KR20170077656A - Flexible Display Device and Method for Manufacturing the Same - Google Patents

Abstract

The present invention relates to a flexible display device which is easy to peel off during glass removal and a method of manufacturing the same, and a flexible display device of the present invention is a flexible display device in which a polymer substrate is formed on a glass substrate and then inorganic films are formed, Holes are formed so that inorganic films having strong bonding force to the glass substrate at the edges are not present, thereby facilitating the peeling of the glass substrate.

Description

Technical Field [0001] The present invention relates to a flexible display device and a manufacturing method thereof,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a display device, and more particularly, to a flexible display device which is easy to peel off when glass is removed and a method of manufacturing the same.

Specific examples of the flat panel display include a liquid crystal display (LCD) device, an organic light emitting display device, a plasma display panel (PDP) device, a quantum dot display device ), A field emission display device (FED), and an electrophoretic display device (EPD). The flat display panel, which realizes images in common, is an essential component, The flat panel display panel has a structure in which a pair of transparent insulation substrates are bonded together with inherent light emission, polarization, or other optical material layers interposed therebetween.

In recent years, there has been a demand for a flat display device to be used in a flexible form.

The flexible display device considered in response to such a demand has been gradually reduced in thickness and developed in a foldable form. Also, in consideration of the convenience of the user, a form in which a touch screen is added on the upper side is also proposed.

Among the flexible display devices to which the touch screen is added, an example in which the display panel is used as the organic light emitting display panel is omnipresent because the light source is omitted and a slimmer and lighter weight configuration is possible and the flexible form can be easily realized.

In general flexible display devices, a thin film transistor array and an organic light emitting diode array are formed on a lower plate glass substrate, a touch sensing array is formed on an upper plate glass substrate, and then an adhesive layer is made to correspond between the both glass substrates.

On the other hand, the upper glass substrate and the lower glass substrate are removed in the order mentioned, the glass substrate is separated from the adjacent array by irradiating the laser, and the upper and lower glass substrates are removed.

In the process of removing the upper and lower glass substrates, a physical external force is applied to the array side in order to completely remove the glass substrate in addition to the laser irradiation. In this process, some wirings connected to the array are cracked, . As a result, there is a problem that the operation of the array in which cracks are generated is impossible, and a solution thereof is required.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a flexible display device which is easy to peel off during glass removal and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a flexible display device comprising: a polymer substrate formed on a glass substrate; an inorganic film formed on the glass substrate; and a hole formed along the edge of the polymer substrate, So that the glass substrate can be easily peeled off.

To this end, a flexible display device of the present invention comprises a first polymer substrate having a lower surface than the upper surface and being wider than the upper surface, a second polymer substrate facing the first polymer substrate, A plurality of layers of an inorganic film covering the top and sides and having a cut surface conforming to an edge line in which the bottom surface of the first polymer substrate is defined and an adhesive layer provided between the first and second polymer substrates.

In addition, the cut surfaces of the plurality of inorganic films may have a rectangular shape along the edge of the lower surface of the first polymer substrate in plan view.

In addition, each corner of the rim of the quadrangle may further include an inorganic film pattern connected to the plurality of inorganic films.

On the other hand, the cut surfaces of the inorganic films of the plurality of layers may be discontinuously provided along the edge line of the first polymer base. In this case, inorganic film patterns protruding outside the first polymer substrate may further be provided between the cut surfaces of the inorganic film provided discontinuously in a plane.

On the other hand, the inorganic film may include a plurality of buffer layers, an interlayer insulating film, and a protective film.

Here, a first touch electrode and a second touch electrode positioned above and below the interlayer insulating film may be further provided on the plurality of buffer layers. The protective layer may cover the interlayer insulating layer and the second touch electrode.

Further, on the second polymer substrate, a thin film transistor array and an organic light emitting diode array connected thereto may be further included. The first surface and the second surface of the adhesive layer may contact the organic light emitting diode array and the protective film, respectively.

The first and second polymer substrates may be polyimides.

