TWI806114B - Cutting device and method of manufacturing cut product - Google Patents

Abstract

An object of the present invention is to provide a cutting device or the like capable of detecting the height position of a workpiece at a lower cost. Means for solving the problems of the present invention is a cutting device configured to cut a workpiece. This cutting device includes: a light source, an imaging unit, and a detection unit. A light source configured to project a light pattern onto the workpiece. The imaging unit is configured to capture the light pattern and generate the first image data. The detection unit is configured to detect the height position of the workpiece based on the first image data. The angle formed by the direction in which the light source projects the light pattern and the direction in which the imaging unit captures the light pattern is larger than 0°.

Description

Cutting device and method of manufacturing cut product

The present invention relates to a cutting device and a method for manufacturing a cut product.

Japanese Patent Laid-Open No. 2019-45418 (Patent Document 1) discloses a laser processing device that divides semiconductor wafers to be processed. In this laser processing device, light in a specific wavelength band is irradiated onto the upper surface of the object to be processed, and the height position of the object to be processed is detected based on the interference light between the reflected light and the reference light (refer to Patent Document 1).

[Prior Art Literature] (patent documents) Patent Document 1: Japanese Patent Laid-Open No. 2019-45418.

(Problem to be solved by the invention) In the laser processing device disclosed in the aforementioned Patent Document 1, the height position of the object to be processed is detected by using expensive components such as a laser light source. That is, when the technique of the above-mentioned Patent Document 1 is used, it will cost a lot to detect the height position of the object to be processed.

The present invention was made to solve the above problems, and an object of the present invention is to provide a cutting device or the like capable of detecting the height position of a workpiece at a lower cost.

(means used to solve a problem) A cutting device according to one aspect of the present invention is configured to cut a workpiece. This cutting device includes: a light source, an imaging unit, and a detection unit. A light source configured to project a light pattern onto the workpiece. The imaging unit is configured to capture the light pattern and generate the first image data. The detection unit is configured to detect the height position of the workpiece based on the first image data. The angle formed by the direction in which the light source projects the light pattern and the direction in which the imaging unit captures the light pattern is larger than 0°.

Moreover, the manufacturing method of the cut product according to another aspect of this invention is a manufacturing method using the said cutting apparatus. The manufacturing method of the cut-off product includes the following steps: projecting a light pattern onto a workpiece; photographing the light pattern and generating image data; detecting the height position of the workpiece based on the image data; and cutting the workpiece based on the height position of the workpiece to Manufacture cutouts.

(effect of invention) According to the present invention, it is possible to provide a cutting device or the like capable of detecting the height position of a workpiece at a lower cost.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or equivalent part in a figure, and description is not repeated.

[1. Structure of cutting device] Fig. 1 is a plan view schematically showing a part of the cutting device 10 according to the present embodiment. FIG. 2 is a front view schematically showing a part of the cutting device 10 . In addition, in FIG. 1 and FIG. 2, the directions indicated by the arrows XYZ are common.

The cutting device 10 is configured to separate the workpiece W1 into a plurality of cut products (full cut) by cutting the workpiece W1. Furthermore, the cutting device 10 is configured to form a groove (half cut) in the workpiece W1 by removing a part of the workpiece W1. That is, the concept of the term "cutting" included in the name of the cutting device 10 (cutting device) includes separating the cutting object into plural pieces and removing a part of the cutting object. The workpiece W1 is, for example, a package substrate. In the package substrate, a substrate on which a semiconductor chip is mounted or a lead frame is sealed with resin. That is, the workpiece W1 is a resin-molded substrate. In the following description, the surface on the sealing side of the workpiece W1 is also referred to as a "package surface", and the surface on the substrate or lead frame side is referred to as a "substrate surface".

As an example of the package substrate, a Ball Grid Array (BGA) package substrate, a Land Grid Array (LGA) package substrate, a Chip Size Package (Chip Size Package, CSP) package substrate can be cited. , Light Emitting Diode (Light Emitting Diode, LED) package substrate, quad flat no-lead (Quad Flat No-leaded, QFN) package substrate.

As shown in FIGS. 1 and 2 , the cutting device 10 includes a cutting unit 100 , a workpiece holding unit 200 , a Contact Cutter Set (CCS) block 300 , a camera unit 400 and a control unit 500 .

The cutting unit 100 is configured to cut the workpiece W1 and includes a main shaft portion 110 , sliders 103 and 104 , and a support 105 . Moreover, the cutting device 10 is a double-spindle structure including two sets of main shaft parts 110 and sliders 103 and 104, but it may also be a single-spindle structure including only one set of main shaft parts 110 and sliders 103 and 104. .

The support body 105 is a metal rod-shaped member, and is configured to move in the arrow Y direction along a guide (not shown). On the supporting body 105 , a guide G1 extending along the long side direction (arrow X direction) is formed.

The slider 104 is a metal rectangular plate-shaped member, and is attached to the support body 105 in a movable state in the arrow X direction along the guide G1. On the slider 104, a guide G2 extending along the long side direction (arrow Z direction) is formed. The slider 103 is a metal rectangular plate member, and is attached to the slider 104 in a movable state in the height direction (arrow Z direction) along the guide G2.

The main shaft part 110 includes a main shaft part main body 102 and a blade 101 mounted on the main shaft part main body 102 . The blade 101 cuts the workpiece W1 by rotating at a high speed, thereby singulating the workpiece W1 into a plurality of cut products (semiconductor packages). The spindle unit main body 102 is attached to the slider 103 . The spindle unit 110 is configured to move to a desired position in the cutting device 10 as the sliders 103 and 104 and the support body 105 move.

