TW202112496A - 研磨裝置、研磨方法、及基板處理裝置 - Google Patents

研磨裝置、研磨方法、及基板處理裝置 Download PDF

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Publication number
TW202112496A
TW202112496A TW109123683A TW109123683A TW202112496A TW 202112496 A TW202112496 A TW 202112496A TW 109123683 A TW109123683 A TW 109123683A TW 109123683 A TW109123683 A TW 109123683A TW 202112496 A TW202112496 A TW 202112496A
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TW
Taiwan
Prior art keywords
substrate
polishing
element surface
wafer
cleaning
Prior art date
Application number
TW109123683A
Other languages
English (en)
Chinese (zh)
Inventor
中西正行
Original Assignee
日商荏原製作所股份有限公司
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Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202112496A publication Critical patent/TW202112496A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B24B55/08—Dust extraction equipment on grinding or polishing machines specially designed for belt grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
TW109123683A 2019-09-03 2020-07-14 研磨裝置、研磨方法、及基板處理裝置 TW202112496A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-160218 2019-09-03
JP2019160218A JP7406943B2 (ja) 2019-09-03 2019-09-03 研磨装置、研磨方法、および基板処理装置

Publications (1)

Publication Number Publication Date
TW202112496A true TW202112496A (zh) 2021-04-01

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ID=74847361

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109123683A TW202112496A (zh) 2019-09-03 2020-07-14 研磨裝置、研磨方法、及基板處理裝置

Country Status (3)

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JP (1) JP7406943B2 (ja)
TW (1) TW202112496A (ja)
WO (1) WO2021044694A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117260515B (zh) * 2023-11-22 2024-02-13 北京特思迪半导体设备有限公司 抛光机的动态联动控制方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273961A (ja) 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP4507967B2 (ja) 2005-04-20 2010-07-21 セイコーエプソン株式会社 基板の洗浄装置
JP6210935B2 (ja) 2013-11-13 2017-10-11 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP2017108113A (ja) 2015-11-27 2017-06-15 株式会社荏原製作所 基板処理装置および基板処理方法ならびに基板処理装置の制御プログラム
JP7148349B2 (ja) * 2017-11-14 2022-10-05 株式会社荏原製作所 基板処理装置および基板処理方法

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WO2021044694A1 (ja) 2021-03-11
JP7406943B2 (ja) 2023-12-28
JP2021040022A (ja) 2021-03-11

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