TW202120238A - Scribing method and dividing method wherein the scribing method forms a scribe line for easily and satisfactorily dividing an end portion from a substrate along a scribe line formed on a substrate - Google Patents

Abstract

The present invention provides a scribing method and a dividing method. The scribing method forms a scribe line for easily and satisfactorily dividing an end portion from a substrate along a scribe line formed on a substrate, and the dividing method is implemented for dividing the substrate along the scribe line. The scribing method for dividing the substrate 1 and forming a scribe line on the substrate 1 includes the scribe line forming step (S11, S12) of forming a main scribe line L1 on the substrate 1 along the contour shape of the product part 2 and forming a sub-scribe line L2 on the area other than the product part 2 of the substrate 1, that is, the end portion 3. In the scribe line forming step (S11, S12), the sub-scribe line L2 has a greater effect on the formation of cracks in comparison with the main scribe line L1. In the scribe line forming step, the sub-scribe line is formed by irradiating a laser beam or using a knife tip. The sub-scribe line is formed together with the main scribe line along a predetermined line corresponding to the sub-scribe line. According to the present invention, the dividing method for dividing a substrate includes a scribe line forming step of forming a main scribe line on the substrate along the contour shape of the product part and forming a sub-scribe line on the area other than the product part of the substrate; and a dividing step of dividing the substrate along the main scribe line and the sub-scribe line, wherein the main scribe line is formed on the substrate along the contour shape of the product part, the sub-scribe line is formed on the end portion which is a region other than the product part, and the sub-scribe line has a greater effect on the formation of cracks in comparison with the main scribe line in the scribe line forming step.

Description

Scribing method and breaking method

The present invention relates to a scribing method for forming a scribe line on a substrate, and a substrate breaking method for slicing the substrate along the scribe line.

Conventionally, the breaking of brittle material substrates such as glass substrates is performed by a scribing step in which a scribe line is formed on the surface of the substrate, and a breaking step in which a predetermined force is applied to the surface of the substrate along the formed scribe line. . In the scribing step, a scribing line is formed along the shape of the product part to be separated from the substrate. In addition, in order to easily separate the product portion from the substrate, there are cases where a scribe line is formed outside the product portion (end material portion).

In Patent Document 1, a cutting method for taking out a disc-shaped glass product from a glass plate is disclosed. In this cutting method, a contour line is provided in order to cut the glass plate product from the glass plate. The area surrounded by the contour line is the product section. The contour line is formed on the glass plate using well-known cutting means such as a cutter.

In addition, as with the outline, a lead wire is provided between the outer circumference of the glass plate and the outer circumference of the outline using a known cutting means such as a cutter at the end material portion. The end material part is divided along the contour line and the lead line, and the product part is cut out from the substrate. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2006-240948 A

[The problem to be solved by the invention]

In the cutting method of Patent Document 1, lead lines are formed on the glass plate in the same manner as the formation of contour lines. When the contour line and the lead-out line are formed, when the scribing load on the substrate is set to be both large, it is easy to form a deeper crack in the substrate. However, if an excessive pressing force is applied to the substrate, there is a risk that a chip (debris) may be generated on the end surface of the product portion after the division. Therefore, the quality of the product department is degraded.

On the other hand, when the contour line and the lead-out line are formed, when the scribing load on the substrate is set to be both small, the pressing force applied to the substrate is reduced, resulting in defects on the end surface of the part after the split suppressed. However, since the scribing load on the substrate is small, no deep cracks are formed in the substrate, and it is difficult to smoothly separate the substrate.

In view of the above problems, the object of the present invention is to provide a scribing method and a cutting method for forming a scribing line along the scribing line formed on the substrate to easily and well separate the end material portion from the substrate. This breaking method breaks the substrate along the scribe line. [Technical means to solve the problem]

The first aspect of the present invention relates to a scribing method for forming a scribe line on the substrate in order to separate the substrate. The scribing method of this aspect includes the step of forming a scribing line, forming a main scribing line along the contour shape of the product portion on the substrate, and forming a sub-scribing on the end portion of the substrate other than the product portion. Line; In the step of forming the scribe line, the secondary scribe line has a greater effect on the formation of cracks than the main scribe line.

If the main scribing line and the sub-scribing line are formed on the substrate, cracks (cracks) are generated in the substrate along each of the main scribing line and the sub-scribing line. According to the scribing method of this aspect, in the scribing line forming step, the aforementioned secondary scribing line has a greater effect on forming cracks than the aforementioned main scribing line. That is, the number of cracks formed along the sub-scribing line is deeper or formed in the substrate than the cracks formed along the main scribing line.

According to this, the end material portion can be easily separated from the substrate along the sub-scribing line.

In addition, when the main scribe line is formed, the effect applied to the substrate is suppressed to be lower than that when the sub-scribe line is formed. Therefore, there is no excessive effect (pressure) applied to the product part when the main scribe line is formed. ) Situation. Therefore, the occurrence of defects and residues in the product part can be suppressed.

As described above, even if the effect on the main scribing line is suppressed, the substrate can be smoothly divided along the sub-scribing line as described above. Therefore, the crack can be moved toward the main scribing line along with the breaking of the sub-scribing line. It stretches smoothly and breaks the substrate smoothly along the main scribe line. According to this, the product part can be cut out smoothly and well.

In the scribing method of this aspect, it may be: in the scribing line forming step, the sub-scribing line is formed to be continuous with the main scribing line.

According to the scribing method of this aspect, since the main scribing line and the sub-scribing line are continuous, the cracks generated along the sub-scribing line extend more smoothly and connect to the main scribing line. Therefore, it is possible to more easily and satisfactorily split the end material part along the main scribe line and the sub-scribe line, and cut out the product part.

In the scribing method of this aspect, it may be: in the scribing line forming step, at least the sub-scribing line is formed by irradiating laser light, and the power of the laser light is set as follows: The score line forms more cracks than the aforementioned main score line.

According to the scribing method of this aspect, since the power of the laser light during the formation of the main scribing line is suppressed compared with the formation of the sub-scribing line, the heat applied to the substrate during the formation of the main scribing line can be suppressed. Thereby, the influence of heat on the product portion can be suppressed, and the occurrence of damage due to heat in the product portion can be suppressed. In addition, since more cracks are formed in the substrate, the substrate can be smoothly divided along the sub-scribing line when the substrate is divided. In addition, the cracks generated along the sub-scribing line smoothly extend to the main scribing line, thereby making it possible to cut out the product part easily and smoothly.

