TW202145851A - Method for manufacturing circuit board by using reinforcing frame providing a substrate including a first surface and a second surface which are opposite - Google Patents

Abstract

This invention provides a method for manufacturing a circuit board by using a reinforcing frame. The method includes the following steps: providing a substrate including a first surface and a second surface which are opposite, and disposing a first metal layer on the first surface of the substrate; forming a first reinforcing frame on the first metal layer; forming a first plastic film layer on the first metal layer and the first reinforcing frame; and forming a first circuit layer on the first plastic film layer. Since the method for manufacturing the circuit board by using the reinforcing frame forms the first reinforcing frame in the substrate, a strength of the substrate is improved by virtue of the first reinforcing frame to avoid damages of the substrate or a first circuit layer, so that the production yield and efficiency of the circuit board are increased.

Description

Method of making circuit board using reinforcement frame

The invention relates to a method for manufacturing a circuit board, especially a method for manufacturing a circuit board by using a reinforcing frame.

In the existing circuit board manufacturing method, a first circuit layer is directly formed on a substrate, and then subsequent processes are performed, for example, a second circuit layer is formed on the first circuit layer, or a second circuit layer is formed on the first circuit layer. Then a solder resist layer is formed, so as to complete the fabrication of a circuit board.

However, since the thickness of the substrate is quite thin, the substrate is easily broken during the production process of each circuit layer, resulting in waste products. What's more, when there is a circuit board with one of the substrates broken on the production line, it may cause The entire production line was shut down due to the cracked circuit board, which in turn affected production efficiency.

In addition, in another manufacturing process of a coreless circuit board, when the first circuit layer is completed, the substrate needs to be removed first, and then a subsequent process is performed on the first circuit layer after removing the substrate, such as forming a The second circuit layer, or a solder resist layer is formed, to complete the fabrication of a circuit board of a coreless carrier. However, when the substrate is removed, since the first circuit layer and the substrate are relatively thin, it is easy to cause the first circuit layer to be damaged while the substrate is removed, resulting in waste products and the damaged first circuit layer. It is also easy to affect subsequent processes. Therefore, the circuit board manufacturing method in the prior art is bound to need further improvement.

In view of the shortcomings that the existing circuit board manufacturing method is easy to cause board breakage, resulting in waste products or affecting subsequent manufacturing processes, the present invention provides a method for manufacturing a circuit board using a reinforcing frame, so as to avoid board breakage in the manufacturing process, improve production yield and efficient.

The method for making a circuit board by using a reinforcing frame includes the following steps: A substrate is provided; wherein the substrate includes a first surface and a second surface opposite to each other, and a first metal layer is disposed on the first surface of the substrate; forming a first reinforcement frame on the first metal layer; forming a first film layer on the first metal layer and the first reinforcing frame; A first circuit layer is formed on the first film layer.

Since the method of manufacturing a circuit board by using a reinforcing frame of the present invention is to form the first reinforcing frame in the substrate, the method of manufacturing a circuit board by using a reinforcing frame can strengthen the circuit board by the first reinforcing frame when manufacturing the circuit board. The strength of the substrate can prevent the substrate or the first circuit layer from being damaged, so as to improve the yield and efficiency of circuit board production.

The technical means adopted by the present invention to achieve the predetermined purpose of the invention are further described below with reference to the drawings and the embodiments of the present invention.

