JP2012220578A - Method for manufacturing display device and intermediate product for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a display device and an intermediate product for the display device where a cutting step can be favorably performed.SOLUTION: An intermediate product having a pair of inorganic substrates 10 opposing to each other where a sealed space 20 is formed by an organic seal material 12 between the pair of the inorganic substrates 10 is prepared. The pair of the inorganic substrates 10 is cut externally to the sealed space 20. On at least one of opposing surfaces of the pair of the inorganic substrates 10, a circuit for displaying an image is formed in the sealed space 20. The intermediate product has a flow path 56 sectioned by at least one of the surfaces of the pair of the inorganic substrates 10 and the organic seal material 12 externally to the sealed space 20. In the step of cutting the pair of the inorganic substrates 10, etching liquid 58 is allowed to flow into the flow path 56 with respect to an inorganic material to etch at least one of the surfaces of the pair of the inorganic substrates 10 along the flow path 56 to form a groove 60.

Description

  The present invention relates to a method for manufacturing a display device and an intermediate product used for the method.

  As a method for manufacturing a liquid crystal display panel, a method using a large mother glass substrate is known, and a sealing material for sealing liquid crystals of individual products is disposed between the pair of mother glass substrates. The mother glass may be thinned by chemical etching (Patent Document 1). Moreover, a sealing material may be provided on the peripheral edge of the pair of mother glass substrates. When the mother glass substrate is chemically etched and thinned, the sealing material prevents the etchant from entering between the pair of mother glass substrates and protects the sealing material of each product.

JP 2009-73711 A

  Conventionally, due to the presence of the sealing material, the mother glass is difficult to be etched at the end, and a difference in plate thickness occurs, which has an adverse effect on the subsequent cutting process.

  An object of this invention is to provide the manufacturing method of the display apparatus which can perform a cutting process favorably, and the intermediate product used for this.

  (1) A method for manufacturing a display device according to the present invention provides an intermediate product having a pair of inorganic substrates facing each other and having a sealing space formed between the pair of inorganic substrates by an organic sealing material. And a step of cutting the pair of inorganic substrates outside the sealed space, and at least one of the opposing surfaces of the pair of inorganic substrates is provided in the sealed space for image display. A circuit is formed, and the intermediate product has a flow path partitioned by at least one surface of the pair of inorganic substrates and the organic sealing material outside the sealing space, and cuts the pair of inorganic substrates. The step of performing includes intruding an etchant for the inorganic material into the flow path, and etching the at least one surface of the pair of inorganic substrates along the flow path to form a groove. . According to the present invention, since the groove is formed in the inorganic substrate, the inorganic substrate can be favorably cut along the groove.

  (2) In the method of manufacturing a display device described in (1), the groove is formed by immersing the intermediate product in the etching solution, and the pair of inorganic substrates is opposite to each other by the etching solution. The pair of inorganic substrates may be thinned by etching the surfaces facing each other.

  (3) In the manufacturing method of the display device described in (1), a plurality of the sealing spaces may be formed by the organic sealing material.

  (4) In the manufacturing method of the display device described in (1), the organic sealing material may be provided between the pair of inorganic substrates.

  (5) In the method for manufacturing a display device according to (1), the organic sealing material includes an intervening sealing material provided between the pair of inorganic substrates, and a cover seal provided on end surfaces of the pair of inorganic substrates. And a material.

  (6) In the method for manufacturing a display device according to (1), the organic sealing material includes an inner sealing material adjacent to the sealing space, and an outer side of the sealing space surrounded by the inner sealing material. And an outer sealing material separated from the sealing material with a space therebetween.

  (7) In the method for manufacturing a display device according to (1), the organic sealing material includes a pair of all contact portions disposed so as to be in close contact with both the pair of inorganic substrates. And a semi-adhering part that is disposed between the pair of all-adhering parts and avoids contact with one of the pair of inorganic substrates and adheres to the other.

  (8) In the method for manufacturing a display device according to (1), the organic sealing material is at least one layer formed so as to extend from the inside to the outside of the sealed space between the pair of inorganic substrates. A part of the organic film may be included.

  (9) In the method for manufacturing a display device according to (1), the organic sealing material is at least one layer formed so as to extend from the inside to the outside of the sealing space between the pair of inorganic substrates. A part of the organic film and an adhesive part that is laminated on the part of the at least one organic film and adheres the pair of inorganic substrates may be included.

  (10) In the method for manufacturing a display device according to (1), the organic sealing material includes a part of at least one first organic film laminated on one inorganic substrate and the other inorganic substrate. A part of at least one layer of the second organic film, and the part of the at least one layer of the first organic film and the part of the at least one layer of the second organic film are bonded together. It is good also as being characterized.

  (11) In the method for manufacturing a display device according to (1), the organic sealing material includes a part of at least one first organic film laminated on one inorganic substrate and the other inorganic substrate. A part of at least one second organic film stacked on the substrate and an adhesive portion, and the one of the at least one first organic film and the one of the at least one second organic film. The part may be joined via the adhesive part.

  (12) In the method for manufacturing a display device described in (1), in the step of cutting the pair of inorganic substrates, a surface opposite to the surface on which the groove is formed is scribed along the groove. This may be a feature.

  (13) In the method for manufacturing a display device described in (1), the groove may be advanced by the etching to form the slit through the at least one of the pair of inorganic substrates. .

  (14) In the display device manufacturing method described in (13), the slit may be formed so as to surround the sealing space, and the at least one of the pair of inorganic substrates may be cut. .

  (15) In the display device manufacturing method described in (14), both of the pair of inorganic substrates may be cut by the etching.

  (16) In the method for manufacturing a display device described in (1), a product sealing material surrounding a space to be a product is provided in the sealed space between the pair of inorganic substrates. It is good also as arranged in the space made into the product.

  (17) In the manufacturing method of the display device described in (16), liquid crystal may be sealed in the space formed as the product by the product sealing material.

  (18) In the method for manufacturing a display device described in (16), the product sealing material may be characterized in that an opening for injecting liquid crystal is formed in the space formed as the product.

  (19) In the manufacturing method of the display device described in (1), liquid crystal may be sealed in the sealing space.

  (20) In the method of manufacturing a display device described in (1), the organic sealing material is formed to have a partition portion that partitions the sealing space into a plurality of divided sealing spaces. It is good.

  (21) In the method for manufacturing a display device described in (20), the organic sealing material may be formed so that the flow path avoids the partition portion.

  (22) In the method for manufacturing a display device described in (20), the organic sealing material may be formed so that the flow path passes through the partition portion.

  (23) In the method for manufacturing a display device according to (22), in the partition portion, the flow path is formed so as to be partitioned by only one surface of the pair of inorganic substrates and the organic sealing material. And in the part surrounding the whole said sealing area | region, the said flow path may be divided by the said surface of both said pair of inorganic substrates, and the said organic sealing material.