On the other hand, to achieve the same object, a manufacturing method of a flexible display device of the present invention includes the steps of forming a first polymer substrate on a first glass substrate, covering the first polymer substrate on the first polymer substrate Forming an inorganic film in contact with the first glass substrate by projecting a predetermined width from an edge of the first polymer substrate; removing the inorganic film on an edge of the first polymer substrate to expose the first glass substrate Forming a second polymer substrate on the second glass substrate; bonding the first polymer substrate and the second polymer substrate through an adhesive layer between the inorganic film and the second polymer substrate; Irradiating the second glass substrate with laser light to remove the first glass substrate and irradiating a laser beam on the back surface of the second glass substrate, A giant step to comprise.

The flexible display device of the present invention and its manufacturing method have the following effects.

By providing a hole along the edge of the polymer substrate with respect to the inorganic film protruding from the edge of the polymer substrate on the glass substrate, it is possible to remove the glass substrate naturally from the polymer substrate It can peel off.

Therefore, when an external force is not applied to the polymer substrate at the time of removing the glass substrate, cracks of the edges, which are generated when removing the glass substrate, are generated and transmitted to the active region. However, I can solve the remaining problem.

In addition, applications such as TVs, tablets, and mobile products can be applied, ensuring mass productivity and panel reliability of the products.

1 is a cross-sectional view of a touch screen of the present invention.
2 is a plan view of the touch screen of the present invention.
3 is a plan view showing a configuration on a first glass substrate in manufacturing a touch screen of the present invention.
4A to 4C are process sectional views showing a method of manufacturing a touch screen.
5 is a cross-sectional view showing an active region and a non-active region of the flexible display device of the present invention.
6 is a process sectional view showing a manufacturing method of a flexible display device of the present invention.
7 is a plan view of a first glass substrate showing inorganic film holes and inorganic film lamination patterns in the method of manufacturing a touch screen of the present invention.
8A to 8B are cross-sectional views taken on lines I to I 'and II to II' of FIG. 7;
FIGS. 9A and 9B are plan views of a touch screen illustrating a method of manufacturing a touch screen according to a first embodiment of the present invention, which illustrates steps of forming an inorganic film hole and removing a first glass substrate; FIG.
FIGS. 10A and 10B are top views of a touch screen illustrating steps of forming an inorganic film hole and removing a first glass substrate in a method of manufacturing a touch screen according to a second embodiment of the present invention;
FIGS. 11A and 11B are plan views of a touch screen illustrating a method of manufacturing a touch screen according to a third embodiment of the present invention, which illustrates steps of forming an inorganic film hole and removing the first glass substrate. FIG.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Like reference numerals throughout the specification denote substantially identical components. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description, a detailed description of known technologies or configurations related to the present invention will be omitted when it is determined that the gist of the present invention may be unnecessarily obscured. The component names used in the following description are selected in consideration of easiness of specification, and may be different from the parts names of actual products.

FIG. 1 is a cross-sectional view of a touch screen of the present invention, and FIG. 2 is a plan view of a touch screen of the present invention. 3 is a plan view showing a configuration on a first glass substrate in manufacturing a touch screen of the present invention.

1, the touch screen 1000 of the present invention includes a first polymer substrate 110, a first multi-buffer layer 120, an interlayer insulating layer 130, and a protective layer 140 ).

1, the upper surface and the lower surface of the first polymer substrate 110 are formed in different areas on the touch screen 1000, and in particular, in the outer region, the lower surface is formed on the upper surface And the inclined side surfaces of the first polymer substrate 110 are connected to the upper surface of the first multiple buffer layer 120, the interlayer insulating film 130, and the protective film 140 Covering.

Here, the edges of the first multi-buffer layer 120, the interlayer insulating layer 130, and the protective layer 140 have vertical cut surfaces that coincide with the edge lines.

In the flexible display device, after forming from the first polymer substrate 110 on the first glass substrate for the purpose of softening the device and bending or folding a specific region, An array is formed on the first glass substrate 110, and then a process for removing the first glass substrate is performed for softening.

However, the first polymer substrate 110 of the organic polymer polymer component coated with the solution process is aggregated and agglomerated inward from the edge line of the first glass substrate 100, and has a predetermined inclination at the edge thereof.

3, an inorganic film laminate 170 including an inorganic component first buffer layer 120, an interlayer insulating film 130, and a protective film 140 deposited by an inorganic gas CVD (Chemical Vapor Deposition) And protrude from the edge of the first polymer substrate 110 so as to cover the edge of the first polymer substrate 110.

