CN116978827A - Etching device and method for processing semiconductor chip - Google Patents

Etching device and method for processing semiconductor chip Download PDF

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Publication number
CN116978827A
CN116978827A CN202310990151.5A CN202310990151A CN116978827A CN 116978827 A CN116978827 A CN 116978827A CN 202310990151 A CN202310990151 A CN 202310990151A CN 116978827 A CN116978827 A CN 116978827A
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China
Prior art keywords
fixedly connected
etching
groove
gear
wall
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CN202310990151.5A
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Chinese (zh)
Inventor
台淑梅
金新华
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Individual
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Individual
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Priority to CN202310990151.5A priority Critical patent/CN116978827A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)

Abstract

The invention discloses an etching device and method for processing a semiconductor chip, and belongs to the technical field of semiconductor chip processing. Including the workstation, still include: an etching groove arranged on the surface of the workbench, wherein etching liquid is filled in the etching groove; the first support plate is fixedly connected to the surface of the workbench, the bottom of the first support plate is fixedly connected with a cylinder, the output end of the cylinder is fixedly connected with a second support plate, and the bottom of the second support plate is fixedly connected with a placement frame; the invention adopts the structure that the chip is vertically clamped between the adjacent positioning blocks, so that both side walls of the chip can be contacted with etching liquid, and the etching effect of both sides of the chip is improved.

