TW202125680A - Test tray and handler for testing electronic component - Google Patents
Test tray and handler for testing electronic component Download PDFInfo
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- TW202125680A TW202125680A TW110102814A TW110102814A TW202125680A TW 202125680 A TW202125680 A TW 202125680A TW 110102814 A TW110102814 A TW 110102814A TW 110102814 A TW110102814 A TW 110102814A TW 202125680 A TW202125680 A TW 202125680A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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Abstract
Description
本發明涉及一種在電子部件的測試中使用的測試托盤以及移動相應測試托盤並支援電子部件的測試的電子部件測試用分選機。The present invention relates to a test tray used in testing of electronic components and a sorting machine for testing electronic components that moves the corresponding test trays and supports the testing of electronic components.
生產的半導體元件等電子部件在通過測試機被測試後分為良品與不良品,進而僅將良品出貨。Electronic components such as semiconductor components produced are classified into good and defective products after being tested by a testing machine, and only good products are shipped.
測試機與電子部件之間的電連接通過電子部件測試用分選機(以下,簡稱為「分選機」)實現。The electrical connection between the testing machine and the electronic components is realized by a sorting machine for testing electronic components (hereinafter referred to as "sorting machine").
通常,分選機根據要測試的電子部件的多樣的種類而製造為多種形態。這樣的分選機大致可以分為是否應用測試托盤。Generally, the sorting machine is manufactured in various forms according to the various types of electronic components to be tested. Such sorting machine can be roughly divided into whether to use a test tray.
一些種類的分選機具有在抓持電子部件的狀態下將電子部件直接電連接於測試機的結構(參照韓國公開專利10-2002-0028480號)。但是,另一些種類的分選機具有在電子部件裝載於測試托盤的狀態下將電子部件電連接於測試機的結構(參照韓國授權專利10-0801927號)。由於前者一次能夠測試的電子部件的數量較少,因此在提高處理容量方面,需要製造如同後者的應用測試托盤的分選機。本發明涉及後者的應用測試托盤的分選機。Some sorting machines have a structure in which the electronic components are directly electrically connected to the testing machine in a state where the electronic components are gripped (refer to Korean Laid-open Patent No. 10-2002-0028480). However, other types of sorting machines have a structure in which the electronic components are electrically connected to the testing machine in a state where the electronic components are loaded on the test tray (refer to Korean Patent No. 10-0801927). Since the number of electronic components that can be tested at one time in the former is small, it is necessary to manufacture a sorting machine using test trays like the latter in terms of increasing the processing capacity. The present invention relates to the latter sorting machine using test trays.
近來,為了推動電子部件的性能高度化,集中發展集成技術,因此需要與測試機接觸的端子的數量正急劇增加,另外,對於半導體元件而言,為了實現所需的性能而將多個半導體元件組合為一個產品,因此其尺寸增加的情況也會頻頻發生。在這種情況下,必須增加測試機的容量。Recently, in order to advance the performance of electronic components and focus on the development of integration technology, the number of terminals that need to be in contact with the tester is increasing rapidly. In addition, for semiconductor components, multiple semiconductor components are required to achieve the required performance. The combination is a product, so its size increase will happen frequently. In this case, the capacity of the test machine must be increased.
例如,若電子部件的端子數量增加,則通過測試機有限的電子數量無法一次對如同以往的數量的電子部件進行測試,若電子部件的尺寸變化,則電子部件與測試機之間的電連接位置也要變化。因此,必須將測試機替換為高規格的測試機或者規劃通過改良的容量增大。但是,現實中不僅會產生巨大的成本,而且需要高端的技術。並且,額外地伴隨著替換符合高規格測試機的分選機或者增大分選機容量。這樣,即使電子部件的規格實現高度化,由於成本負擔等多種現實困難而需要仍然使用現有的測試機,據此可以考慮如下所述的示例。For example, if the number of terminals of an electronic component increases, the limited number of electronic components in the tester cannot test the same number of electronic components at one time. If the size of the electronic component changes, the electrical connection position between the electronic component and the tester Change too. Therefore, it is necessary to replace the test machine with a high-spec test machine or plan to increase the capacity through improvement. However, in reality, not only huge costs will be incurred, but also high-end technology is required. In addition, it is accompanied by replacing the sorting machine that meets the high-standard testing machine or increasing the capacity of the sorting machine. In this way, even if the specifications of electronic components are advanced, it is necessary to use existing testers due to various practical difficulties such as cost burdens. Based on this, the following examples can be considered.
第一,可以採取減少要一次測試的電子部件的數量。在這種情況下,需要改良測試機的介面板(與電子部件電連接的部分),將在分選機中使用的測試托盤替換為能夠裝載較少物量的測試托盤,並且替換或改良對應於該測試托盤的連接構成等各種構成。當然,在採用這樣的方法的情況下,必須要接受處理速度的大幅增加及其伴隨的成本。First, it is possible to reduce the number of electronic components to be tested at one time. In this case, it is necessary to improve the interface panel (the part that is electrically connected to the electronic components) of the test machine, replace the test tray used in the sorting machine with a test tray that can load a smaller amount of material, and replace or improve the corresponding Various structures such as the connection structure of the test tray. Of course, in the case of adopting such a method, a substantial increase in processing speed and its accompanying costs must be accepted.
