KR102470566B1 - Flexible Organic Light Emitting Display Device - Google Patents

Abstract

The present invention relates to a flexible organic light emitting display device in which defects such as disconnection and stress at the time of removing a glass substrate are improved by adjusting the position of a routing wire connected to a touch electrode pad at a region where an anisotropic conductive film is applied, and the location of the touch routing wire overlaps the adhesive layer and the anisotropic conductive film to hold the touch routing wiring of the adhesive material component even when an external force is applied when removing the upper glass substrate, thereby preventing wiring cracks.

Description

Flexible Organic Light Emitting Display Device {Flexible Organic Light Emitting Display Device}

The present invention relates to a display device, and more particularly, to a flexible organic light emitting display device in which defects such as disconnection and stress at the time of removing a glass substrate are improved by adjusting the position of a routing wire connected to a touch electrode pad at a region where an anisotropic conductive film is applied. will be.

Specific examples of the flat panel display device include a liquid crystal display device (LCD), an organic light emitting display device (Organic Emitting Display Device), a plasma display panel device (PDP), and a quantum dot display device (Quantum Dot Display Device). ), a field emission display device (FED), an electrophoretic display device (EPD), etc., which commonly use a flat panel display panel that implements an image as an essential component, A flat panel display panel has a structure in which a pair of transparent insulating substrates are bonded face-to-face with an inherent light emitting or polarizing or other optical material layer interposed therebetween.

With the recent increase in the size of display devices, demand for a flat display device that occupies less space is increasing. This demand is increasing, and recently, there is a demand for using a flat display device in a flexible form.

The flexible display device has gradually become thinner and is being developed into a foldable type. In addition, in consideration of user's convenience, a form in which a touch screen is added to the upper side has also been proposed.

Among flexible display devices with a touch screen, an example in which a display panel is used as an organic light emitting display panel is drawing attention because it can be configured with a slimmer and lighter weight by omitting a light source, and thus can be easily implemented in a flexible form.

In a typical flexible organic light emitting display device, a thin film transistor array and an organic light emitting diode array are formed on a lower glass substrate, and a touch sensing array is formed on an upper glass substrate, and then the two glass substrates are bonded together with adhesive layers corresponding to each other.

Here, in the thin film transistor array and the organic light emitting diode array, the lower glass substrate has a pad configuration on one side protruding from the touch sensing array, and it is easy to configure a driving circuit board bonded thereto, but the touch sensing array side has a thin film formation surface. Since it faces the transistor array and the organic light emitting diode array side, it is difficult to proceed with a bonding process with a separate touch-only driving circuit board. Dummy electrodes are formed on the side of the diode array, and electrical signals for touch driving are applied from the lower side of the thin film transistor array and the organic light emitting diode array by conducting them with a conductive ball or the like.

On the other hand, the upper glass substrate and the lower glass substrate are removed in the mentioned order, and the upper and lower glass substrates are removed by irradiating a laser so that the glass substrate is separated from the corresponding array.

However, in the process of removing the upper and lower glass substrates, in addition to laser irradiation, a physical external force is applied to the array side to completely remove the glass substrate. . As a result, there is a problem in which the operation of the cracked array is impossible, and a solution thereof is required.

The present invention has been made to solve the above-mentioned problems, and by adjusting the position of the routing wiring connected to the touch electrode pad at the anisotropic conductive film application area, defects such as disconnection and stress during removal of the glass substrate are improved. Flexible organic light emitting An object of the present invention is to provide a display device.

In order to achieve the above object, the flexible organic light emitting display device of the present invention overlaps the position of the touch routing wiring with the adhesive layer and the anisotropic conductive film, so that even when an external force is applied when the upper glass substrate is removed, the touch routing wiring of the adhesive material is applied. , can prevent wiring cracks.

To this end, the flexible organic light emitting display device of the present invention has a rectangular shape, has a pad portion having a certain width along a first side, and has an active area adjacent to the pad portion and spaced apart from edges of the remaining three sides by a predetermined distance. a thin film transistor and organic light emitting diode array provided on an active area of the first flexible substrate, a second flexible substrate overlapping both ends of the active area and the pad part along the first side, and the second flexible substrate A touch pad including a touch sensing array provided on the first flexible substrate and facing the active area of the first flexible substrate, and a plurality of touch pad electrodes provided on the second flexible substrate at portions overlapping both ends of the pad unit. a portion, an anisotropic conductive film disposed between layers at both ends of the touch pad portion and the pad portion, and disposed between layers between the thin film transistor, the organic light emitting diode array, and the touch sensing array, in a direction perpendicular to the first side. At the side of the touch pad unit, the adhesive layer in contact with the anisotropic conductive film overlaps with the adhesive layer at the periphery of the active region on the second flexible substrate, is connected to the touch sensing array, and touches in a direction perpendicular to the first side At the side of the pad part, a plurality of touch routing wires connected to the plurality of touch pad electrodes are included.

