KR20200010795A - Display device - Google Patents

Abstract

The present invention relates to a display device. According to the present invention, the display device comprises: a display panel; and a touch sensing unit disposed to face the display panel and including a touch region, a touch pad region extending from the touch region, and a test pad region extending from the touch pad region, wherein the touch sensing unit includes a plurality of touch pads disposed in the touch pad region, a plurality of test pads disposed in the test pad region, a plurality of dummy wires disposed between the touch pads and the test pads, and an organic material layer integrally formed in the touch region, the touch pad region, and the test pad region. According to the present invention, it is possible not to remove the test pad region during a process of manufacturing the touch sensing unit and to prevent increase of a defect rate of the display device due to foreign substances generated by damage to the dummy wires by minimizing damage to the dummy wires.

Description

Display device {DISPLAY DEVICE}

The present invention relates to a display device, and more particularly, to a display device capable of improving damage to a wiring formed in an area where an inspection pad of a touch sensing unit is disposed during a manufacturing process of a display device.

Display devices used in computer monitors, TVs, mobile phones, and the like include organic light emitting displays (OLEDs) that emit light by themselves, and liquid crystal displays (LCDs) that require a separate light source. have.

The display device has been widely applied to not only a monitor and a TV of a computer but also a personal portable device, and research on a display device having a large display area and a reduced volume and weight is being conducted.

In such a display device, a touch sensing unit for more easily receiving a user input is used. The touch sensing unit is a component that senses a user's touch input to a display device, and is widely used in a large display device such as a display device in a public facility and a smart TV, as well as a personal portable device such as a smartphone and a tablet PC.

Recently, a foldable display device, in which a display unit, a wiring, or the like is formed on a flexible substrate such as plastic, which is a flexible material, and is manufactured to be able to display an image even when bent like paper, has attracted attention as a next generation display device. In order to apply the touch sensing unit to such a foldable display device, there is a demand for a technology of forming the touch sensing unit disposed on the display panel with a flexible material.

In order to form a touch sensing unit applied to a flexible display unit such as a foldable display unit, the inventors of the present invention form the components of the touch sensing unit on a base substrate made of glass, and after all the components are formed, the base substrate is formed. In order to eliminate the problem, the present invention provides a technique for imparting flexibility to the touch sensing unit. In this case, a plurality of test pads for checking whether the touch sensing unit is normally operated are disposed in the non-touch area of the touch sensing unit, and the plurality of test pads are disposed in the touch area of the touch sensing unit via the plurality of touch pads. Is electrically connected to the However, since the plurality of test pads is not necessarily required in the final product, the inventors of the present invention can simultaneously connect a plurality of test pads, a plurality of test pads, and a plurality of touch pads in a process of removing the base substrate. An attempt was made to remove the test wiring. However, in the process of removing the base substrate and the plurality of test wirings, foreign materials of the plurality of test wirings and / or foreign materials of the inorganic layer disposed above or below the plurality of test wirings may be generated to increase the defective rate of the display device. The inventors of the present invention have recognized that possible problems may arise.

Accordingly, the inventors of the present invention have invented a display device having a new structure that can minimize foreign substances generated in the process of removing the base substrate.

The problem to be solved by the present invention is to include the organic material layer integrally formed on the touch area, the touch pad area, and the entire inspection pad area of the touch sensing unit, the damage of the plurality of dummy wiring in the process of removing the base substrate can be minimized It is to provide a display device.

In addition, another object of the present invention is to electrically insulate a plurality of dummy wires extending from a plurality of touch pads and a plurality of dummy wires extending from a plurality of test pads, thereby providing a plurality of touch electrodes to a plurality of touch electrodes. The present invention provides a display device in which a signal is applied to prevent a touch sensor from malfunctioning.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above problems, the display device according to the exemplary embodiment of the present invention is disposed to face the display panel, the display panel, and extends from the touch area, the touch pad area extending from the touch area, and the touch pad area. And a touch sensing unit including an inspection pad area, wherein the touch sensing unit is disposed between the plurality of touch pads disposed in the touch pad area, the plurality of test pads disposed in the test pad area, and the plurality of touch pads and the plurality of test pads. The plurality of dummy wires and the organic material layer integrally formed with the touch area, the touch pad area, and the test pad area may be included. It may not be removed in the test pad area during the manufacturing process of the touch sensing unit, and damage of the plurality of dummy wires may be minimized to prevent an increase in the defective rate of the display device due to foreign matter caused by the damage of the plurality of dummy wires. .

A display device according to another embodiment of the present invention includes a display panel, a touch sensing unit disposed on the display panel and defining a touch area and a pad area, wherein the touch sensing unit includes a plurality of dummy wires and a plurality of dummy wires disposed in the pad area. The dummy wiring may include a planarization layer that flattens the plurality of dummy wirings so as to reduce damage to the dummy wiring. Damage of the plurality of dummy wires of the touch sensing unit may be prevented, thereby reducing the defective rate of the display device.

According to an embodiment of the present invention, a method of manufacturing a display device includes: forming a plurality of display panels on a mother substrate, a touch region on a base substrate, a touch pad region extending from the touch region, and an inspection extending from the touch pad region Forming a plurality of touch sensing units each including a pad area, bonding the mother substrate and the base substrate to align the plurality of display panels and the plurality of touch sensing units, and removing the base substrate from the plurality of touch sensing units. The method may include cutting the mother substrate in units of cells including a display panel and a touch sensing unit, and the forming of the plurality of touch sensing units may include forming an organic material layer integrally formed in the touch region, the touch pad region, and the inspection pad region. And a plurality of touch pads in the touch pad area, a plurality of test pads in the test pad area, and It may include the step of forming a plurality of scan lines for connecting a plurality of touch pads and a plurality of test pads. Thus, damage to the dummy wirings during the manufacturing process can be reduced, and the defective rate of the display device can be reduced.

Details of other embodiments are included in the detailed description and drawings.

The present invention can minimize damage to the dummy wires connected to the test pads of the touch sensing unit during the manufacturing process of the display device.

The present invention can effectively reduce the defective rate of the display device, which may be caused by foreign matter caused by damage to the dummy wiring of the touch sensing unit.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a plan view of a display device according to an exemplary embodiment of the present invention.
2 is a cross-sectional view of a display device according to an exemplary embodiment of the present invention.
3 is a rear view of the touch sensing unit according to the exemplary embodiment of the present invention.
4A to 4C are cross-sectional views of a touch sensing unit according to an embodiment of the present invention.
5A to 5H are plan views and cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the present embodiments make the disclosure of the present invention complete, and those of ordinary skill in the art to which the present invention belongs. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims.

Shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are exemplary, and thus, the present invention is not limited thereto. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When 'comprises', 'haves', 'consists of' and the like mentioned in the present specification are used, other parts may be added unless 'only' is used. In the case where the component is expressed in the singular, the plural includes the plural unless specifically stated otherwise.

In interpreting a component, it is interpreted to include an error range even if there is no separate description.

