CN111129081A

CN111129081A - Method for manufacturing flexible organic EL display

Info

Publication number: CN111129081A
Application number: CN201911021955.4A
Authority: CN
Inventors: 池田刚史; 高松生芳; 山本幸司; 崔东光
Original assignee: Mitsuboshi Diamond Industrial Co Ltd
Current assignee: Mitsuboshi Diamond Industrial Co Ltd
Priority date: 2018-10-30
Filing date: 2019-10-24
Publication date: 2020-05-08
Also published as: TW202046824A; KR102212175B1; KR20200049473A; JP2020071968A

Abstract

The invention provides a method for manufacturing a flexible organic EL display, wherein the quality of a resin layer peeled from a glass layer is not easy to reduce. A method for manufacturing a flexible organic EL display includes a cutting step in which a unit laminated substrate (70) having a predetermined size is cut out from a laminated substrate (60) in which a glass layer (61) and a resin layer (62) are laminated. In the cutting step, the glass layer (61) of the unit laminated substrate (70) is cut so that the cut surface (66) of the glass layer (61) is positioned outside the cut surface (67) of the resin layer (62).

Description

Method for manufacturing flexible organic EL display

Technical Field

The present invention relates to a method for manufacturing a flexible organic EL display.

Background

An organic el (electro luminescence) display includes a light emitting device in which a light emitting layer, an electrode, and a substrate are stacked. In the flexible organic EL display, a flexible substrate is used as a substrate. In a process of manufacturing a flexible organic EL display, a resin layer is formed on a glass layer, and a light-emitting layer and the like are formed on the resin layer (for example, patent document 1).

Prior art documents

Patent document

Patent document 1: re-publication of patent WO2011/030716

In the manufacturing process of the flexible organic EL display, the resin layer and the glass layer on which the light-emitting layer and the like are formed are peeled off. The method of peeling is, for example, laser peeling. The state of irradiation with laser light to the irradiation subject may affect the quality of the peeled resin layer.

Disclosure of Invention

Problems to be solved by the invention

The invention aims to provide a method for manufacturing a flexible organic EL display, wherein the quality of a resin layer peeled from a glass layer is not easy to reduce.

Means for solving the problems

The method for manufacturing a flexible organic EL display according to the present invention includes a cutting step of cutting a unit laminated substrate having a predetermined size from a laminated substrate in which a glass layer and a resin layer are laminated, and the cutting step of cutting the glass layer so that a cut surface of the glass layer of the unit laminated substrate is positioned outside a cut surface of the resin layer.

In this manufacturing method, the laser beam is irradiated to the resin layer without being affected by the cut surface of the glass layer. Since the resin layer is appropriately irradiated with laser light, the quality of the resin layer peeled from the glass layer is not easily degraded.

In one example of the method of manufacturing the flexible organic EL display, the glass layer includes a first plane on which the resin layer is formed and a second plane that is a pair with the first plane, and the cutting step cuts the glass layer so as to form a cut surface in which a width of the glass layer becomes narrower from the second plane toward the first plane.

Even when it is desired to form a cut surface parallel to the vertical surface and cut the glass layer, the cut surface may be inclined with respect to the vertical surface due to manufacturing errors. It is difficult to accurately manage the formation of such cut surfaces. In the above-described manufacturing method, it is desirable to form an inclined cut surface to cut the glass layer, and therefore the influence of manufacturing errors is taken into consideration. It is also difficult to form a cut surface inclined in a direction different from the desired direction.

In one example of the method of manufacturing the flexible organic EL display, in the cutting step, the glass layer is scribed so as to form a scribe line in which a width of the glass layer becomes narrower from the second plane toward the first plane, and the scribed glass layer is broken.

In this manufacturing method, the cut surface of the glass layer located outside the cut surface of the resin layer can be efficiently formed.

In one example of the method of manufacturing a flexible organic EL display, in the cutting step, the glass layer is scribed using a scribing wheel having a cutting edge portion asymmetrical in shape with respect to a rotational center plane.

In this manufacturing method, the shape of the cut surface of the glass layer inclined with respect to the vertical plane is defined by the shape of the cutting edge portion, and the glass layer can be easily cut.

In one example of the method for manufacturing a flexible organic EL display, the method further includes a peeling step of peeling the glass layer and the resin layer of the unit laminated substrate by laser peeling.

According to this production method, the resin layer and the glass layer can be efficiently peeled.

In one example of the method of manufacturing a flexible organic EL display, in the cutting step, a unit laminated substrate is cut out from a multilayer laminated substrate including a plurality of the laminated substrates including a first laminated substrate in which a first glass layer and a first resin layer are laminated and a second laminated substrate in which a second glass layer and a second resin layer are laminated, the multilayer laminated substrate being laminated such that the first resin layer and the second resin layer face each other.

In this manufacturing method, even when the laminated substrate that is a raw material for cutting out the unit laminated substrate is a multilayer laminated substrate, the laser beam is irradiated to the resin layer without being affected by the cut surface of the glass layer, and the quality of the resin layer peeled from the glass layer is not easily degraded.

Effects of the invention

According to the present invention, the quality of the resin layer peeled from the glass layer is not easily degraded.

Drawings

Fig. 1 is a cross-sectional view of a multilayer laminated substrate relating to the manufacturing method of the first embodiment.

Fig. 2 is a plan view of the multilayer laminated substrate of fig. 1.

Fig. 3 is a schematic diagram showing the structure of the laser processing apparatus.

FIG. 4 is a schematic view showing the structure of the scribing apparatus.

FIG. 5 is a cross-sectional view of a scoring wheel.

Fig. 6 is a flowchart showing the manufacturing method of the first embodiment.

Fig. 7 is a diagram showing a relationship between a processing procedure and a processing type in the subsequent processing step.

Fig. 8 is a schematic diagram showing the structure of the laser processing apparatus.

