JP2010189736A - Automatic plating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an automatic plating apparatus which reduces plating failures due to the contamination of a washing solution and a plating solution, properly and uniformly holds a current density in an electrolytic solution in the periphery of an article to be plated, and can form an adequately plated film on the article to be plated. <P>SOLUTION: The automatic plating apparatus is directed for forming a plated film on the article to be plated, by making a rack 25 which is suspended by an elevating hanger 24 of an elevating tool 2 hold the article W to be plated, and making an elevating member 22 of the elevating tool 2 elevate the article W to be plated to automatically immerse the article W into each treatment tank, while making a rack transport machine 1 intermittently transport the article to be plated together with the elevating tool 2 to each treatment tank. The automatic plating apparatus has a projection 31a for dripping and eliminating the washing solution and the plating solution which remain in the article W to be plated by applying a light dropping impact to the elevating member 22 of the elevating tool 2 provided on an elevating transverse rail 31, and an oiling stamp table for oiling a current-collecting portion of a current collector 26 provided in a transportation path above a washing tank 51. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  In the present invention, the object to be plated is automatically immersed in each processing tank by raising and lowering the lifting member of the lifting tool while intermittently sending the object to be processed to each processing tank by a rack transporter. The present invention relates to an automatic plating apparatus that performs a plating process.

  As a nickel chrome plating device that deposits nickel chrome on the surface of the object to be plated, a number of pretreatment tanks, water washing tanks, semi-gloss plating tanks, bright plating tanks, water washing tanks, chrome plating tanks, etc. are provided along the plating production line. In addition to laying a separate transport rail for each treatment tank, each transport rail is provided with a rack transporter equipped with a rack hanger that suspends the object to be plated and can be moved up and down. A plating apparatus having a provided structure is proposed in Patent Document 1 below.

  The rack hanger of this plating apparatus has a cathode hanger on the cathode side that suspends the object to be plated and energizes it so as to be separable from the support, and each rack transporter that moves on the transport rail has When the rack hanger that suspends the object to be plated and can be moved up and down reaches the treatment tank at the end of the next transfer rail and lowers it, the cathode hanger that holds the object to be plated is moved to the rack of the next rack transporter. It changes so that it may mount on a hanger, and a to-be-plated object is immersed in the following process tank, and a plating process is performed.

Japanese Patent Laid-Open No. 7-180086

  This conventional plating equipment separates the rails for transport between the pretreatment tanks, washing tanks, semi-gloss plating tanks, bright plating tanks, washing tanks, chrome plating tanks, etc., and uses an independent rack conveyor. When moving between the treatment tanks, the rack hangers in which the objects to be plated are suspended from the rack hangers are transported and immersed by the rack transporters, and then the cathode hangers are rack hangers of the next rack transporter. By switching so as to be mounted on the substrate, liquid removal of the object to be plated is improved, and problems due to mixing of the previous plating solution into the subsequent plating solution have been solved.

  However, since the rack hangers are partly removed from the support and are exchanged between the rack transporters, the exchange operation of the cathode hangers becomes unstable, and in addition, poor current conduction to the workpiece to be the cathode electrode is likely to occur. . For this reason, the automatic operation of the plating apparatus cannot be performed, and manual work by the operator is required at each location, which makes it difficult to automatically perform a good plating process.

  The present invention solves the above-mentioned problems, reduces plating defects due to mixing of washing solution and plating solution, maintains the current density in the electrolyte solution around the object to be plated properly, and is good. An object is to provide an automatic plating apparatus capable of performing a plating process.

  In the automatic plating apparatus according to claim 1 of the present invention, the object to be plated is held on a rack suspended on an elevating hanger of an elevating tool, and the object to be plated is intermittently sent to each processing tank together with the elevating tool by a rack transporter. On the other hand, in the automatic plating apparatus for automatically immersing the object to be plated in each processing tank by raising and lowering the elevating member of the elevating tool and plating the object to be plated, the rack of the elevating tool is used by the rack transporter. When the container is transported or moved up and down, the rack is provided with a draining means for applying a light drop impact to the rack to drop the residual liquid from the object to be plated.

  According to this invention, the problem that the properties of the treatment liquid deteriorate due to mixing the residual liquid remaining in the object to be plated by immersing in a washing tank or plating tank into the next treatment tank is eliminated, and the plating process is improved. Can be done.

  The invention of claim 2 is characterized in that, in the automatic plating apparatus of claim 1, the draining means is provided above the washing tank in front of the acid neutralization tank and above the washing tank in front of the plating tank. To do.

  According to this invention, the acid neutralization in the acid neutralization tank is satisfactorily performed, the deterioration of the properties of the plating solution can be prevented, and the plating process can be favorably performed.

  According to the invention of claim 3, the object to be plated is held on a rack suspended on an elevating hanger of an elevating tool, and the elevating and lowering of the elevating tool is performed while intermittently sending the object to be plated together with the elevating tool to each processing tank by a rack transporter. In an automatic plating apparatus that automatically immerses the object to be plated in each processing tank by raising and lowering the member and plating the object to be plated, a conductive rail for energizing the rack is provided along the lower side of the conveyance path. A current collecting portion that can be slidably contacted with the conductive rail is provided on the elevating hanger, and an oiled stamp stand is provided at a position where the current collecting portion contacts when the elevating tool is lowered. Features.

  According to this invention, when the lifting tool is lowered, an appropriate amount of conductive oil can be automatically applied to the current collector, so that conventionally, when an operator has applied oil to the current collector, , No dripping of oil into the plating tank or shortage of oil occurs, the current collecting part is energized well, the current density of the electrolyte is kept properly, the deterioration of the properties of the plating solution, etc. is prevented, and the plating process Can be performed satisfactorily.

