TWI806114B - Cutting device and method of manufacturing cut product - Google Patents
Cutting device and method of manufacturing cut product Download PDFInfo
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- TWI806114B TWI806114B TW110128330A TW110128330A TWI806114B TW I806114 B TWI806114 B TW I806114B TW 110128330 A TW110128330 A TW 110128330A TW 110128330 A TW110128330 A TW 110128330A TW I806114 B TWI806114 B TW I806114B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
本發明的問題是要提供一種切斷裝置等,其能夠以更低成本檢測工件的高度位置。本發明用來解決問題的手段是一種切斷裝置,其構成為將工件加以切斷。該切斷裝置具備:光源、攝像部、檢測部。光源,被構成為將光圖案投影至工件。攝像部,被構成為拍攝光圖案,並生成第一圖像資料。檢測部,被構成為基於第一圖像資料檢測工件的高度位置。光源投影光圖案之方向與攝像部拍攝光圖案之方向所形成的角度大於0°。An object of the present invention is to provide a cutting device or the like capable of detecting the height position of a workpiece at a lower cost. Means for solving the problems of the present invention is a cutting device configured to cut a workpiece. This cutting device includes: a light source, an imaging unit, and a detection unit. A light source configured to project a light pattern onto the workpiece. The imaging unit is configured to capture the light pattern and generate the first image data. The detection unit is configured to detect the height position of the workpiece based on the first image data. The angle formed by the direction in which the light source projects the light pattern and the direction in which the imaging unit captures the light pattern is larger than 0°.
Description
本發明關於一種切斷裝置及切斷品的製造方法。The present invention relates to a cutting device and a method for manufacturing a cut product.
日本特開2019-45418號公報(專利文獻1)揭示一種雷射加工裝置,其對半導體晶圓等待加工物進行分割。於該雷射加工裝置中,將特定波長段的光照射至待加工物的上表面,基於反射光與基準光的干涉光檢測待加工物的高度位置(參考專利文獻1)。Japanese Patent Laid-Open No. 2019-45418 (Patent Document 1) discloses a laser processing device that divides semiconductor wafers to be processed. In this laser processing device, light in a specific wavelength band is irradiated onto the upper surface of the object to be processed, and the height position of the object to be processed is detected based on the interference light between the reflected light and the reference light (refer to Patent Document 1).
[先前技術文獻] (專利文獻) 專利文獻1:日本特開2019-45418號公報。[Prior Art Literature] (patent documents) Patent Document 1: Japanese Patent Laid-Open No. 2019-45418.
(發明所欲解決的問題) 於上述專利文獻1所揭示之雷射加工裝置中,是藉由使用雷射光源等昂貴的零件來檢測待加工物的高度位置。亦即,當使用上述專利文獻1的技術時,為了檢測待加工物的高度位置,會花費較高成本。(Problem to be solved by the invention) In the laser processing device disclosed in the aforementioned Patent Document 1, the height position of the object to be processed is detected by using expensive components such as a laser light source. That is, when the technique of the above-mentioned Patent Document 1 is used, it will cost a lot to detect the height position of the object to be processed.
本發明是為解決如上問題而完成的,其目的在於提供一種切斷裝置等,其能夠以更低成本檢測工件的高度位置。The present invention was made to solve the above problems, and an object of the present invention is to provide a cutting device or the like capable of detecting the height position of a workpiece at a lower cost.
(用於解決問題的手段) 根據本發明的一方面的切斷裝置,其構成為將工件加以切斷。該切斷裝置具備:光源、攝像部、檢測部。光源,被構成為將光圖案投影至工件。攝像部,被構成為拍攝光圖案,並生成第一圖像資料。檢測部,被構成為基於第一圖像資料檢測工件的高度位置。光源投影光圖案之方向與攝像部拍攝光圖案之方向所形成的角度大於0°。(means used to solve a problem) A cutting device according to one aspect of the present invention is configured to cut a workpiece. This cutting device includes: a light source, an imaging unit, and a detection unit. A light source configured to project a light pattern onto the workpiece. The imaging unit is configured to capture the light pattern and generate the first image data. The detection unit is configured to detect the height position of the workpiece based on the first image data. The angle formed by the direction in which the light source projects the light pattern and the direction in which the imaging unit captures the light pattern is larger than 0°.
又,根據本發明的另一方面的切斷品的製造方法是使用上述切斷裝置的製造方法。該切斷品的製造方法包含以下步驟:將光圖案投影至工件;拍攝光圖案,並生成圖像資料;基於圖像資料檢測工件的高度位置;及,基於工件的高度位置切斷工件,以製造切斷品。Moreover, the manufacturing method of the cut product according to another aspect of this invention is a manufacturing method using the said cutting apparatus. The manufacturing method of the cut-off product includes the following steps: projecting a light pattern onto a workpiece; photographing the light pattern and generating image data; detecting the height position of the workpiece based on the image data; and cutting the workpiece based on the height position of the workpiece to Manufacture cutouts.
(發明的功效) 根據本發明,可提供一種切斷裝置等,其能夠以更低成本檢測工件的高度位置。(effect of invention) According to the present invention, it is possible to provide a cutting device or the like capable of detecting the height position of a workpiece at a lower cost.
以下,一邊參考圖式一邊對本發明的實施方式進行詳細說明。再者,對圖中相同或相當的部分附加上相同符號,不再重複說明。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or equivalent part in a figure, and description is not repeated.
[1.切斷裝置的構造]
第1圖是示意性地表示根據本實施方式的切斷裝置10的一部分的平面之圖。第2圖是示意性地表示切斷裝置10的一部分的正面之圖。再者,於第1圖及第2圖中,箭頭XYZ各自所表示之方向是共通的。[1. Structure of cutting device]
Fig. 1 is a plan view schematically showing a part of the
切斷裝置10構成為藉由切斷工件W1而將工件W1單片化為複數個切斷品(全切)。又,切斷裝置10構成為藉由移除工件W1的一部分而於工件W1形成溝槽(半切)。亦即,切斷裝置10的名稱(切斷裝置)中所包含之用語「切斷」的概念包括將切斷對象分離成複數個以及移除切斷對象的一部分。工件W1例如為封裝體基板。於封裝體基板中,安裝有半導體晶片之基板或引線框架由樹脂密封。亦即,工件W1為樹脂成形後的基板。於以下說明中,亦將工件W1的密封側的面記為「封裝體面」,將基板或引線框架側的面記為「基板面」。The
作為封裝體基板的一例,可列舉球柵陣列(Ball Grid Array, BGA)封裝體基板、柵格陣列(Land Grid Array,LGA)封裝體基板、晶片尺寸封裝(Chip Size Package,CSP)封裝體基板、發光二極體(Light Emitting Diode,LED)封裝體基板、四方無引線(Quad Flat No-leaded,QFN)封裝體基板。As an example of the package substrate, a Ball Grid Array (BGA) package substrate, a Land Grid Array (LGA) package substrate, a Chip Size Package (Chip Size Package, CSP) package substrate can be cited. , Light Emitting Diode (Light Emitting Diode, LED) package substrate, quad flat no-lead (Quad Flat No-leaded, QFN) package substrate.