The workpiece holding unit 200 is configured to hold the workpiece W1 and includes a cutting table 201 and a rubber member 202 arranged on the cutting table 201 . In the present embodiment, the cutting device 10 constituted by a double cutting table having two workpiece holding units 200 is exemplified. Furthermore, the number of workpiece holding units 200 is not limited to two, and may be one, or three or more.

The rubber member 202 is a plate-shaped member made of rubber, which is an example of an adsorption member, and a plurality of holes are formed in the rubber member 202 . The workpiece W1 is arranged on the rubber member 202 . The cutting table 201 holds the workpiece W1 by suctioning the workpiece W1 placed on the rubber member 202 from the package surface side below. The cutting table 201 is rotatable in the θ direction. The workpiece W1 is cut by the spindle portion 110 from the substrate surface side in a state held by the workpiece holding unit 200 . Furthermore, the workpiece holding unit 200 does not necessarily include the rubber member 202 , and may include other members that absorb the workpiece W1 disposed above from the lower side of the package surface instead of the rubber member 202 .

The CCS block 300 is used to detect the origin of the control coordinates in the control of the height position of the spindle unit 110 . The control coordinate origin is a reference position for control of the main shaft portion 110 in the height direction, and includes, for example, an electrical origin.

FIG. 3 is a diagram for explaining the detection procedure of the control coordinate origin using the CCS block 300 . In the cutting device 10, the height H1 of the CCS block 300 is stored in advance. As shown in FIG. 3 , in the cutting device 10 , by bringing the blade 101 into contact with the CCS block 300 , the origin of the control coordinates of the main shaft portion 110 in the height direction is detected.

The imaging unit 400 is configured to project a light pattern onto the upper surface of the workpiece W1 while the workpiece W1 is positioned below the imaging unit 400 , and to image the upper surface of the workpiece W1 on which the light pattern is projected. The imaging unit 400 is movable in an up and down direction (arrow Z direction). Based on the image data generated by the imaging unit 400, the following various detections are performed.

FIG. 4 is a diagram schematically showing the structure of the imaging unit 400 . As shown in FIG. 4 , the imaging unit 400 includes a light source 410 and an imaging unit 420 . The light source 410 is configured to project a light pattern onto the upper surface of the workpiece W1. The imaging unit 420 is configured to image the upper surface of the workpiece W1 and generate image data. That is, the light source 410 makes light incident on the workpiece W1, and the imaging unit 420 captures the light reflected by the workpiece W1.

The angle formed by the direction in which the light source 410 projects a light pattern onto the upper surface of the workpiece W1 and the direction in which the imaging unit 420 captures images of the upper surface of the workpiece W1 is A1. The angle A1 is greater than 0°, preferably 30°-60°, and more preferably 40°-50°. The light source 410 projects a light pattern toward the upper surface of the workpiece W1 from obliquely above the upper surface of the workpiece W1 . The imaging unit 420 images the upper surface of the workpiece W1 from directly above the workpiece W1.

FIG. 5 is a diagram schematically showing the structure of a light source 410 . As shown in FIG. 5 , the light source 410 includes an LED lighting 411 and an optical system 412 . The LED lighting 411 is configured to emit light toward the optical system 412 .

The optical system 412 includes a projection lens 413 , an aperture 414 and a slit member 415 . In the optical system 412, a slit member 415, a diaphragm 414, and a projection lens 413 are sequentially arranged from the LED lighting 411 side. The projection lens 413 is composed of a biconvex lens designed with a unit conjugate ratio. The diaphragm 414 is arranged at the focal point of the projection lens 413 . Telecentric illumination is achieved by disposing the aperture 414 at the focal point of the projection lens 413 . In the slit member 415, linear slits are formed. The size of the slit, for example 2 mm in length and 0.05 mm in width.

Fig. 6 is a diagram showing an example of a light pattern projected onto the workpiece W1. As shown in FIG. 6 , when the LED lighting 411 emits light toward the optical system 412 , a light pattern L1 having the same shape (line shape) as the slit formed in the slit member 415 is projected onto the workpiece W1 .

Referring again to FIGS. 1 and 2, the control unit 500 includes a central processing unit (Central Processing Unit, CPU), a random access memory (Random Access Memory, RAM) and a read only memory (Read Only Memory, ROM), etc. , and is configured to control each constituent element according to information processing. The control unit 500 is configured to control the cutting unit 100 , the workpiece holding unit 200 , and the imaging unit 400 , for example.

In the cutting device 10, full cutting and half cutting of the workpiece W1 are performed. In order to form a groove with a desired depth on the workpiece W1 by half-cutting, it is necessary to detect the height position of the workpiece W1 with high precision. In the cutting device 10, the height position of the workpiece W1 is detected with high precision. Furthermore, in the cutting device 10, the depth of the groove formed in the workpiece W1, the state of wear of the blade 101, the burr formed in the workpiece W1, and the state of deterioration of the rubber member 202 are detected. Next, the reason for detecting the height position of the workpiece W1 in the cutting device 10 will be described.

[2. Reason for detection of altitude position] FIG. 7 is a front view including the workpiece W1 held on the workpiece holding unit 200 . As shown in FIG. 7 , when the workpiece W1 is cut, the rubber member 202 is arranged on the upper surface of the cutting table 201 , and the workpiece W1 is arranged on the upper surface of the rubber member 202 .

In the cutting device 10, if the heights of the components such as the height H2 of the workpiece W1 and the height H3 of the rubber member 202 are stored in advance based on the dimensional values at the design stage, it may not necessarily be necessary to detect the height position of the workpiece W1. However, the height information of each component may not be accurate. For example, the rubber member 202 may bend due to suction from the cutting table 201 . Also, the rubber member 202 may be worn over time. Also, the workpiece W1 may be warped by heat or the like in the previous steps. In addition, the workpiece W1 may be warped due to errors or the like caused by machining components such as the main shaft portion 110 .

