TW202206216A - Cut-off device and method for manufacturing cut-off product wherein the cut-off device includes a light source, an image capturing unit, and a detection unit - Google Patents

Abstract

The issue of the present invention is to provide a cut-off device, which can detect the height position of a workpiece at a lower cost. The solution of the present invention is a cut-off device configured to cut off a workpiece. The cut-off device includes a light source, an image capturing unit, and a detection unit. The light source is configured to project a light pattern onto a workpiece. The image capturing unit is configured to capture the light pattern and generate a first image data. The detection unit is configured to detect the height position of the workpiece based on the first image data. The angle formed by the direction of the light source projecting the light pattern and the direction of the image capturing unit capturing the light pattern is greater than 0 DEG.

Description

Cutting device and manufacturing method of cut product

The present invention relates to a cutting device and a method for manufacturing a cut product.

Japanese Patent Application Laid-Open No. 2019-45418 (Patent Document 1) discloses a laser processing apparatus that divides a semiconductor wafer to be processed. In this laser processing apparatus, the upper surface of the object to be processed is irradiated with light of a specific wavelength band, and the height position of the object to be processed is detected based on the interference light between the reflected light and the reference light (refer to Patent Document 1).

[Prior Art Literature] (patent literature) Patent Document 1: Japanese Patent Laid-Open No. 2019-45418.

(Problems to be solved by the invention) In the laser processing apparatus disclosed in the above-mentioned Patent Document 1, the height position of the object to be processed is detected by using expensive components such as a laser light source. That is, when the technique of the above-mentioned Patent Document 1 is used, high cost is incurred in order to detect the height position of the object to be processed.

The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide a cutting device and the like which can detect the height position of a workpiece at a lower cost.

(means used to solve problems) According to one aspect of the present invention, a cutting device is configured to cut a workpiece. The cutting device includes a light source, an imaging unit, and a detection unit. The light source is configured to project a light pattern onto the workpiece. The imaging unit is configured to capture the light pattern and generate the first image data. The detection unit is configured to detect the height position of the workpiece based on the first image data. The angle formed by the direction of the light source projecting the light pattern and the direction of the imaging part shooting the light pattern is greater than 0°.

Moreover, the manufacturing method of the cut product according to another aspect of the present invention is a manufacturing method using the above-mentioned cutting device. The manufacturing method of the cut product includes the following steps: projecting a light pattern onto a workpiece; photographing the light pattern and generating image data; detecting a height position of the workpiece based on the image data; and cutting the workpiece based on the height position of the workpiece to Manufacture of cut products.

(Effect of invention) According to this invention, the cutting apparatus etc. which can detect the height position of a workpiece|work at lower cost can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same symbols are attached to the same or corresponding parts in the drawings, and the description will not be repeated.

[1. Structure of the cutting device] FIG. 1 is a plan view schematically showing a part of the cutting device 10 according to the present embodiment. FIG. 2 is a front view schematically showing a part of the cutting device 10 . In addition, in FIG. 1 and FIG. 2, the directions indicated by arrows XYZ are common to each other.

The cutting device 10 is configured to separate the workpiece W1 into a plurality of cut products (full cut) by cutting the workpiece W1. Moreover, the cutting apparatus 10 is comprised so that a groove|channel (half cut) may be formed in the workpiece|work W1 by removing a part of workpiece|work W1. That is, the concept of the term "cutting" included in the name (cutting device) of the cutting device 10 includes separating the cutting object into plural pieces and removing a part of the cutting object. The workpiece W1 is, for example, a package substrate. In the package substrate, the substrate or lead frame on which the semiconductor chip is mounted is sealed with resin. That is, the workpiece W1 is a substrate after resin molding. In the following description, the surface on the sealing side of the workpiece W1 is also referred to as a "package surface", and the surface on the substrate or lead frame side is referred to as a "substrate surface".

Examples of package substrates include Ball Grid Array (BGA) package substrates, Land Grid Array (LGA) package substrates, and Chip Size Package (CSP) package substrates , Light Emitting Diode (Light Emitting Diode, LED) package substrate, Quad Flat No-leaded (Quad Flat No-leaded, QFN) package substrate.

As shown in FIGS. 1 and 2 , the cutting device 10 includes a cutting unit 100 , a workpiece holding unit 200 , a contact cutter set (CCS) block 300 , a camera unit 400 and a control unit 500 .

The cutting unit 100 is configured to cut the workpiece W1 , and includes a main shaft portion 110 , sliders 103 and 104 , and a support body 105 . Furthermore, the cutting device 10 has a double-spindle structure including two sets of the spindle portion 110 and a set of the sliders 103 and 104, but may also be a single-spindle structure including only one set of the spindle portion 110 and a set of the sliders 103 and 104. .

The support body 105 is a metal rod-shaped member, and is comprised so that it may move in the arrow Y direction along the guide which is not shown in figure. The support body 105 is formed with a guide G1 extending in the longitudinal direction (arrow X direction).

The slider 104 is a metal rectangular plate-like member, and is attached to the support body 105 in a state of being movable in the arrow X direction along the guide G1. The slider 104 is formed with a guide G2 extending in the longitudinal direction (arrow Z direction). The slider 103 is a metal rectangular plate-shaped member, and is attached to the slider 104 in a state of being movable in the height direction (arrow Z direction) along the guide G2 .

The main shaft part 110 includes a main shaft part main body 102 and a blade 101 attached to the main shaft part main body 102 . The blade 101 cuts the workpiece W1 by rotating at a high speed, and separates the workpiece W1 into a plurality of cut products (semiconductor packages). The main shaft portion main body 102 is attached to the slider 103 . The main shaft portion 110 is configured to move to a desired position in the cutting device 10 with the movement of the sliders 103 and 104 and the support body 105 .