Fig. 9 is a cross-sectional view of an example of a unit laminated substrate.

Fig. 10 is a diagram showing an example of the peeling step.

Fig. 11 is a sectional view of a multilayer laminated substrate relating to the manufacturing method of the second embodiment.

Fig. 12 is a flowchart showing a manufacturing method of the second embodiment.

Fig. 13 is a diagram showing a relationship between a processing procedure and a processing type in the cutting step.

Fig. 14 is a diagram showing an example of the peeling step.

Fig. 15 is a cross-sectional view of a multilayer laminated substrate according to a manufacturing method of a modification.

Description of reference numerals:

10: multilayer laminated substrate

11: first laminated substrate

11A: first glass layer

11B: a first resin layer

12: second laminated substrate

12A: second glass layer

12B: second resin layer

14A: first plane

14B: second plane

15A: first plane

15B: second plane

20: unit laminated substrate

23A: cut surface

23B: cut surface

24A: cut surface

24B: cut surface

50. 50A, 50B: scribing wheel

52: cutting edge part

60: laminated substrate

61: glass layer

62: resin layer

63A: first plane

63B: second plane

66: cut surface

67: cut surface

70: unit laminated substrate

RC: a central plane of rotation.

Detailed Description

(first embodiment)

A method of manufacturing a flexible organic EL display is explained with reference to the drawings. Flexible organic EL displays are used for stationary devices, portable devices, and the like. Examples of stationary devices are personal computers and television receivers. Examples of portable devices are a portable information terminal, a wearable computer, and a notebook personal computer. Examples of the portable information terminal are a smart phone, a tablet computer, and a portable game machine. Examples of wearable computers are head mounted displays and smart watches.

The flexible organic EL display includes: a light-emitting device in which a light-emitting layer, an electrode, and a substrate are stacked; a first protective film covering the light emitting device from one side; and a second protective film covering the light emitting device from the other side. For the first protective film and the second protective film, pet (polyethylene terephthalate), for example, is used, respectively. One of the first protective film and the second protective film may be omitted. In the manufacturing process of the light emitting device, a plurality of light emitting devices are manufactured from one multilayer laminated substrate 10 shown in fig. 1.

The multilayer laminated substrate 10 is manufactured at an intermediate stage of the manufacture of the flexible organic EL display. The multilayer laminated substrate 10 includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated. The multilayer laminated substrate 10 is configured such that the first resin layer 11B and the second resin layer 12B are laminated so as to face each other. The multilayer laminated substrate 10 also has a conductive layer 13. The conductive layer 13 is formed on, for example, the first resin layer 11B of the first laminate substrate 11. The conductive layer 13 is sandwiched by the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed with electronic device members such as an oled (organic Light diode) and a tft (thin film transistor). The first resin layer 11B, the conductive layer 13, and the second resin layer 12B constitute a light emitting device.

The first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12 are formed of the same material and have the same size. The composition of the first glass layer 11A and the second glass layer 12A is not particularly limited, and for example, glass containing an alkali metal oxide, or glass having various compositions such as alkali-free glass can be used. An example of the alkali metal oxide-containing glass is soda lime glass. In the present embodiment, alkali-free glass is used for the first glass layer 11A and the second glass layer 12A. The thicknesses of the first glass layer 11A and the second glass layer 12A are not particularly limited, but are preferably about 0.5mm, for example. The first glass layer 11A has a first plane 14A on which the first resin layer 11B is formed and a second plane 14B paired with the first plane 14A. The second glass layer 12A has a first plane 15A on which the second resin layer 12B is formed and a second plane 15B paired with the first plane 15A.

The first resin layer 11B of the first laminate substrate 11 and the second resin layer 12B of the second laminate substrate 12 are formed of the same material and have the same size. The composition of the first resin layer 11B and the second resin layer 12B is not particularly limited, and for example, Polyimide (PI) may be used. The thicknesses of the first resin layer 11B and the second resin layer 12B are not particularly limited, but are preferably in the range of 10 μm to 30 μm, for example.

Fig. 2 is a plan view of the multilayer laminated substrate 10.

The multilayer laminated substrate 10 is cut into a lattice shape along the portions to be cut 16 and 17 indicated by broken lines in fig. 2, thereby forming a unit laminated substrate 20. The dimension of the unit laminated substrate 20 in a plan view corresponds to a predetermined dimension of the light emitting device in a plan view.

At least one of a laser processing device and a scribing device is used for cutting the multilayer laminated substrate 10. Fig. 3 shows an example of the structure of the laser processing apparatus, and fig. 4 shows an example of the structure of the scribing processing apparatus. In fig. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in fig. 3 and 4. When the first laminated substrate 11 and the second laminated substrate 12 are cut, a dicing device (not shown) may be used.

As shown in fig. 3, the laser processing apparatus 30 includes a laser apparatus 31 for cutting the multilayer laminated substrate 10, a mechanical drive system 32 for moving the multilayer laminated substrate 10 relative to the laser apparatus 31, and a first control unit 33 for controlling the laser apparatus 31 and the mechanical drive system 32.

The laser device 31 can process at least one of the first resin layer 11B and the second resin layer 12B, and the first glass layer 11A and the second glass layer 12A in the multilayer laminated substrate 10. The laser device 31 has a laser oscillator 34 for irradiating the multilayer laminated substrate 10 with laser light, and a transmission optical system 35 for transmitting the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (ultra Violet) laser or CO₂And (4) laser. In the laserWhen the optical processing device 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing apparatus 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is CO₂Laser or UV laser. The transmission optical system 35 includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. The transmission optical system 35 has, for example, an X-axis direction moving mechanism for moving the laser irradiation head incorporating the laser oscillator 34 in the X-axis direction. The laser beam emitted from the laser oscillator 34 is emitted to the multilayer laminated substrate 10 via the transmission optical system 35.

