CN214976289U - Flushing device for semiconductor silicon wafer - Google Patents
Flushing device for semiconductor silicon wafer Download PDFInfo
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- CN214976289U CN214976289U CN202121788354.9U CN202121788354U CN214976289U CN 214976289 U CN214976289 U CN 214976289U CN 202121788354 U CN202121788354 U CN 202121788354U CN 214976289 U CN214976289 U CN 214976289U
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Abstract
The utility model relates to the technical field of semiconductors, in particular to a flushing device for semiconductor silicon wafers, which comprises an ultrasonic flushing machine, wherein the top end of the ultrasonic flushing machine is provided with a cover, the middle part of the cover is provided with a first rectangular through hole, the top part of the cover is provided with two door bodies and at least two telescopic mechanisms, a linear driving device is arranged at the top part of the cover through a portal frame, the linear driving device is arranged at the top end of the portal frame, at least one lifting driving device is arranged on the linear driving device, a material taking device is arranged on the lifting driving device, compared with the prior art, the utility model has the advantages that the problem of repeatedly opening and closing the cover without manpower is solved through the matching between the door bodies on the cover and all the telescopic mechanisms, the problem of manual transportation is solved through the matching of the linear driving device and the lifting driving device, the problem of manual placing and taking out is solved through the material taking device.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically relate to a semiconductor silicon chip is with washing equipment.
Background
With the continuous progress of integrated circuit manufacturing processes, semiconductor devices are becoming smaller and smaller, which results in very fine particles becoming sufficient to affect the manufacturing and performance of semiconductor devices, and therefore, the silicon wafer rinsing process is becoming more and more important. For these tiny particles, conventional fluid flushing methods are not very effective in removing them. This is due to the presence of a relatively static boundary layer between the semiconductor wafer surface and the rinsing liquid. When the diameter of the particles attached to the surface of the silicon wafer is smaller than the thickness of the boundary layer, the flow of the rinsing liquid does not act on the particles. To ameliorate this problem, ultrasound and megasonic waves are introduced into the semiconductor rinse process. The ultrasonic energy can generate tiny bubbles in the water, and the vibration generated when the bubbles burst helps to strip off the tiny particles attached to the silicon wafer, thereby cleaning the silicon wafer. However, in the existing process flow, the carrier with the semiconductor silicon wafer is soaked in the ultrasonic wave washing machine, then the cover is closed, the cover is opened after washing is completed, the carrier is taken out, then the carrier is placed in other process equipment for subsequent processing, wherein the carrier needs to be repeatedly put in and taken out manually, the work efficiency is very complicated and low, and therefore a scheme needs to be provided to solve the problem.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the technical scheme provides the flushing equipment for the semiconductor silicon wafer, and the problem that the carrier needs to be placed by manually opening the cover and taken out by closing the cover in the working process of the ultrasonic flushing machine is solved.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a semiconductor silicon chip is with washing equipment, include:
the top end of the ultrasonic flushing machine is provided with a cover, the middle of the cover is provided with a first rectangular through hole, the top of the cover is provided with two door bodies and at least two telescopic mechanisms, the two door bodies are arranged in the first rectangular through hole, the ends, away from each other, of the two door bodies are hinged with the cover, one end of each telescopic mechanism is arranged on one door body, and the other end of each telescopic mechanism is arranged on the cover;
the linear driving device is arranged at the top of the cover through a portal frame, and the linear driving device is arranged at the top end of the portal frame;
at least one lifting driving device is arranged on the linear driving device;
and the material taking device is arranged on the lifting driving device.
Preferably, a first water pipe valve and a second water pipe valve are installed on one side of the ultrasonic flushing machine, the first water pipe valve is arranged at one position close to the top end, the second water pipe valve is arranged at one position of the bottom of the inner side of the ultrasonic flushing machine, and a water level meter is installed on the inner side wall of the ultrasonic flushing machine.
