TW202102723A - Clamp horizontal circulation continuous movement plating device allowing a plate-shaped object to be plated to be continuously transported horizontally in a processing solution in a vertical position while performing a plating process - Google Patents
Clamp horizontal circulation continuous movement plating device allowing a plate-shaped object to be plated to be continuously transported horizontally in a processing solution in a vertical position while performing a plating process Download PDFInfo
- Publication number
- TW202102723A TW202102723A TW108146177A TW108146177A TW202102723A TW 202102723 A TW202102723 A TW 202102723A TW 108146177 A TW108146177 A TW 108146177A TW 108146177 A TW108146177 A TW 108146177A TW 202102723 A TW202102723 A TW 202102723A
- Authority
- TW
- Taiwan
- Prior art keywords
- plating
- plate
- clamp
- opening
- stroke
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
Description
本發明,是關於夾具供電的夾具水平循環連續移動式鍍覆裝置,使沿著具有水平之迴圈路徑的環狀軌道來循環移動的夾具,可在去程路徑上移動的去程行程將板狀被鍍覆物以垂直姿勢一邊往水平方向搬運一邊進行鍍覆處理。The present invention relates to a clamp horizontally circulating continuous-moving plating device powered by a clamp. The clamp moves cyclically along a circular track with a horizontal loop path, and the outstroke stroke that can move on the outstroke path is the plate The shape to be plated is plated in a vertical position while being transported in the horizontal direction.
本申請人,提案有一種水平搬運式電解鍍覆裝置,是以沿著環狀軌道來在迴圈路徑移動的複數個供電夾具來保持印刷配線基板等之板狀被鍍覆物的兩側端部,並使該板狀被鍍覆物的板面朝向上下而成為水平姿勢來在鍍覆液中(電解鍍覆液中)連續地水平搬運來進行電解鍍覆處理(例如專利文獻1)。 此外,本申請人,提案有使用該水平搬運式之電解鍍覆裝置的夾具(例如專利文獻2)。該夾具,是使供電接點部於上下方向開閉,從上下方向開閉自如地抓持板狀被鍍覆物的側端部。The applicant proposes a horizontal transport type electrolytic plating device, which uses a plurality of power supply jigs that move along a loop track to hold the both sides of a plate-shaped substrate such as a printed wiring board. The plate surface of the plate-shaped object to be plated is turned up and down into a horizontal posture, and is continuously transported horizontally in the plating solution (in the electrolytic plating solution) for electrolytic plating treatment (for example, Patent Document 1) . In addition, the applicant proposed a jig using this horizontal transport type electrolytic plating apparatus (for example, Patent Document 2). This jig opens and closes the power supply contact part in the vertical direction, and grips the side end of the plate-shaped plated object freely from the vertical direction.
但是,在使板狀被鍍覆物的板面朝向上下而成為水平姿勢來在鍍覆液中連續地水平搬運來進行電解鍍覆處理的水平搬運式電解鍍覆裝置中,對板狀被鍍覆物的兩面(上下面)進行均勻的鍍覆處理是在技術上有困難。However, in a horizontal conveyance type electroplating apparatus that makes the plate surface of the plate-shaped object to be plated up and down into a horizontal posture, and is continuously conveyed horizontally in the plating solution for electrolytic plating treatment, the plate-shaped cover is It is technically difficult to perform uniform plating treatment on both sides (upper and lower) of the plating.
且,本申請人,在約20年前,開發、提案有一種電氣鍍覆處理系統,其以沿著軌道來移動的保持治具(供電夾具)來保持印刷基板等板狀被鍍覆物的上端部,使被該保持治具保持成懸吊狀態的板狀被鍍覆物在鍍覆液中一邊水平搬運一邊進行電氣鍍覆處理。(專利文獻3) [先前技術文獻] [專利文獻]In addition, the applicant, about 20 years ago, developed and proposed an electrical plating processing system that uses a holding jig (power supply jig) that moves along a rail to hold a plate-shaped substrate such as a printed circuit board. At the upper end, the plate-shaped object to be plated, which is held in a suspended state by the holding jig, is subjected to electrical plating while being transported horizontally in the plating solution. (Patent Document 3) [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本專利第5805055號公報 [專利文獻2]日本實用新案登錄第3176980號公報 [專利文獻3]日本專利第2943070號公報[Patent Document 1] Japanese Patent No. 5805055 [Patent Document 2] Japanese Utility Model Registration No. 3176980 [Patent Document 3] Japanese Patent No. 2943070
[發明所欲解決的課題][The problem to be solved by the invention]
本申請人,在約20年前所開發、提案之專利文獻3的電氣鍍覆處理系統,是謀求鍍覆處理之均勻化之劃時代的裝置,但以懸吊狀態來保持板狀被鍍覆物之較大的保持治具,是在鍍覆行程與保持治具的回歸行程以各別的軌道與治具移動手段來移動者,故難以使裝置緊湊化。The electric plating treatment system of
於是,本發明者,應用了在專利文獻1等提案之沿著環狀軌道而在迴圈路徑移動的供電夾具之想法,而創新思及了將板狀被鍍覆物以垂直姿勢在處理液中連續地水平搬運來進行電解鍍覆處理的裝置,而完成本發明。Therefore, the inventors applied the idea of a power supply jig that was proposed in