  According to a fourth aspect of the present invention, in the automatic plating apparatus according to the third aspect, the oil-applied stamp stand is disposed above a washing tank in front of the plating tank.

  According to the present invention, the conductive oil is attached to the current collector portion in front of the plating tank through which a relatively high current flows, so that the electric resistance of the current collector portion is minimized to prevent the current collector portion from being baked, and plating is performed. The electrolytic solution in the tank can be maintained at an appropriate current density, and the plating process can be performed satisfactorily. Moreover, if an oil-attached stamp stand is disposed above the washing tank, even if an oil droplet is accidentally dropped, the influence can be reduced.

  The invention of claim 5 holds the object to be plated on the rack suspended on the lifting hanger of the lifting tool, while intermittently sending the object to be plated together with the lifting tool to the processing tanks including the plating tank by the rack transporter, In an automatic plating apparatus for automatically immersing the object to be plated in each treatment tank by raising and lowering the elevating member of the lifting tool, the object to be plated is bent in an inverted U shape. An I-type anode electrode is formed and vertically inserted near one side of the plating tank, while an L-type anode electrode bent toward the other side of the plating tank with the tip portion facing upward is formed. The bent tip portion of the L-shaped anode electrode inserted vertically is disposed in the central portion of the plating tank, and the object to be plated in the plating tank is located inside the tip portion of the L-shaped anode electrode. It is dipped so that it may contain.

  According to the present invention, the upward tip portion of the L-type anode electrode enters the inside of the workpiece to be bent in an inverted U shape, so that the I-type anode electrode and the L-type anode electrode, the outside of the workpiece to be plated, All distance intervals including the inside are uniform. As a result, the current density of the electrolytic solution, which is the plating solution in the plating tank, can be made uniform around the object to be plated, and the plating metal is uniformly deposited on all surfaces of the object to be plated. A layer can be formed on the entire surface of the object to be plated.

  According to the automatic plating apparatus of the present invention, defective plating due to mixing of a washing solution and a plating solution is reduced, and the current density in the electrolyte solution around the object to be plated is appropriately and uniformly maintained, thereby performing a good plating process. Can be done.

1 is a schematic perspective view of a rack transporter 1 of an automatic plating apparatus showing an embodiment of the present invention. It is plane explanatory drawing which shows the structure of an automatic plating apparatus. 1 is a longitudinal cross-sectional explanatory view of a plating apparatus including a rack transporter 1. It is a front view of the lifting tool. 3 is a right side view of the lifting tool 2. FIG. 3 is a rear view of the lifting tool 2. FIG. It is VII-VII sectional drawing of FIG. It is a front view of the state which mounted the electrically conductive part 24a of the raising / lowering hanger 24 of the raising / lowering tool 2 on the oiling stamp stand. It is an expansion right view of a raising / lowering hanger. It is a right view of the state which mounted | worn the electrically conductive part 24a of the raising / lowering hanger 24 on the oiling stamp stand. 4 is an enlarged cross-sectional view of a semi-bright nickel plating tank 46 and a bright nickel plating tank 48. FIG. It is an expanded sectional view of the chromium plating tank 49.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the automatic plating apparatus of the present invention, the rack 25 holding the workpiece W is hooked on the lifting hanger 24 of each lifting tool 2 at the loading position, and the lifting tool 2 in this state is pretreated, plated, and posttreated. And a rack transporter 1 that transports endlessly to a carry-out position near the carry-in position.

  As shown in FIG. 1, the rack transporter 1 has an upper roller chain 11 for transport and a lower roller chain 16 for transport disposed in an endless manner so as to span between chain sprockets in the horizontal direction. A large number of vertically long lifting tools 2 each having a lifting hanger 24 and a rack 25 are connected between the roller chain 11 and the lower roller chain 16 for conveyance, and the rack 25 holding the workpiece W is loaded. It is configured to be hooked on the lifting hanger 24 of each lifting tool 2 at the position, and to transport the lifting tool 2 intermittently to each processing step of pre-treatment, plating treatment, and post-treatment.

  As shown in FIG. 1, the drive shaft 13 of the rack transporter 1 is supported so as to be vertically rotatable, and an upper chain sprocket 12 for hanging an upper roller chain 11 for transportation is attached to the drive shaft 13 on the upper portion thereof. A lower chain sprocket 17 is attached to the lower portion of the drive shaft 13 to hang the lower roller chain 16 for conveyance. The drive shaft 13 is intermittently driven at a low speed by a drive mechanism including a drive motor 14. The tact rotation is driven with a tact distance of.

  Although not shown, an assembly of a rotating shaft, an upper chain sprocket, and a lower chain sprocket is also arranged on the opposite side of the drive shaft 13, and the endless transport upper roller chain 11 and the transport bottom The other end of the roller chain 16 is stretched over them, and the lifting tool 2 that is vertically connected and supported by the transport upper roller chain 11 and the transport lower roller chain 16 at a predetermined interval is tactless in the horizontal and lateral directions. It is designed to be transported.

  In addition, instead of the drive mechanism including the drive motor 14 that rotationally drives the drive shaft 13 described above, the drive shaft 13 may be rotationally driven intermittently by using a ratchet arm having a ratchet mechanism and a fluid pressure cylinder. . In this case, the ratchet arm provided with the ratchet mechanism is pivotally attached to the drive shaft 13, the tip of the piston rod of the fluid pressure cylinder is connected to the tip of the ratchet arm, and the drive shaft is connected via the ratchet arm by the reciprocating operation of the fluid pressure cylinder. 13 is intermittently driven at every tact rotation angle.