第二,在要測試的電子部件的尺寸變大的情況下,也可以考慮增加擴大托盤的整體尺寸的方法。但是,在這種情況下,由於托盤的尺寸變化而無法使用現有的分選機,因此伴隨必須要替換高價的分選機的成本負擔。Second, when the size of the electronic component to be tested becomes larger, a method of increasing the overall size of the tray can also be considered. However, in this case, the existing sorting machine cannot be used due to the change in the size of the pallet. Therefore, it is necessary to replace the expensive sorting machine with a cost burden.
第三,代替上述的第一種方法或第二種方法,如上文所述的參照韓國授權專利10-0801927號所記載,具有如下所述的技術(以下,稱為「現有技術」):在測試腔室內的測試區間內,以預定間隔移動測試托盤,進而經過兩個階段而依次將電子部件電連接到測試機。若使用該方法,則通過採取最小化的構成變更,能夠使現有的測試機及分選機全部被重新利用,只需接受其處理速度最小化的降低。Thirdly, instead of the above-mentioned first method or second method, as described above with reference to Korean Granted Patent No. 10-0801927, it has the following technology (hereinafter referred to as "prior art"): In the test interval in the test chamber, the test tray is moved at predetermined intervals, and then the electronic components are sequentially electrically connected to the test machine through two stages. If this method is used, the existing testing machine and sorting machine can all be reused by adopting a minimal configuration change, and it is only necessary to accept a reduction in the processing speed that is minimized.
接著,針對上文的三種方法進行更詳細的說明。Next, the above three methods will be explained in more detail.
可知上文的三種方法是在電子部件裝載於測試托盤的狀態下在測試區間內使測試托盤分階段移動的方法。可知這裡重要的是裝載於測試托盤的電子部件的分階段移動。即,測試托盤的分階段移動僅僅是為了使電子部件分階段移動而附加的流程。因此,現有技術具有只能夠在測試區間內測試托盤的移動方向與電子部件的分階段移動方向一致的情況下採用。It can be seen that the above three methods are methods of moving the test tray in stages in the test section with the electronic components loaded on the test tray. It can be seen that what is important here is the phased movement of the electronic components loaded on the test tray. That is, the step-by-step movement of the test tray is only an additional flow for the step-by-step movement of the electronic components. Therefore, the prior art can only be used when the moving direction of the test tray in the test section is consistent with the phased moving direction of the electronic component.
因此,若在測試托盤的循環移動過程中,在測試區間中進行的測試托盤的移動方向與用於分階段測試的電子部件的分階段移動方向(與測試托盤的移動方向垂直的方向)不一致,則無法應用現有技術。並且,在這種情況下,仍然必須要採用上文的第一種方法或第二種方法,這意味著仍然要承擔前述的成本負擔或處理速度的大幅降低。當然,由於電子部件的分階段移動方向是根據測試器的結構來確定的,因此,若分選機的所有者將以使測試托盤的移動方向與電子部件的分階段移動方向一致的方式變更測試機的規格,則解決了困難,但是很難期望所有者變更比分選機貴得多的高價測試機。即,從所有者的角度來看,測試機非常昂貴,因此更希望持續使用而並非替換,因此需要替換或改良比測試機相對低廉的分選機。因此,考慮現有測試機或新型測試機的插座方向和佈置等而調整分選機較為現實。Therefore, if during the cyclic movement of the test tray, the moving direction of the test tray in the test section does not match the phased moving direction of the electronic component used for the phased test (the direction perpendicular to the moving direction of the test tray), Then the existing technology cannot be applied. Moreover, in this case, the first method or the second method above must still be adopted, which means that the aforementioned cost burden or a substantial reduction in processing speed must still be borne. Of course, since the phased movement direction of the electronic component is determined according to the structure of the tester, if the owner of the sorting machine will change the test in a way that the movement direction of the test tray is consistent with the phased movement direction of the electronic component The specification of the machine solves the difficulty, but it is difficult to expect the owner to change the expensive test machine, which is much more expensive than the sorting machine. That is, from the perspective of the owner, the testing machine is very expensive, so it is more desirable to use it continuously rather than replacing it. Therefore, it is necessary to replace or improve a sorting machine that is relatively cheaper than the testing machine. Therefore, it is more realistic to adjust the sorting machine in consideration of the direction and arrangement of the sockets of the existing testing machine or the new type of testing machine.
本發明的目的在於提供一種使電子部件在測試區間內沿與測試托盤的移動方向相同的方向或垂直的方向分階段移動時均能夠使用的技術。The object of the present invention is to provide a technique that can be used when an electronic component is moved in a stepwise direction in the same direction as the moving direction of the test tray or in a vertical direction in a test area.
根據本發明的電子部件測試用分選機的測試托盤包括:外廓框架,決定測試托盤的外廓尺寸;以及裝載框架,可移動地設置於所述外廓框架,從而借助於由分選機施加的移動力移動,並且使多個電子部件能夠具有預定間隔地進行裝載。The test tray of the sorting machine for testing electronic components according to the present invention includes: an outer profile frame, which determines the outer profile size of the test tray; The applied moving force moves and enables a plurality of electronic components to be loaded with a predetermined interval.