The workpiece holding unit 200 is configured to hold the workpiece W1 , and includes a cutting table 201 and a rubber member 202 arranged on the cutting table 201 . In the present embodiment, the cutting device 10 having two workpiece holding units 200 including a double cutting table is exemplified. Furthermore, the number of the workpiece holding units 200 is not limited to two, and may be one or three or more.

The rubber piece 202 is a rubber-made plate-shaped member, and is an example of an adsorption member, and a plurality of holes are formed in the rubber piece 202 . The workpiece W1 is arranged on the rubber member 202 . The cutting table 201 holds the workpiece W1 by attracting the workpiece W1 arranged on the rubber member 202 from the lower sealing surface side. The cutting table 201 is rotatable in the θ direction. The workpiece W1 is cut by the spindle portion 110 from the substrate surface side in a state held by the workpiece holding unit 200 . Furthermore, the workpiece holding unit 200 does not necessarily have to include the rubber member 202 , and may also include other components that absorb the workpiece W1 disposed above from the lower packaging surface side instead of the rubber member 202 .

The CCS block 300 is used to detect the control coordinate origin in the control of the height position of the main shaft portion 110 . The origin of the control coordinates is a reference position in the control of the main shaft portion 110 in the height direction, and includes, for example, an electrical origin.

FIG. 3 is a diagram for explaining the detection procedure of the origin of the control coordinates using the CCS block 300 . In the cutting device 10, the height H1 of the CCS block 300 is stored in advance. As shown in FIG. 3 , in the cutting device 10 , by bringing the blade 101 into contact with the CCS block 300 , the origin of the control coordinates in the height direction of the spindle portion 110 is detected.

The imaging unit 400 is configured to project a light pattern on the upper surface of the workpiece W1 in a state where the workpiece W1 is positioned below the imaging unit 400 , and to photograph the upper surface of the workpiece W1 on which the light pattern is projected. The imaging unit 400 can move in the up-down direction (arrow Z direction). The following various detections are performed based on the image data generated by the imaging unit 400 .

FIG. 4 is a diagram schematically showing the structure of the imaging unit 400 . As shown in FIG. 4 , the imaging unit 400 includes a light source 410 and an imaging unit 420 . The light source 410 is configured to project a light pattern onto the upper surface of the workpiece W1. The imaging unit 420 is configured to image the upper surface of the workpiece W1 and generate image data. That is, the light source 410 makes the light incident on the workpiece W1, and the imaging unit 420 captures the light reflected by the workpiece W1.

The angle formed by the direction in which the light source 410 projects the light pattern on the upper surface of the workpiece W1 and the direction in which the imaging unit 420 images the upper surface of the workpiece W1 is A1. The angle A1 is larger than 0°, preferably 30° to 60°, and more preferably 40° to 50°. The light source 410 projects a light pattern toward the upper surface of the workpiece W1 from obliquely above the upper surface of the workpiece W1. The imaging unit 420 images the upper surface of the workpiece W1 from directly above the workpiece W1.

FIG. 5 is a diagram schematically showing the structure of the light source 410 . As shown in FIG. 5 , the light source 410 includes an LED illumination 411 and an optical system 412 . The LED illumination 411 is configured to emit light toward the optical system 412 .

The optical system 412 includes a projection lens 413 , a diaphragm 414 and a slit member 415 . In the optical system 412, a slit member 415, a diaphragm 414, and a projection lens 413 are arranged in this order from the LED illumination 411 side. The projection lens 413 is composed of a lenticular lens designed with a unit conjugate ratio. The diaphragm 414 is arranged at the focal position of the projection lens 413 . Telecentric illumination is realized by arranging the diaphragm 414 at the focal position of the projection lens 413 . In the slit member 415, a linear slit is formed. The size of the slit, e.g. 2 mm in length and 0.05 mm in width.

FIG. 6 is a diagram showing an example of a light pattern projected on the workpiece W1. As shown in FIG. 6 , when the LED illumination 411 emits light toward the optical system 412 , a light pattern L1 having the same shape (linear) as the slit formed in the slit member 415 is projected onto the workpiece W1 .

Referring to FIGS. 1 and 2 again, the control unit 500 includes a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), etc. , and is configured to control each component according to information processing. The control unit 500 is configured to control the cutting unit 100 , the workpiece holding unit 200 , and the imaging unit 400 , for example.

In the cutting device 10, full cutting and half cutting of the workpiece W1 are performed. In order to form a groove of a desired depth in the workpiece W1 by half cutting, it is necessary to detect the height position of the workpiece W1 with high accuracy. In the cutting device 10, the height position of the workpiece W1 is detected with high accuracy. Moreover, in the cutting device 10, the depth of the groove formed in the workpiece|work W1, the wear state of the blade 101, the burr formed in the workpiece|work W1, and the deterioration state of the rubber|gum 202 are detected. Next, the reason for detecting the height position of the workpiece W1 in the cutting device 10 will be described.

[2. Reason for need to detect height position] FIG. 7 is a front view including the workpiece W1 held by the workpiece holding unit 200 . As shown in FIG. 7 , when cutting the workpiece W1 , the rubber piece 202 is arranged on the upper surface of the cutting table 201 , and the workpiece W1 is arranged on the upper surface of the rubber piece 202 .

In the cutting device 10, if the heights of the components such as the height H2 of the workpiece W1 and the height H3 of the rubber piece 202 are stored in advance based on the dimension values at the design stage, it can be considered that it is not always necessary to detect the height position of the workpiece W1. However, the height information of each component may not be accurate. For example, the rubber piece 202 may be deflected by suction from the cutting table 201 . Also, the rubber member 202 may be worn over time. Also, the workpiece W1 may be deflected by heat or the like in the previous step. In addition, the workpiece W1 may be deflected due to an error or the like caused by machining of components such as the main shaft portion 110 .

