CN117577577B - Wet etching device for semiconductor chip - Google Patents
Wet etching device for semiconductor chip Download PDFInfo
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- CN117577577B CN117577577B CN202410050776.8A CN202410050776A CN117577577B CN 117577577 B CN117577577 B CN 117577577B CN 202410050776 A CN202410050776 A CN 202410050776A CN 117577577 B CN117577577 B CN 117577577B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 73
- 238000001039 wet etching Methods 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 140
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 210000000078 claw Anatomy 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims description 24
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 6
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 6
- 241001330002 Bambuseae Species 0.000 claims description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 6
- 239000011425 bamboo Substances 0.000 claims description 6
- 230000006978 adaptation Effects 0.000 claims description 3
- 230000000994 depressogenic effect Effects 0.000 claims description 3
- 239000012530 fluid Substances 0.000 description 14
- 238000004804 winding Methods 0.000 description 9
- 230000000149 penetrating effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
The invention discloses a wet etching device for a semiconductor chip, and relates to the technical field of semiconductor chip processing. The semiconductor chip wet etching device comprises a frame mechanism, wherein the frame mechanism comprises a frame, a swinging mechanism is arranged in the middle of the lower inner wall of the frame, the swinging mechanism comprises a first swinging table, the first swinging table presents a three-fork claw shape, a second swinging table is arranged right above the first swinging table, the second swinging table is identical to the first swinging table in shape, first electric telescopic columns are annularly connected to two sides of the upper surface of the three-fork claw end of the first swinging table through universal shafts, one end of the first electric telescopic column, far away from the first swinging table, is annularly connected to one side of the lower surface of the three-fork claw end of the adjacent second swinging table through the universal shafts, a main body mechanism is arranged above the swinging mechanism, the main body mechanism comprises a blanking mechanism, the blanking mechanism comprises a bottom plate, the semiconductor chip wet etching device is improved in quality of chips produced by the device, and the consumption of processing liquid is effectively saved.
Description
Technical Field
The invention relates to the technical field of semiconductor chip processing, in particular to a wet etching device for a semiconductor chip.
Background
And (3) a semiconductor chip: etching and wiring are performed on a semiconductor sheet to produce a semiconductor device capable of realizing a certain function. Not only silicon chips, but also gallium arsenide (gallium arsenide is toxic, so some bad circuit boards do not have to decompose it) and germanium.
In the prior art, in the wet etching process of a semiconductor chip, the chip to be processed is generally fixed at one position, and the processing liquid is sprayed onto the chip through the nozzle, so that the front surface of the semiconductor chip is ensured to be in full contact with the processing liquid by adopting the nozzle at present, but the processing liquid sprayed by the means can not only lead to the moist and ponding of the working environment, but also cause the waste of the processing liquid, and is unfavorable for the production and processing work of the wet etching device of the semiconductor chip, so that the wet etching device of the semiconductor chip is needed to solve the problems.
Disclosure of Invention
The invention aims to provide a wet etching device for a semiconductor chip, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the wet etching device for the semiconductor chip comprises a frame mechanism, wherein the frame mechanism comprises a frame, a swinging mechanism is arranged in the middle of the lower inner wall of the frame, the swinging mechanism comprises a first swinging table, the first swinging table is in a three-fork claw shape, a second swinging table is arranged right above the first swinging table, the second swinging table is identical to the first swinging table in shape, first electric telescopic columns are movably connected to the two circumferential sides of the upper surface of the three-fork claw end of the first swinging table through universal shafts, and one end of each first electric telescopic column, far away from the first swinging table, is movably connected with the lower surface of the adjacent three-fork claw end of the second swinging table through the universal shafts to one circumferential side; a main body mechanism is arranged above the swing mechanism; the main body mechanism comprises a blanking mechanism, the blanking mechanism comprises a bottom plate, the bottom plate is opposite to the second swinging table, the lower surface of the bottom plate is fixedly connected with the second swinging table, and the outer side of the bottom plate is fixedly sleeved with a fence; the upper part of the blanking mechanism is provided with a platform mechanism, the platform mechanism comprises a platform, the platform is embedded into and fixedly connected with the inner side of an upper port of the enclosure, a middle hole is formed in the middle of the surface of the platform in a penetrating manner, sliding grooves are formed in the middle of four sides of the surface of the platform in a penetrating manner, sliding rods are radially and fixedly connected to the four sliding grooves in the sliding grooves, cushion grooves are formed in the four sides of the surface of the platform in a penetrating manner, the cushion grooves are arc-shaped, the four cushion grooves are close to the middle hole, and the four cushion grooves are staggered with the four sliding grooves; pushing mechanisms are arranged in the four sliding grooves; a pressing and moving mechanism is arranged below the platform mechanism; a first clamping plate mechanism is arranged above the pushing mechanisms on the front side, the left side and the rear side; and a second clamping plate mechanism is arranged above the pushing mechanism on the right side.