如第1圖及第2圖所示,切斷裝置10包括切斷單元100、工件保持單元200、接觸刀具組(Contact Cutter Set, CCS)區塊300、攝像單元400及控制部500。As shown in FIGS. 1 and 2 , the
切斷單元100構成為將工件W1加以切斷,且包括主軸部110、滑塊103和104、及支撐體105。再者,切斷裝置10為包括兩組主軸部110與滑塊103和104之組的雙主軸構造,但亦可為僅包括一組主軸部110與滑塊103和104之組的單主軸構造。The
支撐體105為金屬製棒狀構件,構成為沿未圖示之導件在箭頭Y方向上移動。於支撐體105,形成有沿長側方向(箭頭X方向)延伸之導件G1。The
滑塊104為金屬製的矩形形狀的板狀構件,且以可沿導件G1在箭頭X方向移動之狀態安裝於支撐體105。於滑塊104,形成有沿長側方向(箭頭Z方向)延伸之導件G2。滑塊103為金屬製的矩形形狀的板狀構件,且以可沿導件G2在高度方向(箭頭Z方向)移動之狀態安裝於滑塊104。The
主軸部110包括主軸部主體102、及安裝於主軸部主體102之刀片101。刀片101藉由高速旋轉,而將工件W1切斷,從而將工件W1單片化為複數個切斷品(半導體封裝體)。主軸部主體102安裝於滑塊103。主軸部110構成為隨滑塊103和104及支撐體105的移動而移動至切斷裝置10內的期望位置。The
工件保持單元200構成為保持工件W1,且包括切斷台201、及配置於切斷台201上之橡膠件202。於本實施方式中,例示有具有兩個工件保持單元200之雙切割台構成的切斷裝置10。再者,工件保持單元200的數量並不限於兩個,亦可為一個,亦可為三個以上。The
橡膠件202為橡膠製的板狀構件,是吸附構件的一例,於橡膠件202中形成有複數個孔。於橡膠件202上配置有工件W1。切斷台201藉由自下方的封裝面側對配置於橡膠件202上之工件W1進行吸附而保持工件W1。切斷台201可沿θ方向旋轉。工件W1是在由工件保持單元200保持之狀態下,自基板面側被主軸部110切斷。再者,工件保持單元200並非必須包括橡膠件202,亦可包括自下方的封裝面側對配置於上方之工件W1進行吸附之其他構件來代替橡膠件202。The
CCS區塊300用來檢測主軸部110的高度位置的控制中的控制座標原點。控制座標原點為主軸部110在高度方向上的控制上的基準位置,例如包括電性原點。The
第3圖是用來說明使用了CCS區塊300之控制座標原點的檢測順序的圖。於切斷裝置10中,預先記憶有CCS區塊300的高度H1。如第3圖所示,於切斷裝置10中,藉由使刀片101接觸CCS區塊300,而檢測主軸部110在高度方向上的控制座標原點。FIG. 3 is a diagram for explaining the detection procedure of the control coordinate origin using the
攝像單元400構成為在工件W1位於攝像單元400的下方之狀態下將光圖案投影至工件W1的上表面,並拍攝投影有該光圖案之工件W1的上表面。攝像單元400能夠沿上下方向(箭頭Z方向)移動。基於攝像單元400所生成之圖像資料進行下述各種檢測。The
第4圖是示意性地表示攝像單元400的構造的圖。如第4圖所示,攝像單元400包括光源410及攝像部420。光源410構成為將光圖案投影至工件W1的上表面。攝像部420構成為拍攝工件W1的上表面,並生成圖像資料。亦即,光源410使光線入射至工件W1,攝像部420拍攝由工件W1反射之光線。FIG. 4 is a diagram schematically showing the structure of the
光源410將光圖案投影至工件W1的上表面之方向與攝像部420拍攝工件W1的上表面之方向所形成的角度為A1。角度A1大於0°,較佳為30°~60°,進而較佳為40°~50°。光源410將光圖案自工件W1的上表面的斜上方朝工件W1的上表面投影。攝像部420自工件W1的正上方拍攝工件W1的上表面。The angle formed by the direction in which the
第5圖是示意性地表示光源410的構造的圖。如第5圖所示,光源410包括LED照明411及光學系統412。LED照明411構成為朝向光學系統412發光。FIG. 5 is a diagram schematically showing the structure of a
光學系統412包括投影透鏡413、光圈414及狹縫構件415。於光學系統412中,自LED照明411側依序配置有狹縫構件415、光圈414及投影透鏡413。投影透鏡413由單位共軛比設計的雙凸透鏡構成。光圈414配置於投影透鏡413的焦點位置。藉由將光圈414配置於投影透鏡413的焦點位置而實現遠心照明。在狹縫構件415,形成有線狀狹縫。狹縫的大小,例如長度為2 mm,寬度為0.05 mm。The
第6圖是表示投影至工件W1之光圖案的一例的圖。如第6圖所示,若LED照明411朝向光學系統412發光,則形狀與形成於狹縫構件415之狹縫相同(線狀)的光圖案L1便被投影至工件W1上。Fig. 6 is a diagram showing an example of a light pattern projected onto the workpiece W1. As shown in FIG. 6 , when the
再次參考第1圖及第2圖,控制部500包括中央處理單元(Central Processing Unit,CPU)、隨機存取記憶體(Random Access Memory,RAM)及唯讀記憶體(Read Only Memory,ROM)等,且構成為根據資訊處理而控制各構成要素。控制部500例如構成為控制切斷單元100、工件保持單元200及攝像單元400。Referring again to FIGS. 1 and 2, the
於切斷裝置10中,進行工件W1的全切及半切。為了透過半切於工件W1上形成期望深度的溝槽,需要高精度地檢測工件W1的高度位置。於切斷裝置10中,高精度地檢測工件W1的高度位置。又,於切斷裝置10中,檢測形成於工件W1之溝槽的深度、刀片101的磨損狀態、形成於工件W1之毛邊、及橡膠件202的劣化狀態。隨後,對在切斷裝置10中檢測工件W1的高度位置之理由進行說明。In the
[2.需要檢測高度位置的理由]
第7圖是包含保持於工件保持單元200上之工件W1的前視圖。如第7圖所示,於切斷工件W1時,橡膠件202配置於切斷台201的上表面,工件W1配置於橡膠件202的上表面。[2. Reason for detection of altitude position]
FIG. 7 is a front view including the workpiece W1 held on the
於切斷裝置10中,若基於設計階段的尺寸值而預先記憶有工件W1的高度H2及橡膠件202的高度H3等各構件的高度,則亦可認為並非一定需要檢測工件W1的高度位置。然而,各構件的高度資訊未必準確。例如,橡膠件202可能會因來自切斷台201的吸附而撓曲。又,橡膠件202可能會隨時間變化而被磨損。又,工件W1可能會因之前的步驟中的熱等而撓曲。又,工件W1可能會因由主軸部110等構成零件的加工所引起的誤差等而撓曲。In the
如此,由於各種因素,有時各構件的實際高度與預先記憶的高度並不一致。因此,需要實際檢測工件W1的高度位置,以掌握工件W1的實際高度位置。Thus, due to various factors, the actual height of each member may not match the previously memorized height. Therefore, it is necessary to actually detect the height position of the workpiece W1 to grasp the actual height position of the workpiece W1.
