TW202025331A - Apparatus and method for processing substrates - Google Patents

Abstract

An apparatus　includes a processing device, a feeding device, a cleaner device and a control device. The control device is configured to instruct, when a first parameter meets a first condition, a switch element of the feeding device to switch, from a first configuration, to a second configuration in order to change a providing tank of a treatment liquid. The control device is further configured to instruct, when a second parameter meets a second condition, the cleaner device to provide a cleanser liquid into the processing device for cleaning the processing device.

Description

Substrate processing equipment and method

The present invention relates to the manufacturing process of semiconductor devices, and more particularly relates to the technology of processing substrates using processing liquids.

The manufacturing process of semiconductor devices may use processing solutions to process substrates. For example, a wet etching process may use an acid solution as an etchant to create a specific pattern on the substrate. The processing liquid is generally stored in the tank of the liquid supply device, and is transported to the substrate as needed. In order to maintain the stability and accuracy of the manufacturing process, the storage tank of the liquid supply device must be replaced manually at intervals, and the processing facilities must also be cleaned manually at intervals. However, such manual operations are not only time-consuming, but sometimes even error occurs due to human factors.

Therefore, the object of the present invention is to provide a substrate processing apparatus and method that can avoid at least one of the above-mentioned disadvantages of the conventional technology.

Therefore, in some embodiments of the present invention, the substrate processing equipment includes a processing device. The processing device has a chamber and is configured to accommodate the substrate in the chamber. The substrate processing equipment further includes a supply device. The supply device has a switching element and a plurality of storage tanks for storing the processing liquid, and is configured to provide the processing liquid to the processing device for processing the substrate, Wherein, the switching element can be operated to allow one of the storage tanks to provide the treatment liquid to the treatment device. The substrate processing equipment also includes a cleaning device that is configured to provide cleaning fluid to the processing device for cleaning the processing device. The substrate processing equipment further includes a control device, which is configured to instruct the switching element to switch from the first configuration to the first condition when a first parameter related to the consumption of the processing liquid reaches a first condition Two configurations, wherein the first configuration allows one of the plurality of storage tanks to provide processing liquid to the processing device, and the second configuration allows one of the plurality of storage tanks A second storage tank provides treatment liquid to the treatment device. The control device is also configured to instruct the cleaning device to provide cleaning fluid into the processing device when a second parameter related to the operation of the switching element reaches a second condition.

In some implementations, the first parameter is one of the following: the number of substrates processed in the processing device since the switching element was last switched to the first configuration, and since the switching element was last The time elapsed after switching to the first configuration, the total amount of processing liquid supplied from the first storage tank to the processing device since the switching element was last switched to the first configuration, since the switching element After being switched to the first configuration last time, the sum of the time that the first storage tank provides the treatment liquid to the treatment device each time, and any combination of the foregoing items; and the first condition is at least one predetermined threshold.

In some implementation aspects, the first parameter is time, and the first condition is a predetermined time point.

In some implementation aspects, the second parameter is the number of times of switching performed by the switching element, and the second condition is a predetermined threshold.

In some embodiments, the cleaning device is further configured to provide the cleaning liquid to the plurality of storage tanks for cleaning the storage tanks, and the control device is further configured to switch between After the element is switched from the first configuration that allows the processing liquid to be supplied from the first storage tank to the second configuration that allows the processing liquid to be supplied to the processing device from the second storage tank, instruct the The cleaning device supplies the cleaning liquid into the first storage tank in parallel with the operation of the cleaning device providing the cleaning liquid into the processing device.

In some embodiments, the control device is further configured to perform the following operations after the switching element is switched to the second configuration: determining whether to perform the operation according to a third parameter related to a test operation Test operation; after deciding to perform the test operation, instruct the processing device and the supply device to perform the test operation, and schedule at least one substrate after the test operation is completed so that the at least one substrate is in the processing device Is processed in the chamber, wherein the test operation will cause a test substrate to be processed in the chamber of the processing device; and after deciding not to perform the test operation, instruct the processing device to discharge the at least one substrate Process so that the at least one substrate is processed in the chamber of the processing device.

