CN110289290B - Display mother board, preparation method thereof and electroluminescent display panel - Google Patents
Display mother board, preparation method thereof and electroluminescent display panel Download PDFInfo
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- CN110289290B CN110289290B CN201910551150.4A CN201910551150A CN110289290B CN 110289290 B CN110289290 B CN 110289290B CN 201910551150 A CN201910551150 A CN 201910551150A CN 110289290 B CN110289290 B CN 110289290B
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- frame sealing
- sealing glue
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses a display mother board, a preparation method thereof and an electroluminescent display panel, which are used for preventing frame sealing glue from flowing into a cutting area and ensuring the preparation yield of display products. The embodiment of the application provides a display motherboard, display motherboard includes: the display substrate and the cover plate are oppositely arranged; the display motherboard is divided into a display panel area and a peripheral area surrounding the display panel area; the display panel area includes a plurality of electroluminescent display panels; the peripheral zone includes: the packaging structure comprises a cutting area and a packaging area surrounding the cutting area; the package region includes: the display device comprises a display substrate, a cover plate, a frame sealing glue and a frame sealing glue blocking structure, wherein the display substrate and the cover plate are sealed, the frame sealing glue surrounds a cutting area, and the frame sealing glue blocking structure is positioned on one side of the frame sealing glue, which faces the cutting area.
Description
Technical Field
The application relates to the technical field of display, in particular to a display mother board, a preparation method thereof and an electroluminescent display panel.
Background
An Organic Light Emitting Diode (OLED) display device has many advantages of self-luminescence, low driving voltage, high luminous efficiency, short response time, high definition and contrast, a viewing angle of about 180 °, a wide temperature range, and capability of realizing flexible display and large-area full-color display, and is considered as a display device with the most potential development in the industry.
When an OLED display product is manufactured, an encapsulation process is required, wherein one encapsulation method is as follows: coating glass cement (Frit cement) on the cover plate glass and adhering the cover plate glass and the back plate glass, wherein the Frit cement is hard before a laser process after curing and has no adhesiveness with the back plate glass; therefore, the glass edge needs to be transit-packaged by using ultraviolet curing glue (UV glue) at the stage before the laser process. As shown in fig. 1 and 2, the UV glue 1 is disposed on the edge area of the cover glass 2, and then the cover glass 2 and the back glass 4 are paired with each other to form a box, which is then cut along the cutting line 3, and the area where the UV glue 1 is disposed is removed. However, since the UV glue has adhesiveness and is soft, in the process of entering atmospheric pressure after vacuum bonding of the cover glass and the back glass, as shown in fig. 3, the atmospheric pressure causes the UV glue 1 to flow from the edge region along the inside of the glass to form a puncture shape 5, and the UV glue 1 exists in the region corresponding to the cutting line 3, which affects the subsequent cutting and causes panel breakage.
In conclusion, in the packaging process of the OLED display product in the prior art, UV glue puncture easily occurs, which affects the subsequent cutting process, causes cutting damage, and affects the manufacturing yield of the OLED display product.
Disclosure of Invention
The embodiment of the application provides a display mother board, a preparation method thereof and an electroluminescent display panel, which are used for preventing frame sealing glue from flowing into a cutting area and ensuring the preparation yield of display products.
The display mother board that this application embodiment provided, the display mother board includes: the display substrate and the cover plate are oppositely arranged; the display motherboard is divided into a display panel area and a peripheral area surrounding the display panel area; the display panel area includes a plurality of electroluminescent display panels; the peripheral zone includes: the packaging structure comprises a cutting area and a packaging area surrounding the cutting area; the package region includes: the display device comprises a display substrate, a cover plate, a frame sealing glue and a frame sealing glue blocking structure, wherein the display substrate and the cover plate are sealed, the frame sealing glue surrounds a cutting area, and the frame sealing glue blocking structure is positioned on one side of the frame sealing glue, which faces the cutting area.
The display mother board provided by the embodiment of the application is characterized in that the packaging area is provided with the frame sealing glue blocking structure, the display substrate and the cover plate are arranged behind the display substrate and the cover plate in the preparation process of the display mother board, the frame sealing glue blocking structure can block the frame sealing glue from flowing into the cutting area, and when the display mother board is required to be cut along the cutting area, the cutting damage can not occur, so that the preparation yield of display products can be ensured.
Optionally, the frame sealing adhesive blocking structure includes a frame sealing adhesive blocking component surrounding the cutting area.
