TWI823492B - Device and exception handling method for single-wafer wet process - Google Patents

Abstract

This disclosure is directed to an exception handling method for a single-wafer wet process having the following steps: providing a wafer, an arm and a light receiver, the arm is connected to an actuating motor and provided with a nozzle and a light deflector, the actuating motor can rotate among multiple angular positions to swing the arm horizontally, the actuating motor is configured within an angular reference range when the nozzle is located at a center of the wafer, and the light deflector is located at a trigger position; projecting a ray from a predetermined position to the trigger position; swinging the arm and receiving the ray by the light receiver when the light deflector passes the trigger position; shutting the nozzle and rinsing the wafer if the light receiver detects the ray when the actuating motor is configured out of the angular reference range.

Description

Single wafer wet process equipment and abnormality handling method

The present invention relates to wafer processing, in particular to a single wafer wet processing device and an abnormality processing method thereof.

The existing wafer processing process includes multiple steps of soaking in chemical solution, spraying chemical solution, rinsing and drying. In the single-wafer process, the arm can be used to move the nozzle over the wafer to spray the etching solution. Generally speaking, when the arm is not moving, there is a sensor in its standby position, and the sensor can be used to detect whether the arm is deflected. Once deviation occurs, the process will be interrupted.

The aforementioned structure cannot measure the arm deflection while the process is in progress. The deflection generated when the arm starts to move cannot be measured until the arm returns to the standby position after the process is completed. This makes the wafer no longer usable and needs to be scrapped. . Therefore, the detection mechanism of existing single-wafer wet processing equipment often cannot save the wafer currently being processed when the arm is deflected.

In view of this, the inventor has devoted himself to research on the above-mentioned existing technology and cooperated with the application of academic theory to try his best to solve the above-mentioned problems, which has become the goal of the inventor's improvement.

The present invention provides a single wafer wet processing device and an abnormality handling method thereof, which can detect the deflection of mechanical components during the process to further interrupt the process and recover the wafer.

The invention provides an abnormality processing method for a single wafer wet process. The steps include: providing a wafer, a swing arm and a light receiving unit, the actuating motor of which is connected to the swing arm, and the swing arm is equipped with a nozzle, a light steering element and an actuating motor. , the actuating motor has a plurality of circumferential positions arranged at equal angular intervals along the circumferential direction, and the actuating motor can rotate between the circumferential positions to drive the swing arm to swing horizontally, where a reference angle interval is defined among the circumferential positions, when When the nozzle is located above the center of the wafer, the actuation motor is within the reference angle range, and the light steering element is located at a trigger position above the center of the wafer; a light beam is projected from a predetermined position to the trigger position; the swing arm is swinging, and when the light is turned When the element passes through the trigger position, the light receiving unit receives the light beam from the light steering element; the circumferential position of the actuating motor when the light receiving unit detects the light beam is compared with the reference angle interval; when the step is performed, the circumferential position of the actuating motor is When the reference angle range is exceeded, the nozzle is turned off and the wafer is rinsed.

In one embodiment, a light steering element is used to reflect the light beam to redirect the light beam. The predetermined position is located directly above the center of the wafer. The light receiving unit is used to receive the light beam from the light steering element at a predetermined position.

In one embodiment, a light steering element is used to refract the light beam to redirect the light beam.

In one embodiment, a light emitting unit is provided, and the light emitting unit projects a light beam.

In one embodiment, an optical transceiver is provided. The optical transceiver is arranged at a predetermined position. The optical transceiver includes a light emitting unit and a light receiving unit.

The present invention further provides a single wafer wet processing device, which includes: a wafer carrier, a swing arm, a light emitting unit, a light receiving unit, an emergency flushing component and a controller. The swing arm is pivoted on one side of the wafer carrier and can swing horizontally above the wafer carrier. The end of the swing arm is provided with A nozzle and a light steering element. When the nozzle is located above the center of the wafer stage, the light steering element is in a trigger position. The swing arm is equipped with an actuating motor. The actuating motor has a plurality of cycles arranged at equal angular intervals along the circumferential direction. position, the actuating motor can rotate between the circumferential positions to drive the swing arm to swing, wherein a reference angle interval is defined among the circumferential positions. When the light turning element is at the triggering position, the actuating motor is at within the reference angle range. The light emitting unit is arranged at a predetermined position and is configured toward the triggering position so as to be able to project a light beam toward the triggering position. The light receiving unit is arranged corresponding to the light emitting unit. When the light turning element is in the triggering position, the light turning element can redirect the light beam and project it to the light receiving unit. The emergency flushing component corresponds to the wafer stage configuration. The controller is electrically connected to the light receiving unit, the actuation motor and the flushing component.