所述電子部件測試用分選機的測試托盤還包括:固定器,設置於所述外廓框架,使所述裝載框架在至少兩個位置上固定而防止所述裝載框架任意地移動,並且能夠借助於分選機的操作而解除所述裝載框架的固定狀態,其中,所述至少兩個位置之間的間隔是裝載於所述裝載框架的相互鄰近的電子部件之間的間隔。The test tray of the sorting machine for testing electronic components further includes: a fixer arranged on the outer frame to fix the loading frame in at least two positions to prevent the loading frame from moving arbitrarily, and can The fixed state of the loading frame is released by the operation of the sorting machine, wherein the interval between the at least two positions is the interval between mutually adjacent electronic components loaded on the loading frame.
所述裝載框架包括:固定部件,具有用於固定所述裝載框架的位置的至少兩個固定槽,所述固定器包括:固定桿,具有固定凸起,所述固定凸起選擇性地插入所述至少兩個固定槽而能夠使所述裝載框架的位置在至少兩個位置上固定;以及彈性部件,施加彈力,使得所述固定凸起保持選擇性地插入到所述至少兩個固定槽的狀態,相鄰的所述固定槽之間的間隔是裝載於所述裝載框架的相鄰的電子部件之間的間隔。The loading frame includes a fixing component having at least two fixing grooves for fixing the position of the loading frame, and the fixing device includes a fixing rod having a fixing protrusion, and the fixing protrusion is selectively inserted into the mounting frame. The at least two fixing grooves are capable of fixing the position of the loading frame in at least two positions; and an elastic member that applies elastic force so that the fixing protrusions remain selectively inserted into the at least two fixing grooves In the state, the interval between the adjacent fixing grooves is the interval between the adjacent electronic components loaded on the loading frame.
在測試區間,所述裝載框架的移動方向是垂直於所述外廓框架的移動方向的方向。In the test interval, the moving direction of the loading frame is a direction perpendicular to the moving direction of the outer frame.
根據本發明的電子部件測試用分選機,包括:裝載裝置,將需要測試的電子部件裝載到位於裝載位置的測試托盤;連接裝置,將裝載於所述測試托盤的電子部件電連接到測試機,所述測試托盤為在通過所述裝載裝置完成電子部件的裝載後來到測試位置的測試托盤;卸載裝置,從通過所述連接裝置而電連接到測試機的電子部件的測試完成後來到卸載位置的所述測試托盤卸載完成測試的電子部件;以及分步支援裝置,支援裝載於所述測試托盤的電子部件經過至少兩輪的階段而依次通過所述連接裝置電連接到測試機,所述分步支援裝置包括:分步移動器,使所述測試托盤的裝載框架相對於外廓框架而經過至少兩輪的階段而依次移動,從而使裝載於所述測試托盤的電子部件能夠通過所述連接裝置分階段地連接到測試機,所述測試托盤為如請求項1所述的測試托盤。The sorting machine for testing electronic components according to the present invention includes: a loading device for loading electronic components to be tested on a test tray at a loading position; and a connecting device for electrically connecting the electronic components loaded on the test tray to the testing machine The test tray is the test tray that arrives at the test position after the loading of the electronic components is completed by the loading device; the unloading device is the unloading position after the completion of the test of the electronic components that are electrically connected to the testing machine through the connecting device The test tray unloads the electronic components that have been tested; and a step-by-step support device that supports the electronic components loaded on the test tray to pass through at least two rounds of stages and are sequentially electrically connected to the testing machine through the connecting device, and the sub- The step support device includes: a step-by-step mover that moves the loading frame of the test tray through at least two rounds relative to the outer frame and sequentially moves, so that the electronic components loaded on the test tray can pass through the connection The device is connected to the testing machine in stages, and the test tray is the test tray as described in claim 1.
所述分步支援裝置還包括:操縱器,操縱用於固定配備於所述測試托盤的裝載框架的位置的固定器,進而使得所述裝載框架處於能夠相對於測試托盤的外廓框架移動的狀態。The step-by-step support device further includes: a manipulator for manipulating a fixer for fixing the position of the loading frame provided on the test tray, so that the loading frame is in a state capable of moving relative to the outer frame of the test tray .
在裝載框架沿與所述裝載框架的移動方向垂直的方向形成有較長的長孔,所述分步移動器包括:移動銷,插入或脫離所述長孔;旋轉源,用於使所述移動銷旋轉;以及旋轉軸,設置有所述移動銷,並且借助於所述旋轉源的操作而旋轉,從而最終使得所述移動銷旋轉,所述移動銷的旋轉中心與所述旋轉軸的旋轉中心隔開預定間隔,從而若所述移動銷以插入於所述長孔的狀態旋轉,則所述裝載框架能夠直線移動。A long long hole is formed in the loading frame along a direction perpendicular to the moving direction of the loading frame, and the step mover includes: a moving pin for inserting or detaching from the long hole; and a rotation source for making the The moving pin rotates; and a rotating shaft is provided with the moving pin and is rotated by means of the operation of the rotation source, thereby finally rotating the moving pin, the rotation center of the moving pin and the rotation of the rotating shaft The center is separated by a predetermined interval, so that if the moving pin rotates while being inserted into the long hole, the loading frame can move linearly.
所述電子部件測試用分選機還包括:恢復原狀裝置,在所述裝載框架借助於所述分步支援裝置移動之後,將所述裝載框架恢復到原來的位置。The sorting machine for testing electronic components further includes a restoration device for restoring the loading frame to its original position after the loading frame is moved by the step support device.
