TW202120914A - Inspection system, inspection method, cutting apparatus, and resin molding apparatus - Google Patents

Abstract

The disclosure relates to an inspection system and an inspection method for inspecting electronic components, a cutting apparatus using the inspection system, and a resin molding apparatus using the inspection system. The disclosure is one which improves the inspection accuracy of electronic components, in which an inspection system (100C) images and inspects an electronic component (Wx) placed on a placing member (5) in which one of the electronic component (Wx) or the placing member (5) on which the electronic component (Wx) is placed contains a fluorescent substance and is provided with an excitation light illuminator (6) that irradiates excitation light for exciting the fluorescent substance to the electronic component (Wx) and the placing member (5); and an imaging apparatus (7) that selectively images the fluorescence or light other than fluorescence generated from the electronic component (Wx) or the placing member (5).

Description

Inspection system, inspection method, cutting device, and resin molding device

The present invention relates to an inspection system and an inspection method for inspecting electronic parts, a cutting device using the inspection system, and a resin molding device using the inspection system.

Conventionally, for example, image inspection has been performed for quality inspection of the size or debris of a plurality of electronic components cut by a cutting device. As an inspection device that performs the image inspection, as shown in Patent Document 1, an inspection device that irradiates electronic components with visible light such as white light and red light to inspect the presence or absence of electronic components, positional deviation, and the like can be considered. [Prior Art Literature]

[Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2002-71577

[The problem to be solved by the invention] In the inspection device that irradiates visible light to inspect the inspection target as described above, for example, the contrast between the electronic part and the mounting member on which the electronic part is mounted is used to inspect the appearance of the electronic part, so the contrast between the two is poor. Become important.

However, due to deterioration of the mounting member or adhesion of dirt, the contrast difference between the two is reduced, and edge detection of electronic parts becomes difficult, causing problems such as delay in operation or undetectability. In addition, depending on the type of electronic component, adjustment for increasing the contrast with the mounting member becomes difficult, and it takes time to set the inspection conditions.

Therefore, the present invention is an invention made to solve the above-mentioned problems, and the improvement of the inspection accuracy of electronic components is its main subject. [Technical means to solve the problem]

That is, in the inspection system of the present invention, in a state where one of the electronic component or the mounting member on which the electronic component is mounted contains a fluorescent substance, the electronic component mounted on the mounting member is photographed and inspected. The inspection system is characterized by comprising: an excitation light illuminating device that irradiates the electronic part and the mounting member with the excitation light of the fluorescent substance; and a photographing device that selectively photographs the electronic part or the The fluorescent light or light other than fluorescent light generated by the mounting member. [Effects of the invention]

According to the present invention, the inspection accuracy of electronic parts can be improved.

Then, the present invention will be explained in more detail with examples. However, the present invention is not limited by the following description.

As described above, in the inspection system of the present invention, one of the electronic component or the mounting member on which the electronic component is mounted contains a fluorescent substance, and the electronic component mounted on the mounting member is photographed for inspection. The system is characterized by comprising: an excitation light illuminating device that irradiates the electronic component and the mounting member with the excitation light of the fluorescent substance; and a photographing device that selectively photographs the electronic component or the carrier Set the fluorescent light or other light generated by the component. In the inspection system, one of the electronic parts or the mounting member contains a fluorescent substance, and the fluorescent light or light other than the fluorescent light generated by irradiating them with the excitation light is selectively captured, so that the electronic parts and the mounting member can be enlarged. The contrast of the set components is poor, which can improve the inspection accuracy of the electronic parts.

For example, when the mounting member contains a fluorescent substance and the electronic component does not contain a fluorescent substance, the electronic component and the mounting member are irradiated with excitation light, whereby the electronic component directly reflects the excitation light and the fluorescent light is emitted from the mounting member. In this state, if the photographing device is used to selectively photograph light (excitation light) other than fluorescent light or fluorescent light, the contrast difference between the electronic component and the mounting member can be increased.

On the other hand, when the electronic component contains a fluorescent substance and the mounting member does not contain a fluorescent substance, the electronic component and the mounting member are irradiated with excitation light, whereby the mounting member directly reflects the excitation light, and the fluorescent light is emitted from the electronic component. Light. In this state, if the photographing device is used to selectively photograph light (excitation light) other than fluorescent light or fluorescent light, the contrast difference between the electronic component and the mounting member can be increased.

