TW202124304A - Dividing method and dividing device the present invention provides dividing method and dividing device that can easily and well divide a waste material portion along a scribed line formed on a substrate - Google Patents

Dividing method and dividing device the present invention provides dividing method and dividing device that can easily and well divide a waste material portion along a scribed line formed on a substrate Download PDF

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TW202124304A
TW202124304A TW109136101A TW109136101A TW202124304A TW 202124304 A TW202124304 A TW 202124304A TW 109136101 A TW109136101 A TW 109136101A TW 109136101 A TW109136101 A TW 109136101A TW 202124304 A TW202124304 A TW 202124304A
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line
sub
waste material
scribing
substrate
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中川智子
植田光寿
黒川正光
秀島護
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日商三星鑽石工業股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

To provide dividing method and dividing device that can easily and well divide a waste material portion along a scribed line formed on a substrate. The method of dividing the waste material portion 30 from the substrate 10 includes: a scribing step (S11), forming a main scribed line L and a sub-scribed line S1 formed along the shape of the waste material portion 30; In dividing step (S12), the substrate 10 is divided along the main scribed line L and the sub-scribed line S1; in the scribing step (S11), the sub-scribing line S1 is extended in the direction crossing the main scribed line L. In the width direction, the method of dividing the waste material portion 30 is formed; the dividing step (S12) includes a dividing step, which is to bend the area containing the sub-scribed line S1 to extend the vertical crack C1 along the sub-scribed line S1, The waste material part 30 is divided into a plurality of areas divided by the sub-scribed line S1.

Description

分割方法以及分割裝置Division method and division device

本揭示係有關於一種分割已形成劃線之基板的分割方法以及分割裝置。The present disclosure relates to a dividing method and a dividing device for dividing a substrate on which scribe lines have been formed.

以往,玻璃基板等之脆性材料基板的分割係藉以下之步驟所構成,劃線步驟,係在基板之表面形成劃線;及分離(break)步驟,係沿著所形成之劃線,對與形成劃線之面相反側的面賦與既定力。在劃線步驟,係劃線輪一面被壓在基板之表面,一面沿著既定線移動。In the past, the division of brittle material substrates such as glass substrates was constituted by the following steps. The scribing step is to form a scribe line on the surface of the substrate; and the break step is to follow the formed scribe line, and A predetermined force is applied to the surface opposite to the surface forming the scribe line. In the scribing step, the scribing wheel is pressed against the surface of the substrate while moving along a predetermined line.

在專利文獻1,係揭示一種方法,該方法係沿著劃線除去從基板之端緣往基板之內側凹下之形狀的廢材部。在專利文獻1所揭示之廢材部除去方法係包含:劃線形成步驟,係沿著廢材部之外緣形成劃線;副劃線形成步驟,係以形成帶狀部的方式沿著劃線在廢材部形成副劃線;除去步驟,係從廢材部除去本體部;以及移動步驟,係使帶狀部的兩端部移動成彼此接近。 [先行專利文獻] [專利文獻]Patent Document 1 discloses a method of removing waste material portions recessed from the edge of the substrate toward the inner side of the substrate along the scribe line. The waste material part removal method disclosed in Patent Document 1 includes: a scribe line forming step, which is to form a scribe line along the outer edge of the waste material part; The line forms a secondary scribe line in the waste material part; the removing step is to remove the main body part from the waste material part; and the moving step is to move the two ends of the belt-shaped part close to each other. [Prior Patent Document] [Patent Literature]

專利文獻1:特開2015-174804號公報Patent Document 1: Japanese Patent Application Publication No. 2015-174804

[發明所欲解決之課題][The problem to be solved by the invention]

在專利文獻1所記載之方法,係使帶狀部的兩端部移動成彼此接近,而從製品部分離帶狀部,但是在廢材部包含銳角之部分等複雜之形狀的情況,係帶狀部難分離。又,在此方法,係除了形成劃線以外,在廢材部還形成輔助劃線。進而,在分割廢材部時,需要分別地分割本體部與帶狀部,但是根據廢材部之大小,係有難形成帶狀部的情況。In the method described in Patent Document 1, the two ends of the belt-shaped part are moved close to each other, and the belt-shaped part is separated from the product part. However, when the waste material part contains a complicated shape such as an acute-angled part, the belt is tied The shape is difficult to separate. Furthermore, in this method, in addition to forming the scribe line, an auxiliary scribe line is also formed in the waste material portion. Furthermore, when dividing the waste material part, it is necessary to divide the main body part and the band-shaped part separately. However, depending on the size of the waste material part, it may be difficult to form the band-shaped part.

鑑於該課題,本發明係目的在於得到一種分割方法以及分割裝置,該分割方法係沿著在基板所形成之劃線可易於且良好地分割廢材部。 [解決課題之手段]In view of this problem, an object of the present invention is to obtain a dividing method and a dividing device that can easily and well divide the waste material portion along the scribe line formed on the substrate. [Means to solve the problem]

本發明之第1形態係有關於一種從基板分割廢材部的分割方法。本形態之分割方法係包括:劃線步驟,係形成:主劃線,係沿著廢材部的輪廓形狀所形成;及副劃線,係位於該廢材部內並被形成於與該主劃線相同的面;及分割步驟,係沿著該主劃線及該副劃線分割該基板;在該劃線步驟,係該副劃線以在與該主劃線交叉之方向延伸,並在寬度方向劃分該廢材部之方式形成;該分割步驟係包含分割之步驟,該分割之步驟係藉由使包含該副劃線之區域彎曲,使垂直龜裂沿著該副劃線伸展,而以分成藉該副劃線所劃分之複數個區域的方式分割該廢材部。The first aspect of the present invention relates to a method of dividing a waste material portion from a substrate. The division method of this form includes: the step of scribing, forming: the main scribing line is formed along the contour shape of the waste material part; And the dividing step is to divide the substrate along the main scribing line and the sub-scribing line; in the scribing step, the sub-scribing line extends in the direction intersecting the main scribing line, and in the The waste material part is divided in the width direction; the dividing step includes a dividing step, and the dividing step is to bend the area containing the sub-scribing line to extend the vertical crack along the sub-scribing line, and The waste material part is divided in a manner of being divided into a plurality of areas divided by the sub-line.

若依據本形態之分割方法,在廢材部使包含副劃線之區域彎曲時,副劃線之附近在基板之厚度方向位移。因此,在副劃線所形成的垂直龜裂滲透,該垂直龜裂之滲透沿著副劃線伸展。沿著副劃線所伸展之垂直龜裂係與主劃線連接,而垂直龜裂沿著主劃線滲透並伸展。因此,在藉副劃線所劃分之各區域可易於分割廢材部。在此時,因為垂直龜裂沿著副劃線及主劃線滲透並伸展,所以可抑制在分割後之基板所產生的碎片(chipping)或被稱為所謂的「扭歪」之細的損傷。因此,可從基板得到高品質的製品。According to the dividing method of this form, when the waste material portion bends the area including the sub-scribing line, the vicinity of the sub-scribing line is displaced in the thickness direction of the substrate. Therefore, the vertical crack formed in the secondary scribe line penetrates, and the penetration of the vertical crack extends along the secondary scribe line. The vertical crack system extending along the secondary scribe line is connected with the main scribe line, and the vertical crack penetrates and extends along the main scribe line. Therefore, the waste material part can be easily divided in each area divided by the sub-line. At this time, because the vertical crack penetrates and stretches along the sub-scribing line and the main scribing line, it is possible to suppress chipping or fine damage called "twist" generated on the substrate after the division. . Therefore, high-quality products can be obtained from the substrate.

尤其,廢材部中基板之內側的角部分係在從基板分割廢材部時,廢材部與製品部摩擦而易發生扭歪。可是,若依據上述的構成,因為垂直龜裂沿著副劃線及主劃線良好地滲透並伸展,所以在分割廢材部時,在廢材部之角部分所產生的扭歪減少。Particularly, when the corner portion inside the substrate in the waste material part is divided from the substrate, the waste material part rubs against the product part and tends to be twisted. However, according to the above configuration, since the vertical cracks penetrate and extend well along the sub-scribing line and the main scribing line, when the waste material part is divided, the distortion generated in the corner portion of the waste material part is reduced.

在本形態之分割方法,該分割步驟係朝向該副劃線推壓與形成該副劃線之該廢材部的面相反側的面,並隔著該副劃線在至少2處可推壓形成該副劃線之該廢材部的面。In the dividing method of this form, the dividing step is to push the side opposite to the side of the waste material portion forming the auxiliary scribing line toward the auxiliary scribing line, and press at least two places across the auxiliary scribing line The surface of the waste material portion that forms the secondary scribe line.

若依據本形態之分割方法,因為向外側打開副劃線之力作用,所以垂直龜裂沿著副劃線良好地滲透並伸展。According to the division method of this form, the vertical crack penetrates and stretches well along the sub-scribing line because of the force that opens the sub-scribing line to the outside.

又,因為從隔著副劃線之位置對廢材部在同方向賦與力,所以沿著副劃線滲透及伸展之垂直龜裂與主劃線連接時,在主劃線之全周垂直龜裂圓滑地滲透並伸展。因此,從廢材部可易於且良好地分割藉副劃線所分割之區域。In addition, because the waste material is applied in the same direction from the position separated by the sub-scribing line, when the vertical cracks that penetrate and extend along the sub-scribing line are connected to the main scribing line, they are perpendicular to the entire circumference of the main scribing line The cracks penetrate and stretch smoothly. Therefore, the area divided by the sub-scribing line can be easily and well divided from the waste material part.

在本形態之分割方法,該廢材部係從該基板之外周緣往該基板之內側的凹狀,並可被形成為具有包含直線部與曲線部的輪廓形狀。In the dividing method of this aspect, the waste material portion is a concave shape from the outer periphery of the substrate to the inner side of the substrate, and can be formed to have an outline shape including a straight portion and a curved portion.

若依據本形態之分割方法,因為使廢材部彎曲並分割廢材部,所以是如上述所示之形狀的廢材部,亦不會損害製品部之品質便可從基板可分割廢材部。According to the dividing method of this form, because the waste material part is bent and the waste material part is divided, it is a waste material part of the shape shown above, and the quality of the product part can be divided from the substrate. .

在此情況,該分割步驟係可包含分離步驟,該分離步驟係在使垂直龜裂沿著該副劃線伸展之狀態,向該基板之外側分離該廢材部。In this case, the dividing step may include a separating step that separates the waste material portion from the substrate in a state where the vertical crack is extended along the sub-scribing line.

因此,可不會與製品部接觸地分割廢材部。Therefore, the waste material part can be divided without contacting the product part.

在本形態之分割方法,以朝向該主劃線之該副劃線的端部與該主劃線分開僅既定距離的方式可形成該副劃線。In the dividing method of this form, the sub-scribing line can be formed in such a way that the end of the sub-scribing line facing the main scribing line is separated from the main scribing line by a predetermined distance.

若依據本形態之分割方法,因為副劃線的端部與主劃線分開僅既定距離,所以可防止朝向主劃線並沿著副劃線滲透並伸展的垂直龜裂超出主劃線而進入製品部內。因此,在分割廢材部時,可更確實地抑制製品部受損,而可提高製品部之品質。According to the division method of this form, because the end of the secondary scribe line is separated from the main scribe line by only a predetermined distance, it can prevent vertical cracks that penetrate and extend toward the main scribe line and penetrate along the secondary scribe line and enter beyond the main scribe line. In the product department. Therefore, when the waste material part is divided, damage to the product part can be suppressed more reliably, and the quality of the product part can be improved.

又,該副劃線係可包含第1副劃線,該第1副劃線係被形成於該廢材部之在該寬度方向的中央附近。In addition, the sub-scribing line may include a first sub-scribing line formed in the vicinity of the center of the waste material portion in the width direction.

若依據本形態之分割方法,在使廢材部彎曲時,以第1副劃線為中心,廢材部大致均勻地彎曲。因此,向基板之外側打開之力大致均勻地作用於第1副劃線。因此,垂直龜裂沿著第1副劃線更圓滑地滲透及伸展。另一方面,根據上述的構成,在主劃線之全周大致均勻地在基板之厚度方向產生變形的力作用。因此,沿著第1副劃線滲透並伸展的垂直龜裂與主劃線連續時,垂直龜裂沿著主劃線均勻地滲透並伸展。因此,沿著第1副劃線及主劃線可更圓滑且良好地分割廢材部。According to the dividing method of this aspect, when the waste material part is bent, the waste material part is bent substantially uniformly with the first sub-scribed line as the center. Therefore, the force of opening to the outside of the substrate acts on the first sub-scribing line substantially uniformly. Therefore, the vertical crack penetrates and spreads more smoothly along the first auxiliary scribe line. On the other hand, according to the above-mentioned configuration, the force of deformation is generated substantially uniformly in the thickness direction of the substrate over the entire circumference of the main scribing line. Therefore, when the vertical cracks penetrating and extending along the first auxiliary scribing line are continuous with the main scribing line, the vertical cracks evenly infiltrating and extending along the main scribing line. Therefore, the waste material part can be divided more smoothly and well along the first sub-scribing line and the main scribing line.

在本形態之分割方法,該副劃線係包含在隔著該第1副劃線之位置所形成的第2副劃線與第3副劃線,該分割步驟係包含:垂直龜裂伸展步驟,係從與形成該第1副劃線之該廢材部的面相反的面側朝向該第1副劃線推壓該廢材部的中心附近;及第1分割步驟,係從形成該第1副劃線之面側推壓廢材部的2處,而分割由該第2副劃線及該第3副劃線所夾之區域,該廢材部的2處係由該第2副劃線及該第3副劃線、與該第1副劃線所夾。In the dividing method of this form, the sub-line includes the second sub-line and the third sub-line formed at a position separated from the first sub-line, and the division step includes: a vertical crack extension step , Is to push the vicinity of the center of the waste material portion from the side opposite to the surface of the waste material portion on which the first sub-scribing line is formed toward the first sub-scribing line; and the first dividing step is to form the first sub-scribing line The side of the one side of the scribe line pushes the two places of the waste material part, and the area sandwiched by the second scribe line and the third scribe line is divided. The two places of the waste material part are divided by the second part The line and the third sub-line are sandwiched by the first sub-line.

若依據本形態之分割方法,在龜裂伸展步驟,因為向外側打開第1副劃線之力作用於廢材部,所以垂直龜裂沿著第1副劃線滲透並伸展。According to the division method of this form, in the crack extension step, since the force of opening the first secondary scribe line to the outside acts on the waste material part, the vertical crack penetrates and extends along the first secondary scribe line.

而且,在第1分割步驟,藉由推壓由第2副劃線及第3副劃線、與第1副劃線所夾之廢材部的2處,在基板之厚度方向位移之力作用於第2及第3副劃線。因此,垂直龜裂沿著第2副劃線及第3副劃線滲透並伸展。Furthermore, in the first dividing step, the force of displacement in the thickness direction of the substrate is exerted by pressing two places of the scrap part sandwiched by the second and third sub-scribing lines, and the first sub-scribing line Underline the 2nd and 3rd sublines. Therefore, the vertical crack penetrates and extends along the second and third auxiliary scribe lines.

依此方式,第1副劃線、第2副劃線以及第3副劃線係因為垂直龜裂是良好地滲透並伸展之狀態,所以該區域係以第1副劃線為中心易於且良好地被分割成2個區域。In this way, the first sub-line, the second sub-line, and the third sub-line are because the vertical cracks penetrate and spread well, so the area is easy and good with the first sub-line as the center. The ground is divided into 2 areas.

在本形態之分割方法,該副劃線係包含:第2副劃線與第該3副劃線,係被形成於隔著該第1副劃線之位置;及第4副劃線,係以與該第1副劃線、該第2副劃線以及該第3副劃線之各條相交的方式所形成;該分割步驟係可包含:龜裂伸展步驟,係從與形成該第1副劃線之該廢材部的面相反的面側朝向該第1副劃線推壓該第1副劃線與該第4副劃線之交點;及第1分割步驟,係從形成該第1副劃線之面側推壓2個區域,而分割該區域,該2個區域係被該第1副劃線、該基板之外周緣、該第2副劃線以及該第3副劃線包圍。In the division method of this form, the sub-line includes: the second sub-line and the third sub-line, which are formed at a position separated from the first sub-line; and the fourth sub-line, which is It is formed by intersecting each of the first sub-line, the second sub-line, and the third sub-line; The side of the side opposite to the side of the waste material portion of the auxiliary scribing line pushes the intersection of the first auxiliary scribing line and the fourth auxiliary scribing line toward the first auxiliary scribing line; and the first dividing step is to form the first auxiliary scribing line The surface side of one sub-scribing line pushes two areas and divides the two areas. The two areas are divided by the first sub-scribing line, the outer periphery of the substrate, the second sub-scribing line, and the third sub-scribing line Surrounded.

