CN219811465U - Swing device applied to semiconductor wet cleaning - Google Patents
Swing device applied to semiconductor wet cleaning Download PDFInfo
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- CN219811465U CN219811465U CN202320599834.3U CN202320599834U CN219811465U CN 219811465 U CN219811465 U CN 219811465U CN 202320599834 U CN202320599834 U CN 202320599834U CN 219811465 U CN219811465 U CN 219811465U
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- 238000004140 cleaning Methods 0.000 title claims abstract description 71
- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 230000008093 supporting effect Effects 0.000 claims abstract description 40
- 238000004891 communication Methods 0.000 claims description 11
- 238000005260 corrosion Methods 0.000 claims description 11
- 230000007797 corrosion Effects 0.000 claims description 8
- 230000005484 gravity Effects 0.000 abstract description 12
- 238000012423 maintenance Methods 0.000 abstract description 9
- 235000012431 wafers Nutrition 0.000 description 15
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a swinging device applied to semiconductor wet cleaning, which is applied to the field of semiconductor cleaning and comprises the following components: the device comprises a motion motor assembly, a linear sliding table, at least two ejector rods and a swing tray; one end of the swing tray is at least connected with one ejector rod, and the opposite end of the swing tray, which is connected with the ejector rod, is at least connected with one ejector rod; the ejector rod and the motion motor component are respectively connected with the linear sliding table. According to the utility model, at least one ejector rod is respectively connected with two ends of the swing tray along the alignment, so that the supporting force on the swing tray can be increased, when the ejector rod moves to the top end, the problem that the ejector rod is deformed and damaged due to the fact that the gravity center deviates from a supporting point when the ejector rod moves to the top end can be avoided, the cleaning efficiency of the bracket bearing the wafer through swing is improved, and the maintenance cost of the swing device applied to semiconductor wet cleaning is reduced.
Description
Technical Field
The utility model relates to the field of semiconductor cleaning, in particular to a swinging device applied to semiconductor wet cleaning.
Background
In the current process of cleaning semiconductor devices by using wet cleaning equipment, the etching rate is required to be uniform by swinging a bracket for carrying wafers because the etching property of cleaning liquid is strong. In the related art, a push rod is driven to move up and down through a moving part, but because the gravity center deviates from a supporting point when the push rod moves to the top end, the push rod can be correspondingly deformed, the push rod is damaged, and the cleaning efficiency of a bracket for swinging and bearing a wafer is affected.
Disclosure of Invention
Therefore, the utility model aims to provide a swinging device applied to semiconductor wet cleaning, which solves the problems that in the prior art, as the gravity center deviates from a supporting point when a top rod moves to the top end, the top rod can be correspondingly deformed, the top rod is damaged, and the cleaning efficiency of a bracket for swinging and bearing a wafer is affected.
In order to solve the above technical problems, the present utility model provides a swing device applied to wet cleaning of a semiconductor, including:
the device comprises a motion motor assembly, a linear sliding table, at least two ejector rods and a swing tray;
one end of the swing tray is at least connected with one ejector rod, and the opposite end of the swing tray, which is connected with the ejector rod, is at least connected with one ejector rod;
the ejector rod and the motion motor component are respectively connected with the linear sliding table.
Optionally, the ejector rods connected with the swing supporting pieces are connected through a communication rod;
the ejector rod is connected with the linear sliding table through the communication rod.
Optionally, the method further comprises:
and the linear sliding table and the motion motor assembly are connected with the bearing part.
Optionally, the ejector rod extends through a fixing member provided on the bearing member; the ejector pin has a relative movement with the fixing member in a direction extending through the fixing member.
Optionally, the ejector rod extends through a linear bearing provided on the carrier member.
Optionally, an anti-corrosion sleeve is arranged outside the ejector rod.
Optionally, the swing tray is welded with the ejector rod.
Optionally, the supporting strip structure in the swing tray is connected with the side plate structure through bolts.
Optionally, the side plate structure is provided with a notch at a position connected with the supporting strip structure.
