TW202046824A - El method of manufacturing flexible organic electro luminescence display - Google Patents

Abstract

Provided is a manufacturing method of a flexible organic electroluminescence (EL) display in which the quality of a resin layer peeled from a glass layer is difficult to deteriorate. The manufacturing method of the flexible organic EL display includes a cutting step of cutting out the unit laminated substrate (70) of a predetermined size from a laminated substrate (60) on which the glass layer (61) and the resin layer (62) are laminated. In the cutting process, the glass layer (61) is cut so that the cut surface (66) of the glass layer (61) of the unit laminated substrate (70) is located outside the cut surface (67) of the resin layer (62).

Description

Manufacturing method of flexible organic electroluminescent display

The invention relates to a manufacturing method of a flexible organic electroluminescent display.

Organic electroluminescence (EL) displays are equipped with light-emitting devices in which light-emitting layers, electrodes, and substrates are laminated. In a flexible organic EL display, a flexible substrate is used as the substrate. In the manufacturing process of a flexible organic EL display, a resin layer is formed on a glass layer, and a light emitting layer etc. are formed on a resin layer (for example, invention patent document 1).

[Prior Technical Literature] [Invention Patent Literature]

[Invention Patent Document 1] Japan Republished Table Patent WO2011/030716 gazette.

In the manufacturing process of the flexible organic EL display, the resin layer and the glass layer formed with the light emitting layer etc. are peeled off. The peeling method is, for example, laser liftoff. Laser for irradiated object The irradiated state may affect the quality of the peeled resin layer.

The object of the present invention is to provide a method for manufacturing a flexible organic EL display in which the quality of the resin layer peeled from the glass layer is not easily degraded.

The method for manufacturing a flexible organic EL display of the present invention includes a cutting step of cutting a unit laminate substrate of a predetermined size from a laminate substrate on which a glass layer and a resin layer are laminated, and in the cutting step, The glass layer is cut so that the cut surface of the glass layer of the unit build-up substrate is located on the outer side with respect to the cut surface of the resin layer.

In this manufacturing method, the laser system is irradiated to the resin layer without being affected by the cut surface of the glass layer. Since the resin layer is properly irradiated by the laser, the quality of the resin layer peeled from the glass layer is not easily degraded.

In an example of the manufacturing method of the flexible organic EL display, the glass layer includes a first plane on which the resin layer is formed and a second plane paired with the first plane, and in the cutting step , The glass layer is cut in such a way that the width of the glass layer becomes narrower as the width of the glass layer becomes narrower from the second plane toward the first plane.

Even in the case of cutting the glass layer with the intention of forming a cutting surface parallel to the vertical surface, the cutting surface may be inclined with respect to the vertical surface due to manufacturing errors. It is not easy to properly manage the formation of such cut surfaces. In the above-mentioned manufacturing method, the glass layer is cut in order to form an inclined cutting surface. Even considering the influence of manufacturing errors, it is not easy to form the desired method. Cutting surface inclined in different directions.

In an example of the manufacturing method of the flexible organic EL display, in the cutting step, it is formed so that the width of the glass layer becomes narrower as the width of the glass layer goes from the second plane to the first plane. The glass layer is scribed in a scribing line, and the scribed glass layer is broken.

In this manufacturing method, the cut surface of the glass layer located outside with respect to the cut surface of the resin layer can be effectively formed.

In an example of the manufacturing method of the flexible organic EL display, in the cutting step, a scribing wheel having a blade portion having an asymmetrical shape with respect to the center of rotation surface is used to scribe the glass Floor.

In this manufacturing method, the shape of the cutting surface of the glass layer inclined with respect to the vertical plane is defined by the shape of the blade portion, so that the glass layer can be easily cut.

In an example of the manufacturing method of the flexible organic EL display, the method further includes a peeling step of peeling the glass layer and the resin layer of the unit multi-layer substrate by laser liftoff .

With this manufacturing method, the resin layer and the glass layer can be effectively peeled off.

In an example of the manufacturing method of the flexible organic EL display, in the cutting step, a plurality of the laminated substrates are provided, and the plurality of laminated substrates includes a first glass layer and a first resin layer laminated 1 Multilayer substrate, and 2nd layer substrate with 2nd glass layer and 2nd resin layer Board, and cut out a unit build-up substrate from a multi-layer build-up substrate layered so that the first resin layer and the second resin layer face each other.

In this manufacturing method, even when the build-up substrate from which the unit build-up substrate is cut is a multi-layer build-up substrate, the laser is not affected by the cut surface of the glass layer and is irradiated to the resin layer. The quality of the resin layer peeled from the glass layer is not easily degraded.

With the present invention, the quality of the resin layer peeled from the glass layer is not easily degraded.