Preferably, the upper wall embedding fixedly connected with spouts the platform, the lower surface mid-mounting who spouts the platform has the shower nozzle, the upper surface fixedly connected with treatment fluid case of spouting the platform, treatment fluid case and shower nozzle intercommunication.
Preferably, a second electric telescopic column is embedded and fixedly connected in the middle of the upper surface of the bottom plate, a stand column is fixedly connected to the upper end of the second electric telescopic column, a sucking disc is embedded and fixedly connected to the upper end of the stand column, the outer side edge of the sucking disc extends out of the stand column, and the sucking disc is inserted into the middle hole and is matched with the middle hole; the lower extreme outside of stand has fixedly cup jointed the area ring, the side middle part of area ring is sunken.
Preferably, the pushing mechanism comprises a sliding block, the sliding block is matched with and slides in a plug-in sliding groove, the sliding rod penetrates through the sliding block, a first spring is fixedly connected to one surface, close to the middle hole, of the sliding block, the first spring is wound on the sliding rod, and one end, far away from the sliding block, of the first spring is fixedly connected with the sliding groove; the lower end of the sliding block is fixedly connected with an inserting block at the clockwise side, a slot is formed in the middle of the clockwise surface of the inserting block, and the section of the slot is triangular; the lower extreme anticlockwise side fixedly connected with first splicing block of slider, first splicing block and inserted block fixed connection.
Preferably, the number of the pressing and moving mechanisms is four, and the centers of the four pressing and moving mechanisms are symmetrical; the pressing and moving mechanism comprises a tray, wherein second springs are uniformly and fixedly connected to the outer side of the upper surface of the tray at equal intervals, the upper ends of the second springs are fixedly connected with a platform, the inner side of the upper surface of the tray is fixedly connected with a pressing and moving block, and the upper ends of the pressing and moving blocks are correspondingly inserted into the cushion grooves and are matched with the cushion grooves; the pressing and moving mechanism comprises a column casing, the upper surface of the column casing is fixedly connected with a platform, the column casing is positioned on the clockwise side of the inserting block and is opposite to the inserting block, a column groove is formed in the middle of the anticlockwise surface of the column casing, an inserting column is adapted to the inside of the column groove and is in sliding connection with the column casing, the anticlockwise end of the inserting column presents an inclined plane at one side close to the middle hole, and the anticlockwise end of the inserting column is correspondingly inserted into the inserting groove and is adapted to the inserting groove; the end face of the inserted column, which is inserted into the column casing, is fixedly connected with a third spring, and one end of the third spring, which is far away from the inserted column, is fixedly connected with a casing groove; the inserted column inserts the terminal surface middle part fixedly connected with stay cord of column casing, the third spring wiring stay cord, the one end that the inserted column was kept away from to the stay cord runs through column casing and fixedly connected with arm-tie, clockwise face downside fixedly connected with of arm-tie links the post, the one end that the arm-tie was kept away from to the post corresponds fixedly connected tray.
Preferably, the first clamping plate mechanism comprises a first clamping plate, the middle part of the lower surface of the first clamping plate is correspondingly and fixedly connected with the sliding block, and the lower surface of the first clamping plate is attached to the upper surface of the platform; the surface annular both sides of first splint all imbeds fixedly connected with band frame, the upper end protrusion of band frame is in first splint, the vertical fixedly connected with frame post in inboard middle part of band frame.
Preferably, the second clamping plate mechanism comprises a second clamping plate, the middle part of the lower surface of the second clamping plate is correspondingly and fixedly connected with the sliding block, and the lower surface of the second clamping plate is attached to the upper surface of the platform; the middle part of the surface of the second clamping plate is embedded and fixedly connected with a baffle pad, the upper end of the baffle pad protrudes out of the second clamping plate, the right surface of the baffle pad is fixedly connected with a winding drum, the inside of the winding drum is hollow, the right part upper end fixedly connected with motor around a section of thick bamboo, the lower extreme output shaft fixed connection organic post of motor, the machine post runs through and through bearing swing joint around a section of thick bamboo.
Preferably, the inner sides of the first clamping plate mechanism and the second clamping plate mechanism are surrounded by a baffle belt, the starting point end of the baffle belt is embedded into and fixedly connected with the front side of the surface of the baffle pad, the ending point end of the baffle belt penetrates through the rear side of the surface of the baffle pad and is fixedly connected with a machine column, and the ending point side of the baffle belt is wound with the machine column.
Preferably, the outside of stand is provided with canceling release mechanical system, canceling release mechanical system includes the lantern ring, the side middle part depressed part of lantern ring fixed sleeve joint area ring and rather than the adaptation, the outside equidistance of lantern ring evenly fixedly connected with second splicing block, the quantity of second splicing block is four, four the second splicing block corresponds with four the inserted block, the anticlockwise side of second splicing block has flexible post through pivot swing joint, the anticlockwise side of swing joint first splicing block is passed through in the one end that the flexible post kept away from the second splicing block.