The mechanical drive system 32 is disposed to face the laser device 31 in the Z-axis direction. The mechanical drive system 32 is composed of a base 36, a machining table 37, and a moving device 38. The multilayer laminated substrate 10 is placed on the processing table 37. The moving device 38 moves the machining table 37 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the base 36. The moving device 38 is a well-known mechanism having a guide rail, a moving table, a motor, and the like.

The first control unit 33 includes an arithmetic processing device that executes a preset control program. The arithmetic Processing device includes, for example, a CPU (Central Processing Unit) or an MPU (micro Processing Unit). The first control unit 33 may have one or more microcomputers. The first control unit 33 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit includes, for example, a nonvolatile memory and a volatile memory. The first control unit 33 may be provided in the laser device 31, in the mechanical drive system 32, or may be provided separately from the laser device 31 and the mechanical drive system 32. In the case where the first control unit 33 is provided separately from the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be arbitrarily set.

As shown in fig. 4, the scribing processing device 40 forms a scribing line along the X-axis direction and the Y-axis direction on the multilayer laminated substrate 10 by relatively moving the scribing wheel 50 and the multilayer laminated substrate 10 in the X-axis direction and the Y-axis direction. The scribing processing device 40 includes a processing device 41 for processing the multilayer laminated substrate 10, a conveying device 42 for conveying the multilayer laminated substrate 10, and a second control unit 43 for controlling the processing device 41 and the conveying device 42.

The conveying device 42 is composed of a pair of guide rails 44, a table 45, a linear drive device 46, a rotating device 47, and the like. The pair of guide rails 44 extend in the Y-axis direction. In the scribing apparatus 40 of fig. 4, a pair of guide rails 44 are disposed on a base (not shown) of the scribing apparatus 40, a table 45 is reciprocated along the pair of guide rails 44 by a linear driving device 46, and the table 45 is rotated around a central axis C by a rotating device 47. The multilayer laminated substrate 10 is placed on the stage 45. One example of the linear drive device 46 includes a feed screw device. The rotating device 47 has a motor as a driving source.

The processing device 41 is composed of a transverse driving device 48, a longitudinal driving device 49, a scribing wheel 50, and the like. The scoring wheel 50 is mounted to a holder unit for holding the scoring wheel 50. The holder unit is attached to a scribing head for holding the holder unit. The scribing head is moved in the X-axis direction by a transverse driving device 48 and in the Z-axis direction by a longitudinal driving device 49. The scribing wheel 50 moves in the X-axis direction, thereby forming a scribing line along the X-axis direction on the multilayer laminated substrate 10.

The scribing wheel 50 is rotatably supported by a pin (not shown) attached to the holder unit. Examples of the material constituting the scribing wheel 50 include sintered Diamond (Poly Crystalline Diamond), a superhard metal, single crystal Diamond, and polycrystalline Diamond. For example, any one of the scribing wheel 50A having a shape shown in fig. 5 (a) and the scribing wheel 50B having a shape shown in fig. 5 (B) may be used as the scribing wheel 50.

The scribing wheel 50A shown in fig. 5 (a) is composed of a disk-shaped body 51 and a V-shaped cross-sectional cutting edge 52. The V-shaped cross section is a shape in which the tip of the scribing wheel 50A tapers toward the outer peripheral edge of the scribing wheel 50A in the cross section of the scribing wheel 50A cut along the plane in the thickness direction of the scribing wheel 50A (hereinafter, referred to as "thickness direction DT").

An insertion hole 53 penetrating the body 51 in the thickness direction DT is formed in the center of the body 51. A pin is inserted into the insertion hole 53.

The nose portion 52 has a first inclined surface 52A and a second inclined surface 52B as two inclined surfaces forming a cross-sectional V shape. The first inclined surface 52A and the second inclined surface 52B are symmetrical with respect to the center of the scribing wheel 50A in the thickness direction DT and a rotation center plane RC orthogonal to the thickness direction DT.

In the scribing wheel 50B shown in fig. 5 (B), the shape of the blade tip portion 52 is different from that of the scribing wheel 50A. First bevel 52A and second bevel 52B in nose portion 52 of scoring wheel 50B are asymmetrical with respect to center plane of rotation RC. More specifically, in a cross section of the scribing wheel 50B along the thickness direction, a first angle θ 1 formed by a line segment L1 parallel to the axial direction of the scribing wheel 50B and the first inclined surface 52A is larger than a second angle θ 2 formed by a line segment L1 and the second inclined surface 52B. Note that, as long as the position of the tip end of the cutting edge portion 52 in the direction along the line segment L1 is offset with respect to the rotation center plane RC, the first angle θ 1 may be equal to the second angle θ 2.

The second control unit 43 includes an arithmetic processing device that executes a preset control program. The arithmetic processing device includes, for example, a CPU or an MPU. The second control unit 43 may have one or more microcomputers. The second control unit 43 further has a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit includes, for example, a nonvolatile memory and a volatile memory. The second controller 43 may be provided in the processing apparatus 41, the conveying apparatus 42, or a separate unit from the processing apparatus 41 and the conveying apparatus 42. When the second controller 43 is provided separately from the processing device 41 and the conveying device 42, the arrangement position of the second controller 43 can be arbitrarily set.

[ method for manufacturing Flexible organic EL display ]

Next, a method for manufacturing the flexible organic EL display will be described in detail. Fig. 6 shows an example of a process of a method for manufacturing a flexible organic EL display.

In the method of manufacturing a flexible organic EL display, after a multilayer laminated substrate 10 is manufactured by laminating a first laminated substrate 11 and a second laminated substrate 12, the multilayer laminated substrate 10 is cut into a predetermined size, thereby manufacturing a unit laminated substrate 20. Next, the light emitting device is manufactured by removing the first glass layer 11A and the second glass layer 12A from the unit laminate substrate 20. Then, the first protective film and the second protective film are mounted on the first resin layer 11B and the second resin layer 12B. Thereby, a flexible organic EL display is manufactured.