10‧‧‧Multi-layer laminated substrate

10A‧‧‧Outer peripheral surface

11‧‧‧The first build-up substrate

11A‧‧‧The first glass layer

11B‧‧‧The first resin layer

12‧‧‧The second build-up substrate

12A‧‧‧The second glass layer

12B‧‧‧The second resin layer

13, 68‧‧‧Conductive layer

14A‧‧‧The first plane of the first glass layer

14B‧‧‧The second plane of the first glass layer

15A‧‧‧The first plane of the second glass layer

15B‧‧‧The second plane of the second glass layer

16,17‧‧‧Cutting reservation department

20、70‧‧‧Unit multilayer substrate

23A‧‧‧Cutting surface of the first glass layer

23B‧‧‧The cutting surface of the first resin layer

24A‧‧‧Cut surface of the second glass layer

24B‧‧‧Cut surface of the second resin layer

30, 30A‧‧‧Laser processing device

31、31A‧‧‧Laser device

32‧‧‧Mechanical Drive System

33‧‧‧First Control Unit

34‧‧‧Laser oscillator

34A‧‧‧The first laser oscillator

34B‧‧‧Second laser oscillator

35‧‧‧Transmission optical system

36‧‧‧Base

37‧‧‧Processing table

38‧‧‧Mobile device

40‧‧‧Scribing processing device

41‧‧‧Processing device

42‧‧‧Transporting device

43‧‧‧Second Control Department

44‧‧‧A pair of rails

45‧‧‧table

46‧‧‧Straight drive

47‧‧‧Rotating device

48‧‧‧Horizontal drive

49‧‧‧Longitudinal drive

50、50A、50B‧‧‧Scribing wheel

51‧‧‧Main body

52‧‧‧Blade

52A‧‧‧The first slope

52B‧‧‧Second slope

53‧‧‧Insert hole

60‧‧‧Laminate substrate

61‧‧‧Glass layer

62‧‧‧Resin layer

63A‧‧‧First plane

63B‧‧‧Second plane

64A‧‧‧Cutting scheduled part of glass layer

64B‧‧‧Cutting scheduled part of resin layer

66‧‧‧Cutting surface of glass layer

67‧‧‧Cutting surface of resin layer

80‧‧‧Suction mechanism

C‧‧‧Central axis

DT, T‧‧‧Thickness direction

L1‧‧‧Line segment

LS‧‧‧laser processing

RC‧‧‧Rotation center surface

SC‧‧‧Scribing

SD‧‧‧Adhesive layer

W‧‧‧Width direction

WD‧‧‧The width of the glass layer

WD1‧‧‧The width of the first glass layer

WD2‧‧‧The width of the second glass layer

X‧‧‧X axis direction

Y‧‧‧Y axis direction

Z‧‧‧Z axis direction

θ1‧‧‧The first angle

θ 2 ‧‧‧The second angle

FIG. 1 is a cross-sectional view of a multilayer build-up substrate related to the manufacturing method of Embodiment 1. FIG.

Fig. 2 is a plan view showing the multilayer build-up substrate of Fig. 1.

Fig. 3 is a schematic diagram showing the structure of the laser processing device.

Fig. 4 is a schematic diagram showing the structure of the scribing processing device.

Figure 5 shows a cross-sectional view of the scoring wheel.

FIG. 6 is a flowchart showing the manufacturing method of Embodiment 1. FIG.

Figure 7 is a diagram showing the relationship between the processing sequence and the processing type of the subsequent processing steps.

Fig. 8 is a schematic diagram showing the structure of the laser processing device.

Fig. 9 is a cross-sectional view showing an example of a unit multilayer substrate.

Fig. 10 is a diagram showing an example of the peeling step.

FIG. 11 is a cross-sectional view of a multilayer build-up substrate related to the manufacturing method of the second embodiment.

FIG. 12 is a flowchart showing the manufacturing method of Embodiment 2.

Fig. 13 is a diagram showing the relationship between the processing sequence of the cutting step and the processing type.

Fig. 14 is a diagram showing an example of the peeling step.

FIG. 15 is a cross-sectional view showing a multilayer build-up substrate related to a manufacturing method of a modification example.

(Implementation aspect 1)

The method for manufacturing a flexible organic EL display will be described with reference to the drawings. Flexible organic EL displays are used in stationary devices and portable devices. Examples of stationary devices are personal computers and televisions. Examples of portable devices are handheld terminals, wearable computers, and notebook personal computers. Examples of handheld terminals are smart phones, tablets, and portable game consoles. Examples of portable computers are head-mounted displays and smart watches.

The flexible organic EL display has a light-emitting layer, electrodes, and a light-emitting device laminated with a substrate, a first protective film covering the light-emitting device from one side, and a second protective film covering the light-emitting device from the other side. For each of the first protective film and the second protective film, PET (polyethylene terephthalate; polyethylene terephthalate) is used. In addition, one of the first protective film or the second protective film may be omitted. In the manufacturing step of the light-emitting device, a plurality of light-emitting devices are manufactured from a single multilayer build-up substrate 10 shown in FIG. 1.

The multilayer build-up substrate 10 is manufactured in the middle of the manufacturing of the flexible organic EL display. The multilayer laminated substrate 10 has a first laminated substrate 11 on which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 on which a second glass layer 12A and a second resin layer 12B are laminated. The multilayer build-up substrate 10 is formed by stacking a first build-up substrate 11 and a second build-up substrate 12 such that the first resin layer 11B and the second resin layer 12B face each other. The multilayer build-up substrate 10 further has a conductive layer 13. The conductive layer 13 is formed, for example, on the first resin layer 11B of the first build-up substrate 11. The conductive layer 13 is sandwiched between the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed with components for electronic devices such as OLED (Organic Light Emitting Diode) and TFT (Thin Film Transistor). The first resin layer 11B, the conductive layer 13 and the second resin layer 12B constitute a light emitting device.

The first glass layer 11A of the first build-up substrate 11 and the second glass layer 12A of the second build-up substrate 12 use the same material and have the same size. Although the composition of the first glass layer 11A and the second glass layer 12A is not particularly limited, for example, glasses of various compositions such as alkali metal oxide-containing glass or alkali-free glass can be used. An example of alkali metal oxide-containing glass is soda-lime glass. In this embodiment, the first glass layer 11A and the second glass layer 12A use alkali-free glass. Although the thickness of each of the first glass layer 11A and the second glass layer 12A is not particularly limited, it is preferably about 0.5 mm, for example. The first glass layer 11A has a first flat surface 14A on which the first resin layer 11B is formed, and a second flat surface 14B paired with the first flat surface 14A. The second glass layer 12A has a first flat surface 15A on which a second resin layer 12B is formed, and a second flat surface 15B paired with the first flat surface 15A.

The first resin layer 11B of the first build-up substrate 11 and the second resin layer 12B of the second build-up substrate 12 use the same material and have the same size. Although the first resin layer 11B and the second tree are not particularly limited The composition of the lipid layer 12B, but for example, polyimide (PI) can be used. Although the thickness of each of the first resin layer 11B and the second resin layer 12B is not particularly limited, it is preferably in the range of, for example, 10 μm or more and 30 μm or less.

FIG. 2 is a plan view showing the multilayer build-up substrate 10.

The multi-layer build-up substrate 10 is cut into a lattice shape by cutting along the planned cutting portions 16 and 17 indicated by the broken line in FIG. 2 to form the unit build-up substrate 20. The size of the unit build-up substrate 20 in plan view corresponds to the size of the light emitting device determined in advance in plan view.

For cutting the multilayer build-up substrate 10, at least one of a laser processing device and a scribing processing device is used. FIG. 3 shows an example of the configuration of the laser processing device, and FIG. 4 shows an example of the configuration of the scribing processing device. In FIGS. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in FIGS. 3 and 4. In addition, in cutting the first build-up substrate 11 and the second build-up substrate 12, a scribing processing device (not shown in the figure) may be used.

