CN218414487U

CN218414487U - Silicon chip monolithic washs mechanism that spin-dries

Info

Publication number: CN218414487U
Application number: CN202222054464.3U
Authority: CN
Inventors: 靳立辉; 杨骅; 杜晨朋; 白子川; 吕原杰
Original assignee: Tianjin Huanbo Science and Technology Co Ltd
Current assignee: Tianjin Huanbo Science and Technology Co Ltd
Priority date: 2022-08-05
Filing date: 2022-08-05
Publication date: 2023-01-31
Anticipated expiration: 2032-08-05

Abstract

The utility model provides a silicon wafer single-sheet cleaning and spin-drying mechanism, which comprises a frame main body for installing and fixing the spin-drying mechanism, wherein the upper end of the frame main body is provided with a bearing platform, and a silicon wafer is arranged on the bearing platform to be cleaned and spin-dried; the bearing platform is provided with a silicon wafer clamping jaw, and the silicon wafer clamping jaw is used for clamping a silicon wafer on the bearing platform; still be equipped with the swing pipeline on the load-bearing platform, the swing pipeline sprays cleaner and air to the silicon chip for clean and spin-dry silicon chip. The utility model has the advantages that the drying process of the silicon chip is realized, compared with the traditional sucking disc positioning and drying mode, the risk that the sucking disc damages the surface of the silicon chip and the condition that the sucking disc cannot be dried are avoided; a water baffle is arranged to prevent water from being scattered in the equipment in the spin-drying process; the silicon wafer clamping mechanism can adapt to silicon wafers of various sizes through compatibility.

Description

Silicon chip monolithic washs mechanism that spin-dries

Technical Field

The utility model belongs to silicon chip washs the field, especially relates to a silicon chip monolithic washs mechanism that spin-dries.

Background

In the process of current industrial development, it is more and more common to replace manual work with mechanization, and especially in the development and utilization of new energy, the mechanization work can better ensure the cleanness of materials and has intellectualization, informatization and automation.

Therefore, in the semiconductor manufacturing industry, silicon wafers belong to highly clean materials, in order to guarantee the performance of the silicon wafers, the silicon wafers need to be cleaned, and a spin-drying process is performed after the silicon wafers are cleaned.

SUMMERY OF THE UTILITY MODEL

The to-be-solved problem of the utility model is to provide a silicon chip monolithic washs mechanism that spin-dries, especially is fit for the self-cleaning of silicon chip and spin-dries.

In order to solve the technical problem, the utility model adopts the technical scheme that:

a silicon wafer single-wafer cleaning and spin-drying mechanism comprises a frame main body used for installing and fixing a spin-drying mechanism, wherein a bearing platform is arranged at the upper end of the frame main body, and a silicon wafer is placed on the bearing platform to be cleaned and spin-dried; and

the silicon wafer clamping jaw is arranged on the bearing platform and used for clamping a silicon wafer on the bearing platform;

and the bearing platform is also provided with a swinging pipeline, and the swinging pipeline sprays cleaning agent and air to the silicon wafer for cleaning and spin-drying the silicon wafer.

Furthermore, the lower end of the frame main body is provided with a rotating motor, and the rotating motor is connected with the bearing platform through a connecting rod and used for driving the bearing platform to rotate.

Furthermore, the edge of the bearing platform is provided with a water baffle which can be lifted and used for preventing the cleaning agent from overflowing.

Furthermore, the lower end of the water baffle is provided with a lifting motor, and the lifting motor is used for driving the water baffle to lift.

Furthermore, a swing motor is arranged on the frame body and used for driving the swing pipeline to swing to a fixed position as required.

Furthermore, a clamping jaw cylinder is arranged on the bearing platform and used for driving the silicon wafer clamping jaw to be opened or clamped.

Furthermore, a control box is arranged at the side end of the frame main body, and a switch for controlling the starting and closing of each component is arranged in the control box.

Furthermore, a fixed sucker is arranged at the bottom end of the frame main body.

The utility model has the advantages and positive effects be:

(1) Compared with the traditional sucking disc positioning and spin-drying mode, the silicon wafer drying process avoids the risk that the sucking disc damages the surface of the silicon wafer and the condition that the sucking disc cannot spin-dry.

(2) The water baffle is arranged to prevent water in the spin-drying process from being scattered in the equipment

(3) The silicon wafer clamping mechanism can adapt to silicon wafers of various sizes through compatibility.

Drawings

Fig. 1 is a schematic view of a single silicon wafer cleaning and spin-drying mechanism according to an embodiment of the present invention.

Fig. 2 is a front view of a single silicon wafer cleaning and spin-drying mechanism according to an embodiment of the present invention.

Fig. 3 is a side view of a silicon wafer single wafer cleaning and spin-drying mechanism according to an embodiment of the present invention.

Fig. 4 is a top view of a single silicon wafer cleaning and spin-drying mechanism according to an embodiment of the present invention.

In the figure:

1. frame main part 2, load-bearing platform 3, silicon chip clamping jaw

4. Swing pipeline 5, rotating electrical machines 6, breakwater

7. Lifting motor 8, swing motor 9 and clamping jaw air cylinder

10. Control box

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

As shown in fig. 1-4, the utility model discloses the structure of embodiment is shown, the embodiment of the utility model relates to a silicon chip monolithic washs mechanism that spin-dries, a washing and the technology of spin-drying for compatible each size silicon chip, this mechanism is structurally including being used for the fixed frame main part 1 that spin-dries the mechanism of installation, the upper end of frame main part 1 is equipped with load-bearing platform 2, the silicon chip is placed and is waited to wash on load-bearing platform 2 and spin-dries, it can be understood, frame main part 1 is the cube structure, the bottom sets up four spinal branch posts, and set up fixed suction cup in the bottom of pillar, consolidate frame main part 1's stability, prevent to empty, load-bearing platform 2 installs in frame main part 1's up end, set up the connecting hole that matches with load-bearing platform 2 at the up end, help subsequent platform rotation operation.

