JP2022034846A - Parting method and parting device - Google Patents

Abstract

To provide a parting method and a parting device capable of satisfactorily parting a substrate along a scribe line including a curved part.SOLUTION: A parting method has a process where a product part F1 with a shape including a straight part L12 and a curved part L11 is parted from a substrate F by a scribe line L formed along the outer shape of the product part F1. The scribe line L has a circumscription part L2 extending to the outer circumference of the substrate F, a starting point position Q1 in the vicinity of the circumscription part L2 in the region of an end material part F2 in the outside of the scribe line L is pressed by pressing means 30 (S15), and the pressing position by the pressing means 30 is changed to the circumferential direction of the scribe line L in the region of the end material part F2 (S17).SELECTED DRAWING: Figure 4

Description

The present invention relates to a dividing method and a dividing device for dividing a substrate along a scribe line.

Conventionally, cutting out a product portion of a brittle material substrate such as a glass substrate is performed by a scribe step of forming a scribe line on the surface of the substrate and a break step of dividing the substrate along the scribe line.

The following Patent Document 1 discloses a method for dividing a substrate by rolling a break bar along a scribe line while pressing a break bar in the vicinity of the scribe line. When the product part is rectangular, a scribe line is formed along the four sides, and the dividing step by the above method is performed for each side. As a result, the substrate is curved along the scribe lines on each side, and the substrate is divided along the scribe lines.

Japanese Patent No. 5129826

The outline of the product part may include a curved part such as a shape in which the corners of a rectangle are rounded. In this case, since the scribe line is formed along the contour of the product portion, the scribe line includes the curved portion. As described above, when the scribe line includes a curved portion, it is necessary to satisfactorily divide the substrate along the curved portion without causing chipping or cracking on the end face on the product portion side.

In view of such problems, it is an object of the present invention to provide a dividing method and a dividing device capable of satisfactorily dividing a substrate along a scribe line including a curved portion.

The first aspect of the present invention relates to a dividing method for dividing a substrate. The division method according to this aspect is a method of dividing a product portion having a shape including a straight portion and a curved portion from a substrate by a scribe line formed along the outer shape of the product portion. Has an circumscribed portion extending to the outer periphery of the substrate, presses the starting point position near the circumscribed portion in the region of the end material portion outside the scribe line by the pressing means, and presses the pressing position by the pressing means. , Within the region of the scrap portion, the scribe line is changed in the circumferential direction.

According to the configuration according to this aspect, when the starting point position is pressed by the pressing means, the crack at the starting point position extends in the thickness direction of the substrate and reaches the back surface of the substrate, so that the product part and the end material part are separated. .. As the pressing means moves, cracks grow one after another along the pressing position pressed by the pressing means. In this configuration, the pressing position changes along the circumferential direction of the scribe line. Therefore, the crack also extends along the circumferential direction of the scribe line. As a result, the product part can be separated from the substrate.

Further, since the crack extends along the circumferential direction of the scribe line in this way, even when the scribe line has a curved portion, the pressing position moves along the outside of the curved portion, so that the scribe line moves along the curved portion. The cracks grow smoothly. Therefore, the product portion can be separated from the substrate in a good condition without chipping (chipping) or cracking on the end faces of the straight portion and the curved portion of the product portion.

In the dividing method according to this aspect, the pressing position by the pressing means can be continuously moved from the starting point position to the circumferential direction of the scribe line in the region of the scrap portion.

According to this configuration, since the cracks are continuously extended with the continuous movement of the pressing position, the cracks can be smoothly extended along the scribe line. Therefore, the product part can be separated from the substrate in a better state.

In the dividing method according to the present embodiment, the pressing position can be moved along the curved portion of the scribe line at a speed lower than the speed at which the pressing position is moved along the straight portion of the scribe line.

According to this configuration, the speed at which the pressing means presses the vicinity of the curved portion is slower than that of the other portions. As a result, the crack gradually extends in the curved portion, and the extending direction of the crack becomes easy to follow the curved portion of the scribe line. Therefore, the curved portion can be satisfactorily divided. Further, in the curved portion, it is possible to prevent the crack from extending to a portion other than the scribe line, so that the end face of the product portion can be formed in a good state.

In the dividing method according to this aspect, the pressing position by the pressing means can be intermittently moved from the starting point position to the circumferential direction of the scribe line in the region of the scrap portion.

According to this configuration, even with such a pressing method, by appropriately adjusting the interval between the pressing positions, the cracks extended by the pressing at each pressing position are sequentially formed into a scribe line by the pressing at the next pressing position. It can be extended along. As a result, the product part can be separated from the substrate along the scribe line.

In the dividing method according to this aspect, the substrate may be supported by a support member in the region of the product portion, and a space may be provided below the end material portion.

According to this configuration, when the substrate is placed on the support member, the end material portion is in a state of protruding from the support member. As a result, when the end material portion is divided by pressing, the end material portion sequentially hangs down to the lower space due to its own weight, and at the divided position, a force in the direction of opening a crack is generated. Therefore, the product part can be more smoothly separated from the substrate along the scribe line.

In the dividing method according to this aspect, the product part has a shape in which the corners of the rectangle are rounded in an arc shape, the support member is smaller than the shape of the product part, and the corners of the rectangle are in the shape of an arc. The curvature of the arc portion having a rounded shape and having the corners rounded in the support member may be set to be smaller than the curvature of the arc portion having the rounded corners in the product portion.

According to this configuration, since the arc portion of the support member has a smaller curvature than the arc portion of the product portion, the stress generated in the vicinity of the arc portion of the product portion is dispersed. Therefore, when the product is divided by pressing, excessive stress is not applied to the vicinity of the arc portion of the product portion, and therefore, the scrap portion can be satisfactorily divided along the arc portion of the product portion. As a result, the product part can be separated from the substrate in a better state without chipping or cracking at the end face of the product part.

In the dividing method according to this aspect, the pressing means may be configured to be a pressing member for pressing the end material portion.

A second aspect of the present invention relates to a dividing device that divides a substrate. The dividing device according to this embodiment is a dividing device for dividing a product portion having a shape including a straight portion and a curved portion from a substrate by a scribe line formed along the outer shape of the product portion. The supporting member to be supported, the pressing member that presses the region of the outer end material portion of the scribe line, and the pressing position by the pressing member are changed in the circumferential direction of the scribe line within the region of the end material portion. It is provided with a pressing position adjusting means.

According to this configuration, the same effect as that of the first aspect is obtained.

In the dividing device according to this embodiment, the pressing position adjusting means may include a moving mechanism for moving the pressing member relative to the substrate, and a control unit for controlling the moving mechanism. The control unit may be configured to change the pressing position by the pressing member in the region of the scrap material portion in the circumferential direction of the scribe line by controlling the moving mechanism.

According to this configuration, the pressing position of the pressing member can be adjusted by the control by the control unit. As a result, the division operation of the product part can be smoothly performed.

In this case, the control unit may be configured to continuously move the pressing position by the pressing member in the region of the scrap portion in the circumferential direction of the scribe line.

Further, the control unit may be configured to set the speed at which the pressing member is moved along the curved portion of the scribe line to be lower than the speed at which the pressing member is moved along the straight portion of the scribe line. ..

In the dividing device according to this embodiment, the pressing position adjusting means includes an elevating mechanism for bringing a plurality of the pressing members arranged along the scrap portion closer to and away from the substrate, and the plurality of pressing members are provided. When the member is located above the substrate, the distance between the plurality of pressing members and the substrate may be set to increase as the position of the scribe line changes in the circumferential direction.

According to this configuration, when the elevating mechanism brings a plurality of pressing members close to the substrate, the pressing members having the shortest distance from the substrate are brought into contact with the substrate in order. As a result, the pressing position moves intermittently along the circumferential direction of the scribe line. In this way, the pressing position can be changed in the circumferential direction of the scribe line simply by driving the elevating mechanism linearly. Therefore, the substrate can be divided with a simple configuration without the need for complicated control.

In the dividing device according to this embodiment, the pressing position adjusting means includes an elevating mechanism for bringing the pressing member continuously arranged along the end material portion closer to and away from the substrate, and the pressing member. Can be configured such that the distance between the pressing member and the substrate increases with a change in the circumferential position of the scribe line when is located above the substrate.

According to this configuration, when the elevating mechanism brings the pressing member closer to the substrate, the pressing member comes into contact with the substrate in order from the position where the distance from the substrate is short. As a result, the pressing position continuously moves along the circumferential direction of the scribe line. In this way, the pressing position can be changed in the circumferential direction of the scribe line simply by driving the elevating mechanism linearly. Therefore, the substrate can be divided with a simple configuration without the need for complicated control.

In the dividing device according to this embodiment, the support member may be configured to support the substrate within the region of the product portion and to provide a space below the end material portion.