Therefore, in some embodiments of the present invention, the substrate processing method includes the following steps: scheduling at least one substrate so that the at least one substrate is processed in a chamber of a processing device; When a related first parameter reaches a first condition, it indicates that the processing liquid can be provided into the processing device for processing the at least one substrate. A switching element of a supply device is switched from the first configuration to the second group State, wherein the first configuration allows the processing liquid to be supplied from a first tank of the supply device to the processing device, and the second configuration allows the processing liquid to be supplied from a second tank of the supply device To the processing device; and when a second parameter related to the operation of the switching element reaches a second condition, instruct a cleaning device to provide cleaning fluid to the processing device for cleaning the processing device.

In some implementations, the first parameter is one of the following: the number of substrates processed in the processing device since the switching element was last switched to the first configuration, and since the switching element was last The time elapsed after switching to the first configuration, the total amount of processing liquid supplied from the first storage tank to the processing device since the switching element was last switched to the first configuration, since the switching element After being switched to the first configuration last time, the sum of the time that the first storage tank provides the treatment liquid to the treatment device each time, and any combination of the foregoing items; and the first condition is at least one predetermined threshold.

In some implementation aspects, the first parameter is time, and the first condition is a predetermined time point.

In some implementation aspects, the second parameter is the number of times of switching performed by the switching element, and the second condition is a predetermined threshold.

In some embodiments, the substrate processing method further includes: switching the switching element from the first configuration that allows the processing liquid to be supplied to the processing device from the first storage tank of the supply device to allow the processing After the liquid is supplied from the second storage tank of the supply device to the second configuration of the processing device, the cleaning device is instructed to perform the operation in parallel with the cleaning device supplying the cleaning liquid to the processing device. The cleaning liquid is provided into the first storage tank for cleaning the first storage tank.

In some embodiments, the substrate processing method further includes: switching the switching element from the first configuration that allows the processing liquid to be supplied to the processing device from the first storage tank of the supply device to allow the processing After the liquid is supplied from the second storage tank of the supply device to the second configuration of the processing device, the cleaning device is instructed to and the second storage tank provides the processing liquid to the chamber of the processing device. The cleaning solution is provided into the first storage tank in a parallel manner for processing at least one substrate of the at least one substrate for cleaning the first storage tank.

In some embodiments, the substrate processing method further includes: after the switching element is switched to the second configuration, determining whether to perform the test operation according to a third parameter related to a test operation; When deciding to perform the test operation, instruct the processing device and the supply device to perform the test operation, and schedule another at least one substrate after the test operation is completed so that the other at least one substrate is in the cavity of the processing device Is processed in the chamber, wherein the test operation will cause a test substrate to be processed in the chamber of the processing device; and when it has been decided not to perform the test operation, at least one other substrate is scheduled so that the other At least one substrate is processed in the chamber of the processing device.

In some embodiments, the substrate processing method further includes: when the test operation is determined to be performed, instructing the cleaning device to allow the processing liquid to be supplied from the first storage tank of the supply device to the switching element. After the first configuration of the processing device is switched to the second configuration that allows the processing liquid to be supplied to the processing device from the second storage tank of the supply device, the cleaning is performed in parallel with the test operation The liquid is provided into the first storage tank for cleaning the first storage tank.

The effect of the present invention is that it can save related human resources and avoid errors caused by human factors. In addition, such automated procedures are more efficient in the use of time than traditional manual procedures.

Please refer to FIG. 1, which exemplifies a substrate processing equipment 100 by which a substrate wet process (including etching, cleaning, drying, etc.) can be performed according to an embodiment of the present invention. The illustrated equipment 100 includes a processing device 110, a supply device 120, a cleaning device 130, and a control device 140 electrically connected to the processing device 110, the supply device 120, and the cleaning device 130.

