KR20220018424A - Cutting devices and manufacturing methods of cutting products - Google Patents

Abstract

A cutting device or the like for detecting the height position of a work at a lower cost is provided. The cutting device is configured to cut the work. The cutting device comprises a light source, an imaging part, and a detection part. The light source is configured to project the pattern of light onto the work. The imaging part is configured to image the pattern of light and generate first image data. The detection part is configured to detect the height position of the work based on the first image data. The angle formed by the direction in which the light source projects the pattern of light and the direction in which the imaging part images the pattern of light is greater than 0°.

Description

A cutting device and a manufacturing method of a cutting product {CUTTING DEVICES AND MANUFACTURING METHODS OF CUTTING PRODUCTS}

The present invention relates to a cutting device and a method for manufacturing a cut product.

Japanese Patent Laid-Open No. 2019-45418 (Patent Document 1) discloses a laser processing apparatus for dividing a workpiece such as a semiconductor wafer. In this laser processing apparatus, the light of a specific wavelength band is irradiated to the upper surface of a to-be-processed object, and the height position of a to-be-processed object is detected based on the interference light of a reflected light and a reference|standard light (refer patent document 1).

Japanese Patent Laid-Open No. 2019-45418

In the laser processing apparatus disclosed by the said patent document 1, the height position of a to-be-processed object is detected by using expensive components, such as a laser light source. That is, when the technique of the said patent document 1 is used, in order to detect the height position of a to-be-processed object, high cost is required.

The present invention has been made in order to solve such a problem, and an object thereof is to provide a cutting device or the like capable of detecting the height position of the work at a lower cost.

The cutting device which concerns on any aspect of this invention is comprised so that a workpiece|work may be cut|disconnected. This cutting device is equipped with a light source, an imaging part, and a detection part. The light source is configured to project a pattern of light onto the work. The imaging unit is configured to image a pattern of light and generate first image data. The detection unit is configured to detect the height position of the work based on the first image data. The angle formed by the direction in which the light source projects the pattern of light and the direction in which the imaging unit images the pattern of light is greater than 0°.

Moreover, the manufacturing method of the cut product which concerns on another situation of this invention is the manufacturing method of the cut product using the said cutting device. The manufacturing method of this cut product includes a step of projecting a pattern of light onto a work, a step of imaging a pattern of light and generating image data, a step of detecting a height position of the work based on the image data, and a height position of the work. and cutting the workpiece based on the , and manufacturing a cut product.

ADVANTAGE OF THE INVENTION According to this invention, the cutting device etc. which can detect the height position of a workpiece|work can be provided at lower cost.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows typically the plane of a part of a cutting device.
It is a figure which shows typically the front of a part of a cutting device.
3 is a diagram for explaining a procedure for detecting a control coordinate origin using a CCS block.
4 is a diagram schematically showing the configuration of an imaging unit.
5 is a diagram schematically showing the configuration of a light source.
It is a figure which shows an example of the pattern of the light projected on a workpiece|work.
It is a figure including the front surface of the work hold|maintained on the work holding unit.
Fig. 8 is a view showing how the pattern of light projected by the light source is changed depending on the height position of the upper surface of the work.
It is a figure for demonstrating the example of the pattern of the light projected on a workpiece|work.
It is a figure for demonstrating the example of the pattern of the light projected to a work, when a groove|channel is formed in a work.
11 is a view schematically showing a partial cross section of a work in which a groove is formed by a blade.
12 is a view for explaining an example of a pattern of light projected on a work when a groove is formed by a worn blade.
13 is a view showing an example of a burr formed on a work.
Fig. 14 is a view for explaining an example of a pattern of light projected on a work when a burr is formed in the terminal;
It is a figure for demonstrating the example of the pattern of the light projected on rubber.
It is a flowchart which shows the manufacturing procedure of a cut product.
Fig. 17 is a flowchart showing specific processing contents in step S110 of Fig. 16 .
18 is a flowchart showing an operation of detecting the depth of a groove formed in a work.
19 is a flowchart showing an operation of detecting a wear state of a blade.
20 is a flowchart showing an operation of detecting the presence or absence of a burr formed on a work.
Fig. 21 is a flowchart showing an operation of detecting the height of a burr formed on a work;
It is a flowchart which shows the detection operation|movement of the deterioration state of rubber.
It is a figure which shows typically the plane of a part of a cutting device in another embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail, referring drawings. In addition, the same reference numerals are attached to the same or equivalent parts in the drawings, and the description thereof is not repeated.

[One. Configuration of cutting device]

1 : is a figure which shows typically the plane of a part of the cutting device 10 which concerns on this embodiment. FIG. 2 : is a figure which shows typically the front surface of a part of the cutting device 10. As shown in FIG. In addition, in FIG.1 and FIG.2, the direction which each of arrow XYZ shows is common.

The cutting device 10 is comprised so that the workpiece|work W1 may be divided into several pieces by cutting|disconnecting the workpiece|work W1 (full cut). Moreover, the cutting device 10 is comprised so that a groove|channel may be formed in the workpiece|work W1 by removing a part of the workpiece|work W1 (half-cut). That is, the concept of the term "cutting" included in the name (cutting device) of the cutting device 10 includes separating the cutting object into a plurality and removing a part of the cutting object. The work W1 is, for example, a package substrate. In a package substrate, the board|substrate or lead frame to which the semiconductor chip was mounted is resin-sealed. That is, the work W1 is a resin-molded substrate. In the following description, the sealing-side surface of the work W1 is also referred to as "package surface", and the surface on the substrate or lead frame side is also described as "substrate surface".