The first multiple buffer layer, the interlayer insulating film, and the protective film component of the first polymer-based edge and outer covering inorganic compound have good bonding with the glass substrate, and the inorganic films are held at the edge of the first glass substrate 100 In the process of removing the first glass substrate required for softening, the first polymer substrate containing the inorganic films was difficult to separate from the first glass substrate merely by laser irradiation. To solve this problem, there has been proposed a method of removing a glass substrate by applying a force to the first polymer substrate in a direction different from that of the first glass substrate. Particularly, the removal of the first glass substrate is carried out by using a touch screen manufactured on the first glass substrate, an adhesive layer between the thin film transistor array fabricated on another second glass substrate and the display panel including the organic light emitting diode array, In this case, a different residual stress acts on the first polymer base material of the touch screen or the second polymer base material of the display panel side each time the first glass substrate is removed, so that the first glass substrate removal There is a problem that the first polymer substrate and the second polymer substrate are dried or peeled afterwards, and this provision of external force has not completely solved the problem of glass substrate removal.

As shown in FIG. 3, the flexible display device of the present invention is compared with the first glass substrate 100 and the first polymer substrate 110, which are excellent in the elimination reaction by laser irradiation when the first glass substrate 100 is removed, The first multi-buffer layer 120, the interlayer insulating film 130, and the protective film 140 of an inorganic component covering the edge and the outer edge of the first polymer substrate 110 are formed to have a good bonding property with the first glass substrate 100 An inorganic film hole 150 is formed in a plane perpendicular to the edge of the first polymer substrate 110 so as to separate the region from the non-existent region, so that the first polymer substrate 110 and the first glass The first glass substrate 100 can be peeled off naturally only by laser irradiation by dividing the substrate 100 by dividing the inorganic film hole 150 into boundaries only.

 The inorganic film hole 150 is formed by removing a first multi-buffer layer 120 of an inorganic component, an interlayer insulating film 130, and a protective film 140 having a good bonding property with the first glass substrate 100, The width of the first polymer substrate 110 can be determined in various ranges as long as the first polymer substrate 110 can be separated from the inorganic stack 170 outside the inorganic membrane hole 150. However, depending on the method of forming the inorganic film hole 150, the size may be determined. For example, when the inorganic film hole 150 is defined by laser cutting, its width may be determined in a range of several μm And the inorganic film hole 150 may have the same diameter in each inorganic film. That is, it has a vertical cross-section.

2 shows the shape after the first glass substrate 100 is removed, and shows a state in which a part of the inorganic film pattern 170a remains at the four corners of the first polymer substrate 110. In Fig. This is because when the first glass substrate 100 is relatively removed from the inorganic film stacked body 170 in the region where the inorganic film hole 150 is not formed, And the protruding inorganic film pattern 170a may be gently formed along the side of the first polymer substrate 110 in a region where the first glass substrate 100 is absent. The inorganic film patterns 170a are integrally connected to the plurality of inorganic films 120, 130, and 140 that cover the side and upper portions of the first polymer substrate 110, though they appear to protrude from the four corners .

In addition to the laser cutting, the inorganic film holes 150 may be defined together with the inorganic films 120, 130 and 140 by the exposure method, or may be defined by the dry etch method, 130 and 140 by applying a specific mask so that the inorganic film holes 150 having laser vertical cut surfaces can be formed.

In this case, the shapes of the inorganic films 120, 130, and 140 in the inorganic film hole 150 have a rectangular shape along the edge of the lower surface of the first polymer substrate in plan view. At this time, the first polymer substrate and the first glass substrate in the inorganic film hole 150 can be easily removed only by laser irradiation, so that the first glass substrate can be removed by simple laser irradiation.

Meanwhile, in the touch screen of the present invention, the first polymer substrate 110 may be made of a copolymer containing a polyester or a polyester, a polyimide or a polyimide- , Copolymers comprising olefinic copolymers, polyacrylic acid or polyacrylic acid, copolymers comprising polystyrene or polystyrene, copolymers comprising polysulfates or polysulfates, polycarbonates a copolymer comprising a polycarbonate or polycarbonate, a copolymer including a polyamic acid or a polyamic acid, a copolymer including a polyamine and a polyamic acid, a polyvinyl alcohol, a polyallyl amine and polyallyamine, and may include one or more polymer compounds selected from the group consisting of polyalamine, The thickness may be 5㎛ to 20㎛. The first polymer substrate 110 is a transparent substrate, and may be an outermost surface viewed by a viewer when applied to an actual flexible display device. The first polymer substrate 110 described above may be, for example, a polyimide.