Optionally, each ejector rod comprises a plurality of sub ejector rods arranged in a segmented manner.
The swing device for semiconductor wet cleaning provided by the utility model comprises a motion motor assembly, a linear sliding table, at least two ejector rods and a swing tray; one end of the swing tray is at least connected with one ejector rod, and the opposite end of the swing tray, which is connected with the ejector rod, is at least connected with one ejector rod; the ejector rod and the motion motor component are respectively connected with the linear sliding table. According to the utility model, at least one ejector rod is respectively connected with two ends of the swing tray along the alignment, so that the supporting force on the swing tray can be increased, when the ejector rod moves to the top end, the problem that the ejector rod is deformed and damaged due to the fact that the gravity center deviates from a supporting point when the ejector rod moves to the top end can be avoided, the cleaning efficiency of the bracket bearing the wafer through swing is improved, and the maintenance cost of the swing device applied to semiconductor wet cleaning is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a swing device for conventional wet cleaning of a semiconductor according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a swing device for wet cleaning of a semiconductor according to an embodiment of the present utility model;
in fig. 1-2, the reference numerals are as follows:
10-a motion motor assembly;
20-a linear sliding table;
30-ejector rod, 31-communication rod, 32-linear bearing and 33-corrosion-resistant sleeve;
40-swinging tray, 41-notch;
50-a load bearing member.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The main cleaning targets in the semiconductor process are particles (particles), metal contamination (Metal contamination), organic impurities (PR), and Native Oxide (Native Oxide). And for some chemical liquids, the etching property is strong, and the uniform etching rate is required to be ensured through swinging motion. For example, the swinging tray is moved up and down by a manipulator, but the mode occupies the manipulator to influence the productivity of the machine. In order to ensure uniform etching rate without reducing productivity, a special design of a set of swing structure is proposed in the prior art to realize this function. The current swinging structure specifically comprises a servo motor, a speed reducer set, an eccentric link mechanism and a linear sliding table set. Through fixing eccentric link mechanism at the speed reducer output, radius of rotation is the motion range that sways, converts rotary motion into rectilinear motion through linear slip table, and linear slip table side has photoelectric detection switch and bottom to prevent falling the piece and can detect and protect. A fixing plate is fixed on the linear sliding table, and the back of the fixing plate is used for fixing a push rod connected with the swing tray to drive the swing tray to move. Referring to fig. 1 specifically, fig. 1 is a schematic structural diagram of a swing device for conventional wet cleaning of a semiconductor according to an embodiment of the present utility model.
However, in the process that the moving part drives the ejector rod to move up and down, as the gravity center deviates from the supporting point when the ejector rod moves to the top end, the ejector rod can be correspondingly deformed along with the influence of the increase of the number of wafers carried by the swinging tray and the increase of the weight of the swinging tray, so that the ejector rod is damaged, and the cleaning efficiency of the bracket for swinging and carrying the wafers is influenced.
In order to solve the problem, the utility model provides the swinging device applied to the wet cleaning of the semiconductor, and the swinging device is characterized in that at least two ends of the swinging tray, which are arranged along the alignment direction, are respectively connected with at least one ejector rod, so that the supporting force to the swinging tray can be increased, when the ejector rod moves to the top end, the problem that the ejector rod is deformed and damaged due to the fact that the gravity center deviates from a supporting point when the ejector rod moves to the top end can be avoided, the cleaning efficiency of a bracket bearing a wafer through swinging is improved, and the maintenance cost of the swinging device applied to the wet cleaning of the semiconductor is reduced.
Example 1:
referring to fig. 2, fig. 2 is a schematic structural diagram of a swing device for conventional wet cleaning of semiconductors according to an embodiment of the present utility model. The apparatus may include:
a moving motor group 10, a linear slide 20, at least two ejector pins 30, and a swing tray 40;
one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30;
the ejector rod 30 and the moving motor assembly 10 are respectively connected with the linear sliding table 20.