The display mother board that this application embodiment provided, because the frame sealing glue stops that the part surrounds the cutting district to can the omnidirectional avoid frame sealing glue to flow into the cutting district, when needs cut the display mother board along the cutting district, can not appear cutting the damage, thereby can guarantee the preparation yield of display product.
Optionally, the frame sealing glue blocking structure only includes a circle of frame sealing glue blocking component surrounding the cutting area, or the frame sealing glue blocking structure includes a plurality of circles of frame sealing glue blocking components surrounding the cutting area.
According to the display mother board provided by the embodiment of the application, when the frame sealing glue blocking structure comprises a plurality of circles of frame sealing glue blocking parts, in the process of closing the cover board and the display substrate, due to the fact that other frame sealing glue blocking parts are further arranged, even if frame sealing glue leakage occurs at the position of the frame sealing glue blocking part closest to the frame sealing glue, the frame sealing glue leakage does not flow into a cutting area under the blocking of the other frame sealing glue blocking parts, cutting damage does not occur, and the preparation yield of display products is guaranteed.
Optionally, the frame sealing adhesive blocking structure is in contact with both the display substrate and the cover plate.
The display mother board provided by the embodiment of the application, because the frame sealing glue blocks the structure and the display substrate and the cover plate to all channels of the frame sealing glue flowing into the cutting area can be blocked, the frame sealing glue is prevented from flowing into the cutting area, when the display mother board is required to be cut along the cutting area, the cutting damage can not occur, and the preparation yield of display products can be ensured.
Optionally, the frame sealing glue blocking component is in contact with the frame sealing glue.
Optionally, a distance between the frame sealing glue blocking structure and the cutting region boundary is greater than 0.
According to the display mother board provided by the embodiment of the application, the distance between the frame sealing glue blocking structure and the cutting area boundary is greater than 0, so that the frame sealing glue blocking structure cannot influence subsequent cutting, and the cutting damage cannot be caused.
Optionally, the frame sealing glue blocking structure is made of glass frit or polyimide.
The preparation method of the display mother board provided by the embodiment of the application comprises the following steps:
forming a pattern of the frame sealing glue and a pattern of the frame sealing glue barrier structure in the packaging area of the cover plate;
and aligning a cover plate with the display substrate, and curing the frame sealing glue to seal the display substrate and the cover plate.
According to the preparation method of the display mother board, the frame sealing glue blocking structure for blocking frame sealing glue from flowing into the cutting area is formed in the packaging area of the cover plate, the frame sealing glue blocking structure can prevent the frame sealing glue from flowing into the cutting area after the display substrate and the cover plate are aligned, and when the display mother board needs to be cut along the cutting area, cutting damage can not occur, so that the preparation yield of display products can be guaranteed.
Optionally, the forming a pattern of the frame sealing adhesive and a pattern of the frame sealing adhesive blocking structure in the encapsulation area of the cover plate specifically includes:
forming a pattern of the frame sealing glue in a packaging area of the cover plate, wherein the frame sealing glue defines a sealing area;
forming a frame sealing glue blocking structure pattern on one side of the frame sealing glue facing the closed area, wherein the thickness of the frame sealing glue blocking structure is less than or equal to that of the frame sealing glue.
According to the preparation method of the display mother board, the frame sealing glue blocking structure is formed on the cover board, the thickness of the frame sealing glue blocking structure is smaller than or equal to that of the frame sealing glue, so that the cover board and the display substrate can be connected through the frame sealing glue in the box-packing process, the frame sealing glue sealing cover board and the display substrate cannot be affected, and the sealing reliability of the display mother board cannot be affected.
According to the electroluminescent display panel provided by the embodiment of the application, the electroluminescent display panel is obtained by cutting the display mother board provided by the embodiment of the application.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art OLED display product package;
FIG. 2 is a schematic diagram of a prior art structure after UV glue is formed on backplane glass;
FIG. 3 is a schematic diagram of a prior art back plate glass and cover plate glass paired with each other;
fig. 4 is a schematic diagram of a display motherboard according to an embodiment of the present application;
FIG. 5 is a schematic view of a cross-section along AA' in FIG. 4 according to an embodiment of the present application;
fig. 6 is a schematic diagram of another display mother board according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram illustrating a manufacturing method of a display mother substrate according to an embodiment of the present disclosure;
fig. 8 is a schematic diagram illustrating a frame sealing adhesive and a frame sealing adhesive blocking structure formed on a cover plate in a method for manufacturing a display mother board according to an embodiment of the present disclosure.