The first multi-buffer layer 120 may be an oxide layer, a nitride layer, or a nitride oxide layer. In some cases, it may be in the form of a metal oxide film including a metal. The first multi-buffer layer 120 compensates for the weak moisture permeability of the first polymer substrate 110, and the first multi-buffer layer 120 is formed on the first multi- The polymer substrate 110 can be protected.

Meanwhile, the touch screen 1000 includes first and second touch electrodes 122 and 124 crossing each other for touch sensing in the active area AA, as shown in FIG. 5 which will be described later.

The first and second touch electrodes 122 and 124 may be formed in various shapes such as a bar shape, a diamond shape, or a polygonal shape. The first and second touch electrodes 122 and 124 may be formed in the same layer, (122a, 124), and bridge electrodes (122b) are provided in the other layer at the intersections to prevent a short circuit between them. The main sensing portion 122a and the bridge electrode 122b of the first touch electrode are connected to each other through the contact hole provided in the interlayer insulating layer 130 with the interlayer insulating layer 130 interposed therebetween . In this case, the second touch electrode 124 has a shape in which the main sensing portion and the connection portion thereof are integrally formed. In some cases, the first touch electrode 122 and the second touch electrode 124 can be formed in different shapes.

In any case, the touch screen is located on the upper side of the display panel. For display, the main sensing unit of the first and second touch electrodes 122 and 124 is a transparent electrode.

A protective layer 140 is formed to cover the first and second touch electrodes 122 and 124 and the interlayer insulating layer 130. The protective layer 140 protects the first and second touch electrodes 122 and 124 and prevents the influence of the driving of the touch screen 1000 on the display panel.

Hereinafter, a method of manufacturing a touch screen of the present invention will be described.

Figs. 4A to 4C are process cross-sectional views illustrating a method of manufacturing the touch screen.

As shown in FIG. 4A, the first polymer substrate 110 is coated on the first glass substrate 100. In this case, the first polymer substrate 110 is cohesively coated on the inside from the edge of the first glass substrate 100 in a liquid state, and has an inclination of a certain angle of the edge after curing. In the active region, the first polymer substrate 110 maintains flatness.

Next, a first multiple buffer layer 120 of an oxide film, a nitride film, or a nitrided oxide film is formed on the first polymer substrate 110 by a chemical vapor deposition (CVD) method. Here, the first multiple buffer layer 120 covers the inclination of the edge of the first polymer substrate 110, and protrudes more than the inclination of the edge of the first polymer substrate 110, so that the edge of the first multiple buffer layer 120 contacts the surface of the first glass substrate 100 .

Next, the first multi-buffer layer 120 is formed in a shape similar to the first multi-buffer layer 120 by covering the edges of the first polymer substrate 110 and protruding from the first multi-buffer layer 120, 130 and a protective film 140 are formed.

The first and second electrodes 122 and 124 provided in the active area AA of FIG. 5 to be described later are formed by patterning a transparent electrode on the first multiple buffer layer 120 and forming a first electrode sensing part 122a And a second electrode sensing part having a first electrode sensing part and a second electrode sensing part, the second electrode sensing part having a connection part for connecting between the second electrode sensing parts, An interlayer insulating layer 130 covering the first electrode sensing portion 122a and the second electrode 124 and having a contact hole exposing a portion of the adjacent first electrode sensing portion 122a is formed, And a bridge electrode 122b connected to the adjacent first electrode sensing portion 122a and connecting them on the interlayer insulating layer 130 is formed. Here, the first electrode sensing unit 122a and the bridge electrode 122b are electrically connected to each other to function as a first electrode 122.

Next, a protective film 140 covering the interlayer insulating layer 130 and the bridge electrode 122b is formed.

4B, the protective film 140 of the inorganic film component, the interlayer insulating film 130, and the first multiple buffer layer 120 are removed at the edge of the first polymer substrate 110 to form the first polymer substrate 110, An inorganic film hole 150 is formed. The inorganic film hole 150 may be formed by laser cutting or selectively dry etching only the inorganic film hole 150. Or the photomask for patterning the inorganic film holes 150 when the first multi-buffer layer 120, the interlayer insulating film 130, and the protective film 140 are formed, The inorganic film hole 150 can be provided. When the photomask is provided, the process according to FIG. 4B is not performed separately, and the process according to FIG. 4A may be performed.