若依據本形態之分割方法,在龜裂伸展步驟,廢材部係藉由從第1副劃線的下方朝向第1副劃線被推壓而彎曲。因此,垂直龜裂以被推壓之第1及第4副劃線的交點為起點成放射狀地伸展。According to the dividing method of this aspect, in the crack extension step, the waste material portion is bent by being pushed from below the first sub-line toward the first sub-line. Therefore, the vertical cracks extend radially from the intersection of the first and fourth subscribed lines being pressed as a starting point.

而且,在第1分割步驟,藉由推壓由第2及第3副劃線與第1副劃線所夾之廢材部的2處,在基板之厚度方向位移之力作用於第2及第3副劃線。因此,垂直龜裂沿著第2及第3副劃線滲透並伸展。Furthermore, in the first dividing step, by pushing two places of the scrap part sandwiched by the second and third sub-scribe lines and the first sub-scribe line, the force of displacement in the thickness direction of the substrate acts on the second and The third underline. Therefore, the vertical crack penetrates and spreads along the second and third auxiliary scribe lines.

依此方式,第1副劃線、第2副劃線以及第3副劃線係因為垂直龜裂是良好地滲透並伸展之狀態,所以該區域係以第1副劃線為中心易於且良好地被分割成2個區域。In this way, the first sub-line, the second sub-line, and the third sub-line are because the vertical cracks penetrate and spread well, so the area is easy and good with the first sub-line as the center. The ground is divided into 2 areas.

該區域係位於廢材部之外周緣側的區域。因此,在進行第1分割步驟而分割該區域的情況,對製品部無影響。又,例如,在廢材部的形狀是寬度從基板之外周緣朝向基板的內側變寬之形狀的情況,若先分割基板之外周緣側的該區域,在分割該區域後,可使分割廢材部之進深側的區域時之變形變大。因此,在分割該區域後,可易於分割剩下的區域。This area is an area located on the outer peripheral side of the waste material part. Therefore, when the region is divided by performing the first division step, there is no influence on the product portion. Also, for example, when the shape of the waste material portion is a shape whose width widens from the outer periphery of the substrate toward the inner side of the substrate, if the area on the outer periphery side of the substrate is divided first, after the area is divided, the waste can be divided. The deformation of the area on the deep side of the material part becomes larger. Therefore, after dividing the area, the remaining area can be easily divided.

又,這種分割係例如在廢材部為大面積的情況尤其有效。藉由在廢材部形成複數條副劃線,將廢材部分割成複數個,並從易分割之區域可局部地分割。In addition, such a division system is particularly effective when, for example, the waste material portion has a large area. By forming a plurality of sub-scribing lines in the waste material part, the waste material part is divided into a plurality of parts, and can be partially divided from the easily divided area.

在本形態之分割方法,該副劃線係包含:第2副劃線與第該3副劃線,係被形成於隔著該第1副劃線之位置;及第4副劃線,係以與該第1副劃線、該第2副劃線以及該第3副劃線之各條相交的方式所形成;該分割步驟係可包含:龜裂伸展步驟,係從與形成該第1副劃線之該廢材部的面相反側朝向該第1副劃線推壓該第1副劃線與該第4副劃線之交點;及第1分割步驟,係從形成該第1副劃線之面側推壓2個區域,而分割該區域,該2個區域係被該第1副劃線、該基板之外周緣、該第2副劃線、該第3副劃線以及該第4副劃線包圍。In the division method of this form, the sub-line includes: the second sub-line and the third sub-line, which are formed at a position separated from the first sub-line; and the fourth sub-line, which is It is formed by intersecting each of the first sub-line, the second sub-line, and the third sub-line; The side opposite to the side of the waste material portion of the auxiliary scribing line pushes the intersection of the first auxiliary scribing line and the fourth auxiliary scribing line toward the first auxiliary scribing line; and the first dividing step is to form the first auxiliary scribing line The surface side of the scribing line presses two areas to divide the areas. The two areas are divided by the first sub-scribing line, the outer periphery of the substrate, the second sub-scribing line, the third sub-scribing line, and the Surrounded by the fourth underline.

若依據本形態之分割方法,在龜裂伸展步驟,廢材部係藉由從第1副劃線的下方朝向第1副劃線被推壓而彎曲。因此,垂直龜裂以被推壓之第1及第4副劃線的交點為起點成放射狀地伸展。According to the dividing method of this aspect, in the crack extension step, the waste material portion is bent by being pushed from below the first sub-line toward the first sub-line. Therefore, the vertical cracks extend radially from the intersection of the first and fourth subscribed lines being pressed as a starting point.

而且,在第1分割步驟,藉由推壓位於由第2、第3以及第4副劃線所包圍之廢材部的外周緣側之區域內的2處,在基板之厚度方向位移之力作用於第1~第4副劃線。因此,垂直龜裂沿著第2及第3副劃線滲透並伸展。Moreover, in the first dividing step, the force of displacement in the thickness direction of the substrate is achieved by pressing two places located in the area on the outer peripheral edge side of the waste material portion surrounded by the second, third, and fourth subscribed lines Acts on the 1st to 4th sub-line. Therefore, the vertical crack penetrates and spreads along the second and third auxiliary scribe lines.

依此方式,第1副劃線、第2副劃線、第3副劃線以及第4副劃線係因為垂直龜裂是良好地滲透並伸展之狀態,所以該區域係沿著各副劃線易於且良好地被分割成複數個區域。In this way, the first sub-line, the second sub-line, the third sub-line, and the fourth sub-line are because the vertical cracks penetrate and extend well, so the area is along each sub-line. The line is easily and well divided into a plurality of regions.

該區域係位於廢材部之外周緣側的區域。因此,在進行第1分割步驟而分割該區域的情況,對製品部無影響。又,例如,在廢材部的形狀是寬度從基板之外周緣朝向基板的內側變寬之形狀的情況,若先分割基板之外周緣側的該區域,在分割該區域後,分割廢材部之進深側的區域時,可使廢材部之進深側的區域大為變形。因此,在分割該區域後,可易於分割剩下的區域。This area is an area located on the outer peripheral side of the waste material part. Therefore, when the region is divided by performing the first division step, there is no influence on the product portion. Also, for example, when the shape of the waste material portion is a shape whose width widens from the outer periphery of the substrate toward the inside of the substrate, if the area on the outer peripheral edge side of the substrate is divided first, after the area is divided, the waste material portion is divided When it enters the area on the deep side, the area on the deep side of the waste material section can be greatly deformed. Therefore, after dividing the area, the remaining area can be easily divided.

又,這種分割係例如在廢材部為大面積的情況尤其有效。藉由在廢材部形成複數條副劃線,將廢材部分割成複數個,並從易分割之區域可局部地分割。In addition, such a division system is particularly effective when, for example, the waste material portion has a large area. By forming a plurality of sub-scribing lines in the waste material part, the waste material part is divided into a plurality of parts, and can be partially divided from the easily divided area.

在本形態之分割方法,該第2副劃線及該第3副劃線係能以從對該主劃線垂直之狀態傾斜的方式形成。In the dividing method of this aspect, the second sub-scribing line and the third sub-scribing line can be formed so as to be inclined from a state perpendicular to the main scribing line.

若依據本形態之分割方法,推壓廢材部時,廢材部以第1副劃線為中心彎曲。因此,垂直龜裂沿著第2副劃線及第3副劃線滲透及伸展。在此時,與對主劃線垂直之狀態的情況相比,在第2副劃線及第3副劃線從對該主劃線垂直之狀態傾斜的情況,沿著第2副劃線及第3副劃線所伸展的龜裂與主劃線更圓滑地連接。因此,在第2副及第3副劃線之垂直龜裂到達主劃線時,垂直龜裂沿著主劃線易滲透及伸展。因此,可易於且良好地分割廢材部。According to the division method of this form, when the waste material part is pushed, the waste material part bends with the first sub-line as the center. Therefore, the vertical crack penetrates and spreads along the second auxiliary scribe line and the third auxiliary scribe line. At this time, compared to the case where the main scribing line is perpendicular to the main scribing line, when the second subscribing line and the third subscribing line are inclined from the state perpendicular to the main scribing line, follow the second subscribing line and The crack extended by the third auxiliary scribe line is more smoothly connected with the main scribe line. Therefore, when the vertical cracks of the second and third auxiliary scribe lines reach the main scribe line, the vertical cracks are easy to penetrate and extend along the main scribe line. Therefore, the waste material part can be divided easily and well.

在本形態之分割方法,以朝向該主劃線之該第2副劃線及該第3副劃線之各自的端部與該主劃線分開僅既定距離的方式可形成該第2副劃線及該第3副劃線。In the dividing method of this form, the second sub-scribing line can be formed in such a way that the respective ends of the second sub-scribing line and the third sub-scribing line are separated from the main scribing line by a predetermined distance. Line and the third underline.

若依據本形態之分割方法,因為第2及第3副劃線的端部與主劃線分開僅既定距離,所以可防止朝向主劃線並沿著副劃線滲透並伸展的垂直龜裂超出主劃線而進入製品部內。因此,在分割廢材部時,可更確實地抑制製品部受損,而可提高製品部之品質。According to the division method of this form, because the ends of the second and third sub-scribing lines are separated from the main scribing line by only a predetermined distance, vertical cracks that penetrate and extend toward the main scribing line and extend along the sub-scribing line can be prevented from exceeding The main line is drawn into the product department. Therefore, when the waste material part is divided, damage to the product part can be suppressed more reliably, and the quality of the product part can be improved.

在本形態之分割方法,以朝向該主劃線之該第4副劃線的端部與該主劃線分開僅既定距離的方式形成該第4副劃線。In the dividing method of this form, the fourth sub-scribing line is formed such that the end of the fourth sub-scribing line facing the main scribing line is separated from the main scribing line by a predetermined distance.

若依據本形態之分割方法,因為第4副劃線的端部與主劃線分開僅既定距離,所以可防止朝向主劃線並沿著副劃線滲透並伸展的垂直龜裂超出主劃線而進入製品部內。因此,在分割廢材部時,可更確實地抑制製品部受損,而可提高製品部之品質。According to the division method of this form, because the end of the fourth sub-line is separated from the main line by a predetermined distance, vertical cracks that penetrate and extend toward the main line and extend along the sub-line can be prevented from exceeding the main line And enter the product department. Therefore, when the waste material part is divided, damage to the product part can be suppressed more reliably, and the quality of the product part can be improved.

在本形態之分割方法,該分割步驟係可包含第2分割步驟,該第2分割步驟係在該第1分割步驟之後,對在廢材部藉該第1分割步驟所分割之區域以外的區域,推壓形成該第1副劃線之該廢材部的面之至少2處而分割。In the dividing method of the present aspect, the dividing step may include a second dividing step, which is after the first dividing step, for areas other than the area divided by the first dividing step in the waste material section , Pressing at least two of the surface of the waste material portion forming the first sub-line to divide.

若依據本形態之分割方法,因為在第1分割步驟垂直龜裂沿著各劃線滲透及伸展,所以只要推壓剩下之區域的至少2處,可易於分割該區域。According to the division method of this form, since the vertical crack penetrates and spreads along each scribe line in the first division step, it is easy to divide the area by pushing at least two places of the remaining area.

本發明之第2形態係有關於一種沿著在基板所形成之劃線從基板分割廢材部的分割裝置。本形態之分割裝置係特徵為:具有:載置台,係載置該基板;治具,係使該廢材部向厚度方向彎曲;升降機構,係使該治具升降;以及移動機構,係使該治具向該基板之面內方向移動;該治具係包括:第1治具,係推壓該廢材部之一側的面;及第2治具,係推壓該廢材部之另一側的面;該第2治具係被配置於該第1治具的外側。The second aspect of the present invention relates to a dividing device that divides a waste material portion from a substrate along a scribe line formed on the substrate. The dividing device of this form is characterized in that it has: a placing table for placing the substrate; a jig for bending the waste material part in the thickness direction; an elevating mechanism for raising and lowering the jig; and a moving mechanism for making The jig moves in the direction of the surface of the substrate; the jig includes: a first jig that pushes the surface on one side of the waste material part; and a second jig that pushes the surface of the waste material part The other side surface; the second jig system is arranged on the outside of the first jig.

在本形態之分割裝置,亦可具有與本發明之第1形態相同的效果。 [發明之效果]The dividing device of this aspect can also have the same effect as the first aspect of the present invention. [Effects of Invention]

如以上所示,若依據本發明,可提供一種分割方法以及分割裝置,該分割方法係沿著在基板所形成之劃線可易於且良好地分割廢材部。As described above, according to the present invention, it is possible to provide a dividing method and a dividing device that can easily and well divide the waste material portion along the scribe line formed on the substrate.

本發明之效果及意義係根據以下所示之實施形態的說明將更明白。但,以下所示之實施形態係完全是實施本發明時之一個舉例表示,本發明係絲毫未被限制為以下之實施形態所記載者。The effects and significance of the present invention will be more apparent from the description of the embodiments shown below. However, the embodiment shown below is completely an example when implementing the present invention, and the present invention is not limited to what is described in the following embodiment at all.

以下,參照圖面,說明本發明之實施形態。此外,在各圖,係權宜上,附記彼此正交之X軸、Y軸以及Z軸。Z軸係表示在鉛垂方向之上方及下方。以後,上方及下方係分別意指Z軸正側及Z軸負側。 <實施形態1>Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing, the X-axis, Y-axis, and Z-axis that are orthogonal to each other are added as expedients. The Z-axis system indicates above and below the vertical direction. Hereinafter, upper and lower refer to the positive side of the Z axis and the negative side of the Z axis, respectively. <Embodiment 1>

圖1係表示分割基板10之分割方法的流程圖。FIG. 1 is a flowchart showing a dividing method of dividing the substrate 10.

應用本實施形態之分割方法的基板係具有是作為製品所需之部分的製品部、與是不要之部分的廢材部。在本分割方法,係使用治具從基板分離廢材部。The substrate to which the dividing method of this embodiment is applied has a product part which is a part required for the product and a waste material part which is an unnecessary part. In this dividing method, a jig is used to separate the waste material part from the substrate.

如圖1所示,基板10之分割係由劃線步驟(S11)與分割步驟(S12)所構成,而該劃線步驟係在基板10形成劃線,該分割步驟係分割廢材部30。As shown in FIG. 1, the division of the substrate 10 is composed of a scribing step (S11) and a dividing step (S12 ). The scribing step forms a scribing line on the substrate 10, and the dividing step divides the waste material portion 30.

以下,詳細地說明圖1所示之基板的分割方法。Hereinafter, the method of dividing the substrate shown in FIG. 1 will be described in detail.

圖2係在模式上表示劃線裝置100之構成的圖。劃線裝置100係包括移動台101與劃線頭120。移動台101係與滾珠螺桿102螺合。移動台101係藉一對導軌103被支撐成在Y軸方向可移動。藉馬達之驅動而滾珠螺桿102轉動,藉此,移動台101沿著一對導軌103在Y軸方向移動。FIG. 2 is a diagram schematically showing the structure of the scribing device 100. As shown in FIG. The scribing device 100 includes a mobile station 101 and a scribing head 120. The moving table 101 is screwed with the ball screw 102. The moving table 101 is supported by a pair of guide rails 103 so as to be movable in the Y-axis direction. Driven by the motor, the ball screw 102 rotates, whereby the moving table 101 moves along the pair of guide rails 103 in the Y-axis direction.

在移動台101的上面,係設置馬達104。馬達104係使位於上部之載置部105在XY平面轉動,並定位於既定角度。藉馬達104可水平轉動之載置部105係具有未圖示之真空吸附手段。在載置部105上所載置之基板10係藉該真空吸附手段,被固持於載置部105上。On the upper surface of the mobile station 101, a motor 104 is provided. The motor 104 rotates the placement part 105 located on the upper part in the XY plane and positions it at a predetermined angle. The placing portion 105 that can be rotated horizontally by the motor 104 has a vacuum suction means (not shown). The substrate 10 placed on the placing portion 105 is held on the placing portion 105 by the vacuum suction means.

劃線裝置100係在載置部105所載置之基板10的上方,具有2台相機106,該相機106係拍攝在此基板10所形成之對準記號。又,以跨移動台101與其上部之載置部105的方式將橋107架設於支柱108a、108b。The scribing device 100 is located above the substrate 10 placed on the placing portion 105 and has two cameras 106 that photograph the alignment marks formed on the substrate 10. In addition, the bridge 107 is erected on the pillars 108a and 108b so as to straddle the moving table 101 and the placing portion 105 above it.

在橋107,係安裝軌道109。軌道109與劃線頭120係經由移動部110被連接,藉由移動部110在軌道109滑動,劃線頭120係被設置成在X軸方向移動。At the bridge 107, a rail 109 is installed. The rail 109 and the scribing head 120 are connected via the moving part 110, and the moving part 110 slides on the rail 109, and the scribing head 120 is set to move in the X-axis direction.

在使用劃線裝置100在基板10形成劃線的情況,首先,將已安裝刀尖5之刀架單元130安裝於劃線頭120的支撐部121。In the case of using the scribing device 100 to form a scribing line on the substrate 10, first, the tool holder unit 130 to which the blade tip 5 has been mounted is mounted on the support portion 121 of the scribing head 120.