It should be noted that, in this embodiment, the motion motor assembly 10 may be the same as the motion motor assembly 10 in the prior art, that is, the motion motor assembly 10 formed by a servo motor and a speed reducer set is used to provide power for the swing tray, and the servo motor and the speed reducer set are selected to take output torque and rotation speed into consideration, wherein the rotation speed is controlled by a servo. The linear sliding table 20 in this embodiment is connected to the moving motor group 10 and the ejector rod 30, respectively, and the linear sliding table 20 in this embodiment may be connected to the moving motor group 10 through an eccentric link mechanism, specifically, the linear sliding table 20 may be fixed to an output end of a speed reducer group in the moving motor group 10 through the eccentric link mechanism, to convert the rotational motion into the linear motion.
The present embodiment is not limited to a specific manner of connecting the linear slide 20 and the ejector pins 30, as long as all the ejector pins can be driven to move. For example, the linear slide 20 may be rigidly connected directly to the plurality of ejector pins 30, or the linear slide 20 may be connected to the ejector pins 30 through an intermediate member, or the linear slide 20 may be connected to the ejector pins 30 in other manners. The present embodiment is not limited to a specific number of the jack 30, and the number of the jack 30 may be at least 2. For example, the specific number of the jack 30 may be 2, or the specific number of the jack 30 may be 3, or the specific number of the jack 30 may be 4. Accordingly, the present embodiment does not limit the preset number of swing trays 40. For example, the preset number of swing trays 40 may be 1, or the preset number of swing trays 40 may be 2, or the preset number of swing trays 40 may be 4. The present embodiment does not limit the specific manner in which the swing tray 40 is connected to the jack 30. For example, the swing tray 40 may be welded to the ejector pins 30, or the swing tray 40 may be bolted to the ejector pins 30, or the swing tray 40 may be connected to the ejector pins 30 in other manners.
It should be further noted that, when the number of the ejector pins 30 is greater than two, at least one ejector pin 30 is disposed at one end of the swing tray 40, and at least one ejector pin 30 is disposed at the other end of the swing tray 40 along the alignment direction, the connection manner between the remaining ejector pins 30 and the swing tray 40 is not limited, and the ejector pins may be connected at any position of the swing tray 40. When the number of swing trays 40 is greater than 1, the top end of the ejector rod 30 may extend out of a cross bar portion provided perpendicularly to the lower end of the ejector rod 30, and the cross bar portion may be connected to the plurality of swing trays 40 or may be connected to the plurality of swing trays 40 by increasing the number of the ejector rod 30, which is not set in the present embodiment.
The swing device for semiconductor wet cleaning provided by the embodiment of the utility model comprises a motion motor assembly 10, a linear sliding table 20, at least two ejector rods 30 and a swing tray 40; one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30; the ejector rod 30 and the moving motor assembly 10 are respectively connected with the linear sliding table 20. According to the utility model, at least two ends of the swing tray 40 along the alignment are respectively connected with at least one ejector rod 30, so that the supporting force on the swing tray 40 can be increased, when the ejector rod 30 moves to the top end, the problem that the ejector rod 30 is deformed and damaged due to the fact that the gravity center deviates from a supporting point when the ejector rod 30 moves to the top end can be avoided, the cleaning efficiency of a bracket for bearing a wafer through swing is improved, and the maintenance cost of the swing device applied to semiconductor wet cleaning is reduced.
Example 2:
referring to fig. 2, fig. 2 is a schematic structural diagram of a swing device for conventional wet cleaning of semiconductors according to an embodiment of the present utility model. The apparatus may include:
a moving motor group 10, a linear slide 20, at least two ejector pins 30, and a swing tray 40;
one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30;
the ejector rod 30 and the motion motor assembly 10 are respectively connected with the linear sliding table 20;
the ejector rods 30 connected with the swinging support plates 40 are connected through the communication rods 31;
the ejector rod 30 is connected to the linear slide 20 through a communication rod 31.
