CN113097419B - Preparation method of organic light-emitting display panel, organic light-emitting display panel and device - Google Patents
Preparation method of organic light-emitting display panel, organic light-emitting display panel and device Download PDFInfo
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- CN113097419B CN113097419B CN202110368949.7A CN202110368949A CN113097419B CN 113097419 B CN113097419 B CN 113097419B CN 202110368949 A CN202110368949 A CN 202110368949A CN 113097419 B CN113097419 B CN 113097419B
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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Abstract
The application discloses a preparation method of an organic light-emitting display panel, the organic light-emitting display panel and a device, wherein the method comprises the following steps: arranging an organic light-emitting display device on one side of a substrate to obtain a first intermediate substrate, wherein the first intermediate substrate comprises a function binding region and a cutting region, and the cutting region surrounds the function binding region; arranging an encapsulation layer on the whole surface of one side of the first intermediate substrate, which is far away from the substrate; etching the whole packaging layer to form a packaging pattern, so that the cutting region surrounds a packaging projection, and the packaging projection is adjacent to the function binding region, wherein the packaging projection is an orthographic projection of the packaging pattern on the first middle substrate. The method can avoid the occurrence of shadow areas at the edges of the packaging layer, thereby avoiding the problem of reliability reduction of the organic light-emitting display panel caused by the shadow areas.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a method for manufacturing an organic light emitting display panel, and an apparatus.
Background
In the organic light emitting display panel, the organic light emitting material and the metal electrode are easily corroded by water and oxygen inside and outside to generate oxidation reaction, so that pixels shrink or do not emit light. The packaging layer is arranged to prevent external water and oxygen from entering and corroding the organic light-emitting device, so that the organic light-emitting device is protected, and the service life of the organic light-emitting device can be prolonged.
However, in the preparation process of the organic light emitting display panel, the arrangement manner of the encapsulation layer is prone to generate a shadow region at the edge of the encapsulation layer, and the shadow region is prone to cause a reduction in reliability of the organic light emitting display panel.
Disclosure of Invention
The embodiment of the application provides a preparation method of an organic light-emitting display panel, the organic light-emitting display panel and a device, which can avoid the occurrence of a shadow region at the edge of a packaging layer, thereby avoiding the problem of reliability reduction of the organic light-emitting display panel caused by the shadow region.
In a first aspect, a method of fabricating an organic light emitting display panel includes:
arranging an organic light-emitting display device on one side of a substrate to obtain a first intermediate substrate, wherein the first intermediate substrate comprises a function binding region and a cutting region, and the cutting region surrounds the function binding region;
arranging an encapsulation layer on the whole surface of one side of the first intermediate substrate, which is far away from the substrate;
etching the whole packaging layer to form a packaging pattern, so that the cutting area surrounds a packaging projection, and the packaging projection is adjacent to the function binding area, wherein the packaging projection is an orthographic projection of the packaging pattern on the first intermediate substrate.
In a possible embodiment, the step of etching the entire surface of the encapsulation layer to form the encapsulation pattern is preceded by the steps of:
arranging a first touch electrode on one side of the packaging layer, which is far away from the substrate base plate, so as to obtain a second intermediate base plate;
arranging an insulating layer on one side of the second intermediate substrate far away from the substrate;
after the step of etching the whole surface of the packaging layer to form a packaging pattern, the method comprises the following steps:
and arranging a second touch electrode on one side of the insulating layer far away from the substrate base plate.
In a possible implementation manner, the step of etching the entire surface of the encapsulation layer to form an encapsulation pattern includes:
etching the insulating layer and the packaging layer by using a first mask plate, forming a touch through hole on the insulating layer, and forming the packaging pattern on the packaging layer, so that the first touch electrode and the second touch electrode are electrically connected through the touch through hole, the packaging projection is surrounded by the cutting area, and the packaging projection is adjacent to the function binding area.
In a possible embodiment, the step of providing an insulating layer on a side of the second intermediate substrate remote from the substrate is preceded by:
etching the whole packaging layer by using a second mask plate to form an initial packaging pattern;
the steps of etching the insulating layer and the packaging layer by using a first mask plate, forming a touch through hole on the insulating layer, and forming the packaging graph on the packaging layer comprise:
etching the insulating layer and the initial packaging pattern by using the first mask plate, forming the touch control through hole on the insulating layer, and forming the packaging pattern on the packaging layer so that the first touch control electrode and the second touch control electrode are electrically connected through the touch control through hole, the cutting area surrounds the packaging projection, the packaging projection is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging pattern.
In one possible embodiment, the first mask comprises a semi-transparent mask;
the steps of etching the insulating layer and the packaging layer by using a first mask plate, forming a touch through hole on the insulating layer, and forming the packaging graph on the packaging layer comprise:
and etching the insulating layer and the packaging layer by using the semi-permeable mask plate, forming the touch control through hole on the insulating layer, and forming the packaging graph on the packaging layer so as to enable the first touch control electrode and the second touch control electrode to be electrically connected through the touch control through hole, wherein the cutting area surrounds the packaging projection, the packaging projection is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging graph.