The present invention relates to a method for manufacturing a circuit board using a reinforcing frame. Please refer to FIGS. 1A to 1D . A first embodiment of the method for manufacturing a circuit board using a reinforcing frame includes the following steps: As shown in FIG. 1A, a substrate 10 is provided; wherein the substrate 10 includes a first surface 11 and a second surface 12 opposite to each other, and a first metal layer 111 is disposed on the first surface 11 of the substrate 10; in this embodiment In an example, the first metal layer 111 includes a first metal portion 1111 and a first seed portion 1112; in other embodiments, the first metal layer 111 may be formed only by the first metal portion 1111, or Formed only by the first seed portion 1112, or composed of multiple metal layers formed in other ways; As shown in FIG. 1B , a first reinforcement frame 112 is formed on the first metal layer 111 ; the first reinforcement frame 112 is formed in a predetermined invalid area 101 , and there is an effective area 101 relative to the invalid area 101 . District 102; As shown in FIG. 1C , a first film layer 113 is formed on the first metal layer 111 and the first reinforcing frame 112 ; in this embodiment, a third seed portion 1130 is further provided on the first film layer 113 ; As shown in FIG. 1D , a first circuit layer 114 is formed on the first film layer 113 ; in this embodiment, the first circuit layer 114 is formed on the third seed portion 1130 and on the first After the circuit layer 114 is fabricated, the redundant portion of the third seed portion 1130 is removed.

The method of the present invention for manufacturing a circuit board by using a reinforcing frame is to form the first reinforcing frame 112 in the substrate 10, so as to strengthen the strength of the substrate 10 by the first reinforcing frame 112 and avoid the substrate 10, the first circuit Layer 114, or other potentially damaged parts, are broken during the process stage to improve the yield and efficiency of circuit board production.

In this embodiment, the first reinforcement frame 112 is a polyimide film. Since the polyimide film is a soft material, it can provide certain toughness, thereby protecting the substrate 10 , the first circuit layer 114 , or other parts that may be damaged to avoid damage during the process. It should be noted that, the first reinforcement frame 112 is not limited to polyimide film, and other soft materials that can provide certain toughness or other materials that can provide certain protection can also be used as the reinforcement frame.

Referring to FIG. 2 , the first reinforcement frame 112 is formed in the predetermined invalid area 101 . For example, the invalid area 101 corresponds to the periphery of the first metal layer 111 and surrounds the predetermined invalid area 101 . The effective area 102 is used to protect the circuits in the effective area 102 . As shown in FIG. 3A , the first reinforcement frame 112 is formed in the ineffective area 101 in a zigzag shape.

Further, please refer to FIG. 1E and FIG. 1F , in the first embodiment of the method for fabricating a circuit board using a reinforcing frame, when “forming a first circuit layer 114 on the first film layer 113 ” After the steps are completed, the following steps are also included: As shown in FIG. 1E, a second film layer 115 is formed on the first circuit layer 114; As shown in FIG. 1F , the substrate 10 and the first metal portion 1111 and the first seed portion 1112 of the first metal layer 111 are removed.

In the first embodiment, it belongs to a coreless circuit board manufacturing process, so after the first circuit layer 114 is fabricated, the second film layer 115 is further formed, and the substrate 10 is removed to form A circuit board with a coreless carrier.

It should be noted that the invalid area 101 refers to the invalid area of typesetting, and the part of each layer or each element in the invalid area can be cut out correspondingly without affecting the function of the finished product. Therefore, in some processes, the corresponding parts of each layer or each element in the inactive area are directly cut off. For example, in this embodiment, after the step of removing the substrate 10, the first reinforcement frame 112, the first film layer 113, the first circuit layer 114, and the second film layer 115 are in the invalid area The corresponding part in 101 will be cut off.

In addition, when the circuit board is fabricated, a plurality of identical circuit boards can be fabricated at the same time on a common board, and the shared board can be a four-part board, an eight-part board, or other types of sub-boards, so that four boards can be fabricated at the same time. Circuit boards, eight circuit boards, or other numbers of circuit boards, and the distribution positions of the circuit boards on the common board are distinguished by the invalid area 101 .

