TW202113003A - Dicing tape and dicing die-bonding film - Google Patents

Abstract

Provided is a dicing tape and the like including: a base layer; and an adhesive layer overlapping the base layer, in which the dicing tape has a permanent deformation ratio of 35% or more when stretched at 23 ℃ or at -5 ℃.

Description

Slicing tape, and slicing chip mucous film

The present invention relates to, for example, a dicing tape used in the manufacture of semiconductor integrated circuits, and a dicing die attach film provided with the dicing tape.

Previously, diced die bonding films used in the manufacture of semiconductor integrated circuits have been known. Such a dicing die bonding film includes, for example, a dicing tape and a die bonding layer laminated on the dicing tape and then on the wafer. The dicing tape has a base material layer and an adhesive layer connected with the die-bonding layer. Such a diced die bonding film is used in the manufacture of semiconductor integrated circuits in the following manner, for example.

The method of manufacturing a semiconductor integrated circuit generally includes: a preliminary step, which uses a high-integrated electronic circuit to form a circuit surface on a single side of the wafer; and a subsequent step, which cuts the chip from the wafer with the circuit surface to assemble .

The subsequent steps include, for example, the mounting step, which attaches the surface of the wafer on the opposite side of the circuit surface to the die-bonding layer, and fixes the wafer to the dicing tape; the die-cutting step, which attaches the intervening die-bonding layer In the dicing tape, the wafer is cut into small chips (die) to be chipped; the expansion step, which expands the distance between the chipped chips; and the picking step, which peels off between the die bond layer and the adhesive layer, Take out the chip (die) with the die-bonding layer attached; and the die-bonding step, which connects the wafer (die) with the die-bonding layer attached to the bonded body. Semiconductor integrated circuits are manufactured through these steps.

In the above-mentioned manufacturing method, in the expansion step, for example, in the state where the wafer is arranged on the bonding layer overlapping with the dicing tape, the dicing tape is stretched in the radial direction at a low temperature such as the freezing point, and then the dicing tape is stretched in the radial direction. Stretching at room temperature, thereby expanding the gap (notch) between adjacent wafers (die). Thereafter, in order to maintain the gap (notch), a part of the dicing tape whose tension is reduced due to extension is heat-shrinked (heat-shrinked). Specifically, the dicing tape of the outer part than the part overlapping with the cut wafer (die) is heat-shrinked, so that the gap (notch) can be maintained.

However, in the expansion step, once the stretched dicing tape shrinks due to elasticity, there may be situations where the aforementioned interval (notch) cannot be maintained thereafter. If the gap (notch) cannot be maintained, the uplift of the wafer (die) will occur, which will cause obstacles in the subsequent picking steps. In order to prevent this problem, it is required that the dicing tape can maintain the performance of the notch well after expansion.

In this regard, as the previous crystal cutting tape, the following are known: for example, under the test conditions of a width of 25 mm, a distance between the marking lines and a distance between the chucks of 100 mm, and a tensile speed of 300 mm/min, the elongation The tensile load at a rate of 10% is 16 to 34 N (Patent Document 1). The dicing tape described in Patent Document 1 has an adhesive force that inhibits the peeling of the wafer during the expansion step, and has the performance of being cut into wafers (die), and the bonded die can be peeled off relatively easily in the pick-up step Floor. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-155270

[The problem to be solved by the invention]

However, it can be said that the dicing mucosa and dicing tape that can maintain the cut well after expansion have not been fully studied.

Therefore, the subject of the present invention is to provide a dicing tape and a dicing die sticking film that can maintain the notch well after expansion. [Technical means to solve the problem]

In order to solve the above-mentioned problems, the dicing tape of the present invention is characterized in that it has a substrate layer and an adhesive layer overlapping the substrate layer, and has a permanent deformation rate of 35% or more when stretched at 23°C. With the above-mentioned dicing belt, the incision can be maintained well after expansion.

In order to solve the above-mentioned problems, the dicing tape of the present invention is characterized in that it has a substrate layer and an adhesive layer overlapping the substrate layer, and has a permanent deformation rate of 35% or more when stretched at -5°C. With the above-mentioned dicing belt, the incision can be maintained well after expansion.

In the dicing tape of the present invention, the elastic modulus measured by a dynamic viscoelastic tensile test is preferably the elastic modulus (B) at 60°C relative to the elastic modulus (A) at 23°C The ratio (B/A) is 0.17 or more. Thereby, it expands at room temperature, and after heat shrinks, the incision can be maintained better.

In the diced tape of the present invention, the elastic modulus measured by dynamic viscoelastic tensile test is preferably that the elastic modulus (A) at 23°C is 40 MPa or more and 300 MPa or less, and the elasticity at 60°C The modulus (B) is 8 MPa or more and 100 MPa or less. Thereby, it expands at room temperature, and after heat shrinks, the incision can be maintained better.

In the diced tape of the present invention, the elastic modulus measured by a dynamic viscoelastic tensile test is preferably that the elastic modulus (C) at 100° C. is 0.5 MPa or more and 20 MPa or less. Thereby, it expands at room temperature, and after heat shrinks, the incision can be maintained better.

The chip adhesive film of the present invention comprises the above-mentioned chipping tape and a chip bonding layer laminated on the adhesive layer of the chipping tape. [Effects of Invention]

The dicing tape and the dicing mucous film of the present invention have the effect of maintaining the incision well after expansion.

Hereinafter, one embodiment of the dicing die film and the dicing tape of the present invention will be described with reference to the drawings.

The dicing die bonding film 1 of this embodiment includes: a die dicing tape 20; and a die bonding layer 10 laminated on the adhesive layer 22 of the die dicing tape 20 and then on the semiconductor wafer.

The dicing tape 20 of this embodiment is usually a long sheet, and is stored in a wound state before use. The dicing die sticking film 1 of this embodiment is stretched on a circular frame having an inner diameter one circle larger than that of the silicon wafer to be cut, and is cut for use.

The dicing tape 20 of this embodiment includes a base layer 21 and an adhesive layer 22 overlapping the base layer 21.

The dicing tape 20 of the present embodiment has a permanent deformation rate of 35% or more when it is stretched at 23°C. Generally, the permanent deformation rate when stretched at 23°C is below 100%. The dicing tape 20 of the present embodiment has a permanent deformation rate of 35% or more when it is stretched at -5°C. Generally, the permanent deformation rate when stretched at -5°C is below 100%. The dicing tape 20 of the present embodiment has any of the above-mentioned configurations, and therefore can maintain the cut well after expansion. The above-mentioned permanent deformation rate refers to the physical properties of the slicing tape 20 when it is stretched 100% at 23°C, or the physical properties of the slicing tape 20 when it is stretched 120% at -5°C. It is measured at each temperature according to the method described in the examples. . For example, "extension 100%" means extending to a length that is twice the length before extension. The direction in which the dicing tape 20 extends can be any of the MD direction and the TD direction, as long as the permanent deformation rate of the extension in either direction meets the above-mentioned value. The average value of the measured values obtained from the three measurements is used as the above-mentioned permanent deformation rate.

The above-mentioned permanent deformation rate can be increased by, for example, increasing the mass ratio of the resin that is easily plastically deformed in the base layer 21. On the other hand, the above-mentioned permanent deformation rate can be reduced by increasing the mass ratio of the elastomer resin in the base layer 21, for example. Moreover, when the base material layer 21 includes a plurality of resin layers, the above-mentioned permanent deformation rate can be adjusted by changing the relative thickness of at least one layer. For example, by relatively increasing the thickness of the resin layer that is more susceptible to plastic deformation, the above-mentioned permanent deformation rate can be increased.

Regarding the elastic modulus measured by the dynamic viscoelastic tensile test in the dicing tape 20, the elastic modulus (A) at 23°C is preferably 40 MPa or more and 300 MPa or less, and the elastic modulus at 60°C (B) is 8 MPa or more and 100 MPa or less. Thereby, it expands at room temperature, and after heat shrinks, the incision can be maintained better. The modulus of elasticity (A) at 23°C is more preferably 50 MPa or more. Furthermore, it is more preferably 250 MPa or less. The modulus of elasticity (B) at 60°C is more preferably 10 MPa or more. Furthermore, it is more preferably 80 MPa or less.