Thus, due to various factors, sometimes the actual height of each member does not match the pre-recorded height. Therefore, it is necessary to actually detect the height position of the workpiece W1 to grasp the actual height position of the workpiece W1.

[3. Various detection principles] <3-1. Principle of detection of height position> FIG. 8 is a diagram showing how the light pattern projected by the light source 410 changes according to the height position of the upper surface of the workpiece W1. As shown in FIG. 8, in the cutting device 10, when the height position of the upper surface of the workpiece W1 is the reference position Z1, the pattern of light emitted by the light source 410 is projected to the position A1. Also, when the height position of the upper surface of the workpiece W1 is position Z1+α, the light pattern is projected to position A2, and when the height position of the upper surface of workpiece W1 is position Z1-α, the light pattern is projected to position A3.

In the cutting device 10, a reference position Z2 (not shown) in the height direction of the imaging unit 400 is predetermined. At the start time of detection of the height position of the workpiece W1, the height position of the imaging unit 400 is the reference position Z2. When the height position of the imaging unit 400 is the reference position Z2, and the height position of the upper surface of the workpiece W1 is the reference position Z1, the focus of the light pattern is aligned on the upper surface of the workpiece W1. That is, in the cutting device 10, such reference positions Z1 and Z2 are prepared in advance. In the cutting device 10, reference positions Z1 and Z2 are stored in advance.

FIG. 9 is a diagram for explaining an example of the light pattern projected on the workpiece W1. As shown in FIG. 9 , when the imaging unit 400 exists at the reference position Z2 and the upper surface of the workpiece W1 exists at the reference position Z1 , the light pattern L2 is projected onto the workpiece W1 . In addition, when the imaging unit 400 is present at the reference position Z2 and the upper surface of the workpiece W1 is present at the position Z1-α, the light pattern L3 is projected on the workpiece W1. In addition, when the imaging unit 400 is present at the reference position Z2 and the upper surface of the workpiece W1 is present at the position Z1+α, the light pattern L4 is projected on the workpiece W1.

That is, the projection position of the light pattern changes according to the height position of the upper surface of the workpiece W1. This is because the angle formed by the direction in which the light source 410 projects the light pattern on the upper surface of the workpiece W1 and the direction in which the imaging unit 420 captures the upper surface of the workpiece W1 is greater than 0°.

When the imaging unit 400 is present at the reference position Z2 and the upper surface of the workpiece W1 is present at the reference position Z1, the light pattern L2 is positioned at the center in the direction of arrow Y in the image captured by the imaging unit 420. Since the height position of the upper surface of the workpiece W1 is shifted from the reference position Z1, the projected position of the light pattern is shifted in the arrow Y direction. Furthermore, although the focus of the light pattern L2 is aligned, the focus of the light patterns L3 and L4 is not aligned.

As described above, when the detection of the height position of the upper surface of the workpiece W1 starts, the height position of the imaging unit 400 is the reference position Z2. At this time, when the light pattern is projected to the center in the arrow Y direction of the image captured by the imaging unit 420, the control unit 500 determines the height position of the upper surface of the workpiece W1 as the reference position Z1. On the other hand, when the light pattern is projected to a position shifted from the center in the arrow Y direction of the image captured by the imaging unit 420, the control unit 500 adjusts the height position of the imaging unit 400 so as to move the light pattern to the center . In the cutting device 10, the relationship between the movement amount of the imaging unit 400 and the height position of the upper surface of the workpiece W1 is stored in advance. The control part 500 calculates the height position of the upper surface of the workpiece|work W1 based on the movement amount of the imaging unit 400 in the height direction (arrow Z direction). By the above-described method, the height position of the upper surface of the workpiece W1 is detected.

<3-2. Principle of detection of groove depth> FIG. 10 is a diagram for explaining an example of a light pattern projected to the workpiece W1 when the groove GR1 is formed in the workpiece W1. As shown in FIG. 10, the groove|channel GR1 extended in the arrow Y direction is formed in the upper surface of the workpiece|work W1.

The light source 410 is configured to project the light pattern L5 to the region of the groove GR1 spanning the upper surface of the workpiece W1. The light pattern L5 extends in a direction substantially perpendicular to the direction in which the trench GR1 extends. Furthermore, the direction in which the light pattern L5 extends is not necessarily substantially perpendicular to the direction in which the trench GR1 extends. It is sufficient as long as the light pattern L5 straddles the trench GR1. The light pattern L5 includes portions P1, P2, P3. Parts P1, P3 are projected onto the upper surface of the workpiece W1 except for the groove GR1, and part P2 is projected onto the groove GR1. Since the height position of the upper surface of the workpiece W1 other than the groove GR1 is different from the height position of the groove GR1, the parts P1, P3 and P2 are projected to different positions in the arrow Y direction.

For example, the control unit 500 adjusts the height position of the imaging unit 400 so that the parts P1 and P3 are moved to the center in the arrow Y direction of the image captured by the imaging unit 420 . Then, the control part 500 adjusts the height position of the imaging unit 400 so that the part P2 may be moved to the center of the arrow Y direction. The control unit 500 calculates the depth of the groove GR1 based on the movement amount of the imaging unit 400 in the height direction when the portion P2 is moved to the center in the arrow Y direction. By the above method, the depth of the groove GR1 is detected. In this example, the parts P1 and P3 are first moved to the center in the arrow Y direction of the image, but the part P2 may be moved to the center in the arrow Y direction first.