As shown in FIG. 3, the laser processing device 30 is provided with a laser device 31 for cutting the multilayer build-up substrate 10, a mechanical drive system 32 for moving the multilayer build-up substrate 10 relative to the laser device 31, and a control laser The first control unit 33 of the injection device 31 and the mechanical drive system 32.

The laser device 31 can process at least one of the first resin layer 11B and the second resin layer 12B, and the first glass layer 11A and the second glass layer 12A of the multilayer build-up substrate 10. The laser device 31 has a laser oscillator 34 for irradiating laser light to the multilayer laminate substrate 10 and a transmission optical system 35 for transmitting the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (ultra violet; ultraviolet) laser or a CO ₂ (carbon dioxide) laser. When the laser processing device 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing device 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is a CO ₂ laser or a UV laser. The transmission optical system 35 includes, for example, a condensing lens, a plurality of mirrors, a prism, a beam expander, and the like. In addition, the transmission optical system 35 has, for example, an X-axis direction moving mechanism for moving a laser irradiation head with a built-in laser oscillator 34 in the X-axis direction. The laser light irradiated by the laser oscillator 34 is irradiated toward the multilayer build-up substrate 10 via the transmission optical system 35.

The mechanical drive system 32 is arranged opposite to the laser device 31 in the Z-axis direction. The mechanical drive system 32 includes a base 36, a processing table 37 and a moving device 38. The multi-layer build-up substrate 10 is placed on the processing table 37. The moving device 38 moves the processing table 37 relative to the base 36 in the horizontal direction (X-axis direction and Y-axis direction). The moving device 38 has a known mechanism such as a guide rail, a moving table, and a motor.

The first control unit 33 has an arithmetic processing device that executes a control program set in advance. The arithmetic processing device has, for example, a CPU (Central Processing Unit; central processing unit) or an MPU (Micro Processing Unit; microprocessor). The first control unit 33 may have one or more microcomputers. The first control unit 33 further has a memory unit. Information used in various control programs and various control processes is stored in the memory. The memory unit has, for example, a nonvolatile memory (nonvolatile memory) and a volatile memory (volatile memory). The first control section 33 series It can be installed in the laser device 31, in the mechanical drive system 32, or in the laser device 31 and the mechanical drive system 32, respectively. When the first control unit 33 is respectively provided in the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be arbitrarily set.

As shown in FIG. 4, the scribing processing device 40 is formed on the multilayer substrate 10 by the relative movement of the scribing wheel 50 and the multilayer substrate 10 in the X-axis direction and the Y-axis direction. Scribe lanes in the X-axis and Y-axis directions. The scribing processing device 40 includes a processing device 41 for processing the multilayer build-up substrate 10, a conveying device 42 for conveying the multilayer build-up substrate 10, and a second control unit 43 that controls the processing device 41 and the conveying device 42.

The conveying device 42 includes a pair of rails 44, a table 45, a straight driving device 46, a rotating device 47 and the like. The pair of rails 44 extend along the Y-axis direction. In the scribing device 40 of FIG. 4, a pair of rails 44 are arranged on the base of the scribing device 40 (not shown), and the table 45 is moved back and forth along the pair of rails 44 by the straight driving device 46 Move, and the table 45 is rotated around the central axis C by the rotating device 47. The table 45 has a multilayer build-up substrate 10 placed thereon. An example of the straight driving device 46 has a feed screw device. The rotating device 47 has a motor as a driving source.

The processing device 41 includes a transverse drive device 48, a longitudinal drive device 49, a scoring wheel 50 and the like. The scoring wheel 50 is installed in a holder unit for holding the scoring wheel 50. The support unit is installed on the scoring head to hold the support unit. The scribing head is moved in the X-axis direction by the lateral drive device 48 and moved in the Z-axis direction by the longitudinal drive device 49. The scribing wheel 50 moves in the X-axis direction to form a scribing track along the X-axis direction on the multilayer build-up substrate 10.

The scoring wheel 50 is rotatably supported by a pin (not shown) installed in the supporting unit. Examples of materials constituting the scoring wheel 50 are sintered diamond, superhard metal, single crystal diamond, and polycrystalline diamond. As the scoring wheel 50, either the scoring wheel 50A in the shape shown in FIG. 5(a) and the scoring wheel 50B in the shape shown in FIG. 5(b) can be used.

The scoring wheel 50A shown in FIG. 5(a) includes a disc-shaped body portion 51 and a V-shaped cross-sectional blade portion 52. The V-shaped cross-section refers to cutting the section of the scoring wheel 50A on a plane along the thickness direction of the scoring wheel 50A (hereinafter referred to as the "thickness direction DT"), which tapers toward the outer periphery of the scoring wheel 50A状(tapered shape).

An insertion hole 53 penetrating the main body 51 in the thickness direction DT is formed in the center of the main body 51. The pin element is inserted into the insertion hole 53.

The blade portion 52 has a first inclined surface 52A and a second inclined surface 52B that form two inclined surfaces having a V-shaped cross section. The first inclined surface 52A and the second inclined surface 52B are symmetrical with respect to the rotation center surface RC perpendicular to the thickness direction DT in the center of the thickness direction DT of the scoring wheel 50A.

Comparing the scoring wheel 50B and the scoring wheel 50A shown in FIG. 5(b), the shapes of the two attached to the blade portion 52 are different. The first inclined surface 52A and the second inclined surface 52B of the blade portion 52 of the scoring wheel 50B are asymmetric with respect to the rotation center surface RC. In more detail, in the cross section of the scoring wheel 50B along the thickness direction, a line segment L1 parallel to the radial direction of the scoring wheel 50B is formed by the first inclined surface 52A The first angle θ1 is greater than the second angle θ2 formed by the line segment L1 and the second inclined surface 52B. In addition, as long as the position of the front end of the blade portion 52 in the direction of the line segment L1 is shifted relative to the rotation center surface RC, the first angle θ1 may be equal to the second angle θ2.

The second control unit 43 has an arithmetic processing device that executes a control program set in advance. The arithmetic processing device has, for example, a CPU or MPU. The second control unit 43 may have one or more microcomputers. The second control unit 43 further has a memory unit. Information used in various control programs and various control processes is stored in the memory. The memory unit has, for example, non-volatile memory and volatile memory. The second control unit 43 may be provided in the processing device 41, may be provided in the conveying device 42, or may be provided in the processing device 41 and the conveying device 42 respectively. When the second control unit 43 is provided in the processing device 41 and the conveying device 42, the arrangement position of the second control unit 43 can be arbitrarily set.