As an example of the package substrate, a BGA (Ball Grid Array) package substrate, LGA (Land Grid Array) package substrate, CSP (Chip Size Package) package substrate, LED (Light Emitting Diode) package substrate, QFN (Quad Flat No-leaded) A package substrate is mentioned.

As shown in FIGS. 1 and 2 , the cutting device 10 includes a cutting unit 100 , a work holding unit 200 , a Contact Cutter Set (CCS) block 300 , and an imaging unit 400 . and a control unit 500 .

The cutting unit 100 is configured to cut the work W1 , and includes a spindle unit 110 , sliders 103 and 104 , and a support 105 . Further, the cutting device 10 has a twin spindle configuration including two sets of the spindle unit 110 and the sliders 103 and 104, but includes only one set of the spindle unit 110 and the sliders 103 and 104. A single spindle configuration may be used.

The support body 105 is a metal rod-shaped member, and is comprised so that it may move in the arrow Y direction along a guide (not shown). A guide G1 extending in the longitudinal direction (arrow X direction) is formed on the support 105 .

The slider 104 is a rectangular plate-shaped member made of metal, and is attached to the support body 105 in a state movable in the direction of the arrow X along the guide G1. The slider 104 is formed with a guide G2 extending in the longitudinal direction (arrow Z direction). The slider 103 is a rectangular plate-shaped member made of metal, and is attached to the slider 104 in a state where it can move in the height direction (arrow Z direction) along the guide G2.

The spindle unit 110 includes a spindle unit body 102 and a blade 101 installed on the spindle unit body 102 . The blade 101 cuts the work W1 by rotating at a high speed, and separates the work W1 into pieces into a plurality of cut products (semiconductor packages). The spindle main body 102 is attached to the slider 103 . The spindle portion 110 is configured to move to a desired position in the cutting device 10 according to the movement of the sliders 103 , 104 and the support 105 .

The work holding unit 200 is configured to hold the work W1 , and includes a cutting table 201 and a rubber 202 disposed on the cutting table 201 . In this embodiment, the cutting device 10 of the twin cut table structure which has the two workpiece|work holding units 200 is illustrated. In addition, the number of the work holding units 200 is not limited to two, One or three or more may be sufficient as it.

The rubber 202 is a rubber plate-shaped member, and is an example of an adsorption|suction member, and the some hole is formed in the rubber 202. On the rubber 202, the work W1 is arrange|positioned. The cutting table 201 holds the work W1 by adsorbing the work W1 disposed on the rubber 202 from the package surface side below. The cutting table 201 is rotatable in the θ direction. The work W1 is cut by the spindle part 110 from the substrate surface side in the state held by the work holding unit 200 . In addition, the work holding unit 200 does not necessarily include the rubber 202, and instead of the rubber 202, another member for adsorbing the work W1 disposed above from the package surface side below may be included. do.

The CCS block 300 is used for detection of the control coordinate origin in the control of the height position of the spindle unit 110 . The control coordinate origin is a reference position on control in the height direction of the spindle unit 110, and includes, for example, an electrical origin.

FIG. 3 is a diagram for explaining a procedure for detecting the control coordinate origin using the CCS block 300 . In the cutting device 10, the height H1 of the CCS block 300 is memorize|stored previously. As shown in FIG. 3 , in the cutting device 10 , the control coordinate origin in the height direction of the spindle unit 110 is detected by bringing the blade 101 into contact with the CCS block 300 .

The imaging unit 400 projects a pattern of light on the upper surface of the work W1 in a state where the work W1 is positioned below the image capturing unit 400, and the upper surface of the work W1 onto which the pattern of light is projected. It is configured to take pictures. The imaging unit 400 is movable in the vertical direction (arrow Z direction). Various detections described later are performed based on the image data generated by the imaging unit 400 .

4 is a diagram schematically showing the configuration of the imaging unit 400 . 4 , the imaging unit 400 includes a light source 410 and an imaging unit 420 . The light source 410 is configured to project a pattern of light onto the upper surface of the work W1 . The imaging unit 420 is configured to image the upper surface of the work W1 and generate image data. That is, the light source 410 makes the light beam incident on the work W1, and the imaging unit 420 captures the light beam reflected from the work W1.

The angle formed by the direction in which the light source 410 projects the pattern of light on the upper surface of the work W1 and the direction in which the imaging unit 420 images the upper surface of the work W1 is A1. The angle A1 is larger than 0°, preferably 30° to 60°, and still more preferably 40° to 50°. The light source 410 projects a pattern of light toward the upper surface of the work W1 from obliquely upward from the upper surface of the work W1. The imaging unit 420 images the upper surface of the work W1 from just above the work W1.

5 : is a figure which shows typically the structure of the light source 410. As shown in FIG. As shown in FIG. 5 , the light source 410 includes an LED light 411 and an optical system 412 . The LED light 411 is configured to emit light toward the optical system 412 .

The optical system 412 includes a projection lens 413 , a stop 414 , and a slit member 415 . In the optical system 412, the slit member 415, the stop 414, and the projection lens 413 are arrange|positioned in order from the LED illumination 411 side. The projection lens 413 is composed of a biconvex lens of a unit conjugate ratio design. The stop 414 is disposed at the focal position of the projection lens 413 . By arranging the stop 414 at the focal position of the projection lens 413, telecentric illumination is realized. A linear slit is formed in the slit member 415 . The size of the slit is, for example, 2 mm in length and 0.05 mm in width.