  4-6, the lifting / lowering tool 2 is formed in the rectangular frame shape which has a pair of raising / lowering vertical rail 21 on either side, The moving wheel 18 is pivotally supported in the lower part, and the moving wheel 18 is conveyed. It rolls on the rail 15 so as to move in the horizontal and horizontal directions on the transport rail 15.

  As shown in FIG. 2, the transport rail 15 is laid endlessly in an oval shape along the annular transport path of the rack transporter 1. The lifting / lowering tool 2 has a lifting / lowering hanger 24 attached to the front surface of the lifting / lowering member 22, a rack 25 is suspended from the lifting / lowering hanger 24, and a workpiece W to be plated on the rack 25 can be moved up and down. The holding rail 15 is configured to move while being held.

  Here, as shown in FIG. 5 and the like, the workpiece W is a headrest stay that constitutes a stay of the headrest for an automobile, and is formed by bending a metal pipe into an inverted U shape. Since the end of the metal pipe of the headrest stay is in an open state, the washing liquid remains in the pipe, but as described later, a light drop impact is applied to the workpiece W after being washed in the washing tank. The remaining liquid is dropped and drained.

  A pair of elevating vertical rails 21 provided in the elevating tool 2 is configured by assembling a channel material having a C-shaped cross section into a vertically long frame shape with a predetermined interval between the opening portions thereof inside each other, Inside, a rectangular elevating member 22 is held through a guide wheel 23 so as to be movable up and down.

  The elevating member 22 is configured by rotatably supporting two pairs of guide wheels 23 on both upper and lower sides of a main body formed in a rectangular plate. Inserted and held inside the rail 21 so as to roll, the elevating member 22 can freely move up and down inside the pair of elevating vertical rails 21.

  As shown in FIGS. 6 and 7, a support wheel 27 is pivotally supported on the back surface of the elevating member 22 so as to protrude. The support wheel 27 is configured so that the vertically movable member 22 can be moved up and down at a predetermined position (a position where the rack 25 holding the workpiece W is raised and lowered above a degreasing tank, a water washing tank, a plating tank, etc.). While raising and lowering along with the raising and lowering, the support wheel 27 rolls on the raising and lowering horizontal rail 31, so that the workpiece W held by the lifting tool 2, that is, the rack 25, is moved at the height position of the raising and lowering horizontal rail 31. It can be transported in the horizontal direction.

  As shown in FIG. 1, the elevating horizontal rail 31 is arranged to be movable up and down by the operation of the elevating drive device 32. Further, the elevating horizontal rail 31 is held in a horizontal state by a vertical guide member (not shown), and the tip of the elevating chain 33 of the elevating drive device 32 is connected to the elevating horizontal rail 31. The elevating horizontal rail 31 moves up and down.

  An elevating drive device 32 is disposed above the elevating horizontal rail 31, and the elevating chain 33 is hung on a chain wheel 36 attached to the drive shaft 34 of the elevating drive device 32. The drive shaft 34 is rotationally driven at a low speed by a rotation drive mechanism including a drive motor 35, and rotates the chain wheel 36 in both directions to raise and lower the elevating chain 33, that is, the elevating horizontal rail 31. Although not shown, the elevating horizontal rail 31 is suspended horizontally by two elevating chains from above, and is moved up and down while maintaining a horizontal state.

  Instead of a mechanism for rotating the drive shaft by a drive motor, the end of the elevating chain 33 is connected to the tip of the piston rod of the fluid pressure cylinder, and the elevating horizontal rail 31 can be driven up and down by the operation of the fluid pressure cylinder. it can. Further, the elevating mechanism including the elevating horizontal rail 31, the elevating drive device 32, the elevating chain 33, and the drive motor 35 is disposed at a plurality of positions along the conveyance path of the rack conveyance machine 1. However, the lifting / lowering tool 2 can be lifted / lowered independently, and the support wheel 27 of the lifting / lowering tool 2 transported by the previous lifting / lowering horizontal rail 31 is placed on the next succeeding lifting / lowering horizontal rail 31 and moved.

  A support wheel 27 that protrudes from the lifting member 22 of the lifting tool 2 rolls on the lifting and lowering horizontal rail 31. A light drop impact is given to the lifting tool 2 at a predetermined position via the support wheel 27 to be covered. In order to drain the plated product W, a draining projection 31a having a substantially right triangular shape on the front is provided on the elevating horizontal rail 31 as shown in FIG. The draining protrusion 31a is disposed above a washing tank 51, which will be described later, and when the object to be plated W is rinsed and sent to the next step, when the support wheel 27 gets over the draining protrusion 31a, the lifting member The light drop impact is given to 22 and the water remaining on the to-be-plated object W is dropped.

  When the object to be plated W is formed by bending a metal pipe like a headrest stay, the water that has penetrated into the pipe from the end of the object to be plated after being washed in the water washing tank Remains inside. If the remaining water is mixed with the workpiece W in the next step, such as a PR degreasing tank, an acid neutralizing tank, or a chrome plating tank, the plating process may be adversely affected due to degreasing, acid neutralization, or deterioration of the plating solution. Receiving and plating defects are likely to occur. For this reason, when the water washing tank 51 and the recovery water washing tank 52 finish the water washing and move to the next processing step, the support ring 27 of the elevating hanger 24 gets over the draining protrusion 31a, and a light drop impact is given to the elevating member 22. By giving and dropping the water remaining on the to-be-plated object W, it is made to drain well after washing in the washing tank.

