KR20200049473A - Method of manufacturing flexible organic electro luminescence dispaly - Google Patents

Abstract

Provided is a manufacturing method of a flexible organic electroluminescence (EL) display in which the quality of a resin layer peeled from a glass layer is difficult to deteriorate. The manufacturing method of the flexible organic EL display includes a cutting step of cutting out the unit laminated substrate (70) of a predetermined size from a laminated substrate (60) on which the glass layer (61) and the resin layer (62) are laminated. In the cutting process, the glass layer (61) is cut so that the cut surface (66) of the glass layer (61) of the unit laminated substrate (70) is located outside the cut surface (67) of the resin layer (62).

Description

Manufacturing method of flexible organic EL display {METHOD OF MANUFACTURING FLEXIBLE ORGANIC ELECTRO LUMINESCENCE DISPALY}

The present invention relates to a method for manufacturing a flexible organic EL display.

An organic electroluminescence (EL) display includes a light emitting device in which a light emitting layer, an electrode, and a substrate are stacked. In a flexible organic EL display, a flexible substrate is used for the substrate. In the manufacturing process of a flexible organic EL display, a resin layer is formed on the glass layer, and a light emitting layer or the like is formed on the resin layer (for example, Patent Document 1).

Japanese Patent Publication No. WO2011 / 030716

In the manufacturing process of the flexible organic EL display, the resin layer and the glass layer on which the light emitting layer or the like is formed are peeled off. The means of peeling is laser lift off, for example. The state of irradiation of the laser with respect to the irradiation target may affect the quality of the resin layer to be peeled off.

An object of the present invention is to provide a method of manufacturing a flexible organic EL display in which the quality of the resin layer peeled from the glass layer is difficult to deteriorate.

The method for manufacturing a flexible organic EL display according to the present invention includes a cutting step of cutting out a unit stacked substrate of a predetermined size from a stacked substrate on which a glass layer and a resin layer are stacked, and in the cutting step, the The glass layer is cut so that the cut surface of the glass layer is located outside the cut surface of the resin layer.

In this manufacturing method, the laser is irradiated onto the resin layer without being affected by the cut surface of the glass layer. Since the resin layer is properly irradiated with a laser, the quality of the resin layer peeled from the glass layer is difficult to deteriorate.

As an example of a method of manufacturing the flexible organic EL display, the glass layer includes a first plane on which the resin layer is formed, and a second plane paired with the first plane, and in the cutting step, the The glass layer is cut so as to form a cut surface in which the width of the glass layer is narrowed from the second plane to the first plane.

Even when the glass layer is cut with the intention of forming a cut surface parallel to the vertical surface, the cut surface may be inclined with respect to the vertical surface due to manufacturing errors. It is difficult to accurately manage the formation of such cut surfaces. In the above manufacturing method, since the glass layer is cut with the intention of forming an inclined cut surface, it is difficult to form an inclined cut surface in a direction different from the intended direction even if the effect of manufacturing error is considered.

As an example of a method of manufacturing the flexible organic EL display, in the cutting step, the glass layer is scribed to form a scribe line in which the width of the glass layer is narrowed toward the first plane from the second plane. , Break the scribed glass layer.

In this manufacturing method, the cut surface of the glass layer positioned outside the cut surface of the resin layer can be efficiently formed.

As an example of a method of manufacturing the flexible organic EL display, in the cutting step, the glass layer is scribed using a scribing wheel having a blade end having an asymmetric shape with respect to a rotational center surface.

In this manufacturing method, the shape of the cut surface of the glass layer inclined with respect to the vertical surface is defined by the shape of the blade end portion, and the glass layer can be easily cut.

An example of a method of manufacturing the flexible organic EL display further includes a peeling step of peeling the glass layer and the resin layer of the unit stacked substrate by laser lift-off.

According to this manufacturing method, a resin layer and a glass layer can be peeled efficiently.

As an example of a method of manufacturing the flexible organic EL display, in the cutting step, a plurality of the laminated substrates are provided, and the plurality of laminated substrates include a first laminated substrate in which a first glass layer and a first resin layer are stacked, and , A second laminated substrate on which a second glass layer and a second resin layer are stacked, and the unit laminated substrate is cut out from the multilayer laminated substrate stacked so that the first resin layer and the second resin layer face each other.

In this manufacturing method, even when the laminated substrate serving as a source for cutting out the unit laminated substrate is a multilayer laminated substrate, the laser is irradiated to the resin layer without being affected by the cut surface of the glass layer, and the resin layer peeled from the glass layer. Quality is difficult to deteriorate.

According to the present invention, the quality of the resin layer peeled from the glass layer is difficult to deteriorate.

1 is a cross-sectional view of a multi-layer laminated substrate according to the manufacturing method of the first embodiment.
FIG. 2 is a plan view of the multilayer laminated substrate of FIG. 1.
3 is a schematic view showing the configuration of a laser processing apparatus.
4 is a schematic view showing the configuration of a scribe processing apparatus.
5 is a cross-sectional view of the scribing wheel.
6 is a flow chart showing the manufacturing method of the first embodiment.
7 is a view showing a relationship between a processing sequence number and a processing type in a post-processing process.
8 is a schematic view showing the configuration of a laser processing apparatus.
9 is a cross-sectional view of an example of a unit laminated substrate.
10 is a view showing an example of a peeling process.
11 is a cross-sectional view of a multi-layer laminated substrate according to the manufacturing method of the second embodiment.
12 is a flow chart showing the manufacturing method of the second embodiment.
13 is a view showing the relationship between the processing sequence number and the processing type of the cutting process.
14 is a view showing an example of a peeling process.
15 is a cross-sectional view of a multi-layer laminated substrate according to a manufacturing method of a modified example.