In the case of the description of the positional relationship, for example, if the positional relationship of the two parts is described as 'on', 'upper', 'lower', 'next to', etc. Alternatively, one or more other parts may be located between the two parts unless 'direct' is used.

When an element or layer is referred to as “on” another element or layer, it encompasses both the case where another layer or other element is interposed on or in the middle of another element.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may be a second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout.

The size and thickness of each component shown in the drawings are shown for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated configuration.

Each of the features of the various embodiments of the present invention may be combined or combined with each other, partly or wholly, various technically possible interlocking and driving as can be understood by those skilled in the art, each of the embodiments may be independently implemented with respect to each other It may be possible to carry out together in an association.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a display device according to an exemplary embodiment of the present invention. 2 is a cross-sectional view of a display device according to an exemplary embodiment of the present invention. 1 and 2, the display device 100 includes a substrate 111, a transistor 120, an organic light emitting element 130, a touch sensing unit 140, a first flexible film 151, and a second flexible. Film 152 and printed circuit board 160.

The substrate 111 is a component for supporting and protecting various components of the display device 100. The substrate 111 may be made of a plastic material having flexibility, or may be made of polyimide (PI). However, it is not limited thereto.

The substrate 111 includes a display area AA and a non-display area NA surrounding the display area AA.

The display area AA is an area where an image is displayed on the display device 100, and the display area AA includes various display devices and various driving devices for driving the display device. The display area AA includes a plurality of pixels. The plurality of pixels are in the display area AA and include elements such as the transistor 120. Each of the plurality of pixels is connected to a gate line, a data line, and a power line. The gate wiring is a wiring for transmitting a gate signal to a plurality of pixels, the data wiring is a wiring for transmitting a data signal to a plurality of pixels, and the power supply wiring is a wiring for supplying a high potential voltage to the plurality of pixels.

Referring to FIG. 2 to describe the structure of each pixel of the display area AA, the transistor 120 is disposed on the substrate 111.

In detail, the active layer 122 in which the channel of the transistor 120 is formed is formed on the substrate 111. The active layer 122 may be made of Low Temperature Poly-Silicon (LTPS) or an oxide semiconductor, but is not limited thereto. The gate insulating layer 112 is formed on the active layer 122. The gate insulating layer 112 may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be a single layer or a plurality of layers thereof, but is not limited thereto. Although not shown in FIG. 2, a buffer layer made of an inorganic material and a single layer or a plurality of layers may be disposed between the substrate 111 and the active layer 122.

The gate electrode 121 is formed on the gate insulating layer 112. The gate electrode 121 may be formed of a conductive material.

An interlayer insulating layer 113 is formed on the gate electrode 121. The interlayer insulating layer 113 may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be a single layer or a plurality of layers thereof, but is not limited thereto.

The source electrode 124 and the drain electrode 123 of the transistor 120 may be formed on the interlayer insulating layer 113. The source electrode 124 and the drain electrode 123 are electrically connected to the active layer 122 through contact holes formed in the gate insulating layer 112 and the interlayer insulating layer 113. The source electrode 124 and the drain electrode 123 may be made of a conductive material, and the source electrode 124 and the drain electrode 123 may be made of the same material through the same process.

In FIG. 2, the transistor 120 is illustrated as a top gate type coplanar transistor 120, but the stacked structure of the transistor 120 is not limited thereto.

2, a first planarization layer 114 is disposed on the transistor 120 and the interlayer insulating layer 113. The first planarization layer 114 is an insulating layer for planarizing the upper portion of the transistor 120 and may be formed of an organic material.

The organic light emitting element 130 is disposed on the first planarization layer 114. The organic light emitting element 130 includes an anode 131 electrically connected to the drain electrode 123 of the transistor 120, an organic light emitting layer 132 disposed on the anode 131, and a cathode formed on the organic light emitting layer 132 ( 133). When the display device 100 is the top emission type organic light emitting display device 100, the anode 131 supplies holes to the reflective layer and the organic light emitting layer 132 to reflect the emitted light toward the cathode 133. It may be defined to include a transparent conductive layer for. However, the present invention is not limited thereto, and the anode 131 may include only a transparent conductive layer, and the reflective layer may be defined as having a separate configuration from the anode 131.

The bank 115 is disposed on the anode 131 and the first planarization layer 114. The bank 115 is a structure for distinguishing pixels adjacent to each other in the display area AA and may define a plurality of pixels. The bank 115 may be formed of an organic material.

An encapsulation layer 116 is disposed on the cathode 133 and the bank 115 of the organic light emitting element 130. The encapsulation layer 116 may cover the organic light emitting element 130 and contact the portion of the upper surface of the bank 115 to seal the organic light emitting element 130. The encapsulation layer 116 may be made of an inorganic material, or may have a structure in which an inorganic layer and an organic layer are alternately stacked. Thus, the encapsulation layer 116 may protect the organic light emitting device 130 from moisture, air, or physical impact that may penetrate from the outside.

1 and 2, the non-display area NA is an area surrounding the display area AA adjacent to the display area AA. The non-display area NA is an area where no image is displayed, and wirings and circuits are formed. The pad area PA is an area where a plurality of pads P are formed. The pad area PA is disposed on one side of the non-display area NA. An external module such as a chip on film (COF), for example, a first flexible film 151 is bonded to the plurality of pads P of the pad area PA.

The first flexible film 151 is a film in which various components are arranged on a flexible base film, and is a component for supplying a signal to a plurality of sub pixels in the display area AA. The first flexible film 151 may be bonded to a plurality of pads P disposed in the non-display area NA, and display a power supply voltage, a data voltage, a gate voltage, and the like through the pads P. Supply to each of a plurality of sub-pixels. The first flexible film 151 may include a base film and a driving IC. In addition to this, various components may be disposed.

The base film is a layer that supports the driving IC of the first flexible film 151. The base film may be made of an insulating material, for example, may be made of an insulating material having flexibility.

The driving IC is a component that processes data for displaying an image and a driving signal for processing the same. Although FIG. 2 illustrates that the driving IC is mounted in a COF method, the driving IC is not limited thereto, and the driving IC may be mounted in a method such as a chip on glass (COG) or a tape carrier package (TCP).

1 and 2, the touch detector 140 is a component that detects external contact applied from the surface of the display device 100. The touch sensing unit 140 is disposed to face the display panel and includes a touch area TA, a touch pad area TPA, and an inspection pad area EPA. The touch pad area TPA extends from one side of the touch area TA, and the test pad area EPA from the other side of the touch pad area TPA facing one side of the touch pad area TPA in contact with the touch area TA. ) Is extended.

The touch area TA of the touch detector 140 is an area in which the plurality of touch electrodes 144 are disposed. The touch pad area TPA is an area in which a plurality of touch pads TP are disposed. The touch sensing area EPA is an area in which a plurality of sensing pads EP is disposed. Unlike the touch area TA of FIG. 1, the touch area TA may be defined to correspond to the display area AA of the substrate 111. In this case, the touch area TA and the touch pad area may be defined. Another area may be included between the TPAs. However, it is not limited thereto.