<3-3. Principle of detection of the wear state of the blade> FIG. 11 is a partial cross-sectional view schematically showing a workpiece W1 in which the groove GR2 is formed by the insert 101 . As shown in FIG. 11, if the insert 101 is not worn, the groove GR21 should be formed in the workpiece W1. That is, if the side surface of the insert 101 is not thinned by wear, the groove GR21 should be formed in the workpiece W1. The side wall of the groove GR21 extends downward substantially vertically from the upper surface of the workpiece W1. On the other hand, when the blade 101 is worn and the side surface of the blade 101 becomes thinner, for example, a groove GR2 is formed in the workpiece W1. The side wall of the groove GR2 is gently inclined from the upper surface of the workpiece W1 and extends downward.

FIG. 12 is a diagram for explaining an example of a light pattern projected to the workpiece W1 when the groove GR2 is formed by the worn insert 101 . As shown in FIG. 12, the groove|channel GR2 extended in the arrow Y direction is formed in the upper surface of the workpiece|work W1.

The light source 410 is configured to project the light pattern L6 to the region of the groove GR2 spanning the upper surface of the workpiece W1. The light pattern L6 extends in a direction substantially perpendicular to the direction in which the trench GR2 extends. Furthermore, the direction in which the light pattern L6 extends is not necessarily substantially perpendicular to the direction in which the trench GR2 extends. It is sufficient as long as the light pattern L6 straddles the trench GR2. Light pattern L6 includes portions P4, P5, P6, P7, P8. Portions P4, P8 are projected onto the upper surface of the workpiece W1 except for the groove GR2, and portions P5, P6, P7 are projected onto the trench GR2.

Since the height position of the upper surface of the workpiece W1 other than the groove GR2 is different from the height position of the groove GR2, the parts P4, P8 and the parts P5, P6, and P7 are projected to different positions in the arrow Y direction. In particular, since the sidewall of the trench GR2 is gentle, the portion P5 extends obliquely from the portion P4 and gradually approaches the portion P6, and the portion P7 extends obliquely from the portion P8 and gradually approaches the portion P6.

The control unit 500 detects the slopes of the parts P5 and P7 based on, for example, the image captured by the imaging unit 420 . When the slopes of the parts P5 and P7 are gentler than the predetermined slopes, the control unit 500 determines that the blade 101 is worn, otherwise, it is determined that the blade 101 is not worn.

For example, the control unit 500 determines the slope of the portion P5 when the difference between the X-coordinate (coordinate in the arrow X direction) of the connecting portion of the portion P4 and the portion P5 and the X-coordinate of the connecting portion of the portion P5 and the portion P6 is equal to or greater than a predetermined value gentle. Furthermore, the control unit 500 may determine that the blade 101 is worn when the slopes of both the parts P5 and P7 are gentle, or determine that the blade 101 is worn when the slope of at least one of the parts P5 and P7 is gentle. By the above method, the wear state of the blade 101 is detected.

<3-4. Detection principle related to burrs> For example, when the workpiece W1 is a QFN package substrate using a metal lead frame, burrs may be generated in the metal terminal portion of the workpiece W1 due to cutting of the workpiece W1.

FIG. 13 is a diagram showing an example of burrs formed on the workpiece W1. As shown in FIG. 13, in the workpiece|work W1, the burr 511 is formed in the terminal 510. The terminal 510 is made of metal.

FIG. 14 is a diagram for explaining an example of a light pattern projected on the workpiece W1 when the terminal 510 has the burr 511 formed thereon. As shown in FIG. 14, the groove|channel GR3 extended in the arrow Y direction is formed in the upper surface of the workpiece|work W1. In the workpiece W1, a plurality of terminals 510 are arranged along the groove GR3.

The light source 410 is configured to project the light pattern L7 on the area of the groove GR3 and the terminal 510 spanning the upper surface of the workpiece W1. The light pattern L7 extends in a direction substantially perpendicular to the direction in which the trench GR3 extends. Furthermore, the direction in which the light pattern L7 extends is not necessarily substantially perpendicular to the direction in which the trench GR3 extends. It is sufficient as long as the light pattern L7 straddles the trench GR3. Light pattern L7 includes portions P9, P10, P11. Parts P9 and P11 are projected to the upper surface of the workpiece W1 except for the groove GR3, and part P10 is projected to the groove GR3.

A burr 511 is formed on the terminal 510 , and since the burr 511 is partially raised compared to the portion where the burr 511 is not formed, the projected positions of the portions P9 and P11 are shifted in the arrow Y direction near the burr 511 .

The control unit 500 determines whether or not there is a raised portion in the portion of the terminal 510 formed on the upper surface of the workpiece W1 based on, for example, the image captured by the imaging unit 420 . For example, the control unit 500 determines whether or not there is a raised portion in the terminal 510 portion based on whether the projection positions of the portions P9 and P11 are shifted by a predetermined amount or more in the arrow Y direction in the vicinity of the terminal 510 . The control part 500 determines that the burr 511 is formed in the workpiece|work W1, when it determines that there exists a raised part. By the above-described method, the burrs 511 formed on the workpiece W1 are detected.

Moreover, in the cutting device 10, not only the presence or absence of the burr 511 in the workpiece W1 is detected, but also the height of the burr 511 is detected. Next, the detection principle of the height of the burr 511 will be described. For example, the control unit 500 moves the position in the portion P9 away from the groove GR3 by a predetermined amount (the position in the portion P9 that is not displaced in the direction of the arrow Y) to the center in the direction of the arrow Y of the image captured by the imaging unit 420, Adjust the height position of the camera unit 400 . After that, the control unit 500 adjusts the height position of the imaging unit 400 so that the position most displaced in the arrow Y direction (the position where the burr 511 is most protruded) in the portion P9 is moved to the center in the arrow Y direction. The control unit 500 calculates the height of the burr 511 based on the amount of movement of the imaging unit 400 in the height direction when the position of the portion P9 most displaced in the arrow Y direction is moved to the center in the arrow Y direction. By the above method, the height of the burr 511 is detected. Furthermore, in this example, the position in the portion P9 that is far away from the groove GR3 by a predetermined amount is moved to the center of the image in the direction of the arrow Y, but the position in the portion P9 that is most shifted in the direction of the arrow Y may be moved first. Move to the center in the Y direction of the arrow.