本發明所提供的鍍覆裝置的解決課題,是提供一種夾具水平循環連續移動式鍍覆裝置,可使裝置緊湊化,可使夾具的抓持部(供電接點部)平滑地開閉,且夾具在開閉時不會往夾具的橫向偏移而可正確地抓住板狀被鍍覆物。此外,在包含夾具之開閉時的夾具移動中沒有偏移,謀求對夾具之供電的穩定化。此外,本發明,在以垂直姿勢將板狀被鍍覆物在處理液中往水平方向一邊搬運一邊進行電解鍍覆處理的電解鍍覆裝置中,還可將在鍍覆工程附著於夾具之抓持部(供電接點部)的金屬予以在同一槽內的夾具回歸行程來電解剝離。 [用以解決課題的手段]The problem to be solved by the plating device provided by the present invention is to provide a plating device with horizontal circulation and continuous movement of clamps, which can make the device compact, enable the gripping part (power supply contact part) of the clamp to be opened and closed smoothly, and the clamp During opening and closing, the plate-shaped plated object can be grasped accurately without shifting to the lateral direction of the clamp. In addition, there is no deviation in the movement of the clamp including the opening and closing of the clamp, and the power supply to the clamp is stabilized. In addition, in the present invention, in an electrolytic plating apparatus that carries a plate-shaped object to be plated in a processing solution in a horizontal direction while performing an electrolytic plating process, it can also be attached to the grip of the jig during the plating process. The metal of the holding part (power supply contact part) is electrolytically peeled off by the return stroke of the jig in the same tank. [Means to solve the problem]
為了解決上述課題,本發明(請求項1的發明),提供夾具水平循環連續移動式鍍覆裝置,是具備:環狀軌道3,其具有固定地配設之水平的迴圈路徑;複數個夾具4,其上部在該環狀軌道3被保持成移動自如,於下部具有作為供電接點部來發揮功能之可開閉的抓持部6,以該抓持部6來抓持板狀被鍍覆物P的上端部而可用垂直姿勢的懸吊狀態來保持該被鍍覆物P;無限迴圈的夾具移動手段5,其連結於該等之夾具4,在使該等之夾具4於前述環狀軌道3之直線的去程路徑移動的去程行程A移動之後,經過在該環狀軌道3的回歸路徑移動的回歸行程B而再次進入前述去程行程A,而在前述環狀軌道3之水平的迴圈路徑連續地循環移動;以及夾具開閉機構,其使在前述環狀軌道3之水平的迴圈路徑連續地循環移動的前述夾具4,在前述去程行程A的起點部處控制使前述抓持部6從開狀態成為閉狀態來抓持前述板狀被鍍覆物P,被前述夾具4抓持的前述板狀被鍍覆物P是以該被鍍覆物P的板面與搬運方向平行的垂直姿勢而在鍍覆槽(電解鍍覆槽)2內的鍍覆液(電解鍍覆液)W中被搬運,在前述去程行程A的終點部處控制使前述抓持部6從閉狀態成為開狀態來將抓持狀態的前述板狀被鍍覆物P從前述抓持部6放開。In order to solve the above-mentioned problems, the present invention (invention of claim 1) provides a clamp horizontally circulating continuous-moving plating apparatus, which is provided with: an
且,本發明(請求項2的發明),提供夾具水平循環連續移動式鍍覆裝置,前述夾具4的抓持部(供電接點部)6在鍍覆槽(電解鍍覆槽)2內之鍍覆液(電解鍍覆液)W中的前述去程行程A移動之後,經過與在該鍍覆槽(電解鍍覆槽)2內之鍍覆液(電解鍍覆液)W中的前述去程行程A平行的前述回歸行程B而再次進入前述去程行程A來在水平的迴圈路徑連續移動,對前述環狀軌道3之成為直線之去程路徑的軌道部分供給陰極電流,將該軌道部分作為鍍覆用供電軌道3A來發揮功能,從該鍍覆用供電軌道3A對鍍覆液(電解鍍覆液)W中的抓持部(供電接點部)6供給陰極電流,被該抓持部(供電接點部)6抓持且被供給陰極電流的板狀被鍍覆物P,是在鍍覆液(電解鍍覆液)W中的鍍覆用陽極7間搬運的過程被電解鍍覆。In addition, the present invention (invention of claim 2) provides a horizontally circulating and continuous-moving jig plating device, and the gripping portion (power supply contact portion) 6 of the
根據該發明(請求項1、2的發明),使夾具沿著環狀軌道來在迴圈路徑循環移動,由在該循環移動中之前述去程行程A移動的夾具供給陰極電流,對板狀被鍍覆物的表面進行鍍覆處理,該板狀被鍍覆物是被在該去程行程A移動的夾具來在電解液中以垂直姿勢往水平方向搬運,故可使鍍覆裝置緊湊化。According to this invention (the inventions of
且,本發明(請求項3的發明),提供夾具水平循環連續移動式鍍覆裝置,被前述夾具4在前述去程行程A懸吊保持於該夾具4來搬運的前述板狀被鍍覆物P,是依序通過前處理部1A、鍍覆處理部1B、後處理部1C之各處理槽內的處理液中,被前述夾具4保持成懸吊狀態而在前述去程行程A搬運的前述板狀被鍍覆物P是在前處理部1A進行前處理(脫脂、水洗、酸洗、水洗等),在鍍覆處理部1B進行鍍覆處理,在後處理部1C進行後處理(水洗、乾燥等)。此外,在本發明中,可在前述回歸行程B配設剝離處理部1D,而使前述夾具的前述抓持部(供電接點部)6在前述回歸行程B通過剝離處理槽內的處理液中,可將在前述去程行程A的前述鍍覆處理部1B附著於前述抓持部(供電接點部)6的金屬以該通過過程剝離。此外,在本發明中,亦可在與前述環狀軌道3之直線之去程路徑的鍍覆處理部1B所對應的軌道部分供給陰極電流,將該軌道部分作為以鍍覆用供電軌道3A來發揮功能的陰極軌道,而可進行與請求項2之發明同樣的電解鍍覆。In addition, the present invention (the invention of claim 3) provides a plate-like plated object conveyed by the
根據該發明(請求項3發明),藉由一連串的搬運手段來將板狀被鍍覆物搬運至前處理部1A、鍍覆處理部1B、後處理部1C的各處理工程,在每個處理工程不會有搬運手段所致之板狀被鍍覆物的轉移,故可遍及前處理部1A、鍍覆處理部1B、後處理部1C之一連串的各處理工程來平滑地搬運板狀被鍍覆物。According to this invention (claim 3 invention), the plate-shaped plated object is conveyed to each of the processing steps of the pre-processing section 1A, the
且,本發明(請求項4的發明),提供夾具水平循環連續移動式鍍覆裝置,其特徵為,前述夾具4,具備:板狀固定構件12,其固定保持在軌道滑動部10的外側且為上下方向較長之形狀並具有導電性,該滑動軌道部是滑動移動自如地保持在前述環狀軌道3並具有導電性;以及開閉構件16,其具有開閉側面部16a且為剖面彎曲形狀並具有導電性,該開閉側面部構成為,透過支點軸15而可反轉地被支撐在該板狀固定構件12的外側,在常態中,以彈簧體18的彈推力使開閉側面部16a關閉,藉由與前述去程行程A的起點部和終點部對應地固定配置的抵抗導引體20之間的卡合來賦予抵抗前述彈簧體18之彈推力的按壓作用(向下方向的按壓作用、向橫方向的按壓作用),而使前述開閉側面部16a打開;前述抓持部(供電接點部)6,是由內側固定抓持部(內側供電接點部)6A與外側可動抓持部(外側供電接點部)6B所構成,該內側固定抓持部是在前述板狀固定構件12之外側的下端部突出形成,該外側可動抓持部是在前述開閉構件16之前述開閉側面部16a的下端部與前述內側固定抓持部(內側供電接點部)6A相對向地突出形成,在前述抓持部(供電接點部)6打開的狀態下,前述開閉構件16之開閉側面部16a的下端部及形成在該下端部的前述外側可動抓持部(外側供電接點部)6B,是構成為反轉移動至:比在前述去程行程A之起點部位置以垂直姿勢往水平方向搬入之板狀被鍍覆物P的上端部、以及從前述去程行程A的終點部位置以垂直姿勢往水平方向搬出之板狀被鍍覆物P的上端部還要上方的位置。In addition, the present invention (the invention of claim 4) provides a horizontally circulating continuous-moving jig plating apparatus, characterized in that the
根據該發明(請求項4的發明)的夾具,可在前述去程行程A的起點部與終點部,平滑地開閉夾具的抓持部(供電接點部)。According to the jig of this invention (the invention of claim 4), it is possible to smoothly open and close the gripping portion (power supply contact portion) of the jig at the starting point and the end point of the aforementioned outbound stroke A.
