CN202052722U - Rinsing sink - Google Patents
Rinsing sink Download PDFInfo
- Publication number
- CN202052722U CN202052722U CN201020695508.5U CN201020695508U CN202052722U CN 202052722 U CN202052722 U CN 202052722U CN 201020695508 U CN201020695508 U CN 201020695508U CN 202052722 U CN202052722 U CN 202052722U
- Authority
- CN
- China
- Prior art keywords
- plug
- tank
- drain
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000007654 immersion Methods 0.000 claims abstract description 13
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 12
- 239000012535 impurity Substances 0.000 abstract description 7
- 239000000126 substance Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Nozzles (AREA)
Abstract
本实用新型公开了一种浸洗槽,包括槽体,其特征在于,所述槽体底部设置有排水口,排水口处设置有可移动的堵头,所述堵头与驱动装置连接,驱动装置可驱动堵头移动以使堵头堵住排水口或打开排水口。本实用新型中的浸洗槽,在堵头快速打开排水口时,槽体内的液体可快速排出,在水快速排出过程中,会产生一定的负压吸力,将芯片表面附着的化学液体、杂质吸除。本实用新型利用虹吸原理,在液体快速排放的时候以高速、负压的状态将芯片表面的杂质、液体清洗干净。此结构简单,操作、维修方便,效率高,且容易制造。
The utility model discloses a immersion tank, which comprises a tank body, and is characterized in that a drain is arranged at the bottom of the tank, and a movable plug is arranged at the drain, and the plug is connected with a driving device to drive The device can drive the plug to move so that the plug blocks the drain or opens the drain. In the immersion tank of the utility model, when the plug quickly opens the drain, the liquid in the tank can be quickly discharged. During the rapid discharge of water, a certain negative pressure suction will be generated, and the chemical liquid and impurities attached to the chip surface Suction. The utility model utilizes the siphon principle to clean impurities and liquid on the surface of the chip in a state of high speed and negative pressure when the liquid is quickly discharged. The utility model has the advantages of simple structure, convenient operation and maintenance, high efficiency and easy manufacture.
Description
技术领域 technical field
本实用新型涉及一种浸洗槽。 The utility model relates to a dipping tank. the
背景技术 Background technique
在芯片湿法制程生产领域里,经过各种工艺环节后,芯片表面会残留各种化学液体及杂质,由于有些化学液体及杂质具有一定的粘附力,传统的浸泡及喷淋方法,由于仅能简单的向芯片喷淋水或浸泡,难以将化学液体清理干净。 In the field of chip wet process production, after various process steps, various chemical liquids and impurities will remain on the surface of the chip. Because some chemical liquids and impurities have certain adhesion, the traditional soaking and spraying methods, because only It is easy to spray water or soak the chip, but it is difficult to clean up the chemical liquid. the
实用新型内容 Utility model content
本实用新型的目的是为了克服现有技术中的不足,提供可快速清理芯片等表面附着的液体及杂质的浸洗槽。 The purpose of the utility model is to overcome the deficiencies in the prior art and provide a immersion tank that can quickly clean up liquid and impurities attached to the surface of chips and the like. the
为实现以上目的,本实用新型通过以下技术方案实现: In order to achieve the above purpose, the utility model is realized through the following technical solutions:
浸洗槽,包括槽体,其特征在于,所述槽体底部设置有排水口,排水口处设置有可移动的堵头,所述堵头与驱动装置连接,驱动装置可驱动堵头移动以使堵头堵住排水口或打开排水口。 The immersion tank includes a tank body, which is characterized in that a drain is provided at the bottom of the tank, and a movable plug is arranged at the drain, and the plug is connected with a driving device, and the driving device can drive the plug to move to Make a plug to block the drain or open the drain. the
优选地是,所述的驱动装置为气缸,所述的堵头与气缸的输出杆连接。 Preferably, the driving device is an air cylinder, and the plug is connected to the output rod of the air cylinder. the
优选地是,所述气缸设置在气缸座上,堵头下表面设置有防水套,防水套套装在气缸座外部。 Preferably, the cylinder is arranged on the cylinder base, the lower surface of the plug is provided with a waterproof cover, and the waterproof cover is set on the outside of the cylinder base. the
优选地是,所述槽体内部上端设置有喷淋管。 Preferably, a spray pipe is provided at the inner upper end of the tank body. the
优选地是,所述槽体内底部设置有注水管。 Preferably, a water injection pipe is provided at the bottom of the tank body. the