In one possible embodiment, the first mask comprises a semi-transparent mask;
the step of etching the insulating layer and the initial packaging pattern by using the first mask plate, forming the touch control through hole on the insulating layer, and forming the packaging pattern on the packaging layer includes:
etching the insulating layer and the initial packaging graph by using the semi-permeable mask plate, forming the touch control through hole on the insulating layer, and forming the packaging graph on the packaging layer so that the first touch control electrode and the second touch control electrode are electrically connected through the touch control through hole, the cutting area surrounds the packaging projection, the packaging projection is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging graph;
and/or the presence of a gas in the gas,
the second mask plate comprises a semi-transparent mask plate;
the step of etching the whole packaging layer by using a second mask plate to form an initial packaging graph comprises the following steps:
and etching the whole packaging layer by using the semi-permeable mask plate to form the initial packaging pattern.
In a possible implementation manner, the etching the insulating layer and the encapsulation layer by using the semi-permeable mask, forming the touch through hole on the insulating layer, and forming the encapsulation pattern on the encapsulation layer includes:
the semi-permeable mask plate is used for etching the insulating layer and the packaging layer, touch control through holes are formed in the insulating layer, packaging patterns are formed in the packaging layer, so that the first touch control electrode and the second touch control electrode are electrically connected through the touch control through holes, the packaging projection is surrounded by the cutting area, the packaging projection is adjacent to the function binding area, at least two slopes are formed at the edge of the packaging patterns, the semi-permeable mask plate corresponds to the light transmittance gradient of the area at the edge of the packaging patterns, and the light transmittance gradient direction is the direction of the packaging projection pointing to the cutting area.
In a possible implementation manner, the etching the insulating layer and the initial packaging pattern by using the semi-permeable mask, forming the touch through hole on the insulating layer, and forming the packaging pattern on the packaging layer includes:
etching the insulating layer and the initial packaging graph by using the semi-permeable mask plate, forming the touch control through hole on the insulating layer, and forming the packaging graph on the packaging layer so as to enable the first touch control electrode and the second touch control electrode to be electrically connected through the touch control through hole, wherein the cutting region surrounds the surrounding packaging projection, the packaging projection is adjacent to the function binding region, and at least two slopes are formed at the edge of the packaging graph, wherein the light transmittance of the area of the semi-permeable mask plate corresponding to the edge of the packaging graph is gradually changed, and the direction of the gradual change of the light transmittance is the direction of the packaging projection pointing to the cutting region;
and/or the presence of a gas in the gas,
the step of using the semi-permeable mask plate to etch the whole packaging layer to form the initial packaging graph comprises the following steps:
and etching the whole packaging layer by using the semi-permeable mask plate to form the initial packaging graph, wherein the semi-permeable mask plate has gradually changed light transmittance in the region corresponding to the edge of the packaging graph, and the direction of the gradually changed light transmittance is the direction in which the packaging projection points to the cutting region.
In a possible embodiment, before the step of disposing the organic light emitting display device on one side of the substrate base plate to obtain the first intermediate base plate, the method further includes:
arranging a driving device on one side of the substrate base plate to obtain a driving back plate, wherein the driving device is electrically connected with the second touch electrode;
the step of providing an organic light emitting display device on one side of a substrate base plate to obtain a first intermediate base plate includes:
and arranging the organic light-emitting display device on one side of the driving backboard far away from the substrate base plate to obtain the first intermediate base plate.
In one possible embodiment, the encapsulation layer includes a first inorganic encapsulation layer and a second inorganic encapsulation layer;
the step of arranging the packaging layer on the whole surface of one side of the first intermediate substrate, which is far away from the substrate, comprises the following steps:
arranging the first inorganic packaging layer on the whole surface of one side of the first intermediate substrate, which is far away from the substrate;
and arranging the second inorganic packaging layer on the whole surface of one side of the first inorganic packaging layer, which is far away from the substrate base plate.
In a second aspect, an organic light emitting display panel is manufactured by the method for manufacturing an organic light emitting display panel, and the organic light emitting display panel includes: the packaging structure comprises a first middle substrate and a packaging layer, wherein the packaging layer is arranged on one side of the first middle substrate;
the first intermediate substrate comprises a substrate and an organic light-emitting display device, and the organic light-emitting display device is arranged between the substrate and the packaging layer;
the first intermediate substrate comprises a function binding region and a cutting region, wherein the cutting region surrounds the function binding region;
the packaging layer comprises a packaging pattern, the cutting area surrounds a packaging projection, and the packaging projection is adjacent to the function binding area, wherein the packaging projection is an orthographic projection of the packaging pattern on the first intermediate substrate.
In a possible embodiment, the edge of the encapsulation pattern comprises at least two slopes.
In a third aspect, an organic light emitting display device includes the organic light emitting display panel described in any one of the above.
According to the preparation method of the organic light-emitting display panel, the organic light-emitting display panel and the device, in the process flow of forming the film of the packaging layer, the film is formed on the whole surface, and the packaging pattern is formed by adopting an etching process subsequently. The packaging graph formed by the etching process can avoid the occurrence of a shadow region at the edge of the packaging graph, the cutting region surrounds the packaging projection, the packaging graph cannot extend to the cutting region, the cutting crack caused by the fact that the shadow region extends to the cutting region can be improved, the packaging failure is avoided, and therefore the reliability of the organic light-emitting display panel can be improved. In addition, the encapsulation graph is obtained by adopting an etching mode, so that the encapsulation projection and the function binding region are not overlapped, the function binding region can be completely exposed, the subsequent binding of the function device is facilitated, the influence of the residual shadow region on the binding of the function device is eliminated, and the production yield of the organic light-emitting display panel is improved.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural change diagram of a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure;
fig. 3 is a top view of a first substrate in a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram of an encapsulation pattern in a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure;
FIG. 5 is a schematic illustration of a shadow layer of an encapsulation layer according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of an organic light-emitting display panel manufactured by a method for manufacturing an organic light-emitting display panel according to an embodiment of the present disclosure;
fig. 7 is a schematic view of an edge structure of an encapsulation pattern obtained by a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure;
fig. 8 is a schematic view of an edge structure of another encapsulation pattern obtained by a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a semi-transparent mask in a method for manufacturing an organic light-emitting display panel according to an embodiment of the present application;
fig. 10 is a schematic structural diagram of an organic light emitting display device according to an embodiment of the present disclosure.