In this case, the support member may be configured to include a mounting surface on which the substrate is mounted and a pedestal portion having a cross-sectional area smaller than that of the previously described mounting surface.

According to this configuration, it is permissible for the portion of the end material divided along the scribe line to slip into the space of the step generated between the mounting surface and the pedestal portion when it hangs downward due to its own weight. .. As a result, it is suppressed that the divided end material portion collides with the side wall of the pedestal portion and is curved, so that unnecessary stress is not applied to the substrate from the divided end material portion. Therefore, the product part can be satisfactorily separated from the substrate.

In the dividing device according to this embodiment, the product part has a shape in which the corners of a rectangle are rounded in an arc shape, the support member is smaller than the shape of the product part, and the corners of the rectangle are in an arc shape. It has a rounded shape, and the curvature of the arc portion with rounded corners in the support member may be configured to be smaller than the curvature of the arc portion with rounded corners in the product portion.

In the dividing device according to this embodiment, the scribe head for forming the scribe line, the support frame for supporting the area outside the product part of the substrate, and the support frame are provided on the outside of the product part. It may include a support frame drive unit that drives between a first position that supports the region and a second position that does not support the region outside the product unit. The support frame driving unit may be configured to set the support frame to the first position when the scribe line is formed, and to set the support frame to the second position when the end material portion is divided.

According to this configuration, one scribe line can be used to both form the scribe line and divide the scrap portion.

In this case, the support frame is divided into a plurality of frame portions along the circumferential direction of the scribe line, and the support frame drive portion corresponds to a pressing position by the pressing member when the end material portion is divided. The frame portion of the position may be configured to be set from the first position to the second position.

According to this configuration, at the start of division of the end material portion, the end material portion is not supported by the support frame at the start point position in the circumferential direction, and is supported by the support frame at the end point position in the circumferential direction. Therefore, at the start of division of the scrap material portion, a pressing force is applied to the starting point position in a state where the ending point position adjacent to the starting point position is supported by the corresponding frame portion across the scribe line near the starting point position. .. As a result, a force in the opening direction is more effectively applied to the scribe line near the starting point position, and as a result, the scrap portion near the starting point position can be smoothly divided along the scribe line.

As described above, according to the present invention, it is possible to provide a dividing method and a dividing device capable of satisfactorily dividing a substrate along a scribe line including a curved portion.

The effects or significance of the present invention will be further clarified by the description of the embodiments shown below. However, the embodiments shown below are merely examples for implementing the present invention, and the present invention is not limited to those described in the following embodiments.

FIG. 1A is a schematic diagram showing a dividing device according to the first embodiment. FIG. 1B is a perspective view showing a configuration of a pressing member used in the dividing device according to the first embodiment. 2A to 2C are schematic views for explaining the configuration of the support portion in the dividing device according to the embodiment, respectively. FIG. 2A is a schematic view showing the state of the support portion at the time of forming the scribe line. FIG. 2B is a schematic diagram showing a state of the support portion at the start of the dividing operation. FIG. 2C is a schematic diagram showing a state of the support portion at the time of progress of the dividing operation. FIG. 3 is a block diagram showing the configuration of the dividing device according to the first embodiment. FIG. 4A is a flowchart showing a method of dividing a substrate by using the dividing device according to the first embodiment. FIG. 4B is a flowchart showing the division of the substrate in FIG. 4A in detail. FIG. 5A is a schematic view showing the state of the substrate before being divided in the dividing device according to the first embodiment. 5 (b) is a side view of the substrate and the support member of FIG. 5 (a). FIG. 5C is a schematic view of a substrate when the starting point position is pressed in the dividing device according to the first embodiment. 5 (d) is a side view of the substrate and the support member of FIG. 5 (c). FIG. 6A is a schematic diagram of a substrate when dividing along a scribe line in the dividing device according to the first embodiment. 6 (b) is a side view of the substrate and the support member of FIG. 6 (a). FIG. 7A is a perspective view showing the configuration of the dividing device according to the first modification. FIG. 7B is a perspective view showing the configuration of the pressing member in the dividing device according to the first modification. FIG. 8 is a perspective view showing the configuration of the dividing device according to the modified example 1. FIG. 9 is a perspective view showing the configuration of the support member of the dividing device according to the modified example 1. FIG. 10A is a schematic view showing a state before the substrate is divided in the dividing device according to the first modification. FIG. 9B is a schematic view showing a state of the substrate when the substrate is divided in the dividing device according to the first modification. FIG. 11 is a perspective view showing the configuration of the dividing device according to the second modification. FIG. 12 is a perspective view showing the configuration of the pressing member of the dividing device according to the second modification. FIG. 13 is a perspective view showing the configuration of the pressing member of the dividing device according to the third modification. FIG. 14A is a schematic view showing the configuration of a support portion in the dividing device according to another modified example. FIG. 14B is a schematic view showing the configuration of a support portion when a substrate is placed in the dividing device according to another modified example. FIG. 14 (c) is a schematic view showing the configuration of the substrate and the support portion when the substrate is divided by the pressing member in the dividing device according to another modified example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience, the X-axis, Y-axis, and Z-axis that are orthogonal to each other are added to each figure. The Z-axis indicates above and below in the vertical direction. Hereinafter, the upper side and the lower side mean the Z-axis positive side and the Z-axis negative side, respectively.

In this embodiment, the moving table 2, the ball screw 5, the rail 11, and the motor 16 correspond to the "moving mechanism" described in the claims.

FIG. 1A is a diagram schematically showing the configuration of the dividing device 1.

The dividing device 1 is a so-called multi-head mounted scribe device. The multi-head mounted scribe device has two functions, that is, a function of forming a scribe line on the substrate and a function of dividing the substrate along the formed scribe line. In the present embodiment, for convenience of explanation, this multi-head mounted scribe device is referred to as a "dividing device".

The dividing device 1 includes a moving table 2, a scribe head 3, and a break head 4. The moving table 2 is screwed with the ball screw 5. The moving table 2 is supported by a pair of guide rails 6 so as to be movable in the Y-axis direction. The ball screw 5 is rotated by the drive of the motor, so that the moving table 2 moves in the Y-axis direction along the pair of guide rails 6.

A motor 7 is installed on the upper surface of the moving table 2. The motor 7 rotates the table 8 located at the upper part in the XY plane and positions the table 8 at a predetermined angle. A support portion 20 is arranged on the table 8. A negative pressure is applied to the upper surface of the support portion 20 by the suction portion 51 (see FIG. 3). The substrate F is sucked and held on the upper surface of the support portion 20 by the suction portion 51.

The substrate F may be, for example, a glass substrate, a ceramic substrate such as low-temperature fired ceramics or high-temperature fired ceramics, a silicon substrate, a compound semiconductor substrate, a sapphire substrate, a quartz substrate, or the like. Further, the substrate F may have a thin film or a semiconductor material that does not correspond to a brittle material adhered to or contained on the surface or the inside. In the present embodiment, the dividing method is applied to a glass substrate, particularly a thin glass substrate.

The substrate F may be a bonded substrate in which two substrates are bonded together. Examples of such a substrate F include a substrate in which a color filter (CF) is formed on one substrate and a thin film transistor (TFT) is formed on the other substrate.

Each of the scribe head 3 and the break head 4 has a built-in camera (not shown) for photographing the alignment mark formed on the substrate F. Further, the bridge 9 is erected on the columns 10a and 10b so as to straddle the moving table 2, the table 8, and the support portion 20.

A rail 11 is attached to the bridge 9. The scribe head 3 and the break head 4 are each connected to the rail 11. The scribe head 3 and the break head 4 are installed so as to move in the X-axis direction by sliding the rail 11 by driving the motors 15 and 16 (see FIG. 3), respectively. The motor 15 is built in the scribe head 3, and the motor 16 is also built in the break head 4.

The scribe head 3 forms a scribe line on the substrate F. The holder unit 13 to which the cutting edge 12 is attached is attached to the joint portion 14 of the scribe head 3. The break head 4 divides the substrate F into a product portion F1 and a scrap portion F2 (see FIGS. 5A to 6A) along a scribe line formed on the substrate F by the scribe head 3. The break head 4 is provided with a joint portion 14 like the scribe head 3. A pressing member 30 is attached to the joint portion 14 of the break head 4.

FIG. 1B is a perspective view showing the configuration of a structure including the pressing member 30.

As shown in FIG. 1 (b), the pressing member 30 is attached to the joint portion 14 of the break head 4 shown in FIG. 1 (a) in a state of being supported by the support member 31. The pressing member 30 is a shaft-shaped member, and the lower end thereof is formed in a hemispherical shape to form the pressing portion 32.

