TW202216398A - Dividing method and dividing device wherein capable of excellently dividing a substrate along a scribe line including a curved part - Google Patents

Abstract

A dividing method and a dividing apparatus is provided. The dividing method can satisfactorily divide a substrate along a scribe line including a curved part. The solution of the invention is to provide a dividing method of dividing the product portion F1 having a shape including the straight line part L12 and the curved part L11 from the substrate F by a scribe line L formed along the profile of the product portion F1, wherein the scribe line L has an external connected portion L2 extending toward the outer periphery of the substrate F; pressing the starting point position Q1 (S15) near the external connected portion L2 in the area of the waste material portion F2 outside the scribe line by the pressing means 30; and changing the pressing position of the pressing means 30 in a circumferential direction of the scribe line L within an area of the waste material portion F2 (S17).

Description

Dividing method and dividing device

The present disclosure relates to a dividing method and a dividing device for dividing a substrate along a scribe line.

Conventionally, cutting out the product portion of a brittle material substrate such as a glass substrate is performed by the following steps: a scribing step, which forms a scribe line on the surface of the substrate; and a dividing step, which divides the substrate along the scribe line.

The following Patent Document 1 discloses a dividing method for dividing a substrate by rolling a break bar along the scribe line while press-contacting a break bar in the vicinity of the scribe line. When the product part is rectangular, a scribe line is formed along four sides, and the dividing step according to the above-mentioned method is performed on each side. Thereby, the substrate is bent along the scribe lines on each side, and the substrate is divided along the scribe lines. [Preceding Patent Documents] [Patent Literature]

Patent Document 1: Patent No. 5129826

[The problem to be solved by the invention]

The contour of the product part includes a curved part such as a shape in which the corners of a rectangle are rounded. In this case, since the scribe line is formed along the outline of the product portion, the scribe line includes the curved portion. In this way, when the scribe line includes a curved portion, it is necessary to divide the substrate well along the curved portion without chipping or cracks occurring on the end face on the product portion side.

In view of this problem, an object of the present invention is to provide a dividing method and a dividing apparatus capable of dividing a substrate satisfactorily along a scribe line including a curved portion. [Means of Solving Problems]

A first aspect of the present invention relates to a method for dividing a divided substrate. The dividing method of this aspect is a dividing method for dividing a product portion having a shape including a straight portion and a curved portion from a substrate according to a scribe line formed along the outer shape of the product portion, the scribe line having a scribe line extending toward the outer periphery of the substrate. Circumscribed portion; press the starting point position near the outer portion in the area of the waste material portion outside the scribe line by pressing means; in the area of the waste material portion, change the pressing force of the pressing means in the circumferential direction of the scribe line Location.

According to the structure of this aspect, when the starting position is pressed by the pressing means, the crack at the starting position extends in the thickness direction of the substrate and reaches the back surface of the substrate, thereby causing separation of the product portion and the waste portion. Along with the movement of the pressing means, the cracks continuously extend along the pressing position pressed by the pressing means. In this configuration, the pressing position changes along the circumferential direction of the scribe line. Therefore, the cracks also extend along the circumferential direction of the scribe line. Thereby, the product part can be divided|segmented from a board|substrate.

Furthermore, in this way, since the cracks extend along the circumferential direction of the scribe line, when the scribe line has a curved portion, the pressing position also moves along the outer side of the curved portion, whereby the cracks smoothly follow the curved portion. Stretch out gradually. Therefore, chipping and cracks do not occur on the end surfaces of the straight portion and the curved portion of the product portion, and the product portion can be divided from the substrate in a good state.

In the dividing method of this aspect, the pressing position of the pressing means can be continuously moved in the circumferential direction of the scribe line from the starting point in the region of the waste material portion.

According to this configuration, since the crack continuously expands with the continuous movement of the pressing position, the crack can be smoothly extended along the scribe line. Therefore, the product portion can be divided in a better state from the substrate.

In the dividing method of this aspect, the pressing position can be moved along the curved portion of the scribed line at a lower speed than the speed at which the pressing position is moved along the straight portion of the scribed line.

According to this configuration, the speed at which the pressing means presses the vicinity of the curved portion is slower than the speed at which the other portion is pressed. As a result, the cracks are gradually extended in the curved portion, and the direction of extension of the cracks becomes the curved portion that is easy to follow the scribe line. Therefore, the division of the curved portion can be performed favorably. In addition, in the curved portion, since the crack can be prevented from extending beyond the scribed line, the end face of the product portion can be formed in a good state.

In the dividing method of this aspect, the pressing position of the pressing means can be moved intermittently in the circumferential direction of the scribe line from the starting point in the region of the waste material portion.

According to this configuration, according to this dividing method, also by appropriately adjusting the interval between the pressing positions, the cracks extended by pressing at each pressing position can be sequentially moved along the line by pressing at the next pressing position. The line stretches gradually. Thereby, the product part can be divided|segmented from a board|substrate along a scribe line.

In the dividing method of this aspect, the substrate is supported by the support member in the area of the product portion, and a space can be provided below the waste portion.

According to this configuration, when the substrate is placed on the support member, the waste material portion is in a state of protruding from the support member. Therefore, when the scrap portion is gradually divided by pressing, the scrap portion sags down to the lower space in sequence due to its own weight, and a force in the direction of opening the crack is generated at the split position. Therefore, the product portion can be more smoothly divided from the substrate along the scribe line.

In the dividing method of this aspect, the product portion has a shape in which the corners of a rectangle are rounded into an arc shape; the support member has a shape smaller than the shape of the product portion, and the corners of the rectangle are rounded into an arc shape; The curvature of the arc portion rounded at the corner of the support member may be set to be smaller than the curvature of the arc portion rounded at the corner of the product portion.

According to this configuration, since the curvature of the arc portion of the support member is smaller than the curvature of the arc portion of the product portion, the stress generated in the vicinity of the arc portion of the product portion is dispersed. Therefore, when dividing by pressing, excessive stress does not act on the vicinity of the arc portion of the product portion, so that the waste material portion can be favorably divided along the arc portion of the product portion. Thereby, chips and cracks are not generated on the end face of the product part, and the product part can be divided from the substrate in a better state.

In the dividing method of this aspect, the pressing means may be configured as a pressing member for pressing the waste material portion.

A second aspect of the present invention relates to a dividing apparatus for dividing a substrate. The dividing device of this form is a dividing device that divides a product part having a shape including a linear part and a curved part from a substrate according to a scribe line formed along the outer shape of the product part, and includes: a support member for supporting the product part; The pressing member presses the area of the scrap portion outside the scribe line; and the pressing position adjusting means is connected to the area of the scrap portion and changes the pressing position of the pressing member in the circumferential direction of the scribe line.

According to this configuration, the same effects as those of the first aspect are obtained.

In the dividing device of this aspect, the pressing position adjusting means may include: a moving mechanism for relatively moving the pressing member to the substrate; and a control unit for controlling the moving mechanism. The control portion may be configured to change the pressing position of the pressing member in the circumferential direction of the scribed line in the region of the scrap portion by controlling the moving mechanism.

According to this configuration, the pressing position of the pressing member can be adjusted by the control of the control unit. Thereby, the division|segmentation operation|movement of a product part can be performed smoothly.

In this case, the control portion may be configured to continuously move the pressing position of the pressing member in the circumferential direction of the scribe line in the region of the waste material portion.

Also, the control unit may be configured to set the speed at which the pressing member moves along the curved portion of the scribed line to be lower than the speed at which the pressing member moves along the linear portion of the scribed line.

In the dividing device of the present aspect, the pressing position adjusting means includes a lift mechanism that moves the plurality of pressing members arranged along the waste material portion toward and away from the substrate; it may be configured such that the plurality of When the pressing member is positioned above the substrate, the distances between the plurality of pressing members and the substrate are set so as to become longer along with the change of the position of the scribe line in the circumferential direction.

According to this configuration, when the lifting mechanism brings the plurality of pressing members close to the substrate, the pressing members with the shortest distance from the substrate come into contact with the substrate in order. Thereby, the pressing position moves intermittently along the circumferential direction of the scribe line. In this way, the pressing position can be changed in the circumferential direction of the scribe line by simply driving the lift mechanism linearly. Therefore, the substrate can be divided by a simple structure without requiring complicated control.

In the dividing apparatus of this aspect, the pressing position adjusting means includes a lift mechanism that moves the pressing member continuously arranged along the waste material portion toward and away from the substrate; it may be configured such that the pressing member When positioned above the substrate, the distance between the pressing member and the substrate is set so as to become longer as the position of the scribe line in the circumferential direction changes.

According to this configuration, when the elevating mechanism brings the pressing member closer to the substrate, the pressing member comes into contact with the substrate in order from the point where the distance from the substrate is short. Thereby, the pressing position moves continuously along the circumferential direction of the scribe line. In this way, the pressing position can be changed in the circumferential direction of the scribe line by simply driving the lift mechanism linearly. Therefore, the substrate can be divided by a simple structure without requiring complicated control.

In the dividing apparatus of this aspect, the support member may be configured to support the substrate in the area of the product portion, and to provide a space below the waste portion.