As shown in fig. 6, the method of manufacturing the flexible organic EL display is divided into a front-stage step, which is a step before the step of laminating the first laminated substrate 11 and the second laminated substrate 12, and a rear-stage step, which is a step after the step of laminating the first laminated substrate 11 and the second laminated substrate 12. The former step includes a former stacking step. The first-stage lamination step is a step of manufacturing the first laminated substrate 11 and the second laminated substrate 12. The back-end process includes a back-end stacking process, a back-end processing process, and a peeling process. The subsequent lamination step is a step of laminating the first laminated substrate 11 and the second laminated substrate 12 to manufacture the multilayer laminated substrate 10. The subsequent processing step is a step of manufacturing the unit laminated substrate 20 by cutting the multilayer laminated substrate 10 along the

portions

16 and 17 to be cut of the multilayer laminated substrate 10, that is, by cutting the multilayer laminated substrate 10 into a predetermined size. The peeling step is a step of peeling the first glass layer 11A and the first resin layer 11B and peeling the second glass layer 12A and the second resin layer 12B by Laser Lift Off (LLO). The details of each step will be described below.

In the preceding lamination step, the first laminated substrate 11 is manufactured by forming the first resin layer 11B on the entire first plane 14A of the first glass layer 11A, and the second laminated substrate 12 is manufactured by forming the second resin layer 12B on the entire first plane 15A of the second glass layer 12A. A method of forming the first resin layer 11B on the first plane 14A of the first glass layer 11A and a method of forming the second resin layer 12B on the first plane 15A of the second glass layer 12A may be selected from a method of coating a resin layer on a glass layer and a method of laminating a resin layer on a glass layer via an adhesive layer. As a method for fixing the resin layer to the glass layer, heat curing treatment, or heat and pressure treatment by a press method can be selected.

In the subsequent lamination step, the first laminated substrate 11 not cut into a predetermined size and the second laminated substrate 12 not cut into a predetermined size are laminated. In one example, the first laminated substrate 11 and the second laminated substrate 12 are bonded to each other via an adhesive layer SD, for example. Thereby, the multilayer laminated substrate 10 is manufactured.

The post-processing step includes a post-cutting step of cutting the first laminated substrate 11 and the second laminated substrate 12. In the subsequent cutting step of the subsequent processing step, the order of cutting the multilayer laminated substrate 10 and the type of processing may be arbitrarily selected, for example, as shown in fig. 7 (a) and (b). Fig. 7 (a) shows an example of the relationship between the processing order and the processing type of each layer when the first laminated substrate 11 and the second laminated substrate 12 are cut in this order. Fig. 7 (b) shows an example of the relationship between the processing order and the processing type of each layer when the second laminated substrate 12 and the first laminated substrate 11 are cut in this order. As shown in fig. 7 (a) and (B), when the first resin layer 11B is cut or scribed before the first glass layer 11A and when the second resin layer 12B is cut or scribed before the second glass layer 12A, the scribing apparatus 40 cannot be used for processing the first resin layer 11B and the second resin layer 12B. When the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are cut with a laser, for example, the following first method and second method can be selected. In the first method, after the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are scribed with a laser, the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are cut. In the second method, the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are cut with laser light. In the subsequent cutting step of the subsequent processing step of the first process example, any of the cut layer and the layer cut after scribing can be arbitrarily selected for the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B.

When the first resin layer 11B or the second resin layer 12B is cut with a laser beam, the first resin layer 11B or the second resin layer 12B is preferably irradiated with a laser beam a plurality of times while setting the output of the laser beam when the first resin layer 11B or the second resin layer 12B is irradiated with a laser beam to be smaller than a predetermined output for suppressing generation of a gas having a predetermined temperature or higher. Since the gas generated during the processing of the first resin layer 11B or the second resin layer 12B by the laser is cooled with the passage of time, an increase in the volume of the gas inside the multilayer laminated substrate 10 can be suppressed.

When the first glass layer 11A is scribed with a laser or a scribing wheel 50 and then the second resin layer 12B is cut with a laser or the second resin layer 12B is scribed, it is preferable that the laser is irradiated from the second glass layer 12A side. In the case of cutting the second resin layer 12B with a laser, after cutting the second resin layer 12B, the first resin layer 11B may be cut with a laser beam in the same irradiation direction or the first resin layer 11B may be scribed. When the second glass layer 12A is scribed with a laser or a scribing wheel 50 and then the first resin layer 11B is cut with a laser or the first resin layer 11B is scribed, it is preferable that the laser is irradiated from the first glass layer 11A side. In the case of cutting the first resin layer 11B with a laser, after cutting the first resin layer 11B, the second resin layer 12B may be cut with a laser beam in the same irradiation direction or the second resin layer 12B may be scribed.

When the glass layer and the resin layer are cut or scribed with a laser, a laser processing apparatus 30A shown in fig. 8 is used instead of the laser processing apparatus 30 shown in fig. 3. The laser processing apparatus 30A is different in structure from the laser processing apparatus 30. Hereinafter, a different configuration of the laser processing apparatus 30A will be described.

The laser device 31A of the laser processing device 30A includes a first laser oscillator 34A and a second laser oscillator 34B. The first laser oscillator 34A is a UV laser, and the second laser oscillator 34B is a CO laser₂And (4) laser. The laser light irradiated from the first laser oscillator 34A and the laser light irradiated from the second laser oscillator 34B are irradiated to the multilayer laminated substrate 10 via the transmission optical system 35. Need to explainThe transmission optical system 35 may be provided with a transmission optical system corresponding to the first laser oscillator 34A and a transmission optical system corresponding to the second laser oscillator 34B.