4C, the first glass substrate 100 is irradiated with a laser beam to separate the first polymer substrate 110 inside the inorganic film hole 150 from the first glass substrate 100 .

Through this separation process, the first polymer substrate 110 and the first multi-buffer layer 120, the interlayer insulating film 130, and the protective film 140 on the first polymer substrate 110 and the first and second electrodes 122, 124 are formed on the touch screen.

On the other hand, as in the above-described method, if the glass substrate is naturally peeled off only in a non-touch screen, and has a structure in which an inorganic film is formed with a wider edge relative to a polymer substrate, It will also be applicable to the panel side.

However, since the polymer substrate of the display panel is a colored substrate and may not have a slope at the edge portion, there may be no difficulty in peeling the glass substrate relative to the touch screen side. Therefore, depending on the shape of the edge of the polymer substrate, Such inorganic film hole provision proceeds selectively.

Hereinafter, a configuration of a flexible display device of the present invention to which the touch screen is applied will be described in detail.

5 is a cross-sectional view showing an active region and a non-active region of the flexible display device of the present invention.

The first multi-buffer layer 120, the first and second electrodes 122 and 124, the interlayer insulating film 130, and the protective film 140 are formed on the first flexible substrate 110 in the active area on the touch- As shown in Fig.

5, on the touch screen side, the edge of the first flexible substrate 110 has a predetermined inclination, and the first multi-buffer layer 120 of the inorganic film component on the edge of the first flexible substrate 110 has an inclination, An interlayer insulating film 130, and a protective film 140 are provided so as to cover the inclination, and these inorganic films have vertical cut surfaces.

In the meantime, an example in which the touch routing wiring 125 is provided on the first multi-buffer layer 120 has been described. However, the metal wiring may be formed by patterning a separate metal wiring before forming the first and second electrodes 122 and 124 Alternatively, when the first and second electrodes 122 and 124 are double layers, they may be formed of the heavy metal component or may be formed on the same layer as the bridge electrode 122b of the first electrode. The touch routing wiring 125 may be located on the interlayer insulating layer 130 when the bridge electrode 122b of the first electrode and the touch routing wiring 125 are formed on the same layer.

A second multi-buffer layer 220 is formed on the second polymer substrate 210 so as to cover the second polymer substrate 210. The thin film transistor array 230 in the active area is formed on the second multi- And a second interlayer insulating film 237 covering the thin film transistor and having a protective function.

The second polymer substrate 210 may also include a copolymer, a polyimide, or a polyimide, as in the first polymer substrate 110, whose components include a polyester or a polyester. A copolymer comprising an olefinic copolymer, a copolymer comprising polyacrylic acid or polyacrylic acid, a copolymer comprising polystyrene or polystyrene, a copolymer comprising polysulfate or polysulfate, Copolymers comprising polycarbonate or polycarbonate, copolymers comprising polyamic acid or polyamic acid, copolymers comprising polyamine and polyamic acid, polyvinylalcohol, poly (vinyl alcohol), poly Polyallylamine, and mixtures thereof. The term " polyallylamine " And its thickness may be 5 탆 to 30 탆. However, the second polymer substrate 210 may be non-transparent relative to the first polymer substrate 110 as a colored substrate. For example, the second polymer substrate 210 described above may be a polyimide, but in this case, the second polymer substrate 210 may be formed in a different color than the first polymer substrate 110, It is possible to block the outside light of the light source.

The thin film transistor includes an active layer 231 located in a selective region of the second multiple buffer layer 120, a gate insulating layer 222 covering the active layer 231, A first interlayer insulating film 234 covering the gate electrode 233 and a gate electrode 233 located adjacent to the gate insulating film 222. The first interlayer insulating film 234 is formed on both sides of the active layer 231 through the first interlayer insulating film 234, And a source electrode 235 and a drain electrode 236 connected to both sides of the active layer 231 through contact holes exposing the active layer 231.

The second interlayer insulating film 237 has a contact hole at a connection portion between the source electrode 235 and the drain electrode 236 and the active layer 231 and covers the remaining portion.