(Form for carrying out the invention)

(First embodiment)

A method of manufacturing a flexible organic EL display will be described with reference to the drawings. The flexible organic EL display is used in stationary devices and portable devices. Examples of stationary devices are personal computers and television receivers. Examples of portable devices are portable information terminals, wearable computers, and notebook personal computers. An example of a portable information terminal is a smart phone, a tablet, and a portable game machine. One example of a wearable computer is a head mounted display and a smart watch.

The flexible organic EL display has a light emitting device in which a light emitting layer, an electrode, and a substrate are stacked, a first protective film covering the light emitting device from one side, and a second protective film covering the light emitting device from the other side. Each of the first protective film and the second protective film is, for example, PET (polyethylene terephthalate). Further, one of the first protective film and the second protective film may be omitted. In the manufacturing process of the light emitting device, a plurality of light emitting devices are manufactured from a single multilayer laminated substrate 10 shown in FIG. 1.

The multi-layered laminated substrate 10 is produced in the middle of the production of a flexible organic EL display. The multilayer laminated substrate 10 includes a first laminated substrate 11 on which the first glass layer 11A and the first resin layer 11B are stacked, and a second glass layer 12A and the second resin layer 12B. This laminated second laminated substrate 12 is provided. The multilayer laminated substrate 10 is configured by stacking the first laminated substrate 11 and the second laminated substrate 12 so that the first resin layer 11B and the second resin layer 12B face each other. The multilayer laminated substrate 10 further includes a conductive layer 13. The conductive layer 13 is formed on the first resin layer 11B of the first laminated substrate 11, for example. The conductive layer 13 is sandwiched between the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed of a member for an electronic device such as an organic light diode (OLED) or a thin film transistor (TFT). The first resin layer 11B, the conductive layer 13, and the second resin layer 12B constitute a light emitting device.

The first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12 are made of the same material and are formed in the same size. Although the composition of the 1st glass layer 11A and the 2nd glass layer 12A is not specifically limited, Glass of various compositions, such as glass containing alkali metal oxide, or alkali free glass, can be used, for example. . One example of a glass containing an alkali metal oxide is soda lime glass. In the present embodiment, alkali-free glass is used for the first glass layer 11A and the second glass layer 12A. Although the thickness of the 1st glass layer 11A and the 2nd glass layer 12A is not specifically limited respectively, It is preferable that it is about 0.5 mm, for example. The first glass layer 11A has a first plane 14A on which the first resin layer 11B is formed, and a second plane 14B paired with the first plane 14A. The second glass layer 12A has a first plane 15A on which the second resin layer 12B is formed, and a second plane 15B paired with the first plane 15A.

The first resin layer 11B of the first laminated substrate 11 and the second resin layer 12B of the second laminated substrate 12 are made of the same material and are formed in the same size. The composition of the 1st resin layer 11B and the 2nd resin layer 12B is not specifically limited, For example, polyimide (PI) can be used. Although the thickness of the 1st resin layer 11B and the 2nd resin layer 12B is not specifically limited, It is preferable that it is 10 micrometers or more and 30 micrometers or less, for example.

2 is a plan view of the multilayer laminated substrate 10.

The unit stacked substrate 20 is formed by cutting the multilayer stacked substrate 10 in a lattice shape along the cut scheduled portions 16 and 17 indicated by the broken line in FIG. 2. The size of the unit laminated substrate 20 when viewed from the plane corresponds to a predetermined size of the light emitting device when viewed from the plane.

At least one of a laser processing apparatus and a scribe processing apparatus is used for cutting of the multilayer laminated substrate 10. 3 is an example of the configuration of the laser processing apparatus, and FIG. 4 is an example of the configuration of the scribing processing apparatus. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in Figs. In addition, a dicing processing apparatus (not shown) may be used for cutting the first laminated substrate 11 and the second laminated substrate 12.

As shown in FIG. 3, the laser processing device 30 includes a laser device 31 for cutting the multilayer laminated substrate 10 and a machine for moving the multilayer laminated substrate 10 relative to the laser device 31. A driving system 32, a laser device 31, and a first control unit 33 for controlling the mechanical driving system 32 are provided.

The laser device 31 includes at least the first resin layer 11B and the second resin layer 12B and the first glass layer 11A and the second glass layer 12A in the multilayer laminated substrate 10. One side can be processed. The laser device 31 has a laser oscillator 34 for irradiating laser light on the multilayer laminated substrate 10 and a transmission optical system 35 that transmits the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (Ultra Violet) laser or a CO ₂ laser. When the laser processing device 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing apparatus 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is a CO ₂ laser or a UV laser. The transmission optical system 35 is composed of, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, or the like. In addition, the transmission optical system 35 has an X-axis direction movement mechanism for moving the laser irradiation head in which the laser oscillator 34 is embedded, for example, in the X-axis direction. The laser light irradiated from the laser oscillator 34 is irradiated toward the multilayer laminated substrate 10 through the transmission optical system 35.

The mechanical drive system 32 is disposed facing the laser device 31 in the Z-axis direction. The mechanical drive system 32 is composed of a bed 36, a processing table 37, and a moving device 38. On the processing table 37, a multilayer laminated substrate 10 is placed. The moving device 38 moves the machining table 37 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the bed 36. The moving device 38 is a known mechanism having a guide rail, a moving table, a motor, and the like.

The first control unit 33 has an arithmetic processing device that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The first control unit 33 may have one or a plurality of microcomputers. The first control unit 33 further has a storage unit. In the storage unit, information used for various control programs and various control processes is stored. The storage unit has, for example, a nonvolatile memory and a volatile memory. The first control unit 33 may be formed in the laser device 31, may be formed in the machine drive system 32, or may be formed separately from the laser device 31 and the machine drive system 32. When the first control unit 33 is formed separately from the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be arbitrarily set.

As shown in FIG. 4, the scribe processing apparatus 40 is X on the multi-layer laminated substrate 10 as the scribing wheel 50 and the multi-layer laminated substrate 10 move relatively in the X-axis direction and the Y-axis direction. A scribe line along the axial direction and the Y-axis direction is formed. The scribing processing device 40 includes a processing device 41 for processing the multilayer laminated substrate 10, a transport device 42 for transporting the multilayer laminated substrate 10, a processing device 41 and a transport device It is equipped with the 2nd control part 43 which controls 42.