  (24) An intermediate product for manufacturing a display device according to the present invention includes a pair of inorganic substrates facing each other, and an organic sealing material that forms a sealed space between the pair of inorganic substrates, A circuit for image display is formed in at least one of the opposing surfaces of the pair of inorganic substrates in the sealed space, and at least one surface of the pair of inorganic substrates and the outside are disposed outside the sealed space. It has the flow path divided with the organic sealing material, It is characterized by the above-mentioned. According to the present invention, the groove can be formed in the inorganic substrate by allowing the etching solution to enter the flow path, and the inorganic substrate can be cut well along the groove.

  (25) In the intermediate product for manufacturing a display device described in (24), a plurality of the sealing spaces may be formed by the organic sealing material.

  (26) In the intermediate product for manufacturing a display device described in (24), the organic sealing material may be provided between the pair of inorganic substrates.

  (27) In the intermediate product for manufacturing a display device described in (24), the organic sealing material is provided between an intervening sealing material provided between the pair of inorganic substrates and an end surface of the pair of inorganic substrates. And a cover sealing material.

  (28) In the intermediate product for manufacturing a display device described in (24), the organic sealing material is disposed outside the sealing space surrounded by the inner sealing material adjacent to the sealing space and the inner sealing material. And an outer sealing material separated from the inner sealing material with a space therebetween.

  (29) In the intermediate product for manufacturing a display device described in (24), the organic sealing material is a pair of all-adhesive members arranged so as to be in close contact with both the pair of inorganic substrates. And a semi-contact portion that is disposed between the pair of all-contact portions and avoids contact with one of the pair of inorganic substrates and adheres to the other.

  (30) In the intermediate product for manufacturing a display device described in (24), the organic sealing material is formed between the pair of inorganic substrates so as to extend from the inside to the outside of the sealed space. A part of the organic film of the layer may be included.

  (31) In the intermediate product for manufacturing a display device described in (24), the organic sealant is formed between the pair of inorganic substrates so as to extend from the inside to the outside of the sealed space. A part of the organic film of the layer, and an adhesive portion that is stacked on the part of the organic film of the at least one layer and adheres the pair of inorganic substrates.

  (32) In the intermediate product for manufacturing a display device described in (24), the organic sealing material includes a part of at least one first organic film stacked on one inorganic substrate and the other organic material. A part of at least one second organic film stacked on an inorganic substrate, and the part of the at least one first organic film and the part of the at least one second organic film, May be joined.

  (33) In the intermediate product for manufacturing a display device described in (24), the organic sealing material includes a part of at least one first organic film laminated on one inorganic substrate and the other organic material. A part of at least one second organic film laminated on an inorganic substrate; and an adhesive portion; and the part of the at least one first organic film and the at least one second organic film. The part may be joined through the adhesive portion.

  (34) In the intermediate product for manufacturing a display device described in (24), a product sealing material surrounding a space to be a product is provided in the sealing space between the pair of inorganic substrates, The circuit may be arranged in the space to be the product.

  (35) The intermediate product for manufacturing a display device described in (34) may be characterized in that liquid crystal is sealed in the space formed as the product by the product sealing material.

  (36) In the intermediate product for manufacturing a display device described in (34), the product sealing material may be characterized in that an opening for injecting liquid crystal into the space formed in the product is formed. Good.

  (37) In the intermediate product for manufacturing a display device described in (24), liquid crystal may be sealed in the sealing space.

  (38) In the intermediate product for manufacturing a display device described in (24), the organic sealing material is formed so as to have a partition portion that divides the sealing space into a plurality of divided sealing spaces. May be a feature.

  (39) In the intermediate product for manufacturing a display device described in (38), the organic sealing material may be formed so that the flow path avoids the partition portion.

  (40) In the intermediate product for manufacturing a display device described in (38), the organic sealing material may be formed so that the flow path passes through the partition portion.

  (41) In the intermediate product for manufacturing a display device described in (40), in the partition portion, the flow path is partitioned by only one surface of the pair of inorganic substrates and the organic sealing material. The flow path may be defined by both the surfaces of the pair of inorganic substrates and the organic sealing material in a portion that is formed in a portion and surrounds the entire sealing region.

  (42) In the intermediate product for manufacturing a display device described in any one of (24) to (41), the pair of inorganic substrates may have different thicknesses.

It is a side view which shows the intermediate product which concerns on 1st Embodiment. It is the II-II sectional view taken on the line of the intermediate product shown in FIG. It is an enlarged view of the III-III line cross section of the intermediate product shown in FIG. It is an enlarged view which shows a part of cross section of one inorganic substrate. It is a figure explaining the manufacturing method of the display apparatus which concerns on 1st Embodiment. It is a figure explaining the manufacturing method of the display apparatus which concerns on 1st Embodiment. It is a figure explaining the manufacturing method of the display apparatus which concerns on the modification 1 of 1st Embodiment. It is a figure which shows the intermediate product which concerns on the modification 2 of 1st Embodiment. It is a figure which shows the intermediate product which concerns on the modification 3 of 1st Embodiment. It is a figure which shows the intermediate product which concerns on the modification 4 of 1st Embodiment. It is a figure which shows the intermediate product which concerns on the modification 5 of 1st Embodiment. It is a figure which shows the intermediate product which concerns on the modification 6 of 1st Embodiment. It is a figure which shows the intermediate product which concerns on the modification 7 of 1st Embodiment. It is a figure which shows the intermediate product which concerns on the modification 8 of 1st Embodiment. It is a figure explaining the manufacturing method of the display apparatus using the intermediate product which concerns on the modification 8. It is a figure which shows the intermediate product which concerns on the modification 9 of 1st Embodiment. It is a figure explaining the manufacturing method of the display apparatus using the intermediate product which concerns on the modification 9. FIG. It is a figure which shows the intermediate product which concerns on the modification 10 of 1st Embodiment. It is a figure explaining the manufacturing method of the display apparatus using the intermediate product which concerns on the modification 10. FIG. It is a figure which shows the intermediate product which concerns on 2nd Embodiment to which this invention is applied. It is a figure explaining the cut intermediate product concerning a 2nd embodiment. It is the XXII-XXII sectional view taken on the line of the intermediate product shown in FIG. It is a figure which shows the intermediate product from which the cut piece was removed. It is a figure which shows the modification of the intermediate product which concerns on 2nd Embodiment. FIG. 25 is a cross-sectional view of the intermediate product shown in FIG. 24 taken along the line XXV-XXV. FIG. 25 is a cross-sectional view of the intermediate product shown in FIG. 24 taken along the line XXVI-XXVI. It is a figure explaining the manufacturing method of the display apparatus which concerns on the modification of 2nd Embodiment. It is a figure explaining the manufacturing method of the display apparatus which concerns on the modification of 2nd Embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. The display device manufacturing method according to the embodiment includes a step of preparing an intermediate product. An intermediate product is a product obtained during the manufacturing process. The final product of the manufacturing process is a display device. The display device manufactured in this embodiment is a liquid crystal display device, but the present invention can also be applied to other display devices such as organic electroluminescence devices.