According to an embodiment, the processing device 110 has a chamber and is configured to accommodate at least one substrate 150 to be processed in the chamber. According to some embodiments, the processing of the substrate 150 by the processing device 110 may be a single-substrate wet process, a multi-substrate wet process, a single square wafer under-ball metal etching, a thinned wafer support or peeling, bonding or peeling process , Silicon carbide recycled wafers, recycled silicon wafers or other similar technologies. For simplicity, only one substrate 150 is illustrated in FIG. 1. In one embodiment, only one substrate 150 is accommodated and processed in the chamber at a time, but the present invention is not so limited. According to some embodiments of the present invention, the substrate 150 may be in the form of a carrier, a wafer, a chip or other components, and may have a circular, square, rectangular or other geometric shape.

According to one embodiment, the supply device 120 has a plurality of processing liquid storage tanks 122 (for example, the two processing liquid storage tanks shown in the figure including the first storage tank 122-1 and the second storage tank 122-2, but The present invention is not so limited) and a switching element 121, the processing liquid storage tanks 122 are used to store the processing liquid, the switching element 121 can be operated to enable one of the processing liquid storage tanks 122 It communicates with the processing device 110 and provides a processing liquid to the chamber of the processing device 110. The switching element 121 includes a first pipeline connected to the processing device 110 so that the supply device 120 can supply the processing liquid stored in the processing liquid storage tank 122 into the processing device 110 via the first pipeline. The switching element 121 is configured to allow only one of the processing liquid storage tanks 122 to provide the processing liquid to the processing device 110 at the same time. The processing liquid is applied to the substrate 150 in the chamber of the processing device 110 to perform a certain specific processing procedure (for example, etching) on the substrate 150. In one embodiment, the switching element 121 further includes a plurality of control valves and a second pipeline connected to the processing liquid storage tanks 122, so that the switching element 121 can switch between the processing liquid storage tanks 122, and select Which treatment liquid storage tank 122 should be used as the source of the treatment liquid. In one embodiment, the supply device 120 further includes a replenishment device (not shown in the figure) that stores replenishment liquid (ie, unused treatment liquid) and is connected to the treatment liquid storage tanks 122 via a third pipeline. ) For supplementing the treatment liquid storage tank 122. In another embodiment, the supply device 120 further includes a temperature controller connected to the processing liquid storage tanks 122 and a circulation pipe for controlling the temperature of the processing liquid stored in the processing liquid storage tanks 122.

According to one embodiment, the cleaning device 130 has a lotion storage tank 131 for storing cleaning liquid, and is connected to the processing device 110 via a fourth pipeline, so that the cleaning device 130 can supply the cleaning liquid via the fourth pipeline Into the processing device 110 for cleaning the processing device 110. The cleaning device 130 may be further connected to the processing liquid storage tank 122 via a fifth pipeline, so that the cleaning device 130 can supply the cleaning liquid to the processing liquid storage tank 122 via the fifth pipeline for cleaning the processing liquid storage tank 122.

According to an embodiment, the control device 140 has an input module 141 and a processor 142 electrically connected to each other. The processor 142 is configured to receive control information from the user of the device 100 through the input module 141, and can automatically control the operations of the processing device 110, the supply device 120, and the cleaning device 130 based on the received control information . The control information may include but is not limited to at least one of the following: the number of substrates, the length of time, the time, the amount of processing liquid used, the number of switching times, and the number of tests. The processor 142 is further configured to automatically control when and which processing liquid storage tank 122 supplies the processing liquid according to the received control information.

FIG. 2 is a flowchart illustrating a substrate processing method according to an embodiment of the present invention. The method can be implemented by the apparatus 100 illustrated in FIG. 1. The method will be described below for the device 100 of FIG. 1.