Specifically, it is desirable that the excitation light illuminating device has a coaxial illuminating unit that irradiates the electronic component with the excitation light. With this configuration, the electronic component can be imaged through a coaxial optical system such as a half mirror of the coaxial illuminating unit while irradiating the electronic component with excitation light, and thereby the appearance of the electronic component can be inspected with high accuracy.

In addition, it is desirable that the excitation light illuminating device has a ring-shaped illuminating portion that irradiates the electronic component with the excitation light. With this configuration, the electronic component can be photographed from the central opening of the ring-shaped illuminating part while irradiating the electronic component with excitation light, whereby the appearance of the electronic component can be inspected with high accuracy.

As a specific embodiment of the fluorescent substance and the excitation light illuminating device, it can be considered that the fluorescent substance is excited by ultraviolet rays to emit fluorescent light as visible light, and the excitation light illuminating device affects the electronic component and the mounting member. Expose ultraviolet rays. In the above configuration, in order to inspect the surface structure of the electronic part in addition to the appearance of the electronic part, it is desirable that the inspection system includes not only the excitation light illuminating device, but also the electronic parts and the carrier. A visible light illuminating device that sets the component to illuminate visible light.

In order to inspect the surface structure of the electronic component with high accuracy, it is desirable that the visible light illuminating device has a ring-shaped illuminating part that irradiates the electronic component with the visible light. In addition, with the above-mentioned configuration, by setting the excitation light illumination device as coaxial illumination, the appearance inspection of the electronic component will not be hindered.

In order to achieve objective inspection by automatically inspecting electronic parts, it is desirable that the inspection system of the present invention further includes an appearance inspection unit that performs all inspections based on the photographed image obtained by the imaging device. Describe the visual inspection of electronic parts.

As a specific inspection item performed by the appearance inspection unit, at least one of the outer shape of the electronic component, the surface structure of the electronic component, or the marking of the electronic component may be considered.

In addition, in the inspection method of the present invention, one of the electronic component or the mounting member on which the electronic component is mounted contains a fluorescent substance, and the electronic component is photographed while the electronic component is mounted on the mounting member. An inspection method for inspecting parts, comprising: irradiating the electronic part and the mounting member with excitation light of the fluorescent substance, and selectively photographing the electronic part or the mounting member. Fluorescent or light other than fluorescent. According to the inspection method, one of the electronic parts or the mounting member contains a fluorescent substance, and the fluorescence generated by irradiating them with the excitation light or light other than the fluorescence can be selectively photographed, so that the electronic parts and the mounting member can be enlarged. The contrast of the mounted components is poor, which can improve the inspection accuracy of the electronic parts.

Furthermore, the cutting device of the present invention is a cutting device that cuts a plurality of semiconductor wafers through a resin-sealed resin molded product into a plurality of electronic components, and is characterized by including a device for inspecting the plurality of electronic components that have been cut. An inspection system, the inspection system having the above configuration. In the case of the cutting device, the inspection system of the present invention is used to inspect the cut electronic parts, thereby improving the quality of the electronic parts.

In addition, the resin molding apparatus of the present invention is a resin molding apparatus that performs resin molding on a molded object having a plurality of semiconductor wafers, and is characterized in that it includes an inspection system for inspecting a resin molded molded object, the inspection system For the composition. In the case of the resin molding apparatus, the inspection system of the present invention is used to inspect the resin-molded molded object (resin molded product), thereby improving the quality of the resin molded product.

<One embodiment of the present invention> Hereinafter, an embodiment of a cutting device incorporating the inspection system of the present invention will be described with reference to the drawings. In addition, for ease of understanding, any of the drawings shown below are appropriately omitted or exaggerated to be schematically depicted. The same symbols are attached to the same constituent elements, and the description is omitted as appropriate.

<The overall structure of the cutting device 100> The cutting device 100 of the present embodiment cuts a sealed substrate as a resin molded product as a to-be-cut object. In addition, the sealed substrate includes, for example, a substrate, a plurality of semiconductor wafers mounted on a plurality of regions of the substrate, and a sealing resin formed to cover the plurality of regions collectively.

Specifically, as shown in FIG. 1, the cutting device 100 includes a supply module 100A that supplies a sealed substrate W, a cutting module 100B that cuts the sealed substrate W, and a pair of pieces that are cut into pieces. The inspection module 100C, which is an inspection system for inspecting the electronic component Wx, is used as a constituent element. Each constituent element is detachable and replaceable with respect to other constituent elements.