The conveying device 42 is composed of a pair of rails 44, a table 45, a straight drive device 46, a rotating device 47, and the like. The pair of rails 44 extend along the Y-axis direction. In the scribe processing apparatus 40 of Fig. 4, a pair of rails 44 are arranged on the base (not shown) of the scribing processing apparatus 40, and the table 45 is paired by the straight drive device 46. It reciprocates along the rail 44 of the table, and the table 45 is rotated around the central axis C by the rotation device 47. On the table 45, a multi-layer laminated substrate 10 is placed. An example of the straight drive device 46 has a feed screw device. The rotating device 47 has a motor serving as a driving source.

The processing device 41 is composed of a horizontal driving device 48, a vertical driving device 49, a scribing wheel 50, and the like. The scribing wheel 50 is attached to a holder unit for holding the scribing wheel 50. The holder unit is attached to a scribe head for holding the holder unit. The scribe head moves in the X-axis direction by the horizontal drive device 48, and moves in the Z-axis direction by the vertical drive device 49. As the scribing wheel 50 moves in the X-axis direction, a scribe line along the X-axis direction is formed on the multi-layer laminated substrate 10.

The scribing wheel 50 is rotatably supported by a pin (not shown) attached to the holder unit. Examples of materials constituting the scribing wheel 50 are sintered diamond (Poly Crystalline Diamond), cemented metal, single crystal diamond, and polycrystalline diamond. The scribing wheel 50 is, for example, any one of the scribing wheel 50A of the shape shown in Fig. 5 (a) and the scribing wheel 50B of the shape shown in Fig. 5 (b). Can be used.

The scribing wheel 50A shown in Fig. 5 (a) is composed of a disk-shaped main body portion 51 and a cross-section V-shaped blade end portion 52. The cross-section V-shape is a scribing wheel 50A in a cross section in which the scribing wheel 50A is cut in a plane along the thickness direction (hereinafter “thickness direction (DT)”) of the scribing wheel 50A. It has a tapered shape toward the outer periphery of.

In the central portion of the body portion 51, an insertion hole 53 is formed through the body portion 51 in the thickness direction DT. A pin is inserted into the insertion hole 53.

The blade end portion 52 has a first inclined surface 52A and a second inclined surface 52B, which are two inclined surfaces forming a V-shaped cross section. The first inclined surface 52A and the second inclined surface 52B are the center of the thickness direction DT of the scribing wheel 50A, and are symmetrical with respect to the rotational center surface RC orthogonal to the thickness direction DT. .

The scribing wheel 50B shown in FIG. 5 (b) has a different shape of the blade end 52 as compared with the scribing wheel 50A. The first inclined surface 52A and the second inclined surface 52B at the blade end portion 52 of the scribing wheel 50B are asymmetrical with respect to the rotational center surface RC. More specifically, in the cross section of the scribing wheel 50B along the thickness direction, the first angle formed by the line segment L1 and the first inclined surface 52A parallel to the radial direction of the scribing wheel 50B. (θ1) is greater than the second angle θ2 formed by the line segment L1 and the second inclined surface 52B. Further, if the position of the tip end of the blade end 52 in the direction along the line segment L1 with respect to the rotational center surface RC is misaligned, the first angle θ1 may be the same as the second angle θ2 good.

The second control unit 43 has an arithmetic processing device that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU or an MPU. The second control unit 43 may have one or a plurality of microcomputers. The second control unit 43 further has a storage unit. In the storage unit, information used for various control programs and various control processes is stored. The storage unit has, for example, a nonvolatile memory and a volatile memory. The 2nd control part 43 may be provided in the processing apparatus 41, may be provided in the conveying apparatus 42, or may be formed separately from the processing apparatus 41 and the conveying apparatus 42. When the second control part 43 is formed separately from the processing device 41 and the transfer device 42, the arrangement position of the second control part 43 can be set arbitrarily.

(Method of manufacturing flexible organic EL display)

Next, details of the manufacturing method of the flexible organic EL display will be described. 6 shows an example of a process of a method for manufacturing a flexible organic EL display.

In the method of manufacturing a flexible organic EL display, the first laminated substrate 11 and the second laminated substrate 12 are joined to produce a multilayer laminated substrate 10, and then the multilayer laminated substrate 10 is cut into a predetermined size to unit The laminated substrate 20 is manufactured. Next, the light emitting device is manufactured by removing the first glass layer 11A and the second glass layer 12A from the unit laminated substrate 20. Then, the first protective film and the second protective film are attached to the first resin layer 11B and the second resin layer 12B. Thus, a flexible organic EL display is produced.

As shown in FIG. 6, the manufacturing method of the flexible organic EL display includes a shearing step, which is a step prior to the step of laminating the first laminated substrate 11 and the second laminated substrate 12, It is divided into a rear end process, which is a process after the process of stacking the first laminated substrate 11 and the second laminated substrate 12. The shearing step includes a shearing laminating step. The shear lamination process is a process of manufacturing the first laminated substrate 11 and the second laminated substrate 12. The rear end step includes a rear end lamination step, a rear end step, and a peeling step. The back-end lamination process is a process of manufacturing the multi-layer laminated substrate 10 by laminating the first laminated substrate 11 and the second laminated substrate 12. In the post-processing step, the multi-layer laminated substrate 10 is cut along a predetermined cutting portion 16, 17 of the multi-layer laminated substrate 10, that is, by cutting the multi-layer laminated substrate 10 to a predetermined size. 20). In the peeling process, the first glass layer 11A and the first resin layer 11B are separated by laser lift off (LLO), and the second glass layer 12A and the second resin layer 12B are removed. It is a process of peeling. Hereinafter, the detail of each process is demonstrated.