In this case, the support member may be configured to include a placing surface on which the substrate is placed, and a pedestal portion having a smaller cross-sectional area than the placing surface.

According to this configuration, when the waste material portion divided along the scribe line sags downward due to its own weight, it is allowed to sneak into the space of the level difference generated between the mounting surface and the pedestal portion. Thereby, since the divided waste material portion is prevented from being bent by hitting the side wall of the pedestal portion, unnecessary stress does not act on the substrate from the divided waste material portion. Therefore, the product portion can be favorably divided from the substrate.

In the dividing device of this form, the product portion has a shape in which the corners of a rectangle are rounded into a circular arc; the support member has a shape smaller than the shape of the product portion, and the corners of the rectangle are rounded into an arc; The curvature of the arc portion rounded at the corner of the support member may be configured to be smaller than the curvature of the arc portion rounded at the corner of the product portion.

The dividing device of this aspect may include: a scribing head for forming the scribe line; a support frame for supporting the area outside the product portion of the substrate; and a support frame driving unit for the first The support frame is driven between a position and a second position, wherein the first position supports the area outside the product portion, and the second position does not support the outside area of the product portion. The support frame driving unit may be configured to set the support frame to the first position when forming the scribe line, and to set the support frame to the second position when the waste material portion is divided.

According to this configuration, both the formation of the scribe line and the division of the waste material portion can be performed by a single dividing device.

In this case, the support frame is divided into a plurality of frame parts along the circumferential direction of the scribe line; the support frame drive part can be configured to correspond to the pressing position of the pressing member when dividing the waste material part The frame portion at the position is set to the second position from the first position.

According to this configuration, when starting to divide the scrap portion, the scrap portion is not supported by the support frame at the starting point in the circumferential direction, and is supported by the support frame at the end position in the circumferential direction. Therefore, when starting to divide the waste material portion, the end position adjacent to the start point position across the scribe line near the start point position is supported by the corresponding frame portion, and a pressing force is applied to the start point position. Thereby, the force in the opening direction is more effectively applied to the scribe line near the starting point position, and as a result, the scrap portion near the starting point position can be smoothly divided along the scribe line. [Effect of invention]

As described above, according to the present invention, it is possible to provide a dividing method and a dividing apparatus capable of dividing a substrate satisfactorily along a scribe line including a curved portion.

The effect and meaning of this invention will become clearer from the description of the embodiment shown below. However, the embodiment shown below is merely an example for carrying out the present invention, and the present invention is by no means limited to what is described in the following embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, X-axis, Y-axis, and Z-axis which are orthogonal to each other are denoted expediently. The Z-axis system represents above and below the vertical direction. Hereinafter, upper and lower mean the Z-axis positive side and the Z-axis negative side, respectively.

In addition, in the present embodiment, the moving table 2, the ball screw 5, the rail 11, and the motor 16 correspond to the "moving mechanism" described in the scope of the patent claim.

FIG. 1( a ) is a diagram schematically showing the configuration of the dividing device 1 .

The dividing device 1 is a so-called multi-head mounted scribing device. A multi-head mounted scribing device has two functions, a function of forming a scribe line on a substrate, and a function of dividing the substrate along the formed scribe line. In the present embodiment, this multi-head mounted scribing device is referred to as a "dividing device" for convenience of description.

The dividing apparatus 1 includes a mobile station 2 , a scribing head 3 and a separating head 4 . The moving table 2 is screwed with the ball screw 5 . The moving stage 2 is supported so as to be movable in the Y-axis direction by a pair of guide rails 6 . Driven by the motor, the ball screw 5 is rotated, whereby the moving table 2 is moved in the Y-axis direction along the pair of guide rails 6 .

On the upper surface of the moving table 2, a motor 7 is provided. The motor 7 rotates the upper table 8 in the XY plane and positions it at a predetermined angle. On the table 8, the support part 20 is arrange|positioned. On the upper surface of the support part 20, a negative pressure is applied by the suction part 51 (refer to FIG. 3). The substrate F is adsorbed and held on the upper surface of the support portion 20 by the adsorption portion 51 .

The substrate F may be, for example, a glass substrate, a low temperature baked ceramic, or a ceramic substrate such as a high temperature baked ceramic, a silicon substrate, a compound semiconductor substrate, a sapphire substrate, a quartz substrate, or the like. Moreover, the board|substrate F may adhere to the surface or inside, or contain the thin film or semiconductor material which is not a brittle material. In this embodiment, the dividing method is applied to a glass substrate, especially a thin glass substrate.

In addition, the substrate F may be a bonded substrate formed by bonding two substrates to each other. As such a substrate F, for example, a color filter (CF) is formed on one substrate, and a thin film transistor (TFT) is formed on the other substrate.

Each of the scribing head 3 and the separating head 4 has a built-in camera (not shown), and the camera is used to photograph the alignment marks formed on the substrate F. As shown in FIG. Moreover, the bridge 9 is built over the support|pillars 10a and 10b so that the moving table 2, the table 8, and the support part 20 may be bridged.

On the bridge 9, rails 11 are installed. The scribing head 3 and the separating head 4 are connected to the rails 11, respectively. The scribing head 3 and the separating head 4 are driven by the motors 15 and 16 (see FIG. 3 ), respectively, to slide on the rail 11, and thereby are set to move in the X-axis direction. In addition, the motor 15 is built in the scribing head 3 , and the motor 16 is also built in the separating head 4 .

The scribe head 3 forms scribe lines on the substrate F. As shown in FIG. The jig unit 13 to which the blade 12 is attached is attached to the joint portion 14 of the scribing head 3 . The separation head 4 divides the substrate F into a product part F1 and a waste part F2 along a scribe line formed on the substrate F by the scribe head 3 (see FIGS. 5( a ) to 6 ( a )). Like the scribing head 3, the separation head 4 is provided with the joint part 14. A pressing member 30 is attached to the joint portion 14 of the separation head 4 .

FIG.1(b) is a perspective view which shows the structure of the structure including the pressing member 30. FIG.

As shown in FIG. 1( b ), the pressing member 30 is attached to the joint portion 14 of the separation head 4 shown in FIG. 1( a ) in a state supported by the supporting member 31 . The pressing member 30 is a shaft-shaped member, and the lower end is formed into a hemispherical shape to constitute the pressing portion 32 .

FIGS. 2( a ) to ( c ) are schematic diagrams for explaining the structure of the support portion 20 , respectively. FIG. 2( a ) is a schematic view showing the state of the support portion 20 when a scribe line is formed. Fig. 2(b) is a schematic view showing the state of the support portion 20 at the start of the dividing operation. FIG.2(c) is a schematic diagram which shows the state of the support part 20 when the division|segmentation operation|movement is performed. In addition, in FIG.2(a)-(c), the part shown with oblique lines is the upper surface of the table 8. As shown in FIG.

As shown in FIG. 2( a ), the support portion 20 includes a support member 21 and a support frame 22 surrounding the outer side of the support member 21 . The support frame 22 is divided into a first frame portion 22a and a second frame portion 22b in the circumferential direction. The support member 21 is a rectangular plate-shaped member. The upper surface of the support member 21 is the mounting surface 21a on which the product part F1 (refer FIG.5(a)) of the board|substrate F is mounted. Five holes 23 are formed in the center portion of the mounting surface 21a. Through these holes 23 , a positive pressure or a negative pressure is applied to the substrate F by the suction part 51 (see FIG. 3 ).

Both the first frame portion 22a and the second frame portion 22b are plate-shaped members formed into an L-shape. The 1st frame part 22a and the 2nd frame part 22b are arrange|positioned so that the periphery of the support member 21 may be enclosed. At this time, the support member 21, the first frame portion 22a, and the second frame portion are formed so that the mounting surface 21a of the support member 21 is flush with the upper surface of each of the first frame portion 22a and the second frame portion 22b. 22b.

When forming a scribe line on the substrate F, as shown in FIG. 2( a ), the support member 21 , the first frame portion 22 a and the second frame portion 22 b are arranged on the upper surface of the table 8 . The board|substrate F is mounted on the upper surface of the mounting surface 21a of the support member 21 in this state, the 1st frame part 22a, and the 2nd frame part 22b. At this time, a negative pressure is applied to the substrate F by the suction portion 51 (see FIG. 3 ), whereby the substrate F is sucked and held by the support member 21 . The scribe line is formed on the outer side of the support member 21, that is, in the region of the first frame portion 22a and the second frame portion 22b.

In this way, after the scribe line is formed on the substrate F, as shown in FIG. Then, the pressing member 30 of the separation head 4 (see FIG. 1( b )) presses the substrate F at the position of the end portion on the positive side of the X axis of the first frame portion 22 a, and further, from this position to the end portion on the negative side of the Y axis position, the substrate F is continuously pressed along the shape of the first frame portion 22a.

Furthermore, before the pressing member 30 reaches the position on the negative side of the Y-axis of the first frame portion 22a, as shown in FIG. 2(c), the second frame portion 22b descends to the upper surface of the second frame portion 22b and The upper surface of the table 8 is the same position. Then, the pressing member 30 continuously presses the substrate F along the shape of the second frame portion 22b from the position of the end portion on the negative side of the X-axis to the position of the end portion on the positive side of the Y-axis of the second frame portion 22b. Thereby, the division|segmentation of the board|substrate F along the scribe line is complete|finished. The method of dividing the substrate F along the scribe line will be described in detail later with reference to FIGS. 5( a ) to 6 ( b ).