<3-5. Detection principle of deterioration state of rubber parts> As described above, the cutting device 10 also performs full cutting of the workpiece W1. The rubber member 202 on which the workpiece W1 is placed is deteriorated due to the full cut of the workpiece W1.

FIG. 15 is a diagram for explaining an example of the light pattern projected on the rubber member 202 . As shown in FIG. 15, grooves GR4 and GR5 are formed in the rubber member 202 through the full cut of the workpiece W1, for example. Each of the grooves GR4 and GR5 extends in the arrow Y direction. A plurality of holes B1 for attracting the workpiece W1 are formed in the rubber member 202 .

The light source 410 is configured to project the light pattern L8 onto the regions of the grooves GR4 and GR5 spanning the upper surface of the rubber member 202 . The light pattern L8 extends in a direction substantially perpendicular to the direction in which the grooves GR4 and GR5 extend. Furthermore, the extending direction of the light pattern L8 is not necessarily substantially perpendicular to the extending direction of the trenches GR4 and GR5. The light pattern L8 only needs to straddle the grooves GR4 and GR5. The light pattern L8 includes portions P12, P13, P14, P15, P16, P17. Portions P12, P14, P15, P17 are projected onto the upper surface of the rubber piece 202 except for the grooves GR4, GR5. Portion P13 is projected onto trench GR4, and portion P16 is projected onto trench GR5.

If the area of the upper surface of the rubber member 202 other than the grooves GR4, GR5, etc. is narrowed, the contact area between the workpiece W1 and the rubber member 202 becomes small, and therefore, the adsorption of the workpiece W1 becomes unstable. That is, if the parts P12, P14, P15, P17, etc. are short, the adsorption of the workpiece W1 becomes unstable.

For example, when the lengths of the parts P12, P14, P15, P17, etc. are shorter than a predetermined length, the control section 500 determines that the rubber piece 202 is deteriorated. Furthermore, the control unit 500 may determine that the rubber member 202 is deteriorated when all of the parts P12, P14, P15, P17, etc. are shorter than the predetermined length, or at least some of the parts P12, P14, P15, P17, etc. are shorter than the predetermined length. When it is judged that the rubber piece 202 is deteriorated. In addition, the control unit 500 may determine that the rubber member 202 is deteriorated when the parts P13, P16 and the like are longer than a predetermined length. At this time, the control unit 500 may determine that the rubber member 202 is degraded when all of the parts P13, P16, etc. are longer than a predetermined length, or determine that the rubber member 202 is deteriorated when at least some of the parts P13, P16, etc. are longer than a predetermined length. By the above method, the deterioration state of the rubber member 202 is detected.

[4. Action] <4-1. Manufacturing sequence of cut products> Fig. 16 is a flowchart showing a manufacturing procedure of a cut product. The processing shown in this flowchart is executed by the control unit 500 after the workpiece W1 to be cut is prepared.

16 , the control unit 500 controls the spindle unit 110 so that the blade 101 contacts the CCS block 300 to detect the control coordinate origin of the spindle unit 110 in the height direction (step S100 ). The control unit 500 controls the imaging unit 400 to detect the height positions of a plurality of locations on the upper surface of the workpiece W1 held by the workpiece holding unit 200 (step S110 ). Furthermore, at this time, the workpiece W1 is located below the imaging unit 400 .

FIG. 17 is a flowchart showing the specific processing content in step S110 of FIG. 16 . Referring to FIG. 17 , the control unit 500 controls the imaging unit 400 to project the light pattern on the upper surface of the workpiece W1 (step S200 ). The control unit 500 determines whether the light pattern is located at the center of the image captured by the imaging unit 400 in the arrow Y direction (refer to FIG. 9 and the like) (hereinafter, also simply referred to as the “center of the image”) (step S210 ).

When it is determined that the light pattern is located at the center of the image (YES in step S210 ), the control unit 500 determines the height position of the workpiece W1 as the reference position Z1 (step S220 ).

On the other hand, if it is determined that the light pattern is not located at the center of the image (NO in step S210 ), the control unit 500 moves the imaging unit 400 in the vertical direction so as to move the position of the light pattern to the center of the image move (step S230). The control part 500 calculates the height position of the workpiece|work W1 based on the movement amount of the imaging unit 400 (step S240).

The control unit 500 determines whether or not the height positions of all predetermined parts have been detected (step S250 ). If it is determined that the detection of the height positions of all the predetermined parts has been completed (YES in step S250 ), the processing shown in this flowchart ends. On the other hand, if it is determined that the height positions of all the predetermined parts have not been detected (NO in step S250 ), the control unit 500 repeats the processing of steps S200 to S250 after adjusting the position of the workpiece holding unit 200 .

Referring again to FIG. 16 , when the process of step S110 ends, the control unit 500 adjusts the height position of the spindle unit 110 based on the measurement result of the height position of the workpiece W1 (step S120 ). The control unit 500 controls the spindle unit 110 to perform cutting of the workpiece W1 while adjusting the height position of the spindle unit 110 (step S130 ). The cutting of the workpiece W1 is performed by the above-mentioned processing.

<4-2. Detection operation of groove depth> FIG. 18 is a flowchart showing the detection operation of the depth of the groove formed in the workpiece W1. The processing shown in this flowchart is executed by the control unit 500 in a state where the workpiece W1 having the groove formed on the upper surface is positioned below the imaging unit 400 .