  As shown in FIGS. 4-10, the raising / lowering hanger 24 is attached to the raising / lowering member 22 of the raising / lowering tool 2 so that a square pipe may protrude ahead. A conductive (copper) conductive hanger 24 b is attached to the tip of the lift hanger 24 formed of a square pipe, and a current collector 26 is attached to the base of the lift hanger 24. A conductive plate-like (copper) conductive portion 24a is connected from the conductive hanger 24b to the current collector 26 of the original portion.

  As shown in FIG. 9, the current collector 26 is configured by attaching a current collector 26a with a slight width to the lower side of the elevating hanger 24 so as to be movable up and down, and a current collecting surface is formed on the lower surface of the current collector 26a. Has been. The current collector 26a is attached to the lower side of the current collector 26 via a coil spring 26d, and is in sliding contact with the conductive rail 28 on the transport rail 15 with the biasing force of the coil spring 26d.

  Furthermore, the current collecting arm 26b is attached to both sides of the current collecting portion 26a so as to open obliquely upward, and a flexible conductor lead wire 26c is provided between the current collecting arm 26b and the conductive portion 24a. Connected. When the elevating member 22 of the elevating tool 2 moves up and down so as to immerse the workpiece W while applying an electric field in an electrolytic degreasing tank, a plating tank, etc. The current collecting arm 26b is slidably contacted to be energized, or the object to be plated W is provided in a state of being immersed in a plating bath and energized to the object to be plated W.

  On the other hand, when the elevating member 22 of the elevating tool 2 moves transversely while the workpiece W is immersed in an electrolytic degreasing tank, a plating tank, etc., as shown in FIG. 5, the current collecting surface on the lower surface of the current collecting part 26a However, sliding is performed on the conductive rail 28 attached on the transport rail 15, and a DC voltage is applied between an anode electrode such as an electrolytic degreasing tank or a plating tank and the object to be plated W to supply power. .

  Electroplating is performed by feeding a large current between the anode electrode inserted in the plating tank and the object to be plated W (cathode), so if the current collector surface on the lower surface of the current collector is worn, it is baked. The electrical resistance during that time increases, and the current density of the electrolyte decreases due to the decrease in current, resulting in poor plating.

  For this reason, the conductive oil is usually applied to the current collecting surface of the current collecting portion every predetermined time, but the conductive oil has been conventionally applied before the object to be plated is immersed in the chrome plating tank. It was applied to the current collector by the operator. However, if the amount of conductive oil applied to the current collector of the lifting hanger is small, baking will occur on the current collector surface, and if too much conductive oil is applied, the oil will be washed in the water tank or chrome plating tank. This causes the plating solution and the like to deteriorate, resulting in poor plating.

  In this automatic plating apparatus, the conductive oil is automatically attached to the current collector 26a, and an appropriate amount of oil is securely attached, and the excess oil is not dropped into the washing tank or the plating tank. Therefore, as shown in FIGS. 8 and 10, an oil-applied stamp base 9 is attached to a predetermined upper position of the transport rail 15 via a bracket.

  The oil-applied stamp base 9 accommodates an oil absorption holder made of woven fabric or non-woven fabric in a rectangular box having an upper opening, is filled with conductive oil, and the current collector 26a is placed on the slump base from above. When pressed, an appropriate amount of oil is attached. This oiled stamp stand 9 is installed above the alkaline degreasing tank 41 and above the washing tank position before the chrome plating tank 49 in the plan view of the automatic plating apparatus shown in FIG. When the elevating tool 2 reaches the position, the elevating horizontal rail 31 is lowered to lower the elevating hanger 24, and the current collecting portion 26a of the current collector 26 is placed on the oiled stamp stand 9 as shown in FIGS. And an appropriate amount of oil is adhered to the current collector 26a.

  As shown in FIGS. 4, 5, and 7, a copper alloy conductive hanger 24 b is horizontally attached to the tip of the elevating hanger 24, and the conductive part 24 a is electrically connected to the conductive hanger 24 b. . A copper alloy rack 25 is hooked on the conductive hanger 24b, and a large number of objects to be plated W are hooked on the rack 25 in the horizontal direction.

  The rack 25 is formed in a rectangular frame shape, and a large number of hook holding portions 25a are arranged in the horizontal direction at the horizontal lower portion, and each hook holding portion 25a is an inverted U-shaped headrest stay. As shown in FIGS. 4, 5, and 7, the object W is configured to be hooked and held in an upright state while being aligned in the movement (lateral) direction. As a result, the object to be plated W is electrolyzed under the same conditions in a plating tank or the like in order to be hooked and held so that the rack 25 stands with the object to be plated W aligned in the moving (lateral) direction. Since it is immersed and processed in the liquid, a plating layer can be formed uniformly between the objects to be plated W.

  Next, a degreasing tank, a plating tank, a rinsing tank, and the like arranged along the transport path of the rack transporter 1 will be described. As shown in FIG. 1, the rack transporter 1 of the automatic plating apparatus is configured to move the lifting tool 2 at the loading / unloading position while intermittently rotating the transport upper roller chain 11 and the transport lower roller chain 16 in the clockwise direction in the figure. The workpiece W loaded on the rack 25 is transferred to the pretreatment, plating treatment, and post-treatment processes, and the workpiece W is immersed in each treatment tank arranged in each treatment process. Then, the plating process is performed. Each processing tank, such as a degreasing tank, a plating tank, and a water washing tank, is sequentially arranged along the transport path of the rack transporter 1.