Thus, due to various factors, the actual height of each member may not match the previously memorized height. Therefore, it is necessary to actually detect the height position of the workpiece W1 to grasp the actual height position of the workpiece W1.

[3. Various detection principles] ＜3-1. The detection principle of height position＞ FIG. 8 is a diagram showing how the light pattern projected by the light source 410 changes according to the height position of the upper surface of the workpiece W1. As shown in FIG. 8, in the cutting device 10, when the height position of the upper surface of the workpiece W1 is the reference position Z1, the light pattern emitted by the light source 410 is projected to the position A1. Also, when the height position of the upper surface of the workpiece W1 is position Z1+α, the light pattern is projected to position A2, and when the height position of the upper surface of the workpiece W1 is position Z1-α, the light pattern is projected to position A3.

In the cutting device 10 , a reference position Z2 (not shown) of the imaging unit 400 in the height direction is determined in advance. At the start of detection of the height position of the workpiece W1, the height position of the imaging unit 400 is the reference position Z2. When the height position of the imaging unit 400 is the reference position Z2, and the height position of the upper surface of the workpiece W1 is the reference position Z1, the focus of the light pattern is aligned on the upper surface of the workpiece W1. That is, in the cutting device 10, such reference positions Z1 and Z2 are prepared in advance. In the cutting device 10, reference positions Z1 and Z2 are stored in advance.

FIG. 9 is a diagram for explaining an example of a light pattern projected onto the workpiece W1. As shown in FIG. 9 , when the imaging unit 400 exists at the reference position Z2 and the upper surface of the workpiece W1 exists at the reference position Z1 , the light pattern L2 is projected onto the workpiece W1 . Also, when the imaging unit 400 exists at the reference position Z2 and the upper surface of the workpiece W1 exists at the position Z1-α, the light pattern L3 is projected onto the workpiece W1. Also, when the imaging unit 400 exists at the reference position Z2 and the upper surface of the workpiece W1 exists at the position Z1+α, the light pattern L4 is projected onto the workpiece W1.

That is, the projection position of the light pattern changes according to the height position of the upper surface of the workpiece W1. The reason is that the angle formed by the direction in which the light source 410 projects the light pattern onto the upper surface of the workpiece W1 and the direction in which the imaging unit 420 images the upper surface of the workpiece W1 is greater than 0°.

When the imaging unit 400 exists at the reference position Z2 and the upper surface of the workpiece W1 exists at the reference position Z1 , the light pattern L2 is located at the center of the arrow Y direction in the image captured by the imaging unit 420 . Since the height position of the upper surface of the workpiece W1 is shifted from the reference position Z1, the projected position of the light pattern is shifted in the arrow Y direction. Furthermore, although the focus of the light pattern L2 is aligned, the focus of the light patterns L3 and L4 is not aligned.

As described above, when detection of the height position of the upper surface of the workpiece W1 starts, the height position of the imaging unit 400 is the reference position Z2. At this time, when the light pattern is projected onto the center of the arrow Y direction of the image captured by the imaging unit 420 , the control unit 500 determines the height position of the upper surface of the workpiece W1 as the reference position Z1 . On the other hand, when the light pattern is projected to a position shifted from the center of the arrow Y direction of the image captured by the imaging unit 420, the control unit 500 adjusts the height position of the imaging unit 400 so that the light pattern moves to the center. . In the cutting device 10, the relationship between the movement amount of the imaging unit 400 and the height position of the upper surface of the workpiece W1 is stored in advance. The control unit 500 calculates the height position of the upper surface of the workpiece W1 based on the movement amount of the imaging unit 400 in the height direction (arrow Z direction). By the method described above, the height position of the upper surface of the workpiece W1 is detected.

<3-2. Measuring Principle of Groove Depth> FIG. 10 is a diagram for explaining an example of a light pattern projected on the workpiece W1 when the groove GR1 is formed on the workpiece W1. As shown in FIG. 10, a groove GR1 extending in the arrow Y direction is formed on the upper surface of the workpiece W1.

The light source 410 is configured to project the light pattern L5 onto the region of the groove GR1 across the upper surface of the workpiece W1. The light pattern L5 extends in a direction substantially perpendicular to the direction in which the groove GR1 extends. Furthermore, the direction in which the light pattern L5 extends is not necessarily substantially perpendicular to the direction in which the groove GR1 extends. It is only necessary that the light pattern L5 straddles the groove GR1. The light pattern L5 comprises portions P1, P2, P3. The parts P1 and P3 are projected onto the upper surface of the workpiece W1 other than the groove GR1, and the part P2 is projected onto the groove GR1. Since the height position of the upper surface of the workpiece W1 other than the groove GR1 is different from the height position of the groove GR1, the portions P1, P3 and P2 are projected to different positions in the arrow Y direction.

For example, the control unit 500 adjusts the height position of the imaging unit 400 so that the portions P1 and P3 are moved to the center in the arrow Y direction of the image captured by the imaging unit 420 . Thereafter, the control unit 500 adjusts the height position of the imaging unit 400 so that the portion P2 is moved to the center in the arrow Y direction. The control unit 500 calculates the depth of the groove GR1 based on the amount of movement of the imaging unit 400 in the height direction when the portion P2 is moved to the center in the arrow Y direction. By the method described above, the depth of the groove GR1 is detected. In addition, in this example, the parts P1 and P3 are moved to the center of the arrow Y direction of the image first, but the part P2 may be moved to the center of the arrow Y direction first.