6 : is a figure which shows an example of the pattern of the light projected on the workpiece|work W1. As shown in FIG. 6 , when the LED light 411 emits light toward the optical system 412 , a light pattern L1 having the same shape (linear shape) as the slit formed in the slit member 415 is formed on the work W1 . is projected on

1 and 2 again, the control unit 500 includes a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), and the like, and controls each component according to information processing. is configured to do. The control part 500 is comprised so that the cutting unit 100, the workpiece|work holding unit 200, and the imaging unit 400 may be controlled, for example.

In the cutting device 10, the full cut and the half cut of the workpiece|work W1 are performed. In order to form a groove of a desired depth on the work W1 through the half-cut, it is necessary to detect the height position of the work W1 with high accuracy. In the cutting device 10, the height position of the workpiece|work W1 is detected with high precision. Moreover, in the cutting device 10, the depth of the groove|channel formed in the workpiece|work W1, the wear state of the blade 101, the burr|burr formed in the workpiece|work W1, and the deterioration state of the rubber 202 are detected. Next, in the cutting device 10, the reason why the height position of the workpiece|work W1 is detected is demonstrated.

[2. The reason why the height position detection is necessary]

7 : is a figure including the front surface of the work W1 hold|maintained on the work holding unit 200. As shown in FIG. As shown in FIG. 7 , at the time of cutting the work W1 , the rubber 202 is disposed on the upper surface of the cutting table 201 , and the work W1 is disposed on the upper surface of the rubber 202 .

In the cutting device 10, if the height of each member, such as the height H2 of the workpiece|work W1, and the height H3 of the rubber 202, is memorize|stored in advance based on the dimension value of a design stage, the height position of the workpiece|work W1 It is also considered that it is not necessarily necessary to detect . However, the height information of each member is not necessarily accurate. For example, there is a possibility that the rubber 202 is bent by suction from the cutting table 201 . In addition, there is a possibility that the rubber 202 is worn due to a change with time. In addition, the workpiece W1 may be warped due to heat or the like in the previous process. In addition, the workpiece W1 may be warped due to an error or the like due to processing of components such as the spindle part 110 .

In this way, due to various factors, the actual height of each member and the previously stored height may not match. Therefore, in order to grasp the actual height position of the work W1, it is necessary to actually detect the height position of the work W1.

[3 Various detection principles]

<3-1. Principle of detection of height position>

8 is a diagram showing how the pattern of light projected by the light source 410 is changed by the height position of the upper surface of the work W1. 8, in the cutting device 10, when the height position of the upper surface of the workpiece|work W1 is the reference position Z1, the pattern of the light emitted by the light source 410 is projected to the position A1. Further, when the height position of the upper surface of the work W1 is at the position Z1+α, the pattern of light is projected to the position A2, and when the height position of the upper surface of the work W1 is at the position Z1-α, the pattern of light is at the position A3 is projected on

In the cutting device 10, the reference position Z2 (not shown) of the height direction of the imaging unit 400 is predetermined. At the detection start time of the height position of the work W1 , the height position of the imaging unit 400 is the reference position Z2 . When the height position of the imaging unit 400 is the reference position Z2 and the height position of the upper surface of the work W1 is the reference position Z1, the focus of the pattern of light meets the upper surface of the work W1. That is, in the cutting device 10, such reference positions Z1 and Z2 are prepared in advance. In the cutting device 10, the reference positions Z1 and Z2 are memorized beforehand.

9 : is a figure for demonstrating the example of the pattern of the light projected on the workpiece|work W1. As shown in Fig. 9, when the imaging unit 400 exists at the reference position Z2 and the upper surface of the work W1 exists at the reference position Z1, the light pattern L2 is projected onto the work W1. do. Further, when the imaging unit 400 exists at the reference position Z2 and the upper surface of the work W1 exists at the position Z1-α, the light pattern L3 is projected on the work W1 . Further, when the imaging unit 400 exists at the reference position Z2 and the upper surface of the work W1 exists at the position Z1+α, the light pattern L4 is projected on the work W1.

That is, the projection position of the pattern of light changes according to the height position of the upper surface of the workpiece|work W1. This is because the angle formed by the direction in which the light source 410 projects the pattern of light on the upper surface of the work W1 and the direction in which the imaging unit 420 images the upper surface of the work W1 is greater than 0°. .

When the imaging unit 400 exists at the reference position Z2 and the upper surface of the work W1 exists at the reference position Z1, light is located at the center of the arrow Y direction in the image captured by the imaging unit 420 . The pattern L2 is located. When the height position of the upper surface of the workpiece|work W1 shift|deviates from the reference position Z1, the position where the pattern of light is projected shift|deviates in the arrow Y direction. In addition, while the focus of the light patterns L2 coincide, the focus of the light patterns L3 and L4 do not coincide.

As described above, at the start of detection of the height position of the upper surface of the work W1 , the height position of the imaging unit 400 is the reference position Z2 . In this case, when the pattern of light is projected on the center of the arrow Y direction of the image captured by the imaging unit 420, the control unit 500 specifies that the height position of the upper surface of the work W1 is the reference position Z1. . On the other hand, when the pattern of light is projected at a position deviated from the center of the arrow Y direction of the image captured by the imaging unit 420 , the control unit 500 controls the height position of the imaging unit 400 so that the pattern of light moves to the center. to adjust In the cutting device 10, the relationship between the movement amount of the imaging unit 400 and the height position of the upper surface of the workpiece|work W1 is memorize|stored beforehand. The control unit 500 calculates the height position of the upper surface of the work W1 based on the movement amount in the height direction (arrow Z direction) of the imaging unit 400 . By the above method, the height position of the upper surface of the workpiece|work W1 is detected.