  As shown in FIG. 2, an alkaline degreasing tank 41 is arranged adjacent to the loading / unloading position as the first tank for the pretreatment, and this alkaline degreasing tank 41 is provided with an ultrasonic generator at the bottom of the tank, An ultrasonic wave is generated in the alkaline degreasing solution accommodated in the tank to perform the alkaline degreasing of the workpiece W. As described above, the oil-applied stamp base 9 is provided above the alkaline degreasing tank 41. As the elevating horizontal rail 31 descends, the elevating hanger 24 is lowered, and the conductive portion 24a is placed on the oil-applied stamp base 9. The conductive oil is adhered to the conductive portion 24a.

  Next to the alkaline degreasing tank 41, an electrolytic degreasing tank 42 is disposed with a water washing tank 51 in between. The electrolytic degreasing tank 42 is configured to perform positive electrolysis and negative electrolysis in separate liquids in a degreasing solution, and a water washing tank 51 is disposed after each electrolytic degreasing tank 42. The elevating horizontal rail 31 is disposed above the washing tank 51 after the electrolytic degreasing tank 42 so as to be movable up and down. As described above, the draining protrusion 31a is provided on the elevating horizontal rail 31 as shown in FIG. After the electrolytic degreasing and washing, when the lifting tool 2 raises the workpiece W and transports it to the next tank, it gives a light drop impact to the workpiece W and remains in the workpiece W. Water is drained to ensure drainage.

  A PR degreasing tank 43 is arranged next to the electrolytic degreasing tank 42, and two flushing tanks 51 are arranged next to the PR degreasing tank 43. The PR degreasing tank 43 performs degreasing by applying positive electrolysis and negative electrolysis alternately in the degreasing liquid. A draining protrusion 31a is also provided on the elevating horizontal rail 31 as shown in FIG. 6 above the two water rinsing tanks 51 that perform water washing after PR degreasing. After electrolytic degreasing and water washing, the workpiece W When the substrate is lifted and transported to the next tank, a light drop impact is applied to the object to be plated W, water remaining in the object to be plated W is dropped and drained. Next to the PR degreasing tank 43, an acid neutralization tank 45 is arranged, and after the acid neutralization tank 4, a water washing tank 51 is arranged.

  Further, next to the acid neutralization tank 45, a semi-bright nickel plating tank 46 is installed along the transport path of the rack transporter. As shown in FIG. 11, a titanium case electrode 64 is inserted as an anode electrode on both sides of the semi-bright nickel plating tank 46, and nickel metal is accommodated in the titanium case electrode 64. Conductive latches 67 are attached to a plurality of upper portions of the titanium case electrode 64, and these conductive latches 67 are latched by a cooling energizing pipe 65 disposed above the semi-bright nickel plating tank 46. Yes. The cooling energization pipe 65 forms a conductive part for the positive electrode, and is connected to the inside so that the cooling water is circulated by the cooling water circulation device 66, and the cooling energization pipe 65 is being plated by the circulation of the cooling water. It is supposed to be cooled.

  A semi-bright nickel plating solution is accommodated in the semi-bright nickel plating tank 46, and the plating object W hung on the rack 25 of the cathode electrode is immersed in the plating solution in a heated state. Although the bright nickel plating process is performed, the current density of the electrolytic solution, which is a plating solution, is considerably high, and the current value flowing through the current-carrying pipe and the conductive portion is considerably high. Further, since the plating solution in the semi-bright nickel plating tank 46 is agitated, the plating solution scatters above the tub, and the scattered plating solution attaches to the conductive portion of the current-carrying pipe and the conductive latch 67 and crystallizes. For this reason, the electrical resistance of the contact portion between the current-carrying pipe and the conductive latch 67 increases, and this portion is baked, and the current value in the plating solution, that is, the current density of the electrolytic solution is lowered, so that plating failure is likely to occur. .

  Therefore, the cooling water circulating device 66 circulates cooling water through the cooling energization pipe 65 disposed above the semi-bright nickel plating tank 46 to cool the cooling energization pipe 65. When the cooling energization pipe 65 is cooled during the process, water vapor evaporated from the heated semi-bright nickel plating solution comes into contact with the cooling energization pipe 65 to cause condensation, and water droplets adhere to the periphery of the cooling energization pipe 65. . This water drop lowers the electrical resistance of the contact portion between the cooling energization pipe 65 and the conductive latch 67 and prevents the contact portion from being burned. For this reason, the fall of the current density in a plating solution is prevented and favorable plating is enabled.

  Next to the semi-bright nickel plating tank 46, a bright nickel plating tank 48 is installed along the transport path of the rack transporter through the tri-nickel tank 47. In the bright nickel plating tank 48, a titanium case electrode 64 is inserted as an anode electrode on both sides of the bright nickel plating tank 48 as shown in FIG. 11, and nickel metal is accommodated in the titanium case electrode 64. Conductive latches 67 are attached to a plurality of upper portions of the titanium case electrode 64, and these conductive latches 67 are latched by a cooling energization pipe 65 disposed above the bright nickel plating tank 48. . The cooling energization pipe 65 forms a conductive portion for the positive electrode, and is connected to the inside so that the cooling water is circulated by the cooling water circulation device 66 as described above. 65 is cooled during the plating process.

