JP2007230223A5 - - Google Patents

Download PDF

Info

Publication number
JP2007230223A5
JP2007230223A5 JP2007006646A JP2007006646A JP2007230223A5 JP 2007230223 A5 JP2007230223 A5 JP 2007230223A5 JP 2007006646 A JP2007006646 A JP 2007006646A JP 2007006646 A JP2007006646 A JP 2007006646A JP 2007230223 A5 JP2007230223 A5 JP 2007230223A5
Authority
JP
Japan
Prior art keywords
hole
metal
resist
forming
annular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007006646A
Other languages
Japanese (ja)
Other versions
JP5034506B2 (en
JP2007230223A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2007006646A priority Critical patent/JP5034506B2/en
Priority claimed from JP2007006646A external-priority patent/JP5034506B2/en
Publication of JP2007230223A publication Critical patent/JP2007230223A/en
Publication of JP2007230223A5 publication Critical patent/JP2007230223A5/ja
Application granted granted Critical
Publication of JP5034506B2 publication Critical patent/JP5034506B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (4)

金属板にパターン状の孔が設けられてなるメタルマスクであって、その被印刷物側の面に、当該面からの高さが略揃い、かつ、その端部が平面状の複数のポストが、全面にわたり配されており、前記被印刷物側の面における前記孔の縁に、当該面からの高さが前記ポストと略同一で、前記孔を取り囲む環状突起が形成されてなることを特徴とするメタルマスク。 A metal mask in which a patterned hole is provided in a metal plate, the surface on the side of the substrate to be printed, the height from the surface is substantially uniform, and a plurality of posts whose ends are planar, It is arranged over the entire surface, and an annular protrusion surrounding the hole is formed on the edge of the hole on the surface of the substrate to be printed, the height from the surface being substantially the same as the post. Metal mask. 前記環状突起において、その一部に、環の内外に渡り、被印刷物側の面からの高さが低い部位を有することを特徴とする請求項１に記載のメタルマスク。 In the annular projection, in part, over and out of the ring, the metal mask according to claim 1, characterized in that it comprises a lower height region from the surface of the substrate side. 平面を有する金属母材の当該平面に対して、所望のパターン状のレジストを形成する第１レジスト形成工程と、
金属母材のレジストが形成された面に金属メッキを施し、前記パターン状の孔が穿たれた金属メッキ層を形成する第１メッキ工程と、
金属母材の金属メッキ層が形成された面に、複数のホール状の貫通孔が穿たれたレジストを形成するとともに、前記金属メッキ層に穿たれた前記パターン状の孔を取り囲む環状、または、当該孔とそれを取り囲む環とからなる円盤状の貫通孔がさらに穿たれたレジストを形成する第２レジスト形成工程と、
金属母材のレジストが形成された面に、再び前記金属メッキと同一材質の金属メッキを施し、前記ホール状の貫通孔に対応する金属メッキのポストを形成するとともに、前記貫通孔における環状の部位に対応する金属メッキの環状突起を形成する第２メッキ工程と、
残存する前記レジストを剥離する剥離工程と、
金属母材から、積層されたメッキ層を脱型してメタルマスクを得る脱型工程と、
を含むことを特徴とするメタルマスクの製造方法。 A first resist forming step for forming a resist in a desired pattern on the plane of the metal base material having a plane;
A first plating step of performing metal plating on the surface of the metal base material on which the resist is formed, and forming a metal plating layer having the pattern-shaped holes;
Forming a resist having a plurality of hole-like through holes on the surface of the metal base material on which the metal plating layer is formed, and an annular shape surrounding the pattern-like hole made in the metal plating layer, or A second resist forming step of forming a resist in which a disc-shaped through hole including the hole and a ring surrounding the hole is further formed;
The surface of the metal base material on which the resist is formed is again subjected to metal plating of the same material as the metal plating to form a metal plating post corresponding to the hole-shaped through hole, and an annular portion in the through hole A second plating step of forming an annular protrusion of metal plating corresponding to
A peeling step for peeling off the remaining resist;
A demolding step of demolding the laminated plating layer from the metal base material to obtain a metal mask,
A metal mask manufacturing method comprising: 第２レジスト形成工程において形成するレジストに穿たれた環状または円盤状の貫通孔が、環状の部位において、環の内外に渡り、レジストが形成されている部位を有することを特徴とする請求項３に記載のメタルマスクの製造方法。 Resist drilled an annular or disc-shaped through hole formed in the second resist formation step, at the site of annular claim 3, characterized in that it has a portion over the inside and outside of the ring, the resist is formed The manufacturing method of the metal mask as described in 2.
JP2007006646A 2006-01-31 2007-01-16 Metal mask and manufacturing method thereof Expired - Fee Related JP5034506B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007006646A JP5034506B2 (en) 2006-01-31 2007-01-16 Metal mask and manufacturing method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006022788 2006-01-31
JP2006022788 2006-01-31
JP2007006646A JP5034506B2 (en) 2006-01-31 2007-01-16 Metal mask and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2007230223A JP2007230223A (en) 2007-09-13
JP2007230223A5 true JP2007230223A5 (en) 2010-02-25
JP5034506B2 JP5034506B2 (en) 2012-09-26

Family

ID=38551269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007006646A Expired - Fee Related JP5034506B2 (en) 2006-01-31 2007-01-16 Metal mask and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP5034506B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5561110B2 (en) * 2010-11-10 2014-07-30 日本電気株式会社 Multilayer wiring structure and manufacturing method
JP6638221B2 (en) * 2015-06-19 2020-01-29 日本電気株式会社 Print mask and method of manufacturing the same
JP6486872B2 (en) * 2016-08-31 2019-03-20 太陽誘電株式会社 Stencil for printing

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781263A (en) * 1993-09-14 1995-03-28 Dainippon Screen Mfg Co Ltd Screen printing block

Similar Documents

Publication Publication Date Title
JP2010141018A5 (en)
TWI265639B (en) Air gap interconnect structure and method thereof
JP2009135184A5 (en)
WO2007104171A3 (en) Uv-liga process for fabricating a multilayer metal structure having adjacent layers that are not entirely superposed, and structure obtained
JP2009099681A5 (en)
JP5607312B2 (en) Vapor deposition mask and manufacturing method thereof
JP2010519738A5 (en)
WO2004101857A3 (en) Methods and apparatus for forming multi-layer structures using adhered masks
JP2009141121A5 (en)
JP2008523618A5 (en)
JP2008500727A5 (en)
JP2007150275A5 (en)
TW200619856A (en) Printing plate and method for fabricating the same
JP2008282842A5 (en)
JP2017516308A5 (en)
JP2007142382A5 (en)
JP2007230223A5 (en)
JP2006261390A5 (en)
JP2010192781A5 (en)
JP2009081357A5 (en)
JP2007180212A (en) Manufacturing method and intermediate product of wiring board
TW200633578A (en) Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device
EP2091309A3 (en) Producing Method of Wired Circuit Board
JP2006165595A5 (en)
JP2017517142A5 (en)