In this case, it may be: irradiating laser light to form both the main scribe line and the sub-scribe line.

According to the scribing method of this aspect, the main scribing line and the sub-scribing line are formed by irradiating laser light. Therefore, when forming the sub-scribing line, it is possible to form the sub-scribing line only by changing the power of the laser light. Accordingly, two scribe lines can be formed by a series of processes, which can simplify the steps.

In the scribing method of this aspect, it may be: in the step of forming the scribing line, at least the sub-scribing line is formed using a knife tip, and the scribing load is set as follows: A deeper crack is formed than the aforementioned main scribe line.

According to the scribing method of this aspect, since the scribing load during the formation of the main scribing line is suppressed compared to the formation of the sub-scribing line, the pressing force applied to the substrate during the formation of the main scribing line can be suppressed. . Thereby, it is possible to prevent excessive pressing force from being applied to the product part, and to suppress the occurrence of chipping in the product part.

In addition, since deeper cracks are formed on the sub-scribing line, the substrate can be smoothly divided along the sub-scribing line when the substrate is divided. In addition, the cracks generated along the sub-scribing line smoothly extend to the main scribing line, thereby making it possible to cut out the product part easily and smoothly.

In this case, it is possible to use the tip of a knife to form both the main scribe line and the secondary scribe line.

According to the scribing method of this aspect, the main scribing line and the sub-scribing line are formed by the tip of a knife. Therefore, when forming the sub-scribing line, it is possible to form the sub-scribing line only by changing the scribing load on the substrate. Accordingly, two scribe lines can be formed by a series of processes, which can simplify the steps.

In the scribing method of this aspect, the scribing line forming step may include the main scribing line forming step of forming the main scribing line and the sub-scribing line forming step of forming the sub-scribing line.

According to the scribing method of this aspect, the main scribing line and the sub-scribing line are formed separately. The main scribe line is the contour shape of the product department. Therefore, in the case of forming the sub-scribing line after the main scribing line is formed, for example, the sub-scribing line can be appropriately formed depending on the size or shape of the product portion.

In the scribing method of this aspect, in the scribing line forming step, together with the main scribing line, the auxiliary scribing line is formed along a predetermined line corresponding to the auxiliary scribing line.

According to the scribing method of this aspect, the main scribing line and the sub-scribing line can be simultaneously formed in the scribing line forming step. Accordingly, the step of forming the scribe line can be efficiently performed.

The second aspect of the present invention relates to a method of breaking the substrate. The severing method of this aspect includes the step of forming a scribing line, forming a main scribing line along the contour shape of the product part on the aforementioned substrate, and forming a sub-scribing line in an area other than the product part, that is, the end material part; In the breaking step, the substrate is divided along the main scribing line and the sub-scribing line; in the scribing line forming step, the sub-scribing line is compared to the main scribing line for forming cracks. A greater effect is produced.

According to the dividing method of this aspect, in the scribe line forming step, the secondary scribe line has a greater effect on the formation of cracks than the main scribe line. That is, the cracks formed along the sub-scribing line are formed deeper in the substrate or more cracks are formed in the substrate than the cracks formed along the main scribing line. As described above, even if the effect on the main scribe line is suppressed, the substrate can be smoothly divided along the sub-scribe line. Therefore, the crack can be smoothly extended to the main scribe line along with the division of the sub-scribe line. Follow the main scribe line to smoothly break the substrate. According to this, the product part can be cut out smoothly and well. [Effects of Invention]

As described above, according to the present invention, it is possible to provide a scribing method and a scribing method in order to be able to easily and well separate the end material portion from the substrate along the scribing line formed on the substrate to form a scribing Line, this breaking method breaks the substrate along the scribe line.

The effect and significance of the present invention will be more apparent from the description of the embodiments shown below. However, the embodiment shown below is only an example when implementing the present invention, and the present invention is not limited at all by the content described in the following embodiment.

<Embodiment 1> FIG. 1 is a schematic diagram showing a state in which a substrate 1 to which the dividing method of this embodiment is applied is divided from a mother substrate 4.

As shown in FIG. 1, a plurality of scribe lines L in the vertical direction and the horizontal direction are formed on the mother substrate 4. When the mother substrate 4 is divided along the scribe line L, a plurality of divided units 1 of a predetermined size can be obtained. In this embodiment, the product part is further cut out from each dividing unit 1 cut out from the mother substrate 4. Hereinafter, in this embodiment, the dividing unit 1 will be described as the substrate 1.

As shown in FIG. 1, the substrate 1 is divided into a product part 2 and an end material part 3. The product part 2 is formed inside the substrate 1. The contour shape of the product part 2 shown in FIG. 1 is a rectangle with rounded corners. Along the contour shape of the product part 2, a main scribe line L1 for cutting out the product part 2 is formed.

Moreover, in the end material part 3 of the board|substrate 1, in order to separate the product part 2 from the board|substrate 1 easily and well, the subscribed line L2 is formed. For example, as shown in FIG. 1, in the contour shape of the product portion 2, the sub-scribing line L2 is formed on the extension line of the two straight portions that are arranged oppositely in the main scribing line L1. In the substrate 1 of FIG. 1, the sub-scribing lines L2 are formed at four places of the end material portion 3, and the end material portion 3 is divided into four regions R1 to R4.

Hereinafter, the cutting method of the present embodiment when the product portion 2 is cut out using the main scribe line L1 and the sub-scribe line L2 in the substrate 1 shown in FIG. 1 will be described.

The main scribing line L1 and the sub-scribing line L2 of FIG. 1 are formed by the scribing device 20 of the substrate cutting system 50 described with reference to FIG. 2. The four regions R1 to R4 in the end material part 3 are sequentially broken from the substrate 1 by the breaking device 30, and the product part 2 is cut out from the substrate 1.

The substrate 1 is, for example, a ceramic substrate such as a glass substrate, a low-temperature sintered ceramic or a high-temperature sintered ceramic, a silicon substrate, a compound semiconductor substrate, a sapphire substrate, a quartz substrate, and other brittle material substrates. In addition, the substrate 1 may also be attached with a thin film of a non-brittle material or a semiconductor material on the surface or inside. Furthermore, the substrate 1 may also be a bonded substrate formed by bonding two substrates. For the laminated substrate, for example, a color filter (CF) is formed on one substrate, and a thin film transistor (TFT) is formed on the other substrate.