Please refer to FIG. 2. In the following description, it is assumed that the switching element 121 of the supply device 120 is configured to allow the first storage tank 122-1 to provide the processing liquid to the processing device 110 when the procedure is about to start. The first configuration (that is, the first storage tank 122-1 is responsible for providing the processing liquid to the processing device 110).

In step 205, the control device 140 of the equipment 100 schedules at least a part of the substrates in a batch of multiple substrates so that the at least part of the substrates are processed in the chamber of the processing device 110. According to some embodiments, the at least a part of the substrate may be one of the substrates, several substrates, or all of the substrates in the batch, and when the at least a part of the substrate includes a plurality of substrates, the substrates may be processed one by one or in groups. Subject to processing.

In step 210, the control device 140 determines whether to perform the tank replacement operation. If the answer is yes, proceed to step 215; if the answer is no, then return to step 205 to schedule another part of the same batch of substrates or at least a part of the other batch of substrates. According to one embodiment, step 210 may be performed by determining whether a first parameter related to the consumption of the processing liquid meets a first condition for the last substrate scheduled in step 205 to determine whether to proceed Replace the storage tank. The first parameter may be, for example, the number of substrates processed in the processing device 110 since the switching element 121 was assembled or switched to the first configuration allowing the processing liquid to be provided by the first tank 122-1 last time, and since the switching The time elapsed after the element 121 was assembled or switched to the first configuration last time, and since the switching element 121 was assembled or switched to the first configuration last time, it is provided from the first storage tank 122-1 The total amount of the treatment liquid of the treatment device 110, the sum of the time that the first storage tank 122-1 provides treatment liquid to the treatment device 110 since the switching element 121 was assembled or switched to the first configuration last time, or the foregoing Any combination of the items; and the first condition can be at least one predetermined threshold, the value of which can be set based on the control information input by the user, for example. According to another embodiment, the first parameter may also be time, and the first condition may be a predetermined time point.

In step 215, the control device 140 instructs the supply device 120 to perform the tank replacement operation, and schedules this so that the processing liquid storage tanks that are allowed to provide the processing liquid to the processing device 110 (that is, are responsible for providing the processing liquid to the processing device) The processing liquid storage tank of 110) is changed from the first storage tank 122-1 to another storage tank, for example, to the second storage tank 122-2. In this case, this step includes instructing the switching element 121 to switch from the first configuration allowing the processing liquid to be supplied from the first tank 122-1 to the second configuration allowing the processing liquid to be supplied from the second tank 122-2. According to an embodiment, this operation of replacing the processing liquid storage tank 122 may be accomplished by, for example, changing the configuration of the control valve set for each processing liquid storage tank 122. In one embodiment, as long as all the substrates scheduled in step 205 have been processed, then the tank replacement operation can be started. However, in another embodiment, the replacement of the storage tank is only performed after the entire batch of substrates has been processed. Therefore, in this embodiment, if the batch of substrates scheduled in step 205 has not yet For the processed person, in step 215, the control device 140 will schedule all the unprocessed substrates in the batch of substrates before scheduling the replacement of the tank, so that the unprocessed substrates are being replaced. The storage tank is processed in the processing device 110 before operation.

It is stated here that the processing liquid storage tank 122 that is used and replaced is not limited to the above. For example, when performing the aforementioned procedures, the identities of the first storage tank 122-1 and the second storage tank 122-2 can be interchanged; in other words, when performing the aforementioned procedures, it is possible that the second storage tank was originally replaced by the second The storage tank 122-2 is responsible for supplying the processing liquid to the processing device 110, and the replacement of the storage tank may be performed by replacing the storage tank responsible for supplying the processing liquid from the second storage tank 122-2 to the first storage tank 122-1.

In step 220, the control device 140 determines whether to perform the chamber cleaning operation. If the answer is yes, proceed to step 225; if the answer is no, proceed to step 230. According to some embodiments, it is possible to determine whether to perform the chamber cleaning operation by determining whether a second parameter related to the operation of the switching element 121 reaches a second condition. The second parameter may be, for example, the number of switching performed by the switching element 121, and the second condition may be a predetermined threshold, the value of which may be determined based on the control information input by the user, for example.