[Manufacturing Method of Flexible Organic EL Display]

Next, the manufacturing method of the flexible organic EL display will be described in detail. FIG. 6 shows an example of the steps of the manufacturing method of the flexible organic EL display.

In the method of manufacturing a flexible organic EL display, the first build-up substrate 11 and the second build-up substrate 12 are bonded to produce the multilayer build-up substrate 10, and then the multilayer build-up substrate 10 is cut into a predetermined size to manufacture the unit build-up substrate 20 . Next, by removing the first glass layer 11A and the second glass layer 12A from the unit build-up substrate 20, a light-emitting device is manufactured. Next, the first protective film and the second protective film are bonded to the first resin layer 11B and the second resin layer 12B. Thus, a flexible organic EL display is manufactured.

As shown in FIG. 6, the manufacturing method of the flexible organic EL display is divided into a front step and a back step. The front step is a step before the step of laminating the first build-up substrate 11 and the second build-up substrate 12, and the latter step It is a step after the step of laminating the first build-up substrate 11 and the second build-up substrate 12. The front-end step system includes the front-end lamination step. The first-stage build-up step is a step of manufacturing the first build-up substrate 11 and the second build-up substrate 12. The latter step includes the latter lamination step, the latter processing step and the peeling step. The subsequent build-up step is a step of stacking the first build-up substrate 11 and the second build-up substrate 12 to manufacture the multilayer build-up substrate 10. The subsequent processing step is a step of cutting the multilayer build-up substrate 10 along the predetermined cutting portions 16 and 17 of the multilayer build-up substrate 10, that is, the step of manufacturing the unit build-up substrate 20 by cutting the multilayer build-up substrate 10 into a predetermined size. The peeling step is a step of peeling the first glass layer 11A and the first resin layer 11B, and the second glass layer 12A and the second resin layer 12B by laser lift off (LLO). The following is a detailed description of each step.

In the previous lamination step, the first resin layer 11B is formed on the entire first plane 14A of the first glass layer 11A to produce the first build-up substrate 11, and the second glass layer 12A is formed on the first plane 15A. The second resin layer 12B is formed as a whole to manufacture the second build-up substrate 12. The method of forming the first resin layer 11B on the first plane 14A of the first glass layer 11A, and the method of forming the second resin layer 12B on the first plane 15A of the second glass layer 12A can be selected separately. The method of coating the layer on the glass layer, or the method of laminating the resin layer on the glass layer through the adhesive layer. Furthermore, as a method for fixing the resin layer on the glass layer, a heat hardening treatment or a heating and pressure treatment using a press method can be selected.

In the subsequent lamination step, the first build-up substrate 11 that has not been cut into a predetermined size and the uncut The second build-up substrate 12 is cut into a predetermined size. In one example, the first build-up substrate 11 and the second build-up substrate 12 are bonded via, for example, an adhesive layer SD. Thus, the multilayer build-up substrate 10 is manufactured.

The post-processing step includes a post-cutting step of separately cutting the first build-up substrate 11 and the second build-up substrate 12. As shown in FIGS. 7(a) and 7(b), in the subsequent cutting step after the subsequent processing step, the order and processing type of cutting the multilayer build-up substrate 10 can be arbitrarily selected. The table of FIG. 7(a) shows an example of the relationship between the processing order of each layer and the processing type when the first build-up substrate 11 and the second build-up substrate 12 are sequentially cut. FIG. 7(b) shows an example of the relationship between the processing order of each layer and the processing type when the second build-up substrate 12 and the first build-up substrate 11 are sequentially cut. 7(a) and 7(b), when the first resin layer 11B is cut or scored before the first glass layer 11A, and the first resin layer 11B is cut or scored before the second glass layer 12A In the case of 2 resin layer 12B, it is impossible to use the scribing processing device 40 for processing the first resin layer 11B and the second resin layer 12B. In the case where the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are cut by laser, for example, the following first method and second method can be selected. The first method is to use a laser to scribe the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B, and then break the first glass layer 11A, the second glass layer 12A, and the second glass layer 12A. 1 resin layer 11B and second resin layer 12B. The second method is to cut the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B by laser cutting. In addition, in the post-processing step and post-cutting step of the first step example, the cutting can be arbitrarily selected for the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B Any one of the layers and the layers broken after scribing.

Preferably, in the case of using a laser to cut the first resin layer 11B or the second resin layer 12B, The output of the laser irradiated to the first resin layer 11B or the second resin layer 12B is set to be less than a predetermined output that suppresses the generation of gas above a predetermined temperature, and is applied to the first resin layer 11B or the second resin layer. 12B irradiates the laser multiple times. Since the gas system generated by the laser during the processing of the first resin layer 11B or the second resin layer 12B is cooled with the passage of time, the increase in the gas volume inside the multilayer build-up substrate 10 can be suppressed.

After scribing the first glass layer 11A by the laser or the scribing wheel 50, in the case of cutting the second resin layer 12B or scribing the second resin layer 12B through the laser, it is preferably from the second The glass layer 12A side is irradiated with laser. In the case of cutting the second resin layer 12B through a laser, after the second resin layer 12B is cut, the first resin layer 11B may be cut or the first resin layer 11B may be cut by the laser in the same irradiation direction . After scribing the second glass layer 12A by the laser or the scribing wheel 50, in the case of cutting the first resin layer 11B or scribing the first resin layer 11B through the laser, it is preferably from the first The glass layer 11A side is irradiated with laser. In the case of cutting the first resin layer 11B through a laser, after the first resin layer 11B is cut, the second resin layer 12B or the second resin layer 12B can also be cut by laser in the same irradiation direction. .

In the case of cutting the glass layer and resin layer separately through laser or scribing the glass layer and resin layer separately, the laser processing device 30A shown in FIG. 8 is used instead of the laser processing device shown in FIG. 3 30. Comparing the laser processing device 30 and the laser processing device 30A, the two are different in the configuration of the laser device. The following describes different configurations of the laser processing device 30A.