FIG. 2 is a schematic diagram of a substrate cutting system 50 for cutting the substrate 1. In addition, in FIG. 2, it is shown that the substrate 1 before the main scribing line L1 and the sub-scribing line L2 are formed is set in the scribing device 20, and the main scribing line L1 and the sub-scribing line L2 are formed respectively. situation.

As shown in FIG. 2, the substrate cutting system 50 includes a conveying device 10, a scribing device 20, a breaking device 30, and a control unit 40.

The conveying device 10 conveys the substrate 1 to the scribing device 20 and the breaking device 30. The conveying device 10 includes a holding part 11, a robot arm 12, and a turning member 13. The holding portion 11 holds the substrate 1. A suction portion 11a is provided on the lower surface of the holding portion 11. The suction part 11a abuts on the surface of the substrate 1, and if a negative pressure is applied to the suction part 11a from a pressure adjusting part not shown, the substrate 1 is suctioned to the suction part 11a. In the manner described above, the holding portion 11 holds the substrate 1.

One end of the arm of the robotic arm 12 can move three-dimensionally. The above-mentioned holding portion 11 is provided at one end of the robot arm 12. The robot arm 12 sets the substrate 1 held by the holding portion 11 at a predetermined position of the scribing device 20 and the breaking device 30.

The revolving member 13 is provided above the holding portion 11, so that the holding portion 11 revolves on the X-Y plane. Thereby, the substrate 1 held by the holding portion 11 is rotated. For example, when the robot arm 12 transports the substrate 1 to the scribing device 20, the holding portion 11 is moved on the X-Y plane by the rotating member 13, thereby setting the area where the main scribing line L1 is formed at an appropriate position.

The scribing device 20 irradiates the substrate 1 with laser light to form the main scribing line L1 and the sub-scribing line L2 on the substrate 1. The scribing device 20 is provided with two scribing heads 21, and the two scribing heads 21 are arranged to face up and down. The two scoring heads 21 are configured to be movable on the X-Y plane. When the end material portion 3 of the substrate 1 is set between the two scribing heads 21 by the robot arm 12, the two scribing heads 21 move along the main scribing line L1 and the sub-scribing line L2, while facing The upper surface and the lower surface of the substrate 1 are irradiated with laser light.

As described above, if the substrate 1 is irradiated with laser light, a large number of very fine cracks (cracks) are generated in the part where the laser light is condensed. Such cracks are continuously generated along a predetermined line, and the substrate 1 is weakened. The cracks generated on the substrate 1 are called "processing marks". In this way, if the substrate 1 is irradiated with laser light, a function for forming cracks occurs.

If an impact is applied to the end material portion 3 by the breaking device 30 described below, the crack further penetrates into the substrate 1, and the penetrated crack extends along the main scribe line L1 and the sub-scribe line L2.

In the present embodiment, when the sub-scribing line L2 is formed on the substrate 1, the main scribing line L1 and the sub-scribing line L2 are given a greater effect for forming cracks. When the secondary scribe line L2 is formed, more cracks are formed in the substrate 1 than when the main scribe line L1 is formed.

When the main scribe line L1 is formed, the energy density of the laser light irradiated on the substrate 1 is adjusted in such a way that no defect or heat influence is generated in the product part 2. When forming the secondary scribe line L2, the energy density of the laser light irradiated on the substrate 1 is adjusted to be larger than the main scribe line L1. In addition, if the energy density of the laser light irradiated on the substrate 1 is to be set to be larger, it is only necessary to increase the power (output) of the laser oscillator or delay the scanning speed to set it.

In the case where the irradiation conditions of the laser light are set as described above, the sub-scribing line L2 is easier to be broken than the main scribing line L1 at the time of breaking, and also extends smoothly toward the main scribing line L1. Thereby, the crack formed along the main scribe line L1 penetrates and extends into the substrate 1. According to this, the substrate 1 can be easily and satisfactorily divided along the main scribing line L1 and the sub-scribing line L2.

The breaking device 30 breaks the substrate 1 along the main scribing line L1 and the sub-scribing line L2 formed by the scribing device 20. The breaking device 30 includes grip portions 31 a and 31 b and a rotating portion 32.

The grip parts 31a and 31b clamp the end material part 3. Specifically, after the end material part 3 is placed on the lower grip part 31a, the upper grip part 31b is lowered to clamp the end material part 3.

The rotating part 32 is a member that can rotate in the up-down direction. The rotating portion 32 is provided with grip portions 31a and 31b. If the rotating part 32 rotates downward in a state where the end material part 3 is clamped by the grip parts 31a and 31b, the four regions R1 to R4 in the end material part 3 are separated from the substrate 1.

In addition, in order to cut the substrate 1 smoothly along the main scribing line L1 and the sub-scribing line L2, for example, a heater or the like may be used near the main scribing line L1 and the sub-scribing line L2. Heating, and easy to break the substrate 1. Thereby, the cracks generated along the main scribing line L1 and the sub-scribing line L2 penetrate further and deeper. According to this, it becomes easier to break the substrate 1.

In addition, there may be one scribing head 21, or only one surface of the substrate 1 may be irradiated with laser light.

The control unit 40 includes arithmetic processing circuits such as a CPU (Central Processing Unit), and storage media such as ROM (Read Only Memory) and RAM (Random Access Memory). The control unit 40 controls each unit in accordance with the program stored in the storage medium.

Next, a method of cutting the substrate 1 using the above-mentioned substrate cutting system 50 will be described.

FIG. 3 is a flowchart showing a cutting method for cutting the end material portion 3 from the substrate 1 to cut out the product portion 2.

The cutting method of the substrate 1 is carried out by the following steps: forming a main scribe line L1 along the contour shape of the product part 2 in the substrate 1 and forming a scribe line L2 on the end material part 3 , The dividing step of dividing the substrate 1 along the main scribe line L1 and the secondary scribe line L2.

Specifically, as shown in FIG. 3, the scribing line forming step includes a main scribing line forming step (S11) of forming a main scribing line L1, and a sub-scribing line forming step (S12) of forming a sub-scribing line L2. .

Furthermore, in the dividing step, the regions R1 to R4 in the end material portion 3 are sequentially divided from the substrate 1 along the main scribe line L1 and the sub-scribe line L2 to obtain the product portion 2 (S13). In addition, the operations of the conveying device 10, the scoring device 20, and the breaking device 30 are controlled by the control unit 40.

Among the above steps S11 to S13, the steps S11 and S12 are performed by the scribing device 20. In the main scribe line forming step of step S11, the control section 40 holds the substrate 1 in the holding section 11 by adsorbing the product section 2 of the substrate 1 to the suction section 11a of the conveying device 10. The control unit 40 conveys the substrate 1 to the scribing device 20 by the robot arm 12.