Compared with the prior art, the invention has the beneficial effects that:
(1) Under the action of the tensile force of the first spring, the sliding blocks on the four sides drive the first clamping plate mechanism and the second clamping plate mechanism to move towards the direction of the semiconductor chip, the semiconductor chip is initially positioned and clamped from the four sides, the operation is automatically carried out after the semiconductor chip is placed, and the automation performance of the device is improved.
(2) A wet etching device for semiconductor chips can stably clamp various types and sizes of semiconductor chips and improves the application range of the device.
(3) The utility model provides a semiconductor chip wet etching device, sprays through the shower nozzle to the middle part of semiconductor chip, and the width of keeping off the area is greater than the thickness of semiconductor chip far away, closely the centre gripping back is carried out to the semiconductor chip in the keeping off area, can effectually enclose the fender to the spraying of treatment fluid, and the outside environment diffusion when avoiding the treatment fluid to spray effectively improves the operational environment of device.
(4) The wet etching device for semiconductor chip is connected to the bottom board via the second oscillating stage to drive the main body mechanism to oscillate, so that the treating liquid rolls homogeneously on the semiconductor surface and covers the front surface of the semiconductor chip homogeneously and comprehensively to raise the etching quality of the device.
(5) The utility model provides a semiconductor chip wet etching device, after the lifting semiconductor chip, can make the semiconductor chip produce slight crooked for the semiconductor chip is toppled over its front remaining treatment fluid on platform mechanism, and gets into through the mesopore and enclose keep off inside and be collected, improves the quality of device output chip and effectual saving treatment fluid quantity.
(6) The wet etching device for semiconductor chip has the advantages that when the sucking disc is controlled to lift the semiconductor chip, the clamping effect of the first clamping plate mechanism, the second clamping plate mechanism and the baffle belt on the semiconductor chip can be synchronously removed, and the adaptability between the device mechanisms is improved.
(7) The utility model provides a semiconductor chip wet etching device, the slope setting of the anticlockwise terminal surface of spliced pole to can accomplish the grafting of spliced pole and slot voluntarily, make the device carry out the unloading to the semiconductor chip when, can return to the position the processing to first splint mechanism and second splint mechanism simultaneously, improve the work efficiency of device.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of a frame mechanism of the present invention;
FIG. 3 is a schematic view of a swing mechanism according to the present invention;
FIG. 4 is a schematic view of the main mechanism of the present invention;
FIG. 5 is a schematic view of a blanking mechanism of the present invention;
FIG. 6 is a schematic diagram of a platform mechanism according to the present invention;
FIG. 7 is a schematic view of the position of the pushing mechanism of the present invention;
FIG. 8 is a schematic view of a pushing mechanism according to the present invention;
FIG. 9 is a schematic diagram of a slot according to the present invention;
FIG. 10 is a schematic view of the position of the pressing and moving mechanism of the present invention;
FIG. 11 is a schematic view of the position of the spar of the present invention;
FIG. 12 is a schematic view of a press-shifting mechanism according to the present invention;
FIG. 13 is a schematic view of a belt according to the present invention;
FIG. 14 is a schematic view of a band attachment according to the present invention;
FIG. 15 is a schematic view of a belt termination of the present invention;
FIG. 16 is a schematic view of a first clamping mechanism according to the present invention;
FIG. 17 is a schematic view of a second clamping mechanism according to the present invention;
FIG. 18 is a schematic view of the interior of the winding drum of the present invention;
FIG. 19 is a schematic view of the position of the reset mechanism of the present invention;
FIG. 20 is a schematic view of a reset mechanism according to the present invention.