[3.各種檢測原理]
<3-1.高度位置的檢測原理>
第8圖是表示光源410所投影之光圖案是如何根據工件W1的上表面的高度位置而變化的圖。如第8圖所示,於切斷裝置10中,當工件W1的上表面的高度位置為基準位置Z1時,由光源410發出之光的圖案投影至位置A1。又,當工件W1的上表面的高度位置為位置Z1+α時,光圖案投影至位置A2,當工件W1的上表面的高度位置為位置Z1-α時,光圖案投影至位置A3。[3. Various detection principles]
<3-1. The detection principle of height position>
FIG. 8 is a diagram showing how the light pattern projected by the
於切斷裝置10中,預先決定攝像單元400在高度方向上的基準位置Z2(未圖示)。於工件W1的高度位置的檢測開始時刻,攝像單元400的高度位置為基準位置Z2。當攝像單元400的高度位置為基準位置Z2,且工件W1的上表面的高度位置為基準位置Z1時,光圖案的焦點在工件W1的上表面對準。亦即,於切斷裝置10中,預先準備這樣的基準位置Z1、Z2。於切斷裝置10中,預先記憶有基準位置Z1、Z2。In the
第9圖是用以說明投影至工件W1之光圖案的示例的圖。如第9圖所示,當攝像單元400存在於基準位置Z2,且工件W1的上表面存在於基準位置Z1時,有光圖案L2投影至工件W1。又,當攝像單元400存在於基準位置Z2,且工件W1的上表面存在於位置Z1-α時,有光圖案L3投影至工件W1。又,當攝像單元400存在於基準位置Z2,且工件W1的上表面存在於位置Z1+α時,有光圖案L4投影至工件W1。FIG. 9 is a diagram for explaining an example of a light pattern projected onto the workpiece W1. As shown in FIG. 9 , when the
亦即,光圖案的投影位置根據工件W1的上表面的高度位置而發生變化。其原因在於,光源410將光圖案投影至工件W1的上表面之方向與攝像部420拍攝工件W1的上表面之方向所形成的角度大於0°。That is, the projection position of the light pattern changes according to the height position of the upper surface of the workpiece W1. The reason is that the angle formed by the direction in which the
當攝像單元400存在於基準位置Z2,且工件W1的上表面存在於基準位置Z1時,光圖案L2位於攝像部420拍攝到之圖像中的箭頭Y方向的中心。因工件W1的上表面的高度位置自基準位置Z1偏移,故光圖案之投影位置在箭頭Y方向上發生偏移。再者,雖然光圖案L2的焦點有對準,但光圖案L3、L4的焦點未對準。When the
如上所述,於工件W1的上表面的高度位置的檢測開始時,攝像單元400的高度位置為基準位置Z2。此時,當光圖案被投影至攝像部420拍攝到之圖像的箭頭Y方向的中心時,控制部500確定工件W1的上表面的高度位置為基準位置Z1。另一方面,當光圖案被投影至自攝像部420拍攝到之圖像的箭頭Y方向的中心偏移的位置時,控制部500以使光圖案移動至中心之方式調整攝像單元400的高度位置。於切斷裝置10中,預先記憶有攝像單元400的移動量與工件W1的上表面的高度位置的關係。控制部500基於攝像單元400在高度方向(箭頭Z方向)上的移動量,算出工件W1的上表面的高度位置。藉由上述方法,檢測工件W1的上表面的高度位置。As described above, when detection of the height position of the upper surface of the workpiece W1 starts, the height position of the
<3-2.溝槽的深度的檢測原理> 第10圖是用以說明當於工件W1形成有溝槽GR1時投影至工件W1之光圖案的示例的圖。如第10圖所示,於工件W1的上表面形成有沿箭頭Y方向延伸之溝槽GR1。<3-2. Measuring Principle of Groove Depth> FIG. 10 is a diagram for explaining an example of a light pattern projected on the workpiece W1 when the groove GR1 is formed on the workpiece W1. As shown in FIG. 10, a groove GR1 extending in the arrow Y direction is formed on the upper surface of the workpiece W1.