Cut a common board into four or eight boards by cutting the dead area, thereby saving production time. Therefore, there is no wiring layout in the dead area 101 that needs to exist in the finished product. For example, as shown in FIG. 3B , when the common board is a quarter board, the reinforcing frame 112 has four parallel perforations, which are in the shape of a field, and the shape corresponds to the invalid area 101 , and the four The perforated areas correspond to the wiring areas of the four circuit boards, that is, the effective area 102 , and are used for setting the first circuit layer 114 for wiring. For another example, as shown in FIG. 3C , when the common plate is an eight-part plate, the reinforcing frame 112 has eight parallel through holes, and the shape of the reinforcing frame 112 corresponds to the invalid area 101 . It should be noted that, the reinforcing frame 112 can be matched with various types of common plates, and its shape corresponds to the invalid area of each common plate.

Further, since the substrate 10 has the first surface 11 and the second surface 12 opposite to each other, the second surface can still be used when the circuit board is fabricated on the first surface 11 because the manufacturing process of the circuit board is the same. 12 Make another circuit board to make two circuit boards at the same time, saving the overall manufacturing time of the circuit boards and improving the production efficiency of the production line.

Please refer to FIG. 4A to FIG. 4H , in a second embodiment of the method for fabricating a circuit board by using a reinforcing frame, the following steps are further included: As shown in FIG. 4A , when a substrate 10 is provided, a second metal layer 121 is further provided on the second surface 12 of the substrate 10 ; in this embodiment, the second metal layer 121 includes a second metal portion 1211 and the second seed portion 1212; in other embodiments, the second metal layer 121 may also be a multi-layer metal formed only by the second metal portion 1211, only by the second seed portion 1212, or formed in other ways composed of layers; As shown in FIG. 4B, when the first reinforcement frame 112 is formed on the first metal layer 111, a second reinforcement frame 122 is further formed under the second metal layer 121; similarly, the first reinforcement frame 112 and the second reinforcement frame 122 are also set in a preset invalid area 101, and relative to the invalid area 101, there is an effective area 102; As shown in FIG. 4C , when the first film layer 113 is formed on the first metal layer 111 and the first reinforcement frame 112 , a third film layer 123 is further formed on the second metal layer 121 and the first reinforcing frame 112 . Under the second reinforcing frame 122; in this embodiment, a fourth seed portion 1230 is further provided under the third film layer 123; As shown in FIG. 4D, when the first circuit layer 114 is formed on the first film layer 113, a second circuit layer 124 is further formed under the third film layer 123; The second circuit layer 124 is formed under the fourth seed portion 1230 , and after the second circuit layer 124 is fabricated, the redundant portion of the fourth seed portion 1230 is removed. .

In addition, after the step of "forming the first circuit layer 114 on the first film layer 113" is completed, the following steps are further included: As shown in FIG. 4E, a second film layer 115 is formed on the first circuit layer 114, and a fourth film layer 125 is formed under the second circuit layer 124; in this embodiment, the second film layer A fifth seed portion 1150 is further provided on the 115, and a sixth seed portion 1250 is further provided under the fourth film layer 125; As shown in FIG. 4F , the substrate 10 and the first metal layer 111 are removed; As shown in FIG. 4G, a third circuit layer 116 is formed on the second film layer 115, and a fourth circuit layer 117 is formed under the first reinforcing frame 112 and the first film layer 113; in this embodiment Among them, the third circuit layer 116 is formed on the fifth seed portion 1150, and after the third circuit layer 116 is fabricated, the redundant portion of the fifth seed portion 1150 is removed, and the fourth circuit layer 117 is is formed under the first seed portion 1112, and after the fourth circuit layer 117 is fabricated, the redundant portion of the first seed portion 1112 is removed; As shown in FIG. 4H , a solder resist layer 20 is formed on the third wiring layer 116 , and another solder resist layer 20 is formed under the fourth wiring layer 117 .

