JP2009158597A - Substrate treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress a substrate treatment defect by detecting a leakage fault of a treatment liquid valve and a fault of a suction means. <P>SOLUTION: The substrate treatment apparatus includes a nozzle 12 which discharges a treatment liquid to a substrate W, a treatment liquid supply pipe 25 connected to the nozzle 12, and first and second treatment liquid valves 28A and 28B interposed in the treatment liquid supply pipe 25. To a branch position 36 set between the first treatment liquid valve 28A and nozzle 12, a treatment liquid suction pipe 32 is connected to and branched from the treatment liquid supply pipe 25. A suction device 34 is connected to the treatment liquid suction pipe 32, and a suction valve 33 is interposed at its middle part. The treatment liquid supply pipe 25 has a liquid level detection part 40 along a perpendicular direction between the branch position 36 and nozzle 12. A liquid level sensor 41 is disposed at a liquid level detection position 42 set at the liquid level detection part 40. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus that performs processing using a processing liquid on a substrate. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photo A mask substrate is included.

In a manufacturing process of a semiconductor device or a liquid crystal display device, a substrate processing apparatus that performs processing using a processing liquid on a substrate such as a semiconductor wafer is used. Such substrate processing apparatuses include a batch type that performs processing on a plurality of substrates at once and a single-wafer type that performs processing on each substrate.
The single wafer type substrate processing apparatus includes a spin chuck that rotates while holding the substrate substantially horizontally, and a processing liquid nozzle that supplies a processing liquid to the substrate held by the spin chuck. For example, as a processing liquid nozzle, the discharge unit is held near the tip of a fixed nozzle in which the discharge unit is fixed at a fixed position, or a swinging arm that swings along a substrate held by a spin chuck. A scan type nozzle that scans the processing liquid supply position on the substrate by swinging the arm is used.

FIG. 4 is an illustrative view showing a configuration for supplying the treatment liquid. A processing liquid pipe 5 is connected to the processing liquid nozzle 1, and a processing liquid valve 6 is interposed in the processing liquid pipe 5. The supply and stop of the processing liquid 10 to the substrate W is controlled by opening and closing the processing liquid valve 6.
The processing liquid nozzle 1 has a horizontal portion 2 and a hanging portion 3 that hangs down from the horizontal portion 2, and a lower end of the hanging portion 3 serves as a processing liquid discharge port 4.

A suction pipe 7 is branched from the treatment liquid pipe 5 between the treatment liquid valve 6 and the treatment liquid nozzle 1. The suction pipe 7 is connected to a suction device (not shown) via a suction valve 8.
When the processing liquid valve 6 is closed and the supply of the processing liquid 10 is stopped, the suction valve 8 is opened, and the processing liquid on the processing liquid nozzle 1 side is sucked from the processing liquid valve 6. The suction of the processing liquid is performed until the front end surface of the processing liquid retracts to the horizontal part 2.
JP 2005-277111 A

However, when the processing liquid valve 6 breaks down and the processing liquid leaks, there is a concern that the front end surface of the processing liquid advances from the horizontal portion 2 to the drooping portion 3 and drops from the processing liquid discharge port 4. is there. As a result, the processing liquid may drop on the substrate W before the processing liquid supply start timing or after the processing liquid supply stop timing. As a result, the substrate processing becomes defective.
Such a substrate processing defect is often discovered only after the processed substrate W is verified, and there is a problem that a large number of processing defective substrates are generated in lot units, resulting in a large loss.

  Further, if a failure occurs in the suction system including the suction valve 8 and the suction device, the front end surface of the processing liquid cannot be retracted to the horizontal portion 2 and may remain in the hanging portion 3. Therefore, the residual processing liquid 10 in the processing liquid nozzle 1 may fall on the substrate W. Accordingly, the start and / or stop timing of the treatment liquid cannot be accurately defined, and there is a possibility that the processing of the substrate becomes defective or the processing varies among the substrates.

