TW202115807A - Wet processing device - Google Patents
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- TW202115807A TW202115807A TW108144171A TW108144171A TW202115807A TW 202115807 A TW202115807 A TW 202115807A TW 108144171 A TW108144171 A TW 108144171A TW 108144171 A TW108144171 A TW 108144171A TW 202115807 A TW202115807 A TW 202115807A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/04—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto specially adapted for plate glass, e.g. prior to manufacture of windshields
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/045—Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Cleaning By Liquid Or Steam (AREA)
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Abstract
Description
本發明係有關於晶片的濕製程裝置,特別是一種用於大尺寸矩型玻璃基板的浸泡式濕製程裝置。The invention relates to a wet processing device for wafers, in particular to an immersion wet processing device for large-size rectangular glass substrates.
半導體製程中,前端的電路蝕刻等高精度製程直接在晶圓上加工,後端封裝相關製程精度較低,因此一般將晶圓裁切成複數晶片後分別貼附於玻璃基板再進行封裝相關製程藉此減少加工成本。In the semiconductor manufacturing process, the front-end circuit etching and other high-precision processes are directly processed on the wafer, and the back-end packaging-related processes have low accuracy. Therefore, the wafers are generally cut into multiple chips and attached to the glass substrate for packaging-related processes. This reduces processing costs.
現行的濕製程以噴嘴對旋轉的基板表面噴灑藥液,其藥液無法均勻覆蓋基板表面各處,特別是在於矩形基板的各角落處。再者,若為提升處理速度而加大玻璃基板,當玻璃基板尺寸較大時(一般指至少單邊大於300mm),其因過重而不易控加減速,造成製程良率低。因此現行的濕製程無法兼顧處理速度及製程良率。The current wet process uses nozzles to spray chemical liquid on the surface of the rotating substrate, and the chemical liquid cannot evenly cover all parts of the substrate surface, especially at the corners of the rectangular substrate. Furthermore, if the glass substrate is enlarged in order to increase the processing speed, when the size of the glass substrate is larger (generally at least one side is larger than 300mm), it is too heavy to control the acceleration and deceleration, resulting in low process yield. Therefore, the current wet process cannot balance the processing speed and the process yield.
有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人改良之目標。In view of this, the inventor of the present invention focused on the above-mentioned prior art, especially concentrated research and the application of scientific theory, and tried to solve the above-mentioned problems, which became the goal of the present inventor's improvement.
本發明提供一種用於大尺寸矩型玻璃基板的浸泡式濕製程裝置。The invention provides a immersion type wet process device for large-size rectangular glass substrates.
本發明提供一種濕製程裝置,其包含一處理槽、一支架、一承載組件及至少一致動機構。處理槽頂部設有一開口,承載組件設置在支架,承載組件的至少一部分供承載玻璃基板且可活動地對應開口配置而能夠移動而通過開口出入處理槽。致動機構連動承載組件而能夠驅動承載組件在處理槽內水平移動玻璃基板。The invention provides a wet process device, which comprises a processing tank, a support, a bearing assembly and at least an actuation mechanism. An opening is provided on the top of the processing tank, and the carrying component is arranged on the support. At least a part of the carrying component is configured to carry the glass substrate and movably corresponds to the opening so as to be able to move in and out of the processing tank through the opening. The actuating mechanism is linked to the carrier assembly to drive the carrier assembly to move the glass substrate horizontally in the processing tank.
本發明的濕製程裝置,其承載組件內的底部凸設有用於支撐玻璃基板的複數支撐柱。承載組件設有一升降裝置,升降裝置連動承載組件而能夠升降承載組件通過開口出入處理槽。承載組件包含有一座體以及一承載籃,座體連接支架,承載籃以一旋轉軸桿樞設在座體且旋轉軸桿直立配置,致動機構包含有一馬達,馬達連動旋轉軸桿且能夠驅動旋轉軸桿旋轉而帶動承載籃水平旋轉。In the wet process device of the present invention, a plurality of supporting pillars for supporting the glass substrate are protrudingly provided at the bottom of the supporting assembly. The carrying assembly is provided with a lifting device, which is linked with the carrying assembly to lift the carrying assembly into and out of the processing tank through the opening. The carrying assembly includes a base and a carrying basket. The base is connected to the bracket. The carrying basket is pivoted on the base with a rotating shaft and the rotating shaft is arranged upright. The actuating mechanism includes a motor which is linked with the rotating shaft and can be driven to rotate. The shaft rotates to drive the carrying basket to rotate horizontally.