Detailed Description
An embodiment of the present application provides a display mother board provided in an embodiment of the present application, as shown in fig. 4 and 5, where fig. 5 is a cross-sectional view taken along AA' in fig. 4, the display mother board includes: a display substrate 6 and a cover plate 7 which are oppositely arranged; the display mother board is divided into a display panel area 8 and a peripheral area 9 surrounding the display panel area 8; the display panel area 8 includes a plurality of electroluminescent display panels 14; the peripheral section 9 includes: a cutting region 10 and a packaging region 11 surrounding the cutting region 10; the package region 11 includes: the display device comprises a frame sealing adhesive 12 which seals the display substrate 6 and the cover plate 7 and surrounds the cutting area 10, and a frame sealing adhesive blocking structure 13 which is positioned on one side of the frame sealing adhesive 12 facing the cutting area 10.
The display mother board provided by the embodiment of the application is characterized in that the packaging area is provided with the frame sealing glue blocking structure, the display substrate and the cover plate are arranged behind the display substrate and the cover plate in the preparation process of the display mother board, the frame sealing glue blocking structure can block the frame sealing glue from flowing into the cutting area, and when the display mother board is required to be cut along the cutting area, the cutting damage can not occur, so that the preparation yield of display products can be ensured.
Optionally, in the display mother board shown in fig. 5 to 6 provided in this embodiment of the present application, the frame sealing adhesive blocking structure 13 includes a frame sealing adhesive blocking component 15 surrounding the cutting region 10.
The display mother board that this application embodiment provided, because the frame sealing glue stops that the part surrounds the cutting district to can the omnidirectional avoid frame sealing glue to flow into the cutting district, when needs cut the display mother board along the cutting district, can not appear cutting the damage, thereby can guarantee the preparation yield of display product.
Optionally, as shown in fig. 5, the frame sealing glue blocking structure only includes a circle of frame sealing glue blocking component surrounding the cutting region, or, as shown in fig. 6, the frame sealing glue blocking structure includes a plurality of circles of frame sealing glue blocking components surrounding the cutting region.
According to the display mother board provided by the embodiment of the application, when the frame sealing glue blocking structure comprises a plurality of circles of frame sealing glue blocking parts, in the process of closing the cover board and the display substrate, due to the fact that other frame sealing glue blocking parts are further arranged, even if frame sealing glue leakage occurs at the position of the frame sealing glue blocking part closest to the frame sealing glue, the frame sealing glue leakage does not flow into a cutting area under the blocking of the other frame sealing glue blocking parts, cutting damage does not occur, and the preparation yield of display products is guaranteed.
Fig. 6 illustrates that the frame sealing glue blocking structure includes two circles of frame sealing glue blocking members, but of course, the frame sealing glue blocking structure may also include more circles of frame sealing glue blocking members.
Optionally, in the display mother board shown in fig. 5 and 6 provided in this embodiment of the present application, the frame sealing adhesive blocking structure 13 is in contact with both the display substrate 6 and the cover plate 7.
The display mother board provided by the embodiment of the application, because the frame sealing glue blocks the structure and the display substrate and the cover plate to all channels of the frame sealing glue flowing into the cutting area can be blocked, the frame sealing glue is prevented from flowing into the cutting area, when the display mother board is required to be cut along the cutting area, the cutting damage can not occur, and the preparation yield of display products can be ensured.
Optionally, in the display mother board shown in fig. 5 and 6 provided in this embodiment of the present application, the frame sealing adhesive blocking component 15 is in contact with the frame sealing adhesive 12.
It should be noted that, when the frame sealing glue blocking structure includes a plurality of circles of frame sealing glue blocking components surrounding the cutting region, the frame sealing glue blocking component closest to the frame sealing glue contacts with the frame sealing glue.
Optionally, in the display mother board shown in fig. 4 to 6 provided in this embodiment of the present application, a distance between the frame sealing adhesive blocking structure and the boundary of the cutting region is greater than 0.
According to the display mother board provided by the embodiment of the application, the distance between the frame sealing glue blocking structure and the cutting area boundary is greater than 0, so that the frame sealing glue blocking structure cannot influence subsequent cutting, and the cutting damage cannot be caused.
Optionally, in the display mother board as shown in fig. 4 to 6 provided in this embodiment of the present application, distances between the frame sealing adhesive blocking structure and the boundary of the cutting region are all the same.
Optionally, the frame sealing glue blocking structure is made of frit (frit) or Polyimide (PI).
The frame sealing glue blocking component can be formed by adopting frat glue or PI glue. Of course, other materials may be selected to form the sealant blocking member.
Optionally, in the display mother board provided in the embodiment of the present application, the frame sealing adhesive is an ultraviolet curing adhesive (UV adhesive).