The organic light emitting diode array 240 includes an organic light emitting diode OLED corresponding to each pixel and the organic light emitting diode OLED includes a first electrode connected to the driving thin film transistor D- An organic light emitting layer 243 provided on the first electrode 242 and a second electrode 244 formed on the organic light emitting layer 243. Here, the organic light emitting layer 243 includes a bank 242 at a boundary of each pixel to define a light emitting region, and is formed in the light emitting region.

The sealing layer 250 may be included in the organic light emitting diode array 240 together with a plurality of organic light emitting diodes OLED provided for each pixel in order to protect the organic light emitting diode array 240 from external moisture or external air. The sealing layer 250 may be formed in the shape of a barrier laminate having an alternating configuration of an organic film and an inorganic film in a shape covering the upper and side portions of the organic light emitting array 240.

The display panel including the touch screen 1000, the thin film transistor array 230, the organic light emitting diode array 240, and the sealing layer 250 is bonded together with an adhesive layer 160 therebetween. After the adhesion, the first surface of the adhesive layer 160 is an encapsulating layer 250 covering the organic light emitting diode array 240 and the second surface is in contact with the protective layer 140.

4A to 4C, the removal of the first glass substrate 100 is shown after the formation of the inorganic film hole 150. However, the removal of the first glass substrate 100 is not limited to the removal of the first glass substrate 100 After the touch screen 1000 manufactured on the first glass substrate 100 and the display element array 2000 manufactured on the second glass substrate 200 are attached to each other, Removal takes place one after another.

In addition, in the method of manufacturing a flexible display device of the present invention, the removal of the first glass substrate 100 can be performed simply by laser irradiation, which facilitates the process compared to a known method in which an external force process is added, It is possible to solve the problem that the inorganic films of the inorganic components formed are not peeled off at the edge of the first polymer substrate 110 and denaturation of the first polymer substrate 110 occurs when an external force is applied.

Hereinafter, a manufacturing method of a flexible display device using the above-described touch screen manufacturing method will be described.

6 is a process sectional view showing a manufacturing method of the flexible display device of the present invention. The following manufacturing process can be understood including the cross-sectional view of Fig.

First, a first polymer substrate 110 is formed on a first glass substrate 100 (S100).

An inorganic film that covers the first polymer substrate 110 and protrudes from the edge of the first polymer substrate 110 by a predetermined width and is in contact with the first glass substrate 100 is formed on the first polymer substrate 110, (S110). Examples of the inorganic film include a first multiple buffer layer 120, an interlayer insulating film 130, and a protective film 140. The inorganic film includes not only a single inorganic film but also a plurality of inorganic films.

An inorganic film hole 150 is formed at an edge of the first polymer substrate 110 by removing the inorganic film to expose the first glass substrate 100 (S120). After the formation of the inorganic film, the formation of the inorganic film hole 150 only in the characteristic region can be performed by laser cutting or a dry etch method in which only the corresponding region is opened to supply the plasma of the etching component.

Alternatively, the removal of the inorganic film may proceed simultaneously with the patterning of the inorganic film of each layer. In this case, the diameters of the holes in the respective layers may not be aligned or the diameters may be different, and it may be preferable to form the inorganic film holes at the edge portions of the first polymer substrate 110 after the above-described inorganic film is formed .

A second polymer substrate 210 is formed on the second glass substrate 200 (S130).

The inorganic film and the second polymer substrate 210 are bonded together through an adhesive layer 160 (S140).

Next, the first glass substrate 100 is removed by laser irradiation on the back surface of the first glass substrate 100 (S150).

Next, the second glass substrate 200 is removed by laser irradiation on the back surface of the second glass substrate 200 (S160).

That is, the flexible display device of the present invention recognizes the problem that the inorganic film in contact with the first glass substrate protruding to the outside of the first flexible substrate is not peeled only by laser irradiation with strong adhesion to the first glass substrate, A hole is formed in the inorganic film located at the edge of the flexible substrate by a method such as laser cutting or the like, whereby the first flexible substrate and the first glass substrate can be peeled off naturally.

Further, the holes are formed in the inorganic film before the glass substrate is bonded, and thereafter, the arrays on both glass substrates are adhered to each other while facing each other, and the respective glass substrates are removed.

Here, although the formation of the holes is shown only on the first glass substrate in the illustrated process flow chart, the inorganic films on the second polymer substrate cover the edges of the second glass substrate on the second glass substrate, It can also be applied to this.

