TWI693655B - Apparatus and method for processing substrates - Google Patents

Abstract

An apparatus　includes a processing device, a feeding device, a cleaner device and a control device. The control device is configured to instruct, when a first parameter meets a first condition, a switch element of the feeding device to switch, from a first configuration, to a second configuration in order to change a providing tank of a treatment liquid. The control device is further configured to instruct, when a second parameter meets a second condition, the cleaner device to provide a cleanser liquid into the processing device for cleaning the processing device.

Description

Substrate processing equipment and method

The present invention relates to a semiconductor device manufacturing process, and more particularly relates to a technology for processing a substrate using a processing liquid.

The process of the semiconductor device may use a processing liquid to process the substrate. For example, wet etching operations may use acid as an etchant to create specific patterns on the substrate. The treatment liquid is generally stored in the storage tank of the liquid supply device, and is transferred to the substrate as needed. In order to maintain the stability and accuracy of the process, the storage tank of the liquid supply device must be replaced manually at intervals, and the treatment facility must also be manually cleaned at intervals. However, such manual operations are not only quite time-consuming, but sometimes even cause errors due to human factors.

Therefore, an object of the present invention is to provide a substrate processing apparatus and method that can avoid at least one of the above-mentioned disadvantages of the conventional technology.

Therefore, in some embodiments of the present invention, the substrate processing apparatus includes a processing device that has a chamber and is configured to accommodate the substrate in the chamber. The substrate processing apparatus still includes a supply device having a switching element and a plurality of storage tanks for storing processing liquid, and is configured to provide the processing liquid into the processing device for processing the substrate, Wherein, the switching element can be operated to allow one of the storage tanks to provide the processing liquid to the processing device. The substrate processing apparatus also includes a cleaning device configured to provide a cleaning liquid into the processing device for cleaning the processing device. The substrate processing apparatus further includes a control device configured to instruct the switching element to switch from the first configuration to the first when a first parameter related to the consumption of the processing liquid reaches a first condition Two configurations, wherein the first configuration allows one of the plurality of storage tanks to provide processing liquid to the processing device, and the second configuration allows the plurality of storage tanks to A second storage tank provides treatment liquid to the treatment device. The control device is also configured to instruct the cleaning device to provide cleaning fluid into the processing device when a second parameter related to the operation of the switching element reaches a second condition.

In some embodiments, the first parameter is one of the following: the number of substrates processed in the processing device since the switching element was last switched to the first configuration, since the switching element was last The time elapsed after switching to the first configuration, the total amount of processing liquid supplied from the first storage tank to the processing device since the switching element was last switched to the first configuration, since the switching element The total amount of time each time that the first storage tank provides the processing liquid to the processing device and any combination of the foregoing items after being switched to the first configuration last time; and the first condition is at least one predetermined threshold.

In some embodiments, the first parameter is time, and the first condition is a predetermined time point.

In some implementations, the second parameter is the number of switchings performed by the switching element, and the second condition is a predetermined threshold.

In some embodiments, the cleaning device is further configured to provide the cleaning liquid into the plurality of storage tanks for cleaning the storage tanks, and the control device is further configured to switch between the After the element switches from the first configuration allowing the first storage tank to supply the processing liquid to the processing device to the second configuration allowing the second storage tank to provide the processing liquid to the processing device, the component is instructed The cleaning device supplies the cleaning liquid into the first storage tank in parallel with the operation of the cleaning device supplying the cleaning liquid into the processing device.

In some implementation aspects, the control device is further configured to perform the following operations after the switching element is switched to the second configuration: according to a third parameter related to a test operation, determine whether to perform the operation Test operation; after deciding to perform the test operation, instruct the processing device and the supply device to perform the test operation, and schedule at least one substrate after the test operation is completed so that the at least one substrate is in the processing device Being processed in the chamber, wherein the test operation causes a test substrate to be processed in the chamber of the processing device; and after deciding not to perform the test operation, instructing the processing device to discharge the at least one substrate To process the at least one substrate in the chamber of the processing device.

Therefore, in some embodiments of the present invention, the substrate processing method includes the following steps: scheduling at least one substrate so that the at least one substrate is processed in a chamber of a processing apparatus; consumption of processing liquid When a related first parameter reaches a first condition, it indicates that the processing liquid can be supplied into the processing device for a switching element of a supply device for processing the at least one substrate to switch from the first configuration to the second group Wherein the first configuration allows the processing liquid to be supplied from the first storage tank of the supply device to the processing device, and the second configuration allows the processing liquid to be supplied from the second storage tank of the supply device To the processing device; and when a second parameter related to the operation of the switching element reaches a second condition, instruct a cleaning device to provide cleaning fluid into the processing device for cleaning the processing device.