劃線裝置100係藉一對相機106進行基板10之定位。而且,劃線裝置100係使劃線頭120移至既定位置後,對刀尖5施加既定負載,使其對基板10接觸。然後,劃線裝置100係藉由使劃線頭120在X軸方向移動,而在基板10形成主劃線L(參照圖3(a))。The scribing device 100 uses a pair of cameras 106 to position the substrate 10. In addition, after the scribing device 100 moves the scribing head 120 to a predetermined position, a predetermined load is applied to the blade tip 5 to make it contact the substrate 10. Then, the scribing device 100 moves the scribing head 120 in the X-axis direction to form the main scribing line L on the substrate 10 (see FIG. 3(a)).

劃線裝置100係因應於需要,可使載置部105轉動或在Y軸方向移動。在基板10形成主劃線L時,劃線裝置100係使載置部105轉動,而在基板10形成副劃線S1(參照圖3(a))。The scribing device 100 can rotate or move the placing part 105 in the Y-axis direction according to needs. When the main scribing line L is formed on the substrate 10, the scribing device 100 rotates the mounting portion 105 to form the sub-scribing line S1 on the substrate 10 (see FIG. 3(a)).

在上述,係表示劃線頭120在X軸方向移動,載置部105在Y軸方向移動,且轉動之劃線裝置100,但是劃線裝置100係只要是劃線頭120與載置部105相對地移動者即可。例如,亦可是劃線頭120被固定、載置部105在X軸、Y軸方向移動,且轉動之劃線裝置100。又,在此情況,亦可相機106係被固定於劃線頭120。In the above, it means that the scribing head 120 moves in the X-axis direction, and the placement portion 105 moves in the Y-axis direction and rotates the scribing device 100. However, the scribing device 100 only needs to be the scribing head 120 and the placement portion 105. Just move the person relatively. For example, it may be the scribing device 100 in which the scribing head 120 is fixed, the mounting portion 105 is moved in the X-axis and Y-axis directions, and is rotated. Moreover, in this case, the camera 106 may be fixed to the scribing head 120.

圖3(a)係表示應用分割方法之基板10及分割裝置1的圖。圖3(a)係基板10及分割裝置1的上視圖。FIG. 3(a) is a diagram showing the substrate 10 and the dividing device 1 to which the dividing method is applied. FIG. 3(a) is a top view of the substrate 10 and the dividing device 1.

如圖3(a)所示,基板10係由製品部20及廢材部30所構成。權宜上,在圖3(a),係對製品部20附加斜線。根據該圖1所示之分割方法,廢材部30係從基板10被除去。As shown in FIG. 3( a ), the substrate 10 is composed of a product part 20 and a waste material part 30. Expediently, in FIG. 3(a), diagonal lines are added to the product part 20. According to the dividing method shown in FIG. 1, the waste material portion 30 is removed from the substrate 10.

廢材部30係具有從基板10之外周緣朝向基板10之內側凹下之凹狀的輪廓形狀,在一部分包含曲線部。圖3(a)所示之廢材部30的輪廓形狀係包含基板10之外周緣中之一個端緣的梯形。在圖3(a),係在基板10之外周緣中,將廢材部30的輪廓形狀所含之部分的端緣當作端緣10a。The waste material portion 30 has a concave contour shape that is recessed from the outer periphery of the substrate 10 toward the inner side of the substrate 10, and includes a curved portion in a part. The outline shape of the waste material part 30 shown in FIG. In FIG. 3(a), in the outer periphery of the substrate 10, the end edge of the part included in the contour shape of the waste material portion 30 is regarded as the end edge 10a.

廢材部30的輪廓形狀所含之Y軸正側之2處的角部34係曲線狀。在圖3(a)所示的廢材部30之角部34的角度α是約102°。藉圖2所示之劃線裝置100,沿著廢材部30的輪廓形狀形成主劃線L。The two corners 34 on the positive side of the Y axis included in the contour shape of the waste material portion 30 are curved. The angle α of the corner portion 34 of the waste material portion 30 shown in FIG. 3(a) is about 102°. With the scribing device 100 shown in FIG. 2, a main scribing line L is formed along the outline shape of the waste material portion 30.

在廢材部30係形成副劃線S1。副劃線S1係在與主劃線L交叉的方向延伸,並被形成於廢材部30之寬度方向(在圖3(a)為X軸方向)的中央附近。在本實施形態,副劃線S1係被形成於在寬度方向將廢材部30二等分的直線上。A sub-scribing line S1 is formed in the waste material part 30. The auxiliary scribing line S1 extends in a direction intersecting the main scribing line L, and is formed near the center of the waste material portion 30 in the width direction (the X-axis direction in FIG. 3(a)). In the present embodiment, the auxiliary scribing line S1 is formed on a straight line that bisects the waste material portion 30 in the width direction.

在此時,副劃線S1係以和主劃線L中與端緣10a相向的直線部L1不連接的方式所形成。即,副劃線S1係以從端緣10a朝向廢材部30之內側延伸,並與直線部L1僅相距距離d的方式被形成於廢材部30。At this time, the auxiliary scribing line S1 is formed so as not to be connected to the linear portion L1 of the main scribing line L facing the end edge 10a. That is, the secondary scribing line S1 is formed in the waste material part 30 so that it may extend toward the inside of the waste material part 30 from the edge 10a, and is only a distance d from the linear part L1.

距離d係根據基板10之種類、厚度、尺寸等適當地被調整。例如,在基板10的厚度為0.4mm的情況,距離d係被設定成約5mm。The distance d is appropriately adjusted according to the type, thickness, size, etc. of the substrate 10. For example, when the thickness of the substrate 10 is 0.4 mm, the distance d is set to about 5 mm.

如圖3(a)所示,分割裝置1係包括載置台2、移動機構3以及治具40。載置台2係載置基板10。移動機構3係使治具40對基板10升降,且使其至少向Y軸方向移動。亦可分開地設置使治具40對基板10升降的升降機構與對基板向X軸、Y軸方向移動的移動機構。治具40係使廢材部30在厚度方向彎曲並從廢材部30分割。但,移動機構3係在圖3(a)未被圖示,而在圖3(b)被圖示。As shown in FIG. 3(a), the dividing device 1 includes a mounting table 2, a moving mechanism 3, and a jig 40. The mounting table 2 mounts the substrate 10. The moving mechanism 3 raises and lowers the jig 40 with respect to the substrate 10 and moves it at least in the Y-axis direction. It is also possible to separately provide an elevating mechanism for raising and lowering the jig 40 to the substrate 10 and a moving mechanism for moving the substrate in the X-axis and Y-axis directions. The jig 40 is divided from the waste material part 30 by bending the waste material part 30 in the thickness direction. However, the moving mechanism 3 is not shown in FIG. 3(a), but is shown in FIG. 3(b).

在圖3(a),在廢材部30內所示之白圓圈及黑圓圈係在模式上表示治具40(參照圖3(b))所抵接的位置。以黑圓圈所示之位置31、32及以白圓圈圖所示之位置33係接近端緣10a,且,沿著端緣10a排列。位置33係基板10的下面11,且位於副劃線S1的正下。在基板10,治具40與下面11之位置31抵接。在基板10,治具40與上面12之位置31、32抵接。In FIG. 3(a), the white circles and black circles shown in the waste material portion 30 schematically indicate the positions where the jig 40 (see FIG. 3(b)) abuts. The positions 31 and 32 shown by the black circles and the position 33 shown by the white circles are close to the end edge 10a, and are arranged along the end edge 10a. The position 33 is the lower surface 11 of the substrate 10 and is located directly below the sub-scribing line S1. On the base plate 10, the jig 40 abuts against the position 31 of the lower surface 11. On the substrate 10, the jig 40 abuts on the positions 31 and 32 of the upper surface 12.

圖3(b)係從X軸負側觀察圖3(a)之構成的側視圖。但,移動機構3係以虛線表示。Fig. 3(b) is a side view of the structure of Fig. 3(a) viewed from the negative side of the X-axis. However, the moving mechanism 3 is shown by a broken line.

如圖3(b)所示,在從基板10分割廢材部30時,以包含廢材部30之基板10之端的區域從分割裝置1之載置台2超出的方式將基板10載置於載置台2。將基板10載置於載置台2時,藉由移動機構3使治具40升降,治具40係與廢材部30抵接。As shown in FIG. 3(b), when the waste material portion 30 is divided from the substrate 10, the substrate 10 is placed on the mount so that the area at the end of the substrate 10 including the waste material portion 30 protrudes from the mounting table 2 of the dividing device 1置台2. When the substrate 10 is placed on the mounting table 2, the jig 40 is raised and lowered by the moving mechanism 3, and the jig 40 abuts against the waste material portion 30.

治具40係由第1治具41與第2治具42所構成,並藉移動機構3,第1治具41及第2治具42之各個升降。移動機構3係由例如氣壓缸之周知的升降手段所構成。在此情況,藉由對氣壓缸適當地賦與壓力,可使第1治具41及第2治具42之各個朝向廢材部30升降。The jig 40 is composed of a first jig 41 and a second jig 42, and is raised and lowered by the moving mechanism 3, the first jig 41 and the second jig 42. The moving mechanism 3 is constituted by a well-known lifting means such as a pneumatic cylinder. In this case, by appropriately applying pressure to the pneumatic cylinder, each of the first jig 41 and the second jig 42 can be raised and lowered toward the waste material portion 30.

又,在基板10之分割當中,為了抑制基板10在載置台2移動或製品部20過度的變形,如圖3(b)所示,以壓住構件4壓住基板10的上面12。壓住構件4係例如被配置於載置台2之端部附近,並是被設置成至少與基板10之接近廢材部30的表面抵接之構件。或者,亦可對載置台2,例如設置用以對基板10賦與壓力的壓力調整部。在此情況,藉由對壓力調整部適當地賦與壓力,因為可將基板10吸附於載置台2,所以可省略壓住構件4。In order to prevent the substrate 10 from moving on the mounting table 2 or excessive deformation of the product part 20 during the division of the substrate 10, as shown in FIG. 3(b), the upper surface 12 of the substrate 10 is pressed by the pressing member 4. The pressing member 4 is, for example, a member that is arranged near the end of the mounting table 2 and is provided so as to abut at least the surface of the substrate 10 close to the waste material portion 30. Alternatively, the mounting table 2 may be provided with a pressure adjusting part for applying pressure to the substrate 10, for example. In this case, by appropriately applying pressure to the pressure adjusting portion, since the substrate 10 can be adsorbed to the mounting table 2, the pressing member 4 can be omitted.

亦可基板10係例如是玻璃基板、低溫燒成陶瓷或高溫燒成陶瓷等之陶瓷基板、矽基板、化合物半導體基板、藍寶石基板、石英基板等。又,亦可基板10係使不屬於脆性材料之薄膜或半導體材料附著或包含於表面或內部。在本實施形態,係對玻璃基板應用分割方法。The substrate 10 may be, for example, a ceramic substrate such as a glass substrate, a low-temperature fired ceramic or a high-temperature fired ceramic, a silicon substrate, a compound semiconductor substrate, a sapphire substrate, a quartz substrate, and the like. In addition, the substrate 10 may have a thin film or semiconductor material that is not a brittle material attached to or contained on the surface or inside. In this embodiment, the dividing method is applied to the glass substrate.

此外,亦可基板10係由2片基板黏貼而成的黏貼基板。作為這種基板10,例如列舉在一方之基板形成彩色濾光片(CF),並在另一方之基板形成薄膜電晶體(TFT)。In addition, the substrate 10 may be an adhesive substrate formed by pasting two substrates. As such a substrate 10, for example, a color filter (CF) is formed on one substrate, and a thin film transistor (TFT) is formed on the other substrate.

如上述所示,治具40係由第1治具41及第2治具42所構成。如圖3(b)所示,第1治具41及第2治具42係分別被配置成隔著基板10相對向。以後,在本專利說明書,係將第1治具稱為「上治具」,並將第2治具稱為「下治具42」。As described above, the jig 40 is composed of the first jig 41 and the second jig 42. As shown in FIG. 3(b), the first jig 41 and the second jig 42 are respectively arranged so as to face each other with the substrate 10 interposed therebetween. Hereafter, in this patent specification, the first jig will be referred to as the "upper jig", and the second jig will be referred to as the "lower jig 42".

上治具41及下治具42係亦可構成為一體,亦可是分開。在上治具41,係設置與位置31、32抵接的突部41a、41b。此外,在圖3(b),係只圖示突部41a。在下治具42,係設置與位置33抵接的突部42a。突部41a、41b與突部42a係在X-Y平面上被配置成彼此隔著既定間隔。The upper jig 41 and the lower jig 42 can also be integrated or separated. The upper jig 41 is provided with protrusions 41a and 41b that abut the positions 31 and 32. In addition, in FIG. 3(b), only the protrusion 41a is shown. The lower jig 42 is provided with a protrusion 42a that abuts on the position 33. The protrusions 41a, 41b and the protrusion 42a are arranged on the X-Y plane with a predetermined interval therebetween.

上治具41之突部41a、41b及下治具42之突部42a的形狀與尺寸係因應於廢材部30的厚度、形狀以及尺寸,適當地被調整成使廢材部30彎曲並從基板10可分割廢材部30。又,在廢材部30之上治具41的突部41a、41b及下治具42的突部42a之各個所抵接的位置亦因應於廢材部30的厚度、形狀以及尺寸,以使垂直龜裂伸展並從基板10可分割廢材部30的方式選擇適當的位置。The shape and size of the protrusions 41a, 41b of the upper jig 41 and the protrusion 42a of the lower jig 42 are adapted to the thickness, shape, and size of the waste material portion 30, and are appropriately adjusted so that the waste material portion 30 is bent and removed from The substrate 10 can be divided into the waste material part 30. In addition, the position where each of the protrusions 41a, 41b of the upper jig 41 and the protrusion 42a of the lower jig 42 abut on the waste material part 30 also depends on the thickness, shape, and size of the waste material part 30, so that The vertical cracks extend and an appropriate position is selected from the manner in which the substrate 10 can divide the waste material portion 30.

在根據圖1所示之分割方法分割基板10的情況,移動機構3使上治具41及下治具42分別在圖3(b)之箭號的方向移動並夾住廢材部30。然後,移動機構3使上治具41及下治具42進一步移動,藉由使上治具41及下治具42對廢材部30賦與推壓力,而沿著主劃線L,即廢材部30的輪廓形狀,從基板10分割廢材部30。In the case of dividing the substrate 10 according to the dividing method shown in FIG. 1, the moving mechanism 3 moves the upper jig 41 and the lower jig 42 in the direction of the arrow in FIG. 3( b) and clamps the waste material portion 30. Then, the moving mechanism 3 moves the upper jig 41 and the lower jig 42 further, and by making the upper jig 41 and the lower jig 42 apply a pressing force to the waste material portion 30, it follows the main scribe line L, that is, waste The contour shape of the material portion 30 divides the waste material portion 30 from the substrate 10.

其次,參照圖4(a)~(c),詳細地說明圖1所示之分割方法的步驟中的分割步驟(S12)。Next, referring to FIGS. 4(a) to (c), the dividing step (S12) among the steps of the dividing method shown in FIG. 1 will be described in detail.

圖4(a)~(c)係在模式上表示基板10之分割方法之過程的圖。圖4(a)~(c)係從Y軸負側觀察在圖3(a)所示的廢材部30之在Y軸方向的位置31~33在與X-Z平面平行的平面剖開移動機構3、基板10以及治具40的情況之剖面的情況之剖面圖。權宜上,在圖4(a)~(c),只對基板10,附加表示剖面的斜線。又,在圖4(a)、(b),係為了便於說明,虛擬地圖示垂直龜裂C、C1。又,在圖4(a)~(c),係省略載置台2及壓住構件4的圖示。4(a) to (c) are diagrams schematically showing the process of the method of dividing the substrate 10. Figures 4 (a) ~ (c) are viewed from the negative side of the Y axis at positions 31 to 33 in the Y axis direction of the waste material portion 30 shown in Figure 3 (a), which are sectioned on a plane parallel to the X-Z plane A cross-sectional view of the case of the moving mechanism 3, the substrate 10, and the jig 40. Expediently, in Fig. 4(a)~(c), only the substrate 10 is attached with oblique lines indicating the cross section. In addition, in FIGS. 4(a) and (b), for convenience of explanation, the vertical cracks C and C1 are virtually illustrated. In addition, in FIGS. 4(a) to (c), illustration of the mounting table 2 and the pressing member 4 is omitted.

圖4(a)係表示分割廢材部30之前的狀態。基板10係以在基板10包含廢材部30之區域從載置台2超出的方式被載置於載置台2。基板10的上面12係被壓住構件4壓住。上治具41係被配置於圖3(a)之位置31、32的正上。下治具42係被配置於圖3(a)之位置33的正下。即,下治具42係被配置於副劃線S1的正下。FIG. 4(a) shows a state before the waste material part 30 is divided. The substrate 10 is placed on the mounting table 2 so as to protrude from the mounting table 2 in an area of the substrate 10 including the waste material portion 30. The upper surface 12 of the substrate 10 is pressed by the pressing member 4. The upper jig 41 is arranged directly above the positions 31 and 32 in Fig. 3(a). The lower jig 42 is arranged directly below the position 33 in Fig. 3(a). That is, the lower jig 42 is arranged directly under the sub-scribing line S1.