  For example, in the case of a scan type nozzle, pre-dispensing is performed in a pre-dispensing pod on the side of the spin chuck, and then the processing liquid nozzle is guided onto the substrate by swinging of the swing arm. In this case, if the processing liquid drops from the processing liquid nozzle immediately after pre-dispensing, it is not possible to accurately define the processing start timing by the processing liquid. More specifically, the processing liquid may drop on the substrate before the ejection unit reaches the processing start position, and the processing on the substrate may be defective.

Accordingly, an object of the present invention is to provide a substrate processing apparatus capable of detecting a failure of a processing liquid valve and suppressing or preventing a substrate processing defect caused by a processing liquid leak.
Another object of the present invention is to provide a substrate processing apparatus capable of detecting a failure of a suction means and suppressing or preventing a substrate processing failure caused by an inadvertent supply of processing liquid.

  In order to achieve the above object, according to the first aspect of the present invention, there is provided a nozzle (12) for discharging a processing liquid for processing the substrate (W) and a nozzle connected to the nozzle and supplying the processing liquid to the nozzle. A treatment liquid supply pipe (25), a treatment liquid valve (28A) interposed between the treatment liquid supply pipe and switching supply and stop of the treatment liquid to the nozzle, and between the treatment liquid valve and the nozzle A processing liquid suction pipe (32) for branching and connecting to the processing liquid supply pipe at the branch position (36) set to the above, and sucking and discharging the processing liquid in the processing liquid supply pipe, and the processing liquid suction pipe A suction means (33, 34) for sucking the processing liquid in the processing liquid supply pipe through the pipe, and processing in the processing liquid supply pipe at a predetermined liquid level detection position set between the branch position and the nozzle. Treatment liquid tip surface detection hand that detects the liquid tip surface (41) a a substrate processing apparatus. The alphanumeric characters in parentheses indicate corresponding components in the embodiments described later. The same applies hereinafter.

  According to this configuration, the processing liquid can be supplied to the nozzle through the processing liquid supply pipe by opening the processing liquid valve, and the processing liquid can be discharged from the nozzle. By closing the processing liquid valve, the processing liquid discharge from the nozzle can be stopped. By operating the suction means with the processing liquid valve closed, the processing liquid on the nozzle side is sucked from the branch position of the processing liquid supply pipe through the processing liquid suction pipe, and the front end surface of the processing liquid in the processing liquid pipe is removed. Can be retreated.

  If the processing liquid is sucked in until the processing liquid front end surface is retracted from the liquid level detection position, then if the processing liquid front end detection means detects the processing liquid front end surface, a leakage failure of the processing liquid valve occurs. I understand that. In this way, it is possible to detect a leakage failure of the processing liquid valve. In addition, if it is not possible to detect that the processing liquid front end surface has moved backward from the liquid level detection position even if the suction means is operated for a time sufficient to retract the processing liquid front end surface from the nozzle to the liquid level detection position, It can be seen that there is a problem with the suction means. Thus, a failure of the suction means can be detected. In this way, since the failure of the processing liquid nozzle and the suction means can be detected, it is possible to suppress or prevent the processing liquid from being inadvertently supplied to the substrate at an undesired timing. Can do.

  The substrate processing apparatus may further include a processing chamber in which the nozzle is disposed, and a processing liquid unit in which the processing liquid valve, the suction unit, and the processing liquid front end surface detecting unit are disposed. In this case, the processing liquid may be supplied from the processing liquid unit to the processing chamber through the processing liquid supply pipe, and the liquid level detection position may be set in the processing liquid unit. In this case, the suction means is operated so as to suck the processing liquid until the front end surface of the processing liquid moves backward from the liquid level detection position in the processing liquid unit.

  According to a second aspect of the present invention, after the processing liquid valve is closed, the suction means (S1, S2) for operating the suction means to suck and remove the processing liquid in the processing liquid supply pipe ( 55), and the control means determines that an abnormality has occurred in the processing liquid valve in response to the processing liquid tip surface detecting means detecting the processing liquid tip surface after the suction step. The substrate processing apparatus according to claim 1, further comprising processing liquid valve abnormality processing means (S6, S7) for performing predetermined processing liquid valve abnormality processing.