In this embodiment, the ejector pins 30 connected to the swing supporting piece 40 are connected by the communication rod 31, and the ejector pins 30 are connected to the linear sliding table 20 by the communication rod 31, so that the number of the ejector pins 30 connected to the linear sliding table 20 can be increased, and the critical point of deformation damage of the ejector pins 30 can be further increased.
The swing device for semiconductor wet cleaning provided by the embodiment of the utility model comprises a motion motor assembly 10, a linear sliding table 20, at least two ejector rods 30 and a swing tray 40; one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30; the ejector rod 30 and the moving motor assembly 10 are respectively connected with the linear sliding table 20. According to the utility model, at least one ejector rod 30 is respectively connected to two ends of the swinging tray 40 along the alignment, so that the supporting force on the swinging tray 40 can be increased, when the ejector rod 30 moves to the top end, the problem that the ejector rod 30 is deformed and damaged due to the fact that the gravity center deviates from a supporting point when the ejector rod 30 moves to the top end can be avoided, the ejector rods 30 connected with the swinging tray 40 are connected through the communicating rods 31, the ejector rods 30 are connected with the linear sliding table 20 through the communicating rods 31, the number of the ejector rods connected with the linear sliding table 20 can be increased, the critical point of deformation damage of the ejector rods is further improved, the total quality of the supported swinging tray 40 is further increased, the cleaning efficiency of the bracket carrying wafers through swinging is improved, and the maintenance cost of the swinging device applied to semiconductor wet cleaning is reduced.
Example 3:
referring to fig. 2, fig. 2 is a schematic structural diagram of a swing device for conventional wet cleaning of semiconductors according to an embodiment of the present utility model. The apparatus may include:
a moving motor group 10, a linear slide 20, at least two ejector pins 30, and a swing tray 40;
one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30;
the ejector rod 30 and the motion motor assembly 10 are respectively connected with the linear sliding table 20;
the carrier 50, the linear slide 20 and the movement motor assembly 10 are connected to the carrier 50.
In this embodiment, the linear sliding table 20 and the motion motor assembly 10 are carried by the carrying member 50, and the carrying member 50 may also carry the ejector rod 30 and the swing tray 40 connected to the linear sliding table 20.
Further, in order to enhance the supporting effect of the lift pins 30 on the swing tray 40, the lift pins 30 may be extended through a fixing member provided on the carrier member 50, and the lift pins 30 may be relatively moved with respect to the fixing member in a direction extending through the fixing member.
In this embodiment, the ejector rod 30 has a relative motion with the fixing member along the direction extending through the fixing member, so as to ensure that the swing tray 40 can be driven to move. The present embodiment does not limit the number of fixing members. For example, the number of securing members may be the same as the number of rams 30, i.e. each ram 30 extends through one securing member; or the number of fixing members may be larger than the number of the jack 30, for example, the number of fixing members may be a preset multiple of the number of the jack 30. Accordingly, the specific values of the preset multiples are not limited in this embodiment. For example, the specific value of the preset multiple may be 2, or the specific value of the preset multiple may be 3, or the specific value of the preset multiple may be 4.
Further, in order to reduce the influence of the fixing member on the ejector pin 30, which moves in the direction extending through the fixing member, and to improve the efficiency of the ejector pin 30 to move the swing member 40, the ejector pin 30 may extend through a linear bearing 32 provided on the carrier member 50.
In the present embodiment, the fixing member through which the jack extends is provided as the linear bearing 32, so that the resistance to movement of the jack 30 in the direction extending through the fixing member can be reduced.
Further, in order to avoid the problem that the cleaning solution corrodes the ejector pin 30 and damages the ejector pin 30, an anti-corrosion sleeve 33 may be disposed outside the ejector pin 30.
The present embodiment is not limited to the specific material of the corrosion-resistant sleeve 33, as long as the cleaning liquid can prevent the corrosion of the jack 30. For example, the material of the corrosion-resistant sleeve 33 may be polyvinylidene fluoride, or the material of the corrosion-resistant sleeve 33 may be other materials that can resist corrosion by the cleaning solution.