所述恢復原狀裝置配備於所述裝載位置與所述卸載位置之間,從而將位於在從所述卸載位置到所述裝載位置的途中的所述測試托盤的裝載框架移動到原來的位置。The restoration device is provided between the loading position and the unloading position so as to move the loading frame of the test tray on the way from the unloading position to the loading position to the original position.
在測試區間,所述裝載框架的移動方向是垂直於所述外廓框架的移動方向的方向。In the test interval, the moving direction of the loading frame is a direction perpendicular to the moving direction of the outer frame.
根據本發明,可以符合測試機的規格地製造在測試區間內對應於電子部件的分階段移動方向的分選機,尤其能夠製造在測試區間內使電子部件沿與測試托盤的移動方向垂直的方向分階段地移動的分選機。據此,即使要測試的電子部件為高規格或者尺寸大,也能夠實現測試機等高價資源的回收利用,因此能夠最小化處理容量的減小,同時能夠降低資源浪費或成本負擔。According to the present invention, it is possible to manufacture a sorting machine corresponding to the phased movement direction of the electronic components in the test section in accordance with the specifications of the testing machine, and in particular, it is possible to manufacture the electronic components in the test section in a direction perpendicular to the direction of movement of the test tray. Sorting machine that moves in stages. According to this, even if the electronic components to be tested are of high specifications or large in size, it is possible to realize the recycling of expensive resources such as test machines, so that the reduction in processing capacity can be minimized, and resource waste or cost burden can be reduced at the same time.
參照附圖,對根據本發明的較佳實施例進行說明,為了說明的簡潔性,盡可能地省略或壓縮針對重複或實質上相同的構成的說明。 <對測試托盤的說明>The preferred embodiments according to the present invention will be described with reference to the accompanying drawings. For the sake of brevity of the description, the description of the repeated or substantially the same configuration is omitted or condensed as much as possible. <Description of the test tray>
圖1是關於根據本發明的測試托盤100的立體圖,圖2是關於圖1的測試托盤100的分解立體圖。FIG. 1 is a perspective view of a
如圖1及圖2所示,測試托盤100包括外廓框架110、裝載框架120以及一對固定器130。As shown in FIGS. 1 and 2, the
外廓框架110決定測試托盤100的外廓尺寸。並且,在外廓框架110設置有裝載框架120及固定器130。這樣的外廓框架110配備有四個用於引導裝載框架120的移動並支撐裝載框架120的引導件GE。The
四個引導件GE每兩個構成一對,並且配備為沿裝載框架120的移動方向較長地凸出的凸起形態。Two of the four guides GE each constitute a pair, and are equipped in a convex form that protrudes long in the moving direction of the
裝載框架120可移動地設置於外廓框架110,從而借助於由分選機施加的移動力而移動。在這樣的裝載框架120具有多個裝載器121,使得多個電子部件D能夠具有預定間隔地進行裝載。The
裝載器121包括用於支撐電子部件D的兩端的一對裝載要素LE1、LE2。這樣的裝載要素LE1、LE2可以通過配備於分選機的開放器打開,從而分選機能夠裝載或取出電子部件D,當關閉時,能夠保持電子部件D安置於裝載框架120的狀態。這樣的裝載器121以及關於其打開及關閉的技術在韓國公開專利10-2011-0136312號(在該專利文獻中將裝載器命名為插座)中進行了詳細介紹,因此省略其詳細說明。The
並且,裝載框架120具有與上文所述的四個引導件GE對應的引導孔GH、用於固定裝載框架120的位置的一對固定部件122、傳遞部件123。In addition, the
在引導孔GH插入有外廓框架110的引導件GE。因此,裝載框架120被支撐設置於外廓框架110,並且裝載框架120可以沿引導件GE的長度方向穩定地移動。The guide GE of the
固定部件122配備為約束並固定裝載框架120的位置。在這樣的固定部件122沿前後方向形成有兩個固定槽FG,兩個固定槽FG之間的間隔與裝載於裝載框架120的相互鄰近的電子部件D之間的間隔相同。The fixing
傳遞部件123配備為接收分選機的移動力,使得裝載框架120能夠借助來自於分選機的移動力而移動,在本實施例中,在傳遞部件123形成有用於將來自於分選機的旋轉力狀態的移動力轉換為線性移動力的長孔LH。對此,將在之後的操作說明部分添加描述。The
固定器130配備為固定在各個階段中處於完成移動的狀態的裝載框架120的位置。在本實施例中,裝載框架120能夠固定在原來的裝載框架120的位置以及移動一步後的裝載框架120的移動位置。為此,如圖3的局部圖所示,固定器130包括固定桿131及彈性部件132。The
固定桿131插入上文的固定槽FG,並且具有能夠將裝載框架120的位置約束固定在當前的位置的固定凸起131a,其末端被鉸合,從而可以進行上下運動。The fixing
彈性部件132為了沿使得固定凸起131a保持插入到固定槽FG的狀態的方向施加彈力而配備為彈簧。彈性部件132配備於固定凸起131a側,用於操縱固定桿131的操縱力施加到彈性部件132的相反側。因此,如圖4所示,若對彈性部件132所在的相反側部位向下方施加操縱力F,則固定凸起131a上升而從固定槽FG脫離,從而解除裝載框架120的固定。並且,若這樣解除裝載框架120的固定,則裝載框架120可相對於外廓框架110移動。The
另外,如圖5的示意性平面圖所示,在測試托盤100中,例如,電子部件D可以裝載有2行,每1行為16個電子部件D。即,在根據本實施例的測試托盤100中,可以以2×16行列形態裝載總共32個電子部件D。In addition, as shown in the schematic plan view of FIG. 5, in the
若應用如上所述的測試托盤100,則能夠通過測試機一次測試32個電子部件D。If the
但是,由於如今要測試的電子部件D的電子數量增加等原因,在測試機一次能夠測試的數量減少的情況下,可以經過兩個階段進行測試。例如,若測試托盤100到達測試位置,則在圖5的狀態下,首先位於奇數列的16個電子部件D通過第一階段進行測試。接著,在裝載框架120如圖6所示地向前方移動之後,剩餘的位於偶數列的16個電子部件D通過第二階段進行測試。此時,裝載框架120的移動間隔與相互鄰近的電子部件D的間隔相同。
<對分選機的示意性說明>However, due to the increase in the number of electronic components D to be tested today and other reasons, in the case that the number of tests that can be tested by the test machine at one time is reduced, the test can be carried out in two stages. For example, if the
圖7是關於根據本發明的一實施例的電子部件測試用分選機200(以下,簡稱為「分選機」)的概念性平面圖。FIG. 7 is a conceptual plan view of a sorting machine 200 (hereinafter, simply referred to as "sorting machine") for testing electronic components according to an embodiment of the present invention.