此外,上治具41之突部41a、41b的間隔係根據基板10之種類、厚度以及尺寸等,適當地被調整。In addition, the interval between the protrusions 41a and 41b of the upper jig 41 is appropriately adjusted according to the type, thickness, size, and the like of the substrate 10.

又,如上述所示,基板10是玻璃基板,並在基板10的上面12形成圖3(a)所示之主劃線L。沿著主劃線L形成垂直龜裂C。從Y軸負側觀察圖3(a)之基板10的情況之模式圖是圖4(a)。In addition, as described above, the substrate 10 is a glass substrate, and the main scribe line L shown in FIG. 3(a) is formed on the upper surface 12 of the substrate 10. A vertical crack C is formed along the main scribe line L. A schematic diagram of the case where the substrate 10 of FIG. 3(a) is viewed from the negative side of the Y axis is FIG. 4(a).

如圖4(b)所示,移動機構3使上治具41向下方向移動,而從上方推壓廢材部30,且移動機構3使下治具42向上方向移動,而從下方推壓廢材部30。即,廢材部30係藉三點折彎而彎曲。藉此,沿著副劃線S1所形成的垂直龜裂C1及沿著主劃線L所形成之垂直龜裂C在基板10之厚度方向滲透並伸展。在此狀態,使治具40向開口側移動,而從基材分離廢材部30。此外,關於此垂直龜裂C、C1之滲透及伸展,係在後面參照圖5(a)、(b)來說明。As shown in FIG. 4(b), the moving mechanism 3 moves the upper jig 41 downward and pushes the waste material portion 30 from above, and the moving mechanism 3 moves the lower jig 42 upward and pushes it from below Waste material department 30. That is, the waste material part 30 is bent by three-point bending. Thereby, the vertical crack C1 formed along the auxiliary scribing line S1 and the vertical crack C formed along the main scribing line L penetrate and extend in the thickness direction of the substrate 10. In this state, the jig 40 is moved to the opening side, and the waste material portion 30 is separated from the base material. In addition, the penetration and extension of the vertical cracks C and C1 will be described later with reference to Figs. 5(a) and (b).

依此方式,在主劃線L及副劃線S1,垂直龜裂C、C1分別滲透並伸展時,如圖4(c)所示,廢材部30係從基板10被分割。在此時,從基板10所分割之廢材部30係以副劃線S1(垂直龜裂C1)為邊界,被分割成2個區域。In this way, when the vertical cracks C and C1 penetrate and expand on the main scribing line L and the auxiliary scribing line S1, respectively, as shown in FIG. 4(c), the waste material portion 30 is divided from the substrate 10. At this time, the waste material portion 30 divided from the substrate 10 is divided into two regions with the sub-scribing line S1 (vertical crack C1) as the boundary.

其次,參照圖5(a)、(b),說明藉在該圖4(a)~(c)所示並說明之分割步驟(S12)之垂直龜裂C、C1的伸展。Next, referring to Figs. 5(a) and (b), the extension of the vertical cracks C and C1 in the dividing step (S12) shown and described in Figs. 4(a) to (c) will be described.

圖5(a)係用以說明在分割基板10時,垂直龜裂C、C1沿著主劃線L及副劃線S1之各個滲透並伸展的模式圖。FIG. 5(a) is a schematic diagram for explaining that when the substrate 10 is divided, the vertical cracks C and C1 penetrate and extend along each of the main scribing line L and the sub-scribing line S1.

如圖4(b)所示,在以上治具41及下治具42推壓廢材部30時,以下治具42推壓位置33。位置33係如上述所示,位於副劃線S1之正下。因此,廢材部30係以副劃線S1為中心易彎曲,而在基板10之厚度方向產生變形。As shown in FIG. 4( b ), when the upper jig 41 and the lower jig 42 push the waste material portion 30, the lower jig 42 pushes the position 33. The position 33 is as shown above, and is located directly below the underline S1. Therefore, the waste material portion 30 is easily bent with the sub-scribing line S1 as the center, and deforms in the thickness direction of the substrate 10.

在此時,如圖5(a)所示,在副劃線S1所形成的垂直龜裂C1係以位置33為起點在基板10之厚度方向滲透,並在沿著副劃線S1往主劃線L之方向E1伸展。At this time, as shown in FIG. 5(a), the vertical crack C1 formed on the secondary scribing line S1 penetrates in the thickness direction of the substrate 10 starting from the position 33, and moves toward the main scribing along the secondary scribing line S1. The direction E1 of the line L stretches.

沿著副劃線S1在方向E1伸展的垂直龜裂C1到達主劃線L之直線部L1的位置G1時,與主劃線L之垂直龜裂C連接,而從位置G1在直線部L1所形成的垂直龜裂C在方向E2、E3滲透並伸展。When the vertical crack C1 extending along the sub-scribing line S1 in the direction E1 reaches the position G1 of the straight line portion L1 of the main scribing line L, it is connected to the vertical crack C of the main scribing line L, and from the position G1 at the straight line portion L1 The formed vertical crack C penetrates and spreads in the directions E2 and E3.

此外,副劃線S1與直線部L1係分開僅距離d,但是垂直龜裂C1係沿著副劃線S1之延長線上伸展至直線部L1。In addition, the secondary scribing line S1 is separated from the linear portion L1 by a distance d, but the vertical crack C1 extends along the extension line of the secondary scribing line S1 to the linear portion L1.

另一方面,廢材部30因彎曲而產生變形時,在主劃線L,因外力而垂直龜裂C從垂直龜裂C最易滲透的端部LA、LB在基板10之厚度方向滲透。而且,在從主劃線L之端部LA、LB往內側的方向F1、F2,垂直龜裂C沿著主劃線L依序滲透並伸展。On the other hand, when the waste material portion 30 is deformed due to bending, at the main scribing line L, the vertical crack C due to external force penetrates in the thickness direction of the substrate 10 from the end portions LA and LB where the vertical crack C is most permeable. In addition, in directions F1 and F2 from the ends LA and LB of the main scribing line L to the inside, the vertical crack C penetrates and spreads along the main scribing line L in order.

在主劃線L,垂直龜裂C在方向F1、F2伸展時,在主劃線L之中間位置的附近,即,是副劃線S1之延長線與直線部L1之交點的位置G1附近,在方向F1、F2伸展之垂直龜裂C與從方向E2、E3所伸展出來之垂直龜裂C1的伸展連接。依此方式,垂直龜裂C在主劃線L之全部範圍滲透。在此狀態,藉由使治具40向開口端側移動,從基板10除去廢材部30。On the main scribing line L, when the vertical crack C extends in the directions F1 and F2, it is near the middle position of the main scribing line L, that is, near the position G1 that is the intersection of the extension line of the sub-scribing line S1 and the straight portion L1, The vertical crack C extending in the directions F1 and F2 is connected with the vertical crack C1 extending in the directions E2 and E3. In this way, the vertical crack C penetrates the entire range of the main scribe line L. In this state, by moving the jig 40 to the opening end side, the waste material portion 30 is removed from the substrate 10.

圖5(b)係在模式上表示垂直龜裂C、C1在基板10之厚度方向滲透之狀況的剖面圖。圖5(b)係從Y軸負側觀察在圖5(a)之在Y軸方向的位置33在與X-Z平面平行的平面剖開基板10及治具40的情況之剖面的情況之剖面圖。權宜上,在圖5(b),只對基板10,附加表示剖面的斜線。FIG. 5(b) is a cross-sectional view schematically showing the penetration of vertical cracks C and C1 in the thickness direction of the substrate 10. Fig. 5(b) is viewed from the negative side of the Y-axis at the position 33 in the Y-axis direction of Fig. 5(a) when the substrate 10 and the jig 40 are cut in a plane parallel to the X-Z plane. Sectional view. Expediently, in FIG. 5(b), only the substrate 10 is attached with oblique lines showing the cross section.

如圖5(b)之上段所示,在以上治具41及下治具42推壓廢材部30而使廢材部30彎曲之前,垂直龜裂C、C1係在基板10之厚度方向滲透至同程度之深度。As shown in the upper part of Figure 5(b), before the upper jig 41 and the lower jig 42 push the waste material portion 30 to bend the waste material portion 30, vertical cracks C and C1 penetrate in the thickness direction of the substrate 10 To the same depth.

如圖5(b)之下段所示,副劃線S1係被下治具42推壓,位置31、32係被上治具41推壓,藉此,廢材部30彎曲,因此,垂直龜裂C1係在基板之厚度方向滲透。As shown in the lower part of Figure 5(b), the sub-line S1 is pushed by the lower jig 42, and the positions 31 and 32 are pushed by the upper jig 41. As a result, the waste material portion 30 is bent, so that the vertical tortoise The crack C1 penetrates in the thickness direction of the substrate.

另一方面,關於沿著主劃線L所形成的垂直龜裂C,亦因廢材部30彎曲,垂直龜裂C在基板10之厚度方向滲透。此處,主劃線L係未被治具40(上治具41)推壓,但是因廢材部30彎曲而其中央向上方向位移,藉此,在廢材部30的周緣係產生往廢材部之內側方向的位移。在圖5(b),係以箭號表示基板之位移。因此,垂直龜裂C在基板10之厚度方向滲透。On the other hand, regarding the vertical crack C formed along the main scribing line L, the vertical crack C penetrates in the thickness direction of the substrate 10 because the waste material portion 30 is bent. Here, the main scribing line L is not pressed by the jig 40 (upper jig 41), but the center of the waste material portion 30 is bent upward, thereby causing waste to be generated on the periphery of the waste material portion 30 Displacement in the inner direction of the material part. In Figure 5(b), the displacement of the substrate is indicated by arrows. Therefore, the vertical crack C penetrates in the thickness direction of the substrate 10.

如圖5(a)、5(b)所示,垂直龜裂C、C1沿著副劃線S1及主劃線L滲透並伸展時,以副劃線S1為中心,廢材部30在寬度方向(X軸方向)被分割成2個區域。As shown in Figures 5(a) and 5(b), when the vertical cracks C and C1 penetrate and extend along the auxiliary scribing line S1 and the main scribing line L, with the auxiliary scribing line S1 as the center, the waste material portion 30 is in the width The direction (X-axis direction) is divided into two areas.

此外,在本實施形態,係利用上治具41之對廢材部30的推壓,廢材部30之X軸方向的兩端向下方向且內側位移。因此,如圖5(a)所示,在從主劃線L之端部LA、LB往內側的方向F1、F2,垂直龜裂C1、C2沿著主劃線L在相同之狀態逐漸地伸展。因此,在主劃線L的全周,可使垂直龜裂C1、C2圓滑地伸展,而可圓滑地分割廢材部30。 <實施形態1之效果>In addition, in this embodiment, by pressing the waste material portion 30 by the upper jig 41, both ends of the waste material portion 30 in the X-axis direction are displaced downward and inward. Therefore, as shown in Figure 5(a), in the directions F1 and F2 from the ends LA and LB of the main scribe line L to the inside, the vertical cracks C1 and C2 gradually extend in the same state along the main scribe line L . Therefore, the vertical cracks C1 and C2 can be smoothly extended over the entire circumference of the main scribe line L, and the waste material portion 30 can be smoothly divided. <Effects of Embodiment 1>

如圖1、圖3(a)~圖5(b)所示,副劃線S1係以在與主劃線L交叉之方向延伸,並在寬度方向將廢材部30劃分成2個區域的方式被形成於廢材部30。使廢材部30彎曲時,首先,沿著副劃線S1,垂直龜裂C1在基板10之厚度方向滲透,並沿著副劃線S1伸展。此伸展向主劃線L進展時,沿著主劃線L,垂直龜裂C在基板10之厚度方向滲透,並沿著主劃線L伸展。As shown in Figure 1, Figure 3 (a) ~ Figure 5 (b), the sub-scribing line S1 extends in the direction intersecting the main scribing line L, and divides the waste material portion 30 into two areas in the width direction The pattern is formed in the waste material part 30. When the waste material portion 30 is bent, first, along the secondary scribing line S1, the vertical crack C1 penetrates in the thickness direction of the substrate 10 and extends along the secondary scribing line S1. When this stretching progresses to the main scribing line L, along the main scribing line L, the vertical crack C penetrates in the thickness direction of the substrate 10 and extends along the main scribing line L.

因此,因為廢材部30係以副劃線S1為中心被分割成2個區域,並從基板10被分割,且在主劃線L的全周,垂直龜裂C滲透並伸展,所以可抑制在分割後之製品部20的端面所產生的碎片或扭歪。因此,從基板10可易於且良好地分割廢材部30。Therefore, because the waste material portion 30 is divided into two regions centered on the sub-scribing line S1 and divided from the substrate 10, and the vertical crack C penetrates and spreads over the entire circumference of the main scribing line L, so that it can be suppressed Fragments or distortions generated on the end surface of the divided product portion 20. Therefore, the waste material portion 30 can be easily and well divided from the substrate 10.

如圖1、圖3(a)~圖5(b)所示,廢材部30係藉下治具42推壓副劃線S1。因此,垂直龜裂C1沿著副劃線S1良好地滲透並伸展。As shown in Figs. 1 and 3(a) to 5(b), the waste material part 30 is pressed by the lower jig 42 against the sub-scribing line S1. Therefore, the vertical crack C1 penetrates and spreads well along the sub-scribing line S1.

又,藉由利用上治具41推壓隔著副劃線S1之位置31、32,因為對廢材部30在相同之方向賦與力,所以在主劃線L之全周垂直龜裂C圓滑且均勻地滲透並伸展。因此,從廢材部30可易於且良好地分割在廢材部30藉副劃線S1所劃分的區域。In addition, by using the upper jig 41 to push the positions 31 and 32 across the sub-scribing line S1, the waste material portion 30 is given force in the same direction, so vertical cracks C are formed on the entire circumference of the main scribing line L Smoothly and evenly penetrates and stretches. Therefore, the waste material part 30 can be easily and well divided into the area demarcated by the subscribed line S1 of the waste material part 30.

如圖3(a)、圖5(a)所示,廢材部30的輪廓形狀係從基板10之端緣10a往基板10之內側的凹狀,並包含直線部與曲線狀的角部34。As shown in Figures 3(a) and 5(a), the contour shape of the waste material portion 30 is a concave shape from the edge 10a of the substrate 10 to the inside of the substrate 10, and includes straight portions and curved corner portions 34 .

因為是如上述所示的形狀,所以在廢材部30未設置副劃線S1之狀態使廢材部30彎曲的情況,因為角部34係彎曲所造成之位移比廢材部30之內側少,所以在角部34之附近易發生碎片或扭歪。關於這一點,在本實施形態,係以在寬度方向劃分廢材部30之方式形成副劃線S1。因此,以治具40推壓廢材部30之位置31~33時,垂直龜裂C1沿著副劃線S1滲透並伸展。此垂直龜裂C1之伸展與主劃線L連接,而垂直龜裂C在主劃線L之全周滲透並伸展。Because of the shape shown above, when the waste material part 30 is not provided with the auxiliary scribing line S1 and the waste material part 30 is bent, the displacement caused by the bending of the corner part 34 is less than the inner side of the waste material part 30 , So chipping or distortion is likely to occur near the corner 34. In this regard, in the present embodiment, the sub-scribing line S1 is formed so as to divide the waste material portion 30 in the width direction. Therefore, when the positions 31 to 33 of the waste material portion 30 are pressed by the jig 40, the vertical crack C1 penetrates and extends along the secondary scribe line S1. The extension of this vertical crack C1 is connected to the main scribe line L, and the vertical crack C penetrates and extends throughout the main scribe line L.

因此,在角部34,亦垂直龜裂C在基板10之厚度方向充分地滲透並伸展。因此,包含角部34在內,沿著主劃線L可易於且良好地分割廢材部30。Therefore, at the corner portion 34, the vertical crack C sufficiently penetrates and spreads in the thickness direction of the substrate 10. Therefore, including the corner portion 34, the waste material portion 30 can be easily and well divided along the main scribe line L.

如圖3(a)、圖5(a)所示,朝向主劃線L,以副劃線S1之端部與主劃線L分開僅距離d的方式形成副劃線S1。因此,從副劃線S1所伸展出來之垂直龜裂C1不會超出直線部L1而進入製品部20內。因此,在分割廢材部30時,更確實地抑制製品部20之受損。As shown in FIGS. 3(a) and 5(a), toward the main scribing line L, the auxiliary scribing line S1 is formed such that the end of the auxiliary scribing line S1 is separated from the main scribing line L by only a distance d. Therefore, the vertical crack C1 extending from the sub-scribing line S1 does not go beyond the linear portion L1 and enter the product portion 20. Therefore, when the waste material part 30 is divided, the damage of the product part 20 is suppressed more reliably.

如圖3(a)、圖5(a)所示,副劃線S1係在寬度方向的中央附近形成廢材部30。As shown in FIG. 3(a) and FIG. 5(a), the auxiliary scribing line S1 forms the waste material portion 30 near the center in the width direction.