光源410被構成為將光圖案L5投影至橫跨工件W1的上表面的溝槽GR1之區域。光圖案L5沿與溝槽GR1延伸之方向大致垂直之方向延伸。再者,光圖案L5延伸之方向並非必須與溝槽GR1延伸之方向大致垂直。只要光圖案L5橫跨溝槽GR1即可。光圖案L5包括部分P1、P2、P3。部分P1、P3投影至除溝槽GR1以外之工件W1的上表面,部分P2投影至溝槽GR1。因除溝槽GR1以外之工件W1的上表面的高度位置與溝槽GR1的高度位置不同,故部分P1、P3與部分P2投影至箭頭Y方向上的不同位置。The
控制部500例如以使部分P1、P3移動至攝像部420拍攝到之圖像的箭頭Y方向的中心之方式,來調整攝像單元400的高度位置。之後,控制部500以使部分P2移動至箭頭Y方向的中心之方式,來調整攝像單元400的高度位置。控制部500基於使部分P2移動至箭頭Y方向的中心時攝像單元400在高度方向上的移動量,算出溝槽GR1的深度。藉由上述方法,檢測溝槽GR1的深度。再者,於該例中是先使部分P1、P3移動至圖像的箭頭Y方向的中心,但亦可先使部分P2移動至箭頭Y方向的中心。For example, the
<3-3.刀片的磨損狀態的檢測原理>
第11圖是示意性地表示利用刀片101形成有溝槽GR2之工件W1的局部剖面圖。如第11圖所示,若刀片101未磨損,則應於工件W1形成溝槽GR21。亦即,若刀片101的側面未因摩耗而變薄,則應於工件W1形成溝槽GR21。溝槽GR21的側壁自工件W1的上表面大致垂直地向下方延伸。另一方面,當刀片101磨損,刀片101的側面變薄時,例如,會於工件W1形成溝槽GR2。溝槽GR2的側壁自工件W1的上表面平緩地傾斜並向下方延伸。<3-3. The detection principle of the wear state of the blade>
FIG. 11 is a partial cross-sectional view schematically showing a workpiece W1 in which a groove GR2 is formed by a
第12圖是用以說明當利用磨損的刀片101形成有溝槽GR2時,投影至工件W1之光圖案的示例的圖。如第12圖所示,於工件W1的上表面形成有沿箭頭Y方向延伸之溝槽GR2。FIG. 12 is a diagram for explaining an example of a light pattern projected onto the workpiece W1 when the groove GR2 is formed with the
光源410被構成為將光圖案L6投影至橫跨工件W1的上表面的溝槽GR2之區域。光圖案L6沿與溝槽GR2延伸之方向大致垂直之方向延伸。再者,光圖案L6延伸之方向並非必須與溝槽GR2延伸之方向大致垂直。只要光圖案L6橫跨溝槽GR2即可。光圖案L6包括部分P4、P5、P6、P7、P8。部分P4、P8投影至除溝槽GR2以外之工件W1的上表面,部分P5、P6、P7投影至溝槽GR2。The
因除溝槽GR2以外之工件W1的上表面的高度位置與溝槽GR2的高度位置不同,故部分P4、P8與部分P5、P6、P7投影至箭頭Y方向上的不同位置。尤其是,因溝槽GR2的側壁平緩,故部分P5自部分P4斜向延伸並逐漸靠向部分P6,部分P7自部分P8斜向延伸並逐漸靠向部分P6。Since the height position of the upper surface of the workpiece W1 other than the groove GR2 is different from the height position of the groove GR2, the portions P4, P8 and the portions P5, P6, and P7 are projected to different positions in the arrow Y direction. In particular, because the sidewall of the trench GR2 is gentle, the portion P5 extends obliquely from the portion P4 and gradually approaches the portion P6, and the portion P7 extends obliquely from the portion P8 and gradually approaches the portion P6.
控制部500例如基於攝像部420拍攝到之圖像,檢測部分P5、P7的斜率。當部分P5、P7的斜率相較於既定斜率較為平緩時,控制部500判定刀片101有磨損,否則,判定刀片101未磨損。The
例如,當部分P4與部分P5的連接部分的X座標(箭頭X方向上的座標)和部分P5與部分P6的連接部分的X座標的差為既定值以上時,控制部500判定部分P5的斜率平緩。再者,控制部500既可於部分P5、P7兩者的斜率平緩時判定刀片101有磨損,亦可於部分P5、P7中的至少一者的斜率平緩時判定刀片101有磨損。藉由上述方法,檢測刀片101的磨損狀態。For example, when the difference between the X coordinate (coordinate in the X direction of the arrow) of the connecting part of the part P4 and the part P5 and the X coordinate of the connecting part of the part P5 and the part P6 is more than a predetermined value, the
<3-4.與毛邊相關的檢測原理> 例如,當工件W1為使用了金屬製引線框架之QFN封裝體基板時,有時會因工件W1的切斷而於工件W1的金屬端子部分產生毛邊。<3-4. Detection principle related to burrs> For example, when the workpiece W1 is a QFN package substrate using a metal lead frame, burrs may be generated on the metal terminal portion of the workpiece W1 by cutting the workpiece W1.