The swing device for semiconductor wet cleaning provided by the embodiment of the utility model comprises a motion motor assembly 10, a linear sliding table 20, at least two ejector rods 30 and a swing tray 40; one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30; the ejector rod 30 and the moving motor assembly 10 are respectively connected with the linear sliding table 20. According to the utility model, at least two ends of the swing tray 40 along the alignment are respectively connected with at least one ejector rod 30, so that the supporting force on the swing tray 40 can be increased, when the ejector rod 30 moves to the top end, the problem that the ejector rod 30 is deformed and damaged due to the fact that the gravity center deviates from a supporting point when the ejector rod 30 moves to the top end can be avoided, the cleaning efficiency of a bracket for bearing a wafer through swinging is improved, the maintenance cost of the swing device applied to semiconductor wet cleaning is reduced, and the integration level of the swing device applied to semiconductor wet cleaning is improved by connecting the linear sliding table 20 and the moving motor assembly 10 with the bearing component 50. In addition, by extending the ejector rod 30 through the fixing member provided on the bearing member 50, there is relative movement of the ejector rod 30 with the fixing member in the direction extending through the fixing member, the supporting effect of the ejector rod 30 on the swing tray 40 is improved, and deformation of the ejector rod 30 can be further prevented; by arranging the fixing part through which the ejector rod 30 extends as the linear bearing 32, the influence of the fixing part on the movement of the ejector rod 30 in the direction extending through the fixing part is reduced, and the efficiency of the ejector rod 30 for driving the swinging part 40 to move is improved; by providing the corrosion-resistant sleeve 33 outside the jack 30, the problem that the cleaning liquid corrodes the jack 30 and damages the jack 30 can be avoided.
Example 4:
referring to fig. 2, fig. 2 is a schematic structural diagram of a swing device for conventional wet cleaning of semiconductors according to an embodiment of the present utility model. The apparatus may include:
a moving motor group 10, a linear slide 20, at least two ejector pins 30, and a swing tray 40;
one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30;
the ejector rod 30 and the motion motor assembly 10 are respectively connected with the linear sliding table 20;
the swing tray 40 is welded to the ejector pins 30.
In this embodiment, the swing tray 40 is welded to the ejector rod 30, so that the connection between the swing tray 40 and the ejector rod 30 is more stable, and the supporting effect of the ejector rod 30 on the swing tray 40 is improved.
The swing device for semiconductor wet cleaning provided by the embodiment of the utility model comprises a motion motor assembly 10, a linear sliding table 20, at least two ejector rods 30 and a swing tray 40; one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30; the ejector rod 30 and the moving motor assembly 10 are respectively connected with the linear sliding table 20. According to the utility model, at least two ends of the swing tray 40 along the alignment are respectively connected with at least one ejector rod 30, so that the supporting force on the swing tray 40 can be increased, when the ejector rod 30 moves to the top end, the problem that the ejector rod 30 is deformed and damaged due to the fact that the gravity center deviates from a supporting point when the ejector rod 30 moves to the top end can be avoided, the cleaning efficiency of a bracket for bearing a wafer through swinging is improved, the maintenance cost of a swinging device applied to semiconductor wet cleaning is reduced, the swing tray 40 is welded and connected with the ejector rod 30, the connection between the swing tray 40 and the ejector rod 30 is firmer, and the supporting effect of the ejector rod 30 on the swing tray 40 is improved.
Example 5:
referring to fig. 2, fig. 2 is a schematic structural diagram of a swing device for conventional wet cleaning of semiconductors according to an embodiment of the present utility model. The apparatus may include:
a moving motor group 10, a linear slide 20, at least two ejector pins 30, and a swing tray 40;
one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30;
the ejector rod 30 and the motion motor assembly 10 are respectively connected with the linear sliding table 20;
the bar structure in the swing tray 40 is connected with the side plate structure by bolts.
In this embodiment, the bracket structure in the swing tray 40 and the side plate structure are connected by bolts, so that the bracket structure and the side plate structure in the swing tray 40 can be easily detached.