In step 225, the control device 140 instructs the cleaning device 130 and the processing device 110 to perform the chamber cleaning operation, and schedules it. This step includes instructing the cleaning device 130 to provide cleaning liquid into the processing device 110 for use in cleaning the processing device 110.

In step 230, the control device 140 determines whether to perform a test operation. If the answer is yes, proceed to step 235; if the answer is no, then return to step 205 to schedule another part of the substrate of the same batch or at least part of the substrate of another batch. The purpose of the test operation is to ensure that the processing device 110 can still process the substrate correctly after replacing the processing liquid storage tank 122 that supplies the processing liquid. According to some embodiments, it is possible to determine whether to perform the test operation according to a third parameter related to the test operation. For example, the third parameter may be a flag, and it may be determined whether to perform a test operation by determining whether the third parameter is a specific value. In a further embodiment, the control device 140 can set and change the value of the third parameter. For example, the control device 140 may pre-set the value of the third parameter to a value indicating that the test operation is to be performed or a value indicating that the test operation is not to be performed, and may change the value of the third parameter according to, for example, the control information input by the user. Numerical value. In one embodiment, the preset value of the third parameter is the first value indicating that the test operation is to be performed, and after the switching element 121 has been switched for a specific number of times (for example, five times), the control device 140 will The value of the parameter is changed to a second value indicating that no test operation is to be performed; in a further embodiment, the control device 140 may switch the switching element 121 for a specific number of times (for example, five times) or after reaching a certain Change the value of the third parameter back to the first value at the predetermined time.

In step 235, the control device 140 instructs the processing device 110 and the supply device 120 to perform a test operation, and schedules it. In one embodiment, at least one test substrate dedicated for testing is processed by the processing liquid from the supply device 120 in the chamber of the processing device 110 during the test operation. For example, in this case, since the switching element 121 has been switched to the second configuration allowing the processing liquid to be supplied from the second tank 122-2 at this time, there will be at least one test substrate in the processing device 110 during the test operation. The chamber is processed by the processing liquid from the second storage tank 122-2. After the test operation is completed, step 205 may be returned to schedule another part of the same batch of substrates or at least a part of the other batch of substrates.

It is worth noting that in the method illustrated in Figure 2, the tank replacement operation, the cleaning chamber operation and the test operation are all automatically scheduled and executed by the machine. In this way, the implementation of this method can save related human resources , And can avoid errors caused by human factors. In addition, such automated procedures are more efficient in the use of time than traditional manual procedures.

Those who are familiar with the general knowledge in the technical field of the present invention can recognize that steps 215 to 230 do not necessarily have to be performed in the order shown in FIG. 2. For example, step 220 can be performed at any time point between step 210 and step 225, and does not have to be sandwiched between step 215 and step 225, and step 230 can be performed at any time point between step 210 and step 235, and It does not have to be sandwiched between step 225 and step 235.