In the figure: 1. a frame mechanism; 101. a frame; 102. a spraying table; 103. a spray head; 104. a treatment liquid tank; 2. a swinging mechanism; 201. a first swing table; 202. a second swing table; 203. a first electrically-operated telescopic column; 3. a blanking mechanism; 301. a bottom plate; 302. a surrounding baffle; 303. a second electrically-operated telescopic column; 304. a column; 305. a suction cup; 306. a belt loop; 4. a platform mechanism; 401. a platform; 402. a middle hole; 403. a chute; 404. a slide rod; 405. a pad groove; 5. a pushing mechanism; 501. a slide block; 502. a first spring; 503. inserting blocks; 504. a slot; 505. a first joint block; 6. a press-moving mechanism; 601. a tray; 602. a second spring; 603. a pressing and moving block; 604. a column casing; 605. a barrel groove; 606. inserting a column; 607. a third spring; 608. a pull rope; 609. pulling a plate; 610. connecting columns; 7. a first clamping plate mechanism; 701. a first clamping plate; 702. a belt frame; 703. a frame column; 8. a second clamping plate mechanism; 801. a second clamping plate; 802. a baffle pad; 803. winding a cylinder; 804. a motor; 805. a machine column; 806. a baffle belt; 9. a reset mechanism; 901. a collar; 902. a second joint block; 903. an elastic telescopic column.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-20, the present invention provides a technical solution: the wet etching device for the semiconductor chip comprises a frame mechanism 1, wherein the frame mechanism 1 comprises a frame 101, a swinging mechanism 2 is arranged in the middle of the lower inner wall of the frame 101, the swinging mechanism 2 comprises a first swinging platform 201, the first swinging platform 201 is in a three-fork claw shape (shown in fig. 3), a second swinging platform 202 is arranged right above the first swinging platform 201, the second swinging platform 202 is identical to the first swinging platform 201 in shape, the second swinging platform 202 is obtained by rotating the horizontal center of the first swinging platform 201 for sixty degrees, the two circumferential sides of the upper surface of the three-fork claw end of the first swinging platform 201 are movably connected with a first electric telescopic column 203 through a universal shaft, one end, far away from the first swinging platform 201, of the first electric telescopic column is movably connected with the lower surface of the adjacent three-fork claw end of the second swinging platform 202 through the universal shaft to one side (shown in fig. 3), and initially the second swinging platform 202 is kept horizontal; a main body mechanism is arranged above the swinging mechanism 2; the main body mechanism comprises a blanking mechanism 3, the blanking mechanism 3 comprises a bottom plate 301, the bottom plate 301 is opposite to the second swinging table 202, the lower surface of the bottom plate 301 is fixedly connected with the second swinging table 202, and a fence 302 is fixedly sleeved on the outer side of the bottom plate 301; a platform mechanism 4 is arranged above the blanking mechanism 3, the platform mechanism 4 comprises a platform 401, the platform 401 is embedded into and fixedly connected with the inner side of the upper port of the surrounding baffle 302, a middle hole 402 is formed in the middle of the surface of the platform 401 in a penetrating manner, sliding grooves 403 are formed in the middle of four sides of the surface of the platform 401 in a penetrating manner, sliding rods 404 are fixedly connected in the four sliding grooves 403 in a radial manner, cushion grooves 405 are formed in the four sides of the surface of the platform 401 in a penetrating manner, the cushion grooves 405 are arc-shaped, the four cushion grooves 405 are close to the middle hole 402, and the four cushion grooves 405 are staggered with the four sliding grooves 403 (shown in fig. 6); the four sliding grooves 403 are internally provided with pushing mechanisms 5; a pressing and moving mechanism 6 is arranged below the platform mechanism 4; a first clamping plate mechanism 7 is arranged above the pushing mechanisms 5 on the front side, the left side and the rear side; a second clamping plate mechanism 8 is arranged above the pushing mechanism 5 on the right side.
The upper wall embedding fixedly connected with spouting platform 102 of frame 101, the lower surface mid-mounting of spouting platform 102 has shower nozzle 103, and the upper surface fixedly connected with treatment fluid case 104 of spouting platform 102, treatment fluid case 104 and shower nozzle 103 intercommunication.
The middle part of the upper surface of the bottom plate 301 is embedded and fixedly connected with a second electric telescopic column 303, the upper end of the second electric telescopic column 303 is fixedly connected with a stand column 304, the upper end of the stand column 304 is embedded and fixedly connected with a sucker 305, the outer side edge of the sucker 305 extends out of the stand column 304, when the sucker 305 carries a semiconductor chip to be lifted, the semiconductor chip can be poured out of redundant processing liquid on the front surface of the semiconductor chip through deflection, the sucker 305 is inserted into a middle hole 402 and is matched with the middle hole 402, and initially, the upper end of the sucker 305 is flush with the upper end of the middle hole 402; the outer side of the lower end of the upright post 304 is fixedly sleeved with a belt ring 306, and the middle part of the side surface of the belt ring 306 is sunken.
The pushing mechanism 5 comprises a sliding block 501, the sliding block 501 is matched with and slides to be connected with the sliding chute 403 in a sliding manner, the sliding rod 404 penetrates through the sliding block 501, a first spring 502 is fixedly connected to one surface of the sliding block 501 close to the middle hole 402, the first spring 502 is wound on the sliding rod 404, and one end of the first spring 502, which is far away from the sliding block 501, is fixedly connected with the sliding chute 403; the lower end of the sliding block 501 is fixedly connected with an inserting block 503 in the clockwise side, a slot 504 is formed in the middle of the clockwise surface of the inserting block 503, and the cross section of the slot 504 is triangular; the lower end of the slider 501 is fixedly connected with a first connector 505 at the anticlockwise side, and the first connector 505 is fixedly connected with the plug 503.