Further, in order to improve the connection stability of the supporting strip structure and the side plate structure in the swing tray 40, improve the supporting effect of the side plate structure on the supporting strip structure, and ensure the safety of the wafer in the semiconductor cleaning process, the side plate structure may be provided with a notch 41 at the position connected with the supporting strip structure.
It should be noted that, in this embodiment, the supporting strip structure extends through the notch 41 in the side plate structure, and the male screw driver structure may be disposed in the supporting strip structure, so that the male substructure in the supporting strip structure extends through the notch 41 in the side plate structure. In order to further increase the stability of the connection of the stay strip structure to the side plate structure, the protruding sub-parts in the stay strip structure extend through one side of the recess 41 in the side plate structure, and stay strip fixing parts are provided which fix the ends of the protruding sub-parts in the stay strip structure to that side. The present embodiment is not limited to the specific structure of the stay fixing member, as long as the protruding sub-members in the stay structure can be fixed.
The swing device for semiconductor wet cleaning provided by the embodiment of the utility model comprises a motion motor assembly 10, a linear sliding table 20, at least two ejector rods 30 and a swing tray 40; one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30; the ejector rod 30 and the moving motor assembly 10 are respectively connected with the linear sliding table 20. According to the utility model, at least two ends of the swing tray 40 along the alignment are respectively connected with at least one ejector rod 30, so that the supporting force on the swing tray 40 can be increased, when the ejector rods 30 move to the top end, the problem that the ejector rods 30 deform and damage the ejector rods 30 due to the fact that the gravity centers deviate from supporting points when the ejector rods 30 move to the top end can be avoided, the cleaning efficiency of a bracket for bearing a wafer through swing is improved, the maintenance cost of a swing device applied to semiconductor wet cleaning is reduced, and the support bar structure in the swing tray 40 is connected with the side plate structure through bolts, so that the support bar structure in the swing tray 40 and the side plate structure can be conveniently detached. In addition, through setting up notch 41 with the curb plate structure in the position of being connected with the support strip structure, can improve the stability that support strip structure and curb plate structure in the swing tray 40 are connected, further improve the supporting effect of curb plate structure to support strip structure, and then guarantee the safety of semiconductor cleaning process wafer.
Example 6:
referring to fig. 2, fig. 2 is a schematic structural diagram of a swing device for conventional wet cleaning of semiconductors according to an embodiment of the present utility model. The apparatus may include:
a moving motor group 10, a linear slide 20, at least two ejector pins 30, and a swing tray 40;
one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30;
the ejector rod 30 and the motion motor assembly 10 are respectively connected with the linear sliding table 20;
each ejector 30 includes a plurality of sub-ejector rods arranged in segments.
It should be noted that, the sub-ejector rods arranged in a plurality of segments form the ejector rod 30, so that the detachable and movable swinging device applied to the wet cleaning of the semiconductor is convenient to detach.
The swing device for semiconductor wet cleaning provided by the embodiment of the utility model comprises a motion motor assembly 10, a linear sliding table 20, at least two ejector rods 30 and a swing tray 40; one end of the swing tray 40 is at least connected with one ejector rod 30, and the opposite end of the swing tray 40 connected with the ejector rod 30 is at least connected with one ejector rod 30; the ejector rod 30 and the moving motor assembly 10 are respectively connected with the linear sliding table 20. According to the utility model, at least one ejector rod 30 is respectively connected to two ends of the swing tray 40 along the alignment, so that the supporting force on the swing tray 40 can be increased, when the ejector rod 30 moves to the top end, the problem that the ejector rod 30 is deformed and damaged due to the fact that the gravity center deviates from a supporting point when the ejector rod 30 moves to the top end can be avoided, the cleaning efficiency of a bracket for bearing a wafer through swinging is improved, the maintenance cost of a swinging device applied to semiconductor wet cleaning is reduced, and the ejector rod 30 is formed by a plurality of sub-ejector rods arranged in a segmented mode, so that the swinging device applied to semiconductor wet cleaning is convenient to disassemble and move.