Detailed Description
In order to better understand the technical solutions provided by the embodiments of the present specification, the technical solutions of the embodiments of the present specification are described in detail below with reference to the drawings and specific embodiments, and it should be understood that the specific features in the embodiments and examples of the present specification are detailed descriptions of the technical solutions of the embodiments of the present specification, and are not limitations on the technical solutions of the embodiments of the present specification, and the technical features in the embodiments and examples of the present specification may be combined with each other without conflict.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element. The term "two or more" includes the case of two or more.
In the organic light emitting display panel, the organic light emitting material and the metal electrode are easily corroded by water and oxygen inside and outside to generate oxidation reaction, so that pixels shrink or do not emit light. The packaging layer is arranged to prevent external water and oxygen from entering and corroding the organic light-emitting device, so that the organic light-emitting device is protected, and the service life of the organic light-emitting device can be prolonged. However, in the preparation process of the organic light emitting display panel, the arrangement manner of the encapsulation layer is prone to generate a shadow region at the edge of the encapsulation layer, and the shadow region is prone to cause a reduction in reliability of the organic light emitting display panel.
In view of this, embodiments of the present disclosure provide a method for manufacturing an organic light emitting display panel, and an apparatus, which can prevent a shadow region from occurring at an edge of an encapsulation layer, so as to avoid a problem of reliability degradation of the organic light emitting display panel caused by the shadow region.
In a possible implementation manner, for example, fig. 1 is a schematic flow chart of a method for manufacturing an organic light emitting display panel provided in an embodiment of the present application. As shown in fig. 1, a method for manufacturing an organic light emitting display panel provided in an embodiment of the present application includes:
s100: and arranging an organic light-emitting display device on one side of the substrate base plate to obtain a first intermediate base plate, wherein the first intermediate base plate comprises a function binding area and a cutting area, and the cutting area surrounds the function binding area.
Fig. 2 is a schematic diagram illustrating a structural change of a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure; fig. 3 is a top view of a first substrate in a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure. Referring to fig. 2 and 3, during step S100, an organic light emitting display device 200 is disposed on one side of a base substrate 100, resulting in a first intermediate substrate G100. As shown in fig. 3, the first intermediate substrate G100 includes a function binding region G110 and a cutting region G120, and the cutting region G120 surrounds the function binding region G110. It is easy to understand that, the organic light emitting display panel may be prepared by first performing uniform film and device preparation on a large substrate 100, cutting the large display panel after all processes are completed to obtain a plurality of display panel monomers (panel), and bonding (bonding) an IC (driver chip) or an FPC (flexible circuit board) after the panel is obtained to obtain a display module, where the IC and the FPC may be collectively referred to as a functional device, and the display module may be assembled into a display device, for example, a smart phone, a computer, or a flat panel, and the application is not limited specifically. In the process of cutting the large display panel, the large display panel needs to be cut according to the cutting region G120, in the process of bonding the IC or the FPC, the IC or the FPC needs to be bonded to the function bonding region G110, the cutting region G120 generally surrounds the function bonding region G110, and the cutting region G120 generally does not overlap with the function bonding region G110.
S200: and arranging an encapsulation layer on the whole surface of one side of the first intermediate substrate, which is far away from the substrate. As shown in fig. 2, in step S200, the encapsulation layer 300 is disposed on the entire surface of the first intermediate substrate G100 away from the substrate 100.
S300: and etching the whole packaging layer to form a packaging pattern, so that the cutting region surrounds a packaging projection, and the packaging projection is adjacent to the function binding region, wherein the packaging projection is an orthographic projection of the packaging pattern on the first intermediate substrate.
Fig. 4 is a schematic diagram illustrating an encapsulation pattern in a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure. As shown in fig. 4, the encapsulation layer 300 is formed through the whole film formation in step S200, the encapsulation layer 300 is etched on the whole surface, so as to form an encapsulation pattern 310, an orthogonal projection of the encapsulation pattern 310 on the first intermediate substrate G100 is an encapsulation projection 320, the cutting region G120 surrounds the encapsulation projection 320, and the encapsulation projection 320 is adjacent to the function binding region G110. It is easy to understand that the encapsulation pattern 310 and the function binding region G110 are both surrounded by the cutting region G120, a single panel includes the encapsulation pattern 310 and the function binding region G110, and the encapsulation pattern 310 is used for encapsulating and protecting the organic light emitting display device, so that external water and oxygen corrosion can be prevented, and the service life of the organic light emitting display device can be prolonged. The package projection 320 is adjacent to the function bonding region G110, and the package projection 320 is connected to the cutting region G120, i.e., the package projection 320 does not overlap with the function bonding region G110 or the cutting region G120, and the package pattern 310 does not extend to the function bonding region G110 or the cutting region G120.