且,本發明(請求項5的發明),提供夾具水平循環連續移動式鍍覆裝置,其特徵為,前述夾具4,具備:板狀固定構件12,其固定保持在軌道滑動部10的外側且為上下方向較長之形狀並具有導電性,該滑動軌道部是滑動移動自如地保持在前述環狀軌道3並具有導電性;於上下方向具有較長形狀之(具有導電性的)上下動作桿13,其可上下活動地保持在該板狀固定構件12之外側的上部位置,被壓縮彈簧18以往上動方向的彈簧壓給彈推;以及開閉構件16,其具有開閉側面部16a且為剖面彎曲形狀並具有導電性,該開閉側面部,是透過支點軸15而可反轉地被支撐在設在前述板狀固定構件12之外側之下部位置的安裝配件14;在被前述壓縮彈簧18之往上動方向的彈簧壓給彈推的前述上下動作桿13之下端部,連結有前述開閉構件16之中介有前述支點軸15的其他部分亦即連結用構件16b,前述抓持部(供電接點部)6,是由內側固定抓持部(內側供電接點部)6A與外側可動抓持部(外側供電接點部)6B所構成,該內側固定抓持部是在前述板狀固定構件12之外側的下端部突出形成,該外側可動抓持部是在前述開閉構件16之前述開閉側面部16a的下端部與前述內側固定抓持部(內側供電接點部)6A相對向地突出形成,在常態中,與以前述壓縮彈簧18之往上動方向的彈推力而往上動的前述上下動作桿13連動,而使前述開閉構件16的前述連結用構件16b往上動,藉此前述外側可動抓持部(外側供電接點部)6B會以前述支點軸15為中心而從動地反轉移動至壓接於前述內側固定抓持部(內側供電接點部)6A的關閉位置,藉此關閉前述抓持部(供電接點部)6,在與前述去程行程A的起點部和終點部對應地固定配置之具有高低差的抵抗導引體20,使設在該夾具4之上部的卡合體21卡合而抵抗前述壓縮彈簧18之往上動方向的彈推力來使前述上下動作桿13往下動,與往下動的前述上下動作桿13連動而使前述開閉構件16的前述連結用構件16b往下動,藉此使形成在前述開閉構件16之開閉側面部16a之下端部的外側可動抓持部(外側供電接點部)6B以前述支點軸15為中心來從動地反轉移動至從前述內側固定抓持部(內側供電接點部)6A分離的傾斜開放位置,藉此打開前述抓持部(供電接點部)6而構成為可開閉,在前述抓持部(供電接點部)6打開的狀態下,前述開閉構件16之開閉側面部16a的下端部及形成在該下端部的前述外側可動抓持部(外側供電接點部)6B,是構成為反轉移動至:比在前述去程行程A之起點部位置以垂直姿勢往水平方向搬入之板狀被鍍覆物P的上端部、以及從前述去程行程A的終點部位置以垂直姿勢往水平方向搬出之板狀被鍍覆物P的上端部還要上方的位置。In addition, the present invention (the invention of claim 5) provides a horizontally circulating continuous-moving jig plating apparatus, characterized in that the
根據該發明(請求項5的發明)的夾具,可在前述去程行程A的起點部與終點部,平滑地開閉夾具的抓持部(供電接點部)。而且,該發明的夾具,是藉由往下方向的按壓來使夾具打開。因此,跟藉由往橫方向的按壓來使夾具打開之機構的夾具不同,在開閉時不會有夾具的橫向偏移,可正確地抓住板狀被鍍覆物。According to the jig of this invention (the invention of claim 5), it is possible to smoothly open and close the gripping portion (power supply contact portion) of the jig at the starting point and the end point of the aforementioned outbound stroke A. Moreover, the clamp of this invention opens the clamp by pressing in the downward direction. Therefore, unlike the clamp of a mechanism that opens the clamp by pressing in the horizontal direction, there will be no lateral deviation of the clamp during opening and closing, and the plate-shaped plated object can be grasped correctly.
且,為了解決上述的課題,本發明(請求項8的發明),提供夾具水平循環連續移動式鍍覆裝置,其特徵為,是使前述夾具移動手段5沿著前述環狀軌道3的迴圈路徑來無限迴圈地週回驅動的環狀之滾子鏈帶5A,該滾子鏈帶5A之無限迴圈的週回驅動路徑,形成為比前述環狀軌道3的迴圈路徑還小,該滾子鏈帶5A與前述夾具4,是透過以垂下狀態安裝在該滾子鏈帶5A的夾具安裝用連結板28與前述軌道滑動部10而連結,使從前述軌道滑動部10的上部往內側方向突出的螺栓軸部30貫通於形成在該夾具安裝用連結板28的貫通孔29來連結,以可吸收滾子鏈帶5A對於固定地配設之前述環狀軌道3的位移(往與週回驅動方向相交之方向的位移或往上下方向的位移)的方式,將前述夾具安裝用連結板28連結成可在前述螺栓軸部30的軸方向移動地繞軸方向旋動。In addition, in order to solve the above-mentioned problems, the present invention (the invention of claim 8) provides a clamp horizontally circulating continuous-moving plating apparatus, which is characterized in that the
根據該發明(請求項8的發明),由於可吸收滾子鏈帶對於固定地配設之環狀軌道的位移(往與週回驅動方向相交之方向的位移或往上下方向的位移),故滑動移動自如地保持在環狀軌道的夾具,包含在夾具之開閉時的夾具移動中不會有偏移,而謀求對夾具之供電的穩定化。According to this invention (the invention of claim 8), since the displacement of the roller chain with respect to the fixedly arranged endless track (displacement in the direction intersecting with the circumferential driving direction or displacement in the vertical direction) can be absorbed, The jig that is slidably moved and held on the ring-shaped rail does not shift during the jig movement when the jig is opened and closed, and the power supply to the jig is stabilized.
且,為了解決上述課題,本發明(請求項9的發明),提供夾具水平循環連續移動式鍍覆裝置,其對於配設在前述環狀軌道3之直線之回歸路徑的軌道部分供給陽極電流,將供給有陽極電流的直線之回歸路徑的軌道部分作為剝離用供電軌道3B來發揮功能,在前述回歸行程B移動的前述夾具4,是在該剝離用供電軌道3B使該夾具4的上部在空中被接觸導引而移動,從前述剝離用供電軌道3B對鍍覆液(電解鍍覆液)W中的前述抓持部(供電接點部)6供給陽極電流,可在前述回歸行程(電解剝離行程)B溶解並剝離在前述去程行程(鍍覆行程)A附著於前述抓持部(供電接點部)6的析出金屬,該鍍覆裝置,是使鍍覆用整流器40的正極與由不溶性陽極所成的前述鍍覆用陽極7電性連接,使該鍍覆用整流器40的負極與前述鍍覆用供電軌道3A電性連接,而對於一邊接觸該鍍覆用供電軌道3A一邊在前述去程行程(鍍覆行程)A移動的前述夾具4供給陰極電流;使剝離用整流器41的正極與前述剝離用供電軌道3B電性連接,使該剝離用整流器41的負極與前述鍍覆用供電軌道3A電性連接,而對於一邊接觸該剝離用供電軌道3B一邊在前述回歸行程(電解剝離行程)B移動的前述夾具4供給陽極電流;在供給有陽極電流的前述回歸行程(電解剝離行程)B移動的前述夾具4,是以在供給相反極性之電流的前述去程行程(鍍覆行程)A移動之由前述夾具4所供電之陰極的前述板狀被鍍覆物P作為對極,可使附著在構成陽極之前述夾具4之前述抓持部(供電接點部)6的金屬藉由電解而溶解剝離。In addition, in order to solve the above-mentioned problems, the present invention (invention of claim 9) provides a horizontally circulating continuous-moving-type plating apparatus for a clamp, which supplies anode current to the track portion of the linear regression path arranged on the aforementioned
根據該發明(請求項9的發明),在以垂直姿勢將板狀被鍍覆物在處理液中水平搬運的電解鍍覆裝置,還可將在前述去程行程(鍍覆行程)A附著在夾具4之抓持部(供電接點部)6的析出金屬予以在同一槽內的前述回歸行程(電解剝離行程)B來電解剝離。
[發明的效果]According to this invention (the invention of claim 9), in an electrolytic plating apparatus that horizontally conveys a plate-shaped object to be plated in a treatment solution in a vertical position, it is also possible to attach the plate-shaped object to be plated in the aforementioned outgoing stroke (plating stroke) A to The deposited metal of the gripping portion (power supply contact portion) 6 of the
根據本發明的夾具水平循環連續移動式鍍覆裝置,可使鍍覆裝置緊湊化。此外,根據本發明的夾具水平循環連續移動式鍍覆裝置,藉由一連串的夾具搬運手段來將板狀被鍍覆物搬運至前處理部、鍍覆處理部、後處理部的各處理工程,故在每個處理工程不會有搬運手段所致之板狀被鍍覆物的轉移,可遍及前處理部、鍍覆處理部、後處理部之一連串的各處理工程來平滑地搬運板狀被鍍覆物。此外,根據本發明,可使夾具的抓持部(供電接點部)平滑地開閉。此外,根據本發明,在夾具的開閉時不會有夾具的橫向偏移,可正確地抓住板狀被鍍覆物。此外,根據本發明,在包含夾具之開閉時的夾具移動中沒有偏移,謀求對夾具之供電的穩定化。此外,根據本發明,在以垂直姿勢將板狀被鍍覆物在處理液中水平搬運的電解鍍覆裝置,還可將在去程行程(鍍覆行程)附著於夾具之供電接點部的金屬予以在同一槽內的夾具之回歸行程來電解剝離。According to the clamp horizontal circulation continuous moving plating device of the present invention, the plating device can be made compact. In addition, according to the clamp horizontal circulation continuous moving plating apparatus of the present invention, the plate-shaped object to be plated is transported to each process of the pre-processing section, plating processing section, and post-processing section by a series of jig transporting means. Therefore, there will be no transfer of plate-like coatings caused by conveying means in each treatment process, and the plate-shaped quilt can be smoothly transported throughout a series of treatment processes including the pre-treatment part, the plating treatment part, and the post-treatment part. Plating. In addition, according to the present invention, the gripping portion (power supply contact portion) of the clamp can be opened and closed smoothly. In addition, according to the present invention, there is no lateral deviation of the clamp during opening and closing of the clamp, and the plate-shaped object to be plated can be grasped correctly. In addition, according to the present invention, there is no deviation in the movement of the clamp including the opening and closing of the clamp, and the power supply to the clamp is stabilized. In addition, according to the present invention, in an electrolytic plating apparatus that horizontally transports a plate-shaped substrate in a processing solution in a vertical position, it is also possible to attach the power supply contact part of the fixture during the outgoing stroke (plating stroke). The metal is electrolytically stripped by the return stroke of the clamp in the same tank.