According to the display mother board provided by the embodiment of the application, the display panel area includes a plurality of electroluminescent display panels, and the display substrate may include, for example, a pixel circuit and an electroluminescent device sequentially disposed on a backplane glass. In the electroluminescent display panel, the electroluminescent device may be, for example, an electroluminescent Diode, and the electroluminescent Diode may be, for example, an Organic Light-Emitting Diode (OLED). The pixel circuit may comprise a plurality of transistors, and the electroluminescent device may be driven to emit light by the interaction of the transistors, thereby implementing a display function. In the display panel provided in the embodiment of the present invention, the transistor structure includes, for example: the grid electrode, the active layer insulated from the grid electrode, the source electrode and the drain electrode which are insulated from the grid electrode and electrically connected with the active layer. The Transistor may be, for example, a Thin Film Transistor (TFT). The cover plate may be a glass cover plate, for example.
Based on the same inventive concept, an embodiment of the present application further provides a method for manufacturing the display mother board, as shown in fig. 7, the method includes:
s101, forming a pattern of frame sealing glue and a pattern of a frame sealing glue blocking structure in a packaging area of the cover plate;
s102, aligning a cover plate and the display substrate, and curing the frame sealing glue to seal the display substrate and the cover plate.
According to the preparation method of the display mother board, the frame sealing glue blocking structure for blocking the frame sealing glue from flowing into the cutting area is formed in the packaging area of the cover plate, the frame sealing glue blocking structure can prevent the frame sealing glue from flowing into the cutting area after the display substrate and the cover plate are aligned, and when the display mother board needs to be cut along the cutting area, cutting damage can not occur, so that the preparation yield of display products can be guaranteed.
Optionally, the step S101 of forming a pattern of the frame sealing adhesive and a pattern of the frame sealing adhesive blocking structure in the encapsulation area of the cover plate specifically includes:
s1011, forming a pattern of the frame sealing glue in a packaging area of the cover plate, wherein the frame sealing glue limits a sealing area;
and S1012, forming a frame sealing glue blocking structure pattern on one side of the frame sealing glue facing the closed region, wherein the thickness of the frame sealing glue blocking structure is less than or equal to that of the frame sealing glue.
According to the preparation method of the display mother board, the frame sealing glue blocking structure is formed on the cover board, the thickness of the frame sealing glue blocking structure is smaller than or equal to that of the frame sealing glue, so that the cover board and the display substrate can be connected through the frame sealing glue in the box-packing process, the frame sealing glue sealing cover board and the display substrate cannot be affected, and the sealing reliability of the display mother board cannot be affected.
Taking the example that the frame sealing glue blocking structure includes a circle of frame sealing glue blocking component, the structure after the frame sealing glue and the frame sealing glue blocking component are formed on the cover plate is shown in fig. 8, the thickness of the frame sealing glue blocking component 15 is smaller than that of the frame sealing glue 12. It should be noted that, as shown in fig. 8, a gap is formed between the sealant 12 and the sealant blocking member 15 adjacent to the sealant 12. In specific implementation, the frame sealing glue and the frame sealing glue blocking component are not contacted with each other, and after the cover plate and the display substrate are aligned with each other, the frame sealing glue is soft in texture and can flow in the direction of the packaging area to be contacted with the frame sealing glue blocking component in the process of entering the atmospheric pressure after vacuum bonding.
Of course, the pattern of the frame sealing adhesive and the pattern of the frame sealing adhesive blocking structure are formed in the packaging area of the cover plate, or the pattern of the frame sealing adhesive blocking structure may be formed in the packaging area of the cover plate first and then the pattern of the frame sealing adhesive is formed.
It should be noted that the display mother board provided in the embodiment of the present application includes a plurality of electroluminescent display panels, and after the display mother board is prepared, a subsequent cutting process needs to be performed to obtain each individual electroluminescent display panel, taking the display mother board shown in fig. 4 as an example, in a specific implementation, the peripheral region may be removed by cutting along the cutting region of the peripheral region, and then the display panel region may be cut to obtain a plurality of individual electroluminescent display panels.
According to the electroluminescent display panel provided by the embodiment of the application, the electroluminescent display panel is obtained by cutting the display mother board provided by the embodiment of the application.