若依據上述的構成,在以治具40推壓位置31~33而使廢材部30彎曲時(參照圖4(a)~(c)),以副劃線S1為中心兩側之區域大致同等地彎曲。因此,在基板10之厚度方向產生變形之力在主劃線L之全周大致均勻地作用。因此,沿著副劃線S1及主劃線L可更圓滑且良好地分割廢材部30。 <實施形態2>According to the above-mentioned structure, when the waste material portion 30 is bent by pressing the positions 31 to 33 by the jig 40 (refer to Figure 4 (a) to (c)), the area on both sides of the center with the subscribed line S1 is roughly Bend equally. Therefore, the force generating deformation in the thickness direction of the substrate 10 acts substantially uniformly over the entire circumference of the main scribe line L. Therefore, the waste material portion 30 can be divided more smoothly and well along the sub-scribing line S1 and the main scribing line L. <Embodiment 2>

在該實施形態1,廢材部30的輪廓形狀係包含基板10的端緣10a,並是基板10之梯形。在實施形態2,廢材部30的輪廓形狀是長方形。In the first embodiment, the contour shape of the waste material portion 30 includes the edge 10 a of the substrate 10 and is a trapezoid of the substrate 10. In Embodiment 2, the outline shape of the waste material part 30 is rectangular.

圖6係表示實施形態2之廢材部30的輪廓形狀的模式圖。FIG. 6 is a schematic diagram showing the outline shape of the waste material portion 30 in the second embodiment.

如圖6所示,實施形態2之廢材部30的形狀係角部34之角度α為約90°的長方形。副劃線S1係與該實施形態1一樣,以朝向主劃線L之副劃線S1的端部與主劃線L分開僅距離d的方式所形成。又,副劃線S1係被形成於廢材部30之中央附近,具體而言,在寬度方向將廢材部30二等分的直線上。As shown in FIG. 6, the shape of the waste material portion 30 of the second embodiment is a rectangle with the angle α of the corner portion 34 being approximately 90°. The auxiliary scribing line S1 is formed in such a manner that the end of the auxiliary scribing line S1 facing the main scribing line L is separated from the main scribing line L by a distance d, as in the first embodiment. In addition, the sub-scribing line S1 is formed near the center of the waste material portion 30, specifically, on a straight line that bisects the waste material portion 30 in the width direction.

在如圖6所示之廢材部30的情況,亦按照與實施形態1相同的程序(圖1之S11、S12),可分割廢材部30。 <變形例1>In the case of the waste material part 30 shown in FIG. 6, the waste material part 30 can be divided according to the same procedure as in the first embodiment (S11 and S12 in FIG. 1). <Modification 1>

在上述之實施形態1、2,在廢材部30,基板10之端緣10a的寬度係被形成為與主劃線L之直線部L1的寬度同程度或比較大,角部34之角度α是90°以上。在變形例1,係說明廢材部30,該廢材部30係端緣10a的寬度被形成為比直線部L1的寬度更窄,角部34之角度α是銳角。In the first and second embodiments described above, in the waste material portion 30, the width of the end edge 10a of the substrate 10 is formed to be the same as or larger than the width of the linear portion L1 of the main scribe line L, and the angle α of the corner portion 34 It is above 90°. In Modification 1, the waste material portion 30 is described. The width of the end edge 10a of the waste material portion 30 is formed to be narrower than the width of the linear portion L1, and the angle α of the corner portion 34 is an acute angle.

圖7(a)係表示應用變形例1的分割方法之在基板10之廢材部30的輪廓形狀及在廢材部30所形成之副劃線S1~S4的模式圖。FIG. 7(a) is a schematic diagram showing the outline shape of the waste material portion 30 on the substrate 10 and the sub-scribing lines S1 to S4 formed on the waste material portion 30 to which the dividing method of Modification 1 is applied.

如圖7(a)所示,廢材部30係角部34之角度α是銳角。又,主劃線L中與端緣10a相對向地配置之直線部L1的寬度係比基板10之端緣10a的寬度更寬。在這種形狀的廢材部30,形成4條副劃線S1~S4。As shown in FIG. 7(a), the angle α of the corner portion 34 of the waste material portion 30 is an acute angle. In addition, the width of the straight portion L1 arranged opposite to the end edge 10a in the main scribing line L is wider than the width of the end edge 10a of the substrate 10. In the waste material portion 30 of this shape, four sub-scribing lines S1 to S4 are formed.

副劃線S1係與上述之實施形態1、2一樣,以朝向主劃線L之副劃線S1的端部與主劃線L分開僅距離d1的方式所形成。又,副劃線S1係被形成於廢材部30之中央附近,具體而言,在寬度方向將廢材部30二等分的直線上。The sub-scribing line S1 is formed in such a manner that the end of the sub-scribing line S1 facing the main scribing line L is separated from the main scribing line L by a distance d1, as in the above-mentioned first and second embodiments. In addition, the sub-scribing line S1 is formed near the center of the waste material portion 30, specifically, on a straight line that bisects the waste material portion 30 in the width direction.

副劃線S2、S3係被配置於隔著副劃線S1對稱的位置,並以從對主劃線L垂直之狀態傾斜的方式所形成。又,副劃線S2、S3係與副劃線S1一樣,以朝向主劃線L之副劃線S2及副劃線S3之各自的端部與主劃線L分開僅距離d1的方式所形成。The sub-scribing lines S2 and S3 are arranged at symmetrical positions across the sub-scribing line S1, and are formed so as to be inclined from a state perpendicular to the main scribing line L. In addition, the sub-scribing lines S2 and S3 are the same as the sub-scribing line S1, and are formed such that the respective ends of the sub-scribing line S2 and the sub-scribing line S3 facing the main scribing line L are separated from the main scribing line L by a distance d1. .

副劃線S4係通過副劃線S1之中央附近,並沿著端緣10a平行地被形成。副劃線S4係以朝向主劃線L之副劃線S4的兩端部與主劃線L分開僅距離d2的方式所形成。The auxiliary scribing line S4 passes through the vicinity of the center of the auxiliary scribing line S1 and is formed in parallel along the edge 10a. The auxiliary scribing line S4 is formed in such a manner that the two ends of the auxiliary scribing line S4 facing the main scribing line L are separated from the main scribing line L by a distance d2.

該距離d1、d2係根據基板10之種類、厚度以及尺寸、廢材部30的形狀等適當地被調整。The distances d1 and d2 are appropriately adjusted according to the type, thickness, and size of the substrate 10, the shape of the waste material portion 30, and the like.

依此方式在廢材部30形成4條副劃線S1~S4時,廢材部30係被劃分成複數個區域。在變形例1,分成2個階段,分割被劃分成複數個區域的廢材部30。In this manner, when the four sub-scribing lines S1 to S4 are formed in the waste material part 30, the waste material part 30 is divided into a plurality of regions. In Modification 1, it is divided into two stages, and the waste material part 30 divided into a plurality of regions is divided.

作為分割之第1階段,如圖7(a)所示,分割包含由副劃線S1、端緣10a以及副劃線S2、S3、S4所包圍之2個區域的區域R1。在分割之第2階段,係分割區域R1以外之剩下的區域R2。As the first stage of the division, as shown in FIG. 7(a), the region R1 including two regions surrounded by the sub-scribing line S1, the edge 10a, and the sub-scribing lines S2, S3, and S4 is divided. In the second stage of the division, it is the region R2 remaining outside the divided region R1.

圖7(b)係表示從基板10分割如圖7(a)所示之形成4條副劃線S1~S4的廢材部30之分割方法的流程圖。FIG. 7(b) is a flowchart showing a method of dividing the waste material portion 30 formed with four sub-scribing lines S1 to S4 from the substrate 10 as shown in FIG. 7(a).

如圖7(b)所示,基板10之分割係由以下之步驟所構成,劃線步驟(S21),係在基板10形成主劃線L及副劃線S1~S4;龜裂伸展步驟(S22),係從正下推壓副劃線S1,使垂直龜裂C1~C4沿著副劃線S1~S4滲透並伸展;第1分割步驟(S23),係分割區域R1;以及第2分割步驟(S24),係分割區域R2。As shown in Figure 7(b), the division of the substrate 10 is composed of the following steps. The scribing step (S21) is to form the main scribing line L and the sub-scribing lines S1 to S4 on the substrate 10; the crack extension step ( S22), pressing the sub-scribing line S1 from directly below, so that the vertical cracks C1~C4 penetrate and extend along the sub-scribing lines S1~S4; the first division step (S23), the division area R1; and the second division Step (S24) is to divide the region R2.

以下,詳細地說明圖7(b)所示之基板10的分割方法中之龜裂伸展步驟(S22)、第1分割步驟(S23)以及第2分割步驟(S24)。此外,在以下之說明中,言及垂直龜裂C、C1~C4之滲透及伸展,但是垂直龜裂C、C1~C4之詳細的說明係在後面在圖11說明。Hereinafter, the crack extension step (S22), the first dividing step (S23), and the second dividing step (S24) in the method of dividing the substrate 10 shown in FIG. 7(b) will be described in detail. In addition, in the following description, the penetration and extension of the vertical cracks C and C1 to C4 are mentioned, but the detailed description of the vertical cracks C and C1 to C4 will be described later in FIG. 11.

圖8(a)~(d)係在模式上表示在基板10之分割的過程之廢材部30的狀態及治具40所抵接之位置的平面圖。圖8(a)~(d)所示之廢材部30係與圖7(a)所示之基板10的廢材部30一樣,形成主劃線L、副劃線S1~S4。8(a) to (d) are plan views schematically showing the state of the waste material portion 30 in the process of dividing the substrate 10 and the position where the jig 40 abuts. The waste material part 30 shown in FIGS. 8(a) to (d) is the same as the waste material part 30 of the substrate 10 shown in FIG.

圖9(a)~(f)及圖10(a)~(f)係在模式上表示在基板10的分割方法中之龜裂伸展步驟(S22)、第1分割步驟(S23)以及第2分割步驟(S24)之基板10的狀態及治具40的動作的圖。Figures 9(a)~(f) and Figures 10(a)~(f) schematically show the crack extension step (S22), the first dividing step (S23), and the second in the method of dividing the substrate 10 A diagram of the state of the substrate 10 and the operation of the jig 40 in the dividing step (S24).

圖9(a)~(f)係從X軸負側觀察在廢材部30之在X軸方向的位置35a在與Y-Z平面平行的平面剖開基板10、載置台2、移動機構3、壓住構件4以及治具40的情況之剖面的情況之剖面圖。圖10(a)~(f)係從Y軸負側觀察在廢材部30之在Y軸方向的位置35a在與X-Z平面平行的平面剖開移動機構3、基板10以及治具40的情況之剖面的情況之剖面圖。權宜上,在圖9(a)~(f)及圖10(a)~(f),只對基板10,附加表示剖面的斜線。又,在圖9(a)~(f)及圖10(a)~(f),係為了便於說明,虛擬地圖示垂直龜裂C、C1~C3。又,在圖10(a)~(f),係省略載置台2及壓住構件4的圖示。Figure 9 (a) ~ (f) are viewed from the negative side of the X-axis at a position 35a in the X-axis direction of the waste material portion 30, which cuts the substrate 10, the mounting table 2, and the moving mechanism 3 in a plane parallel to the Y-Z plane , A cross-sectional view of the cross-section of the case where the member 4 and the jig 40 are pressed. Figure 10 (a) ~ (f) are viewed from the negative side of the Y axis at the position 35a of the waste material portion 30 in the Y axis direction, cutting the moving mechanism 3, the substrate 10 and the jig 40 in a plane parallel to the X-Z plane The cross-section of the situation. The cross-section of the situation. Expediently, in Figs. 9(a) to (f) and Figs. 10(a) to (f), only the substrate 10 is attached with oblique lines indicating the cross section. In addition, in FIGS. 9(a) to (f) and FIGS. 10(a) to (f), for convenience of explanation, the vertical cracks C and C1 to C3 are virtually illustrated. In addition, in FIGS. 10(a) to (f), illustration of the mounting table 2 and the pressing member 4 is omitted.

在圖8(a),在廢材部30內所示之白圓圈係在模式上表示下治具42所抵接的位置。以白圓圈圖所示之位置35a係廢材部30之中心附近,是基板10的下面11,且位於副劃線S1的正下。又,副劃線S4係以通過位置35a並沿著端緣10a成為平行的方式所形成。In FIG. 8(a), the white circle shown in the waste material portion 30 schematically shows the position where the lower jig 42 abuts. The position 35a shown by the white circle is near the center of the waste material portion 30, is the lower surface 11 of the substrate 10, and is located directly under the sub-scribing line S1. In addition, the auxiliary scribing line S4 is formed so as to pass through the position 35a and become parallel along the edge 10a.

如圖9(a)、圖10(a)所示,下治具42與基板10之下面11的位置35a抵接。此外,在圖10(a),係以位置M0表示下治具42與下面11的位置35a抵接時之Z軸方向的位置。As shown in FIG. 9(a) and FIG. 10(a), the lower jig 42 is in contact with the position 35a of the lower surface 11 of the substrate 10. In addition, in FIG. 10(a), the position of the lower jig 42 in the Z-axis direction when the lower jig 42 is in contact with the position 35a of the lower surface 11 is indicated by the position M0.

如圖10(b)所示,藉移動機構3,下治具42從位置M0向上方向移至位置M1,而如圖9(b)所示,向上方向推壓廢材部30。在此時,在副劃線S1、S4,垂直龜裂C1、C4從位置35a附近滲透,並朝向外側伸展。圖8(a)、圖9(a)、(b)、圖10(a)、(b)係對應於圖7(b)之龜裂伸展步驟(S22)。As shown in FIG. 10(b), by the moving mechanism 3, the lower jig 42 is moved from the position M0 to the position M1 in the upward direction, and as shown in FIG. 9(b), the waste material portion 30 is pushed in the upward direction. At this time, on the sub-scribing lines S1 and S4, the vertical cracks C1 and C4 penetrate from the vicinity of the position 35a and extend outward. Fig. 8(a), Fig. 9(a), (b), Fig. 10(a), (b) correspond to the crack extension step (S22) of Fig. 7(b).

在圖8(b),在廢材部30內所示之白圓圈及黑圓圈係在模式上表示治具40所抵接的位置。以白圓圈圖所示之位置35b及以黑圓圈所示之位置36a、36b係接近基板10之端緣10a的位置,並被配置於區域R1。位置35b係基板10的下面11,並位於副劃線S1的正下。在基板10,下治具42與作成下面11之位置35b抵接。在基板10,上治具41與上面12之位置36a、36b抵接。又,位置36a、36b係經由副劃線S1對稱的位置。In FIG. 8(b), the white circle and the black circle shown in the waste material portion 30 schematically indicate the position where the jig 40 abuts. The position 35b shown in the white circle diagram and the positions 36a and 36b shown in the black circle are positions close to the edge 10a of the substrate 10 and are arranged in the region R1. The position 35b is the lower surface 11 of the substrate 10, and is located directly under the sub-scribing line S1. On the substrate 10, the lower jig 42 is in contact with the position 35b where the lower surface 11 is made. On the substrate 10, the upper jig 41 is in contact with the positions 36a and 36b of the upper surface 12. In addition, the positions 36a and 36b are symmetrical positions via the sub-scribing line S1.

為了使下治具42及上治具41與圖8(b)所示之位置35b、36a、36b的各個抵接,首先,如圖9(c)、圖10(c)所示,移動機構3係使下治具42從位置M1下降至位置M2。又,移動機構3係使下治具42向基板10的端緣10a側移動,並定位於位置35b的正下。在圖9(c),虛線之箭號係表示下治具42向端緣10a側移動,又,向下方移動。此外,在圖9(c)、圖10(c)係未圖示,移動機構3係將上治具41定位於位置36a、36b的正上。In order to make the lower jig 42 and the upper jig 41 abut each of the positions 35b, 36a, and 36b shown in Fig. 8(b), first, as shown in Figs. 9(c) and 10(c), the moving mechanism In the 3 system, the lower jig 42 is lowered from the position M1 to the position M2. In addition, the moving mechanism 3 moves the lower jig 42 to the edge 10a side of the substrate 10 and is positioned directly under the position 35b. In Fig. 9(c), the broken arrow indicates that the lower jig 42 moves to the edge 10a side, and also moves downward. In addition, FIG. 9(c) and FIG. 10(c) are not shown, and the moving mechanism 3 positions the upper jig 41 directly above the positions 36a and 36b.

依此方式,以與位置35b、36a、36b的各個對應的方式將下治具42及上治具41進行定位時,如圖9(d)、圖10(d)所示,移動機構3係使下治具42向上方移動且使上治具41向下方移動。因此,藉上治具41及下治具42推壓廢材部30的區域R1。In this way, when the lower jig 42 and the upper jig 41 are positioned in a manner corresponding to each of the positions 35b, 36a, and 36b, as shown in Fig. 9(d) and Fig. 10(d), the moving mechanism 3 is The lower jig 42 is moved upward and the upper jig 41 is moved downward. Therefore, the upper jig 41 and the lower jig 42 push the area R1 of the waste material part 30.