In one embodiment, the nozzle and the light redirecting element are arranged on the same vertical line.

In one embodiment, the light receiving unit is located at a predetermined position.

In one embodiment, the light redirecting element is a reflector. The light turning element is arranged upward and the normal direction of the light turning element is arranged vertically.

In one embodiment, the light turning element is a lens.

In one embodiment, the exception handling device further includes an optical transceiver. The optical transceiver is disposed at a predetermined position. The optical transceiver includes an optical transmitting unit and an optical receiving unit.

In one embodiment, there are a plurality of swing arms. These swing arms are configured corresponding to the wafer carrier and can respectively swing horizontally above the wafer carrier. When the nozzle of any swing arm is located above the center of the wafer carrier , the light steering element on the swing arm is in the trigger position.

In one embodiment, the emergency flushing component is disposed on one side of the wafer carrier and is adjacent to the wafer carrier.

The single wafer wet process device and abnormality handling method of the present invention can determine whether the component is offset when the light steering element passes the trigger position during the process. Once offset occurs, the process can be immediately interrupted and the process liquid on the wafer can be cleaned. . The recovered wafers are then used in the manufacturing process based on the degree of surface wear. During the process, the light steering element frequently passes through the trigger position, so component deflection can be determined immediately, thereby reducing the amount of wafer scrap caused by component deflection.

10:wafer

100:Wafer carrier

110:Clamp

200/200a:Swing arm

201: Radial reference line

202: Reference angle interval

203: Circumferential position

210/210a:Nozzle

220/220a/220b:Light steering element

230: Actuating motor

231:Drive shaft

300: Optical transceiver

310:Light emitting unit

320:Light receiving unit

400:Emergency flushing component

P1: trigger position

P2: Reserve a location

a~e: steps

Figure 1 is a schematic three-dimensional view of the single wafer wet processing device of the present invention.

Figure 2 is a top view of the single wafer wet processing device of the present invention.

Figure 3 is a top view of the single wafer wet processing device in use according to the present invention.

Figure 4 is a three-dimensional schematic diagram of the actuator motor of the single wafer wet processing device of the present invention.

Figure 5 is a side view of the single wafer wet processing device of the present invention in use.

6 and 7 are schematic diagrams of other modified embodiments of the single wafer wet processing device of the present invention.

Figure 8 is a step flow chart of the abnormality handling method of the single wafer wet process of the present invention.

Figure 9 is a schematic diagram of the wafer rinsed by the single wafer wet processing device of the present invention.

Referring to FIGS. 1 to 5 , the present invention provides a single wafer 10 wet processing device, which includes at least a wafer stage 100 , at least a swing arm 200 , a light emitting unit 310 , a light receiving unit 320 , and an emergency rinse component. 400 and a controller (not shown).

In this embodiment, the wafer stage 100 is used to carry a single wafer 10 , and the wafer stage 100 has a plurality of clamping jaws 110 to clamp the edge of the wafer 10 so that the center of the wafer 10 is aligned with the center of the wafer stage 100 .

The swing arm 200 is pivoted on one side of the wafer stage 100 and can swing the swing arm 200 horizontally above the wafer stage 100 . The swing arms 200 can be plural. The end of at least one of the swing arms 200 is provided with a nozzle 210 and a light turning element 220. When the nozzle 210 is located above the center of the wafer stage 100, the light turning element 220 is located at a triggering position P1. The swing arm 200 is provided with an actuation motor 230 . Generally speaking, the swing arm 200 of the nozzle 210 used for spraying the etching liquid is provided with a light steering element 220; the swing arm 200a of the nozzle 210a used for spraying the cleaning liquid may have no light steering element 220.