The touch sensing unit 140 includes a second planarization layer 141, a first inorganic layer 142, a second inorganic layer 143, a plurality of touch electrodes 144, a plurality of connection wires 145, and a plurality of touches. The pad TP includes a plurality of dummy wires 146, a plurality of test pads EP, and a plurality of connection pads CP.

Hereinafter, the touch sensing unit 140 will be referred to together with FIGS. 3 and 4 for a more detailed description.

3 is a rear view of the touch sensing unit according to the exemplary embodiment of the present invention. 4A to 4C are cross-sectional views of a touch sensing unit according to an embodiment of the present invention. 4A to 4C are cross-sectional views of the touch pad area TPA and the test pad area EPA of the touch sensing unit 140 of FIG. 3. Specifically, FIG. 4A is a cross-sectional view for describing a portion where the plurality of touch electrodes 144, the plurality of touch pads TP, the plurality of dummy wires 146, and the plurality of test pads EP are not disposed. 4B is a cross-sectional view illustrating a plurality of touch pads TP, a plurality of dummy wires 146, and a plurality of test pads EP disposed on the same layer as the plurality of first touch electrodes 144a. 4C is a cross-sectional view for describing a plurality of touch pads TP, a plurality of dummy wires 146, and a plurality of test pads EP disposed on the same layer as the plurality of second touch electrodes 144b.

1 to 3, the second planarization layer 141 is disposed on the entire touch area TA, the touch pad area TPA, and the test pad area EPA of the touch sensing unit 140. The second planarization layer 141 is an insulating layer planarizing the lower surface of the second planarization layer 141 and is disposed in the entire area of the touch sensing unit 140. The second planarization layer 141 may be disposed on various components disposed in the touch pad area TPA and the test pad area EPA of the touch sensing unit 140.

The second planarization layer 141 may be an organic material layer made of an organic material. The second planarization layer 141 may be made of an acryl-based organic material, but is not limited thereto. The second planarization layer 141 may include a contact hole for electrically connecting the plurality of touch pads TP and the plurality of connection pads CP.

1 to 3, a plurality of touch electrodes 144 and a plurality of connection wires 145 are disposed in the touch area TA of the touch sensing unit 140.

The plurality of touch electrodes 144 are electrodes made of a conductive material such as metal. In this case, the plurality of touch electrodes 144 may be disposed to overlap the bank 115 disposed in the display area AA. When the plurality of touch electrodes 144 are made of a conductive material such as metal, the plurality of touch electrodes 144 may be visually recognized from outside, and thus, the plurality of touch electrodes 144 may be areas in which the banks 115 are disposed. Since it is not disposed in an area except for, it may not overlap with the organic light emitting device 130. Thus, the plurality of touch electrodes 144 may be disposed in an area other than the emission area in which the organic light emitting element 130 is disposed, and thus may not affect the visibility of the user.

2 and 3, the plurality of touch electrodes 144 may include a plurality of first touch electrodes 144a and a plurality of second touch electrodes 144b. The plurality of first touch electrodes 144a and the plurality of second touch electrodes 144b extend in different directions in the touch area TA. For example, the plurality of first touch electrodes 144a are spaced apart from each other to extend in the vertical direction, and the plurality of second touch electrodes 144b are spaced apart from each other to extend in the direction of the plurality of first touch electrodes 144a. It may be disposed extending in the horizontal direction perpendicular to the. In FIG. 3, the extending directions of the plurality of first touch electrodes 144a and the plurality of second touch electrodes 144b are illustrated in the vertical direction and the horizontal direction, respectively, but are not limited thereto.

Referring to FIG. 2, a first inorganic layer 142 and a second inorganic layer 143 are disposed between the plurality of first touch electrodes 144a and the second planarization layer 141. Specifically, the first inorganic layer 142 is disposed below the second planarization layer 141, the second inorganic layer 143 is disposed below the first inorganic layer 142, and the second inorganic layer 143 is disposed. A plurality of first touch electrodes 144a is disposed below.

In detail, the first inorganic layer 142 functions as a barrier layer that prevents penetration of moisture, oxygen, and the like, and thus includes a plurality of touch electrodes 144, a plurality of connection wires 145, a plurality of touch pads TP, and a plurality of layers. Is a component for protecting the dummy wiring 146 and the plurality of test pads EP. The first inorganic layer 142 is an insulating layer made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx). The first inorganic layer 142 may include a contact hole for electrically connecting the plurality of touch pads TP and the plurality of connection pads CP.

2 and 3, a second inorganic layer 143 is disposed below the first inorganic layer 142. The second inorganic layer 143 is configured to insulate the components disposed above and below the second inorganic layer 143 from each other. Specifically, the plurality of first touch electrodes 144a may be disposed below the second inorganic layer 143, and the plurality of second touch electrodes 144b may be disposed above the second inorganic layer 143. Thus, the plurality of first touch electrodes 144a and the plurality of second touch electrodes 144b may be insulated by the second inorganic layer 143. However, differently, both the plurality of first touch electrodes 144a and the plurality of second touch electrodes 144b are formed under the second inorganic layer 143, and the plurality of first touch electrodes 144a and the plurality of first touch electrodes 144a are formed. The bridge disposed above the second inorganic layer 143 in the region where the second touch electrodes 144b of the second overlap the contact holes of the second inorganic layer 143 to form the plurality of first touch electrodes 144a or The plurality of second touch electrodes 144b may be connected. However, it is not limited thereto.

The second inorganic layer 143 is an insulating layer made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be made of the same material as the first inorganic layer 142. The second inorganic layer 143 may include a contact hole for electrically connecting the plurality of touch pads TP and the plurality of connection pads CP.

2 and 3, a plurality of second touch electrodes 144b is disposed between the first inorganic layer 142 and the second inorganic layer 143. The plurality of second touch electrodes 144b may extend perpendicular to the extending direction of the plurality of first touch electrodes 144a and may be insulated from the plurality of first touch electrodes 144a by the second inorganic layer 143. 2 and 3, the plurality of touch electrodes 144 may have a mesh pattern shape. The plurality of touch electrodes 144 may be made of a metal material and formed in a mesh pattern. In this case, the virtual region connecting the outer portion of the mesh pattern, that is, the region where the plurality of touch electrodes of the mesh pattern are disposed may have a rhombus shape as shown in FIG. 3, but is not limited thereto.

The plurality of touch electrodes 144 having a mesh pattern shape may be metal lines made of a low resistance metal. For example, the plurality of touch electrodes 144 may include molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). ) Or an alloy thereof. In this case, since the plurality of touch electrodes 144 are made of a metal material having low resistance, the RC delay of the touch sensing unit 140 may be lowered. In addition, since the plurality of touch electrodes 144 are made of a metal material having flexibility, the touch sensing unit 140 may also have flexibility.