The operation control of the cutting device 100 including the modules 100A to 100C shown below is performed by the control unit CTL provided in the supply module 100A. The control unit CTL may be provided in modules 100B and 100C other than the supply module 100A. In addition, the control unit CTL may be divided into a plurality of modules and provided in at least two of the supply module 100A, the shutoff module 100B, and the inspection module 100C.

The supply module 100A is supplied with the sealed substrate W to be cut from the outside, and accommodates the sealed substrate W. The supply module 100A is provided with a substrate accommodating portion 2 for accommodating the sealed substrate W. The sealed substrate W is transported from the supply module 100A to the cutting module 100B by a transport mechanism (not shown). In addition, the cutting device 100 of the present embodiment includes three substrate accommodating parts 2, but the number of substrate accommodating parts 2 is not particularly limited.

The cutting module 100B cuts the sealed substrate W and singulates it into a plurality of electronic components Wx. The cutting module 100B has a cutting stage 3 on which the sealed substrate W is placed, and a cutting mechanism 4 that cuts the sealed substrate W placed on the stage 3. The cutting mechanism 4 is configured by attaching a rotating knife 42 to the main shaft 41. Then, the platform 3 and the cutting mechanism 4 are relatively moved, whereby the sealed substrate W is cut by the rotary knife 42. In addition, the cutting device 100 of the present embodiment includes two cutting mechanisms 4, but the cutting mechanism 4 may be one.

Specifically, in the cutting module 100B of this embodiment, the stage 3 on which the sealed substrate W is placed is moved in the X direction, and the cutting mechanism 4 is sequentially moved in the Y direction, whereby the sealed substrate W is cut into multiple pieces along the X direction. After that, the platform 3 rotates 90 degrees, and the platform 3 moves in the X direction, and the cutting mechanism 4 moves in the Y direction in turn, whereby the sealed substrate W is covered Chips become electronic parts Wx. After that, the singulated electronic component Wx is transported from the cutting module 100B to the inspection module 100C by a transport mechanism (not shown).

The inspection module 100C images and inspects the electronic components Wx singulated by cutting the module 100B. Hereinafter, a case where no fluorescent substance is contained in the electronic component Wx will be described as an example.

Specifically, the inspection module 100C, as shown in FIGS. 1 and 2, includes: a mounting member 5 for mounting a plurality of electronic parts Wx and containing fluorescent substances; an excitation light illuminating device 6 for electronic parts Wx and a mounting member 5 irradiates the excitation light of the fluorescent substance; and the imaging device 7 captures the fluorescent light generated from the mounting member 5.

The mounting member 5 contains a fluorescent substance at least in the region where the electronic component Wx is mounted, and in this embodiment is a rubber member formed in a flat plate shape. The mounting member 5 is provided on the upper surface of the inspection platform 50, and the platform 50 is relatively moved relative to the excitation light illumination device 6 and the imaging device 7, or the imaging device 7 is relatively moved relative to the platform 50, thereby The multiple electronic components Wx placed on the placement member 5 are inspected. In addition, the plurality of electronic components Wx are collectively transported from the cutting platform 3 to the mounting member 5 by a transport mechanism (not shown).

The fluorescent substance of the present embodiment is excited by, for example, ultraviolet light (Ultraviolet (UV) light) having a wavelength of 250 nm to 400 nm, and emits fluorescent light having a wavelength of, for example, 495 nm to 570 nm, which is visible light. Specifically, as the fluorescent substance, a fluorescent whitening agent can be cited.

The excitation light illuminating device 6 irradiates the electronic component Wx and the mounting member 5 with ultraviolet rays as excitation light, and has a coaxial illuminating unit 61 that irradiates the excitation light from above the electronic component Wx. The coaxial illuminating unit 61 irradiates excitation light from the same direction as the imaging axis of the imaging device 7. Specifically, the coaxial illuminating unit 61 includes an ultraviolet light source 611 such as a light emitting diode (LED) that emits ultraviolet light, and a half mirror 612 that reflects ultraviolet light from the ultraviolet light source 611. The half mirror 612 makes the ultraviolet light from the ultraviolet light source 611 fall on the same axis with respect to the imaging axis of the imaging device 7.

FIG. 3 is a diagram schematically showing the incident light from the coaxial illuminating unit 61 and the emitted light in the electronic component Wx and the mounting member 5 of the present embodiment. In addition, in FIG. 3, for easy understanding, the incident light and the outgoing light are shifted (that is, inclined) from the vertical for illustration. As shown in FIG. 3, the ultraviolet rays irradiated to the electronic component Wx are still reflected as ultraviolet rays. On the other hand, the ultraviolet light irradiated to the mounting member 5 is absorbed by the fluorescent substance contained in the mounting member 5, and the fluorescent substance is excited to emit visible light.