[First Embodiment]
FIG. 1 is a side view showing an intermediate product according to the first embodiment. 2 is a cross-sectional view of the intermediate product shown in FIG. 1 taken along the line II-II. FIG. 3 is an enlarged view of a cross section taken along line III-III of the intermediate product shown in FIG.

  The intermediate product has a pair of inorganic substrates 10 (for example, glass substrates). Each inorganic substrate 10 has a rectangular planar shape. Each of the pair of inorganic substrates 10 is a mother substrate, and is cut out along the cutting line L corresponding to each final product. A pair of inorganic substrate 10 is arrange | positioned so that it may mutually oppose at intervals. An organic sealing material 12 made of resin or the like is provided between the pair of inorganic substrates 10.

  The organic sealing material 12 is divided into an intervening sealing material 14 and a cover sealing material 16 according to the position. The intervening sealing material 14 is provided between the pair of inorganic substrates 10 (specifically, facing surfaces). The intervening sealing material 14 avoids the periphery of the inorganic substrate 10 on the opposing surfaces of the pair of inorganic substrates 10 and does not protrude from the inorganic substrate 10. The intervening sealing material 14 is in contact with or in close contact with the opposing surfaces of the pair of inorganic substrates 10. On the other hand, the cover seal material 16 is provided on the end surfaces of the pair of inorganic substrates 10 (the outer peripheral surface rising from the peripheral edge of the opposing surface). The cover sealing material 16 is configured to close the space between the pair of inorganic substrates 10 except for a part thereof. The space between the pair of inorganic substrates 10 is open to the outside in an area where the cover seal material 16 is not provided. That is, the cover seal material 16 is formed to have the opening 18. The cover seal material 16 may enter a space between the pair of inorganic substrates 10, or may be in contact with (in close contact with) the opposing surfaces (for example, end portions) of the pair of inorganic substrates 10.

  The organic sealing material 12 partially surrounds the space between the pair of inorganic substrates 10 to form a sealed space 20. In the example shown in FIG. 2, a plurality of sealed spaces 20 are formed by the organic sealing material 12 (intervening sealing material 14). In the present embodiment, the sealed space 20 is a space that includes a portion to be a final product.

  From the viewpoint of the function with respect to the sealing space 20, the organic sealing material 12 includes an inner sealing material 22 and an outer sealing material 24. The inner sealing material 22 defines the sealing space 20 and is adjacent to the sealing space 20. The outer sealing material 24 is separated from the inner sealing material 22 surrounding the sealing space 20 and is arranged outside the sealing space 20. However, as shown in FIG. 2, since a plurality of sealing spaces 20 are formed, the organic sealing material 12 as the adjacent inner sealing material 22 that surrounds the adjacent sealing spaces 20 is mutually outside. It is also a sealing material 24. That is, one of the adjacent inner sealing materials 22 is also an outer sealing material 24 with respect to the other inner sealing material 22. In other words, the organic sealing material 12 that is the inner sealing material 22 with respect to one sealing space 20 is also the outer sealing material 24 because the sealing space 20 is not partitioned with respect to the adjacent sealing space 20. On the other hand, the organic sealing material 12 that is separated from the portion of the inner sealing material 22 closest to the end of the inorganic substrate 10 in the direction of the peripheral edge of the inorganic substrate 10 includes a sealed space 20 that includes a portion that becomes a final product. However, the outer seal material 24 is not the inner seal material 22.

  The organic sealing material 12 a that is the outer sealing material 24 but not the inner sealing material 22 includes a first portion 26 that extends along the organic sealing material 12 b that is the inner sealing material 22, and an outward direction (inner sealing material) from the first portion 26. And a second portion 28 that is folded back and extends at an angle of more than 90 degrees (in a direction away from 22). The second portions 28 adjacent to each other of the adjacent organic sealing materials 12 are arranged with a space therebetween, and the space widens outward. Then, the cover seal material 16 is provided in contact with (adhering to) the front end portion (for example, the outside) of the second portion 28. In the example of FIG. 2, there is a space sealed by the cover sealing material 16 and the second portion 28 at the end of the inorganic substrate 10, but this is not the sealed space 20 defined in the present invention. Adjacent cover seal materials 16 that contact (adhere) the adjacent second portions 28 of the adjacent organic seal materials 12 are arranged at intervals, and the intervals narrow toward the outside. It has become. An opening 18 is formed between the cover seal materials 16 adjacent to each other. The pair of cover seal materials 16 positioned on both sides of the opening 18 are formed so that the distance between them is narrowed outward.

  At the corner of the rectangular inorganic substrate 10, an organic sealing material 12 c that is bent in a V shape is disposed with both ends directed in the angular direction of the inorganic substrate 10. Since the V-shaped organic sealing material 12 c is not related to the sealing space 20, it does not correspond to either the inner sealing material 22 or the outer sealing material 24. The cover seal material 16 is also in close contact with both ends (for example, the outside) of the V-shaped organic seal material 12c, and a sealed space is formed by these, which is also a seal defined in the present invention. It is not the stop space 20. In the example of FIG. 2, the portion from the tip of the V-shaped organic sealing material 12 c to the bent portion and the above-described second portion 28 of the organic sealing material 12 a are arranged so as to be adjacent to each other with a gap therebetween. The interval is extended toward the outer side of the inorganic substrate 10. The cover seal material 16 (contacting the V-shaped organic seal material 12c) disposed at the corner of the inorganic substrate 10 and the cover seal material 16 adjacent to the cover seal material 16 (contacting the second portion 28) are spaced apart from each other. It is arranged with a gap, and the interval is narrowed outward. That is, the pair of cover seal materials 16 positioned on both sides of the opening 18 are formed so that the distance between them is narrowed outward.

  As shown in FIG. 3, one or a plurality of layers of organic films are formed between the pair of inorganic substrates 10 so as to extend from the inside to the outside (including the position where the organic sealing material 12 b is disposed) of the sealed space 20. 30 is formed. For example, on the inorganic substrate 10 that is a color filter substrate, an organic film 30a that constitutes a black matrix and an organic film 30b that constitutes an overcoat layer are laminated. A bonding portion 32 is laminated on these organic films 30 to bond a pair of inorganic substrates 10. The organic sealing material 12 includes a part of each organic film 30 and an adhesive portion 32. That is, the organic sealing material 12 includes a part of the organic film 30 of one layer or a plurality of layers. In the example of FIG. 3, an inorganic film 34 is formed on the lower inorganic substrate 10.

  As shown in FIG. 2, a product sealing material 36 is provided between the pair of inorganic substrates 10 in the sealed space 20 so as to surround a space to be a product. A plurality of product sealing materials 36 are provided in one sealing space 20. A liquid crystal 38 is sealed by a product sealing material 36 in a space for the product.