Description

Etching device and method for processing semiconductor chip
Technical Field
The invention relates to the technical field of semiconductor chip processing, in particular to an etching device and method for semiconductor chip processing.
Background
Semiconductor chips are semiconductor devices which are etched and wired on a semiconductor sheet material and can realize certain functions, and the semiconductor chips are not only silicon chips, but also commonly comprise semiconductor materials such as gallium arsenide, germanium and the like.
The semiconductor chip etching device in the prior art usually adopts the method that the chip is directly placed at the bottom of the etching groove to carry out etching reaction, so that the side surface of the chip, which is contacted with the bottom of the etching groove, is less in acid liquor, and the etching effect of the two sides of the chip is reduced, therefore, the chip needs to be improved.
Disclosure of Invention
The invention aims to solve the problems that in the prior art, a semiconductor chip etching device is usually used for directly placing a chip at the bottom of an etching groove to carry out etching reaction, so that the side surface of the chip, which is contacted with the bottom of the etching groove, is less in acid liquor, and the etching effect when two sides of the chip are etched is reduced.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
an etching device for processing a semiconductor chip, comprising a workbench, and further comprising: an etching groove arranged on the surface of the workbench, wherein etching liquid is filled in the etching groove; the first support plate is fixedly connected to the surface of the workbench, the bottom of the first support plate is fixedly connected with a cylinder, the output end of the cylinder is fixedly connected with a second support plate, and the bottom of the second support plate is fixedly connected with a placement frame; the positioning blocks are fixedly connected to the inner wall of the placement frame, clamping grooves are formed between adjacent positioning blocks, and the clamping grooves are matched with the chips.
In order to facilitate the shaking of the placement frame, the placement frame preferably further comprises: the first rotating rod is rotatably connected to the surface of the second supporting plate, the outer wall of the first rotating rod is fixedly connected with a first bevel gear and a first gear, a first rack is fixedly connected in the etching groove, and the first rack and the first gear can be meshed and separated; the second rotating rod is rotatably connected to the surface of the second supporting plate, the outer wall of the second rotating rod is fixedly connected with a second bevel gear and a rotating disc, and the second bevel gear is meshed with the first bevel gear; the eccentric rod is fixedly connected to the bottom of the turntable, and the bottom of the eccentric rod is fixedly connected with a connecting ring; the connecting plates are symmetrically and rotatably connected to the surface of the second supporting plate, connecting rods are fixedly connected between adjacent connecting plates, the connecting rods are in sliding connection with the connecting rings, and the connecting plates are fixedly connected with the placement frame.
In order to facilitate transferring the placing frame into the cleaning tank, further, a motor is fixedly connected to the bottom of the workbench, a rotating shaft is fixedly connected to the output end of the motor, the rotating shaft is fixedly connected with the first supporting plate, and the cleaning tank is arranged on the surface of the workbench.
In order to facilitate the placing frame to shake in the cleaning process, a second rack is fixedly connected in the cleaning tank, and the second rack and the first gear can be meshed and separated.
In order to facilitate collecting the liquid falling from the placement frame, further, a first guide groove and a second guide groove are formed in the surface of the workbench, the first guide groove is located between the cleaning groove and the etching groove, the first guide groove is inclined towards the etching groove, and the second guide groove is inclined towards the cleaning groove.
In order to conveniently spray and clean the chips in the placement frame, the device further comprises: the support frame is fixedly connected to the surface of the workbench, the surface of the support frame is fixedly connected with a water tank, and the water tank is positioned above the cleaning tank; the water outlet pipe is fixedly connected to the bottom of the water tank, a first sliding groove is formed in the bottom of the water outlet pipe, a plurality of first sliding blocks are connected in a sliding manner in the first sliding groove, and an adjusting plate is fixedly connected to the bottom of the first sliding blocks; the adjusting plate is connected in the groove in a sliding way, a sliding column is fixedly connected to the bottom of the adjusting