In the shear lamination process, the first laminated substrate 11 is manufactured by forming the first resin layer 11B over the entire first plane 14A of the first glass layer 11A, and the second glass layer 12A The second laminated substrate 12 is manufactured by forming the second resin layer 12B over the entire first plane 15A of). Method of forming the first resin layer 11B in the first plane 14A of the first glass layer 11A, and second resin layer 12B in the first plane 15A of the second glass layer 12A ), Respectively, the method of applying a resin layer to the glass layer or the method of laminating the resin layer through the adhesive layer to the glass layer can be selected. In addition, as a method of fixing the resin layer to the glass layer, heat curing treatment or heating and pressing treatment by a pressing method can be selected.

In the subsequent stacking step, the first laminated substrate 11 that is not cut to a predetermined size and the second laminated substrate 12 that is not cut to a predetermined size are stacked. As an example, the first laminated substrate 11 and the second laminated substrate 12 are bonded, for example, through an adhesive layer SD. Thereby, the multilayer laminated substrate 10 is manufactured.

The rear end processing step includes a rear end cutting step in which the first stacked substrate 11 and the second stacked substrate 12 are respectively cut. In the rear end cutting step of the rear end processing step, as shown in, for example, FIGS. 7 (a) and 7 (b), the sequence number and the type of processing for cutting the multi-layer laminated substrate 10 can be arbitrarily selected. The table in FIG. 7A shows an example of the relationship between the processing sequence number and the processing type of each layer when cutting in the order of the first laminated substrate 11 and the second laminated substrate 12. Fig. 7B shows an example of the relationship between the processing sequence number and the processing type of each layer when cutting in the order of the second laminated substrate 12 and the first laminated substrate 11. 7 (a) and 7 (b), when the first resin layer 11B is cut or scribed before the first glass layer 11A, and the second resin layer 12B is the second glass When cutting or scribing before the layer 12A, the scribing apparatus 40 cannot be used for the processing of the first resin layer 11B and the second resin layer 12B. When the 1st glass layer 11A, the 2nd glass layer 12A, the 1st resin layer 11B, and the 2nd resin layer 12B are cut by laser, for example, the following 1st method and 2nd You can choose a method. In the first method, after scribing the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B by laser, the first glass layer ( 11A), the 2nd glass layer 12A, the 1st resin layer 11B, and the 2nd resin layer 12B are braked. In the second method, the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are cut by a laser. Moreover, in the post-cutting process of the post-processing process of the 1st process example, about 1st glass layer 11A, 2nd glass layer 12A, 1st resin layer 11B, and 2nd resin layer 12B, Any of the layers to cut and the layer to break after scribing can be arbitrarily selected.

When cutting the 1st resin layer 11B or the 2nd resin layer 12B with a laser, the output of the laser in irradiation of the laser to the 1st resin layer 11B or the 2nd resin layer 12B, It is desirable to set the gas at a predetermined temperature or less to a predetermined output that is suppressed, and irradiate the first resin layer 11B or the second resin layer 12B multiple times. Since the gas generated during the processing of the first resin layer 11B or the second resin layer 12B by the laser is cooled over time, the increase in the volume of the gas inside the multilayer laminated substrate 10 is increased. Can be suppressed.

When the first glass layer 11A is scribed by a laser or a scribing wheel 50, the second resin layer 12B is cut by a laser or the second resin layer 12B is scribed. It is preferable to irradiate the laser from the glass layer 12A side. In the case of cutting the second resin layer 12B by laser, after cutting the second resin layer 12B, the first resin layer 11B is cut by the laser in the same irradiation direction or the first resin layer 11B You may scribe. When the second glass layer 12A is scribed by a laser or a scribing wheel 50, the first resin layer 11B is cut by a laser or the first resin layer 11B is scribed by the laser. It is preferable to irradiate the laser from the glass layer 11A side. When cutting the 1st resin layer 11B with a laser, after cutting the 1st resin layer 11B, the 2nd resin layer 12B is cut with the laser of the same irradiation direction, or the 2nd resin layer 12B You may scribe.

In the case of cutting each of the glass layer and the resin layer by laser or scribing each of the glass layer and the resin layer, instead of the laser processing device 30 shown in FIG. 3, the laser processing device 30A shown in FIG. 8 is used. Is used. The laser processing device 30A has a different configuration of the laser device compared to the laser processing device 30. Hereinafter, different structures in the laser processing apparatus 30A will be described.

The laser device 31A of the laser processing device 30A has a first laser oscillator 34A and a second laser oscillator 34B. The first laser oscillator 34A is a UV laser, and the second laser oscillator 34B is a CO ₂ laser. The laser light irradiated from the first laser oscillator 34A and the laser light irradiated from the second laser oscillator 34B are irradiated to the multilayer laminated substrate 10 through the transmission optical system 35. In addition, the transmission optical system 35 may have a transmission optical system corresponding to the first laser oscillator 34A and a transmission optical system corresponding to the second laser oscillator 34B individually.

The first control unit 33 selects the first laser oscillator 34A and the second laser oscillator 34B according to the type of processing object (glass layer or resin layer) for the multilayer laminated substrate 10. For example, the first control unit 33 determines the processing sequence of the glass layer and the resin layer, which are the types of objects to be processed, by the previously stored control program, and the first laser oscillator 34A and the second laser according to the determined processing sequence. Select the oscillator 34B.

9 shows an example of the unit stacked substrate 20 manufactured in the rear end cutting process. The unit laminated substrate 20 shown in FIG. 9 is manufactured by being braked after the first glass layer 11A and the second glass layer 12A are scribed by the scribing wheel 50B shown in FIG. 5 (b). do. In the cross section of the unit laminated substrate 20 shown in FIG. 9, the direction orthogonal to the thickness direction T of the unit laminated substrate 20 is defined as the width direction W. In the cross section of the unit laminated substrate 20, the side facing the center of the width direction W of the unit laminated substrate 20 is made inside, and the direction toward the end of the width direction W is made outward.