FIG. 4 is an enlarged view showing a part of a cross section of one inorganic substrate 10. A thin film transistor is formed on the inorganic substrate 10. That is, the inorganic substrate 10 is a TFT (Thin Film Transistor) substrate. The thin film transistor is a switch for controlling driving of the liquid crystal 38 (see FIG. 2). The thin film transistor is a bottom gate type in which a gate electrode 40 to which a control scanning voltage is applied is disposed below. A gate electrode 40 made of an inorganic material (semiconductor oxide such as SiO ₂ or semiconductor nitride such as SiN) is formed on the inorganic substrate 10. A gate insulating film 42 is formed so as to cover the gate electrode 40. A semiconductor layer 44 is formed on the gate insulating film 42. A source electrode 46 and a drain electrode 48 are formed on the semiconductor layer 44. A protective insulating layer 50 made of an inorganic material (a semiconductor oxide such as SiO ₂ or a semiconductor nitride such as SiN) is formed so as to cover the source electrode 46, the drain electrode 48, and the semiconductor layer 44. The protective insulating layer 50 prevents humidity contamination of the semiconductor layer 44. The inorganic film 34 shown in FIG. 3 includes a gate insulating film 42 and a protective insulating layer 50.

  When the gate voltage is applied to the gate electrode 40, the resistance of the semiconductor layer 44 between the drain electrode 48 and the source electrode 46 to which the video signal voltage is applied is reduced, and thereby the pixel electrode 52 connected to the source electrode 46 and Then, an electric field is generated between the common electrodes 54 to which a common voltage is applied, and this is applied to the liquid crystal 38 to change the transmittance of the liquid crystal 38 and display. The liquid crystal driving method according to the present embodiment is an IPS (In Plane Switching) method.

  An organic insulating film 47 is disposed above the thin film transistor (on the protective insulating layer 50). A common electrode 54 is formed on the organic insulating film 47. An interlayer insulating film 55 is formed on the common electrode 54. The interlayer insulating film 55 is made of an insulating film made of an inorganic material such as SiN. Further, a pixel electrode 52 is formed on the upper portion. A liquid crystal 38 (not shown) (see FIG. 2) is disposed on the pixel electrode 52.

  The circuit described above is a circuit for image display. This circuit is formed on at least one of the opposing surfaces of the pair of inorganic substrates 10 (lower inorganic substrate 10 in the example of FIG. 3). The circuit is arranged in a space (a region surrounded by the product sealing material 36) to be a product.

  As shown in FIG. 3, a flow path 56 is defined outside the sealed space 20 by at least one surface of the pair of inorganic substrates 10 and the organic sealing material 12. As shown in FIG. 2, the flow path 56 passes between the adjacent sealed spaces 20 and circulates to the outside through the outside of the sealed space 20. In the example of FIG. 2, the integral flow paths 56 that are in communication with each other are formed, but as a modification, a plurality of flow paths 56 that are not in communication may be formed.

  As shown in FIG. 2, the flow path 56 communicates with the outside through an opening 18 formed by not providing the cover seal material 16. The flow path 56 includes an organic sealing material 12b that is the inner sealing material 22 and an organic sealing material 12a that is the outer sealing material 24 but does not become the inner sealing material 22 at a position surrounding the entirety of the plurality of sealing spaces 20. It is formed between. The flow path 56 is formed between a pair of organic sealing materials 12 b that are the inner sealing materials 22 that define the sealing spaces 20 and are also relatively outer sealing materials 24 between the adjacent sealing spaces 20. Is done. A flow path 56 is also formed between a pair of adjacent organic sealing materials 12 a that are adjacent to each other but are not the inner sealing material 22. Further, a flow path 56 is also formed between the organic sealing material 12a that is the outer sealing material 24 but does not become the inner sealing material 22, and the organic sealing material 12c that does not become the inner sealing material 22 or the outer sealing material 24. Is done. A channel 56 is also formed between the pair of cover seal materials 16 that sandwich the opening 18.

  The opposing surface of the inorganic substrate 10 is exposed in the flow path 56. Specifically, the opposing surface itself of the base material of the inorganic substrate 10 may be exposed, or the surface of a layer made of an inorganic material provided on the base material of the inorganic substrate 10 may be exposed. In any case, the surface exposed to the flow path 56 of at least one of the inorganic substrates 10 is made of an inorganic material. One or more organic films 30 (see FIG. 3) formed on the inorganic substrate 10 are formed so as to avoid the flow path 56. Besides this, there is no organic material between the inorganic substrate 10 and the flow path 56.

  5 and 6 are views for explaining a method for manufacturing the display device according to the present embodiment. The method for manufacturing the display device includes a step of cutting the pair of inorganic substrates 10 outside the sealed space 20.

  Specifically, as shown in FIG. 5, an etchant 58 for the inorganic material is caused to enter the flow path 56. The groove 60 is formed by etching at least one surface of the pair of inorganic substrates 10 along the flow path 56 with the etchant 58. According to the present embodiment, the groove 60 can be formed in the inorganic substrate 10 by allowing the etchant 58 to enter the flow path 56, and the inorganic substrate 10 can be favorably cut along the groove 60.

  The step of forming the groove 60 can be performed simultaneously with the step of thinning the inorganic substrate 10. For example, the intermediate product is immersed in the etching solution 58. Thereby, the etching solution 58 can enter the flow path 56. The surfaces facing the opposite sides of the pair of inorganic substrates 10 are etched by the etchant 58, and the pair of inorganic substrates 10 are thinned.

  Next, a surface opposite to the surface on which the groove 60 is formed is scribed along the groove 60. Then, as shown in FIG. 6, the pair of inorganic substrates 10 is cut. That is, the pair of inorganic substrates 10 is cut out in a state where a plurality of sealing spaces 20 (see FIG. 2) are sealed with the organic sealing material 12. In each sealed space 20, spaces made into a plurality of products are sealed with the product sealing material 36, and these are cut out for each product. Thus, a display device can be obtained.

[Modification]
FIG. 7 is a diagram for explaining a method for manufacturing a display device according to the first modification of the present embodiment. In this example, the groove is advanced to cut both the pair of inorganic substrates 10. That is, the slit 62 penetrating the inorganic substrate 10 is formed by etching. The slit 62 is formed so as to surround the sealing space 20 (see FIG. 2). According to this, scribing can be omitted. Moreover, there is an effect of omitting the process only by cutting one inorganic substrate 10 by etching. Other details are as described in the above embodiment.

  FIG. 8 is a diagram illustrating an intermediate product according to the second modification of the present embodiment. In this example, the product sealing material 64 is formed with an opening 66 for injecting liquid crystal into a space to be a product in a subsequent process. Therefore, the inside of the product sealing material 64 is empty. That is, a plurality of empty cells are arranged in the sealed space 20. The product sealing material 64 continuously partitions a plurality of empty cells. The pair of inorganic substrates 10 are cut for each empty cell after being cut along the groove 60 (see FIG. 5) described above. Thereafter, liquid crystal is injected into the empty cell. The other contents correspond to the contents described in the above embodiment.