本發明的夾具水平循環連續移動式鍍覆裝置,適合用在將方形或長條帶狀之可撓性板狀被鍍覆物予以鍍覆處理的裝置,特別是,適合用在將以設置在本裝置之外側的支撐輥與驅動輥來支撐成垂直姿勢之可撓性長條帶狀的箍狀的板狀被鍍覆物、或是以設置在本裝置之外側的供給輥與卷取驅動輥來支撐成垂直姿勢的可撓性長條帶狀的板狀被鍍覆物予以鍍覆處理的裝置。The clamp horizontal circulation continuous movable plating device of the present invention is suitable for use in a device for plating a rectangular or long strip-shaped flexible plate-shaped object to be plated. In particular, it is suitable for use in installations The support roller and the drive roller on the outer side of the device support the flexible long strip hoop-shaped plate-like coating in a vertical posture, or the supply roller and the take-up drive provided on the outer side of the device A device in which a flexible strip-shaped plate-shaped object to be plated in a vertical posture supported by a roll is plated.
基於圖式來說明本發明的夾具水平循環連續移動式鍍覆裝置的實施形態。圖1是表示較薄之可撓性板狀被鍍覆物P為長條帶狀物的例子之電解鍍覆裝置的概略俯視圖,圖2是表示較薄之可撓性板狀被鍍覆物P為印刷基板等之方形物的例子之電解鍍覆裝置的概略俯視圖,圖3是圖1、圖2所示之電解鍍覆裝置的縱斷側視圖。且,圖4是其他例子之鍍覆裝置的概略俯視圖。Based on the drawings, the embodiment of the horizontally circulating continuous-moving-type plating apparatus of the clamp of the present invention will be described. Fig. 1 is a schematic plan view of an electrolytic plating apparatus showing an example of a thin flexible plate-shaped coating P being a long strip, and Fig. 2 is a diagram showing a thin flexible plate-shaped coating P is a schematic plan view of an electrolytic plating apparatus as an example of a rectangular object such as a printed circuit board, and FIG. 3 is a vertical cross-sectional side view of the electrolytic plating apparatus shown in FIGS. 1 and 2. In addition, FIG. 4 is a schematic plan view of a plating apparatus of another example.
圖1~圖4所示之夾具水平循環連續移動式鍍覆裝置(以下有時簡稱為鍍覆裝置)1,具備:環狀軌道3,其具有固定地(固定於未圖示的架台等)配設之水平的迴圈路徑;複數個夾具4(該夾具4是遍及環狀軌道3之迴圈路徑的全範圍來複數設置),其上部在該環狀軌道3被保持成滑動移動自如,於下部具有作為供電接點部來發揮功能之可開閉的抓持部6,以該抓持部6來抓持板狀被鍍覆物P的上端部而可用垂直姿勢的懸吊狀態來保持該被鍍覆物P;無限迴圈的夾具移動手段5(沿著環狀軌道3的迴圈路徑來無限迴圈地週回驅動的環狀之滾子鏈帶5A),其連結於該等之夾具4,在使該等之夾具4於前述環狀軌道3之直線的去程路徑移動的去程行程A移動之後,經過在該環狀軌道3的回歸路徑移動的回歸行程B之移動而再次進入前述去程行程A,而在前述環狀軌道3之水平的迴圈路徑連續地循環移動;以及夾具開閉機構,其使在前述環狀軌道3之水平的迴圈路徑連續地循環移動的前述夾具4,在前述去程行程A的起點部處控制使前述抓持部6從開狀態成為閉狀態來抓持前述板狀被鍍覆物P,被前述夾具4抓持的前述板狀被鍍覆物P是以該被鍍覆物P的板面與搬運方向平行的垂直姿勢而在鍍覆槽(電解鍍覆槽)2內的鍍覆液(電解鍍覆液)W中被搬運,在前述去程行程A的終點部處控制使前述抓持部6從閉狀態成為開狀態來將抓持狀態的前述板狀被鍍覆物P從前述抓持部6放開。The horizontally circulating continuous-moving jig-moving plating device (hereinafter sometimes referred to as the plating device) 1 shown in FIGS. 1 to 4 includes: an
前述夾具移動手段5,是將在鏈輪或有溝皮帶輪卷架成無限迴圈之環狀的滾子鏈帶5A藉由搬運驅動用馬達(未圖示)來週回驅動。The above-mentioned
又,在表示板狀被鍍覆物P為方形物之例子的圖2之電解鍍覆裝置,使夾具4的安裝間隔比圖1的電解鍍覆裝置還窄,夾具4的安裝個數比較多。在圖1、圖2、圖4,為了避免煩雜化而僅表示一部分的夾具4。但是,夾具4是遍及無限迴圈地週回驅動之夾具移動手段5(滾子鏈帶5A)的全範圍以相同的安裝間隔來設置。In addition, in the electroplating apparatus of FIG. 2 showing an example in which the plate-shaped object P to be plated is a square object, the installation interval of the
圖1~圖3所示之夾具水平循環連續移動式鍍覆裝置(以下有時簡稱為鍍覆裝置)1,前述夾具4的抓持部(供電接點部)6在鍍覆槽(電解鍍覆槽)2內之鍍覆液(電解鍍覆液)W中的前述去程行程A移動之後,經過與在該鍍覆槽(電解鍍覆槽)2內之鍍覆液(電解鍍覆液)W中的前述去程行程A平行的前述回歸行程B而再次進入前述去程行程A來在水平的迴圈路徑連續移動,對前述環狀軌道3之成為直線之去程路徑的軌道部分供給陰極電流,將該軌道部分作為鍍覆用供電軌道3A來發揮功能,從該鍍覆用供電軌道3A對鍍覆液(電解鍍覆液)W中的抓持部(供電接點部)6供給陰極電流,被該抓持部(供電接點部)6抓持且被供給陰極電流的板狀被鍍覆物P,是在鍍覆液(電解鍍覆液)W中的不溶性之鍍覆用陽極7(圖3所示)間搬運的過程被電解鍍覆。又,圖1、2中,符號2a是表示將板狀被鍍覆物P搬入至電解槽2內的搬入口,符號2b是表示將板狀被鍍覆物P搬出至電解槽2外的搬出口。於該搬入口2a或搬出口2b,配設公知的密封輥亦可。Fig. 1 to Fig. 3 shows the horizontal circulation continuous movement type plating apparatus (hereinafter sometimes referred to as the plating apparatus) 1, the gripping part (power supply contact part) 6 of the
圖4所示之夾具水平循環連續移動式鍍覆裝置(以下有時簡稱為鍍覆裝置)1,被前述夾具4在前述去程行程A懸吊保持於該夾具4來搬運的前述板狀被鍍覆物P,是依序通過前處理部1A、鍍覆處理部1B、後處理部1C之各處理槽內的處理液中,被前述夾具4保持成懸吊狀態而在前述去程行程A搬運的前述板狀被鍍覆物P是在前處理部1A進行前處理(脫脂、水洗、酸洗、水洗等),在鍍覆處理部1B進行鍍覆處理,在後處理部1C進行後處理(水洗、乾燥等)。該鍍覆裝置1,亦可在與前述環狀軌道3之直線之去程路徑的鍍覆處理部1B所對應的軌道部分供給陰極電流,將該軌道部分作為以鍍覆用供電軌道3A來發揮功能的陰極軌道。The clamp horizontal circulation continuous-moving type plating device (hereinafter sometimes referred to as the plating device) 1 shown in FIG. 4 is suspended by the
且,圖4所示之鍍覆裝置1,在前述回歸行程B配設剝離處理部1D,而使前述夾具4的前述抓持部(供電接點部)6在前述回歸行程B通過剝離處理槽內的處理液中,可將在前述去程行程A的前述鍍覆處理部1B附著於前述抓持部(供電接點部)6的金屬以該通過過程剝離。Furthermore, the
以下,針對前述夾具4,加上圖5~圖9來詳細說明。圖5是夾具的側視圖,圖6是圖5之夾具的前視圖,圖7是表示夾具之其他實施形態的側視圖,圖8是圖7之夾具的前視圖。且,圖9是表示夾具之其他實施形態,(A)為側視圖,(B)為前視圖。Hereinafter, the above-mentioned
