CN214043614U - Guide rail type degumming machine - Google Patents

Abstract

The utility model relates to a guide rail type photoresist remover, which comprises a film box unit (102) and a photoresist removing unit (103) which are arranged on one side of a machine table (101), wherein the two film box units (102) are respectively positioned on two sides of the photoresist removing unit (103), a sliding module (105) is arranged on a sliding rail (104) on the other side of the machine table (101) in a sliding way, and an adsorption mechanism (106) is arranged on the sliding module (105); the box unit (102) comprises a lifting bedplate (2.1) arranged on a lifting module (2.2), and a box body (2.3) is stacked on the lifting bedplate (2.1). The utility model relates to a guide tracked degumming machine, compact structure, reasonable in design and small in size.

Description

Guide rail type degumming machine

Technical Field

The utility model relates to a guide tracked machine of gluing especially relates to one kind and is used for the clear equipment of gluing to semiconductor substrate (like the wafer), belongs to semiconductor equipment technical field.

Background

Currently, in the manufacturing process of semiconductor devices, the cleanliness requirement of the surface of a semiconductor substrate such as a wafer is becoming more and more severe, and contaminants such as particles, organic substances and metals on the semiconductor substrate are generally removed by chemical reaction or physical force acting to overcome the attractive force or physical adhesion of chemical bonds. Nowadays, the cleaning of semiconductor substrates is mainly wet cleaning, which is generally divided into two modes, namely tank cleaning and single wafer cleaning. The tank cleaning can simultaneously process a plurality of substrates and has high cleaning efficiency, however, the tank cleaning has a major disadvantage in that the removal rate of contaminants is limited because contaminants cleaned from the substrates remain in the cleaning solution even though high-purity chemical reagents and deionized water are used in the cleaning, which causes secondary contamination of the substrates. In order to avoid secondary pollution of the substrate, the single-chip cleaning is gradually replacing the groove type cleaning, and the single-chip cleaning can effectively prevent the secondary pollution of the substrate. During the cleaning of the substrate, new chemical and deionized water are continuously supplied to the surface of the substrate, and used chemical and deionized water are directly discharged and recovered. In addition, yield is also an important factor in transition to single-wafer cleaning, and yield can be effectively increased by using single-wafer cleaning. Compared with the tank type cleaning, the single-chip cleaning has the advantages of good cleaning effect, high cleaning liquid recovery rate, capability of effectively preventing cross contamination and the like, but the yield is lower compared with the tank type cleaning.

Therefore, in some processes, in order to obtain a better cleaning effect and properly improve the productivity, the substrate needs to be cleaned by adopting a mode of combining slot type cleaning and single-chip cleaning, the existing slot type cleaning device and the existing single-chip cleaning device are two sets of devices which are completely and independently separated, and the substrate is cleaned in the slot type cleaning device and then put into the single-chip cleaning device for cleaning and drying, so that the cleaning process period is long, the cleaning cost is high, and the two sets of devices occupy large space. Therefore, a photoresist stripper capable of solving the above problems is needed.

Disclosure of Invention

An object of the utility model is to overcome the aforesaid not enough, provide a compact structure, reasonable in design and small in size's guide tracked degumming machine.

The purpose of the utility model is realized like this:

the utility model provides a guide tracked degumming machine, includes and installs in the spool box unit and the unit of removing the film of board one side, and two spool box units are located the both sides of unit of removing the film respectively, and it is provided with the slip module to slide on the slide rail of board opposite side, installs adsorption apparatus structure on the slip module.

The utility model relates to a guide tracked degumming machine, the spool box unit includes the lift platen of installing on lift module, it has the box body to pile up on the lift platen.

The utility model relates to a guide rail type degumming machine, the degumming unit comprises a fixed plate arranged on a machine table, a square cavity is arranged on the fixed plate, a jacking cavity is arranged in the square cavity, a crystal ring is arranged in the jacking cavity, one end of a rotating main shaft inserted into the square cavity passes through the jacking cavity and then drives the crystal ring, one end of a cavity jacking rod penetrating into the square cavity is connected with the outer wall of the top of the jacking cavity, and the top of the crystal ring jacking rod penetrates into one end of the square cavity and then is connected with the bottom surface of the crystal ring after penetrating through the jacking cavity; and the bottom of the crystal ring jacking rod is arranged on the jacking seat.

The utility model relates to a guide tracked degumming machine, the square intracavity is provided with the swing arm.

The utility model relates to a guide tracked degumming machine, the part that cavity stretching rod and brilliant ring jacking rod are located the square cavity all overlaps and is equipped with and keep off liquid spare.

The utility model relates to a guide tracked degumming machine, the cover is equipped with sealed guide on the brilliant ring jacking rod, and this sealed guide is embedded on the jacking chamber.