The number of the pressing and moving mechanisms 6 is four, and the centers of the four pressing and moving mechanisms 6 are symmetrical; the pressing and moving mechanism 6 comprises a tray 601, wherein second springs 602 are uniformly and fixedly connected to the outer side of the upper surface of the tray 601 at equal intervals, the upper ends of the second springs 602 are fixedly connected with a platform 401, the inner side of the upper surface of the tray 601 is fixedly connected with a pressing and moving block 603, the upper ends of the pressing and moving block 603 are correspondingly inserted into the pad groove 405 and are matched with the pad groove 405, and initially, the upper ends of the pressing and moving block 603 protrude out of the upper surface of the platform 401; the press-moving mechanism 6 comprises a column casing 604, the upper surface of the column casing 604 is fixedly connected with the platform 401, the column casing 604 is positioned on the clockwise side of the inserting block 503 and is opposite to the inserting block 503 (as shown in fig. 11), a casing groove 605 is formed in the middle of the anticlockwise surface of the column casing 604, a plug column 606 is adapted and slidingly inserted in the casing groove 605, the anticlockwise end of the plug column 606 presents an inclined plane (as shown in fig. 12) near to the middle hole 402, and the anticlockwise end of the plug column 606 is correspondingly inserted into the inserting groove 504 and is adapted to the inserting groove 504; the end face of the inserted column 606, inserted into the column casing 604, is fixedly connected with a third spring 607, and one end of the third spring 607, which is far away from the inserted column 606, is fixedly connected with a casing groove 605; the inserted post 606 is inserted in the middle of the end face of the post 604 and is fixedly connected with a pull rope 608, the third spring 607 is wound on the pull rope 608, one end of the pull rope 608, which is far away from the inserted post 606, penetrates through the post 604 and is fixedly connected with a pull plate 609, initially, the pull plate 609 is attached to the clockwise face of the post 604, the lower side of the clockwise face of the pull plate 609 is fixedly connected with a connecting post 610, and one end of the connecting post 610, which is far away from the pull plate 609, is correspondingly fixedly connected with the tray 601.
The first clamping plate mechanism 7 comprises a first clamping plate 701, wherein the middle part of the lower surface of the first clamping plate 701 is correspondingly and fixedly connected with the sliding block 501, and the lower surface of the first clamping plate 701 is attached to the upper surface of the platform 401; the surface annular both sides of first splint 701 are embedded fixedly connected with band frame 702, and band frame 702's upper end protrusion is in first splint 701, and the vertical fixedly connected with frame post 703 in the middle part of band frame 702's inboard.
The second clamping plate mechanism 8 comprises a second clamping plate 801, the middle part of the lower surface of the second clamping plate 801 is correspondingly and fixedly connected with a sliding block 501, and the lower surface of the second clamping plate 801 is attached to the upper surface of the platform 401; the middle part of the surface of the second clamping plate 801 is embedded with a baffle pad 802 fixedly connected, the baffle pad 802 is made of waterproof materials, the upper end of the baffle pad 802 protrudes out of the second clamping plate 801, the right surface of the baffle pad 802 is fixedly connected with a winding drum 803, the inside of the winding drum 803 is hollow, the upper end of the right part of the winding drum 803 is fixedly connected with a motor 804, the lower end output shaft of the motor 804 is fixedly connected with an organic column 805, and the machine column 805 penetrates through and is movably connected with the winding drum 803 through a bearing.
The inner sides of the first clamping plate mechanism 7 and the second clamping plate mechanism 8 are surrounded by a baffle belt 806 (as shown in fig. 13), the baffle belt 806 is made of waterproof materials, the starting point end of the baffle belt 806 is embedded into and fixedly connected with the front side of the surface of the baffle pad 802, the terminal point end of the baffle belt 806 penetrates through the rear side of the surface of the baffle pad 802 and is fixedly connected with a machine post 805, the terminal point side of the baffle belt 806 is wound with the machine post 805 (as shown in fig. 15), and the baffle belt 806 is inserted into the belt frame 702 from the inner side of the first clamping plate mechanism 7 and is wound with the frame post 703 and then penetrates out from the inner side of the first clamping plate mechanism 7 (as shown in fig. 14).
The outside of stand 304 is provided with canceling release mechanical system 9, canceling release mechanical system 9 includes the lantern ring 901, the lantern ring 901 is fixed to cup joint the side middle part depressed part of area ring 306 and rather than the adaptation, the radius of lantern ring 901 is greater than the radius of mesopore 402, the outside equidistance of lantern ring 901 evenly fixedly connected with second splicing block 902, the quantity of second splicing block 902 is four, four second splicing blocks 902 correspond with four inserts 503, the anticlockwise side of second splicing block 902 has flexible post 903 through pivot swing joint, the one end that flexible post 903 kept away from second splicing block 902 corresponds the anticlockwise side of swing joint first splicing block 505 through the pivot.