plate, a plurality of second sliding grooves are formed in the inner wall of the butt joint, and the sliding columns are connected in the second sliding grooves in a sliding way; the waste liquid pipe is fixedly connected in the cleaning tank, and an electromagnetic valve is fixedly connected to the waste liquid pipe; the first limit switch and the second limit switch are fixedly connected to the surface of the workbench, the first limit switch and the second limit switch are electrically connected with the electromagnetic valve, the driving column is fixedly connected to the outer wall of the rotating shaft, and the first limit switch and the second limit switch can be separated from the driving column in a propping way; the adjusting mechanism is arranged on the supporting frame and used for controlling the opening and closing of the butt joint.
In order to conveniently control the opening and closing of the butt joint, further, the adjusting mechanism comprises a second gear fixedly connected to the bottom of the support frame, a third gear is rotatably connected to the surface of the first support plate and meshed with the second gear, a toothed ring is fixedly connected to the outer wall of the butt joint, the toothed ring and the third gear can be meshed and separated, and a torsion spring is fixedly connected between the toothed ring and the support frame.
In order to facilitate drying treatment of the cleaned chip, further, the surface of the workbench is rotationally connected with a third rotating rod, the outer wall of the third rotating rod is fixedly connected with a turbine, a chain is connected between the third rotating rod and the rotating shaft in a transmission manner, a volute casing is fixedly connected with the surface of the supporting frame, an air inlet pipe and an air outlet pipe are fixedly connected to the volute casing, an air guide hopper is fixedly connected to the outlet end of the air outlet pipe, and the turbine is positioned in the volute casing.
In order to facilitate improving the drying efficiency, further, the inner wall fixedly connected with friction ring of volute, the outer wall fixedly connected with friction disc of third bull stick, friction disc offsets with the friction ring.
An etching method for processing a semiconductor chip comprises the following operation steps:
step one: etching reaction is carried out on a plurality of chips at the same time, and the chips are rocked in the etching reaction process;
step two: spraying and cleaning the etched chip, and then placing the chip in clear water for continuous shaking and cleaning;
step three: and drying the cleaned chip.
Compared with the prior art, the invention provides an etching device for processing a semiconductor chip, which has the following beneficial effects:
1. this etching device is used in semiconductor chip processing, through with each chip joint in the draw-in groove, start the cylinder and promote second backup pad downwardly moving, when first rack and first gear intermesh, first rack drives and places the frame and take place to rock, on the one hand, be convenient for etching solution and chip fully contact, improved etching efficiency, simultaneously, adopt with the vertical joint of chip between adjacent locating piece, can make the both sides wall homoenergetic of chip and etching liquid phase contact, the effect of etching when having improved the chip both sides, on the other hand, make it take place to rock at placing the frame and shift up the in-process, the unnecessary etching solution that conveniently detains on placing the frame drops to in the etching groove.
2. This etching device is used in semiconductor chip processing, treat that the chip etching treatment is finished, control cylinder makes and places the frame and rise to initial position, then start motor drive first backup pad and rotate, thereby be convenient for remove to washing tank department with placing the frame, in this process, when third gear and ring gear intermesh, open the butt joint, make the clear water in the water tank empty to the chip on, and collect in the washing tank, then control cylinder makes and places the frame submergence and rock in the clear water and wash, further improved the cleaning performance, reduce the harm because the washing is not clean, the processingquality of chip has been improved.
3. This etching device is used in semiconductor chip processing, under the effect of chain, the pivot drives the third bull stick and rotates, on the one hand, and the third bull stick drives the turbine and rotates to be convenient for make external air current blow on the chip from the wind scooper at last through going out the tuber pipe, the convenience carries out drying treatment to the chip, on the other hand, the third bull stick drives the friction disc and rotates, friction heat generation between friction disc and the friction ring, thereby be convenient for improve the temperature of air current, and then be convenient for improve drying efficiency.
Drawings