如圖7所示,根據本發明的分選機200包括裝載裝置210、熱處理腔室(Soak chamber)220、測試腔室230、連接裝置240、兩個軌道裝置250、退熱腔室260、卸載裝置270、兩個分步支援裝置280及恢復原狀裝置290。As shown in FIG. 7, the sorting
裝載裝置210將需要測試的電子部件D從客戶托盤CT1裝載到位於裝載位置LP的測試托盤100。The
熱處理腔室220對在被收容的測試托盤100中所裝載的電子部件D進行預熱或預冷。The
測試腔室230配備為使得在被收容的測試托盤100中所裝載的電子部件D在要求的溫度條件下得到測試。The
連接裝置240將位於測試位置TP1、TP2的兩個測試托盤TT中所裝載的電子部件D電連接到測試機。The connecting
軌道裝置250支撐位於測試位置TP1、TP2的測試托盤100的外廓框架110並引導其移動。The
上文的連接裝置240及軌道裝置250將在後文中分出目錄而進行更詳細的說明。The above-mentioned connecting
退熱腔室260將在被收容的測試托盤100中所裝載的電子部件D恢復到接近常溫。The heat-relieving
卸載裝置270將從退熱腔室260來到卸載位置UP的測試托盤100中所裝載的電子部件D從測試托盤100卸載,並根據測試等級進行分類,進而裝載到空置的客戶托盤CT2。The
分步支援裝置280支援被收容於測試腔室230的測試托盤100中所裝載的電子部件D可以經過兩輪依次通過連接裝置240電連接到測試機。關於該分步支援裝置280將在後文中分出目錄而進行更詳細的說明。The
恢復原狀裝置290將被分步支援裝置280變更的測試托盤100恢復到原來的狀態。The
另外,測試托盤100通過未圖示的多個移送裝置而能夠沿著經過裝載位置LP、測試位置TP1、TP2、卸載位置UP及等待位置WP而連接到裝載位置LP連接的封閉的循環路徑C循環移動。In addition, the
當測試托盤100位於裝載位置LP時,需要測試的電子部件D通過裝載裝置210而被裝載到測試托盤100。When the
當測試托盤100位於測試位置TP1、TP2時,裝載於測試托盤100的電子部件D通過連接裝置240而被電連接到測試機,使得電子部件D能夠通過測試機得到測試。When the
在卸載位置UP,通過卸載裝置270將完成測試的電子部件D從測試托盤100卸載。At the unloading position UP, the electronic component D that has been tested is unloaded from the
在等待位置WP,下一順序的空置測試托盤100在向裝載位置LP移動之前進行等待,直到在當前裝載位置LP進行裝載作業的上一順序的測試托盤100完成裝載作業而移動到熱處理腔室220為止。為了充分利用如上所述的測試托盤100在位於從卸載位置UP到裝載位置LP的途中的等待位置WP的等候狀態所對應的時間,較佳地,上文中的恢復原狀裝置290配備在位於卸載位置UP與裝載位置LP之間的等待位置WP。At the waiting position WP, the next
作為參考,雖然在圖7的概念圖中示出了具有為了擴大處理容量而一次測試裝載於兩個測試托盤100的電子部件D的結構的分選機200,但是,根據實施方式,也能夠簡化為一次僅測試安裝於一個測試托盤100的電子部件D的結構。
<對分選機的特定部位的說明>For reference, although the sorting
圖8是從圖7的分選機200摘取特徵部位的立體圖。FIG. 8 is a perspective view of a characteristic part extracted from the sorting
參照圖8,連接裝置240、軌道裝置250、分步支援裝置280有機地佈置為如同一個模組。Referring to FIG. 8, the connecting
以下,從圖8摘取主要構成進行說明。但是,如上文所述,本實施例具有一次對裝載於兩個測試托盤100的電子部件D一同進行測試的結構,因此考慮構成重複,從而為了說明的簡潔性,除了必要的情況以外,僅摘取一側的構成進行說明。
1、連接裝置240Hereinafter, the main configuration will be extracted from FIG. 8 for description. However, as described above, the present embodiment has a structure in which the electronic components D loaded on the two
圖9是摘取將裝載於測試托盤100的電子部件D電連接到測試機的連接裝置240的立體圖。FIG. 9 is a perspective view of the connecting
如圖9所示,連接裝置240包括加壓驅動源241、升降板242以及兩個加壓板243。As shown in FIG. 9, the connecting
加壓驅動源241產生使升降板242升降的驅動力。這樣的加壓驅動源241需要實現升降板242的多階升降,因此可以較佳地考慮採用伺服馬達。The
升降板242隨著加壓驅動源241的操作而升降。The lifting
加壓板243以分別對應於一個測試托盤100的方式總共配備為兩個。這樣的加壓板243通過四個結合棒B1而與升降板242結合,從而隨著升降板242的升降一同升降,通過其升降,向測試機的插座側對裝載於測試托盤100的電子部件D進行加壓,或者解除加壓。為此,較佳地,在加壓板243具有與裝載於測試托盤100的電子部件D的數量相同的數量的推動件P。但是,由於本發明的特徵在於針對裝載於測試托盤100的電子部件D的分階段測試,因此在圖8中,為了對分階段測試進行說明,圖示了加壓板243在測試托盤100僅裝載有2行16列總共32個電子部件D的數量的一半,即2行8列總共16個推動件P的情形。在此,推動件P之間的間隔是裝載於測試托盤100的彼此鄰近的電子部件D之間的間隔的兩倍。當然,若測試機的規格能夠被支援,則在加壓板243將會配備有2行16列總共32個推動件P,在這種情況下,推動件P與電子部件D構成為一對一的對應。
2、軌道裝置250The
圖10是摘取在測試位置TP1、TP2支撐測試托盤100並引導移動的軌道裝置250的立體圖。FIG. 10 is a perspective view of a