The robot arm 12 sets the formation target area of the product part 2 in the substrate 1 between the two scribing heads 21. Thereafter, the substrate 1 is irradiated with laser light on the upper and lower surfaces of the substrate 1 by the upper and lower scribing heads 21. Thereby, processing marks are formed along the irradiation track of the laser light. In this way, the main scribe line L1 is formed along the contour shape of the product portion 2 of the substrate 1 (refer to FIG. 1).

In the sub-scribing line forming step of step S12, the sub-scribing line L2 is formed on the end material portion 3 by the scribing device 20 in the same manner as described above. The power of the laser light at this time is set to be higher than when the main scribe line L1 is formed.

4(a) to (d) are schematic diagrams showing the formation patterns of the sub-scribing line L2 with respect to the main scribing line L1 formed on the substrate 1, respectively. In addition, the contour shape of the product part 2 in Figs. 4(a) to (d) is the same as the product part 2 shown in Fig. 1. In addition, Fig. 4(a) is also the same as the pattern of the sub-scribing line L2 in Fig. 1. In addition, in FIGS. 4(a) to (d), the main scribing line L1 is shown by a solid line, and the sub-scribing line L2 is shown by a broken line.

When the contour shape of the product part 2 is a rectangle with rounded corners, for example, a sub-scribing line L2 as shown in Figs. 4(a) to (d) can be formed. Fig. 4(a) is a pattern in which the sub-scribing line L2 is formed on the extension line of the two linear portions oppositely arranged in the Y-axis direction in the main scribing line L1. On the other hand, FIG. 4(b) shows a pattern in which the sub-scribing line L2 is formed on the extension line of the two linear portions oppositely arranged in the X-axis direction in the main scribing line L1.

Fig. 4(c) is the four curved parts adjacent to the straight line part of the main scribe line L1 (that is, the part corresponding to the corners with rounded corners in the contour shape of the product part 2) and the substrate 1 A pattern of sub-scribed lines L2 is formed between the corners. As shown in FIG. 4(c), each of the four sub-scribing lines L2 is formed radially from the four corners of the substrate 1 toward the curved portions of the main scribing line L1.

Fig. 4(d) is a pattern of a sub-scribing line L2 formed between the outer periphery of the substrate 1 and the straight portion of the main scribing line L1. As shown in FIG. 4(d), each of the four sub-scribing lines L2 extends perpendicularly from the four straight portions of the main scribing line L1 to the outer periphery of the substrate 1.

In step S12, the sub-scribing line L2 is formed on the end material portion 3 of the substrate 1. If the sub-scribed line L2 is formed as described above, as shown in FIGS. 4(a) to (d), the end material portion 3 is divided into four regions R1 to R4.

In addition, in FIG. 4(d), each of the four sub-scribing lines L2 may be formed so as to be inclined from the outer periphery of the substrate 1 toward the four straight portions of the main scribing line L1. 4(a)~(d) has four sub-scribing lines L2 formed on the end material part 3. However, it can also be a sub-scribing combining the situation of Fig. 4(a) and the situation of Fig. 4(c), for example The line L2 is formed in the end material part 3, and the end material part 3 is divided into a plurality of regions.

In step S13, the regions R1 to R4 shown in FIGS. 4(a) to (d) are divided from the substrate 1 for each region, and the product part 2 is cut out.

In this embodiment, in the scribe line forming step, the power of the laser light is set to be higher when the sub scribe line L2 is formed (S12) than when the main scribe line L1 is formed (S11). The reason is explained.

When the main scribing line L1 and the sub-scribing line L2 are formed on the substrate 1, a crack is formed in the substrate 1 along the main scribing line L1 and the sub-scribing line L2 (S11, S12). When the substrate 1 is divided, if the crack penetrates the substrate 1 and stretches along the main scribe line L1 and the sub-scribe line L2, the regions R1~R4 divided by the sub-scribe line L2 are divided into each region. The product department 2 is disconnected.

Here, when the laser light is irradiated to form a plurality of cracks along the main scribe line L1 since the formation of the main scribe line L1, when the substrate 1 is divided, first, the cracks are along the auxiliary scribe line L1. The scribe line L2 progresses and the substrate 1 is divided. In addition, the cracks that progressed along the sub-scribing line L2 extend to the side of the main scribing line L1, and it is considered that the product portion 2 can be easily separated from the substrate 1 along the main scribing line.

Therefore, it is considered that it is preferable to form the main scribe line L1 on the substrate 1 in a state where the power of the laser light is increased not only when the sub-scribe line L2 is formed, but also when the main scribe line L1 is formed.

In addition, the power of the above-mentioned laser light is the energy density of the laser light. If the energy density of the laser light is to be set to be larger, you only need to increase the power (output) of the laser oscillator or delay the scanning speed to set it. can.

Generally speaking, when the laser light is irradiated on the substrate to form a scribe line, the greater the power of the laser light, the more susceptible the substrate is to the heat of the laser light. For example, there are cases where the surface of the substrate is damaged. In addition, there are cases in which thin films such as metal, semiconductor, and resin attached to the surface of the substrate have deteriorated. If the substrate is affected by such heat, the quality of the cut-out product portion is likely to be degraded.

Therefore, after the laser light is irradiated along the contour shape of the product part to form a scribe line, when the product part is cut from the substrate, the power of the laser light is restricted. The upper limit of the power of the laser light is adjusted according to the material, thickness and size of the substrate. Accordingly, it is not good to increase the power of the laser light to form both the main scribe line L1 and the secondary scribe line L2.

Therefore, as described above, a method of reducing the power of the laser light to form the main scribing line L1 and the sub-scribing line L2 in a way that the substrate is not affected by heat is conceived.

However, when the power of the laser light is set to be small and the main scribing line L1 and the sub-scribing line L2 are formed on the substrate 1, the number of cracks formed along the main scribing line L1 and the sub-scribing line L2 decreases . Therefore, when the substrate 1 is divided, the penetration of the cracks generated along the main scribe line L1 and the sub-scribe line L2 is insufficient, so that the crack extension is insufficient. Therefore, there is a problem that it is difficult to separate the substrate 1 and the substrate cannot be smoothly separated.