<3-2. Principle of detecting the depth of the groove>

10 : is a figure for demonstrating the example of the pattern of the light projected to the workpiece|work W1, when the groove|channel GR1 is formed in the workpiece|work W1. As shown in FIG. 10 , a groove GR1 extending in the arrow Y direction is formed on the upper surface of the work W1 .

The light source 410 is configured to project the light pattern L5 on the region spanning the groove GR1 on the upper surface of the work W1 . The light pattern L5 extends in a direction substantially perpendicular to the direction in which the groove GR1 extends. In addition, the direction in which the light pattern L5 extends is not necessarily substantially perpendicular to the direction in which the groove GR1 extends. The light pattern L5 just needs to span the groove GR1. The light pattern L5 includes portions P1, P2, and P3. The parts P1 and P3 are projected on the upper surface of the workpiece|work W1 other than the groove|channel GR1, and the part P2 is projected on the groove|channel GR1. Since the height position of the upper surface of the workpiece W1 other than the groove GR1 and the height position of the groove GR1 are different, the parts P1 and P3 and the part P2 are projected at different positions in the arrow Y direction. .

The control unit 500 adjusts, for example, the height position of the imaging unit 400 so that the portions P1 and P3 move to the center of the arrow Y direction of the image captured by the imaging unit 420 . Thereafter, the control unit 500 adjusts the height position of the imaging unit 400 so that the portion P2 moves to the center of the arrow Y direction. The control part 500 calculates the depth of the groove|channel GR1 based on the movement amount in the height direction of the imaging unit 400 when the part P2 is moved to the center of the arrow Y direction. By the above method, the depth of the groove GR1 is detected. In addition, in this example, although the parts P1 and P3 were first moved to the center of the arrow Y direction of an image, you may move the part P2 first to the center of the arrow Y direction.

<3-3. Principle of detection of blade wear>

11 is a diagram schematically showing a partial cross section of the work W1 in which the groove GR2 is formed by the blade 101 . 11, for example, if the blade 101 is not worn, a groove GR21 will be formed in the work W1. That is, if the side surface of the blade 101 is not thinned by wear, a groove GR21 will be formed in the work W1. The side wall of the groove GR21 extends downward substantially vertically from the upper surface of the work W1. On the other hand, when the blade 101 is worn and the side surface of the blade 101 is thinned, for example, a groove GR2 is formed in the work W1 . The side wall of the groove GR2 is gently inclined from the upper surface of the work W1 and extends downward.

12 : is a figure for demonstrating the example of the pattern of the light projected to the workpiece|work W1 when the groove|channel GR2 is formed by the worn blade 101. As shown in FIG. As shown in FIG. 12 , a groove GR2 extending in the arrow Y direction is formed on the upper surface of the work W1 .

The light source 410 is configured to project the light pattern L6 on the region spanning the groove GR2 on the upper surface of the work W1 . The light pattern L6 extends in a direction substantially perpendicular to the direction in which the groove GR2 extends. In addition, the direction in which the light pattern L6 extends is not necessarily substantially perpendicular to the direction in which the groove GR2 extends. The light pattern L6 just needs to span the groove GR2. The light pattern L6 includes portions P4, P5, P6, P7, and P8. The parts P4 and P8 are projected on the upper surface of the workpiece|work W1 other than the groove|channel GR2, and the parts P5, P6, P7 are projected on the groove|channel GR2.

Since the height position of the upper surface of the workpiece W1 other than the groove GR2 and the height position of the groove GR2 are different, the parts P4, P8 and the parts P5, P6, P7 are different in the arrow Y direction. projected on the location. In particular, since the sidewall of the groove GR2 is gentle, the portion P5 extends obliquely from the portion P4 and gradually toward the portion P6, and the portion P7 extends obliquely from the portion P8 Gradually toward part P6.

The control unit 500 detects the inclination of the portions P5 and P7, for example, based on the image captured by the imaging unit 420 . The control unit 500 determines that the blade 101 is worn when the inclination of the portions P5 and P7 is gentler than predetermined, and otherwise determines that the blade 101 is not worn.

The control unit 500 includes, for example, X coordinates (coordinates in the X direction of the arrow) in the connection part of the part P4 and the part P5, and in the connection part of the part P5 and the part P6. In the case where the difference from the X coordinate is equal to or greater than a predetermined value, it is determined that the inclination of the portion P5 is gentle. In addition, the controller 500 may determine that the blade 101 is worn when both inclinations of the parts P5 and P7 are gentle, and when the inclination of at least one of the parts P5 and P7 is gentle, the blade You may determine that (101) is worn out. By the above method, the wear state of the blade 101 is detected.

<3-4. Detection principle for burrs>

For example, when the work W1 is a QFN package substrate using a metal lead frame, burrs may be generated in the metal terminal portion of the work W1 due to cutting of the work W1.

13 : is a figure which shows an example of the burr formed in the workpiece|work W1. As shown in FIG. 13 , in the work W1 , a burr 511 is formed in the terminal 510 . The terminal 510 is made of metal.

FIG. 14 is a diagram for explaining an example of a pattern of light projected on the work W1 when the burr 511 is formed on the terminal 510 . As shown in FIG. 14 , a groove GR3 extending in the arrow Y direction is formed on the upper surface of the work W1 . In the work W1, the plurality of terminals 510 are arranged along the groove GR3.