圖5~圖8所示之夾具4與圖9所示之夾具4,具備:板狀固定構件12,其透過墊片構件11固定保持在軌道滑動部10的外側且為上下方向較長之形狀並具有導電性,該滑動軌道部是滑動移動自如地保持在前述環狀軌道3並具有導電性;以及開閉構件16,其具有開閉側面部16a且為剖面彎曲形狀並具有導電性,該開閉側面部構成為,透過支點軸15而可反轉地被支撐在該板狀固定構件12的外側,在常態中,以彈簧體18(在圖5~圖8的夾具4為壓縮線圈彈簧,在圖9的夾具4為扭力線圈彈簧)的彈推力使開閉側面部16a關閉,藉由與前述去程行程A的起點部和終點部對應地固定配置的抵抗導引體20(在圖9省略)之間的卡合來賦予抵抗前述彈簧體18之彈推力的按壓作用(在圖5~圖8的夾具4是向下方向的按壓,在圖9的夾具4是向橫方向的按壓),而使前述開閉側面部16a打開;前述抓持部(供電接點部)6,是由內側固定抓持部(內側供電接點部)6A與外側可動抓持部(外側供電接點部)6B所構成,該內側固定抓持部是在前述板狀固定構件12之外側的下端部突出形成,該外側可動抓持部是在前述開閉構件16之前述開閉側面部16a的下端部與前述內側固定抓持部(內側供電接點部)6A相對向地突出形成。此外,在前述抓持部(供電接點部)6打開的狀態下,前述開閉構件16之開閉側面部16a的下端部及形成在該下端部的前述外側可動抓持部(外側供電接點部)6B,是構成為反轉移動至:比在前述去程行程A之起點部位置以垂直姿勢往水平方向搬入之板狀被鍍覆物P的上端部、以及從前述去程行程A的終點部位置以垂直姿勢往水平方向搬出之板狀被鍍覆物P的上端部還要上方的位置。前述內側固定抓持部(內側供電接點部)6A,是比以垂直姿勢水平地搬入之板狀被鍍覆物P的搬入線還位於內側,且將夾著該搬入線在外側開閉的外側可動抓持部(外側供電接點部)6B予以關閉。The jig 4 shown in Figs. 5-8 and the jig 4 shown in Fig. 9 are provided with a plate-shaped fixing member 12 which is fixed and held on the outside of the rail sliding portion 10 through a spacer member 11 and has a vertically long shape The sliding rail is slidably held on the annular rail 3 and has conductivity; and the opening and closing member 16 has an opening and closing side portion 16a that has a curved cross-sectional shape and has conductivity, and the opening and closing side The part is configured to be reversibly supported on the outside of the plate-shaped fixing member 12 through the fulcrum shaft 15, and in the normal state, the spring body 18 (the clamp 4 in FIGS. 5 to 8 is a compression coil spring, in the figure The elastic force of the clamp 4 of 9 is a torsion coil spring) closes the opening and closing side part 16a, and the resistance guide 20 (omitted in FIG. 9) fixedly arranged corresponding to the starting point and end point of the aforementioned outstroke stroke A The engagement between the spring bodies 18 provides a pressing action against the elastic thrust of the spring body 18 (the clamp 4 in FIGS. 5 to 8 is pressed in the downward direction, and the clamp 4 in FIG. 9 is pressed in the horizontal direction), and The opening and closing side surface portion 16a is open; the gripping portion (power supply contact portion) 6 is composed of an inner fixed gripping portion (inner power supply contact portion) 6A and an outer movable gripping portion (outer power supply contact portion) 6B The inner fixed gripping portion is formed to protrude from the lower end of the outer side of the plate-shaped fixing member 12, and the outer movable gripping portion is formed on the lower end of the opening and closing side surface portion 16a of the opening and closing member 16 and the inner fixed grip The portion (inner power supply contact portion) 6A is formed to protrude oppositely. In addition, in a state where the grasping portion (power supply contact portion) 6 is opened, the lower end portion of the opening and closing side surface portion 16a of the opening and closing
圖3、及圖5~圖8所示之夾具4,具備:前述板狀固定構件12;於上下方向具有較長形狀之具有導電性的上下動作桿13,其藉由固接在該板狀固定構件12之上部外側面的上部保持部12a與下部保持部12b貫通而被保持成可上下活動,被壓縮彈簧(壓縮線圈彈簧)18之往上動方向的彈簧壓給彈推;以及開閉構件16,其具有開閉側面部16a且為剖面彎曲形狀(在圖5的實施例是剖面為上下倒L字形狀)並具有導電性,該開閉側面部,是透過支點軸15而可反轉地被支撐在設在前述板狀固定構件12之外側之下部位置的安裝配件14;在被前述壓縮彈簧(壓縮線圈彈簧)18之往上動方向的彈簧壓給彈推的前述上下動作桿13之下端部,連結有前述開閉構件16之中介有前述支點軸15的其他部分亦即連結用構件16b(以插通至形成在開閉構件16之連結用構件16b的長孔16c的連結軸17來連結)。The
在常態中,與以前述壓縮彈簧18之往上動方向的彈推力而往上動的前述上下動作桿13連動,而使前述開閉構件16的前述連結用構件16b往上動,藉此前述外側可動抓持部(外側供電接點部)6B會以前述支點軸15為中心而從動地反轉移動至壓接於前述內側固定抓持部(內側供電接點部)6A的關閉位置,藉此關閉前述抓持部(供電接點部)6。In the normal state, in conjunction with the up-and-down
在與前述去程行程A的起點部和終點部對應地固定配置之具有高低差的抵抗導引體20(圖1、圖2、圖4、圖6、圖8所示),使設在該夾具4之上部的卡合體21卡合而抵抗前述壓縮彈簧(壓縮線圈彈簧)18之往上動方向的彈推力來使前述上下動作桿13往下動,與往下動的前述上下動作桿13連動而使前述開閉構件16的前述連結用構件16b往下動,藉此使形成在前述開閉構件16之開閉側面部16a之下端部的外側可動抓持部(外側供電接點部)6B以前述支點軸15為中心而從動地反轉移動至從前述內側固定抓持部(內側供電接點部)6A分離的傾斜開放位置(在圖3、圖5、圖7以一點鏈線表示),藉此打開前述抓持部(供電接點部)6,而構成為可開閉。圖3、及圖5~圖8所示的夾具4,是成為藉由往下方向的按壓來打開夾具4。因此,是與藉由往橫方向的按壓來打開夾具的機構之夾具(例如圖9所示的夾具4)不同,在開閉時不會有夾具的橫向偏移,有著可正確地抓住板狀被鍍覆物之優點。The resistance guide 20 (shown in Figure 1, Figure 2, Figure 4, Figure 6, and Figure 8) is fixedly arranged corresponding to the starting point and ending point of the aforementioned outbound stroke A, so that the resistance guide 20 (shown in Figure 1, Figure 2, Figure 4, Figure 6, and Figure 8) The engaging