The laser device 31A of the laser processing device 30A has a first laser oscillator 34A and a second laser oscillator 34B. The first laser oscillator 34A is a UV laser, and the second laser oscillator 34B is a CO ₂ laser. The laser light irradiated by the first laser oscillator 34A and the laser light irradiated by the second laser oscillator 34B are irradiated to the multilayer build-up substrate 10 via the transmission optical system 35. In addition, the transmission optical system 35 may also be provided with a transmission optical system corresponding to the first laser oscillator 34A and a transmission optical system corresponding to the second laser oscillator 34B.

The first control unit 33 selects the first laser oscillator 34A and the second laser oscillator 34B according to the type (glass layer or resin layer) of the processing object for the multilayer build-up substrate 10. For example, the first control unit 33 sets the processing sequence of the glass layer and the resin layer as the type of processing target through a control program stored in advance, and selects the first laser oscillator 34A and the second laser according to the set processing sequence. Radio oscillator 34B.

FIG. 9 shows an example of the unit multi-layer substrate 20 manufactured in the subsequent cutting step. The unit multilayer substrate 20 shown in FIG. 9 is manufactured by scribing the first glass layer 11A and the second glass layer 12A through the scoring wheel 50B shown in FIG. 5(b) and then breaking them. In the cross section of the unit multi-layer substrate 20 shown in FIG. 9, the direction orthogonal to the thickness direction T of the unit multi-layer substrate 20 is defined as the width direction W. In the cross section of the unit build-up substrate 20, the side facing the center in the width direction W of the unit build-up substrate 20 is taken as the inside, and the direction facing the end in the width direction W is taken as the outside.

In the subsequent cutting step, the first glass layer 11A is cut so that the cut surface 23A of the first glass layer 11A of the unit build-up substrate 20 is positioned outside with respect to the cut surface 23B of the first resin layer 11B. The cut surface 24A of the second glass layer 12A of the unit build-up substrate 20 is opposed to the second resin layer 12B The second glass layer 12A is cut so that the cutting surface 24B is located outside. In more detail, the first glass layer 11A is cut in such a manner that the width WD1 forming the first glass layer 11A shows a narrowing cut surface 23A from the second plane 14B of the first glass layer 11A toward the first plane 14A. . The second glass layer 12A is cut so that the width WD2 forming the second glass layer 12A shows a narrowing cut surface 24A from the second flat surface 15B of the second glass layer 12A toward the first flat surface 15A. Since the first glass layer 11A and the second glass layer 12A are scored through the scoring wheel 50B, the scoring processing device 40 is configured to form the width WD1 of the first glass layer 11A in the cross-sectional view shown in FIG. The second plane 14B of the first glass layer 11A scribes the first glass layer 11A in such a manner that a scribe lane (crack) becomes narrower toward the first plane 14A. Then, the scored first glass layer 11A is broken. The scribing processing device 40 is such that in the cross-sectional view shown in FIG. 9, the width WD2 of the second glass layer 12A is formed as the scribing becomes narrower from the second plane 15B of the second glass layer 12A to the first plane 15A. The second glass layer 12A is scored in a way (crack). Then, the scored second glass layer 12A is broken off. In addition, the scoring wheel 50B may be replaced with a laser through the laser processing device 30 to form the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A shown in FIG. 9.

In the peeling step, a laser peeling device (not shown) is used. In this embodiment, a UV laser is used as the laser stripping device. As shown in FIG. 10(a), the first resin layer 11B is peeled from the first resin layer 11B and the first glass layer 11A by irradiating the laser from the first glass layer 11A side to the first resin layer 11B. When the first resin layer 11B and the first glass layer 11A are peeled off, the laser is irradiated so as to be orthogonal to the second plane 14B of the first glass layer 11A. Next, as shown in FIG. 10(b), the second resin layer 12B and the second glass layer 12A are separated by irradiating the second resin layer 12B with a laser from the second glass layer 12A side. In the case of peeling off the second resin layer 12B and the second glass layer 12A, the laser system is arranged on the second plane orthogonal to the second glass layer 12A. Illuminated in the manner of surface 15B. In addition, the order of peeling the first glass layer 11A and the second glass layer 12A can be arbitrarily changed. For example, after peeling the second resin layer 12B and the second glass layer 12A, the first resin layer 11B and the first glass layer 11A may be peeled.

After removing the first glass layer 11A and the second glass layer 12A from the multilayer build-up substrate 10 (see FIG. 10(c)), the first protective film is bonded to cover the first resin layer 11B to cover the second resin The second protective film is bonded to the layer 12B, thereby manufacturing a flexible organic EL display.

In the unit build-up substrate 20 shown in FIG. 9, the second flat surface 14B on which the first glass layer 11A is formed is formed up to the end edge in the width direction W of the first resin layer 11B, and up to the width direction of the second resin layer 12B The second plane 15B in which the second glass layer 12A is formed up to the end edge of W is formed. That is, in the thickness direction T, the end edge in the width direction W of the first resin layer 11B does not overlap with the cut surface 23A of the first glass layer 11A, and the end edge in the width direction W of the second resin layer 12B does not overlap with the first glass layer 11A. The cut surfaces 24A of the two glass layers 12A overlap. For this reason, when the laser peeling device irradiates the end edge in the width direction W of the first resin layer 11B and the end edge in the width direction W of the second resin layer 12B with a laser, the laser system does not penetrate the first glass The cut surface 23A of the layer 11A and the cut surface 24A of the second glass layer 12A.

The effect of this embodiment is explained.

(1-1) The cut surface 23A of the first glass layer 11A of the unit build-up substrate 20 is located outside the width direction W than the cut surface 23B of the first resin layer 11B, and the cut surface 24A of the second glass layer 12A is relatively The cut surface 24B of the second resin layer 12B is located further outside the width direction W. By this manufacturer In this way, the laser system irradiates the first resin layer 11B and the second resin layer 12B without being affected by the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A. Since the laser appropriately irradiates the first resin layer 11B and the second resin layer 12B, it is not easy to reduce the difference between the first resin layer 11B peeled from the first glass layer 11A and the second resin layer 12B peeled from the second glass layer 12A. The respective quality.