Regarding the elastic modulus measured by the dynamic viscoelastic tensile test in the dicing tape 20, it is preferable that the elastic modulus (C) at 100° C. is 0.5 MPa or more and 20 MPa or less. By setting the modulus of elasticity (C) at 100° C. to 0.5 MPa or more, it is possible to more sufficiently suppress the melting damage or deformation of the dicing tape 20 due to thermal shrinkage. Therefore, a more uniform cut can be achieved. In addition, by setting the elastic modulus (C) at 100° C. to 20 MPa or less, the dicing tape 20 can be more fully heat-shrinked due to heat shrinkage. For this reason, by setting the modulus of elasticity (C) at 100°C to the above-mentioned value, it expands at room temperature, and after thermal shrinkage, the incision can be maintained better. The modulus of elasticity (C) at 100°C is more preferably 1 MPa or more. Moreover, it is more preferably 10 MPa or less.

The elastic modulus of the dicing tape 20 is measured at each temperature according to the method described in the examples. The above-mentioned elastic modulus is the value of the tensile storage elastic modulus measured by dynamic viscoelasticity measurement.

The above-mentioned elastic modulus (A, B, C) can be increased, for example, by increasing the mass ratio of a resin with a higher elastic modulus in the base layer 21. On the other hand, the above-mentioned elastic modulus can be reduced, for example, by reducing the mass ratio of a higher elastic modulus resin. In addition, when the base layer 21 includes a plurality of resin layers, the above-mentioned elastic modulus can be adjusted by changing the relative thickness of at least one layer. For example, by relatively increasing the thickness of a resin layer with a higher elastic modulus, the above-mentioned elastic modulus can be increased.

In the dicing tape, the ratio (B/A) of the above-mentioned elastic modulus (B) at 60°C to the above-mentioned elastic modulus (A) at 23°C (B/A) is preferably 0.17 or more. Thereby, it expands at room temperature, and after heat shrinks, the incision can be maintained better. The above-mentioned ratio (B/A) is more preferably 0.18 or more, and still more preferably 0.20 or more. In addition, the above-mentioned ratio (B/A) may be 0.5 or less, or 0.3 or less.

The base material layer 21 may have a single-layer structure or a multilayer structure. In terms of relatively easy adjustment of the elastic modulus and permanent deformation rate of the base layer 21 by changing the type of resin contained in each layer or changing the thickness ratio of the layers, the base layer 21 preferably has Layered structure.

Each layer of the base material layer 21 is, for example, a metal foil, a fiber sheet such as paper or cloth, a rubber sheet, a resin film, and the like. The fiber sheet constituting the base layer 21 may, for example, be paper, woven fabric, non-woven fabric, or the like. As the material of the resin film, for example, polyolefin such as polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer; ethylene-vinyl acetate copolymer (EVA), ionomer resin, ethylene- (Meth) acrylic copolymers, ethylene-(meth)acrylate (random, alternating) copolymers and other ethylene copolymers; polyethylene terephthalate (PET), polyethylene naphthalate ( PEN), polybutylene terephthalate (PBT) and other polyesters; polyacrylate; polyvinyl chloride (PVC); polyurethane; polycarbonate; polyphenylene sulfide (PPS); aliphatic Polyamides, fully aromatic polyamides (aromatic polyamides) and other polyamides; polyether ether ketone (PEEK); polyimine; polyether imine; polyvinylidene chloride; ABS (propylene Nitrile-butadiene-styrene copolymer); cellulose or cellulose derivatives; polysiloxane-containing polymers; fluorine-containing polymers, etc. These can be used individually by 1 type or in combination of 2 or more types.

When the base material layer 21 has a resin film, the resin film may be subjected to a stretching treatment or the like to control deformability such as elongation. In order to improve the adhesiveness with the adhesive layer 22, the surface of the base layer 21 may be subjected to surface treatment. As the surface treatment, for example, chemical or physical oxidation treatment such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionized radiation treatment, etc. can be used. In addition, coating treatment using coating agents such as anchor coating agents, primers, and adhesives may also be performed.

The base material layer 21 preferably includes a plurality of layers, more preferably includes at least three layers, and even more preferably includes three layers. By making the base material layer 21 have a multilayer structure of multiple layers (for example, a three-layer structure), there is an advantage that the ratio of the layer thickness of each layer can be changed to relatively easily adjust the elastic modulus and permanent deformation rate.

The base material layer 21 of the three-layer structure preferably has two non-elastomeric layers (X, X) formed of a non-elastomeric body, and an elastomer layer (Y) formed of an elastomer disposed between the two non-elastomeric layers (Layer X/Layer Y/Layer X). The elastomer layer is usually formed of a polymer material that exhibits rubber elasticity at room temperature (23°C). The elastomer layer is a layer whose permanent deformation rate is less than 35% when the same measurement as the above-mentioned permanent deformation rate measurement is performed at 23°C. On the other hand, the non-elastomeric layer is a layer other than the elastomer. Each layer of the elastomer having such a three-layer laminated structure is usually formed of resin. The elastomer having a three-layer laminated structure is produced by, for example, co-extrusion molding to integrate the three layers.

The non-elastomeric layer arranged on the outside has, for example, a melting point of 100°C or more and 130°C or less. In addition, the non-elastomeric layer preferably has a molecular weight distribution dispersion (mass average molecular weight/number average molecular weight) of 3 or less when the constituent resin is measured by GPC (gel permeation chromatograph).

The non-elastomeric layer (X) may also include low-density polyethylene (LDPE), high-density polyethylene (HDPE), polypropylene, and the like. The polypropylene may, for example, be a homopolymer (homopolypropylene) or a copolymer such as random polypropylene and block polypropylene. The polypropylene may also be a metallocene polypropylene synthesized by a metallocene catalyst. The non-elastomeric layer (X) preferably contains metallocene polypropylene.

On the other hand, the elastomer layer (Y) preferably contains an ethylene-vinyl acetate copolymer (EVA) or an α-olefin-based thermoplastic elastomer. The α-olefin-based thermoplastic elastomer may, for example, be a homopolymer of α-olefin, a copolymer of two or more kinds of α-olefin, and the like.

The thickness of the base layer 21 may also be 60 μm or more and 160 μm or less. The thickness of the base layer 21 is preferably 60 μm or more and 120 μm or less, more preferably 80 μm or more and 100 μm or less. The thickness is the average value of the thickness measured at 5 randomly selected locations measured by a dial gauge.

The ratio (X layer/Y layer) of the thickness of one layer (X layer) of the non-elastomeric layer to the thickness of the elastomer layer (Y layer) is preferably in the range of 0.05 to 0.25.

In order to impart releasability to the back side of the base material layer 21 (the side that does not overlap the adhesive layer 22), for example, release agents (release agents) such as silicone resins or fluorine resins may be used to perform release. deal with. In terms of being able to apply active energy rays such as ultraviolet rays to the adhesive layer 22 from the back side, the base layer 21 is preferably a light-transmitting (ultraviolet-transmitting) resin film or the like.

The dicing tape 20 of the present embodiment may be provided with a release sheet covering one surface of the adhesive layer 22 (the surface of the adhesive layer 22 that does not overlap the base layer 21) in the state before use. In the case where the die bonding layer 10 having an area smaller than the adhesive layer 22 is arranged in a manner to fall into the adhesive layer 22, the peeling sheet is configured to cover both the adhesive layer 22 and the die bonding layer 10. The peeling sheet is used to protect the adhesive layer 22 and is peeled off before attaching the die-bonding layer 10 to the adhesive layer 22.

As the release sheet, for example, a plastic film or paper that has been surface-treated with a release agent such as a silicone-based, long-chain alkyl-based, fluorine-based, or molybdenum sulfide, can be used. In addition, as the release sheet, for example, polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride copolymer can be used. Fluorine-based polymer films such as materials; polyethylene, polypropylene, and other polyolefin films; polyethylene terephthalate (PET) and other polyester films, etc. In addition, as the release sheet, for example, a plastic film or paper coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent can be used. Furthermore, the release sheet can be used as a support material to support the adhesive layer 22. In particular, the release sheet is suitably used when stacking the adhesive layer 22 on the base layer 21. In detail, the adhesive layer 22 is superimposed on the base layer 21 in the state where the release sheet and the adhesive layer 22 are laminated, and the release sheet is peeled off (transferred) after the superposition, so that the adhesive layer 22 can be placed on the base layer 21. Overlap the adhesive layer 22.