第13圖是表示形成於工件W1之毛邊的一例的圖。如第13圖所示,於工件W1中,於端子510形成有毛邊511。端子510為金屬製。Fig. 13 is a diagram showing an example of burrs formed on the workpiece W1. As shown in FIG. 13 , in the workpiece W1 , burrs 511 are formed on the
第14圖是用以說明當於端子510形成有毛邊511時,投影至工件W1之光圖案的示例的圖。如第14圖所示,於工件W1的上表面形成有沿箭頭Y方向延伸之溝槽GR3。於工件W1中,沿溝槽GR3排列有複數個端子510。FIG. 14 is a diagram for explaining an example of a light pattern projected onto the workpiece W1 when the terminal 510 is formed with the
光源410被構成為將光圖案L7投影至橫跨工件W1的上表面的溝槽GR3及端子510之區域。光圖案L7沿與溝槽GR3延伸之方向大致垂直之方向延伸。再者,光圖案L7延伸之方向並非必須與溝槽GR3延伸之方向大致垂直。只要光圖案L7橫跨溝槽GR3即可。光圖案L7包括部分P9、P10、P11。部分P9、P11投影至除溝槽GR3以外之工件W1的上表面,部分P10投影至溝槽GR3。The
於端子510形成有毛邊511,因相較於未形成毛邊511之部分,毛邊511部分隆起,故部分P9、P11的投影位置在毛邊511附近於箭頭Y方向中偏移。A
控制部500例如基於攝像部420拍攝到之圖像,判定形成於工件W1的上表面之端子510部分中是否存在隆起之部分。例如,控制部500基於部分P9、P11的投影位置是否在端子510附近於箭頭Y方向上偏移既定量以上,判定端子510部分中是否存在隆起之部分。控制部500於判定出存在隆起之部分時,判定於工件W1形成有毛邊511。藉由上述方法,檢測形成於工件W1之毛邊511。The
又,於切斷裝置10中,不僅檢測工件W1中有無毛邊511,亦檢測毛邊511的高度。隨後,對毛邊511的高度的檢測原理進行說明。控制部500例如以使部分P9中遠離溝槽GR3既定量的位置(部分P9中於箭頭Y方向未偏移之位置)移動至攝像部420拍攝到之圖像的箭頭Y方向的中心之方式,調整攝像單元400的高度位置。之後,控制部500以使部分P9中於箭頭Y方向上偏移最大的位置(毛邊511最為隆起之位置)移動至箭頭Y方向的中心之方式,調整攝像單元400的高度位置。控制部500基於使部分P9中於箭頭Y方向上偏移最大的位置移動至箭頭Y方向的中心時,攝像單元400在高度方向上的移動量,算出毛邊511的高度。藉由上述方法,檢測毛邊511的高度。再者,於該例中是先使部分P9中遠離溝槽GR3既定量的位置移動至圖像的箭頭Y方向的中心,但亦可先使部分P9中於箭頭Y方向上偏移最大的位置移動至箭頭Y方向的中心。In addition, in the
<3-5.橡膠件的劣化狀態的檢測原理>
如上所述,於切斷裝置10中,亦進行工件W1的全切。因工件W1的全切而導致載置有工件W1之橡膠件202劣化。<3-5. Principle of detection of deterioration state of rubber parts>
As described above, also in the
第15圖是用以說明投影至橡膠件202之光圖案的示例的圖。如第15圖所示,於橡膠件202,透過工件W1的全切,例如形成溝槽GR4、GR5。溝槽GR4、GR5各自沿箭頭Y方向延伸。於橡膠件202形成有用以吸引工件W1之複數個孔B1。FIG. 15 is a diagram for explaining an example of a light pattern projected onto the
光源410被構成為將光圖案L8投影至橫跨橡膠件202的上表面的溝槽GR4、GR5之區域。光圖案L8沿與溝槽GR4、GR5延伸之方向大致垂直的方向延伸。再者,光圖案L8延伸之方向並非必須與溝槽GR4、GR5延伸之方向大致垂直。只要光圖案L8橫跨溝槽GR4、GR5即可。光圖案L8包括部分P12、P13、P14、P15、P16、P17。部分P12、P14、P15、P17投影至除溝槽GR4、GR5以外之橡膠件202的上表面。部分P13投影至溝槽GR4,部分P16投影至溝槽GR5。The
若除溝槽GR4、GR5等以外之橡膠件202的上表面的面積變窄,則工件W1與橡膠件202的接觸面積變小,因此,工件W1的吸附變得不穩定。亦即,若部分P12、P14、P15、P17等短,則工件W1的吸附會變得不穩定。If the area of the upper surface of the
例如,當部分P12、P14、P15、P17等的長度短於既定長度時,控制部500判定橡膠件202劣化。再者,控制部500既可於部分P12、P14、P15、P17等皆短於既定長度時判定橡膠件202劣化,亦可於部分P12、P14、P15、P17等中的至少一部分短於既定長度時判定橡膠件202劣化。又,控制部500亦可於部分P13、P16等長於既定長度時判定橡膠件202劣化。此時,控制部500亦既可於部分P13、P16等皆長於既定長度時判定橡膠件202劣化,亦可於部分P13、P16等中的至少一部分長於既定長度時判定橡膠件202劣化。藉由上述方法,檢測橡膠件202的劣化狀態。For example, when the lengths of the portions P12, P14, P15, P17, etc. are shorter than a predetermined length, the
[4.動作]
<4-1.切斷品的製造順序>
第16圖是表示切斷品的製造順序的流程圖。該流程圖所示之處理是於準備好作為切斷對象的工件W1後由控制部500執行。[4. Action]
<4-1. Manufacturing procedure of cut products>
Fig. 16 is a flow chart showing the manufacturing procedure of cut products. The processing shown in this flowchart is executed by the
參考第16圖,控制部500以使刀片101接觸CCS區塊300之方式控制主軸部110,以檢測主軸部110在高度方向上的控制座標原點(步驟S100)。控制部500控制攝像單元400以檢測被保持於工件保持單元200上之工件W1的上表面的複數個部位的高度位置(步驟S110)。再者,此時,工件W1位於攝像單元400的下方。Referring to FIG. 16 , the
第17圖是表示第16圖的步驟S110中之具體處理內容的流程圖。參考第17圖,控制部500控制攝像單元400う將光圖案投影至工件W1的上表面(步驟S200)。控制部500判定光圖案是否位於攝像單元400拍攝到之圖像的箭頭Y方向(參考第9圖等)的中心(以下,亦簡稱為「圖像的中心」)(步驟S210)。Fig. 17 is a flowchart showing the specific processing contents in step S110 in Fig. 16 . Referring to FIG. 17 , the
若判定出光圖案位於圖像的中心(步驟S210中為「是」),則控制部500確定工件W1的高度位置為基準位置Z1(步驟S220)。If it is determined that the light emitting pattern is located at the center of the image (YES in step S210 ), the
另一方面,若判定出光圖案未位於圖像的中心(步驟S210中為「否」),則控制部500以使光圖案的位置移動至圖像的中心之方式,使攝像單元400於上下方向移動(步驟S230)。控制部500基於攝像單元400的移動量,算出工件W1的高度位置(步驟S240)。On the other hand, if it is determined that the light emitting pattern is not located at the center of the image ("No" in step S210), the
控制部500判定預定的所有部位的高度位置是否已檢測完畢(步驟S250)。若判定出預定的所有部位的高度位置已檢測完畢(步驟S250中為「是」),則該流程圖所示之處理結束。另一方面,若判定出預定的所有部位的高度位置未檢測完畢(步驟S250中為「否」),則控制部500於調整工件保持單元200的位置後,重複步驟S200~S250的處理。The
再次參考第16圖,若步驟S110的處理結束,則控制部500基於工件W1的高度位置的測定結果調整主軸部110的高度位置(步驟S120)。控制部500控制主軸部110一邊調整主軸部110的高度位置,一邊進行工件W1的切斷(步驟S130)。透過上述處理,進行工件W1的切斷。Referring again to FIG. 16 , when the process of step S110 ends, the
<4-2.溝槽的深度的檢測動作>
第18圖是表示形成於工件W1之溝槽的深度的檢測動作的流程圖。該流程圖所示之處理是於在上表面形成有溝槽之工件W1位於攝像單元400的下方之狀態下,由控制部500執行。<4-2. Detection operation of groove depth>