The anisotropic conductive film is preferably spaced apart from the edge of the second flexible substrate by a first distance in the first side direction.

In addition, the anisotropic conductive film is spaced apart from the adhesive layer by a second distance in a direction along the first side.

The touch routing wires may not overlap with the second spacing.

The second flexible substrate has a shape recessed adjacent to the active region between both ends of the pad portion.

In addition, an array pad electrode connected to the thin film transistor and the organic light emitting diode array may be provided on the pad portion exposed from the second flexible substrate.

Dummy pad electrodes may be provided on the first flexible substrate to correspond to the touch pad electrodes.

The touch routing wires may be respectively connected to the touch pad electrodes.

As another example, in the touch pad unit, the touch pad electrodes are arranged in two rows along the first side, the touch pad electrodes in the two rows are connected to each other in a direction crossing the first side, and the two touch pad electrodes are connected. Pad electrodes may be connected to the touch routing wires, respectively.

The flexible organic light emitting display device of the present invention has the following effects.

The touch routing wiring connecting the touch pad electrode and the touch sensing array is located on the side of the touch pad part covered by the anisotropic conductive film and overlaps with the adhesive layer, so that even when external force is applied when the upper glass substrate is removed, the force is not concentrated only on the touch routing wiring. By doing so, wiring cracks can be prevented. That is, the touch routing wiring is covered with an adhesive layer so that the adhesive layer on the upper substrate holds the touch routing wiring, so that it has resistance to external force and can be protected.

In addition, the upper side of the anisotropic conductive film is separated from the second flexible substrate at a predetermined interval to prevent defects in the cutting process of exposing a partial region of the pad portion, and the lower side is separated from the adhesive layer to achieve a touch sensing array, a thin film transistor array, and organic light emitting Bonding defects may be prevented by preventing overlapping of the adhesive layer and the anisotropic conductive film due to pressure applied during the bonding process between the diode arrays.

In particular, in the flexible organic light emitting display of the present invention, even if there is a horizontal separation distance between the anisotropic conductive film and the adhesive layer or a horizontal separation distance between the anisotropic conductive film and the edge portion in order to prevent defects such as bonding failure or cutting process, the upper portion Touch channel open failure due to stress caused by removing the glass substrate can be prevented and contact reliability can be improved, thereby improving the yield and reliability of the touch sensing array.

1 is a process flow chart showing a manufacturing process of a flexible organic light emitting display device according to the present invention.
2A to 2D are process cross-sectional views illustrating a manufacturing process of a flexible organic light emitting display device according to the present invention.
3 is a perspective view showing scribing for each unit panel after removing the second glass substrate;
Figure 4 is a plan view showing the second substrate cutting of the scribing unit panel of Figure 3
5 is an enlarged plan view of the left touch pad part of FIG. 4 according to the first embodiment of the present invention;
6 is an enlarged plan view of the left touch pad part of FIG. 4 according to the second embodiment of the present invention;
7a and 7b are plan views showing the correspondence between the adhesive layer and the routing wiring of the comparative example and the first embodiment of the present invention;
Figure 8 is a photograph showing cracks appearing in the comparative example of Figure 7a
9A to 9C are cross-sectional views of an active area of a flexible organic light emitting display according to an embodiment of the present invention and along lines II to II' of FIG. 5 ;

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Like reference numbers throughout the specification indicate substantially the same elements. In the following description, if it is determined that a detailed description of a known technology or configuration related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, the component names used in the following description are selected in consideration of the ease of writing the specification, and may be different from the part names of the actual product.

1 is a process flow chart showing a manufacturing process of a flexible organic light emitting display device according to the present invention, and FIGS. 2A to 2D are process cross-sectional views showing manufacturing processes of the flexible organic light emitting display device according to the present invention. Further, FIG. 3 is a perspective view illustrating scribing for each unit panel after removing the second glass substrate, and FIG. 4 is a plan view illustrating cutting of the second base material of the scribing unit panel of FIG. 3 .

As shown in FIGS. 1 to 4 , the manufacturing process of the flexible organic light emitting display according to the present invention is performed in the following order.

First, as shown in FIG. 2A, a first flexible substrate 110 is formed on a first glass substrate 300, and the thin film transistor array 120 and organic light emitting diodes are sequentially formed on the first flexible substrate 110. A diode array 130 is formed (100S). Here, the thin film transistor array 120 and the organic light emitting diode array 130 are located in the active region of the first flexible substrate 110, and the lower array including the two arrays 120 and 130 located on the same substrate ( including a thin film transistor and an organic light emitting diode array) (100).

Also, in the same process of forming the thin film transistor array 120, the thin film transistor array pad electrode 135 and the dummy pad electrode 125 are formed on the outer pad portion of the active region.

Meanwhile, when the thin film transistor array 120 is formed, an array pad electrode 135 electrically connected to the thin film transistor array 120 is provided on a pad portion outside the active region, and the array pad electrode 135 ), and a dummy pad electrode 125 is provided to correspond to both ends of the pad part.