In summary, according to the display mother board and the preparation method thereof provided by the embodiment of the application, the frame sealing adhesive blocking structure is arranged on one side of the display mother board, facing the cutting area, of the frame sealing adhesive in the packaging area of the display mother board, so that the frame sealing adhesive blocking structure can prevent the frame sealing adhesive from flowing into the cutting area after the display substrate and the cover plate are aligned, and the display mother board is not cut or damaged when the display mother board is required to be cut along the cutting area, thereby ensuring the preparation yield of display products.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (9)
1. A display motherboard, comprising: the display substrate and the cover plate are oppositely arranged; the display motherboard is divided into a display panel area and a peripheral area surrounding the display panel area; the display panel area includes a plurality of electroluminescent display panels; the peripheral zone includes: the packaging structure comprises a cutting area and a packaging area surrounding the cutting area; the package region includes: the frame sealing glue sealing structure is used for sealing the display substrate and the cover plate and surrounding the cutting area, and the frame sealing glue blocking structure is positioned on one side of the frame sealing glue facing the cutting area;
the distance between the frame sealing glue blocking structure and the cutting area boundary is greater than 0; the distances between the frame sealing glue blocking structures and the boundary of the cutting area are the same.
2. The display mother board according to claim 1, wherein the frame sealing glue blocking structure comprises a frame sealing glue blocking member surrounding the cutting region.
3. The display mother board according to claim 2, wherein the frame sealing glue blocking structure comprises only one circle of frame sealing glue blocking component surrounding the cutting area, or the frame sealing glue blocking structure comprises a plurality of circles of frame sealing glue blocking component surrounding the cutting area.
4. The display mother board according to claim 1, wherein the sealant barrier structure contacts both the display substrate and the cover plate.
5. The display mother board according to claim 1, wherein the frame sealing glue barrier member is in contact with the frame sealing glue.
6. The display mother board according to claim 2, wherein the frame sealing adhesive blocking structure is made of glass frit or polyimide.
7. A method of manufacturing a display mother panel according to any one of claims 1 to 6, the method comprising:
forming a pattern of the frame sealing glue and a pattern of the frame sealing glue barrier structure in the packaging area of the cover plate;
and aligning a cover plate with the display substrate, and curing the frame sealing glue to seal the display substrate and the cover plate.
8. The method according to claim 7, wherein the forming of the pattern of the sealant and the pattern of the sealant barrier structure in the encapsulation area of the cover plate specifically comprises:
forming a pattern of the frame sealing glue in a packaging area of the cover plate, wherein the frame sealing glue defines a sealing area;
forming a frame sealing glue blocking structure pattern on one side of the frame sealing glue facing the closed area, wherein the thickness of the frame sealing glue blocking structure is less than or equal to that of the frame sealing glue.
9. An electroluminescent display panel obtained by cutting the display mother substrate according to any one of claims 1 to 6.
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| CN201910551150.4A CN110289290B (en) | 2019-06-24 | 2019-06-24 | Display mother board, preparation method thereof and electroluminescent display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910551150.4A CN110289290B (en) | 2019-06-24 | 2019-06-24 | Display mother board, preparation method thereof and electroluminescent display panel |
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| CN110289290B true CN110289290B (en) | 2022-07-01 |
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| CN111047970B (en) * | 2019-11-21 | 2022-04-19 | 昆山国显光电有限公司 | Display panel and display panel mother board |
| CN111538185A (en) * | 2020-05-19 | 2020-08-14 | Tcl华星光电技术有限公司 | Backlight module and manufacturing method thereof |
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| CN103077956A (en) * | 2013-01-28 | 2013-05-01 | 四川虹视显示技术有限公司 | Organic electroluminescence light emitting diode (LED) panel |
| CN104241542A (en) * | 2014-09-22 | 2014-12-24 | 深圳市华星光电技术有限公司 | OLED packaging method and structure |
| CN104638201A (en) * | 2015-03-06 | 2015-05-20 | 京东方科技集团股份有限公司 | OLED (Organic Light Emitting Diode) display mother board, packaging system and packaging method thereof |
| CN108389981A (en) * | 2018-04-11 | 2018-08-10 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102036908B1 (en) * | 2013-04-19 | 2019-10-28 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103077956A (en) * | 2013-01-28 | 2013-05-01 | 四川虹视显示技术有限公司 | Organic electroluminescence light emitting diode (LED) panel |
| CN104241542A (en) * | 2014-09-22 | 2014-12-24 | 深圳市华星光电技术有限公司 | OLED packaging method and structure |
| CN104638201A (en) * | 2015-03-06 | 2015-05-20 | 京东方科技集团股份有限公司 | OLED (Organic Light Emitting Diode) display mother board, packaging system and packaging method thereof |
| CN108389981A (en) * | 2018-04-11 | 2018-08-10 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
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