2A to 2C are schematic views for explaining the configuration of the support portion 20, respectively. FIG. 2A is a schematic diagram showing a state of the support portion 20 at the time of forming the scribe line. FIG. 2B is a schematic diagram showing a state of the support portion 20 at the start of the dividing operation. FIG. 2C is a schematic diagram showing a state of the support portion 20 when the division operation is in progress. In FIGS. 2 (a) to 2 (c), the portion shown by the diagonal line is the upper surface of the table 8.

As shown in FIG. 2A, the support portion 20 includes a support member 21 and a support frame 22 that surrounds the outside of the support member 21. The support frame 22 is divided into a first frame portion 22a and a second frame portion 22b in the circumferential direction. The support member 21 is a plate-shaped member formed in a rectangular shape. The upper surface of the support member 21 is a mounting surface 21a on which the product portion F1 of the substrate F (see FIG. 5A) is mounted. Five holes 23 are formed in the central portion of the mounting surface 21a. A positive pressure or a negative pressure is applied to the substrate F by the suction portion 51 (see FIG. 3) through these holes 23.

Both the first frame portion 22a and the second frame portion 22b are plate-shaped members formed in an L shape. The first frame portion 22a and the second frame portion 22b are arranged so as to surround the periphery of the support member 21. At this time, the support member 21, the first frame portion 22a, and the second frame portion 22a are flush with each other so that the mounting surface 21a of the support member 21 and the upper surfaces of the first frame portion 22a and the second frame portion 22b are flush with each other. The frame portion 22b is formed.

When the scribe line is formed on the substrate F, as shown in FIG. 2A, the support member 21, the first frame portion 22a, and the second frame portion 22b are arranged on the upper surface of the table 8. The substrate F is mounted on the mounting surface 21a of the support member 21 in such a state and the upper surfaces of the first frame portion 22a and the second frame portion 22b. At this time, a negative pressure is applied to the substrate F by the suction portion 51 (see FIG. 3), so that the substrate F is sucked and held by the support member 21. The scribe line is formed on the outside of the support member 21, that is, in the region of the first frame portion 22a and the second frame portion 22b.

After the scribe line is formed on the substrate F in this way, as shown in FIG. 2B, the first frame portion 22a descends to a position where the upper surface of the first frame portion 22a is flush with the upper surface of the table 8. do. After that, the pressing member 30 of the break head 4 (see FIG. 1B) presses the substrate F at the position of the end on the positive side of the X axis of the first frame portion 22a, and further, the negative side of the Y axis from this position. The substrate F is continuously pressed along the shape of the first frame portion 22a up to the position of the end portion of.

Further, as shown in FIG. 2C, the second frame portion 22b is the second frame portion until the pressing member 30 reaches the position of the end portion on the negative side of the Y axis of the first frame portion 22a. The upper surface of 22b descends to a position where it is flush with the upper surface of the table 8. After that, the pressing member 30 continuously presses the substrate F along the shape of the second frame portion 22b from the position of the end portion on the negative side of the X axis of the second frame portion 22b to the position of the end portion on the positive side of the Y axis. Press. As a result, the division of the substrate F along the scribe line is completed. The method of dividing the substrate F along the scribe line will be described in detail with reference to FIGS. 5 (a) to 6 (b).

FIG. 3 is a block diagram showing the configuration of the dividing device 1.

As shown in FIG. 3, in addition to the configurations of FIGS. 1A and 1B, the dividing device 1 includes a control unit 50, a suction unit 51, a support frame drive unit 52, a scribe head drive unit 53, and the like. A break head drive unit 54 and a moving table drive unit 55 are provided.

The control unit 50 includes an arithmetic processing circuit such as a CPU and a memory such as a ROM, RAM, and a hard disk. The control unit 50 controls each unit according to a program stored in the memory.

The suction unit 51 applies a positive pressure or a negative pressure to the substrate F placed on the support member 21. The support frame driving unit 52 moves the first frame portion 22a and the second frame portion 22b up and down. The scribe head drive unit 53 drives the scribe head 3 by driving the motor 15. The break head drive unit 54 drives the break head 4 by driving the motor 16. The moving table driving unit 55 moves the moving table 2 in the Y-axis direction by driving the ball screw 5 shown in FIG. 1 (a).

Next, regarding the division of the substrate F using the dividing device 1, the flowcharts of FIGS. 4A and 4B, and the state transition diagrams of the substrate F and the support portion 20 of FIGS. 5A to 6B. Will be described using.

FIG. 4A is a flowchart showing the operation of the dividing device 1. 5 (a) and 5 (b) are schematic views showing the state of the substrate F before being divided. 5 (c) and 5 (d) are schematic views of the substrate F when the starting point position Q1 is pressed. 6 (a) and 6 (b) are schematic views of the substrate F when it is divided along the scribe line L.

5 (a), 5 (c), and 6 (a) are schematic views of the substrate F and the support portion 20 when viewed from the positive side of the Z-axis, and FIGS. 5 (b), 5 (d), and FIG. FIG. 6B is a side view seen from the positive side of the X-axis.

As shown in FIG. 4A, in step S11, the control unit 50 raises the first frame unit 22a and the second frame unit 22b to the upper surface of the table 8 by the support frame driving unit 52. As a result, the support portion 20 is in the state shown in FIG. 2 (a).

In this state, the substrate F before scribe line formation is placed on the upper surface of the support portion 20 by a transfer means such as a robot arm. The size of the substrate F is substantially the same as the upper surface of the support portion 20. In step S12, the control unit 50 generates a negative pressure in the suction unit 51 to suck the substrate F to the support member 21. Instead of the robot arm, the user may place the substrate F on the support portion 20.

As shown in FIG. 5A, the substrate F has a rectangular shape in a plan view and is divided into a product portion F1 and a scrap portion F2. The product unit F1 is arranged inside the substrate F. Here, the shape of the product portion F1 in a plan view is a shape in which the corners of a rectangle are rounded, and in FIG. 5A, the region surrounded by the scribe line L1 corresponds to the shape. The product unit F1 has an arc portion at a position corresponding to the corner of the rectangle.

The shape of the support member 21 (the shape of the mounting surface 21a) in the support portion 20 is a shape in which the corners of a rectangle are rounded, similar to the shape of the product portion F1. The support member 21 has an arc portion at a position corresponding to the corner of the rectangle. The curvature of the arc portion of the support member 21 is smaller than the curvature of the arc portion of the product portion F1. Further, the size of the support member 21 is smaller than the size of the product unit F1.

In the substrate F, the arc portions of the product portion F1 are arranged in the vicinity of the arc portions of the support member 21, and the central portion of the product portion F1 is overlapped with the central portion of the support member 21 so that the support member 21 is overlapped. It is placed in. When the substrate F is placed on the support member 21 in this way, the outer peripheral portion of the product portion F1 and the end material portion F2 are placed on the upper surfaces of the first frame portion 22a and the second frame portion 22b.

In this state, the control unit 50 applies a negative pressure to the substrate F from the suction unit 51 as described above. As a result, the substrate F is attracted to the support member 21 and held by the support member 21. Therefore, the substrate F does not shift from the support member 21.

Returning to FIG. 4A, in step S13, the control unit 50 causes the substrate F to form the scribe line L. The scribe line L is formed along the outer circumference of the product portion F1. At this time, the control unit 50 controls the scribe head drive unit 53 and the moving platform drive unit 55 to move the scribe head 3 in the X-axis direction and the Y-axis direction relative to the substrate F. As a result, the cutting edge 12 of the scribe head 3 moves two-dimensionally on the substrate F, and the scribe line L is formed on the surface of the substrate F.

In the formation of the scribe line L, the substrate F is positioned by the camera built in the scribe head 3. When the position P1 indicated by the black circle in FIG. 5A is set as the formation start position of the scribe line L, the control unit 50 places the scribe head 3 on the scribe head drive unit 53 to be true of the position P1. Position it on the top. At this time, as shown in FIG. 5B, the substrate F is supported by the support member 21, the first frame portion 22a, and the second frame portion 22b constituting the support portion 20.

Then, the control unit 50 brings the cutting edge 12 into contact with the substrate F with a predetermined load, and then moves the cutting edge 12 relative to the substrate F along the shape of the product unit F1 to form the scribe line L1. do.

When the scribe line L1 is formed in this way, that is, when the scribe head 3 moves relatively along the shape of the product unit F1 and is repositioned at the position P1, the control unit 50 moves the cutting edge 12 from the position P1. It is linearly moved to the position P2 on the outer circumference of the substrate F (the position indicated by the white circle in FIG. 5A). As a result, the circumscribed portion L2 is formed between the position P1 and the position P2 located on the extension line of the scribe line L1 through the position P1.

As described above, the scribe line L includes the scribe line L1 along the outer periphery of the product portion F1 and the circumscribed portion L2 reaching the outer periphery of the substrate F from the scribe line L1. Further, among the scribe lines L1, the four curved portions L11 correspond to the four arc portions of the product portion F1, and the four straight portions L12 correspond to the four straight portions of the product portion F1.