The first control unit 33 selects the first laser oscillator 34A and the second laser oscillator 34B according to the type of processing target (glass layer or resin layer) for the multilayer laminated substrate 10. For example, the first control unit 33 determines the processing sequence of the glass layer and the resin layer, which are types of processing objects, by a control program stored in advance, and selects the first laser oscillator 34A and the second laser oscillator 34B according to the determined processing sequence.

Fig. 9 shows an example of the unit laminated substrate 20 manufactured in the subsequent cutting step. The unit laminated substrate 20 shown in fig. 9 is manufactured by scribing the first glass layer 11A and the second glass layer 12A with a scribing wheel 50B shown in fig. 5 (B) and then breaking them. In the cross section of the unit laminated substrate 20 shown in fig. 9, a direction perpendicular to the thickness direction T of the unit laminated substrate 20 is defined as a width direction W. In the cross section of the unit laminated substrate 20, the direction toward the center in the width direction W of the unit laminated substrate 20 is defined as the inner side, and the direction toward the end in the width direction W is defined as the outer side.

In the subsequent cutting step, the first glass layer 11A is cut so that the cut surface 23A of the first glass layer 11A of the unit laminated substrate 20 is positioned outside the cut surface 23B of the first resin layer 11B. The second glass layer 12A is cut so that the cut surface 24A of the second glass layer 12A of the unit laminated substrate 20 is positioned outside the cut surface 24B of the second resin layer 12B. More specifically, the first glass layer 11A is cut so as to form a cut surface 23A in which the width WD1 of the first glass layer 11A becomes narrower from the second plane 14B toward the first plane 14A of the first glass layer 11A. The second glass layer 12A is cut so as to form a cut surface 24A in which the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B toward the first plane 15A of the second glass layer 12A. Since the first glass layer 11A and the second glass layer 12A are scribed by the scribing wheel 50B, the scribing processing device 40 scribes the first glass layer 11A in such a manner as to form a scribing line (crack) in which the width WD1 of the first glass layer 11A becomes narrower from the second plane 14B toward the first plane 14A of the first glass layer 11A in the sectional view shown in fig. 9. Next, the scribed first glass layer 11A is broken. The scribing apparatus 40 scribes the second glass layer 12A so as to form a scribe line (crack) in which the width WD2 of the second glass layer 12A is narrowed from the second plane 15B toward the first plane 15A of the second glass layer 12A in the cross section shown in fig. 9. Next, the second glass layer 12A after scribing is broken. Instead of the scribing wheel 50B, the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A shown in fig. 9 may be formed by the laser of the laser processing apparatus 30.

In the peeling step, a laser peeling apparatus (not shown) is used. In the present embodiment, a UV laser is used as the laser of the laser lift-off device. As shown in fig. 10 (a), the first resin layer 11B and the first glass layer 11A are peeled by irradiating the first resin layer 11B with laser light from the first glass layer 11A side. When the first resin layer 11B and the first glass layer 11A are peeled off, laser light is irradiated so as to be orthogonal to the second plane 14B of the first glass layer 11A. Next, as shown in fig. 10 (B), the second resin layer 12B and the second glass layer 12A are peeled by irradiating laser light from the second glass layer 12A side to the second resin layer 12B. When the second resin layer 12B and the second glass layer 12A are peeled off, the laser beam is irradiated so as to be orthogonal to the second plane 15B of the second glass layer 12A. The order of peeling the first glass layer 11A and the second glass layer 12A can be changed arbitrarily. For example, the first resin layer 11B and the first glass layer 11A may be peeled after the second resin layer 12B and the second glass layer 12A are peeled.

After the first glass layer 11A and the second glass layer 12A (see fig. 10 c) are removed from the multilayer laminated substrate 10, the first protective film is attached so as to cover the first resin layer 11B, and the second protective film is attached so as to cover the second resin layer 12B, thereby manufacturing a flexible organic EL display.

In the unit laminated substrate 20 shown in fig. 9, the second flat surface 14B of the first glass layer 11A is formed up to the end edge of the first resin layer 11B in the width direction W, and the second flat surface 15B of the second glass layer 12A is formed up to the end edge of the second resin layer 12B in the width direction W. That is, in the thickness direction T, the end edge of the first resin layer 11B in the width direction W does not overlap the cut surface 23A of the first glass layer 11A, and the end edge of the second resin layer 12B in the width direction W does not overlap the cut surface 24A of the second glass layer 12A. Therefore, when the edge in the width direction W of the first resin layer 11B and the edge in the width direction W of the second resin layer 12B are irradiated with the laser beam of the laser peeling device, the laser beam does not pass through the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A.

The effects of the present embodiment will be described.

(1-1) the cut surface 23A of the first glass layer 11A of the unit laminated substrate 20 is located on the outer side in the width direction W than the cut surface 23B of the first resin layer 11B, and the cut surface 24A of the second glass layer 12A is located on the outer side in the width direction W than the cut surface 24B of the second resin layer 12B. According to this manufacturing method, the laser light is irradiated to the first resin layer 11B and the second resin layer 12B without being affected by the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A. Since the first resin layer 11B and the second resin layer 12B are each appropriately irradiated with laser light, the quality of the first resin layer 11B peeled from the first glass layer 11A and the quality of the second resin layer 12B peeled from the second glass layer 12A are not easily degraded.

(1-2) in the subsequent cutting step, the first glass layer 11A is cut so as to form a cut surface 23A in which the width WD1 of the first glass layer 11A becomes narrower from the second plane 14B toward the first plane 14A. The second glass layer 12A is cut so as to form a cut surface 24A in which the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B toward the first plane 15A. In this manufacturing method, since the first glass layer 11A and the second glass layer 12A are cut so that the inclined cut surfaces 23A and 24A are desired to be formed, it is difficult to form a cut surface inclined in a direction different from a desired direction even when the influence of manufacturing errors is taken into consideration.