(1-2) In the subsequent cutting step, the first glass layer is cut in such a way that the width WD1 of the first glass layer 11A is formed as a narrowing cutting surface 23A from the second plane 14B to the first plane 14A 11A. The second glass layer 12A is cut in such a manner that the width WD2 forming the second glass layer 12A presents a narrowing cut surface 24A from the second plane 15B toward the first plane 15A. In this manufacturing method, since the first glass layer 11A and the second glass layer 12A are cut in order to form the inclined cutting surface 23A and the cutting surface 24A, it is not easy to form different directions from the desired direction even if the influence of manufacturing errors is considered. The cutting surface with inclined direction.

(1-3) In the subsequent cutting step, the width WD1 of the first glass layer 11A is formed to show a narrowing scribe lane (crack) as the width WD1 of the first glass layer 11A moves from the second plane 14B to the first plane 14A The first glass layer 11A is scored, and the scored first glass layer 11A is broken. The second glass layer 12A is scored in such a manner that the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B toward the first plane 15A, and the second glass layer 12A is broken. The second glass layer 12A. In this manufacturing method, the cutting surface 23A of the first glass layer 11A located outside with respect to the cutting surface 23B of the first resin layer 11B can be effectively formed, and the cutting surface of the second resin layer 12B can be effectively formed 24B is the cut surface 24A of the second glass layer 12A located outside.

(1-4) In the subsequent cutting step, a scoring wheel 50B having a blade portion 52 that is asymmetrical to the rotation center surface RC shown in FIG. 5(b) is used to score the first glass layer 11A and the second glass layer 12A. In this manufacturing method, the shape of the cut surface 23A of the first glass layer 11A inclined with respect to the second plane 14B and the shape of the cut surface 24A of the second glass layer 12A inclined with respect to the second plane 15B are based on the blade The shape of the portion 52 is defined, and the first glass layer 11A and the second glass layer 12A can be easily cut.

(1-5) It further includes a peeling step of peeling the first glass layer 11A and the first resin layer 11B by laser peeling, and peeling the second glass layer 12A and the second resin layer 12B. In this manufacturing method, the first glass layer 11A and the first resin layer 11B can be peeled off efficiently, and the second glass layer 12A and the second resin layer 12B can be peeled off efficiently.

(1-6) Manufacturing method of flexible organic EL display In the subsequent step after the step of laminating the first build-up substrate 11 and the second build-up substrate 12, the multilayer build-up substrate 10 is cut into a predetermined size. In this manufacturing method, since the cutting is performed in the state where the multilayer build-up substrate 10 in which the first build-up substrate 11 and the second build-up substrate 12 are stacked, the stacking operation is simplified. Therefore, it is not easy to reduce the manufacturing efficiency of the flexible organic EL display.

(1-7) In the subsequent cutting step after the subsequent processing step, the first glass layer 11A and the second glass layer 12A are first cut, and then the first resin layer 11B and the second resin layer 12B are cut. In this manufacturing method, since the first glass layer 11A and the second glass layer 12A are cut first, in the step of cutting the first resin layer 11B and the second resin layer 12B, the first resin layer can be cut separately 11B is not the first glass layer 11A The covered part and the part of the second resin layer 12B not covered by the second glass layer 12A. For example, in the case of cutting the first resin layer 11B and the second resin layer 12B by laser, the gas generated by irradiating the first resin layer 11B and the second resin layer 12B from the first glass layer The cut portion of 11A and the cut portion of the second glass layer 12A are discharged. This reduces the risk of gas affecting the quality of the first resin layer 11B and the second resin layer 12B.

(1-8) In the subsequent cutting step, the first resin layer 11B and the second resin layer 12B are cut by laser. Therefore, compared to cutting using, for example, the scoring wheel 50, the first resin layer 11B and the second resin layer 12B generate less heat during cutting, and the quality of the first resin layer 11B and the second resin layer 12B is not easily reduced .

(1-9) In the subsequent cutting step, the laser output of the laser irradiated once to the first resin layer 11B and the second resin layer 12B is set to be less than the predetermined value to suppress the generation of gas above a predetermined temperature Output. With this manufacturing method, when the first resin layer 11B and the second resin layer 12B are irradiated with a laser, high-temperature gas is not easily generated, and the influence of the gas is reduced to reduce the first glass layer 11A and the second glass layer. 12A, the risk of the quality of the first resin layer 11B and the second resin layer 12B.

(Implementation Mode 2)

The method for manufacturing the flexible organic EL display of Embodiment 2 will be described with reference to FIGS. 11 to 14. Compared with the first embodiment, in this embodiment, the manufacturing of the multilayer substrate 10 is replaced with the manufacturing of the multilayer substrate 60 is different.

As shown in FIG. 11, the laminated substrate 60 is composed of a laminated glass layer 61 and a resin layer 62. glass The layer 61 has a first flat surface 63A on which the resin layer 62 is formed, and a second flat surface 63B paired with the first flat surface 63A. The multilayer substrate 60 further has a conductive layer 68. The conductive layer 68 is the same as the conductive layer 13 of the first embodiment. The resin layer 62 and the conductive layer 68 constitute a light emitting device. The composition of the glass layer 61 is the same as that of the first glass layer 11A or the second glass layer 12A of the first embodiment, for example. The composition of the resin layer 62 is the same as the composition of the first resin layer 11B or the second resin layer 12B of Embodiment 1, for example.

As shown in FIG. 12, the manufacturing method of a flexible organic EL display includes a layering step, a cutting step, and a peeling step. The laminating step is a step of laminating the resin layer 62 on the glass layer 61 to manufacture the laminated substrate 60. The cutting step is a step of cutting a unit build-up substrate 70 of a predetermined size from the build-up substrate 60 (refer to FIG. 14(a)). The peeling step is a step of peeling the resin layer 62 and the glass layer 61 of the unit multi-layer substrate 70 by laser peeling. The following is a detailed description of each step.

In the lamination step, the resin layer 62 is formed on the entire first plane 63A of the glass layer 61 to produce the multilayer substrate 60. The method of forming the resin layer 62 on the first plane 63A of the glass layer 61 can be a method of coating the resin layer 62 on the glass layer 61, or by laminating the resin layer 62 on the glass layer 61 through an adhesive layer method. Furthermore, as a method of fixing the resin layer 62 on the glass layer 61, a heat hardening treatment or a heating and pressure treatment using a pressing method can be selected.