Preferably, one ends, close to each other, of the two door bodies are provided with a second rectangular through hole, and the ends, close to each other, of the second rectangular through holes are communicated with each other.
Preferably, the telescopic mechanism includes:
one end of the electric sleeve is hinged with the corresponding door body;
one end of the telescopic rod is inserted into one end of the electric sleeve, which is far away from the door body;
the middle of the limiting pull rail is provided with a strip-shaped through hole, the strip-shaped through hole is hinged with the other end of the telescopic rod, one end of the limiting pull rail is fixedly arranged at one end of the top of the cover, and the other end of the limiting pull rail is fixedly arranged at one end of the rectangular through hole.
Preferably, the linear driving device includes:
the first sliding rail is provided with a plurality of tooth openings at one side far away from the portal frame, and the first sliding rail is arranged at one side of the portal frame in a horizontal state;
the sliding device comprises at least one first sliding table, a plurality of second sliding tables and a plurality of connecting plates, wherein the first sliding table is arranged on one side of a first sliding rail, which is close to a plurality of tooth openings, the side of the first sliding table, which is close to the first sliding rail, is provided with the two connecting plates;
the first motor is vertically arranged on one connecting plate;
the first gear is arranged between the two connecting plates through the second connecting rod, one end of the second connecting rod penetrates through one of the connecting plates, the other end of the second connecting rod is in transmission connection with the output end of the first motor, and the first gear is meshed with the plurality of tooth openings.
Preferably, the elevation driving means includes:
the first mounting plate is vertically arranged on the first sliding table;
the electric push rod is vertically and fixedly arranged on one side, away from the first sliding table, of the first mounting plate;
the second sliding rail is vertically and fixedly arranged at the bottom of the electric push rod;
and the second sliding table is inserted on the second sliding rail, and one end of the second sliding table is fixedly connected with the output end of the electric push rod.
Preferably, the material extracting apparatus includes:
the second mounting plate is transversely arranged on the second sliding table;
the second motor is arranged on one side, close to the second sliding table, of the second mounting plate, and the output end of the second motor penetrates through the center of the second mounting plate;
the second gear is sleeved on the output end of the second motor;
the two third sliding rails are fixedly arranged on one side, close to the second gear, of the second mounting plate in a horizontal state, and are respectively arranged at one position close to the top of the second gear and one position close to the bottom of the second gear;
the two racks are respectively in one-to-one correspondence with the two third sliding rails, the two racks are respectively inserted on the corresponding third sliding rails, and the two racks are respectively meshed with the second gear;
the tops of the two clamping jaws are arranged on a rack through mounting blocks respectively, and each mounting block is fixedly arranged on one rack.
Compared with the prior art, the utility model beneficial effect who has is: the problem that the cover is not required to be opened and closed repeatedly manually is solved through the cooperation between the door body on the cover and all the telescopic mechanisms, the problem of manual transportation is solved through the cooperation of the linear driving device and the lifting driving device, and the problem of manual placement and taking out is solved through the material taking device.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the three-dimensional structure of the ultrasonic washing machine of the present invention;
FIG. 3 is a schematic perspective view of the door body of the present invention;
fig. 4 is a schematic perspective view of the telescopic mechanism of the present invention;
fig. 5 is a schematic view of a first three-dimensional structure of the linear driving mechanism of the present invention;
fig. 6 is a schematic view of a second three-dimensional structure of the linear driving mechanism of the present invention;
fig. 7 is a schematic perspective view of the lifting driving device of the present invention;
fig. 8 is a schematic view of the three-dimensional structure of the material taking device of the present invention.