Referring to FIG. 18 , the control section 500 controls the imaging unit 400 to project the light pattern to the area including the grooves on the upper surface of the workpiece W1 (step S300 ). The control part 500 determines whether the light pattern projected on the upper surface of the workpiece|work W1 other than a groove|channel is located in the center of the image captured by the imaging unit 400 (step S310).

If it is determined that the light pattern projected onto the upper surface of the workpiece W1 other than the groove is not located at the center of the image (NO in step S310 ), the control unit 500 moves the position of the light pattern to the center of the image In this way, the imaging unit 400 is moved in the up-down direction (step S320 ). On the other hand, if it is determined that the light pattern projected onto the upper surface of the workpiece W1 other than the groove is located at the center of the image (YES in step S310 ), the process proceeds to step S330 .

After that, the control unit 500 moves the imaging unit 400 in the vertical direction so as to move the position of the light pattern projected on the groove to the center of the image (step S330 ). The control part 500 calculates the depth of the groove|channel formed in the workpiece|work W1 based on the movement amount of the imaging unit 400 in step S330 (step S340).

<4-3. Detection operation of the wear state of the blade> FIG. 19 is a flowchart showing the detection operation of the wear state of the blade 101 . The processing shown in this flowchart is executed by the control unit 500 in a state where the workpiece W1 having the groove formed on the upper surface is positioned below the imaging unit 400 .

Referring to FIG. 19 , the control part 500 controls the imaging unit 400 to project the light pattern to the area including the grooves on the upper surface of the workpiece W1 (step S400 ). The control unit 500 detects, for example, a portion P5 (connection portion) that connects the portion P4 (the line on the right) and the portion P6 (the line on the left) shown in FIG. 12 based on the image captured by the imaging unit 400 . (step S410).

The control part 500 determines whether the slope of the part P5 (connection part) is gentler than a predetermined slope (step S420). If it is determined that the slope of the portion P5 is gentler than the predetermined slope (YES in step S420 ), the control unit 500 determines that the side surface of the blade 101 is worn (step S430 ). On the other hand, if it is determined that the slope of the portion P5 is not gentler than the predetermined slope (NO in step S420 ), the control unit 500 determines that the side surface of the blade 101 is not worn (step S440 ).

<4-4. Detection operation related to burrs> FIG. 20 is a flowchart showing the detection operation of the presence or absence of the burrs 511 formed on the workpiece W1. The processing shown in this flowchart is executed by the control unit 500 in a state where the cut workpiece W1 is located below the imaging unit 400 .

Referring to FIG. 20 , the control section 500 controls the imaging unit 400 to project the light pattern to the area including the terminal 510 of the upper surface of the workpiece W1 (step S500 ).

The control unit 500 determines whether or not there is a raised area at the terminal 510 based on the image captured by the imaging unit 400 (step S510 ). When it is determined that there is a raised region (YES in step S510 ), the control unit 500 determines that the burr 511 is formed in the workpiece W1 (step S520 ). On the other hand, if it is determined that there is no raised region (NO in step S510 ), the control unit 500 determines that the burr 511 is not formed on the workpiece W1 (step S530 ).

FIG. 21 is a flowchart showing the detection operation of the height of the burr 511 formed on the workpiece W1. The processing shown in this flowchart is executed by the control unit 500 in a state where the cut workpiece W1 is located below the imaging unit 400 .

Referring to FIG. 21 , the control part 500 controls the imaging unit 400 to project the light pattern to the area including the terminal 510 of the upper surface of the workpiece W1 (step S600 ). The control unit 500 determines whether or not a portion of the light pattern that is far away from the groove GR3 ( FIG. 14 ) by a predetermined amount (in FIG. 14 , the portion P9 that is not shifted in the direction of the arrow Y) is located in the image captured by the imaging unit 400 the center (step S610).

If it is determined that the portion of the light pattern that is far away from the groove GR3 by the predetermined amount is not located at the center of the image (NO in step S610 ), the control unit 500 moves the portion of the light pattern that is far away from the groove GR3 by the predetermined amount to the image. The camera unit 400 is moved in the up and down direction in a manner of being in the center (step S620 ). On the other hand, if it is determined that a portion of the light pattern that is distant from the groove GR3 by a predetermined amount is located at the center of the image (YES in step S610 ), the process proceeds to step S630 .

After that, the control unit 500 moves the part of the light pattern projected to the most protruding part of the burr 511 (in FIG. 14, the part with the largest deviation in the direction of the arrow Y in the part P9) to the center of the image, The imaging unit 400 is moved up and down (step S630 ). The control part 500 calculates the height of the burr 511 based on the movement amount of the imaging unit 400 in step S630 (step S640).

<4-5. Detection operation of the deterioration state of rubber parts> FIG. 22 is a flowchart showing the detection operation of the deterioration state of the rubber material 202 . The processing shown in this flowchart is executed by the control unit 500 in a state where the rubber member 202 on which the workpiece W1 is not placed on the upper surface is positioned below the imaging unit 400 .

Referring to FIG. 22 , the control part 500 controls the imaging unit 400 to project the light pattern on the upper surface of the rubber member 202 (step S700 ). The control unit 500 detects the linear light pattern projected onto the upper surface of the rubber member 202 excluding the grooves based on the image captured by the imaging unit 400 (step S710 ).

The control unit 500 determines whether or not the linear light pattern projected onto the upper surface of the rubber member 202 excluding the groove is shorter than a predetermined length (step S720 ). If it is determined that the light pattern is shorter than the predetermined length (YES in step S720 ), the control unit 500 determines that the rubber piece 202 is deteriorated (step S730 ). On the other hand, if it is determined that the light pattern is not shorter than the predetermined length (NO in step S720 ), the control unit 500 determines that the rubber member 202 is not degraded (step S740 ).