The working principle of the invention is as follows:
the first step: the semiconductor chip is placed on the upper surface of the platform 401, the pressure during placement presses the pressing block 603 into the pad groove 405, the tray 601 follows the lowering position, the pulling plate 609 is driven to move downwards through the connecting column 610, the pulling rope 608 is pulled, the inserting column 606 is contracted towards the inside of the barrel groove 605, at the moment, the anticlockwise end of the inserting column 606 is separated from the inserting groove 504, under the action of the pulling force of the first spring 502, the sliding blocks 501 on four sides drive the first clamping plate mechanism 7 and the second clamping plate mechanism 8 to move towards the semiconductor chip, the semiconductor chip is initially righted and clamped from four sides, the operation is automatically performed after the semiconductor chip is placed, and the automation performance of the device is improved.
And a second step of: the sizes of the semiconductor chips are different, the right angles and the round angles of the corners are different, the semiconductor chips are rightly clamped from the middle parts of the four sides of the semiconductor chips through the first clamping plate mechanism 7 and the second clamping plate mechanism 8, and then the motor 804 is started to rotate, so that the winding drum 803 is controlled to wind the baffle belt 806, the baffle belt 806 is attached to the outer side edge of the semiconductor chips, the semiconductor chips of various types and sizes can be stably clamped, and the application range of the device is improved.
And a third step of: the middle part of the semiconductor chip is sprayed with the treatment fluid through the spray head 103, the width of the baffle belt 806 is far greater than the thickness of the semiconductor chip, and after the baffle belt 806 tightly clamps the semiconductor chip, the treatment fluid can be effectively sprayed to enclose the baffle, so that the treatment fluid is prevented from diffusing to the external environment when being sprayed, and the working environment of the device is effectively improved.
Fourth step: through the enclosing of the baffle belt 806, the treatment fluid is completely accumulated above the front surface of the semiconductor chip, and the first electric telescopic column 203 is started to perform telescopic motion at the moment, so that the plane of the second swinging table 202 can swing according to the telescopic motion of the first electric telescopic column 203 at different positions, and the main body mechanism is driven to swing through the connection of the second swinging table 202 and the bottom plate 301, so that the treatment fluid uniformly rolls on the surface of the semiconductor, the front surface of the semiconductor chip is uniformly and comprehensively covered by the treatment fluid, and the etching quality of the device is improved.
Fifth step: after the etching time is up, the second electric telescopic column 303 is started to extend, so that the semiconductor chip is pushed up and discharged through the sucker 305, and the outer side edge of the sucker 305 is softer and extends out of the upright column 304, so that the semiconductor chip can slightly skew after being lifted, the semiconductor chip can pour the processing liquid left on the front surface of the semiconductor chip on the platform mechanism 4, and the processing liquid is collected by entering the enclosure block 302 through the middle hole 402, so that the quality of the chip produced by the device is improved, and the consumption of the processing liquid is effectively saved.
Sixth step: through the existence of the reset mechanism 9, when the upright post 304 is lifted, the clamping connection between the lantern ring 901 and the belt ring 306 enables the lantern ring 901 to move upwards synchronously, so that the existence of the elastic telescopic column 903 enables the elastic telescopic column 903 to shrink and be accompanied with the synchronous pushing and pushing mechanism 5, and thus when the sucker 305 is controlled to lift the semiconductor chip, the clamping effect of the first clamping plate mechanism 7, the second clamping plate mechanism 8 and the blocking belt 806 on the semiconductor chip can be synchronously removed, and the adaptability between device mechanisms is improved.