In this embodiment, the adhesive layer 22 contains, for example, an acrylic polymer, an isocyanate compound, and a polymerization initiator. The adhesive layer 22 preferably has a thickness of 3 μm or more and 200 μm or less. The shape and size of the adhesive layer 22 are generally the same as the shape and size of the base layer 21. In the dicing tape 20 of the present embodiment, the ratio of the thickness of the adhesive layer 22 to the total thickness of the dicing tape 20 may also be 1% or more and 15% or less.

The acrylic polymer has at least a structural unit of alkyl (meth)acrylate, a structural unit of (meth)acrylate containing a hydroxyl group, and a structural unit of (meth)acrylate containing a polymerizable group in the molecule . The structural unit is the unit constituting the main chain of the acrylic polymer. Each side chain in the above-mentioned acrylic polymer is contained in each structural unit constituting the main chain. Furthermore, in this specification, the notation of "(meth)acrylate" means at least one of methacrylate (Methacrylic acid ester) and Acrylic acid ester (Acrylic acid ester). Similarly, the notation of "(meth)acrylic acid" means at least one of methacrylic acid and acrylic acid.

In the acrylic polymer contained in the adhesive layer 22, the above-mentioned structural units can be ^{analyzed by 1} H-NMR, ¹³ C-NMR and other NMR (nuclear magnetic resonance, nuclear magnetic resonance) analysis, thermal decomposition GC/MS (Gas chromatography/ mass spectrometry, gas chromatography/mass spectrometry) analysis, and infrared spectroscopy. In addition, the molar ratio of the above-mentioned structural unit in the acrylic polymer is usually calculated based on the compounding amount (addition amount) when the acrylic polymer is polymerized.

The structural unit of the above-mentioned alkyl (meth)acrylate is derived from an alkyl (meth)acrylate monomer. In other words, the molecular structure of the alkyl (meth)acrylate monomer after polymerization is the structural unit of the alkyl (meth)acrylate. The notation system of "alkyl" refers to the hydrocarbon moiety ester-bonded to (meth)acrylic acid. The hydrocarbon of the alkyl part in the structural unit of the alkyl (meth)acrylate may be a saturated hydrocarbon or an unsaturated hydrocarbon. Furthermore, the alkyl moiety preferably does not contain a polar group containing oxygen (O), nitrogen (N), or the like. Thereby, it is possible to suppress the extreme increase in the polarity of the alkyl polymer. Therefore, it is suppressed that the adhesive layer 22 has an excessive affinity for the die bonding layer 10. Therefore, the dicing tape 20 can be peeled off from the crystal bonding layer 10 more favorably. The carbon number of the alkyl moiety may be 6 or more and 10 or less.

Examples of the structural unit of the alkyl (meth)acrylate include structural units such as hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and decyl (meth)acrylate.

The acrylic polymer has a structural unit of (meth)acrylate containing a hydroxyl group, and the hydroxyl group of the structural unit easily reacts with an isocyanate group. By coexisting an acrylic polymer having a structural unit of (meth)acrylate containing a hydroxyl group and an isocyanate compound in the adhesive layer 22, the adhesive layer 22 can be properly hardened. Therefore, the acrylic polymer can be sufficiently gelled. Therefore, the adhesive layer 22 can maintain its shape and exhibit adhesive performance.

The structural unit of the (meth)acrylate containing a hydroxyl group is preferably a structural unit of a C2-C4 alkyl (meth)acrylate containing a hydroxyl group. The notation system of "C2-C4 alkyl" represents the carbon number of the hydrocarbon moiety ester-bonded to (meth)acrylic acid. In other words, the C2-C4 (meth)acrylic acid C2-C4 alkyl ester monomer containing a hydroxyl group means a monomer in which (meth)acrylic acid is ester-bonded with an alcohol (usually a diol) with 2 to 4 carbon atoms. The hydrocarbon portion of the C2-C4 alkyl group is usually a saturated hydrocarbon. For example, the hydrocarbon portion of the C2-C4 alkyl group is a linear saturated hydrocarbon or a branched saturated hydrocarbon. The hydrocarbon portion of the C2-C4 alkyl group preferably does not contain a polar group containing oxygen (O) or nitrogen (N).

As the structural unit of the C2-C4 alkyl (meth)acrylate containing a hydroxyl group, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, and hydroxyn-butyl (meth)acrylate can be mentioned. , Or (meth) hydroxyisobutyl acrylate and other structural units of (meth) hydroxybutyl acrylate. Furthermore, in the structural unit of hydroxybutyl (meth)acrylate, the hydroxyl group (-OH group) can be bonded to the carbon (C) at the end of the hydrocarbon moiety, or can be bonded to the carbon (C) other than the end of the hydrocarbon moiety. ) Bonding.

The said acrylic polymer contains the structural unit of the (meth)acrylate containing a polymerizable group which has a polymerizable unsaturated double bond in a side chain. By making the acrylic polymer contain a polymerizable group-containing (meth)acrylate structural unit, the adhesive layer 22 can be cured by irradiating active energy rays (ultraviolet rays, etc.) before the pickup step. Specifically, by irradiating active energy rays such as ultraviolet rays, free radicals can be generated from the photopolymerization initiator, and the acrylic polymers can undergo a crosslinking reaction by the action of the free radicals. Thereby, the adhesive force of the adhesive layer 22 before irradiation can be reduced by irradiation. Therefore, the adhesive layer 10 can be peeled off from the adhesive layer 22 well. Furthermore, as the active energy rays, ultraviolet rays, radiation rays, and electron beams are used.

Specifically, the structural unit of the (meth)acrylate containing a polymerizable group may also have the following molecular structure: on the hydroxyl group in the structural unit of the above-mentioned (meth)acrylate containing a hydroxyl group, a urethane bond Bonded with isocyanate groups of (meth)acrylate monomers containing isocyanate groups.

The polymerizable group-containing (meth)acrylate structural unit can be prepared after the acrylic polymer is polymerized. For example, after the (meth)acrylic acid alkyl ester monomer and the hydroxyl-containing (meth)acrylate monomer are copolymerized, the hydroxyl group in a part of the structural unit of the hydroxyl-containing (meth)acrylate is made to contain isocyanide The isocyanate group of the polymerizable monomer of the acid group undergoes a urethane reaction, whereby the structural unit of the (meth)acrylate containing the polymerizable group can be obtained.

The aforementioned (meth)acrylate monomer containing an isocyanate group preferably has one isocyanate group and one (meth)acrylic acid group in the molecule. As the monomer, for example, 2-isocyanatoethyl (meth)acrylate may be mentioned.

The adhesive layer 22 of the dicing tape 20 in this embodiment further contains an isocyanate compound. A part of the isocyanate compound may be in a state after being reacted by a urethane reaction or the like. The isocyanate compound has a plurality of isocyanate groups in the molecule. By allowing the isocyanate compound to have a plurality of isocyanate groups in the molecule, the crosslinking reaction between the acrylic polymers in the adhesive layer 22 can proceed. In detail, one of the isocyanate groups of the isocyanate compound reacts with the hydroxyl group of the acrylic polymer, and the other isocyanate group reacts with the hydroxyl group of the other acrylic polymer. The joint reaction proceeds.

The isocyanate compound may, for example, be a diisocyanate such as aliphatic diisocyanate, alicyclic diisocyanate, or araliphatic diisocyanate.

Furthermore, as the isocyanate compound, for example, polymeric polyisocyanates such as dimers or trimers of diisocyanates, and polymethylene polyphenyl polyisocyanates may be mentioned.

Moreover, as an isocyanate compound, the polyisocyanate obtained by reacting the excess amount of the said isocyanate compound and the compound containing an active hydrogen can be mentioned, for example. Examples of compounds containing active hydrogen include low-molecular-weight compounds containing active hydrogen, and high-molecular-weight compounds containing active hydrogen. Furthermore, as an isocyanate compound, allophanate polyisocyanate, biuret polyisocyanate, etc. can also be used. The said isocyanate compound can be used individually by 1 type or in combination of 2 or more types.

The isocyanate compound is preferably a reaction product of an aromatic diisocyanate and a low molecular weight compound containing active hydrogen. The reactant of the aromatic diisocyanate has a relatively slow reaction speed of the isocyanate group, so the adhesive layer 22 containing the reactant can be prevented from over-hardening. As said isocyanate compound, it is preferable to have 3 or more isocyanate groups in a molecule|numerator.