As described with reference to FIGS. 1 and 2, the mesh patterns of the plurality of touch electrodes 144 may be disposed to overlap the banks 115 of the display panel. The metal forming the plurality of touch electrodes 144 may have high reflectivity, and thus, the plurality of touch electrodes 144 may be visually recognized from the outside. Since the plurality of touch electrodes 144 overlap with the banks 115 of the display panel, the plurality of touch electrodes 144 are not visible from the outside, thereby reducing the visibility of the display device 100.

2 and 3, a plurality of connection wires 145 are disposed between the plurality of touch electrodes 144 and the plurality of touch pads TP. The plurality of connection wires 145 electrically connect each of the plurality of touch electrodes 144 and the plurality of touch pads TP between the plurality of touch electrodes 144 and the plurality of touch pads TP to connect the plurality of touches. A signal may be transferred between the electrode 144 and the plurality of touch pads TP. In detail, the plurality of connection wires 145 may transmit signals from the plurality of touch electrodes 144 to the plurality of touch pads TP, and signals from the plurality of touch pads TP to the plurality of touch electrodes 144. You can also pass

In detail, the plurality of connection wires 145 may be disposed under the second inorganic layer 143 to connect the plurality of first touch electrodes 144a and the plurality of touch pads TP. In this case, the plurality of connection wires 145 may be made of the same material as the plurality of first touch electrodes 144a, and thus may be simultaneously formed in the same process as the plurality of first touch electrodes 144a. However, it is not limited thereto.

In addition, the plurality of connection wires 145 may be disposed between the first inorganic layer 142 and the second inorganic layer 143 to connect the plurality of second touch electrodes 144b and the plurality of touch pads TP. . In this case, the plurality of connection wires 145 may be made of the same material as the plurality of second touch electrodes 144b, and thus may be simultaneously formed in the same process as the plurality of second touch electrodes 144b. However, it is not limited thereto.

2 and 3, a plurality of touch pads TP is disposed in the touch pad area TPA of the touch sensing unit 140. The plurality of touch pads TP are connected to the plurality of touch electrodes 144 in the touch pad area TPA to receive signals from the plurality of touch electrodes 144 and transmit them to an external module connected to the touch sensing unit 140. Can be.

In detail, the plurality of touch pads TP may be disposed under the second inorganic layer 143 to be connected to the plurality of connection wires 145 connected to the plurality of first touch electrodes 144a. In this case, the plurality of touch pads TP may be made of the same material as that of the plurality of first touch electrodes 144a, and thus, in the same process as the plurality of first touch electrodes 144a and the plurality of connection wires 145. Can be formed at the same time. However, it is not limited thereto.

The plurality of touch pads TP may be disposed between the first inorganic layer 142 and the second inorganic layer 143 to be connected to the plurality of connection wires 145 connected to the plurality of second touch electrodes 144b. have. In this case, the plurality of touch pads TP may be made of the same material as the plurality of second touch electrodes 144b, and thus, may be formed in the same process as the plurality of second touch electrodes 144b and the plurality of connection wires 145. Can be formed at the same time. However, it is not limited thereto.

2 and 3, a plurality of test pads EP are disposed in the test pad area EPA of the touch sensing unit 140. The plurality of test pads EP are pads for inspecting whether the plurality of touch electrodes 144 are defective. The plurality of test pads EP are connected to the plurality of touch electrodes 144 during the manufacturing process of the touch sensing unit 140 to transmit a test signal to the plurality of touch electrodes 144. 144 and the plurality of connection lines 145 may be inspected for defects. In detail, the plurality of test pads EP may be formed under the second inorganic layer 143, and thus may be formed of the same material as the plurality of first touch electrodes 144a. In addition, the plurality of test pads EP may be formed between the first inorganic layer 142 and the second inorganic layer 143, and thus may be formed of the same material as the plurality of second touch electrodes 144b. .

2 and 3, a plurality of dummy wires 146 are disposed between the plurality of touch pads TP and the plurality of test pads EP. The plurality of dummy wires 146 electrically connect the plurality of touch pads TP and the plurality of test pads EP to each other during the manufacturing process of the touch sensing unit 140, thereby providing a plurality of touch electrodes on the plurality of test pads EP. 144 is a component that transmits a test signal. In detail, the plurality of dummy wires 146 are disposed under the second inorganic layer 143, and the plurality of touch pads TP and the plurality of test pads EP electrically connected to the plurality of first touch electrodes 144a. ) Can be connected. In this case, the plurality of dummy wires 146 may be formed through the same process as the plurality of first touch electrodes 144a, the plurality of touch pads TP, and the plurality of test pads EP. However, it is not limited thereto.

The plurality of dummy wires 146 are disposed between the first inorganic material layer 142 and the second inorganic material layer 143, and the plurality of touch pads TP electrically connected to the plurality of second touch electrodes 144b. And a plurality of test pads EP may be connected. In this case, the plurality of dummy wires 146 may be formed through the same process as the plurality of second touch electrodes 144b, the plurality of touch pads TP, and the plurality of test pads EP. However, it is not limited thereto.

2 and 3, the plurality of dummy wires 146 includes a plurality of first dummy wires 146a and a plurality of second dummy wires 146b.

The plurality of first dummy wires 146a are electrically connected to each of the plurality of touch pads TP and extend toward the plurality of test pads EP. Specifically, one end of the plurality of first dummy wires 146a is electrically connected to each of the plurality of touch pads TP, and the other end of the plurality of first dummy wires 146a faces toward the plurality of test pads EP. It extends and is spaced apart from and insulated from the plurality of second dummy wires 146b.

The plurality of second dummy wires 146b are electrically connected to each of the plurality of test pads EP and extend toward the plurality of touch pads TP. Specifically, one end of the plurality of second dummy wires 146b is electrically connected to each of the plurality of test pads EP, and the other end of the plurality of second dummy wires 146b faces toward the plurality of touch pads TP. It extends and is spaced apart from and insulated from the plurality of first dummy wires 146a. Thus, adjacent ends of the plurality of first dummy wires 146a and the plurality of second dummy wires 146b are spaced apart from each other and are insulated from each other.

As described above, the other ends of the plurality of first dummy wires 146a and the other ends of the plurality of second dummy wires 146b are spaced apart from each other and insulated from each other, and correspond to each other one to one. Therefore, the number of the plurality of first dummy wires 146a and the number of the plurality of second dummy wires 146b may be the same. The plurality of first dummy wires 146a and the plurality of second dummy wires 146b are connected to each of the plurality of touch pads TP and the plurality of test pads EP during the manufacturing process of the touch sensing unit 140. It may be a wiring of. In addition, one wire connecting each of the plurality of touch pads TP and the plurality of test pads EP may include a plurality of first dummy wires 146a and a plurality of second dummy wires during the manufacturing process of the touch sensing unit 140. The plurality of first dummy wires 146a and the plurality of second dummy wires 146b may be insulated from each other by adjacent ends thereof. Thus, the plurality of test pads EP may be electrically separated from the plurality of touch pads TP and the plurality of touch electrodes 144.