The light source 410 is configured to project the light pattern L7 on the region spanning the groove GR3 and the terminal 510 on the upper surface of the work W1 . The light pattern L7 extends in a direction substantially perpendicular to the direction in which the groove GR3 extends. In addition, the direction in which the light pattern L7 extends is not necessarily substantially perpendicular to the direction in which the groove GR3 extends. The light pattern L7 just needs to span the groove GR3. The light pattern L7 includes portions P9, P10, and P11. The parts P9 and P11 are projected on the upper surface of the workpiece|work W1 other than the groove|channel GR3, and the part P10 is projected on the groove|channel GR3.

Since the burr 511 is formed on the terminal 510 and the portion of the burr 511 is higher than the portion where the burr 511 is not formed, the projected position of the portions P9 and P11 is the burr 511 . In the vicinity, it shifts|deviates in the arrow Y direction.

For example, the control unit 500 determines whether there is a raised portion in the portion of the terminal 510 formed on the upper surface of the work W1 based on the image captured by the imaging unit 420 . The control unit 500 controls, for example, whether the projected positions of the portions P9 and P11 are deviated by a predetermined amount or more in the direction of the arrow Y in the vicinity of the terminal 510. Determine whether a part exists. When it is determined that there is a raised portion, the control unit 500 determines that the burr 511 is formed in the work W1. By the above method, the burr 511 formed on the work W1 is detected.

Moreover, in the cutting device 10, not only the detection of the presence or absence of the burr 511 in the workpiece|work W1, but the detection of the height of the burr 511 is also performed. Next, the detection principle of the height of the burr 511 will be described. The control unit 500 determines that, for example, a position away from the groove GR3 by a predetermined amount in the portion P9 (a position not deviated in the arrow Y direction among the portions P9) of the image captured by the imaging unit 420 is The height position of the imaging unit 400 is adjusted so as to move to the center of the arrow Y direction. Thereafter, the control unit 500 controls the height position of the imaging unit 400 so that the position most shifted in the arrow Y direction (the position where the burr 511 is the most protruded) among the portions P9 moves to the center of the arrow Y direction. to adjust The control unit 500 determines the height of the burr 511 based on the amount of movement in the height direction of the imaging unit 400 when the position most shifted in the arrow Y direction among the portions P9 is moved to the center of the arrow Y direction. to calculate By the above method, the height of the burr 511 is detected. In addition, in this example, the position away from the groove GR3 by a predetermined amount among the portions P9 is first moved to the center of the image in the arrow Y direction, but the position most shifted in the arrow Y direction among the portions P9 is first moved to the arrow Y You may move to the center of a direction.

<3-5. Principle of detection of rubber deterioration>

As mentioned above, in the cutting device 10, the full cut of the workpiece|work W1 is also performed. Through the full cut of the work W1, the rubber 202 on which the work W1 is mounted deteriorates.

15 : is a figure for demonstrating the example of the pattern of the light projected to the rubber 202. As shown in FIG. As shown in FIG. 15 , grooves GR4 and GR5 are formed in the rubber 202 through the full cut of the work W1 . Each of the grooves GR4 and GR5 extends in the arrow Y direction. A plurality of holes B1 for sucking the work W1 are formed in the rubber 202 .

The light source 410 is configured to project the light pattern L8 on the region spanning the grooves GR4 and GR5 on the upper surface of the rubber 202 . The light pattern L8 extends in a direction substantially perpendicular to the direction in which the grooves GR4 and GR5 extend. In addition, the direction in which the light pattern L8 extends is not necessarily substantially perpendicular to the direction in which the grooves GR4 and GR5 extend. The light pattern L8 only needs to span the grooves GR4 and GR5. The light pattern L8 includes portions P12, P13, P14, P15, P16, and P17. The parts P12, P14, P15, and P17 are projected on the upper surface of the rubber 202 other than groove|channel GR4, GR5. Part P13 is projected onto groove GR4 , and part P16 is projected onto groove GR5 .

When the area of the upper surface of the rubber 202 other than the grooves GR4 and GR5 becomes narrow, the contact area between the work W1 and the rubber 202 becomes small, so that the adsorption of the work W1 becomes unstable. That is, when the portions P12, P14, P15, P17, etc. are shortened, the adsorption of the work W1 becomes unstable.

For example, when the length of the parts P12, P14, P15, P17, etc. is shorter than predetermined, the control part 500 determines that the rubber 202 has deteriorated. In addition, when all of the parts P12, P14, P15, P17, etc. are shorter than predetermined, the control part 500 may determine that the rubber 202 is deteriorated, and the parts P12, P14, P15, P17, etc. When at least one part is shorter than predetermined, you may determine that the rubber 202 has deteriorated. In addition, the control part 500 may determine that the rubber 202 is deteriorated, when the parts P13, P16, etc. are longer than predetermined|prescribed. Also in this case, the control part 500 may determine that the rubber 202 is deteriorated when all of the parts P13, P16, etc. are longer than predetermined|prescribed, and at least a part of the parts P13, P16, etc. is more than predetermined. In a long case, you may determine that the rubber 202 has deteriorated. By the above method, the deterioration state of the rubber 202 is detected.

[4. movement]

<4-1. Manufacturing procedure for cut products>

It is a flowchart which shows the manufacturing procedure of a cut product. The process shown in this flowchart is performed by the control part 500 after the workpiece|work W1 to be cut is prepared.