  According to this configuration, the processing liquid valve is closed, and the processing liquid in the processing liquid supply pipe is sucked by the suction means (more specifically, the processing liquid is sucked until the front end surface of the processing liquid moves backward from the liquid level detection position to the branch position side). ), The output of the processing liquid tip surface detecting means is monitored. Since the processing liquid valve is closed, as long as this processing liquid valve is normal, there is no supply of processing liquid, and therefore the front end surface of the processing liquid should not move to the nozzle side. Nevertheless, if the processing liquid front end surface detecting means detects the processing liquid front end surface, a leak failure has occurred in the processing liquid valve. Accordingly, the processing liquid valve abnormality processing is performed in response to the processing liquid front end surface detecting means detecting the processing liquid front end surface. This processing liquid valve abnormality processing may be processing including alarm generation processing, substrate processing stop processing, and the like.

  According to a third aspect of the present invention, in addition to the first processing liquid valve that is the processing liquid valve, the second processing liquid is interposed in the processing liquid supply pipe, and switches between supply and stop of the processing liquid to the nozzle. The processing liquid valve abnormality processing further including a processing liquid valve (28B) and performed by the processing liquid valve abnormality processing means includes a process of closing the second processing liquid valve and stopping the supply of the processing liquid to the nozzle. The substrate processing apparatus according to claim 2. It is preferable that the second processing liquid valve is maintained in an open state at a normal time when no abnormality occurs in the first processing liquid valve.

  According to this configuration, the second processing liquid valve is interposed in the processing liquid supply pipe in addition to the first processing liquid valve. When it is determined that a leak failure has occurred in the first processing liquid valve, the second processing liquid valve is closed. Thereby, supply of the process liquid to a nozzle can be stopped. As a result, it is possible to suppress or prevent the processing liquid from being supplied to the substrate at an undesired timing due to a leakage failure of the first processing liquid valve. In this way, processing defects on the substrate can be more reliably suppressed or prevented.

  The invention according to claim 4 further includes control means for performing a suction step of operating the suction means to suck and remove the processing liquid in the processing liquid supply pipe after closing the processing liquid valve. When the means does not detect that the front end surface of the processing liquid has moved backward from the liquid level detection position toward the branch position with reference to the output of the processing liquid front end surface detection means during or after the suction step 4. The substrate processing apparatus according to claim 1, further comprising a suction abnormality processing unit (S <b> 3, S <b> 4) that determines that the abnormality of the suction unit has occurred and performs a predetermined suction abnormality process. 5. It is.

  According to this configuration, it is detected by referring to the output of the processing liquid front end surface detecting means whether or not the front end surface of the processing liquid has moved backward from the liquid level detection position toward the branch position. If such retreat of the front end surface of the processing liquid is not detected, it is determined that an abnormality has occurred in the suction means, and suction abnormality processing is performed. This abnormal suction process may be a process including generating an alarm and stopping the substrate processing apparatus.

  For example, the output of the processing liquid front end surface detecting means may be monitored during the suction process to detect whether the front end surface of the processing liquid has passed through the liquid level detection position and moved back to the branch position side. In addition, after the suction means is operated for a time sufficient for the treatment liquid tip surface to move backward from the liquid level detection position to the branch position side (however, the time corresponding to the case when the suction means is normal), With reference to the output of the detection means, it may be detected whether or not the front end surface of the processing liquid has retracted to the branch position side from the liquid level detection position (whether or not the processing liquid exists at the liquid level detection position).

According to a fifth aspect of the present invention, there is provided a liquid level detection unit (40) in which the processing liquid supply pipe has a height difference so that the nozzle side is higher than the branch position side in a section including the liquid level detection position. 5. The substrate processing apparatus according to claim 1, wherein the processing liquid front end surface detecting unit detects a processing liquid front end surface in the liquid level detection unit. .
According to this configuration, the processing liquid supply pipe is provided with the liquid level detection unit with a difference in height so that the nozzle side is higher than the branch position in the section including the liquid level detection position. Accordingly, the position of the front end surface of the processing liquid can be stabilized using gravity, and therefore it can be accurately detected whether or not the front end surface of the processing liquid is on the nozzle side with respect to the liquid level detection position. It is preferable that the liquid level detection unit is provided along the vertical direction. Thereby, more accurate detection becomes possible.