Therefore, in the present embodiment, in the formation of the sub-scribing line L2, the sub-scribing line L2 has a greater effect on the formation of cracks than the main scribing line L1. That is, when the secondary scribe line L2 is formed, compared to when the main scribe line L1 is formed, the power of the laser light is set to be higher to form the secondary scribe line L2 and cause the substrate 1 to crack.

The situation where the secondary scribe line L2 is formed is in the end material part 3. Therefore, when the secondary scribe line L2 is formed, the power of the laser light is set to be higher and the laser light is irradiated to the substrate 1. Even if the end material part 3 is affected by heat, it will not affect the product part 2, or even if there is It's also very small. According to this, a high-quality product part 2 can be cut out from the substrate 1.

In addition, since the power of the laser light is set to be higher when the secondary scribe line L2 is formed than when the main scribe line L1 is formed, the cracks formed along the secondary scribe line L2 are longer than along the main scribe line. There are many cracks formed by the line. When the substrate 1 is divided, the crack formed along the sub-scribing line L2 progresses. First, the substrate 1 is divided along the sub-scribing line L2. Furthermore, the cracks that progressed along the sub-scribing line L2 extend toward the main scribing line L1.

In this way, along the main scribing line L1 and the sub-scribing line L2, the crack spreads well. According to this, the substrate 1 can be easily divided along the main scribing line L1 and the sub-scribing line L2.

As described above, in the scribe line forming step, when forming the sub scribe line L2 (S12), compared to the case of forming the main scribe line L1 (S11) by increasing the power of the laser light, it can be formed along The main scribing line L1 and the sub-scribing line L2 break the substrate 1 easily and well (S13).

That is, when forming the sub-scribing line L2, the power of the laser light is set as follows: more cracks are formed than the cracks formed along the main scribing line L1, and along the main scribing line L1 and the sub-scribing line L2 is progressing well.

<Effects of Embodiment 1> As shown in FIGS. 3 and 4 (a) to (d), the formation of the sub-scribing line L2 has a greater effect on the substrate 1 for forming cracks than when the main scribing line L1 is formed. Specifically, the power of the laser light when forming the secondary scribe line L2 is set to be higher than when the main scribe line L1 is formed.

As a result, the effect applied to the substrate 1 when the main scribe line L1 is formed is suppressed to be lower than that when the sub-scribe line L2 is formed, so that no excessive effect is exerted on the product portion 2 when the main scribe line L1 is formed (pressure). Therefore, the occurrence of defects or remaining in the product portion 2 is suppressed.

As described above, even if the effect on the main scribing line L1 is suppressed, the substrate 1 can be smoothly divided along the sub-scribing line L2 as described above. Therefore, it is possible to follow the division of the sub-scribing line L2 and the crack to the main scribing line. The scribing line L1 extends smoothly and the substrate 1 is smoothly divided along the main scribing line L1. According to this, the product part 2 can be cut out smoothly and well.

As shown in Figs. 4(a) to (d), the sub-scribing line L2 is formed on the substrate 1 to be continuous with the main scribing line L1. Therefore, the cracks generated along the sub-scribing line L2 spread more smoothly and are connected toward the main scribing line L1. Therefore, along the main scribe line L1 and the sub-scribe line L2, the end material part 3 can be divided for each region R1 to R4 more easily and well, and the product part 2 can be cut out.

As shown in Figure 3 and Figure 4(a)~(d), the main scribing line L1 and the sub-scribing line L2 are formed by irradiating the substrate 1 with laser light, but at this time, compared to the sub-scribing line L2 When forming, the power of the laser light when the main scribe line L1 is formed is suppressed. Therefore, it is possible to suppress heat applied to the substrate 1 when the main scribe line L1 is formed. Thereby, the influence of heat on the product portion 2 can be suppressed, and the occurrence of damage due to heat in the product portion 2 can be suppressed.

In addition, since more cracks are formed along the sub-scribing line L2, when the substrate 1 is divided, the substrate 1 can be smoothly divided along the sub-scribing line L2. Furthermore, the cracks generated along the sub-scribing line L2 smoothly extend to the main scribing line L1, whereby the product portion 2 can be easily and smoothly cut out.

In addition, when forming the sub-scribing line L2, only by changing the power of the laser light, the sub-scribing line L2 can be formed. Accordingly, the main scribing line L1 and the sub-scribing line L2 can be formed in a series of processes, which can simplify the steps.

<Embodiment 2> In the first embodiment described above, the substrate 1 is irradiated with laser light to form the main scribing line L1 and the sub-scribing line L2. In the second embodiment, the cutting edge 5 is used to form the main scribing line L1 and the sub-scribing line L2.

The dividing method of the second embodiment is performed by the scribe line forming step and the dividing step (S13) in the same way as the first described embodiment with the flow chart shown in FIG. 3. The scribing line forming step includes a main scribing line forming step (S11) and a sub-scribing line forming step (S12).

Hereinafter, the scribing device 100 of the second embodiment will be described.

FIG. 5 is a diagram schematically showing the structure of the scribing apparatus 100 according to the second embodiment. The scribing device 100 includes a mobile station 101 and a scribing head 120. The moving table 101 is screwed with the ball screw 102. The moving table 101 is supported by a pair of guide rails 103 so as to be movable in the Y-axis direction. Driven by the motor, the ball screw 102 rotates, whereby the moving table 101 moves along the pair of guide rails 103 in the Y-axis direction.

A motor 104 is provided on the upper surface of the mobile station 101. The motor 104 rotates the mounting part 105 located at the upper part in the X-Y plane, and positions it at a predetermined angle. The mounting part 105 which can be rotated horizontally by the motor 104 is equipped with the vacuum suction means which is not shown in figure. The substrate 1 placed on the placing portion 105 is held on the placing portion 105 by the vacuum suction means.

The scribing apparatus 100 is provided with two cameras 106 above the substrate 1 placed on the mounting portion 105, and the scribing device 100 images the alignment marks formed on the substrate 1. In addition, a bridge 107 is bridged on the pillars 108a and 108b so as to straddle the moving table 101 and the placement portion 105 above it.

A rail 109 is installed on the bridge 107. The track 109 and the scribing head 120 are connected via the moving part 110, and the moving part 110 slides on the track 109 so that the scribing head 120 is set to move in the X-axis direction.

When the scribing device 100 is used to form a scribing line on the substrate 1, first, the holder unit 130 with the blade tip 5 is installed on the support 121 of the scribing head 120.

The scribing device 100 uses a pair of cameras 106 to position the substrate 1. Furthermore, the scribing device 100 moves the scribing head 120 to a predetermined position, and applies a predetermined load to the blade tip 5 to make it contact the substrate 1. After that, the scribing device 100 moves the scribing head 120 in the X-axis direction to form the main scribing line L1 on the substrate 1.