Referring to FIG. 4 , the actuating motor 230 has a plurality of circumferential positions 203 arranged at equal angular intervals along the circumferential direction, and the actuating motor 230 can rotate between these circumferential positions 203 to drive the swing arm 200 to swing. In this embodiment, a radial reference line 201 can be defined on the drive shaft 231 of the actuating motor 230, and the angle of the specific radial reference line 201 indicates the circumferential position 203. A reference angle interval 202 is defined among the circumferential positions 203. When the light turning element 220 is located at the trigger position P1, the actuating motor 230 is located within the reference angle interval 202, that is, the direction of the radial reference line 201 is located in the reference angle interval. Within 202. The reference angle interval 202 refers to the interval in which the circumferential position 203 of the actuating motor 230 extends slightly forward and backward when the light steering element 220 stops at the trigger position P1, thereby compensating for the detection time difference caused by the rapid movement of the swing arm 200. .

Referring to FIGS. 1 and 5 , the light emitting unit 310 is disposed at a predetermined position P2 and is configured toward the trigger position P1 so as to project a light beam toward the trigger position P1. The light receiving unit 320 is provided corresponding to the light emitting unit 310. When the light turning element 220 is located at the trigger position P1, the light turning element 220 can redirect the light beam and project it to the light receiving unit 320.

Referring to FIGS. 1 to 3 , in this embodiment, multiple swing arms 200 for spraying etching solution can be provided, and the structures of these swing arms 200 have substantially the same function. These swing arms 200 correspond to the wafer carrier. 100 is configured so that the horizontal swing arm 200 can swing above the wafer stage 100 respectively. When the nozzle 210 of any swing arm 200 is located above the center of the wafer stage 100, the light turning element 220 on this swing arm 200 is located at the triggering position P1.

In this embodiment, as shown in FIG. 5 , the light redirecting element 220 is a reflector. Specifically, the function of the reflector can be achieved by a reflective sticker, or a partial surface of the swing arm 200 can be polished into a mirror surface. achieved. In this embodiment, the light turning element 220 is arranged horizontally upward. The nozzle 210 and the light redirecting element 220 are arranged on the same vertical line, and the light receiving unit 320 is located at a predetermined position P2. Specifically, the exception handling device shown in this embodiment further includes an optical transceiver 300. The optical transceiver 300 is disposed at a predetermined position P2, and the optical transmitting unit 310 and the optical receiving unit 320 are integrated and included in the optical transceiver 300. .

The emergency rinse assembly 400 is configured corresponding to the wafer stage 100 and can supply water to the wafer stage 100 to rinse the wafer 10 carried on the wafer stage 100 . In this embodiment, the emergency cleaning component 400 is disposed on one side of the wafer carrier 100 and is adjacent to the wafer carrier 100 .

The controller is electrically connected to the light receiving unit 320, the actuation motor 230 and the emergency flushing assembly 400. The present invention is not limited to the form of the controller. Generally speaking, it can be achieved by a computer executing corresponding control software, or a customized circuit board can be used to execute a control program. The controller can read the switch signal of the light receiving unit 320. The light receiving unit 320 is in the normally closed state OFF. When the light receiving unit 320 detects the light beam, the controller detects the ON signal. The controller can compare the circumferential position 203 where the actuating motor 230 is located when the light receiving unit 320 detects the light beam with the reference angle interval 202 . As shown in FIG. 9 , when the circumferential position 203 of the actuation motor 230 exceeds the reference angle interval 202 , the controller can immediately turn off the nozzle 210 and start the emergency flushing assembly 400 to flush the wafer 10 .

Referring to FIG. 6 , the light redirecting element 220 a can be a reflecting mirror. The light redirecting element 220 a is tilted and arranged, and the light receiving unit 320 and the light emitting unit 310 are arranged separately and are not located at the predetermined position P2 . When the light emitting unit 310 projects a light beam toward the triggering position P1, the light steering element 220a can reflect and turn the light beam and project it to the light receiving unit 320.

Referring to FIG. 7 , the light turning element 220b can be a lens, and the light receiving unit 320 and the light emitting unit 310 are separately configured and not located at the predetermined position P2. When the light emitting unit 310 projects a light beam toward the triggering position P1, the light turning element 220b can refract and turn the light beam and project it to the light receiving unit 320.