  The invention according to claim 6 further includes a holding member (43) that forms the liquid level detecting portion by holding the processing liquid supply pipe, and the processing liquid front end surface detecting means is attached to the holding member. The substrate processing apparatus according to claim 5, further comprising a sensor (41). According to this configuration, the holding surface can form the liquid level detection unit with a height difference in the middle of the processing liquid supply pipe. A sensor for detecting the front end surface of the processing liquid is attached using this holding member. As a result, the processing liquid front end surface detecting means can reliably detect the processing liquid front end surface by the liquid level detecting section and can simplify the configuration for attaching the sensor.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a conceptual diagram for explaining the configuration of a substrate processing apparatus according to an embodiment of the present invention. This substrate processing apparatus is for supplying a processing liquid to a circular substrate W such as a semiconductor wafer to process the substrate W. The substrate processing apparatus includes a processing chamber 51 in which a substrate W is processed, and a processing liquid unit 52 for supplying a processing liquid toward the processing chamber 51.

In the processing chamber 51, a spin chuck 11, a processing liquid nozzle 12, a rinsing liquid nozzle 13, and a nozzle holding mechanism 16 are accommodated. The spin chuck 11 includes a spin base 14 that can rotate about a vertical axis while holding the substrate W substantially horizontally, and a rotation drive mechanism 15 that rotates the spin base 14 about the vertical axis.
The nozzle holding mechanism 16 includes a rotation shaft 18 disposed substantially along the vertical direction, a swing arm 19 attached to the rotation shaft 18 along the horizontal direction, and the rotation shaft 18 as a vertical axis. A swing drive mechanism 20 that swings the swing arm 19 by reciprocatingly rotating around a predetermined rotation angle range is provided. The treatment liquid nozzle 12 is held at the tip of the swing arm 19. Therefore, the landing point of the processing liquid supplied from the processing liquid nozzle 12 is held by the spin chuck 11 by operating the swing driving mechanism 20 and swinging the swing arm 19 along the horizontal plane. It moves by drawing an arc-shaped locus 22 including the rotation center and peripheral edge of the substrate W. Accordingly, the processing liquid can be supplied while the entire upper surface of the substrate W is scanned by the processing liquid discharge unit 15.

  The processing liquid supply mechanism 17 is accommodated in the processing unit 52. The processing liquid supply mechanism 17 is a processing liquid pipe 25 that supplies the processing liquid to the processing liquid nozzle 12, a processing liquid tank 26 that stores the processing liquid, and pumps the processing liquid from the processing liquid tank 26 to the processing liquid pipe 25. And a pump 27 for feeding in. In the processing liquid pipe 25, a flow rate adjusting valve 23 for adjusting the flow rate of the processing liquid, a first processing liquid valve 28A and a second processing liquid valve 28B for switching supply / stop of the processing liquid, and a flow rate of the processing liquid are measured. A temperature meter 30 for adjusting the temperature of the processing liquid sent to the processing liquid piping 25 and the processing liquid piping 25 is interposed. In the configuration of FIG. 1, the second processing liquid valve 28B is arranged upstream of the first processing liquid valve 28A in the processing liquid supply direction, but these arrangements may be reversed.

The processing liquid pipe 25 exits the processing liquid unit 52 and enters the processing chamber 51, and is connected to the processing liquid nozzle 12 in the processing chamber 51. The treatment liquid pipe 25 and the treatment liquid nozzle 12 may be separate parts, or the tip of the treatment liquid pipe 25 may be used as the treatment liquid nozzle 12. That is, the processing liquid pipe 25 and the processing liquid nozzle 12 can be configured with the same components.
A return pipe 31 for returning the processing liquid to the processing liquid tank 26 is branched and connected between the temperature controller 30 and the first processing liquid valve 28 </ b> A in the processing liquid pipe 25. When the processing liquid valve 28 is closed, the processing liquid pumped out by the pump 27 is circulated by returning to the processing liquid tank 26 through the temperature regulator 30 and further through the return pipe 31. Thereby, the temperature of the processing liquid can be maintained at a constant temperature suitable for processing the substrate W.