FIG. 3 is a block diagram showing the configuration of the dividing device 1. As shown in FIG.

As shown in FIG. 3 , the dividing device 1 includes a control unit 50 , a suction unit 51 , a support frame drive unit 52 , a scribing head drive unit 53 , and a separation head drive unit in addition to the configuration of FIGS. 1( a ) and ( b ) part 54 and the mobile station drive part 55 .

The control unit 50 includes an arithmetic processing circuit such as a CPU, or a memory such as a ROM, a RAM, and a hard disk. The control part 50 controls each part according to the program memorize|stored in the memory.

The suction part 51 applies a positive pressure or a negative pressure to the substrate F placed on the support member 21 . The support frame drive unit 52 moves the first frame portion 22a and the second frame portion 22b up and down. The scribing head driving unit 53 drives the scribing head 3 by driving the motor 15 . The separation head drive unit 54 drives the separation head 4 by driving the motor 16 . The moving table driving unit 55 moves the moving table 2 in the Y-axis direction by driving the ball screw 5 shown in FIG. 1( a ).

Next, the division of the substrate F using the dividing device 1 will be described using the flowcharts of FIGS. .

FIG. 4( a ) is a flowchart showing the operation of the dividing device 1 . FIGS. 5( a ) and ( b ) are schematic views showing the state of the substrate F before being divided. FIGS. 5( c ) and ( d ) are schematic views of the substrate F when the starting point position Q1 is pressed. FIGS. 6( a ) and ( b ) are schematic views of the substrate F when it is divided along the scribe line L. FIG.

5( a ), ( c ), and FIG. 6( a ) are schematic views of the case where the substrate F and the support portion 20 are viewed from the Z-axis positive side, and FIGS. 5( b ), ( d ) and 6 ( b ) ) is a side view viewed from the positive side of the X-axis.

As shown in FIG. 4( a ), in step S11 , the control unit 50 raises and lowers the first frame portion 22 a and the second frame portion 22 b to the upper surface of the table 8 via the support frame drive portion 52 . Thereby, the support part 20 becomes the state shown to FIG.2(a).

In this state, the substrate F before forming the scribe line is placed on the upper surface of the support portion 20 by a transfer means such as a robot arm, and the size of the substrate F is substantially equal to the upper surface of the support portion 20 . In step S12, the control part 50 generates a negative pressure in the suction part 51, and makes the support member 21 suction the board|substrate F. Instead of the robot arm, the user may place the substrate F on the support portion 20 .

As shown in FIG.5(a), the board|substrate F has a rectangular shape in plan view, and is divided into the product part F1 and the waste part F2. The product part F1 is arrange|positioned inside the board|substrate F. Here, the shape of the product part F1 in the plan view is a shape in which the corners of the rectangle are rounded, and in FIG. 5( a ), the area surrounded by the scribe line L1 corresponds. The product portion F1 has a circular arc portion at a position corresponding to a corner of the rectangle.

The shape of the support member 21 in the support portion 20 (the shape of the placement surface 21a) is the same as the shape of the product portion F1, and the corners of the rectangle are rounded. The support member 21 has a circular arc portion at a position corresponding to the corner of the rectangle. The curvature of the arc portion of the support member 21 is smaller than the curvature of the arc portion of the product portion F1. In addition, the dimension of the support member 21 is smaller than the dimension of the product part F1.

The substrate F is placed on the support member 21 so that each arc portion of the product portion F1 is arranged in the vicinity of the respective arc portions of the support member 21, and the center portion of the product portion F1 and the center portion of the support member 21 are made to overlap. . In this way, when the substrate F is placed on the support member 21, the outer peripheral portion of the product portion F1 and the waste portion F2 are placed on the upper surfaces of the first frame portion 22a and the second frame portion 22b.

In this state, the control part 50 applies a negative pressure to the board|substrate F from the adsorption|suction part 51 as mentioned above. Thereby, the substrate F is attracted by the support member 21 and held by the support member 21 . Therefore, the substrate F is not displaced from the support member 21 .

Returning to FIG. 4( a ), in step S13 , the control unit 50 forms a scribe line L on the substrate F. As shown in FIG. The scribe line L is formed along the outer periphery of the product part F1. At this time, the control unit 50 controls the scribing head driving unit 53 and the moving table driving unit 55 to relatively move the scribing head 3 with respect to the substrate F in the X-axis direction and the Y-axis direction. Thereby, the blade 12 of the scribing head 3 moves two-dimensionally on the substrate F, and a scribe line L is formed on the surface of the substrate F. As shown in FIG.

In the formation of the scribing line L, the positioning of the substrate F is performed by the camera built in the scribing head 3 . Furthermore, when the position P1 indicated by the black circle in FIG. 5( a ) is set as the starting position for forming the scribing line L, the control unit 50 positions the scribing head 3 at the position P1 by the scribing head driving unit 53 right above. At this time, as shown in FIG.5(b), the board|substrate F is supported by the support member 21 which comprises the support part 20, the 1st frame part 22a, and the 2nd frame part 22b.

Then, the control unit 50 moves the blade 12 relative to the substrate F along the shape of the product portion F1 to form a scribe line L1 after bringing the blade 12 into contact with the substrate F under a predetermined load.

In this way, when the scribe line L1 is formed, that is, when the scribe head 3 is relatively moved along the shape of the product portion F1 and is positioned at the position P1 again, the control unit 50 causes the blade 12 to extend from the position P1 to the outer periphery of the substrate F. The position P2 (in the position shown by the white circle in FIG. 5( a )) moves linearly. Thereby, the external part L2 is formed between the position P1 and the position P2 which passes through the position P1 and is located on the extension line of the scribe line L1.

In this way, the scribe line L includes a scribe line L1 along the outer periphery of the product portion F1 and an outer portion L2 extending from the scribe line L1 to the outer periphery of the substrate F. In addition, in the scribe line L1, the four curved portions L11 correspond to the four circular arc portions of the product portion F1, and the four straight portions L12 correspond to the four straight portions of the product portion F1.

Then, in step S14, the control part 50 controls the support frame drive part 52, and lowers the 1st frame part 22a. Thereby, the support part 20 will be in the state shown in FIG.2(b). The board|substrate F is supported by the support part 20 in the state shown to FIG.5(b). The vicinity of the circumscribing portion L2 is not supported by the first frame portion 22a, but is only supported by the second frame portion 22b.

Next, in step S15 , the control unit 50 positions the separation head 4 at the starting point position Q1 of FIG. 5( c ) by the separation head driving unit 54 . The starting point position Q1 is the position indicated by the white triangle in FIG. 5( c ), and is positioned in the vicinity of the positive side of the Y-axis with respect to the circumscribed portion L2 of the scribed line L in the area of the scrap portion F2. Then, the control unit 50 controls the separation head 4 so that the pressing member 30 presses the starting point position Q1 with a predetermined load. In this way, when the pressing member 30 presses the starting point position Q1, the crack at the end portion on the outer peripheral side of the circumscribed portion L2 extends in the thickness direction of the substrate F and reaches the back surface of the substrate F, and further the crack extends toward the inner side of the circumscribed portion L2. , and the vicinity of the starting point position Q1 of the scrap portion F2 is divided from the substrate F. As shown in FIG.

At this time, the vicinity of the circumscribed portion L2 is as shown in FIG. 5( d ), and since the scrap portion F2 on the negative side of the Y-axis of the circumscribed portion L2 is supported by the second frame portion 22 b , the circumscribing portion L2 is pressed by the pressing member 30 . On the positive side of the Y-axis, a force in the direction of opening the crack is efficiently applied to the outer portion L2. Thereby, the crack smoothly spreads from the edge part on the outer peripheral side of the circumscribed part L2 to the circumscribed part L2, and the vicinity of the starting point position Q1 of the scrap part F2 is divided|segmented from the board|substrate F well.

In this way, when the vicinity of the starting point position Q1 is divided, the control unit 50 controls the support frame driving unit 52 in step S16 to lower the second frame unit 22b. Thereby, the support part 20 becomes the state shown in FIG.2(c). The board|substrate F is supported by the support part 20 in the state shown in FIG.6(b). In addition, after the vicinity of the starting point position Q1 is divided, the control part 50 may make the pressing member 30 separate from the board|substrate F once.

Then, in step S17 , the control unit 50 controls the separation head drive unit 54 and the moving table drive unit 55 to relatively move the separation head 4 along the scribe line L in the area of the waste material portion F2 . Thereby, the pressing position of the pressing member 30 with respect to the board|substrate F moves along the waste material part F2, and the waste material part F2 is divided|segmented from the board|substrate F along with this movement.