  FIG. 9 is a diagram illustrating an intermediate product according to the third modification of the present embodiment. In this example, the liquid crystal 68 is sealed in the sealed space 20. That is, the product sealing material is not provided in the sealing space 20, and the entire sealing space 20 becomes one product. Therefore, the pair of inorganic substrates 10 cut out for each sealed space 20 is not cut out again because it becomes a product. This content can be applied to the above embodiment. Further, in this example, the cover seal material 16 shown in FIG. 2 is omitted. The organic sealing material 12 positioned adjacent to the flow path 56 on the most end side of the pair of inorganic substrates 10 is the intervening sealing material 14 and is the outer sealing material 24 that does not seal the sealing space 20. This content can also be applied to the above embodiment.

  FIG. 10 is a diagram illustrating an intermediate product according to the fourth modification of the present embodiment. In this example, the shape of the organic sealing material 70 as the outer sealing material located on the most end side of the pair of inorganic substrates 10 adjacent to the flow path 56 is different from that of the third modification shown in FIG. That is, in the example of FIG. 9, the organic sealing material 12 a is disposed so as to avoid the peripheral portions of the pair of inorganic substrates 10, whereas in the example of FIG. 10, the organic sealing material 12 a reaches the periphery of the pair of inorganic substrates 10. An organic sealing material 70 is disposed on the surface. The other contents correspond to the contents described in the third modification.

  FIG. 11 is a diagram illustrating an intermediate product according to the fifth modification of the present embodiment. In this example, the shape of the organic sealing material 72 as the outer sealing material located on the most end side of the pair of inorganic substrates 10 is different from that of the third modification shown in FIG. That is, unlike the example of FIG. 9, in the example of FIG. 11, the organic seal material 72 as the outer seal material located on the outermost side is formed so as to surround a predetermined region. Moreover, the organic sealing material 74 that does not correspond to either the inner sealing material or the outer sealing material is also formed so as to surround a predetermined region. The other contents correspond to the contents described in the third modification.

FIG. 12 is a diagram illustrating an intermediate product according to the sixth modification of the present embodiment. In this example, the inorganic substrate 10 is cut along a plurality of cutting lines L. However, the flow path 76 is not formed along all the cutting lines L, which is different from the above embodiment. Passage 76 is formed along the cutting line L _X except at least one of the plurality of cutting lines L. Further, the channel 76 is not formed so as to reach the end of the inorganic substrate 10. That is, the flow path 76 is formed so as to avoid the end of the inorganic substrate 10. Specifically, the inner sealing material 78 is formed avoiding the end portion of the inorganic substrate 10, and the outer sealing material 80 is also formed avoiding the end portion of the inorganic substrate 10. Thus, the channel 76 is formed only on a part of the cutting line L _X. Such flow path 76 of the etching solution is entering, to form a groove only in a part of the cutting line L _X. In the region where the groove is formed, the inorganic substrate 10 is cut along the groove by a method such as scribing. In the region where the groove is not formed, the inorganic substrate 10 is cut by a conventional method without the groove. In this example, the cutting line L is also planned to cross the sealing space 20, and this point can be applied to the above-described embodiment or other modifications. The other contents correspond to the contents described in the above embodiment.

  FIG. 13 is a diagram illustrating an intermediate product according to Modification 7 of the present embodiment. In this example, a plurality of flow paths 82 are formed in one cutting line L so as not to communicate with each other. Each channel 82 has an opening 84 at the end of the inorganic substrate 10 and communicates with the outside. In the example of FIG. 13, a pair of flow paths 82 are formed on one cutting line L so that the openings 84 face in opposite directions. Each flow path 82 includes a main path 86 and a branch path 88, and the main path 86 extends along the cutting line L. The branch path 88 extends in a direction intersecting with the main path 86 and has an opening 90 different from the opening 18 of the main path 86. That is, one flow path 82 has a plurality of openings 84 and 90 and is formed so as to be connected to all the openings 84 and 90.

  The sealing space 92 is sealed with an inner sealing material 94 and a cover sealing material 96. That is, the inner sealing material 94 intermittently surrounds the sealing space 92 and forms an opening 98 of the sealing space 92. The opening 98 is covered with a cover seal material 96. The sealing space 92 has one or a plurality of openings 98 (two on the left and right in FIG. 13) by the inner sealing material 94. The opening 98 is used as a liquid crystal injection port. The flow channel 82 is formed so as not to pass through the opening 98 of the sealed space 92. Therefore, no groove is formed in the opening 98 of the sealed space 92.

  When the method according to this embodiment is applied using this intermediate product, the etching solution does not enter the sealing space 92 covered with the cover seal material 96, and a groove is formed along the flow path 82. . The groove is not formed from the end of the inorganic substrate 10 to the other end along the cutting line L, and is formed only in a part of the section. Even if it is such a groove | channel, a cutting process will become easy by utilizing this. After the cutting process is completed, the cover seal material 96 is removed, and liquid crystal is injected from the opening 98 formed from the cut of the inner seal material 94, whereby a final product can be obtained.

  FIG. 14 is a diagram illustrating an intermediate product according to Modification 8 of the present embodiment. In this example, the organic sealing material 100 includes a pair of all contact portions 102 that are disposed with a space therebetween so as to be in close contact with both of the pair of inorganic substrates 10. In the example of FIG. 14, each full contact portion 102 is constituted by a part of at least one organic film 104 and an adhesive portion 106. At least one layer of the organic film 104 is in close contact with one inorganic substrate 10, the bonding portion 106 is in close contact with the other inorganic substrate 10, and the organic film 104 and the bonding portion 106 are in close contact. The bonding portion 106 is adjacent to the sealing space 108. The organic sealing material 100 includes a semi-adhesion portion 110 that is disposed between the pair of all-adhesion portions 102 and avoids contact with one of the pair of inorganic substrates 10 and adheres to the other. At least a part (for example, the adhesion part 106) and the semi-adhesion part 110 of each of the all adhesion parts 102 are integrally formed, and the semi-adhesion part is formed on the remaining part (for example, at least one layer of the organic film 104). 110 is in close contact. A channel 112 is formed between the pair of all-adhering portions 102 and between the inorganic substrate 10 and the semi-adhering portion 110 where the semi-adhering portion 110 does not contact. FIG. 14 is a view showing a cross section orthogonal to the length direction of the pair of full contact portions 102 and semi-contact portions 110.

  FIG. 15 is a diagram illustrating a method for manufacturing a display device using an intermediate product according to the modification 8. Since one surface of the pair of inorganic substrates 10 is exposed in the flow path 112, the grooves 114 can be formed in the inorganic substrate 10 having the exposed surfaces with an etching solution. On the other hand, since the other inorganic substrate 10 is covered with the organic sealing material 100, it is not exposed to the etching solution and no groove is formed. Thus, the groove 114 can be formed in only one of the pair of inorganic substrates 10. Further, the inorganic substrate 10 in which the grooves 114 are formed is cut by scribing or the like from a surface opposite to the surface on which the grooves 114 are formed. Regarding this example, the other contents correspond to the contents described in the above embodiment.