在此時,在副劃線S2、S3,垂直龜裂C2、C3自規定區域R1之部分滲透並伸展,且以區域R1之副劃線S1為中心,將區域R1分割成2個區域。圖8(b)、圖9(c)、(d)、圖10(c)、(d)係對應於圖7(b)之第1分割步驟(S23)。At this time, on the sub-scribing lines S2 and S3, the vertical cracks C2 and C3 penetrate and extend from the part of the predetermined area R1, and the area R1 is divided into two areas with the sub-scribing line S1 of the area R1 as the center. Fig. 8(b), Fig. 9(c), (d), Fig. 10(c), (d) correspond to the first division step (S23) of Fig. 7(b).

在圖8(c),以在廢材部30內所示之黑圓圈所示的位置37a、37b係被配置於區域R2內,並是接近廢材部30之角部34的位置。又,位置37a、37b係經由副劃線S1對稱的位置。在基板10,上治具41與上面12之位置37a、37b抵接。In FIG. 8( c ), the positions 37 a and 37 b shown by the black circles shown in the waste material part 30 are arranged in the region R2 and are close to the corners 34 of the waste material part 30. In addition, the positions 37a and 37b are symmetrical positions via the subscribing line S1. On the substrate 10, the upper jig 41 is in contact with the positions 37a and 37b of the upper surface 12.

為了使上治具41與圖8(c)所示之位置37a、37b抵接,如圖9(e)、圖10(e)所示,移動機構3係將上治具41定位於位置37a、37b的正上,並使上治具41向下方移動。因此,廢材部30之區域R2被上治具41推壓。在此時,在副劃線S1~S4,區域R2所含之部分的垂直龜裂C1~C4滲透並伸展。進而,在主劃線L,垂直龜裂C滲透並伸展。In order to make the upper jig 41 abut the positions 37a and 37b shown in Fig. 8(c), as shown in Figs. 9(e) and 10(e), the moving mechanism 3 positions the upper jig 41 at the position 37a , 37b is directly above, and moves the upper jig 41 downward. Therefore, the area R2 of the waste material portion 30 is pushed by the upper jig 41. At this time, in the sub-line S1~S4, the vertical cracks C1~C4 in the part contained in the region R2 penetrate and spread. Furthermore, at the main scribe line L, the vertical crack C penetrates and spreads.

依此方式,因為垂直龜裂C、C1~C4伸展,所以區域R2係從基板10被分割。分割後之基板10係如圖8(d)、圖9(f)、圖10(f)所示。圖8(c)、(d)、圖9(e)、(f)、圖10(e)、(f)係對應於圖7(b)之第2分割步驟(S24)。In this way, because the vertical cracks C and C1 to C4 extend, the region R2 is divided from the substrate 10. The divided substrate 10 is shown in Fig. 8(d), Fig. 9(f), and Fig. 10(f). Fig. 8(c), (d), Fig. 9(e), (f), Fig. 10(e), (f) correspond to the second division step (S24) of Fig. 7(b).

其次,參照圖11,說明在變形例2之垂直龜裂C、C1~C4的伸展。Next, referring to FIG. 11, the vertical cracks C and the extension of C1 to C4 in Modification 2 will be described.

圖11係用以說明在根據變形例1之分割方法分割基板10時,主劃線L及副劃線S1~S4之垂直龜裂C、C1~C4之滲透及伸展的模式圖。11 is a schematic diagram for explaining the penetration and extension of vertical cracks C, C1 to C4 of the main scribing line L and the auxiliary scribing lines S1 to S4 when the substrate 10 is divided according to the dividing method of the modification 1.

在步驟S22之龜裂伸展步驟(圖9(a)、(b)、圖10(a)、(b)),下治具42推壓廢材部30的位置35a。因此,首先,以位置35a為起點,垂直龜裂C1、C4沿著副劃線S1、S4滲透,並向方向E5、E6、E7、E10伸展。In the crack extension step of step S22 (FIG. 9(a), (b), FIG. 10(a), (b)), the lower jig 42 pushes the position 35a of the waste material portion 30. Therefore, first, starting from the position 35a, the vertical cracks C1 and C4 penetrate along the sub-scribing lines S1 and S4 and extend in the directions E5, E6, E7, and E10.

接著,在步驟S23之第1分割步驟(圖9(c)、(d)、圖10(c)、(d)),下治具42推壓廢材部30的位置35b,上治具41推壓廢材部30的位置36a、36b(參照圖8(b))。因此,區域R1係在基板10之厚度方向位移。因此,在副劃線S2、S3,對規定區域R1的部分,發生向區域R1之內側方向的位移。因此,在副劃線S2、S3,區域R1所含之部分的垂直龜裂C2、C3滲透,並向方向E8、E9伸展。Next, in the first division step of step S23 (Figure 9(c), (d), Figure 10(c), (d)), the lower jig 42 pushes the position 35b of the waste material portion 30, and the upper jig 41 The positions 36a and 36b of the waste material part 30 are pressed (refer to FIG. 8(b)). Therefore, the region R1 is displaced in the thickness direction of the substrate 10. Therefore, in the subscribed lines S2 and S3, the portion of the predetermined region R1 is displaced in the inner direction of the region R1. Therefore, the vertical cracks C2 and C3 in the part contained in the region R1 penetrate in the sub-scribing lines S2 and S3 and extend in the directions E8 and E9.

如上述所示,在龜裂伸展步驟(S22),副劃線S4中規定區域R1之部分的垂直龜裂C4滲透並伸展。因此,在副劃線S4與副劃線S2的交點G2、及副劃線S4與副劃線S3的交點G3,垂直龜裂C4與垂直龜裂C2、及垂直龜裂C4與垂直龜裂C3連接,並向方向E8、E9圓滑地伸展。As described above, in the crack extension step (S22), the vertical crack C4 in the portion of the predetermined area R1 in the subscribed line S4 penetrates and extends. Therefore, at the intersection point G2 of the auxiliary scribing line S4 and the auxiliary scribing line S2 and the intersection point G3 of the auxiliary scribing line S4 and the auxiliary scribing line S3, the vertical crack C4 and the vertical crack C2, and the vertical crack C4 and the vertical crack C3 Connect and extend smoothly in directions E8 and E9.

此處,在副劃線S2,垂直龜裂C2從交點G2向方向E11滲透並伸展。一樣地,在副劃線S3,垂直龜裂C3從交點G3向方向E12滲透並伸展。Here, at the auxiliary dash line S2, the vertical crack C2 penetrates and extends from the intersection G2 in the direction E11. Similarly, at the secondary dash line S3, the vertical crack C3 penetrates and extends from the intersection G3 in the direction E12.

因此,副劃線S1~S4中區域R1所含之部分的垂直龜裂C1~C4滲透並伸展。因此,以副劃線S1為中心,區域R1被分割成二等分(參照圖10(d))。Therefore, the vertical cracks C1 to C4 in the part contained in the area R1 in the subline S1 to S4 penetrate and extend. Therefore, the region R1 is divided into two equal parts with the subline S1 as the center (refer to FIG. 10(d)).

接著,在步驟S24之第2分割步驟(圖9(e)、(f)、圖10(e)、(f)),上治具41推壓廢材部30的位置37a、37b(參照圖8(c))。因此,區域R2係在基板10之厚度方向位移,且區域R2之周緣係向內側方向位移。因此,在副劃線S1~S4,區域R2所含之部分的垂直龜裂C1~C4滲透,並向方向E10~E14伸展。Next, in the second division step of step S24 (FIG. 9(e), (f), FIG. 10(e), (f)), the upper jig 41 pushes the positions 37a, 37b of the waste material portion 30 (see FIG. 8(c)). Therefore, the region R2 is displaced in the thickness direction of the substrate 10, and the peripheral edge of the region R2 is displaced in the inner direction. Therefore, in the sub-line S1~S4, the vertical cracks C1~C4 contained in the region R2 penetrate and extend in the directions E10~E14.

如上述所示,在龜裂伸展步驟(S22),在副劃線S1之區域R2的部分,係垂直龜裂C1已滲透。又,在第1分割步驟(S23),亦在副劃線S2、S3,在區域R2所含的部分,係垂直龜裂C2、C3滲透,並向方向E11、E12伸展。然後,以上治具41推壓區域R2時,在副劃線S1~S4,區域R2所含之部分的垂直龜裂C1~C4圓滑地滲透,並向方向E10~E14伸展。As described above, in the crack extension step (S22), the vertical crack C1 has penetrated in the area R2 of the sub-scribing line S1. Moreover, in the first dividing step (S23), the vertical cracks C2 and C3 penetrate into the sub-scribing lines S2 and S3 in the part included in the region R2 and extend in the directions E11 and E12. Then, when the above jig 41 pushes the region R2, the vertical cracks C1~C4 in the sub-scribed line S1~S4 and the part of the region R2 penetrate smoothly and extend in the directions E10~E14.

又,副劃線S4的垂直龜裂C4係從交點G2向方向E13伸展。一樣地,垂直龜裂C4係從交點G3向方向E14伸展。In addition, the vertical crack C4 of the auxiliary scribing line S4 extends from the intersection G2 in the direction E13. Similarly, the vertical crack C4 extends from the intersection G3 to the direction E14.

副劃線S1之垂直龜裂C1向方向E10伸展,而到達主劃線L之位置G1時,主劃線L之垂直龜裂C滲透並向方向E15、E16伸展。一樣地,垂直龜裂C2係向方向E11伸展,而與主劃線L的垂直龜裂C連接。垂直龜裂C3係向方向E12伸展,而與主劃線L的垂直龜裂C連接。垂直龜裂C4係向方向E13、E14伸展,而與主劃線L的垂直龜裂C連接。The vertical crack C1 of the secondary scribing line S1 extends in the direction E10, and when it reaches the position G1 of the main scribing line L, the vertical crack C of the main scribing line L penetrates and extends in the directions E15 and E16. Similarly, the vertical crack C2 extends in the direction E11 and is connected to the vertical crack C of the main scribe line L. The vertical crack C3 extends in the direction E12 and is connected to the vertical crack C of the main scribe line L. The vertical crack C4 extends in the directions E13 and E14, and is connected to the vertical crack C of the main scribe line L.

另一方面,在主劃線L,係如參照圖5(a)之說明所示,藉上治具41推壓區域R2時,廢材部30因彎曲而產生變形。因此,在主劃線L,垂直龜裂C從因外力而垂直龜裂C最易滲透的端部LC、LD在基板10之厚度方向滲透。而且,在從端部LC、LD往內側之方向F3、F4,垂直龜裂C沿著主劃線L依序滲透並伸展。On the other hand, in the main scribing line L, as shown in the description with reference to FIG. 5(a), when the region R2 is pushed by the upper jig 41, the waste material portion 30 is deformed due to bending. Therefore, on the main scribe line L, the vertical crack C penetrates in the thickness direction of the substrate 10 from the end portions LC and LD where the vertical crack C is most easily penetrated by the external force. In addition, in the directions F3 and F4 from the ends LC and LD to the inside, the vertical crack C penetrates and spreads along the main scribe line L in order.

在主劃線L,垂直龜裂C在方向F3、F4伸展時,垂直龜裂C係與到達主劃線L之垂直龜裂C1~C4依序連接。依此方式,垂直龜裂C在主劃線L之全部範圍滲透。On the main scribe line L, when the vertical crack C extends in the directions F3 and F4, the vertical crack C is connected in sequence with the vertical cracks C1~C4 that reach the main scribe line L. In this way, the vertical crack C penetrates the entire range of the main scribe line L.

依此方式,垂直龜裂對區域R2所含之全部的劃線滲透並伸展。藉此,沿著副劃線S1~S4,區域R2被分割成複數個且沿著主劃線L分割廢材部30。 <驗證>In this way, the vertical crack penetrates and spreads to all the scribe lines contained in the region R2. Thereby, the region R2 is divided into a plurality of sections along the sub-scribing line S1 to S4, and the waste material portion 30 is divided along the main scribing line L. As shown in FIG. <Verification>

本發明者們係為了驗證使用該變形例1之分割方法的情況之效果,進行以下的驗證。此外,在本驗證,係使用既定移動機構使上治具及下治具在上下方向移動。又,在本驗證,係適當地參照在該變形例1所參照之圖7(a)~圖10(f)。The inventors of the present invention performed the following verification in order to verify the effect of the case of using the division method of this modification 1. In addition, in this verification, the upper jig and the lower jig are moved in the up and down direction using the established moving mechanism. In addition, in this verification, appropriately refer to FIGS. 7(a) to 10(f) referred to in this modification 1.

在本驗證所使用之廢材部的形狀係與圖7(a)所示之基板10的廢材部30相同的形狀。並使用角部34之角度α為60°者。The shape of the waste material part used in this verification is the same shape as the waste material part 30 of the substrate 10 shown in FIG. 7(a). The angle α of the corner 34 is 60°.

又,基板10係使用厚度為0.4mm的玻璃基板。如圖7(a)所示,副劃線S1~S4係與變形例1一樣地被形成於廢材部30。這係對應於圖7(b)之劃線步驟(S21)。In addition, as the substrate 10, a glass substrate having a thickness of 0.4 mm was used. As shown in FIG. 7( a ), the sub-scribing lines S1 to S4 are formed in the waste material portion 30 in the same manner as in Modification Example 1. As shown in FIG. This corresponds to the scribing step (S21) in Figure 7(b).

藉上述之劃線步驟,如圖7(a)所示,廢材部30係被劃分成區域R1、R2。 [驗證的程序]By the above-mentioned scribing step, as shown in FIG. 7(a), the waste material portion 30 is divided into regions R1 and R2. [Verification Procedure]

首先,如圖8(a)、圖9(a)、(b)、圖10(a)、(b)所示,藉移動機構,利用下治具推壓是廢材部30之中心附近的位置35a,而使廢材部30上升0.7mm。此位置35a係基板10的下面11,並位於副劃線S1與副劃線S4之交點的正下。這係對應於圖7(b)之龜裂伸展步驟(S22)。First, as shown in Figure 8 (a), Figure 9 (a), (b), Figure 10 (a), (b), by means of a moving mechanism, the lower jig is used to push the area near the center of the waste material portion 30 Position 35a, and the waste material portion 30 is raised by 0.7 mm. This position 35a is the lower surface 11 of the substrate 10, and is located directly below the intersection of the auxiliary scribing line S1 and the auxiliary scribing line S4. This corresponds to the crack extension step (S22) in Figure 7(b).

接著,如圖8(b)、圖9(c)、(d)、圖10(c)、(d)所示,移動機構係使下治具從廢材部30向下方移動2mm,使下治具從位置35a向基板10之端緣10a側移動,而定位於位置35b的正下。然後,移動機構係將上治具定位於位置36a、36b。位置36a、36b係在基板10是上面12,並被配置於經由位置35b對稱的位置。Next, as shown in Figure 8 (b), Figure 9 (c), (d), Figure 10 (c), (d), the moving mechanism is to move the lower jig from the waste material portion 30 downward by 2mm, so that the lower The jig moves from the position 35a to the edge 10a side of the substrate 10, and is positioned directly under the position 35b. Then, the moving mechanism positions the upper jig at positions 36a and 36b. The positions 36a and 36b are on the upper surface 12 of the substrate 10, and are arranged at symmetrical positions via the position 35b.

移動機構係將上治具及下治具定位於上述之位置時,使上治具下降,並使下治具上升,而推壓廢材部30之區域R1。藉此,分割區域R1。這係對應於圖7(b)之第1分割步驟(S23)。When the moving mechanism positions the upper jig and the lower jig at the above-mentioned positions, the upper jig is lowered and the lower jig is raised, and the area R1 of the waste material portion 30 is pushed. In this way, the region R1 is divided. This corresponds to the first division step (S23) in Fig. 7(b).

然後,如圖8(c)、(d)、圖9(e)、(f)、圖10(e)、(f)所示,移動機構係使上治具移至位置37a、37b的正上並抵接。位置37a、37b係在基板10是上面12,並是經由副劃線S1對稱的位置。Then, as shown in Figure 8(c), (d), Figure 9(e), (f), Figure 10(e), (f), the moving mechanism moves the upper jig to the position 37a, 37b. Go up and meet. The positions 37a and 37b are on the upper surface 12 of the substrate 10, and are symmetrical positions via the sub-scribing line S1.

移動機構係將上治具定位於上述之位置時,使上治具下降,而推壓廢材部30之區域R2。藉此,分割區域R2。這係對應於圖7(b)之第2分割步驟(S24)。When the moving mechanism positions the upper jig at the above-mentioned position, the upper jig is lowered, and the area R2 of the waste material portion 30 is pressed. In this way, the region R2 is divided. This corresponds to the second division step (S24) in Fig. 7(b).

分割基板10之廢材部30後,確認製品部20的端部。在製品部20的端部,係雖然發生微小之碎片及扭歪,但是是不影響製品品質的程度。After the waste material portion 30 of the substrate 10 is divided, the end portion of the product portion 20 is confirmed. At the end of the product part 20, although small fragments and distortions occur, they do not affect the quality of the product.