On the other hand, in the above description of the manufacturing method of the flexible display device, the structures formed on the first and second glass substrates are the touch screen and the thin film transistor array / organic light emitting diode array, but the present invention is not limited thereto, And the inorganic insulating films formed after the polymer substrate of the present invention has a shape with a side face inclined are positioned not only on the upper side of the polymer substrate but also on the side faces and the glass substrate and have strong bonding properties between the substrate and the inorganic insulating films Can be applied to the application.

Hereinafter, the shape of the inorganic film hole and various embodiments thereof will be described.

FIG. 7 is a plan view of a first glass substrate showing inorganic film holes and inorganic film patterns in the method of manufacturing a touch screen of the present invention. FIGS. 8A to 8B are sectional views taken on lines I to I 'and II to II' to be.

7 to 8B, a first multiple buffer layer 120 formed on the first polymer substrate 110 is formed outside the inorganic film hole 150 on the first glass substrate 100 immediately after the inorganic film hole 150 is formed. The interlayer insulating film 130, and the protective film 140 are left.

The first polymer substrate 110 is disposed on the inside of the inorganic film hole 150 in a planar manner directly on the first glass substrate 100 and on top of the first polymer substrate 110, The first multiple buffer layer 120, the interlayer insulating film 130, and the protective film 140 are located.

FIGS. 9A and 9B are plan views of a touch screen illustrating a method of manufacturing a touch screen according to a first embodiment of the present invention, which illustrates steps of forming an inorganic film hole and removing the first glass substrate.

9A shows that the area occupied by the first polymer substrate 110 on the first glass substrate 100 is up to the area A corresponding to a certain width of the active area AA and its periphery, (110), and is formed to be wider outward than the region (A) to the region (B). The inorganic film hole 150 provided in the inorganic film laminate is provided between the A region and the B region so as to have a rectangular shape in the shape of a plane along the edge of the first polymer substrate 110. The time point of the inorganic film hole 150 in the region A is determined and the end point is located in the region B than the first glass substrate 100 to prevent the inorganic glass film stack 100 from being bonded to the first glass substrate 100 It is possible to prevent the touch screen from sliding on the touch screen. Here, such a border shape is a continuous shape without interruption.

The first multiple buffer layer 120, the interlayer insulating film 130 and the protective film 140 are formed on the first glass substrate 100 having the inorganic film holes 150, The inorganic film stack body 170 protrudes on the substrate 100. In the step of removing the first glass substrate 100 by laser irradiation after attaching the both glass substrates together as shown in Fig. Removed.

The first glass substrate 110 is exposed at the outer holes of the first polymer substrate 110 on the first glass substrate 100 and the first polymer substrate 110 having different components is irradiated with laser light on the back surface of the first glass substrate 100. [ Pores are generated between the first glass substrate 100 and the first glass substrate 100 and the edges are opened so that the first polymer substrate 110 can be easily separated from the first glass substrate 100. After the first glass substrate 100 is removed, the touch screen has the edge of the first polymer substrate 110 as an edge. That is, when the edge side of the first polymer substrate 110 has a constant inclination, the side having the inclination reaches the edge of the touch screen touching the first glass substrate 100 (see FIG. 4A) Is defined.

FIGS. 10A and 10B are plan views of a touch screen illustrating a method of manufacturing a touch screen according to a second embodiment of the present invention, which illustrates steps of forming an inorganic film hole and removing the first glass substrate.

10A shows the formation of an inorganic film hole in the method of manufacturing a touch screen according to the second embodiment of the present invention, in which the inorganic film hole 150 is formed in a plane except for a corner of a rectangular frame. In this case, as shown in FIG. 10B, the inorganic film stack 170a on the first glass substrate 100 remains at a corner of the rectangular edge and outside the inorganic film hole 151 with a constant width. In this case, the inorganic film stack body 170a remaining on the outside of the rim corner and the inorganic film hole 151 is divided into a first glass substrate 100 having a touch screen, a second thin film transistor array having a lower thin film transistor array and an organic light emitting diode array 2 glass substrate 200, the flow of the substrate of both glass substrates is caught. That is, since the inorganic film hole 150 is formed before the two glass substrates are bonded together, when the edge of the first polymer substrate 110 is exposed to the inorganic film hole, the first polymer substrate 110 is exposed The inorganic film stack 170a may be in contact with the first glass substrate 100 only at the corners with a weak attraction force during the adhesion process to prevent the sliding of the inorganic film stack 170a.