  Due to the cooling of the cooling current supply pipe 65, water vapor evaporated from the bright nickel plating solution heated during the plating process contacts the cooling current supply pipe 65 and is condensed as described above. Adheres. This water drop lowers the electrical resistance of the contact portion between the current-carrying pipe and the conductive latch 67, prevents the contact portion from being burned, and prevents the current density in the plating solution from decreasing.

  Next to the bright nickel plating tank 48, a recovered water washing tank 52 and two water washing tanks 51 are installed. In the recovered water rinsing tank 52 and the water rinsing tank 51, the object to be plated W that has been subjected to the bright nickel plating treatment is immersed in the water rinsing tank and washed with water. Further, a draining protrusion 31a is provided on the elevating horizontal rail 31 as shown in FIG. Thus, the bright nickel plating process is performed, and after the object to be plated W is immersed in the recovered water washing tank 52 and the water washing tank 51 and washed, the elevating member 22 is raised when the object to be plated W is lifted and transported to the next tank. The support ring 27 protruding from the back of the metal plate rides on the draining protrusion 31a and falls, so that a light drop impact is given to the object to be plated W, and water remaining in the object to be plated W is dropped and drained. It has become.

  Further, the oil-applied stamp stand 9 is installed above the washing tank 51 located in front of the chrome plating tank 49. In the same manner as described above, the oil-applied stamp base 9 accommodates an oil absorbing holder made of woven fabric, non-woven fabric, etc. in a rectangular box having an upper opening, filled with conductive oil, and collected from above. When the electric part 26a is pressed onto the slump table, an appropriate amount of oil is attached. That is, when the lifting / lowering tool 2 reaches above the washing tank 51, the lifting / lowering horizontal rail 31 is lowered to lower the lifting / lowering hanger 24, and as shown in FIGS. 8 and 10, the current collector 26a of the current collector 26 is provided. Is pressed onto the oil-applied stamp base 9, and an appropriate amount of oil is adhered to the current collecting portion 26a.

  As described above, the oil-applied stamp base 9 is installed above the place where the workpiece W is carried in and above the rinsing tank 51 located in front of the chromium plating tank 49, and the current collector 26 of the lifting tool 2. While the current collecting portion 26a goes around the plating process by the rack transporter 1, an appropriate amount of conductive oil is attached to the current collecting portion 26a. In particular, in the chromium plating treatment in the chromium plating tank 49, Since the current density of the electrolytic solution is high and a high current flows through the current collector 26, the current collector 26a is likely to be seized when the electrical resistance of the current collector 26a increases. However, since the oil-applied stamp base 9 is disposed above the rinsing tank 51 in front of the chrome plating tank 49 and an appropriate amount of conductive oil is applied to the current collector 26a by the oil-applied stamp base 9, the chrome plating process is in progress. The electrical resistance of the current collector 26a is kept low, and the current collector 26a is prevented from being burned. Moreover, if it is above the water-washing tank 51, even if an oil drop of the oil-applied stamp stand 9 is accidentally dropped, the plating process is not adversely affected.

  Next to the recovered water washing tank 52 and the two water washing tanks 51, a chromium plating tank 49 is installed. In the chrome plating tank 49, as shown in FIG. 12, a plurality of I-type anode electrodes 61 are inserted and arranged along the transport path at intervals on one side of the chrome plating tank 49, and on the other side in the tank The plurality of L-type anode electrodes 62 are inserted and arranged along the transport path at the same interval. These L-type anode electrodes 62 have an upward tip portion 62 a and are bent into an approximately L shape, and are inserted into the tank so that the tip portion 62 a bent upward is positioned at the center of the chromium plating tank 49. The The I-type anode electrode 61 and the L-type anode electrode 62 are insoluble electrodes, and a chromic acid solution is accommodated in the chromium plating tank 49 as a plating solution.

  During the plating process, an object to be plated W (a headrest stay in which a metal pipe is bent in an inverted U shape) hung on the rack 25 is immersed in the chrome plating tank 49 along the conveyance path. At this time, as shown in FIG. 12, the object to be plated W is immersed in the plating tank 49 so that the upward tip portion 62a of the L-type anode electrode 62 enters the inside of the headrest stay of the object to be plated W from below. Is done.

  Thus, in the chrome plating tank 49, the upward tip 62a of the L-type anode electrode 62 enters the inside of the headrest stay bent in an inverted U shape, and the I-type anode electrode 61, the L-type anode electrode 62, All the distance intervals including the outer side and the inner side of the plated product W are made uniform. Thereby, the current density of the electrolytic solution that is the plating solution in the chromium plating tank 49 is made uniform around the object to be plated W, and chromium metal is uniformly deposited on all surfaces of the object to be plated W, A uniform chromium plating layer is formed on the entire surface of the workpiece W.

  As shown in FIG. 12, conductive latches 67 are attached to the upper ends of the I-type anode electrode 61 and the L-type anode electrode 62, and these conductive latches 67 are disposed above the chromium plating tank 49. The energized pipe 63 is hooked. The energization pipe 63 forms a conductive portion for a positive electrode, and a DC voltage is applied from a DC power source to the object to be plated W serving as a negative electrode.

  Next, the operation of the automatic plating apparatus will be described. An object W to be plated of a headrest stay formed by bending a metal pipe into an inverted U shape is hung in a standing position on the hook holding portion 25a of the rack 25, and the rack 25 is As shown in FIGS. 4 to 7, the rack carrier 1 is hooked on the conductive portion 24 a of the elevating hanger 24 from the loading / unloading position and loaded.