After that, in step S14, the control unit 50 controls the support frame drive unit 52 to lower the first frame unit 22a. As a result, the support portion 20 is in the state shown in FIG. 2 (b). The substrate F is supported by the support portion 20 in the state shown in FIG. 5 (b). The vicinity of the circumscribed portion L2 is not supported by the first frame portion 22a, but is supported only by the second frame portion 22b.

Next, in step S15, the control unit 50 causes the break head drive unit 54 to position the break head 4 at the starting point position Q1 in FIG. 5 (c). The starting point position Q1 is a position indicated by a white triangular mark in FIG. 5C, and is positioned near the positive side of the Y-axis with respect to the circumscribed portion L2 of the scribe line L in the region of the scrap portion F2. Then, the control unit 50 controls the break head 4 to cause the pressing member 30 to press the starting point position Q1 with a predetermined load. In this way, when the pressing member 30 presses the starting point position Q1, the crack at the outer peripheral end of the circumscribed portion L2 extends in the thickness direction of the substrate F to reach the back surface of the substrate F, and further cracks inside the circumscribed portion L2. Is extended, and the vicinity of the starting point position Q1 of the scrap portion F2 is separated from the substrate F.

At this time, in the vicinity of the circumscribed portion L2, as shown in FIG. When the positive side of the Y-axis of the portion L2 is pressed, a force in the direction of opening a crack is efficiently applied to the circumscribed portion L2. As a result, cracks smoothly extend from the outer peripheral end of the circumscribed portion L2 to the outer peripheral portion L2, and the vicinity of the starting point position Q1 of the end material portion F2 is satisfactorily separated from the substrate F.

In this way, when the division near the starting point position Q1 is performed, the control unit 50 controls the support frame drive unit 52 in step S16 to lower the second frame unit 22b. As a result, the support portion 20 is in the state shown in FIG. 2 (c). The substrate F is supported by the support portion 20 in the state shown in FIG. 6 (b). The control unit 50 may temporarily separate the pressing member 30 from the substrate F after the division near the starting point position Q1 is performed.

After that, in step S17, the control unit 50 controls the break head drive unit 54 and the moving table drive unit 55 to relatively move the break head 4 along the scribe line L in the region of the end material portion F2. As a result, the pressing position of the pressing member 30 against the substrate F moves along the scrap portion F2, and the scrap portion F2 is separated from the substrate F with this movement.

Specifically, the division of the substrate F by the break head 4 will be described specifically. In step S15, the pressing member 30 positioned at the starting point position Q1 in FIG. 6A moves from the starting point position Q1 to the position Q2 in step S17. .. The position Q2 is the position indicated by the black triangular mark in FIG. 6A. Along with this movement, cracks that reach the back surface of the substrate F at the positive end of the circumscribed circle L2 on the positive side of the X-axis extend in the negative direction of the X-axis along the circumscribed circle L2. After that, when the pressing member 30 arrives at the position Q2, the pressing member 30 moves in the circumferential direction in the region of the end material portion F2 along the scribe line L1 while still pressing the end material portion F2. This moving direction is indicated by a broken line arrow in FIG. 6A. Along with this movement, the crack generated in the circumscribed portion L2 extends from the circumscribed circle L2 to the straight portion L12 of the scribe line L1, and the end material portion F2 is divided along the straight portion L12.

In this way, when the pressing member 30 moves in the circumferential direction along the scribe line L1 in the region of the scrap line F2 and arrives at the position Q3 after about one round, the scrap F2 covers the entire circumference of the scribe line L1. Is divided. As a result, the division of the substrate F is completed. The position Q3 is indicated by a white square mark in FIG. 6A and is located on the circumscribed circle L2.

As described above, as the pressing member 30 moves, the crack extends from the circumscribed circle L2 to the scribe line L1 starting from the starting point position Q1, and further extends along the scribe line L1 from the substrate F. The scrap portion F2 can be smoothly divided, and the product portion F1 can be smoothly cut out from the substrate F.

In this way, when the division of the substrate F by the pressing member 30 is completed, the control unit 50 controls the suction unit 51 in step S18 to apply a positive pressure to the substrate F. As a result, the product unit F1 is released from the adsorption with the support member 21 and can be removed from the support member 21. After that, the product unit F1 is collected by a transfer means such as a robot arm. In this way, a series of operations related to the division of the substrate F by the dividing device 1 is completed.

In step S17 of FIG. 4A, it is preferable that the moving speed of the pressing member 30 is controlled so that the curved portion L11 is slower than the straight portion L12 of the scribe line L1. As a result, the curved portion L11 can be divided more smoothly.

Further, it is preferable that the movement locus of the pressing member 30 in the portion corresponding to the curved portion L11 of the scribe line L1 is set so that the center of rotation coincides with the curved portion L11. In other words, the curvature of the curved portion of the movement locus of the pressing member 30 is set to be smaller than the curvature of the curved portion L11. This makes it easier for the crack extension direction to follow the curved portion L11.

FIG. 4B is a flowchart showing movement control of the pressing member 30 with respect to the substrate F.

In step S21, the control unit 50 moves the pressing member 30 from the starting point position Q1 in the circumferential direction of the end material portion F2 with a predetermined load. At this time, in step S22, the control unit 50 first moves the pressing member 30 relative to the substrate F at the first speed. As a result, as shown in FIG. 6A, the pressing member 30 moves from the starting point position Q1 to the position Q2 at a relatively first speed along the circumscribed portion L2, and further, the scrap portion. It moves in the region of F2 from the position Q2 along the straight line portion L12 of the scribe line L1 at a relatively first speed.

In step S23, the control unit 50 determines whether or not the pressing member 30 has arrived in the vicinity of the curved unit L11 of the scribe line L1. When the pressing member 30 arrives in the vicinity of the curved portion L11 of the scribe line L1 (S23: YES), the control unit 50 switches the moving speed of the pressing member 30 to a second speed lower than the first speed. (S24).

Then, the control unit 50 determines in step S25 whether or not the pressing member 30 has passed the vicinity of the curved unit L11. When the pressing member 30 has not yet passed the vicinity of the curved portion L11 (S25: NO), the moving speed of the pressing member 30 is maintained at the second speed (S24).

After that, when the pressing member 30 passes near the curved portion L11 (S25: YES), the control unit 50 returns the process to step S22 and switches the moving speed of the pressing member 30 from the second speed to the first speed. .. As a result, the pressing member 30 moves at the first speed along the straight line portion L12 after passing through the curved portion L11.

After that, the control unit 50 executes the same process as described above until it is determined in step S26 that the pressing member 30 has arrived at the position Q3. In this case, the position Q3 is the end point of movement by the pressing member 30. As a result, the pressing member 30 moves in the region of the scrap portion F2 at the first speed along the straight portion L12 of the scribe line L1, and also moves along the straight portion L12 of the scribe line L1. Move in the region of the scrap F2 at a second speed slower than the speed of. In this way, when the pressing member 30 arrives at the position Q3 (S26: YES), the control unit 50 ends the process of FIG. 4 (b). As a result, the division process of the substrate F in step S17 of FIG. 4A is completed.

As described above, in the present embodiment, when the pressing member 30 relatively moves in the region of the scrap portion F2 along the scribe line L, it passes near the curved portion L11 and near the straight portion L12. The relative moving speed of the pressing member 30 can be switched between the case of passing through and the case of passing through. As a result, the crack can be gently extended in the curved portion L11, and the curved portion L11 can be smoothly and satisfactorily divided.

In the operation of the dividing device 1 described above, the table 8 may be rotated as necessary.

Further, in the above, the scribe head 3 and the break head 4 move in the X-axis direction, the moving table 2 moves in the Y-axis direction, and the dividing device 1 that rotates is shown. However, the dividing device 1 is the scribe head 3. The configuration may be such that the break head 4 can be relatively moved two-dimensionally in the in-plane direction of the XY plane with respect to the substrate F. For example, the scribe head 3 and the break head 4 may be fixed, and the moving table 2 may be a dividing device 1 that moves in the X-axis and Y-axis directions.

<Effect of embodiment>
According to this embodiment, the following effects are achieved.

As shown in FIGS. 4A and 5A to 6B, when the starting point position Q1 is pressed by the pressing member 30, cracks extend in the thickness direction of the substrate F at the starting point position Q1 and the substrate F Division occurs. As the pressing member 30 moves, the product portion F1 is separated from the substrate F along the pressing position pressed by the pressing member 30. In this configuration, the pressing position changes along the circumferential direction of the scribe line L. Therefore, the crack also extends along the circumferential direction of the scribe line L. As a result, the product unit F1 can be separated from the substrate F.