When specifically describing the division of the substrate F by the separation head 4, in step S15, the pressing member 30 positioned at the starting position Q1 in FIG. 6(a) moves from the starting position Q1 to the position Q2 at step S17. The position Q2 is shown in Fig. 6(a) by a black triangle mark. Along with this movement, the cracks reaching the back surface of the substrate F at the end on the positive side of the X-axis of the circumscribed portion L2 extend in the negative direction of the X-axis along the circumscribed portion L2. Then, when the pressing member 30 reaches the position Q2, the pressing member 30 is in a state still pressing the scrap portion F2, and further moves in the circumferential direction along the scribe line L1 in the region of the scrap portion F2. This moving direction is indicated by a dotted arrow in Fig. 6(a). Along with this movement, the cracks generated in the circumscribed portion L2 extend from the circumscribed portion L2 to the straight portion L12 of the scribe line L1, and the scrap portion F2 is divided along the straight portion L12.

In this manner, when the pressing member 30 moves about one circle in the circumferential direction along the scribe line L1 in the area of the scrap portion F2 and reaches the position Q3, the scrap portion F2 is divided over the entire circumference of the scribe line L1. Thereby, the division|segmentation of the board|substrate F is complete|finished. The position Q3 is shown in Fig. 6(a), indicated by a white square symbol, and is located on the outer portion L2.

As described above, with the movement of the pressing member 30, the cracks extend from the outer portion L2 to the scribe line L1 with the starting point position Q1 as the starting point, and further extend along the scribe line L1, so that the waste can be smoothly divided from the substrate F. The material part F2 is formed, and the product part F1 can be cut out from the substrate F smoothly.

In this way, when the division of the substrate F by the pressing member 30 is completed, the control unit 50 controls the suction unit 51 to apply a positive pressure to the substrate F in step S18. Thereby, the product part F1 is released from the adsorption|suction with the support member 21, and can be removed from the support member 21. FIG. Then, the product part F1 is collected by a transfer means such as a robot arm. In this way, a series of operations related to the division of the substrate F by the division device 1 is completed.

In addition, in step S17 of FIG. 4( a ), it is preferable to control the moving speed of the pressing member 30 so that the curved portion L11 of the scribe line L1 is slower than the straight portion L12 . Thereby, the curve part L11 can be divided|segmented more smoothly.

In addition, it is preferable that the movement locus of the pressing member 30 in the portion corresponding to the curved portion L11 of the scribe line L1 is set so that the center of rotation coincides with the curved portion L11. In other words, the curvature of the curved portion of the movement locus of the pressing member 30 is set to be smaller than the curvature of the curved portion L11. Thereby, the extension direction of a crack is easy to follow the curve part L11.

FIG.4(b) is a flowchart which shows the movement control of the pressing member 30 with respect to the board|substrate F. FIG.

In step S21, the control part 50 moves the pressing member 30 in the circumferential direction of the waste material part F2 from the starting point position Q1 with a predetermined load. At this time, in step S22, the control unit 50 firstly moves the pressing member 30 relative to the substrate F at the first speed. Thereby, the pressing member 30 relatively moves at the first speed along the outer portion L2 from the starting point position Q1 to the position Q2 as shown in FIG. 6( a ), and further, in the area of the waste material portion F2 The linear portion L12 along the scribe line L1 from the position Q2 relatively moves at the first speed.

In step S23, the control part 50 determines whether the pressing member 30 has reached the vicinity of the curve part L11 of the scribe line L1. When the pressing member 30 reaches the vicinity of the curved portion L11 of the scribe line L1 (S23: YES), the control unit 50 switches the moving speed of the pressing member 30 to a second speed lower than the first speed (S24).

Then, in step S25, the control unit 50 determines whether or not the pressing member 30 has passed the vicinity of the curved portion L11. When the pressing member 30 has not passed the vicinity of the curve portion L11 ( S25 : NO), the moving speed of the pressing member 30 is maintained at the second speed ( S24 ).

Then, when the pressing member 30 passes the vicinity of the curved portion L11 ( S25 : YES), the control unit 50 returns the process to step S22 and switches the moving speed of the pressing member 30 from the second speed to the first speed. Thereby, the pressing member 30 moves at the first speed along the straight line portion L12 after passing through the curved portion L11.

Next, in step S26, the control unit 50 executes the same processing as described above until it is determined that the pressing member 30 has reached the position Q3. In this case, the position Q3 is the end point of the movement of the pressing member 30 . Thereby, the pressing member 30 moves along the straight line L12 of the scribe line L1 in the region of the scrap portion F2 at the first speed, and also moves along the straight line L12 of the scribe line L1 at the first speed slower than the first speed. 2 speed, moves in the area of the waste material part F2, and when the pressing member 30 reaches the position Q3 in this way (S26: YES), the control part 50 completes the process of FIG. 4(b). Thereby, the division|segmentation process of the board|substrate F in step S17 of Fig.4 (a) is complete|finished.

In this way, in the present embodiment, when the pressing member 30 relatively moves along the scribe line L within the area of the waste material portion F2, it passes the vicinity of the curved portion L11 and passes the vicinity of the straight line portion L12 according to the situation. In this case, the relative moving speed of the pressing member 30 is switched. As a result, cracks can be relaxedly extended in the curved portion L11, and the curved portion L11 can be divided smoothly and favorably.

In addition, the table 8 may be rotated according to the needs of the operation of the above-mentioned dividing device 1 .

In the above, the dividing device 1 is shown in which the scribing head 3 and the separating head 4 move in the X-axis direction, and the moving table 2 moves in the Y-axis direction, and rotates, but the dividing device 1 is as long as the scribing head 3 can be moved. And the configuration in which the separation head 4 relatively moves the substrate F two-dimensionally in the in-plane direction of the XY plane is sufficient. For example, the scribing head 3 and the separating head 4 may be fixed, and the moving table 2 may be moved in the X-axis and Y-axis directions. <Effect of the embodiment>

According to this embodiment, the following effects are obtained.

As shown in FIGS. 4( a ) and 5 ( a ) to 6 ( b ), when the starting point position Q1 is pressed by the pressing member 30 , the cracks extend in the thickness direction of the substrate F at the starting point position Q1 , and the division of the substrate F occurs. . Along with the movement of the pressing member 30 , the product portion F1 is gradually separated from the substrate F along the pressing position pressed by the pressing member 30 . In this configuration, the pressing position changes along the circumferential direction of the scribe line L. Therefore, the cracks also extend along the circumferential direction of the scribe line L. As shown in FIG. Thereby, the product part F1 can be divided|segmented from the board|substrate F.

In addition, since the cracks extend in the circumferential direction of the scribe line L in this way, when the scribe line L has the curved portion L11, the pressing position also moves along the outer side of the curved portion L11, whereby the cracks along the The curved portion L11 extends smoothly and gradually. Therefore, the product part F1 can be divided from the substrate F in a good state without chipping or cracks occurring on the end surfaces of the straight part L12 and the curved part L11 of the product part F1.

As shown in Fig. 4(a), (b), Fig. 5(a) to Fig. 6(b), since the crack extends continuously with the continuous movement of the pressing position, the crack can be made along the cut Line L stretches smoothly. Therefore, the product part F1 can be divided|segmented from the board|substrate F in a more favorable state.

Generally, when the thickness of the brittle material substrate is reduced, when the substrate is bent along the curved shape, wrinkles gather, and excessive stress tends to act on the curved portion. Therefore, when the shape of the corner portion of the product portion is curvilinear, when the corner portion is folded, the crack may extend in a direction deviating from the scribe line, for example, toward the product portion side.

However, according to the present embodiment, as shown in FIGS. 4( a ), ( b ), and FIGS. 5( a ) to 6 ( b ), the speed at which the pressing member 30 presses the vicinity of the curve portion L11 is higher than when pressing the other Partially slow. As a result, the crack gradually spreads in the curved portion L11, and the direction of extension of the crack is likely to follow the curved portion L11 of the scribe line L. As shown in FIG. Therefore, the division|segmentation of the curve part L11 can be performed favorably. Moreover, in the curved part L11, since a crack can be prevented from spreading to the product part F1 side, the edge part of the product part F1 can be made into a favorable state.

As shown in FIGS. 2( c ) and 5( a ) to 6 ( b ), when the substrate F is placed on the support portion 20 , the waste material portion F2 is in a state of protruding from the support member 21 . Therefore, when the waste material portion F2 is gradually divided by pressing, the waste material portion F2 sags downward in order by its own weight, and a force in the direction of opening the crack is generated at the dividing position. Therefore, the product portion F1 can be more smoothly divided from the substrate F along the scribe line L.

In addition, in this way, a force in the direction of opening the crack is generated at the dividing position of the substrate F, and the crack is continuous along the scribe line L. As shown in FIG. Therefore, the cracks extend along the scribe line L without deviating from the area of the waste material portion F2 or the area of the product portion F1. As a result, the scrap portion F2 is removed from the substrate F in a connected state without being divided in the middle. Thereby, generation|occurrence|production of a chip|tip and a crack is suppressed in the edge surface of the product part F1 which is also the boundary of the product part F1 and the waste material part F2, and the quality of the product part F1 becomes favorable.

As shown in FIGS. 2( c ) and 5 ( a ) to 6 ( b ), since the curvature of the arc portion of the support member 21 (the mounting surface 21 a ) is smaller than the curvature of the arc portion of the product portion F1 , Therefore, the stress generated in the vicinity of the arc portion of the product portion F1 is dispersed. Therefore, when dividing by pressing, excessive stress does not act on the vicinity of the arc portion, so that the scrap portion F2 can be favorably divided along the arc portion of the product portion F1. Thereby, a chip|tip or a crack does not generate|occur|produce in the end surface of the product part F1, and the product part F1 can be divided|segmented from the board|substrate F in a more favorable state.