本發明的濕製程裝置,其承載組件可平移地連接支架,致動機構包含有一往復致動器,往復致動器連動承載組件而能夠驅動承載組件水平往復移動。往復致動器包含一凸輪、一馬達以及一連桿,凸輪樞接支架,連桿的一端樞接凸輪且樞接於凸輪旋轉中心的一側,連桿的另一端樞接承載組件,馬達連動凸輪而能夠驅動凸輪旋轉而往復移動連桿進而往復移動承載組件。In the wet process device of the present invention, the carrier component is connected to the bracket in a translational manner, and the actuation mechanism includes a reciprocating actuator. The reciprocating actuator links the carrier component to drive the carrier component to move horizontally and reciprocally. The reciprocating actuator includes a cam, a motor, and a connecting rod. The cam is pivotally connected to the bracket. One end of the connecting rod is pivotally connected to the cam and is pivoted to one side of the cam rotation center. The other end of the connecting rod is pivotally connected to the bearing assembly, and the motor is linked. The cam can drive the cam to rotate to reciprocate the connecting rod to reciprocate the carrier assembly.
本發明的濕製程裝置,其承載組件包含有一座體、用於承載玻璃基板的一承載籃以及一翻轉致動器,承載籃樞接吊掛於座體,翻轉致動器連動承載籃且翻轉致動器能夠驅動承載籃相對於座體翻轉而傾斜。濕製程裝置更包含一沖洗機構,沖洗機構包含一傾斜軌道以及一沖洗管路,傾斜軌道設置在支架的一側,沖洗管路上具有設有上下相向配置的複數上噴嘴及複數下噴嘴,且沖洗管路設置在傾斜軌道上,當承載籃傾斜時,沖洗管路能夠沿傾斜軌道移動而將上噴嘴及下噴嘴分別移至承載籃的上側及下側以沖洗所述玻璃基板的二面。In the wet process device of the present invention, the carrying assembly includes a base, a carrying basket for carrying the glass substrate, and an overturning actuator. The carrying basket is pivotally hung on the base, and the overturning actuator links the carrying basket and turns over. The actuator can drive the carrying basket to turn and tilt relative to the base. The wet process device further includes a flushing mechanism. The flushing mechanism includes an inclined track and a flushing pipeline. The inclined track is arranged on one side of the bracket. The flushing pipeline has a plurality of upper nozzles and a plurality of lower nozzles arranged in opposite directions. The pipeline is arranged on an inclined rail. When the carrying basket is inclined, the flushing pipeline can move along the inclined rail to move the upper nozzle and the lower nozzle to the upper and lower sides of the carrying basket respectively to wash the two sides of the glass substrate.
本發明的濕製程裝置,其處理槽底部形成至少一坡面且對應坡面的下緣設有至少一排水閥。其坡面為複數,各坡面的上緣相連而形成一脊部且對應每一坡面的下緣分別設有至少一排水閥。排水閥包含一筒體、一活塞以及一致動元件,筒體的一端通過一排液口連通處理槽的底部,筒體的另一端則連通至循環槽,活塞可活動地設置在筒體內,活塞連接致動元件且能夠被致動元件移動而塞閉排液口,活塞形成一錐面且錐面通過排液口露出於處理槽內的底部。處理槽設有一注液頭,注液頭可以與排水閥分別連通一循環槽;開口外環繞設置有一溢流槽道,溢流槽道連通循環槽,且溢流槽道與循環槽之間設有一閥門。循環槽可為複數,各循環槽皆連通注液頭且各循環槽分別連通對應的各排水閥;溢流槽道分別連通各循環槽,且溢流槽道與各循環槽之間分別設有一閥門。注液頭可以連通一清洗液槽。In the wet process device of the present invention, at least one slope is formed at the bottom of the treatment tank and at least one drain valve is provided on the lower edge of the corresponding slope. The slope surface is plural, the upper edge of each slope surface is connected to form a ridge, and at least one drain valve is respectively provided corresponding to the lower edge of each slope surface. The drain valve includes a cylinder, a piston, and an actuating element. One end of the cylinder is connected to the bottom of the processing tank through a drain port, and the other end of the cylinder is connected to the circulation groove. The piston is movably arranged in the cylinder. The actuating element is connected and can be moved by the actuating element to block the liquid discharge port. The piston forms a conical surface and the conical surface is exposed to the bottom of the processing tank through the liquid discharge port. The treatment tank is provided with a liquid injection head, which can be connected to a circulation tank with the drain valve respectively; an overflow channel is arranged around the opening, and the overflow channel is connected to the circulation tank, and there is provided between the overflow channel and the circulation tank. There is a valve. There can be a plurality of circulation tanks, each circulation tank is connected to the liquid injection head and each circulation tank is connected to the corresponding drain valve; the overflow channel is connected to each circulation tank, and there is a respectively between the overflow channel and each circulation tank. valve. The liquid injection head can be connected to a cleaning liquid tank.