Further, since the crack extends along the circumferential direction of the scribe line L in this way, even when the scribe line L has the curved portion L11, the pressing position moves along the outside of the curved portion L11, so that the curve is curved. The crack extends smoothly along the portion L11. Therefore, the product portion F1 can be separated from the substrate F in a good condition without chipping or cracking at the end faces of the straight portion L12 and the curved portion L11 of the product portion F1.

As shown in FIGS. 4 (a), 4 (b), 5 (a) to 6 (b), the cracks continuously extend with the continuous movement of the pressing position, so that the cracks continuously extend along the scribe line L. The crack can be smoothly extended. Therefore, the product unit F1 can be separated from the substrate F in a better state.

Generally, when the thickness of the brittle material substrate is reduced, wrinkles are formed when the substrate is bent along the curved shape, and excessive stress is likely to be applied to the curved portion. Therefore, when the shape of the corner portion of the product portion is formed in a curved shape, if the corner portion is bent, the crack may extend in a direction deviating from the scribe line, for example, toward the product portion.

However, according to the present embodiment, as shown in FIGS. 4A, 4B, 5A to 6B, the speed at which the pressing member 30 presses the vicinity of the curved portion L11. Is slower than the other parts. As a result, the crack gradually extends in the curved portion L11, and the extending direction of the crack becomes easy to follow the curved portion L11 of the scribe line L. Therefore, the curved portion L11 can be satisfactorily divided. Further, in the curved portion l11, since the crack can be prevented from extending toward the product portion F1, the end face of the product portion F1 can be formed in a good state.

As shown in FIGS. 2 (c) and 5 (a) to 6 (b), when the substrate F is placed on the support portion 20, the end material portion F2 is in a state of protruding from the support member 21. As a result, when the end material portion F2 is divided by pressing, the end material portion F2 sequentially hangs down into the lower space due to its own weight, and at the divided position, a force in the direction of opening a crack is generated. Therefore, the product unit F1 can be more smoothly separated from the substrate F along the scribe line L.

Further, in this way, a force in the direction of opening cracks is generated at the divided position of the substrate F, and such cracks are continuous along the scribe line L. Therefore, the crack extends along the scribe line L without deviating into the region of the scrap portion F2 or the region of the product portion F1. As a result, the scrap portion F2 is removed from the substrate F in a connected state without being divided in the middle. As a result, the end surface of the product part F1, which is also the boundary between the product part F1 and the end material part F2, is suppressed from being chipped or cracked, and the quality of the product part F1 is improved.

As shown in FIGS. 2 (c) and 5 (a) to 6 (b), the arc portion of the support member 21 (mounting surface 21a) has a smaller curvature than the arc portion of the product portion F1. The stress generated near the arc portion of the product portion F1 is dispersed. Therefore, when the product is divided by pressing, excessive stress is not applied to the vicinity of the arc portion, and therefore, the end material portion F2 can be satisfactorily divided along the arc portion of the product portion F1. As a result, the product part F1 can be separated from the substrate F in a better state without chipping (chipping) or cracking at the end surface of the product part F1.

As shown in FIGS. 1 (a) and 3 to 4 (b), the pressing position of the pressing member 30 can be adjusted by control by the control unit 50. As a result, the division operation of the product unit F1 can be smoothly performed.

<Change example>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made to the embodiments of the present invention.

In each of the following modified examples, the substrate to be divided is the substrate F as in the above embodiment, and the shapes of the product portion F1 and the scrap portion F2 are also the same.

[Change example 1]
FIG. 7A is a perspective view showing the configuration of the dividing device 100 according to the modified example 1.

The dividing device 100 according to the first modification is for dividing the substrate F on which the scribe line L1 and the circumscribed portion L2 are formed in advance along the circumscribed portion L2 and the scribe line L1 as shown in FIG. 5A. It is a device of. That is, the dividing device 100 does not have a configuration for forming a scribe line on the substrate F, but has only a configuration for dividing the substrate F along the scribe line.

As shown in FIG. 7A, the dividing device 100 includes an elevating mechanism 110, a support portion 120, a frame member 130, and a pressing member 140. The pressing member 140 will be described with reference to FIG. 7 (b). Further, in the dividing device 100 according to the modification example 1, the user manually sets the substrate F on the dividing device 100 and operates the pressing member 140.

The elevating mechanism 110 is installed on the base installation table 101. In the elevating mechanism 110, three holes are formed in the rectangular plate portion 111 so as to be arranged in the X-axis direction. Of these three holes, a linear bush 112 is provided in each of the two holes other than the hole 111a located in the center in the X-axis direction. A shaft 113 is passed through each linear bush 112.

A set collar 114 is mounted on the upper portion of each shaft 113. A screw hole (not shown) is formed at the lower end of each shaft 113. Further, an urging member 115 is provided so as to cover the periphery of each shaft 113. Each urging member 115 is locked so that the upper end portion is sandwiched between the set collar 114 and the lower end portion is sandwiched between the linear bush 112.

The screw shaft of the screw 116 is fitted in the hole 111a located at the center in the X-axis direction. The lower end of the screw shaft abuts on the upper surface of the support 117.

The support 117 is formed in a shape obtained by hollowing out from a rectangular plate member except for the end edge portion 117a on the positive side of the Y axis, the edge portion 117b on the positive side of the X axis, and the edge portion 117c on the negative side of the X axis. ing. A slight step is provided between the edge portion 117a and the edge portion 117b and 117c. The width of this step in the Z-axis direction matches the width of the frame member 130 in the thickness direction. The lower end of the screw shaft of the screw 116 described above abuts on the edge portion 117a of the support 117. ..

Further, two screw holes 117d are formed in the end edge portion 117a of the support 117 (see FIG. 8). A screw (not shown) is fitted from below into these screw holes 117d and screw holes (not shown) formed at the lower end of each of the shafts 113 described above. As a result, the support 117 and each shaft 113 are connected to each other.

The plate portion 111 is supported by a pair of support plates 119 installed on the positive side and the negative side of the X-axis of the base 118, respectively. In this way, the elevating mechanism 110 is configured.

The support portion 120 integrally includes a support member 121, a pedestal portion 122, and a plate portion 123. The plate portion 123 is installed on the table 101a on the upper surface of the installation table 101.

The upper surface of the support member 121 is the mounting surface 121a of the substrate F. Similar to the above embodiment, the mounting surface 121a is formed with a hole 124 for applying air to the substrate F by a suction portion (not shown).

The shape of the support member 121 (the shape of the mounting surface 121a) in the support portion 120 is the same as that of the above embodiment. That is, it is a shape with rounded corners similar to the shape of the product part F1. The support member 121 has an arc portion at a position corresponding to a corner. The support member 121 has a smaller curvature of the arc portion than the arc portion of the product portion F1, and the support member 121 has a smaller size than the product portion F1.

The pedestal portion 122 is formed in a substantially rectangular shape. The pedestal portion 122 is formed so that the cross-sectional area when cut in a plane parallel to the XY plane is smaller than that of the support member 121.

The frame member 130 is a member in which a large opening is formed in the central portion of the rectangular plate member. The X-axis positive and negative end edges of the frame member 130 are placed on the end edges 117b and 117c of the support 117, respectively, and the Y-axis positive end of the frame member 130 is the support 117. It is placed on the edge portion 117a. At this time, the frame member 130 is placed so as to fit in the step between the edge portion 117a of the support 117 and the edge portions 117b and 117c. In this state, the corners on the positive and negative sides of the X-axis of the frame member 130 are screwed to the support 117. As a result, the frame member 130 is fixed to the support 117.

FIG. 7B is a perspective view showing the configuration of the pressing member 140.

As shown in FIG. 7B, the pressing member 140 includes a gripping portion 141 and a pressing portion 142. The grip portion 141 is a long and thin cylindrical member, and a pressing portion 142 is provided at the lower end portion. The pressing portion 142 is a shaft-shaped member, and the lower end portion is formed in a hemispherical shape like the pressing portion 32 of the above embodiment. When the user divides the substrate F, he / she grips the grip portion 141 of the pressing member 140 and presses the substrate F at the lower end portion of the pressing portion 142.

Next, the division of the substrate F using the dividing device 100 will be described.

FIG. 8 is a perspective view showing the configuration of the dividing device 100 when the substrate F is divided. In FIG. 8, the substrate F is shown by diagonal lines.

As shown in FIG. 8, when the substrate F is divided by using the dividing device 100, the user attaches the substrate F on which the scribe line L1 (see FIG. 5A) is formed to the mounting surface 121a of the support member 121. Place it. Next, the user operates an operation unit (not shown) to apply a negative pressure to the substrate F through the hole 124 by the suction unit (not shown). The method of placing the substrate F is the same as that of the above embodiment (see FIG. 5A). This corresponds to the process of step S12 in the flowchart of FIG. 4A in the above embodiment.

