TWI717278B - Method for making circuit board using reinforcing frame - Google Patents

Abstract

The present invention provides a method for manufacturing a circuit board using a reinforcing frame, including the following steps: providing a substrate including a first surface and a second surface opposite to each other, and a first metal layer is provided on the first surface of the substrate; Forming a first reinforcing frame on the first metal layer; forming a first film layer on the first metal layer and the first reinforcing frame; forming a first circuit layer on the first film layer. Because the method for manufacturing a circuit board using a reinforcing frame is to form the first reinforcing frame in the substrate, the strength of the substrate is strengthened by the first reinforcing frame to avoid damage to the substrate or the first circuit layer to improve The yield and efficiency of circuit board production.

Description

Method for making circuit board using reinforcing frame

The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a circuit board by using a reinforcing frame.

The existing circuit board manufacturing method is to directly form a first circuit layer on a substrate, and then perform subsequent processes, such as forming a second circuit layer above the first circuit layer, or above the first circuit layer Then a solder resist layer is formed, thus completing the manufacture of a circuit board.

However, because the thickness of the substrate is quite thin, the substrate is easy to crack during the production process of each circuit layer, resulting in waste products. What is more, when there is a circuit board with a broken substrate on the production line, it may cause The entire production line was shut down due to the broken circuit board of the substrate, which affected the production efficiency.

In addition, in another coreless circuit board manufacturing process, when the first circuit layer is completed, the substrate needs to be removed first, and then the subsequent process is performed on the first circuit layer after the substrate is removed, such as forming a The second circuit layer may form a solder resist layer to complete the manufacture of a circuit board without a core carrier. However, when the substrate is removed, since the first circuit layer and the substrate are quite thin, it is easy to cause the first circuit layer to be damaged while removing the substrate, and form a waste product, and the damaged first circuit layer It is also easy to affect the subsequent manufacturing process. Therefore, the prior art circuit board manufacturing method inevitably needs further improvement.

In view of the shortcomings that the existing circuit board manufacturing method is easy to cause the board to be broken, forming a waste product or affecting the subsequent manufacturing process, the present invention provides a method for manufacturing a circuit board by using a reinforcing frame to avoid board breakage in the manufacturing process and improve the production yield and effectiveness.

The method of making a circuit board using a reinforcing frame includes the following steps: A substrate is provided; wherein the substrate includes a first surface and a second surface opposite to each other, and the first surface of the substrate is provided with a first metal layer; Forming a first reinforcing frame on the first metal layer; Forming a first film layer on the first metal layer and the first reinforcing frame; A first circuit layer is formed on the first film layer.

Since the method for manufacturing a circuit board using a reinforcing frame of the present invention is to form the first reinforcing frame in the substrate, the method for manufacturing a circuit board using a reinforcing frame can be reinforced by the first reinforcing frame when manufacturing a circuit board The strength of the substrate prevents the substrate or the first circuit layer from being damaged, so as to improve the yield and efficiency of circuit board production.

The following describes the technical means adopted by the present invention to achieve the intended purpose of the invention in conjunction with the drawings and the embodiments of the present invention.

The present invention is a method for manufacturing a circuit board using a reinforcing frame. Please refer to FIG. 1A to FIG. 1D. A first embodiment of the method for manufacturing a circuit board using a reinforcing frame includes the following steps: As shown in FIG. 1A, a substrate 10 is provided; wherein the substrate 10 includes a first surface 11 and a second surface 12 opposite to each other, and the first surface 11 of the substrate 10 is provided with a first metal layer 111; in this embodiment In an example, the first metal layer 111 includes a first metal portion 1111 and a first seed portion 1112; in other embodiments, the first metal layer 111 may also be formed only by the first metal portion 1111, or It is formed only by the first seed part 1112, or is composed of multiple metal layers formed in other ways; As shown in FIG. 1B, a first reinforcement frame 112 is formed on the first metal layer 111; the first reinforcement frame 112 is formed in a preset invalid region 101, and relative to the invalid region 101, there is a valid Area 102; As shown in FIG. 1C, a first film layer 113 is formed on the first metal layer 111 and the first reinforcement frame 112; in this embodiment, the first film layer 113 is further provided with a third seed part 1130 ； As shown in FIG. 1D, a first circuit layer 114 is formed on the first film layer 113; in this embodiment, the first circuit layer 114 is formed on the third seed portion 1130, and is formed on the first After the circuit layer 114 is completed, the redundant part of the third seed part 1130 is removed.