The scribing device 100 can rotate the mounting part 105 or move it in the Y-axis direction as needed. When the main scribe line L1 is formed on the substrate 1, the scribing device 100 rotates the placing portion 105 to form the sub-scribe line L2 on the substrate 1.

In the second embodiment described above, although the scribing head 120 moves in the X-axis direction and the placement portion 105 moves and rotates in the Y-axis direction, the scribing device 100 only needs to be connected to the scribing head 120. It is sufficient for the placing portion 105 to move relatively. For example, it may also be a scribing device 100 in which the scribing head 120 is fixed, and the placement portion 105 moves and rotates in the X-axis and Y-axis directions. Moreover, in this case, the camera 106 may also be fixed to the scoring head 120.

When the scribing device 100 is used to form the main scribing line L1 and the sub-scribing line L2 on the substrate 1, the sub-scribing line L2 is compared to the main scribing line L1 for forming cracks in the same way as the above-mentioned embodiment 1. A greater effect is produced. That is, the scribing load on the substrate 1 is set such that the sub-scribing line L2 is larger than the main scribing line L1 to form the sub-scribing line L2.

The scribing load set when the main scribing line L1 and the sub-scribing line L2 are formed is appropriately set according to the type, thickness, size, etc. of the substrate 1. For example, it can be set as follows: the depth of the crack generated in the substrate 1 by the formation of the sub-scribe line L2 is 1.2 times the depth of the crack generated in the substrate 1 by the formation of the main scribe line L1 the above.

In the case of setting as described above, the cracks formed along the sub-scribing line L2 penetrate deeper into the substrate 1 at the time of breaking, and further extend smoothly toward the main scribing line L1. Thereby, the crack formed along the main scribe line L1 penetrates and extends in the substrate 1. According to this, the substrate 1 can be easily and satisfactorily divided along the main scribing line L1 and the sub-scribing line L2.

In addition, the tip 5 used in the formation of the auxiliary scribe line L2 may be the same as that in the formation of the main scribe line L1.

If the main scribing line L1 and the sub-scribing line L2 are formed on the substrate 1 by the above-mentioned scribing device 100 (S11, S12 in FIG. 3), the substrate 1 is transported to a cleaving device not shown in the figure. Each area R1~R4 is divided (S13 in Fig. 3). The breaking device, for example, sets the breaking bar on the main scribe line L1 and the sub-scribe line L2 of the substrate 1 placed on the mounting table, and applies a predetermined pressure to the substrate 1. Thereby, as described above, the crack extends along the main scribe line L1 and the sub-scribe line L2, whereby the substrate 1 can be divided for each of the regions R1 to R4.

In the second embodiment described above, when the sub-scribe line L2 is formed (S12 in FIG. 3), the scribing load is set to be higher than when the main scribe line L1 is formed (S11 in FIG. 3).

Assuming that the scribing load set during the formation of the main scribing line L1 is set to be as high as that of the sub-scribing line L2, there is a risk that an excessive pressing force may be applied to the substrate 1 after breaking. The end surface of the product part 2 may be damaged.

On the other hand, when the scribing load set during the formation of the sub-scribing line L2 is set to be as small as the main scribing line L1, the crack will follow the main scribing line L1 and the sub-scribing line L2 Formed relatively shallowly. In this case, when the substrate 1 is divided, it is difficult to divide the substrate 1 along the main scribe line L1 and the sub-scribe line L2, and the substrate 1 cannot be divided smoothly.

Therefore, in the second embodiment, in the scribe line forming step, when the sub scribe line L2 is formed (S12), the scribing load is set to be higher than when the main scribe line L1 is formed (S11).

That is, when forming the sub-scribing line L2, the scribing load is set as follows: compared with the cracks formed along the main scribing line L1, the cracks are formed deeper in the substrate 1 and along the main scribing line L1 And the sub-score L2 progresses well.

As described above, compared with the formation of the sub-scribing line L2, the size of the scribing load when the main scribing line L1 is formed is suppressed, and therefore the pressing force applied to the substrate 1 when the main scribing line L1 is formed can be suppressed. Thereby, it is possible to prevent excessive pressing force from being applied to the product portion 2 and to suppress the occurrence of chipping in the product portion 2.

In addition, since the cracks are formed deeper in the sub-scribing line L2, the substrate 1 can be smoothly divided along the sub-scribing line L2 when the substrate 1 is divided. In addition, the cracks generated along the sub-scribing line L2 smoothly extend to the main scribing line L1, whereby the product portion 2 can be cut out easily and smoothly.

As in the cutting method of the second embodiment, it is preferable to use the tip 5 to form the main scribe line L1 and the sub scribe line L2 on the substrate 1, for example, the thickness and size of the substrate 1 and the size of the product part 2 It's also a big situation. In the case of this type of substrate 1, there is no need to worry about cracking of the substrate 1 even if the scribing load is strong to a certain degree. Since there is no small curved part that is difficult to process with the tool tip 5, it can be used even if the tool tip 5 is used. The main scribing line L1 and the sub-scribing line L2 are correctly formed.

In addition, in the second embodiment, a knife tip is used and the scribing load is adjusted to form cracks of the desired depth as the main scribing line and the sub-scribing line. However, instead of it, laser melting can be used ( Laser ablation) processing to form grooves of the desired depth as the main scribing line and the sub-scribing line. In this case, just by adjusting the output of the laser oscillator or the scanning speed of the laser irradiation, the energy density of the laser irradiation can be changed to form a groove of the desired depth.

<Change example 1> In the above-mentioned Embodiments 1 and 2, in the scribe line forming step, the main scribe line L1 and the sub-scribe line L2 are formed in separate steps. In Modification 1, in the scribe line forming step, the main scribe line L1 and the sub-scribe line L2 are formed at the same time.

Fig. 6(a) is a flowchart showing the breaking method of Modification Example 1.

As shown in Figure 6(a), the cutting method of Modification 1 is performed by the following steps: a scribe line forming step (S21), forming a main scribe line L1 along the contour shape of the product part 2, and The end material portion 3 forms a sub-scribing line L2; and a dividing step (S22), the regions R1 to R4 in the end material portion 3 are sequentially divided from the substrate 1 along the main scribing line L1 and the sub-scribing line L2 And get the product department 2. In addition, in the cutting method of Modified Example 1, the case where the main scribe line L1 and the sub-scribe line L2 are formed on the substrate 1 by irradiating laser light in the same manner as in the first embodiment will be described.