  By the operation of the rack transporter 1, each lifting tool 2 is first sent to the alkaline degreasing tank 41, and the object W to be plated on the rack 25 hung on the lifting hanger 24 is lowered and immersed in the alkaline degreasing tank 41, Alkaline degreasing treatment for a predetermined time is performed. At this time, ultrasonic waves are generated in the alkaline degreasing tank 41 by the ultrasonic generator, and the degreasing process is efficiently performed. Here, when the elevating member 22 of the elevating tool 2 is lowered, the current collector 26 of the elevating humbar 24 is pressed onto the oil-applied stamp base 9, and an appropriate amount of conductive oil is adhered to the current collecting portion 26a. The

  Next, each lifting / lowering tool 2 is sent to the electrolytic degreasing tank 42, and the object W to be plated on the rack 25 hung on the lifting hanger 24 is lowered into the electrolytic degreasing tank 42 and immersed in the electrolytic degreasing tank 42 for electrolytic degreasing treatment. Done. Next, each lifting tool 2 is sent to the PR degreasing tank 43, and the workpiece W on the rack 25 is lowered into the PR degreasing tank 43, immersed for a predetermined time, and PR degreasing treatment is performed. Thereafter, the object to be plated W on each rack 25 is sent to the water washing tank 51 and washed with water, and then sent to the acid neutralization tank 45 where neutralization treatment with acid is performed, but PR degreasing and acid neutralization are performed. When washing is performed after the treatment, draining is performed in order to completely remove water remaining in the pipe of the workpiece W.

  In this draining, after the rack 25 of the workpiece W is pulled up from the washing tank 51, the support wheel 27 of the elevating member 22 of the elevating hanger 24 moves on the elevating horizontal rail 31 by driving the rack transporter 1. At this time, the support wheel 27 gets over the draining protrusion 31a provided on the rail. At this time, the elevating member 22 of the elevating hanger 24, that is, the rack 25 is subjected to a light drop impact, and this drop impact is applied to the object to be plated W. The water is dropped and drained. By this draining, the washing water remaining on the workpiece W in the washing tank 51 is prevented from being mixed into the next acid neutralization tank 45, and the degreasing and the neutralization with the acid are performed well.

  Next, the object W to be plated on the rack 25 hung on the elevating hanger 24 is lowered into a semi-bright nickel plating tank 46 and immersed for a predetermined time to perform a semi-bright nickel plating process. In this plating tank, as shown in FIG. 11, between the anode of the titanium case electrode 64 and the cathode of the workpiece W, a cooling energizing pipe 65, a conductive latch 67, a current collector 26, a conductive portion 24a, and the like are interposed. Thus, a direct current is applied and semi-bright nickel plating is performed. During this plating process, nickel ions are eluted from the nickel metal in the titanium case electrode 64 of the anode, and the eluted nickel ions move toward the object to be plated W of the cathode, and nickel metal is deposited on the surface of the object to be plated W. Precipitates and a semi-bright nickel plating layer is formed.

  During this time, the direct current for electroplating flows from the titanium case electrode 64 of the anode to the workpiece W of the cathode, from the workpiece W through the conductive portion 24a, and from the current collecting portion 26a of the current collector 26 to the conductive rail 28. Although an appropriate amount of conductive oil is attached to the current collector 26a, the current density of the electrolyte in the plating tank can be maintained at an appropriate value without causing baking due to an increase in contact resistance. it can.

  In addition, as shown in FIG. 11, the cooling energization pipe 65 disposed above the semi-bright nickel plating tank 46 is cooled by the cooling water circulation device 66, and the semi-bright nickel plating solution accommodated in the semi-bright nickel plating tank 46 is Since it is heated, water vapor evaporated from the plating solution contacts the cooling energizing pipe 65 to cause condensation, and water droplets adhere to the surface of the cooling energizing pipe 65. As a result, seizure between the cooling energization pipe 65 and the conductive latch 67 is prevented, and no plating liquid crystal adheres between them, and the energization is performed satisfactorily and an appropriate current density is maintained in the plating tank. In addition, semi-bright nickel plating can be performed satisfactorily.

  Following the semi-bright nickel plating process, the object W to be plated on the rack 25 is sent to the trinickel plating tank 47, the trinickel plating process is performed, and further, the object W to be plated is sent to the bright nickel plating tank 48. Then, a bright nickel plating process is performed. During this plating process, as described above, nickel ions are eluted from the nickel metal in the titanium case electrode 64 of the anode, and the eluted nickel ions move toward the cathode W to be plated. Nickel metal is deposited on the surface, and a bright nickel plating layer is formed.

  During this time, DC current flows from the titanium case electrode 64 of the anode to the workpiece W, from the workpiece W through the conductive portion 24a, and from the current collector portion 26a of the current collector 26 to the conductive rail 28 in the same manner as described above. However, since an appropriate amount of conductive oil is attached to the current collector 26a, an appropriate current density can be maintained in the electrolytic solution in the plating tank without causing baking due to an increase in contact resistance.

  Further, as shown in FIG. 11, similarly to the above, the cooling energization pipe 65 disposed above the bright nickel plating tank 48 is cooled by the cooling water circulation device 66, and the bright nickel accommodated in the semi-bright nickel plating tank 46. Since the plating solution is heated, the water vapor evaporated from the plating solution comes into contact with the cooling energizing pipe 65 to cause condensation, and water droplets adhere to the surface of the cooling energizing pipe 65. As a result, seizure between the cooling energization pipe 65 and the conductive latch 67 is prevented, and no plating liquid crystals adhere between them, so that energization is performed well and an appropriate current density is maintained in the plating tank. In addition, bright nickel plating can be performed satisfactorily.