In some embodiments, the first parameter is one of the following: the number of substrates processed in the processing device since the switching element was last switched to the first configuration, since the switching element was last The time elapsed after switching to the first configuration, the total amount of processing liquid supplied from the first storage tank to the processing device since the switching element was last switched to the first configuration, since the switching element The total amount of time each time that the first storage tank provides the processing liquid to the processing device and any combination of the foregoing items after being switched to the first configuration last time; and the first condition is at least one predetermined threshold.

In some embodiments, the first parameter is time, and the first condition is a predetermined time point.

In some implementations, the second parameter is the number of switchings performed by the switching element, and the second condition is a predetermined threshold.

In some embodiments, the substrate processing method further includes: switching from the first configuration that allows the processing liquid to be supplied to the processing device from the first storage tank of the supply device to the switching element to allow the processing After the liquid is supplied from the second storage tank of the supply device to the second configuration of the processing device, the cleaning device is instructed to operate in parallel with the operation of the cleaning device supplying the cleaning liquid into the processing device The cleaning liquid is provided into the first storage tank for cleaning the first storage tank.

In some embodiments, the substrate processing method further includes: switching from the first configuration that allows the processing liquid to be supplied to the processing device from the first storage tank of the supply device to the switching element to allow the processing After the liquid is supplied from the second storage tank of the supply device to the second configuration of the processing device, the cleaning device is instructed to supply the processing liquid from the second storage tank into the chamber of the processing device to The cleaning liquid is supplied into the first storage tank in a parallel manner for the operation for processing at least one substrate of the at least one substrate for cleaning the first storage tank.

In some embodiments, the substrate processing method further includes: after the switching element is switched to the second configuration, deciding whether to perform the test operation according to a third parameter related to a test operation; When deciding to perform the test operation, instruct the processing device and the supply device to perform the test operation, and schedule at least one other substrate after the test operation is completed so that the at least one other substrate is in the cavity of the processing device Processed in the chamber, wherein the test operation causes a test substrate to be processed in the chamber of the processing device; and when it has been decided not to perform the test operation, schedule at least one other substrate to make the additional At least one substrate is processed in the chamber of the processing device.

In some embodiments, the substrate processing method further includes: instructing the cleaning device to allow the processing liquid to be supplied from the first storage tank of the supply device when the switching element has been decided to perform the test operation After the first configuration of the processing device is switched to the second configuration that allows the processing liquid to be supplied from the second storage tank of the supply device to the processing device, the cleaning is performed in parallel with the test operation The liquid is provided into the first storage tank for cleaning the first storage tank.

The effect of the invention is that it can save relevant human resources and avoid mistakes caused by human factors. In addition, such automated procedures are more efficient in terms of time than traditional manual procedures.

Please refer to FIG. 1, which illustrates a substrate processing apparatus 100 by which a substrate wet process (including etching, cleaning, drying operations, etc.) can be performed according to an embodiment of the present invention. The illustrated apparatus 100 includes a processing device 110, a supply device 120, a cleaning device 130, and a control device 140 electrically connected to the processing device 110, the supply device 120, and the cleaning device 130.

According to one embodiment, the processing device 110 has a chamber and is configured to accommodate at least one substrate 150 to be processed in the chamber. According to some embodiments, the processing performed by the processing device 110 on the substrate 150 may be a single-substrate wet process, a multi-substrate wet process, a single-square wafer under-ball metal etching, thinned wafer support or peeling, bonding or peeling process , Recycled silicon carbide wafers, recycled silicon wafers or other similar technologies. For simplicity, only one substrate 150 is illustrated in FIG. 1. In one embodiment, only one substrate 150 is accommodated and processed in the chamber at a time, but the present invention is not so limited. According to some embodiments of the present invention, the substrate 150 may be in the form of a carrier board, a wafer, a wafer, or other elements, and may have a circular shape, a square shape, a rectangular shape, or other geometric shapes.