Seventh step: the lantern ring 901 continuously moves upwards under the drive of the upright post 304, and finally the elastic telescopic column 903 can push the pushing mechanism 5 to the outermost position along the sliding groove 403, and due to the inclined arrangement of the anticlockwise end surface of the inserting column 606, the insertion of the inserting column 606 and the inserting slot 504 can be automatically completed, so that the device can perform homing treatment on the first clamping plate mechanism 7 and the second clamping plate mechanism 8 simultaneously when the device is used for discharging a semiconductor chip, and the working efficiency of the device is improved.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a semiconductor chip wet etching device, includes frame mechanism (1), frame mechanism (1) include frame (101), the lower inner wall middle part of frame (101) is provided with swing mechanism (2), its characterized in that: the swing mechanism (2) comprises a first swing table (201), the first swing table (201) is in a three-fork claw shape, a second swing table (202) is arranged right above the first swing table (201), the second swing table (202) and the first swing table (201) are identical in shape, first electric telescopic columns (203) are movably connected to two circumferential sides of the upper surface of the three-fork claw end of the first swing table (201) through universal shafts, and one end of the first electric telescopic column (203) far away from the first swing table (201) is movably connected to one circumferential side of the lower surface of the adjacent three-fork claw end of the second swing table (202) through the universal shafts;
a main body mechanism is arranged above the swinging mechanism (2);
the main body mechanism comprises a blanking mechanism (3), the blanking mechanism (3) comprises a bottom plate (301), the bottom plate (301) is opposite to the second swinging table (202), the lower surface of the bottom plate (301) is fixedly connected with the second swinging table (202), and a surrounding baffle (302) is fixedly sleeved on the outer side of the bottom plate (301);
the upper part of the blanking mechanism (3) is provided with a platform mechanism (4), the platform mechanism (4) comprises a platform (401), the platform (401) is embedded into and fixedly connected with the inner side of an upper port of the enclosing shield (302), a middle hole (402) is formed in the middle of the surface of the platform (401), sliding grooves (403) are formed in the middle of four sides of the surface of the platform (401), sliding rods (404) are fixedly connected with the inner parts of the four sliding grooves (403) in a radial mode, cushion grooves (405) are formed in the four sides of the surface of the platform (401), the cushion grooves (405) are arc-shaped, the four cushion grooves (405) are close to the middle hole (402), and the four cushion grooves (405) are staggered with the four sliding grooves (403);
the sliding grooves (403) are internally provided with pushing mechanisms (5);
a pressing and moving mechanism (6) is arranged below the platform mechanism (4);
a first clamping plate mechanism (7) is arranged above the pushing mechanism (5) at the front side, the left side and the rear side;
a second clamping plate mechanism (8) is arranged above the pushing mechanism (5) on the right side.
2. The wet etching apparatus for semiconductor chips as defined in claim 1, wherein: the upper wall embedding fixedly connected with spouts platform (102) of frame (101), the lower surface mid-mounting of spouting platform (102) has shower nozzle (103), the upper surface fixedly connected with of spouting platform (102) handles liquid case (104), handle liquid case (104) and shower nozzle (103) intercommunication.
3. The wet etching apparatus for semiconductor chips as defined in claim 2, wherein: the middle part of the upper surface of the bottom plate (301) is embedded and fixedly connected with a second electric telescopic column (303), the upper end of the second electric telescopic column (303) is fixedly connected with a stand column (304), the upper end of the stand column (304) is embedded and fixedly connected with a sucker (305), the outer side edge of the sucker (305) extends out of the stand column (304), and the sucker (305) is inserted into a middle hole (402) and is matched with the middle hole (402);
the outer side of the lower end of the upright post (304) is fixedly sleeved with a belt ring (306), and the middle part of the side face of the belt ring (306) is sunken.
4. A semiconductor chip wet etching apparatus according to claim 3, wherein: the pushing mechanism (5) comprises a sliding block (501), the sliding block (501) is matched with and slides to be inserted into the sliding groove (403), the sliding rod (404) penetrates through the sliding block (501), a first spring (502) is fixedly connected to one surface, close to the middle hole (402), of the sliding block (501), the first spring (502) is wound on the sliding rod (404), and one end, far away from the sliding block (501), of the first spring (502) is fixedly connected with the sliding groove (403);
an inserting block (503) is fixedly connected to the lower end clockwise side of the sliding block (501), a slot (504) is formed in the middle of the clockwise surface of the inserting block (503), and the cross section of the slot (504) is triangular;
the lower end of the sliding block (501) is fixedly connected with a first connecting block (505) on the anticlockwise side, and the first connecting block (505) is fixedly connected with the inserting block (503).
5. The wet etching apparatus for semiconductor chips as defined in claim 4, wherein: the number of the pressing and moving mechanisms (6) is four, and the four pressing and moving mechanisms (6) are centrally symmetrical;
the pressing and moving mechanism (6) comprises a tray (601), wherein second springs (602) are uniformly and fixedly connected to the outer side of the upper surface of the tray (601) at equal intervals, the upper ends of the second springs (602) are fixedly connected with a platform (401), pressing and moving blocks (603) are fixedly connected to the inner side of the upper surface of the tray (601), and the upper ends of the pressing and moving blocks (603) are correspondingly inserted into the cushion grooves (405) and are matched with the cushion grooves (405);
the pressing and moving mechanism (6) comprises a column casing (604), wherein the upper surface of the column casing (604) is fixedly connected with the platform (401), the column casing (604) is positioned on the clockwise side of the inserting block (503) and is opposite to the inserting block (503), a column groove (605) is formed in the middle of the anticlockwise surface of the column casing (604), a plug column (606) is adapted and slidingly inserted in the column groove (605), the anticlockwise end of the plug column (606) is inclined at one side close to the middle hole (402), and the anticlockwise end of the plug column (606) is correspondingly inserted into the inserting groove (504) and is adapted to the inserting groove (504);
the end face of the inserting column (606) inserted into the column casing (604) is fixedly connected with a third spring (607), and one end, far away from the inserting column (606), of the third spring (607) is fixedly connected with a casing groove (605);
the inserting column (606) is inserted into the middle part of the end face of the column casing (604) and fixedly connected with a pull rope (608), the third spring (607) is wound with the pull rope (608), one end of the pull rope (608) away from the inserting column (606) penetrates through the column casing (604) and is fixedly connected with a pull plate (609), the lower side of the clockwise face of the pull plate (609) is fixedly connected with a connecting column (610), and one end of the connecting column (610) away from the pull plate (609) corresponds to the fixedly connected tray (601).