FIG. 1 is a schematic diagram of an etching apparatus for processing semiconductor chips according to the present invention;
fig. 2 is an enlarged schematic view of a structure at a in an etching apparatus 1 for processing semiconductor chips according to the present invention;
FIG. 3 is a schematic diagram showing a portion of an etching apparatus for processing semiconductor chips according to the present invention;
FIG. 4 is a schematic diagram showing a portion of an etching apparatus for processing a semiconductor chip according to the present invention;
FIG. 5 is a schematic diagram showing an explosion structure of an adjusting mechanism in an etching apparatus for processing semiconductor chips according to the present invention;
fig. 6 is a schematic diagram showing an exploded structure of an adjusting mechanism in an etching apparatus for processing a semiconductor chip according to the present invention.
In the figure: 1. a work table; 101. etching the groove; 102. a first support plate; 103. a cylinder; 104. a second support plate; 105. placing a frame; 106. a positioning block; 107. a clamping groove; 2. a first rotating lever; 201. a first bevel gear; 202. a second bevel gear; 203. a second rotating rod; 204. a first gear; 205. a first rack; 206. a turntable; 207. an eccentric rod; 208. a linking ring; 3. a splice plate; 301. a connecting rod; 302. a motor; 303. a rotating shaft; 304. a cleaning tank; 305. a second rack; 306. a first guide groove; 307. a second guide groove; 4. a water tank; 401. a water outlet pipe; 402. a first chute; 403. an adjusting plate; 404. a first slider; 405. a spool; 406. a second chute; 407. butt joint; 408. a groove; 5. a second gear; 501. a toothed ring; 502. a third gear; 503. a waste liquid pipe; 504. an electromagnetic valve; 505. a first limit switch; 506. a second limit switch; 507. a support frame; 508. a drive column; 509. a torsion spring; 6. a turbine; 601. a scroll case; 602. a chain; 603. an air guide hopper; 604. a third rotating rod; 605. a friction ring; 606. a friction plate; 607. an air inlet pipe; 608. and (5) an air outlet pipe.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Example 1
Referring to fig. 1 to 3, an etching apparatus for processing semiconductor chips includes a stage 1, and further includes: an etching groove 101 arranged on the surface of the workbench 1, wherein etching liquid is filled in the etching groove 101; the first support plate 102 is fixedly connected to the surface of the workbench 1, the bottom of the first support plate 102 is fixedly connected with the air cylinder 103, the output end of the air cylinder 103 is fixedly connected with the second support plate 104, and the bottom of the second support plate 104 is fixedly connected with the placing frame 105; the positioning blocks 106 are fixedly connected to the inner wall of the placement frame 105, clamping grooves 107 are formed between adjacent positioning blocks 106, and the clamping grooves 107 are matched with the chips.
Each chip is clamped in the clamping groove 107, the starting cylinder 103 pushes the second supporting plate 104 to move downwards, the second supporting plate 104 drives the placing frame 105 to move downwards until the placing frame 105 is completely immersed in etching liquid in the etching groove 101, and as the chips are vertically clamped between the adjacent positioning blocks 106, both side walls of the chips can be contacted with the etching liquid, and the etching effect when the two sides of the chips are etched is improved.
Example 2
Referring to fig. 1 to 4, substantially the same as in example 1, further, a specific embodiment for shaking the placement frame 105 is added.
Referring to fig. 1 to 4, the etching apparatus for processing a semiconductor chip further includes: the first rotating rod 2 is rotatably connected to the surface of the second supporting plate 104, the outer wall of the first rotating rod 2 is fixedly connected with the first bevel gear 201 and the first gear 204, the first rack 205 is fixedly connected in the etching tank 101, and the first rack 205 and the first gear 204 can be meshed and separated; the second rotating rod 203 is rotatably connected to the surface of the second supporting plate 104, the outer wall of the second rotating rod 203 is fixedly connected with the second bevel gear 202 and the rotary table 206, and the second bevel gear 202 is meshed with the first bevel gear 201; an eccentric rod 207 fixedly connected to the bottom of the turntable 206, and a connecting ring 208 is fixedly connected to the bottom of the eccentric rod 207; the connecting plates 3 are symmetrically and rotatably connected to the surface of the second supporting plate 104, connecting rods 301 are fixedly connected between adjacent connecting plates 3, the connecting rods 301 are slidably connected with the connecting rings 208, and the connecting plates 3 are fixedly connected with the placing frame 105.