It should be noted that other film layers or device lines may also be manufactured on the side of the encapsulation layer 300 away from the substrate 100, and a specific process flow may be performed according to the film layer arrangement of a specific organic light emitting display panel, which is not described in detail herein, and the present application is not limited specifically.
The preparation method of the organic light-emitting display panel provided by the embodiment of the application aims at a process method for preparing an encapsulation layer by using a CVD Mask (chemical vapor deposition) to obtain an encapsulation pattern. Fig. 5 is a schematic diagram illustrating an encapsulation layer shadow according to an embodiment of the present application. An encapsulation pattern is formed on the first intermediate substrate G100 by CVD Mask using a CVD Mask process, however, as shown in fig. 5, in an edge region of the CVD Mask, the encapsulation pattern is prone to generate a residual Shadow region in which an excessive encapsulation material remains, the residual Shadow region including a Shadow region and an Under coating region. In one possible case, the formation of the Shadow region and the Under coating region is an edge "diffraction" phenomenon caused by the center sagging due to the self-weight of the CVD Mask, forming Gap between the CVD Mask and the first intermediate substrate G100. If the shadow region of the edge of the package pattern extends to the cutting region, it is liable to cause a cutting crack, cracks easily extend along the encapsulation layer to the inside of the display region of the display panel, causing encapsulation failure, and finally causing a serious decrease in reliability of the organic light emitting display panel. The CVD Mask has higher manufacturing cost and the difficulty of improving the Gap is higher. In addition, if the residual shadow area of the packaging pattern extends to the function binding area, the binding of subsequent functional devices is easily influenced, the binding failure of the functional devices is caused, and the product reject ratio of the organic light-emitting display panel is increased. Therefore, the method for manufacturing the organic light-emitting display panel provided by the embodiment of the application cancels CVD Mask, carries out film forming on the whole surface in the process flow of the film forming of the packaging layer, and then forms the packaging pattern by adopting an etching process. The packaging graph formed by the etching process can avoid the occurrence of a shadow region at the edge of the packaging graph, the cutting region surrounds the packaging projection, the packaging graph cannot extend to the cutting region, the cutting crack caused by the fact that the shadow region extends to the cutting region can be improved, the packaging failure is avoided, and therefore the reliability of the organic light-emitting display panel can be improved. In addition, the encapsulation graph is obtained by adopting an etching mode, so that the encapsulation projection and the function binding region are not overlapped, the function binding region can be completely exposed, the subsequent binding of the function device is facilitated, the influence of the residual shadow region on the binding of the function device is eliminated, and the production yield of the organic light-emitting display panel is improved.
In a possible implementation manner, before step S300, the method further includes:
and arranging a first touch electrode on one side of the packaging layer far away from the substrate base plate to obtain a second intermediate base plate. Fig. 6 is a schematic structural diagram of an organic light emitting display panel manufactured by a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure. As shown in fig. 6, a first touch electrode 400 is disposed on a side of the encapsulation layer 300 away from the substrate 100, so as to obtain a second intermediate substrate G200.
And an insulating layer is arranged on one side of the second intermediate substrate far away from the substrate. With continued reference to fig. 6, an insulating layer 500 is provided on the second intermediate base plate G200 on the side remote from the base plate 100.
After step S300, the method further includes:
and arranging a second touch electrode on one side of the insulating layer far away from the substrate base plate. With continued reference to fig. 6, a second touch electrode 600 is disposed on a side of the insulating layer 500 away from the substrate 100. The first touch electrode 400 and the second touch electrode 600 can be used to implement a touch function, and the insulating layer 500 is used to implement an insulating barrier for the first touch electrode 400 and the second touch electrode 600. The structure of the display panel shown in fig. 6 is merely illustrative and is not a specific limitation of the present application.
In one possible implementation, step S300 may include:
and etching the insulating layer and the packaging layer by using a first mask plate, forming a touch through hole on the insulating layer, and forming a packaging graph on the packaging layer, so that the first touch electrode is electrically connected with the second touch electrode through the touch through hole, the packaging projection is surrounded by the cutting area, and the packaging projection is adjacent to the function binding area.
According to the preparation method of the organic light-emitting display panel, two etching mask plates and two etching process flows are needed for the process flows of respectively etching the insulating layer and the packaging layer. Because the etching of the insulating layer and the packaging layer shares the first mask plate, the etching of the packaging layer obtains the packaging graph, the etching of the insulating layer is punching, and the etching positions are different, so that the patterns on the first mask plate are not interfered with each other, and the sharing of the first mask plate can be realized. Therefore, an etching process flow and an etching mask plate can be saved, the cost is saved, the time can be saved, and the production efficiency is improved.
In a possible embodiment, before the step of disposing the insulating layer on the side of the second intermediate substrate away from the substrate, the method further includes:
and etching the whole packaging layer by using a second mask plate to form an initial packaging pattern. In the step, before the insulating layer is formed into a film, the packaging layer is etched to form an initial packaging pattern, the initial packaging pattern usually does not necessarily satisfy the condition that the cutting area surrounds the packaging projection, and the initial packaging pattern is determined according to the actual process capability or the etching degree, and the method is not particularly limited in the application.