[5. Features] As described above, in the cutting device 10 according to the present embodiment, the angle formed by the direction in which the light source 410 projects the light pattern to the workpiece W1 and the direction in which the imaging unit 420 captures the light pattern is greater than 0°. Therefore, the projection position of the light pattern on the upper surface of the workpiece W1 changes according to the height position of the upper surface of the workpiece W1. Therefore, according to the cutting device 10, the height position of the upper surface of the workpiece W1 can be detected based on the projected position of the light pattern without using expensive components.

Furthermore, since the cutting device 10 has the above-mentioned features, the cutting device 10 can detect the wear state of the blade 101 based on the shape of the light pattern projected on the workpiece W1 without using expensive components.

In addition, since the cutting device 10 has the above-mentioned features, the cutting device 10 can detect the burrs 511 formed on the workpiece W1 based on the shape of the light pattern projected on the workpiece W1 without using expensive components.

Moreover, since the cutting device 10 has the above-mentioned characteristics, the cutting device 10 can detect the deterioration state of the rubber material 202 based on the shape of the light pattern projected on the rubber material 202 without using expensive components.

[6. Other Embodiments] The idea of the above-described embodiment is not limited to the above-described embodiment. Hereinafter, an example of another embodiment to which the idea of the above-described embodiment can be applied will be described.

In the above embodiment, the light pattern projected by the light source 410 is linear. However, the shape of the light pattern is not limited to this. The shape of the light pattern may be, for example, a circular shape or a polygonal shape.

Further, in the above-described embodiment, the cutting device 10 has the function of detecting the height position of the workpiece W1, the function of detecting the depth of the groove formed in the workpiece W1, the function of detecting the deterioration state of the blade 101, and the burr formed in the workpiece W1. The detection function of 511, and the detection function of the deterioration state of the rubber member 202. However, the cutting device 10 does not necessarily have all functions. The cutting device 10 may have, for example, only some of the functions described above.

In addition, in the above-mentioned embodiment, the main shaft part 110 moves in the arrow XY directions. However, the main shaft portion 110 does not necessarily need to move in the arrow XY directions. For example, the workpiece W1 may be conveyed to the cutting position below the spindle portion 110 by moving the workpiece holding unit 200 in the arrow XY directions instead of the spindle portion 110 moving in the arrow XY directions.

Furthermore, in the above-described embodiment, the control coordinate origin of the main shaft portion 110 in the height direction is detected by using the CCS block 300 . However, the origin of the control coordinates in the height direction of the main shaft portion 110 does not need to be detected by using the CCS block 300 . The origin of the control coordinates of the spindle portion 110 in the height direction can also be detected, for example, by using a touch sensor or the like that detects the contact of the blade 101 . In addition, when detecting the origin of the control coordinates, the portion contacting the CCS block 300 and the like does not necessarily have to be the blade 101 . For example, the portion of the spindle portion 110 other than the blade 101 may contact the CCS block 300 or the like.

In addition, in the cutting device 10 according to the above-described embodiment, in order to realize the various functions described above, an imaging unit 400 is separately provided. However, it is not necessary to separately provide the imaging unit 400 to realize the various functions described above.

Fig. 23 is a plan view schematically showing a part of the cutting device 10A. As shown in FIG. 23 , the cutting device 10A does not include the imaging unit 400 in the above-described embodiment.

The cutting device 10A includes a first position checking camera 700 and a second position checking camera 800 . The first position checking camera 700 and the second position checking camera 800 are not shown in the first figure. A predetermined mark is printed on the upper surface of the workpiece W1. This mark indicates, for example, the cutting position of the workpiece W1. The first position confirmation camera 700 images the workpiece W1 and generates image data. The control unit 500 confirms the position of the workpiece W1 on the workpiece holding unit 200 and the cutting position of the workpiece W1 based on the position of the mark shown in the image data. The imaging by the first position confirmation camera 700 is performed before the workpiece W1 is cut.

In addition, the second position checking camera 800 images the workpiece W1 after cutting, and generates image data. The control unit 500 confirms the position of the workpiece W1 on the workpiece holding unit 200, the cutting position and the cutting width of the workpiece W1, and the like based on the generated image data. Based on the image data generated by the second position checking camera 800, it is determined whether or not there is a problem with the cutting position and cutting width of the workpiece W1.

For example, the first position confirmation camera 700 or the second position confirmation camera 800 may also include the configuration of the imaging unit 400 in the above-described embodiment. In this way, by including the imaging unit 400 in the conventional camera, cost reduction and space saving can be achieved.

Also, for example, when the first position checking camera 700 includes the imaging unit 400, the height position of the workpiece W1 is also detected when the cutting position of the workpiece W1 is checked, so that the cutting of the workpiece W1 can be detected more accurately. The height position of the workpiece W1 at the position.

Also, for example, when the second position checking camera 800 includes the imaging unit 400, it is possible to detect the burr of the workpiece W1 or the wear state of the side surface of the blade 101 with minimal movement of the workpiece W1. The inspection of the workpiece W1 is performed after the workpiece W1 is cut.

The embodiments of the present invention have been exemplified above. That is, for illustrative purposes, the detailed description and accompanying drawings are disclosed. Therefore, the components described in the detailed description and the attached drawings may include components that are not necessary to solve the problem. Therefore, it should not be assumed that these unnecessary components are essential because they are described in the detailed description and the accompanying drawings.

In addition, the above-mentioned embodiment is only an illustration of this invention in every respect. The above-mentioned embodiment can be variously improved or changed within the scope of the present invention. That is, when carrying out this invention, a specific structure can be suitably employ|adopted according to embodiment.