In the process of downward movement of the placement frame 105, when the first rack 205 and the first gear 204 are meshed with each other, the first rack 205 drives the first gear 204 to rotate, the first gear 204 drives the first rotating rod 2 to rotate, the first rotating rod 2 drives the first bevel gear 201 to rotate, the first bevel gear 201 drives the second bevel gear 202 to rotate, the second bevel gear 202 drives the second rotating rod 203 to rotate, the second rotating rod 203 drives the turntable 206 to rotate, and the turntable 206 drives the eccentric rod 207 to rotate, so that the placement frame 105 shakes, on one hand, etching liquid is convenient to fully contact with a chip, etching efficiency is improved, on the other hand, the placement frame 105 is made to shake in the upward movement process, and redundant etching liquid which is convenient to stay on the placement frame 105 falls into the etching groove 101.
Example 3
Referring to fig. 1, substantially the same as example 2, further, a specific embodiment of cleaning the chip is added.
Referring to fig. 1, a motor 302 is fixedly connected to the bottom of the workbench 1, a rotating shaft 303 is fixedly connected to the output end of the motor 302, the rotating shaft 303 is fixedly connected to the first supporting plate 102, and a cleaning tank 304 is opened on the surface of the workbench 1.
In order to facilitate the shaking of the placement frame 105 during the cleaning process, referring to fig. 1, a second rack 305 is fixedly connected in the cleaning tank 304, and the second rack 305 can be meshed with and separated from the first gear 204.
In order to collect the liquid falling on the placement frame 105 conveniently, referring to fig. 1, a first guide groove 306 and a second guide groove 307 are formed on the surface of the workbench 1, the first guide groove 306 is located between the cleaning groove 304 and the etching groove 101, the first guide groove 306 is inclined towards the etching groove 101 to facilitate the recovery of the etching liquid retained on the placement frame 105 into the etching groove 101, and the second guide groove 307 is inclined towards the cleaning groove 304 to facilitate the recovery of the clean water retained on the placement frame 105 into the cleaning groove 304.
After the chip etching treatment is finished, the control cylinder 103 enables the placing frame 105 to rise to an initial position, then the motor 302 is started to drive the rotating shaft 303 to rotate, the rotating shaft 303 drives the first supporting plate 102 to rotate, so that the placing frame 105 is conveniently transferred to the cleaning tank 304, then the control cylinder 103 enables the placing frame 105 to move downwards, in the process, the second rack 305 drives the first gear 204 to rotate, so that the placing frame 105 can shake in clean water, and cleaning efficiency is improved.
Example 4
Referring to fig. 1-6, substantially the same as example 3, further, a specific embodiment of spray cleaning the chips in the placement frame 105 was added.
Referring to fig. 1 to 6, the etching apparatus for processing a semiconductor chip further includes: the support frame 507 is fixedly connected to the surface of the workbench 1, the surface of the support frame 507 is fixedly connected with the water tank 4, and the water tank 4 is positioned above the cleaning tank 304; the water outlet pipe 401 is fixedly connected to the bottom of the water tank 4, the bottom of the water outlet pipe 401 is provided with a first chute 402, a plurality of first sliding blocks 404 are slidably connected to the first chute 402, and the bottom of the first sliding blocks 404 is fixedly connected with an adjusting plate 403; the butt joint 407 rotatably connected to the outer wall of the water outlet pipe 401, the surface of the butt joint 407 is provided with a groove 408, the adjusting plate 403 is slidably connected in the groove 408, the bottom of the adjusting plate 403 is fixedly connected with a slide column 405, the inner wall of the butt joint 407 is provided with a plurality of second slide grooves 406, and the slide column 405 is slidably connected in the second slide grooves 406; a waste liquid pipe 503 fixedly connected in the cleaning tank 304, and an electromagnetic valve 504 is fixedly connected on the waste liquid pipe 503; the first limit switch 505 and the second limit switch 506 are fixedly connected to the surface of the workbench 1, the first limit switch 505 and the second limit switch 506 are electrically connected with the electromagnetic valve 504, the driving column 508 is fixedly connected to the outer wall of the rotating shaft 303, and the first limit switch 505 and the second limit switch 506 can be separated from the driving column 508 in a propping way; an adjusting mechanism is provided on the support 507 for controlling the opening and closing of the docking head 407.
It should be noted that, referring to fig. 5 to 6, the first sliding groove 402 is a hexagonal groove, and the number of the first sliding block 404, the adjusting plate 403, the sliding column 405, and the second sliding groove 406 is six; when the driving post 508 contacts the first limit switch 505, the solenoid valve 504 is opened to facilitate the drainage of waste water, and when the driving post 508 contacts the second limit switch 506, the solenoid valve 504 is closed.