  FIG. 16 is a diagram illustrating an intermediate product according to the ninth modification of the present embodiment. In this example, the organic sealing material 116 includes a part of at least one first organic film 118 laminated on one inorganic substrate 10. In the example of FIG. 16, the first organic film 118 a constituting the black matrix under the upper inorganic substrate 10, the first organic film 118 b constituting the overcoat thereunder, and the gap between the pair of inorganic substrates 10 are secured. A first organic film 118c constituting a spacer is provided. The organic sealing material 116 includes a part of at least one second organic film 120 stacked on the other inorganic substrate 10. A part of the first organic film 118 of at least one layer and a part of the second organic film 120 of at least one layer are bonded (for example, closely adhered). Other contents correspond to the contents described in the above-described embodiment (particularly, refer to FIG. 3).

  FIG. 17 is a diagram illustrating a method for manufacturing a display device using the intermediate product according to the modification 9. Since both surfaces of the pair of inorganic substrates 10 are exposed in the flow path 122, the grooves 123 can be formed in both inorganic substrates 10 with an etching solution. Further, FIG. 17 shows an example in which only one inorganic substrate 10 is cut by scribing or the like, and this content can be applied to the above-described embodiment and other modifications. Regarding this example, the other contents correspond to the contents described in the above embodiment.

  FIG. 18 is a diagram illustrating an intermediate product according to the tenth modification of the present embodiment. In this example, the thickness of the pair of inorganic substrates 124 and 126 is different. The organic sealing material 128 includes a part of at least one layer of the first organic film 130 stacked on one inorganic substrate 124 and at least one layer of the second organic film 132 stacked on the other inorganic substrate 126. A part and the adhesion part 125 are included. A part of at least one layer of the first organic film 130 and a part of at least one layer of the second organic film 132 are joined via an adhesive portion 125. Regarding this example, the other contents correspond to the contents described in the above embodiment.

  FIG. 19 is a diagram illustrating a method for manufacturing a display device using the intermediate product according to the modification 10. Since both surfaces of the pair of inorganic substrates 124 and 126 are exposed in the flow path 134, the groove 129 can be formed in both the inorganic substrates 124 and 126 with an etching solution. Also in this example, the outer surfaces of the inorganic substrates 124 and 126 are etched and thinned with an etching solution. Since the thickness of the pair of inorganic substrates 10 is different, etching of the outer surface of the thinner inorganic substrate 124 is continued until the groove 129 penetrates the inorganic substrate 124. If the groove 129 continuously surrounds the sealing space 136, the inorganic substrate 124 can be cut only by etching. On the other hand, the thicker inorganic substrate 126 is not cut because the groove 129 is formed but the groove 129 does not penetrate the outer surface. Regarding this example, the other contents correspond to the contents described in the above embodiment.

[Second Embodiment]
FIG. 20 is a diagram showing an intermediate product according to the second embodiment to which the present invention is applied. In this example, the first cutting line L ₁ of the inorganic substrate 210 is set so as to surround the above polygonal pentagonal. A sealing space 212 is located in the polygonal region. Along the first cutting line L _1, to form a flow path 214 as described in the above embodiments. The flow path 214 includes an inner path 216 that surrounds the sealed space 212 and an outer path 220 that branches from the inner path 216 and connects to the opening 218. The inner path 216 is formed to draw a polygon, and the outer path 220 extends from the corner of the polygon. The outer path 220 extends at right angles to the sides of the rectangular inorganic substrate 210.

  The organic sealing material 222 has a partition part 217 that partitions the sealed space 212 into a plurality of divided sealed spaces 215a and 215b. The plurality of divided sealed spaces 215a and 215b have different sizes. In the larger divided sealed space 215a, a liquid crystal 219 is sealed. The smaller divided sealed space 215b includes a region for mounting the integrated circuit chip 221 for driving the liquid crystal 219, and a circuit (not shown) for that is formed.

  A groove is formed along the flow path 214 by flowing an etching solution through the flow path 214 shown in FIG. Since the organic sealant 222 is formed so that the flow path 214 avoids the partition part 217, a groove along the partition part 217 is not formed. If the groove is formed so as to penetrate the inorganic substrate 210, the inorganic substrate 210 can be cut into a polygonal shape without performing scribing. In detail, the groove | channel of an opposing surface can be penetrated to an outer surface by immersing an intermediate product in etching liquid, etching the outer surface of a pair of inorganic substrate 210, and making thickness thin.

FIG. 21 is a diagram for explaining the cut intermediate product. 22 is a cross-sectional view of the intermediate product shown in FIG. 21 taken along line XXII-XXII. By the above process, the inorganic substrate 210 is cut as shown in FIG. Then, along a second cutting line L _2, cutting one of the inorganic substrate 210. The second cutting line _{L 2,} a plurality of split sealing space 215a, is set to at least one outer 215b. For example, one inorganic substrate 210 is cut along the partition part 217 outside the larger divided sealed space 215a (that is, on the smaller divided sealed space 215b side). This cutting is performed by applying a conventional method such as scribing. Thereby, a part of one inorganic substrate 210 becomes the cut piece 224 outside the partition part 217. The cut piece 224 of one inorganic substrate 210 is fixed to the other inorganic substrate 210 by an organic sealing material 222. In order to remove the organic sealing material 222, further along the third cutting line L _3, to cut both the inorganic substrate 210. This cutting is also performed by applying a conventional method such as scribing. In this way, the cut piece 224 is removed.

FIG. 23 is a diagram illustrating the intermediate product from which the cut piece 224 has been removed. A region for mounting the integrated circuit chip 221 is exposed, and a final product can be obtained by mounting the integrated circuit chip 221 in the subsequent process. Incidentally, peeling the cut pieces 224 of an organic sealing material 222 is possible, the cleavage of both inorganic substrate 210 along a third cut line L ₃ may be omitted. The details described in the above embodiment apply to other details.

  FIG. 24 is a diagram illustrating a modification of the intermediate product according to the second embodiment. 25 is a cross-sectional view of the intermediate product shown in FIG. 24 taken along line XXV-XXV. 26 is a cross-sectional view of the intermediate product shown in FIG. 24 taken along the line XXVI-XXVI. The organic sealing material 322 includes a partition part 316. The intermediate product according to this modification is different from the second embodiment in that the flow path 314 passes through the partition part 316. In the partition part 316, the flow path 314 is partitioned by only one surface of the pair of inorganic substrates 310 and the organic sealing material 322. The details of the partition unit 316 correspond to the contents described with reference to FIG. Note that the flow path 314 is partitioned by both surfaces of the pair of inorganic substrates 310 and the organic sealing material 322 in a portion surrounding the entire sealing space 312. Also in this modified example, the sealing space 312 is divided into a plurality of divided sealing spaces 315a and 315b, as in the second embodiment. Unlike the second embodiment, a part 324 (partition part 316 is not included) adjacent to the smaller divided sealing space 315b of the organic sealing material 322 surrounding the sealing space 312 is the other part. The width is narrower than.