＜3-3. The detection principle of the wear state of the blade＞ FIG. 11 is a partial cross-sectional view schematically showing a workpiece W1 in which a groove GR2 is formed by a blade 101 . As shown in FIG. 11, if the insert 101 is not worn, the groove GR21 should be formed on the workpiece W1. That is, if the side surface of the blade 101 is not thinned due to wear, the groove GR21 should be formed in the workpiece W1. The sidewalls of the groove GR21 extend substantially vertically downward from the upper surface of the workpiece W1. On the other hand, when the blade 101 is worn and the side surface of the blade 101 becomes thinner, for example, a groove GR2 will be formed on the workpiece W1. The side walls of the groove GR2 are gently inclined from the upper surface of the workpiece W1 and extend downward.

FIG. 12 is a diagram for explaining an example of a light pattern projected onto the workpiece W1 when the groove GR2 is formed with the worn blade 101 . As shown in FIG. 12, a groove GR2 extending in the arrow Y direction is formed on the upper surface of the workpiece W1.

The light source 410 is configured to project the light pattern L6 onto the region of the groove GR2 across the upper surface of the workpiece W1. The light pattern L6 extends in a direction substantially perpendicular to the direction in which the groove GR2 extends. Furthermore, the direction in which the light pattern L6 extends is not necessarily substantially perpendicular to the direction in which the groove GR2 extends. It is only necessary that the light pattern L6 straddles the groove GR2. The light pattern L6 comprises portions P4, P5, P6, P7, P8. Parts P4 and P8 are projected onto the upper surface of the workpiece W1 other than the groove GR2, and parts P5, P6 and P7 are projected onto the groove GR2.

Since the height position of the upper surface of the workpiece W1 other than the groove GR2 is different from the height position of the groove GR2, the portions P4, P8 and the portions P5, P6, and P7 are projected to different positions in the arrow Y direction. In particular, because the sidewall of the trench GR2 is gentle, the portion P5 extends obliquely from the portion P4 and gradually approaches the portion P6, and the portion P7 extends obliquely from the portion P8 and gradually approaches the portion P6.

The control unit 500 detects the slopes of the portions P5 and P7 based on, for example, the image captured by the imaging unit 420 . When the slopes of the portions P5 and P7 are gentler than the predetermined slope, the control unit 500 determines that the blade 101 is worn, otherwise, determines that the blade 101 is not worn.

For example, when the difference between the X coordinate (coordinate in the X direction of the arrow) of the connecting part of the part P4 and the part P5 and the X coordinate of the connecting part of the part P5 and the part P6 is more than a predetermined value, the control part 500 determines the slope of the part P5 gentle. Moreover, the control unit 500 can determine that the blade 101 is worn when both the slopes of the portions P5 and P7 are gentle, and can also determine that the blade 101 is worn when the slope of at least one of the portions P5 and P7 is gentle. By the method described above, the wear state of the blade 101 is detected.

＜3-4. Detection principle related to burrs＞ For example, when the workpiece W1 is a QFN package substrate using a metal lead frame, burrs may be generated on the metal terminal portion of the workpiece W1 by cutting the workpiece W1.

Fig. 13 is a diagram showing an example of burrs formed on the workpiece W1. As shown in FIG. 13 , in the workpiece W1 , burrs 511 are formed on the terminals 510 . The terminal 510 is made of metal.

FIG. 14 is a diagram for explaining an example of a light pattern projected onto the workpiece W1 when the terminal 510 is formed with the burr 511 . As shown in FIG. 14, a groove GR3 extending in the arrow Y direction is formed on the upper surface of the workpiece W1. In the workpiece W1, a plurality of terminals 510 are arranged along the groove GR3.

The light source 410 is configured to project a light pattern L7 onto a region spanning the groove GR3 and the terminal 510 on the upper surface of the workpiece W1. The light pattern L7 extends in a direction substantially perpendicular to the direction in which the groove GR3 extends. Furthermore, the direction in which the light pattern L7 extends is not necessarily substantially perpendicular to the direction in which the groove GR3 extends. It is only necessary that the light pattern L7 straddles the groove GR3. The light pattern L7 comprises portions P9, P10, P11. The parts P9 and P11 are projected onto the upper surface of the workpiece W1 other than the groove GR3, and the part P10 is projected onto the groove GR3.

A burr 511 is formed on the terminal 510 . Compared with the portion without the burr 511 , the burr 511 is partially raised, so the projected positions of the portions P9 and P11 are shifted in the arrow Y direction near the burr 511 .

The control unit 500 determines, for example, based on the image captured by the imaging unit 420 , whether or not there is a raised portion in the portion of the terminal 510 formed on the upper surface of the workpiece W1 . For example, the control unit 500 determines whether there is a raised portion in the terminal 510 based on whether the projected positions of the portions P9 and P11 deviate by a predetermined amount or more in the arrow Y direction near the terminal 510 . The control unit 500 determines that the burrs 511 are formed on the workpiece W1 when it is determined that there is a raised portion. By the method described above, the burrs 511 formed on the workpiece W1 are detected.

In addition, in the cutting device 10 , not only the presence or absence of the burrs 511 in the workpiece W1 but also the height of the burrs 511 are detected. Next, the detection principle of the height of the burr 511 will be described. For example, the control unit 500 moves a position away from the groove GR3 by a predetermined amount in the portion P9 (a position not shifted in the arrow Y direction in the portion P9) to the center of the image captured by the imaging unit 420 in the arrow Y direction, Adjust the height position of the camera unit 400 . Afterwards, the control unit 500 adjusts the height position of the imaging unit 400 so that the position of the part P9 with the largest deviation in the direction of the arrow Y (the position where the burr 511 is most raised) is moved to the center of the direction of the arrow Y. The control unit 500 calculates the height of the burr 511 based on the amount of movement of the imaging unit 400 in the height direction when the position with the largest deviation in the arrow Y direction in the portion P9 is moved to the center in the arrow Y direction. By the above method, the height of the burr 511 is detected. Furthermore, in this example, the position farther away from the groove GR3 in the portion P9 by a predetermined amount is first moved to the center of the image in the arrow Y direction, but it is also possible to first shift the position in the portion P9 that is most shifted in the arrow Y direction. Move to the center in the Y direction of the arrow.