FIG. 18 is a flowchart showing the detection operation of the depth of the groove formed in the workpiece W1. The process shown in this flowchart is executed by the
參考第18圖,控制部500控制攝像單元400以將光圖案投影至工件W1的上表面的包括溝槽在內之區域(步驟S300)。控制部500判定投影至除溝槽以外之工件W1的上表面之光圖案是否位於攝像單元400拍攝到之圖像的中心(步驟S310)。Referring to FIG. 18 , the
若判定出投影至除溝槽以外之工件W1的上表面之光圖案未位於圖像的中心(步驟S310中為「否」),則控制部500以使光圖案的位置移動至圖像的中心之方式,使攝像單元400於上下方向移動(步驟S320)。另一方面,若判定出投影至除溝槽以外之工件W1的上表面之光圖案位於圖像的中心(步驟S310中為「是」),則處理移至步驟S330。If it is determined that the light pattern projected onto the upper surface of the workpiece W1 other than the groove is not located at the center of the image ("No" in step S310), the
之後,控制部500以使投影至溝槽之光圖案的位置移動至圖像的中心之方式,使攝像單元400於上下方向移動(步驟S330)。控制部500基於步驟S330中之攝像單元400的移動量,算出形成於工件W1之溝槽的深度(步驟S340)。After that, the
<4-3.刀片的磨損狀態的檢測動作>
第19圖是表示刀片101的磨損狀態的檢測動作的流程圖。該流程圖所示之處理是於在上表面形成有溝槽之工件W1位於攝像單元400的下方之狀態下,由控制部500執行。<4-3. Detection operation of blade wear state>
FIG. 19 is a flowchart showing the detection operation of the wear state of the
參考第19圖,控制部500控制攝像單元400以將光圖案投影至工件W1的上表面的包括溝槽在內之區域(步驟S400)。控制部500基於攝像單元400拍攝到之圖像,對例如將第12圖所示之部分P4(靠右的線)與部分P6(靠左的線)加以連接之部分P5(連接部分)進行檢測(步驟S410)。Referring to FIG. 19 , the
控制部500判定部分P5(連接部分)的斜率相較於既定斜率是否較為平緩(步驟S420)。若判定出部分P5的斜率相較於既定斜率較為平緩(步驟S420中為「是」),則控制部500判定刀片101的側面有磨損(步驟S430)。另一方面,若判定出部分P5的斜率相較於既定斜率並不平緩(步驟S420中為「否」),則控制部500判定刀片101的側面未磨損(步驟S440)。The
<4-4.與毛邊相關的檢測動作>
第20圖是表示形成於工件W1之毛邊511的有無的檢測動作的流程圖。該流程圖所示之處理是於經切斷之工件W1位於攝像單元400的下方之狀態下,由控制部500執行。<4-4. Detection operation related to burr>
FIG. 20 is a flowchart showing the detection operation of the presence or absence of
參考第20圖,控制部500控制攝像單元400以將光圖案投影至工件W1的上表面的包括端子510在內之區域(步驟S500)。Referring to FIG. 20 , the
控制部500基於攝像單元400拍攝到之圖像,判定端子510處是否存在隆起之區域(步驟S510)。若判定出存在隆起之區域(步驟S510中為「是」),則控制部500判定於工件W1形成有毛邊511(步驟S520)。另一方面,若判定出不存在隆起之區域(步驟S510中為「否」),則控制部500判定於工件W1未形成毛邊511(步驟S530)。The
第21圖是表示形成於工件W1之毛邊511的高度的檢測動作的流程圖。該流程圖所示之處理是於經切斷之工件W1位於攝像單元400的下方之狀態下,由控制部500執行。FIG. 21 is a flowchart showing the detection operation of the height of the
參考第21圖,控制部500控制攝像單元400以將光圖案投影至工件W1的上表面的包括端子510在內之區域(步驟S600)。控制部500判定光圖案中遠離溝槽GR3(第14圖)既定量之部分(於第14圖中,部分P9中於箭頭Y方向未偏移之部分)是否位於攝像單元400拍攝到之圖像的中心(步驟S610)。Referring to FIG. 21 , the
若判定出光圖案中遠離溝槽GR3既定量之部分未位於圖像的中心(步驟S610中為「否」),則控制部500以使光圖案中遠離溝槽GR3既定量之部分移動至圖像的中心之方式,使攝像單元400於上下方向移動(步驟S620)。另一方面,若判定出光圖案中遠離溝槽GR3既定量之部分位於圖像的中心(步驟S610中為「是」),則處理移至步驟S630。If it is determined that the part of the light pattern that is far away from the groove GR3 by a predetermined amount is not located at the center of the image ("No" in step S610), the
之後,控制部500以使光圖案中投影至毛邊511最為隆起之部位的部分(於第14圖中,部分P9中於箭頭Y方向上偏移最大之部分)移動至圖像的中心之方式,使攝像單元400於上下方向移動(步驟S630)。控制部500基於步驟S630中之攝像單元400的移動量,算出毛邊511的高度(步驟S640)。Afterwards, the
<4-5.橡膠件的劣化狀態的檢測動作>
第22圖是表示橡膠件202的劣化狀態的檢測動作的流程圖。該流程圖所示之處理是於在上表面未載置工件W1之橡膠件202位於攝像單元400的下方之狀態下,由控制部500執行。<4-5. Detection operation of the deterioration state of rubber parts>
FIG. 22 is a flowchart showing the detection operation of the deterioration state of the
參考第22圖,控制部500控制攝像單元400以將光圖案投影至橡膠件202的上表面(步驟S700)。控制部500基於攝像單元400拍攝到之圖像,檢測投影至除溝槽以外之橡膠件202的上表面之線狀光圖案(步驟S710)。Referring to FIG. 22 , the
控制部500判定被投影至除溝槽以外之橡膠件202的上表面之線狀光圖案是否短於既定長度(步驟S720)。若判定出光圖案短於既定長度(步驟S720中為「是」),則控制部500判定橡膠件202劣化(步驟S730)。另一方面,若判定出光圖案並不短於既定長度(步驟S720中為「否」),則控制部500判定橡膠件202未劣化(步驟S740)。The
[5.特徵]
如上所述,於根據本實施方式的切斷裝置10中,光源410將光圖案投影至工件W1之方向與攝像部420拍攝光圖案之方向所形成的角度大於0°。因此,工件W1的上表面的光圖案的投影位置根據工件W1的上表面的高度位置而發生變化。因此,根據切斷裝置10,無需使用昂貴的零件,基於光圖案的投影位置,便能夠檢測工件W1的上表面的高度位置。[5. Features]
As described above, in the
又,因切斷裝置10具有如上所述的特徵,故根據切斷裝置10,無需使用昂貴的零件,基於投影至工件W1之光圖案的形狀,便能夠檢測刀片101的磨損狀態。Furthermore, since the cutting
又,因切斷裝置10具有上述特徵,故根據切斷裝置10,無需使用昂貴的零件,基於投影至工件W1之光圖案的形狀,便能夠進行與形成於工件W1之毛邊511相關的檢測。Furthermore, since the cutting
又,因切斷裝置10具有上述特徵,故根據切斷裝置10,無需使用昂貴的零件,基於投影至橡膠件202之光圖案的形狀,便能夠檢測橡膠件202的劣化狀態。Furthermore, since the cutting
[6.其他實施方式] 上述實施方式的思想並不限於以上所說明之實施方式。以下,對能夠應用上述實施方式的思想之其他實施方式的一例進行說明。[6. Other implementation modes] The idea of the above-mentioned embodiments is not limited to the above-described embodiments. Hereinafter, an example of other embodiment to which the idea of the above-mentioned embodiment can be applied will be described.