Fig. 6(b) is a schematic diagram illustrating the formation of the main scribe line L1 and the auxiliary scribe line L2 in the cutting method of Modification Example 1.

In FIG. 6(b), a predetermined line for forming the main scribing line L1 and the sub-scribing line L2 is shown. The part indicated by the dashed line is the line L21~L24 forming the auxiliary scribe line L2, and the part indicated by the solid line is the line L11~L14 forming the main scribe line L1. If laser light is irradiated along these lines L11~L14, L21~L24, the main scribing line L1 and the sub-scribing line L2 shown in Figs. 1 and 4(a) are formed.

The above-mentioned step S21 is performed by the scribing device 20 of FIG. 2. The following describes the path when the laser light is irradiated.

As shown in Fig. 6(b), taking the point LA located on the end edge 1a of the substrate 1 as the starting point, passing through the line L21, passing straight through the line L11 as it is, going back and forth to the line L22 located on the extension of the line L11. After going back and forth to the line L22, it passes through the curved part near the terminal part of the line L11 (the starting end of the line L12), the line L12, and the curved part near the terminal part of the line L12 (the starting end of the line L13) to and from the line L23. After going back and forth to the line L23, it passes through the line L13 and goes back and forth to the line L24 on the extension line of the line L13 as it is. After going back and forth to the line L24, pass through the curved part near the terminal part of the line L13 (the starting end of the line L14), pass through the curved part near the terminal part of the line L14 and the line L14 (the starting end of the line L11), and pass through the line again L21, return to the point LA on the edge 1a.

If the laser light is irradiated along the path described above, the sub-scribing line L2 is formed along the lines L21 to L24, and the main scribing line L1 is formed along the lines L11 to L14.

As described above, in Modification Example 1, the main scribing line L1 and the sub-scribing line L2 are formed with one stroke to the bottom (S21).

After the main scribing line L1 and the sub-scribing line L2 are formed, the substrate 1 is divided along the main scribing line L1 and the sub-scribing line L2 by the breaking device 30 (S22). Step S22 is the same as step S13 of the above-mentioned first embodiment, so the description is omitted.

In Modification Example 1, the sub-scribing line L2 is also formed when the main scribing line L1 is formed. According to this, the main scribe line L1 and the sub-scribe line L2 can be formed in a series of processes, so the steps can be simplified.

In addition, in the cutting method of Modified Example 1, as in Embodiment 2, the scribing device 100 may be used to form the main scribing line L1 and the sub-scribing line L2 with the blade edge 5.

In addition, in the above-mentioned scribe line forming step (S21), in order to form the sub-scribe line L2, the lines L21 to L24 are irradiated with laser light twice. In the case of using the scribing device 100 of the second embodiment, the knife tip 5 scribes the lines L21 to L24 twice.

Here, by irradiating the substrate 1 with laser light multiple times, more cracks are formed in the substrate 1. Or, when the substrate 1 is scribed several times with the blade 5, a deeper crack is formed in the substrate 1.

Therefore, in the cutting method of Modification 1, as described in the above-mentioned Embodiments 1 and 2, when the secondary scribe line L2 is formed, compared to the main scribe line L1, the laser beam is not increased. The power or the setting of increasing the scribing load can also be the same as the power of the laser light or the scribing load when forming the main scribing line L1 to form the secondary scribing line L2. According to this, it is possible to further simplify the scribe line forming step.

In addition, in the breaking method of Modified Example 1, as described in the first embodiment, when forming the sub-scribing line L2, the power of the laser light can also be set as compared with that of the main scribing line L1. Higher. In the case of using the tip 5, the scribing load is set to be higher when forming the auxiliary scribing line L2 than when forming the main scribing line L1.

In addition, in the above, although the formation of the scribe line is started from the point LA of the edge 1a of the substrate 1, it is not limited to this, and the starting point can be determined arbitrarily. In addition, the sub-scribing line L2 may be a pattern as shown in, for example, FIGS. 4(b) and (c).

＜Other modification examples＞ In the above-mentioned Embodiments 1, 2 and Modification 1, the outline shape of the product portion 2 is rectangular, but the outline shape of the product portion 2 may be a shape other than the rectangle.

Figs. 7(a) to 8(d) are schematic diagrams showing the shape of the product part 2 and the pattern of the subscribed line L2 in the separation method of other modified examples, respectively.

Figures 7(a) to (d) show the case where the contour shape of the product part 2 is trapezoidal. In FIG. 7(a), a sub-scribing line L2 is formed on the extension line of the straight portions arranged substantially parallel to each other in the main scribing line L1.

In Fig. 7(b), the main scribing line L1 is different from the straight line part of Fig. 7(a), and the sub-scribing line L2 is formed on the extension line of the straight line part arranged opposite to each other.

Fig. 7(c), in the main scribe line L1, the curve part (corresponding to the rounded corner part in the contour shape of the product part 2) is formed between each of the four corners of the substrate 1. Vice scribe line L2. 7(c), that is, the sub-scribing line L2 is formed radially from each of the four corners of the substrate 1 to the curved part of the main scribing line L1.

In addition, the contour shape of the product part 2 is as shown in Fig. 7(a)~(c), but it may be a straight line between the outer circumference of the substrate 1 and the main scribe line L1 as shown in Fig. 4(d) A sub-scribed line L2 is formed between the parts.

Furthermore, for example, the sub-scribing line L2 combining the situation of FIG. 7(a) and the situation of FIG. 7(c) may be formed in the end material part 3, and the end material part 3 may be divided into a plurality of regions.

8(a) and (b) show the case where the outline shape of the product part 2 is rectangular, but one edge is formed in a curved shape. In Fig. 8(a), a sub-scribing line L2 is formed on the extension line of the straight portions arranged substantially parallel to each other in the main scribing line L1.

Fig. 8(b) is the same as Fig. 4(c) and Fig. 7(c), from the four corners of the substrate 1 to the curved part of the main scribe line L1 (corresponding to the contour shape of the work-in-progress part 2). The part with rounded corners) is formed radially.

Figures 8(c) and (d) show the contour shape of the product part 2 in Figures 8(a) and (b), and the edge arranged opposite to the curved edge is also formed in a curved shape situation.

In Fig. 8(c), similar to Fig. 8(a), a sub-scribing line L2 is formed on the extension line of the straight portions arranged substantially parallel to each other in the main scribing line L1.