The method of manufacturing a circuit board using a reinforcing frame of the present invention is to form the first reinforcing frame 112 in the substrate 10, so as to strengthen the strength of the substrate 10 by the first reinforcing frame 112, and avoid the substrate 10 and the first circuit The layer 114 or other parts that may be damaged are damaged during the manufacturing process to improve the yield and efficiency of circuit board production.

In this embodiment, the first reinforcing frame 112 is a polyimide film. Since the polyimide film is a soft material, it can provide a certain degree of toughness, thereby protecting the substrate 10, the first circuit layer 114, or other parts that may be damaged to avoid damage during the manufacturing process. It should be noted that the first reinforcement frame 112 is not limited to a polyimide film, and other soft materials that can provide a certain degree of toughness or other materials that can provide a certain degree of protection can also be applied as a reinforcement frame.

Please refer to FIG. 2, the first reinforcing frame 112 is formed in the preset invalid area 101. For example, the invalid area 101 corresponds to the periphery of the first metal layer 111 and surrounds the preset The effective area 102 protects the circuits in the effective area 102. As shown in FIG. 3A, the first reinforcing frame 112 is formed in a square shape to be formed in the ineffective area 101.

Further, please refer to FIG. 1E and FIG. 1F. In the first embodiment of the method for fabricating a circuit board by using a reinforcing frame, when "a first circuit layer 114 is formed on the first film layer 113" After the steps are completed, it also contains the following steps: As shown in FIG. 1E, a second film layer 115 is formed on the first circuit layer 114; As shown in FIG. 1F, the substrate 10 and the first metal portion 1111 and the first seed portion 1112 of the first metal layer 111 are removed.

In the first embodiment, it belongs to a coreless circuit board manufacturing process. Therefore, after the first circuit layer 114 is manufactured, the second film layer 115 is further formed, and the substrate 10 is removed to form A circuit board without a core carrier.

It should be noted that the invalid area 101 refers to the invalid area of typesetting, and the parts of each layer or element in the invalid area can be correspondingly cut without affecting the function of the finished product. Therefore, in some manufacturing processes, the corresponding parts of each layer or each element in the invalid region are directly cut off. For example, in this embodiment, after the step of removing the substrate 10, the first reinforcing frame 112, the first film layer 113, the first circuit layer 114, and the second film layer 115 are in the invalid area. The corresponding part in 101 will be cut off.

In addition, as the circuit board is manufactured, multiple identical circuit boards can be made on a common board at the same time, and the common board can be a quarter board, an eighth board, or other types of sub-boards to make four at the same time Circuit boards, eight circuit boards, or other number of circuit boards, and the distribution positions of the circuit boards on the common board are distinguished by the invalid area 101.

Cut a common board into four or eight circuit boards by cutting the invalid area, thereby saving production time. Therefore, there is no circuit layout in the invalid area 101 that needs to be in the finished product. For example, as shown in FIG. 3B, when the common board is a four-part board, the reinforcing frame 112 has four parallel perforations, which are in the shape of a square, and the shape corresponds to the invalid area 101, and the four The perforated area corresponds to the wiring area of the four circuit boards, that is, the effective area 102, which is used for setting the wiring of the first circuit layer 114. For another example, as shown in FIG. 3C, when the shared board is an eighth-divided board, the reinforcing frame 112 has eight parallel perforations, and the shape of the reinforcing frame 112 corresponds to the invalid area 101. It should be noted that the reinforcing frame 112 can be matched with various types of common boards, and the shape of the reinforcing frame 112 can be matched with the invalid area of each common board.

Furthermore, since the substrate 10 has the first surface 11 and the second surface 12 opposite to each other, the manufacturing process of the circuit board is the same, so when the circuit board is made on the first surface 11, the second surface can still be used 12 Make another circuit board to make two circuit boards at the same time, saving the overall production time of the circuit board and improving the production efficiency of the production line.

Please refer to FIG. 4A to FIG. 4H. In a second embodiment of the method for manufacturing a circuit board by using a reinforcing frame, the method further includes the following steps: As shown in FIG. 4A, when a substrate 10 is provided, the second surface 12 of the substrate 10 is further provided with a second metal layer 121; in this embodiment, the second metal layer 121 includes a second metal portion 1211 And the second seed part 1212; in other embodiments, the second metal layer 121 may also be formed by only the second metal part 1211, or only by the second seed part 1212, or a multilayer metal formed in other ways Layer composition As shown in FIG. 4B, when the first reinforcement frame 112 is formed on the first metal layer 111, a second reinforcement frame 122 is further formed under the second metal layer 121; similarly, the first reinforcement frame 112 and the second reinforcement frame 122 are also arranged in a preset invalid area 101, and there is a valid area 102 relative to the invalid area 101; As shown in FIG. 4C, when the first film layer 113 is formed on the first metal layer 111 and the first reinforcement frame 112, a third film layer 123 is further formed on the second metal layer 121 and the first reinforcement frame 112. Under the second reinforcing frame 122; in this embodiment, a fourth seed part 1230 is further provided under the third film layer 123; As shown in FIG. 4D, when the first circuit layer 114 is formed on the first film layer 113, a second circuit layer 124 is further formed under the third film layer 123; in this embodiment, the The second circuit layer 124 is formed under the fourth seed portion 1230, and after the second circuit layer 124 is completed, the excess portion of the fourth seed portion 1230 is removed. .