The etching of the insulating layer and the packaging layer by using the first mask plate, the formation of the touch through hole on the insulating layer, and the formation of the packaging pattern on the packaging layer may include:
and etching the insulating layer and the initial packaging graph by using a first mask plate, forming a touch through hole on the insulating layer, and forming a packaging graph on the packaging layer, so that the first touch electrode is electrically connected with the second touch electrode through the touch through hole, the cutting area surrounds the packaging projection, the packaging projection is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging graph.
Fig. 7 is a schematic view of an edge structure of an encapsulation pattern obtained by a method for manufacturing an organic light emitting display panel according to an embodiment of the present disclosure. As shown in fig. 7, the second mask and the first mask are sequentially used to perform two etching processes on the encapsulation layer, and at least two slopes 330 may be formed on the edge of the obtained encapsulation pattern 310. The formation of the at least two slopes 330 is mainly realized by two etching processes, the appearance of the at least two slopes 330 can be controlled by the pattern difference design of the mask plate, and can also be controlled and realized by the adjustment of parameters of the two etching processes, which is not specifically limited in the present application.
According to the preparation method of the organic light-emitting display panel, the second mask plate and the first mask plate are sequentially adopted to carry out two etching treatments on the packaging layer, at least two slopes can be formed on the edge of the obtained packaging graph, the edge of the packaging graph is ensured not to extend to the cutting area and the function binding area, at least two slopes are formed on the edge of the packaging graph, the edge of the packaging graph can be in a gentle state, particularly, at the boundary of the packaging graph and the function binding area, the first touch electrode and/or the second touch electrode can cross the edge of the packaging graph to be connected with the circuit of the function binding area, and if the edge of the packaging graph is too steep, the first touch electrode and/or the second touch electrode are easy to break, so that the touch function failure is caused. The at least two slopes are formed on the edge of the packaging pattern, so that the edge of the packaging pattern is in a gentle state, the film thickness difference between the packaging pattern and the boundary of the function binding area is reduced, and the breakage of the first touch electrode and/or the second touch electrode can be improved.
In a possible embodiment, in the case that only one first Mask is used to perform one etching process, the first Mask may include a half-transparent Mask (Halftone Mask).
The method comprises the following steps of etching an insulating layer and a packaging layer by using a first mask plate, forming a touch through hole on the insulating layer, and forming a packaging graph on the packaging layer, wherein the steps comprise:
etching the insulating layer and the packaging layer by using a semi-permeable mask plate, forming a touch control through hole on the insulating layer, and forming a packaging pattern on the packaging layer, so that the first touch electrode and the second touch electrode are electrically connected through the touch through hole, the cutting area surrounds the packaging projection, the packaging projection is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging pattern.
For example, fig. 8 is a schematic view of an edge structure of another encapsulation pattern obtained by a method for manufacturing an organic light emitting display panel according to an embodiment of the present application. As shown in fig. 8, a touch through hole and a package pattern are simultaneously obtained by using a single half mask, and the formation of at least two slopes 330 on the edge of the package pattern 310 can be achieved by using the design of the half mask with respect to the light transmittance at different positions. The edge of the packaging graph 310 obtained by the semi-permeable mask plate can be smoother than the edge of the packaging graph 310 obtained by a common mask plate, the routing of the first touch electrode and the second touch electrode is facilitated, the film thickness difference of the packaging graph and the function binding area boundary can be further reduced, and the breakage of the first touch electrode and/or the second touch electrode can be improved.
According to the preparation method of the organic light-emitting display panel, the touch through holes and the packaging patterns are obtained simultaneously by using the semi-permeable mask, and the edge of the packaging pattern 310 can form at least two slopes 330 by utilizing the design of the semi-permeable mask about the light transmittance of different positions. The edge of the packaging graph 310 obtained by the semi-permeable mask plate can be smoother than the edge of the packaging graph 310 obtained by a common mask plate, the routing of the first touch electrode and the second touch electrode is facilitated, the film thickness difference of the packaging graph and the function binding area boundary can be further reduced, and the breakage of the first touch electrode and/or the second touch electrode can be improved.
In a possible implementation, in the case of two etching process flows using the second mask and the first mask, respectively, the first mask may be a semi-permeable mask.
The steps of etching the insulating layer and the initial packaging graph by using the first mask plate, forming a touch control through hole on the insulating layer and forming a packaging graph on the packaging layer comprise:
and etching the insulating layer and the initial packaging pattern by using a semi-permeable mask plate, forming a touch through hole on the insulating layer, and forming a packaging pattern on the packaging layer, so that the first touch electrode is electrically connected with the second touch electrode through the touch through hole, the cutting area surrounds the packaging projection, the packaging projection is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging pattern.
According to the preparation method of the organic light-emitting display panel, in the two etching process flows, the first mask plate in the etching step that the insulating layer and the packaging layer share the first mask plate is the semi-transparent mask plate, the second mask plate is the common mask plate, more than two slopes can be formed at the edge of the packaging graph, the slopes with corresponding number can be obtained according to the specific setting of the mask plate, the film thickness drop of the boundary of the packaging graph and the function binding region can be further reduced, and the fracture of the first touch electrode and/or the second touch electrode can be further improved.
In a feasible implementation manner, in the case of two etching process flows using the second mask and the first mask respectively, both the first mask and the second mask may adopt a semi-permeable mask.
And etching the whole packaging layer by using a second mask plate to form an initial packaging pattern, wherein the step comprises the following steps of:
and etching the whole packaging layer by using the semi-permeable mask plate to form an initial packaging pattern.