於上述實施方式中,光源410所投影之光圖案為線狀。然而,光圖案的形狀並不限於此。光圖案的形狀例如亦可為圓狀,亦可為多邊形狀。In the above embodiments, the light pattern projected by the
又,於上述實施方式中,切斷裝置10具有工件W1的高度位置的檢測功能、形成於工件W1之溝槽的深度的檢測功能、刀片101的劣化狀態的檢測功能、形成於工件W1之毛邊511的檢測功能、及橡膠件202的劣化狀態的檢測功能。然而,切斷裝置10並非必須具有所有功能。切斷裝置10例如亦可僅具有上述功能中的一部分功能。In addition, in the above-mentioned embodiment, the cutting
又,於上述實施方式中,主軸部110是於箭頭XY方向移動。然而,主軸部110亦可不必於箭頭XY方向移動。例如,亦可藉由工件保持單元200於箭頭XY方向移動,代替主軸部110於箭頭XY方向移動,而將工件W1搬送至主軸部110的下方的切斷位置。In addition, in the above-mentioned embodiment, the
又,於上述實施方式中,是藉由使用CCS區塊300,檢測主軸部110在高度方向上的控制座標原點。然而,主軸部110在高度方向上的控制座標原點亦可不必藉由使用CCS區塊300進行檢測。主軸部110在高度方向上的控制座標原點,例如亦可藉由使用對刀片101的接觸進行檢測之觸控感測器等進行檢測。又,於檢測控制座標原點時,接觸CCS區塊300等之部分並非必須是刀片101。例如,亦可由主軸部110的除刀片101以外之部分來接觸CCS區塊300等。In addition, in the above-mentioned embodiment, by using the
又,於根據上述實施方式的切斷裝置10中,為實現上述各種功能,另行設置有攝像單元400。然而,並非必須另行設置攝像單元400來實現上述各種功能。In addition, in the
第23圖是示意性地表示切斷裝置10A的一部分的平面之圖。如第23圖所示,切斷裝置10A不包括上述實施方式中的攝像單元400。Fig. 23 is a plan view schematically showing a part of the
切斷裝置10A包括第一位置確認相機700及第二位置確認相機800。第一位置確認相機700及第二位置確認相機800於第1圖中未圖示。於工件W1的上表面印刷有既定標記。該標記例如表示工件W1的切斷位置。第一位置確認相機700拍攝工件W1,並生成圖像資料。控制部500基於圖像資料所示之標記的位置,確認工件保持單元200上的工件W1的位置及工件W1的切斷位置。利用第一位置確認相機700進行的拍攝是於切斷工件W1之前進行。The
又,第二位置確認相機800拍攝切斷後的工件W1,並生成圖像資料。控制部500基於所生成之圖像資料,確認工件保持單元200上的工件W1的位置、以及工件W1的切斷位置及切斷寬度等。基於由第二位置確認相機800生成之圖像資料,判定工件W1的切斷位置及切斷寬度等是否有問題。In addition, the second
例如,第一位置確認相機700或第二位置確認相機800亦可包括上述實施方式中的攝像單元400的構成。如此,能夠藉由在現有的相機中包括攝像單元400的構成,實現成本的降低及空間的節省。For example, the first
又,例如,當第一位置確認相機700包括攝像單元400的構成時,於確認工件W1的切斷位置時,一併檢測工件W1的高度位置,因此,得以更準確地檢測工件W1的切斷位置處的工件W1的高度位置。Also, for example, when the first
又,例如,當第二位置確認相機800包括攝像單元400的構成時,能夠藉由最低限度的工件W1的移動,實現與工件W1的毛邊相關的檢測、或與刀片101的側面的磨損狀態相關的檢測等的在切斷工件W1後進行之檢測。Also, for example, when the second
以上,對本發明的實施方式進行了示例性說明。亦即,為進行示例性說明,揭示了詳細說明及隨附圖式。因此,於詳細說明及所附圖式所記載之構成要素中,有時會包括並非解決問題所必需的構成要素。因此,不應該因為在詳細說明及隨附圖式中記載有這些並非必需的構成要素,便直接認定這些並非必需的構成要素是必需的。The embodiments of the present invention have been described above as examples. That is, the detailed description and accompanying drawings are disclosed for purposes of illustration. Therefore, among the constituent elements described in the detailed description and the attached drawings, constituent elements not necessary for solving the problem may be included. Therefore, it should not be assumed that these unnecessary constituent elements are essential just because they are described in the detailed description and the accompanying drawings.
又,上述實施方式在所有方面僅是本發明的例示。上述實施方式可於本發明的範圍內進行各種改良或變更。即,於實施本發明時,可根據實施方式適當地採用具體的構成。In addition, the above-mentioned embodiment is merely an illustration of the present invention in all points. Various improvements and changes can be made to the above-mentioned embodiment within the scope of the present invention. That is, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment.