The reference numbers in the figures are:
1-ultrasonic wave washing machine; 11-a lid; 12-a first rectangular through hole; 13-a door body; 14-a telescoping mechanism; 141-an electric sleeve; 142-a telescoping rod; 143-limit pull rail; 144-strip-shaped through holes; 15-a first water line valve; 16-a second water pipe valve; 17-a water level gauge; 18-a second rectangular through hole;
2-a linear drive; 21-a portal frame; 22-a first slide rail; 23-a tooth mouth; 24 — a first slide; 25-a connecting plate; 26-a first connecting rod; 27-a pulley; 28-a first motor; 29-a first gear; 210-a second connecting rod;
3-a lifting drive device; 31-a first mounting plate; 32-an electric push rod; 33-a second slide rail; 34-a second slide table;
4-a material taking device; 41-a second mounting plate; 42-a second motor; 43-a second gear; 44-a third slide rail; 45-rack; 46-a jaw; 47-mounting block.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
As the utility model discloses a preferred embodiment, the utility model discloses a semiconductor silicon chip is with washing equipment, include:
the top end of the ultrasonic flushing machine is provided with a cover, the middle of the cover is provided with a first rectangular through hole, the top of the cover is provided with two door bodies and at least two telescopic mechanisms, the two door bodies are arranged in the first rectangular through hole, the ends, away from each other, of the two door bodies are hinged with the cover, one end of each telescopic mechanism is arranged on one door body, and the other end of each telescopic mechanism is arranged on the cover;
the linear driving device is arranged at the top of the cover through a portal frame, and the linear driving device is arranged at the top end of the portal frame;
at least one lifting driving device is arranged on the linear driving device;
and the material taking device is arranged on the lifting driving device.
This flushing device for semiconductor silicon chip has solved the problem that need not the manual work and opens repeatedly and close the lid through the cooperation between the door body on the lid and all telescopic machanism, has solved the problem of artifical transportation through sharp drive arrangement and lift drive's cooperation, has solved the problem that the manual work was placed and was taken out through extracting device.
The preferred embodiments of the polishing device of the present invention will be described with reference to the accompanying drawings.
Referring to fig. 1, a rinsing apparatus for a semiconductor wafer includes:
the ultrasonic washing machine 1 is characterized in that a cover 11 is arranged at the top end of the ultrasonic washing machine 1, a first rectangular through hole 12 is formed in the middle of the cover 11, two door bodies 13 and at least two telescopic mechanisms 14 are arranged at the top of the cover 11, the two door bodies 13 are arranged in the first rectangular through hole 12, one ends, away from each other, of the two door bodies 13 are hinged to the cover 11, one end of each telescopic mechanism 14 is arranged on one door body 13, and the other end of each telescopic mechanism 14 is arranged on the cover 11;
the linear driving device 2 is arranged at the top of the cover 11 through a portal frame 21, and the linear driving device 2 is arranged at the top end of the portal frame 21;
at least one lifting driving device 3 arranged on the linear driving device 2;
and the material taking device 4 is arranged on the lifting driving device 3.
Firstly, a carrier provided with a semiconductor silicon wafer is grabbed by a material fetching device 4, then the material fetching device 4 is driven to move upwards by a lifting driving device 3, then the lifting driving device 3 is driven by a linear driving device 2 to move on a portal frame 21 to the upper part of an ultrasonic washing machine 1, then the material fetching device 4 is driven by the lifting driving device 3 to move downwards into the ultrasonic washing machine 1, a corresponding door body 13 is driven by a telescopic mechanism 14 to move downwards until the top of a parallel cover 11, when the semiconductor silicon wafer is cleaned, the corresponding door body 13 is driven by the telescopic mechanism 14 to move upwards until the top of a vertical cover 11, then the material fetching device 4 is driven by the lifting driving device 3 to move upwards, and finally the lifting driving device 3 is driven by the linear driving device 2 to move into subsequent equipment such as pure water washing, drying, protection storage and the like, therefore, the carrier provided with the semiconductor silicon wafer does not need to manually open the cover 11 and put the cover 11 into the ultrasonic washer 1, and then carry out a series of complicated and tedious work of closing the cover 11 and opening the cover 11 to take out the carrier, and the first rectangular through hole 12 is used for installing the two door bodies 13.