In addition, when the thin film transistor array 120 or the organic light emitting diode array 130 is formed, a lighting inspection pattern 145 spaced apart from the array pad electrode 135 or the dummy pad electrode 125 is further provided outside the active region. It can be. This is a kind of test pattern and may be omitted or positioned differently depending on the case.

Subsequently, as shown in FIG. 2B, after the second flexible substrate 210 is provided on the second glass substrate 400, the touch sensing array 220 is formed thereon (110S). Here, it is called the upper array 200 including the second flexible substrate 210 and the touch sensing array 220 .

Next, an adhesive layer 150 is applied to the active area of the second glass substrate 400 .

Also, when the sensing array 210 is formed, touch pad electrodes 225 are formed at positions corresponding to the dummy pad electrode 125 in the same process. In addition, an anisotropic conductive film 250 including conductive balls 255 is applied on the touch pad electrodes 225 and spaced apart from the adhesive layer 150 .

Meanwhile, the order of forming the thin film transistor array 120 and the organic light emitting diode array 130 of FIG. 2A or the touch sensing array 220 of FIG. 2B may be reversed. In addition, regions where the thin film transistor array 120 and the organic light emitting diode array 130 or the touch sensing array 220 of FIG. 2B are formed are active regions of the first flexible substrate 110 and the second flexible substrate 210 Corresponds to , and a pad part is defined outside the active area.

The first glass substrate 300 and the second glass substrate 400 form arrays in a mother state, respectively, and each glass substrate 300, 400 is a state in which a plurality of panels are not divided into unit panels, and the area Differently, the individual array process proceeds. That is, as shown in FIG. 3 , the first glass substrate 300 or the second glass substrate 400 is provided with a plurality of panel arrays horizontally.

Subsequently, as shown in FIG. 2C, the second glass substrate 400 is inverted so that the lower array 100 and the upper array 200 face each other so that the respective array formation surfaces face each other through the adhesive layer 150. The arrays 130 and 220 are coalesced (120S). In this process, pressure is applied to the first and second glass substrates 300 and 400 in the vertical direction so that force is applied evenly to the plane, and bonding is performed. When the arrays are bonded through the adhesive layer 150, the conductive ball 255 in the anisotropic conductive film 250 is broken between the dummy pad electrode 125 and the touch pad electrode 225 by the same pressure, Electrical conduction of the two electrodes 125 and 225 is achieved.

Subsequently, as shown in FIG. 2D, laser is irradiated to the second glass substrate 400 located on the upper side of the bonded first and second glass substrates 300 and 400, and the first and second glass substrates 300 and 400 are bonded together. 2 The glass substrate 400 is detached (130S).

Subsequently, as shown in FIG. 3 , laser is irradiated from the rear side of the second flexible substrate 210 opened after the second glass substrate 400 is removed, and scribing is performed for each unit panel (140S). In the unit panel divided on the basis of these scribed lines, the lower first glass substrate 300 is maintained, which means that when bonding is made with a flexible printed circuit board (FPCB) in the pad part, the applied pressure or to be resistant to heat.

Meanwhile, as shown in FIG. 4 for the scribed unit panel, a part of the second flexible substrate 210 corresponding to the pad part is cut (150S). After this cutting is completed, the first flexible substrate 110 is relatively protruded from the second flexible substrate 210, and the lighting inspection pattern 145 and the array pad electrode 135 are formed at the protruding portion. this is exposed In addition, even during this cutting, the second flexible substrate 210 is formed on the first flexible substrate 210 so that the dummy pad electrode 125 and the touch pad electrode 225 maintain an electrically connected state with respect to the touch pad portion. The state in which the substrate 110 is overlapped is maintained.

As shown in FIG. 4 , the cutting of the second flexible substrate 210 exposes the edge of the first side of the first flexible substrate 110 where the pad part is located and covers the dummy pad electrode 125 . It is formed by coming out from both ends of the part and entering between both ends of the pad part so as to be more adjacent to the active area AA. That is, the second flexible substrate 210 is cut relative to the first flexible substrate 110 only in the pad portion, and the overlapping of the first flexible substrate 110 is maintained in the active area and its periphery. And, the lighting inspection pattern 135 and the array pad electrode 145 are exposed from the cut second flexible substrate 210, and the first flexible substrate 110 and the second flexible substrate 210 are exposed in the pad portion. There will be a difference between the regions.

Here, each of the first flexible substrate 110 and the second flexible substrate 210 may be a transparent plastic film or a multi-layered inorganic film or a combination thereof. The first and second flexible substrates 110 and 210 each have a thickness of less than 20 μm, less than 1/20 of the thickness of the first and second glass substrates 300 and 400, and are sufficiently thin and flexible, The flexible organic light emitting diode display device manufactured by bonding thereof maintains a state in which it can be folded or rolled.

Subsequently, a flexible printed circuit board (not shown) capable of transmitting signals to the array and touch pad electrodes is connected to the array pad electrodes 145 (160S).