  Next, the object W to be plated on the rack 25 is sent to the recovered water rinsing tank 52 and the water rinsing tank 51 and subjected to a water rinsing process. Here, when the elevating member 22 of the lifting tool 2 descends in order to immerse the workpiece W in the washing tank 51, the current collector 26 of the elevating hanger 24 is pressed onto the oil stamp base 9, An appropriate amount of conductive oil is applied to the current collector 26a. The oiling to the current collecting part 26a is the second time following the carry-in, but the oiling at this position is particularly chrome plating which supplies a relatively large direct current and easily causes the current collecting part 26a to be seized. From the point before the treatment, the second oiling to the current collector 26a is necessary and effective.

  After the water washing process in the water washing tank 51, the workpiece W on the rack 25 is sent to the chromium plating tank 48, immersed in the chromic acid solution in the tank, and the chromium plating process is performed. During this time, chromium ions in the chromic acid solution (electrolytic solution) in the tank gather on the surface of the metal pipe of the workpiece W, chromium metal is deposited on the surface, and the chromium plating layer is thin on the nickel plating layer. It is formed.

  In the plating tank for performing this chromium plating treatment, as shown in FIG. 12, the object W to be plated on the rack 25 hung on the elevating hanger 24 is composed of the I-type anode electrode 61 and the L-type anode electrode in the chromium plating tank 49. It is lowered between 62 and dipped in the chromic acid solution. In particular, the inverted U-shaped workpiece W has an upward tip 62a of the L-type anode electrode 62 placed inside thereof. The whole object to be plated W is immersed so as to maintain the same distance with respect to the I-type anode electrode 61 or the L-type anode electrode 62. For this reason, the current density of the electrolyte in the entire periphery of the inverted U-shaped workpiece W is made uniform, and a chromium plating layer can be formed on the surface of the metal pipe of the workpiece W with a uniform thickness. .

  Thereafter, the object to be plated W on the rack 25 hung on the lifting hanger 24 is subjected to post-processing, forcibly ascending and descending to drain water, and then the recovered water washing tank 52, the water washing tank 51, and hot water. A washing process is performed in the washing 53, and the plating process is terminated.

  In the above embodiment, as the draining means, the draining protrusion 31a is provided on the elevating horizontal rail 31, and a light drop impact is given to the support wheel 27 that rolls on the projection 31a, so that the workpiece W having a pipe structure remains. Although the liquid is dropped, when the lifting member 22 of the lifting / lowering tool 2 moves up and down, the descending drive of the lifting / lowering device 3 is suddenly stopped to give a light drop impact to drop the residual liquid of the workpiece W and drain the water. Can also be performed.

DESCRIPTION OF SYMBOLS 1 Rack transporter 2 Lifting tool 4 Acid neutralization tank 9 Stamp stand 15 Transport rail 21 Lifting vertical rail 22 Lifting member 23 Guide wheel 24 Lifting hanger 24a Conducting part 24b Conducting hanger 25 Rack 26 Current collector 26a Current collecting part 27 Supporting ring 28 Conductive rail 31 Elevating horizontal rail 31a Draining projection 45 Acid neutralization tank 46 Semi-bright nickel plating tank 48 Bright nickel plating tank 49 Chromium plating tank 51 Flushing tank 52 Recovered washing tank 61 I-type anode electrode 62 L-type anode electrode 62a Tip 65 Cooling current pipe

Claims (5)

By holding the object to be plated on a rack suspended on the lifting hanger of the lifting tool, and by intermittently sending the plating object together with the lifting tool to each processing tank by a rack transporter, by lifting and lowering the lifting member of the lifting tool, In automatic plating equipment that automatically immerses the object to be plated in each treatment tank and performs plating on the object to be plated,
When the rack of the lifting tool is transported or lifted by the rack transporter, an automatic draining means is provided for applying a light drop impact to the rack to drop the residual liquid from the object to be plated. Plating equipment.   2. The automatic plating apparatus according to claim 1, wherein the draining means is provided above the washing tank in front of the acid neutralization tank and above the washing tank in front of the plating tank. By holding the object to be plated on a rack suspended on the lifting hanger of the lifting tool, and by intermittently sending the plating object together with the lifting tool to each processing tank by a rack transporter, by lifting and lowering the lifting member of the lifting tool, In automatic plating equipment that automatically immerses the object to be plated in each treatment tank and performs plating on the object to be plated,
Conductive rails for energizing the rack are laid along the transport path, while a current collector that is slidable on the conductive rail is provided on the elevating hanger, and when the elevating tool is lowered, the current collector is An automatic plating apparatus characterized in that an oil-applied stamp stand is provided at a contact position.   4. The automatic plating apparatus according to claim 3, wherein the oil-applied stamp stand is disposed above the washing tank in front of the plating tank. The object to be plated is held on a rack suspended on an elevating hanger of an elevating tool, and the elevating tool is moved up and down while intermittently sending the object to be plated together with the elevating tool to each processing tank including a plating tank by a rack transporter. In automatic plating equipment that automatically immerses the object to be plated in each treatment tank by raising and lowering the member, and plating the object to be plated,
The object to be plated is formed to be bent in an inverted U shape, and an I-type anode electrode is vertically inserted near one side in the plating tank, while a tip portion is formed near the other side in the plating tank. An L-type anode electrode bent so as to face upward is inserted vertically, and a bent tip portion of the L-type anode electrode is disposed at a central portion in the plating tank, and the object to be plated in the plating tank Is immersed so that the tip of the L-shaped anode electrode is placed inside.

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