In the cutting step, the glass layer 61 and the resin layer 62 are respectively cut along the predetermined cutting portion 64A of the glass layer 61 and the predetermined cutting portion 64B of the resin layer 62 shown in FIG. 11. The planned cutting portions 64A and 64B are cutting portions for cutting the multilayer substrate 60 to a predetermined size. As shown in FIG. 13, in the cutting step, the order of cutting the multilayer substrate 60 and the type of processing can be arbitrarily selected. Multilayer substrate 60 series available The resin layer 62 and the glass layer 61 are cut in sequence, and the glass layer 61 and the resin layer 62 can also be cut in sequence. Either the laser processing device 30 and the scribing processing device 40 can also be used to cut the glass layer 61 and the resin layer 62. Furthermore, it may be broken after being scribed by the laser processing device 30 or the scribing processing device 40, or it may be cut by the laser processing device 30 to cut the glass layer 61 and the resin layer 62.

In the cutting step, the laser processing device shown in FIG. 8 can be used when scribing or cutting the predetermined cutting portion 64A of the glass layer 61 and the predetermined cutting portion 64B of the resin layer 62 through a laser. 30A replaces the laser processing device 30 shown in FIG. 3.

FIG. 14(a) shows a unit laminate substrate 70 as a predetermined size laminate substrate 60 when the glass layer 61 is scored and broken by the scoring wheel 50B shown in FIG. 5(b) in the cutting step. In the cross section of the unit build-up substrate 70 shown in FIG. 14(a), the direction orthogonal to the thickness direction T of the unit build-up substrate 70 is defined as the width direction W. In the cross section of the unit build-up substrate 70, the side facing the center in the width direction W of the unit build-up substrate 70 is taken as the inside, and the direction facing the end in the width direction W is taken as the outside.

In the cutting step, the cutting surface 66 of the glass layer 61 of the unit build-up substrate 70 is positioned outside the cutting surface 67 of the resin layer 62 to cut the predetermined cutting portion 64A of the glass layer 61 (see FIG. 11) . In more detail, in the cutting step, the glass layer 61 is cut in such a manner that the width WD of the glass layer 61 forms a narrowing cutting surface 66 from the second plane 63B of the glass layer 61 toward the first plane 63A. The cut plan part 64A. Since the glass layer 61 is scored through the scoring wheel 50B, in the cutting step, the scoring processing device 40 sets the width WD of the glass layer 61 formed in the cross-sectional view of FIG. 14(a) with The planned cutting portion 64A of the glass layer 61 is scored in a manner that the second plane 63B of the glass layer 61 is facing the first plane 63A with a narrowing scribe lane (crack). Then, the predetermined cut portion 64A of the scored glass layer 61 is broken off. In addition, the scoring wheel 50B may be replaced with a laser through the laser processing device 30 to form the cut surface 66 of the glass layer 61 shown in FIG. 14(a).

As shown in Figure 14(a), the same laser peeling device (not shown) as in the first embodiment is used in the peeling step, and the resin layer 62 is peeled off by irradiating the laser from the glass layer 61 to the resin layer 62 The glass layer 61.

After removing the glass layer 61 (see FIG. 14(b)) from the multilayer build-up substrate 10, the first protective film is bonded to cover one side of the thickness direction T of the resin layer 62 to cover the thickness direction T of the resin layer 62 On the other side, the second protective film is joined to manufacture a flexible organic EL display.

In the unit build-up substrate 70 shown in FIG. 14( a ), the second plane 63B of the glass layer 61 is formed up to the end edge in the width direction W of the resin layer 62. That is, in the thickness direction T, the end edge in the width direction W of the resin layer 62 does not overlap with the cut surface 66 of the glass layer 61. Therefore, when the laser peeling device irradiates the end edge in the width direction W of the resin layer 62 with a laser, the laser system does not penetrate the cut surface 66 of the glass layer 61.

The effect of this embodiment is explained.

(2-1) The cut surface 66 of the glass layer 61 of the unit build-up substrate 70 is located outside the width direction W than the cut surface 67 of the resin layer 62. With this manufacturing method, the laser system of the laser stripping device is not The resin layer 62 is irradiated under the influence of the cut surface 66 of the glass layer 61 and the cut surface 67 of the glass layer 61. Since the laser of the laser peeling device irradiates the resin layer 62 appropriately, the quality of the resin layer 62 peeled from the glass layer 61 is not easily reduced.

(2-2) In the cutting step, the glass layer 61 is cut in such a manner that the width WD of the glass layer 61 forms a narrowing cutting surface 66 from the second plane 63B to the first plane 63A. In this manufacturing method, since the glass layer 61 is cut in order to form the inclined cutting surface 66, it is not easy to form a cutting surface inclined in a direction different from the desired direction even if the influence of manufacturing errors is considered.

(2-3) In the cutting step, the glass is scored in such a way that the width WD of the glass layer 61 is formed to show a narrower scribe lane (crack) from the second plane 63B to the first plane 63A Layer 61, and break the scored glass layer 61. In this manufacturing method, the cut surface 66 of the glass layer 61 located on the outside with respect to the cut surface 67 of the resin layer 62 can be efficiently formed.

(2-4) The scoring wheel 50B having the blade portion 52 having an asymmetrical shape with respect to the rotation center surface RC shown in FIG. 5(b) is used to score the glass layer 61. In this manufacturing method, the shape of the cutting surface 66 of the glass layer 61 inclined with respect to the second plane 63B is defined by the shape of the blade portion 52, and the glass layer 61 can be easily cut.

(2-5) The manufacturing method of the flexible organic EL display further includes a peeling step of peeling the glass layer 61 and the resin layer 62 by laser peeling. In this manufacturing method, the glass layer 61 and the resin layer 62 can be peeled off efficiently.

(Modification)

The foregoing series of embodiments give examples of the aspect of the manufacturing method of the flexible organic EL display of the present invention, and are not intended to limit the aspect. Regarding the manufacturing method of the flexible organic EL display of the present invention, a different aspect from the aspect illustrated in each embodiment may be mentioned. An example of this is an aspect in which a part of the configuration of each embodiment is replaced, changed or omitted, or an aspect in which a new configuration is added to each embodiment. In the following modified examples, the parts that are common to the aspects of the respective embodiments are given the same reference numerals as the respective embodiments, and the description thereof is omitted.