  On the other hand, in order to suck the processing liquid in the processing liquid pipe 25 on the downstream side of the first processing liquid valve 28, in this embodiment, the branch position 36 set on the downstream side of the flow meter 29. The suction pipe 32 is branched and connected. The suction pipe 32 is connected to a suction device 34 via a suction valve 33 and a flow rate adjustment valve 24. In this embodiment, the branch position 36 is set in the processing liquid unit 52.

  On the downstream side of the branch position 36, a liquid level detection unit 40 for detecting the front end surface (liquid level) of the processing liquid in the processing liquid piping 25 is provided. The liquid level detection unit 40 is a partial section of the processing liquid pipe 25. In this embodiment, the liquid level detection unit 40 is disposed in the processing liquid unit 52 and is higher on the processing liquid nozzle 12 side than on the branch position 36 side. The height difference is attached so that. More specifically, in this embodiment, the liquid level detection unit 40 is configured to hold a section in the middle of the processing liquid piping 25 so as to form a straight pipe portion along the vertical direction. At a position close to the liquid level detection unit 40, the liquid level of the processing liquid (processing liquid front end surface) in the liquid level detection unit 40 is set to a predetermined liquid level detection position (predetermined liquid level detection height) 42. The liquid level sensor 41 for detecting by is arrange | positioned. Specifically, the liquid level sensor 41 detects the presence or absence of the processing liquid at the liquid level detection position 42, and outputs a signal corresponding to the detection result. By passing the processing liquid front end surface through the liquid level detection position 42, the liquid level of the processing liquid (processing liquid front end surface) is detected.

  A control unit 55 is provided to control each part of the substrate processing apparatus. The control unit 55 is given the output of the liquid level sensor 41. The control unit 55 further controls the operations of the rotation drive mechanism 15, the swing drive mechanism 20, the suction device 34, and the temperature controller 30, and controls the first and second processing liquid valves 28A and 28B and the suction valve 33. Open / close control is performed and the output of the flow meter 29 is monitored.

  A pre-dispense pod 38 for pre-dispensing the processing liquid from the processing liquid nozzle 12 is disposed on the side of the spin chuck 11 prior to processing the substrate W. The pre-dispense pod 38 receives the processing liquid to be pre-dispensed from the processing liquid nozzle 12 and guides it to the drainage pipe 39. By pre-dispensing the processing liquid, if there is a non-temperature-controlled processing liquid in the processing liquid pipe 25, the processing liquid is appropriately drained, and then processing of the processing liquid whose temperature is appropriately adjusted is started. It can be supplied to the substrate W from the beginning.

  FIG. 2 is an illustrative view for explaining a configuration related to the liquid level detection unit 40. In the processing liquid unit 52, a pipe bracket 43 that holds the liquid level detection unit 40 in the middle of the processing liquid pipe 25 in a posture along the vertical direction is provided, and is fixed at an appropriate position in the processing liquid unit 52. The piping bracket 43 is formed in, for example, a horizontal U-shape including a long main body 44 extending along the vertical direction and a pair of piping clamps 45 and 46 provided at both ends of the main body 44. . The pair of pipe clamps 45 and 46 are arranged vertically along the vertical direction, and are arranged at a predetermined interval in the vertical direction. One pipe clamp 45 holds the upper end of the liquid level detection unit 40, and the other pipe clamp 46 holds the lower end of the liquid level detection unit 40. Thereby, the liquid level detection part 40 has comprised the straight tube form along a perpendicular direction.

The liquid level sensor 41 is fixed to a sensor bracket 48 coupled near the middle part of the main body 44. The sensor bracket 48 is disposed so as to hold the processing liquid pipe 25 near the liquid level detection position 42. Thus, the structure in which the sensor bracket 48 is attached to the piping bracket 43 can effectively suppress or prevent the displacement of the liquid level sensor 41.
The liquid level sensor 41 may be an optical sensor that optically detects the processing liquid, an ultrasonic sensor that detects the processing liquid using ultrasonic waves, or near the liquid level detection position 42. It may be a capacitance sensor that detects a change in capacitance. The optical sensor may be configured by a pair of a light emitting element and a light receiving element, for example. As such an optical sensor, a transmission type sensor that detects light generated from the light emitting element and passed through the processing liquid pipe 25, and light that is generated from the light emitting element and reflected from the processing liquid pipe 25 are detected. There are reflection type sensors, both of which can be used for detecting the processing liquid in the processing liquid pipe 25.