In order to conveniently control the opening and closing of the butt joint 407, referring to fig. 5-6, the adjusting mechanism comprises a second gear 5 fixedly connected to the bottom of the supporting frame 507, a third gear 502 is rotatably connected to the surface of the first supporting plate 102, the third gear 502 is meshed with the second gear 5, a toothed ring 501 is fixedly connected to the outer wall of the butt joint 407, the toothed ring 501 and the third gear 502 can be meshed and separated, and a torsion spring 509 is fixedly connected between the toothed ring 501 and the supporting frame 507.
When the chip etching is finished, the first supporting plate 102 is driven to rotate by the starting motor 302, so that the placing frame 105 is conveniently moved to the cleaning tank 304, in the process, when the third gear 502 and the toothed ring 501 are meshed with each other, the second gear 5 drives the third gear 502 to rotate, the toothed ring 501 is driven by the third gear 502 to rotate, the butt joint 407 is driven by the toothed ring 501 to rotate, and as the first sliding block 404 slides in the first sliding groove 402 and the sliding column 405 slides in the second sliding groove 406, the adjusting plate 403 is moved, the butt joint 407 is conveniently opened, clean water in the water tank 4 is poured onto the chip and collected in the cleaning tank 304, then the placing frame 105 is immersed in the clean water to shake and clean by the controlling cylinder 103, so that the cleaning effect is further improved, damage caused by unclean cleaning is reduced, and the processing quality of the chip is improved.
Example 5
Referring to fig. 1 and 4, substantially the same as in example 4, further, a specific embodiment of drying the cleaned chips was added.
Referring to fig. 1 and 4, a third rotating rod 604 is rotatably connected to the surface of the workbench 1, a turbine 6 is fixedly connected to the outer wall of the third rotating rod 604, a chain 602 is connected between the third rotating rod 604 and the rotating shaft 303 in a transmission manner, a volute casing 601 is fixedly connected to the surface of the supporting frame 507, an air inlet pipe 607 and an air outlet pipe 608 are fixedly connected to the volute casing 601, an air guide hopper 603 is fixedly connected to the outlet end of the air outlet pipe 608, and the turbine 6 is located in the volute casing 601.
In order to improve the drying efficiency conveniently, the inner wall of the scroll casing 601 is fixedly connected with a friction ring 605, the outer wall of the third rotating rod 604 is fixedly connected with a friction disc 606, and the friction disc 606 is propped against the friction ring 605.
Under the effect of chain 602, pivot 303 drives third bull stick 604 and rotates, on the one hand, and third bull stick 604 drives turbine 6 and rotates to be convenient for make external air current blow on the chip from wind scooper 603 at last through play tuber pipe 608, the convenience carries out drying treatment to the chip, on the other hand, third bull stick 604 drives friction disc 606 and rotates, friction generates heat between friction disc 606 and the friction ring 605, thereby is convenient for improve the temperature of air current, and then is convenient for improve drying efficiency.
An etching method for processing a semiconductor chip comprises the following operation steps:
step one: each chip is clamped in the clamping groove 107, the air cylinder 103 is started to push the placing frame 105 to move downwards, so that etching reaction is carried out on a plurality of chips at the same time, and in the moving process of the placing frame 105, the placing frame 105 is driven by the first rack 205 to shake;
step two: when the chip etching is finished, the motor 302 is started to drive the first supporting plate 102 to rotate, and when the third gear 502 and the toothed ring 501 are meshed with each other, the butt joint 407 is opened to enable clear water in the water tank 4 to be poured onto the chip and collected in the cleaning tank 304, and then the cylinder 103 is controlled to enable the placing frame 105 to be immersed in the clear water for shaking cleaning;
step three: the rotating shaft 303 drives the third rotating rod 604 to rotate, and the third rotating rod 604 drives the turbine 6 to rotate, so that external air current is conveniently blown onto the chip from the air guide hopper 603 through the air outlet pipe 608, and drying treatment of the chip is facilitated.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art who is skilled in the art to which the present invention pertains should make equivalent substitutions or modifications according to the technical scheme and the inventive concept disclosed herein, and should be covered by the scope of the present invention.