Referring to FIG. 16 , the control unit 500 controls the spindle unit 110 to bring the blade 101 into contact with the CCS block 300 in order to detect the control coordinate origin in the height direction of the spindle unit 110 . control (step S100). The control part 500 controls the imaging unit 400 so that the height position in several places of the upper surface of the workpiece|work W1 hold|maintained on the workpiece|work holding unit 200 may be detected (step S110). In addition, at this point in time, the work W1 is positioned below the imaging unit 400 .

FIG. 17 is a flowchart showing specific processing contents in step S110 of FIG. 16 . Referring to FIG. 17 , the control unit 500 controls the imaging unit 400 to project a pattern of light on the upper surface of the work W1 (step S200 ). The control unit 500 determines whether the pattern of light is located at the center of the arrow Y direction (refer to FIG. 9 and the like) of the image captured by the imaging unit 400 (hereinafter, also simply referred to as “center of the image”) ( step S210).

If it is determined that the pattern of light is located in the center of the image (YES in step S210), the control unit 500 specifies that the height position of the work W1 is the reference position Z1 (step S220).

On the other hand, if it is determined that the light pattern is not located in the center of the image (No in step S210), the control unit 500 moves the imaging unit 400 up and down so that the light pattern position moves to the center of the image. (Step S230). The control unit 500 calculates the height position of the work W1 based on the movement amount of the imaging unit 400 (step S240).

The control unit 500 determines whether the height positions of all the planned locations have been detected (step S250). When it is determined that the height positions of all the planned locations have been detected (YES in step S250), the processing shown in this flowchart ends. On the other hand, if it is determined that the height positions of all the planned locations are not detected (No in step S250), the control unit 500 adjusts the positions of the work holding units 200, and then, steps S200 to S250. repeat the processing of

Referring again to FIG. 16 , when the process of step S110 is finished, the control unit 500 adjusts the height position of the spindle unit 110 based on the measurement result of the height position of the workpiece W1 (step S120 ). The control unit 500 controls the spindle unit 110 to cut the workpiece W1 while adjusting the height position of the spindle unit 110 (step S130). Through such processing, the workpiece W1 is cut.

<4-2. Detecting the depth of the groove>

18 is a flowchart showing an operation of detecting the depth of the groove formed in the work W1. The processing shown in this flowchart is executed by the control unit 500 in a state where the workpiece W1 in which the groove is formed in the upper surface is positioned below the imaging unit 400 .

Referring to FIG. 18 , the control unit 500 controls the imaging unit 400 to project a pattern of light onto the area including the upper surface groove of the work W1 (step S300 ). The control unit 500 determines whether or not the pattern of light projected onto the upper surface of the work W1 other than the groove is located in the center of the image captured by the imaging unit 400 (step S310).

If it is determined that the pattern of light projected on the upper surface of the workpiece W1 other than the groove is not located in the center of the image (No in step S310), the control unit 500 captures the image so that the position of the pattern of light moves to the center of the image. The unit 400 is moved up and down (step S320). On the other hand, if it is determined that the pattern of the light projected on the upper surface of the work W1 other than the groove is located in the center of the image (YES in step S310), the process shifts to step S330.

Then, the control unit 500 moves the imaging unit 400 up and down so that the pattern position of the light projected on the groove moves to the center of the image (step S330). The control part 500 calculates the depth of the groove|channel formed in the workpiece|work W1 based on the movement amount of the imaging unit 400 in step S330 (step S340).

<4-3. Detecting the wear state of the blade>

19 is a flowchart showing a detection operation of the wear state of the blade 101. As shown in FIG. The processing shown in this flowchart is executed by the control unit 500 in a state where the workpiece W1 in which the groove is formed in the upper surface is positioned below the imaging unit 400 .

Referring to FIG. 19 , the control unit 500 controls the imaging unit 400 to project a pattern of light onto the area including the upper surface groove of the work W1 (step S400 ). Based on the image captured by the imaging unit 400, the control unit 500 connects the portion P4 (right line) and the portion P6 (left line) shown in Fig. 12, for example, to a portion ( P5) (connection portion) is detected (step S410).

The control unit 500 determines whether or not the inclination of the portion P5 (connection portion) is gentler than predetermined (step S420). If it is determined that the inclination of the portion P5 is gentler than predetermined (YES in step S420), the control unit 500 determines that the side surface of the blade 101 is worn (step S430). On the other hand, if it is determined that the inclination of the portion P5 is not more gentle than predetermined (No in step S420), the control unit 500 determines that the side surface of the blade 101 is not worn (step S440).

<4-4. Burr detection operation>

20 is a flowchart showing the operation of detecting the presence or absence of the burr 511 formed on the work W1. The processing shown in this flowchart is executed by the control unit 500 in a state where the cut workpiece W1 is positioned below the imaging unit 400 .

Referring to FIG. 20 , the control unit 500 controls the imaging unit 400 to project a pattern of light onto the area including the upper surface terminal 510 of the work W1 (step S500 ).

The control unit 500 determines whether there is a raised region in the terminal 510 based on the image captured by the imaging unit 400 (step S510). If it is determined that there is a raised area (YES in step S510), the control unit 500 determines that the burr 511 is formed in the work W1 (step S520). On the other hand, if it is determined that there is no raised area (NO in step S510), the control unit 500 determines that the burr 511 is not formed in the work W1 (step S530).

21 is a flowchart showing the detection operation of the height of the burr 511 formed on the work W1. The processing shown in this flowchart is executed by the control unit 500 in a state where the cut workpiece W1 is positioned below the imaging unit 400 .