＜3-5. Principle of detection of deterioration state of rubber parts＞ As described above, also in the cutting device 10, the workpiece W1 is fully cut. The rubber member 202 on which the workpiece W1 is placed deteriorates due to the full cut of the workpiece W1.

FIG. 15 is a diagram for explaining an example of a light pattern projected onto the rubber member 202 . As shown in FIG. 15 , grooves GR4 and GR5 are formed on the rubber member 202 through full cutting of the workpiece W1 . Each of the grooves GR4 and GR5 extends in the arrow Y direction. A plurality of holes B1 for attracting the workpiece W1 are formed in the rubber member 202 .

The light source 410 is configured to project the light pattern L8 onto the region of the grooves GR4 and GR5 straddling the upper surface of the rubber member 202 . The light pattern L8 extends in a direction substantially perpendicular to the direction in which the grooves GR4 and GR5 extend. Furthermore, the direction in which the light pattern L8 extends is not necessarily substantially perpendicular to the direction in which the grooves GR4 and GR5 extend. It is only necessary that the light pattern L8 straddles the grooves GR4 and GR5. The light pattern L8 includes portions P12, P13, P14, P15, P16, P17. Parts P12, P14, P15, P17 are projected onto the upper surface of the rubber member 202 except the grooves GR4, GR5. Part P13 projects into groove GR4 and part P16 projects into groove GR5.

If the area of the upper surface of the rubber member 202 other than the grooves GR4, GR5, etc. is narrowed, the contact area between the workpiece W1 and the rubber member 202 becomes small, and thus the adsorption of the workpiece W1 becomes unstable. That is, if the portions P12, P14, P15, P17, etc. are short, the adsorption of the workpiece W1 becomes unstable.

For example, when the lengths of the portions P12, P14, P15, P17, etc. are shorter than a predetermined length, the control unit 500 determines that the rubber member 202 is deteriorated. Furthermore, the control unit 500 can determine that the rubber member 202 is deteriorated when all of the parts P12, P14, P15, P17, etc. are shorter than a predetermined length, or it can be determined that at least some of the parts P12, P14, P15, P17, etc. are shorter than a predetermined length , it is determined that the rubber member 202 is degraded. In addition, the control unit 500 may also determine that the rubber member 202 is deteriorated when the portions P13, P16, etc. are longer than a predetermined length. At this time, the control unit 500 may also determine that the rubber member 202 is deteriorated when all of the portions P13, P16, etc. are longer than a predetermined length, or may determine that the rubber member 202 is deteriorated when at least some of the portions P13, P16, etc. are longer than a predetermined length. By the method described above, the deterioration state of the rubber member 202 is detected.

[4. Action] ＜4-1. Manufacturing procedure of cut products＞ Fig. 16 is a flow chart showing the manufacturing procedure of cut products. The processing shown in this flowchart is executed by the control unit 500 after the workpiece W1 to be cut is prepared.

Referring to FIG. 16 , the control unit 500 controls the main shaft unit 110 so that the blade 101 contacts the CCS block 300 to detect the origin of the control coordinates of the main shaft unit 110 in the height direction (step S100 ). The control unit 500 controls the imaging unit 400 to detect height positions of a plurality of locations on the upper surface of the workpiece W1 held on the workpiece holding unit 200 (step S110 ). Furthermore, at this time, the workpiece W1 is located below the imaging unit 400 .

Fig. 17 is a flowchart showing the specific processing contents in step S110 in Fig. 16 . Referring to FIG. 17 , the control unit 500 controls the imaging unit 400 to project a light pattern onto the upper surface of the workpiece W1 (step S200 ). The control unit 500 determines whether the light pattern is located at the center of the arrow Y direction (see FIG. 9 , etc.) of the image captured by the imaging unit 400 (hereinafter also simply referred to as “the center of the image”) (step S210 ).

If it is determined that the light emitting pattern is located at the center of the image (YES in step S210 ), the control unit 500 determines the height position of the workpiece W1 as the reference position Z1 (step S220 ).

On the other hand, if it is determined that the light emitting pattern is not located at the center of the image ("No" in step S210), the control unit 500 moves the position of the light pattern to the center of the image, and moves the imaging unit 400 in the vertical direction. Move (step S230). The control unit 500 calculates the height position of the workpiece W1 based on the movement amount of the imaging unit 400 (step S240 ).

The control unit 500 determines whether the height positions of all predetermined parts have been detected (step S250 ). When it is determined that the height positions of all predetermined parts have been detected (YES in step S250 ), the processing shown in this flowchart ends. On the other hand, if it is determined that the height positions of all predetermined parts have not been detected (NO in step S250 ), the control unit 500 repeats the processing of steps S200 to S250 after adjusting the position of the workpiece holding unit 200 .

Referring again to FIG. 16 , when the process of step S110 ends, the control unit 500 adjusts the height position of the spindle unit 110 based on the measurement result of the height position of the workpiece W1 (step S120 ). The control unit 500 controls the spindle unit 110 to cut the workpiece W1 while adjusting the height position of the spindle unit 110 (step S130 ). Through the above processing, cutting of the workpiece W1 is performed.