After the substrate 10 is removed, the first reinforcing frame 112 , the first film layer 113 , the first circuit layer 114 and the second film layer 115 located on the first surface 11 of the substrate 10 belong to the same circuit board , and the second reinforcing frame 122 , the second film layer 123 , the second circuit layer 124 and the fourth film layer 125 located on the second surface 12 of the substrate 10 belong to another circuit board, and the subsequent process is the same, Therefore, the subsequent process is described by taking the first reinforcement frame 112 , the first film layer 113 , the first circuit layer 114 and the second film layer 115 located on the first surface 11 of the substrate 10 as an example. The second reinforcing frame 122 , the second film layer 123 , the second circuit layer 124 and the fourth film layer 125 located on the second surface 12 of the substrate 10 have the same manufacturing process, so they are not repeated here.

Similarly, the portion within the invalid area 101 may be cut out correspondingly. In this embodiment, after the solder resist layer 20 is formed, the first reinforcement frame 112 and the second reinforcement frame 122 in the invalid area are cut off, and the parts of the layers or components in the invalid area 101 are combined together Correspondingly removed. However, it should be noted that, after the step of removing the substrate, the sequence of the cutting step and other process steps can be arranged according to actual needs, which is not limited herein.

In this embodiment and other embodiments, when each element is sequentially described above and below other elements, it is only to illustrate the relative positional relationship between the elements, and is not intended to be an absolute limitation. The direction of up or down in the actual process can be determined according to actual needs. For example, when the substrate 10 is turned over by 180 degrees, the first surface 11 in FIGS. 4A and 4B can also be facing downward, and the second surface 12 is relatively facing upward; then the first metal layer 111 is disposed on the Facing the lower first surface 11 , the first reinforcing frame 112 is correspondingly formed under the first metal layer 111 , and similarly, the second reinforcing frame 122 is correspondingly formed on the second metal layer 121 .

In addition, please refer to FIG. 5A to FIG. 5G , in a third embodiment of the method for fabricating a circuit board by using a reinforcing frame, the following steps are included: As shown in FIG. 5A, a substrate 10 is provided; wherein the substrate 10 includes a first surface 11 and a second surface 12 opposite to each other, a first metal layer 111 is provided on the first surface 11 of the substrate 10, and the substrate 10 A second metal layer 121 is provided on the second surface 12 of the As shown in FIG. 5B, a first reinforcement frame 112 is formed on the first metal layer 111, and a second reinforcement frame 122 is formed under the second metal layer 121; similarly, the first reinforcement frame 112 and the The second reinforcement frame 122 is set in a preset invalid area 101, and there is an effective area 102 relative to the invalid area 101; As shown in FIG. 5C , a first substrate wiring layer 110 is formed on the first metal layer 111 where the first reinforcing frame 112 is not formed, and a second substrate wiring layer 120 is formed on the second metal layer 121 The lower part is not formed with the second reinforcement frame 122; As shown in FIG. 5D, a first film layer 113 is formed on the first substrate circuit layer 110 and the first reinforcing frame 112, and a third film layer 123 is formed on the second substrate circuit layer 120 and the second under the reinforcing frame 122; in this embodiment, a third seed portion 1130 is further provided on the first film layer 113, and a fourth seed portion 1230 is further provided under the third film layer 123; As shown in FIG. 5E, a first circuit layer 114 is formed on the first film layer 113, and a second circuit layer 124 is formed under the third film layer 123; in this embodiment, the first circuit layer 114 is formed on the third seed portion 1130, and after the first circuit layer 114 is fabricated, the redundant portion of the third seed portion 1130 is removed; the second circuit layer 124 is formed on the fourth seed portion 1230 and after the second circuit layer 124 is fabricated, the redundant portion of the fourth seed portion 1230 is removed.

It should be noted in this embodiment that, in response to different design requirements, in FIG. 5D “the first film layer 113 is formed on the first substrate circuit layer 110 and the first reinforcement frame 112, and the first film layer 113 is formed on the first substrate circuit layer 110 and the first reinforcement frame 112. The step of forming the three film layers 123 under the circuit layer 120 of the second substrate and the second reinforcing frame 122 ” can also be changed to “forming the resistance A solder layer is formed on the first substrate circuit layer 110 and the first reinforcement frame 112, and a solder resist layer is formed under the second substrate circuit layer 120 and the second reinforcement frame 122." Similarly, after the solder resist layer is formed, the first reinforcement frame 112 and the second reinforcement frame 122 in the inactive area 101 and the parts of each layer or each element in the inactive area 101 are correspondingly removed.