Next, the operation of the substrate processing apparatus will be described.
The unprocessed substrate W is carried into the processing chamber 51 by a substrate transport robot (not shown) and delivered to the spin chuck 11. After the hand of the substrate transfer robot leaves the processing chamber 51, the spin base 14 of the spin chuck 11 is rotated by the rotation drive mechanism 15. Accordingly, the substrate W held on the spin chuck 1 is rotated around the vertical axis.

  In the initial state, the swing arm 19 is in a retracted position where the processing liquid nozzle 12 is disposed on the pre-dispense pod 38. In this state, when the first processing liquid valve 28A is opened for a certain period of time, the processing liquid upstream from the first processing liquid valve 28A is guided to the processing liquid nozzle 12 via the processing liquid pipe 25, and the processing liquid is discharged. The inside of the liquid pipe 25 is filled with the processing liquid whose temperature is adjusted.

  When the pre-dispensing is finished, the first processing liquid valve 28A is closed, and instead, the suction valve 33 is opened. As a result, the function of the suction device 34 that is always in operation is validated, and the processing liquid existing in the processing liquid pipe 25 between the branch position 36 and the processing liquid nozzle 12 is sucked and removed. The suction valve 33 is closed after being opened for a predetermined time. Thereafter, the swing drive mechanism 20 is operated, and the swing arm 19 is moved to the scan start position. The scan start position may be, for example, a position where the processing liquid nozzle 12 is disposed immediately above the rotation center of the substrate W, or a position where the processing liquid nozzle 12 is disposed immediately above the peripheral edge of the substrate W. May be.

  From this state, the first processing liquid valve 28A is opened. At the same time, the swing drive mechanism 20 has a treatment liquid landing point over a predetermined swing range (a range corresponding to the radius of the substrate W or a range corresponding to the diameter) including the rotation center of the substrate W and its peripheral end. Is swung back and forth so as to move. Thereby, the processing liquid discharged from the processing liquid nozzle 12 through the processing liquid piping 25 is guided to the entire area of the substrate W, and the surface of the substrate W is processed.

  After storing a chemical liquid such as hydrofluoric acid as a processing liquid in the processing liquid tank 26 and discharging the chemical liquid from the processing liquid nozzle 12 onto the substrate W, the swing arm 19 is retracted to the above-described retracted position. Thereafter, pure water (deionized water) and other rinse liquids are supplied from the rinse liquid nozzle 13 toward the rotation center of the substrate W. The rinsing liquid receives a centrifugal force on the rotating substrate W and spreads over the entire area, and replaces the chemical solution on the substrate W.

After performing the rinsing process for a certain time in this way, the supply of the rinsing liquid is stopped, and the spin chuck 11 is rotated at a high speed by the rotation drive mechanism 12 to perform a drying process for shaking off the droplets on the surface of the substrate W. Is called. After the drying process, the processed substrate W is discharged from the processing chamber 51 by the substrate transfer robot.
The second processing liquid valve 28B is always kept open as long as the first processing liquid valve 28A operates normally.

  FIG. 3 is a flowchart for explaining a suction / abnormality determination process performed by the control unit 55 when the first processing liquid valve 28A is closed. After closing the first processing liquid valve 28A, the control unit 55 opens the suction valve 33 and validates the suction operation for the processing liquid pipe 25 by the suction device 34 (step S1). Thereafter, the control unit 55 waits for the elapse of the predetermined time T (step S2). For a predetermined time T, the front end surface of the processing liquid in the processing liquid pipe 25 is retracted from the processing liquid nozzle 12 by the suction in the processing liquid pipe 25 by the suction device 34 in a normal state, and is branched from the liquid level detection position 42. It is set to a time sufficient to reach the 36 side.