Next, the user adjusts the vertical position of the frame member 130. When the user pushes down the frame member 130, the support 117 and the frame member 130 are lowered against the urging of the urging member 115. At this time, when the user brings the step between the grip portion 141 of the pressing member 140 and the pressing portion 142 into contact with the inner peripheral edge of the frame member 130, a desired load is applied to the substrate F from the tip of the pressing portion 142. The frame member 130 is lowered to the hanging position (adjustment position). In this state, the user tightens the screw 116 to bring the lower end of the screw into contact with the upper surface of the support 117. As a result, the frame member 130 is locked to the above-mentioned adjustment position by the urging of the urging member 115.

After adjusting the height position of the frame member 130, the user presses the substrate F with the pressing portion 142 of the pressing member 140. Specifically, the user moves the pressing portion 142 in the circumferential direction of the scribe line L1 from the position Q2 of the substrate F (see FIG. 6A) along the scribe line L1. At this time, the user moves the pressing member 140 while keeping the step of the pressing member 140 along the side wall of the opening of the frame member 130.

That is, as shown in FIG. 6A, the user starts the pressing member 140 from the position Q2 and circles the vicinity of the scribe line L1 in the region of the scrap portion F2 along the scribe line L1. Move in the direction. By moving the pressing member 140 while keeping the step of the pressing member 140 along the side wall of the opening of the frame member 130, the pressing portion 142 of the pressing member 140 follows such a trajectory. When the pressing member 140 (pressing portion 142) is positioned at the position Q3 (see FIG. 6A), the division of the substrate F is completed. This corresponds to the process of step S17 in FIG. 4 (a).

When the division of the substrate F is completed, the user operates the operation unit to release the adsorption between the mounting surface 121a (support member 121) and the substrate F by the suction portion (not shown), and collects the substrate F. This corresponds to the process of step S18 in FIG. 4 (a).

In this way, a series of processes related to the division of the substrate F by the dividing device 100 is completed.

Also in the case of the first modification, the user may change the moving speed of the pressing member 140 depending on the position of the F (within the region of the scrap portion F2) pressed by the pressing portion 142, as in the above embodiment. That is, the user has a slower moving speed when moving the pressing member 140 along the curved portion L11 of the scribe line L1 than the moving speed when moving the pressing member 140 along the straight line portion L12 of the scribe line L1. do. Thereby, the same operation as in FIG. 4B of the above embodiment can be realized.

FIG. 9 is a perspective view showing the configuration of the support portion 120 according to the modified example 1.

As shown in FIG. 9, the support portion 120 includes a support member 121, a pedestal portion 122, and a plate portion 123. As described with reference to FIG. 7A, the support portion 120 is formed so that the cross-sectional area of the pedestal portion 122 when cut in a plane parallel to the XY plane is smaller than the mounting surface 121a. Will be done. The support portion 120 is fixed to the installation base 101 by screwing the four corners of the plate portion 123 to the table 101a of FIG. 7.

FIG. 10A is a schematic diagram for explaining a state of the substrate F when the substrate F is divided. FIG. 10B is a diagram showing a state of the substrate F when the substrate F is divided.

When the substrate F is divided by using the support portion 120 as shown in FIG. 10A, particularly the support member 121 and the pedestal portion 122, the substrate F is placed on the mounting surface 121a of the support member 121.

When the user operates the pressing member 140 to move the substrate F (inside the region of the scrap portion F2) while pressing it along the scribe line L1 (see FIG. 6A), the starting point position Q1 (FIG. 6A). )) The cracks generated in) grow one after another. As a result, the portion of the end material portion F2 that is pressed and divided by the pressing portion 142 first is deformed by the deformation of the end material portion F2 that is pressed later, and the divided end is formed. The material part F2 hangs down one after another.

At this time, as shown in FIG. 10B, since a step is formed between the support member 121 and the pedestal portion 122 in the Z-axis direction, the end material portion F2 slips into the back side of the support member 121. It hangs down like this.

As described above, in the configuration of the modified example 1, when the portion of the end material portion F2 divided along the scribe line L1 hangs down, it may slip into the space created in the step between the support member 121 and the pedestal portion 122. Permissible. As a result, the end surface of the divided end material portion F2 is prevented from colliding with the side wall of the pedestal portion 122 and being curved, so that unnecessary stress may be applied to the substrate F from the divided end material portion F2. do not have. Therefore, the product unit F1 can be satisfactorily separated from the substrate F.

[Change example 2]
FIG. 11 is a perspective view showing the configuration of the dividing device 100 according to the second modification.

As shown in FIG. 11, the dividing device 100 includes an elevating mechanism 110, a support portion 120, a frame member 150, and a pressing member 160. In the dividing device 100 of the second modification, the frame member 150 and the pressing member 160 are different from the frame member 130 and the pressing member 140 of the first modification. Since other configurations are the same as those of the first modification, the description thereof will be omitted. Further, in FIG. 11, the substrate F is omitted.

Similar to the frame member 130 of the first modification, the frame member 150 is formed by providing an opening in the center of the plate-shaped member. However, the frame member 150 of the modified example 2 is thicker than the frame member 130 of the modified example 1, and the area of the opening formed in the central portion is small. The frame member 150 is installed on the support 117 in the same state as the frame member 130 of the first modification.

Further, a plurality of screw holes 150a are formed in the frame member 150 along the periphery of the opening. The pressing member 160 is screwed to each of these screw holes 150a. The pressing member 160 is formed with a screw groove on the shaft portion. The tip of the pressing member 160 has a spherical shape and protrudes toward the negative side of the Z axis.

FIG. 12 is a perspective view of a state in which the pressing member 160 is attached to the frame member 150 as viewed from the negative side of the Z axis.

The plurality of pressing members 160 are arranged at positions where they can be pressed in the region of the end material portion F2 of the substrate F. That is, when the substrate F is supported by the support portion 120, the plurality of pressing members 160 are mounted on the frame member 150 so as to line up along the region of the end material portion F2 of the substrate F. Further, the plurality of pressing members 160 are provided so that the amount of protrusion from the frame member 150 is different from each other. Specifically, when the substrate F is supported by the support portion 120 and the pressing member 160 is located above the substrate F, the distance between the plurality of pressing members 160 and the substrate F (within the region of the scrap portion F2) is large. A plurality of pressing members 160 are set on the frame member 150 so as to become longer as the position of the scribe line L1 in the circumferential direction changes. The amount of protrusion of each pressing member 160 is adjusted by the amount of screwing of the pressing member 160 into the frame member 150.

In the state of FIG. 11, the height positions of the support 117 and the frame member 150 are set so that the pressing member 160 having the largest protrusion amount is separated from the surface of the substrate F mounted on the support member 121 by a predetermined distance. The position in the Z-axis direction) is adjusted. The height positions of the support 117 and the frame member 150 are adjusted by the protrusion amount of the screw 116 as in the above embodiment.

In this state, the user mounts the substrate F on the support portion 120 (the mounting surface 121a of the support member 121) and operates the suction portion (not shown) to suck the substrate F onto the support member 121. Then, the user pushes down the frame member 150 downward, and lowers the plurality of pressing members 160 together with the frame member 150. As a result, the pressing member 160 having the shortest distance from the surface of the substrate F (the surface of the end material portion F2) first abuts on the end material portion F2, and then each pressing is performed in the order of the shortest distance from the end material portion F2. The member 160 comes into contact with the end material portion F2. As a result, the pressing position of the end material portion F2 by the pressing member 160 moves intermittently along the circumferential direction of the scribe line L1.

At this time, the pressing position moves along the locus shown by the broken line in FIG. 6A. In this way, the amount of protrusion of the plurality of pressing members 160 is adjusted so that the pressing position changes. As a result, as in the case of FIG. 6A, first, the cracks on the outer peripheral side edge of the circumscribed portion L2 extend in the thickness direction of the substrate F, and further, the cracks extend along the circumscribed portion L2. Then, when the next pressing position is pressed, the crack extends to the straight portion L12 of the scribe line L1, and further, as the pressing position moves, the crack extends along the scribe line L1. In this way, when the pressing position circulates to the vicinity of the circumscribed portion L2, cracks extend over the entire circumference of the scribe line L1 and the scrap portion F2 is separated from the substrate F.

As described above, in the configuration of the second modification, the pressing position by the pressing member 160 can be changed in the circumferential direction of the scribe line L1 only by linearly driving the frame member 150 by the elevating mechanism 110. Therefore, the substrate F can be divided with a simple configuration without the need for complicated control.

As for the distance between the adjacent pressing members 160, the crack generated in the scribe line L1 by the pressing by one pressing member 160 extends to the scribe line L1 near the pressing position by the pressing by the adjacent pressing member 160. Adjusted to the interval.