Claims (10)

1. An etching device for processing semiconductor chips, comprising a workbench (1), characterized by further comprising:
an etching groove (101) arranged on the surface of the workbench (1), wherein etching liquid is filled in the etching groove (101);
the device comprises a first supporting plate (102) fixedly connected to the surface of a workbench (1), wherein an air cylinder (103) is fixedly connected to the bottom of the first supporting plate (102), a second supporting plate (104) is fixedly connected to the output end of the air cylinder (103), and a placing frame (105) is fixedly connected to the bottom of the second supporting plate (104);
a plurality of locating blocks (106) fixedly connected to the inner wall of the placement frame (105), and clamping grooves (107) are formed between the adjacent locating blocks (106), and the clamping grooves (107) are matched with the chips.
2. The etching device for semiconductor chip processing according to claim 1, further comprising:
the first rotating rod (2) is rotatably connected to the surface of the second supporting plate (104), a first bevel gear (201) and a first gear (204) are fixedly connected to the outer wall of the first rotating rod (2), a first rack (205) is fixedly connected to the etching groove (101), and the first rack (205) and the first gear (204) can be meshed and separated;
the second rotating rod (203) is rotatably connected to the surface of the second supporting plate (104), a second bevel gear (202) and a rotary table (206) are fixedly connected to the outer wall of the second rotating rod (203), and the second bevel gear (202) is meshed with the first bevel gear (201);
an eccentric rod (207) fixedly connected to the bottom of the turntable (206), wherein a connection ring (208) is fixedly connected to the bottom of the eccentric rod (207);
the symmetrical rotation is connected with the adapter plate (3) on the surface of the second support plate (104), an adapter rod (301) is fixedly connected between the adjacent adapter plates (3), the adapter rod (301) is in sliding connection with the adapter ring (208), and the adapter plate (3) is fixedly connected with the placement frame (105).
3. The etching device for processing semiconductor chips according to claim 2, wherein a motor (302) is fixedly connected to the bottom of the working table (1), a rotating shaft (303) is fixedly connected to the output end of the motor (302), the rotating shaft (303) is fixedly connected to the first supporting plate (102), and a cleaning tank (304) is provided on the surface of the working table (1).
4. The etching device for semiconductor chip processing according to claim 3, wherein a second rack (305) is fixedly connected in the cleaning tank (304), and the second rack (305) and the first gear (204) can be meshed and separated.
5. The etching device for semiconductor chip processing according to claim 3, wherein a first guide groove (306) and a second guide groove (307) are formed in the surface of the table (1), the first guide groove (306) is located between the cleaning groove (304) and the etching groove (101), the first guide groove (306) is inclined toward the etching groove (101), and the second guide groove (307) is inclined toward the cleaning groove (304).
6. The etching device for semiconductor chip processing according to claim 3, further comprising:
the support frame (507) is fixedly connected to the surface of the workbench (1), a water tank (4) is fixedly connected to the surface of the support frame (507), and the water tank (4) is positioned above the cleaning tank (304);
the water outlet pipe (401) is fixedly connected to the bottom of the water tank (4), a first sliding groove (402) is formed in the bottom of the water outlet pipe (401), a plurality of first sliding blocks (404) are connected in a sliding mode in the first sliding groove (402), and an adjusting plate (403) is fixedly connected to the bottom of the first sliding blocks (404);
the device comprises a water outlet pipe (401), a butt joint (407) rotatably connected to the outer wall of the water outlet pipe (401), a groove (408) is formed in the surface of the butt joint (407), the adjusting plate (403) is slidably connected in the groove (408), a sliding column (405) is fixedly connected to the bottom of the adjusting plate (403), a plurality of second sliding grooves (406) are formed in the inner wall of the butt joint (407), and the sliding column (405) is slidably connected in the second sliding grooves (406);
a waste liquid pipe (503) fixedly connected in the cleaning tank (304), wherein an electromagnetic valve (504) is fixedly connected on the waste liquid pipe (503);
the first limit switch (505) and the second limit switch (506) are fixedly connected to the surface of the workbench (1), the first limit switch (505) and the second limit switch (506) are electrically connected with the electromagnetic valve (504), the driving column (508) is fixedly connected to the outer wall of the rotating shaft (303), and the first limit switch (505) and the second limit switch (506) can be separated against the driving column (508);
and the adjusting mechanism is arranged on the supporting frame (507) and is used for controlling the opening and closing of the butt joint (407).
7. The etching device for semiconductor chip processing according to claim 6, wherein the adjusting mechanism comprises a second gear (5) fixedly connected to the bottom of the supporting frame (507), a third gear (502) is rotatably connected to the surface of the first supporting plate (102), the third gear (502) is meshed with the second gear (5) mutually, a toothed ring (501) is fixedly connected to the outer wall of the butt joint (407), the toothed ring (501) and the third gear (502) can be meshed and separated, and a torsion spring (509) is fixedly connected between the toothed ring (501) and the supporting frame (507).
8. The etching device for processing semiconductor chips according to claim 6, wherein a third rotating rod (604) is rotatably connected to the surface of the working table (1), a turbine (6) is fixedly connected to the outer wall of the third rotating rod (604), a chain (602) is in transmission connection between the third rotating rod (604) and the rotating shaft (303),
the surface of the supporting frame (507) is fixedly connected with a volute casing (601), an air inlet pipe (607) and an air outlet pipe (608) are fixedly connected to the volute casing (601), an air guide hopper (603) is fixedly connected to the outlet end of the air outlet pipe (608), and the turbine (6) is located in the volute casing (601).
9. The etching device for semiconductor chip processing according to claim 8, wherein a friction ring (605) is fixedly connected to an inner wall of the scroll casing (601), a friction plate (606) is fixedly connected to an outer wall of the third rotating rod (604), and the friction plate (606) abuts against the friction ring (605).
10. An etching method for processing a semiconductor chip, employing the etching apparatus for processing a semiconductor chip according to any one of claims 1 to 9, characterized by comprising the steps of:
step one: etching reaction is carried out on a plurality of chips at the same time, and the chips are rocked in the etching reaction process;
step two: spraying and cleaning the etched chip, and then placing the chip in clear water for continuous shaking and cleaning;
step three: and drying the cleaned chip.
CN202310990151.5A 2023-08-08 2023-08-08 Etching device and method for processing semiconductor chip Pending CN116978827A (en)

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CN202310990151.5A CN116978827A (en) 2023-08-08 2023-08-08 Etching device and method for processing semiconductor chip

Applications Claiming Priority (1)

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CN202310990151.5A CN116978827A (en) 2023-08-08 2023-08-08 Etching device and method for processing semiconductor chip

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117577577A (en) * 2024-01-15 2024-02-20 南通丞胜机电设备有限公司 Wet etching device for semiconductor chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117577577A (en) * 2024-01-15 2024-02-20 南通丞胜机电设备有限公司 Wet etching device for semiconductor chip
CN117577577B (en) * 2024-01-15 2024-03-15 南通丞胜机电设备有限公司 Wet etching device for semiconductor chip

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