軌道裝置250包括軌道升降源251、升降框架252以及一對引導軌道253a、253b。The
軌道升降源251產生用於使一對引導軌道253a、253b升降的動力,並且設置於升降板242。因此,軌道裝置250也隨著升降板242的升降一同升降。The rail raising and lowering
升降框架252隨著軌道升降源251的操作而升降。The
一對引導軌道253a、253b相互對稱地配備,從而引導測試托盤100的移動,或者支撐位於測試位置TP1、TP2的測試托盤100。A pair of
當然,升降框架252與一對引導軌道253a、253b通過結合條B2相互結合,從而升降框架252的升降與一對引導軌道253a、253b的升降聯動。Of course, the elevating
作為參考,由於軌道升降源251設置於升降板242,因此軌道裝置250也隨著升降板242的升降而一同升降,但是由於軌道升降源251獨立於加壓驅動源241而操作,因此軌道裝置250的引導軌道253a、253b能夠獨立於連接裝置240的加壓板243而升降,從而引導軌道253a、253b能夠相對於加壓板243升降。
3、分步支援裝置For reference, since the
圖11是關於用於支持裝載於測試托盤100的電子部件D的分階段測試的分步支援裝置280的局部圖。FIG. 11 is a partial view of a step-by-
如圖11所示,分步支援裝置280包括分步移動器281及操縱器282。As shown in FIG. 11, the
如圖12所示,分步移動器281包括移動銷281a、旋轉源281b、旋轉軸281c及升降源281d。As shown in FIG. 12, the
移動銷281a可升降地配備,並且插入或脫離配備於測試托盤100的傳遞部件123的長孔LH。The moving
旋轉源281b提供用於使移動銷旋轉的動力。The
在旋轉軸281c的下端設置有升降源281d及移動銷281a,旋轉軸281c借助於旋轉源281b的操作而旋轉。因此,若旋轉軸281c借助於旋轉源281b的操作而旋轉,則最終設置於其下端的移動銷281a也會旋轉。A lifting
升降源281d配備於旋轉軸281c的下端,提供用於使移動銷281a升降的動力。即,若升降源281d進行操作,則移動銷281a升降,從而移動銷281a插入或脫離於長孔LH。The lifting
在此,移動銷281a的旋轉中心O1與旋轉軸281c的旋轉中心O2隔開預定間隔。即,移動銷281a與旋轉軸281c的旋轉中心O2隔開預定間隔而進行偏轉。因此,若移動銷281a在插入傳遞部件123的長孔LH的狀態下旋轉,則如參照圖13的(a)及(b)所示,裝載框架120進行直線移動。因此,傳遞部件123還起到將旋轉力轉換為線性力的轉換部件的功能。Here, the rotation center O1 of the moving
操縱器282具有操縱用於約束並固定裝載框架120的位置的固定器130以解除其固定狀態的功能。為此,如圖14所示,操縱器282包括一對操縱驅動源282a、升降部件282b、一對操縱銷282c。The
一對操縱驅動源282a提供用於使升降部件282b升降的動力。The pair of steering
升降部件282b根據操縱驅動源282a的操作而升降。The elevating
一對操縱銷282c配備為向下方凸出,並且結合於升降部件282b而隨著升降部件282b的升降一同升降。The pair of manipulation pins 282c are provided so as to protrude downward, and are coupled to the elevating
圖15的(a)示出了當前固定器130固定裝載框架120的狀態,圖15的(b)示出了升降部件282b及操縱銷282c隨著操縱驅動源282a的操作而下降並操縱固定器130的狀態。即,圖15的(a)為固定器130的固定凸起131a插入固定部件122的固定槽FG的狀態,圖15的(b)為操縱銷282c下降並向下方按壓固定桿131的另一側,從而固定器130解除針對裝載框架120的固定的狀態。關於電子部件D的測試在圖15的(a)的狀態下進行,裝載框架120的移動在圖15的(b)的狀態下進行。
<對主要部位的操作的說明>
1、配備有高規格的測試機的情況FIG. 15(a) shows the current state where the
在配備有高規格的測試機的情況下,可以一次對裝載於兩個測試托盤100的64個電子部件D一同進行測試。但是,為了說明的簡潔性,僅以裝載於一個測試托盤100的32個電子部件D為基準進行說明。When equipped with a high-standard testing machine, 64 electronic components D loaded on two
在這種情況下,在加壓板243配備有2行16列總共32個推動件P,從而各個推動件P可以全部與裝載於測試托盤100的電子部件D一對一的對應。In this case, the
若測試托盤100來到測試位置TP1、TP2而支撐於引導軌道253a、253b,則引導軌道253a、253b上升,從而加壓板243的推動件P與裝載於測試托盤100的電子部件D首先進行匹配。接著,加壓板243下降,從而裝載於測試托盤100的電子部件D與測試機電連接。
2、配備有低規格的測試機的情況When the
在配備有低規格的測試機的情況下,無法一次對裝載於一個測試托盤100的32個電子部件D全部進行測試。因此,需要經過兩次而進行分階段測試,此時,在加壓板243配備有2行8列的推動件P。當然,相鄰的推動件P之間的列間間隔是裝載於測試托盤100的相鄰的電子部件D之間的列間間隔的兩倍。When a low-spec tester is equipped, it is impossible to test all the 32 electronic components D loaded on one
首先,若測試托盤100在圖13的(a)的狀態下來到測試位置TP1、TP2,則引導軌道253a、253b上升。因此,位於奇數列的電子部件D匹配到推動件P。並且,在加壓板243下降而實現奇數列的電子部件D與測試機之間的電連接之後,進行第一階段的測試。First, when the