Referring to FIG. 21 , the control unit 500 controls the imaging unit 400 to project a pattern of light onto the area including the upper surface terminal 510 of the work W1 (step S600 ). The control unit 500 captures an image of a portion of the light pattern that is separated from the groove GR3 ( FIG. 14 ) by a predetermined amount (in FIG. 14 , a portion P9 that does not deviate in the arrow Y direction) by the imaging unit 400 . It is determined whether or not it is located in the center of the image (step S610).

If it is determined that the portion of the light pattern that is separated from the groove GR3 by a predetermined amount is not located in the center of the image (No in step S610), the control unit 500 determines that the portion of the light pattern that is separated from the groove GR3 by a predetermined amount is not located in the center of the image. The imaging unit 400 is moved up and down to move to the center of the image (step S620). On the other hand, if it is determined that the portion of the light pattern separated by a predetermined amount from the groove GR3 is located in the center of the image (YES in step S610), the processing proceeds to step S630.

Thereafter, the control unit 500 moves the portion of the light pattern projected on the most protruding portion of the burr 511 (the portion most shifted in the arrow Y direction among the portions P9 in FIG. 14) to the center of the image. The imaging unit 400 is moved in the up-down direction (step S630). The control unit 500 calculates the height of the burr 511 based on the movement amount of the imaging unit 400 in step S630 (step S640).

<4-5. Detection operation of rubber deterioration state>

22 : is a flowchart which shows the detection operation|movement of the deterioration state of the rubber 202. As shown in FIG. The processing shown in this flowchart is executed by the control unit 500 in a state where the rubber 202 on which the work W1 is not mounted on the upper surface is positioned below the imaging unit 400 .

Referring to FIG. 22 , the control unit 500 controls the imaging unit 400 to project a pattern of light on the upper surface of the rubber 202 (step S700 ). The control unit 500 detects a line-shaped light pattern projected on the upper surface of the rubber 202 other than the groove based on the image captured by the imaging unit 400 (step S710).

The control part 500 determines whether the line-shaped light pattern projected on the upper surface of the rubber 202 other than a groove|channel is shorter than predetermined (step S720). If it is determined that the light pattern is shorter than predetermined (YES in step S720), the control unit 500 determines that the rubber 202 is deteriorated (step S730). On the other hand, if it is determined that the light pattern is not shorter than predetermined (No in step S720), the control unit 500 determines that the rubber 202 is not deteriorated (step S740).

[5. Characteristic]

As mentioned above, in the cutting device 10 which concerns on this embodiment, the direction in which the light source 410 projects the pattern of light on the workpiece|work W1, and the direction in which the imaging part 420 images the pattern of light is formed The angle is greater than 0°. Therefore, according to the height position of the upper surface of the work W1, the projection position of the pattern of light in the upper surface of the work W1 changes. Therefore, according to the cutting device 10, the height position of the upper surface of the workpiece|work W1 can be detected based on the projection position of the pattern of light, without using expensive components.

Moreover, since the cutting device 10 has the above characteristics, according to the cutting device 10, the blade 101 is based on the shape of the pattern of the light projected on the workpiece|work W1 without using expensive parts. ) can be detected.

Moreover, since the cutting device 10 has the above characteristics, according to the cutting device 10, based on the shape of the pattern of the light projected to the workpiece|work W1, without using expensive parts, the workpiece W1 ) can be detected regarding the burr 511 formed in the .

Moreover, since the cutting device 10 has the above characteristics, according to the cutting device 10, based on the shape of the pattern of the light projected to the rubber 202, without using expensive parts, the rubber 202 ) can be detected.

[6. other embodiment]

The idea of the said embodiment is not limited to the embodiment demonstrated above. Hereinafter, an example of another embodiment to which the idea of the said embodiment can be applied is demonstrated.

In the above embodiment, the pattern of light projected by the light source 410 was linear. However, the light pattern shape is not limited thereto. The light pattern shape may be, for example, a circular shape or a polygonal shape.

Moreover, in the said embodiment, the cutting device 10 has the detection function of the height position of the workpiece|work W1, the detection function of the depth of the groove|channel formed in the workpiece|work W1, the detection function of the deterioration state of the blade 101, the workpiece|work It had the detection function of the burr 511 formed in W1, and the detection function of the deterioration state of the rubber 202. However, the cutting device 10 does not necessarily have to have all the functions. The cutting device 10 may have only some functions among the said functions, for example.

In addition, in the said embodiment, it was assumed that the spindle part 110 moves in arrow XY direction. However, the spindle unit 110 does not necessarily move in the arrow XY direction. For example, instead of the spindle unit 110 not moving in the arrow XY direction, the work holding unit 200 moves in the arrow XY direction, thereby moving the work W1 to the downward cutting position of the spindle unit 110 . You may send it back.

Moreover, in the said embodiment, the control coordinate origin in the height direction of the spindle part 110 was detected by using the CCS block 300. As shown in FIG. However, the control coordinate origin in the height direction of the spindle unit 110 does not necessarily need to be detected by using the CCS block 300 . The control coordinate origin in the height direction of the spindle unit 110 may be detected, for example, by using a touch sensor that detects the contact of the blade 101 . In addition, the portion in contact with the CCS block 300 or the like when the control coordinate origin is detected does not necessarily have to be the blade 101 . For example, parts other than the blade 101 of the spindle unit 110 may contact the CCS block 300 or the like.

Moreover, in the cutting device 10 which concerns on the said embodiment, in order to implement|achieve the said various functions, the imaging unit 400 was provided separately. However, in order to realize the various functions, a separate imaging unit 400 is not necessarily provided.