优选地是,所述槽体内底部设置有筛板,筛板位于注水管上方。 Preferably, a sieve plate is provided at the bottom of the tank body, and the sieve plate is located above the water injection pipe. the
优选地是,所述槽体外部上端设置有可接住从槽体内溢出的水的溢流槽。 Preferably, the outer upper end of the tank body is provided with an overflow tank capable of catching water overflowing from the tank body. the
优选地是,所述的溢流槽上端设置有可开启的盖板。 Preferably, the upper end of the overflow tank is provided with an openable cover plate. the
本实用新型中的浸洗槽,在堵头快速打开排水口时,槽体内的液体可快速排出,在水快速排出过程中,会产生一定的负压吸力,将芯片表面附着的化学液体、杂质吸除。本实用新型利用虹吸原理,在液体快速排放的时候以高速、负压的状态将芯片表面的杂质、液体清洗干净。此结构简单,操作、维修方便,效率高,且容易制造。 In the immersion tank of the utility model, when the plug quickly opens the drain, the liquid in the tank can be quickly discharged. During the rapid discharge of water, a certain negative pressure suction will be generated, and the chemical liquid and impurities attached to the chip surface Suction. The utility model utilizes the siphon principle to clean impurities and liquid on the surface of the chip in a state of high speed and negative pressure when the liquid is quickly discharged. The utility model has the advantages of simple structure, convenient operation and maintenance, high efficiency and easy manufacture. the
附图说明 Description of drawings
图1为本实用新型外部结构示意图。 Fig. 1 is a schematic diagram of the external structure of the utility model. the
图2为去除盖板后的本实用新型结构示意图。 Fig. 2 is a structural schematic diagram of the utility model after removing the cover plate. the
图3为图2的竖剖图。 Fig. 3 is a vertical sectional view of Fig. 2 . the
具体实施方式 Detailed ways
下面结合附图对本实用新型进行详细的描述: The utility model is described in detail below in conjunction with accompanying drawing:
如图1至图3所示,浸洗槽,包括槽体1。槽体1底部设置有排水口13。 槽体1上端安装有溢流槽6。溢流槽6可接住从槽体1溢流出的水。溢流槽6内的水可通过水管(图中未示出)排出。溢流槽6上端设置有可以打开的盖板61。
As shown in FIGS. 1 to 3 , the immersion tank includes a tank body 1 . A
槽体1内部上端设置有喷淋管12,底部设置有注水管14。槽体1内还设置有筛板15,筛板15位于注水管14上方。
A
槽体1安装在底座2上。底座2内设置有气缸座32,气缸座32内设置有气缸3。气缸3的输出杆31端部设置有堵头4,堵头4位于排水口13下方。气缸3可推动堵头4向上移动堵住排水口13,也可以拉动堵头4向下移动打开排水口13。
The tank body 1 is installed on the
堵头4下表面设置有防水套5,防水套5套装在气缸座32外部,可防止气缸座32进水。
The lower surface of the
本实用新型中的实施例仅用于对本实用新型进行说明,并不构成对权利要求范围的限制,本领域内技术人员可以想到的其他实质上等同的替代,均在本实用新型保护范围内。 The embodiments in the utility model are only used to illustrate the utility model, and do not constitute a limitation on the scope of the claims. Other substantially equivalent substitutions conceivable by those skilled in the art are all within the protection scope of the utility model. the
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020695508.5U CN202052722U (en) | 2010-12-31 | 2010-12-31 | Rinsing sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020695508.5U CN202052722U (en) | 2010-12-31 | 2010-12-31 | Rinsing sink |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202052722U true CN202052722U (en) | 2011-11-30 |
Family
ID=45012709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201020695508.5U Expired - Lifetime CN202052722U (en) | 2010-12-31 | 2010-12-31 | Rinsing sink |
Country Status (1)
Country | Link |
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CN (1) | CN202052722U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108878321A (en) * | 2018-06-25 | 2018-11-23 | 扬州思普尔科技有限公司 | A kind of semiconductor crystal wafer cleaning fast row's flushing tank of energy conservation |
CN112775137A (en) * | 2020-12-22 | 2021-05-11 | 内蒙古东岳金峰氟化工有限公司 | Multichannel alkali washing circulation tank |
-
2010
- 2010-12-31 CN CN201020695508.5U patent/CN202052722U/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108878321A (en) * | 2018-06-25 | 2018-11-23 | 扬州思普尔科技有限公司 | A kind of semiconductor crystal wafer cleaning fast row's flushing tank of energy conservation |
CN112775137A (en) * | 2020-12-22 | 2021-05-11 | 内蒙古东岳金峰氟化工有限公司 | Multichannel alkali washing circulation tank |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20111130 |