The lower surfaces of the plurality of dummy wires 146 may be flat. The second planarization layer 141 is disposed on the plurality of dummy wires 146, so that the upper surface of the plurality of dummy wires 146 may be flat, and thus the bottom surface of the plurality of dummy wires 146 may be flat. 2 and 3, a plurality of connection pads CP are disposed on the second planarization layer 141. The plurality of connection pads CP are components that electrically connect the plurality of touch pads TP and the second flexible film 152. The plurality of connection pads CP may be electrically connected to the plurality of touch pads TP through the contact holes of the second planarization layer 141, the first inorganic layer 142, and the second inorganic layer 143.

The second flexible film 152 is bonded on the plurality of connection pads CP. The second flexible film 152 is a film in which various components are disposed on a flexible base film, and supplies a signal to the touch sensing unit 140 and the plurality of touch electrodes 144 or signals from the plurality of touch electrodes 144. This is a part for receiving. The second flexible film 152 may be electrically connected to and bonded to the plurality of touch pads TP on the second planarization layer 141. The touch driving signals may be touched through the plurality of touch pads TP. 144 and supplies touch sensing signals from the plurality of touch electrodes 144. The second flexible film 152 may include a base film and a driving IC. In addition to this, various components may be disposed.

The base film is a layer that supports the driving IC of the second flexible film 152. The base film may be made of an insulating material, for example, may be made of an insulating material having flexibility.

The driving IC is a component that processes data for displaying an image and a driving signal for processing the same. Although FIG. 2 illustrates that the driving IC is mounted in a COF method, the driving IC is not limited thereto, and the driving IC may be mounted in a method such as a chip on glass (COG) or a tape carrier package (TCP).

Referring to FIG. 2, a printed circuit board 160 is connected to each of the first flexible film 151 and the second flexible film 152. The printed circuit board 160 transmits a signal for driving the display element to the display element, and transmits a signal for driving the touch sensing unit 140 to the touch sensing unit 140. The printed circuit board 160 may be equipped with a control unit such as an IC chip, a circuit unit, and the like.

The plurality of pads P is connected to the printed circuit board 160 through the first flexible film 151, and the plurality of connection pads CP are connected to the printed circuit board 160 through the second flexible film 152. Connected. The first flexible film 151 and the second flexible film 152 may be attached to the same side of the printed circuit board 160 as shown in FIG. 2, but are not limited thereto and may include the first flexible film 151. The second flexible film 152 may be attached to different surfaces of the printed circuit board 160, respectively. In addition, although the first flexible film 151 and the second flexible film 152 are illustrated as being connected to the same printed circuit board 160 in FIG. 2, the present invention is not limited thereto, and the first flexible film 151 and the second flexible film 152 may be connected to each other. The flexible film 152 may be connected to different printed circuit boards.

Referring to FIG. 4A, FIG. 4A illustrates a touch pad area TPA in which a plurality of connection wires 145, a plurality of touch pads TP, a plurality of dummy wires 146, and a plurality of test pads EP are not disposed. And cross section for explaining the test pad region EPA.

Referring to FIG. 4A, a second planarization layer 141 is disposed in the touch pad area TPA and the test pad area EPA of the touch sensor 140. The first inorganic layer 142 is disposed below the second planarization layer 141, and the second inorganic layer 143 is disposed below the first inorganic layer 142.

Referring to FIG. 4B, FIG. 4B illustrates a plurality of connection wires 145, a plurality of touch pads TP, a plurality of dummy wires 146, and a plurality of connection wires 145 disposed on the same layer as the plurality of first touch electrodes 144a. It is sectional drawing for demonstrating test pad EP. Referring to FIG. 4B, a second planarization layer 141 is disposed in the touch pad area TPA and the test pad area EPA. The first inorganic layer 142 is disposed below the second planarization layer 141, and the second inorganic layer 143 is disposed below the first inorganic layer 142.

In addition, a plurality of connection wires 145, a plurality of touch pads TP, and a plurality of first dummy wires 146a are disposed under the second inorganic layer 143 in the touch pad area TPA. Although not illustrated in FIG. 4B, the plurality of connection wires 145 may be connected to the plurality of first touch electrodes 144a disposed under the second inorganic layer 143 of the touch area TA. The plurality of touch pads TP may be connected to the plurality of connection wires 145, and the plurality of first dummy wires 146a may be connected to the plurality of touch pads TP.

A plurality of second dummy wires 146b and a plurality of test pads EP are disposed under the second inorganic layer 143 in the test pad region EPA. The plurality of second dummy wires 146b and the plurality of test pads EP may be connected to each other.

The plurality of first dummy wires 146a and the plurality of second dummy wires 146b may be insulated from and spaced apart from each other. Accordingly, an electrical signal may not be transmitted between the plurality of first dummy wires 146a and the plurality of second dummy wires 146b, and thus, between the plurality of touch pads TP and the plurality of test pads EP. An electrical signal may not be delivered.

 Referring to FIG. 4C, FIG. 4C illustrates a plurality of connection wires 145, a plurality of touch pads TP, a plurality of dummy wires 146, and a plurality of connection wires 145 disposed on the same layer as the plurality of second touch electrodes 144b. It is sectional drawing for demonstrating test pad EP. Referring to FIG. 4C, a second planarization layer 141 is disposed in the touch pad area TPA and the test pad area EPA. The first inorganic layer 142 is disposed under the second planarization layer 141.

In the touch pad area TPA, a plurality of connection wires 145, a plurality of touch pads TP, and a plurality of first dummy wires 146a are disposed under the first inorganic layer 142. Although not shown in FIG. 4C, the plurality of connection wires 145 may be connected to the plurality of second touch electrodes 144b disposed under the first inorganic layer 142 of the touch area TA. The plurality of touch pads TP may be connected to the plurality of connection wires 145, and the plurality of first dummy wires 146a may be connected to the plurality of touch pads TP.

In addition, a plurality of second dummy wires 146b and a plurality of test pads EP are disposed under the first inorganic layer 142 in the test pad region EPA. The plurality of second dummy wires 146b and the plurality of test pads EP may be connected to each other. However, unlike FIG. 4C, the plurality of second dummy wires 146b may extend to an area where the plurality of test pads EP are disposed, and the plurality of test pads EP may be formed of a plurality of test pads EP. 2 may be formed under the dummy wiring 146b. In this case, the plurality of test pads EP may be made of the same material as the plurality of first touch electrodes 144a. However, it is not limited thereto.

Referring to FIG. 4C, the plurality of first dummy wires 146a and the plurality of second dummy wires 146b may be insulated from and spaced apart from each other. Accordingly, an electrical signal may not be transmitted between the plurality of first dummy wires 146a and the plurality of second dummy wires 146b, and thus, between the plurality of touch pads TP and the plurality of test pads EP. An electrical signal may not be delivered.

Hereinafter, a method of manufacturing a display device according to an exemplary embodiment of the present invention will be described with reference to FIGS. 5A to 5J to describe the effects of the display device according to an exemplary embodiment.