According to the preparation method of the organic light-emitting display panel, in the two etching process flows, the first mask plate and the second mask plate are both semi-transparent mask plates, more than two slopes may be formed at the edge of the packaging graph, the slopes with corresponding number can be obtained according to the specific setting of the mask plates, the thickness drop of the film at the boundary of the packaging graph and the function binding region can be further reduced, and the fracture of the first touch electrode and/or the second touch electrode can be further improved.
In a possible implementation, in the case of two etching process flows using the second mask and the first mask, respectively, only the second mask is a semi-permeable mask.
And etching the whole packaging layer by using a second mask plate to form an initial packaging pattern, wherein the step comprises the following steps of:
and etching the whole packaging layer by using the semi-permeable mask plate to form an initial packaging pattern.
According to the preparation method of the organic light-emitting display panel, in the two etching process flows, only the second mask plate is the semi-transparent mask plate, more than two slopes can be formed at the edge of the packaging graph possibly, the corresponding number of slopes can be obtained according to the specific setting of the mask plate, the film thickness difference between the packaging graph and the boundary of the function binding area can be further reduced, and the breakage of the first touch electrode and/or the second touch electrode can be further improved.
In a feasible implementation manner, the light transmittance of the area of the semi-permeable mask used in the above embodiment, which corresponds to the edge of the package pattern, is gradually changed, and the direction of the gradual change of the light transmittance is the direction in which the package projection points to the cutting area.
It should be noted that, the process step of etching the encapsulation layer by using the mask plate actually includes photoresist coating, exposure, development, etching, and photoresist stripping, and the application is not particularly limited.
For example, fig. 9 is a schematic structural diagram of a half-transparent mask in a manufacturing method of an organic light emitting display panel provided in an embodiment of the present application. As shown in fig. 9, an opening area W of the semi-permeable Mask may correspond to the package pattern 310, and the opening area W also corresponds to the package projection 320, and when the positive photoresist is used for exposure and development, the light transmittance of the opening area W corresponding to the opening area W is much smaller than that of the remaining areas, so that the package layer corresponding to the opening area W is retained after the package layer is etched, and the package layers in the remaining areas are etched away. If the negative photoresist is adopted, the light transmittance of the opening area W is far greater than that of other residual areas, so that the packaging layer corresponding to the opening area W is reserved after the packaging layer is etched, and the packaging layers in the residual areas are etched. Therefore, the design of the light transmittance pattern of the mask plate needs to correspond to the selection of positive and negative photoresists. By taking a positive photoresist as an example, the light transmittance of the opening area W of the semi-transparent Mask is much smaller than that of other remaining areas, so that the edge of the opening area W of the semi-transparent Mask can be designed to have a gradual change in light transmittance in order to obtain a plurality of slopes or form smooth steps at the edge of the package pattern. Exemplarily, as shown in fig. 9, the light transmittance gradually increases in a direction R directed to the cutting region by the package projection and also in a direction directed to the cutting region by the opening region W.
According to the preparation method of the organic light-emitting display panel, the direction R of the packaging projection pointing to the cutting area is also the direction of the opening area W pointing to the cutting area, the light transmittance is gradually increased, more slopes can be formed at the edge of the packaging graph, or the edge of the packaging graph is smoother. The film thickness difference between the packaging pattern and the boundary of the function binding area can be further reduced, and the breakage of the first touch electrode and/or the second touch electrode can be further improved.
In a possible implementation manner, before step S100, the method further includes:
and arranging a driving device on one side of the substrate base plate to obtain a driving backboard, wherein the driving device is electrically connected with the second touch electrode. The driving device may be a TFT (thin film transistor), and the present application is not particularly limited. The driving device may drive light emission of the organic light emitting device to implement a function of display. The driving device may be electrically connected to the second touch electrode in the function binding region through other circuit designs to drive the second touch electrode, which is not limited in this application.
Step S100, comprising:
and arranging an organic light-emitting display device on one side of the driving backboard far away from the substrate base plate to obtain a first intermediate base plate.
In one possible embodiment, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer;
step S200, including:
and arranging a first inorganic packaging layer on the whole surface of one side of the first intermediate substrate far away from the substrate.
And arranging a second inorganic packaging layer on the whole surface of one side of the first inorganic packaging layer, which is far away from the substrate base plate.
According to the preparation method of the organic light-emitting display panel, the packaging layer adopts the packaging structure of the first inorganic packaging layer, the organic packaging layer and the second inorganic packaging layer, the organic packaging layer can play a role in flattening the organic light-emitting device and providing packaging protection such as stress release, however, the organic packaging layer cannot prevent water and oxygen erosion, and the two layers of inorganic packaging layers are clamped on two sides of the organic packaging layer, so that the water and oxygen erosion of the organic light-emitting device can be prevented. The etching of the packaging layer is mainly aimed at two inorganic packaging layers, and the edges of the inorganic packaging layers can extend to the outermost edges of the single display panel, so that the organic light-emitting device can be comprehensively prevented and controlled from water and oxygen invasion. The organic encapsulation layer usually only covers the display area of the organic light emitting display panel, so that the size of the film forming area is controlled during film forming, and etching is not needed.