Next, the first glass substrate 300 is removed (170S) to expose the first flexible substrate 110.

In some cases, a back cover film having a greater thickness may be further added to the lower side of the exposed first flexible substrate 110 to maintain relatively rigidity compared to the first flexible substrate 110 for accommodation in the bezel.

In the above description, the first and second flexible substrates 110 and 210 are a heat-resistant transparent plastic film having flexibility and a transparent plastic film, the components of which are polyester or a copolymer containing polyester, Polyimide or a copolymer containing polyimide, an olefinic copolymer, polyacrylic acid or a copolymer containing polyacrylic acid, a copolymer containing polystyrene or polysterin, polysulfate Polysulfate or copolymers containing polysulfate, polycarbonate or copolymers containing polycarbonate, polyamic acid or copolymers containing polyamic acid, polyamines and polyamic acids It may include one or more polymer compounds selected from the group consisting of a copolymer, polyvinylalcohol, and polyallyamine, and the thickness of the transparent plastic film may be 5 μm to 100 μm. In some cases, the second flexible substrate 210 may include only a transparent inorganic film. In this case, the transparent inorganic film may have a plurality of layers, and its components may include a nitride film, an oxide film, an oxynitride film, or a metal oxide film.

Meanwhile, in the flexible organic light emitting display device of the present invention, in the process of removing the second glass substrate 400, an external force to lift the second glass substrate 400 is applied in addition to laser irradiation. 2 Noting that cracks are generated in the portion of the touch routing wiring, which is the thinnest part of the flexible substrate 210, the location of the touch routing wiring will be changed.

That is, in consideration of the occurrence of cracks in areas where the touch routing wiring (see 227 in FIG. 5 ) does not overlap with the adhesive layer 150 or the anisotropic conductive film 250 in the pad portion, the location of the touch routing wiring 227 is determined. , proceeds along the side of the touch sensing array 220 in the vertical direction, and enters the touch pad unit.

Meanwhile, referring to FIG. 4 , when a unit panel has a substantially rectangular shape, a pad portion is defined along one of four sides of the unit panel, and a rectangular active area AA is defined adjacent to the pad portion. . An edge of a side with a pad part is farther from the active area than edges of other sides, and a distance between the side with the pad part and the active area AA corresponds to the width of the pad part.

This will be described with reference to FIGS. 4 and 5 .

5 is an enlarged plan view of the left touch pad part of FIG. 4 according to the first embodiment of the present invention.

Meanwhile, as shown in FIGS. 2A to 4 , it may have a rectangular shape common to general flexible organic light emitting display devices. A flexible organic light emitting display device of the present invention includes a first flexible substrate 110 having a pad portion having a certain width along a first side and having an active area adjacent to the pad portion and spaced apart from edges of the remaining three sides by a predetermined distance; The thin film transistors and organic light emitting diode arrays 120 and 130 provided on the active area of the first flexible substrate and the second flexible substrate 210 overlapping the active area and both ends of the pad part along the first side, , and a touch sensing array 220 provided on the second flexible substrate, facing the active area of the first flexible substrate.

4 and 5, looking at the structure of the flexible organic light emitting display device according to the first embodiment of the present invention from the viewpoint of top and bottom bonding, provided on the second flexible substrate and overlapping both ends of the pad part a touch pad portion including a plurality of touch pad electrodes 225, an anisotropic conductive film 250 having a conductive ball 255 positioned between the touch pad portion and the layers at both ends of the pad portion, the thin film transistor and the organic An adhesive layer 150 located between layers between the light emitting diode arrays 120 and 130 and the touch sensing array 220 and in contact with the anisotropic conductive film 250 in a direction perpendicular to the first side and the second A plurality of touch routing wires 227 overlapping the adhesive layer 150 on the outside of the active region on the flexible substrate 210, connected to the touch sensing array 220, and connected to the plurality of touch pad electrodes 225 ).

5 , in the touch pad portion of the flexible organic light emitting display device according to the first embodiment of the present invention, the touch pad electrodes 225 are arranged in two rows along the first side, and The touch pad electrodes 225 are connected to each other in a direction crossing the first side, and each of the two connected touch pad electrodes 225 is connected to the touch routing wires 227 .

In particular, in the flexible organic light emitting display device of the present invention, even if there is a space between the adhesive layer 150 and the anisotropic conductive film 250 that occurs in the horizontal direction, the touch routing wires 227 have an anisotropic conductive film on the vertical side. It is positioned so as to overlap the adhesive layer 150 in contact with 250 to increase the adhesive force of the touch routing wires 227 on the surface of the second flexible substrate 210 and to protect it. Through this, cracks of the touch routing wires 227 and opening of the touch channel may be prevented, thereby improving the yield of the entire device.