Referring to FIG. 8 , the present invention provides an abnormality processing method for a single wafer 10 wet process, which is applied to the aforementioned single wafer 10 wet process device. In this embodiment, the abnormality processing method of the single wafer 10 wet process of the present invention includes the steps described below.

Referring to Figures 1 to 3 and 8, first, in step a, the aforementioned single wafer 10 wet processing device is provided, so the swing arm 200 and the light receiving unit 320 are provided, and a wafer 10 is carried on the wafer stage. 100 for wet processing.

Referring to FIGS. 1 and 5 , in the aforementioned single wafer 10 wet processing device, at least one swing arm 200 is provided with a nozzle 210 for spraying etching liquid, a light turning element 220 and an actuating motor 230 . In this embodiment, the nozzle 210 and the light steering element 220 are arranged on the same vertical line, but the invention is not limited to this.

Referring to FIGS. 2 to 4 , the actuating motor 230 has a plurality of circumferential positions 203 arranged at equal angular intervals along the circumferential direction, and the actuating motor 230 can rotate between the circumferential positions 203 to drive the swing arm 200 to swing horizontally. A reference angle interval 202 is defined within the circumferential position 203 of the actuation motor 230 , within which the actuation motor 230 is located when the nozzle 210 is located above the center of the wafer 10 .

1 and 8 , following step a, in step b, a light beam is projected from the predetermined position P2 to the trigger position P1. Specifically, in this step, the light emitting unit 310 is used to project the light beam. In this embodiment, the predetermined position P2 and the triggering position P1 are both located directly above the center of the wafer 10, and the predetermined position P2 is located directly above the triggering position P1, but the invention is not limited thereto. Figures 6 to 7 Various different predetermined position P2 configurations are also provided in the corresponding previous article.

Referring to Figures 2, 3, 5 and 8, following step b, swing the swing arm 200 in step c. When the light turning element 220 passes through the trigger position P1, the light receiving unit 320 receives the signal from the light turning element 220. beam. In this step, the light steering element 220 is used to reflect the light beam to divert the light beam. Here, the light steering element 220 is in the form of a mirror, but the present invention is not limited thereto. As shown in FIG. 7 , the light steering element 220b in the form of a lens can also be used to refract the light beam to redirect the light beam.

In this embodiment, the light receiving unit 320 is used to receive the light beam from the light steering element 220 at a predetermined position P2. Specifically, the optical transceiver 300 including the light emitting unit 310 and the light receiving unit 320 is provided at the predetermined position P2. However, the present invention is not limited thereto. The light receiving unit 320 may also be configured separately from the light emitting unit 310 as shown in FIGS. 6 and 7 instead of being disposed at the predetermined position P2.

Referring to FIGS. 4 to 5 and 8 , following step c, in step d, the circumferential position 203 of the actuating motor 230 when the light receiving unit 320 detects the light beam is compared with the reference angle interval 202 . In this embodiment, a controller electrically connected to the light receiving unit 320 and the actuating motor 230 is used for comparison.

Referring to FIGS. 8 and 9 , following step d, in step e, when the circumferential position 203 of the actuating motor 230 in the above step exceeds the reference angle interval 202 , the nozzle 210 is turned off and the wafer 10 is rinsed. In this embodiment, the controller may further be electrically connected to the emergency flushing component 400 adjacent to the wafer stage 100 . When the circumferential position 203 of the actuation motor 230 exceeds the reference angle interval 202, the controller can immediately turn off the nozzle 210 and start the emergency flushing assembly 400 to flush the wafer 10.

The single wafer 10 wet process device and abnormality handling method of the present invention can determine whether the component is offset when the light steering element 220 passes the trigger position P1 during the process. Once offset occurs, the process can be immediately interrupted and the wafer 10 can be cleaned. process chemicals. The recovered wafer 10 is then determined whether to be used in the manufacturing process again based on the degree of surface wear. During the process, the light turning element 220 frequently passes through the trigger position P1, so the component offset can be determined immediately, thereby reducing the amount of scrapping of the wafer 10 caused by the component offset.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Other equivalent changes that apply the patent spirit of the present invention shall all fall within the patent scope of the present invention.