10,10A: Cut-off device 100: Cut off unit 101: Blades 102: Main body of main shaft 103, 104: Slider 105: Support body 110: Spindle part 200: Workpiece holding unit 201: Cut-off table 202: Rubber parts (an example of adsorption member) 300: CCS block 400: Camera unit 410: Light source 411: LED lighting 412: Optical System 413: Projection Lens 414: Aperture 415: Slit Member 420: Camera Department 500: Control part (an example of detection part) 510: Terminal 511: Burrs 700: First position confirmation camera 800: Second position confirmation camera A1: Angle A1～A3: Location B1: hole G1, G2: Guide GR1～GR5, GR21: Groove H1～H3: Height L1～L8: Light pattern P1～P17: part S100～S130, S200～S250, S300～S340, S400～S440, S500～S530, S600～S640, S700～S740: Steps W1: Workpiece X,Y,Z: Arrow Z1: Reference position Z1＋α, Z1－α: position θ: direction

FIG. 1 is a plan view schematically showing a part of the cutting device. FIG. 2 is a front view schematically showing a part of the cutting device. FIG. 3 is a diagram for explaining the detection procedure of the origin of the control coordinates using the CCS block. FIG. 4 is a diagram schematically showing the structure of the imaging unit. FIG. 5 is a diagram schematically showing the structure of the light source. FIG. 6 is a diagram showing an example of a light pattern projected on a workpiece. Fig. 7 is a front view including the workpiece held by the workpiece holding unit. FIG. 8 is a diagram showing how the light pattern projected by the light source changes according to the height position of the upper surface of the workpiece. FIG. 9 is a diagram for explaining an example of a light pattern projected onto a workpiece. FIG. 10 is a diagram for explaining an example of a light pattern projected on the workpiece when grooves are formed in the workpiece. Fig. 11 is a partial cross-sectional view schematically showing a workpiece in which grooves are formed by an insert. FIG. 12 is a diagram for explaining an example of a light pattern projected on a workpiece when a groove is formed by a worn blade. Fig. 13 is a diagram showing an example of burrs formed on a workpiece. FIG. 14 is a diagram for explaining an example of a light pattern projected on a workpiece when a burr is formed on a terminal. FIG. 15 is a diagram for explaining an example of a light pattern projected onto a rubber member. Fig. 16 is a flowchart showing a manufacturing procedure of a cut product. FIG. 17 is a flowchart showing the specific processing content in step S110 of FIG. 16 . FIG. 18 is a flowchart showing the detection operation of the depth of the groove formed in the workpiece. FIG. 19 is a flowchart showing the detection operation of the wear state of the blade. FIG. 20 is a flowchart showing the detection operation for the presence or absence of burrs formed on the workpiece. Fig. 21 is a flowchart showing the detection operation of the height of the burr formed on the workpiece. Fig. 22 is a flowchart showing the detection operation of the deterioration state of the rubber material. Fig. 23 is a plan view schematically showing a part of a cutting device in another embodiment.

Domestic storage information (please note in the order of storage institution, date and number) without Foreign deposit information (please note in the order of deposit country, institution, date and number) without

10: Cutting device

100: Cut off unit

101: Blades

102: Main body of main shaft

103, 104: Slider

105: Support body

110: Spindle part

200: Workpiece holding unit

201: Cut-off table

202: Rubber parts (an example of adsorption member)

300: CCS block

400: Camera unit

500: Control part (an example of detection part)

W1: Workpiece

X,Y,Z: Arrow

θ: direction

21~22: Substrate

Claims (9)

A cutting device, which is configured to cut a workpiece, and is provided with: a light source configured to project a light pattern onto the workpiece; an imaging unit configured to capture the light pattern and generate first image data; and, a detection unit configured to detect the height position of the workpiece based on the first image data; and, The angle formed by the direction in which the light source projects the light pattern and the direction in which the imaging unit captures the light pattern is greater than 0°. A cutting device as claimed in claim 1, wherein: The detection unit is configured to detect the height position of the workpiece based on the position of the light pattern captured by the imaging unit. A cutting device as claimed in claim 1 or 2, wherein: The workpiece is a substrate after resin molding. The cutting device according to any one of claims 1 to 3, wherein: The light source is configured to project the light pattern toward the workpiece from an oblique direction of the workpiece. The cutting device according to any one of claims 1 to 4, further comprising: a blade, wherein: a groove is formed in the workpiece; the light source is configured to project the light pattern onto an area including the groove in the workpiece, The detection unit is configured to detect the wear state of the blade based on the shape of the light pattern captured by the imaging unit. The cutting device according to any one of claims 1 to 5, wherein: the light source is configured to project the light pattern onto an area including metal terminals formed on the workpiece; The detection unit is configured to detect the burrs of the workpiece based on the shape of the light pattern captured by the imaging unit. The cutting device according to any one of claims 1 to 6, further comprising: a suction member for placing the workpiece, wherein: The light source is configured to project the light pattern onto the suction member, The imaging unit is configured to photograph the suction member, The detection unit is configured to detect the deterioration state of the suction member based on the shape of the light pattern on the suction member captured by the imaging unit. The cutting device according to any one of claims 1 to 7, wherein: The imaging unit is configured to capture a mark formed on the workpiece and generate second image data, The detection unit is configured to detect the cutting position of the workpiece based on the second image data. A manufacturing method of a cut product, which uses the cutting device as described in any one of claims 1 to 7, and comprises the following steps: projecting a light pattern onto the workpiece; photographing the light pattern and generating image data; Detecting the height position of the workpiece based on the image data; and, The workpiece is cut based on the height position of the workpiece to manufacture the cut product.

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