The polymerization initiator contained in the adhesive layer 22 is a compound that can initiate a polymerization reaction by the energy of heat or light applied. By making the adhesive layer 22 contain a polymerization initiator, when heat or light energy is applied to the adhesive layer 22, the cross-linking reaction between the acrylic polymers can proceed. Specifically, it is possible to start the polymerization reaction between the polymerizable groups between the acrylic polymers having the structural unit of the (meth)acrylate containing the polymerizable group to harden the adhesive layer 22. Thereby, the adhesive force of the adhesive layer 22 can be reduced, and the die-bonding layer 10 can be easily peeled off from the hardened adhesive layer 22 in the pickup step. As the polymerization initiator, for example, a photopolymerization initiator, a thermal polymerization initiator, or the like is used. As the polymerization initiator, general commercially available products can be used.

The adhesive layer 22 may contain other components in addition to the above-mentioned components. Examples of other ingredients include: adhesion imparting agents, plasticizers, fillers, anti-aging agents, antioxidants, ultraviolet absorbers, light stabilizers, heat-resistant stabilizers, antistatic agents, surfactants, and light peeling agents.剂 etc. The types and usage amounts of other ingredients can be appropriately selected according to the purpose.

Next, the diced die bonding film 1 of this embodiment will be described in detail.

The dicing die-cutting film 1 of this embodiment includes the above-mentioned die-cutting tape 20 and the die-cutting layer 10 laminated on the adhesive layer 22 of the die-cutting tape 20. In the manufacture of semiconductor integrated circuits, the die bonding layer 10 is attached to the semiconductor wafer.

The die bonding layer 10 may include at least one of a thermosetting resin and a thermoplastic resin. The die bonding layer 10 preferably includes thermosetting resin and thermoplastic resin.

Examples of thermosetting resins include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, thermosetting polyimide resins, and the like. As the above-mentioned thermosetting resin, only one type or two or more types are used. In terms of containing less ionic impurities, etc., which may cause corrosion of the semiconductor wafer to be bonded, the thermosetting resin is preferably an epoxy resin. The hardener of the epoxy resin is preferably a phenol resin.

As the above-mentioned epoxy resin, for example, bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type , Sulphur type, phenol novolac type, o-cresol novolac type, trihydroxyphenylmethane type, tetraphenol ethane type, hydantoin type, triglycidyl isocyanurate type, or glycidylamine type Each epoxy resin.

Phenolic resin can act as a hardener for epoxy resin. As the phenol resin, for example, a novolak type phenol resin, a resol type phenol resin, polyhydroxystyrene such as poly(p-hydroxystyrene), and the like may be mentioned. As a novolak type phenol resin, a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tertiary butylphenol novolak resin, a nonylphenol novolak resin, etc. are mentioned, for example. Only one type or two or more types of the above-mentioned phenol resin are used.

In the die bonding layer 10, the hydroxyl group of the phenol resin is preferably 0.5 equivalent or more and 2.0 equivalent or less, and more preferably 0.7 equivalent or more and 1.5 equivalent or less per equivalent of epoxy group of the epoxy resin. Thereby, the hardening reaction of the epoxy resin and the phenol resin can fully proceed.

When the die-bonding layer 10 contains thermosetting resin, the content of the thermosetting resin in the die-bonding layer 10 relative to the total mass of the die-bonding layer 10 is preferably not less than 5 mass% and not more than 60 mass%, more preferably 10 mass% % Above 50% by mass. Thereby, the function as a thermosetting adhesive can be appropriately expressed in the die-bonding layer 10.

As the thermoplastic resin that can be included in the die bond layer 10, for example, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, Ethylene-acrylate copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nylon or 6,6-nylon (trade name), phenoxy resin, acrylic resin , Saturated polyester resins such as PET or PBT, polyamide imide resins, fluororesins, etc. As the above-mentioned thermoplastic resin, an acrylic resin is preferable in terms of ensuring the adhesiveness of the die-bonding layer 10 due to its low ionic impurities and high heat resistance. Only one type or two or more types of the above-mentioned thermoplastic resin are used.

The above-mentioned acrylic resin is preferably a polymer in which the structural unit of the alkyl (meth)acrylate is the largest in terms of mass ratio among the structural units in the molecule. As the alkyl (meth)acrylate, for example, a C2-C4 alkyl (meth)acrylate may be mentioned. The above-mentioned acrylic resin may also contain structural units derived from other monomer components that can be copolymerized with the alkyl (meth)acrylate monomer. Examples of the above-mentioned other monomer components include: carboxyl group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, and phosphoric acid group-containing monomers , Acrylamide, acrylonitrile and other monomers containing functional groups, or various other multifunctional monomers. In terms of being able to exert higher cohesive force in the die-bonding layer 10, the above-mentioned acrylic resin is preferably an alkyl (meth)acrylate (especially (methyl) with a carbon number of 4 or less in the alkyl part). Alkyl acrylate) and a copolymer of monomers containing carboxyl groups, monomers containing nitrogen atoms, and polyfunctional monomers (especially polyglycidyl-based polyfunctional monomers), more preferably ethyl acrylate and butyl acrylate A copolymer of ester and acrylic acid and acrylonitrile and (meth)acrylic acid polyglycidyl ester.

In terms of the ease of setting the elasticity and viscosity of the die-bonding layer 10 within the required range, the glass transition temperature (Tg) of the acrylic resin is preferably 5°C or more and 35°C or less, more preferably 10°C or more Below 30°C.

When the die-bonding layer 10 contains thermosetting resin and thermoplastic resin, the content of the above-mentioned thermoplastic resin in the die-bonding layer 10 is relative to the organic components other than fillers (e.g., thermosetting resin, thermoplastic resin, curing catalyst, etc., silane The total mass of the coupling agent and dye) is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, and still more preferably 45% by mass or more and 55% by mass or less. Furthermore, by changing the content ratio of the thermosetting resin, the elasticity and viscosity of the die-bonding layer 10 can be adjusted.

When the thermoplastic resin of the die bonding layer 10 has a thermosetting functional group, for example, an acrylic resin containing a thermosetting functional group can be used as the thermoplastic resin. The acrylic resin containing a thermosetting functional group preferably contains a structural unit derived from an alkyl (meth)acrylate in the molecule with the largest mass ratio. As this alkyl (meth)acrylate, the (meth)alkyl (meth)acrylate exemplified above can be mentioned, for example. On the other hand, as the thermosetting functional group in the acrylic resin containing a thermosetting functional group, for example, a glycidyl group, a carboxyl group, a hydroxyl group, an isocyanate group, etc. may be mentioned. The die bonding layer 10 preferably includes an acrylic resin containing a thermosetting functional group and a hardener. As a curing agent, what was exemplified as a curing agent that can be contained in the adhesive layer 22 may be mentioned. When the thermosetting functional group in the acrylic resin containing the thermosetting functional group is a glycidyl group, it is preferable to use a compound having a plurality of phenol structures as the hardener. For example, the above-mentioned various phenol resins can be used as hardeners.

The crystal bonding layer 10 preferably contains a filler. By changing the amount of filler in the die-bonding layer 10, the elasticity and viscosity of the die-bonding layer 10 can be adjusted more easily. Furthermore, the electrical conductivity, thermal conductivity, and elastic modulus of the die-bonding layer 10 can be adjusted. As the filler, an inorganic filler and an organic filler may be mentioned. The filler is preferably an inorganic filler. Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, and crystalline materials. Filler of silicon oxide, such as silicon oxide or amorphous silicon oxide. In addition, as the material of the inorganic filler, a simple metal such as aluminum, gold, silver, copper, nickel, etc., or an alloy may be mentioned. It can also be aluminum borate whiskers, amorphous carbon black, graphite and other fillers. The shape of the filler can also be spherical, needle-like, flake-like and other shapes. Only one of the above-mentioned fillers or two or more of the above-mentioned fillers are used.

The average particle size of the filler is preferably 0.005 μm or more and 10 μm or less, more preferably 0.005 μm or more and 1 μm or less. By making the above-mentioned average particle diameter 0.005 μm or more, the wettability and adhesiveness to adherends such as semiconductor wafers are further improved. By making the above-mentioned average particle diameter 10 μm or less, the characteristics of the filler added can be more fully exhibited, and the heat resistance of the die-bonding layer 10 can be further exhibited. The average particle diameter of the filler can be determined using, for example, a photometric particle size distribution meter (for example, product name "LA-910", manufactured by Horiba Manufacturing Co., Ltd.).

When the die-bonding layer 10 contains a filler, the content of the filler relative to the total mass of the die-bonding layer 10 is preferably 30% by mass to 70% by mass, more preferably 40% by mass to 60% by mass, and further Preferably it is 42 mass% or more and 55 mass% or less.