As shown in FIGS. 1( a ) and 3 to 4 ( b ), the pressing position of the pressing member 30 can be adjusted by the control of the control unit 50 . Thereby, the division|segmentation operation|movement of the product part F1 can be performed smoothly. <Example of change>

The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications can be made to the embodiments of the present invention.

In addition, in the following modification, the board|substrate which also divides object is the board|substrate F like the above-mentioned embodiment, and the shape of the product part F1 and the waste part F2 is also the same. [Modification 1]

FIG. 7( a ) is a perspective view showing the configuration of the dividing apparatus 100 according to Modification 1. FIG.

The dividing apparatus 100 of Modification 1 is an apparatus for dividing the substrate F on which the scribe line L1 and the circumscribed portion L2 are formed in advance as shown in FIG. 5( a ) along the circumscribed portion L2 and the scribe line L1 . That is, the dividing apparatus 100 does not have a structure for forming a scribe line on the substrate F, but only has a structure for dividing the board F along the scribe line.

As shown in FIG. 7( a ), the dividing device 100 includes an elevating mechanism 110 , a support portion 120 , a frame member 130 , and a pressing member 140 . 7(b), the pressing member 140 is demonstrated. Moreover, in the dividing apparatus 100 of the modification 1, a user manually sets the board|substrate F in the dividing apparatus 100, and operates the pressing member 140.

The elevating mechanism 110 is installed on the installation table 101 serving as a base. The elevating mechanism 110 is fastened to the rectangular plate portion 111, and three holes are formed which are arranged in the X-axis direction. Among these three holes, a linear bush 112 is provided in each of the two holes other than the hole 111a located at the center in the X-axis direction. In each linear bush 112, the tie shaft 113 passes through.

A fixing ring 114 is attached to the upper part of each shaft 113, respectively. A screw hole (not shown) is formed at the lower end of each shaft 113, respectively. In addition, biasing members 115 are respectively provided so as to cover the circumference of each shaft 113 . Each biasing member 115 is locked so that the upper end is sandwiched by the fixing ring 114 and the lower end is sandwiched by the linear bush 112 .

The screw shaft of the screw 116 is inserted into the hole 111a located at the center in the X-axis direction. The lower end of the screw shaft is in contact with the upper surface of the support body 117 .

The support body 117 is formed in a shape drilled from the rectangular plate member except for the Y-axis positive side edge portion 117a, the X-axis positive side edge portion 117b, and the X-axis negative side edge portion 117c. The edge portion 117a and the edge portions 117b and 117c are provided with a slight level difference. The width of the step in the Z-axis direction corresponds to the width of the frame member 130 in the thickness direction. The lower end portion of the screw shaft of the aforementioned screw 116 is in contact with the end edge portion 117 a of the support body 117 .

Moreover, in the edge part 117a of the support body 117, two screw holes 117d are formed (refer to FIG. 8). In these screw holes 117d and the screw holes (not shown) formed in the lower ends of the above-mentioned shafts 113, screws (not shown) are inserted from below. Thereby, the support body 117 and each shaft 113 are connected.

The plate portion 111 is supported by a pair of support plates 119 , and the pair of support plates 119 are respectively disposed on the positive side and the negative side of the X-axis of the seat 118 . In this way, the elevating mechanism 110 is constructed.

The support portion 120 integrally includes a support member 121 , a pedestal portion 122 and a plate portion 123 . The plate portion 123 is provided on the table 101 a on the upper surface of the installation table 101 .

The upper surface of the support member 121 becomes the mounting surface 121a of the board|substrate F. As in the above-described embodiment, holes 124 are formed on the placement surface 121a, and the holes 124 are used to impart air to the substrate F by means of a suction part not shown.

The shape of the support member 121 in the support portion 120 (the shape of the mounting surface 121a) is the same as that of the above-described embodiment. That is, the corners are rounded like the shape of the product portion F1. The support member 121 has a circular arc portion at a position corresponding to an angle. The curvature of the arc portion of the support member 121 is smaller than the curvature of the arc portion of the product portion F1, and the size of the support member 121 is smaller than that of the product portion F1.

The pedestal portion 122 is formed in a substantially rectangular shape. The cross-sectional area of the pedestal portion 122 when cut along a plane parallel to the XY plane is formed to be smaller than that of the support member 121 .

The frame member 130 is a member that forms a large opening in the central portion of the rectangular plate member. The end edges of the frame member 130 on the positive side and the negative side of the X-axis are placed on the end edges 117b and 117c of the support body 117 , respectively, and the end edges on the positive side of the Y axis of the frame member 130 are placed on the support body 117 . The edge portion 117a. At this time, the frame member 130 is placed so as to be fitted to the end edge portion 117a of the support body 117 and the step difference between the end edge portions 117b and 117c. In this state, the corners of the frame member 130 on the positive side and the negative side of the X-axis are fixed to the support body 117 with screws. Thereby, the frame member 130 is fixed to the support body 117 .

FIG. 7( b ) is a perspective view showing the configuration of the pressing member 140 .

As shown in FIG. 7( b ), the pressing member 140 is composed of a holding portion 141 and a pressing portion 142 . The grip portion 141 is an elongated cylindrical member, and a pressing portion 142 is provided at the lower end. The pressing portion 142 is a shaft-shaped member, and the lower end portion is formed into a hemispherical shape like the pressing portion 32 of the above-described embodiment. When the user divides the substrate F, the user holds the grip portion 141 of the pressing member 140 and presses the substrate F with the lower end portion of the pressing portion 142 .

Next, the division|segmentation of the board|substrate F using the division apparatus 100 is demonstrated.

FIG. 8 is a perspective view showing the configuration of the dividing apparatus 100 when the substrate F is divided. In addition, in FIG. 8, the board|substrate F is shown with oblique lines.

As shown in FIG. 8, when dividing the board|substrate F using the dividing apparatus 100, a user places the board|substrate F on which the scribe line L1 (refer FIG.5(a)) was formed on the mounting surface 121a of the support member 121. Next, the user operates the operation part not shown, and applies negative pressure to the substrate F through the hole 124 by the suction part not shown. The method of mounting the board|substrate F is the same as that of the above-mentioned embodiment (refer FIG.5(a)). This corresponds to the processing of step S12 in the flowchart of Fig. 4(a) in the above-mentioned embodiment.

Then, the user adjusts the vertical position of the frame member 130 . When the user pushes the frame member 130 downward, the support body 117 and the frame member 130 are lowered against the bias of the biasing member 115 . At this time, the user lowers the frame member 130 to a desired load from the pressing portion 142 when the step between the grip portion 141 and the pressing portion 142 of the pressing member 140 is brought into contact with the inner peripheral edge of the frame member 130 . The tip acts on the position of the substrate F (adjustment position). In this state, the user tightens the screw 116 so that the lower end of the screw is in contact with the upper surface of the support body 117 . Thereby, the frame member 130 is locked at the above-mentioned adjustment position by the bias of the biasing member 115 .

After adjusting the height position of the frame member 130 , the user presses the substrate F by the pressing portion 142 of the pressing member 140 . Specifically, the pressing portion 142 is moved along the scribe line L1 from the position Q2 of the substrate F (see FIG. 6( a )) in the circumferential direction of the scribe line L1 . At this time, the user moves the pressing member 140 while moving the step of the pressing member 140 along the side wall of the opening of the frame member 130 .

That is, as shown in FIG. 6( a ), the user moves the pressing member 140 from the position Q2 and moves in the circumferential direction along the scribe line L1 in the vicinity of the scribe line L1 in the area of the scrap portion F2 . The pressing portion 142 of the pressing member 140 follows this trajectory by moving the pressing member 140 while the step of the pressing member 140 is along the side wall of the opening of the frame member 130 . When the pressing member 140 (the pressing portion 142 ) is positioned at the position Q3 (see FIG. 6( a )), the division of the substrate F is completed. This corresponds to the processing of step S17 of Fig. 4(a).

When the division of the substrate F is completed, the user operates the operation part to release the adsorption of the substrate F by the mounting surface 121a (support member 121 ) of the not-shown adsorption part, and collects the substrate F. This corresponds to the processing of step S18 of Fig. 4(a).

In this way, a series of processing related to the division of the substrate F by the division apparatus 100 ends.

In the case of Modification 1, as in the above-mentioned embodiment, the user may change the moving speed of the pressing member 140 according to the position of F pressed by the pressing portion 142 (in the area of the waste material portion F2). That is, the moving speed when the user moves the pressing member 140 along the curved portion L11 of the scribe line L1 is slower than the moving speed when the user moves the pressing member 140 along the straight portion L12 of the scribe line L1. Thereby, the same effect as FIG. 4(b) of the above-mentioned embodiment can be achieved.

FIG. 9 is a perspective view showing the configuration of the support portion 120 in Modification 1. FIG.