In some cases, the inorganic film stack body 170a at the corner of the inorganic film hole 150 of the first glass substrate 100 may also be removed.

The first glass substrate 100 is removed along with the inorganic film stack body 170a around the inorganic film hole 150 when a laser beam is irradiated to the back side of the first glass substrate 100 as shown in FIG. In this case, a part of the inorganic film pattern 170a at the corner of the inorganic film hole 150 may remain.

FIGS. 11A and 11B are plan views of a touch screen illustrating a method of manufacturing a touch screen according to a third embodiment of the present invention, which illustrates steps of forming an inorganic film hole and removing the first glass substrate.

As shown in FIG. 11A, the touch screen according to the third embodiment of the present invention includes the inorganic film hole 150 discontinuously along the edge of the first polymer substrate 110. Such a discontinuity surface can be defined, for example, by laser cutting or dry etching only the portion corresponding to the inorganic film hole 152.

In this case, as shown in FIG. 11B, after the first glass substrate 100 is removed after the laser irradiation, as shown in FIG. 11B, a part of the inorganic film pattern 170a made of the inorganic film laminate may remain. Alternatively, as shown in FIG. 9B, an inorganic film removing region having a substantially quadrangular rim shape is defined along the edge line of the first polymer substrate 110 by the inorganic film hole 150, and when the intensity at the time of laser irradiation is increased The inorganic film stack 170 may also be removed between the inorganic membrane holes 150 along the edge of the first polymer substrate 110.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Will be apparent to those of ordinary skill in the art.

100: first glass substrate 110: first polymer substrate
120: first multiple buffer layer 130: interlayer insulating film
140: Protective film 150: Inorganic film hole
160: adhesive layer 170: inorganic laminate
200: second glass substrate 210: second polymer substrate
220: second multiple buffer layer 230: thin film transistor array
240: organic light emitting diode array 250: sealing layer

Claims (12)

A first polymer substrate having a lower surface wider than an upper surface and having a slope on a side;
A second polymer substrate opposite the first polymer substrate;
A plurality of layers of inorganic films covering the top and sides of the first polymer substrate and having a cross-section corresponding to an edge line in which the bottom surface of the first polymer substrate is defined; And
And an adhesive layer provided between the first and second polymer substrates. The method according to claim 1,
Wherein the cut surfaces of the plurality of inorganic films have a rectangular shape along the edge of the lower surface of the first polymer substrate in a plan view. 3. The method of claim 2,
Further comprising an inorganic film pattern connected to the plurality of inorganic films at corners of the rim of the quadrangle. The method according to claim 1,
Wherein the cut surfaces of the inorganic films of the plurality of layers are discontinuously provided along an edge line of the first polymer substrate. 5. The method of claim 4,
Further comprising inorganic film patterns protruding outward from the first polymer substrate between cut surfaces of the inorganic film disposed discontinuously in a plane. The method according to claim 1,
Wherein the inorganic film includes a plurality of buffer layers, an interlayer insulating film, and a protective film. The method according to claim 6,
Further comprising: a first touch electrode and a second touch electrode disposed above and below the interlayer insulating film on the plurality of buffer layers. 8. The method of claim 7,
And the protective film covers the interlayer insulating film and the second touch electrode. 9. The method of claim 8,
Further comprising a thin film transistor array and an organic light emitting diode array connected to the thin film transistor array on the second polymer substrate. 10. The method of claim 9,
Wherein the first surface and the second surface of the adhesive layer are in contact with the organic light emitting diode array and the protective film, respectively. The method according to claim 1,
Wherein the first and second polymer substrates are polyimide. Forming a first polymer substrate on a first glass substrate;
Forming an inorganic film on the first polymer substrate on the first polymer substrate so as to protrude from the edge of the first polymer substrate to a predetermined width and in contact with the first glass substrate;
Removing the inorganic film on an edge of the first polymer substrate to form a hole exposing the first glass substrate;
Forming a second polymer substrate on a second glass substrate;
Bonding the inorganic film and the second polymer substrate through an adhesive layer;
Removing the first glass substrate by laser irradiation on the back surface of the first glass substrate; And
And removing the second glass substrate by laser irradiation on the back surface of the second glass substrate.

Images