若第一階段的測試完成,則首先加壓板243上升預定間隔,並且引導軌道253a、253b下降。接著,操縱器282工作而解除通過固定器130實現的裝載框架120的固定狀態,並且分步移動器281工作而使裝載框架120移動,從而將測試托盤100轉換為圖13的(b)的狀態。當然,若測試托盤100轉換為圖13的(b)的狀態,則操縱銷282c上升,進而裝載框架120被固定器130固定。If the test of the first stage is completed, first the
若引導軌道253a、253b在圖13的(b)的狀態下上升,則16個推動件P與位於偶數列的16個電子部件D相互配備。並且,加壓板243下降而實現偶數列的電子部件D與測試機之間的電連接之後,進行第二階段的測試。If the
再次參照圖7,在循環路徑C上,經過測試位置TP1、TP2的測試托盤100沿從左側向右側的方向移動。但是,可知通過本實施例的用於分階段測試的分步支援裝置280實現的裝載框架120以及裝載於裝載框架120的電子部件D的移動方向為從後方向前方的移動。即,在本實施例中,為了電子部件D的分階段測試,使電子部件D垂直於測試托盤100的移動路徑而移動。
<對恢復原狀裝置的附加說明>Referring again to FIG. 7, on the circulation path C, the
恢復原狀裝置290將通過分步支援裝置280而以變更為圖13的(b)狀態的狀態來到等待位置WP的測試托盤100的裝載框架120恢復為原來的狀態,即圖13的(a)的狀態。為此,恢復原狀裝置290具有與分步支援裝置280相同的構成,因此省略其詳細說明。
<參考事項>
1、關於裝載框架120的移動方向The restoring
本發明以在測試托盤100的移動方向與用於分階段測試的電子部件D的移動方向垂直的情況下進行應用的目的而導出,對於上文的實施例而言,同樣地,實現為電子部件D沿與測試托盤100的移動方向垂直的方向移動的形態。The present invention is derived for the purpose of application when the moving direction of the
然而,根據實施方式,本發明也可以充分地應用於測試托盤100的移動方向與電子部件D的移動方向相同的情況。這僅通過改變長孔LH與移動銷281a的佈置即可簡單地實現。
2、關於階段的次數However, according to the embodiment, the present invention can also be sufficiently applied to the case where the moving direction of the
雖然在上文的實施例中假設了經過兩個階段而對裝載於測試托盤100的電子部件D進行測試的情形,但是也能夠實現為通過長孔LH的長度、移動銷281a與旋轉軸281c之間的間隔以及移動銷281a的經三個階段以上的旋轉及停止而使裝載於測試托盤100的電子部件D經歷三個階段以上的階段進行測試。
3、關於恢復原狀Although it is assumed in the above embodiment that the electronic component D loaded on the
在本說明書中,設置單獨的恢復原狀裝置290以使測試托盤100的狀態恢復原狀。In this specification, a separate restoring
然而,根據實施方式,若第二階段的測試完成,則分步支援裝置280可以控制為使測試托盤100恢復原狀,在這種情況下,可以省略單獨的恢復原狀裝置的構成。However, according to the embodiment, if the second stage of the test is completed, the step-by-
並且,通過對裝載裝置210及卸載裝置270的程序性的控制,可以考慮省略單獨的恢復原狀過程而實現為進行與測試托盤100的當前狀態(裝載框架的當前位置)對應的裝載作業及卸載作業。In addition, through the procedural control of the
但是,通過分步支援裝置280執行恢復原狀的方法在測試位置TP1、TP2進行,因此恢復原狀的時間期間無法靈活利用測試機,並且通過程序性的控制而省略單獨的恢復原狀過程的方法需要複雜的演算法開發以及複雜的控制。However, the method of restoring to the original state by the step-by-
因此,如上文的實施例所述,可以最佳地考慮配備用於將在等待位置WP等待的測試托盤100恢復原狀的單獨的恢復原狀裝置290。即,如本實施例所述,在等待位置WP配備單獨的恢復原狀裝置290,從而將測試托盤100恢復原狀的作業不會限制分選機200或測試機的處理容量,其控制也能夠簡單地實現。Therefore, as described in the above embodiment, it can be best considered to equip with a separate restoring
如上文所述,雖然基於參照附圖的實施例而針對本發明進行了具體說明,但是上述的實施例僅僅說明了本發明的較佳實施例,因此不應理解為本發明局限於上述實施例,本發明的權利範圍應按照申請專利範圍的範圍及其等同範圍來理解。As mentioned above, although the present invention has been specifically described based on the embodiments with reference to the drawings, the above-mentioned embodiments only illustrate the preferred embodiments of the present invention, and therefore should not be construed as limiting the present invention to the above-mentioned embodiments. The scope of rights of the present invention should be understood in accordance with the scope of the patent application and its equivalent scope.