The imaging device 7 captures visible light from above the electronic component Wx, and it is possible to use an imaging device using an imaging element that detects visible light without detecting ultraviolet rays, or an imaging device including a UV cut filter. The imaging device 7 of this embodiment takes an image of the electronic component Wx via the half mirror 612 of the coaxial illuminating unit 61. In addition, as an imaging element used in the imaging device 7, a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS), a charge coupled device (Charge Coupled Device, CCD), or the like can be considered. In the photographed image obtained by the photographing device 7, the mounting member 5 becomes white, and the electronic component Wx becomes black.

In addition, the inspection module 100C of the present embodiment includes not only the excitation light illuminating device 6 but also the visible light illuminating device 8 that irradiates the electronic component Wx and the mounting member 5 with visible light. The visible light illuminating device 8 has a ring-shaped illuminating unit 81 that irradiates visible light from the periphery of the electronic component Wx. The ring illuminating unit 81 has a visible light source 811 such as a white LED arranged to surround the imaging axis of the imaging device 7. Thereby, the imaging device 7 can image the electronic component Wx and the mounting member 5 from the central opening of the ring-shaped illuminating unit 81. In addition, the ring-shaped illuminating unit 81 does not prevent the excitation light illuminating device 6 (specifically, the coaxial illuminating unit 61) from irradiating the electronic component Wx with ultraviolet rays.

In the inspection module 100C configured in this way, the mounting member 5 located outside the electronic component Wx can emit fluorescence, and the contrast difference between the electronic component Wx and the mounting member 5 can be increased. At the same time, the surface of the electronic component Wx is irradiated with visible light from the visible light illuminating device 8, thereby increasing the contrast difference in the surface of the electronic component Wx. In this way, the inspection module 100C can simultaneously perform the inspection of the outer shape of the electronic component Wx and the inspection of the surface structure of the electronic component Wx. As a result, it is possible to reduce the time for setting inspection conditions by changing the image taken for inspection from two to one sheet in the past. In addition, by reducing the number of captured images for inspection, the cycle of inspection of the electronic component Wx can be shortened.

In addition, the inspection module 100C may also include an appearance inspection unit 9 that automatically performs an appearance inspection of the electronic component Wx based on the photographed image obtained by the imaging device 7.

The appearance inspection unit 9 inspects at least one of the outer shape of the electronic component Wx, the surface structure of the electronic component Wx, and the marking of the electronic component Wx. Here, the mark of the electronic component Wx refers to, for example, a mark such as a manufacturing number or an alignment mark when the sealed substrate W is singulated into the electronic component Wx. As a method of inspection, for example, it can be considered that the appearance inspection unit 9 compares the outer shape, surface structure, or mark of the electronic component Wx in the captured image with the sample data used as their reference, thereby inspecting at least one of them. . In addition, the sample data is stored in the appearance inspection section 9 in advance. In addition, the visual inspection part 9 may be provided in the control part CTL, or may be provided separately from the control part CTL.

Furthermore, the inspection module 100C classifies the singulated electronic components Wx into good products and defective products based on the inspection result of the appearance inspection unit 9. Then, good products are transferred to the good product tray 10 for storage by a transfer mechanism (not shown), and defective products are transferred to the defective product tray 11 for storage (see FIG. 1 ).

FIG. 4 shows a captured image in a conventional inspection system that uses only visible light, and a captured image in the inspection system of the present embodiment. In the conventional inspection system, the electronic components are irradiated with visible light and photographed in a state where the electronic components are placed on a black rubber member. The values of the detection part and the contrast difference in FIG. 4 are values in 256 gray scales. The closer the value of the detection part is to white, the larger the value becomes, and the closer to black, the smaller the value becomes.

As can be seen from FIG. 4, in the conventional inspection system, the contrast difference between the electronic component and the black rubber member is about 125 in 256 gray scales. On the other hand, in the inspection system of this embodiment, the contrast difference between the electronic component and the mounting member is 210 in 256 gray scales. In this way, in the inspection system of the present embodiment, the contrast difference between the electronic component and the mounting member can be increased.