In the subsequent cutting step of implementation aspect 1, a suction mechanism 80 may also be provided for cutting the first resin layer 11B and the second resin layer 12B, suction is accompanied by the first resin layer 11B and the second resin layer 12B are irradiated with gas generated by the laser. As shown in FIG. 15, the suction mechanism 80 is configured to suck gas through the outer peripheral surface 10A of the multilayer build-up substrate 10. An example of the suction mechanism 80 is to have a suction fan. The suction mechanism 80 sucks air in the outer peripheral surface 10A of the multilayer build-up substrate 10 by the driving of an air extractor. In this case, the gas system generated in the multilayer build-up substrate 10 is discharged to the outside of the multilayer build-up substrate 10 via the outer peripheral surface 10A.

In the first embodiment, in the case of cutting the first resin layer 11B and the second resin layer 12B by irradiating the laser multiple times, the laser can also be set so that it does not reach the predetermined output. The first resin layer 11B and the second resin layer 12B are irradiated with a laser multiple times at regular intervals, thereby cutting the first resin layer 11B and the second resin layer 12B. In this manufacturing method, one of the first resin layer 11B and the second resin layer 12B is irradiated with a laser, and the laser irradiation is temporarily interrupted. After a while, one of the first resin layer 11B and the second resin layer 12B is irradiated with a laser, and the irradiation of the lasers is repeated a plurality of times and the irradiation is temporarily interrupted. The same applies to the case where the other of the first resin layer 11B and the second resin layer 12B is irradiated with laser. The gas system generated by irradiating the first resin layer 11B and the second resin layer 12B with the laser is cooled when the irradiation of the laser is temporarily interrupted, so that the influence of the gas is reduced and the first glass layer 11A and the second glass layer are reduced. 12A, the risk of the quality of the first resin layer 11B and the second resin layer 12B.

In the first embodiment, the first unit multi-layer substrate of the first multi-layer substrate 11 of a predetermined size and the second unit multi-layer substrate of the second multi-layer substrate 12 of a predetermined size may be bonded to manufacture the unit multi-layer substrate 20. That is, the previous step includes a first cutting step of cutting the first build-up substrate 11 into a predetermined size, and a second cutting step of cutting the second build-up substrate 12 into a predetermined size. In the subsequent layering step, the first unit layered substrate and the second unit layered substrate are layered. In this case, the cut surface 23A is formed in the first glass layer 11A of the first unit build-up substrate, and the cut surface 24A is formed in the second glass layer 12A of the second unit build-up substrate.

In Embodiment 1, after bonding the first unit build-up substrate of the first build-up substrate 11 of a predetermined size and the second build-up substrate 12 before being cut to the predetermined size, the second build-up substrate 12 may be cut into The predetermined size is used to manufacture the unit build-up substrate 20. Alternatively, after bonding the second unit build-up substrate of the second build-up substrate 12 of a predetermined size and the first build-up substrate 11 before being cut to the predetermined size, the first build-up substrate 11 may be cut into a predetermined size to manufacture a unit build-up. The substrate 20. That is, the previous step includes one of a first cutting step of cutting the first build-up substrate 11 into a predetermined size and a second cutting step of cutting the second build-up substrate 12 into a predetermined size. The latter step includes cutting the first build-up substrate 11 into a predetermined size The other of the first cutting step of 1 inch and the second cutting step of cutting the second build-up substrate 12 to a predetermined size. In this case, after the subsequent processing steps, the unit build-up substrate 20 shown in FIG. 9 is manufactured.

In the first embodiment, the method of forming the conductive layer 13 on the first build-up substrate 11 may be replaced with, or the method of forming the conductive layer 13 on the first build-up substrate 11 may be added: on the second build-up substrate 12 The conductive layer 13 is formed.

60‧‧‧Laminate substrate

61‧‧‧Glass layer

62‧‧‧Resin layer

63A‧‧‧First plane

63B‧‧‧Second plane

66‧‧‧Cutting surface of glass layer

67‧‧‧Cutting surface of resin layer

68‧‧‧Conductive layer

70‧‧‧Unit multilayer substrate

T‧‧‧Thickness direction

W‧‧‧Width direction

WD‧‧‧The width of the glass layer

Claims (7)

A method for manufacturing a flexible organic electroluminescent display, which includes: The cutting step is to cut out a predetermined size unit laminated substrate from the laminated substrate on which the glass layer and the resin layer are laminated; Wherein, in the cutting step, the glass layer is cut in such a manner that the cutting surface of the glass layer of the unit multi-layer substrate is located outside with respect to the cutting surface of the resin layer. The method for manufacturing a flexible organic electroluminescent display as described in claim 1, wherein: The glass layer includes a first plane on which the resin layer is formed and a second plane paired with the first plane; In the cutting step, the glass layer is cut in such a manner that the width of the glass layer becomes narrower as the width of the glass layer becomes narrower from the second plane toward the first plane. The method for manufacturing a flexible organic electroluminescent display as described in claim 2, wherein: In the cutting step, the glass layer is scribed in such a way that the width of the glass layer becomes narrower from the second plane toward the first plane, and the scribed glass layer is broken. The glass layer. The method for manufacturing a flexible organic electroluminescent display as described in claim 3, wherein: In the cutting step, a scoring wheel having a blade portion having an asymmetrical shape with respect to the center of rotation surface is used to score the glass layer. The method for manufacturing a flexible organic electroluminescent display described in any one of claim 1 to claim 4 further includes: The peeling step is to peel the glass layer and the resin layer of the unit multi-layer substrate by laser peeling. The method for manufacturing a flexible organic electroluminescent display as described in any one of claim 1 to claim 4, wherein: In the cutting step, a plurality of the laminated substrates are provided, and the plurality of laminated substrates include a first laminated substrate in which a first glass layer and a first resin layer are laminated, and a second glass layer and a second resin layer are laminated The second build-up substrate, and the unit build-up substrate is cut out from the multi-layer build-up substrate laminated so that the first resin layer and the second resin layer face each other. The method for manufacturing a flexible organic electroluminescent display as described in claim 5, wherein: In the cutting step, a plurality of the laminated substrates are provided, and the plurality of laminated substrates include a first laminated substrate in which a first glass layer and a first resin layer are laminated, and a second glass layer and a second resin layer are laminated The second build-up substrate, and the unit build-up substrate is cut out from the multi-layer build-up substrate laminated so that the first resin layer and the second resin layer face each other.

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