本發明的濕製程裝置以浸泡方式處理玻璃基板,並且藉由致動機構帶動玻璃基板在液體中移動使得液體能夠均勻接觸玻璃基板表面。因此,本發明的濕製程裝置能夠處理大尺寸矩型玻璃基板且良率佳。The wet process device of the present invention processes the glass substrate in a soaking manner, and the actuation mechanism drives the glass substrate to move in the liquid so that the liquid can evenly contact the surface of the glass substrate. Therefore, the wet processing apparatus of the present invention can process large-size rectangular glass substrates with good yield.
參閱圖1及圖2,本發明提供一種用於大尺寸矩型玻璃基板10的濕製程裝置,其包含一處理槽100、一支架200、一承載組件300及至少一致動機構400。Referring to FIGS. 1 and 2, the present invention provides a wet processing apparatus for large-size
處理槽100頂部設有一開口101,承載組件300設置在支架200。處理槽100內供盛裝濕製程的藥液或是清洗液等液體20,承載組件300的至少一部分供承載玻璃基板10且可活動地對應開口101配置而能夠移動而通過開口101出入處理槽100,藉此將玻璃基板10浸入藥液中進行濕製程或是浸入清洗液中清洗。本發明不限定支架200的形式,支架200只要能夠供承載組件300設置於其上而使承載組承載的玻璃基板10對應開口101配置即可。因此在能夠達成前述功效的前提下,本發明也不限定支架200的具體設置位置,例如支架200可以設置在處理槽100旁;也可以直接設置在處理槽100上。An
具體而言,承載組件300至少包含有一座體310以及一承載籃320,座體310連接支架200,承載籃320用於承載玻璃基板10且其吊掛於座體310。承載組件300內的底部凸設有用於支撐玻璃基板10的複數支撐柱321,具體而言,支撐柱321設置在承載籃320內的底部,且各撐柱的頂端可以選擇性地設有軟墊322,藉此能夠克服玻璃基板10的平整度公差而避免玻璃基板10在承載籃320內非預期地晃動。Specifically, the
參閱圖1至圖4,承載組件300設有一升降裝置330,升降裝置330連動承載組件300而能夠升降承載組件300通過開口101出入處理槽100,藉此將承載於其上的載玻璃基板10移動而通過開口101出入處理槽100。1 to 4, the
較佳地,承載籃320可以選擇性地藉由一翻轉軸桿302樞設於座體310,且翻轉軸桿302水平配置。承載組件300可以選擇性地更包含一翻轉致動器340,翻轉致動器340連動承載籃320且翻轉致動器340能夠驅動承載籃320沿翻轉軸桿302相對於座體310翻轉而傾斜。藉此將承載於承載籃320的玻璃基板10翻轉傾斜。承載組件300將玻璃基板10傾斜浸入處理槽100入的液體20而能夠減少液面對玻璃基板10所造成的阻力。Preferably, the carrying
致動機構400連動承載組件300而能夠驅動承載組件300水平作動,藉此在處理槽100內水平帶動玻璃基板10使玻璃基板10表面與液體20均勻接觸。本實施例中提供了後述二種致動機構400的具體實施方式,分別以不同的作動方式帶動玻璃基板10。The
參閱圖5,致動機構400可以用於水平旋轉承載籃320。在此體實施方式中,承載籃320以一旋轉軸桿301樞設在座體310且旋轉軸桿301直立配置,致動機構400a包含有一馬達410a,馬達410a連動旋轉軸桿301且能夠驅動旋轉軸桿301旋轉而帶動承載籃320水平旋轉。Referring to FIG. 5, the
參閱圖6至圖8,致動機構400可以用於水平晃動承載籃320。在此體實施方式中,承載組件300的座體310以一滑軌311可平移地連接支架200,致動機構400包含有一往復致動器420,往復致動器420連動承載組件300而能夠驅動座體310及其上的承載籃320水平往復移動。往復致動器420可以藉由馬達410b驅動,往復致動器420包含一凸輪421以及一連桿422,凸輪421樞接支架200,連桿422的一端樞接凸輪421且樞接於凸輪421旋轉中心的一側,連桿422的另一端樞接承載組件300,馬達410b連動凸輪421而能夠驅動凸輪421旋轉而往復移動連桿422進而往復移動承載組件300。然而本發明不以此為限,例如往復致動器420也可以是一氣壓缸,其連接承載組件300且藉由氣壓驅動。Referring to FIGS. 6 to 8, the
參閱圖9及圖12,處理槽100設有一注液頭120,注液頭120可以連通至少一循環槽610以及一清洗液槽620,循環槽610內用於儲存濕製程的藥液,清洗液槽620則用於儲存清洗液,且通過注液頭120將液體20注入處理槽100內。依據濕製程所使用藥液的種類數目,可以設置對應數量的多個循環槽610以分別儲存各種類的藥液。於本實施例中,循環槽610較佳地為兩個,但本發明不限定其數量。9 and 12, the