In addition, after the step of "forming the first circuit layer 114 on the first film layer 113" is completed, the following steps are further included: As shown in FIG. 4E, a second film layer 115 is formed on the first circuit layer 114, and a fourth film layer 125 is formed under the second circuit layer 124; in this embodiment, the second film layer 115 is further provided with a fifth seed part 1150, and the fourth film layer 125 is further provided with a sixth seed part 1250; As shown in FIG. 4F, the substrate 10 and the first metal layer 111 are removed; As shown in FIG. 4G, a third circuit layer 116 is formed on the second film layer 115, and a fourth circuit layer 117 is formed under the first reinforcing frame 112 and the first film layer 113; in this embodiment In this case, the third circuit layer 116 is formed on the fifth seed portion 1150, and after the third circuit layer 116 is fabricated, the excess part of the fifth seed portion 1150 is removed, and the fourth circuit layer 117 is Be formed under the first seed portion 1112, and after the fourth circuit layer 117 is completed, remove the excess part of the first seed portion 1112; As shown in FIG. 4H, a solder resist layer 20 is formed on the third circuit layer 116, and another solder resist layer 20 is formed under the fourth circuit layer 117.

Because when the substrate 10 is removed, the first reinforcement frame 112, the first film layer 113, the first circuit layer 114, and the second film layer 115 on the first surface 11 of the substrate 10 belong to the same circuit board , And the second reinforcing frame 122, the second film layer 123, the second circuit layer 124, and the fourth film layer 125 on the second surface 12 of the substrate 10 belong to another circuit board, and the subsequent manufacturing processes are the same. Therefore, the first reinforcing frame 112, the first film layer 113, the first circuit layer 114 and the second film layer 115 on the first surface 11 of the substrate 10 are taken as examples to illustrate the subsequent manufacturing process. The second reinforcing frame 122, the second film layer 123, the second circuit layer 124, and the fourth film layer 125 located on the second surface 12 of the substrate 10 are not repeated here because the manufacturing process is the same.

Similarly, the part in the invalid area 101 can be correspondingly cut off. In this embodiment, after the solder resist layer 20 is formed, the first reinforcement frame 112 and the second reinforcement frame 122 in the ineffective area are removed, and the portions of the layers or components in the ineffective area 101 are combined. Correspondence is cut off. However, it should be noted that after the step of removing the substrate, the sequence of the cutting step and other process steps can be arranged according to actual needs, which is not limited here.

In this embodiment and other embodiments, when each element is described in sequence above and below other elements, it is only used to illustrate the relative positional relationship between the elements in conjunction with the illustrations, and is not an absolute limitation. The up or down direction in the actual manufacturing process can be determined according to actual needs. For example, when the substrate 10 is turned over 180 degrees, the first surface 11 in FIGS. 4A and 4B may also face downward, and the second surface 12 may face upward relatively; then the first metal layer 111 is disposed on Facing the first surface 11 below, the first reinforcing frame 112 is correspondingly formed under the first metal layer 111, and similarly, the second reinforcing frame 122 is correspondingly formed on the second metal layer 121.