In addition, the method can have more variations. For example, in one embodiment, the control device 140 may further perform a step of determining whether to perform the tank cleaning operation after determining in step 210 that the tank replacement operation is to be performed (this determination may be based on, for example, a flag Whether a fourth parameter is made for a specific value). In this embodiment, if the determination result is that the tank cleaning operation is to be performed, the control device 140 will instruct the cleaning device 130 and the first tank 122-1 to be allowed to provide the treatment liquid to the treatment device 110 after completing step 215 After the replacement of the processing liquid storage tank from the first storage tank 122-1 to the second storage tank 122-2, a cleaning storage tank operation for the first storage tank 122-1 is performed and scheduled. In some embodiments of the present invention, the control device 140 schedules the cleaning of the storage tank in parallel with other operations (for example, at the same time) to effectively use time. For example, the control device 140 may schedule the cleaning tank operation performed by the cleaning device 130 and the first tank 122-1 to the cleaning chamber operation performed by the cleaning device 130 and the processing device 110, and the supply device 120 and The testing operations performed by the processing device 110 or the processing operations performed by the processing device 110 on the one or more substrates 150 with the processing liquid from the second storage tank 122-2 are parallel to save time. According to one embodiment, during the cleaning operation of the storage tank, the first storage tank 122-1 will empty the treatment liquid inside, and the cleaning device 130 will then pour the cleaning liquid into the first storage tank 122-1 for use To clean the first storage tank 122-1. In a further embodiment, the control device 140 instructs the replenishing device of the supply device 120 to fill the replenishing liquid (ie, the treatment liquid) into the cleaned first storage tank 122-1 after the cleaning of the storage tank is completed. , And maintain the temperature of the treatment liquid replenished in the first storage tank 122-1 within a specific temperature range through the circulation pipeline of the supply device 120 and the temperature controller.

Although the foregoing has described many details in order to provide a thorough understanding of the embodiments of the present invention, it should be obvious to those who are familiar with the general knowledge in the technical field to which the present invention pertains to implement other one or more embodiments of the present invention. It is not necessary to include all the details mentioned above. In addition, it should be recognized that the reference to an embodiment, an embodiment, or a few embodiments, and the like in this specification is intended to point out the specific features, structures, or the like when the present invention is implemented in this manner. characteristic. In addition, in this article, sometimes many features are collected in a single embodiment, figure, or the description of the embodiment or figure. This is just to make the explanation smooth and to better understand the present invention. Various aspects. It should be recognized that when the present invention is implemented, one or more features or specific details from one embodiment may be implemented together with one or more features or specific details from another embodiment as long as appropriate.

Although the foregoing description of the present invention is based on exemplary embodiments, it should be understood that the present invention is not limited to the foregoing embodiments. The present invention should cover all that fall within the spirit and broadest interpretation of the present invention. All designs include all changes and equivalent designs that fall within the scope of the spirit and broadest interpretation of the present invention.

100: equipment 110: treatment device 120: supply device 121: switching element 122 (122-1, 122-2): treatment liquid storage tank (storage tank) 130: cleaning device 131: lotion storage tank 140: control device 141: Input module 142: processor 150: substrate 205～235: steps

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a schematic diagram illustrating a substrate processing equipment according to an embodiment of the present invention; and FIG. 2 is based on the present invention. An embodiment of the invention illustrates a flowchart of a substrate processing method.

100: equipment

110: processing device

120: supply device

121: switching element

122 (122-1, 122-2): Treatment liquid storage tank (storage tank)

130: cleaning device

131: Lotion Storage Tank

140: control device

141: Input Module

142: processor

150: substrate

Claims (11)