Meanwhile, the anisotropic conductive film 250 is spaced apart by a first distance d1 from the edge of the second flexible substrate 210 in the direction of the first side (a horizontal line passing through the center of the alignment key in FIG. 5). it is desirable This is because the second flexible substrate 210 is not normally cut when the anisotropic conductive film 250 remains on the cutting line when the second flexible substrate 210 is cut after the second glass substrate 400 is removed. This is because the anisotropic conductive film 250 should be applied to the inside of the edge, avoiding the edge of .

In addition, the anisotropic conductive film 250 is spaced apart from the adhesive layer 150 by a second distance d2 in a direction along the first side. In this case, overlapping between the adhesive layer 150 and the anisotropic conductive film 250 is prevented in the horizontal direction, thereby preventing lifting of a specific portion during the bonding process. In addition, the reason why the second distance d2 is required in the horizontal direction is that when pressure is applied in a relatively wide horizontal area compared to the side in the vertical direction, the adhesive layer 150 or the anisotropic conductive film 250 spreads Since the deviation is large, when applying or overlapping the adhesive layer 150 and the anisotropic conductive film 250, pressure is applied, and the overlapping between the adhesive layer 150 and the anisotropic conductive film 250 becomes severe, causing lifting of the corresponding area. Because. To prevent this, a second distance d2 is provided between the adhesive layer 150 and the anisotropic conductive film 250 in consideration of bonding/press pressure. In this case, even when pressure is applied, the anisotropic conductive film 250 does not come into contact with the adhesive layer 150 in the horizontal direction of the adhesive layer 150, thereby preventing the bonding from lifting, and the second distance d2 Since the touch routing wiring 227 is not located therein, a region in which the touch routing wiring 227 does not overlap with the adhesive layer 150 is not generated, so that the touch routing wiring 227 is cracked even after the second glass substrate 400 is removed. phenomenon can be prevented.

Here, when the adhesive layer 150 and the anisotropic conductive film 250 are applied adjacent to each other on the side of the touch pad in a direction perpendicular to the first side crossing the longitudinal direction of the pad, the vertical touch pad Since the section is short, when pressure is applied, the adhesive layer 150 and the anisotropic conductive film 250 spread by the pressure do not overlap each other and spread in the vertical direction so that the adhesive layer 150 and the anisotropic conductive film 250 are close to each other at the boundary. The area is different, and therefore, the touch routing wiring 227 located on the vertical side of the touch pad unit (direction perpendicular to the first side) overlaps the adhesive layer 150 to prevent wiring cracking by excluding wiring exposure in a specific area. It can.

In this way, there are regions (first gap and second gap) where the adhesive layer 150 or the anisotropic conductive film 250 are not provided in the regions in the horizontal direction (direction along the first side), but these are approximately 10 μm. It is an interval of ~400 μm, and the second interval d2 may be smaller than the first interval d1.

Meanwhile, the adhesive layer 150 and the anisotropic conductive film 250 are made of different materials and have different extensibility even when the same planar pressure is applied in the process of bonding the first and second glass substrates 300 and 400 together. In addition, compared to the anisotropic conductive film 250 limited to a local area, the area in which the adhesive layer 150 including the active area and areas other than the touch pad portion is extended is larger. For example, when the thickness of the adhesive layer 150 is 10 μm, it is stretched by a maximum of 381.6 μm and an average of 200 μm. In addition, when the thickness is 15 μm, the maximum elongation is 445.7 μm, and the average elongation is 250 μm. That is, since the adhesive layer 150 is proportional to the thickness, the first interval d1 and the second interval d2 are adjusted in consideration of the elongation rate and material of the adhesive layer 150 and the anisotropic conductive film 250. .

In addition, since the touch routing wire 227 is located in the vertical direction (direction crossing the first direction), it is not located in the second distance d2 between the touch pad part and the end of the adhesive layer located in the horizontal direction. Therefore, it may not overlap with the second interval d2.

In addition, an array pad electrode 145 connected to the thin film transistor and the organic light emitting diode arrays 120 and 130 may be provided on the pad portion exposed from the second flexible substrate 210 .

And, corresponding to the touch pad electrodes 225, dummy pad electrodes 125 are provided on the first flexible substrate 110, and in the anisotropic conductive film 250 positioned between the layers therebetween The conductive ball 255 is broken by pressure, and a connection between the dummy pad electrode 125 and the touch pad electrode 225 is made.

In this case, in the first embodiment of the present invention, the touch pad electrodes 225 may be connected in pairs and connected to one dummy pad electrode 125, and the actual touch-related driving signal may be transmitted to the first flexible substrate ( 110), it may be formed by connecting (not shown) the dummy pad electrode 125 in a plane through a wire to a pad portion where the array pad electrode 145 is located.

6 is an enlarged plan view of the left touch pad part of FIG. 4 according to the second embodiment of the present invention.

As shown in FIG. 6 , as a different example from the aforementioned first embodiment, in the organic light emitting display device according to the second embodiment of the present invention, the touch routing wires 227 are connected to the touch pad electrodes 225, respectively. As shown in shape, the touch routing wire 227 and the touch pad electrode 225 are connected in a one-to-one relationship.