本發明的濕製程裝置,其處理槽100底部形成至少一坡面110且對應坡面110的下緣設有至少一排水閥500。排水閥500包含一筒體510、一活塞520以及一致動元件530,筒體510的一端通過一排液口511連通處理槽100的底部,活塞520可活動地設置在筒體510內,活塞520連接致動元件530且能夠被致動元件530移動而塞閉排液口511,活塞520形成一錐面521且錐面521通過排液口511露出於處理槽100內的底部。筒體510的另一端可以選擇性地連通至一循環槽610或是連接至排放管路630直接排放。依據濕製程所使用藥液的種類數目,可以設置對應數量的多個排水閥500,排水閥500連通至對應的各循環槽610以回收處理槽100內所盛裝的藥液。於本實施例中,較佳地,各循環槽610皆連通至注液頭120而且分別連接至對應的各排水閥500。藉由各致動元件530能夠依據使用的需求控制各排水閥500開閉,藉此控制排出處理槽100的液體20之去向。In the wet process device of the present invention, at least one
處理槽100內可以選擇地設置複數坡面110,於本實施例中,處理槽100內較佳地設置有一對相背配置的坡面110,但本發明不限定其數量,各坡面110的上緣相連而形成一脊部111且對應每一坡面110的下緣分別設有至少一排水閥500。藉由處理槽100的坡面110以及排水閥500的錐面521能夠加快排水速度,且能夠避免液體20殘留。A plurality of slope surfaces 110 can be optionally provided in the
開口101之外環繞設置有一溢流槽道102,溢流槽道102連通循環槽610,溢流槽道102與各循環槽610之間設有一閥門500a,本發明不限定閥門500a的型式,其較佳地可以如同前述的排水閥500,但也可以是其他型式的閥。然而,溢流槽道102也可以選擇性地連通至排放管路630以供直接排放清洗液,且溢流槽道102與排放管路630之間也可以選擇性地設置另一閥門500a。本發明的濕製程裝置使用時,注液頭120持續地將液體20注入處理槽100內,當處理槽100滿水時,通過開口101溢出的液體20能夠匯集於溢流槽道102,進而回流至循環槽610或是直接排放。依據使用的需求控制溢流槽道102內的各閥門500a開閉,藉此能夠控制排出處理槽100的液體20之去向。開口101的口緣較佳地為鋸齒狀以消除液面張力,故能夠準確控制液面。An
本發明的濕製程裝置使用時,通過注液頭120依序將各藥液注滿處理槽100,並以致動機構400驅動承載組件300將玻璃基板10依序浸入各藥液中。在各段藥液的浸泡程序完成後,通過排水閥500將處理槽100內的藥液排出,通過注液頭120將清洗液注滿處理槽100,再將玻璃基板10浸入清洗液中洗清,其洗清時可以藉由致動機構400在清洗液中旋轉或是往復搖晃玻璃基板10。When the wet process apparatus of the present invention is used, the
參閱圖10及圖11,本發明的濕製程裝置除了藉由浸泡方式清洗玻璃基板10之外,注入清洗液的同時也可以選擇性地更包含一沖洗機構700以沖洗玻璃基板10的二面。具體而言,沖洗機構700包含一傾斜軌道710以及一沖洗管路720,傾斜軌道710設置在支架200的一側,沖洗管路720上具有設有上下相向配置的複數上噴嘴721及複數下噴嘴722,且沖洗管路720設置在傾斜軌道710上,當承載籃320傾斜時,沖洗管路720能夠沿傾斜軌道710移動而將上噴嘴721及下噴嘴722分別移至承載籃320的上側及下側以沖洗所述玻璃基板10的二面。因此沖洗後的清洗液能夠沿著傾斜的玻璃基板10向下流動而離開玻璃基板10,藉此避免玻璃基板10表面沾附殘液。Referring to FIGS. 10 and 11, in addition to cleaning the
本發明的濕製程裝置以浸泡方式處理玻璃基板10,並且藉由400致動機構帶動玻璃基板10在液體20中移動使得液體20能夠均勻接觸玻璃基板10表面。因此,本發明的濕製程裝置能夠處理大尺寸矩型玻璃基板10且良率佳。The wet process apparatus of the present invention processes the
以上所述僅為本發明之較佳實施例,非用以限定本發明之專利範圍,其他運用本發明之專利精神之等效變化,均應俱屬本發明之專利範圍。The foregoing descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patent of the present invention. Other equivalent changes using the patent spirit of the present invention should all fall within the scope of the patent of the present invention.