10:wafer

100:Wafer carrier

110:Clamp

200: Swing arm

210:Nozzle

220:Light steering element

230: Actuating motor

231:Drive shaft

300: Optical transceiver

400:Emergency flushing component

P1: trigger position

P2: Reserve a location

Claims (16)

An abnormality processing method for a single wafer wet process: a) Provide a wafer, a swing arm, a nozzle and a light receiving unit. The swing arm is provided with a nozzle, a light steering element and an actuation motor. The actuation motor There are a plurality of circumferential positions arranged at equal angular intervals along the circumferential direction, and the actuating motor can rotate between the circumferential positions to drive the swing arm to swing horizontally, wherein a reference angle interval is defined among the circumferential positions. , when the light steering element is located at a triggering position above the center of the wafer, the actuating motor is located within the reference angle interval; b) projects a light beam from a predetermined position to the triggering position; c) swings the swing arm , when the light steering element passes the trigger position, the light receiving unit receives the light beam from the light turning element; d) Compare the circumferential position of the actuating motor when the light receiving unit detects the light beam. the reference angle interval; and e) when the circumferential position of the actuation motor exceeds the reference angle interval in step d, the nozzle is turned off and the wafer is rinsed. The abnormality handling method of a single wafer wet process as described in claim 1, wherein in step c, the light steering element is used to reflect the light beam to redirect the light beam. The abnormality processing method of a single wafer wet process as described in claim 2, wherein the predetermined position is located directly above the center of the wafer. The abnormality handling method of a single wafer wet process as described in claim 3, wherein in step c, the light receiving unit is used to receive the light beam from the light steering element at the predetermined position. The abnormality processing method of a single wafer wet process as described in claim 1, wherein in step c, the light steering element is used to refract the light beam to redirect the light beam. The abnormality processing method of a single wafer wet process as claimed in claim 1, wherein a light emitting unit is provided in step a, and the light emitting unit is used to project the light beam in step c. The method for handling exceptions in a single wafer wet process as described in claim 6, wherein an optical transceiver is provided in step a, and the optical transceiver is arranged at the predetermined position. The optical transceiver includes the light emitting unit and the light receiving unit. unit. A single wafer wet processing device includes: a wafer carrier; a swing arm, which is pivoted on one side of the wafer carrier and can swing horizontally above the wafer carrier; the end of the swing arm is provided with a The nozzle and a light steering element. When the nozzle is located above the center of the wafer stage, the light steering element is in a triggering position. The swing arm is provided with an actuation motor, and the actuation motor has equal angular intervals along the circumferential direction. A plurality of circumferential positions are configured, and the actuating motor can rotate between the circumferential positions to drive the swing arm to swing, wherein a reference angle interval is defined among the circumferential positions. When the light turning element is located at the At the trigger position, the actuation motor is located within the reference angle interval; a light emitting unit is set at a predetermined position and is configured toward the trigger position to project a light beam toward the trigger position; a light receiving unit corresponds to the light emission The unit is configured such that when the light steering element is located at the triggering position, the light steering element can redirect the light beam and project it to the light receiving unit; an emergency flushing component corresponding to the configuration of the wafer stage; and a controller electrically connected The light receiving unit, the actuation motor and the flushing component. The single-wafer wet processing device of claim 8, wherein the nozzle and the light redirecting element are arranged on the same vertical line. The single wafer wet processing device as claimed in claim 8, wherein the light receiving unit is located at the predetermined position. The single-wafer wet processing device of claim 8, wherein the light redirecting element is a reflector. The single-wafer wet processing device as claimed in claim 11, wherein the light turning element is arranged upward and the normal direction of the light turning element is arranged vertically. The single-wafer wet processing device of claim 8, wherein the light turning element is a lens. The single-wafer wet process device of claim 8 further includes an optical transceiver, the optical transceiver is disposed at the predetermined position, and the optical transceiver includes the light emitting unit and the light receiving unit. The single wafer wet processing device as described in claim 8, wherein the swing arms are plural, and the swing arms are arranged corresponding to the wafer carrier and can respectively swing horizontally to above the wafer carrier. When any one of the swing arms is When the nozzle of the arm is located above the center of the wafer stage, the light turning element on the swing arm is in the triggering position. The single-wafer wet processing device of claim 8, wherein the emergency cleaning component is disposed on one side of the wafer carrier and is adjacent to the wafer carrier.

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