In addition, referring to FIG. 5A to FIG. 5G, in a third embodiment of the method for manufacturing a circuit board by using a reinforcing frame, the following steps are included: As shown in FIG. 5A, a substrate 10 is provided; wherein the substrate 10 includes a first surface 11 and a second surface 12 opposite to each other. The first surface 11 of the substrate 10 is provided with a first metal layer 111, and the substrate 10 Is provided with a second metal layer 121 on the second surface 12; As shown in FIG. 5B, a first reinforcement frame 112 is formed on the first metal layer 111, and a second reinforcement frame 122 is formed under the second metal layer 121; similarly, the first reinforcement frame 112 and the The second reinforcing frame 122 is arranged in a preset invalid area 101, and relative to the invalid area 101, there is an effective area 102; As shown in FIG. 5C, a first substrate circuit layer 110 is formed on the first metal layer 111 where the first reinforcement frame 112 is not formed, and a second substrate circuit layer 120 is formed on the second metal layer 121 The part where the second reinforcing frame 122 is not formed below; As shown in FIG. 5D, a first film layer 113 is formed on the first substrate circuit layer 110 and the first reinforcement frame 112, and a third film layer 123 is formed on the second substrate circuit layer 120 and the second Under the reinforcing frame 122; in this embodiment, a third seed part 1130 is further provided on the first film layer 113, and a fourth seed part 1230 is further provided under the third film layer 123; As shown in FIG. 5E, a first circuit layer 114 is formed on the first film layer 113, and a second circuit layer 124 is formed under the third film layer 123; in this embodiment, the first circuit layer 114 is formed on the third seed portion 1130, and after the first circuit layer 114 is completed, the excess part of the third seed portion 1130 is removed; the second circuit layer 124 is formed on the fourth seed portion 1230 After the second circuit layer 124 is fabricated, the excess part of the fourth seed portion 1230 is removed.

In this embodiment, it should be explained that in response to different design requirements, in FIG. 5D, "form the first film layer 113 on the first substrate circuit layer 110 and the first reinforcement frame 112, and form the second The step of "three film layers 123 under the second substrate circuit layer 120 and the second reinforcement frame 122" can also be changed to "form a barrier instead of forming the first film layer 113 and the third film layer 123 as required. The solder layer is on the first substrate circuit layer 110 and the first reinforcement frame 112, and a solder resist layer is formed under the second substrate circuit layer 120 and the second reinforcement frame 122". And similarly, after the solder resist layer is formed, the first reinforcement frame 112 and the second reinforcement frame 122 in the ineffective area 101 are correspondingly removed, as well as the portions of the layers or components in the ineffective area 101.

In the third embodiment of the method of making a circuit board by using a reinforcing frame, when the first circuit layer 114 is formed on the first film layer 113, and the second circuit layer 124 is formed on the third film layer After the steps under 123 are completed, it further includes the following steps: As shown in FIG. 5F, a second film layer 115 is formed on the first circuit layer 114, and a fourth film layer 125 is formed under the second circuit layer 124; in this embodiment, the second film layer A fifth seed part 1150 is further provided on the 115, and a sixth seed part 1250 is further provided under the fourth film layer 125.

Similarly, when the circuit board is completed, the part in the invalid area 101 can be cut off, so the method of making the circuit board by using the reinforcing frame is to "form the fourth film layer 125 under the second circuit layer 124" After the steps, you can also include the following steps: The first reinforcement frame 112 and the second reinforcement frame 122 in the ineffective area are cut; and similarly, the portions of the layers or components in the ineffective area 101 are correspondingly cut out.

Similarly, the step of "forming a second film layer 115 on the first circuit layer 114 and forming a fourth film layer 125 under the second circuit layer 124" in FIG. 5F can also be directly changed to "Form a solder resist layer to cover the first circuit layer 114 and the second circuit layer 124, respectively." After the solder resist layer is formed, the first reinforcing frame 112 and the second reinforcing frame 122 in the invalid area are cut off. And similarly, the parts of each layer or each element in the invalid region 101 are cut out correspondingly.

In addition, if it is necessary to further fabricate more layers of circuits, after the step of "forming the fourth film layer 125 under the second circuit layer 124", the cutting step is not performed first, but the following steps are included: As shown in FIG. 5G, a third circuit layer 116 is formed on the second film layer 115, and a fifth circuit layer 126 is formed under the fourth film layer 125; in this embodiment, the third circuit layer 116 is formed on the fifth seed portion 1150, and after the third circuit layer 116 is completed, the excess part of the fifth seed portion 1150 is removed, and the fifth circuit layer 126 is formed on the sixth seed portion Under 1250, and after the manufacture of the fifth circuit layer 126 is completed, remove the excess part of the sixth seed part 1250; As shown in FIG. 5H, a solder resist layer 20 is formed on the third circuit layer 116, and another solder resist layer 20 is formed under the fifth circuit layer 126; After the steps shown in FIG. 5G and FIG. 5H are completed, a similar ineffective area removal step is performed.

The above are only the embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with the field will not Without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make slight changes or modification into equivalent embodiments with equivalent changes, as long as the content of the technical solution of the present invention is not deviated from the technical solution of the present invention, the above Any simple modifications, equivalent changes and modifications made in the embodiments still fall within the scope of the technical solutions of the present invention.

