TW202146465A - 硬化性組成物、硬化物及印刷配線板 - Google Patents

硬化性組成物、硬化物及印刷配線板 Download PDF

Info

Publication number
TW202146465A
TW202146465A TW110110032A TW110110032A TW202146465A TW 202146465 A TW202146465 A TW 202146465A TW 110110032 A TW110110032 A TW 110110032A TW 110110032 A TW110110032 A TW 110110032A TW 202146465 A TW202146465 A TW 202146465A
Authority
TW
Taiwan
Prior art keywords
curable composition
mass
parts
printed wiring
acrylate
Prior art date
Application number
TW110110032A
Other languages
English (en)
Chinese (zh)
Inventor
高嶋脩平
橫山裕
小田桐悠斗
伊藤秀之
米田一善
Original Assignee
日商太陽油墨製造股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽油墨製造股份有限公司 filed Critical 日商太陽油墨製造股份有限公司
Publication of TW202146465A publication Critical patent/TW202146465A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
TW110110032A 2020-03-31 2021-03-19 硬化性組成物、硬化物及印刷配線板 TW202146465A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-063287 2020-03-31
JP2020063287 2020-03-31

Publications (1)

Publication Number Publication Date
TW202146465A true TW202146465A (zh) 2021-12-16

Family

ID=77928278

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110110032A TW202146465A (zh) 2020-03-31 2021-03-19 硬化性組成物、硬化物及印刷配線板

Country Status (3)

Country Link
JP (1) JPWO2021200258A1 (https=)
TW (1) TW202146465A (https=)
WO (1) WO2021200258A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115413280B (zh) * 2020-07-08 2025-10-21 捷恩智株式会社 光硬化性组合物、喷墨用油墨组合物、活性能量线硬化型油墨组合物、硬化物及电子零件
JPWO2024063144A1 (https=) * 2022-09-22 2024-03-28

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140049983A (ko) * 2011-08-19 2014-04-28 후지필름 가부시키가이샤 감광성 수지 조성물, 및 이것을 사용한 감광성 필름, 감광성 적층체, 영구 패턴 형성방법 및 프린트 기판
JP2013041226A (ja) * 2011-08-19 2013-02-28 Fujifilm Corp 感光性樹脂組成物、並びにこれを用いた感光性フイルム、感光性積層体、永久パターン形成方法およびプリント基板
JP2014205624A (ja) * 2013-04-11 2014-10-30 サンアプロ株式会社 オニウムボレート塩系酸発生剤
JP7076263B2 (ja) * 2018-03-30 2022-05-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品

Also Published As

Publication number Publication date
JPWO2021200258A1 (https=) 2021-10-07
WO2021200258A1 (ja) 2021-10-07

Similar Documents

Publication Publication Date Title
CN113646698B (zh) 光致抗蚀剂组合物及其固化物
CN105278251A (zh) 感光性干膜和使用其的印刷电路板的制造方法
TWI744470B (zh) 光硬化性樹脂組成物、乾薄膜、硬化物及印刷電路板
JP7826426B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TW202146465A (zh) 硬化性組成物、硬化物及印刷配線板
TWI761412B (zh) 硬化性組成物、主劑及硬化劑、乾膜、硬化物以及印刷配線板
TWI817047B (zh) 硬化被膜
TWI864119B (zh) 配線基板用基材的再利用方法
TW201942146A (zh) 鹼顯影型光硬化性熱硬化性樹脂組成物
WO2024075717A1 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
CN116368196A (zh) 固化性树脂组合物和干膜
TW202142620A (zh) 硬化性樹脂組成物、乾膜、硬化物及電子零件
TWI838054B (zh) 基板上的樹脂硬化物之製造方法
JP2025154570A (ja) 感光性樹脂組成物、ドライフィルム、硬化物及び電子部品
JP2022159028A (ja) ２液型硬化性樹脂組成物、製品、ドライフィルム、硬化物、およびプリント配線板
JP2025186944A (ja) ソルダーレジスト用硬化性樹脂組成物、硬化物、及びプリント配線基板
TW202519502A (zh) 感光性樹脂組成物、乾膜、硬化物及電子零件
JP2025021186A (ja) ドライフィルム
JP2025074841A (ja) ドライフィルムおよびその製造方法
JP2023146928A (ja) 樹脂硬化膜を備えた基板の製造方法
CN118613547A (zh) 固化性树脂组合物、固化物、印刷布线板和印刷布线板的制造方法
JP2025099326A (ja) 樹脂組成物を収容したプラスチック容器
JP2020166211A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板、および電子部品