As shown in FIG. 9 , the support portion 120 includes a support member 121 , a base portion 122 and a plate portion 123 . As shown in the description with reference to FIG. 7( a ), the support portion 120 has a cross-sectional area of the base portion 122 when cut on a plane parallel to the XY plane, and is formed to be smaller than that of the mounting surface 121 a. The four corners of the plate portion 123 are fixed to the table 101 a in FIG. 7 by screws, whereby the support portion 120 is fixed to the installation table 101 .

FIG. 10( a ) is a schematic view for explaining the state of the substrate F when the substrate F is divided. FIG. 10( b ) is a diagram showing the state of the substrate F when the substrate F is divided.

When the substrate F is divided using the support portion 120 shown in FIG. 10( a ), especially the support member 121 and the pedestal portion 122 , the substrate F is placed on the placement surface 121 a of the support member 121 .

When the user operates the pressing member 140 and moves it while pressing the substrate F (in the area of the waste material portion F2) along the scribe line L1 (refer to FIG. 6(a) ), at the starting point position Q1 (refer to FIG. The resulting cracks continue to expand. As a result, the portion of the waste material portion F2 that was first pressed and divided by the pressing portion 142 is deformed along with the deformation of the portion of the waste material portion F2 that is pressed later, and the divided waste material portion F2 is constantly sagging downward. .

At this time, as shown in FIG. 10( b ), since a level difference occurs in the Z-axis direction between the support member 121 and the pedestal portion 122 , the scrap portion F2 hangs down so as to submerge into the back side of the support member 121 .

In this way, in the configuration of Modification 1, when the waste material portion F2 divided along the scribe line L1 hangs down, it is allowed to sneak into the space created by the step difference between the support member 121 and the base portion 122 . Thereby, since the end surface of the divided scrap portion F2 is prevented from colliding with the side wall of the pedestal portion 122 and being bent, unnecessary stress does not act on the substrate F from the divided scrap portion F2. Therefore, the product part F1 can be divided|segmented from the board|substrate F favorably. [Modification 2]

FIG. 11 is a perspective view showing the configuration of the dividing apparatus 100 according to Modification 2. FIG.

As shown in FIG. 11 , the dividing device 100 includes an elevating mechanism 110 , a support portion 120 , a frame member 150 , and a pressing member 160 . The frame member 150 and the pressing member 160 of the dividing device 100 of the modified example 2 are different from the frame member 130 and the pressing member 140 of the modified example 1. Since the other configuration is the same as that of Modification 1, the description is omitted. In addition, in FIG. 11, the board|substrate F is abbreviate|omitted.

The frame member 150 is formed so as to provide an opening in the center of the plate-shaped member as in the frame member 130 of the modification 1. However, the frame member 150 of Modification 2 is thicker than the frame member 130 of Modification 1, and the area of the opening formed in the central portion is small. The frame member 150 is installed on the support body 117 in the same state as the frame member 130 of the first modification.

Further, in the frame member 150, a plurality of screw holes 150a are formed along the circumference of the opening. In each of these screw holes 150a, the pressing member 160 is fixed with a screw. In the pressing member 160, a screw groove is formed on the shaft portion. The tip end of the pressing member 160 is spherical and protrudes toward the Z-axis negative side.

FIG. 12 is a perspective view of a state in which the pressing member 160 is attached to the frame member 150 as viewed from the Z-axis negative direction.

The several pressing members 160 are arrange|positioned in the position which can press in the area|region of the waste material part F2 of the board|substrate F. That is, the plurality of pressing members 160 are attached to the frame member 150 so as to be aligned along the region of the waste material portion F2 of the substrate F when the substrate F is in a state supported by the support portion 120 . In addition, the plurality of pressing members 160 are provided so that their protruding amounts from the frame member 150 are different from each other. Specifically, when the substrate F is supported by the support portion 120 and the pressing member 160 is positioned above the substrate F, the distance between the plurality of pressing members 160 and the substrate F (in the area of the waste portion F2 ) is accompanied by the scribe line L1 The plurality of pressing members 160 are set on the frame member 150 so that the position in the circumferential direction becomes longer. The protruding amount of each pressing member 160 is adjusted by the screwing amount of the pressing member 160 to the frame member 150 .

In the state of FIG. 11 , the height positions (positions in the Z-axis direction) of the support body 117 and the frame member 150 are adjusted so that the pressing member 160 with the largest protruding amount is separated from the surface of the substrate F placed on the support member 121 by only a given distance. The height positions of the support body 117 and the frame member 150 are adjusted by the protruding amount of the screw 116 as in the above-mentioned embodiment.

In this state, the user places the substrate F on the support portion 120 (the placement surface 121a of the support member 121 ), and then operates the suction portion (not shown), so that the support member 121 absorbs the substrate F. Then, the user pushes the frame member 150 downward to lower the plurality of pressing members 160 together with the frame member 150 . Thereby, the pressing member 160 with the shortest distance from the surface of the substrate F (the surface of the scrap portion F2 ) first comes into contact with the scrap portion F2, and then, the respective pressing members 160 are placed in the order of the shortest distance from the scrap portion F2. It abuts against the scrap portion F2. Thereby, the pressing position of the pressing member 160 with respect to the waste material portion F2 is intermittently moved along the circumferential direction of the scribe line L1.

At this time, the pressing position moves along the trajectory shown by the dotted line in FIG. 6( a ). In this way, the protruding amounts of the plurality of pressing members 160 are adjusted so that the pressing positions vary. Thereby, as in the case of FIG. 6( a ), first, the cracks at the outer peripheral edge of the circumscribed portion L2 extend in the thickness direction of the substrate F, and then the cracks extend along the circumscribed portion L2 . Then, when the next pressing position is pressed, the fissure spreads toward the linear portion L12 of the scribe line L1, and further, with the movement of the pressing position, the fissure gradually spreads along the scribe line L1. In this way, when the pressing position is around the vicinity of the outer portion L2, the cracks extend over the entire circumference of the scribe line L1, and the waste portion F2 is divided from the substrate F.

In this way, in the configuration of Modification 2, only by driving the frame member 150 linearly by the elevating mechanism 110, the pressing position of the pressing member 160 can be changed in the circumferential direction of the scribe line L1. Therefore, the substrate F can be divided by a simple structure without requiring complicated control.

In addition, the interval between the adjacent pressing members 160 is adjusted so that the cracks generated by the pressing of one pressing member 160 on the scribe line L1 will be pressed by the adjacent pressing members 160 to the scribe near the pressing position. The interval at which the line L1 stretches.

Here, the frame member 150 is moved up and down manually, but the frame member 150 may be raised and lowered by a drive mechanism such as a motor or a pneumatic cylinder as a drive source. In this case, for example, the drive mechanism is configured so as to raise and lower the two spindles 113 at the same time. In addition, the driving mechanism may control the speed when the pressing position moves in the vicinity of the curved portion L11 of the scribe line L1 to be proportional to the speed when the pressing position moves in the vicinity of the straight portion L12 of the scribe line L1, as in the above-described embodiment. slower. In addition, in the case where the frame member 150 is raised and lowered manually as described above, the user may change the lowering speed of the frame member 150 to realize the same operation as the control. [Modification 3]

13 is a perspective view of the configuration of the frame member 170 and the pressing member 180 of the dividing device 100 of Modification 3 as viewed from the negative side of the Z-axis.

In the dividing apparatus 100 of the modification 3, the tie frame member 170 and the pressing member 180 are different from the frame member 130 and the pressing member 140 of the modification 1. Since the other configuration of the modification 3 is the same as the modification, the description is omitted. The configuration of the dividing apparatus 100 is the same as that of FIG. 11 . The frame member 170 of FIG. 13 is attached to the support body 117 in place of the frame member 150 of FIG. 11 .

As shown in FIG. 13 , the frame member 170 has the same shape as the frame member 150 of the second modification. In the frame member 170 of Modification 3, two screw holes 170a are formed in the vicinity of the four corners of the opening portion, respectively. A bolt 182 is fastened to each screw hole 170a with a screw.

At the head ends of the eight bolts 182, the pressing portion 181 is fixed by a fixing means such as an adhesive. The pressing portion 181 has a shape in which an elongated continuous plate-shaped member is bent into a frame shape. In a plan view, the pressing portion 181 is looped in a rail shape. The protrusion amounts of the eight bolts 182 from the frame member 170 are different from each other. Specifically, in a state where the substrate F is attached to the support member 121 of FIG. 11 and the pressing portion 181 is positioned above the substrate F, the distance between the lower end of the bolt 182 and the substrate F (in the area of the scrap portion F2 ) is set. The length of the scribe line L1 is increased according to the change of the position in the circumferential direction.

By adjusting the protruding amounts of the eight bolts 182 in this way, the distance between the pressing portion 181 and the substrate F also increases with the change in the position of the scribe line L1 in the circumferential direction. Therefore, when the frame member 170 is attached to the dividing device 100 of FIG. 11 and the frame member 170 is manually lowered, the pressing portion 181 comes into contact with the substrate F in order from the position where the distance from the substrate F is short.