(1-3) in the subsequent cutting step, the first glass layer 11A is scribed so as to form a scribe line (crack) in which the width WD1 of the first glass layer 11A becomes narrower from the second plane 14B toward the first plane 14A, and the scribed first glass layer 11A is broken. The second glass layer 12A is scribed so as to form a scribe line (crack) in which the width WD2 of the second glass layer 12A narrows from the second plane 15B toward the first plane 15A, and the scribed second glass layer 12A is broken. In this manufacturing method, the cut surface 23A of the first glass layer 11A located outside the cut surface 23B of the first resin layer 11B can be efficiently formed, and the cut surface 24A of the second glass layer 12A located outside the cut surface 24B of the second resin layer 12B can be efficiently formed.

(1-4) in the post-cutting step, the first glass layer 11A and the second glass layer 12A are scribed using a scribing wheel 50B having a tip portion 52 having an asymmetrical shape with respect to the rotation center plane RC shown in fig. 5 (B). In this manufacturing method, the shape of the cut surface 23A of the first glass layer 11A inclined with respect to the second plane 14B and the shape of the cut surface 24A of the second glass layer 12A inclined with respect to the second plane 15B are defined by the shape of the cutting edge portion 52, and the first glass layer 11A and the second glass layer 12A can be easily cut.

(1-5) further comprising a peeling step of peeling the first glass layer 11A and the first resin layer 11B by laser peeling and peeling the second glass layer 12A and the second resin layer 12B. In this manufacturing method, the first glass layer 11A and the first resin layer 11B can be efficiently peeled, and the second glass layer 12A and the second resin layer 12B can be efficiently peeled.

(1-6) in the method for manufacturing a flexible organic EL display, the multilayer laminated substrate 10 is cut into a predetermined size in a subsequent step that is a step after the step of laminating the first laminated substrate 11 and the second laminated substrate 12. In this manufacturing method, since the multilayer laminated substrate 10 in which the first laminated substrate 11 and the second laminated substrate 12 are laminated is cut in a state where the substrates are laminated, the laminating work is simplified. Therefore, the manufacturing efficiency of the flexible organic EL display is not easily lowered.

(1-7) in the post-cutting step of the post-processing step, the first glass layer 11A and the second glass layer 12A are first cut, and then the first resin layer 11B and the second resin layer 12B are cut. In this manufacturing method, since the first glass layer 11A and the second glass layer 12A are cut first, in the step of cutting the first resin layer 11B and the second resin layer 12B, a portion of the first resin layer 11B which is not covered with the first glass layer 11A and a portion of the second resin layer 12B which is not covered with the second glass layer 12A can be cut, respectively. For example, when the first resin layer 11B and the second resin layer 12B are cut with a laser beam, gas generated as the first resin layer 11B and the second resin layer 12B are irradiated with the laser beam is discharged from the cut portion of the first glass layer 11A and the cut portion of the second glass layer 12A. Therefore, the possibility that the gas affects the quality of the first resin layer 11B and the second resin layer 12B is low.

(1-8) in the post-cutting step, the first resin layer 11B and the second resin layer 12B are cut with a laser. Therefore, for example, compared to cutting using the scribing wheel 50, the amount of heat generated when cutting the first resin layer 11B and the second resin layer 12B is small, and the quality of the first resin layer 11B and the second resin layer 12B is not easily degraded.

(1-9) in the post-cutting step, the laser output per irradiation of the laser light to the first resin layer 11B and the second resin layer 12B is set to be smaller than a predetermined output for suppressing the generation of a gas having a predetermined temperature or higher. According to this manufacturing method, high-temperature gas is less likely to be generated when the first resin layer 11B and the second resin layer 12B are irradiated with laser light, and the possibility of quality degradation of the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B due to the influence of the gas is reduced.

(second embodiment)

A method for manufacturing a flexible organic EL display according to a second embodiment will be described with reference to fig. 11 to 14. In the present embodiment, the difference from the first embodiment is that a laminated substrate 60 is manufactured instead of the multilayer laminated substrate 10.

As shown in fig. 11, the laminated substrate 60 is configured by laminating a glass layer 61 and a resin layer 62. The glass layer 61 has a first plane 63A on which the resin layer 62 is formed, and a second plane 63B paired with the first plane 63A. The laminated substrate 60 also has a conductive layer 68. The conductive layer 68 is the same as the conductive layer 13 of the first embodiment. The resin layer 62 and the conductive layer 68 constitute a light emitting device. The composition of the glass layer 61 is, for example, the same as that of the first glass layer 11A or the second glass layer 12A of the first embodiment. The composition of the resin layer 62 is, for example, the same as that of the first resin layer 11B or the second resin layer 12B of the first embodiment.

As shown in fig. 12, the method for manufacturing a flexible organic EL display includes a lamination step, a cutting step, and a peeling step. The lamination step is a step of laminating a resin layer 62 on a glass layer 61 to manufacture a laminated substrate 60. The cutting step is a step of cutting out a unit laminated substrate 70 (see fig. 14 (a)) having a predetermined size from the laminated substrate 60. The peeling step is a step of peeling the resin layer 62 and the glass layer 61 of the unit laminated substrate 70 by laser peeling. The details of each step will be described below.

In the lamination step, the laminated substrate 60 is manufactured by forming the resin layer 62 on the entire first plane 63A of the glass layer 61. The method of forming the resin layer 62 on the first plane 63A of the glass layer 61 may be a method of applying the resin layer 62 to the glass layer 61 or a method of laminating the resin layer 62 on the glass layer 61 via an adhesive layer. As a method for fixing the resin layer 62 to the glass layer 61, heat curing treatment, or heat and pressure treatment by a press method can be selected.