Further, although the frame member 150 is manually raised and lowered here, the frame member 150 may be raised and lowered by a drive mechanism using a motor, an air cylinder, or the like as a drive source. In this case, for example, the drive mechanism is configured to raise and lower the two shafts 113 at the same time. Further, in this drive mechanism, as in the above embodiment, the speed at which the pressing position moves near the curved portion L11 of the scribe line L1 is higher than the speed at which the pressing position moves near the straight portion L12 of the scribe line L1. May be controlled to be slower. Further, when the frame member 150 is manually moved up and down as described above, the user may change the descending speed of the frame member 150 so that the same operation as this control is realized.

[Change example 3]
FIG. 13 is a perspective view of the configuration of the frame member 170 and the pressing member 180 of the dividing device 100 according to the modified example 3 as viewed from the negative side of the Z axis.

In the dividing device 100 of the third modification, the frame member 170 and the pressing member 180 are different from the frame member 130 and the pressing member 140 of the first modification. Since the other configurations of the modification 3 are the same as those of the modification 1, the description thereof will be omitted. The configuration of the dividing device 100 is the same as the configuration of FIG. Instead of the frame member 150 of FIG. 11, the frame member 170 of FIG. 13 is mounted on the support 117.

As shown in FIG. 13, the frame member 170 has the same shape as the frame member 150 of the second modification. In the frame member 170 of the third modification, two screw holes 170a are formed in the vicinity of the four corners of the opening portion. Bolts 182 are screwed into each screw hole 170a.

The pressing portion 181 is fixed to the tips of the eight bolts 182 by a fixing means such as an adhesive. The pressing portion 181 has a shape in which a series of elongated plate-shaped members are bent into a frame shape. In a plan view, the pressing portion 181 orbits in a track shape. The eight bolts 182 have different amounts of protrusion from the frame member 170. Specifically, in a state where the substrate F is mounted on the support member 121 of FIG. 11 and the pressing portion 181 is located above the substrate F, the lower end of the bolt 182 and the substrate F (in the region of the scrap portion F2) The distance is provided so as to increase as the position of the scribe line L1 in the circumferential direction changes.

By adjusting the protrusion amount of the eight bolts 182 in this way, the distance between the pressing portion 181 and the substrate F also becomes longer as the position of the scribe line L1 in the circumferential direction changes. Therefore, when the frame member 170 is attached to the dividing device 100 of FIG. 11 and the frame member 170 is manually lowered, the pressing portion 181 comes into contact with the substrate F in order from the position where the distance from the substrate F is short.

In a plan view, the pressing portion 181 is arranged along the region of the scrap portion F2 of the substrate F. The end portion of the pressing portion 181 having the shortest distance from the end material portion F2 is positioned at the starting point position Q1 in FIG. 6 (a), and from this position, the end material is along the broken line arrow in FIG. 6 (a). The distance from the part F2 is gradually increasing. Therefore, when the user manually lowers the frame member 170, the pressing portion 181 comes into contact with the end material portion F2 from the starting point position Q1 in FIG. 6A along the broken line arrow. As a result, the pressing position continuously moves along the circumferential direction of the scribe line L1.

In this way, when the pressing position moves continuously, the crack generated near the starting point position Q1 extends along the scribe line L1. The substrate F is divided along the scribe line L1 by extending the cracks over the entire circumference of the scribe line L1.

As described above, also in the modification example 3, the pressing position of the end material portion F2 by the pressing portion 181 can be changed in the circumferential direction of the scribe line L1 only by manually lowering the frame member 170 linearly. Therefore, the substrate F can be divided with a simple configuration without the need for complicated control. Further, in the configuration of the modification example 3, unlike the modification example 2, the pressing position of the end material portion F2 by the pressing portion 181 continuously changes along the end material portion F2. Therefore, the crack can be extended more smoothly along the scribe line L1.

In the third modification as well, the frame member 170 may be raised and lowered by the drive mechanism as in the second modification. Further, the elevating and lowering of the frame member 170 may be controlled so that the moving speed of the pressing position near the curved portion L11 is slower than the moving speed of the pressing position near the straight portion L12. As a result, the curved portion L11 can be well divided.

<Other changes>
In the above embodiment, the pressing position of the pressing member 30 is continuously changed along the end material portion F2 by the control of the control unit 50. However, the control unit 50 may intermittently change the pressing position by the pressing member 30 along the end material portion F2.

In this case, a plurality of pressing positions are set along the scribe line L1 in the region of the scrap portion F2. The control unit 50 controls the break head drive unit 54 and the moving table drive unit 55 so that these pressing positions are sequentially pressed by the pressing member 30. Specifically, the control unit 50 raises the pressing member 30 to the break head 4 while the pressing member 30 moves between the adjacent pressing positions while moving the pressing member 30 along the end material portion F2. The pressing member 30 is separated from the end material portion F2.

According to this control, the end material portion F2 is intermittently pressed in the circumferential direction by the pressing member 30 as in the above-mentioned modification 2. As a result, the crack can be extended along the circumscribed portion L2 and the scribe line L1, and the substrate F can be divided along the scribe line L1.

Further, in the above embodiment, the first frame portion 22a and the second frame portion 22b are sequentially lowered when the substrate F is divided, but when the substrate F is divided, the first frame portion 22a and the second frame portion 22b are simultaneously lowered. You may descend.

In this case, unlike the above embodiment, the substrate F is not supported by the second frame portion 22b when the starting point position Q1 is pressed by the pressing member 30. Therefore, when the starting point position Q1 is pressed, the end material portion F2 moves downward together with the starting point position Q1 and the position opposite to the starting point position Q1 across the circumscribed circle L2, and as a result, the above-described embodiment. In comparison with the above, the force in the opening direction is less likely to be applied to the circumscribed portion L2. Therefore, if the first frame portion 22a and the second frame portion 22b are lowered at the same time when the substrate F is divided, the formation of cracks in the circumscribed circle L2 may be slightly inferior to that in the case of the above embodiment. ..

Therefore, in order to extend the cracks better in the circumscribed portion L2, only the first frame portion 22a is separated from the substrate F when the starting point position Q1 is pressed, as in the above embodiment, and the second frame portion is separated. It is preferable to support the substrate F with 22b. The timing of separating the second frame portion 22b from the substrate F does not necessarily have to be the timing before the pressing member 30 starts moving from the starting point position Q1 as in the above embodiment, and the pressing member 30 may be separated from the substrate F. The pressing position may be any timing before entering the second frame portion 22b.

Further, the method of retracting the first frame portion 22a and the second frame portion 22b from the substrate F is not limited to the method of lowering the first frame portion 22a and the second frame portion 22b as in the above embodiment. For example, the first frame portion 22a and the second frame portion 22b may be retracted from the substrate F by sliding the first frame portion 22a and the second frame portion 22b in a direction parallel to the XY plane.

Further, in the above embodiment, the shapes of the first frame portion 22a and the second frame portion 22b constituting the support portion 20 are formed in an L shape, but the shapes of the first frame portion 22a and the second frame portion 22b are formed. Is not limited to this.

FIG. 14A is a schematic view showing the configuration of the support portion 40 in the dividing device according to another modified example. FIG. 14B is a schematic view showing the configuration of the support portion 40 when the substrate F is placed. FIG. 14C is a schematic view showing the configuration of the substrate F and the support portion 40 when the pressing member 30 presses the substrate F. In FIG. 14B, in order to explain the arrangement of the second frame portion 41b, the movement locus of the pressing member 30 on the substrate F is shown by a broken line.

As shown in FIG. 14A, the support portion 40 has a support frame 41 arranged so as to surround the entire circumference of the support member 21. The support frame 41 is composed of a first frame portion 41a and a rectangular second frame portion 41b arranged so as to form a part of the first frame portion 41a. As shown in FIG. 14B, the second frame portion 41b is arranged on the opposite side (Y) with respect to the starting point position Q1 with the circumscribed circle L2 interposed therebetween when the substrate F is placed on the support portion 40. It is arranged at a position where it can support the substrate F (on the negative side of the shaft) and further, at a position where it does not hinder the movement of the pressing member 30.

The formation of the scribe line L on the substrate F supported by the support portion 40 and the division of the substrate F are performed in the same procedure as in the above embodiment. Here, in the above embodiment, in the flowchart of FIG. 4A, in step S16, the pressing member 30 moves, so that the second frame portion 22b is moved up and down. However, in the support portion 40, as described above, the second frame portion 41b is arranged at a position that does not interfere with the movement locus of the pressing member 30. Therefore, the pressing member 30 is moved with the second frame portion 41b arranged on the table 8 as shown in FIG. 14 (c) without performing the process of step S16 in FIG. 4 (a). Can be done.

Although the shape of the second frame portion 41b is shown as a rectangular shape in FIGS. 14 (a) to 14 (c), the starting point position Q1 sandwiches the circumscribed circle l2 when the pressing member 30 presses the starting point position Q1. Any shape may be used as long as it can support the substrate F on the opposite side (Y-axis negative side).