In a plan view, the pressing portion 181 is arranged along the area of the waste material portion F2 of the substrate F. As shown in FIG. The end of the pressing portion 181 with the shortest distance from the waste material portion F2 is positioned at the starting point position Q1 in FIG. 6(a), and from this position, along the dotted arrow in FIG. The distance gradually becomes longer. Therefore, when the user manually lowers the frame member 170, the pressing portion 181 gradually comes into contact with the waste material portion F2 along the dotted arrow from the starting point position Q1 in Fig. 6(a). Thereby, the pressing position continuously moves along the circumferential direction of the scribe line L1.

In this way, when the pressing position is continuously moved, the cracks generated in the vicinity of the starting point position Q1 extend along the scribe line L1. The substrate F is divided along the scribe line L1 by the crack extending over the entire circumference of the scribe line L1.

In this way, also in Modification 3, only by manually lowering the frame member 170 linearly, the pressing position of the pressing portion 181 on the scrap portion F2 can be changed in the circumferential direction of the scribe line L1. Therefore, the substrate F can be divided by a simple structure without requiring complicated control. In addition, in the structure of the modification 3, it differs from this modification 2, and the pressing position with respect to the waste material part F2 of the pressing part 181 changes continuously along the waste material part F2. Therefore, the crack can be extended more smoothly along the scribe line L1.

In addition, in Modification 3, as in Modification 2, the frame member 170 may be moved up and down by the drive mechanism. In addition, the raising and lowering of the frame member 170 may be controlled so that the moving speed of the pressing position in the vicinity of the curved portion L11 is controlled to be slower than the moving speed of the pressing position in the vicinity of the straight portion L12. Thereby, the division|segmentation of the curve part L11 can be performed favorably. <Other Changes>

In the above-mentioned embodiment, the pressing position of the pressing member 30 is continuously changed along the waste material portion F2 under the control of the control unit 50 . However, the control part 50 may change the pressing position of the pressing member 30 intermittently along the waste material part F2.

In this case, in the region of the waste material portion F2, a plurality of pressing positions are set along the scribe line L1. The control unit 50 controls the separation head driving unit 54 and the moving table driving unit 55 so that these pressing positions are sequentially pressed by the pressing member 30. Specifically, the control unit 50 moves the pressing member 30 along the waste material portion F2. While the pressing member 30 is moved between adjacent pressing positions, the pressing member 30 is lifted by the separating head 4 to separate the pressing member 30 from the waste material portion F2.

According to this control, the waste material portion F2 is intermittently pressed in the circumferential direction by the pressing member 30 as in the second modification. Thereby, the crack can be extended along the circumscribed part L2 and the scribe line L1, and the board|substrate F can be divided along the scribe line L1.

In addition, in the above-mentioned embodiment, when the substrate F is divided, the first frame portion 22a and the second frame portion 22b descend in order, but when the substrate F is divided, the first frame portion 22a and the second frame portion 22b may be decreased at the same time.

In this case, unlike the above-described embodiment, when the starting point position Q1 is pressed by the pressing member 30, the substrate F is not supported by the second frame portion 22b. Therefore, when the starting point position Q1 is pressed, the position of the scrap portion F2 on the opposite side of the starting point position Q1 via the circumscribing portion L2 also moves downward together with the starting point position Q1. It is difficult for the directional force to act on the outer portion L2. Therefore, when the first frame portion 22a and the second frame portion 22b are lowered simultaneously when the substrate F is divided, there is a possibility that the formation of cracks on the outer portion L2 is slightly worse than that in the above-described embodiment.

Therefore, in order to spread the crack more favorably at the outer portion L2, as in the above-mentioned embodiment, when the starting point position Q1 is pressed, only the first frame portion 22a is separated from the substrate F, and the second frame portion 22b is used to separate the first frame portion 22a. It is preferable to support the substrate F in advance. In addition, the sequence of separating the second frame portion 22b from the substrate F may not necessarily be as shown in the above-mentioned embodiment, and the sequence before the pressing member 30 starts to move from the starting position Q1 may be as long as the pressing position of the pressing member 30 enters the first Any timing before the frame portion 22b may be used.

In addition, the method of retracting the first frame portion 22a and the second frame portion 22b from the substrate F is not limited to the method of lowering the first frame portion 22a and the second frame portion 22b as in the above-mentioned embodiment, for example, The first frame portion 22a and the second frame portion 22b may be retracted from the substrate F by sliding the first frame portion 22a and the second frame portion 22b in a direction parallel to the XY plane.

In addition, in the above-described embodiment, the shapes of the first frame portion 22a and the second frame portion 22b constituting the support portion 20 are formed into an L-shape, but the shapes of the first frame portion 22a and the second frame portion 22b are not limited to L-shaped.

FIG. 14( a ) is a schematic view showing the configuration of the support portion 40 of the dividing device in another modified example. FIG.14(b) is a schematic diagram which shows the structure of the support part 40 when the board|substrate F is mounted. FIG. 14( c ) is a schematic view showing the configuration of the substrate F and the support portion 40 when the pressing member 30 presses the substrate F. FIG. In addition, in FIG.14(b), in order to demonstrate the arrangement|positioning of the 2nd frame part 41b, the movement locus of the pressing member 30 on the board|substrate F is shown by a phantom line.

As shown in FIG. 14( a ), the support portion 40 includes a support frame 41 arranged to surround the entire circumference of the support member 21 . The support frame 41 is composed of a first frame portion 41a and a rectangular second frame portion 41b, and the second frame portion 41b is arranged to constitute a part of the first frame portion 41a. A more detailed arrangement of the second frame portion 41 b is shown in FIG. 14( b ), and when the substrate F is placed on the support portion 40 , it is arranged so as to be able to support the opposite side (Y) to the starting point position Q1 via the circumscribing portion L2 The position of the substrate F on the negative side of the axis), and further, if it does not interfere with the movement of the pressing member 30 .

The formation of the scribe line L of the substrate F supported by the support portion 40 and the division of the substrate F are performed in accordance with the same procedures as in the above-described embodiment. Here, in the above-mentioned embodiment, in the flowchart of FIG. 4(a), in step S16, since the pressing member 30 is moved, the second frame portion 22b is moved up and down. However, in the support part 40, as mentioned above, the 2nd frame part 41b is arrange|positioned at the position which does not interfere with the movement locus of the pressing member 30. Therefore, the process of step S16 in FIG. 4( a ) is not performed, and as shown in FIG. 14( c ), the pressing member 30 can be moved in a state where the second frame portion 41 b is arranged on the table 8 .

14( a ) to ( c ), the shape of the second frame portion 41 b is shown as a rectangle, but as long as the pressing member 30 presses the starting point position Q1 , the second frame portion 41 b can support the starting point position Q1 via the circumscribed portion L2 The shape of the substrate F on the opposite side (Y-axis negative side) may be sufficient.

In this modification 2, the pressing member 160 is arranged on the frame member 150 by screwing, but the pressing member 160 may be arranged by a method other than screwing. For example, a shaft-shaped pressing member 160 may be pressed into a hole formed in the frame member 150 and attached to the pressing member 160 . Alternatively, a plurality of pressing members 160 may be integrally formed on the lower surface of the frame member 150 . The bolt 182 of the modification example 3 can also be changed similarly.

In addition, the structure of the dividing apparatus 1 shown in Embodiment 1 can be suitably changed from the structure of FIG.1(a). For example, the dividing device 1 may be configured by omitting the scribing head 3 from the configuration shown in FIG. 1( a ). In this case, the formation of the scribe line L1 and the external portion L2 of the substrate F may be performed by another scribing device.

In addition, the arrangement method of the pressing members 160 in Modification 2 is not limited to the arrangement method shown in FIG. 12 . For example, the interval between the adjacent pressing members 160 or the number of the pressing members 160 to be arranged may be changed from the interval and the number shown in FIG. 12 . In addition, the diameters of the pressing members 160 may not necessarily be the same, and a plurality of types of pressing members 160 having different diameters may be arranged along the scrap portion F2.

In addition, the configuration of each pressing member shown in the above-described embodiment and Modifications 1 to 3 may be appropriately changed. For example, in the above-mentioned Embodiment and Modifications 1 and 2, the tip end of the pressing member is spherical, but the tip end of the pressing member may be an ellipse, or other shapes such as a shape in which the tip end of a cone is rounded.

In addition, in the above-mentioned embodiment, the pressing member 30 may be formed in a cylindrical shape, and may be rolled on the waste material portion F2.

In addition, the shape of the product part F1 is not limited to the shape shown in the above-mentioned Embodiment and Modifications 1-3, for example, other shapes which have a linear part and a curved part may be sufficient. For example, the shape of the product part F1 may be a shape in which the corners of a square or a trapezoid are rounded into an arc shape. Also in this case, in the region surrounding the waste material part F2 of the product part F1, what is necessary is just to press the waste material part F2 so that a pressing position may move in the circumferential direction.

Furthermore, in the above-described embodiment, the substrate F is directly mounted on the mounting surface 21a of the support member 21, but a sheet such as an elastic body may be interposed between the substrate F and the mounting surface 21a. In this case, when the scribe line L is formed on the substrate F, it can be laid on the placement surface 21 a of the support member 21 . In this sheet, the air from the hole 23 formed in the mounting surface 21a is circulated to the substrate F. As shown in FIG.