The first and second embodiments differ only in whether the connection relationship between the touch pad electrode 225 and the touch routing wire 227 is 2:1 or 1:1, and the rest of the configuration is the same, have the same function.

Also in this case, the touch routing wire 227 is located on the vertical side of the touch pad part (direction perpendicular to the direction of the first side).

Meanwhile, although the number of touch pad electrodes 225 shown in FIG. 6 is 8, it is not limited thereto, and may vary according to the number of touch electrodes provided in the touch sensing array 220 and requiring signal application. have. In addition, when the number of touch pad electrodes 225 increases, the number of touch routing wires 227 also increases. In any case, the touch routing wires 227 maintain an overlapping relationship with the adhesive layer 15 at the side of the touch pad part. Thus, stress applied to the touch routing wire 227 due to external force may be prevented.

7A and 7B are plan views showing the correspondence between the adhesive layer and the routing wiring in the comparative example and the first embodiment of the present invention.

As shown in FIG. 7A , in the comparative example, the touch routing wiring 27 extending from the touch sensing array is provided to pass through the lower portion of the anisotropic conductive film 25 . In this case, the touch routing wiring 27 passes through the separation space between the anisotropic conductive film 25 and the adhesive layer 15, and the touch routing wiring 27 on the separation space is vulnerable when the second glass substrate is removed. There is a problem in that wiring cracks occur at the site. That is, there is a contact region electrically connecting the touch pad electrode 30 on the upper second flexible substrate and the dummy pad electrode (not shown) on the lower first flexible substrate, and when the second glass substrate is removed, the adhesive layer ( When an empty space is generated between 15) and the anisotropic conductive film 25, a touch routing wire corresponding to the empty space is vulnerable to stress when the upper glass is removed, and thus a wire crack may occur.

As shown in FIG. 7B , in the first embodiment of the present invention, in order to solve this problem, the anisotropic conductive film ( 250) so that the touch routing wiring 227 meets the touch pad electrode 225 so that the entire touch routing wiring 227 overlaps the adhesive layer 15 or the anisotropic conductive film 250, The problem of the comparative example can be solved.

That is, anisotropic conduction with the adhesive layer 150 is performed by changing the position of the touch routing wire 227 connected to the first and second touch electrodes 221 and 223 of the touch sensing array 220 and the punching position of the adhesive layer 150. Even if an empty space is generated between the films 250 , it is possible to improve touch channel open defects due to stress when the second glass substrate 400 is released.

On the other hand, in plan view, a laser cutting line for cutting the second flexible substrate 210 is located above the anisotropic conductive film 250, and the adhesive layer 150 is located on the lower side, so that the anisotropic conductive film 250 (on a plane) ) While it is impossible to control the vertical extension, the left and right areas are not directly in contact with laser cutting or active areas, so it is easy to control the width, and thus, the touch routing wiring 227 can be provided.

Touch routing wiring open defect rate comparative example First embodiment of the present invention Primary 34% 2% Secondary 40% 3% tertiary 37% One%

Meanwhile, in Table 1 below, open defects of touch routing wires were inspected three times for the comparative example and the first embodiment of the present invention.

That is, in the case of the comparative example, the defects of the touch routing wires were 34%, 40%, and 37%, and all defects of 34% or more appeared, whereas, in the case of the first embodiment of the present invention, 2%, 3%, and 1% , all of which had a defect rate of 3% or less. Accordingly, it can be seen that when the first embodiment of the present invention is applied, wiring cracks or touch channel open problems can be solved to the extent that defects of 5% or less do not affect touch sensing.

8 is a photograph showing cracks appearing in the comparative example of FIG. 7a.

Referring to the photograph of FIG. 8 , a crack is generated in a touch routing wire located in a separation space between the anisotropic conductive film and the adhesive layer. That is, as in the comparative example, when the touch routing wiring is located directly on the touch pad electrodes arranged in the horizontal direction of the touch pad unit in the touch sensing array, no adhesive material is adhered to the second flexible substrate within the separation space. It can be seen that cracks occur in the untouched touch routing wiring.

9A to 9C are cross-sectional views of an active area of the flexible organic light emitting display according to the present invention and lines II to II' of FIG. 5 .

9A to 9C, the flexible organic light emitting display device of the present invention includes the thin film transistor array 120 and the organic light emitting diode array 130 on a first flexible substrate 110, and the second The touch sensing array 220 is provided on the flexible substrate 210, and the active area AA and the outer area are provided at the same corresponding position of each array. In addition, a plurality of pixels are provided in a planar and matrix form in the active area, and each thin film transistor array 120 includes gate lines and data lines divided by pixel and crossing each other, and one or more thin film transistors (TFT) for each pixel. And, the organic light emitting diode array 130 includes an organic light emitting diode (OLED). The touch electrode array 220 includes a plurality of first touch electrodes 221 and second touch electrodes 222 crossing each other in an active area. The arrangement of the first and second touch electrodes 221 and 222 may correspond to a plurality of pixels, but may be arranged regardless of the arrangement of pixels.