The die-bonding layer 10 may also contain other components as needed. Examples of the above-mentioned other components include hardening catalysts, flame retardants, silane coupling agents, ion scavengers, dyes, and the like. As the flame retardant, for example, antimony trioxide, antimony pentoxide, brominated epoxy resin, etc. may be mentioned. As the silane coupling agent, for example, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyl Methyl diethoxysilane and so on. As an ion scavenger, hydrotalcite, bismuth hydroxide, benzotriazole, etc. are mentioned, for example. Only one type or two or more types of the above-mentioned other additives are used.

In terms of easy adjustment of elasticity and viscosity, the die-bonding layer 10 preferably includes a thermoplastic resin (especially an acrylic resin), a thermosetting resin, and a filler. In the die bond layer 10, the content ratio of the thermoplastic resin such as acrylic resin to the total mass of the organic components other than the filler is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, More preferably, it is 45% by mass or more and 55% by mass or less. Relative to the total mass of the die bond layer 10, the filler content is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, and still more preferably 42% by mass or more and 55% by mass or less .

The thickness of the die bond layer 10 is not particularly limited, and is, for example, 1 μm or more and 200 μm or less. The upper limit of the thickness is preferably 100 μm, more preferably 80 μm. The lower limit of the thickness is preferably 3 μm, more preferably 5 μm. Furthermore, when the die-bonding layer 10 is a laminated body, the above-mentioned thickness is the total thickness of the laminated body.

The glass transition temperature (Tg) of the die-bonding layer 10 is preferably 0°C or higher, more preferably 10°C or higher. By setting the above-mentioned glass transition temperature to 0° C. or higher, the adherent layer 10 can be easily cut by cold expansion. The upper limit of the glass transition temperature of the die-bonding layer 10 is, for example, 100°C.

The die-bonding layer 10 may also have a single-layer structure as shown in FIG. 1, for example. In this specification, a single layer refers to only a layer formed of the same composition. It is also a single layer in the form of multiple layers formed by the same composition. On the other hand, the die-bonding layer 10 may have, for example, a multilayer structure in which layers formed of two or more different compositions are laminated.

In the chip adhesive film 1 of this embodiment, the adhesive layer 22 is hardened by irradiating, for example, ultraviolet rays during use. In detail, in a state where the die bonding layer 10 of a semiconductor wafer and the adhesive layer 22 attached to the other side of the die bonding layer 10 are laminated on one side, at least ultraviolet rays or the like are irradiated to the adhesive layer 22. For example, ultraviolet rays and the like are irradiated from the side where the base layer 21 is arranged, and the ultraviolet rays and the like passing through the base layer 21 reach the adhesive layer 22. By irradiating ultraviolet rays or the like, the adhesive layer 22 is cured. By hardening the adhesive layer 22 after irradiation, the adhesive force of the adhesive layer 22 can be reduced. Therefore, the adhesive layer 10 can be relatively easily peeled off from the adhesive layer 22 after irradiation (the state of the semiconductor wafer then) .

The chip adhesive film 1 of this embodiment may also be provided with a peeling sheet covering one surface of the die bond layer 10 (the side of the die bond layer 10 that does not overlap the adhesive layer 22) in the state before use. The peeling sheet is used to protect the die-bonding layer 10 and is peeled off before attaching the adherend (for example, a semiconductor wafer) to the die-bonding layer 10. As this peeling sheet, the same thing as the said peeling sheet can be used. The release sheet can be used as a support material to support the die bonding layer 10. The peeling sheet is suitably used when stacking the die-bonding layer 10 on the adhesive layer 22. In detail, the die-bonding layer 10 is overlapped on the adhesive layer 22 in the state where the release sheet and die-bonding layer 10 are laminated, and after the overlap, the release sheet is peeled off (transferred), whereby the adhesive layer 22 can be Overlap the bonding layer 10.

The diced chip mucosa 1 of the present embodiment is configured as described above, so the incision can be maintained well after expansion.

Next, the manufacturing method of the dicing tape 20 and the dicing die sticking film 1 of this embodiment is demonstrated.

The manufacturing method of the dicing die bonding film 1 of this embodiment includes: The step of manufacturing the dicing tape 20 (the manufacturing method of the dicing tape), and the step of overlapping the die-bonding layer 10 on the manufactured dicing tape 20 to produce the dicing die-bonding film 1.

The manufacturing method of the dicing tape (the steps of manufacturing the dicing tape) has: Synthesis step, which synthesizes acrylic polymer; The adhesive layer preparation step, which volatilizes the solvent from the adhesive composition containing the above-mentioned acrylic polymer, isocyanate compound, polymerization initiator, solvent, and other components appropriately added according to the purpose to produce the adhesive layer 22; and In the laminating step, the base layer 21 and the adhesive layer 22 are laminated by bonding the adhesive layer 22 and the base layer 21 together.

In the synthesis step, for example, the acrylic polymer intermediate is synthesized by radical polymerization of (meth)acrylic acid C9-C11 alkyl ester monomer and hydroxyl-containing (meth)acrylate monomer. Free radical polymerization can be carried out by general methods. For example, while the above-mentioned monomers are dissolved in a solvent and heated, a polymerization initiator is added while stirring, whereby an acrylic polymer intermediate can be synthesized. In order to adjust the molecular weight of the acrylic polymer, polymerization can also be carried out in the presence of a chain transfer agent. Then, a part of the hydroxyl group of the structural unit of the hydroxyl-containing (meth)acrylate contained in the acrylic polymer intermediate and the isocyanate-containing polymerizable monomer are separated by the urethane reaction. The cyanate group is bonded. Thereby, a part of the structural unit of the (meth)acrylate containing a hydroxyl group becomes a structural unit of the (meth)acrylate containing a polymerizable group. The urethane reaction can be carried out by a general method. For example, heating is performed in the presence of a solvent and a urethane catalyst, and the acrylic polymer intermediate and the isocyanate group-containing polymerizable monomer are stirred. Thereby, the isocyanate group and the urethane of the polymerizable monomer containing the isocyanate group can be bonded to a part of the hydroxyl group of the acrylic polymer intermediate.

In the adhesive layer preparation step, for example, an acrylic polymer, an isocyanate compound, and a polymerization initiator are dissolved in a solvent to prepare an adhesive composition. By changing the amount of solvent, the viscosity of the composition can be adjusted. Then, the adhesive composition is applied to the release sheet. As the coating method, for example, general coating methods such as roll coating, screen coating, and gravure coating are used. By performing solvent removal treatment or curing treatment on the coated composition, the coated adhesive composition is cured, and the adhesive layer 22 is produced.

In the lamination step, the adhesive layer 22 and the base material layer 21 in a state of being overlapped with the release sheet are laminated and laminated. Furthermore, the release sheet may be in a state overlapping with the adhesive layer 22 before use. Furthermore, in order to promote the reaction between the crosslinking agent and the acrylic polymer and the reaction between the crosslinking agent and the surface of the base layer 21, it is also possible to perform an aging treatment at 50°C for 48 hours after the lamination step step. Furthermore, the base material layer 21 may use a commercially available film, etc., and may also be produced by film formation by a general method. As a film forming method, for example, a calendering film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T die extrusion method, a dry lamination method, etc. may be mentioned. Co-extrusion can also be used.

Through these steps, the dicing tape 20 can be manufactured.

The manufacturing method of chip adhesive film (the step of manufacturing chip adhesive film) includes: Resin composition preparation step, which prepares the resin composition used to form the die-bonding layer 10; The die bonding layer manufacturing step, which is to fabricate the die bonding layer 10 from the resin composition; and In the attaching step, the die bonding layer 10 is attached to the adhesive layer 22 of the dicing tape 20 manufactured as described above.

In the resin composition preparation step, for example, epoxy resin, epoxy resin curing catalyst, acrylic resin, phenol resin, solvent, etc. are mixed, and each resin is dissolved in the solvent, thereby preparing the resin composition. By changing the amount of solvent, the viscosity of the composition can be adjusted. Furthermore, as these resins, commercially available products can be used.

In the manufacturing step of the die-bonding layer, for example, the resin composition prepared as described above is applied to the release sheet. The coating method is not particularly limited. For example, general coating methods such as roll coating, screen coating, and gravure coating are used. Then, if necessary, the applied composition is cured by solvent removal treatment or hardening treatment, etc., to produce the crystal bonding layer 10.