  27 and 28 are diagrams for explaining a method of manufacturing a display device according to a modification of the second embodiment. In this modified example, as shown in FIG. 27, since the flow path 314 passes through the partition part 316, the groove 326 is formed in one inorganic substrate 310 exposed to the flow path 314 by the etching solution. In this example, the groove 326 penetrates the inorganic substrate 310, so that the inorganic substrate 310 is cut only by etching. Specifically, the pair of inorganic substrates 310 are cut out to have a polygonal planar shape only by etching, and a part of one inorganic substrate 310 is cut. Other details are as described in the second embodiment. In this way, the pair of inorganic substrates 310 is cut so as to surround the sealing space 312. In the partition unit 316, only one inorganic substrate 310 is cut.

  The cut piece 322 of one inorganic substrate 310 cut by the partition part 316 is fixed to the other inorganic substrate 310 by the organic sealing material 322, but the organic sealing material 322 in this portion 324 has a width as described above. Is narrower. Therefore, it is easy to peel off the cut piece 322. By peeling off the cut piece 322, an area for mounting the integrated circuit chip 320 can be exposed as shown in FIG.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the configuration described in the embodiment can be replaced with substantially the same configuration, a configuration that exhibits the same operational effects, or a configuration that can achieve the same purpose.

DESCRIPTION OF SYMBOLS 10 Inorganic board | substrate, 12 Organic sealing material, 12a Organic sealing material, 12b Organic sealing material, 12c Organic sealing material, 14 Intervening sealing material, 16 Cover sealing material, 18 Opening, 20 Sealing space, 22 Inner sealing material, 24 Outer sealing Material 26 first part 28 second part 30 organic film 30a organic film 30b organic film 32 adhesive part 34 inorganic film 36 product sealant 38 liquid crystal 40 gate electrode 42 gate insulating film 44 Semiconductor layer, 46 source electrode, 47 organic insulating film, 48 drain electrode, 50 protective insulating layer, 52 pixel electrode, 54 common electrode, 55 interlayer insulating film, 56 channel, 58 etching solution, 60 groove, 62 slit, 64 products Seal material, 66 opening, 68 liquid crystal, 70 organic seal material, 72 organic seal material, 74 organic seal material, 76 flow path, 78 inner seal material, 0 outer sealing material, 82 flow path, 84 opening, 86 main path, 88 branching path, 90 opening, 92 sealing space, 94 inner sealing material, 96 cover sealing material, 98 opening, 100 organic sealing material, 102 full adhesion part , 104 Organic film, 106 Adhesive part, 108 Sealing space, 110 Semi-adhesion part, 112 Flow path, 114 Groove, 116 Organic sealant, 118 First organic film, 118a First organic film, 118b First organic film, 118c 1st organic film, 120 2nd organic film, 122 flow path, 123 groove, 124 inorganic substrate, 125 adhesion part, 126 inorganic substrate, 128 organic sealing material, 129 groove, 130 1st organic film, 132 2nd organic film, 134 flow path, 136 sealed space, 210 inorganic substrate, 212 sealed space, 214 flow path, 215a divided sealed space, 215b divided sealed space, 216 inner path, 217 par Portion, 218 opening, 219 liquid crystal, 220 outer path, 221 integrated circuit chip, 222 organic sealant, 224 cut piece, 310 inorganic substrate, 312 sealing space, 314 flow path, 315a divided sealing space, 315b divided sealing Space, 316 partition part, 320 integrated circuit chip, 322 organic sealant, 322 cut piece, 324 part, 326 groove, L cutting line, L _X cutting line, L ₁ first cutting line, L ₂ second cutting line, L ₃ Third cutting line.

Claims (42)