  After the predetermined time T has elapsed, the control unit 55 monitors the output signal of the liquid level sensor 41. Based on the output signal of the liquid level sensor 41, the control unit 55 determines whether or not the processing liquid exists at the liquid level detection position 42 (step S3). When the presence of the processing liquid is detected, the control unit 55 determines that a failure has occurred in the suction system (suction means) including the suction device 34 and the like, and performs suction abnormality processing (step S4). The abnormal suction process includes, for example, a process of generating an alarm (alarm sound and / or alarm display) or stopping the system of the substrate processing apparatus. “System stop” means that if there is a substrate W currently in progress, the operation of the substrate processing apparatus is stopped as soon as the processing is completed. If there is no substrate W in process, the operation of the substrate processing apparatus is immediately stopped.

  In step S4, when the presence of the processing liquid in the processing liquid piping 25 is not detected, it is determined that there is no failure in the suction system, and the control unit 55 determines whether there is a leak failure in the first processing liquid valve 28A. Execute the process. That is, it is determined whether or not the first processing liquid valve 28A should be opened to discharge the processing liquid (step S5). When the first processing liquid valve 28A is not opened, the liquid level sensor 41 detects the processing liquid. Is determined (step S6). If the processing liquid is detected, a valve abnormality process is executed assuming that a leak failure has occurred in the first processing liquid valve 28A (step S7). The valve abnormality process may be, for example, a process including a process of generating an alarm (alarm sound and / or alarm display, or stopping the system of the substrate processing apparatus. In this embodiment, the valve abnormality process includes: This includes a process of closing the second processing liquid valve 28B that is controlled to be normally opened.

If it is determined in step S6 that the processing liquid is not detected by the liquid level sensor 41, the process returns to step S5.
If it is determined in step S5 that the first processing liquid valve 28A has been opened, the suction / abnormality determination process ends.
As described above, according to this embodiment, by monitoring the output of the liquid level sensor 41, the control unit 55 detects a leak failure of the first processing liquid valve 28A and a failure of the suction system, and notifies them of them. be able to. Thereby, since those failures can be dealt with at an early stage, dropping of the treatment liquid from the treatment liquid nozzle 12 can be effectively suppressed or prevented. As a result, generation of defective substrates can be suppressed, and the cost of a product manufactured using the substrate can be reduced.

In this embodiment, when a leak failure occurs in the first processing liquid valve 28A, the second processing liquid valve 28B is closed. Thereby, even if a leak failure occurs in the first processing liquid valve 28A, the processing liquid is not supplied to the processing liquid nozzle 12, so that the substrate processing failure due to the leakage failure can be more effectively suppressed or prevented.
As mentioned above, although one Embodiment of this invention was described, this invention can also be implemented with another form.

  For example, in the above-described embodiment, the first and second processing liquid valves 28A and 28B are interposed in the processing liquid pipe 25, and the second processing liquid valve 28B is closed when the first processing liquid valve 28A has a leak failure. However, the second processing liquid valve 28B may be omitted. Even in this case, a leak failure of the first processing liquid valve 28A can be detected and notified, so that the occurrence of a processing-defective substrate can be suppressed by promptly handling the user.

In addition, when a leak failure occurs in the first processing liquid valve 28A, an alarm is generated, while the first processing liquid valve 28A is controlled to be always open, and processing is performed by controlling the second processing liquid valve 28B. The supply / stop of the processing liquid to the liquid nozzle 12 may be switched.
Furthermore, in the above-described embodiment, the presence or absence of the processing liquid is detected at the liquid level detection position 42 after the suction valve 33 is opened for a predetermined time. However, the liquid level sensor 41 is detected at the liquid level detection position 42. The suction valve 33 may be opened until no more is detected. Then, if the liquid level sensor 41 continues to detect the processing liquid even after a lapse of a predetermined time after opening the suction valve 33, it is determined that a suction system abnormality has occurred, and the suction abnormality processing is performed. It may be. The predetermined time in this case may be set longer than the time required for the processing liquid front end surface to move backward from the liquid level detection position 42 to the branch position 36 side after the suction valve 33 is opened.