10: substrate 11: First surface 110: The first substrate circuit layer 111: first metal layer 1111: The first metal part 1112: The first seed department 112: The first reinforcement frame 113: The first film layer 1130: Third Seed Division 114: first circuit layer 115: second film layer 1150: Fifth Seed Department 116: third circuit layer 117: The fourth circuit layer 101: invalid area 102: effective area 12: second surface 120: second substrate circuit layer 121: second metal layer 1211: The second metal part 1212: Second Seed Department 122: second reinforcement frame 123: The third film layer 1230: Fourth Seed Department 124: second circuit layer 125: fourth film layer 1250: Sixth Seed Department 126: Fifth circuit layer 20: Solder mask

Figures 1A to 1F are schematic diagrams of the manufacturing process of the first embodiment of the present invention. Fig. 2 is a schematic view of the layered decomposition of the first embodiment of the present invention. 3A, 3B, and 3C are schematic diagrams of the appearance of different implementations of the first reinforcing frame of the present invention. 4A to 4H are schematic diagrams of the manufacturing process of the second embodiment of the present invention. 5A to 5H are schematic diagrams of the manufacturing process of the third embodiment of the present invention.

10: substrate

111: first metal layer

101: invalid area

102: effective area

112: The first reinforcement frame

113: The first film layer

114: first circuit layer

Claims (10)

A method of making a circuit board using a reinforcing frame, including the following steps: A substrate is provided; wherein the substrate includes a first surface and a second surface opposite to each other, and the first surface of the substrate is provided with a first metal layer; Forming a first reinforcing frame on the first metal layer; Forming a first film layer on the first metal layer and the first reinforcing frame; A first circuit layer is formed on the first film layer. The method for manufacturing a circuit board using a reinforcing frame as described in claim 1, wherein the first reinforcing frame is formed in a preset invalid area. The method for manufacturing a circuit board using a reinforcing frame as described in claim 2, wherein after the step of forming the first circuit layer on the first film layer, the method further includes the following steps: Forming a second film layer on the first circuit layer; Remove the substrate; Cut the first reinforcement frame in the invalid area. The method for manufacturing a circuit board using a reinforcing frame as described in claim 1, wherein a second metal layer is further provided on the second surface of the substrate; Wherein when the first reinforcing frame is formed on the first metal layer, a second reinforcing frame is further formed on the second metal layer; Wherein when forming the first film layer on the first metal layer and the first reinforcement frame, a third film layer is further formed on the second metal layer and the second reinforcement frame; Wherein when forming the first circuit layer on the first film layer, further forming a second circuit layer on the third film layer; After the step of forming the first circuit layer on the first film layer, a second film layer is further formed on the first circuit layer, and a fourth film layer is formed on the second circuit layer; Remove the substrate. According to claim 4, the method for manufacturing a circuit board using a reinforcing frame, wherein the first reinforcing frame and the second reinforcing frame are formed in a preset invalid area. As described in claim 5, the method for manufacturing a circuit board using a reinforcing frame, wherein after the step of removing the substrate, further includes the following steps: The first reinforcement frame and the second reinforcement frame in the invalid area are cut off. A method of making a circuit board using a reinforcing frame, including the following steps: A substrate is provided; wherein the substrate includes a first surface and a second surface opposite to each other, the first surface of the substrate is provided with a first metal layer, and the second surface of the substrate is provided with a second metal layer; Forming a first reinforcing frame on the first metal layer, and forming a second reinforcing frame on the second metal layer; A first substrate circuit layer is formed on the portion of the first metal layer where the first reinforcement frame is not formed, and a second substrate circuit layer is formed on the portion of the second metal layer where the second reinforcement frame is not formed. The method for manufacturing a circuit board using a reinforcing frame as described in claim 7, wherein the first reinforcing frame and the second reinforcing frame are formed in a preset invalid area. The method for manufacturing a circuit board by using a reinforcing frame as described in claim 8, wherein the first substrate circuit layer is formed in the portion of the first metal layer where the first reinforcing frame is not formed, and the second substrate circuit layer is formed After the step of not forming the portion of the second reinforcing frame on the second metal layer, the step further includes the following steps: Forming a first film layer on the first substrate circuit layer and the first reinforcement frame, and forming a third film layer on the second substrate circuit layer and the second reinforcement frame; Forming a first circuit layer on the first film layer, and forming a second circuit layer on the third film layer; A second film layer is formed on the first circuit layer, and a fourth film layer is formed on the second circuit layer. The method for manufacturing a circuit board using a reinforcing frame as described in claim 9, wherein after the step of forming the second film layer on the first circuit layer and forming the fourth film layer on the second circuit layer, it further comprises There are the following steps: The first reinforcement frame and the second reinforcement frame in the invalid area are cut off.

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