In the rear end cutting process, the first glass layer 11A is such that the cut surface 23A of the first glass layer 11A of the unit laminated substrate 20 is located outside the cut surface 23B of the first resin layer 11B. Cut it. The second glass layer 12A is cut so that the cut surface 24A of the second glass layer 12A of the unit laminated substrate 20 is located outside the cut surface 24B of the second resin layer 12B. More specifically, the cutting surface 23A of which the width WD1 of the first glass layer 11A is narrowed as it goes from the second plane 14B of the first glass layer 11A to the first plane 14A. The first glass layer 11A is cut so as to be formed. The second glass so that the cutting surface 24A in which the width WD2 of the second glass layer 12A narrows as it goes from the second plane 15B of the second glass layer 12A toward the first plane 15A Layer 12A is cut. In order to scribe the 1st glass layer 11A and the 2nd glass layer 12A with the scribing wheel 50B, the scribing processing apparatus 40 is a 1st glass layer from the cross section shown in FIG. The first glass layer 11A so that a scribe line (crack) in which the width WD1 of the first glass layer 11A narrows as it goes from the second plane 14B of 11A to the first plane 14A ). Next, the scribed first glass layer 11A is braked. The scribe processing apparatus 40 is seen from the second plane 15B of the second glass layer 12A toward the first plane 15A from the second glass layer 12A when viewed from the cross section shown in FIG. 9. The second glass layer 12A is scribed so that a scribe line (crack) in which the width WD2 is narrowed is formed. Next, the scribed second glass layer 12A is braked. In addition, instead of the scribing wheel 50B, the cut surfaces 23A of the first glass layer 11A and the cut surfaces of the second glass layer 12A shown in FIG. 9 by the laser of the laser processing apparatus 30 ( 24A) may be formed.

In the peeling process, a laser lift-off device (not shown) is used. In this embodiment, a UV laser is used as the laser of the laser lift-off device. As shown in Fig. 10 (a), the first resin layer 11B and the first glass layer 11A are peeled by irradiating a laser to the first resin layer 11B from the first glass layer 11A side. In the case of peeling the first resin layer 11B and the first glass layer 11A, the laser is irradiated to be perpendicular to the second plane 14B of the first glass layer 11A. Next, as shown in FIG. 10 (b), the second resin layer 12B and the second glass layer 12A are irradiated by irradiating a laser to the second resin layer 12B from the second glass layer 12A side. Peel off. In the case of peeling the second resin layer 12B and the second glass layer 12A, the laser is irradiated to be perpendicular to the second plane 15B of the second glass layer 12A. In addition, the order of peeling the 1st glass layer 11A and the 2nd glass layer 12A can be arbitrarily changed. For example, after peeling the 2nd resin layer 12B and the 2nd glass layer 12A, you may peel the 1st resin layer 11B and the 1st glass layer 11A.

After the first glass layer 11A and the second glass layer 12A are removed from the multilayer laminated substrate 10 (see FIG. 10 (c)), the first protective film is covered to cover the first resin layer 11B. By attaching and attaching the second protective film to cover the second resin layer 12B, a flexible organic EL display is produced.

In the unit laminated substrate 20 shown in FIG. 9, the second plane 14B of the first glass layer 11A is formed up to the edge of the width direction W of the first resin layer 11B, The second plane 15B of the second glass layer 12A is formed up to the edge of the width direction W of the second resin layer 12B. That is, in the thickness direction T, the edge of the width direction W of the first resin layer 11B and the cut surface 23A of the first glass layer 11A do not overlap, and the second resin layer 12B The edge of the width direction W and the cutting surface 24A of the second glass layer 12A do not overlap. For this reason, when irradiating the laser of the laser lift-off device with respect to the edge of the width direction W of the 1st resin layer 11B and the edge of the width direction W of the 2nd resin layer 12B, a laser is removed. It does not pass through the cutting surface 23A of the 1 glass layer 11A and the cutting surface 24A of the second glass layer 12A.

The effects of this embodiment will be described.

(1-1) The cut surface 23A of the first glass layer 11A of the unit laminated substrate 20 is located outside the width direction W than the cut surface 23B of the first resin layer 11B, and the second The cutting surface 24A of the glass layer 12A is located outside the width direction W than the cutting surface 24B of the second resin layer 12B. According to this manufacturing method, the first resin layer 11B and the second without the laser being affected by the cutting surface 23A of the first glass layer 11A and the cutting surface 24A of the second glass layer 12A The resin layer 12B is irradiated. Since the laser is properly irradiated to the first resin layer 11B and the second resin layer 12B, respectively, the quality of the first resin layer 11B peeled from the first glass layer 11A and the second glass layer ( The quality of the second resin layer 12B peeled from the 12A) is difficult to deteriorate, respectively.

(1-2) In the rear end cutting process, the cutting surface 23A is formed so that the width WD1 of the first glass layer 11A is narrowed as it goes from the second plane 14B to the first plane 14A. 1 Cut the glass layer 11A. The second glass layer 12A is cut so that the cutting surface 24A, in which the width WD2 of the second glass layer 12A is narrowed as it is directed from the second plane 15B to the first plane 15A, is cut. In this manufacturing method, since the first glass layer 11A and the second glass layer 12A are cut with the intention of forming the inclined cutting surfaces 23A, 24A, even if the effect of manufacturing error is taken into consideration, It is difficult to form a cut surface inclined in different directions.

(1-3) In the rear end cutting process, a scribe line (crack) is formed in which the width (WD1) of the first glass layer 11A is narrowed as it goes from the second plane 14B to the first plane 14A. The first glass layer 11A is scribed, and the scribed first glass layer 11A is braked. The second glass layer 12A is scribed to form a scribe line (crack) in which the width (WD2) of the second glass layer 12A is narrowed from the second plane 15B toward the first plane 15A. , Break the scribed second glass layer 12A. In this manufacturing method, the cut surface 23A of the first glass layer 11A located outside the cut surface 23B of the first resin layer 11B can be efficiently formed, and the second resin layer 12B The cutting surface 24A of the second glass layer 12A located outside the cutting surface 24B of can be efficiently formed.