Referring to fig. 2, a first water pipe valve 15 and a second water pipe valve 16 are installed at one side of the ultrasonic washing machine 1, the first water pipe valve 15 is installed at a position close to the top end, the second water pipe valve 16 is installed at a position at the bottom of the inner side of the ultrasonic washing machine 1, and a water level gauge 17 is installed on the inner side wall of the ultrasonic washing machine 1.
Inject the flush fluid into ultrasonic flushing machine 1 through first water pipe valve 15, inject the capacity of flush fluid through water level gauge 17 restriction, thereby when making the flush fluid surpass the warning line, can remind the staff to close first water pipe valve 15 in information transfer to the siren, flush fluid discharge ultrasonic flushing machine 1 that will wash through second water pipe valve 16, thereby make and constantly inject new flush fluid into in the ultrasonic flushing machine 1, prevent that the follow-up semiconductor silicon chip of used flush fluid influence, lead to washing unclean.
Referring to fig. 3, one end of each of the two door bodies 13 close to each other is provided with a second rectangular through hole 18, and the ends of the two second rectangular through holes 18 close to each other are communicated with each other.
The second rectangular through hole 18 is used for preventing the two door bodies 13 from interfering with the material taking device 4 during the closing process, so that the two door bodies cannot be closed, and therefore, the washing liquid in the ultrasonic washing machine 1 is splashed out of the cover 11.
Referring to fig. 4, the telescoping mechanism 14 includes:
an electric sleeve 141, one end of which is hinged with the corresponding door body 13;
one end of the telescopic rod 142 is inserted into one end of the electric sleeve 141 far away from the door body 13;
the middle of the limiting pull rail 143 is provided with a strip-shaped through hole 144, the strip-shaped through hole 144 is hinged to the other end of the telescopic rod 142, one end of the limiting pull rail 143 is fixedly arranged at one end of the top of the cover 11, and the other end of the limiting pull rail 143 is fixedly arranged at one end of the rectangular through hole.
The electric sleeve 141 drives the telescopic rod 142 to move from one end of the strip-shaped through hole 144 to the other end of the strip-shaped through hole 144 on the limiting pull rail 143, and then the electric sleeve 141 drives the corresponding door bodies 13 to move, so that the two door bodies 13 are opened and closed.
Referring to fig. 5 to 6, the linear driving device 2 includes:
the first sliding rail 22 is provided with a plurality of tooth openings 23 on one side far away from the portal frame 21, and the first sliding rail 22 is arranged on one side of the portal frame 21 in a horizontal state;
at least one first sliding table 24 is arranged on one side of the first slide rail 22 close to the plurality of tooth openings 23, two connecting plates 25 are arranged on one side of the first sliding table 24 close to the first slide rail 22, one side of each connecting plate 25 close to the first slide rail 22 is provided with a first connecting rod 26, each first connecting rod 26 is sleeved with a pulley 27, and each pulley 27 is movably arranged on the first slide rail 22;
a first motor 28 vertically disposed on one of the connection plates 25;
the first gear 29 is arranged between the two connecting plates 25 through the second connecting rod 210, one end of the second connecting rod 210 penetrates through one of the connecting plates 25, the other end of the second connecting rod 210 is in transmission connection with the output end of the first motor 28, and the first gear 29 is meshed with the plurality of tooth gaps 23.
It is rotatory to drive second connecting rod 210 through first motor 28, it is rotatory to drive first gear 29 through second connecting rod 210, it removes to drive two connecting plates 25 through first gear 29, it removes with corresponding first connecting rod 26 to drive first slip table 24 through two connecting plates 25, it removes on first slide rail 22 to drive corresponding pulley 27 through first connecting rod 26, thereby make first slip table 24 drive lift drive 3 and remove, a plurality of tooth mouths 23 are used for cooperating first gear 29 and remove on first slide rail 22.