According to one embodiment, the supply device 120 has a plurality of processing liquid storage tanks 122 (such as the two processing liquid storage tanks shown in the figure including the first storage tank 122-1 and the second storage tank 122-2, but The present invention is not so limited) and a switching element 121, the processing liquid storage tanks 122 are used to store processing liquid, the switching element 121 can be operated to enable one of the processing liquid storage tanks 122 Communicate with the processing device 110 and supply the processing liquid to the chamber of the processing device 110. The switching element 121 includes a first line connected to the processing device 110 to enable the supply device 120 to supply the processing liquid stored in the processing liquid storage tank 122 into the processing device 110 via the first line. The switching element 121 is configured to allow only one of the processing liquid storage tanks 122 to provide the processing liquid to the processing device 110 at the same time. The processing liquid is applied to the substrate 150 in the chamber of the processing device 110 to perform a certain processing procedure (eg, etching) on the substrate 150. In one embodiment, the switching element 121 further includes a plurality of control valves and a second line connected to the processing liquid storage tanks 122, so that the switching element 121 can switch between the processing liquid storage tanks 122 and select Which processing liquid storage tank 122 is to be used as the processing liquid source. In one embodiment, the supply device 120 further includes a replenishment device (not shown in the figure) that stores replenishment liquid (ie, unused processing liquid) and is connected to the processing liquid storage tanks 122 via a third line ) For replenishing the processing liquid storage tank 122. In yet another embodiment, the supply device 120 further includes a temperature controller connected to the processing liquid storage tanks 122 and a circulation line for controlling the temperature of the processing liquid stored in the processing liquid storage tanks 122.

According to one embodiment, the cleaning device 130 has a detergent storage tank 131 for storing cleaning liquid, and is connected to the processing device 110 via a fourth line, thereby enabling the cleaning device 130 to supply the cleaning liquid via the fourth line Into the processing device 110 for cleaning the processing device 110. The cleaning device 130 may be additionally connected to the processing liquid storage tank 122 via a fifth line, so that the cleaning device 130 can supply the cleaning liquid into the processing liquid storage tank 122 via the fifth line for cleaning the processing liquid storage tank 122.

According to an embodiment, the control device 140 has an input module 141 and a processor 142 electrically connected to each other. The processor 142 is configured to receive control information from the user of the device 100 through the input module 141, and can automatically control the operations of the processing device 110, the supply device 120, and the cleaning device 130 according to the received control information . The control information may include but is not limited to at least one of the following: the number of substrates, the length of time, the time, the amount of used processing liquid, the number of switching times, and the number of tests. The processor 142 is further configured to automatically control when and from which processing liquid storage tank 122 provides the processing liquid based on the received control information.

FIG. 2 is a flowchart illustrating a substrate processing method according to an embodiment of the present invention. This method can be implemented by the apparatus 100 illustrated in FIG. 1. The method will be described below for the device 100 of FIG. 1.

Please refer to FIG. 2. In the following description, it is assumed that the switching element 121 of the supply device 120 is configured to allow the first storage tank 122-1 to provide the processing liquid to the processing device 110 when the process is about to start. The first configuration (that is, the first storage tank 122-1 is responsible for providing the processing liquid to the processing device 110).

In step 205, the control device 140 of the apparatus 100 schedules at least a portion of the substrates in the batch of multiple substrates so that the at least a portion of the substrates are processed in the chamber of the processing device 110. According to some embodiments, the at least a portion of the substrates may be one of the substrates, several of the substrates, or all of the substrates, and when the at least a portion of the substrates includes a plurality of substrates, the substrates may be processed one by one or in groups Subject to processing.

In step 210, the control device 140 determines whether to replace the tank. If the answer is yes, then proceed to step 215; if the answer is no, then return to step 205 to schedule another part of the same batch of substrates or at least a part of the substrates of another batch of substrates. According to an embodiment, step 210 can be determined by determining whether a first parameter related to the consumption of the processing liquid reaches a first condition for the last substrate that was scheduled in step 205 Replace the tank. The first parameter may be, for example, since the switching element 121 was last assembled or switched to a first configuration that allows the processing liquid to be provided by the first storage tank 122-1, the number of substrates to be processed in the processing device 110, since switching The time elapsed since the element 121 was last assembled or switched to the first configuration, since the switching element 121 was last assembled or switched to the first configuration is provided from the first storage tank 122-1 to The total amount of processing liquid of the processing device 110, the total amount of time each time the first storage tank 122-1 provides the processing liquid to the processing device 110 since the switching element 121 was last assembled or switched to the first configuration, or the foregoing Any combination of items; and the first condition may be at least one predetermined threshold, and its value may be set based on, for example, control information input by the user. According to another embodiment, the first parameter may also be time, and the first condition may be a predetermined time point.