(1-4) In the rear end cutting process, the first glass layer is used by using a scribing wheel 50B having a blade end 52 having an asymmetrical shape with respect to the center of rotation RC shown in FIG. 5 (b). (11A) and the second glass layer 12A are scribed. In this manufacturing method, the shape of the cut surface 23A of the first glass layer 11A inclined with respect to the second plane 14B and the cut surface of the second glass layer 12A inclined with respect to the second plane 15B The shape of (24A) is defined by the shape of the blade end portion 52, so that the first glass layer 11A and the second glass layer 12A can be easily cut.

(1-5) A peeling process of peeling the first glass layer 11A and the first resin layer 11B by laser lift-off, and peeling the second glass layer 12A and the second resin layer 12B Included additionally. In this manufacturing method, the 1st glass layer 11A and the 1st resin layer 11B can be peeled efficiently, and the 2nd glass layer 12A and the 2nd resin layer 12B can be peeled efficiently. .

(1-6) The manufacturing method of the flexible organic EL display is a step subsequent to the step of laminating the first laminated substrate 11 and the second laminated substrate 12, and the multilayer laminated substrate 10 is predetermined. Cut to size. In this manufacturing method, since the first laminated substrate 11 and the second laminated substrate 12 are cut in the state of the laminated multilayer substrate 10, the lamination operation is simplified. For this reason, the manufacturing efficiency of the flexible organic EL display is unlikely to decrease.

(1-7) In the post-cutting step of the post-processing step, the first glass layer 11A and the second glass layer 12A are first cut, and then the first resin layer 11B and the second resin layer 12B ). In this manufacturing method, since the first glass layer 11A and the second glass layer 12A are cut first, the first resin layer is used in the step of cutting the first resin layer 11B and the second resin layer 12B. The portion not covered by the first glass layer 11A in (11B) and the portion not covered by the second glass layer 12A in the second resin layer 12B can be cut, respectively. For example, when cutting the 1st resin layer 11B and the 2nd resin layer 12B with a laser, it arises with the laser irradiation to the 1st resin layer 11B and the 2nd resin layer 12B. The gas to be discharged is discharged from the cut portion of the first glass layer 11A and the cut portion of the second glass layer 12A. For this reason, there is less possibility that the gas affects the quality of the first resin layer 11B and the second resin layer 12B.

(1-8) In the rear end cutting step, the first resin layer 11B and the second resin layer 12B are cut with a laser. For this reason, compared with cutting using, for example, the scribing wheel 50, the amount of heat generated when cutting the first resin layer 11B and the second resin layer 12B is small, and the first resin layer 11B And it is difficult for the quality of the second resin layer 12B to deteriorate.

(1-9) In the post-cutting step, the output of the laser in the irradiation of the laser per one time to the first resin layer 11B and the second resin layer 12B is suppressed from being generated at a temperature above a predetermined temperature. Set below the specified output. According to this manufacturing method, when a laser is irradiated to the 1st resin layer 11B and the 2nd resin layer 12B, high-temperature gas is hard to generate | occur | produce, and the 1st glass layer 11A and the 1st glass layer are influenced by gas. 2 The possibility that the quality of the glass layer 12A, the first resin layer 11B, and the second resin layer 12B decreases is reduced.

(Second embodiment)

The manufacturing method of the flexible organic electroluminescent display of 2nd Embodiment is demonstrated with reference to FIGS. 11-14. In this embodiment, compared with the first embodiment, the point of manufacturing the laminated substrate 60 in place of the multilayer laminated substrate 10 is different.

As shown in FIG. 11, the laminated substrate 60 is configured by laminating a glass layer 61 and a resin layer 62. The glass layer 61 has a first plane 63A on which the resin layer 62 is formed, and a second plane 63B paired with the first plane 63A. The laminated substrate 60 further has a conductive layer 68. The conductive layer 68 is the same as the conductive layer 13 of the first embodiment. The resin layer 62 and the conductive layer 68 constitute a light emitting device. The composition of the glass layer 61 is the same as the composition of the 1st glass layer 11A or the 2nd glass layer 12A of 1st Embodiment, for example. The composition of the resin layer 62 is, for example, the same as the composition of the first resin layer 11B or the second resin layer 12B of the first embodiment.

12, the manufacturing method of a flexible organic EL display includes a lamination process, a cutting process, and a peeling process. The lamination process is a process of manufacturing the laminated substrate 60 by laminating the resin layer 62 on the glass layer 61. The cutting process is a process of cutting out the unit laminated substrate 70 (see FIG. 14 (a)) of a predetermined size from the laminated substrate 60. The peeling step is a step of peeling the resin layer 62 and the glass layer 61 of the unit laminated substrate 70 by laser lift-off. Hereinafter, the detail of each process is demonstrated.

In the lamination process, the laminated substrate 60 is manufactured by forming the resin layer 62 over the entire first plane 63A of the glass layer 61. The method of forming the resin layer 62 in the first plane 63A of the glass layer 61 is a method of applying the resin layer 62 to the glass layer 61 or an adhesive layer on the glass layer 61. Through this, a method of laminating the resin layer 62 can be selected. In addition, as a method of fixing the resin layer 62 to the glass layer 61, heat curing treatment or heating and pressing treatment by a pressing method can be selected.

In the cutting step, the glass layer 61 and the resin layer 62 are respectively cut along the cutting scheduled portion 64A of the glass layer 61 shown in FIG. 11 and the cutting scheduled portion 64B of the resin layer 62, respectively. . The cutting schedule parts 64A and 64B are cut parts for cutting the laminated substrate 60 to a predetermined size. As shown in Fig. 13, in the cutting step, the sequence number and type of processing for cutting the laminated substrate 60 can be arbitrarily selected. The laminated substrate 60 may be cut in the order of the resin layer 62 and the glass layer 61, or may be cut in the order of the glass layer 61 and the resin layer 62. For the cutting of the glass layer 61 and the resin layer 62, any one of the laser processing device 30 and the scribe processing device 40 may be used. In addition, with respect to the cutting of the glass layer 61 and the resin layer 62, after scribing with the laser processing apparatus 30 or the scribe processing apparatus 40, you may brake, and it cuts with the laser processing apparatus 30. You may do it.