5A through 5J are plan views and cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention. For convenience of description, redundant descriptions of parts described with reference to FIGS. 1 to 4C will be omitted.

First, referring to FIG. 5A, a plurality of display panels are formed on the mother substrate 511. The mother substrate 511 refers to a substrate on which a plurality of display panels are formed. In FIG. 5A, three display panels are formed on one mother substrate 511, but the number of display panels formed on the mother substrate 511 is not limited thereto. A plurality of display panels of the display device 100 of FIGS. 1 to 4C are formed on the mother substrate 511.

5B and 5C, a plurality of touch sensing units 140 are formed on the base substrate 580. As described above, the base substrate 580 is a component for supporting the touch sensing unit 140 in the manufacturing process of the touch sensing unit 140. The base substrate 580 may be made of glass, and a plurality of touch sensing units 140 are formed on the base substrate 580. Specifically, on the base substrate 580, the second planarization layer 141, the first inorganic layer 142, the second inorganic layer 143, the plurality of touch electrodes 144, and the plurality of touch sensing units 140. The connection wire 145, the plurality of touch pads TP, the plurality of test wires 590, and the plurality of test pads EP may be formed. The touch sensing unit 140 of FIGS. 5B and 5C is substantially the same except that the plurality of dummy wirings 146 are the plurality of test wirings 590 as compared to the touch sensing unit 140 of FIGS. 1 to 4C. The duplicate description is omitted.

5B and 5C, a plurality of test wires 590 are formed between the plurality of touch pads TP and the test pads EP. The plurality of test wires 590 are configured to connect the plurality of touch pads TP and the plurality of test pads EP to test whether the plurality of touch electrodes 144 are defective. The plurality of test wires 590 refers to wires in a state in which the plurality of first dummy wires 146a and the plurality of second dummy wires 146b described above are connected to each other. That is, the plurality of first dummy wires 146a and the plurality of second dummy wires 146b may exist as the plurality of test wires 590 in the manufacturing process of the touch sensing unit 140.

In detail, a plurality of test wires 590 connected to each of the plurality of touch pads TP and the plurality of test pads EP may be formed below the second inorganic layer 143. In this case, the plurality of test wires 590 may be electrically connected to the plurality of first touch electrodes 144a disposed under the second inorganic layer 143. The plurality of test wires 590 may be made of the same material as the plurality of touch pads TP or the same material as the plurality of test pads EP. Accordingly, the plurality of touch pads TP, the plurality of test wires 590, and the plurality of test pads EP may be simultaneously formed through the same process.

Although not shown in FIG. 5C, a plurality of test wirings connected to each of the plurality of touch pads TP and the plurality of test pads EP may be disposed between the first inorganic layer 142 and the second inorganic layer 143. 590 may be formed. In this case, the plurality of test wires 590 may be electrically connected to the plurality of second touch electrodes 144b disposed between the first inorganic layer 142 and the second inorganic layer 143. In addition, the plurality of test wires 590 may be made of the same material as the plurality of touch pads TP or the same material as the plurality of test pads EP. Accordingly, the plurality of touch pads TP, the plurality of test wires 590, and the plurality of test pads EP may be simultaneously formed through the same process.

Subsequently, a signal is applied to the plurality of test pads EP to check whether the plurality of touch electrodes 144 are defective. Signals that can determine whether the defect is defective may be applied to each of the plurality of test pads EP, and the signals applied to the plurality of test pads EP are provided through the plurality of test wires 590. And a plurality of connection wires 145 may be transferred to each of the plurality of touch electrodes 144. Thus, each of the plurality of touch electrodes 144 may be inspected for defects.

Subsequently, referring to FIG. 5D, the plurality of test wires 590 may be cut by a laser and divided into a plurality of first dummy wires 146a and a plurality of second dummy wires 146b. When the plurality of test wires 590 are not cut as wires for inspecting whether the plurality of touch electrodes 144 are defective, incorrect signals are applied to the plurality of touch electrodes 144 after the manufacturing process of the display device 100 is completed. Can be passed. Accordingly, the plurality of test wirings 590 are cut between the plurality of touch pads TP and the plurality of test pads EP by a laser or the like, and thus, the plurality of first dummy wires 146a and the plurality of second dummy wires 146b. Can be divided into Thus, as a wrong signal is applied to the plurality of test pads EP of the touch sensing unit 140, the touch sensing unit 140 may be transmitted to the plurality of touch electrodes 144 to prevent the touch sensing unit 140 from malfunctioning.

Subsequently, referring to FIGS. 5E and 5F, the display panel and the touch sensing unit 140 are bonded by the adhesive layer 117. 5E is a plan view illustrating the mother substrate 511 on which the display panel of FIG. 5A is formed and the base substrate 580 on which the touch sensing unit 140 of FIG. 5B is bonded to face each other. 5F is a cross-sectional view of Vf-Vf 'of the bonded mother substrate 511 and the base substrate 580 of FIG. 5E.

5E and 5F, the plurality of display panels formed on the mother substrate 511 and the plurality of touch sensing units 140 formed on the base substrate 580 may include the mother substrate 511 and the base substrate 580. ) Are bonded to each other so that each is disposed outside. The mother substrate 511 and the base substrate 580 may be disposed up and down so that the plurality of display panels and the plurality of touch sensing units 140 are aligned with each other, and an adhesive layer (between the touch sensing unit 140 and the display panel). 117 may be formed. The adhesive layer 117 may be disposed only in an area corresponding to the second planarization layer 141 of the touch sensing unit 140. In addition, pressure may be applied to the mother substrate 511 and the base substrate 580, and the mother substrate 511 and the base substrate 580 may be bonded to each other by the adhesive layer 117.

Subsequently, referring to FIGS. 5G and 5H, the base substrate 580 disposed above the touch sensing unit 140 is removed. A sacrificial layer may be disposed between the base substrate 580 and the second planarization layer 141, and the sacrificial layer may be removed by a laser irradiated on the base substrate 580. Thus, the base substrate 580 may be separated and removed from the touch sensing unit 140. Thus, an upper portion of the second planarization layer 141 may be exposed to the outside.

Subsequently, referring to FIG. 5I, the plurality of display devices 100 are cut in units of one cell. As the base substrate 580 is removed, a plurality of display panels and a plurality of touch sensing units 140 aligned with each display panel are disposed on the mother substrate 511. Accordingly, the plurality of display devices 100 disposed on the mother substrate 511 may be cut in units of one display device 100 so that each of the plurality of display devices 100 may be independently formed.

Subsequently, whether or not the transistor 120 of the display device 100 is defective may be inspected. An inspection signal may be applied to the plurality of pads P of the substrate 111, and the inspection signal may be transmitted to the plurality of transistors 120. Thus, whether the plurality of transistors 120 are defective may be inspected.