23 : is a figure which shows typically the plane of a part of 10 A of cutting devices. As shown in FIG. 23, 10 A of cutting devices do not include the imaging unit 400 in the said embodiment.

The cutting device 10A includes a first positioning camera 700 and a second positioning camera 800 . The first positioning camera 700 and the second positioning camera 800 are not shown in FIG. 1 . A predetermined mark is printed on the upper surface of the work W1. This mark shows the cut position of the workpiece|work W1, for example. The first positioning camera 700 images the work W1 and generates image data. The control part 500 confirms the position of the workpiece|work W1 in the workpiece|work holding unit 200 and the cut position of the workpiece|work W1 based on the position of the mark which the image data shows. Imaging with the 1st positioning camera 700 is performed before cutting|disconnection of the workpiece|work W1.

Moreover, the 2nd positioning camera 800 images the workpiece|work W1 after cutting, and produces|generates image data. The control unit 500 confirms the position of the work W1 in the work holding unit 200 and the cut position and the cut width of the work W1 based on the generated image data. Based on the image data generated by the second positioning camera 800, it is determined whether there are any problems in the cutting position, the cutting width, etc. in the work W1.

For example, the 1st positioning camera 700 or the 2nd positioning camera 800 may include the structure of the imaging unit 400 in the said embodiment. As described above, since the configuration of the imaging unit 400 is included in the existing camera, cost reduction and space saving can be realized.

In addition, for example, when the first positioning camera 700 includes the configuration of the imaging unit 400, the height position of the workpiece W1 is detected at the time of checking the cutting position of the workpiece W1. , the height position of the work W1 in the cut position of the work W1 is detected more accurately.

In addition, for example, when the second positioning camera 800 includes the configuration of the imaging unit 400, detection related to the burr of the workpiece W1 or detection related to the wear state of the side surface of the blade 101, etc. Detection performed after cutting of the workpiece W1 can be realized with the minimum movement of the workpiece W1.

In the above, embodiments of the present invention have been exemplarily described. That is, for illustrative purposes, the detailed description and accompanying drawings have been disclosed. Therefore, components that are not essential for solving the problem may be included among the components described in the detailed description and the accompanying drawings. Accordingly, even if those non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately admitted that those non-essential components are essential.

In addition, the said embodiment is only an illustration of this invention in all points. Various improvement and change are possible in the said embodiment within the scope of the present invention. That is, in the practice of the present invention, a specific configuration can be appropriately adopted depending on the embodiment.

10: cutting device
100: cutting unit
101 : Blade
102: spindle unit body
103, 104: slider
105: support
110: spindle part
200: work holding unit
201 : cutting table
202: rubber (an example of an adsorption member)
300: CCS block
400: imaging unit
410: light source
411: LED light
412: optical system
413: projection lens
414: aperture
415: slit member
420: imaging unit
500: control unit (an example of a detection unit)
510: terminal
511 : Burr
700: first positioning camera
800: second positioning camera
G1, G2: guide
B1: hole
L1-L8: light pattern
P1-P17: Part
GR1-GR5 : Home
W1: work

Claims (9)

A cutting device configured to cut a workpiece,
a light source configured to project a pattern of light onto the work;
an imaging unit configured to image the pattern of light and generate first image data;
a detection unit configured to detect a height position of the work based on the first image data;
The cutting device whose angle formed by the direction in which the said light source projects the said pattern of light, and the direction in which the said imaging part images the said pattern of light is larger than 0 degree. According to claim 1,
The said detection part is a cutting device comprised so that the height position of the said workpiece|work may be detected based on the pattern position of the said light imaged by the said imaging part. 3. The method of claim 1 or 2,
The said workpiece is a resin-molded board|substrate, The cutting device. 4. The method according to any one of claims 1 to 3,
The said light source is comprised so that the pattern of the said light may be projected toward the said workpiece|work from the inclination direction of the said workpiece|work, The cutting device. 5. The method according to any one of claims 1 to 4,
A blade is further provided,
A groove is formed in the work,
the light source is configured to project the pattern of light onto a region including the groove in the work;
The said detection part is comprised so that the wear state of the said blade|wing may be detected based on the shape of the said pattern of the said image imaged by the said imaging part, The cutting device. 6. The method according to any one of claims 1 to 5,
The light source is configured to project the pattern of light onto a region including a metal terminal formed on the work;
The said detection part is a cutting device comprised so that the detection regarding the burr of the said workpiece|work may be performed based on the shape of the said pattern of the said light imaged by the said imaging part. 7. The method according to any one of claims 1 to 6,
Further comprising an adsorption member on which the work is loaded,
The light source is configured to project the pattern of light onto the adsorption member,
The imaging unit is configured to image the suction member,
The said detection part is comprised so that the deterioration state of the said adsorption|suction member may be detected based on the shape of the said pattern of the said light in the said adsorption|suction member imaged by the said imaging part. 8. The method according to any one of claims 1 to 7,
The imaging unit is configured to image a mark formed on the work and generate second image data,
The said detection part is a cutting device comprised so that the cutting position of the said workpiece|work may be detected based on the said 2nd image data. It is a manufacturing method of the cut product using the cutting device in any one of Claims 1-7,
a step of projecting a pattern of light onto the work;
imaging the pattern of light and generating image data;
detecting a height position of the work based on the image data;
The manufacturing method of the cut product comprising the step of cutting the said workpiece|work based on the height position of the said workpiece|work, and manufacturing the said cut product.

Images