In the attaching step, the peeling sheet is peeled off from the adhesive layer 22 of the dicing tape 20 and the die-bonding layer 10 respectively, and the die-bonding layer 10 and the adhesive layer 22 are bonded together in such a way that the die-bonding layer 10 and the adhesive layer 22 are in direct contact. For example, it can be bonded by crimping. The temperature at the time of bonding is not particularly limited. For example, it is 30°C or more and 50°C or less, preferably 35°C or more and 45°C or less. The linear pressure during bonding is not particularly limited, but is preferably 0.1 kgf/cm or more and 20 kgf/cm or less, and more preferably 1 kgf/cm or more and 10 kgf/cm or less.

The diced die bond film 1 manufactured as described above can be used as an auxiliary tool for manufacturing semiconductor integrated circuits, for example. The following describes specific examples in use.

The method of manufacturing a semiconductor integrated circuit generally includes a step of cutting and assembling a chip from a semiconductor wafer with a circuit surface formed thereon. This step includes, for example, a half-cutting step, which forms trenches in the semiconductor wafer in order to process the semiconductor wafer into a wafer (die) by a cutting process, and then grinds the semiconductor wafer to make the thickness thin; the mounting step, It attaches one side of the semi-cut semiconductor wafer (for example, the side opposite to the circuit surface) to the die bonding layer 10, and fixes the semiconductor wafer to the die dicing tape 20; in the expansion step, it is expanded through the half-cut process The distance between the semiconductor wafers; the picking step, which peels off between the die bonding layer 10 and the adhesive layer 22, and taking out the semiconductor wafer (die) with the die bonding layer 10 attached; and the die bonding step, It attaches the semiconductor chip (die) with the die bonding layer 10 attached to the bonded body. When performing these steps, the chip dicing tape (chip slicing film) of this embodiment is used as a manufacturing auxiliary tool.

In the half-cutting step, as shown in FIGS. 2A to 2D, a half-cutting process for cutting the semiconductor integrated circuit into small pieces (die) is performed. Specifically, the wafer processing tape T is attached to the surface of the semiconductor wafer on the opposite side to the circuit surface. In addition, a dicing ring R is attached to the tape T for wafer processing. In the state where the tape T for wafer processing is attached, grooves for division are formed. The back polishing tape G is attached to the surface where the grooves are formed, and on the other hand, the wafer processing tape T that has been attached is peeled off. In the state where the back grinding tape G is attached, the grinding process is performed until the semiconductor wafer has a specific thickness.

In the mounting step, as shown in FIGS. 3A to 3B, after the dicing ring R is mounted on the adhesive layer 22 of the dicing tape 20, the semi-cut semiconductor wafer is attached to the exposed surface of the die bonding layer 10. After that, the back polishing tape G is peeled off from the semiconductor wafer.

In the expansion step, as shown in FIGS. 4A to 4C, after installing the dicing ring R on the adhesive layer 22 of the dicing tape 20, it is fixed to the holder H of the expansion device. By pushing up the lifting member U of the expansion device from the lower side of the dicing mucous membrane 1, the dicing mucous membrane 1 is stretched in a manner of expanding in the plane direction. In this way, under a specific temperature condition, the semi-cut semiconductor wafer is cut. The above-mentioned temperature conditions are, for example, -20 to 5°C, preferably -15 to 0°C, and more preferably -10 to -5°C. By lowering the lifting member U, the expanded state is released (the cold expansion step so far). Furthermore, in the expansion step, as shown in FIGS. 5A to 5B, under higher temperature conditions, the dicing tape 20 is stretched in a manner of expanding the area. Thereby, the cut adjacent semiconductor wafers are pulled apart in the plane direction of the film surface to further expand the gap (normal temperature expansion step). Herein, in order to maintain the interval between the cut (divided) semiconductor wafers, a part of the dicing tape 20 is heat-shrinked (heat-shrinked). Specifically, the part outside the part overlapping with the semiconductor wafer is heat-shrinked (heat-shrinked), and the dicing tape 20 is fixed.

In the pick-up step, as shown in FIG. 6, the semiconductor wafer in the state where the die-bonding layer 10 is attached is peeled off from the adhesive layer 22 of the die-cutting tape 20. In detail, the ejector pin member P is raised, and the intersecting wafer tape 20 ejects the semiconductor wafer to be picked up. The lifted semiconductor chip is held by the suction jig J. In the die bonding step, the semiconductor chip in the state where the die bonding layer 10 is attached is attached to the adherend.

The matters disclosed in this manual include the following. (1) A dicing tape, which is provided with a substrate layer and an adhesive layer overlapped with the substrate layer, and The permanent deformation rate when stretched at 23°C is over 35%. (2) A dicing tape, which is provided with a substrate layer and an adhesive layer overlapped with the substrate layer, and The permanent deformation rate when stretched at -5°C is over 35%. (3) As described in (1) or (2) above, regarding the elastic modulus measured by dynamic viscoelastic tensile test, The ratio (B/A) of the elastic modulus (B) at 60°C to the elastic modulus (A) at 23°C is 0.17 or more and 0.50 or less. (4) The dicing tape described in any one of (1) to (3) above, wherein the elastic modulus measured by a dynamic viscoelastic tensile test is The modulus of elasticity (A) at 23°C is above 40 MPa and below 300 MPa, The modulus of elasticity (B) at 60°C is from 8 MPa to 100 MPa. (5) The dicing tape described in any one of (1) to (4) above, wherein the elastic modulus measured by dynamic viscoelastic tensile test is The modulus of elasticity (C) at 100°C is 0.5 MPa or more and 20 MPa or less. (6) The dicing tape described in any one of (1) to (5) above, wherein the substrate layer includes a plurality of layers. (7) The dicing tape described in any one of (1) to (6) above, wherein the substrate layer includes at least three layers, has two non-elastomeric layers formed of a non-elastomeric body, and is arranged on the two non-elastomeric layers. An elastomer layer formed by an elastomer between the elastomer layers. (8) The dicing tape described in any one of (1) to (7) above, wherein the non-elastomeric layer includes polypropylene. (9) The dicing tape described in any one of (1) to (8) above, wherein the elastomer layer includes at least one of ethylene-vinyl acetate copolymer (EVA) or an α-olefin-based thermoplastic elastomer. (10) The dicing tape described in any one of (7) to (9) above, wherein the ratio of the thickness of one layer (X layer) of the non-elastomeric layer to the thickness of the elastomer layer (Y layer) (X layer) /Y layer) is in the range of 0.05 to 0.25. (11) The dicing tape described in any one of (1) to (10) above, wherein the thickness of the substrate layer is 60 μm or more and 160 μm or less. (12) The dicing tape described in any one of (1) to (11) above, wherein the adhesive layer comprises an acrylic polymer, and the acrylic polymer has at least a (meth)acrylic acid alkyl ester in the molecule. Structural unit, structural unit of (meth)acrylate containing hydroxyl group, and structural unit of (meth)acrylate containing polymerizable group. (13) The dicing tape described in (12) above, wherein the adhesive layer further includes an isocyanate compound and a polymerization initiator. (14) The dicing tape described in any one of (1) to (13) above, wherein the ratio of the thickness of the adhesive layer to the total thickness of the dicing tape is 1% or more and 15% or less. (15) A dicing die-cutting film is provided with the die-cutting tape described in any one of (1) to (14) above, and a die-cutting layer laminated on the adhesive layer of the die-cutting tape.

The dicing tape and the dicing adhesive film of the present embodiment are as exemplified above, but the present invention is not limited to the dicing tape and the dicing adhesive film exemplified above. That is, various forms used in general dicing tape and dicing die bonding film can be adopted within a range that does not impair the effects of the present invention. [Example]

Next, the present invention will be explained in more detail with experimental examples, but the present invention is not limited to these.

The dicing tape is manufactured in the following manner. In addition, the dicing tape is used to produce a dicing die sticking film.

＜Base layer＞ ・Three-layer structure (X-layer/Y-layer/X-layer) in the example, single-layer (Y-layer) in the comparative example [Non-elastomeric layer: X layer] Product name: WXK1233, WMX03 Metallocene-based polypropylene random copolymer WINTEC series made by Japan Polypropylene [Elastomer layer: Y layer] Product name: EV250, EV550 Ethylene-vinyl acetate copolymer resin EVAFLEX series manufactured by Dow-Mitsui Polychemicals Product name: Vistamaxx Acrylic elastomer resin Vistamaxx series manufactured by Exxon Mobil Japan ・Forming conditions Use an extrusion T die forming machine to make a base layer with a three-layer structure of X-layer/Y-layer/X-layer. In detail, co-extrusion is performed from a T die to integrate it, and the extruded laminate is fully cured, and then wound into a roll shape to obtain a roll. In addition, the extrusion temperature conditions are as follows. X layer (outer layer): 190℃ Y layer (inner layer): 190℃ Mold temperature: 190℃ Furthermore, the thickness of the substrate layer in each embodiment and each comparative example is shown in Table 1.