In addition, a pad portion is provided in an outer region of the thin film transistor array 120 , and the touch electrode array 220 has a touch pad portion connected to the dummy pad electrode 125 provided in the pad portion of the thin film transistor array 120 . provide Here, the reason why the touch pad unit is connected to the pad unit of the thin film transistor array 120 is to avoid a separate FPC connection to the touch electrode array 220 side, and to apply signals for touch control to the thin film transistor array 120 and This is to receive from the pad part on the same side. This is also for process simplification and minimal FPC connections.

The thin film transistor (TFT) in the pixel of the thin film transistor array 120 includes an active layer 122 on the TFT buffer layer 121 and a gate insulating film formed on the TFT buffer layer 121 covering the active layer 122 ( 124a), a gate electrode 123 overlapping the active layer 122, an interlayer insulating film 124b formed on the gate electrode 123 and the gate insulating film 124a, and the interlayer insulating film 124b, A source electrode 125 and a drain electrode 126 connected to both ends of the active layer 122 through the gate insulating layer 124a are included. Here, the gate electrode 123 may be located on the same layer as the gate line, and the source electrode 125 and the drain electrode 126 may be located on the same layer as the data line.

A pad electrode for a gate line and a data line and a second electrode pad electrode for grounding or applying a constant voltage to the second electrode of the organic light emitting diode array are provided in the outer region of the thin film transistor array, and as shown in FIG. , a dummy electrode pad 125 connected to the touch pad electrode 225 in the anisotropic conductive film 250 on the upper side may be provided.

The organic light emitting diode array 130 includes an organic light emitting diode (OLED), and the organic light emitting diode (OLED) includes a first electrode 131 connected to the drain electrode 116 and a bank 132a defining a light emitting region. ) and a second electrode 134 covering the organic light emitting layer 133 formed in the organic light emitting layer 133 (EL). Here, the organic light emitting diode (OLED) covers the thin film transistor (TFT) through the passivation layer 128 and forms a contact hole in a portion of the passivation layer 126 to connect to the drain electrode 126 . The first electrode 131 is connected to the drain electrode 126 .

In some cases, the organic light emitting diode array 130 may include a spacer 132b having a predetermined height corresponding to a partial width of the bank 132a on the bank 132a. When the organic light emitting layer 133 is formed, the spacer 132b corresponds to the upper side of the first flexible substrate 110 with a metal mask through which the organic material is transmitted through a predetermined opening, and an organic material deposition process is performed. In this process, the metal mask In order to prevent bank 132a from collapsing or affecting the inside of the light emitting region due to sagging, spacers 132b are regularly provided on the bank 132a. On the other hand, the first electrode 131 is a reflective electrode, and the second electrode 134 is a transparent electrode. When external light is incident, it is reflected through the organic light emitting diode (OLED) to form the first electrode 131. , and the light passes through the second electrode 134, which is transparent when reflected, and the light proceeds. An encapsulation layer 140 (encap) is provided on the uppermost side of the organic light emitting diode array 130 to protect the lower organic light emitting diode (OLED).

An adhesive layer 150 is provided between the organic light emitting diode array 130 and the touch sensing array 220 .

The touch sensing array 220 includes a plurality of first and second touch electrodes 221 and 222 crossing each other in an active area, a protective film 226 covering the first and second touch electrodes 221 and 222, and , a plurality of touch pad electrodes 225 corresponding to the first and second touch electrodes 221 and 222 in the outer area and the first and second touch electrodes 221 in the touch pad electrode 225 , 222) and a routing wire 227 for transmitting signals.

In the illustrated example, the first and second touch electrodes 221 and 222, the routing wiring 227, and the touch pad electrode 225 each have metal mesh patterns 221a, 222a, 227a, and 225a on the lower side. and a two-layer electrode structure having transparent electrodes 221b, 222b, 227b, and 225b on the upper side, through which electric field stabilization and low resistance are sought. However, in the organic light emitting display device of the present invention, the touch electrode array does not need to be limited to an electrode structure including such a metal mesh pattern, and may be implemented as a single-layer electrode structure.

In addition, since the first touch electrode 221 and the second touch electrode 222 are positioned on the same surface in the illustrated example, in order to prevent a short between the two, the first electrode 221 is placed within the protective film 226. A bridge pattern 221c is placed through the provided contact hole so as to be electrically insulated from the intersecting second electrode 222 .

As shown, the first and second touch electrodes 221 and 222 , the routing wire 227 , and the touch pad electrode 225 are positioned on the second flexible substrate 210 . In addition, the second flexible substrate 210 is a single substrate of an organic film such as polyimide or a laminated substrate of an organic film and a plurality of inorganic films, and the top of the plurality of inorganic films is formed on the surface where the touch sensing array 220 is formed. Alternatively, it is possible to include only a plurality of inorganic films by omitting organic film materials such as polyimide. In any case, this is because the second flexible substrate 210 is a transparent substrate, and the side of the second flexible substrate 210 is used as a display surface.