In the third embodiment of the method for manufacturing a circuit board using a reinforcing frame, when "the first circuit layer 114 is formed on the first film layer 113, and the second circuit layer 124 is formed on the third film layer After the steps of "123" are completed, the following steps are further included: As shown in FIG. 5F, a second film layer 115 is formed on the first circuit layer 114, and a fourth film layer 125 is formed under the second circuit layer 124; in this embodiment, the second film layer A fifth seed portion 1150 is further provided on the 115 , and a sixth seed portion 1250 is further provided under the fourth film layer 125 .

Similarly, since the part in the invalid area 101 can be cut off after the circuit board is completed, the method of manufacturing the circuit board by using the reinforcing frame is “forming the fourth film layer 125 under the second circuit layer 124”. , you can also include the following steps: The first reinforcement frame 112 and the second reinforcement frame 122 in the invalid area are cut off; and similarly, the parts of each layer or each element in the invalid area 101 are correspondingly cut out.

Similarly, the step of “forming a second film layer 115 on the first circuit layer 114, and forming a fourth film layer 125 under the second circuit layer 124” in FIG. 5F can also be directly changed as required. "Respectively forming a solder resist layer to cover the first circuit layer 114 and the second circuit layer 124". After the solder resist layer is formed, the first reinforcement frame 112 and the second reinforcement frame 122 in the invalid area are cut off. And similarly, the parts of each layer or each element in the inactive area 101 are correspondingly cut out.

In addition, if more layers of circuits need to be further fabricated, after the step of "forming the fourth film layer 125 under the second circuit layer 124", the step of cutting is not performed first, but the following steps are included: As shown in FIG. 5G, a third circuit layer 116 is formed on the second film layer 115, and a fifth circuit layer 126 is formed under the fourth film layer 125; in this embodiment, the third circuit layer 116 is formed on the fifth seed portion 1150, and after the third circuit layer 116 is fabricated, the redundant portion of the fifth seed portion 1150 is removed, and the fifth circuit layer 126 is formed on the sixth seed portion 1250, and after the fifth circuit layer 126 is fabricated, remove the redundant part of the sixth seed portion 1250; As shown in FIG. 5H , a solder resist layer 20 is formed on the third circuit layer 116 , and another solder resist layer 20 is formed under the fifth circuit layer 126 ; After the steps shown in FIG. 5G and FIG. 5H are completed, a similar step of excising the inactive area is performed.

The above descriptions are only the embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make some changes or modifications to equivalent embodiments with equivalent changes, but any content that does not depart from the technical solution of the present invention, according to the technical essence of the present invention, the above Any simple modifications, equivalent changes and modifications made in the examples still fall within the scope of the technical solutions of the present invention.

10: Substrate 11: The first surface 110: first substrate circuit layer 111: first metal layer 1111: The first metal part 1112: The first seed 112: The first reinforcement frame 113: First Film Layer 1130: Third Seed Division 114: The first circuit layer 115: Second Film Layer 1150: Fifth Seed Division 116: The third circuit layer 117: Fourth circuit layer 101: Invalid area 102: Effective area 12: Second surface 120: Second substrate circuit layer 121: second metal layer 1211: Second metal part 1212: Second seed 122: Second reinforcement frame 123: Third Film Layer 1230: Fourth Seed Division 124: Second circuit layer 125: Fourth Film Layer 1250: Sixth Seed Division 126: Fifth circuit layer 20: Solder mask

FIG. 1A to FIG. 1F are schematic diagrams of the manufacturing method according to the first embodiment of the present invention. FIG. 2 is a schematic diagram of a layered decomposition of the first embodiment of the present invention. 3A, FIG. 3B, and FIG. 3C are schematic appearance diagrams of different implementations of the first reinforcement frame of the present invention. FIG. 4A to FIG. 4H are schematic flowcharts of the manufacturing method according to the second embodiment of the present invention. 5A to 5H are schematic flowcharts of a manufacturing method according to a third embodiment of the present invention.