In step 215, the control device 140 instructs the supply device 120 to perform a tank replacement operation, and schedules this to allow the processing liquid storage tank (ie, responsible for providing the processing liquid to the processing device to be allowed to supply the processing liquid to the processing device 110) The processing liquid storage tank of 110) is replaced from the first storage tank 122-1 to another storage tank, for example, to the second storage tank 122-2. In this example, this step includes instructing the switching element 121 to switch from the first configuration that allows the processing liquid to be provided by the first storage tank 122-1 to the second configuration that allows the processing liquid to be provided by the second storage tank 122-2. According to one embodiment, this operation of replacing the processing liquid storage tank 122 may be performed, for example, by changing the configuration of the control valve provided for each processing liquid storage tank 122. In one embodiment, as long as all the substrates scheduled in step 205 have been processed, the storage tank replacement operation can be started afterwards. However, in another embodiment, the storage tank replacement operation will only be performed after the entire batch of substrates has been processed. Therefore, in this embodiment, if the batch of substrates scheduled in step 205 has not yet been processed If the subject is processed, in step 215, the control device 140 will schedule all the unprocessed substrates in the batch of substrates before scheduling the tank replacement operation, so that the (unprocessed) substrates are being replaced Before the storage tank operation, the processing device 110 is first processed.

It is stated here that the processing liquid storage tank 122 subjected to use and replacement is not limited to those described above. For example, when performing the aforementioned procedure, the identities of the first storage tank 122-1 and the second storage tank 122-2 are interchangeable; in other words, during the foregoing process, it is possible that the second The storage tank 122-2 is responsible for providing the processing liquid to the processing device 110, and the storage tank replacement operation may be performed by replacing the storage tank responsible for supplying the processing liquid from the second storage tank 122-2 to the first storage tank 122-1.

In step 220, the control device 140 determines whether to perform the chamber cleaning operation. If the answer is yes, then proceed to step 225; if the answer is no, then proceed to step 230. According to some embodiments, whether the chamber cleaning operation is to be performed can be determined by determining whether a second parameter related to the operation of the switching element 121 reaches a second condition. The second parameter may be, for example, the number of switching operations performed by the switching element 121, and the second condition may be a predetermined threshold, and the value thereof may be set according to control information input by the user, for example.

In step 225, the control device 140 instructs the cleaning device 130 and the processing device 110 to perform chamber cleaning operations, and schedules this. This step includes instructing the cleaning device 130 to provide cleaning fluid into the processing device 110 for cleaning the processing device 110.

In step 230, the control device 140 determines whether to perform a test operation. If the answer is yes, proceed to step 235; if the answer is no, then return to step 205 to schedule another part of the same batch of substrates or at least a part of the substrates of another batch of substrates. The purpose of performing the test operation is to ensure that the processing apparatus 110 can correctly process the substrate after the processing liquid storage tank 122 that supplies the processing liquid is replaced. According to some embodiments, it may be determined whether to perform the test operation based on a third parameter related to the test operation. For example, the third parameter may be a flag, and whether the test operation is to be performed can be determined by determining whether the third parameter is a specific value. In a further embodiment, the control device 140 can set and change the value of the third parameter. For example, the control device 140 may set the value of the third parameter to a value indicating that the test operation is to be performed or a value not to perform the test operation in advance, and may change the value of the third parameter according to, for example, control information input by the user Value. In one embodiment, the preset value of the third parameter indicates the first value indicating that the test operation is to be performed, and after the switching element 121 performs a certain number of times (for example, five times) of switching, the control device 140 will change the third The value of the parameter is changed to the second value indicating that the test operation is not to be performed; in a further embodiment, the control device 140 may perform a certain number of (for example, five) switching operations after the switching element 121 or after reaching a certain At a predetermined time, the value of the third parameter is changed back to the first value.

In step 235, the control device 140 instructs the processing device 110 and the supply device 120 to perform a test operation and schedule this. In one embodiment, during the test operation, at least one test substrate exclusively for testing is processed in the chamber of the processing device 110 by the processing liquid from the supply device 120. For example, in this case, since the switching element 121 has been switched to the second configuration that allows the processing liquid to be supplied from the second storage tank 122-2, there will be at least one test substrate in the processing device 110 during the test operation The chamber is processed by the processing liquid from the second storage tank 122-2. After the test operation is completed, it may return to step 205 to schedule another part of the substrates of the same batch of substrates or at least a part of the substrates of another batch of substrates.

It is worth noting that in the method illustrated in Figure 2, the operation of replacing the tank, cleaning the chamber, and testing are all automatically scheduled and executed by the machine. In this way, the implementation of this method can save relevant human resources And can avoid mistakes caused by human factors. In addition, such automated procedures are more efficient in terms of time than traditional manual procedures.

