位的一例之圖，且是表示自工件W1的基板面側觀察到的情況之圖。 第8圖是用以說明於非產品區形成臨時溝之順序之圖。 第9圖是用以說明臨時溝的高度位置的測定方法之圖。 第10圖是用以說明切斷裝置中的溝槽的形成順序之圖。 第11圖是表示根據實施方式1之切斷裝置中的溝槽的形成順序之流程圖。 第12圖是示意性地表示根據實施方式2之切斷裝置的一部分的平面之圖。 第13圖是表示根據實施方式2之切斷裝置中的溝槽的形成順序之流程圖。 第14圖是示意性地表示根據實施方式3之切斷裝置的一部分的平面之圖。 第15圖是表示根據實施方式3之切斷裝置中的溝槽的形成順序之第1流程圖。 第16圖是表示根據實施方式3之切斷裝置中的溝槽的形成順序之第2流程圖。FIG. 1 is a plan view schematically showing a part of the cutting device according to the first embodiment. FIG. 2 is a view schematically showing a front side of a part of the cutting device. FIG. 3 is a diagram for explaining the detection procedure of the origin of the control coordinates in the height direction of the main shaft portion in the cutting device to be compared. FIG. 4 is a diagram for explaining the adjustment procedure of the height position of the main shaft portion in the cutting device to be compared. FIG. 5 is a diagram for explaining a method of measuring the height position of a CCS (Contact Cutter Set) block in the cutting device. FIG. 6 is a diagram for explaining a method of measuring the height position of the workpiece in the cutting device. FIG. 7 is a diagram for explaining an example of a position to be measured for a height position, and is a diagram showing a situation as seen from the substrate surface side of the workpiece W1. FIG. 8 is a diagram for explaining the sequence of forming the temporary groove in the non-product area. Fig. 9 is a diagram for explaining a method of measuring the height position of the temporary groove. FIG. 10 is a diagram for explaining the sequence of forming grooves in the cutting device. FIG. 11 is a flowchart showing the procedure of forming grooves in the cutting device according to the first embodiment. FIG. 12 is a plan view schematically showing a part of the cutting device according to the second embodiment. FIG. 13 is a flowchart showing the procedure of forming grooves in the cutting device according to the second embodiment. FIG. 14 is a plan view schematically showing a part of the cutting device according to the third embodiment. FIG. 15 is a first flowchart showing the procedure of forming grooves in the cutting device according to the third embodiment. FIG. 16 is a second flowchart showing the procedure of forming grooves in the cutting device according to the third embodiment.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic storage information (please note in the order of storage institution, date and number) none Foreign deposit information (please note in the order of deposit country, institution, date and number) none

S100-S180:步驟S100-S180: Steps

Claims (8)

一種切斷裝置，其包括： 主軸部，其可調整高度位置且安裝有刀片，該刀片構成為將包括工件之對象物加以切斷； 控制部，其構成為控制該主軸部；及， 測定器，其構成為測定該對象物的上表面的高度位置；並且， 該控制部控制該主軸部，以基於由該測定器測得之該對象物的高度位置，於該對象物上形成臨時溝， 該控制部控制該主軸部，以基於由該測定器測得之該臨時溝部分的高度位置，來調整該主軸部的高度位置，然後基於由該測定器測得之該工件的上表面的複數個部位之各者的高度位置，於該工件上形成溝槽。A cutting device comprising: a main shaft part, which can be adjusted in height and has a blade mounted thereon, and the blade is configured to cut off an object including a workpiece; a control portion configured to control the spindle portion; and, a measuring device configured to measure the height position of the upper surface of the object; and, The control part controls the main shaft part to form a temporary groove on the object based on the height position of the object measured by the measuring device, The control part controls the main shaft part to adjust the height position of the main shaft part based on the height position of the temporary groove part measured by the measuring device, and then based on the plural number of the upper surface of the workpiece measured by the measuring device The height positions of each of the positions form grooves on the workpiece. 如請求項1所述之切斷裝置，其中，該控制部控制該主軸部，以基於該工件的上表面的複數個部位之各者的高度位置，一邊調整該主軸部的高度位置並一邊形成該溝槽。The cutting device according to claim 1, wherein the control section controls the spindle section so as to adjust the height position of the spindle section based on the height position of each of the plurality of positions on the upper surface of the workpiece to form the groove. 如請求項1或請求項2所述之切斷裝置，其中，該臨時溝形成於用於該刀片的修整之修整板上。The cutting device of claim 1 or claim 2, wherein the temporary groove is formed on a dressing plate used for dressing of the blade. 如請求項1或請求項2所述之切斷裝置，其中，該臨時溝形成於該工件的非產品部分上， 該溝槽形成於該工件的產品部分上。The cutting device of claim 1 or claim 2, wherein the temporary groove is formed on the non-product portion of the workpiece, The groove is formed on the product portion of the workpiece. 如請求項4所述之切斷裝置，其中，該工件包括複數個半導體晶片， 該非產品部分不包括該半導體晶片。The cutting device of claim 4, wherein the workpiece includes a plurality of semiconductor wafers, The non-product portion does not include the semiconductor wafer. 如請求項1至請求項5中任一項所述之切斷裝置，其中，該工件為經樹脂成形之基板。The cutting device according to any one of claim 1 to claim 5, wherein the workpiece is a resin-molded substrate. 如請求項1至請求項6中任一項所述之切斷裝置，其進而包括： 複數個切斷台；及， 輔助構件，其數量少於該切斷台的數量；並且， 該工件在由該複數個切斷台中之任一者所保持之狀態下被切斷， 藉由使該主軸部接觸該輔助構件，而進行該主軸部在高度方向上的基準位置的檢測。The cutting device according to any one of claim 1 to claim 6, further comprising: a plurality of cutting tables; and, auxiliary members, the number of which is less than the number of the cutting table; and, the workpiece is cut in a state held by any one of the plurality of cutting tables, By bringing the main shaft portion into contact with the auxiliary member, the detection of the reference position of the main shaft portion in the height direction is performed. 一種切斷品的製造方法，其使用如請求項1至請求項7中任一項所述之切斷裝置，且包括： 第1測定工序，其測定該對象物的上表面的高度位置； 第1溝槽形成工序，其基於該第1測定工序中的測定結果，於該對象物上形成臨時溝； 第2測定工序，其測定該臨時溝部分的高度位置； 調整工序，其基於該第2測定工序中的測定結果，調整該主軸部的高度位置；及， 第2溝槽形成工序，其於該調整工序之後，基於該工件的上表面的複數個部位之各者的高度位置的測定結果，於該工件上形成溝槽。A method for manufacturing a cut product, using the cutting device according to any one of claim 1 to claim 7, and comprising: a first measuring step of measuring the height position of the upper surface of the object; a first groove forming step of forming a temporary groove on the object based on the measurement result in the first measurement step; a second measuring step of measuring the height position of the temporary groove portion; an adjustment step of adjusting the height position of the main shaft portion based on the measurement result in the second measurement step; and, In the second groove forming step, after the adjusting step, grooves are formed on the workpiece based on the measurement result of the height position of each of a plurality of locations on the upper surface of the workpiece.
TW110117429A 2020-06-24 2021-05-14 Cutting device and method of manufacturing cut product TWI834970B (en)

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