Fig. 8(d) is the same as Fig. 8(b), from the four corners of the substrate 1 to the curved part of the main scribe line L1 (equivalent to the rounded corners in the contour shape of the product part 2 ) Is formed into a radial shape.

In addition, the contour shape of the product part 2 is as shown in Fig. 8(a)~(d), but it may be a straight line between the outer circumference of the substrate 1 and the main scribe line L1 as shown in Fig. 4(d) A sub-scribed line L2 is formed between the parts.

In addition, in the above-mentioned first and second embodiments, although the main scribe line L1 and the auxiliary scribe line L2 are formed by irradiating laser light, or by using the blade 5, it may be formed by using laser light. Irradiate both with the tip 5.

For example, in the substrate 1 shown in FIG. 4(a), in the main scribe line forming step, the knife tip 5 is used to form the main scribe line L1 (S11 in FIG. 3), and in the sub-scribe line forming step , The laser light is irradiated to form the sub-scribing line L2 (S12 in Fig. 3).

When the main scribe line L1 and the sub-scribe line L2 are formed as described above, the power of the laser light and the scribing load are set as follows: the effect of forming cracks on the sub-scribe line L2 is compared with that of the main scribe Line L1 is large.

In addition, the breaking method of this embodiment can also be effectively applied to the processing of a display mounted on a smart phone, for example. In recent years, the display of smart phones is expected to have a large area. Therefore, the size of the terminal device is not large, and the camera or the sensor is installed on the front surface of the smartphone. Therefore, a notch (concave-shaped notch) is often formed in the display (notch processing). A camera or sensor is arranged in the notch. If the cutting method of this embodiment is applied to the notch processing, it is possible to manufacture a high-quality display with no defects at the end of the notch portion.

Regarding others, the embodiments of the present invention can be appropriately modified in various ways within the scope of the technical idea shown in the scope of the patent application.

1: substrate 1a: End edge 2: Product Department 3: End parts 4: Mother board 5: Tip of the knife 10: Conveying device 11: Holding part 11a: Adsorption part 12: Robotic arm 13: Swivel member 20: Scribing device 30: Fracture device 31a, 31b: grip 32: Rotating part 40: Control Department 50: Breaking system 100: Scribing device 101: mobile station 102: Ball screw 103: Guide track 104: Motor 105: Placement Department 106: Camera 107: Bridge 108a, 108b: pillars 109: Orbit 110: Mobile Department 120: Scribe head 121: Support 130: Holder unit L1: Main score line L2: Subscribed line L11, L12, L13, L14, L21, L22, L23, L24: Line LA: point R1, R2, R3, R4: area

[Figure 1] is a schematic diagram illustrating a substrate to which the cutting method of Embodiment 1 is applied. [Figure 2] is a schematic configuration diagram of a substrate cutting system that implements the cutting method of the first embodiment. [Fig. 3] is a flow chart showing the breaking method of the first embodiment. [Fig. 4] Fig. 4(a)~(d) are schematic diagrams showing the pattern of sub-scribing lines in the dividing method of the first embodiment. [Fig. 5] is a schematic configuration diagram of a substrate cutting system that implements the cutting method of the second embodiment. [Fig. 6] is a schematic diagram illustrating the formation of the main scribe line and the auxiliary scribe line in the cutting method of Modification Example 1. [Figure 7] Figures 7(a)~(c) are schematic diagrams showing the shape of the product part and the pattern of the sub-scribing line in the separation method of other modified examples, respectively. [Figure 8] Figures 8 (a) to (d) are schematic diagrams showing the shape of the product part and the pattern of the sub-scribing line in the separation method of other modified examples, respectively.

Claims (13)

A scribing method, which forms a scribing line on the aforementioned substrate in order to break the substrate. The scribing method includes: The scribing line forming step is to form a main scribing line along the contour shape of the product portion on the substrate, and forming a secondary scribing line on the end portion of the substrate other than the product portion; In the step of forming the scribing line, the secondary scribing line has a greater effect on the formation of cracks than the main scribing line. Such as the scribing method of claim 1, in which, In the step of forming the scribing line, the sub-scribing line is formed to be continuous with the main scribing line. Such as the scribing method of claim 1, in which, In the step of forming the scribe line, at least the sub-scribe line is formed by irradiating laser light, and The power of the laser light is set as follows: more cracks are formed on the sub-scribing line than the main scribing line. Such as the scribing method of claim 2, in which, In the step of forming the scribe line, at least the sub-scribe line is formed by irradiating laser light, and The power of the laser light is set as follows: more cracks are formed on the sub-scribing line than the main scribing line. Such as the scribing method of claim 3, where: Laser light is irradiated to form both the main scribe line and the sub-scribe line. Such as the scribing method of claim 4, where: Laser light is irradiated to form both the main scribe line and the sub-scribe line. Such as the scribing method of claim 1, in which, In the aforementioned scoring line forming step, at least the aforementioned secondary scoring line is formed using a knife tip, and The scoring load is set in such a way that a deeper crack is formed on the aforementioned sub-scribing line compared to the aforementioned main scribing line. Such as the scribing method of claim 2, in which, In the aforementioned scoring line forming step, at least the aforementioned secondary scoring line is formed using a knife tip, and The scoring load is set in such a way that a deeper crack is formed on the aforementioned sub-scribing line compared to the aforementioned main scribing line. Such as the scribing method of claim 7, in which, The tip of a knife is used to form both the aforementioned main scribe line and the aforementioned secondary scribe line. Such as the scribing method of claim 8, in which, The tip of a knife is used to form both the aforementioned main scribe line and the aforementioned secondary scribe line. Such as the scribing method of any one of claims 1 to 10, wherein: The aforementioned scribing line forming step includes a main scribing line forming step of forming the aforementioned main scribing line, and a sub-scribing line forming step of forming the aforementioned sub-scribing line. Such as the scribing method of any one of claims 1 to 10, wherein: In the aforementioned scribing line forming step, together with the aforementioned main scribing line, a sub-scribing line is formed along a predetermined line corresponding to the aforementioned sub-scribing line. A method for breaking the substrate, which includes: The scribing line forming step is to form a main scribing line along the contour shape of the product portion on the aforementioned substrate, and forming a secondary scribing line in an area other than the aforementioned product portion, that is, the end material portion; In the breaking step, the substrate is broken along the aforementioned main scribe line and the aforementioned secondary scribe line; In the step of forming the scribing line, the secondary scribing line has a greater effect on the formation of cracks than the main scribing line.

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