自該驗證,確認在變形例1之分割方法,亦可易於且良好地從基板10分割廢材部30。 <變形例1之效果>From this verification, it was confirmed that in the dividing method of Modification 1, the waste material portion 30 from the substrate 10 can also be easily and well divided. <Effects of Modification 1>

如圖7(a)~圖11所示,在廢材部30,係形成4條副劃線S1~S4,而被劃分成複數個區域。在龜裂伸展步驟(S22),在基板10的下面11推壓副劃線S1與副劃線S4之交點,即位置35a時,垂直龜裂C1、C4以該位置35a為起點滲透及伸展。As shown in FIG. 7(a) to FIG. 11, in the waste material part 30, four sub-scribing lines S1 to S4 are formed, and it is divided into a plurality of areas. In the crack extension step (S22), when the intersection of the auxiliary scribing line S1 and the auxiliary scribing line S4 is pressed on the lower surface 11 of the substrate 10, that is, the position 35a, the vertical cracks C1 and C4 penetrate and extend with the position 35a as the starting point.

而,在第1分割步驟(S23),藉由推壓在廢材部30之區域R1的2處,區域R1係在基板10之厚度方向位移。因此,在副劃線S2、S3對規定區域R1的部分,產生向區域R1之內側方向的位移。因此,在基板10之厚度方向位移之力作用於副劃線S2、S3。因此,垂直龜裂C1、C2沿著副劃線S2、S3滲透並伸展。However, in the first dividing step (S23), the area R1 is displaced in the thickness direction of the substrate 10 by pressing at two places of the area R1 of the waste material portion 30. Therefore, in the part of the predetermined region R1 by the subscribed lines S2 and S3, a displacement in the inner direction of the region R1 occurs. Therefore, the force of displacement in the thickness direction of the substrate 10 acts on the sub-scribing lines S2 and S3. Therefore, the vertical cracks C1 and C2 penetrate and extend along the sub-scribing lines S2 and S3.

依此方式,副劃線S1~S4係因為垂直龜裂C1~C4是良好地滲透並伸展之狀態,所以區域R1係以副劃線S1為中心易於且良好地被分割成2個區域。In this way, the sub-scribing lines S1 to S4 are in a state where the vertical cracks C1 to C4 are well penetrated and extended, so the area R1 is easily and well divided into two areas with the sub-scribing line S1 as the center.

又,區域R1是位於基板10之端緣10a側的區域。因此,進行第1分割步驟(S23),分割區域R1,亦對製品部20係無影響。In addition, the region R1 is a region located on the edge 10a side of the substrate 10. Therefore, the first division step (S23) is performed, and the division area R1 also has no influence on the product part 20.

尤其,如圖7(a)所示,在廢材部30的形狀是寬度從端緣10a往基板10之內側變寬之形狀的情況,若先分割端緣10a側之區域R1,在分割區域R1後,可使廢材部30之進深側的區域R2更大為變形。因此,在分割區域R1後,可易於分割剩下的區域R2。In particular, as shown in FIG. 7(a), when the shape of the waste material portion 30 is a shape whose width widens from the end edge 10a toward the inner side of the substrate 10, if the area R1 on the end edge 10a side is divided first, the After R1, the region R2 on the deep side of the waste material portion 30 can be more deformed. Therefore, after the region R1 is divided, the remaining region R2 can be easily divided.

如圖7(a)所示,副劃線S2、S3係以從對主劃線L垂直之狀態傾斜的方式所形成。As shown in FIG. 7(a), the sub-scribing lines S2 and S3 are formed so as to be inclined from a state perpendicular to the main scribing line L. As shown in FIG.

若依據這種構成,與副劃線S2、S3對主劃線L垂直之狀態的情況相比,沿著副劃線S2、S3伸展之垂直龜裂C2、C3對主劃線L更圓滑地連接。因此,垂直龜裂C沿著主劃線L易於滲透及伸展。因此,可易於且良好地分割廢材部30。According to this configuration, the vertical cracks C2 and C3 extending along the sub-scribing lines S2 and S3 are more smooth to the main scribing line L compared to the state where the sub-scribing lines S2 and S3 are perpendicular to the main scribing line L connect. Therefore, the vertical crack C easily penetrates and spreads along the main scribe line L. Therefore, the waste material part 30 can be divided easily and well.

又,如圖7(a)所示,在廢材部30,副劃線S2、S3係以朝向主劃線L之副劃線S2、S3之各自的端部與主劃線L分開僅距離d1的方式所形成。7(a), in the waste material portion 30, the sub-scribing lines S2 and S3 are separated from the main scribing line L by the respective ends of the sub-scribing lines S2 and S3 facing the main scribing line L. d1 way.

依據這種構成,可防止朝向主劃線L之側並沿著副劃線S2、S3滲透並伸展的垂直龜裂C2、C3超出主劃線L而進入製品部20。因此,在分割廢材部30時,可更確實地抑制製品部20之受損,而可提高製品部20之品質。According to this configuration, it is possible to prevent the vertical cracks C2, C3 that penetrate and extend toward the side of the main scribing line L and extending along the sub-scribing lines S2, S3 from exceeding the main scribing line L and entering the product portion 20. Therefore, when the waste material part 30 is divided, the damage of the product part 20 can be suppressed more reliably, and the quality of the product part 20 can be improved.

一樣地,副劃線S4的兩端部係以與主劃線L分開僅距離d2的方式所形成。因此,與上述一樣,在製品部20,垂直龜裂滲透,可確實地抑制製品部20之受損,而可提高製品部20之品質。Similarly, both ends of the auxiliary scribing line S4 are formed so as to be separated from the main scribing line L by a distance d2. Therefore, as described above, vertical cracks penetrate into the product portion 20, and damage to the product portion 20 can be reliably suppressed, and the quality of the product portion 20 can be improved.

又,如圖7(a)~圖11所示,分割方法係包含第2分割步驟(S24),該第2分割步驟(S24)係在第1分割步驟(S23)之後,對在廢材部30的區域R2,推壓形成副劃線S1之廢材部30的面之至少2處並分割。7(a) to 11, the dividing method includes a second dividing step (S24). The second dividing step (S24) is after the first dividing step (S23). The area R2 of 30 is divided by pressing at least two of the surface of the waste material portion 30 forming the secondary scribe line S1.

藉第1分割步驟(S23),垂直龜裂C、C1~C4沿著主劃線L及副劃線S1~S4滲透及伸展。因此,在第2分割步驟(S24),若推壓區域R2之至少2處,可易於分割區域R2。依此方式,分成2個階段,從基板10可分割廢材部30。 <變形例2>By the first dividing step (S23), the vertical cracks C, C1~C4 penetrate and extend along the main scribe line L and the sub-scribe line S1~S4. Therefore, in the second division step (S24), if at least two of the regions R2 are pushed, the region R2 can be easily divided. In this way, it is divided into two stages, and the waste material portion 30 can be divided from the substrate 10. <Modification 2>

在該變形例1,係藉4條副劃線S1~S4,將廢材部30劃分成區域R1、R2,區域R1的形狀是梯形。在變形例2,以區域R1、R2的形狀與變形例1相異的方式在廢材部30形成4條副劃線S1~S4。In this modification 1, the waste material portion 30 is divided into regions R1 and R2 by four sub-scribing lines S1 to S4, and the shape of the region R1 is a trapezoid. In Modification 2, four sub-scribing lines S1 to S4 are formed in the waste material portion 30 so that the shapes of the regions R1 and R2 are different from those of Modification 1.

圖12(a)~(d)係表示在變形例2的分割方法之廢材部30的形狀與副劃線S1~S4之形成型式的模式圖。12(a) to (d) are schematic diagrams showing the shape of the waste material portion 30 and the formation patterns of the sub-scribing lines S1 to S4 in the dividing method of the modification 2.

如圖12(a)~(d)所示,在變形例2,副劃線S1、S4係與該變形例1一樣地被形成。As shown in FIGS. 12(a) to (d), in Modification 2, the sub-scribing lines S1 and S4 are formed in the same manner as in Modification 1.

副劃線S2、S3係與該變形例1一樣,被配置於隔著副劃線S1對稱的位置,並以從對主劃線L垂直之狀態傾斜的方式所形成。又,副劃線S2、S3係與副劃線S1一樣,以朝向主劃線L之副劃線S2、S3之各自的端部與主劃線L分開僅距離d1的方式所形成。The sub-scribing lines S2 and S3 are arranged at symmetrical positions across the sub-scribing line S1 as in Modification 1, and are formed so as to be inclined from a state perpendicular to the main scribing line L. In addition, the auxiliary scribing lines S2 and S3 are the same as the auxiliary scribing line S1, and are formed such that the respective ends of the auxiliary scribing lines S2 and S3 facing the main scribing line L are separated from the main scribing line L by a distance d1.

在變形例2,進而,副劃線S2、S3係以通過是副劃線S1、S4之交點的位置35a之方式所形成。In Modification 2, further, the sub-scribing lines S2 and S3 are formed so as to pass through the position 35a which is the intersection of the sub-scribing lines S1 and S4.

依此方式在廢材部30形成4條副劃線S1~S4時,廢材部30係被劃分成複數個區域。在變形例2,係分成2個階段,分割包含被副劃線S1、端緣10a、以及副劃線S2、S3所包圍之2個區域的區域R3、與廢材部30之區域R3以外的區域R4。In this manner, when the four sub-scribing lines S1 to S4 are formed in the waste material part 30, the waste material part 30 is divided into a plurality of regions. In Modification 2, the system is divided into two stages, the area R3 including the two areas surrounded by the sub-scribing line S1, the end edge 10a, and the sub-scribing lines S2, S3, and the area other than the area R3 of the waste material portion 30 are divided Area R4.

在變形例2之分割廢材部30的情況,按照與該變形例1相同的程序分割。如圖12(a)所示,移動機構3係使下治具42與位置35a抵接後,使其上升僅既定距離,而推壓廢材部30(參照圖9(a)、(b)、圖10(a)、(b))。這係對應於圖7(b)之龜裂伸展步驟(S22)。In the case of dividing the waste material portion 30 of the modification 2, the division is performed according to the same procedure as the modification 1. As shown in Fig. 12(a), the moving mechanism 3 makes the lower jig 42 abut the position 35a and raises it only a predetermined distance, and pushes the waste material part 30 (refer to Figs. 9(a), (b) , Figure 10 (a), (b)). This corresponds to the crack extension step (S22) in Figure 7(b).

然後,如圖12(b)所示,移動機構3係將下治具42及上治具41定位於位置35a、36a、36b之各個位置。位置35a、36a、36b係與該變形例1相同的位置。移動機構3係在使上治具41及下治具42與這種位置抵接之狀態,使上治具41向下方移動,並使下治具42向上方移動。因此,廢材部30被治具40推壓,而分割區域R3(參照圖9(c)、(d)、圖10(c)、(d))。這係對應於圖7(b)之第1分割步驟(S23)。Then, as shown in FIG. 12(b), the moving mechanism 3 positions the lower jig 42 and the upper jig 41 at each of the positions 35a, 36a, and 36b. The positions 35a, 36a, and 36b are the same positions as the first modification. The moving mechanism 3 is a state in which the upper jig 41 and the lower jig 42 are in contact with this position, and the upper jig 41 is moved downward and the lower jig 42 is moved upward. Therefore, the waste material part 30 is pressed by the jig 40, and the area|region R3 is divided (refer FIG. 9(c), (d), FIG. 10(c), (d)). This corresponds to the first division step (S23) in Fig. 7(b).

接著,如圖12(b)所示,移動機構3係將上治具41定位於位置37a、37b。位置37a、37b係與該變形例1相同的位置。移動機構3係在使上治具41與這種位置抵接之狀態,使上治具41向下方移動。因此,如圖12(d)所示,廢材部30被上治具41推壓,而分割區域R4(參照圖9(e)、(f)、圖10(e)、(f))。這係對應於圖7(b)之第2分割步驟(S24)。Next, as shown in FIG. 12(b), the moving mechanism 3 positions the upper jig 41 at positions 37a and 37b. The positions 37a and 37b are the same positions as in the first modification. The moving mechanism 3 moves the upper jig 41 downward in a state where the upper jig 41 is in contact with this position. Therefore, as shown in FIG. 12(d), the waste material portion 30 is pressed by the upper jig 41, and the region R4 is divided (see FIGS. 9(e), (f), 10(e), and (f)). This corresponds to the second division step (S24) in Fig. 7(b).

依此方式,在如變形例2所示形成副劃線S1~S4的情況,亦與變形例1一樣,將廢材部30劃分成2個區域R3、R4,並從基板10可分割。In this way, when the sub-scribing lines S1 to S4 are formed as shown in Modification Example 2, the waste material portion 30 is divided into two regions R3 and R4 and can be divided from the substrate 10 as in Modification Example 1.

此外,在上述之變形例1、2,在龜裂伸展步驟(S22)之後,在第1分割步驟(S23),藉下治具42從下方推壓廢材部30之區域R1、R3。因此,垂直龜裂C2、C3沿著區域R1、R3所含的副劃線S2、S3滲透並伸展。In addition, in the above-mentioned Modifications 1 and 2, after the crack extension step (S22), in the first dividing step (S23), the lower jig 42 pushes the regions R1, R3 of the waste material portion 30 from below. Therefore, the vertical cracks C2 and C3 penetrate and extend along the sub-scribing lines S2 and S3 contained in the regions R1 and R3.

可是,例如,基板10薄時,在龜裂伸展步驟(S22),有垂直龜裂C1~C4沿著副劃線S1~S4充分地滲透並伸展的情況。因此,在主劃線L,亦垂直龜裂C滲透並伸展。However, for example, when the substrate 10 is thin, in the crack extension step (S22), the vertical cracks C1 to C4 may fully penetrate and extend along the sub-scribing lines S1 to S4. Therefore, at the main scribe line L, the vertical crack C penetrates and spreads.

在這種情況,在第1分割步驟(S23),不必使用下治具42推壓區域R1、R3,來使垂直龜裂C1~C4滲透及伸展。因此,在第1分割步驟(S23),係只藉上治具41推壓區域R1、R3,從廢材部30分割區域R1、R3,在第2分割步驟(S24)分割剩下的區域R2、R4即可。 <其他的變形例>In this case, in the first dividing step (S23), it is not necessary to use the lower jig 42 to push the regions R1 and R3 to penetrate and extend the vertical cracks C1 to C4. Therefore, in the first division step (S23), only the upper jig 41 is used to push the regions R1 and R3, the regions R1 and R3 are divided from the waste material portion 30, and the remaining region R2 is divided in the second division step (S24) , R4 is fine. <Other modifications>

在上述之變形例1、2,係在廢材部30形成4條副劃線,但是是3條亦可。In Modifications 1 and 2 described above, four sub-scribing lines are formed in the waste material portion 30, but three sub-scribing lines may be used.

圖13係表示在其他的變形例的分割方法之廢材部30的形狀與副劃線S1~S3之形成型式的模式圖。FIG. 13 is a schematic diagram showing the shape of the waste material portion 30 and the formation pattern of the sub-scribing lines S1 to S3 in the dividing method of another modification.

如圖13所示,在變形例2,副劃線S1係與該變形例1一樣地被形成。As shown in FIG. 13, in the second modification example, the auxiliary scribing line S1 is formed in the same manner as in the first modification example.

副劃線S2、S3係與該變形例1一樣,被配置於隔著副劃線S1對稱的位置,並以從對主劃線L垂直之狀態傾斜的方式所形成。又,副劃線S2、S3係與副劃線S1一樣,以朝向主劃線L之副劃線S2及副劃線S3之各自的端部與主劃線L分開僅距離d1的方式所形成,且以與副劃線S1之端部相交的方式所形成。The sub-scribing lines S2 and S3 are arranged at symmetrical positions across the sub-scribing line S1 as in Modification 1, and are formed so as to be inclined from a state perpendicular to the main scribing line L. In addition, the sub-scribing lines S2 and S3 are the same as the sub-scribing line S1, and are formed such that the respective ends of the sub-scribing line S2 and the sub-scribing line S3 facing the main scribing line L are separated from the main scribing line L by a distance d1. , And formed in a way to intersect the end of the sub-line S1.

依此方式形成副劃線S1~S3之廢材部30係被劃分成區域R5、與區域R5以外之區域R6,該區域R5係包含由副劃線S1、端緣10a以及副劃線S2、S3所包圍的2個區域。In this way, the waste material portion 30 forming the sub-scribing lines S1 to S3 is divided into a region R5 and a region R6 other than the region R5. The region R5 includes the sub-scribing line S1, the edge 10a, and the sub-scribing line S2. 2 areas surrounded by S3.

在形成如圖13所示之副劃線S1~S3的情況,亦例如,藉移動機構3使下治具42移動,藉由推壓副劃線S1的中央附近,垂直龜裂C1沿著副劃線S1滲透並伸展。這係對應於圖7(b)之龜裂伸展步驟(S22)。In the case of forming the auxiliary scribing lines S1~S3 as shown in FIG. 13, for example, the lower jig 42 is moved by the moving mechanism 3. Scribe S1 penetrates and stretches. This corresponds to the crack extension step (S22) in Figure 7(b).