In the embodiment of the utility model, the silicon wafer clamping jaw 3 is arranged on the bearing platform 2, the silicon wafer clamping jaw 3 is used for clamping the silicon wafer on the bearing platform 2, and it should be noted that the silicon wafer clamping jaw 3 is of a retractable ring structure, so that the clamping size is adjustable, and the silicon wafer clamping jaw can be compatible with silicon wafers of different sizes to clamp, so that the mechanism of the embodiment of the utility model is suitable for silicon wafer cleaning and spin-drying processes of different sizes;

further optimization scheme, still be equipped with swing pipeline 4 on load-bearing platform 2, swing pipeline 4 sprays cleaner and air to the silicon chip, be used for the cleanness and the silicon chip that spin-dries, in this embodiment, swing pipeline 4 is the arm structure, one end sets up sprays the mouth, the other end is driven by rolling bearing, when out of work, swing pipeline 4 is static in one side of load-bearing platform 2, under operating condition, swing pipeline 4 line swing to the assigned position, silicon chip to load-bearing platform 2 sprays, swing pipeline 4 sprays the cleaner earlier and washs, it drenches the air again and spin-dries, the cleaner is mostly the pure water in the embodiment of the utility model, be equipped with swing motor 8 on the frame main part 1, swing motor 8 is used for driving swing pipeline 4 to fixed position as required.

In the preferred scheme, the lower end of the frame body 1 is provided with a rotating motor 5, and the rotating motor 5 is connected with the bearing platform 2 through a connecting rod, namely penetrates through a connecting hole formed in the upper end face of the frame body 1 and is used for driving the bearing platform 2 to rotate so as to drive the silicon wafer clamped on the bearing platform to rotate, thereby being beneficial to all-dimensional cleaning and drying of the silicon wafer.

According to the utility model discloses silicon chip monolithic washs mechanism that spin-dries, the edge of load-bearing platform 2 is equipped with breakwater 6, breakwater 6 liftable for prevent that the cleaner from spilling over, avoid other equipment in the mechanism to dip the washing liquid and cause malfunctioning or short circuit, in this embodiment, breakwater 6 is driven by elevator motor 7, and elevator motor installs in the installation department of load-bearing platform 2 and breakwater 6, connects breakwater 6 by the telescopic link, and the elevator motor 7 of being convenient for drives breakwater 6 and goes up and down.

Preferably, the bearing platform 2 is provided with a clamping jaw cylinder 9, the clamping jaw cylinder 9 is arranged at the lower end of the silicon wafer clamping jaw 3 and is used for driving the silicon wafer clamping jaw 3 to open or clamp the silicon wafer, and the silicon wafer is only required to be fixed, so that excessive pressing force is not required for avoiding scratching the silicon wafer, and a pneumatic device is adopted to clamp and fix the silicon wafer.

According to the utility model discloses silicon chip monolithic washs mechanism that spin-dries, the side of frame main part 1 is equipped with control box 10, is equipped with the switch that is used for controlling each component start and closes in the control box 10, and the start-up of the motor and the cylinder that mention in this embodiment closes the switch, all installs in control box 10, the operation of the whole mechanism of accessible control box 10 control.

According to the utility model discloses silicon chip monolithic washs mechanism that spin-dries, the beneficial effect of its production is:

(2) The water baffle is arranged to prevent water from being scattered in the equipment in the spin-drying process

(3) The silicon chip clamping mechanism can adapt to silicon chips of various sizes.

The above detailed description of the embodiments of the present invention is only for the purpose of describing the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. The equivalent changes and improvements made according to the application scope of the present invention should be still included in the patent coverage of the present invention.

Claims

1. A silicon wafer single-wafer cleaning and spin-drying mechanism is characterized by comprising a frame main body used for installing and fixing the spin-drying mechanism, wherein a bearing platform is arranged at the upper end of the frame main body, and a silicon wafer is placed on the bearing platform to be cleaned and spin-dried; and

2. The silicon wafer single wafer cleaning and spin-drying mechanism as claimed in claim 1, wherein a rotating motor is disposed at a lower end of the frame body, and the rotating motor is connected to the carrying platform through a connecting rod for driving the carrying platform to rotate.

3. The silicon wafer single-wafer cleaning and spin-drying mechanism as claimed in claim 1, wherein a water baffle is provided at the edge of the carrying platform, and the water baffle can be lifted to prevent the cleaning agent from overflowing.

4. The silicon wafer single-wafer cleaning and spin-drying mechanism as claimed in claim 3, wherein a lifting motor is provided at a lower end of the water baffle for driving the water baffle to lift.

5. The single wafer cleaning and spin-drying mechanism of claim 1, wherein the frame body is provided with a swing motor for driving the swing pipe to swing to a fixed position as required.

6. The silicon wafer single wafer cleaning and spin-drying mechanism of claim 1, wherein a clamping jaw cylinder is arranged on the bearing platform and used for driving the silicon wafer clamping jaws to open or clamp.

7. The single wafer cleaning and spin-drying mechanism as claimed in claim 1, wherein a control box is provided at a side end of the frame body, and a switch for controlling the on/off of each member is provided in the control box.

8. The single wafer cleaning and spin-drying mechanism of claim 1, wherein a fixed suction cup is provided at a bottom end of the frame body.