In the cutting step, the glass layer 61 and the resin layer 62 are cut along the portions 64A to cut of the glass layer 61 and the portions 64B to cut of the resin layer 62 shown in fig. 11. The

portions

64A and 64B to be cut are cut portions for cutting the laminated substrate 60 into a predetermined size. As shown in fig. 13, in the cutting step, the order of cutting the laminated substrate 60 and the type of processing can be arbitrarily selected. The laminated substrate 60 may be cut in the order of the resin layer 62 and the glass layer 61, or may be cut in the order of the glass layer 61 and the resin layer 62. For cutting the glass layer 61 and the resin layer 62, either the laser processing apparatus 30 or the scribing apparatus 40 may be used. The glass layer 61 and the resin layer 62 may be cut by the laser processing device 30 or the scribing device 40 after scribing, or may be cut by the laser processing device 30.

In the cutting step, when the portions 64A to cut the glass layer 61 and the portions 64B to cut the resin layer 62 are scribed or cut with a laser, the laser processing apparatus 30A shown in fig. 8 is used instead of the laser processing apparatus 30 shown in fig. 3.

Fig. 14 (a) shows a unit laminated substrate 70 which is a laminated substrate 60 having a predetermined size when the glass layer 61 is scribed and cut by the scribing wheel 50B shown in fig. 5 (B) in the cutting step. In the cross section of the unit laminated substrate 70 shown in fig. 14 (a), a direction perpendicular to the thickness direction T of the unit laminated substrate 70 is defined as a width direction W. In the cross section of the unit laminated substrate 70, the direction toward the center in the width direction W of the unit laminated substrate 70 is defined as the inner side, and the direction toward the end in the width direction W is defined as the outer side.

In the cutting step, the portion 64A to be cut of the glass layer 61 is cut so that the cut surface 66 of the glass layer 61 of the unit laminated substrate 70 is positioned outside the cut surface 67 of the resin layer 62 (see fig. 11). More specifically, in the cutting step, the portion 64A to be cut of the glass layer 61 is cut so as to form a cut surface 66 in which the width WD of the glass layer 61 is narrowed from the second flat surface 63B toward the first flat surface 63A of the glass layer 61. Since the glass layer 61 is scribed by the scribing wheel 50B, in the cutting step, the scribing processing device 40 scribes the portion 64A to be cut of the glass layer 61 so as to form a scribe line (crack) in which the width WD of the glass layer 61 is narrowed from the second flat surface 63B toward the first flat surface 63A of the glass layer 61 in the cross-section of fig. 14 (a). Next, the planned cutting portion 64A of the glass layer 61 after scribing is cut. Instead of the scribing wheel 50B, the cut surface 66 of the glass layer 61 shown in fig. 14 (a) may be formed by laser light from the laser processing apparatus 30.

In the peeling step, the resin layer 62 and the glass layer 61 are peeled off by irradiating the resin layer 62 with a laser beam from the glass layer 61 as shown in fig. 14 (a) using a laser peeling apparatus (not shown) similar to that of the first embodiment.

After removing the glass layer 61 (see fig. 14 (b)) from the multilayer laminated substrate 10, the first protective film is attached so as to cover one side in the thickness direction T of the resin layer 62, and the second protective film is attached so as to cover the other side in the thickness direction T of the resin layer 62, thereby manufacturing a flexible organic EL display.

In the unit laminated substrate 70 shown in fig. 14 (a), the second flat surface 63B of the glass layer 61 is formed up to the end edge position in the width direction W of the resin layer 62. That is, the edge of the resin layer 62 in the width direction W does not overlap the cut surface 66 of the glass layer 61 in the thickness direction T. Therefore, when the laser beam of the laser peeling device is irradiated to the edge of the resin layer 62 in the width direction W, the laser beam does not pass through the cut surface 66 of the glass layer 61.

The effects of the present embodiment will be described.

(2-1) the cut surface 66 of the glass layer 61 of the unit laminated substrate 70 is located outward in the width direction W from the cut surface 67 of the resin layer 62. According to this manufacturing method, the laser beam of the laser peeling device is irradiated to the resin layer 62 without being affected by the cut surface 66 of the glass layer 61 and the cut surface 67 of the glass layer 61. Since the resin layer 62 is appropriately irradiated with the laser beam of the laser peeling device, the quality of the resin layer 62 peeled from the glass layer 61 is not easily degraded.

(2-2) in the cutting step, the glass layer 61 is cut so as to form a cut surface 66 in which the width WD of the glass layer 61 is narrowed from the second plane 63B toward the first plane 63A. In this manufacturing method, since the glass layer 61 is cut so as to desirably form the inclined cut surface 66, it is difficult to form a cut surface inclined in a direction different from a desired direction, even in consideration of the influence of manufacturing errors.

(2-3) in the cutting step, the glass layer 61 is scribed so as to form a scribe line (crack) in which the width WD of the glass layer 61 becomes narrower from the second plane 63B toward the first plane 63A, and the scribed glass layer 61 is cut. In this manufacturing method, the cut surface 66 of the glass layer 61 located outside the cut surface 67 of the resin layer 62 can be efficiently formed.

(2-4) the glass layer 61 is scribed using a scribing wheel 50B having a tip portion 52 with an asymmetrical shape with respect to the rotation center plane RC shown in fig. 5 (B). In this manufacturing method, the shape of the cut surface 66 of the glass layer 61 inclined with respect to the second plane 63B is defined by the shape of the cutting edge portion 52, and the glass layer 61 can be easily cut.

(2-5) the method of manufacturing a flexible organic EL display further includes a peeling step of peeling the glass layer 61 and the resin layer 62 by laser peeling. In this manufacturing method, the glass layer 61 and the resin layer 62 can be efficiently peeled.