10: Substrate

111: first metal layer

101: Invalid area

102: Effective area

112: The first reinforcement frame

113: First Film Layer

114: The first circuit layer

Claims (10)

A method for making a circuit board by using a reinforcing frame, comprising the following steps: A substrate is provided; wherein the substrate includes a first surface and a second surface opposite to each other, and a first metal layer is disposed on the first surface of the substrate; forming a first reinforcement frame on the first metal layer; forming a first film layer on the first metal layer and the first reinforcing frame; A first circuit layer is formed on the first film layer. The method for manufacturing a circuit board using a reinforcing frame as claimed in claim 1, wherein the first reinforcing frame is formed in a predetermined invalid area. The method for manufacturing a circuit board using a reinforcing frame as claimed in claim 2, wherein after the step of forming the first circuit layer on the first film layer, the following steps are further included: forming a second film layer on the first circuit layer; remove the substrate; The first reinforcement frame in the invalid area is cut off. The method for manufacturing a circuit board using a reinforcing frame as claimed in claim 1, wherein a second metal layer is further provided on the second surface of the substrate; wherein when the first reinforcement frame is formed on the first metal layer, a second reinforcement frame is further formed on the second metal layer; wherein when the first film layer is formed on the first metal layer and the first reinforcement frame, a third film layer is further formed on the second metal layer and the second reinforcement frame; wherein when the first circuit layer is formed on the first film layer, a second circuit layer is further formed on the third film layer; wherein after the step of forming the first circuit layer on the first film layer, a second film layer is further formed on the first circuit layer, and a fourth film layer is formed on the second circuit layer; Remove the substrate. The method for manufacturing a circuit board using a reinforcing frame as claimed in claim 4, wherein the first reinforcing frame and the second reinforcing frame are formed in a predetermined invalid area. The method for manufacturing a circuit board using a reinforcing frame according to claim 5, wherein after the step of removing the substrate, the following steps are further included: The first reinforcement frame and the second reinforcement frame in the invalid area are cut off. A method for making a circuit board by using a reinforcing frame, comprising the following steps: A substrate is provided; wherein the substrate includes a first surface and a second surface opposite to each other, the first surface of the substrate is provided with a first metal layer, and the second surface of the substrate is provided with a second metal layer; forming a first reinforcing frame on the first metal layer, and forming a second reinforcing frame on the second metal layer; A first substrate circuit layer is formed on the portion of the first metal layer where the first reinforcing frame is not formed, and a second substrate circuit layer is formed on the portion of the second metal layer where the second reinforcing frame is not formed. The method for manufacturing a circuit board using a reinforcing frame according to claim 7, wherein the first reinforcing frame and the second reinforcing frame are formed in a predetermined invalid area. The method for manufacturing a circuit board using a reinforcing frame as claimed in claim 8, wherein the second substrate circuit layer is formed on the portion of the first metal layer where the first reinforcing frame is not formed when the first substrate circuit layer is formed After the step of forming the part of the second metal layer without the second reinforcing frame, the following steps are further included: forming a first film layer on the first substrate circuit layer and the first reinforcing frame, and forming a third film layer on the second substrate circuit layer and the second reinforcing frame; forming a first circuit layer on the first film layer, and forming a second circuit layer on the third film layer; A second film layer is formed on the first circuit layer, and a fourth film layer is formed on the second circuit layer. The method for manufacturing a circuit board using a reinforcing frame as claimed in claim 9, wherein after the steps of forming the second film layer on the first circuit layer and forming the fourth film layer on the second circuit layer, further comprising: There are the following steps: The first reinforcement frame and the second reinforcement frame in the invalid area are cut off.

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