In a second aspect, an embodiment of the present application provides an organic light emitting display panel, which can be prepared by using the method for preparing an organic light emitting display panel described in any one of the above embodiments, and referring to fig. 2, for example, the organic light emitting display panel includes: the packaging structure comprises a first middle substrate G100 and a packaging layer 300, wherein the packaging layer 300 is arranged on one side of the first middle substrate G100; the first intermediate substrate G100 includes a substrate 100 and an organic light emitting display device 200, and the organic light emitting display device 200 is disposed between the substrate 100 and the encapsulation layer 300. Referring to fig. 2 to 4, the G100 first intermediate substrate includes a functional bonding region G110 and a cutting region G120, and the cutting region G120 surrounds the functional bonding region G110. The encapsulation layer 300 includes an encapsulation pattern 310, the cutting region G120 surrounds an encapsulation projection 320, and the encapsulation projection 320 is adjacent to the function binding region G110, wherein the encapsulation projection 320 is an orthographic projection of the encapsulation pattern 310 on the first intermediate substrate G100. The cutting area G120 does not overlap with both the package projection 320 and the function binding area G110.
The organic light-emitting display panel provided by the embodiment of the application surrounds the package projection by setting the cutting area, the package graph cannot extend to the cutting area, the cutting crack caused by the fact that the shadow area extends to the cutting area can be improved, the package failure is avoided, and therefore the reliability of the organic light-emitting display panel can be improved. In addition, the encapsulation graph is obtained by adopting an etching mode, so that the encapsulation projection and the function binding region are not overlapped, the function binding region can be completely exposed, the subsequent binding of the function device is facilitated, the influence of the residual shadow region on the binding of the function device is eliminated, and the production yield of the organic light-emitting display panel is improved.
In one possible embodiment, as shown in fig. 6, a first touch electrode 400, an insulating layer 500, and a second touch electrode 600 are sequentially disposed on a side of the encapsulation layer 300 away from the substrate 100. The first touch electrode 400 and the second touch electrode 600 can be used to implement a touch function, and the insulating layer 500 is used to implement an insulating barrier for the first touch electrode 400 and the second touch electrode 600. The structure of the display panel shown in fig. 6 is merely illustrative and is not a specific limitation of the present application.
In one possible embodiment, referring to fig. 7 and 8, the edge of the packaging pattern 310 includes at least two slopes 330.
In the organic light emitting display panel provided by the embodiment of the application, the at least two slopes 330 are formed on the edge of the encapsulation pattern 310, so that the edge of the encapsulation pattern 310 is in a gentle state, the film thickness difference between the encapsulation pattern 310 and the boundary of the function binding region G110 is reduced, and the fracture of the first touch electrode 400 and/or the second touch electrode 600 can be improved.
In a third aspect, embodiments of the present application provide an organic light emitting display device including the organic light emitting display panel of any one of the above embodiments. Fig. 10 is a schematic structural diagram of an organic light emitting display device according to an embodiment of the present disclosure. As shown in fig. 10, an embodiment of the present application provides an organic light emitting display device including the organic light emitting display panel 1000 of any one of the above embodiments. For example, the organic light emitting display device provided in the embodiments of the present application may include a smart phone, a notebook computer, a smart tablet, a display, or the like, and the present application is not limited in particular.
While preferred embodiments of the present specification have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all changes and modifications that fall within the scope of the specification.
It will be apparent to those skilled in the art that various changes and modifications can be made in the present specification without departing from the spirit and scope of the specification. Thus, if such modifications and variations of the present specification fall within the scope of the claims of the present specification and their equivalents, the specification is intended to include such modifications and variations.
Claims (11)
1. A method for manufacturing an organic light emitting display panel includes:
arranging an organic light-emitting display device on one side of a substrate to obtain a first intermediate substrate, wherein the first intermediate substrate comprises a function binding region and a cutting region, and the cutting region surrounds the function binding region;
arranging an encapsulation layer on the whole surface of one side of the first intermediate substrate, which is far away from the substrate;
arranging a first touch electrode on one side of the packaging layer, which is far away from the substrate base plate, so as to obtain a second intermediate base plate;
arranging an insulating layer on one side of the second intermediate substrate far away from the substrate;
etching the insulating layer and the packaging layer by using a first mask plate, forming a touch through hole on the insulating layer, and forming a packaging pattern on the packaging layer, so that the cutting region surrounds a packaging projection, and the packaging projection is adjacent to the functional binding region, wherein the packaging projection is an orthographic projection of the packaging pattern on the first middle substrate;
and arranging a second touch electrode on one side of the insulating layer, which is far away from the substrate base plate, wherein the first touch electrode is electrically connected with the second touch electrode through the touch through hole.
2. The method according to claim 1, wherein the step of providing an insulating layer on a side of the second intermediate substrate remote from the base substrate is preceded by:
etching the whole packaging layer by using a second mask plate to form an initial packaging pattern;
the steps of etching the insulating layer and the packaging layer by using a first mask plate, forming a touch through hole on the insulating layer, and forming the packaging graph on the packaging layer comprise:
etching the insulating layer and the initial packaging pattern by using the first mask plate, forming the touch control through hole on the insulating layer, and forming the packaging pattern on the packaging layer so that the first touch control electrode and the second touch control electrode are electrically connected through the touch control through hole, the cutting area surrounds the packaging projection, the packaging projection is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging pattern.
3. The method according to claim 1, wherein the first mask comprises a half-transmissive mask;
the insulating layer and the packaging layer are etched by using a first mask plate, forming a touch through hole on the insulating layer and forming the packaging pattern on the packaging layer, including:
and etching the insulating layer and the packaging layer by using the semi-permeable mask plate, forming the touch control through hole on the insulating layer, and forming the packaging pattern on the packaging layer so as to enable the first touch control electrode and the second touch control electrode to be electrically connected through the touch control through hole, wherein the cutting area surrounds the packaging projection, the packaging projection is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging pattern.