In a cutting process, when scribing or cutting each of the to-be-cut part 64A of the glass layer 61 and the to-be-cut part 64B of the resin layer 62 by laser, the laser processing device shown in FIG. 3 ( Instead of 30), the laser processing apparatus 30A shown in Fig. 8 is used.

FIG. 14 (a) is a unit stack of a laminated substrate 60 of a predetermined size when the glass layer 61 is scribed and braked by the scribing wheel 50B shown in FIG. 5 (b) in the cutting step. The substrate 70 is shown. In the cross section of the unit laminated substrate 70 shown in Fig. 14 (a), the direction orthogonal to the thickness direction T of the unit laminated substrate 70 is defined as the width direction W. In the cross section of the unit laminated substrate 70, the side facing the center of the width direction W of the unit laminated substrate 70 is made inside, and the direction toward the end of the width direction W is made outward.

In the cutting step, the cut portion 64A of the glass layer 61 is positioned such that the cut surface 66 of the glass layer 61 of the unit laminated substrate 70 is located outside the cut surface 67 of the resin layer 62. (See FIG. 11). More specifically, in the cutting process, the cutting surface 66 in which the width WD of the glass layer 61 narrows as it goes from the second plane 63B of the glass layer 61 to the first plane 63A. The planned cutting portion 64A of the glass layer 61 is cut so as to be formed. In order to scribe the glass layer 61 by the scribing wheel 50B, in the cutting step, the scribe processing apparatus 40 is the second of the glass layer 61 when viewed from the cross section of Fig. 14 (a). Scribe the cutting scheduled portion 64A of the glass layer 61 so that a scribe line (crack) in which the width WD of the glass layer 61 narrows as it goes from the plane 63B to the first plane 63A. do. Next, the cut portion 64A of the scribed glass layer 61 is braked. Further, instead of the scribing wheel 50B, a cut surface 66 of the glass layer 61 shown in Fig. 14 (a) may be formed by the laser of the laser processing apparatus 30.

In the peeling step, the resin layer is obtained by irradiating a laser to the resin layer 62 from the glass layer 61 as shown in Fig. 14 (a), using the same laser lift-off device (not shown) as in the first embodiment. The 62 and the glass layer 61 are peeled off.

After the glass layer 61 is removed from the multilayer laminated substrate 10 (see FIG. 14 (b)), a first protective film is attached to cover one side in the thickness direction T of the resin layer 62, and A flexible organic EL display is manufactured by attaching a second protective film to cover the other side of the thickness direction T of the base layer 62.

In the unit laminated substrate 70 shown in Fig. 14 (a), the second plane 63B of the glass layer 61 is formed until the edge of the resin layer 62 in the width direction W. That is, in the thickness direction T, the edge of the width direction W of the resin layer 62 and the cut surface 66 of the glass layer 61 do not overlap. For this reason, when irradiating the laser of the laser lift-off device with respect to the edge of the width direction W of the resin layer 62, the laser does not pass through the cut surface 66 of the glass layer 61.

The effects of this embodiment will be described.

(2-1) The cut surface 66 of the glass layer 61 of the unit laminated substrate 70 is located outside the width direction W than the cut surface 67 of the resin layer 62. According to this manufacturing method, the laser of the laser lift-off device is irradiated to the resin layer 62 without being affected by the cut surface 66 of the glass layer 61 and the cut surface 67 of the glass layer 61. Since the laser of the laser lift-off device is properly irradiated to the resin layer 62, the quality of the resin layer 62 peeled from the glass layer 61 is difficult to deteriorate.

(2-2) In the cutting process, the glass layer 61 is formed so that the cutting surface 66 in which the width WD of the glass layer 61 becomes narrower as it goes from the second plane 63B to the first plane 63A. ). In this manufacturing method, since the glass layer 61 is cut with the intention of forming the inclined cutting surface 66, it is difficult to form an inclined cutting surface in a direction different from the intended direction even when considering the influence of manufacturing error.

(2-3) In the cutting step, the glass layer (crack) is formed so that a scribe line (crack) in which the width (WD) of the glass layer 61 narrows as it goes from the second plane 63B to the first plane 63A. 61) is scribed, and the scribed glass layer 61 is braked. In this manufacturing method, the cut surface 66 of the glass layer 61 located outside the cut surface 67 of the resin layer 62 can be efficiently formed.

(2-4) The glass layer 61 is scribed by using the scribing wheel 50B having the blade end 52 having an asymmetric shape with respect to the rotational center surface RC shown in FIG. 5 (b). In this manufacturing method, the shape of the cut surface 66 of the glass layer 61 inclined with respect to the second plane 63B is defined by the shape of the blade end 52, and the glass layer 61 can be easily cut. Can be.

(2-5) The method of manufacturing a flexible organic EL display further includes a peeling step of peeling the glass layer 61 and the resin layer 62 by laser lift-off. In this manufacturing method, the glass layer 61 and the resin layer 62 can be peeled efficiently.

(Modified example)

Each of the above-described embodiments is an example of a form that can take the manufacturing method of the flexible organic EL display according to the present disclosure, and is not intended to limit the form. The method for manufacturing a flexible organic EL display according to the present disclosure can take a form different from the form illustrated in each embodiment. An example is a form in which a part of the configuration of each embodiment is replaced, changed, or omitted, or a new configuration is added to each embodiment. In the following modified examples, parts common to those of the respective embodiments are given the same reference numerals as those of the respective embodiments, and descriptions thereof are omitted.