Preparing an intermediate product having a pair of inorganic substrates facing each other and having a sealing space formed between the pair of inorganic substrates by an organic sealing material;
Cutting the pair of inorganic substrates outside the sealing space;
Including
On at least one of the opposing surfaces of the pair of inorganic substrates, a circuit for image display is formed in the sealed space,
The intermediate product has a flow path partitioned by at least one surface of the pair of inorganic substrates and the organic sealing material outside the sealed space,
In the step of cutting the pair of inorganic substrates, an etchant for an inorganic material is intruded into the flow path, and the groove is formed by etching the at least one surface of the pair of inorganic substrates along the flow path. A method for manufacturing a display device, comprising: In the manufacturing method of the display device according to claim 1,
The groove is formed by immersing the intermediate product in the etching solution,
A method of manufacturing a display device, comprising: etching the surfaces of the pair of inorganic substrates facing away from each other with the etchant to thin the pair of inorganic substrates. In the manufacturing method of the display device according to claim 1,
A method for manufacturing a display device, wherein a plurality of the sealing spaces are formed by the organic sealing material. In the manufacturing method of the display device according to claim 1,
The method for manufacturing a display device, wherein the organic sealing material is provided between the pair of inorganic substrates. In the manufacturing method of the display device according to claim 1,
The organic sealing material includes an intervening sealing material provided between the pair of inorganic substrates, and a cover sealing material provided on end surfaces of the pair of inorganic substrates. In the manufacturing method of the display device according to claim 1,
The organic sealing material includes an inner sealing material adjacent to the sealing space, and an outer sealing material separated from the inner sealing material at an interval outside the sealing space surrounded by the inner sealing material. A manufacturing method of a display device characterized by the above. In the manufacturing method of the display device according to claim 1,
The organic sealing material is disposed between the pair of all contact portions and the pair of all contact portions disposed so as to be in close contact with both of the pair of inorganic substrates, and the pair of inorganic contact portions. A method for manufacturing a display device, comprising: a semi-contact portion that avoids contact with one side of a substrate and is in close contact with the other. In the manufacturing method of the display device according to claim 1,
The organic sealing material includes a part of at least one organic film formed between the pair of inorganic substrates so as to extend from the inside to the outside of the sealed space. . In the manufacturing method of the display device according to claim 1,
The organic sealant includes a part of at least one organic film formed between the pair of inorganic substrates from the inside to the outside of the sealed space, and the one of the at least one organic film. And a bonding part that bonds the pair of inorganic substrates to each other. In the manufacturing method of the display device according to claim 1,
The organic sealing material includes a part of at least one first organic film laminated on one inorganic substrate, a part of at least one second organic film laminated on the other inorganic substrate, Including
The method for manufacturing a display device, wherein the part of the at least one first organic film and the part of the at least one second organic film are joined. In the manufacturing method of the display device according to claim 1,
The organic sealing material includes a part of at least one first organic film laminated on one inorganic substrate, a part of at least one second organic film laminated on the other inorganic substrate, An adhesive portion, and
The method for manufacturing a display device, wherein the part of the at least one first organic film and the part of the at least one second organic film are bonded to each other through the adhesive portion. . In the manufacturing method of the display device according to claim 1,
A method of manufacturing a display device, wherein, in the step of cutting the pair of inorganic substrates, a surface opposite to the surface on which the groove is formed is scribed along the groove. In the manufacturing method of the display device according to claim 1,
A method of manufacturing a display device, wherein the slit is formed by advancing the groove through the at least one of the pair of inorganic substrates by the etching. In the manufacturing method of the display device according to claim 13,
A manufacturing method of a display device, wherein the slit is formed so as to surround the sealing space, and the at least one of the pair of inorganic substrates is cut. In the manufacturing method of the display device according to claim 14,
A method for manufacturing a display device, wherein both of the pair of inorganic substrates are cut by the etching. In the manufacturing method of the display device according to claim 1,
Between the pair of inorganic substrates, in the sealing space, a product sealing material surrounding a space to be a product is provided,
The method for manufacturing a display device, wherein the circuit is arranged in the space for the product. In the manufacturing method of the display device according to claim 16,
A liquid crystal is sealed with the product sealing material in the space formed as the product. In the manufacturing method of the display device according to claim 16,
The method for manufacturing a display device, wherein the product sealing material has an opening for injecting liquid crystal into the space formed as the product. In the manufacturing method of the display device according to claim 1,
A method for manufacturing a display device, wherein liquid crystal is sealed in the sealing space. In the manufacturing method of the display device according to claim 1,
The method for manufacturing a display device, wherein the organic sealing material is formed to have a partition portion that partitions the sealing space into a plurality of divided sealing spaces. In the manufacturing method of the display device according to claim 20,
The method for manufacturing a display device, wherein the organic sealing material is formed so that the flow path avoids the partition portion. In the manufacturing method of the display device according to claim 20,
The organic sealing material is formed so that the flow path passes through the partition part. In the manufacturing method of the display device according to claim 22,
In the partition part, the flow path is formed so as to be partitioned by only the one surface of the pair of inorganic substrates and the organic sealing material,
The method for manufacturing a display device, wherein the flow path is partitioned by both the surfaces of the pair of inorganic substrates and the organic sealing material in a portion surrounding the entire sealing region. A pair of inorganic substrates facing each other;
An organic sealing material that forms a sealed space between the pair of inorganic substrates;
Have
On at least one of the opposing surfaces of the pair of inorganic substrates, a circuit for image display is formed in the sealed space,
An intermediate product for manufacturing a display device, comprising a flow path partitioned by at least one surface of the pair of inorganic substrates and the organic sealing material outside the sealing space. An intermediate product for manufacturing a display device according to claim 24,
An intermediate product for manufacturing a display device, wherein a plurality of the sealing spaces are formed by the organic sealing material. An intermediate product for manufacturing a display device according to claim 24,
The organic sealing material is an intermediate product for manufacturing a display device, which is provided between the pair of inorganic substrates. An intermediate product for manufacturing a display device according to claim 24,
The organic sealing material includes an intermediate sealing material provided between the pair of inorganic substrates, and a cover sealing material provided on an end surface of the pair of inorganic substrates. . An intermediate product for manufacturing a display device according to claim 24,
The organic sealing material includes an inner sealing material adjacent to the sealing space, and an outer sealing material separated from the inner sealing material at an interval outside the sealing space surrounded by the inner sealing material. An intermediate product for manufacturing display devices. An intermediate product for manufacturing a display device according to claim 24,
The organic sealing material is disposed between the pair of all contact portions and the pair of all contact portions disposed so as to be in close contact with both of the pair of inorganic substrates, and the pair of inorganic contact portions. An intermediate product for manufacturing a display device, comprising: a semi-contact portion that avoids contact with one of the substrates and adheres to the other. An intermediate product for manufacturing a display device according to claim 24,
The organic sealing material includes a part of at least one organic film formed between the pair of inorganic substrates so as to extend from the inside to the outside of the sealing space. Intermediate product. An intermediate product for manufacturing a display device according to claim 24,
The organic sealant includes a part of at least one organic film formed between the pair of inorganic substrates from the inside to the outside of the sealed space, and the one of the at least one organic film. An intermediate product for manufacturing a display device, comprising: an adhesive portion that is laminated on a portion and adheres the pair of inorganic substrates. An intermediate product for manufacturing a display device according to claim 24,
The organic sealing material includes a part of at least one first organic film laminated on one inorganic substrate, a part of at least one second organic film laminated on the other inorganic substrate, Including
An intermediate product for manufacturing a display device, wherein the part of the at least one first organic film is joined to the part of the at least one second organic film. An intermediate product for manufacturing a display device according to claim 24,
The organic sealing material includes a part of at least one first organic film laminated on one inorganic substrate, a part of at least one second organic film laminated on the other inorganic substrate, An adhesive portion, and
For manufacturing a display device, the part of the at least one first organic film and the part of the at least one second organic film are bonded to each other through the adhesive portion. Intermediate product. An intermediate product for manufacturing a display device according to claim 24,
Between the pair of inorganic substrates, in the sealing space, a product sealing material surrounding a space to be a product is provided,
The said circuit is arrange | positioned in the said space made into the said product, The intermediate product for display apparatus manufacture characterized by the above-mentioned. An intermediate product for manufacturing a display device according to claim 34,
An intermediate product for manufacturing a display device, characterized in that liquid crystal is sealed with the product sealing material in the space formed as the product. An intermediate product for manufacturing a display device according to claim 34,
An intermediate product for manufacturing a display device, wherein the product sealing material has an opening for injecting liquid crystal into the space formed as the product. An intermediate product for manufacturing a display device according to claim 24,
An intermediate product for manufacturing a display device, wherein liquid crystal is sealed in the sealing space. An intermediate product for manufacturing a display device according to claim 24,
The said organic sealing material is formed so that it may have a partition part which divides the said sealing space into several division | segmentation sealing space, The intermediate product for display apparatus manufacture characterized by the above-mentioned. An intermediate product for manufacturing a display device according to claim 38,
The organic sealing material is an intermediate product for manufacturing a display device, wherein the flow path is formed so as to avoid the partition portion. An intermediate product for manufacturing a display device according to claim 38,
The said organic sealing material is formed so that the said flow path may pass through the said partition part, The intermediate product for display apparatus manufacture characterized by the above-mentioned. The intermediate product for manufacturing a display device according to claim 40,
In the partition part, the flow path is formed so as to be partitioned by only the one surface of the pair of inorganic substrates and the organic sealing material,
An intermediate product for manufacturing a display device, wherein the flow path is partitioned by both the surfaces of the pair of inorganic substrates and the organic sealing material in a portion surrounding the entire sealing region. In the intermediate product for manufacturing a display device according to any one of claims 24 to 41,
The intermediate product for manufacturing a display device, wherein the pair of inorganic substrates have different thicknesses.

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