然後,移動機構3將上治具41及下治具42定位於廢材部30的區域R5之適當的位置,並藉上治具41及下治具42推壓區域R5。因此,因為垂直龜裂C2、C3沿著副劃線S2、S3滲透並伸展,所以分割區域R5。這係對應於圖7(b)之第1分割步驟(S23)。Then, the moving mechanism 3 positions the upper jig 41 and the lower jig 42 at an appropriate position in the area R5 of the waste material portion 30, and presses the area R5 with the upper jig 41 and the lower jig 42. Therefore, because the vertical cracks C2 and C3 penetrate and extend along the sub-scribing lines S2 and S3, the region R5 is divided. This corresponds to the first division step (S23) in Fig. 7(b).

接著,移動機構3係將上治具41定位於廢材部30的區域R6之適當的位置,藉由以上治具41推壓區域R6,因為垂直龜裂C、C2、C3沿著主劃線L、副劃線S2、S3滲透並伸展,所以分割區域R6。這係對應於圖7(b)之第2分割步驟(S24)。Next, the moving mechanism 3 positions the upper jig 41 at an appropriate position in the area R6 of the waste material portion 30, and presses the area R6 by the above jig 41, because the vertical cracks C, C2, and C3 are along the main scribe line L, the auxiliary line S2 and S3 penetrate and stretch, so the region R6 is divided. This corresponds to the second division step (S24) in Fig. 7(b).

依此方式,在副劃線為3條的情況,亦藉由將廢材部30劃分成區域R5、R6,可易於且良好地分割廢材部30。In this way, even when the number of sub-dashed lines is three, by dividing the waste material portion 30 into regions R5 and R6, the waste material portion 30 can be divided easily and well.

又,在上述之實施形態1、2、變形例1、2,主劃線L及副劃線S1~S4係對基板10施加相同之負載,來形成垂直龜裂C、C1~C4,但是在別的變形例,係以在主劃線L與副劃線S1~S4使負載相異的方式形成劃線。In addition, in the above-mentioned Embodiments 1, 2, Modifications 1, and 2, the main scribing line L and the sub-scribing line S1 to S4 apply the same load to the substrate 10 to form the vertical cracks C, C1 to C4, but in In another modification, the scribing line is formed so that the load is different between the main scribing line L and the auxiliary scribing line S1 to S4.

在此情況,以將對基板10之劃線負載設定成副劃線S1~S4比主劃線L更大的方式形成副劃線S1~S4。In this case, the auxiliary scribing lines S1 to S4 are formed so that the scribing load on the substrate 10 is set to be larger than the main scribing line L.

因此,垂直龜裂C1~C4沿著副劃線S1~S4更圓滑且良好地滲透並伸展。而且,垂直龜裂C沿著主劃線L滲透並伸展。因此,將廢材部30劃分成複數個區域,並可圓滑且良好地分割。Therefore, the vertical cracks C1~C4 along the sub-scribing line S1~S4 are more smooth and penetrate and extend well. Moreover, the vertical crack C penetrates and spreads along the main scribe line L. Therefore, the waste material part 30 is divided into a plurality of regions, and can be divided smoothly and well.

此外,本發明之實施形態係在專利請求的範圍所示之技術性構想的範圍內可適當地進行各種的變更。In addition, the embodiments of the present invention can be appropriately modified in various ways within the scope of the technical concept shown in the scope of the patent claims.

1:分割裝置 3:移動機構(升降機構) 10:基板 20:製品部 30:廢材部 31,32,33:位置 35a,35b:位置 36a,36b:位置 37a,37b:位置 C:垂直龜裂 C1,C2,C3,C4:垂直龜裂 L:主劃線 L1:直線部 R1~R6:區域 S1~S4:副劃線1: Split device 3: Moving mechanism (lifting mechanism) 10: substrate 20: Product Department 30: Waste Materials Department 31, 32, 33: location 35a, 35b: location 36a, 36b: location 37a, 37b: location C: Vertical cracking C1, C2, C3, C4: vertical cracking L: main line L1: Straight line R1~R6: area S1~S4: Underline

[圖1] 係表示實施形態1之分割方法的流程圖。 [圖2] 係在實施形態1之分割方法使用之劃線裝置的模式圖。 [圖3] 圖3(a)、(b)係分別是表示應用實施形態1之分割方法的基板及分割裝置之一部分的模式圖。圖2(a)係基板及分割裝置的上視圖,圖2(b)係圖2(a)的側視圖。 [圖4] 圖4(a)~(c)係在模式上表示實施形態1之分割方法之過程的剖面圖。 [圖5] 圖5(a)、(b)係分別用以說明在根據實施形態1之分割方法分割基板時,垂直龜裂沿著劃線滲透並伸展的模式圖。圖5(a)係用以說明垂直龜裂之伸展方向的模式圖。圖5(b)係在模式上表示垂直龜裂在基板之厚度方向滲透之狀況的剖面圖。 [圖6] 係表示應用實施形態2的分割方法之廢材部之輪廓形狀的模式圖。 [圖7] 圖7(a)係表示應用變形例1的分割方法之在基板之廢材部的輪廓形狀及在廢材部所形成之副劃線的模式圖。圖7(b)係表示變形例1之分割方法的流程圖。 [圖8] 圖8(a)~(d)係表示在變形例1之分割方法的過程之廢材部的狀態及治具所抵接之位置的模式圖。 [圖9] 圖9(a)~(f)係在模式上表示變形例1之分割方法之過程的剖面圖。 [圖10] 圖10(a)~(f)係在模式上表示變形例1之分割方法之過程的剖面圖。 [圖11] 係在根據變形例1之分割方法分割基板時,用以說明主劃線及副劃線之垂直龜裂之滲透及伸展的模式圖。 [圖12] 圖12(a)~(d)係表示應用變形例2的分割方法之在基板之廢材部的輪廓形狀及在廢材部所形成之副劃線的模式圖。 [圖13] 係表示應用其他的變形例的分割方法之在基板之廢材部的輪廓形狀及在廢材部所形成之副劃線的模式圖。[Fig. 1] It is a flowchart showing the division method of the first embodiment. [Figure 2] is a schematic diagram of the scribing device used in the dividing method of the first embodiment. [Fig. 3] Figs. 3(a) and (b) are schematic diagrams respectively showing a part of a substrate and a dividing device to which the dividing method of Embodiment 1 is applied. Fig. 2(a) is a top view of a substrate and a dividing device, and Fig. 2(b) is a side view of Fig. 2(a). [Fig. 4] Fig. 4(a)~(c) are cross-sectional views schematically showing the process of the division method of the first embodiment. [Fig. 5] Figs. 5(a) and (b) are schematic diagrams respectively for explaining that when the substrate is divided according to the dividing method of the first embodiment, vertical cracks penetrate and extend along the scribe line. Fig. 5(a) is a schematic diagram for explaining the extension direction of the vertical crack. Fig. 5(b) is a cross-sectional view schematically showing the penetration of vertical cracks in the thickness direction of the substrate. [Fig. 6] is a schematic diagram showing the contour shape of the waste material part to which the dividing method of the second embodiment is applied. [FIG. 7] FIG. 7(a) is a schematic diagram showing the outline shape of the waste material portion of the substrate and the sub-scribing lines formed in the waste material portion by applying the dividing method of Modification Example 1. FIG. 7(b) is a flowchart showing the division method of Modification Example 1. FIG. [Fig. 8] Fig. 8(a) to (d) are schematic diagrams showing the state of the waste material portion and the position where the jig abuts in the process of the dividing method of Modification 1. [Figure 9] Figures 9(a) to (f) are cross-sectional views schematically showing the process of the division method of Modification 1. [Fig. 10] Figs. 10(a) to (f) are cross-sectional views schematically showing the process of the division method of Modification 1. [Fig. 11] It is a schematic diagram for explaining the penetration and extension of vertical cracks of the main scribing line and the sub-scribing line when the substrate is divided according to the dividing method of Modification 1. [Fig. 12] Fig. 12(a)~(d) are schematic diagrams showing the outline shape of the waste material portion of the substrate and the subscribed lines formed in the waste material portion using the dividing method of Modification 2. [Fig. 13] is a schematic diagram showing the outline shape of the waste material portion of the substrate and the sub-scribing line formed in the waste material portion by applying the division method of another modified example.

S11:劃線步驟 S11: marking step

S12:分割步驟 S12: Segmentation step

Claims (13)

一種分割方法,係從基板分割廢材部之分割方法,其特徵為: 包括: 劃線步驟,係形成:主劃線,係沿著該廢材部的輪廓形狀所形成;及副劃線,係在該廢材部內並被形成於與該主劃線相同的面; 分割步驟,係沿著該主劃線及該副劃線分割該基板; 在該劃線步驟,係該副劃線以在與該主劃線交叉之方向延伸,並在寬度方向劃分該廢材部之方式形成; 該分割步驟係包含分割之步驟,該分割之步驟係藉由使包含該副劃線之區域彎曲,使垂直龜裂沿著該副劃線伸展,而以分成藉該副劃線所劃分之複數個區域的方式分割該廢材部。A dividing method is a method of dividing the waste material part from the substrate, which is characterized by: include: The scribing step is to form: the main scribing line is formed along the contour shape of the waste material part; and the auxiliary scribing line is formed in the waste material part and is formed on the same surface as the main scribing line; The dividing step is to divide the substrate along the main scribing line and the sub-scribing line; In the scribing step, the auxiliary scribing line is formed in a way that extends in a direction intersecting the main scribing line and divides the waste material part in the width direction; The dividing step includes the step of dividing, and the step of dividing is to bend the area containing the sub-line to extend the vertical crack along the sub-line, and to divide into the plural number divided by the sub-line Divide the waste material section in a manner of three regions. 如請求項1之分割方法,其中該分割步驟係朝向該副劃線推壓與形成該副劃線之該廢材部的面相反側的面,並隔著該副劃線在至少2處推壓形成該副劃線之該廢材部的面。Such as the dividing method of claim 1, wherein the dividing step is to push the side opposite to the side of the waste material portion forming the auxiliary scribing line toward the auxiliary scribing line, and pushing at least two places across the auxiliary scribing line Press to form the side of the waste material portion of the secondary scribe line. 如請求項1之分割方法,其中該廢材部係從該基板之外周緣往該基板之內側的凹狀,並具有包含直線部與曲線部的輪廓形狀。According to the dividing method of claim 1, wherein the waste material portion is a concave shape from the outer periphery of the substrate to the inner side of the substrate, and has an outline shape including a straight portion and a curved portion. 如請求項3之分割方法,其中該分割步驟係包含分離步驟,該分離步驟係在使垂直龜裂沿著該副劃線伸展之狀態,向該基板之外側分離該廢材部。Such as the dividing method of claim 3, wherein the dividing step includes a separating step, and the separating step separates the waste material portion to the outside of the substrate in a state where the vertical crack is extended along the sub-scribing line. 如請求項1之分割方法,其中以朝向該主劃線之該副劃線的端部與該主劃線分開僅既定距離的方式形成該副劃線。Such as the dividing method of claim 1, wherein the sub-scribing line is formed in such a manner that the end of the sub-scribing line facing the main scribing line is separated from the main scribing line by only a predetermined distance. 如請求項5之分割方法,其中該副劃線係包含第1副劃線,該第1副劃線係被形成於該廢材部之在該寬度方向的中央附近。Such as the dividing method of claim 5, wherein the underline includes a first underline, and the first underline is formed near the center of the waste material portion in the width direction. 如請求項6之分割方法,其中 該副劃線係包含:第2副劃線與第該3副劃線,係被形成於隔著該第1副劃線之位置;及第4副劃線,係以與該第1副劃線、該第2副劃線以及該第3副劃線之各條相交的方式所形成; 該分割步驟係包含: 龜裂伸展步驟,係從與形成該第1副劃線之該廢材部的面相反的面側朝向該第1副劃線推壓該第1副劃線與該第4副劃線之交點;及 第1分割步驟,係從形成該第1副劃線之面側推壓2個區域,而分割該區域,該2個區域係被該第1副劃線、該基板之外周緣、該第2副劃線以及該第3副劃線包圍。Such as the division method of claim 6, where The sub-line includes: the second sub-line and the third sub-line, which are formed at the position separating the first sub-line; and the fourth sub-line, which is the same as the first sub-line. It is formed by the way in which each of the line, the second sub-line and the third sub-line intersect; The segmentation step includes: The crack extension step is to push the intersection of the first sub-scribing line and the fourth sub-scribing line from the side opposite to the surface of the waste material portion where the first sub-scribing line is formed toward the first sub-scribing line ;and The first dividing step is to press two areas from the side on which the first sub-scribing line is formed, and to divide the area. The two areas are divided by the first sub-scribing line, the outer periphery of the substrate, and the second sub-scribing line. Surrounded by the sub-line and the third sub-line. 如請求項6之分割方法,其中 該副劃線係包含:第2副劃線與第該3副劃線,係被形成於隔著該第1副劃線之位置;及第4副劃線,係以與該第1副劃線、該第2副劃線以及該第3副劃線之各條相交的方式所形成; 該分割步驟係包含: 龜裂伸展步驟,係從與形成該第1副劃線之該廢材部的面相反側朝向該第1副劃線推壓該第1副劃線與該第4副劃線之交點;及 第1分割步驟,係從形成該第1副劃線之面側推壓2個區域,而分割該區域,該2個區域係被該第1副劃線、該基板之外周緣、該第2副劃線、該第3副劃線以及該第4副劃線包圍。Such as the division method of claim 6, where The sub-line includes: the second sub-line and the third sub-line, which are formed at the position separating the first sub-line; and the fourth sub-line, which is the same as the first sub-line. It is formed by the way in which each of the line, the second sub-line and the third sub-line intersect; The segmentation step includes: The crack extension step is to push the intersection of the first sub-scribing line and the fourth sub-scribing line from the side opposite to the surface of the waste material portion where the first sub-scribing line is formed toward the first sub-scribing line; and The first dividing step is to press two areas from the side on which the first sub-scribing line is formed, and to divide the area. The two areas are divided by the first sub-scribing line, the outer periphery of the substrate, and the second sub-scribing line. Surrounded by the subline, the third subline, and the fourth subline. 如請求項7或8之分割方法,其中該第2副劃線及該第3副劃線係以從對該主劃線垂直之狀態傾斜的方式所形成。Such as the dividing method of claim 7 or 8, wherein the second sub-line and the third sub-line are formed in a manner inclined from a state perpendicular to the main line. 如請求項7或8之分割方法,其中以朝向該主劃線之該第2副劃線及該第3副劃線之各自的端部與該主劃線分開僅既定距離的方式形成該第2副劃線及該第3副劃線。Such as the dividing method of claim 7 or 8, wherein the second sub-line and the third sub-line facing the main line are separated from the main line by a predetermined distance from each end of the second sub-line. 2 underline and the third underline. 如請求項7或8之分割方法,其中以朝向該主劃線之該第4副劃線的端部與該主劃線分開僅既定距離的方式形成該第4副劃線。Such as the dividing method of claim 7 or 8, wherein the fourth sub-scribing line is formed in such a way that the end of the fourth sub-scribing line facing the main scribing line is separated from the main scribing line by only a predetermined distance. 如請求項7或8之分割方法,其中該分割步驟係包含第2分割步驟,該第2分割步驟係在該第1分割步驟之後,對在廢材部藉該第1分割步驟所分割之區域以外的區域,推壓形成該第1副劃線之該廢材部的面之至少2處而分割。For example, the dividing method of claim 7 or 8, wherein the dividing step includes a second dividing step, and the second dividing step is after the first dividing step, for the area divided by the first dividing step in the waste material part The other area is divided by pressing at least two of the surface of the waste material portion forming the first sub-line. 一種分割裝置,係沿著在基板所形成之劃線從該基板分割廢材部的分割裝置,其特徵為: 具有: 載置台,係載置該基板; 治具,係使該廢材部向厚度方向彎曲; 升降機構,係使該治具升降;以及 移動機構,係使該治具向該基板之面內方向移動; 該治具係包括: 第1治具,係推壓該廢材部之一側的面;及 第2治具,係推壓該廢材部之另一側的面; 該第1治具係被配置於該第2治具的外側。A dividing device is a dividing device that divides a waste material portion from the substrate along a scribe line formed on the substrate, and is characterized by: have: The mounting table is for mounting the substrate; The jig is to bend the waste material in the thickness direction; The lifting mechanism is used to lift the fixture; and The moving mechanism is to move the jig in the in-plane direction of the substrate; The fixture system includes: The first jig is to push the surface on one side of the waste material part; and The second jig is to push the other side of the waste material part; The first jig is arranged outside the second jig.
TW109136101A 2019-11-29 2020-10-19 Dividing method and dividing device the present invention provides dividing method and dividing device that can easily and well divide a waste material portion along a scribed line formed on a substrate TW202124304A (en)

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