在前述抓持部(供電接點部)6打開的狀態下,前述開閉構件16之開閉側面部16a的下端部及形成在該下端部的前述外側可動抓持部(外側供電接點部)6B,是構成為反轉移動至:比在前述去程行程A之起點部位置以垂直姿勢往水平方向搬入之板狀被鍍覆物P的上端部、以及從前述去程行程A的終點部位置以垂直姿勢往水平方向搬出之板狀被鍍覆物P的上端部還要上方的位置。又,圖5、圖7所示之符號T是表示板狀被鍍覆物P的上端水平。In the state in which the grasping portion (power supply contact portion) 6 is opened, the lower end portion of the opening and closing side surface portion 16a of the opening and closing
又,使前述抵抗導引體20在回歸行程B的全域延長地設置,而可使夾具4的抓持部(供電接點部)6在回歸行程B的全域成為開狀態。In addition, the
作為前述卡合體21,在圖5~圖8,以大致三角形狀(大致L字狀亦可)之板狀之反轉拉柄22的彎曲部作為支點部而藉由支撐軸23反轉自如地軸裝在前述板狀固定構件12的上端部,將該反轉拉柄22的下方端部透過軸24來連結於前述上下動作桿13的上端部,將旋轉輥25旋轉自如地安裝於前述反轉拉柄22的上方端部,將該旋轉輥25作為卡合體。在該旋轉輥(卡合體)25沿著「設在夾具4之週回移動路徑之開位置且具有高低差的抵抗導引體20之低位下面部20a」來轉動的卡合狀態中,反轉拉柄22是以前述支撐軸23為中心而往下方向反轉(在圖6、圖8以一點鏈線表示),往下方向反轉的反轉拉柄22之下方端部所連結的前述上下動作桿13會抵抗壓縮彈簧(壓縮線圈彈簧)18的彈簧壓而構成為可往下動。As the
如圖6、圖8所示般,前述抵抗導引體20的下面部,是將夾具4之移動方向之中間部設為低位下面部20a,將該低位下面部20a的兩側設為從該低位下面部逐漸變高的傾斜下面部20b。As shown in Figures 6 and 8, the lower surface of the
又,雖未圖示,但作為前述卡合體21,使前述上下動作桿13的上端部往上方延伸,在延伸的上端部旋轉自如地設置前述旋轉輥25,將該旋轉輥25作為卡合體亦可。Also, although not shown, as the engaging
進入電解液W中的夾具4之下方部分,除了抓持部(供電接點部)6以外,是藉由在圖5~圖8以一點鏈線表示之耐酸性的橡膠套27來絕緣覆蓋。The lower part of the
如圖5、圖7所示般,是使前述夾具移動手段5沿著前述環狀軌道3的迴圈路徑來無限迴圈地週回驅動的環狀之滾子鏈帶5A,該滾子鏈帶5A之無限迴圈的週回驅動路徑,形成為比前述環狀軌道3的迴圈路徑還小,該滾子鏈帶5A與夾具4,是透過以垂下狀態安裝在該滾子鏈帶5A的夾具安裝用連結板28與前述軌道滑動部10而連結,使從前述軌道滑動部10的上部往內側方向突出的螺栓軸部30貫通於形成在該夾具安裝用連結板28的貫通孔29來連結,以可吸收鏈帶5A對於固定地配設之前述環狀軌道3的位移(往與週回驅動方向相交之方向的位移或往上下方向的位移)的方式,將前述夾具安裝用連結板28連結成可在前述螺栓軸部30的軸方向移動地繞軸方向旋動。As shown in Figs. 5 and 7, it is an
如圖5~圖8所示般,於前述板狀固定構件12穿設有左右一對的螺栓卡合孔32。使用來固定保持該板狀固定構件12的固定用螺栓33通過前述螺栓卡合孔32來螺鎖於固定在前述軌道滑動部10之外側面的前述墊片構件11之外側側面。前述螺栓卡合孔32,是將下方孔部形成為容許前述固定用螺栓33之螺栓頭部之通過的寬度,並將與該下方孔部連續的上方孔部形成為容許前述固定用螺栓33之螺栓軸部之通過但不容許螺栓頭部之通過的寬窄。在圖6、圖8所示之實施例,是將下方孔部形成為圓形,將與該下方孔部連續的上方孔部形成為縱長。As shown in FIGS. 5 to 8, the plate-shaped fixing
為了固定安裝夾具4,是使以假固定狀態螺鎖於前述墊片構件11的左右一對固定用螺栓33,插通至螺栓卡合孔32的下方孔部,使夾具4下降的話上方孔部就會卡止於固定用螺栓33,在該卡止狀態鎖緊固定用螺栓33的話可確實保持在固定狀態。在將夾具4從固定安裝狀態拆除之際,是將鎖緊的固定用螺栓33放鬆至假固定狀態,使夾具4上升的話就可從下方孔部來拆除。藉此,可簡單且確實地從裝置本體裝卸上下方向較長之構造的夾具4,故可使夾具的點檢作業或鍍敷裝置本體的點檢作業的效率性提升。To fix the mounting
如前述般,作為供電夾具來發揮功能的夾具4是以具有導電性的金屬(不銹鋼等)來形成。在圖7、圖8所示之夾具的實施形態,包含前述內側固定抓持部(內側供電接點部)6A的前述板狀固定構件12之下方部分與包含前述外側可動抓持部(外側供電接點部)6B的前述開閉構件16之前述開閉側面部16a之下方部分,是由鈦材所成之左右對稱的板狀抓持構件35、36來形成。As described above, the
且,在圖7、圖8所示之夾具的實施形態,前述板狀固定構件12側(具體來說,是固接在板狀固定構件12之外側面的不銹鋼製之上部保持部12a)與前述開閉構件16的開閉側面部16a(具體來說,是開閉側面部16a的上方部分)是以導線38來連接成可供電。如圖8所示般,該導線38所致之連接,是以左右一對導線38、38來分別連接。該導線38的連接手段,可藉由將安裝在導線38之端部的壓接端子以螺栓來螺鎖之一般的的連接方法來進行。藉由該導線38的配線,可使電流輕易地流動在供電容易變得不穩定的前述開閉構件16之開閉側面部16a,對設在該開閉側面部16a之下端的前述外側可動抓持部(外側供電接點部)6B的供電效率可大幅提升。又,圖5、圖6所示之夾具的實施形態,雖沒有配線前述導線38,但在圖5、圖6所示之夾具,也是配線與圖7、圖8的實施例相同的導線38為佳。And, in the embodiment of the jig shown in FIGS. 7 and 8, the plate-shaped fixing
圖9所示之夾具4,具備開閉構件16,其具有開閉側面部16a且為剖面彎曲形狀並具有導電性,該開閉側面部,是透過支點軸15而可反轉地被支撐在設在前述板狀固定構件12之外側之大致中間位置的安裝配件14;在常態中,是藉由安裝在支點軸15的扭力線圈彈簧18來將開閉構件16的上方部分往擴開方向彈推,並將開閉構件16之下方部分的開閉側面部16a往關閉方向彈推,而關閉抓持部(供電接點部)6。於前述開閉構件16的上端部安裝有作為卡合體21來發揮功能的旋轉輥25。而且,藉由與前述去程行程A的起點部和終點部對應地固定配置的抵抗導引體20(在圖9省略圖示)與前述卡合體21(旋轉輥25)的卡合,來賦予抵抗前述扭力線圈彈簧18之彈推力之往橫方向(在圖9以符號G表示)的按壓作用來使前述開閉側面部16a打開。The
又,圖9所示之夾具4亦與前述圖7、圖8所示之夾具相同,包含前述內側固定抓持部(內側供電接點部)6A的前述板狀固定構件12之下方部分與包含前述外側可動抓持部(外側供電接點部)6B的前述開閉構件16之前述開閉側面部16a之下方部分,是由鈦材所成之左右對稱的板狀抓持構件35、36來形成。且,圖9所示之夾具4亦與前述圖7、圖8所示之夾具相同,夾具4的下方部分,除了抓持部(供電接點部)6以外,是藉由在圖9以一點鏈線表示之耐酸性的橡膠套27來絕緣覆蓋。In addition, the
如圖10的實施例所示般,圖1~圖3所示之電解鍍覆裝置1,對於配設在前述環狀軌道3之直線之回歸路徑的軌道部分供給陽極電流,將供給有陽極電流的直線之回歸路徑的軌道部分作為剝離用供電軌道3B來發揮功能,在前述回歸行程B移動的前述夾具4,是在該剝離用供電軌道3B使該夾具4的上部在空中被接觸導引而移動,從前述剝離用供電軌道3B對鍍覆液(電解鍍覆液)W中的前述抓持部(供電接點部)6供給陽極電流,可在前述回歸行程B溶解並剝離在前述去程行程(鍍覆行程)A附著於前述抓持部(供電接點部)6的析出金屬。As shown in the embodiment of Fig. 10, the
如圖10所示般,使鍍覆用整流器(供電電源)40的正極(正電極)與由不溶性陽極所成的前述鍍覆用陽極7電性連接,使該鍍覆用整流器(供電電源)40的負極(負電極)與前述鍍覆用供電軌道3A電性連接,而對於一邊接觸該鍍覆用供電軌道3A一邊在前述去程行程(鍍覆行程)A移動的夾具4供給陰極電流;使剝離用整流器(供電電源)41的正極(正電極)與前述剝離用供電軌道3B電性連接,使該剝離用整流器(供電電源)41的負極(負電極)與前述鍍覆用供電軌道3A電性連接,而對於一邊接觸該剝離用供電軌道3B一邊在前述回歸行程B移動的夾具4供給陽極電流;在供給有陽極電流的前述回歸行程B移動的夾具4,是以在供給相反極性之電流的前述去程行程(鍍覆行程)A移動之由夾具4所供電之陰極的板狀被鍍覆物P作為對極,可使附著在構成陽極之夾具4之抓持部(供電接點部)6的金屬藉由電解而溶解剝離。又,鍍覆用供電軌道3A與剝離用供電軌道3B是中介有塑料材等之絕緣軌道。