Further, in the second modification, the pressing member 160 is arranged by screwing to the frame member 150, but the pressing member 160 may be arranged by a method other than screwing. For example, the shaft-shaped pressing member 160 may be press-fitted into a hole formed in the frame member 150 and mounted on the pressing member 160. Alternatively, a plurality of pressing members 160 may be integrally formed on the lower surface of the frame member 150. The bolt 182 of the modification 3 can be modified in the same manner.

Further, the configuration of the dividing device 1 shown in the first embodiment can be appropriately changed from the configuration of FIG. 1 (a). For example, the scribe head 3 may be omitted from the configuration shown in FIG. 1 (a) to configure the dividing device 1. In this case, the scribe line L1 and the circumscribed portion L2 may be formed on the substrate F by another scribe device.

Further, the method of arranging the pressing members 160 according to the second modification is not limited to the method of arranging the pressing members 160 shown in FIG. For example, the spacing between adjacent pressing members 160 and the number of pressing members 160 arranged may be changed from the spacing and number shown in FIG. Further, the diameters of the pressing members 160 do not necessarily have to be the same, and a plurality of types of pressing members 160 having different diameters may be arranged along the end material portion F2.

Further, the configurations of the pressing members shown in the above-described embodiment and the modified examples 1 to 3 may be appropriately modified. For example, in the above-described embodiment and Modifications 1 and 2, the tip of the pressing member is spherical, but the tip of the pressing member may have another shape such as an ellipse or a shape in which the tip of a cone is rounded. ..

Further, in the above embodiment, the pressing member 30 may have a cylindrical shape and may roll on the end material portion F2.

Further, the shape of the product portion F1 is not limited to the shapes shown in the above-described embodiment and the modified examples 1 to 3, and may be, for example, another shape having a straight portion and a curved portion. For example, the shape of the product portion F1 may be a shape in which the corners of a square or trapezoid are rounded in an arc shape. In this case as well, the scrap portion F2 may be pressed so that the pressing position moves in the circumferential direction in the region of the scrap portion F2 surrounding the product portion F1.

Further, in the above embodiment, the substrate F is directly mounted on the mounting surface 21a of the support member 21, but a sheet such as an elastic body is interposed between the substrate F and the mounting surface 21a. You may. In this case, when the scribe line L is formed on the substrate F, it can be laid on the mounting surface 21a of the support member 21. This sheet allows air from the holes 23 formed in the mounting surface 21a to pass through the substrate F.

The mounting surface 21a of the support member 21 has minute irregularities. When a sheet is laid between the substrate F and the mounting surface 21a, the sheet absorbs such minute irregularities, so that the substrate F can be mounted parallel to the horizontal plane on the mounting surface 21a. Therefore, since the substrate F can be stably placed, the scribe line L can be accurately formed, and the substrate F can be divided along the scribe line L.

Further, in the above embodiment, the substrate F is divided by pressing the substrate F by the pressing member 30, but for example, the substrate F is pressed by injecting a fluid such as air from the nozzle. May be good.

In addition, various modifications of the embodiment of the present invention can be made as appropriate within the scope of the technical idea shown in the claims.

1 Dividing device 2 Moving table (moving mechanism)
5 Ball screw (movement mechanism)
4 Break head (movement mechanism)
11 Rail (movement mechanism)
16 Motor (movement mechanism)
21, 121 Support member 21a, 121a Mounting surface 30, 140, 160, 180 Pressing member (pressing means)
Support frame 41
50 Control unit 54 Break head drive unit (pressing position adjusting means)
55 Moving platform drive unit (pressing position adjusting means)
100 Dividing device 110 Elevating mechanism 122 Pedestal part F Board F1 Product part F2 Scrap part L Scrivener L1 Scrivener L2 Circumscribed part L11 Curved part L12 Straight part Q1 Starting point position

Claims (18)

A method of dividing a product portion having a shape including a straight portion and a curved portion from a substrate by a scribe line formed along the outer shape of the product portion.
The scribe line has an circumscribed portion extending to the outer periphery of the substrate.
The starting point position near the circumscribed portion in the region of the end material portion outside the scribe line is pressed by the pressing means.
The pressing position by the pressing means is changed in the circumferential direction of the scribe line in the region of the scrap portion.
A method of division characterized by that. In the division method according to claim 1,
The pressing position by the pressing means is continuously moved from the starting point position in the circumferential direction of the scribe line in the region of the scrap portion.
A method of division characterized by that. The division method according to claim 2.
The pressing position is moved along the curved portion of the scribe line at a speed lower than the speed at which the pressing position is moved along the straight portion of the scribe line.
A method of division characterized by that. The division method according to any one of claims 1 to 3.
The pressing position by the pressing means is intermittently moved from the starting point position to the circumferential direction of the scribe line in the region of the scrap portion.
A method of division characterized by that. The division method according to any one of claims 1 to 4.
The substrate is supported by a support member in the area of the product portion, and a space is provided below the scrap portion.
A method of division characterized by that. In the division method according to any one of claims 1 to 5,
The product part has a shape in which the corners of a rectangle are rounded into an arc shape.
The support member is smaller than the shape of the product portion and has a shape in which rectangular corners are rounded in an arc shape.
The curvature of the arc portion whose corners are rounded in the support member is smaller than the curvature of the arc portion whose corners are rounded in the product portion.
A method of division characterized by that. In the division method according to any one of claims 1 to 6,
The pressing means is a pressing member for pressing the scrap portion.
A method of division characterized by that. A dividing device that divides a product portion having a shape including a straight portion and a curved portion from a substrate by a scribe line formed along the outer shape of the product portion.
A support member that supports the product part and
A pressing member that presses the region of the outer end material of the scribe line, and
A pressing position adjusting means for changing the pressing position by the pressing member in the circumferential direction of the scribe line in the region of the end material portion is provided.
A dividing device characterized by that. In the dividing device according to claim 8,
The pressing position adjusting means is
A moving mechanism that moves the pressing member relative to the substrate,
A control unit that controls the movement mechanism is provided.
By controlling the moving mechanism, the control unit changes the pressing position by the pressing member in the circumferential direction of the scribe line in the region of the scrap material portion.
A dividing device characterized by that. In the dividing device according to claim 9,
The control unit continuously moves the pressing position by the pressing member in the circumferential direction of the scribe line within the region of the scrap material portion.
A dividing device characterized by that. In the dividing device according to claim 10,
The control unit sets the speed at which the pressing member is moved along the curved portion of the scribe line to be lower than the speed at which the pressing member is moved along the straight portion of the scribe line.
A dividing device characterized by that. In the dividing device according to claim 8,
The pressing position adjusting means includes an elevating mechanism for bringing a plurality of the pressing members arranged along the end material portion closer to and away from the substrate.
When the plurality of pressing members are located above the substrate, the distance between the plurality of pressing members and the substrate is set to increase as the position of the scribe line in the circumferential direction changes. ,
A dividing device characterized by that. In the dividing device according to claim 8,
The pressing position adjusting means includes an elevating mechanism for bringing the pressing member continuously arranged along the end material portion closer to and further from the substrate.
When the pressing member is located above the substrate, the distance between the pressing member and the substrate is set to increase as the position of the scribe line in the circumferential direction changes.
A dividing device characterized by that. The dividing device according to any one of claims 8 to 13.
The support member supports the substrate within the area of the product section and supports the substrate.
A space is provided below the scrap portion,
A dividing device characterized by that. The dividing device according to claim 14.
The support member is
The mounting surface on which the substrate is mounted and
A pedestal having a smaller cross-sectional area than the above-mentioned mounting surface,
A dividing device characterized by that. In the dividing device according to any one of claims 8 to 15,
The product part has a shape in which the corners of a rectangle are rounded into an arc shape.
The support member is smaller than the shape of the product portion and has a shape in which rectangular corners are rounded in an arc shape.
The curvature of the rounded arc portion of the support member is smaller than the curvature of the rounded arc portion of the product portion.
A dividing device characterized by that. In the dividing device according to any one of claims 8 to 16.
With the scribe head for forming the scribe line,
A support frame for supporting the outer region of the product part of the substrate, and
The support frame is provided with a support frame drive unit for driving the support frame between a first position that supports the outer region of the product unit and a second position that does not support the outer region of the product unit.
The support frame driving unit sets the support frame to the first position when the scribe line is formed, and sets the support frame to the second position when the end material portion is divided.
A dividing device characterized by that. In the dividing device according to claim 17,
The support frame is divided into a plurality of frame portions along the circumferential direction of the scribe line.
The support frame driving unit sets the frame portion at a position corresponding to the pressing position by the pressing member from the first position to the second position when the end material portion is divided.
A dividing device characterized by that.

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