Referring to fig. 7, the lifting driving device 3 includes:
a first mounting plate 31 vertically disposed on the first slide table 24;
the electric push rod 32 is vertically and fixedly arranged on one side, away from the first sliding table 24, of the first mounting plate 31;
a second slide rail 33 vertically and fixedly arranged at the bottom of the electric push rod 32;
and the second sliding table 34 is inserted on the second sliding rail 33, and one end of the second sliding table 34 is fixedly connected with the output end of the electric push rod 32.
The second sliding table 34 is driven by the electric push rod 32 to move on the second sliding rail 33, so that the second sliding table 34 drives the material taking device 4 to move up and down, and the first mounting plate 31 is used for connecting the first sliding table 24 on one hand and is used for mounting the electric push rod 32 and the second sliding rail 33 on the other hand.
Referring to fig. 8, the material taking device 4 includes:
a second mounting plate 41 transversely arranged on the second slide table 34;
the second motor 42 is arranged on one side, close to the second sliding table 34, of the second mounting plate 41, and the output end of the second motor 42 penetrates through the center of the second mounting plate 41;
a second gear 43 sleeved on the output end of the second motor 42;
the two third slide rails 44 are fixedly arranged on one side, close to the second gear 43, of the second mounting plate 41 in a horizontal state, and the two third slide rails 44 are respectively arranged at one position close to the top of the second gear 43 and one position close to the bottom of the second gear 43;
the two racks 45 correspond to the two third slide rails 44 one by one, the two racks 45 are inserted into the corresponding third slide rails 44, and the two racks 45 are meshed with the second gear 43;
the tops of the two clamping jaws 46 are respectively arranged on one rack 45 through one mounting block 47, and each mounting block 47 is fixedly arranged on one rack 45.
The second motor 42 drives the second gear 43 to rotate, the second gear 43 drives the rack 45 to move on the third slide rail 44, the rack 45 drives the mounting block 47 to move, the mounting block 47 drives the clamping jaw 46 to move, so that the clamping jaw 46 drives the carrier with the semiconductor silicon wafer to move, and the second mounting plate 41 is used for connecting the second sliding table 34 on one hand and is used for mounting the third slide rail 44 on the other hand.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A rinsing apparatus for a semiconductor silicon wafer, comprising:
the ultrasonic washing machine (1) is provided with a cover (11) at the top end, a first rectangular through hole (12) is formed in the middle of the cover (11), two door bodies (13) and at least two telescopic mechanisms (14) are arranged at the top of the cover (11), the two door bodies (13) are arranged in the first rectangular through hole (12), one ends, far away from each other, of the two door bodies (13) are hinged to the cover (11), one end of each telescopic mechanism (14) is arranged on one door body (13), and the other end of each telescopic mechanism (14) is arranged on the cover (11);
the linear driving device (2) is arranged at the top of the cover (11) through a portal frame (21), and the linear driving device (2) is arranged at the top end of the portal frame (21);
at least one lifting driving device (3) is arranged on the linear driving device (2);
and the material taking device (4) is arranged on the lifting driving device (3).
2. The semiconductor silicon wafer rinsing device according to claim 1, wherein a first water pipe valve (15) and a second water pipe valve (16) are installed at one side of the ultrasonic rinsing machine (1), the first water pipe valve (15) is installed at a position close to the top end, the second water pipe valve (16) is installed at a position at the bottom of the inner side of the ultrasonic rinsing machine (1), and a water level gauge (17) is installed on the inner side wall of the ultrasonic rinsing machine (1).
3. The semiconductor silicon wafer flushing equipment according to claim 1, wherein one ends, close to each other, of the two door bodies (13) are provided with a second rectangular through hole (18), and the ends, close to each other, of the two second rectangular through holes (18) are communicated with each other.