6. The wet etching apparatus for semiconductor chips as defined in claim 5, wherein: the first clamping plate mechanism (7) comprises a first clamping plate (701), the middle part of the lower surface of the first clamping plate (701) is correspondingly and fixedly connected with a sliding block (501), and the lower surface of the first clamping plate (701) is attached to the upper surface of the platform (401);
the surface annular both sides of first splint (701) are all embedded fixedly connected with band frame (702), the upper end protrusion of band frame (702) is in first splint (701), the vertical fixedly connected with frame post (703) in inboard middle part of band frame (702).
7. The wet etching apparatus for semiconductor chips as defined in claim 6, wherein: the second clamping plate mechanism (8) comprises a second clamping plate (801), the middle part of the lower surface of the second clamping plate (801) is correspondingly and fixedly connected with a sliding block (501), and the lower surface of the second clamping plate (801) is attached to the upper surface of the platform (401);
the embedded fixedly connected with keeps off pad (802) in the middle part of the surface of second splint (801), the upper end that keeps off pad (802) protrusion in second splint (801), the right surface fixedly connected with who keeps off pad (802) is around section of thick bamboo (803), around the inside cavity of section of thick bamboo (803), around the right part upper end fixedly connected with motor (804) of section of thick bamboo (803), the lower extreme output shaft fixedly connected with organic post (805) of motor (804), machine post (805) run through and around section of thick bamboo (803) through bearing swing joint.
8. The wet etching apparatus for semiconductor chips as defined in claim 7, wherein: the inner side of first splint mechanism (7) and second splint mechanism (8) enclose and are equipped with fender area (806), the starting point end embedding of fender area (806) and the surface front side of fixed connection fender pad (802), the terminal point end of fender area (806) runs through the surface rear side and the fixed connection machine post (805) of fender pad (802), terminal point side wiring machine post (805) of fender area (806).
9. The wet etching apparatus for semiconductor chips as defined in claim 8, wherein: the outside of stand (304) is provided with canceling release mechanical system (9), canceling release mechanical system (9) include lantern ring (901), the side middle part depressed part of lantern ring (901) fixed sleeve joint area ring (306) and rather than the adaptation, the outside equidistance of lantern ring (901) evenly fixedly connected with second splicing block (902), the quantity of second splicing block (902) is four, four second splicing block (902) corresponds with four inserted block (503), the anticlockwise side of second splicing block (902) has flexible post (903) through pivot swing joint, the anticlockwise side of swing joint first splicing block (505) is passed through in the one end that second splicing block (902) was kept away from to flexible post (903) through the pivot.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20210042240A (en) * | 2019-10-08 | 2021-04-19 | 사이언테크 코포레이션 | Wet Processing Device |
| CN216711596U (en) * | 2021-10-14 | 2022-06-10 | 浙江芯动科技有限公司 | Wet etching device for MEMS sensitive chip |
| CN219370988U (en) * | 2023-04-19 | 2023-07-18 | 奇勗科技股份有限公司 | Wet processing equipment of wafer and wafer carrier used for same |
| CN219811465U (en) * | 2023-03-24 | 2023-10-10 | 江苏启微半导体设备有限公司 | Swing device applied to semiconductor wet cleaning |
| CN116978827A (en) * | 2023-08-08 | 2023-10-31 | 台淑梅 | Etching device and method for processing semiconductor chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020139401A1 (en) * | 2001-04-02 | 2002-10-03 | Reynolds Tech Fabricators, Inc. | Wet process station with water spray of wafer reverse side |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210042240A (en) * | 2019-10-08 | 2021-04-19 | 사이언테크 코포레이션 | Wet Processing Device |
| CN216711596U (en) * | 2021-10-14 | 2022-06-10 | 浙江芯动科技有限公司 | Wet etching device for MEMS sensitive chip |
| CN219811465U (en) * | 2023-03-24 | 2023-10-10 | 江苏启微半导体设备有限公司 | Swing device applied to semiconductor wet cleaning |
| CN219370988U (en) * | 2023-04-19 | 2023-07-18 | 奇勗科技股份有限公司 | Wet processing equipment of wafer and wafer carrier used for same |
| CN116978827A (en) * | 2023-08-08 | 2023-10-31 | 台淑梅 | Etching device and method for processing semiconductor chip |
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