As shown in FIG. 10, the positive electrode (positive electrode) of the plating rectifier (power supply) 40 is electrically connected to the aforementioned plating anode 7 made of an insoluble anode, so that the plating rectifier (power supply) The negative electrode (negative electrode) of 40 is electrically connected to the aforementioned power supply rail 3A for plating, and a cathode current is supplied to the clamp 4 that moves in the aforementioned forward stroke (plating stroke) A while contacting the power supply rail 3A for coating; The positive electrode (positive electrode) of the stripping rectifier (power supply) 41 is electrically connected to the aforementioned stripping power supply rail 3B, and the negative electrode (negative electrode) of the stripping rectifier (power supply) 41 is connected to the aforementioned plating power supply rail 3A It is electrically connected, and an anode current is supplied to the jig 4 that moves in the return stroke B while contacting the power supply rail 3B for peeling; the jig 4 that moves in the return stroke B to which the anode current is supplied is supplied with the opposite polarity The aforementioned outgoing stroke (plating stroke) A of the current moves the plate-shaped plate-like substrate P of the cathode powered by the clamp 4 as the counter electrode, which can be attached to the gripping part (power supply contact point) of the clamp 4 constituting the anode Part) 6 metal is dissolved and peeled by electrolysis. In addition, the
如上述般,將作為對極的陰極共用(兼用)在前述去程行程(鍍覆行程)A與前述回歸行程(電解剝離行程)B,故在前述回歸行程(電解剝離行程)B從夾具4的抓持部(供電接點部)6溶解剝離的溶解金屬(例如溶解Cu),是朝向在前述去程行程(鍍覆行程)A移動的板狀被鍍覆物P而在電解液中如箭頭F般移動,而電鍍至在前述去程行程(鍍覆行程)A移動的板狀被鍍覆物P。藉此,在回歸行程(電解剝離行程)B從夾具4的抓持部(供電接點部)6剝離的溶解金屬(例如溶解Cu)可有效活用,可使電解鍍覆及電解剝離的效率提升。這是起因於使去程行程(鍍覆行程)A與回歸行程(電解剝離行程)B在同一個電解槽1內進行所致之極大的優點。As described above, the cathode as the counter electrode is shared (combined) in the forward stroke (plating stroke) A and the return stroke (electrolytic stripping stroke) B, so the return stroke (electrolytic stripping stroke) B is removed from the
1:鍍覆裝置 1A:鍍覆裝置的前處理部 1B:鍍覆裝置的鍍覆處理部 1C:鍍覆裝置的後處理部 2:鍍覆槽(電解鍍覆槽) 3:環狀軌道 3A:鍍覆用供電軌道 3B:剝離用供電軌道 4:夾具 5:夾具移動手段 5A:滾子鏈帶 6:抓持部(供電接點部) 6A:內側固定抓持部(內側供電接點部) 6B:外側可動抓持部(外側供電接點部) P:板狀被鍍覆物 W:鍍覆液(電解鍍覆液) A:去程行程 B:回歸行程 7:鍍覆用陽極 10:軌道滑動部 12:板狀固定構件 13:上下動作桿 14:安裝配件 15:支點軸 16:開閉構件 16a:開閉構件的開閉側面部 16b:開閉構件的連結用構件 16c:長孔 17:連結軸 18:彈簧體 20:抵抗導引體 21:卡合體 22:反轉拉柄 23:支撐軸 24:軸 25:旋轉輥 27:橡膠蓋 28:夾具安裝用連結板 29:貫通孔 30:螺栓軸部 32:螺栓卡合孔 33:固定用螺栓 35、36:板狀抓持構件 38:導線 40:鍍覆用整流器 41:剝離用整流器1: Plating device 1A: Pretreatment section of plating equipment 1B: Plating treatment section of plating equipment 1C: Post-processing part of plating device 2: Plating tank (electrolytic plating tank) 3: circular track 3A: Power rail for plating 3B: Power supply rail for stripping 4: Fixture 5: Fixture moving means 5A: Roller chain belt 6: Grip part (power supply contact part) 6A: Inside fixed gripping part (inside power supply contact part) 6B: External movable gripping part (outside power supply contact part) P: Plate-like coating W: Plating solution (electrolytic plating solution) A: Outbound itinerary B: Return itinerary 7: Anode for plating 10: Rail sliding part 12: Plate-shaped fixing member 13: Up and down action lever 14: Install accessories 15: fulcrum axis 16: opening and closing member 16a: The opening and closing side of the opening and closing member 16b: Connection member of opening and closing member 16c: Long hole 17: connecting shaft 18: Spring body 20: Resistance inducer 21: Snap body 22: Reverse handle 23: Support shaft 24: axis 25: Rotating roller 27: Rubber cover 28: Coupling plate for fixture installation 29: Through hole 30: Bolt shaft 32: Bolt engagement hole 33: Bolt for fixing 35, 36: plate-shaped gripping member 38: Wire 40: Rectifier for plating 41: Rectifier for stripping
圖1,是本發明的概略俯視圖。 圖2,是本發明的概略俯視圖。 圖3,是圖1、圖2所示之本發明的縱斷側視圖。 圖4,是表示本發明之其他實施例的概略俯視圖。 圖5,是表示本發明之夾具的側視圖。 圖6,是表示本發明之夾具的前視圖。 圖7,是表示本發明之夾具之其他實施例的側視圖。 圖8,是圖7所示之夾具的前視圖。 圖9,是表示本發明之夾具之其他實施例,(A)為側視圖,(B)為前視圖。 圖10,是表示本發明之其他實施例的縱斷側視圖。Fig. 1 is a schematic plan view of the present invention. Fig. 2 is a schematic plan view of the present invention. Fig. 3 is a longitudinal sectional side view of the present invention shown in Figs. 1 and 2; Fig. 4 is a schematic plan view showing another embodiment of the present invention. Fig. 5 is a side view showing the clamp of the present invention. Fig. 6 is a front view showing the clamp of the present invention. Fig. 7 is a side view showing another embodiment of the clamp of the present invention. Fig. 8 is a front view of the clamp shown in Fig. 7; Fig. 9 shows another embodiment of the clamp of the present invention, (A) is a side view, and (B) is a front view. Fig. 10 is a longitudinal sectional side view showing another embodiment of the present invention.