On the mounting surface 21a of the support member 21, minute irregularities are generated. When a sheet is laid between the substrate F and the mounting surface 21a, the sheet absorbs such minute irregularities, so that the substrate F can be mounted on the mounting surface 21a in parallel with the horizontal plane. Therefore, since the substrate F can be stably mounted, the scribe line L can be accurately formed, and the substrate F can be divided along the scribe line L.

In the above-described embodiment, the substrate F is divided by pressing the substrate F by the pressing member 30, but the substrate F may be pressed by, for example, ejecting a fluid such as air from a nozzle.

In addition, the embodiment of the present invention can be appropriately modified in various ways within the scope of the technical concept shown in the scope of the claims.

1: Split device 2: Mobile station (mobile mechanism) 5: Ball screw (moving mechanism) 4: Separation head (moving mechanism) 11: Track (moving mechanism) 16: Motor (moving mechanism) 21,121: Supporting members 21a, 121a: Mounting surface 30, 140, 160, 180: Pressing member (pressing means) 41: Support frame 50: Control Department 54: Separation head drive part (pressing position adjustment means) 55: Moving table drive part (pressing position adjustment means) 100: Dividing device 110: Lifting mechanism 122: Pedestal Department F: substrate F1: Product Department F2: Scrap Department L: dash L1: Scribe L2: External part L11: Curve part L12: Straight line Q1: Starting point position

[FIG. 1] FIG. 1(a) is a schematic diagram showing a dividing apparatus according to Embodiment 1. [FIG. FIG.1(b) is a perspective view which shows the structure of the pressing member used for the division|segmentation apparatus of Embodiment 1. FIG. [ Fig. 2] Fig. 2(a) to (c) are schematic views for explaining the configuration of the support portion of the dividing device according to the embodiment, respectively. Fig. 2(a) is a schematic view showing the state of the support portion at the time of forming the scribe line. Fig. 2(b) is a schematic view showing the state of the support portion at the start of the dividing operation. Fig. 2(c) is a schematic view showing the state of the support portion when the dividing operation is performed. [FIG. 3] FIG. 3 is a block diagram showing the configuration of the dividing apparatus according to Embodiment 1. [FIG. [ Fig. 4] Fig. 4(a) is a flowchart showing a method of dividing a substrate using the dividing apparatus of the first embodiment. Fig. 4(b) is a flow chart showing the division of the substrate shown in Fig. 4(a) in detail. [ Fig. 5] Fig. 5(a) is a schematic view showing the state of the substrate before being divided in the dividing apparatus according to the first embodiment. Fig. 5(b) is a side view of the base plate and support member of Fig. 5(a). Fig. 5(c) is a schematic view of the substrate when the starting point position is pressed in the dividing device of the first embodiment. Fig. 5(d) is a side view of the base plate and support member of Fig. 5(c). [ Fig. 6] Fig. 6(a) is a schematic view of the substrate at the time of dividing along the scribe line in the dividing device of the first embodiment. Fig. 6(b) is a side view of the base plate and support member of Fig. 6(a). [ Fig. 7] Fig. 7(a) is a perspective view showing the configuration of a dividing device according to Modification 1. [Fig. FIG.7(b) is a perspective view which shows the structure of the pressing member of the dividing apparatus in the modification 1. FIG. [ Fig. 8] Fig. 8 is a perspective view showing the configuration of a dividing device according to Modification 1. [Fig. [ Fig. 9] Fig. 9 is a perspective view showing a configuration of a support member of the dividing device according to Modification 1. [Fig. [ Fig. 10] Fig. 10(a) is a schematic view showing a state before the substrate is divided in the dividing device of Modification 1. [Fig. Fig. 9(b) is a schematic view showing the state of the substrate when the substrate is divided in the dividing device of Modification 1. [ Fig. 11] Fig. 11 is a perspective view showing the configuration of a dividing device according to Modification 2. [Fig. [ Fig. 12] Fig. 12 is a perspective view showing a configuration of a pressing member of a dividing device according to Modification 2. [Fig. [ Fig. 13] Fig. 13 is a perspective view showing a configuration of a pressing member of a dividing device according to Modification 3. [Fig. [ Fig. 14] Fig. 14(a) is a schematic view showing the configuration of the support portion of the dividing device in another modified example. Fig. 14(b) is a schematic view showing the structure of the support portion when the substrate is placed on the dividing device according to another modification. Fig. 14(c) is a schematic view showing the structure of the substrate and the support portion when the substrate is divided by the pressing member in the dividing device of another modified example.

S11: The first frame part and the second frame part rise

S12: Adsorption

S13: Formation of scribe lines

S14: The first frame part is lowered

S15: Press the starting point position

S16: The second frame part is lowered

S17: Divide along the scribe line

S18: Desorption

S21: Move the pressing member in the circumferential direction from the starting position

S22: move at 1st speed

S23: Have you reached the curve part?

S24: move at 2nd speed

S25: Have you passed the curve section?

S26: Have you reached the end?

Claims (18)

A dividing method is a dividing method for dividing a product part having a shape of a linear part and a curved part from a substrate according to a scribe line formed along the outer shape of the product part, characterized by: The scribe line has an outer portion extending toward the outer periphery of the substrate; Press the starting position near the outer part in the area of the waste material part outside the scribe line by pressing means; In the area of the waste material portion, the pressing position of the pressing means is changed in the circumferential direction of the scribe line. The dividing method of claim 1, wherein the pressing position of the pressing means is continuously moved in the circumferential direction of the scribe line from the starting point in the region of the waste material portion. The dividing method of claim 2, wherein the pressing position is moved along the curved portion of the scribe line at a lower speed than the speed at which the pressing position is moved along the straight portion of the scribe line. The dividing method according to any one of claims 1 to 3, wherein the pressing position of the pressing means is intermittently moved in the circumferential direction of the scribe line from the starting point in the region of the waste material portion. The dividing method of any one of claims 1 to 3, wherein the substrate is supported by a support member in the area of the product portion, and a space is provided below the waste portion. As in the method of division of claim 5, wherein The product part has a shape in which the corners of a rectangle are rounded into a circular arc; The support member is smaller than the shape of the product portion, and the corners of the rectangle are rounded into an arc shape; The curvature of the arc portion rounded at the corner of the support member is smaller than the curvature of the arc portion rounded at the corner of the product portion. The dividing method according to any one of claims 1 to 3, wherein the pressing means is a pressing member for pressing the waste material portion. A dividing device is a dividing device for dividing a product part having a shape of a linear part and a curved part from a substrate according to a scribe line formed along the outer shape of the product part, characterized by comprising: a support member supporting the product portion; a pressing member that presses the area of the scrap portion outside the scribe line; and The pressing position adjusting means is attached to the area of the waste material portion, and changes the pressing position of the pressing member in the circumferential direction of the scribe line. The dividing device of claim 8, wherein The pressing position adjustment means includes: a moving mechanism for moving the pressing member relatively to the substrate; and a control part, which controls the moving mechanism; The control part changes the pressing position of the pressing member in the circumferential direction of the scribe line in the area of the waste material part by controlling the moving mechanism. The dividing device according to claim 9, wherein the control portion continuously moves the pressing position of the pressing member in the area of the waste material portion in the circumferential direction of the scribe line. The dividing device of claim 10, wherein the control section sets the speed at which the pressing member moves along the curved portion of the scribe line to be lower than the speed at which the pressing member moves along the straight portion of the scribe line. The dividing device of claim 8, wherein The pressing position adjusting means is provided with a lifting mechanism, and the lifting mechanism causes the plurality of pressing members arranged along the waste material portion to approach and separate from the substrate; When the plurality of pressing members are positioned above the substrate, the distances between the plurality of pressing members and the substrate are set so as to become longer as the position of the scribe line in the circumferential direction changes. The dividing device of claim 8, wherein The pressing position adjusting means includes a lift mechanism for moving the pressing member continuously arranged along the waste material portion toward and away from the substrate; When the pressing member is positioned above the substrate, the distance between the pressing member and the substrate is set so as to become longer as the position of the scribe line in the circumferential direction changes. The dividing device of any one of claims 8 to 13, wherein the support member supports the substrate in the area of the product portion; A space is provided below the waste material portion. The dividing device of claim 14, wherein The support member system includes: a mounting surface on which the substrate is mounted; and The pedestal portion has a smaller cross-sectional area than the mounting surface. The dividing device of any one of claims 8 to 13, wherein The product part has a shape in which the corners of a rectangle are rounded into a circular arc; The support member is smaller than the shape of the product portion, and the corners of the rectangle are rounded into an arc shape; The curvature of the rounded portion at the corner of the support member is smaller than the curvature of the rounded portion at the corner of the product portion. The dividing device of any one of claims 8 to 13, wherein include: a scribe head for forming the scribe; a support frame for supporting the area outside the product portion of the substrate; and The support frame driving part drives the support frame between a first position and a second position, and the first position supports the outer area of the product part, and the second position does not support the outer area of the product part ; The support frame driving unit sets the support frame at the first position when forming the scribe line, and sets the support frame at the second position when dividing the waste material portion. The dividing device of claim 17, wherein The support frame is divided into a plurality of frame parts along the circumferential direction of the scribe line; The support frame driving part sets the frame part at the position corresponding to the pressing position of the pressing member from the first position to the second position when dividing the waste material part.

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