In the first embodiment, in the rear end cutting step, when cutting the first resin layer 11B and the second resin layer 12B, the first resin layer 11B and the second resin layer 12B A suction mechanism 80 for sucking gas generated in response to laser irradiation may be formed. As shown in FIG. 15, the suction mechanism 80 is configured to suck gas through the main surface 10A of the multilayer laminated substrate 10. An example of the suction mechanism 80 has an intake fan. The suction mechanism 80 sucks air in the main surface 10A of the multi-layer laminated substrate 10 by driving the intake fan. In this case, gas generated in the multilayer laminated substrate 10 is discharged to the outside of the multilayer laminated substrate 10 through the main surface 10A.

In the first embodiment, when the first resin layer 11B and the second resin layer 12B are cut by irradiation of a plurality of lasers, instead of or in addition to setting the laser to be less than a predetermined output, You may cut | disconnect the 1st resin layer 11B and the 2nd resin layer 12B by irradiating the 1st resin layer 11B and the 2nd resin layer 12B with a laser several times over a fixed time. In this manufacturing method, the laser is irradiated to one of the first resin layer 11B and the second resin layer 12B, the laser irradiation is temporarily stopped, and after a certain time has elapsed, the first resin layer 11B ) And one of the second resin layers 12B is irradiated, and the interruption of irradiation of these lasers and temporary irradiation is repeated multiple times. The same applies to the case where the laser is irradiated to the other of the first resin layer 11B and the second resin layer 12B. The gas generated upon irradiation of the laser to the first resin layer 11B and the second resin layer 12B is cooled when the laser irradiation is temporarily stopped, and the first glass layer ( 11A), the possibility that the quality of the 2nd glass layer 12A, the 1st resin layer 11B, and the 2nd resin layer 12B will fall is reduced.

In the first embodiment, the unit stacked substrate 20 is formed by joining a first unit stacked substrate, which is a first stacked substrate 11 of a predetermined size, and a second unit stacked substrate, which is the second stacked substrate 12, of a predetermined size. ). That is, the shearing process includes a first cutting process for cutting the first laminated substrate 11 to a predetermined size, and a second cutting process for cutting the second laminated substrate 12 to a predetermined size. In the rear stage lamination process, the first unit laminated substrate and the second unit laminated substrate are laminated. In this case, a cut surface 23A is formed on the first glass layer 11A of the first unit laminated substrate, and a cut surface 24A is formed on the second glass layer 12A of the second unit laminated substrate.

In the first embodiment, after bonding the first unit stacked substrate, which is the first stacked substrate 11 of a predetermined size, and the second stacked substrate 12 before being cut to a predetermined size, the second stacked substrate 12 is joined. ) May be cut to a predetermined size to manufacture the unit laminated substrate 20. In addition, after the second unit laminated substrate 12, which is the second laminated substrate 12 of a predetermined size, is bonded to the first laminated substrate 11 before being cut to a predetermined size, the first laminated substrate 11 is cut to a predetermined size. The unit laminated substrate 20 may be manufactured. That is, the shearing step includes one of a first cutting step of cutting the first laminated substrate 11 to a predetermined size, and a second cutting step of cutting the second laminated substrate 12 to a predetermined size. The rear end step includes the other of the first cutting step of cutting the first laminated substrate 11 to a predetermined size, and the second cutting step of cutting the second laminated substrate 12 to a predetermined size. In this case, after the post-processing step, the unit laminated substrate 20 shown in FIG. 9 is manufactured.

In the first embodiment, instead of the formation of the conductive layer 13 on the first laminated substrate 11 or in addition to the formation of the conductive layer 13 on the first laminated substrate 11, the second The conductive layer 13 may be formed on the laminated substrate 12.

10: multilayer laminated substrate
11: first laminated substrate
11A: first glass layer
11B: 1st resin layer
12: second laminated substrate
12A: second glass layer
12B: Second resin layer
14A: 1st plane
14B: second plane
15A: 1st plane
15B: second plane
20: unit laminated substrate
23A: Cutting surface
23B: Cutting surface
24A: cut surface
24B: cutting surface
50, 50A, 50B: scribing wheel
52: end of the blade
60: laminated substrate
61: glass layer
62: resin layer
63A: 1st plane
63B: 2nd plane
66: cutting surface
67: cut surface
70: unit laminated substrate
RC: Center of rotation

Claims (6)

And a cutting step of cutting out a unit laminated substrate of a predetermined size from a laminated substrate in which a glass layer and a resin layer are laminated,
In the cutting step, a method of manufacturing a flexible organic EL display in which the glass layer is cut so that the cut surface of the glass layer of the unit laminated substrate is located outside the cut surface of the resin layer. According to claim 1,
The glass layer includes a first plane on which the resin layer is formed, and a second plane paired with the first plane,
In the cutting step, a method of manufacturing a flexible organic EL display, in which the glass layer is cut so that a cutting surface in which the width of the glass layer is narrowed is formed from the second plane to the first plane. According to claim 2,
In the cutting process, a flexible organic EL display that scribes the glass layer so as to form a scribe line that narrows the width of the glass layer as it moves from the second plane to the first plane, and breaks the scribed glass layer. Method of manufacture. According to claim 3,
In the cutting step, a method of manufacturing a flexible organic EL display using a scribing wheel having a blade end having an asymmetric shape with respect to a rotational center surface. The method according to any one of claims 1 to 4,
A method of manufacturing a flexible organic EL display, further comprising a peeling step of peeling the glass layer and the resin layer of the unit laminated substrate by laser lift-off. The method according to any one of claims 1 to 5,
In the cutting step, a plurality of the laminated substrates are provided, and the plurality of laminated substrates is a first laminated substrate on which a first glass layer and a first resin layer are laminated, and a second glass layer and a second resin layer are laminated. A method of manufacturing a flexible organic EL display including a second laminated substrate, and cutting the unit laminated substrate from the multilayer laminated substrate stacked such that the first resin layer and the second resin layer are opposed to each other.

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