<Effects of this embodiment> According to the cutting device 100 of this embodiment, the electronic components Wx that do not contain a fluorescent substance are placed on the placement member 5 containing a fluorescent substance, and the fluorescence generated by irradiating them with excitation light can be increased. The comparison between the electronic component Wx and the mounting member 5 is poor, and the inspection accuracy of the electronic component Wx can be improved. As a result, defective products can be detected and eliminated with higher accuracy, and finally the quality of electronic components Wx as a product can be improved. In addition, in the present embodiment, the fluorescent light is captured, and therefore, the deterioration of the mounting member 5 or the influence of whitening caused by dirt adhesion does not cause delays in the operation of the inspection system or problems that cannot be detected.

<Other Modified Embodiments> In addition, the present invention is not limited to the embodiment.

For example, in the above-mentioned embodiment, the electronic component Wx that does not contain a fluorescent substance is inspected, but the electronic component Wx that contains a fluorescent substance may also be inspected. As the electronic component Wx containing a fluorescent substance, for example, an electronic component using a glass epoxy resin containing a fluorescent substance for a substrate can be considered. When inspecting the electronic component Wx, for example, a black rubber member that does not contain a fluorescent substance is used for the mounting member 5. Furthermore, by irradiating ultraviolet rays in the same manner as in the above-described embodiment to photograph visible light as fluorescent light emitted from the electronic component Wx, a photographed image in which the mounting member 5 appears black and the electronic component Wx appears white can be obtained.

In addition, in the above embodiment, the excitation light illuminating device has a coaxial illuminating unit, but it may have an annular illuminating unit in addition to the coaxial illuminating unit or instead of the coaxial illuminating unit. In addition, the excitation light illuminating device may include a dome illuminating unit having an imaging window at the top.

Furthermore, in the case where the excitation light illuminating device has only the ring-shaped illuminating unit, the visible light illuminating device may be configured to have a coaxial illuminating unit. Thereby, it can be a configuration in which the excitation light illuminating device and the visible light illuminating device do not interfere with each other. In addition, the visible light illuminating device may include a dome illuminating unit having an imaging window on the top.

Furthermore, in the above-mentioned embodiment, the imaging device cuts off ultraviolet light as excitation light and photographs visible light as fluorescent light, but it is also possible to cut off visible light as fluorescent light and photograph ultraviolet light as excitation light.

In addition, as a configuration in which the imaging device captures both ultraviolet and visible light, the imaging device may be configured to perform image processing on the captured image of the imaging device to switchably generate an ultraviolet image and a visible light image.

In the above-mentioned embodiment, the singulated electronic component is inspected, but the mold surface of the resin-molded object (resin molded product) may be inspected. At this time, it can be considered to incorporate the inspection system of the present invention into a resin molding apparatus.

For example, as shown in FIG. 5, the resin molding apparatus 200 includes: a supply and storage module 200A, which is supplied to the pre-sealing substrate W1, and accommodates the sealed substrate W2; a molding module 200B, which performs resin molding on the pre-sealing substrate W1; and resin The supply module 200C supplies the resin material for resin molding; and the inspection module 200D inspects the resin-molded sealed substrate W2.

The supply and storage module 200A is provided with a substrate supply portion 12 for supplying the pre-sealed substrate W1 and a substrate storage portion 13 for storing the sealed substrate W2. The pre-sealing substrate W1 and the sealed substrate W2 are transported between the supply and storage module 200A and the forming module 200B by a transport mechanism (not shown).

The molding module 200B includes a resin molding section 14 having an upper mold, a lower mold, and a mold clamping mechanism for clamping them. Then, the resin material is supplied from the resin supply module 200C toward the lower mold.

The resin supply module 200C is provided with a resin accommodating part 15 for accommodating a resin material, a resin material feeding mechanism 16 for feeding the resin material into the resin accommodating part 15, and a resin conveying mechanism 17 for conveying the resin accommodating part 15. The resin material accommodated in the resin accommodating part 15 is conveyed to the molding module 200B by the resin conveying mechanism 17.

The inspection module 200D is provided between the molding module 200B and the supply and storage module 200A, and the mold surface of the sealed substrate W2 is imaged and inspected by the same configuration as the inspection system of the above-mentioned embodiment. In addition, the inspection module 200D may also include a contact type displacement sensor or an optical displacement sensor, etc., to inspect the thickness of the sealed substrate W2.

In addition, in the resin molding apparatus 200, the inspection system of the present invention may be installed in the molding module 200B, or may be installed in the supply and storage module 200A.