Subsequently, referring to FIG. 5J, modules such as the first flexible film 151, the second flexible film 152, and the printed circuit board 160 are attached. That is, the first flexible film 151 is attached to the plurality of pads P on the substrate 111, the second flexible film 152 is attached to the plurality of connection pads CP, and the first flexible film 151. ) And the second flexible film 152 may be connected to the printed circuit board 160 to manufacture the display device 100.

In the conventional display device, after inspecting whether the plurality of touch electrodes is defective through the plurality of inspection wires of the touch sensing unit, a plurality of inspection wires are used as the plurality of first dummy wires and the plurality of second dummy wires. Did not cut. Instead, the second planarization layer, which overlaps with some regions of the plurality of test wirings, is removed between the plurality of test pads and the plurality of touch pads. Thus, the second planarization layer is not integrally formed in the entire touch area, the touch pad area, and the test pad area of the touch sensing unit, and is removed from the area overlapping the plurality of test wires in the test pad area. Thus, the second planarization layer was divided into a part overlapping with the plurality of test pads and another part overlapping with the plurality of touch pads.

In addition, the inorganic layer is disposed under the second planarization layer, and the plurality of inspection wirings are disposed under the inorganic layer, so that the inorganic layers are not removed because the plurality of inspection wirings function as a mask in the region where the inspection wirings are arranged. can not do it. Therefore, the inorganic material layer disposed between the plurality of test wirings and the second planarization layer remains unremoved after formation of the plurality of test wirings.

In this case, the inorganic layer is in contact with the base substrate in the region where the plurality of inspection wirings are arranged, and thus the base substrate may not be easily removed by the laser process. Since the inorganic layer and the base substrate are in contact with each other in the region where the plurality of inspection wirings are disposed, the removal of the base substrate by the laser process is not easy. The test wiring could be damaged by cracking or tearing. That is, in the process of separating the base substrate from the second planarization layer, the inorganic layer and the plurality of test wirings which contact the base substrate without being overlapped with the second planarization layer may be damaged. Thus, the inorganic layer and the plurality of test wirings may be damaged. Damaged debris could remain on the display. As a result, a failure rate of the display device is increased to cause a problem.

In contrast, in the display device 100 according to the exemplary embodiment, the second planarization layer 141 of the touch sensing unit 140 may be disposed on the touch area TA, the touch pad area TPA, and the entire inspection area. It is arranged in one piece. In particular, the second planarization layer 141 may be disposed to overlap the whole under the plurality of dummy wires 146 between the plurality of touch pads TP and the plurality of test pads EP. Therefore, the first inorganic material layer 142 made of an inorganic material disposed under the plurality of dummy wires 146 may not contact the base substrate 580, and the first inorganic material layer 142 and the base substrate 580 may not be in contact with each other. The second planarization layer 141 made of an organic material may be disposed therebetween. Thus, during the process of removing the base substrate 580, the first inorganic layer 142, the second inorganic layer 143, and the plurality of dummy wires 146 may not be damaged. In addition, the test pad region EPA on which the test pads EP are disposed may not be removed together with the base substrate 580. In this case, foreign matters due to damage of the first inorganic material layer 142, the second inorganic material layer 143, and the plurality of dummy wires 146 may be reduced during the process of removing the base substrate 580. As a result, the defective rate of the display device 100 due to the foreign matter may be reduced.

A display device and a method of manufacturing the same according to embodiments of the present invention can be described as follows.

The display device according to an exemplary embodiment of the present invention includes a touch sensing unit disposed to face the display panel, the display panel, and including a touch area, a touch pad area extending from the touch area, and an inspection pad area extending from the touch pad area. The touch sensing unit may include a plurality of touch pads disposed in the touch pad area, a plurality of test pads disposed in the test pad area, a plurality of dummy wires and a touch area disposed between the plurality of touch pads and the plurality of test pads, The organic material layer may be integrally formed with the touch pad area and the test pad area.

According to another feature of the invention, the plurality of dummy wires may include a plurality of first dummy wires extending from the plurality of touch pads toward the plurality of test pads and a plurality of agents extending toward the plurality of touch pads from the plurality of test pads. It may include two dummy wires.

According to another feature of the invention, the plurality of first dummy wires and the plurality of second dummy wires may be spaced apart from each other and insulated.

According to another feature of the present invention, the number of the plurality of first dummy wires and the number of the plurality of second dummy wires may be the same.

According to another feature of the present invention, the plurality of first dummy wires and the plurality of second dummy wires are disposed between the organic material layer and the display panel so that the bottom surfaces of the plurality of first dummy wires and the plurality of second dummy wires may be flat. Can be.

According to another feature of the invention, the touch sensing unit may further include at least one inorganic layer disposed between the plurality of dummy wires and the organic layer.

According to another feature of the present invention, a display device includes a first flexible film disposed on a display panel, a second flexible film electrically connected to a plurality of touch pads, and a printed circuit board connected to the first flexible film and the second flexible film. It may further include.

According to another feature of the present invention, the touch sensing unit may further include a plurality of connection pads electrically connected to the plurality of touch pads through the contact hole of the organic layer, and the second flexible film may be bonded to the plurality of connection pads.

According to another feature of the invention, the display device further comprises a plurality of touch electrodes disposed in the touch region and a plurality of connection wires connecting the plurality of touch electrodes and the plurality of touch pads, wherein the plurality of touch electrodes are mesh patterns It may be shaped.

A display device according to another embodiment of the present invention includes a display panel, a touch sensing unit disposed on the display panel and defining a touch area and a pad area, wherein the touch sensing unit includes a plurality of dummy wires and a plurality of dummy wires disposed in the pad area. The dummy wiring may include a planarization layer that flattens the plurality of dummy wirings so as to reduce damage to the dummy wiring.

According to another feature of the invention, the display device further comprises a plurality of touch pads and a plurality of test pads disposed in the pad area, the plurality of dummy wires, a plurality of dummy wires extending from the plurality of touch pads toward the plurality of test pads And a plurality of second dummy wires extending from the plurality of first dummy wires and the plurality of test pads toward the plurality of touch pads, wherein the plurality of first dummy wires and the plurality of second dummy wires are insulated from and spaced apart from each other. This can be flat.

According to another feature of the present invention, the semiconductor device may further include at least one inorganic layer disposed between the plurality of dummy wires and the planarization layer, and the planarization layer may overlap the entire inorganic material layer to reduce damage of the plurality of dummy wires. .

According to another feature of the invention, it may further include a plurality of touch electrodes disposed in the touch area and having a mesh pattern shape.

According to an embodiment of the present invention, a method of manufacturing a display device includes: forming a plurality of display panels on a mother substrate, a touch region on a base substrate, a touch pad region extending from the touch region, and an inspection extending from the touch pad region Forming a plurality of touch sensing units each including a pad area, bonding the mother substrate and the base substrate to align the plurality of display panels and the plurality of touch sensing units, and removing the base substrate from the plurality of touch sensing units. The method may include cutting the mother substrate in units of cells including a display panel and a touch sensing unit, and the forming of the plurality of touch sensing units may include forming an organic material layer integrally formed in the touch region, the touch pad region, and the inspection pad region. And a plurality of touch pads in the touch pad area, a plurality of test pads in the test pad area, and It may include the step of forming a plurality of scan lines for connecting a plurality of touch pads and a plurality of test pads.