The utility model relates to a guide tracked degumming machine, the outer arch of following of the upper surface of wafer ring is provided with limit stop.

Compared with the prior art, the beneficial effects of the utility model are that:

the film box of the utility model is combined with the degumming, the film is taken from the film box unit and is transmitted to the degumming unit by the finger adsorption mechanism, and the film is transmitted to the film box unit at the other side by the finger adsorption mechanism after the degumming, the whole set of structure shortens the process flow period and reduces the process cost; and the whole machine has high maintainability, low cost, small investment and convenient popularization and application.

Drawings

Fig. 1 is a schematic structural view of the guide rail type degumming machine of the present invention.

Fig. 2 is a schematic structural diagram of a film cassette unit of the guide-rail type photoresist remover.

Fig. 3 is a schematic structural diagram of a photoresist removing unit of the guide rail type photoresist remover.

Fig. 4 is a schematic diagram of a state of the guide rail type degumming machine when jacking the jacking cavity.

Fig. 5 is a schematic diagram of a state of the jacking cavity of the guide rail type degumming machine of the present invention when descending.

Wherein:

the device comprises a machine table 101, a film box unit 102, a photoresist removing unit 103, a slide rail 104, a sliding module 105 and an adsorption mechanism 106;

a first cavity 201 and a second cavity 202;

a lifting bedplate 2.1, a lifting module 2.2 and a box body 2.3;

the device comprises a fixed plate 3.1, a square cavity 3.2, a jacking cavity 3.3, a wafer ring 3.4, a rotating main shaft 3.5, a cavity jacking rod 3.6, a wafer ring jacking rod 3.7, a jacking seat 3.8, a swing arm 3.9, a liquid blocking piece 3.10 and a sealing guide piece 3.11;

limit stop 3.4.1.

Detailed Description

Referring to fig. 1 to 5, the utility model relates to a guide tracked degumming machine, which comprises a cassette unit 102 and a degumming unit 103 installed on one side of a machine table 101, wherein the two cassette units 102 are respectively located on two sides of the degumming unit 103, a sliding module 105 is arranged on a sliding rail 104 on the other side of the machine table 101 in a sliding manner, and an adsorption mechanism 106 is installed on the sliding module 105;

when the wafer cassette unit is used, the adsorption mechanism 106 grabs the substrate from the wafer cassette unit 102 on one side, then sequentially carries out photoresist stripping cleaning through the photoresist stripping units 103 under the driving of the sliding module 105, and is placed into the wafer cassette unit 102 on the other side after the photoresist stripping cleaning is finished;

referring to fig. 2, further, the cassette unit 102 includes a lifting platen 2.1 mounted on a lifting module 2.2, and a cassette 2.3 is stacked on the lifting platen 2.1; thereby facilitating the lifting, grabbing and placing of the collected sheets into the box body 2.3 during operation;

referring to fig. 3, further, the photoresist removing unit 103 includes a fixed plate 3.1 installed on the machine table 101, a square cavity 3.2 is installed on the fixed plate 3.1, a jacking cavity 3.3 is arranged in the square cavity 3.2, a wafer ring 3.4 (a limit stop 3.4.1 is convexly arranged on an outer edge of an upper surface of the wafer ring 3.4) is arranged in the jacking cavity 3.3, one end of a rotating main shaft 3.5 inserted into the square cavity 3.2 penetrates through the jacking cavity 3.3 and then drives the wafer ring 3.4, one end of a top of a cavity jacking rod 3.6 penetrating into the square cavity 3.2 is connected with an outer wall of the top of the jacking cavity 3.3, and one end of a top of a wafer jacking rod 3.7 penetrating into the square cavity 3.2 penetrates through the jacking cavity 3.3 and then is connected with a bottom surface of the wafer ring 3.4; the bottom of the crystal ring jacking rod 3.7 is arranged on the jacking seat 3.8;

preferably, a swing arm 3.9 is arranged in the square cavity 3.2;

preferably, the liquid blocking parts 3.10 are sleeved on the cavity jacking rod 3.6 and the part of the crystal ring jacking rod 3.7, which is positioned in the square cavity 3.2;

preferably, the crystal ring jacking rod 3.7 is sleeved with a sealing guide part 3.11, and the sealing guide part 3.11 is embedded in the jacking cavity 3.3;

the utility model discloses the degumming process of guide tracked degumming machine does:

an adsorption mechanism (such as a finger) of the taking and placing piece drives the wafer ring 3.4 to enter the square cavity 3.2; lifting a wafer ring lifting rod 3.7 to take a wafer; then, after the wafer ring 3.4 is separated from the adsorption mechanism (such as a finger), the adsorption mechanism (such as the finger) leaves the square cavity; the crystal ring lifting rod 3.7 falls, the crystal ring 3.4 automatically falls into the object carrying disc of the lifting cavity 3.3 in the falling process, and meanwhile, the crystal ring lifting rod 3.7 continuously falls in place and automatically separates from the crystal ring 3.4; the rotating main shaft 3.5 drives the wafer ring 3.4 in the object carrying disc to rotate; the degumming arm in the swing arm 3.9 rotates to swing into the cavity of the jacking cavity 3.3, after the swing arm 3.9 is in place, a nozzle on the arm is opened to spray degumming liquid (the swing arm 3.9 can spray liquid at a fixed point or can swing and spray liquid in a reciprocating manner), and the degumming arm swings out of the cavity after spraying the liquid; then the cleaning and drying arm in the swing arm 3.9 rotates and swings into the cavity; at the moment, the cavity top extension rod 3.6 acts to lift the lifting cavity 3.3, and the first cavity 201 and the second cavity 202 are switched to recover liquid in a separating manner (see fig. 4 and 5, concretely, the cavity is an integrated double cavity which is provided with two cavities (the first cavity 201 and the second cavity 202), when glue is removed, the swing arm 3.9 serving as a glue removing arm enters the first cavity 201, when the swing arm 3.9 is cleaned and dried, the swing arm 3.9 serving as a cleaning and drying arm is firstly swung into the cavity of the lifting cavity 3.3, then the lifting cavity 3.3 is lifted under the action of the cavity top extension rod 3.6, and therefore the cleaning and drying arm enters the second cavity 202); and the nozzles on the swing arms 3.9 are opened to clean and blow-dry in sequence; after the cleaning and drying are finished, the cavity body is descended by the cavity body jacking rod 3.6, and the cleaning and drying arm is swung out of the cavity body; subsequently carry thing dish stall, simultaneously the brilliant ring liftout rod 3.7 rises, and the brilliant ring 3.4 is automatic to break away from with carrying the thing dish in the in-process that rises, is held by brilliant ring liftout rod 3.4 and is taken away from the cavity, and adsorption device (like the finger) is got the piece and is taken away from the square cavity and get other units at last to accomplish a complete cycle.

In addition: it should be noted that the above-mentioned embodiment is only a preferred embodiment of the present patent, and any modification or improvement made by those skilled in the art based on the above-mentioned conception is within the protection scope of the present patent.

Claims (7)

1. The utility model provides a guide tracked degumming machine which characterized in that: the film stripping machine comprises a film box unit (102) and a film stripping unit (103) which are arranged on one side of a machine table (101), wherein the two film box units (102) are respectively positioned on two sides of the film stripping unit (103), a sliding module (105) is arranged on a sliding rail (104) on the other side of the machine table (101) in a sliding mode, and an adsorption mechanism (106) is arranged on the sliding module (105).

2. The guide-type photoresist remover according to claim 1, wherein: the box unit (102) comprises a lifting bedplate (2.1) arranged on a lifting module (2.2), and a box body (2.3) is stacked on the lifting bedplate (2.1).

3. The guide-type photoresist remover according to claim 1, wherein: the photoresist removing unit (103) comprises a fixed plate (3.1) installed on a machine table (101), a square cavity (3.2) is installed on the fixed plate (3.1), a jacking cavity (3.3) is arranged in the square cavity (3.2), a wafer ring (3.4) is arranged on a carrying disc in the jacking cavity (3.3), one end, inserted into the square cavity (3.2), of a rotating main shaft (3.5) penetrates through the jacking cavity (3.3) and then drives the wafer ring (3.4) on the carrying disc to rotate, one end, inserted into the square cavity (3.2), of a top of a cavity jacking rod (3.6) is connected with the outer wall of the top of the jacking cavity (3.3), one end, inserted into the square cavity (3.2), of the top of a wafer ring jacking rod (3.7) penetrates through the jacking cavity (3.3.3), and then is connected with the bottom surface of the wafer ring (3.4); and the bottom of the crystal ring jacking rod (3.7) is arranged on the jacking seat (3.8).

4. The guide-type resist remover according to claim 3, wherein: and a swing arm (3.9) is arranged in the square cavity (3.2).

5. The guide-type resist remover according to claim 3, wherein: the liquid blocking piece (3.10) is sleeved on the cavity jacking rod (3.6) and the part of the crystal ring jacking rod (3.7) located in the square cavity (3.2).

6. The guide-type resist remover according to claim 3, wherein: the crystal ring jacking rod (3.7) is sleeved with a sealing guide piece (3.11), and the sealing guide piece (3.11) is embedded in the jacking cavity (3.3).

7. The guide-type resist remover according to claim 3, wherein: and a limit stop (3.4.1) is convexly arranged on the outer edge of the upper surface of the wafer ring (3.4).

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