Those skilled in the art of the present invention can recognize that steps 215 to 230 do not necessarily need to be performed in the order shown in FIG. 2. For example, step 220 may be performed at any time between step 210 and step 225, and not necessarily between step 215 and step 225, and step 230 may be performed at any time between step 210 and step 235, and It is not necessary to be sandwiched between step 225 and step 235.

In addition, this method can also have more changes. For example, in one embodiment, the control device 140 may further determine whether to perform the tank cleaning operation after determining that the tank replacement operation is to be performed in step 210 (this determination may be based on, for example, a flag Whether a fourth parameter is made for a specific value). In this embodiment, if the result of the determination is that the storage tank cleaning operation is to be performed, the control device 140 will instruct the cleaning device 130 and the first storage tank 122-1 to be allowed to provide the processing liquid to the processing device 110 after completing step 215 After the replacement of the processing liquid storage tank from the first storage tank 122-1 to the second storage tank 122-2, the storage tank cleaning operation for the first storage tank 122-1 is performed and scheduled. In some embodiments of the present invention, the control device 140 schedules the operation of cleaning the storage tank in parallel (eg, simultaneously) with other operations to effectively use time. For example, the control device 140 may schedule the cleaning tank operation performed by the cleaning device 130 and the first storage tank 122-1 as the cleaning chamber operation performed by the cleaning device 130 and the processing device 110, and the supply device 120 and The testing operations performed by the processing device 110 or the processing operations performed by the processing device 110 on the one or more substrates 150 with the processing liquid from the second storage tank 122-2 are parallel to save time. According to an embodiment, in the cleaning storage tank operation, the first storage tank 122-1 will drain the processing liquid inside, and the cleaning device 130 will then pour the cleaning liquid into the first storage tank 122-1 for use于洗第一储槽122-1. In a further embodiment, the control device 140 instructs the replenishment device of the supply device 120 to fill the replenishment liquid (ie, treatment liquid) into the cleaned first storage tank 122-1 after the cleaning storage tank operation is completed , And maintain the temperature of the processing liquid replenished into the first storage tank 122-1 through a circulation line and a temperature controller of the supply device 120 within a specific temperature range.

Although the foregoing has detailed many details in order to provide a comprehensive understanding of the embodiments of the present invention, it should be obvious to those skilled in the art of the technical field to which the present invention belongs, in implementing one or more other embodiments of the present invention Time does not necessarily include all the details described in the previous article. In addition, it should be recognizable that references in this specification to an embodiment, an embodiment or several embodiments, and the like are intended to indicate specific features, structures or characteristic. In addition, in this article, sometimes many features are collected in a single embodiment, drawing, or description of the embodiment or drawing. This is just to make the description smooth and help to understand the present invention. Various aspects. It should be recognized that when implementing the present invention, as appropriate, one or more features or specific details from one embodiment may be implemented together with one or more features or specific details from another embodiment.

Although the foregoing describes the present invention through exemplary embodiments, it should be understood that the present invention is not limited to the foregoing embodiments described above, and the present invention should cover all within the scope of the spirit and the broadest interpretation of the present invention All designs include all changes and equivalent designs that fall within the scope of the spirit of the invention and the broadest interpretation.

100: device 110: processing device 120: Supply device 121: Switching element 122 (122-1, 122-2): processing liquid storage tank (storage tank) 130: Cleaning device 131: lotion storage tank 140: control device 141: Input module 142: processor 150: substrate 205～235: steps

Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a schematic diagram illustrating a substrate processing apparatus according to an embodiment of the present invention; and FIG. 2 is based on the present invention. An embodiment of the invention illustrates a flowchart of a substrate processing method.

100: device

110: processing device

120: Supply device

121: Switching element

122 (122-1, 122-2): processing liquid storage tank (storage tank)

130: Cleaning device

131: lotion storage tank

140: control device

141: Input module

142: processor

150: substrate

Claims (11)