<4-2. Detection operation of groove depth> FIG. 18 is a flowchart showing the detection operation of the depth of the groove formed in the workpiece W1. The process shown in this flowchart is executed by the control unit 500 in a state where the workpiece W1 having the groove formed on the upper surface is positioned below the imaging unit 400 .

Referring to FIG. 18 , the control unit 500 controls the imaging unit 400 to project a light pattern onto an area including the groove on the upper surface of the workpiece W1 (step S300 ). The control unit 500 determines whether the light pattern projected onto the upper surface of the workpiece W1 other than the groove is located at the center of the image captured by the imaging unit 400 (step S310 ).

If it is determined that the light pattern projected onto the upper surface of the workpiece W1 other than the groove is not located at the center of the image ("No" in step S310), the control unit 500 moves the position of the light pattern to the center of the image. In this way, the camera unit 400 is moved in the up and down direction (step S320 ). On the other hand, if it is determined that the light pattern projected onto the upper surface of the workpiece W1 other than the groove is located at the center of the image (YES in step S310 ), the process moves to step S330 .

After that, the control unit 500 moves the imaging unit 400 in the vertical direction so that the position of the light pattern projected on the groove is moved to the center of the image (step S330 ). The control unit 500 calculates the depth of the groove formed in the workpiece W1 based on the movement amount of the imaging unit 400 in step S330 (step S340 ).

<4-3. Detection operation of blade wear state> FIG. 19 is a flowchart showing the detection operation of the wear state of the blade 101 . The process shown in this flowchart is executed by the control unit 500 in a state where the workpiece W1 having the groove formed on the upper surface is positioned below the imaging unit 400 .

Referring to FIG. 19 , the control unit 500 controls the imaging unit 400 to project a light pattern onto the area including the groove on the upper surface of the workpiece W1 (step S400 ). Based on the image captured by the imaging unit 400, the control unit 500 detects, for example, a portion P5 (connected portion) that connects the portion P4 (the right line) and the portion P6 (the left line) shown in FIG. 12 (step S410).

The control unit 500 determines whether the slope of the portion P5 (connection portion) is gentler than a predetermined slope (step S420 ). If it is determined that the slope of the portion P5 is gentler than the predetermined slope (YES in step S420 ), the control unit 500 determines that the side surface of the blade 101 is worn (step S430 ). On the other hand, if it is determined that the slope of the portion P5 is not gentler than the predetermined slope ("No" in step S420), the control unit 500 determines that the side surface of the blade 101 is not worn (step S440).

<4-4. Detection operation related to burr> FIG. 20 is a flowchart showing the detection operation of the presence or absence of burrs 511 formed on the workpiece W1. The processing shown in this flowchart is executed by the control unit 500 in a state where the cut workpiece W1 is located below the imaging unit 400 .

Referring to FIG. 20 , the control unit 500 controls the imaging unit 400 to project a light pattern onto an area including the terminal 510 on the upper surface of the workpiece W1 (step S500 ).

The control unit 500 determines whether there is a raised area at the terminal 510 based on the image captured by the camera unit 400 (step S510 ). If it is determined that there is a raised area (YES in step S510 ), the control unit 500 determines that a burr 511 is formed on the workpiece W1 (step S520 ). On the other hand, if it is determined that there is no raised area ("No" in step S510), the control unit 500 determines that no burr 511 is formed on the workpiece W1 (step S530).

FIG. 21 is a flowchart showing the detection operation of the height of the burr 511 formed on the workpiece W1. The processing shown in this flowchart is executed by the control unit 500 in a state where the cut workpiece W1 is located below the imaging unit 400 .

Referring to FIG. 21 , the control unit 500 controls the imaging unit 400 to project a light pattern onto an area including the terminal 510 on the upper surface of the workpiece W1 (step S600 ). The control unit 500 determines whether the part of the light pattern that is far from the groove GR3 (FIG. 14) by a predetermined amount (in FIG. 14, the part that is not shifted in the direction of the arrow Y in the part P9) is located in the image captured by the imaging unit 400 the center of (step S610).

If it is determined that the part of the light pattern that is far away from the groove GR3 by a predetermined amount is not located at the center of the image ("No" in step S610), the control unit 500 moves the part of the light pattern that is far away from the groove GR3 by a predetermined amount to the image. The camera unit 400 is moved in the up and down direction in the manner of the center of the center (step S620 ). On the other hand, if it is determined that the portion of the light-emitting pattern that is far away from the groove GR3 by a predetermined amount is located at the center of the image ("Yes" in step S610), the process moves to step S630.

Afterwards, the control unit 500 moves the part of the light pattern projected onto the most raised part of the burr 511 (in FIG. 14, the part with the largest deviation in the direction of the arrow Y in the part P9) to the center of the image, The camera unit 400 is moved up and down (step S630 ). The control unit 500 calculates the height of the burr 511 based on the movement amount of the imaging unit 400 in step S630 (step S640 ).

<4-5. Detection operation of the deterioration state of rubber parts> FIG. 22 is a flowchart showing the detection operation of the deterioration state of the rubber material 202 . The processing shown in this flowchart is executed by the control unit 500 in a state in which the rubber material 202 on which the workpiece W1 is not placed on the upper surface is located below the imaging unit 400 .

Referring to FIG. 22 , the control unit 500 controls the imaging unit 400 to project a light pattern onto the upper surface of the rubber member 202 (step S700 ). The control unit 500 detects the linear light pattern projected onto the upper surface of the rubber member 202 excluding the groove based on the image captured by the imaging unit 400 (step S710 ).