4. The method according to claim 2, wherein the first mask comprises a half-mask;
the step of etching the insulating layer and the initial packaging pattern by using the first mask plate, forming the touch control through hole on the insulating layer, and forming the packaging pattern on the packaging layer includes:
etching the insulating layer and the initial packaging graph by using the semi-permeable mask plate, forming the touch control through hole on the insulating layer, and forming the packaging graph on the packaging layer so that the first touch control electrode and the second touch control electrode are electrically connected through the touch control through hole, the cutting area surrounds the packaging projection, the packaging projection is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging graph;
and/or the presence of a gas in the atmosphere,
the second mask plate comprises a semi-transparent mask plate;
the step of etching the whole packaging layer by using a second mask plate to form an initial packaging graph comprises the following steps:
and etching the whole packaging layer by using the semi-permeable mask plate to form the initial packaging pattern.
5. The method according to claim 3, wherein the etching the insulating layer and the encapsulation layer using the semi-permeable mask, the forming the touch via on the insulating layer, and the forming the encapsulation pattern on the encapsulation layer comprise:
the semi-permeable mask plate is used for etching the insulating layer and the packaging layer, touch control through holes are formed in the insulating layer, the packaging pattern is formed in the packaging layer, so that the first touch control electrode is electrically connected with the second touch control electrode through the touch control through holes, the packaging projection is surrounded by the cutting area, the packaging projection is adjacent to the function binding area, at least two slopes are formed at the edge of the packaging pattern, the semi-permeable mask plate corresponds to the light transmittance gradient of the area at the edge of the packaging pattern, and the light transmittance gradient direction is the direction in which the packaging projection points to the cutting area.
6. The method according to claim 4, wherein the etching the insulating layer and the initial encapsulation pattern using the semi-permeable mask, the forming the touch via on the insulating layer, and the forming the encapsulation pattern on the encapsulation layer comprise:
etching the insulating layer and the initial packaging graph by using the semi-permeable mask plate, forming the touch control through hole on the insulating layer, and forming the packaging graph on the packaging layer so as to enable the first touch control electrode and the second touch control electrode to be electrically connected through the touch control through hole, wherein the packaging projection is surrounded by the cutting area and is adjacent to the function binding area, and at least two slopes are formed at the edge of the packaging graph, wherein the light transmittance of the area of the semi-permeable mask plate corresponding to the edge of the packaging graph is gradually changed, and the direction of the light transmittance is the direction of the packaging projection pointing to the cutting area;
and/or the presence of a gas in the gas,
the step of using the semi-permeable mask plate to etch the whole packaging layer to form the initial packaging graph comprises the following steps:
and etching the whole packaging layer by using the semi-permeable mask plate to form the initial packaging graph, wherein the semi-permeable mask plate has gradually changed light transmittance in the region corresponding to the edge of the packaging graph, and the direction of the gradually changed light transmittance is the direction in which the packaging projection points to the cutting region.
7. The method of claim 1, wherein the step of disposing the organic light emitting display device on one side of the substrate base plate to obtain the first intermediate base plate is preceded by the step of:
arranging a driving device on one side of the substrate base plate to obtain a driving back plate, wherein the driving device is electrically connected with the second touch electrode;
the step of providing an organic light emitting display device on one side of a substrate base plate to obtain a first intermediate base plate includes:
and arranging the organic light-emitting display device on one side of the driving backboard far away from the substrate base plate to obtain the first intermediate base plate.
8. The method for manufacturing an organic light-emitting display panel according to any one of claims 1 to 7, wherein the encapsulation layer comprises a first inorganic encapsulation layer and a second inorganic encapsulation layer;
the step of arranging the packaging layer on the whole surface of one side of the first intermediate substrate, which is far away from the substrate, comprises the following steps:
arranging the first inorganic packaging layer on the whole side of the first intermediate substrate far away from the substrate;
and arranging the second inorganic packaging layer on the whole surface of one side of the first inorganic packaging layer, which is far away from the substrate base plate.
9. An organic light-emitting display panel produced by the method for producing an organic light-emitting display panel according to any one of claims 1 to 8, comprising: the touch display device comprises a first middle substrate, a packaging layer, a first touch electrode, an insulating layer and a second touch electrode, wherein the packaging layer is arranged on one side of the first middle substrate;
the first middle substrate comprises a substrate and an organic light-emitting display device, the organic light-emitting display device is arranged between the substrate and the packaging layer, the first touch electrode is arranged on one side, away from the substrate, of the packaging layer, the insulating layer is arranged between the first touch electrode and the second touch electrode, the insulating layer is provided with a touch through hole, and the first touch electrode and the second touch electrode are electrically connected through the touch through hole;
the first intermediate substrate comprises a function binding region and a cutting region, wherein the cutting region surrounds the function binding region;
the packaging layer comprises a packaging pattern, the cutting area surrounds a packaging projection, and the packaging projection is adjacent to the function binding area, wherein the packaging projection is an orthographic projection of the packaging pattern on the first intermediate substrate.
10. The organic light emitting display panel of claim 9, wherein the edge of the encapsulation pattern comprises at least two slopes.
11. An organic light emitting display device comprising the organic light emitting display panel according to claim 9 or 10.
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