In the above-mentioned embodiment, the inspection system is incorporated in the cutting device or the resin molding device, but the inspection system alone may be used to inspect the electronic components. In addition, the inspection system may be incorporated in a size measuring device that measures the external dimensions of electronic components and the like.

In addition, the present invention is not limited to the above-described embodiments, and of course various modifications can be made without departing from the gist of the present invention.

2: Substrate storage section 3: Cut off the platform (platform) 4: Cut off mechanism 5: Placement of components 6: Excitation light illumination device 7: Camera 8: Visible light lighting device 9: Visual inspection department 10: Good product tray 11: Tray for defective products 12: Substrate supply department 13: Board storage section 14: Resin molding department 15: Resin containment part 16: resin material input mechanism 17: Resin conveying mechanism 41: Spindle 42: Rotary Knife 50: Check the platform (platform) 61: Coaxial lighting department 81: Ring Illumination Department 100: cutting device 100A: Supply module (module) 100B: Cut off the module (module) 100C: Check module (module) (check system) 200: Resin molding device 200A: Supply storage module 200B: forming module 200C: Resin supply module 200D: Check the module 611: UV light source 612: Half mirror 811: Visible light source CTL: Control Department W: substrate W1: Seal the front substrate W2: Sealed substrate Wx: Electronic parts X, Y: direction

Fig. 1 is a schematic diagram showing the configuration of a cutting device according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing the configuration of an inspection module (inspection system) of the embodiment. 3 is a schematic diagram showing incident light and emitted light in the electronic component and the mounting member of the embodiment. 4 is a diagram showing a conventional captured image using only visible light and a captured image using ultraviolet rays according to the present embodiment. Fig. 5 is a schematic diagram showing the configuration of a resin molding apparatus using the inspection system of the present invention.

5: Placement of components

6: Excitation light illumination device

7: Camera

8: Visible light lighting device

9: Visual Inspection Department

50: Platform for inspection (platform)

61: Coaxial lighting department

81: Ring Illumination Department

100C: Check module (module) (check system)

611: UV light source

612: Half mirror

811: Visible light source

Wx: Electronic parts

Claims (10)

An inspection system is an inspection system that photographs and inspects the electronic parts mounted on the mounting member when one of the electronic parts or the mounting member on which the electronic parts is mounted contains a fluorescent substance ,include: An excitation light illuminating device that irradiates the electronic component and the mounting member with the excitation light of the fluorescent substance; and A photographing device selectively photographs fluorescent light or light other than fluorescent light generated from the electronic component or the mounting member. The inspection system according to claim 1, wherein the excitation light illuminating device has a coaxial illuminating unit that irradiates the electronic component with the excitation light. The inspection system according to claim 1 or 2, wherein the excitation light illuminating device has a ring-shaped illuminating part that irradiates the electronic component with the excitation light. The inspection system according to any one of claims 1 to 3, wherein the fluorescent substance is excited by ultraviolet rays to emit fluorescence as visible light, The excitation light illuminating device irradiates the electronic component and the mounting member with ultraviolet rays, The inspection system includes not only the excitation light illuminating device, but also a visible light illuminating device that irradiates visible light to the electronic component and the mounting member. The inspection system according to claim 4, wherein the visible light illuminating device has a ring-shaped illuminating portion that irradiates the visible light on the electronic component. The inspection system according to any one of claim 1 to claim 5, further comprising an appearance inspection unit that performs an appearance inspection of the electronic component based on the photographed image obtained by the imaging device . The inspection system according to claim 6, wherein the appearance inspection section inspects at least one of an outer shape of the electronic component, a surface structure of the electronic component, or a mark of the electronic component. An inspection method in which one of an electronic component or a mounting member on which the electronic component is mounted contains a fluorescent substance, and the electronic component is photographed while the electronic component is mounted on the mounting member. Inspection method of inspection, Irradiating the electronic component and the mounting member with the excitation light of the fluorescent substance, Selectively photograph the fluorescent light or light other than fluorescent light generated from the electronic component or the mounting member. A cutting device is a cutting device that cuts a plurality of semiconductor wafers through a resin-sealed resin molded product into a plurality of electronic parts, The inspection system described in any one of claim 1 to claim 7 for inspecting a plurality of cut electronic parts is included. A resin molding apparatus is a resin molding apparatus that performs resin molding on a molding object having a plurality of semiconductor wafers, The inspection system described in any one of claims 1 to 7 for inspecting a resin-molded molded object is included.

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