10:玻璃基板10: Glass substrate
20:液體20: Liquid
100:處理槽100: processing tank
101:開口101: open
102:溢流槽道102: Overflow Channel
110:坡面110: Slope
111:脊部111: spine
120:注液頭120: Injection head
200:支架200: bracket
300:承載組件300: Carrying components
301:旋轉軸桿301: Rotating shaft
302:翻轉軸桿302: Flip shaft
310:座體310: Block
311:滑軌311: Slide
320:承載籃320: Carrying basket
321:支撐柱321: Support Column
322:軟墊322: Soft cushion
330:升降裝置330: Lifting device
340:翻轉致動器340: Flip Actuator
400:致動機構400: Actuating mechanism
410a/410b:馬達410a/410b: Motor
420:往復致動器420: Reciprocating actuator
421:凸輪421: Cam
422:連桿422: connecting rod
500a:閥門500a: Valve
500:排水閥500: Drain valve
510:筒體510: cylinder
511:排液口511: Drain
520:活塞520: Piston
521:錐面521: Cone
530:致動元件530: Actuating element
610:循環槽610: Circulation Slot
620:清洗液槽620: cleaning liquid tank
630:排放管路630: discharge line
700:沖洗機構700: flushing mechanism
710:傾斜軌道710: Inclined track
720:沖洗管路720: flush line
721:上噴嘴721: upper nozzle
722:下噴嘴722: Lower Nozzle
圖1及圖2係本發明較佳實施例的濕製程裝置之示意圖。Figures 1 and 2 are schematic diagrams of a wet process apparatus according to a preferred embodiment of the present invention.
圖3至圖9係本發明較佳實施例的濕製程裝置之各使用狀態示意圖。3 to 9 are schematic diagrams of various usage states of the wet process apparatus according to the preferred embodiment of the present invention.
圖10及11係本發明較佳實施例的濕製程裝置之中的沖洗機構之示意圖。10 and 11 are schematic diagrams of the flushing mechanism in the wet process apparatus of the preferred embodiment of the present invention.
圖12 係本發明較佳實施例的濕製程裝置之流路示意圖。FIG. 12 is a schematic diagram of the flow path of the wet process device according to the preferred embodiment of the present invention.
10:玻璃基板10: Glass substrate
20液:體20 liquid: body
100:處理槽100: processing tank
101:開口101: open
102:溢流槽道102: Overflow Channel
110:坡面110: Slope
111:脊部111: spine
200:支架200: bracket
300:承載組件300: Carrying components
301:旋轉軸桿301: Rotating shaft
302:翻轉軸桿302: Flip shaft
310:座體310: Block
311:滑軌311: Slide
320:承載籃320: Carrying basket
321:支撐柱321: Support Column
322:軟墊322: Soft cushion
400:致動機構400: Actuating mechanism
410a/410b:馬達410a/410b: Motor
420:往復致動器420: Reciprocating actuator
421:凸輪421: Cam
422:連桿422: connecting rod
500a:閥門500a: Valve
500:排水閥500: Drain valve
510:筒體510: cylinder
511:排液口511: Drain
520:活塞520: Piston
521:錐面521: Cone
530:致動元件530: Actuating element
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CN117577577B (en) * | 2024-01-15 | 2024-03-15 | 南通丞胜机电设备有限公司 | Wet etching device for semiconductor chip |
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US6050275A (en) * | 1996-09-27 | 2000-04-18 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
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US7730898B2 (en) * | 2005-03-01 | 2010-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor wafer lifter |
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CN107262437B (en) * | 2017-07-31 | 2019-12-06 | 京东方科技集团股份有限公司 | Cleaning device |
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