In addition, as shown in FIG. 9B, the adhesive layer 150 is brought into contact with the anisotropic conductive film 250 for the vertical side of the touch pad unit, and the touch routing wiring ( 227), the entire upper portion of the touch routing wire 227 is covered with the adhesive layer 150, thereby strengthening the adhesive force of the touch routing wire 227 with respect to the second flexible substrate 210. In this way, wiring cracks can be prevented.

As shown in FIG. 9C , even if the adhesive layer 150 is provided by separating the anisotropic conductive film 250 of the touch pad part at a second distance d2 from the lower part along the horizontal direction of the touch pad part, the second distance Since the touch routing wiring 227 is not provided within the gap, cracking of the touch channel of the touch sensing array may be prevented and yield may be improved.

Meanwhile, the touch routing wire 227 and the touch pad electrode 225 shown in FIGS. 9B and 9C are shown as a double layer, but are not limited thereto and may be formed of a single layer or a triple layer.

The flexible organic light emitting display device of the present invention can secure the contact reliability of the touch pad part when manufacturing an in-cell touch (In-Cell type Touch) organic light emitting panel, and the outer touch connected to the touch pad electrode in the anisotropic conductive film Disconnection of the touch routing wire may be reduced and a defect rate may be minimized by placing the routing wire at a vertical side of the touch pad unit.

An in-cell touch organic light emitting panel has a structure in which an upper touch screen substrate and a lower thin film transistor substrate are bonded together. At this time, there is a contact area that electrically connects the upper touch screen substrate and the lower thin film transistor substrate. When the upper glass is removed, when an empty space is generated between the adhesive layer and the conductive adhesive member, wiring cracks occur due to the stress of removing the upper glass. do.

In order to solve this problem, the present invention prevents touch channel open defects due to stress when removing the upper glass even when an empty space occurs between the adhesive layer and the conductive adhesive member by changing the position of wiring connected to the touch screen channel electrode and the position of punching out the adhesive layer. This can improve the reliability of the product and reduce the defect rate.

On the other hand, the present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be clear to those skilled in the art.

100: lower array 110: first flexible substrate
120: thin film transistor array 125: dummy pad electrode
130: organic light emitting diode array 135: array pad electrode
145: lighting inspection pattern 150: adhesive layer
200: upper array 210: second flexible substrate
220: touch sensing array 225: touch pad electrode
227: touch routing wiring 250: anisotropic conductive film
255: conductive ball 300: first glass substrate
400: second glass substrate

Claims (9)

a first flexible substrate having a rectangular shape, having a pad portion having a predetermined width along a first side, and having an active area adjacent to the pad portion and spaced apart by a predetermined distance from edges of the remaining three sides;
a thin film transistor and an organic light emitting diode array provided on the active area of the first flexible substrate;
a second flexible substrate overlapping both ends of the active area and the pad portion along the first side;
a touch sensing array disposed on the second flexible substrate and facing the active area of the first flexible substrate;
a touch pad unit including a plurality of touch pad electrodes provided on the second flexible substrate and overlapping with both ends of the pad unit;
an anisotropic conductive film positioned between the touch pad part and the layers at both ends of the pad part;
an adhesive layer disposed between layers between the thin film transistor and the organic light emitting diode array and the touch sensing array and in contact with the anisotropic conductive film at a side of the touch pad part in a direction perpendicular to the longitudinal direction of the first side; and
A contact with the outside of the anisotropic conductive film is overlapped with the adhesive layer on a side of the touch pad part in a direction perpendicular to the longitudinal direction of the first side at the outer edge of the active region on the second flexible substrate, and the plurality of touches A flexible organic light emitting display device including a plurality of touch routing wires connecting pad electrodes and the touch sensing array. According to claim 1,
The anisotropic conductive film is spaced apart from an edge of the second flexible substrate by a first distance in the direction of the first side. According to claim 2,
The anisotropic conductive film is spaced apart from the adhesive layer by a second distance in a direction along the first side. According to claim 3,
The touch routing wire does not overlap with the second distance. According to claim 1,
The flexible organic light emitting display device of claim 1 , wherein the second flexible substrate has a shape recessed between both ends of the pad part and adjacent to the active region. According to claim 5,
A flexible organic light emitting display device comprising an array pad electrode connected to the thin film transistor and the organic light emitting diode array on the pad portion exposed from the second flexible substrate. According to claim 1,
A flexible organic light emitting display device comprising dummy pad electrodes on the first flexible substrate, corresponding to the touch pad electrodes. According to claim 1,
The touch routing wires are respectively connected to the touch pad electrodes. According to claim 1,
In the touch pad unit, the touch pad electrodes are arranged in two rows along the first side, the touch pad electrodes in the second row are connected to each other in a direction crossing the first side, and the two connected touch pad electrodes are A flexible organic light emitting display device connected to each of the touch routing lines.

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