100:測試托盤
110:外廓框架
120:裝載框架
122:固定部件
FG:固定槽
123:傳遞部件
LH:長孔
130:固定器
131:固定桿
131a:固定凸起
132:彈性部件
200:電子部件測試用分選機
210:裝載裝置
240:連接裝置
270:卸載裝置
280:分步支援裝置
281:分步移動器
281a:移動銷
281b:旋轉源
281c:旋轉軸
282:操縱器
290:恢復原狀裝置100: test tray
110: Outer frame
120: loading frame
122: fixed parts
FG: fixed groove
123: Passing parts
LH: Long hole
130: Fixer
131: fixed
圖1是關於根據本發明的一實施例的測試托盤的立體圖。Fig. 1 is a perspective view of a test tray according to an embodiment of the present invention.
圖2是關於圖1的測試托盤的分解立體圖。Fig. 2 is an exploded perspective view of the test tray of Fig. 1.
圖3是關於配備於圖1的測試托盤的固定器的局部圖。Fig. 3 is a partial view of a fixture provided on the test tray of Fig. 1.
圖4是用於說明圖3的固定器的操作狀態的參考圖。Fig. 4 is a reference diagram for explaining the operating state of the holder of Fig. 3.
圖5及圖6是用於說明圖1的測試托盤的狀態變更的參考圖。5 and 6 are reference diagrams for explaining the state change of the test tray in FIG. 1.
圖7是關於根據本發明的一實施例的電子部件測試用分選機的概念性平面圖。Fig. 7 is a conceptual plan view of a sorting machine for testing electronic components according to an embodiment of the present invention.
圖8是從圖7的分選機摘取特徵部位的立體圖。Fig. 8 is a perspective view of a characteristic part extracted from the sorting machine of Fig. 7.
圖9是從圖7的分選機摘取連接裝置的立體圖。Fig. 9 is a perspective view of the connecting device taken from the sorting machine of Fig. 7.
圖10是從圖7的分選機摘取軌道裝置的立體圖。Fig. 10 is a perspective view of the rail device taken from the sorting machine of Fig. 7.
圖11是從圖7的分選機摘取分步支援裝置的立體圖。Fig. 11 is a perspective view of the step support device taken from the sorting machine of Fig. 7.
圖12是從圖7的分選機摘取分步移動器的立體圖。Fig. 12 is a perspective view of the step mover taken from the sorting machine of Fig. 7;
圖13是用於說明圖12的分步移動器的操作的參考圖。Fig. 13 is a reference diagram for explaining the operation of the step shifter of Fig. 12.
圖14是從圖7的分選機摘取操縱器的立體圖。Fig. 14 is a perspective view of the manipulator removed from the sorting machine of Fig. 7.
圖15是用於說明圖14的操縱器的操作的參考圖。Fig. 15 is a reference diagram for explaining the operation of the manipulator of Fig. 14.
國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic hosting information (please note in the order of hosting organization, date and number) none
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Foreign hosting information (please note in the order of hosting country, institution, date, and number) none
100:測試托盤 100: test tray
240:連接裝置 240: Connecting device
250:軌道裝置 250: Orbital device
280:分步支援裝置 280: Step-by-step support device
281:分步移動器 281: Step Mover
282:操縱器 282: Manipulator
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WO2024122079A1 (en) * | 2023-04-12 | 2024-06-13 | 株式会社東光高岳 | Workpiece conveyance apparatus and workpiece inspection device |
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