10,10A:切斷裝置 100:切斷單元 101:刀片 102:主軸部主體 103,104:滑塊 105:支撐體 110:主軸部 200:工件保持單元 201:切斷台 202:橡膠件(吸附構件的一例) 300:CCS區塊 400:攝像單元 410:光源 411:LED照明 412:光學系統 413:投影透鏡 414:光圈 415:狹縫構件 420:攝像部 500:控制部(檢測部的一例) 510:端子 511:毛邊 700:第一位置確認相機 800:第二位置確認相機 A1:角度 A1~A3:位置 B1:孔 G1,G2:導件 GR1~GR5,GR21:溝槽 H1~H3:高度 L1~L8:光圖案 P1~P17:部分 S100~S130,S200~S250,S300~S340,S400~S440,S500~S530,S600~S640,S700~S740:步驟 W1:工件 X,Y,Z:箭頭 Z1:基準位置 Z1+α,Z1-α:位置 θ:方向10,10A: cut-off device 100: cut off unit 101: blade 102: The main body of the main shaft 103,104: slider 105: support body 110: Main shaft part 200: Workpiece holding unit 201: cutting table 202: Rubber parts (an example of adsorption member) 300:CCS block 400: camera unit 410: light source 411: LED lighting 412: Optical system 413: Projection lens 414: Aperture 415: Slit component 420: Camera Department 500: control unit (an example of detection unit) 510: terminal 511: rough edge 700: First position confirmation camera 800: second position confirmation camera A1: angle A1~A3: Position B1: hole G1, G2: guide GR1~GR5, GR21: Groove H1~H3: Height L1~L8: light pattern P1~P17: part S100~S130, S200~S250, S300~S340, S400~S440, S500~S530, S600~S640, S700~S740: steps W1: Workpiece X,Y,Z: Arrows Z1: Reference position Z1+α, Z1-α: position θ: direction
第1圖是示意性地表示切斷裝置的一部分的平面之圖。 第2圖是示意性地表示切斷裝置的一部分的正面之圖。 第3圖是用以說明使用了CCS區塊之控制座標原點的檢測順序的圖。 第4圖是示意性地表示攝像單元的構造的圖。 第5圖是示意性地表示光源的構造的圖。 第6圖是表示投影至工件之光圖案的一例的圖。 第7圖是包括保持於工件保持單元上之工件的前視圖。 第8圖是表示光源所投影之光圖案是如何根據工件的上表面的高度位置來變化的圖。 第9圖是用以說明投影至工件之光圖案的示例的圖。 第10圖是用以說明當於工件形成有溝槽時,投影至工件之光圖案的示例的圖。 第11圖是示意性地表示利用刀片形成有溝槽之工件的局部剖面圖。 第12圖是用以說明當利用磨損的刀片形成有溝槽時,投影至工件之光圖案的示例的圖。 第13圖是表示形成於工件之毛邊的一例的圖。 第14圖是用以說明當於端子形成有毛邊時,投影至工件之光圖案的示例的圖。 第15圖是用以說明投影至橡膠件之光圖案的示例的圖。 第16圖是表示切斷品的製造順序的流程圖。 第17圖是表示第16圖的步驟S110中之具體處理內容的流程圖。 第18圖是表示形成於工件之溝槽的深度的檢測動作的流程圖。 第19圖是表示刀片的磨損狀態的檢測動作的流程圖。 第20圖是表示形成於工件之毛邊的有無的檢測動作的流程圖。 第21圖是表示形成於工件之毛邊的高度的檢測動作的流程圖。 第22圖是表示橡膠件的劣化狀態的檢測動作的流程圖。 第23圖是示意性地表示其他實施方式中之切斷裝置的一部分的平面之圖。Fig. 1 is a plan view schematically showing a part of the cutting device. Fig. 2 is a front view schematically showing a part of the cutting device. FIG. 3 is a diagram for explaining the detection procedure of the control coordinate origin using the CCS block. FIG. 4 is a diagram schematically showing the structure of an imaging unit. Fig. 5 is a diagram schematically showing the structure of a light source. Fig. 6 is a diagram showing an example of a light pattern projected onto a workpiece. Fig. 7 is a front view including a workpiece held on a workpiece holding unit. Fig. 8 is a diagram showing how the light pattern projected by the light source changes according to the height position of the upper surface of the workpiece. Fig. 9 is a diagram for explaining an example of a light pattern projected onto a workpiece. FIG. 10 is a diagram for explaining an example of a light pattern projected onto a workpiece when grooves are formed on the workpiece. Fig. 11 is a partial sectional view schematically showing a workpiece in which a groove is formed by a blade. FIG. 12 is a diagram for explaining an example of a light pattern projected on a workpiece when grooves are formed by a worn blade. Fig. 13 is a diagram showing an example of burrs formed on a workpiece. FIG. 14 is a diagram for explaining an example of a light pattern projected onto a workpiece when a burr is formed on a terminal. Fig. 15 is a diagram for explaining an example of a light pattern projected onto a rubber member. Fig. 16 is a flow chart showing the manufacturing procedure of cut products. Fig. 17 is a flowchart showing the specific processing contents in step S110 in Fig. 16 . Fig. 18 is a flowchart showing the detection operation of the depth of the groove formed in the workpiece. Fig. 19 is a flowchart showing the detection operation of the wear state of the blade. Fig. 20 is a flowchart showing the detection operation of the presence or absence of burrs formed on the workpiece. Fig. 21 is a flowchart showing the detection operation of the height of the burr formed on the workpiece. Fig. 22 is a flowchart showing the detection operation of the deterioration state of the rubber material. Fig. 23 is a plan view schematically showing a part of a cutting device in another embodiment.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none
10:切斷裝置10: Cut-off device
100:切斷單元100: cut off unit
101:刀片101: blade
102:主軸部主體102: The main body of the main shaft
103,104:滑塊103,104: slider
105:支撐體105: support body
110:主軸部110: Main shaft part
200:工件保持單元200: Workpiece holding unit
201:切斷台201: cutting table
202:橡膠件(吸附構件的一例)202: Rubber parts (an example of adsorption member)
300:CCS區塊300:CCS block
400:攝像單元400: camera unit
500:控制部(檢測部的一例)500: control unit (an example of detection unit)
W1:工件W1: Workpiece
X,Y,Z:箭頭X,Y,Z: Arrows
θ:方向θ: direction
21~22:基板21~22: Substrate
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