＜Adhesive layer＞ (Synthesis of acrylic polymer) The following raw materials were put into a reaction vessel equipped with a condenser tube, a nitrogen introduction tube, a thermometer, and a stirring device, and a polymerization treatment was performed at 60° C. for 10 hours in a nitrogen stream to synthesize an acrylic polymer intermediate. ・2-Ethylhexyl acrylate (hereinafter also referred to as "2EHA"): 100 parts by mass, ・2-Hydroxyethyl acrylate (hereinafter also referred to as "HEA"): 19 parts by mass, ・Benzyl peroxide: 0.4 parts by mass, Toluene: 80 parts by mass Add 1.2 parts by mass of 2-methacryloxyethyl isocyanate (hereinafter also referred to as "MOI") to the synthetic acrylic polymer intermediate, and perform the addition at 50°C for 60 hours in an air stream Reaction treatment, synthesis of acrylic polymer. (Making of Adhesive Layer) Then, an adhesive solution was prepared with the following composition. ・Synthetic acrylic polymer: 100 parts by mass, ・Polyisocyanate compound (Product name "Coronate L", manufactured by Nippon Polyurethane): 1.3 quality copies, ・Photopolymerization initiator (Product name "Irgacure184", manufactured by Ciba Specialty Chemicals): 3 mass copies Prepare a PET-based film as a release sheet. Coat the surface of the release sheet with the adhesive solution prepared as described above. Furthermore, one side of the release sheet (PET-based film) was subjected to polysiloxane treatment as a release treatment, and an adhesive solution was applied to the side subjected to the release treatment. After coating, drying was performed by heating at 120°C for 2 minutes to form an adhesive layer with a thickness of 10 μm on the release sheet.

＜Production of crystal cut ribbon＞ The exposed surface of the adhesive layer made on the release sheet is attached to each substrate layer, and stored at 23° C. for 72 hours to produce a dicing tape.

＜Production of sticky layer＞ The following (a) to (e) were dissolved in methyl ethyl ketone to prepare a resin composition having a solid content concentration of 20% by mass. (a) Acrylic resin (product name "SG-P3" manufactured by Nagase Kasei Co., Ltd. Glass transition temperature 12°C): 100 parts by mass (b) Epoxy resin (product name "JER1001" manufactured by Mitsubishi Chemical Corporation): 46 parts by mass (c) Phenolic resin (product name "MEH-7851ss" manufactured by Meiwa Chemical Co., Ltd.): 51 parts by mass (d) Spherical silica (product name "SO-25R" manufactured by Admatechs): 191 parts by mass (e) Hardening catalyst (product name "Curezol 2PHZ" manufactured by Shikoku Chemical Co., Ltd.): 0.6 parts by mass The resin composition was coated on a release treatment film (release sheet) containing a polyethylene terephthalate film with a thickness of 50 μm after a silicone release treatment. Thereafter, a drying treatment was performed at 130°C for 2 minutes. In this way, a bonding layer with a thickness (average thickness) of 10 μm was produced.

＜Production of chip chip adhesive film＞ The PET peeling sheet is peeled from the chip chip tape produced, and the chip adhesive layer is attached to the exposed adhesive layer. Use hand rollers when bonding. ^{Then, 300 mJ/cm 2} of ultraviolet rays (cumulative light intensity) were irradiated from the side of the dicing belt. In this way, a diced chip adhesive film is manufactured.

(Examples 1～6) The substrate layer of the composition shown in Table 1 was produced, and the dicing tape and the dicing die sticking film were respectively manufactured according to the above method.

(Comparative Examples 1 to 4) The base material layer of the composition shown in Table 1 was produced, and the dicing tape and the dicing die sticking film were manufactured in the same manner as in the examples.

Table 1 shows the composition of the substrate layer used to manufacture the dicing tape and the dicing chip adhesive film of the embodiment and the comparative example. In addition, the physical properties (permanent deformation rate, etc.) of each diced tape measured by the following method are shown in Table 1.

[Table 1] Example Comparative example 1 2 3 4 5 6 1 2 3 4 Substrate layer structure (thickness ratio) 3 floors (1/10/1) 3 floors (1/10/1) 3 floors (1/10/1) 3 floors (1/10/1) 3 layers (1/4/1) 3 floors (1/10/1) Single layer Single layer Single layer Single layer Substrate layer material WXK1233/ EV250/ WXK1233 WXK1233/ EV250/ WXK1233 WXK1233/ EV550/ WXK1233 WXK1233/ Vistamaxx/ WXK1233 WXK1233/ EV250/ WXK1233 WMX03/ EV250/ WMX03 EV250 EV250 Vistamaxx Vistamaxx Substrate layer thickness (μm) 100 80 80 100 80 100 80 100 80 100 Permanent deformation rate 23℃ (extension 100%) 46.5 46.5 46.9 38.6 53.6 41.0 11.8 11.8 33.4 33.4 Permanent deformation rate -5℃ (extension 120%) 57.2 35.2 46.9 48.9 65.4 38.0 24.0 24.0 32.5 32.5 60℃ Elastic modulus B (MPa) 33 14 44 27 46 15 2 2 5 5 100℃ Elastic modulus C (MPa) 6 2 8 2 6 1 0.1 or less 0.1 or less 0.1 0.1 Modulus of elasticity at 23℃ A (MPa) 133 67 170 122 209 64 19 19 31 31 Ratio of elastic modulus (B/A) 0.25 0.20 0.26 0.22 0.22 0.23 0.09 0.09 0.16 0.16 Evaluation result (incision 30 μm or more ○) ○ ○ ○ ○ ○ ○ X X X X

＜Determination of permanent deformation rate of cut crystal belt＞ Each dicing tape manufactured as described above was cut into a width of 10 mm to prepare a sample. Then, with respect to this sample, the permanent deformation rate was measured as follows. Specifically, using a tensile tester (product name "Tensilon", manufactured by Shimadzu Corporation), the test was conducted under the conditions of an initial distance between the chucks of 50 mm and a tensile speed of 100 mm/min. In addition, the stretching was performed in the MD direction in this measurement, but it is not limited to this. Then, when it is stretched 100% at room temperature (23°C) (extended to twice the length before stretching), or when it is stretched 120% at -5°C, hold for 1 minute. Thereafter, the tensile force was reduced at a speed of 100 mm/min, the distance L between the chucks when the tension became 0 was measured, and the percentage of the ratio of L to the distance between the initial chucks was set as the permanent deformation rate. The conceptual diagram of the measurement used to obtain the permanent deformation rate is shown in Figure 7.

＜Determination of the elastic modulus of the crystal-cut tape (the elastic modulus of stretched storage)＞ The dicing tapes manufactured as described above were superimposed until the thickness became 200 μm. Then, cut it out with a cutting knife so that it becomes a short strip with a length of 40 mm (measurement length) and a width of 10 mm. Then, using a solid viscoelasticity measuring device (product name "RSAIII", manufactured by Rheometric Scientific), the tensile storage elastic modulus at -50 to 100°C was measured. The measurement conditions were set to a frequency of 1 Hz, a heating rate of 10°C/min, and a distance between the chucks of 22.5 mm. Read the values at 23°C and 60°C, and set the read value as the measured value of the tensile storage elastic modulus. The measured value obtained from the first implementation is used as the elastic modulus.