In order to facilitate understanding of the present utility model, the swing device applied to wet cleaning of a semiconductor provided by the present utility model may specifically include:
a moving motor group 10, a linear slide 20, at least two ejector pins 30, and a swing tray 40;
one end of the swing tray 40 is welded with at least one ejector rod 30, and the opposite end of the swing tray 40 welded with the ejector rod 30 is welded with at least one ejector rod 30; the ejector rods 30 welded with the swing supporting plates 40 are connected through the communication rods 31; the ejector rod 30 is connected with the linear sliding table 20 through a communication rod 31;
the supporting strip structure in the swinging tray 40 is connected with the side plate structure through bolts; the side plate structure is provided with a notch 41 at a position connected with the bracket structure;
the ejector rod 30 extends through a linear bearing 32 provided on the carrier member 50; the ejector rod 30 has relative motion with the linear bearing 32 along the direction extending through the linear bearing 32;
the outside of the ejector rod 30 is provided with a corrosion-resistant sleeve 33; each ejector rod 30 comprises a plurality of sub-ejector rods arranged in sections;
the motion motor assembly 10 is connected with the linear sliding table 20;
the carrier 50, the linear slide 20 and the movement motor assembly 10 are connected to the carrier 50.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other.
Finally, it is further noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprise," "include," or any other variation thereof, are intended to cover a non-exclusive inclusion.
The above description of the swing device for wet cleaning of semiconductor provided by the present utility model has been presented in detail, and the present utility model has been described herein by using a plurality of specific examples, the description of the above examples is only for helping to understand the method and core idea of the present utility model; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present utility model, the present description should not be construed as limiting the present utility model in view of the above.
Claims (10)
1. A swinging device for wet cleaning of semiconductors, comprising:
the device comprises a motion motor assembly, a linear sliding table, at least two ejector rods and a swing tray;
one end of the swing tray is at least connected with one ejector rod, and the opposite end of the swing tray, which is connected with the ejector rod, is at least connected with one ejector rod;
the ejector rod and the motion motor component are respectively connected with the linear sliding table.
2. The swing device for wet cleaning of semiconductor according to claim 1, wherein the ejector pins connected to the swing tray are connected by a communication rod;
the ejector rod is connected with the linear sliding table through the communication rod.
3. The swing apparatus for wet cleaning semiconductor according to claim 1, further comprising:
and the linear sliding table and the motion motor assembly are connected with the bearing part.
4. A swing apparatus for use in wet cleaning of semiconductors according to claim 3, wherein said lift pins extend through a fixing member provided on said carrier member; the ejector pin has a relative movement with the fixing member in a direction extending through the fixing member.
5. The swing apparatus for wet cleaning of semiconductors according to claim 4, wherein said lift pins extend through linear bearings provided on said carrier member.
6. The swing apparatus for wet cleaning of semiconductors according to claim 5, wherein the outside of the lift pins is provided with a corrosion-resistant sleeve.
7. The swing device for wet cleaning of semiconductors according to claim 1, wherein the swing tray is welded to the lift pins.
8. The swing device for wet cleaning of semiconductors according to claim 1, wherein the supporting bar structure and the side plate structure in the swing tray are connected by bolts.
9. The swing apparatus for semiconductor wet cleaning according to claim 8, wherein said side plate structure is provided with a recess at a position where it is connected to said carrier strip structure.
10. The swing apparatus for wet cleaning of semiconductors according to claim 1, wherein each of said lift pins comprises a plurality of sub-lift pins arranged in segments.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117577577A (en) * | 2024-01-15 | 2024-02-20 | 南通丞胜机电设备有限公司 | Wet etching device for semiconductor chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117577577A (en) * | 2024-01-15 | 2024-02-20 | 南通丞胜机电设备有限公司 | Wet etching device for semiconductor chip |
| CN117577577B (en) * | 2024-01-15 | 2024-03-15 | 南通丞胜机电设备有限公司 | Wet etching device for semiconductor chip |
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