A substrate processing method, comprising: scheduling at least one substrate so that the at least one substrate is processed in a chamber of a processing apparatus; a first parameter related to consumption of a processing liquid reaches a first condition , Indicating that the processing liquid can be supplied into the processing device for a switching element of a supply device for processing the at least one substrate to switch from a first configuration to a second configuration, wherein the first configuration Allowing the processing liquid to be supplied to the processing device from a first storage tank of the supply device, and the second configuration allowing the processing liquid to be supplied to the processing device from a second storage tank of the supply device; and When a second parameter related to the operation of the switching element reaches a second condition, a cleaning device is instructed to provide a cleaning liquid into the processing device for cleaning the processing device. The substrate processing method according to claim 1, wherein the first parameter is one of the following: the number of substrates processed in the processing device since the switching element was last switched to the first configuration, since The time elapsed since the switching element was last switched to the first configuration, the total amount of processing liquid supplied to the processing device from the first storage tank since the switching element was last switched to the first configuration Any amount of time, the total amount of time each time the first storage tank provides the processing liquid to the processing device since the switching element was last switched to the first configuration, and any combination of the foregoing items; and the first condition is At least one predetermined threshold. The substrate processing method according to claim 1, wherein the first parameter is time, and the first condition is a predetermined time point. The substrate processing method according to claim 1, wherein the second parameter is the number of switchings performed by the switching element, and the second condition is a predetermined threshold. The substrate processing method according to claim 1, further comprising: switching from the first configuration that allows the processing liquid to be supplied from the first storage tank of the supply device to the processing device at the switching element to allow After the processing liquid is supplied from the second storage tank of the supply device to the second configuration of the processing device, the cleaning device is instructed to run in parallel with the operation of the cleaning device supplying the cleaning liquid into the processing device The cleaning liquid is provided into the first storage tank for cleaning the first storage tank. The substrate processing method according to claim 1, further comprising: switching from the first configuration that allows the processing liquid to be supplied from the first storage tank of the supply device to the processing device at the switching element to allow After the processing liquid is supplied from the second storage tank of the supply device to the second configuration of the processing device, the cleaning device is instructed to supply the processing liquid from the second storage tank to the chamber of the processing device The cleaning liquid is supplied into the first storage tank in a room in a manner that operations for processing at least one of the at least one substrate are parallel to the first storage tank for cleaning the first storage tank. The substrate processing method according to claim 1, further comprising: after the switching element is switched to the second configuration, determining whether to perform the test operation according to a third parameter related to a test operation, When it has been decided to perform the test operation, instruct the processing device and the supply device to perform the test operation, and schedule the at least one other substrate after the test operation is completed so that the at least one other substrate is in the processing device Is processed in the chamber, wherein the test operation causes a test substrate to be processed in the chamber of the processing device; and when it is decided not to perform the test operation, schedule at least one other substrate to make The further at least one substrate is processed in the chamber of the processing device. The substrate processing method according to claim 1, further comprising: instructing the cleaning device to allow the processing liquid to be removed from the first storage tank of the supply device when the test device has decided to perform the test operation After the first configuration provided to the processing device is switched to the second configuration that allows the processing liquid to be supplied from the second storage tank of the supply device to the processing device, the test operation is performed in parallel with the test operation. The cleaning liquid is provided into the first storage tank for cleaning the first storage tank. A substrate processing apparatus includes: a processing device having a chamber and configured to accommodate a substrate in the chamber; a supply device configured to provide processing liquid to the processing device The supply device has a switching element and a plurality of storage tanks for storing the processing liquid. The switching element can be operated to allow one of the storage tanks to provide the processing liquid to The processing device; a cleaning device, which is configured to provide cleaning liquid into the processing device for cleaning the processing device; and a control device, which is configured to perform the following operations: When a first parameter related to the consumption reaches a first condition, the switching element is instructed to switch from a first configuration to a second configuration, where the first configuration allows A first storage tank provides the processing liquid to the processing device, and the second configuration allows the processing liquid to be provided to the processing device from a second storage tank among the plurality of storage tanks, and the switching element When a second parameter related to the operation reaches a second condition, the cleaning device is instructed to provide the cleaning fluid to the processing device. The substrate processing apparatus according to claim 9, wherein the first parameter is one of the following: the number of substrates processed in the processing device since the switching element was last switched to the first configuration, since The time elapsed since the switching element was last switched to the first configuration, the total amount of processing liquid supplied to the processing device from the first storage tank since the switching element was last switched to the first configuration The total amount of time, the total amount of time each time the first storage tank provides the processing liquid to the processing device since the switching element was last switched to the first configuration, and any combination of the foregoing items; the first condition is at least A predetermined threshold; the second parameter is the number of switchings performed by the switching element; and the second condition is another predetermined threshold. The substrate processing apparatus according to claim 9, wherein the first parameter is time; the first condition is a predetermined time point; the second parameter is the number of times the switching element has performed switching; and the second condition is A predetermined threshold.

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