The control unit 500 determines whether the linear light pattern projected onto the upper surface of the rubber member 202 other than the groove is shorter than a predetermined length (step S720 ). If it is determined that the light emitting pattern is shorter than the predetermined length ("Yes" in step S720), the control unit 500 determines that the rubber member 202 is deteriorated (step S730). On the other hand, if it is determined that the light-emitting pattern is not shorter than the predetermined length ("No" in step S720), the control unit 500 determines that the rubber member 202 is not degraded (step S740).

[5. Features] As described above, in the cutting device 10 according to this embodiment, the angle formed by the direction in which the light source 410 projects the light pattern onto the workpiece W1 and the direction in which the imaging unit 420 captures the light pattern is greater than 0°. Therefore, the projection position of the light pattern on the upper surface of the workpiece W1 changes according to the height position of the upper surface of the workpiece W1. Therefore, according to the cutting device 10 , the height position of the upper surface of the workpiece W1 can be detected based on the projected position of the light pattern without using expensive components.

Furthermore, since the cutting device 10 has the above features, the cutting device 10 can detect the wear state of the blade 101 based on the shape of the light pattern projected on the workpiece W1 without using expensive components.

Furthermore, since the cutting device 10 has the above features, the cutting device 10 can detect the burrs 511 formed on the workpiece W1 based on the shape of the light pattern projected on the workpiece W1 without using expensive components.

Furthermore, since the cutting device 10 has the above features, the cutting device 10 can detect the deterioration state of the rubber material 202 based on the shape of the light pattern projected on the rubber material 202 without using expensive parts.

[6. Other implementation modes] The idea of the above-mentioned embodiments is not limited to the above-described embodiments. Hereinafter, an example of other embodiment to which the idea of the above-mentioned embodiment can be applied will be described.

In the above embodiments, the light pattern projected by the light source 410 is linear. However, the shape of the light pattern is not limited thereto. The shape of the light pattern may be circular or polygonal, for example.

In addition, in the above-mentioned embodiment, the cutting device 10 has the detection function of the height position of the workpiece W1, the detection function of the depth of the groove formed on the workpiece W1, the detection function of the deterioration state of the blade 101, and the detection function of the burr formed on the workpiece W1. 511 detection function, and the detection function of the degradation state of the rubber part 202. However, the cutting device 10 does not have to have all functions. For example, the cutting device 10 may have only some of the functions described above.

In addition, in the above-mentioned embodiment, the main shaft part 110 moves in the arrow XY direction. However, the main shaft part 110 does not need to move in the arrow XY direction. For example, the workpiece W1 may be conveyed to the cutting position below the spindle unit 110 by moving the workpiece holding unit 200 in the arrow XY direction instead of the spindle unit 110 in the arrow XY direction.

In addition, in the above-mentioned embodiment, by using the CCS block 300, the origin of the control coordinates of the main shaft portion 110 in the height direction is detected. However, the origin of the control coordinates of the spindle portion 110 in the height direction does not need to be detected by using the CCS block 300 . The origin of the control coordinates of the spindle portion 110 in the height direction can also be detected by using a touch sensor for detecting contact with the blade 101 , for example. Also, when detecting the origin of the control coordinates, the part that contacts the CCS block 300 etc. does not have to be the blade 101 . For example, the CCS block 300 and the like may be contacted by a part of the main shaft part 110 other than the blade 101 .

In addition, in the cutting device 10 according to the above-mentioned embodiment, in order to realize the above-mentioned various functions, an imaging unit 400 is additionally provided. However, it is not necessary to separately provide the imaging unit 400 to realize the various functions described above.

Fig. 23 is a plan view schematically showing a part of the cutting device 10A. As shown in FIG. 23 , the cutting device 10A does not include the imaging unit 400 in the above-mentioned embodiment.

The cutting device 10A includes a first position confirmation camera 700 and a second position confirmation camera 800 . The first position confirmation camera 700 and the second position confirmation camera 800 are not shown in FIG. 1 . A predetermined mark is printed on the upper surface of the workpiece W1. This mark indicates, for example, the cutting position of the workpiece W1. The first position confirmation camera 700 photographs the workpiece W1 and generates image data. The control unit 500 confirms the position of the workpiece W1 on the workpiece holding unit 200 and the cutting position of the workpiece W1 based on the position of the mark shown in the image data. The imaging by the first position checking camera 700 is performed before cutting the workpiece W1.

In addition, the second position checking camera 800 photographs the workpiece W1 after cutting, and generates image data. Based on the generated image data, the control unit 500 confirms the position of the workpiece W1 on the workpiece holding unit 200 , the cutting position and cutting width of the workpiece W1 , and the like. Based on the image data generated by the second position confirmation camera 800, it is determined whether there is a problem with the cutting position and cutting width of the workpiece W1.

For example, the first position confirmation camera 700 or the second position confirmation camera 800 may also include the configuration of the imaging unit 400 in the above-mentioned embodiment. In this way, cost reduction and space saving can be achieved by including the imaging unit 400 in an existing camera.

Also, for example, when the first position confirmation camera 700 includes the imaging unit 400, when confirming the cutting position of the workpiece W1, the height position of the workpiece W1 is also detected, so that the cutting of the workpiece W1 can be detected more accurately. The height position of the workpiece W1 at the position.

Also, for example, when the second position confirmation camera 800 includes the configuration of the imaging unit 400, the detection related to the burr of the workpiece W1 or the wear state of the side surface of the blade 101 can be realized by minimally moving the workpiece W1. The detection etc. are carried out after cutting the workpiece W1.

The embodiments of the present invention have been described above as examples. That is, the detailed description and accompanying drawings are disclosed for purposes of illustration. Therefore, among the constituent elements described in the detailed description and the attached drawings, constituent elements not necessary for solving the problem may be included. Therefore, it should not be assumed that these unnecessary constituent elements are essential just because they are described in the detailed description and the accompanying drawings.