Furthermore, in the above-described embodiment, the example in which the present invention is applied to the scan type nozzle has been described. However, the present invention can be similarly applied to a fixed nozzle fixedly disposed in the processing chamber.
In addition, various design changes can be made within the scope of matters described in the claims.

It is a conceptual diagram for demonstrating the structure of the substrate processing apparatus which concerns on one Embodiment of this invention. It is an illustration figure for demonstrating the structure relevant to a liquid level detection part. It is a flowchart for demonstrating abnormality determination processing. It is an illustration figure which shows the prior art for supply of a process liquid.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Spin chuck 12 Process liquid nozzle 13 Rinse liquid nozzle 14 Spin base 15 Rotation drive mechanism 16 Nozzle holding mechanism 17 Process liquid supply mechanism 18 Rotating shaft 19 Oscillation arm 20 Oscillation drive mechanism 21 Holding part 23 Flow rate adjustment valve 24 Flow rate adjustment valve 25 processing liquid piping 26 processing liquid tank 27 pump 28A first processing liquid valve 28B second processing liquid valve 29 flow meter 30 temperature controller 31 return piping 32 suction piping 33 suction valve 34 suction device 36 branch position 38 pre-dip pen pod 39 Drainage pipe 40 Liquid level detector 41 Liquid level sensor 42 Liquid level detection position 43 Piping bracket 44 Main body 45, 46 Piping clamp 48 Sensor bracket 51 Processing chamber 52 Processing liquid unit 55 Control unit

Claims (6)

A nozzle for discharging a processing liquid for processing the substrate;
A treatment liquid supply pipe connected to the nozzle and supplying a treatment liquid to the nozzle;
A treatment liquid valve interposed in the treatment liquid supply pipe, for switching supply and stop of the treatment liquid to the nozzle; and
A treatment liquid suction pipe that is branched and connected to the treatment liquid supply pipe at a branch position set between the treatment liquid valve and the nozzle, and sucks and discharges the treatment liquid in the treatment liquid supply pipe;
A suction means for sucking the processing liquid in the processing liquid supply pipe through the processing liquid suction pipe;
A substrate processing apparatus, comprising: a processing liquid front end surface detecting unit configured to detect a processing liquid front end surface in the processing liquid supply pipe at a predetermined liquid level detection position set between the branch position and the nozzle. A control means for performing a suction step of operating the suction means to suck and remove the processing liquid in the processing liquid supply pipe after closing the processing liquid valve;
The control means determines that an abnormality has occurred in the processing liquid valve in response to the processing liquid front end surface detecting means detecting the processing liquid front end face after the suction step, and a predetermined processing liquid The substrate processing apparatus according to claim 1, further comprising processing liquid valve abnormality processing means for performing valve abnormality processing. In addition to the first processing liquid valve, which is the processing liquid valve, further includes a second processing liquid valve that is interposed in the processing liquid supply pipe and switches between supply and stop of the processing liquid to the nozzle,
The substrate processing apparatus according to claim 2, wherein the processing liquid valve abnormality processing performed by the processing liquid valve abnormality processing means includes processing for closing the second processing liquid valve and stopping supply of the processing liquid to the nozzle. A control means for performing a suction step of operating the suction means to suck and remove the processing liquid in the processing liquid supply pipe after closing the processing liquid valve;
The control means refers to the output of the processing liquid front end surface detecting means during or after the suction process, and detects that the front end surface of the processing liquid has retreated to the branch position side from the liquid level detection position. The substrate processing apparatus according to claim 1, further comprising a suction abnormality processing unit that determines that an abnormality of the suction unit has occurred when not performed and performs a predetermined suction abnormality process. The processing liquid supply pipe has a liquid level detection unit with a difference in height so that the nozzle side is higher than the branch position side in a section including the liquid level detection position,
The substrate processing apparatus according to claim 1, wherein the processing liquid front end surface detecting unit detects a front end surface of the processing liquid in the liquid level detection unit. A holding member that forms the liquid level detection unit by holding the processing liquid supply pipe;
The substrate processing apparatus according to claim 5, wherein the processing liquid front end surface detecting means includes a sensor attached to the holding member.

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