A substrate processing method, comprising: scheduling at least one substrate so that the at least one substrate is processed in a chamber of a processing device; reaching a first condition when a first parameter related to the consumption of a processing liquid , Indicating that the processing liquid can be provided into the processing device for switching a switching element of a supply device for processing the at least one substrate from a first configuration to a second configuration, wherein the first configuration Allowing the processing liquid to be supplied to the processing device from a first storage tank of the supply device, and the second configuration allows the processing liquid to be supplied to the processing device from a second storage tank of the supply device; and When a second parameter related to the operation of the switching element reaches a second condition, it instructs a cleaning device to provide a cleaning fluid into the processing device for cleaning the processing device. The substrate processing method according to claim 1, wherein the first parameter is one of the following: the number of substrates processed in the processing device since the switching element was switched to the first configuration last time, The time elapsed after the switching element was last switched to the first configuration, the total amount of processing liquid supplied from the first storage tank to the processing device since the switching element was switched to the first configuration last time The amount, the sum of the time for each supply of the treatment liquid to the treatment device by the first tank since the switching element was last switched to the first configuration, and any combination of the foregoing items; and the first condition is At least one predetermined threshold. The substrate processing method according to claim 1, wherein the first parameter is time, and the first condition is a predetermined time point. The substrate processing method according to claim 1, wherein the second parameter is the number of switching performed by the switching element, and the second condition is a predetermined threshold. The substrate processing method according to claim 1, further comprising: switching the switching element from the first configuration that allows the processing liquid to be supplied to the processing device from the first tank of the supply device to allow After the processing liquid is supplied from the second storage tank of the supply device to the second configuration of the processing device, the cleaning device is instructed to parallel the operation of the cleaning device supplying the cleaning liquid to the processing device The cleaning liquid is provided into the first storage tank for cleaning the first storage tank. The substrate processing method according to claim 1, further comprising: switching the switching element from the first configuration that allows the processing liquid to be supplied to the processing device from the first tank of the supply device to allow After the processing liquid is supplied from the second storage tank of the supply device to the second configuration of the processing device, the cleaning device is instructed to match the second storage tank providing the processing liquid to the chamber of the processing device The cleaning liquid is provided into the first storage tank in a manner in which operations for processing at least one of the at least one substrate are performed in parallel in the room for cleaning the first storage tank. The substrate processing method according to claim 1, further comprising: after the switching element is switched to the second configuration, determining whether to perform the test operation according to a third parameter related to a test operation, When the test operation is determined to be performed, the processing device and the supply device are instructed to perform the test operation, and after the test operation is completed, another at least one substrate is scheduled so that the other at least one substrate is in the processing device Is processed in the chamber, wherein the test operation causes a test substrate to be processed in the chamber of the processing device; and when the test operation has been decided not to be performed, at least one other substrate is scheduled to make The other at least one substrate is processed in the chamber of the processing device. The substrate processing method according to claim 1, further comprising: when the test operation has been determined to be performed, instructing the cleaning device to allow the processing liquid to be removed from the first storage tank of the supply device when the switching element After the first configuration provided to the processing device is switched to the second configuration that allows the processing liquid to be provided to the processing device from the second storage tank of the supply device, the test operation is performed in parallel with The cleaning liquid is provided into the first storage tank for cleaning the first storage tank. A substrate processing equipment, comprising: a processing device having a chamber and configured to accommodate a substrate in the chamber; a supply device configured to provide a processing liquid to the processing device The supply device has a switching element and a plurality of storage tanks for storing the processing liquid, and the switching element is operable to allow one of the storage tanks to provide the processing liquid to The processing device; a cleaning device configured to provide cleaning fluid to the processing device for cleaning the processing device; and a control device configured to perform the following operations: When a first parameter related to the consumption reaches a first condition, it instructs the switching element to switch from a first configuration to a second configuration, wherein the first configuration allows one of the storage tanks A first storage tank provides the treatment liquid to the treatment device, and the second configuration allows the treatment liquid to be supplied to the treatment device by a second storage tank of the plurality of storage tanks, and is in contact with the switching element When a second parameter related to the operation reaches a second condition, the cleaning device is instructed to provide the cleaning fluid into the processing device. The substrate processing apparatus according to claim 9, wherein the first parameter is one of the following: the number of substrates processed in the processing device since the switching element was last switched to the first configuration, and since The time elapsed after the switching element was last switched to the first configuration, the total amount of processing liquid supplied from the first storage tank to the processing device since the switching element was switched to the first configuration last time The amount, the sum of the time for each supply of the treatment liquid to the treatment device by the first tank since the switching element was last switched to the first configuration, and any combination of the foregoing items; the first condition is at least A predetermined threshold; the second parameter is the number of times of switching performed by the switching element; and the second condition is another predetermined threshold. The substrate processing apparatus according to claim 9, wherein the first parameter is time; the first condition is a predetermined time; the second parameter is the number of times the switching element has been switched; and the second condition is A predetermined threshold.

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