4. The apparatus for rinsing a semiconductor silicon wafer as set forth in claim 1, wherein the retracting mechanism (14) comprises:
one end of the electric sleeve (141) is hinged with the corresponding door body (13);
one end of the telescopic rod (142) is inserted into one end, far away from the door body (13), of the electric sleeve (141);
the middle of the limiting pull rail (143) is provided with a strip-shaped through hole (144), the strip-shaped through hole (144) is hinged to the other end of the telescopic rod (142), one end of the limiting pull rail (143) is fixedly arranged at one end of the top of the cover (11), and the other end of the limiting pull rail (143) is fixedly arranged at one end of the rectangular through hole.
5. The rinsing apparatus for semiconductor silicon wafer according to claim 1, wherein the linear driving means (2) comprises:
the first sliding rail (22) is provided with a plurality of tooth openings (23) at one side far away from the portal frame (21), and the first sliding rail (22) is arranged at one side of the portal frame (21) in a horizontal state;
the sliding device comprises at least one first sliding table (24) arranged on one side, close to a plurality of tooth openings (23), of a first sliding rail (22), two connecting plates (25) are arranged on one side, close to the first sliding rail (22), of the first sliding table (24), a first connecting rod (26) is arranged on one side, close to the first sliding rail (22), of each connecting plate (25), a pulley (27) is sleeved on each first connecting rod (26), and each pulley (27) is movably arranged on the first sliding rail (22); a first motor (28) vertically arranged on one of the connection plates (25);
first gear (29) sets up between two connecting plates (25) through second connecting rod (210), the one end of second connecting rod (210) is worn to locate on one of them connecting plate (25), and the other end and the output transmission of first motor (28) of second connecting rod (210) are connected, and mesh between first gear (29) and a plurality of tooth mouth (23).
6. The rinsing apparatus for semiconductor silicon wafer according to claim 1, wherein the elevating driving means (3) comprises:
a first mounting plate (31) vertically disposed on the first slide table (24);
the electric push rod (32) is vertically and fixedly arranged on one side, away from the first sliding table (24), of the first mounting plate (31);
the second sliding rail (33) is vertically and fixedly arranged at the bottom of the electric push rod (32);
and the second sliding table (34) is inserted on the second sliding rail (33), and one end of the second sliding table (34) is fixedly connected with the output end of the electric push rod (32).
7. The rinsing apparatus for semiconductor silicon wafers as claimed in claim 1, wherein the take-out means (4) comprises:
the second mounting plate (41) is transversely arranged on the second sliding table (34);
the second motor (42) is arranged on one side, close to the second sliding table (34), of the second mounting plate (41), and the output end of the second motor (42) penetrates through the center of the second mounting plate (41);
the second gear (43) is sleeved on the output end of the second motor (42);
the two third sliding rails (44) are fixedly arranged on one side, close to the second gear (43), of the second mounting plate (41) in a horizontal state, and the two third sliding rails (44) are respectively arranged at one position close to the top of the second gear (43) and one position close to the bottom of the second gear (43);
the two racks (45) are respectively in one-to-one correspondence with the two third sliding rails (44), the two racks (45) are respectively inserted into the corresponding third sliding rails (44), and the two racks (45) are respectively meshed with the second gear (43);
the tops of the two clamping jaws (46) are respectively arranged on one rack (45) through one mounting block (47), and each mounting block (47) is fixedly arranged on one rack (45).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121788354.9U CN214976289U (en) | 2021-08-02 | 2021-08-02 | Flushing device for semiconductor silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121788354.9U CN214976289U (en) | 2021-08-02 | 2021-08-02 | Flushing device for semiconductor silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214976289U true CN214976289U (en) | 2021-12-03 |
Family
ID=79125471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121788354.9U Active CN214976289U (en) | 2021-08-02 | 2021-08-02 | Flushing device for semiconductor silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214976289U (en) |
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2021
- 2021-08-02 CN CN202121788354.9U patent/CN214976289U/en active Active
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