(modification example)

In the above embodiments, the modes that can be adopted by the method of manufacturing a flexible organic EL display according to the present invention are exemplified, and the modes are not intended to be limited. The method of manufacturing the flexible organic EL display according to the present invention can be different from the method described in each embodiment. Examples thereof include a mode in which a part of the structure of each embodiment is replaced, changed, or omitted, or a mode in which a new structure is added to each embodiment. In the following modifications, the same portions as those of the embodiments are denoted by the same reference numerals as those of the embodiments, and descriptions thereof are omitted.

In the first embodiment, when the first resin layer 11B and the second resin layer 12B are cut in the subsequent cutting step, the suction mechanism 80 may be provided, and the suction mechanism 80 may suck gas generated by irradiating the first resin layer 11B and the second resin layer 12B with the laser beam. As shown in fig. 15, the suction mechanism 80 is configured to suck the gas through the peripheral surface 10A of the multilayer laminated substrate 10. One example of the suction mechanism 80 includes an intake fan. The suction mechanism 80 drives the suction fan to suck air on the peripheral surface 10A of the multilayer laminated substrate 10. In this case, the gas generated in the multilayer laminated substrate 10 is discharged to the outside of the multilayer laminated substrate 10 through the peripheral surface 10A.

In the first embodiment, when the first resin layer 11B and the second resin layer 12B are cut by irradiating laser light a plurality of times, the first resin layer 11B and the second resin layer 12B may be cut by irradiating laser light a plurality of times with a predetermined time interval instead of setting the laser light to be smaller than a predetermined output. In this manufacturing method, one of the first resin layer 11B and the second resin layer 12B is irradiated with laser light, irradiation of the laser light is temporarily stopped, and after a predetermined period of time has elapsed, one of the first resin layer 11B and the second resin layer 12B is irradiated with laser light again, and the irradiation of the laser light and the temporary interruption of the irradiation are repeated a plurality of times. The same applies to the case where the laser is irradiated to the other of the first resin layer 11B and the second resin layer 12B. The gas generated as the first resin layer 11B and the second resin layer 12B are irradiated with the laser is cooled when the laser irradiation is temporarily interrupted, thereby reducing the possibility of the quality of the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B being degraded by the influence of the gas.

In the first embodiment, the unit laminated substrate 20 may be manufactured by bonding a first unit laminated substrate, which is the first laminated substrate 11 having a predetermined size, and a second unit laminated substrate, which is the second laminated substrate 12 having a predetermined size. That is, the first step includes a first cutting step of cutting the first laminated substrate 11 into a predetermined size and a second cutting step of cutting the second laminated substrate 12 into a predetermined size. In the post-lamination step, the first unit laminated substrate and the second unit laminated substrate are laminated. In this case, the cut surface 23A is formed in the first glass layer 11A of the first unit laminated substrate, and the cut surface 24A is formed in the second glass layer 12A of the second unit laminated substrate.

In the first embodiment, the unit laminated substrate 20 may be manufactured by bonding the first unit laminated substrate, which is the first laminated substrate 11 having the predetermined size, to the second laminated substrate 12 before being cut into the predetermined size, and then cutting the second laminated substrate 12 into the predetermined size. The unit laminated substrate 20 may be manufactured by bonding a second unit laminated substrate, which is a second laminated substrate 12 having a predetermined size, to the first laminated substrate 11 before cutting the second laminated substrate into a predetermined size, and then cutting the first laminated substrate 11 into a predetermined size. That is, the preceding step includes one of a first cutting step of cutting the first laminated substrate 11 to a predetermined size and a second cutting step of cutting the second laminated substrate 12 to a predetermined size. The subsequent step includes the other of the first cutting step of cutting the first laminated substrate 11 into a predetermined size and the second cutting step of cutting the second laminated substrate 12 into a predetermined size. In this case, the unit laminated substrate 20 shown in fig. 9 is manufactured after the subsequent processing step.

In the first embodiment, the conductive layer 13 may be formed on the second multilayer substrate 12 instead of forming the conductive layer 13 on the first multilayer substrate 11 or in addition to forming the conductive layer 13 on the first multilayer substrate 11.

Claims

1. A method of manufacturing a flexible organic EL display, wherein,

the method for manufacturing a flexible organic EL display includes a cutting step of cutting out a unit laminated substrate having a predetermined size from a laminated substrate in which a glass layer and a resin layer are laminated,

in the cutting step, the glass layer is cut so that a cut surface of the glass layer of the unit laminated substrate is positioned outside a cut surface of the resin layer.

2. The method for manufacturing a flexible organic EL display according to claim 1,

the glass layer includes a first plane on which the resin layer is formed and a second plane paired with the first plane,

in the cutting step, the glass layer is cut so as to form a cut surface in which the width of the glass layer becomes narrower from the second plane toward the first plane.

3. The method for manufacturing a flexible organic EL display according to claim 2,

in the cutting step, the glass layer is scribed so as to form a scribe line in which the width of the glass layer becomes narrower from the second plane toward the first plane, and the scribed glass layer is broken.

4. The method for manufacturing a flexible organic EL display according to claim 3,

in the cutting step, the glass layer is scribed by using a scribing wheel having a cutting edge portion asymmetrical in shape with respect to a rotational center plane.

5. The manufacturing method of a flexible organic EL display according to any one of claims 1 to 4,

the method for manufacturing a flexible organic EL display further includes a peeling step of peeling the glass layer and the resin layer of the unit laminated substrate by laser peeling.

6. The method of manufacturing a flexible organic EL display according to any one of claims 1 to 5,

in the cutting step, a unit laminated substrate is cut out from a multilayer laminated substrate including a plurality of the laminated substrates including a first laminated substrate in which a first glass layer and a first resin layer are laminated and a second laminated substrate in which a second glass layer and a second resin layer are laminated, the multilayer laminated substrate being laminated such that the first resin layer and the second resin layer face each other.