＜Evaluation of the performance of dicing and sticking film＞ In the actual manufacturing of semiconductor integrated circuits, most of the wafers are cut in the state where the circuit has been formed on the wafer (the state where the circuit layer is formed). If a circuit layer with a lot of space is formed, internal stress is likely to occur, and a certain degree of warpage occurs in the entire wafer. In order to evaluate the performance under such conditions, a warpage adjustment layer (hardened layer) that can produce warpage is provided on the wafer. A warpage adjustment layer is provided on the single side of the wafer to make the wafer prone to warpage. On this basis, the performance evaluation is carried out as described below. (Composition of warpage adjustment layer) The following (a) to (f) were dissolved in methyl ethyl ketone to prepare a composition for a warpage adjustment layer having a solid content concentration of 20% by mass. (a) Acrylic resin (trade name "SG-70L" manufactured by Nagase Kasei Co., Ltd.): 5 parts by mass (b) Epoxy resin (trade name "JER828" manufactured by Mitsubishi Chemical Corporation): 5 parts by mass (c) Phenolic resin (trade name "LDR8210" manufactured by Meiwa Chemical Co., Ltd.): 14 parts by mass (d) Epoxy resin (trade name "MEH-8005" manufactured by Mitsubishi Chemical Corporation): 2 parts by mass (e) Spherical silicon oxide (trade name "SO-25R" manufactured by Admatechs Co., Ltd.): 53 parts by mass (f) Phosphorus silicon catalyst (TPP-K): 1 part by mass After coating the above composition on a mold release treatment film (release liner) containing a polyethylene terephthalate film with a thickness of 50 μm that has undergone a silicone release treatment, it is dried at 130°C for 2 minutes deal with. In this way, a warpage adjustment layer with a thickness (average thickness) of 25 μm was produced. (Production of wafers for evaluation) The warpage adjustment layer produced as described above is attached to the wafer (bare wafer without a circuit layer), and the mold release treatment film is removed. In addition, the conditions at the time of bonding were set to 60°C, 0.1 MPa, and 10 mm/s. After that, it was heated in an oven at 175°C for 1 hour to thermally harden the warpage adjustment layer. Then, the wafer processing tape is attached to the exposed surface of the wafer, fixed to the dicing ring, and grooves are formed on the surface on the side of the warpage adjustment layer (half-cut processing). Specifically, a dicing device (DFD6361, manufactured by DISCO) was used to form trenches with a depth of 100 μm in a grid of 20 μm in width and 4 mm×11 mm. Furthermore, a back polishing tape was attached to the surface of the warpage adjustment layer, and the tape for wafer processing was peeled off. Then, the back surface grinder DGP8760 manufactured by DISCO was used to grind the back surface so that the total thickness of the warpage adjustment layer and the laminated body of the wafer became 55 μm. After that, the exposed surface of the wafer is attached to the die bonding layer. In detail, the surface of the wafer exposed after grinding is attached to the laminated die-bonding layer on the adhesive layer of the die-cutting tape fixed on the die-cutting ring, and the back polishing tape is peeled off. (Expansion method) Separate and expander device (DDS2300, manufactured by DISCO) is used to cut the semiconductor wafer and heat shrink the dicing tape. Specifically, first, with the cold expansion unit, the semiconductor wafer and the die-bonding layer are cut under the conditions of an expansion temperature of -15°C, an expansion speed of 200 mm/sec, and an expansion amount of 12 mm. After that, with the thermal expansion unit, the dicing tape was heat-shrinked (heat-shrinked) under the conditions of expansion amount of 10 mm, heating temperature of 250°C, air volume of 40 L/min, heating distance of 20 mm, and rotation speed of 3°/sec.

(Incision assessment) A digital microscope (VHX-6000, manufactured by Keyence Corporation) was used for the measurement of the incision. The measurement is performed by observing the gap (notch) between the chip and the chip in the cut part with a digital microscope after the heating and expansion is completed, and measuring the gap length. Measure the cuts in the MD and TD directions at 5 randomly selected locations, and use the smallest value of the measured value. If it is a cut of 30 μm or more, it is evaluated as ○, and if it is a crimp of less than 30 μm, it is evaluated as ×. Furthermore, any 5 locations refer to the 4 locations on the outermost peripheral part of the circular wafer that are separated from each other by about 90 degrees in the circumferential direction, and the vicinity of the center of the wafer.

From the above evaluation results, it can be understood that the diced chip mucosa of the embodiment can maintain the incision well after expansion compared with the diced chip mucosal film of the comparative example.

In the slicing tape of the embodiment, the permanent deformation rate is 35% or more when it is stretched at 100% at 23°C or when it is stretched at 120% at -5°C. The permanent deformation rate is an indicator of whether the cut crystal strip is easily plastically deformed at this temperature. The permanent deformation rate of 35% or more means that the shrinkage due to elasticity after stretching is relatively suppressed. Therefore, it is considered that there is almost no contraction after the extension, and accordingly, the incision can be sufficiently maintained after the expansion.

In the dicing tape of the embodiment, for example, the ratio (B/A) of the elastic modulus (B) at 60° C. to the elastic modulus (A) at 23° C. is 0.17 or more. The above ratio (B/A) of 0.17 or more means that compared with the elasticity at 23°C, the elasticity at a higher temperature of 60°C hardly decreases. Therefore, it can be said that after the dicing tape is stretched, even if it is heated at 60°C (for example, only the heat shrinkage of the peripheral edge portion is heated), the elasticity of the peripheral edge portion hardly decreases. Since the elasticity of the peripheral edge part is hardly reduced, the elasticity of the peripheral edge part can suppress the phenomenon that the stretched diced tape is trying to recover. As a result, it is considered that the dicing tape in the state where the cut wafer is placed can sufficiently maintain the kerf after expansion. [Industrial availability]

The dicing tape and the dicing die sticking film of the present invention can be suitably used as an auxiliary tool when manufacturing semiconductor integrated circuits, for example.

1: slicing crystal sticking film 10: Sticky crystal layer 20: Cut crystal belt 21: Substrate layer 22: Adhesive layer G: Back grinding tape H: retainer J: Adsorption fixture L: Distance between chucks P: ejector component R: Slicing ring T: Tape for wafer processing U: Jack up member

FIG. 1 is a cross-sectional view obtained by cutting the dicing die sticking film of the present embodiment along the thickness direction. FIG. 2A is a cross-sectional view schematically showing the half-cutting process in the manufacturing method of the semiconductor integrated circuit. FIG. 2B is a cross-sectional view schematically showing the half-cutting process in the manufacturing method of the semiconductor integrated circuit. FIG. 2C is a cross-sectional view schematically showing the half-cut process in the manufacturing method of the semiconductor integrated circuit. FIG. 2D is a cross-sectional view schematically showing the half-cut process in the manufacturing method of the semiconductor integrated circuit. FIG. 3A is a cross-sectional view schematically showing the state of the mounting step in the manufacturing method of the semiconductor integrated circuit. FIG. 3B is a cross-sectional view schematically showing the state of the mounting step in the manufacturing method of the semiconductor integrated circuit. 4A is a cross-sectional view schematically showing the expansion step at a low temperature in the manufacturing method of the semiconductor integrated circuit. 4B is a cross-sectional view schematically showing the expansion step at a low temperature in the manufacturing method of the semiconductor integrated circuit. 4C is a cross-sectional view schematically showing the expansion step at a low temperature in the manufacturing method of the semiconductor integrated circuit. 5A is a cross-sectional view schematically showing the expansion step at room temperature in the method of manufacturing a semiconductor integrated circuit. FIG. 5B is a cross-sectional view schematically showing the expansion step at room temperature in the manufacturing method of the semiconductor integrated circuit. FIG. 6 is a cross-sectional view schematically showing the state of the pickup step in the manufacturing method of the semiconductor integrated circuit. Fig. 7 is a schematic diagram showing the measurement concept of permanent deformation rate.

Claims (6)

A dicing tape, which is provided with a substrate layer and an adhesive layer overlapped with the substrate layer, and The permanent deformation rate when stretched at 23°C is over 35%. A dicing tape, which is provided with a substrate layer and an adhesive layer overlapped with the substrate layer, and The permanent deformation rate when stretched at -5°C is over 35%. Such as claim 1 or 2, regarding the elastic modulus measured by dynamic viscoelastic tensile test, The ratio (B/A) of the elastic modulus (B) at 60°C to the elastic modulus (A) at 23°C is 0.17 or more. Such as claim 1 or 2, regarding the elastic modulus measured by dynamic viscoelastic tensile test, The modulus of elasticity (A) at 23°C is above 40 MPa and below 300 MPa, The modulus of elasticity (B) at 60°C is from 8 MPa to 100 MPa. Such as claim 1 or 2, regarding the elastic modulus measured by dynamic viscoelastic tensile test, The modulus of elasticity (C) at 100°C is 0.5 MPa or more and 20 MPa or less. A die-cutting die-cutting film is provided with the die-cutting tape according to any one of claims 1 to 5, and a die-cutting layer laminated on the adhesive layer of the die-cutting tape.

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