In addition, the above-mentioned embodiment is merely an illustration of the present invention in all points. Various improvements and changes can be made to the above-mentioned embodiment within the scope of the present invention. That is, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment.

10,10A: cut-off device 100: cut off unit 101: blade 102: The main body of the main shaft 103,104: slider 105: support body 110: Main shaft part 200: Workpiece holding unit 201: cutting table 202: Rubber parts (an example of adsorption member) 300:CCS block 400: camera unit 410: light source 411: LED lighting 412: Optical system 413: Projection lens 414: Aperture 415: Slit component 420: Camera Department 500: control unit (an example of detection unit) 510: terminal 511: rough edge 700: First position confirmation camera 800: second position confirmation camera A1: angle A1～A3: Position B1: hole G1, G2: guide GR1～GR5, GR21: Groove H1～H3: Height L1～L8: light pattern P1～P17: part S100～S130, S200～S250, S300～S340, S400～S440, S500～S530, S600～S640, S700～S740: steps W1: Workpiece X,Y,Z: Arrows Z1: Reference position Z1+α, Z1－α: position θ: direction

Fig. 1 is a plan view schematically showing a part of the cutting device. Fig. 2 is a front view schematically showing a part of the cutting device. FIG. 3 is a diagram for explaining the detection procedure of the control coordinate origin using the CCS block. FIG. 4 is a diagram schematically showing the structure of an imaging unit. Fig. 5 is a diagram schematically showing the structure of a light source. Fig. 6 is a diagram showing an example of a light pattern projected onto a workpiece. Fig. 7 is a front view including a workpiece held on a workpiece holding unit. Fig. 8 is a diagram showing how the light pattern projected by the light source changes according to the height position of the upper surface of the workpiece. Fig. 9 is a diagram for explaining an example of a light pattern projected onto a workpiece. FIG. 10 is a diagram for explaining an example of a light pattern projected onto a workpiece when grooves are formed on the workpiece. Fig. 11 is a partial sectional view schematically showing a workpiece in which a groove is formed by a blade. FIG. 12 is a diagram for explaining an example of a light pattern projected on a workpiece when grooves are formed by a worn blade. Fig. 13 is a diagram showing an example of burrs formed on a workpiece. FIG. 14 is a diagram for explaining an example of a light pattern projected onto a workpiece when a burr is formed on a terminal. Fig. 15 is a diagram for explaining an example of a light pattern projected onto a rubber member. Fig. 16 is a flow chart showing the manufacturing procedure of cut products. Fig. 17 is a flowchart showing the specific processing contents in step S110 in Fig. 16 . Fig. 18 is a flowchart showing the detection operation of the depth of the groove formed in the workpiece. Fig. 19 is a flowchart showing the detection operation of the wear state of the blade. Fig. 20 is a flowchart showing the detection operation of the presence or absence of burrs formed on the workpiece. Fig. 21 is a flowchart showing the detection operation of the height of the burr formed on the workpiece. Fig. 22 is a flowchart showing the detection operation of the deterioration state of the rubber material. Fig. 23 is a plan view schematically showing a part of a cutting device in another embodiment.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

10: Cut-off device

100: cut off unit

101: blade

102: The main body of the main shaft

103,104: slider

105: support body

110: Main shaft part

200: Workpiece holding unit

201: cutting table

202: Rubber parts (an example of adsorption member)

300:CCS block

400: camera unit

500: control unit (an example of detection unit)

W1: Workpiece

X,Y,Z: Arrows

θ: direction

21~22: Substrate

Claims (9)

A cutting device configured to cut a workpiece, and comprising: a light source configured to project a light pattern onto the workpiece; an imaging unit configured to capture the light pattern and generate first image data and, a detection unit, which is configured to detect the height position of the workpiece based on the first image data; and, the angle formed by the direction in which the light source projects the light pattern and the direction in which the imaging unit captures the light pattern is greater than 0 °. The cutting device according to claim 1, wherein the detection unit is configured to detect the height position of the workpiece based on the position of the light pattern captured by the imaging unit. The cutting device according to claim 1 or 2, wherein the workpiece is a resin molded substrate. The cutting device according to claim 1 or 2, wherein: the light source is configured to project the light pattern toward the workpiece from an oblique direction of the workpiece. The cutting device according to claim 1 or 2, further comprising: a blade, wherein a groove is formed in the workpiece; the light source is configured to project the light pattern to an area including the groove in the workpiece, The detection unit is configured based on the light pattern captured by the imaging unit The shape of the blade is detected to detect the wear state of the blade. The cutting device according to claim 1 or 2, wherein: the light source is configured to project the light pattern to an area including the metal terminal formed on the workpiece; The shape of the light pattern is used to detect the burrs of the workpiece. The cutting device according to claim 1 or 2, further comprising: an adsorption member on which the workpiece is placed, wherein the light source is configured to project the light pattern onto the adsorption member, and the imaging unit is configured to photograph the adsorption member. The detection unit is configured to detect the deterioration state of the adsorption member based on the shape of the light pattern on the adsorption member captured by the imaging unit. The cutting device according to claim 1 or 2, wherein: the imaging unit is configured to photograph the marks formed on the workpiece and generate second image data, and the detection unit is configured to use the second image The data detects the cutting position of the workpiece. A method of manufacturing a cut product, which uses the cutting device according to any one of Claims 1 to 7, and includes the following steps: projecting a light pattern onto the workpiece; photographing the light pattern, and generating image data ; detecting the height position of the workpiece based on the image data; and cutting the workpiece based on the height position of the workpiece to manufacture the cut-off product.

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