According to another feature of the present invention, the forming of the touch sensing unit may further include forming a plurality of dummy wires by cutting the plurality of test wires.

According to still another feature of the present invention, the plurality of dummy wires includes a plurality of first dummy wires extending from the plurality of touch pads toward the plurality of test pads and a plurality of dummy wires extending toward the plurality of touch pads. The second dummy wire may include a plurality of first dummy wires and a plurality of second dummy wires, and may be insulated from each other, and the bottom surface thereof may be flat.

According to another feature of the present invention, the display device after cutting the mother substrate may include a touch pad area and an inspection pad area.

According to another feature of the present disclosure, the forming of the touch sensing unit may further include forming at least one inorganic layer between the plurality of test lines and the organic layer.

According to another feature of the present invention, the organic material layer may overlap the entire inorganic material layer in a region overlapping the plurality of test lines.

According to still another feature of the present disclosure, the forming of the touch sensing unit may further include, after forming the plurality of test wirings, inspecting the plurality of touch electrodes disposed in the touch area using the plurality of test wirings. Can be.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: display device
111: substrate
112: gate insulating layer
113: interlayer insulation layer
114: first planarization layer
115: bank
116: encapsulation layer
117: adhesive layer
120: transistor
121: gate electrode
122: active layer
123: drain electrode
124: source electrode
130: organic light emitting device
131: anode
132: organic light emitting layer
133: cathode
140: touch sensing unit
141: second planarization layer
142: first inorganic layer
143: second inorganic layer
144: touch electrode
144a: first touch electrode
144b: second touch electrode
145: connection wiring
146: dummy wiring
146a: first dummy wiring
146b: second dummy wiring
151: first flexible film
152: second flexible film
160: printed circuit board
511: ledger substrate
580: base substrate
590: inspection wiring
P: pad
TP: touch pad
EP: Inspection Pad
CP: connection pad
TA: touch area
PA: pad area
TPA: Touchpad Area
EPA: Test Pad Area
AA: display area
NA: non-display area

Claims (20)

Display panel;
A touch sensing unit disposed to face the display panel and including a touch area, a touch pad area extending from the touch area, and a test pad area extending from the touch pad area,
The touch sensing unit,
A plurality of touch pads disposed in the touch pad area;
A plurality of test pads disposed in the test pad area;
A plurality of dummy wires disposed between the plurality of touch pads and the plurality of test pads; And
And an organic material layer integrally formed with the touch area, the touch pad area, and the test pad area. The method of claim 1,
The plurality of dummy wires,
A plurality of first dummy wires extending from the plurality of touch pads toward the plurality of test pads; And
And a plurality of second dummy wires extending from the plurality of test pads toward the plurality of touch pads. The method of claim 2,
And the plurality of first dummy wires and the plurality of second dummy wires are insulated from and spaced apart from each other. The method of claim 2,
The number of the plurality of first dummy wires and the number of the plurality of second dummy wires are the same. The method of claim 2,
And the plurality of first dummy wires and the plurality of second dummy wires are disposed between the organic material layer and the display panel, and the bottom surfaces of the plurality of first dummy wires and the plurality of second dummy wires are flat. The method of claim 1,
The touch sensing unit,
And at least one inorganic layer disposed between the plurality of dummy wires and the organic layer. The method of claim 1,
A first flexible film disposed on the display panel;
A second flexible film electrically connected to the plurality of touch pads; And
And a printed circuit board connected to the first flexible film and the second flexible film. The method of claim 7, wherein
The touch sensing unit may further include a plurality of connection pads electrically connected to the plurality of touch pads through contact holes of the organic material layer.
The second flexible film is bonded to the plurality of connection pads. The method of claim 1,
A plurality of touch electrodes disposed in the touch area; And
A plurality of connection wires connecting the plurality of touch electrodes and the plurality of touch pads,
The display device of claim 1, wherein the plurality of touch electrodes have a mesh pattern shape. Display panel;
A touch sensing unit disposed on the display panel and defining a touch area and a pad area,
The touch sensing unit,
A plurality of dummy wires disposed in the pad area; And
And a planarization layer planarizing an upper portion of the plurality of dummy wirings so as to reduce damage of the plurality of dummy wirings. The method of claim 10,
Further comprising a plurality of touch pads and a plurality of test pads disposed in the pad area,
The plurality of dummy wires,
A plurality of first dummy wires extending from the plurality of touch pads toward the plurality of test pads; And
A plurality of second dummy wires extending from the plurality of test pads toward the plurality of touch pads,
And the plurality of first dummy wires and the plurality of second dummy wires are spaced apart from each other and insulated, and the bottom surface thereof is flat. The method of claim 10,
At least one inorganic layer disposed between the plurality of dummy wires and the planarization layer,
And the planarization layer overlaps with the entire inorganic material layer so as to reduce damage of the plurality of dummy wires. The method of claim 10,
And a plurality of touch electrodes disposed in the touch area and having a mesh pattern shape. Forming a plurality of display panels on the mother substrate;
Forming a plurality of touch sensing units on the base substrate, each touch sensing unit including a touch area, a touch pad area extending from the touch area, and a test pad area extending from the touch pad area;
Bonding the mother substrate and the base substrate to each other so that the plurality of display panels and the plurality of touch sensing units are aligned;
Removing the base substrate from the plurality of touch sensing units;
Cutting the mother substrate in units of cells including the display panel and the touch sensing unit;
Forming the plurality of touch sensing units,
Forming an organic material layer integrally formed on the touch area, the touch pad area, and the test pad area; And
Forming a plurality of touch pads in the touch pad area, a plurality of test pads in the test pad area, and a plurality of test wirings connecting the plurality of touch pads and the plurality of test pads. Way. The method of claim 14,
Forming the touch sensing unit,
And cutting the plurality of test wires to form a plurality of dummy wires. The method of claim 15,
The plurality of dummy wires,
A plurality of first dummy wires extending from the plurality of touch pads toward the plurality of test pads; And
A plurality of second dummy wires extending from the plurality of test pads toward the plurality of touch pads,
The plurality of first dummy wires and the plurality of second dummy wires are spaced apart from each other and insulated from each other, and the bottom surface thereof is flat. The method of claim 14,
And the display device after cutting the mother substrate includes the touch pad area and the test pad area. The method of claim 14,
Forming the touch sensing unit,
And forming at least one inorganic layer between the plurality of test wirings and the organic layer. The method of claim 18,
And the organic layer overlaps the entire inorganic layer in a region overlapping the plurality of test lines. The method of claim 14,
Forming the touch sensing unit,
And after the forming of the plurality of inspection wirings, inspecting a plurality of touch electrodes disposed in the touch area using the plurality of inspection wirings.

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