1:鍍覆裝置 1: Plating device
1B:鍍覆裝置的鍍覆處理部 1B: Plating treatment section of plating equipment
2:鍍覆槽(電解鍍覆槽) 2: Plating tank (electrolytic plating tank)
3:環狀軌道 3: circular track
3A:鍍覆用供電軌道 3A: Power rail for plating
4:夾具 4: Fixture
5:夾具移動手段 5: Fixture moving means
5A:滾子鏈帶 5A: Roller chain belt
6:抓持部(供電接點部) 6: Grip part (power supply contact part)
6B:外側可動抓持部(外側供電接點部) 6B: External movable gripping part (outside power supply contact part)
P:板狀被鍍覆物 P: Plate-like coating
W:鍍覆液(電解鍍覆液) W: Plating solution (electrolytic plating solution)
A:去程行程 A: Outbound itinerary
B:回歸行程 B: Return itinerary
7:鍍覆用陽極 7: Anode for plating
10:軌道滑動部 10: Rail sliding part
15:支點軸 15: fulcrum axis
16:開閉構件 16: opening and closing member
18:彈簧體 18: Spring body
21:卡合體 21: Snap body
40:鍍覆用整流器 40: Rectifier for plating
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-128775 | 2019-07-10 | ||
JP2019128775A JP2021014608A (en) | 2019-07-10 | 2019-07-10 | Clamp horizontal cycle continuous movement type plating apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202102723A true TW202102723A (en) | 2021-01-16 |
TWI724691B TWI724691B (en) | 2021-04-11 |
Family
ID=74048233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108146177A TWI724691B (en) | 2019-07-10 | 2019-12-17 | Clamp horizontal circulation continuous movable plating device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2021014608A (en) |
KR (1) | KR20210007802A (en) |
CN (1) | CN112210814A (en) |
TW (1) | TWI724691B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107059097B (en) * | 2017-06-16 | 2024-03-15 | 俊杰机械(深圳)有限公司 | Electroplating device |
CN113549988A (en) * | 2021-07-28 | 2021-10-26 | 厦门海辰新能源科技有限公司 | Conductive base film conveying device and coating machine |
KR102406773B1 (en) * | 2021-11-10 | 2022-06-13 | 주식회사 지씨이 | Vertical continuous plating equipment |
KR102506259B1 (en) | 2022-02-14 | 2023-03-06 | 주식회사 지씨이 | Clamp transfer device for vertical continuous equipment |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS585055B2 (en) | 1977-09-29 | 1983-01-28 | 東芝テック株式会社 | vacuum cleaner |
JP2943070B1 (en) | 1998-07-30 | 1999-08-30 | 丸仲工業株式会社 | Electroplating system that enables uniform plating |
JP3176980U (en) | 2012-04-28 | 2012-07-12 | 丸仲工業株式会社 | Clamping jig for thin plate-like workpieces in horizontal transfer plating processing equipment |
JP6038492B2 (en) * | 2012-06-04 | 2016-12-07 | 丸仲工業株式会社 | Horizontal continuous plating equipment by clamp conveyance |
TW201408822A (en) * | 2012-08-21 | 2014-03-01 | Marunaka Kogyo Co Ltd | Horizontal transportation type electrolytic plating treatment apparatus |
JP5805055B2 (en) * | 2012-11-24 | 2015-11-04 | 丸仲工業株式会社 | Horizontal conveyance type electroplating equipment |
JP6162079B2 (en) * | 2014-06-20 | 2017-07-12 | 丸仲工業株式会社 | Electrolytic plating equipment with clamp power supply for electrolytic peeling of clamp-attached metal |
JP6469204B1 (en) * | 2017-11-28 | 2019-02-13 | 丸仲工業株式会社 | Horizontal transport type electroplating equipment for easy maintenance and inspection |
-
2019
- 2019-07-10 JP JP2019128775A patent/JP2021014608A/en active Pending
- 2019-11-29 KR KR1020190156347A patent/KR20210007802A/en not_active Application Discontinuation
- 2019-11-29 CN CN201911201884.6A patent/CN112210814A/en active Pending
- 2019-12-17 TW TW108146177A patent/TWI724691B/en active
Also Published As
Publication number | Publication date |
---|---|
KR20210007802A (en) | 2021-01-20 |
CN112210814A (en) | 2021-01-12 |
JP2021014608A (en) | 2021-02-12 |
TWI724691B (en) | 2021-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI724691B (en) | Clamp horizontal circulation continuous movable plating device | |
CA1329792C (en) | Device for the electrolytic treatment of board-shaped objects | |
WO2018000779A1 (en) | Electroplating clamp conductive-type reel-to-reel vertical continuous electroplating device | |
TWI586848B (en) | Method and apparatus for electrolytically depositing a deposition metal on a workpiece | |
JP2012097345A (en) | Device for conveying sheet-like material to be processed in surface processing device, and clamp for the same | |
JP6038492B2 (en) | Horizontal continuous plating equipment by clamp conveyance | |
JP2005537392A (en) | Apparatus and method for electrolytic treatment of a workpiece having at least a conductive surface | |
CN107059097B (en) | Electroplating device | |
US5985106A (en) | Continuous rack plater | |
JP3600787B2 (en) | Surface treatment method and surface treatment line for bag-like work | |
KR101581207B1 (en) | System for Automation Anodizing Treatment of Metal | |
KR101582144B1 (en) | System for Automation Anodizing Treatment of Metal | |
JP2010189736A (en) | Automatic plating apparatus | |
KR20160011779A (en) | Automatic plating machine | |
JP6910600B2 (en) | Plating equipment | |
JP6469168B2 (en) | Clamping jig for plate-like workpieces in horizontal transport plating equipment | |
JP2001335993A (en) | Method for plating bag shaped work, and plating line | |
KR101637376B1 (en) | System for Anodizing Treatment typed Trolley Conveyor | |
RU2398918C2 (en) | Installation for treatment of metal item surface, particularly by electrolysis | |
JP6162079B2 (en) | Electrolytic plating equipment with clamp power supply for electrolytic peeling of clamp-attached metal | |
KR102506259B1 (en) | Clamp transfer device for vertical continuous equipment | |
JP2005350703A (en) | Electroplating method for box-shaped work, box-shaped work holder for electroplating, and electroplating device for box-shaped work | |
CN215976098U (en) | High-efficient electroplating treatment device of pendant | |
TWI615510B (en) | Suction plating apparatus | |
KR101943403B1 (en) | Roll-to-roll electroplating equipment with plating peeling function for clamp |